1408-12 [Linear]

6 Channel, 12-Bit, 600ksps Simultaneous Sampling ADC with Shutdown; 6通道, 12位, 600ksps同时采样ADC ,带有关断
1408-12
型号: 1408-12
厂家: Linear    Linear
描述:

6 Channel, 12-Bit, 600ksps Simultaneous Sampling ADC with Shutdown
6通道, 12位, 600ksps同时采样ADC ,带有关断

文件: 总20页 (文件大小:267K)
中文:  中文翻译
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LTC1408-12  
6 Channel, 12-Bit, 600ksps  
Simultaneous Sampling ADC  
U
with Shutdown  
FEATURES  
DESCRIPTIO  
The LTC®1408-12 is a 12-bit, 600ksps ADC with six  
simultaneously sampled differential inputs. The device  
draws only 5mA from a single 3V supply, and comes in a  
tiny 32 pin (5mm× 5mm) QFN package. A SLEEP shut-  
down feature further reduces power consumption to  
6µW. The combination of low power and tiny package  
makes the LTC1408-12 suitable for portable applications.  
600ksps ADC with 6 Simultaneously Sampled  
Differential Inputs  
100ksps Throughput per Channel  
72dB SINAD  
Low Power Dissipation: 15mW  
3V Single Supply Operation  
2.5V Internal Bandgap Reference, Can be Overdriven  
with External Reference  
3-Wire SPI-Compatible Serial Interface  
The LTC1408-12 contains six separate differential inputs  
that are sampled simultaneously on the rising edge of the  
CONV signal. These six sampled inputs are then  
converted at a rate of 100ksps per channel.  
0V to 2.5V Unipolar, or ±1.25V Bipolar Differential  
Input Range  
SLEEP (6µW) Shutdown Mode  
The 83dB common mode rejection allows users to  
eliminate ground loops and common mode noise by  
measuring signals differentially from the source.  
NAP (3.3mW) Shutdown Mode  
Internal Conversion Triggered by CONV  
83dB Common Mode Rejection  
Tiny 32-Pin (5mm × 5mm) QFN Package  
The device converts 0V to 2.5V unipolar inputs differen-  
tially, or ±1.25V bipolar inputs also differentially,  
depending on the state of the BIP pin. Any analog input  
may swing rail-to-rail as long as the differential input  
range is maintained.  
U
APPLICATIO S  
Multiphase Power Measurement  
Multiphase Motor Control  
The conversion sequence can be abbreviated to convert  
fewer than six channels, depending on the logic state of  
the SEL2, SEL1 and SEL0 inputs.  
Data Acquisition Systems  
Uninterruptable Power Supplies  
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.  
All other trademarks are the property of their respective owners.  
Protected by U.S. Patents including 6084440, 6522187.  
The serial interface sends out the six conversion results in  
96 clocks for compatibility with standard serial interfaces.  
W
BLOCK DIAGRA  
+
+
+
+
+
+
10µF  
3V  
25  
CH5  
CH5  
CH4  
CH4  
CH3  
CH3  
CH2  
CH2  
CH1  
CH1  
CH0  
CH0  
V
CC  
V
DD  
21  
20 19 18  
17 16 15  
14 12 11  
13  
10  
9
8
7
6
5
4
24  
12-BIT LATCH 0  
12-BIT LATCH 1  
12-BIT LATCH 2  
12-BIT LATCH 3  
12-BIT LATCH 4  
12-BIT LATCH 5  
OV  
3V  
DD  
3
1
2
THREE-  
STATE  
SERIAL  
OUTPUT  
PORT  
S AND H  
S AND H  
S AND H  
S AND H  
S AND H  
S AND H  
600ksps  
12-BIT ADC  
SD0  
0.1µF  
OGND  
MUX  
TIMING  
LOGIC  
CONV  
30  
32  
31  
2.5V  
REFERENCE  
SCK  
DGND  
V
GND  
22  
REF  
23  
33  
29  
26  
27  
28  
10µF  
235114 TA01  
BIP  
SEL2 SEL1 SEL0  
140812f  
1
LTC1408-12  
W U  
W W W  
U
/O  
PACKAGE RDER I FOR ATIO  
ABSOLUTE AXI U RATI GS  
(Notes 1, 2)  
TOP VIEW  
ORDER PART  
NUMBER  
Supply Voltage (VDD, VCC, OVDD) .............................. 4V  
Analog and VREF Input Voltages  
(Note 3) ................................... – 0.3V to (VDD + 0.3V)  
Digital Input Voltages .................. – 0.3V to (VDD + 0.3V)  
Digital Output Voltage.................. – 0.3V to (VDD + 0.3V)  
Power Dissipation.............................................. 100mW  
Operation Temperature Range  
LTC1408C-12 .......................................... 0°C to 70°C  
LTC1408I-12 ...................................... 40°C to 85°C  
Storage Temperature Range ................. 65°C to 125°C  
32 31 30 29 28 27 26 25  
1
2
3
4
5
6
7
8
24  
23  
22  
21  
20  
19  
18  
17  
SDO  
V
V
CC  
LTC1408CUH-12  
LTC1408IUH-12  
OGND  
REF  
OV  
GND  
DD  
+
CH0  
CH0  
CH5–  
CH5+  
GND  
33  
GND  
+
CH1  
CH4–  
CH4+  
CH1  
QFN PART MARKING  
1408-12  
9
10 11 12 13 14 15 16  
QFN PACKAGE  
32-PIN (5mm × 5mm) PLASTIC QFN  
TJMAX = 125°C, θJA = 34°C/ W  
EXPOSED PIN IS GND (PAD 33)  
MUST BE SOLDERED TO PCB  
Order Options Tape and Reel: Add #TR  
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF  
Lead Free Part Marking: http://www.linear.com/leadfree/  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
U
CO VERTER CHARACTERISTICS  
The  
denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at T = 25°C. With internal reference, V = V = 3V.  
A
DD  
CC  
PARAMETER  
CONDITIONS  
MIN  
12  
TYP  
MAX  
UNITS  
Bits  
LSB  
mV  
Resolution (No Missing Codes)  
Integral Linearity Error  
Offset Error  
(Note 5)  
(Note 4)  
–1  
± 0.25  
±1  
1
4.5  
3
–4.5  
–3  
Offset Match from CH0 to CH5  
Range Error  
±0.5  
±2  
mV  
(Note 4)  
–12  
–5  
12  
5
mV  
Range Match from CH0 to CH5  
Range Tempco  
±1  
mV  
Internal Reference (Note 4)  
External Reference  
± 15  
±1  
ppm/°C  
ppm/°C  
U
U
A ALOG I PUT  
The  
A
denotes the specifications which apply over the full operating temperature range,  
otherwise specifications are at T = 25°C. With internal reference, V = V = 3V.  
