450-0164 [LSTD]
Integrated 802.11 b/g/n WLAN Module;
| 型号： | 450-0164 |
| 厂家： | 
Laird Connectivity |
| 描述： | Integrated 802.11 b/g/n WLAN Module 局域网 WLAN 无线局域网 |
| 文件： | 总35页 (文件大小：1144K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TiWi-C-W Module
Datasheet
Integrated 802.11 b/g/n WLAN Module
FEATURES
DESCRIPTION
•
•
IEEE 802.11 b/g/n (single stream n)
Typical WLAN Transmit Power:
The TiWi-C-W is a high performance 2.4 GHz WLAN
module that contains an IP networking stack in a pre-
certified footprint that simplifies the process of
implementing internet connectivity.
o
o
o
+19.0 dBm, 1 Mbps, CCK (b)
+15.8 dBm, 54 Mbps, OFDM (g)
+15.0 dBm, HT20 MCS7 (n)
•
Typical WLAN Sensitivity:
o
o
o
-90 dBm, 8% PER,11 Mbps (b)
-73 dBm, 10% PER, 54 Mbps (g)
-71 dBm, 10% PER, MCS7 (n)
•
•
•
•
•
Miniature footprint: 10.5 mm x 10.5 mm
Low height profile: 1.4 mm
Operating voltage: 3.13V to 3.46V
Operating temperature: -40 to +85o C
Compact design based on Broadcom BCM4390
SoC
Integrated ARM Cortex-M3 apps processor
Wireless Security WEP, WPA Personal, WPA2
Personal
The module includes the necessary PHY, MAC, and
network layers to support WLAN applications on the
integrated applications processor, or through a simple
host interface.
•
•
•
•
•
Transmit and receive antenna diversity
UART serial host interface
Simple integration with microcontrollers and
microprocessors
Worldwide acceptance: FCC (USA), IC (Canada),
and CE (Europe)
Modular certification allows reuse of LSR FCC ID
and ETSI certification without repeating the
expensive testing on your end product
RoHS compliant
Need to get to market quickly? Not an expert in 802.11.
Need a custom antenna? Would you like to own the
design? Would you like a custom design? Not quite sure
what you need? Do you need help with your host board?
LSR Design Services will be happy to develop custom
hardware or software, or assist with integrating the
design. Contact us at sales@lsr.com or call us at 262-
375-4400.
•
•
•
•
•
•
•
•
•
•
•
Home automation
•
•
Home Network aggregators
Remote appliance diagnostics/support
Home security
Remote storage devices
Home network appliance
Cameras and video surveillance
Fitness
Streamlined development with LSR Design
Services
APPLICATIONS
•
Thermostats, appliances, HVAC controller, and
remote displays, Smart Energy
Home entertainment control
Sensor Networks
Medical
Home Monitoring
Toys
Cable replacement for medical and personal
healthcare
•
•
•
•
•
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 1 of 35
TiWi-C-W Module
Datasheet
ORDERING INFORMATION
Order Number
450-0118C
450-0118R
450-0137
Description
TiWi-C-W Module (Cut Tape)
TiWi-C-W Module (Tape and Reel, SPQ = 2000)
TiWi-C-W Evaluation Platform
450-0143
450-0164
TiWi-C-W Development Kit featuring TiWiConnect
TiWi-C-W Serial-to-WiFi Development Kit
Table 1 Orderable TiWi-C-W Part Numbers
MODULE ACCESSORIES
Order Number
Description
2.4 GHz Dipole Antenna with Reverse Polarity
SMA Connector
001-0001
080-0001
U.FL to Reverse Polarity SMA Bulkhead Cable
105mm
001-0014
2.4 GHz FlexPIFA Antenna
2.4 GHz Metal FlexPIFA Antenna w/U.FL Cable,
100 mm
001-0030
Table 2 Module Accessories
APPLICABLE DOCUMENTS
•
•
TiWi-C-W Module Application Guide (330-0158)
TiWi-C-W Evaluation Platform User Guide (330-0159
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 2 of 35
TiWi-C-W Module
Datasheet
TABLE OF CONTENTS
FEATURES ................................................................................................................................... 1
APPLICATIONS ............................................................................................................................ 1
DESCRIPTION .............................................................................................................................. 1
ORDERING INFORMATION .......................................................................................................... 2
MODULE ACCESSORIES................................................................................................................ 2
APPLICABLE DOCUMENTS ........................................................................................................... 2
BLOCK DIAGRAM ........................................................................................................................ 5
FUNCTIONAL BLOCK FEATURES ................................................................................................... 5
WLAN Features...................................................................................................................................................... 5
Network Stack Supported Protocols ...................................................................................................................... 6
Wireless Security System Features ........................................................................................................................ 6
TIWI-C-W MODULE FOOTPRINT AND PIN DEFINITIONS................................................................ 7
PIN DESCRIPTIONS ...................................................................................................................... 8
ELECTRICAL SPECIFICATIONS ..................................................................................................... 10
Absolute Maximum Ratings................................................................................................................................. 10
Recommended Operating Conditions .................................................................................................................. 10
General Characteristics........................................................................................................................................ 11
Power Consumption ............................................................................................................................................ 12
Power Supply Requirements................................................................................................................................ 13
RF Characteristics ................................................................................................................................................ 14
UART HOST INTERFACE ............................................................................................................. 20
Overview ............................................................................................................................................................. 20
UART Interface .................................................................................................................................................... 20
UART Signal Description ...................................................................................................................................... 20
Recommended Reflow Profile for Lead Free Solder ............................................................................................. 21
CLEANING ................................................................................................................................. 22
OPTICAL INSPECTION ................................................................................................................ 22
The information in this document is subject to change without notice.
