LBH1000N_13

更新时间:2024-09-18 22:12:26
品牌:LUXPIA
描述:Specification for Approval

LBH1000N_13 概述

Specification for Approval

LBH1000N_13 数据手册

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Specification for Approval  
(Ver 1.0)  
Part No. : LBH1000N  
comments  
LUXPIA Co., Ltd.  
Designed by Checked by Approved by  
Approved by Approved by Approved by  
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Date :  
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Date :  
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LUXPIA CO.,LTD.  
948-1, Dunsan-Li Bongdong-Eup, Wanju-Gun, JeonBuk, Korea  
Tel Tel 82-70-8671-2400 Fax 82-70-8620-8080  
-
CONTENTS  
-
1. Features  
2. Package Outline Dimensions and Materials  
3. Absolute Maximum Ratings  
4. Electro-Optical Characteristics  
5. Materials  
6. Taping  
7. Packing  
8. Reliability  
9. Cautions  
10. Warranty  
11. Others  
12. Characteristic Diagrams  
(Ver 1.0)  
1/13  
1. Features  
Package : SMD type (1 Chip in 1 PKG )  
1.6 × 0.8 × 0.4 mm2 (L×W×H) size surface mount type  
Viewing angle : extremely wide(160˚)  
Soldering methods : IR reflow soldering  
2. Package Outline Dimensions and Recommended Solder Patterns  
(Ver 1.0)  
2/13  
3. Absolute Maximum Ratings  
(Ta=25)  
item  
symbol  
value  
unit  
mA  
mA  
V
forward current  
IF  
IFP  
10  
100  
pulse forward current 1)  
reverse voltage  
VR  
5
power dissipation  
operating temperature  
storage temperature  
PD  
70  
mW  
Topr  
Tstg  
-30 to+85  
-40 to +100  
1)  
I
FP  
conditions : pulse width 10msec & duty ratio 1/10  
4. Electro-Optical Characteristics  
(Ta=25)  
item  
rank  
V27  
V28  
V29  
V30  
A1  
A2  
A3  
A4  
D
symbol  
condition  
min  
typ  
max  
2.80  
2.90  
3.00  
3.10  
457.5  
460  
462.5  
465  
12  
unit  
2.70  
2.80  
2.90  
3.00  
455  
457.5  
460  
462.5  
8.5  
-
-
forward  
voltage 3)  
VF  
IF= 5mA  
V
-
-
-
-
-
-
-
Dominant  
(D  
IF= 5m A  
nm  
Wavelength  
E
12  
-
16  
luminous intensity  
IV  
IF= 5mA  
VR=5V  
mcd  
4)  
F
16  
-
21  
G
21  
-
28  
reverse  
current  
-
IR  
-
-
50  
3) Forward voltages are tested at a current pulse duration of 10 ms and an accuracy within ±0.1V.  
4) The allowance of luminous intensity measurement is within ±11%.  
* To avoid optical difference, please do not mix differently ranked product  
* All measurements were made under the standardized environment of LUXPIA.  
(Ver 1.0)  
3/13  
5. Materials  
item  
LED chip  
Wire  
material  
InGaN  
gold  
PCB  
C3965 (Cu/Ni/Au plating)  
Epoxy + Silicone resin  
encapsulation  
6. Taping  
6.1. tape (material : PS conductive, 104~105)  
(units : mm)  
(Ver 1.0)  
4/13  
6.2. wheel (color : black, material : PS conductive, 109~1012)  
(units : mm)  
- quantity per reel  
6.3. label  
LBH1000N : 5,000pcs  
part no.  
size (L X W) : 85mm × 50mm  
LBH1000N  
A1 - E- 1  
5,000ea  
color rank  
IV rank  
VF rank  
(Ver 1.0)  
5/13  
7. Packing  
• The LEDs are packed in cardboard boxes after taping. The label shows part number, lot number, rank,  
and quantity.  
• In order to protect the LEDs from mechanical shock, they are packed with cardboard boxes  
for transportation.  
• The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,  
so cautions must be taken to prevent any possible damage.  
• The boxes are not water-resistant and, therefore, must be kept away from water and moisture.  
• When the LEDs are transported, it is recommended that the same packing method as Luxpia's is used.  
• If noticeable damage on a box appears upon arrival at the user’s warehouse, the user should submit a  
claim to Luxpia within one week after arrival of the products.  
(Ver 1.0)  
6/13  
8. Reliability  
8.1. test items and results  
Standard  
Test  
number of  
damaged  
sample  
no.  
test item  
Test Conditions  
Note  
Method  
resistance to soldering  
heat  
Tsld=260oC, 10sec  
(pre treatment  
1
2
3
JESD22-B106  
2 times  
0/45  
0/45  
0/45  
(reflow)  
30oC,70%,168hrs)  
solderability  
(reflow)  
EIAJED4701-200  
JESD22-B102  
1 time  
Tsld=215±5oC, 3sec  
over 95%  
-40oC through +25oC to  
+100℃  
EIAJED4701-100  
JESD22-A104  
temperature cycle  
100 cycles  
(30min/5min/30min)  
high temperature  
storage  
EIAJED4701-200  
JESD22-A103  
4
5
6
7
Ta=100℃  
Ta=60, RH=90%  
Ta=-30℃  
1000 hrs  
1000 hrs  
1000 hrs  
500 hrs  
0/45  
0/45  
0/45  
0/45  
high humidity and  
temperature storage  
low temperature  
storage  
EIAJED4701-200  
JESD22-A101  
EIAJED4701-200  
JESD22-A103  
steady-state operating  
lifetime test  
MIL-STD-883E  
JESD22-A108  
Ta=25, IF=10mA  
steady-state operating  
lifetime of high  
humidity and  
Ta=60, RH=90%,  
8
9
-
500 hrs  
500 hrs  
0/45  
0/45  
IF=5mA  
temperature  
steady-state operating  
lifetime of low  
MIL-STD-810F  
JESD22-A108  
Ta=-30, IF=10mA  
temperature  