DD  
CC  
SYMBOL PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
V
Analog Differential Input Range (Notes 3, 8, 9)  
2.7V V 3.3V  
0 to 2.5  
V
V
IN  
DD  
Analog Common Mode + Differential  
Input Range  
0 to V  
CM  
DD  
(Note 8)  
(Note 6)  
I
Analog Input Leakage Current  
1
µA  
pF  
ns  
ns  
ps  
ps  
IN  
C
Analog Input Capacitance  
13  
IN  
t
t
t
t
Sample-and-Hold Acquisition Time  
Sample-and-Hold Aperture Delay Time  
Sample-and-Hold Aperture Delay Time Jitter  
Channel to Channel Aperture Skew  
Analog Input Common Mode Rejection Ratio  
39  
ACQ  
AP  
1
0.3  
JITTER  
SK  
200  
CMRR  
f
f
= 100kHz, V = 0V to 3V  
–83  
–67  
dB  
dB  
IN  
IN  
IN  
= 10MHz, V = 0V to 3V  
IN  
140812f  
2
LTC1408-12  
U W  
DY A IC ACCURACY  
The  
denotes the specifications which apply over the full operating temperature range,  
otherwise specifications are at T = 25°C. With internal reference, V = V = 3V.  
A
DD  
CC  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
SINAD  
Signal-to-Noise Plus  
Distortion Ratio  
100kHz Input Signal  
300kHz Input Signal  
70  
72  
72  
dB  
dB  
THD  
SFDR  
IMD  
Total Harmonic  
Distortion  
100kHz First 5 Harmonics  
300kHz First 5 Harmonics  
–80  
–90  
–86  
dB  
dB  
Spurious Free  
Dynamic Range  
100kHz Input Signal  
300kHz Input Signal  
90  
86  
dB  
dB  
Intermodulation  
Distortion  
0.625V , 833kHz into CH0+, 0.625V , 841kHz into CH0–.  
–80  
dB  
P-P  
P-P  
Bipolar Mode. Also Applicable to Other Channels  
Code-to-Code  
V
REF  
= 2.5V (Note 17)  
0.2  
LSB  
RMS  
Transition Noise  
Full Power Bandwidth  
V
= 2.5V , SDO = 11585LSB (–3dBFS) (Note 15)  
50  
5
MHz  
MHz  
IN  
P-P  
P-P  
Full Linear Bandwidth S/(N + D) 68dB, Bipolar Differential Input  
U U  
U
T = 25°C. V = V = 3V.  
I TER AL REFERE CE CHARACTERISTICS  
A
DD  
CC  
PARAMETER  
CONDITIONS  
= 0  
MIN  
TYP  
MAX  
UNITS  
V
V
V
V
V
V
Output Voltage  
Output Tempco  
Line Regulation  
Output Resistance  
Settling Time  
I
2.5  
15  
REF  
REF  
REF  
REF  
REF  
OUT  
ppm/°C  
µV/V  
V
= 2.7V to 3.6V, V = 2.5V  
600  
0.2  
2
DD  
REF  
Load Current = 0.5mA  
= 10µF  
C
ms  
REF  
External V  
Input Range  
2.55  
V
DD  
V
REF  
U
U
The  
DD  
denotes the specifications which apply over the  
CC  
DIGITAL I PUTS A D DIGITAL OUTPUTS  
full operating temperature range, otherwise specifications are at T = 25°C. V = V = 3V.  
A
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
V
High Level Input Voltage  
Low Level Input Voltage  
Digital Input Current  
V
V
V
= 3.3V  
= 2.7V  
2.4  
V
V
IH  
IL  
DD  
DD  
IN  
0.6  
I
= 0V to V  
± 10  
µA  
pF  
V
IN  
DD  
C
V
V
Digital Input Capacitance  
High Level Output Voltage  
Low Level Output Voltage  
5
IN  
V
= 3V, I = 200µA  
OUT  
2.5  
2.9  
0.05  
OH  
OL  
DD  
V
V
= 2.7V, I  
= 2.7V, I  
= 160µA  
V
V
DD  
DD  
OUT  
OUT  
= 1.6mA  
0.4  
I
Hi-Z Output Leakage D  
V
= 0V and V  
DD  
± 10  
µA  
pF  
OZ  
OUT  
OUT  
C
Hi-Z Output Capacitance D  
1
OZ  
OUT  
I
I
Output Short-Circuit Source Current  
Output Short-Circuit Sink Current  
V
V
= 0V, V = 3V  
20  
15  
mA  
mA  
SOURCE  
SINK  
OUT  
OUT  
DD  
= V = 3V  
DD  
140812f  
3
LTC1408-12  
POWER REQUIRE E TS  
W U  
The  
denotes the specifications which apply over the full operating temperature  
range, otherwise specifications are at T = 25°C. With internal reference, V = V = 3V.  
A
DD  
CC  
SYMBOL  
, V  
PARAMETER  
Supply Voltage  
Supply Current  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
2.7  
3.0  
3.6  
V
DD CC  
I
+ I  
CC  
Active Mode, f  
Nap Mode  
Sleep Mode  
= 600ksps  
SAMPLE  
5
1.1  
2.0  
7
1.9  
15  
mA  
mA  
µA  
DD  
PD  
Power Dissipation  
Active Mode with SCK, f  
= 600ksps  
15  
mW  
SAMPLE  
W U  
TI I G CHARACTERISTICS  
The  
DD  
denotes the specifications which apply over the full operating temperature  
range, otherwise specifications are at T = 25°C. V = 3V.  
A
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
f
Maximum Sampling Rate per Channel  
(Conversion Rate)  
100  
kHz  
SAMPLE(MAX)  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Minimum Sampling Period (Conversion + Acquisiton Period)  
Clock Period  
10  
µs  
THROUGHPUT  
(Note 16)  
100  
96  
2
10000  
ns  
SCK  
Conversion Time  
(Notes 6, 17)  
(Note 6)  
SCLK cycles  
CONV  
Minimum High or Low SCLK Pulse Width  
CONV to SCKSetup Time  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
1
(Notes 6, 10)  
(Note 6)  
3
10000  
2
SCK Before CONV  
0
3
Minimum High or Low CONV Pulse Width  
SCKto Sample Mode  
(Note 6)  
4
4
(Note 6)  
4
5
CONVto Hold Mode  
(Notes 6, 11)  
(Notes 6, 7, 13)  
(Notes 6, 12)  
(Notes 6, 12)  
(Notes 6, 12)  
(Notes 6, 14)  
1.2  
45  
6
96th SCKto CONVInterval (Affects Acquisition Period)  
Delay from SCKto Valid Bits 0 Through 11  
SCKto Hi-Z at SDO  
7
8
6
8
9
Previous SDO Bit Remains Valid After SCK  
2
10  
11  
V
Settling Time After Sleep-to-Wake Transition  
2
REF  
+
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliabilty and lifetime.  
Note 9: The absolute voltage at CHx and CHx must be within this range.  
Note 10: If less than 3ns is allowed, the output data will appear one clock  
cycle later. It is best for CONV to rise half a clock before SCK, when  
running the clock at rated speed.  
Note 2: All voltage values are with respect to ground GND.  