330-0129-R4.5
Copyright © 2015-2018 LSR
Page 3 of 35
TiWi-C-W Module
Datasheet
REWORK................................................................................................................................... 22
SHIPPING, HANDLING, AND STORAGE ....................................................................................... 22
Shipping............................................................................................................................................................... 22
Handling .............................................................................................................................................................. 22
Moisture Sensitivity Level (MSL).......................................................................................................................... 22
Storage ................................................................................................................................................................ 22
Repeating Reflow Soldering................................................................................................................................. 23
AGENCY CERTIFICATIONS .......................................................................................................... 24
AGENCY STATEMENTS............................................................................................................... 24
Federal Communication Commission Interference Statement ............................................................................. 24
Industry Canada Statements................................................................................................................................ 25
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS............. 26
OEM LABELING REQUIREMENTS FOR END-PRODUCT................................................................. 27
OEM END PRODUCT USER MANUAL STATEMENTS..................................................................... 28
EUROPE .................................................................................................................................... 29
CE Notice ............................................................................................................................................................. 29
Declaration of Conformity (DOC) ......................................................................................................................... 29
MECHANICAL DATA................................................................................................................... 30
PCB FOOTPRINT ........................................................................................................................ 31
RECOMMENDED SOLDER STENCIL ............................................................................................. 32
TAPE AND REEL PACKAGING...................................................................................................... 33
DEVICE MARKINGS.................................................................................................................... 34
Rev 1 Devices....................................................................................................................................................... 34
Rev 3 Devices....................................................................................................................................................... 34
CONTACTING LSR ...................................................................................................................... 35
The information in this document is subject to change without notice.
330-0129-R4.5
Copyright © 2015-2018 LSR
Page 4 of 35
TiWi-C-W Module
Datasheet
BLOCK DIAGRAM
VCC
ANT 1 ANT 2
Low Pass
Filter
BCM4390
Antenna
Diversity
Switch
TX/RX
Switch
UART
GPIO
I2S
FLASH
Memory
32.768 kHz
Oscillator
37.4 MHz
REF CLK
TiWi-C-W
Module
VCC_OSC
Figure 1 TiWi-C-W Module Block Diagram – Top Level
FUNCTIONAL BLOCK FEATURES
WLAN Features
•
•
•
•
•
IEEE802.11b/g/n 1x1 2.4 GHz Radio
Single Transmit and Single or Dual Receive Antenna Support
Media Access Controller (MAC)
Baseband Processor
Standards
o
o
o
o
IEEE 802.11b, 802.11g, 802.11n
IEEE 802.11 d/i (regulatory domains and WPA2)
IEEE 802.11r (fast roaming between Aps)
IEEE 802.11w (secure management frames)
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 5 of 35
TiWi-C-W Module
Datasheet
Network Stack Supported Protocols
•
Transport layer:
o
TCP
o
UDP
•
Network layer:
o
o
o
o
o
o
IPv4, IPv6
Ping
DHCP
HTTP
NTP
DNS Client
•
Link layer:
ARP
o
Wireless Security System Features
•
•
Supported modes:
o
o
o
o
Open (no security)
WEP
WPA Personal
WPA2 Personal
Supported encryption types:
o
o
o
o
Open
WEP
AES (hardware accelerator)
TKIP (hardware accelerator)
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 6 of 35
TiWi-C-W Module
Datasheet
TIWI-C-W MODULE FOOTPRINT AND PIN DEFINITIONS
To apply the TiWi-C-W module, it is important to use the module pins in your application as they are designated
below, and in the corresponding pin definition table found on pages 8 and 9. Not all the pins on the TiWi-C-W
module may be used, as some are reserved.
Figure 2 TiWi-C-W Pinout (Top View)
The information in this document is subject to change without notice.
330-0129-R4.5
Copyright © 2015-2018 LSR
Page 7 of 35
TiWi-C-W Module
Datasheet
PIN DESCRIPTIONS
Module
Pin
Name
I/O Type
Description
1
2
3
GND
VCC
GND
PI
GROUND
POWER TO MODULE (3.13-3.46 VDC)
GROUND
GND
GND
ACTIVE LOW RESET INPUT. MUST BE PULLED UP TO VCC WITH
A 10k OHM RESISTOR.
4
RESET_N
DI
5
6
GPIO_A11
DIO
GPIO A11
INTERNAL FLASH PROGRAMMING OVERIDE. CAN BE USED TO
ASSIST IN A FORCED FLASH ERASE. SHOULD BE BROUGHT TO
AND EXTERNAL PAD OR PIN.
FLASH_OVERIDE
DIO
7
OSC_32K_OUT
VCC_OSC
DO
PI
32.768 kHz OSCILLATOR OUTPUT
8
POWER TO 32.768 kHz OSCILLATOR (3.13-3.46 VDC)
9
GND
GND
RF
GROUND
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
ANTENNA 1
GND
ANTENNA 1, 50 OHMS, SECONDARY RX ANTENNA
GND
DIO
GND
RF
GROUND
GPIO_A10
GND
GPIO A10
GROUND
ANTENNA 0
GND
ANTENNA 0, 50 OHMS, TX AND PRIMARY RX ANTENNA
GROUND
GND
DIO
DIO
DIO
DIO
GND
DIO
DI
I2S_WS_UART2_TXD_A7
I2S_WS_UART2_RXD_A9
GPIO_A8
UART2 TRANSMIT DATA OUTPUT / GPIO A7
UART 2 RECEIVE DATA INPUT / GPIO A9
GPIO A8
GPIO_A6
GPIO A6
GND
GROUND
UART1_CTS_N_A1
UART1_RXD
UART1_RTS_N_A0
UART1_TXD
GND
UART 1 ACTIVE LOW CLEAR-TO-SEND / GPIO A1
UART 1 RECEIVE DATA INPUT
UART 1 ACTIVE LOW REQUEST-TO-SEND / GPIO A0
UART 1 TRANSMIT DATA OUTPUT
GROUND
DIO
DO
GND
PI
VCC
POWER TO MODULE (3.13-3.46 VDC)
GROUND
GND
GND
DIO
JTAG_TCK_A3
APPS JTAG TCK / GPIO A3
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 8 of 35
TiWi-C-W Module
Datasheet
Module
Pin
Name
I/O Type
Description
29
30
31
32
33
34
35
36
JTAG_TD0_A5
JTAG_TMS_A2
JTAG_TDI_A4
WRF_GPIO_OUT
UART4_TXD
UART4_RXD
NC
DIO
DIO
DIO
DIO
DO
DI
APPS JTAG TDO / GPIO A5
APPS JTAG TMS / GPIO A2
APPS JTAG TDI / GPIO A4
UART 4 TRANSMIT DATA OUTPUT
UART 4 RECEIVE DATA INPUT
-
NO CONNECT (DO NOT CONNECT)
NO CONNECT (DO NOT CONNECT)
NC
-
UNUSED CLOCK IN. CONNECT TO GND THROUGH 1k OHM
RESISTOR.
