SODSF11-SH [LRC]
Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 600V Forward Current 1.0A;
| 型号： | SODSF11-SH |
| 厂家： | 
LESHAN RADIO COMPANY |
| 描述： | Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 600V Forward Current 1.0A |
| 文件： | 总11页 (文件大小：315K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SODSF11-SH thru SODSF18-SH
Surface Mount Glass Passivated Junction Fast Recovery Rectifiers
Reverse Voltage 50 to 600V Forward Current 1.0A
FEATURES
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* High temperature metallurgically
bonded construction
* Cavity-free glass passivated junction
* Capable of meeting environmental standards
of MIL-S-19500
* Typical IR less than 1.0µA
* High temperature soldering guaranteed:
260°C/10 seconds
Mechanical Data
Case: JEDEC SOD123-FL/MINI SMA, molded plastic over glass DIE
Terminals: Tin Plated, solderable per
MIL-STD-750, Method 2026
We declare that the material of product is
Halogen free (green epoxy compound)
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0155 g
Handling precautin:None
Electrical Characteristic
1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
SOD
SOD
SOD
SOD
SOD
SOD
SOD
SOD
Parameter Symbol
symbol
Unit
SF11-SH SF12-SH SF13-SH SF14-SH SF15-SH SF16-SH SF17-SH SF18-SH
Device marking code
SF11 SF12 SF13 SF14 SF15 SF16 SF17 SF18
Maximum repetitive peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
VDC
50
35
50
100
70
150
105
150
200
140
200
300
210
300
400
280
400
500
350
500
600
420
600
V
V
V
Maximum DC blocking voltage
Maximum average forward rectified current
100
1.0
30
35
IF(AV)
IFSM
trr
A
lead length at T = 75°C(Note 2)
C
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
A
Typical reverse recovery time (Note 1)
Typical thermal resistance (Note 2)
ns
110
40
RθJA
RθJC
°C/W
–55 to +150
–65 to +175
Operating junction temperature range
storage temperature range
TJ
°C
°C
TSTG
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
SOD
SOD
SOD
SOD
SOD
SOD
SOD
SOD
Parameter Symbol
symbol
Unit
V
SF11-SH SF12-SH SF13-SH SF14-SH SF15-SH SF16-SH SF17-SH SF18-SH
VF
0.95
1.25
1.7
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current at rated DC blocking
5.0
100
voltage TA = 25℃
Tj = 100℃
IR
µA
PF
15.0
Typical junction capacitance at 4.0V, 1MHz (Note 2)
CJ
NOTES:
1. IF = 0.5A, IR = 1.0A, IRR = 0.25A
2. 8.0mm2 (.013mm thick) land areas
SODSF11-SH thru SODSF18-SH
2. Characteristic Curves ( TA = 25°C unless otherwise noted )
Fig. 2 – Maximum Non-repetitive Peak
Forward Surge Current
Fig. 1 – Forward Current Derating Curve
60 Hz
Resistive or
Inductive Load
TJ = TJ max
8.3ms Single Half Sine-wave
(JEDEC Method)
30
15
1.0
0.5
0.375" (9.5mm) Lead Length
0
0
0
25
50 75 100 125 150 175
1
10
Number of Cycles at 60Hz
100
CASE TEMPERATURE:Tc(°C)
Fig 3. – Typical Instantaneous Forward
Characteristics
Fig 4. – Typical Reverse Characteristics
10
100
10
SODSF11~SODSF14
SODSF15~SODSF16
1.0
Tj=125℃
Tj=75℃
Tj=25℃
SODSF17~SODSF18
0.1
0.01
1.0
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
0.1
0.001
0.01
0.7
0.9
1.1
1.3 1.5
1.7
0
20
40
60
80 100
Instantaneous Forward Voltage (V)
Percent of Rated Peak Reverse Voltage (%)
Fig 5. –typical transient thermal
impedance
Fig 6. – Typical Junction Capacitance
100
10
100
10
TJ = 25°C
f = 1.0 MHz
Vsig = 50mVp-p
1.0
0.1
1.0