Note 11: Not the same as aperture delay. Aperture delay (1ns) is the  
difference between the 2.2ns delay through the sample-and-hold and the  
1.2ns CONV to Hold mode delay.  
Note 3: When these pins are taken below GND or above V , they will be  
DD  
clamped by internal diodes. This product can handle input currents greater  
than 100mA below GND or greater than V without latchup.  
DD  
Note 12: The rising edge of SCK is guaranteed to catch the data coming  
out into a storage latch.  
Note 13: The time period for acquiring the input signal is started by the  
96th rising clock and it is ended by the rising edge of CONV.  
+
Note 4: Offset and range specifications apply for a single-ended CH0 –  
+
CH5 input with CH0 – CH5 grounded and using the internal 2.5V  
reference.  
Note 5: Integral linearity is tested with an external 2.55V reference and is  
defined as the deviation of a code from the straight line passing through  
the actual endpoints of a transfer curve. The deviation is measured from  
the center of quantization band. Linearity is tested for CH0 only.  
Note 6: Guaranteed by design, not subject to test.  
Note 7: Recommended operating conditions.  
Note 14: The internal reference settles in 2ms after it wakes up from Sleep  
mode with one or more cycles at SCK and a 10µF capacitive load.  
Note 15: The full power bandwidth is the frequency where the output code  
swing drops by 3dB with a 2.5V input sine wave.  
P-P  
Note 16: Maximum clock period guarantees analog performance during  
conversion. Output data can be read with an arbitrarily long clock period.  
Note 8: The analog input range is defined for the voltage difference  
between CHx and CHx , x = 0–5.  
Note 17: The conversion process takes 16 clocks for each channel that is  
enabled, up to 96 clocks for all 6 channels.  
+
140812f  
4
LTC1408-12  
U W  
V
DD  
= 3V, T = 25°C  
A
TYPICAL PERFOR A CE CHARACTERISTICS  
THD, 2nd and 3rd  
vs Input Frequency  
THD, 2nd and 3rd  
SINAD vs Input Frequency  
vs Input Frequency  
–50  
–50  
–56  
–62  
–68  
–74  
–80  
–86  
–92  
–98  
–104  
–110  
74  
71  
68  
65  
62  
59  
56  
53  
UNIPOLAR SINGLE-ENDED  
BIPOLAR SINGLE-ENDED  
–56  
–62  
–68  
THD  
THD  
–74  
2nd  
2nd  
–80  
–86  
–92  
3rd  
3rd  
–98  
–104  
–110  
0.1  
1
10  
0.1  
1
10  
0.1  
10  
1
FREQUENCY (MHz)  
FREQUENCY (MHz)  
FREQUENCY (MHz)  
140812 G02  
140812 G03  
140814 G01  
100kHz Unipolar Sine Wave 8192  
Point FFT Plot  
SNR vs Input Frequency  
SFDR vs Input Frequency  
0
–10  
–20  
77  
74  
71  
68  
92  
86  
80  
74  
68  
62  
56  
50  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
65  
62  
59  
56  
53  
50  
–110  
–120  
0.1  
1
10  
0.1  
10  
0
10  
20  
30  
40  
50  
1
FREQUENCY (MHz)  
FREQUENCY (MHz)  
FREQUENCY (kHz)  
140812 G05  
140812 G06  
140814 G04  
Differential Linearity vs Output  
Code, CH0, Unipolar Mode  
Integral Linearity vs Output Code,  
CH0, Unipolar Mode  
100kHz Bipolar Sine Wave 8192  
Point FFT Plot  
0
–10  
1
0.8  
0.6  
0.4  
0.2  
0
1
0.8  
–20  
0.6  
–30  
0.4  
–40  
0.2  
–50  
–60  
0
–70  
–0.2  
–0.4  
–0.6  
–0.8  
0
–0.2  
–0.4  
–0.6  
–0.8  
–1  
–80  
–90  
–100  
–110  
–120  
0
20  
30  
40  
50  
0
512 1024 1536 2048 2560 3072 3584 4096  
OUTPUT CODE  
10  
0
512 1024 1536 2048 2560 3072 3584 4096  
OUTPUT CODE  
FREQUENCY (KHZ)  
140812 G09  
140812 G07  
140812 G08  
140812f  
5
LTC1408-12  
U W  
V
DD  
= 3V, T = 25°C  
TYPICAL PERFOR A CE CHARACTERISTICS  
A
Full Scale Signal Response  
CMRR vs Frequency  
3
0
0
–20  
–3  
–6  
–40  
–60  
–9  
–12  
–15  
–18  
–21  
–24  
–27  
–30  
–80  
–100  
–120  
10  
100  
1000  
100 1k 10k 100k 1M 10M 100M 1G  
FREQUENCY (Hz)  
FREQUENCY (MHz)  
1408 G11  
1408 G10  
PSRR vs Frequency  
Crosstalk vs Frequency  
0
0
–20  
–20  
–40  
–60  
–40  
–60  
–80  
–100  
–120  
–80  
–100  
–120  
100 1k 10k 100k 1M 10M 100M 1G  
100 1k 10k 100k 1M 10M 100M 1G  
FREQUENCY (Hz)  
FREQUENCY (Hz)  
1408 G12  
1408 G13  
140812f  
6
LTC1408-12  
U
U
U
PI FU CTIO S  
CH3+ (Pin 14): Non-Inverting Channel 3. CH3+ operates  
fully differentially with respect to CH3with a 0V to 2.5V,  
or ±1.25V differential swing and a 0V to VDD absolute  
input range.  
CH3(Pin 15): Inverting Channel 3. CH3operates fully  
differentially with respect to CH3+ with a –2.5V to 0V, or  
±1.25V differential swing and a 0V to VDD absolute  
input range.  
CH4+ (Pin 17): Non-Inverting Channel 4. CH4+ operates  
fully differentially with respect to CH4with a 0V to 2.5V,  
or±1.25Vdifferentialswinganda0VtoVDD absoluteinput  
range.  
SDO (Pin 1): Three-State Serial Data Output. Each set of  
six output data words represent the six analog input  
channels at the start of the previous conversion. Data for  
CH0 comes out first and data for CH5 comes out last. Each  
data word comes out MSB first.  
OGND (Pin 2): Ground Return for SDO Currents. Connect  
to the solid ground plane.  
OVDD (Pin 3): Power Supply for the SDO Pin. OVDD must  
be no more than 300mV higher than VDD and can be  
brought to a lower voltage to interface to low voltage logic  
families. The unloaded high state at SDO is at the potential  
of OVDD.  
CH0+ (Pin 4): Non-Inverting Channel 0. CH0+ operates  
fully differentially with respect to CH0with a 0V to 2.5V,  
or ±1.25V differential swing and a 0V to VDD absolute  
input range.  
CH4(Pin 18): Inverting Channel 4. CH4operates fully  
differentially with respect to CH4+ with a –2.5V to 0V, or  
±1.25V differential swing and a 0V to VDD absolute input  
range.  