37
CLK_IN
-
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
NC
-
NO CONNECT (DO NOT CONNECT)
NC
-
NO CONNECT (DO NOT CONNECT)
NC
-
NO CONNECT (DO NOT CONNECT)
GPIO_B2
GPIO_B3
GPIO_B5
GPIO_B6
GPIO_B4
GND
DIO
DIO
DIO
DIO
DIO
GND
PI
GPIO B2
GPIO B3
GPIO B5
GPIO B6
GPIO B4
GROUND
VCC
POWER TO MODULE (3.13-3.46 VDC)
GND
GND
DIO
DIO
DIO
DIO
DIO
DIO
DIO
GND
GND
GROUND
GPIO B0
GPIO B1
GPIO B9
GPIO B10
GPIO B11
GPIO B8
GPIO B7
GROUND
GROUND
GPIO_B0
GPIO_B1
GPIO_B9
GPIO_B10
GPIO_B11
GPIO_B8
GPIO_B7
GND
GND
PI = Power Input DI = Digital Input DO = Digital Output DIO = Bi-directional Digital Port RF = Bi-directional RF Port GND=Ground
Table 3 TiWi-C-W Module Pin Descriptions
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 9 of 35
TiWi-C-W Module
Datasheet
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Parameter
Power supply voltage (VCC)
Min
Max
Unit
0
0
3.46
3.46
V
V
Oscillator power supply voltage (VCC_OSC)
Power supply voltage ripple
Voltage on digital pins
-2
+2
%
-0.5
VCC + 0.5
+10
V
RF input power, antenna port
Operating temperature
dBm
ºC
ºC
-40
-40
+85
Storage temperature
+85
Table 4 Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Min
Typical
Max
Unit
VCC
3.13
3.13
0
3.30
3.30
3.3
3.46
3.46
VCC
85
V
V
VCC_OSC
Voltage on digital pins
Ambient temperature range
V
-40
25
ºC
Table 5 Recommended Operating Conditions
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 10 of 35
TiWi-C-W Module
Datasheet
General Characteristics
DC Characteristics – General Purpose I/O
Parameter
Logic input low, VIL
Test Conditions
Min
Typical
Max
Unit
0
-
-
-
-
0.8
VCC
0.8
V
V
V
V
Logic input high, VIH
Logic output low, VOL
Logic output high, VOH
2.0
0
12mA
12mA
2.3
VCC
Table 6 DC Characteristics General Purpose I/O
RF Characteristics
Parameter
Min
Typical
Max
Unit
RF frequency range
RF data rate
2412
2472
MHz
802.11 b/g/n
rates supported
1
54
Mbps
Table 7 RF Characteristics
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 11 of 35
TiWi-C-W Module
Datasheet
Power Consumption
Parameter
Test Conditions
11 Mbps, Tamb = +25°C, 3.3V
Min
Typical
Max
Unit
11b TX Current
11g TX Current
11g TX Current
11n TX Current
11n TX Current
11b RX Current
11g RX Current
11n RX Current
Power Down Mode
-
-
-
-
-
-
-
310
280
230
260
220
65
360
320
280
310
270
-
mA
mA
mA
mA
mA
mA
mA
mA
uA
6 Mbps, Tamb = +25°C, 3.3V
54 Mbps, Tamb = +25°C, 3.3V
MCS0, Tamb = +25°C, 3.3V
MCS7, Tamb = +25°C, 3.3V
11 Mbps, Tamb = +25°C, 3.3V
54 Mbps, Tamb = +25°C, 3.3V
MCS7, Tamb = +25°C, 3.3V
65
-
65
-
-
Table 8 WLAN Power Consumption
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 12 of 35
TiWi-C-W Module
Datasheet
Power Supply Requirements
Parameter
Min
Typical
Max
Unit
VCC
3.13
3.30
800
3.46
-
V
Supply Current
-
mA
Table 9 Power Supply Requirements
Although the Max continuous supply current to the module is >360 mA, when providing power to the module, a
power source capable of supplying 800 mA peak current for a duration of ~30 mSec is required by the module
transmitter during calibration.
Module calibration occurs:
(1) When the Module is initially powered up.
(2) The module is reset.
(3) When the radio is initialized.
(4) Every 2 minutes after the radio is initialized.
Note: Radio calibration will not occur while the module is in modes Doze, Deep Sleep, Power Down or if
the radio is not initialized.
Figure 3 shows the current profile of the TiWi-C-W module during calibration. If current is limited to <800mA
during this process, the module will fail to calibrate.
Figure 3 Module RF Calibration Current Profile
The information in this document is subject to change without notice.
