SODF157TSH [LRC]
Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.5A;型号: | SODF157TSH |
厂家: | LESHAN RADIO COMPANY |
描述: | Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.5A |
文件: | 总7页 (文件大小:172K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SODF151T-SH thru SODF157T-SH
Surface Mount Glass Passivated Junction Fast Recovery Rectifiers
Reverse Voltage 50 to 1000V Forward Current 1.5A
FEATURES
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* High temperature metallurgically
bonded construction
* Cavity-free glass passivated junction
* Capable of meeting environmental standards
of MIL-S-19500
* Typical IR less than 1.0µA
* High temperature soldering guaranteed:
260°C/10 seconds
Mechanical Data
We declare that the material of product is
Haloggen free (green epoxy compound)
Case: JEDEC SOD123-FL/MINI SMA, molded plastic over glass DIE
Terminals: Tin Plated, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0155 g
Handling precautin:None
Electrical Characteristic
1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
SOD
SOD
SOD
SOD
SOD
SOD
SOD
F151T- F152T- F153T- F154T- F155T- F156T- F157T-
Parameter Symbol
symbol
Unit
SH
G1T
50
SH
G2T
100
70
SH
G3T
200
140
200
SH
G4T
400
280
400
SH
G5T
600
420
600
SH
G6T
800
560
800
SH
Device marking code
G7T
1000
700
Maximum repetitive peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
VDC
V
V
V
35
Maximum DC blocking voltage
50
100
1000
Maximum average forward rectified current
lead length at TA = 75°C(Note 2)
1.5
50
IF(AV)
A
Peak forward surge current 8.3ms single half sine-
wave superimposed on rated load (JEDEC Method)
IFSM
A
100
160
Typical reverse recovery time (Note 1)
Typical thermal resistance (Note 1)
trr
150
ns
110
40
RθJA
RθJC
°C/W
–55 to +150
–65 to +175
Operating junction temperature range
storage temperature range
TJ
°C
°C
TSTG
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
SOD
SOD
SOD
SOD
SOD
SOD
SOD
F151T- F152T- F153T- F154T- F155T- F156T- F157T-
Parameter Symbol
symbol
VF
Unit
V
SH
SH
SH
SH
SH
SH
SH
1.3
Maximum instantaneous forward voltage at 1.5A
Maximum DC reverse current at rated DC blocking
5.0
100
voltage TA = 25℃
Tj = 100℃
IR
µA
15.0
Typical junction capacitance at 4.0V, 1MHz (Note 2)
CJ
PF
NOTES:
1. IF = 0.5A, IR = 1.0A, IRR = 0.25A
2. 8.0mm2 (.013mm thick) land areas
SODF151T-SH thru SODF157T-SH
2. Characteristic Curves ( TA = 25°C unless otherwise noted )
Fig. 2 – Maximum Non-repetitive Peak
Fig. 1 – Forward Current Derating Curve
Forward Surge Current
60 Hz
TJ = TJ max
Resistive or
Inductive Load
8.3ms Single Half Sine-wave
(JEDEC Method)
1.5
50
25
0.75
0.375" (9.5mm) Lead Length
0
0
1
10
100
0
25 50 75 100 125 150 175
Number of Cycles at 60Hz
Ambient Temperature, °C
Fig 3. – Typical Instantaneous Forward
Fig 4. – Typical Reverse Characteristics
Characteristics
10
100
10
1.0
Tj=125℃
Tj=75℃
Tj=25℃
0.1
0.01
1.0
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
0.1
0.001
0.01
0.6
0.8
1.0
1.2
1.4
1.6
0
20
40
60
80
100
Instantaneous Forward Voltage
Percent of Rated Peak Reverse Voltage (%)
Fig 5. –typical transient thermal
Fig 6. – Typical Junction Capacitance
impedance
100
10
100
10
TJ = 25°C
f = 1.0 MHz
Vsig = 50mVp-p
1.0
0.1
1.0
0.1
0.01
0.1
1.0
10
100
1
10
100
t,Pulse duration,sec
Reverse Voltage (V)
SODF151T-SH thru SODF157T-SH
3. dimension:
SOD123-FL
Suggested solder pad layout
Dimensions in inches and (millimeters)
SODF151T-SH thru SODF157T-SH
4.Packing information
Unit:mm
SODF151T-SH thru SODF157T-SH
Reel packing
APPOX.
5.Suggested thermal profile for soldering process
1. Storage environment:Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
SODF151T-SH thru SODF157T-SH
6.High reliability test capabilities
SODF151T-SH thru SODF157T-SH
7. Update Record
更新记录
第一版
更新作者
周杰
更新日期
版次
2013.03.20
1
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