CH0(Pin 5): Inverting Channel 0. CH0operates fully  
differentially with respect to CH0+ with a –2.5V to 0V,  
or ±1.25V differential swing and a 0V to VDD absolute  
input range.  
CH5+ (Pin 20): Non-Inverting Channel 5. CH5+ operates  
fully differentially with respect to CH5with a 0V to 2.5V,  
or±1.25Vdifferentialswinganda0VtoVDD absoluteinput  
range.  
CH5(Pin 21): Inverting Channel 5. CH5operates fully  
differentially with respect to CH5+ with a –2.5V to 0V, or  
±1.25V differential swing and a 0V to VDD absolute input  
range.  
GND (Pins 6, 9, 12, 13, 16, 19): Analog Grounds. These  
groundpinsmustbetieddirectlytothesolidgroundplane  
under the part. Analog signal currents flow through these  
connections.  
CH1+ (Pin 7): Non-Inverting Channel 1. CH1+ operates  
fully differentially with respect to CH1with a 0V to 2.5V,  
or ±1.25V differential swing and a 0V to VDD absolute  
input range.  
CH1(Pin 8): Inverting Channel 1. CH1operates fully  
differentially with respect to CH1+ with a –2.5V to 0V,  
or ±1.25V differential swing and a 0V to VDD absolute  
input range.  
CH2+ (Pin 10): Non-Inverting Channel 2. CH2+ operates  
fully differentially with respect to CH2with a 0V to 2.5V,  
or ±1.25V differential swing and a 0V to VDD absolute  
input range.  
CH2(Pin 11): Inverting Channel 2. CH2operates fully  
differentially with respect to CH2+ with a –2.5V to 0V, or  
±1.25V differential swing and a 0V to VDD absolute  
input range.  
GND (PIN 22): Analog Ground for Reference. Analog  
ground must be tied directly to the solid ground plane  
under the part. Analog signal currents flow through this  
connection. The 10µF reference bypass capacitor should  
be returned to this pad.  
VREF (Pin 23): 2.5V Internal Reference. Bypass to GND  
and a solid analog ground plane with a 10µF ceramic  
capacitor (or 10µF tantalum in parallel with 0.1µF ce-  
ramic). Can be overdriven by an external reference voltage  
between 2.55V and VDD, VCC.  
VCC (Pin 24): 3V Positive Analog Supply. This pin supplies  
3V to the analog section. Bypass to the solid analog  
ground plane with a 10µF ceramic capacitor (or 10µF  
tantalum) in parallel with 0.1µF ceramic. Care should be  
taken to place the 0.1µF bypass capacitor as close to  
Pin 24 as possible. Pin 24 must be tied to Pin 25.  
140812f  
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LTC1408-12  
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PI FU CTIO S  
BIP (Pin 29): Bipolar/Unipolar Mode. The input differen-  
tial range is 0V – 2.5V when BIP is LOW, and it is ±1.25V  
when BIP is HIGH. Must be kept in fixed state during  
conversion and during subsequent conversion to read  
data. When changing BIP between conversions the full  
acquisition time must be allowed before starting the next  
conversion. The output data is in 2’s complement  
format for bipolar mode and straight binary format for  
unipolar mode.  
VDD (Pin 25): 3V Positive Digital Supply. This pin supplies  
3V to the logic section. Bypass to DGND pin and solid  
analog ground plane with a 10µF ceramic capacitor (or  
10µF tantalum in parallel with 0.1µF ceramic). Keep in  
mind that internal digital output signal currents flow  
through this pin. Care should be taken to place the 0.1µF  
bypass capacitor as close to Pin 25 as possible. Pin 25  
must be tied to Pin 24.  
SEL2 (Pin 26): Most significant bit controlling the  
number of channels being converted. In combination with  
SEL1andSEL0,000selectsjustthefirstchannel(CH0)for  
conversion. Incrementing SELx selects additional  
channels(CH0–CH5) for conversion. 101, 110 or 111  
selectall6channelsforconversion. Mustbekeptinafixed  
state during conversion and during the subsequent con-  
version to read data.  
CONV (Pin 30): Convert Start. Holds the six analog input  
signals and starts the conversion on CONV’s rising edge.  
Two CONV pulses with SCK in fixed high or fixed low state  
starts Nap mode. Four or more CONV pulses with SCK in  
fixed high or fixed low state starts Sleep mode.  
DGND (Pin 31): Digital Ground. This ground pin must be  
tied directly to the solid ground plane. Digital input signal  
currents flow through this pin.  
SEL1 (Pin 27): Middle significance bit controlling the  
number of channels being converted. In combination with  
SEL0andSEL2,000selectsjustthefirstchannel(CH0)for  
conversion. Incrementing SELx selects additional  
channels for conversion. 101, 110 or 111 select all 6  
channels (CH0–CH5) for conversion. Must be kept in a  
fixed state during conversion and during the subsequent  
conversion to read data.  
SCK (Pin 32): External Clock Input. Advances the conver-  
sion process and sequences the output data at SD0 (Pin1)  
on the rising edge. One or more SCK pulses wake from  
sleep or nap power saving modes. 16 clock cycles are  
needed for each of the channels that are activated by SELx  
(Pins 26, 27, 28), up to a total of 96 clock cycles needed  
to convert and read out all 6 channels.  
SEL0 (Pin 28): Least significant bit controlling the  
number of channels being converted. In combination with  
SEL1andSEL2,000selectsjustthefirstchannel(CH0)for  
conversion. Incrementing SELx selects additional  
channels for conversion. 101, 110 or 111 select all 6  
channels (CH0–CH5) for conversion. Must be kept in a  
fixed state during conversion and during the subsequent  
conversion to read data.  
EXPOSED PAD (Pin 33): GND. Must be tied directly to the  
solid ground plane.  