330-0129-R4.5
Copyright © 2015-2018 LSR
Page 13 of 35
TiWi-C-W Module
Datasheet
RF Characteristics
WLAN Transmitter Characteristics
(TA = +25°C, VCC = 3.3 V)
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps BPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
1 Mbps DSSS (b) TX Output Power
-
19.0
-
dBm
2 Mbps QPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
2 Mbps DSSS (b) TX Output Power
-
19.0
-
dBm
5.5 Mbps QPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
5.5 Mbps DSSS (b) TX Output Power
11 Mbps DSSS (b) TX Output Power
6 Mbps OFDM (g) TX Output Power
9 Mbps OFDM (g) TX Output Power
12 Mbps OFDM (g) TX Output Power
18 Mbps OFDM (g) TX Output Power
24 Mbps OFDM (g) TX Output Power
36 Mbps OFDM (g) TX Output Power
48 Mbps OFDM (g) TX Output Power
54 Mbps OFDM (g) TX Output Power
MCS0 OFDM (n) TX Output Power
MCS1 OFDM (n) TX Output Power
MCS2 OFDM (n) TX Output Power
MCS3 OFDM (n) TX Output Power
MCS4 OFDM (n) TX Output Power
MCS5 OFDM (n) TX Output Power
MCS6 OFDM (n) TX Output Power
MCS7 OFDM (n) TX Output Power
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
19.0
19.0
17.5
17.5
17.5
17.5
15.8
15.8
15.8
15.8
15.5
15.5
15.5
15.0
15.0
15.0
15.0
15.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
11 Mbps CCK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
6 Mbps BPSK 802.11(g) Mask Compliance
-5 dB EVM RMS power over TX packet
9 Mbps BPSK 802.11(g) Mask Compliance
-8 dB EVM RMS power over TX packet
12 Mbps QPSK 802.11(g) Mask Compliance
-10 dB EVM RMS power over TX packet
18 Mbps QPSK 802.11(g) Mask Compliance
-13 dB EVM RMS power over TX packet
24 Mbps 16-QAM 802.11(g) Mask Compliance
-16 dB EVM RMS power over TX packet
36 Mbps 16-QAM 802.11(g) Mask Compliance
-19 dB EVM RMS power over TX packet
48 Mbps 64-QAM 802.11(g) Mask Compliance
-22 dB EVM RMS power over TX packet
54 Mbps 64-QAM 802.11(g) Mask Compliance
-25 dB EVM RMS power over TX packet
6.5 Mbps BPSK 802.11(n) Mask Compliance
-5 dB EVM RMS power over TX packet
13 Mbps QPSK 802.11(n) Mask Compliance
-10 dB EVM RMS power over TX packet
19.5 Mbps QPSK 802.11(n) Mask Compliance
-13 dB EVM RMS power over TX packet
26 Mbps 16-QAM 802.11(n) Mask Compliance
-16 dB EVM RMS power over TX packet
39 Mbps 16-QAM 802.11(n) Mask Compliance
-19 dB EVM RMS power over TX packet
52 Mbps 64-QAM 802.11(n) Mask Compliance
-22 dB EVM RMS power over TX packet
58.5 Mbps 64-QAM 802.11(n) Mask Compliance
-25 dB EVM RMS power over TX packet
65 Mbps 64-QAM 802.11(n) Mask Compliance
-27 dB EVM RMS power over TX packet
Table 10 WLAN Transmitter RF Characteristics
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 14 of 35
TiWi-C-W Module
Datasheet
WLAN Transmitter Characteristics
(TA = +85°C, VCC = 3.3 V)
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps BPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
1 Mbps DSSS (b) TX Output Power
-
19.0
-
dBm
2 Mbps QPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
2 Mbps DSSS (b) TX Output Power
5.5 Mbps DSSS (b) TX Output Power
11 Mbps DSSS (b) TX Output Power
6 Mbps OFDM (g) TX Output Power
9 Mbps OFDM (g) TX Output Power
12 Mbps OFDM (g) TX Output Power
18 Mbps OFDM (g) TX Output Power
24 Mbps OFDM (g) TX Output Power
36 Mbps OFDM (g) TX Output Power
48 Mbps OFDM (g) TX Output Power
54 Mbps OFDM (g) TX Output Power
MCS0 OFDM (n) TX Output Power
MCS1 OFDM (n) TX Output Power
MCS2 OFDM (n) TX Output Power
MCS3 OFDM (n) TX Output Power
MCS4 OFDM (n) TX Output Power
MCS5 OFDM (n) TX Output Power
MCS6 OFDM (n) TX Output Power
MCS7 OFDM (n) TX Output Power
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
19.0
19.0
19.0
17.6
17.6
17.6
17.6
15.8
15.8
15.8
15.8
15.5
15.5
15.5
15.0
15.0
15.0
15.0
15.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
5.5 Mbps QPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
11 Mbps CCK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
6 Mbps BPSK 802.11(g) Mask Compliance
-5 dB EVM RMS power over TX packet
9 Mbps BPSK 802.11(g) Mask Compliance
-8 dB EVM RMS power over TX packet
12 Mbps QPSK 802.11(g) Mask Compliance
-10 dB EVM RMS power over TX packet
18 Mbps QPSK 802.11(g) Mask Compliance
-13 dB EVM RMS power over TX packet
24 Mbps 16-QAM 802.11(g) Mask Compliance
-16 dB EVM RMS power over TX packet
36 Mbps 16-QAM 802.11(g) Mask Compliance
-19 dB EVM RMS power over TX packet
48 Mbps 64-QAM 802.11(g) Mask Compliance
-22 dB EVM RMS power over TX packet
54 Mbps 64-QAM 802.11(g) Mask Compliance
-25 dB EVM RMS power over TX packet
6.5 Mbps BPSK 802.11(n) Mask Compliance