0.01
0.1
1.0
10
100
0.1
1
10
100
t,Pulse duration,sec
Reverse Voltage (V)
SODSF11-SH thru SODSF18-SH
3. dimension:
E
SOD1A23-FL
J
H
B
D
C
K
K
MILLIMETERS
INCHES
MIN MAX
DIM
MIN
3.5
MAX
3.9
A
B
C
D
E
H
J
0.138
0.029
0.103
0.063
0.159
0.037
0.119
0.079
0.75
2.6
0.95
3.0
1.6
2.0
0.45Typ
0.018Typ
0.9
1.2
0.036
0.005
0.047
0.009
0.12
0.22
0.8Typ
0.032Typ
K
Suggested solder pad layout
B
C
A
Dimensions in inches and (millimeters)
PACKAGE
SOD123-FL
A
B
C
0.044(1.10
0.040(1.00)
0.079(2.00)
Title:
DOC NO.： WI-258
Version: 5 Modification: 0
Page:
Power Diode SMD Package Pa cking Spec
2
5.1 、SMD Packing Reel Spec & Packing Quantity
5.1.1 Reel Packing
A. Reel Spec
unit：mm
A
B
C
W
Quantity/Reel
SPEC
SMA 7" reel
SMA13" reel
SMA-FL13" reel
TO277 13" reel
177.0±2.0 54.0±0.5
330.0±2.0 75.0±0.5
330.0±2.0 75.0±0.5
330.0±2.0 75.0±0.5
177.0±2.0 50.0±0.5
177.0±2.0 50.0±0.5
330.0±2.0 75.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
13.2±0.2
13.2±0.2
13.2±0.2
13.2±0.2
9.4±1.5
9.4±1.5
13.2±0.2
2K
5K
5K
5K
3K
3K
5K
SOD123FL 7" reel
SOD323HE 7" reel
SMB-FL 13" reel
B. 13" reel packing box
unit：mm
A
B
C
size
335±5.0
335±2.0
40±1.0
as per above packing
Spec
Q'ty/Box
SMA13" reel
TO277 13" reel
SMB-FL 13" reel
10K
10K
10K
Title:
DOC NO.： WI-258
DOC NO.： WI-258
Power Diode SMD Package Packing Spec
Page:
3
C. 7" reel packing box
unit：mm
A
B
C
SMA/SMA-FL 188±2.0
188±2.0
138±2.0
SOD123FL
SOD323HE
as per above packing
Q'ty/Box
186±2.0
139±2.0
185±2.0
SMA/SMA-FL
SOD123FL
16K
30K
30K
SOD323HE
unit：mm
D. reel packing carton
A
B
C
size
350±2.0
340±2.0
350±2.0
as per above packing
Spec
Q'ty/Carton
SMA/SMA-FL 7" reel
SMA13"reel
80K
80K
80K
80K
80K
SMA-FL13"reel
TO277 13" reel
SMB-FL 13" reel
unit：mm
A
B
C
SOD123FL
SOD323HE
455±2.0
400±2.0
410±2.0
as per above packing
Spec
SOD123-FL 7" reel
SOD323HE 7" reel
Q'ty/Carton
360K
5.1.2 Tape Spec
360K
A. Cover Tape
unit：mm
B
A
SMA
/SMA-FL
SMB-FL
/TO277
9.5±0.10
0.062±0.007
SOD123FL
SOD323HE
5.4±0.10
Title:
DOC NO.： WI-258
Version: 5 Modification: 0
Page: 4
Power Diode SMD Package Packing Spec
B. Carrier Tape
t
Do
P2
Po
B'
D1
P1
A'
A
B
SEC.:B-B'
Cathode(tape
hole side）
Ao
SEC.:A-A'
Item
W
SOD323HE SOD123FL SMA
SMA-FL
12±0.3
4±0.1
SMB-FL
12±0.3
TO277
8±0.3
8±0.3
12±0.3
4±0.1
12±0.3
P1
E
4±0.1
4±0.1
8±0.1
8±0.1
1.75±0.1
3.5±.05
1.75±0.1
3.5±.05
1.75±0.1
5.5±.05
1.75±0.1
5.5±.05
1.75±0.1
5.5±.05
1.55±0.05
1.5±0.1
4±0.1
1.75±0.1
5.5±0.05
1.55±0.05
1.55±0.05
4±0.1
F
D0
D1
P0
P2
10P0
A0
B0
K0
T
1.55±0.05 1.55±0.05 1.55±0.05 1.55±0.05
1.1±0.1
4±0.1
1.1±0.1
4±0.1
1.5±0.1
4±0.1
1.5±0.1
4±0.1
2±0.05
2±0.05
2±0.05
2±0.05
2±0.05
2±0.05
40±0.2
40±0.2
40±0.2
40±0.2
40±0.2
40±0.2
1.45±0.1
2.75±0.1
0.80±0.1
1.95±0.1
3.95±0.1
1.30±0.1
2.79±0.1
5.33±0.1
2.36±0.1
2.83±0.1
4.75±0.1
1.42±0.1
4.3±0.1
6.8±0.1
1.35±0.1
0.25±0.05
3.8±0.1
5.75±0.1
1.4±0.1
0.25±0.05
0.25±0.05 0.25±0.05 0.25±0.05 0.25±0.05
Title:
DOC NO.： WI-258
Version: 5
Modification: 0
Page: 5
Power Diode SMD Package Packing Spec
5.2、SMD Power Diode General Packing Spec
A. 7" reel
all labels will be at cathode side of reel ；
C
A
C
side
front
A:LRC label;
B:Environment Label C:Halide free label
B. 13" reel
A
A
A:LRC label;
B:Environment Labe C:Halide free label
C.Tape lead: face anode side of the reel,upper side is the tape lead position. All labels are at cathode side of the reel.