140812f  
8
LTC1408-12  
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BLOCK DIAGRA  
0.1µF  
10µF  
3V  
V
V
DD  
CC  
24  
25  
+
CH0  
4
+
S & H  
S & H  
S & H  
S & H  
S & H  
S & H  
CH0  
5
6
7
+
CH1  
+
CH1  
8
9
+
CH2  
10  
+
OV  
3V  
DD  
12-BIT LATCH 0  
12-BIT LATCH 1  
12-BIT LATCH 2  
12-BIT LATCH 3  
12-BIT LATCH 4  
12-BIT LATCH 5  
3
1
2
CH2  
THREE-  
STATE  
SERIAL  
OUTPUT  
PORT  
11  
SD0  
0.1µF  
600ksps  
12-BIT ADC  
MUX  
12 13  
14  
OGND  
+
CH3  
+
CH3  
15  
16  
17  
TIMING  
LOGIC  
CONV  
SCK  
30  
32  
+
CH4  
+
CH4  
18  
19  
20  
+
CH5  
+
CH5  
21  
2.5V  
REFERENCE  
V
REF  
EXPOSED PAD  
33  
22  
23 29  
26  
27  
28  
31  
10µF  
DGND  
GND  
BIP  
SEL2 SEL1 SEL0  
1408 BD  
140812f  
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LTC1408-12  
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TI I G DIAGRA S  
S C K  
140812f  
10  
LTC1408-12  
W U  
W
TI I G DIAGRA S  
Nap Mode and Sleep Mode Waveforms  
SCK  
t
1
t
1
CONV  
NAP  
SLEEP  
t
11  
V
REF  
1408 TD02  
NOTE: NAP AND SLEEP ARE INTERNAL SIGNALS  
SCK to SDO Delay  
SCK  
SCK  
V
IH  
V
IH  
t
10  
8
t
t
9
V
V
OH  
SDO  
SDO  
Hi-Z  
OL  
1408 TD03  
140812f  
11  
LTC1408-12  
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SELECTING THE NUMBER OF CONVERTED CHANNELS  
(SEL2, SEL1, SEL0)  
BIPOLAR/UNIPOLAR MODE  
The input voltage range for each of the CHx input differen-  
tial pairs is UNIPOLAR 0V – 2.5V when BIP is LOW, and  
BIPOLAR ±1.25V when BIP is HIGH. This pin must be kept  
in fixed state during conversion and during subsequent  
conversion to read data. When changing BIP between  
conversions the full acquisition time must be allowed  
beforestartingthenextconversion. Afterchangingmodes  
from BIPOLAR to UNIPOLAR, or from UNIPOLAR to  
BIPOLAR, you can still read the first set of channels in the  
new mode, by inverting the MSB to read these channels in  
the mode that they were converted in.  
These three control pins select the number of channels  
being converted (see Table 1). 000 selects only the first  
channel (CH0) for conversion. Incrementing SELx selects  
additional channels for conversion, up to 6 channels. 101,  
110or111selectall6channelsforconversion. Thesepins  
must be kept in a fixed state during conversion and during  
the subsequent conversion to read data. When changing  
modes between conversions, keep in mind that the output  
data of a particular channel will remain unchanged until  
afterthatchannelisconvertedagain. Forexample:convert  
a sequence of 4 channels (CH0, CH1, CH2, CH3) with  
SELx = 011, then, after these channels are converted  
change SELx to 001 to convert just CH0 and CH1. During  
the conversion of the first set of two channels you will be  
able to read the data from the same two channels con-  
verted as part of the previous group of 4 channels. Later,  
you could convert 4 or more channels to read back the  
unread CH2 and CH3 data that was converted in the first  
setof4channels. Thesepinsareoftenhardwiredtoenable  
the right number of channels for a particular application.  
Choosing to convert fewer channels per conversion re-  
sults in faster throughput of those channels. For example,  
6 channels can be converted at 100ksps/ch, while 3  
channels can be converted at 200ksps/ch.  
DRIVING THE ANALOG INPUT  
The differential analog inputs of the LTC1408-12 may be  
driven differentially or as a single-ended input (i.e., the  
CHxinput is grounded). All twelve analog inputs of all six  
differential analog input pairs, CH0+ and CH0, CH1+ and  
CH1, CH2+ and CH2, CH3+ and CH3, CH4+ and CH4–  
and CH5+ and CH5, are sampled at the same instant. Any  
unwanted signal that is common to both inputs of each  
input pair will be reduced by the common mode rejection  
of the sample-and-hold circuit. The inputs draw only one  
small current spike while charging the sample-and-hold  
capacitors at the end of conversion. During conversion,  
the analog inputs draw only a small leakage current. If the  
source impedance of the driving circuit is low, then the  
Table 1. Conversion Sequence Control  
(“acquire” represents simultaneous sampling of all channels; CHx represents conversion of channels)  
SEL2  
SEL1  
SEL0  
CHANNEL ACQUISITION AND CONVERSION SEQUENCE  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
acquire, CH0, acquire, CH0...  
acquire, CH0, CH1, acquire, CH0, CH1...  
acquire, CH0, CH1, CH2, acquire, CH0, CH1, CH2...  
acquire, CH0, CH1, CH2, CH3, acquire, CH0, CH1, CH2, CH3...  
acquire, CH0, CH1, CH2, CH3, CH4, acquire, CH0,CH1,CH2, CH3, CH4...  
acquire, CH0, CH1, CH2, CH3, CH4, CH5, acquire, CH0, CH1, CH2, CH3, CH4, CH5...  
acquire, CH0, CH1, CH2, CH3, CH4, CH5, acquire, CH0, CH1, CH2, CH3, CH4, CH5...  
acquire, CH0, CH1, CH2, CH3, CH4, CH5, acquire, CH0, CH1, CH2, CH3, CH4, CH5...  
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LTC1408-12  
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LTC1566-1: Low Noise 2.3MHz Continuous Time  
LTC1408-12 inputs can be driven directly. As source  
impedance increases, so will acquisition time. For mini-  
mum acquisition time with high source impedance, a  
buffer amplifier must be used. The main requirement is  
that the amplifier driving the analog input(s) must settle  
after the small current spike before the next conversion  
starts (the time allowed for settling must be at least 39ns  
for full throughput rate). Also keep in mind while choosing  
an input amplifier the amount of noise and harmonic  
distortion added by the amplifier.  
Lowpass Filter.  
LT®1630: Dual 30MHz Rail-to-Rail Voltage FB Amplifier.  
2.7V to ±15V supplies. Very high AVOL, 500µV offset and  
520ns settling to 0.5LSB for a 4V swing. THD and noise  
are 93dB to 40kHz and below 1LSB to 320kHz (AV = 1,  
2VP-P into1k,VS =5V),makingthepartexcellentforAC  
applications (to 1/3 Nyquist) where rail-to-rail perfor-  
mance is desired. Quad version is available as LT1631.  
LT1632: Dual 45MHz Rail-to-Rail Voltage FB Amplifier.  
2.7V to ±15V supplies. Very high AVOL, 1.5mV offset and  
400ns settling to 0.5LSB for a 4V swing. It is suitable for  
applications with a single 5V supply. THD and noise are  
93dB to 40kHz and below 1LSB to 800kHz (AV = 1,  
2VP-P into1k,VS =5V),makingthepartexcellentforAC  
applications where rail-to-rail performance is desired.  
Quad version is available as LT1633.  
CHOOSING AN INPUT AMPLIFIER  
Choosing an input amplifier is easy if a few requirements  
are taken into consideration. First, to limit the magnitude  
of the voltage spike seen by the amplifier from charging  
the sampling capacitor, choose an amplifier that has a low  
output impedance (< 100) at the closed-loop bandwidth  
frequency. For example, if an amplifier is used in a gain of  
1 and has a unity-gain bandwidth of 50MHz, then the  
output impedance at 50MHz must be less than 100. The  
second requirement is that the closed-loop bandwidth  
must be greater than 40MHz to ensure adequate small-  
signal settling for full throughput rate. If slower op amps  
are used, more time for settling can be provided by  
increasing the time between conversions. The best choice  
for an op amp to drive the LTC1408-12 depends on the  
application. Generally, applications fall into two catego-  
ries: AC applications where dynamic specifications are  
most critical and time domain applications where DC  
accuracy and settling time are most critical. The following  
list is a summary of the op amps that are suitable for  
driving the LTC1408-12. (More detailed information is  
available in the Linear Technology Databooks and on the  
website at www.linear.com.)  