-5 dB EVM RMS power over TX packet
13 Mbps QPSK 802.11(n) Mask Compliance
-10 dB EVM RMS power over TX packet
19.5 Mbps QPSK 802.11(n) Mask Compliance
-13 dB EVM RMS power over TX packet
26 Mbps 16-QAM 802.11(n) Mask Compliance
-16 dB EVM RMS power over TX packet
39 Mbps 16-QAM 802.11(n) Mask Compliance
-19 dB EVM RMS power over TX packet
52 Mbps 64-QAM 802.11(n) Mask Compliance
-22 dB EVM RMS power over TX packet
58.5 Mbps 64-QAM 802.11(n) Mask Compliance
-25 dB EVM RMS power over TX packet
65 Mbps 64-QAM 802.11(n) Mask Compliance
-27 dB EVM RMS power over TX packet
Table 11 WLAN Transmitter RF Characteristics
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 15 of 35
TiWi-C-W Module
Datasheet
WLAN Transmitter Characteristics
(TA = -40°C, VCC = 3.3 V)
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps BPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
1 Mbps DSSS (b) TX Output Power
-
18.6
-
dBm
2 Mbps QPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
2 Mbps DSSS (b) TX Output Power
5.5 Mbps DSSS (b) TX Output Power
11 Mbps DSSS (b) TX Output Power
6 Mbps OFDM (g) TX Output Power
9 Mbps OFDM (g) TX Output Power
12 Mbps OFDM (g) TX Output Power
18 Mbps OFDM (g) TX Output Power
24 Mbps OFDM (g) TX Output Power
36 Mbps OFDM (g) TX Output Power
48 Mbps OFDM (g) TX Output Power
54 Mbps OFDM (g) TX Output Power
MCS0 OFDM (n) TX Output Power
MCS1 OFDM (n) TX Output Power
MCS2 OFDM (n) TX Output Power
MCS3 OFDM (n) TX Output Power
MCS4 OFDM (n) TX Output Power
MCS5 OFDM (n) TX Output Power
MCS6 OFDM (n) TX Output Power
MCS7 OFDM (n) TX Output Power
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
18.6
18.6
18.6
17.0
17.0
17.0
17.0
15.5
15.5
15.5
15.5
15.0
15.0
15.0
14.7
14.7
14.7
14.7
14.7
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
5.5 Mbps QPSK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
11 Mbps CCK 802.11(b) Mask Compliance
35% EVM RMS power over TX packet
6 Mbps BPSK 802.11(g) Mask Compliance
-5 dB EVM RMS power over TX packet
9 Mbps BPSK 802.11(g) Mask Compliance
-8 dB EVM RMS power over TX packet
12 Mbps QPSK 802.11(g) Mask Compliance
-10 dB EVM RMS power over TX packet
18 Mbps QPSK 802.11(g) Mask Compliance
-13 dB EVM RMS power over TX packet
24 Mbps 16-QAM 802.11(g) Mask Compliance
-16 dB EVM RMS power over TX packet
36 Mbps 16-QAM 802.11(g) Mask Compliance
-19 dB EVM RMS power over TX packet
48 Mbps 64-QAM 802.11(g) Mask Compliance
-22 dB EVM RMS power over TX packet
54 Mbps 64-QAM 802.11(g) Mask Compliance
-25 dB EVM RMS power over TX packet
6.5 Mbps BPSK 802.11(n) Mask Compliance
-5 dB EVM RMS power over TX packet
13 Mbps QPSK 802.11(n) Mask Compliance
-10 dB EVM RMS power over TX packet
19.5 Mbps QPSK 802.11(n) Mask Compliance
-13 dB EVM RMS power over TX packet
26 Mbps 16-QAM 802.11(n) Mask Compliance
-16 dB EVM RMS power over TX packet
39 Mbps 16-QAM 802.11(n) Mask Compliance
-19 dB EVM RMS power over TX packet
52 Mbps 64-QAM 802.11(n) Mask Compliance
-22 dB EVM RMS power over TX packet
58.5 Mbps 64-QAM 802.11(n) Mask Compliance
-25 dB EVM RMS power over TX packet
65 Mbps 64-QAM 802.11(n) Mask Compliance
-27 dB EVM RMS power over TX packet
Table 12 WLAN Transmitter RF Characteristics
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 16 of 35
TiWi-C-W Module
Datasheet
WLAN Receiver Characteristics
(TA = +25°C, VCC = 3.10V, 3.30V, & 3.46V)
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps DSSS (b) RX Sensitivity
2 Mbps DSSS (b) RX Sensitivity
5.5 Mbps DSSS (b) RX Sensitivity
11 Mbps DSSS (b) RX Sensitivity
8% PER
8% PER
8% PER
8% PER
-
-
-
-
-90
-90
-89
-87
-
-
-
-
dBm
dBm
dBm
dBm
6 Mbps OFDM (g) RX Sensitivity
9 Mbps OFDM (g) RX Sensitivity
12 Mbps OFDM (g) RX Sensitivity
18 Mbps OFDM (g) RX Sensitivity
24 Mbps OFDM (g) RX Sensitivity
36 Mbps OFDM (g) RX Sensitivity
48 Mbps OFDM (g) RX Sensitivity
54 Mbps OFDM (g) RX Sensitivity
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
-
-
-
-
-
-
-
-
-90
-89
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
-85
-84.5
-82
-79
-75
-73
MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity
MCS1 (13 Mbps) OFDM (n) RX Sensitivity
MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity
MCS3 26 Mbps OFDM (n) RX Sensitivity
MCS4 39 Mbps OFDM (n) RX Sensitivity
MCS5 52 Mbps OFDM (n) RX Sensitivity
MCS6 58.5 Mbps OFDM (n) RX Sensitivity
MCS7 65 Mbps OFDM (n) RX Sensitivity
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
-
-
-
-
-
-
-
-
-90
-87
-85
-82
-79
-74
-73
-71
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