* Reliability is measure on the thermal emission PCB for LED Reliability test.  
8.2. criteria for judging the damage  
criteria for judgement  
item  
symbol  
test condition  
min  
max  
U.S.L.4) × 1.2  
forward voltage  
VF  
IV  
IF = 5mA  
IF = 5mA  
-
luminous intensity  
L.S.L.5) × 0.5  
-
4) U.S.L. : upper standard level  
5) L.S.L. : lower standard level  
(Ver 1.0)  
7/13  
9. Cautions  
White LEDs are devices which are materialized by combining Blue LEDs and special phosphors.  
Consequently, the color of White LEDs is subject to change a little by an operating current. Care should be  
taken after due consideration when using LEDs.  
(1) Moisture-Proof Package  
• When moisture is absorbed into the SMT package it may vaporize and expand products during soldering.  
There is a possibility that this may cause exfoliation of the contacts and damage to the optical characteristics  
of the LEDs. For this reason, the moisture-proof package is used to keep moisture to a minimum in the  
package.  
• A package of a moisture-absorbent material (silica gel) is inserted into the shielding bag. The silica gel  
changes its color from blue to pink as it absorbs moisture.  
(2) Storage  
• Storage Conditions  
- After opening the package :  
The LEDs should be kept at 5~30or less and 60%RH or less. The LEDs should be used within a year.  
When storing the LEDs, moisture-proof packaging with moisture-absorbent material (silicagel) is  
recommended. If unused LEDs remain, they should be stored in moisture-proof packages, such as sealed  
containers with packages of moisture-absorbent material (silica gel). It is also recommended to return the  
LEDs to the original moisture-proof bag and to reseal the moisture-proof bag again.  
• If the moisture-absorbent material (silica gel) has faded away or the LEDs have exceeded the recommended  
storage time, baking treatment should be performed using the following conditions.  
- Baking treatment : more than 24 hours at 125±5℃  
(This condition is LED standards which are not in the reel)  
• Luxpia's LED electrode sections are comprised of a silver-plated copper alloy. The silver surface may be  
affected by environments which contain corrosive gases and so on. Please avoid condition which may cause  
difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible.  
• Please avoid rapid transitions in ambient temperature, especially in high humidity environments where  
condensation can occur.  
(3) Heat Generation  
• Thermal design of the end product is of paramount importance. Please consider the heat generation of the  
LED when the system is designed. The coefficient of temperature increase per input electric power is  
affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as  
other components. It is necessary to avoid intense heat generation and operate within the maximum ratings  
given in the specification.  
• The operating current should be decided after considering the ambient maximum temperature of LEDs.  
(Ver 1.0)  
8/13  
(4) Soldering Conditions  
• The LEDs can be soldered in place using the reflow soldering method. Luxpia does not make any  
guarantee on the LEDs after they have been assembled using the dip soldering method.  
• Recommended soldering conditions  
Reflow Soldering  
Lead Solder  
Hand Soldering  
Lead-free Solder  
200~220℃  
pre-heat  
temperature  
350max  
3sec max  
120~150℃  
pre-heat time  
peak temperature  
soldering time  
120sec max  
240max  
120sec max  
260max  
(one time only)  
soldering time  
condition  
10sec max  
5sec max  
refer to profile ①  
refer to profile ②  
* After reflow soldering, rapid cooling should be avoided.  
[temperature-profile (surface of circuit board)]  
Use the conditions shown to the following figures.  
<: Lead Solder>  
2~ 3℃/sec  
240℃ M ax  
10sec M ax  
T
e
m
p
Pre-heating  
120~ 150℃  
2~ 5℃/sec  
60sec  
120sec M ax  
M ax  
Room Tem p  
Tim e [sec]  
<: Lead-free Solder>  
3~ 5℃/sec  
260℃ M ax  
5sec M ax  
Pre-heating  
200~ 220℃  
T
e
m
p
1~ 5℃/sec  
45sec  
M ax  
120sec M ax  
Room Tem p  
Tim e [sec]  
(Ver 1.0)  
9/13  
• Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during  
air reflow. It is recommended that the User use the nitrogen reflow method.  
• Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-  
head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the  
LEDs will or will not be damaged by repairing.  
• Reflow soldering should not be done more than two times.  
• When soldering, do not put stress on the LEDs during heating.  
• After soldering, do not warp the circuit board.  
(5) Cleaning  
• It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other  
solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or  
not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. Do not clean  
the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs  
depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should  
be done to confirm whether any damage to the LEDs will occur.  
(6) Static Electricity  
• Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-  
electrostatic glove be used when handling the LEDs.  
• All devices, equipment and machinery must be properly grounded. It is recommended that measurements  
be taken against surge voltage to the equipment that mounts the LEDs.  
• When inspecting the final products in which LEDs were assembled, it is recommended to check whether the  
assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on  
test or a VF test at a lower current (below 1mA is recommended).  
• Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the  
forward voltage becomes lower, or the LEDs do not light at the low current.  
- criteria : VF > 2.0V at IF=0.5㎃  
(7) Others  
• Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when  
using the LEDs with matrix drive.  
• The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking  
directly at the LEDs with unaided eyes for more than a few seconds.  
• Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions  
during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it.  
10. Warranty  
(1) Luxpia warrants that its LEDs conform to the foregoing specifications and that Luxpia will convey good title  
to all LEDs sold.  
(2) LUXPIA disclaims all other warranties including the implied warranties of merchantability and fitness for a  
particular purpose.  
(3) In the event any LED supplied by Luxpia is found not to conform to the foregoing specifications within  
ninety days of receipt, Luxpia will repair or replace the LED, at Luxpia’s discretion, provided that the User (a)  
promptly notifies Luxpia in writing of the details of the defect (b) ships the LEDs at the User’s expense to  
Luxpia for examination, and (c) the defect is due to the negligence of Luxpia and not mishandling or misuse  
by the User.  
(4) Luxpia will not take responsibility for any trouble that is caused by using the LEDs at conditions exceeding  
our specifications.  
(5) These specifications are applied only when a LED stands alone and it is strongly recommended that the  
User of the LEDs confirms the properties upon assembly. Luxpia is not responsible for failures caused during  
and after assembling. It will be excepted from the rule if the failure would caused undoubtedly by Luxpia.  
(Ver 1.0)  
10/13  
(6) A claim report stating details about the defect shall be made when returning defective LEDs. Luxpia will  
investigate the report immediately and inform the user of the results.  
(7) The LEDs described in the specification are intended to be used for ordinary electronic equipment (such as  
office equipment, communications equipment, on the applications in which exceptional quality and reliability  
are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health  
(such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic  
control equipment, life support systems and safety devices)  
(8) LUXPIA’s liability for defective lamps shall be limited to replacement and in no event shall LUXPIA be liable  
for consequential damage or lost profits.  
11. Others  
(1) The warranties of quality set forth herein are exclusive. All previous negotiations and agreements not  
specifically incorporated herein are superseded and rendered null and void.  
(2) Both parties shall sincerely try to find a solution when any disagreement occurs regarding these  
specifications.  
(3) User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written  
consent from Luxpia. When defective LEDs are found, the User shall inform Luxpia directly before  
disassembling or analysis.  
(4) These specifications can be revised upon mutual agreement.  
(5) Luxpia understands that the User accepts the content of these specifications, if the User does not return  
these specifications with signatures within 3 weeks after receipt.  
(Ver 1.0)  
11/13  
12. Characteristic Diagrams  
(1) forward voltage vs. forward current  
(2) forward current vs. relative luminosity  
(Ta=25)  
(Ta=25)  
forward voltage VF[V]  
forward current IF[mA]  
(3) ambient temperature vs. allowable  
forward current  
(4) ambient temperature vs. relative luminosity  
(IF=5mA)  
60  
10  
50  
40  
30  
1
20  
10  
0.1  
20  
-20  
0
40  
60  
80  
100  
-40  
-20  
0
20  
40  
60  
80  
100  
ambient temperature Ta[]  
ambient temperature Ta[]  
(Ver 1.0)  
12/13  
(5) relative spectral emission  
V(λ) = standard eye response curve  
(Ta=25, IF=5mA)  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
450  
350  
550  
650  
750  
Wavelength [nm]  
(6) radiation characteristics  
(Ta=25, IF=5mA)  
50  
0
50  
100  
100  
Relative Luminous Intensity Iv[%]  
(Ver 1.0)  
13/13  

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