LT1801: 80MHz GBWP, –75dBc at 500kHz, 2mA/ampli-  
fier, 8.5nV/Hz.  
LT1806/LT1807: 325MHz GBWP, –80dBc distortion at  
5MHz, unity gain stable, rail-to-rail in and out,  
10mA/amplifier, 3.5nV/Hz.  
LT1810: 180MHz GBWP, –90dBc distortion at 5MHz,  
unity gain stable, rail-to-rail in and out, 15mA/amplifier,  
16nV/Hz.  
LT1818/LT1819: 400MHz, 2500V/µs, 9mA, Single/Dual  
Voltage Mode Operational Amplifier.  
LT6200: 165MHz GBWP, –85dBc distortion at 1MHz,  
unity gain stable, rail-to-rail in and out, 15mA/amplifier,  
0.95nV/Hz.  
LT6203: 100MHz GBWP, –80dBc distortion at 1MHz,  
unity gain stable, rail-to-rail in and out, 3mA/amplifier,  
1.9nV/Hz.  
LinearView is a trademark of Linear Technology Corporation.  
LT6600: Amplifier/Filter Differential In/Out with 10MHz  
Cutoff frequency.  
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LTC1408-12  
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INPUT RANGE  
INPUT FILTERING AND SOURCE IMPEDANCE  
The analog inputs of the LTC1408-12 may be driven fully  
differentially with a single supply. Either input may swing  
uptoVCC,providedthedifferentialswingisnogreaterthan  
2.5V with BIP (Pin 29) Low, or ±1.25V with (BIP Pin 29)  
High. The 0V to 2.5V range is also ideally suited for single-  
ended input use with single supply applications. The  
common mode range of the inputs extend from ground to  
the supply voltage VCC. If the difference between the CH+  
andCHatanyinputpairexceeds2.5V(unipolar)or1.25V  
(bipolar), the output code will stay fixed at positive full-  
scale, and if this difference goes below 0V (unipolar) or –  
1.25V (bipolar), the output code will stay fixed at negative  
full-scale.  
The noise and the distortion of the input amplifier and  
other circuitry must be considered since they will add to  
the LTC1408-12 noise and distortion. The small-signal  
bandwidth of the sample-and-hold circuit is 50MHz. Any  
noise or distortion products that are present at the analog  
inputs will be summed over this entire bandwidth. Noisy  
input circuitry should be filtered prior to the analog inputs  
tominimizenoise. Asimple1-poleRCfilterissufficientfor  
many applications. For example, Figure 1 shows a 47pF  
capacitor from CHO+ to ground and a 51source resistor  
to limit the net input bandwidth to 30MHz. The 47pF ca-  
pacitoralsoactsasachargereservoirfortheinputsample-  
and-hold and isolates the ADC input from sampling-glitch  
sensitive circuitry. High quality capacitors and resistors  
should be used since these components can add distor-  
tion. NPO and silvermica type dielectric capacitors have  
excellent linearity. Carbon surface mount resistors can  
generate distortion from self heating and from damage  
thatmayoccurduringsoldering. Metalfilmsurfacemount  
resistors are much less susceptible to both problems.  
When high amplitude unwanted signals are close in  
frequency to the desired signal frequency a multiple pole  
filter is required.  
INTERNAL REFERENCE  
The LTC1408-12 has an on-chip, temperature compen-  
sated, bandgap reference that is factory trimmed to 2.5V  
to obtain a precise 2.5V input span. The reference ampli-  
fieroutputVREF, (Pin23)mustbebypassedwithacapaci-  
tortoground.Thereferenceamplifierisstablewithcapaci-  
tors of 1µF or greater. For the best noise performance, a  
10µF ceramic or a 10µF tantalum in parallel with a 0.1µF  
ceramic is recommended. The VREF pin can be overdriven  
with an external reference as shown in Figure 2. The volt-  
age of the external reference must be higher than the 2.5V  
of the open-drain P-channel output of the internal refer-  
ence. The recommended range for an external reference  
is 2.55V to VDD. An external reference at 2.55V will see a  
DC quiescent load of 0.75mA and as much as 3mA  
during conversion.  
High external source resistance, combined with 13pF of  
inputcapacitance,willreducetherated50MHzinputband-  
width and increase acquisition time beyond 39ns.  
51*  
1
ANALOG  
INPUT  
+
CH0  
47pF*  
2
CH0  
LTC1408-12  
REF  
3
V
3.5V to 18V  
10µF  
11  
GND  
51*  
ANALOG  
INPUT  
4
+
3V  
23  
CH1  
CH1  
LT1790-3  
V
REF  
LTC2351-12  
GND  
47pF*  
5
10µF  
22  
1408 F01  
*TIGHT TOLERANCE REQUIRED TO AVOID  
APERTURE SKEW DEGRADATION  
1408 F02  
Figure 2. Overdriving V Pin with an External Reference  
Figure 1. RC Input Filter  
REF  
140812f  
14  
LTC1408-12  
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INPUT SPAN VERSUS REFERENCE VOLTAGE  
Figure 4 shows the ideal input/output characteristics for  
the LTC1408-12 in unipolar mode (BIP = Low). The code  
transitionsoccurmidwaybetweensuccessiveintegerLSB  
values (i.e., 0.5LSB, 1.5LSB, 2.5LSB, FS – 1.5LSB). The  
output code is straight binary with 1LSB = 2.5V/4096 =  
610µV for the LTC1408-12. The LTC1408-12 has 0.2 LSB  
RMS of Gaussian white noise.  
The differential input range has a unipolar voltage span  
that equals the difference between the voltage at the  
reference buffer output VREF (Pin 23) and the voltage at  
ground. The differential input range of the ADC is 0V to  
2.5V when using the internal reference. The internal ADC  
is referenced to these two nodes. This relationship also  
holds true with an external reference.  
111...111  
111...110  
111...101  
DIFFERENTIAL INPUTS  
The ADC will always convert the difference of CH+ minus  
CH, independentofthecommonmodevoltageatanypair  
of inputs. The common mode rejection holds up at high  
frequencies (see Figure 3.) The only requirement is that  
both inputs not go below ground or exceed VDD.  
000...010  
000...001  
000...000  
0
FS – 1LSB  
0
INPUT VOLTAGE (V)  
1408 F04  
–20  
Figure 4. LTC1408-12 Transfer Characteristic  
in Unipolar Mode (BIP = Low)  
–40  
–60  
Figure 5 shows the ideal input/output characteristics for  
the LTC1408-12 in bipolar mode (BIP = High). The code  
transitionsoccurmidwaybetweensuccessiveintegerLSB  
values (i.e., 0.5LSB, 1.5LSB, 2.5LSB, FS – 1.5LSB). The  
output code is 2’s complement with 1LSB = 2.5V/4096 =  
610µV for the LTC1408-12. The LTC1408-12 has 0.2 LSB  
RMS of Gaussian white noise.  