11b RX Overload Level
11g RX Overload Level
11n RX Overload Level
8% PER, 11 Mbps
10% PER, 54 Mbps
10% PER, MCS7
-10
-20
-20
-
-
-
-
-
-
dBm
dBm
dBm
Table 13 WLAN Receiver RF Characteristics
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 17 of 35
TiWi-C-W Module
Datasheet
WLAN Receiver Characteristics
(TA = +85°C, VCC = 3.10V, 3.30V, & 3.46V)
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps DSSS (b) RX Sensitivity
2 Mbps DSSS (b) RX Sensitivity
5.5 Mbps DSSS (b) RX Sensitivity
11 Mbps DSSS (b) RX Sensitivity
8% PER
8% PER
8% PER
8% PER
-
-
-
-
-89
-89
-88
-86
-
-
-
-
dBm
dBm
dBm
dBm
6 Mbps OFDM (g) RX Sensitivity
9 Mbps OFDM (g) RX Sensitivity
12 Mbps OFDM (g) RX Sensitivity
18 Mbps OFDM (g) RX Sensitivity
24 Mbps OFDM (g) RX Sensitivity
36 Mbps OFDM (g) RX Sensitivity
48 Mbps OFDM (g) RX Sensitivity
54 Mbps OFDM (g) RX Sensitivity
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
-
-
-
-
-
-
-
-
-89
-88
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
-84
-83.5
-82
-78
-74
-72
MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity
MCS1 (13 Mbps) OFDM (n) RX Sensitivity
MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity
MCS3 26 Mbps OFDM (n) RX Sensitivity
MCS4 39 Mbps OFDM (n) RX Sensitivity
MCS5 52 Mbps OFDM (n) RX Sensitivity
MCS6 58.5 Mbps OFDM (n) RX Sensitivity
MCS7 65 Mbps OFDM (n) RX Sensitivity
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
-
-
-
-
-
-
-
-
-89
-86
-84
-81
-78
-73
-72
-70
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
11b RX Overload Level
11g RX Overload Level
11n RX Overload Level
8% PER, 11 Mbps
10% PER, 54 Mbps
10% PER, MCS7
-10
-20
-20
-
-
-
-
-
-
dBm
dBm
dBm
Table 14 WLAN Receiver RF Characteristics
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 18 of 35
TiWi-C-W Module
Datasheet
WLAN Receiver Characteristics
(TA = -40°C, VCC = 3.10V, 3.30V, & 3.46V)
Parameter
Test Conditions
Min
Typ
Max
Unit
1 Mbps DSSS (b) RX Sensitivity
2 Mbps DSSS (b) RX Sensitivity
5.5 Mbps DSSS (b) RX Sensitivity
11 Mbps DSSS (b) RX Sensitivity
8% PER
8% PER
8% PER
8% PER
-
-
-
-
-91
-91
-90
-88
-
-
-
-
dBm
dBm
dBm
dBm
6 Mbps OFDM (g) RX Sensitivity
9 Mbps OFDM (g) RX Sensitivity
12 Mbps OFDM (g) RX Sensitivity
18 Mbps OFDM (g) RX Sensitivity
24 Mbps OFDM (g) RX Sensitivity
36 Mbps OFDM (g) RX Sensitivity
48 Mbps OFDM (g) RX Sensitivity
54 Mbps OFDM (g) RX Sensitivity
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
-
-
-
-
-
-
-
-
-91
-90
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
-86
-85.5
-83
-80
-76
-74
MCS0 (6.5 Mbps) OFDM (n) RX Sensitivity
MCS1 (13 Mbps) OFDM (n) RX Sensitivity
MCS2 (19.5 Mbps) OFDM (n) RX Sensitivity
MCS3 26 Mbps OFDM (n) RX Sensitivity
MCS4 39 Mbps OFDM (n) RX Sensitivity
MCS5 52 Mbps OFDM (n) RX Sensitivity
MCS6 58.5 Mbps OFDM (n) RX Sensitivity
MCS7 65 Mbps OFDM (n) RX Sensitivity
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
10% PER
-
-
-
-
-
-
-
-
-91
-88
-86
-83
-80
-75
-74
-72
-
-
-
-
-
-
-
-
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
11b RX Overload Level
11g RX Overload Level
11n RX Overload Level
8% PER, 11 Mbps
10% PER, 54 Mbps
10% PER, MCS7
-10
-20
-20
-
-
-
-
-
-
dBm
dBm
dBm
Table 15 WLAN Receiver RF Characteristics
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 19 of 35
TiWi-C-W Module
Datasheet
UART HOST INTERFACE
The main interface to the TiWi-C-W Module is a Universal Asynchronous Receiver Transmitter (UART). This
section describes the UART host interface.
Overview
The UART is a standard TTL level 4-wire interface (RX, TX, RTS, and CTS) with support for baud rates from
9600 bps to 4.0 Mbps. Default parameters are 115200 baud, 8 data bits, no parity bits, 1 stop bit, hardware
flow control disabled.
UART Interface
Figure 4 UART Connection from TiWi-C-W to Host
UART Signal Description
Port Name
UART1_TXD
Input/Output
Description
UART 1 TRANSMIT DATA OUTPUT
UART 1 RECEIVE DATA INPUT
DO
DI
UART1_RXD
UART1_RTS_N_A0
UART1_CTS_N_A1
DO
DI
UART 1 ACTIVE LOW REQUEST-TO-SEND
UART 1 ACTIVE LOW CLEAR-TO-SEND
Table 16 UART Interface Signal Description
UART TIMING
Figure 5 UART Timing
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 20 of 35
TiWi-C-W Module
Datasheet
Soldering Recommendations
Reflow for Lead Free Solder Paste
•
Optimal solder reflow profile depends on solder paste properties and should be optimized as part of an overall
process development.
•
•
•
It is important to provide a solder reflow profile that matches the solder paste supplier's recommendations.
