TGON9070 [LSTD]
High Thermal Conductive Graphite Sheet;
| 型号： | TGON9070 |
| 厂家： | 
Laird Connectivity |
| 描述： | High Thermal Conductive Graphite Sheet |
| 文件： | 总2页 (文件大小：217K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM
Tgon 9000
High Thermal Conductive Graphite Sheet
Preliminary
HIGH THERMAL CONDUCTIVE GRAPHITE SHEET
Tgon™ 9000 is a syntheꢀc graphite thermal interface material consisꢀng of carbon
in-plane mono-crystal structure.
Tgon™ 9000 is ultra-thin, light-weight, flexible and offers excellent in-plane thermal
conducꢀvity. Ideal for variety of heat spreading applicaꢀons where in-plan thermal
conducꢀvity dominates and limited spaces.
FEATURES AND BENEFITS
MARKETS
• Thermal Conducꢀvity: 500 to 1900W/mK
• 4 ꢀmes thermal conducꢀvity than copper
• Reduce hot spots and protect sensiꢀve areas
• Handheld devices
• Mobile compuꢀng
• Display
• Enables slim device designs with ultra-thin
of 17um
• Lighꢀng
• Telecom
• Light weight with density of 2.05~2.25
5g/cm³ for thickness of 17um & 25um
• Flexible (Withstand more than 10,000 ꢀmes
bending with R=5mm)
• Ease of manufacturing for high volume
producꢀon
PRODUCT NAME AND KEY PROPERTIES AS BELOW:
Test
Method
Product Name
Tgon 9017 Tgon 9025 Tgon 9040 Tgon 9070 Tgon 9100
ASTM
D374
0.017+/-
0.005
0.025+/-
0.005
Thickness (mm)
0.04+/-0.005 0.07+/-0.01 0.1+/-0.01
X,Y
direcꢀon
Thermal
conducꢀvity
(W/mK)
1650~1900 1500~1700 1150~1400 700~1000
500~700
ASTM
E1461
Z direcꢀon
15
15
15
8
15
7
15
7
ASTM
E1461
Thermal diffusivity (cm²/s)
Density (g/cm³)
9
9
ASTM
D792
2.05~2.25 2.05~2.25 1.65~1.85
1.0~1.3
0.85
0.7~1.0
0.85
ASTM
E1269
Specific heat (50˚C)(J/gK)
0.85
0.85
0.85
Over 100
hours of
tesꢀng
Heat resistance (˚C)
400
400
400
400
400
X,Y
direcꢀon
Extensional
strength
(MPa)
39
28
23
20
19.2
0.65
ASTM
F152
Z direcꢀon
0.1
0.4
0.4
0.4
Bending test(ꢀmes)
(R5/180˚)
ASTM
D2176
10,000 or
more
10,000 or
more
10,000 or
more
10,000 or
more
10,000 or
more
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
Electric conducꢀvity
(S/cm)
ASTM
E1269
20000
20000
20000
96000
96000
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
TM
Tgon 9000
High Thermal Conductive Graphite Sheet
Preliminary
PRODUCT STRUCTURE
• There are two types of product structure as follows
• Tgon™9000 series: Tgon™9000 sheet only
• Tgon™9000PA series: Tgon™9000 with one-side
PET film & one-side adhesive
• Below is the product structures available:
Graphite Only
Laminated (Insulaꢀon & Adhesive)
Type
Tgon 9000 series
Tgon 9000PA series
Structure
Features
Thickness
Graphite Sheet
With PET film & Adhesive
PET film: 5µm, 10µm
Adhesive: 5µm, 10µm, 30µm
Graphite: 17µm, 25µm, 40µm, 70µm,
100µm
Graphite: 17µm, 25µm, 40µm,
70µm, 100µm
Standard Size
180 x 220mm
180 x 220mm
• Die-cut edge opꢀons:
Flush Edge
Envelope Seal
Type
Tgon 9000PA series
Tgon 9000EPA series
Structure
PART NUMBER INFORMATION
T
g
o
n
9
0
2
5
P
A
,
1
0
1
0
Product Code
Structure &
PET
Adhesive
Graphite Thickness
Edge Opꢀons
Thickness Thickness
17=>
25=>
40=>
70=>
17µm
25µm
40µm
70µm
PA Laminated
05=> 5µm
05=> 5µm
with PET &
Adhesive with
flush edge
10=> 10µm 10=> 10µm
30=> 30µm
EPA Laminated
with PET &
Adhesive with
envelope seal
100=> 100µm
THR-DS-TGON 9000 032415
Any information furnished by Laird and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use
and application of Laird materials rests with the end user, since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to the fitness,
merchantability or suitability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc or any of its affiliates or agents shall not be liable
for incidental or consequential damages of any kind. All Laird products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time,
a copy of which will be furnished upon request. © Copyright 2014 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Logo, and other marks
are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties.
Nothing herein provides a license under any Laird or any third party intellectual property rights.
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