–80  
–100  
–120  
100 1k 10k 100k 1M 10M 100M 1G  
FREQUENCY (Hz)  
1408 G11  
Figure 3. CMRR vs Frequency  
011...111  
011...110  
011...101  
Integral nonlinearity errors (INL) and differential nonlin-  
earityerrors(DNL)arelargelyindependentofthecommon  
mode voltage. However, the offset error will vary. DC  
CMRR is typically better than –90dB.  
100...010  
100...001  
100...000  
–FS  
FS – 1LSB  
INPUT VOLTAGE (V)  
1408 F05  
Figure 5. LTC1408-12 Transfer Characteristic  
in Bipolar Mode (BIP = High)  
140812f  
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LTC1408-12  
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Conversion Start Input (CONV)  
POWER-DOWN MODES  
The rising edge of CONV starts a conversion, but subse-  
quent rising edges at CONV are ignored by the LTC1408-12  
until the following 96 SCK rising edges have occurred. The  
duty cycle of CONV can be arbitrarily chosen to be used as  
aframesyncsignalfortheprocessorserialport.Asimple  
approachtogenerateCONVistocreateapulsethatisone  
SCK wide to drive the LTC1408-12 and then buffer this  
signal to drive the frame sync input of the processor  
serial port. It is good practice to drive the LTC1408-12  
CONVinputfirsttoavoiddigitalnoiseinterferenceduring  
the sample-to-hold transition triggered by CONV at the  
start of conversion. It is also good practice to keep the  
width of the low portion of the CONV signal greater than  
15ns to avoid introducing glitches in the front end of the  
ADCjustbeforethesample-and-holdgoesintoHoldmode  
at the rising edge of CONV.  
Upon power-up, the LTC1408-12 is initialized to the  
activestateandisreadyforconversion.TheNapandSleep  
mode waveforms show the power down modes for the  
LTC1408-12. TheSCKandCONVinputscontrolthepower  
down modes (see Timing Diagrams). Two rising edges at  
CONV, without any intervening rising edges at SCK, put  
the LTC1408-12 in Nap mode and the power consumption  
drops from 15mW to 3.3mW. The internal reference  
remains powered in Nap mode. One or more rising edges  
at SCK wake up the LTC1408-12 very quickly and CONV  
can start an accurate conversion within a clock cycle. Four  
rising edges at CONV, without any intervening rising  
edges at SCK, put the LTC1408-12 in Sleep mode and the  
power consumption drops from 15mW to 6µW. One or  
more rising edges at SCK wake up the LTC1408-12 for  
operation. Theinternalreference(VREF )takes2mstoslew  
and settle with a 10µF load. Using sleep mode more  
frequently compromises the accuracy of the output data.  
Note that for slower conversion rates, the Nap and Sleep  
modes can be used for substantial reductions in power  
consumption.  
Minimizing Jitter on the CONV Input  
In high speed applications where high amplitude sine  
waves above 100kHz are sampled, the CONV signal must  
have as little jitter as possible (10ps or less). The square  
wave output of a common crystal clock module usually  
meets this requirement. The challenge is to generate a  
CONV signal from this crystal clock without jitter corrup-  
tion from other digital circuits in the system. A clock  
divider and any gates in the signal path from the crystal  
clock to the CONV input should not share the same  
integrated circuit with other parts of the system. The SCK  
andCONVinputsshouldbedrivenfirst,withdigitalbuffers  
DIGITAL INTERFACE  
The LTC1408-12 has a 3-wire SPI (Serial Peripheral Inter-  
face) interface. The SCK and CONV inputs and SDO output  
implement this interface. The SCK and CONV inputs  
acceptswingsfrom3VlogicandareTTLcompatible, ifthe  
logic swing does not exceed VDD. A detailed description of  
the three serial port signals follows:  
140812f  
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after the next convert pulse. It is good practice to drive the  
LTC1408-12 SCK input first to avoid digital noise interfer-  
ence during the internal bit comparison decision by the  
internal high speed comparator. Unlike the CONV input,  
the SCK input is not sensitive to jitter because the input  
signal is already sampled and held constant.  
used to drive the serial port interface. Also note that the  
master clock in the DSP may already be corrupted with  
jitter, even if it comes directly from the DSP crystal.  
Another problem with high speed processor clocks is that  
they often use a low cost, low speed crystal (i.e., 10MHz)  
to generate a fast, but jittery, phase-locked-loop system  
clock (i.e., 40MHz). The jitter in these PLL-generated high  
speed clocks can be several nanoseconds. Note that if you  
choose to use the frame sync signal generated by the DSP  
port, this signal will have the same jitter of the DSP’s  
master clock.  
Serial Data Output (SDO)  
Upon power-up, the SDO output is automatically reset  
to the high impedance state. The SDO output remains  
in high impedance until a new conversion is started.  
SDO sends out up to six sets of 12 bits in the output data  
stream after the third rising edge of SCK after the start  
of conversion with the rising edge of CONV. The six or  
fewer 12-bit words are separated by two don’t care bits  
and two clock cycles in high impedance mode. Please  
note the delay specification from SCK to a valid SDO.  
SDO is always guaranteed to be valid by the next rising  
edge of SCK. The 16 – 96-bit output data stream is  
compatible with the 16-bit or 32-bit serial port of most  
processors.  
The Typical Application Figure on page 20 shows a circuit  
for level-shifting and squaring the output from an RF  
signal generator or other low-jitter source. A single D-type  
flip flop is used to generate the CONV signal to the  
LTC1408-12.Re-timingthemasterclocksignaleliminates  
clock jitter introduced by the controlling device (DSP,  
FPGA, etc.) Both the inverter and flip flop must be treated  
as analog components and should be powered from a  
clean analog supply.  
Serial Clock Input (SCK)  
BOARD LAYOUT AND BYPASSING  
The rising edge of SCK advances the conversion process  
and also udpates each bit in the SDO data stream. After  
CONV rises, the third rising edge of SCK sends out up to  
six sets of 12 data bits, with the MSB sent first. A simple  
approach is to generate SCK to drive the LTC1408-12 first  
and then buffer this signal with the appropriate number of  
inverters to drive the serial clock input of the processor  
serial port. Use the falling edge of the clock to latch data  
from the Serial Data Output (SDO) into your processor  
serial port. The 12-bit Serial Data will be received in six  
16-bit words with 96 or more clocks per frame sync. If  
fewer than 6 channels are selected by SEL0–SEL2 for  
conversion, then 16 clocks are needed per channel to  
convert the analog inputs and read out the resulting data  
Wire wrap boards are not recommended for high resolu-  
tion and/or high speed A/D converters. To obtain the best  
performancefromtheLTC1408-12,aprintedcircuitboard  
with ground plane is required. Layout for the printed  
circuit board should ensure that digital and analog signal  
linesareseparatedasmuchaspossible. Inparticular, care  
should be taken not to run any digital track alongside an  
analog signal track. If optimum phase match between the  
inputsisdesired, thelengthofthetwelveinputwiresofthe  
six input channels should be kept matched. But each pair  
of input wires to the six input channels should be kept  
separated by a ground trace to avoid high frequency  
crosstalk between channels.  