Temperature ranges beyond that of the solder paste supplier's recommendation could result in poor solderability.
All solder paste suppliers recommend an ideal reflow profile to give the best solderability.
Recommended Reflow Profile for Lead Free Solder
2450c
2170c
2000c
1500c
Pre-Heat
Soldering
1500c to 2000c in
90~120 sec
60~90 sec
Time
Figure 6 Recommended Soldering Profile
Note: The quality of solder joints on the surface mount pads where they contact the host board
should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic
Assemblies, section 8.2.1 “Bottom Only Terminations.”
The information in this document is subject to change without notice.
330-0129-R4.5
Copyright © 2015-2018 LSR
Page 21 of 35
TiWi-C-W Module
Datasheet
CLEANING
SHIPPING, HANDLING, AND STORAGE
In general, cleaning the populated modules is
strongly discouraged. Residuals under the module
cannot be easily removed with any cleaning
process.
Shipping
Bulk orders of the TiWi-C-W modules are delivered
in reels of 2000.
•
Cleaning with water can lead to capillary effects
where water is absorbed into the gap between
the host board and the module. The
Handling
The TiWi-C-W modules contain a highly sensitive
electronic circuitry. Handling without proper ESD
protection may damage the module permanently.
combination of soldering flux residuals and
encapsulated water could lead to short circuits
between neighboring pads. Water could also
damage any stickers or labels.
Moisture Sensitivity Level (MSL)
•
•
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux residuals
into the RF shield, which is not accessible for
post-washing inspection. The solvent could also
damage any stickers or labels.
Per J-STD-020, devices rated as MSL 3 and not
stored in a sealed bag with desiccant pack should be
baked prior to use.
Ultrasonic cleaning could damage the module
permanently.
Devices are packaged in a Moisture Barrier Bag with
a desiccant pack and Humidity Indicator Card (HIC).
Devices that will be subjected to reflow should
reference the HIC and J-STD-033 to determine if
baking is required.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the following:
If baking is required, refer to J-STD-033 for bake
procedure.
•
Proper alignment and centering of the module
over the pads.
Storage
•
•
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
Per J-STD-033, the shelf life of devices in a Moisture
Barrier Bag is 12 months at <40ºC and <90% room
humidity (RH).
REWORK
Do not store in salty air or in an environment with a
high concentration of corrosive gas, such as Cl2,
H2S, NH3, SO2, or NOX.
The TiWi-C-W module can be unsoldered from the
host board if the Moisture Sensitivity Level (MSL)
requirements are met as described in this
datasheet.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
Never attempt a rework on the module
itself, e.g. replacing individual
components. Such actions will terminate
warranty coverage.
The information in this document is subject to change without notice.
330-0129-R4.5 Copyright © 2015-2018 LSR
Page 22 of 35
TiWi-C-W Module
Datasheet
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
The information in this document is subject to change without notice.
330-0129-R4.5
Copyright © 2015-2018 LSR
Page 23 of 35
TiWi-C-W Module
Datasheet
AGENCY CERTIFICATIONS
FCC ID: TFB-1001, 15.247
IC ID: 5969A-1001, RSS 210
CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489
AGENCY STATEMENTS
Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the interference by one of the
following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
The information in this document is subject to change without notice.
330-0129-R4.5
Copyright © 2015-2018 LSR
Page 24 of 35
TiWi-C-W Module
Datasheet
Industry Canada Statements
This Device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.
To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the
equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.
This device has been designed to operate with the antenna(s) listed below and having a maximum gain of 2.0 dBi
(LSR Dipole), 2.0 dBi (LSR FlexPIFA), 2.0 dBi (LSR mFlexPIFA), and 0.5dBi (Johanson Chip). Antennas not included
in this list or having a gain greater than 2.0 dBi, 2.0 dBi, 2.0 dBi, and 0.5dBi are strictly prohibited for use with
this device. The required antenna impedance is 50 ohms.
List of all Antennas Acceptable for use with the Transmitter
1) LSR 001-0001 2.4 GHz center-fed dipole antenna and LSR 080-0001 U.FL to Reverse Polarity SMA connector
cable.
2) LSR 001-0014 2.4 GHz FlexPIFA antenna.
3) LSR 001-0030 2.4 GHz Metal FlexPIFA (mFlexPIFA) antenna.
4) Johanson 2450AT18A100 chip antenna.
Cet appareil est conforme avec Industrie Canada , exempts de licence standard RSS (s). L'opération est soumise
aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit
accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de
l'appareil.
Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de
manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une
communication réussie.
Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de 2,0 dBi
(LSR Dipole), 2.0 dBi (LSR FlexPIFA), 2.0 dBi (LSR mFlexPIFA), et 0.5dBi (Johanson Chip). Antennes pas inclus
dans cette liste ou présentant un gain supérieure à 2,0 dBi, 2.0 dBi, 2.0 dBi, et 0.5dBi sont strictement
interdits pour une utilisation avec cet appareil. L'impédance d'antenne requise est de 50 ohms.
Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur
1) Antenne LSR 001-0001 2.4 GHz de centre-dipôle alimenté et LSR 080-0001 U.FL inverser câble connecteur SMA à
polarité.
2) LSR 001-0014 antenne FlexPIFA 2,4 GHz.
3) LSR 001-0030 antenne Métal FlexPIFA (mFlexPIFA) 2,4 GHz.
4) Antenne de puce Johanson 2450AT18A100.
The information in this document is subject to change without notice.
330-0129-R4.5
Copyright © 2015-2018 LSR
Page 25 of 35
TiWi-C-W Module
Datasheet
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS
The TiWi-C-W Module has been certified for integration into products only by OEM integrators under the
following conditions:
This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must
be installed to provide a separation distance of at least 20cm from all person and not be co-located with any
other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures.