标题:
DOC NO.： WI-258
Version: 5 Modification: 0
Page:
Power Diode SMD Package Packing Spec
6
C. Label Content：
Two-dimension code
LRC Label
Manufacturing
P/N
Lot No.
Date code
Maker
Quantity
lot: 140106049X: 140106---2014/1/6；049----lot number:49；X：product code
Environment Label
Halide-free Label
Green
SODSF11-SH thru SODSF18-SH
Reel packing
APPOX.
GROSS
WEIGHT
(kg)
COMPONENT
SPACING
(mm)
CARTON
SIZE
(mm)
REEL
(PCS)
BOX
(pcs)
INNER BOX
(mm)
REEL DIA.
(mm)
CARTON
(PCS)
PACKAGE
SOD123-FL
REEL SIZE
7"
3,000
4.0
30,000
183*183*123
178
382*262*387
240,000
8.7
5.Suggested thermal profile for soldering process
1. Storage environment：Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
Profile Feature
Soldering Condition
L
P
Average ramp-up rate(T to T )
℃
<3 /sec
Preheat
- Temperature Min(Tsmin)
- Temperature Max(Tsmax)
150℃
℃
200
- Time(min to max)(ts)
60~120sec
L
Tsmax to T
- Ramp-up Rate
<3sec
Time maintained above:
L
- Temperature (T )
℃
217
L
- Time(t )
60-260sec
P
Peak Temperature(T )
255 -0/+5℃
℃
Time within 5 of actual Peak
10~30sec
P
Temperature(T )
Ramp-down Rate
℃
<6 /sec
℃
<6minutes
Time 25 to Peak Temperature
SODSF11-SH thru SODSF18-SH
6.High reliability test capabilities
Item Test
Condition
Reference
at 260±5℃ for 10±2sec immerse
body into solder 1/16" ± 1/32"
MIL-STD-750D METHOD-2031
Solder Resistance
MIL-STD-202F METHOD-208
MIL-STD-750D METHOD-1038
Solderability
at 245±5℃ for 5 sec
R
j
High Temperature Reverse Bias
V =80% rate at T=150℃ for 168hrs
Rated average rectifier current
MIL-STD-750D METHOD-1027
MIL-STD-750D METHOD-1036
Forward Operation Life
A
T =25℃ for 500hrs
A
F
O
T =25℃，I =I
On state:power on for 5 min.
Off state:power off for 5 min.
on and off for 500 cycles
Intermittent Operation Life
JESD22-A102
SIG
A
Pressure Cooker
15P at T =121℃ for 4hrs
-55℃ to +125℃ dwelled for 30 min.
and transferred for 5min. Total 10 cycles
MIL-STD-750D METHOD-1051
Temperature Cycling
0℃ for 5min. Rise to 100℃ for 5min.
Total 10 cycles
MIL-STD-750D METHOD-1056
MIL-STD-750D METHOD-4066-2
Thermal Shock
Forward Surge
8.3ms single half sine-wave
superimposed on rated load,one surge
MIL-STD-750D METHOD-1021
MIL-STD-750D METHOD-1031
A
H
Humidity
at T =85℃，R =85% for 1000hrs
High Temperature Storage Life
at 175℃ for 1000hrs
SODSF11-SH thru SODSF18-SH
7. Update Record
更新记录
第一版
更新作者
周杰
更新日期
版次
2013.07.05
1
相关型号：
SODSF18-SH
Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 600V Forward Current 1.0A
LRC
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