As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional
compliance requirements required with this module installed (for example, digital device
emissions, PC peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-
location with another transmitter), then the FCC and Industry Canada authorizations are no longer
considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In
these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC and Industry Canada authorization.
Le module de TiWi-C-W a été certifié pour l'intégration dans des produits uniquement par des
intégrateurs OEM dans les conditions suivantes:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seul dans lequel les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être colocalisés avec les autres émetteurs, sauf en conformité avec la
FCC et de l'Industrie Canada, multi-émetteur procédures produit.
Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas
tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les
exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil
numérique, les exigences de périphériques PC, etc.)
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines
configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations
Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut
pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer
le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada
l'autorisation.
The information in this document is subject to change without notice.
330-0129-R4.5
Copyright © 2015-2018 LSR
Page 26 of 35
TiWi-C-W Module
Datasheet
OEM LABELING REQUIREMENTS FOR END-PRODUCT
The TiWi-C-W module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification
numbers are not visible when the module is installed inside another device, as such the end device into which
the module is installed must display a label referring to the enclosed module. The final end product must be
labeled in a visible area with the following:
“Contains Transmitter Module FCC ID: TFB-1001”
“Contains Transmitter Module IC: 5969A-1001”
or
“Contains FCC ID: TFB-1001”
“Contains IC: 5969A-1001”
The OEM of the TiWi-C-W Module must only use the approved antenna(s) listed above, which have been
certified with this module.
Le module de TiWi-C-W est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la FCC
et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil,
comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant référence
au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant:
“Contient Module émetteur FCC ID: TFB-1001"
“Contient Module émetteur IC: 5969A-1001"
ou
“Contient FCC ID: TFB-1001"
“Contient IC: 5969A-1001"
Les OEM du module TiWi-C-W ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce
module.
The information in this document is subject to change without notice.
330-0129-R4.5
Copyright © 2015-2018 LSR
Page 27 of 35
TiWi-C-W Module
Datasheet
OEM END PRODUCT USER MANUAL STATEMENTS
The OEM integrator should not to provide information to the end user regarding how to install or remove this RF
module or change RF related parameters in the user manual of the end product.
The user manual for the end product must include the following information in a prominent location:
This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must
be installed to provide a separation distance of at least 20cm from all person and not be co-located with any
other transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures.
Other user manual statements may apply.
L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de
supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final.
Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans unendroit bien en
vue:
Ce dispositif est accordé pour une utilisation dans des configurations mobiles seule dans laquelle les
antennes utilisées pour cet émetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toute personne et ne pas être co-localisés avec les autres émetteurs, sauf en conformité
avec FCC et Industrie Canada, multi-émetteur procédures produit.
Autres déclarations manuel de l'utilisateur peuvent s'appliquer.
The information in this document is subject to change without notice.
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TiWi-C-W Module
Datasheet
EUROPE
CE Notice
This device has been tested and certified for use in the European Union. See the Declaration of Conformity
(DOC) for specifics.
If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU
standards. A Declaration of Conformity must be issued and kept on file as described in the Radio and
Telecommunications Terminal Equipment (R&TTE) Directive.
The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive.
Declaration of Conformity (DOC)
This DOC can be downloaded from the LSR Wiki.
The information in this document is subject to change without notice.
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Datasheet
MECHANICAL DATA
Figure 7 Module Mechanical Dimensions (Maximum Module Height = 1.40mm)
The information in this document is subject to change without notice.
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Datasheet
PCB FOOTPRINT
Figure 8 TiWi-C-W Footprint (Top View)
Note:
Three Pad Sizes
Solder Mask
Type A - 0.42 x 0.42 mm
Type B - 0.35 x 0.40 mm
Type C - 5.0 x 5.0 mm
0.52 x 0.52 mm
0.45 x 0.50mm (Not Centered on Type A pads)
5.1 x 5.1 mm
The information in this document is subject to change without notice.
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Datasheet
RECOMMENDED SOLDER STENCIL
Figure 9 - Recommended Solder Stencil (Top View)
The information in this document is subject to change without notice.
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Datasheet
TAPE AND REEL PACKAGING
(MODULE MUST BE IN THIS ORIENTATION WHEN FEEDING)
Figure 10 Tape and Reel Specification
The information in this document is subject to change without notice.
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Datasheet
DEVICE MARKINGS
Rev 1 Devices
LSR
Model: TiWi-C-W
P/N: 450-0118-R1
FCC ID: TFB-1001
IC: 5969A-1001
50C0D0001
Where R1 = Revision 1
Manufacturer Code: 50C0D0001
Rev 3 Devices
LSR
Model:TiWi-C-W
P/N:450-0118-R3
FCC ID:TFB-1001
IC:5969A-1001
50C0D0001
Where R3 = Revisi on 3
Manufacturer Code: 50C0D0001
*Skipped Rev 2 to align Internal MRP System*
The information in this document is subject to change without notice.
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Copyright © 2015-2018 LSR
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Datasheet
CONTACTING LSR
Headquarters
LS Research, LLC
W66 N220 Commerce Court
Cedarburg, WI 53012-2636
USA
Tel: (262) 375-4400
Fax: (262) 375-4248
Website
www.lsr.com
forum.lsr.com
sales@lsr.com
Technical Support
Sales Contact
© Copyright 2018 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed
to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and
application of Laird materials or products rests with the end user since Laird and its agents cannot be aware of all potential
uses. Laird makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird
materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or any of its affiliates or agents shall
not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Terms
and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a
tradename herein, Laird means Laird Limited due to the acquisition by Advent or one or more subsidiaries of Laird Limited.
LairdTM, Laird TechnologiesTM, corresponding logos, and other marks are trademarks or registered trademarks of Laird.
Other marks may be the property of third parties. Nothing herein provides a license under any Laird or any third party
intellectual property right.
The information in this document is subject to change without notice.
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Copyright © 2015-2018 LSR
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