140812f  
17  
LTC1408-12  
APPLICATIO S I FOR ATIO  
W U U  
U
Highqualitytantalumandceramicbypasscapacitorsshould HARDWARE INTERFACE TO TMS320C54x  
be used at the VCC, VDD and VREF pins as shown in the  
The LTC1408-12 is a serial output ADC whose interface  
Block Diagram on the first page of this data sheet. For  
has been designed for high speed buffered serial ports in  
optimum performance, a 10µF surface mount tantalum  
fast digital signal processors (DSPs). Figure 7 shows an  
example of this interface using a TMS320C54X.  
capacitor with a 0.1µF ceramic is recommended for the  
VCC, VDD and VREF pins. Alternatively, 10µF ceramic chip  
The buffered serial port in the TMS320C54x has direct  
access to a 2kB segment of memory. The ADC’s serial  
data can be collected in two alternating 1kB segments, in  
real time, at the full 600ksps conversion rate of the  
LTC1408-12. The DSP assembly code sets frame sync  
mode at the BFSR pin to accept an external positive going  
pulse and the serial clock at the BCLKR pin to accept an  
external positive edge clock. Buffers near the LTC1408-12  
may be added to drive long tracks to the DSP to prevent  
corruption of the signal to LTC1408-12. This configura-  
tion is adequate to traverse a typical system board, but  
source resistors at the buffer outputs and termination  
resistors at the DSP, may be needed to match the charac-  
teristic impedance of very long transmission lines. If you  
need to terminate the SDO transmission line, buffer it first  
withoneortwo74ACxxgates. TheTTLthresholdinputsof  
the DSP port respond properly to the 3V swing used with  
the LTC1408-12.  
capacitors such as X5R or X7R may be used. The capaci-  
tors must be located as close to the pins as possible. The  
tracesconnectingthepinsandthebypasscapacitorsmust  
bekeptshortandshouldbemadeaswideaspossible. The  
VCC and VDD bypass capacitor returns to the ground plane  
and the VREF bypass capacitor returns to the Pin 22. Care  
should be taken to place the 0.1µF VCC and VDD bypass  
capacitor as close to Pins 24 and 25 as possible.  
Figure6showstherecommendedsystemgroundconnec-  
tions. All analog circuitry grounds should be terminated at  
theLTC1408-12ExposedPad. Thegroundreturnfromthe  
LTC1408-12 to the power supply should be low imped-  
ance for noise-free operation. The Exposed Pad of the 32-  
pin QFN package is also internally tied to the ground pads.  
The Exposed Pad should be soldered on the PC board to  
reduce ground connection inductance. All ground pins  
(GND, DGND, OGND) must be connected directly to the  
same ground plane under the LTC1408-12.  
OV BYPASS,  
DD  
0.1µF, 0402  
TMS320C54x  
LTC1408-12  
3V  
5V  
3
OV  
DD  
V
CC  
30  
CONV  
SCK  
BFSR  
32  
BCLKR  
BDR  
B11 B10  
1
2
V
BYPASS,  
SDO  
DD  
0.1µF, 0402  
OGND  
CONV  
CLK  
3-WIRE SERIAL  
INTERFACE LINK  
V
BYPASS,  
1408 F06  
CC  
31  
0.1µF, 0402 AND  
10µF, 0805  
DGND  
0V TO 3V LOGIC SWING  
Figure 7. DSP Serial Interface to TMS320C54x  
V BYPASS,  
REF  
10µF, 0805  
Figure 6. Recommended Layout  
140812f  
18  
LTC1408-12  
U
PACKAGE DESCRIPTIO  
UH Package  
32-Lead Plastic QFN (5mm x 5mm)  
(Reference LTC DWG # 05-08-1693)  
0.70 ±0.05  
5.50 ±0.05  
4.10 ±0.05  
3.45 ± 0.05  
3.50 REF  
(4 SIDES)  
3.45 ± 0.05  
PACKAGE OUTLINE  
0.25 ± 0.05  
0.50 BSC  
RECOMMENDED SOLDER PAD LAYOUT  
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED  
BOTTOM VIEW—EXPOSED PAD  
PIN 1 NOTCH R = 0.30 TYP  
OR 0.35 × 45° CHAMFER  
R = 0.05  
TYP  
0.00 – 0.05  
R = 0.115  
TYP  
0.75 ± 0.05  
5.00 ± 0.10  
(4 SIDES)  
31 32  
0.40 ± 0.10  
PIN 1  
TOP MARK  
(NOTE 6)  
1
2
3.45 ± 0.10  
3.50 REF  
(4-SIDES)  
3.45 ± 0.10  
(UH32) QFN 0406 REV D  
0.200 REF  
0.25 ± 0.05  
0.50 BSC  
NOTE:  
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE  
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION  
ON THE TOP AND BOTTOM OF PACKAGE  
140812f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
19  
LTC1408-12  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
ADCs  
LTC1402  
12-Bit, 2.2Msps Serial ADC  
5V or ±5V Supply, 4.096V or ±2.5V Span  
3V, 15mW, Unipolar Inputs, MSOP Package  
3V, 15mW, Bipolar Inputs, MSOP Package  
5V, Selectable Spans, 115mW  
LTC1403/LTC1403A  
12-/14-Bit, 2.8Msps Serial ADC  
LTC1403-1/LTC1403A-1 12-/14-Bit, 2.8Msps Serial ADC  
LTC1405  
12-Bit, 5Msps Parallel ADC  
LTC1407/LTC1407A  
12-/14-Bit, 3Msps Simultaneous Sampling ADC  
3V, 14mW, 2-Channel Unipolar Input Range  
3V, 14mW, 2-Channel Bipolar Input Range  
3V, 15mW, Selectable Bipolar (Unipolar Input, Six Differential Inputs)  
5V, Selectable Spans, 80dB SINAD  
LTC1407-1/LTC1407A-1 12-/14-Bit, 3Msps Simultaneous Sampling ADC  
LTC1408  
LTC1411  
LTC1412  
LTC1420  
LTC1608  
LTC1609  
14-Bit, 600ksps Simultaneous Sampling ADC  
14-Bit, 2.5Msps Parallel ADC  
12-Bit, 3Msps Parallel ADC  
±5V Supply, ±2.5V Span, 72dB SINAD  
5V, Selectable Spans, 72dB SINAD  
12-Bit, 10Msps Parallel ADC  
16-Bit, 500ksps Parallel ADC  
±5V Supply, ±2.5V Span, 90dB SINAD  
5V Configurable Bipolar/Unipolar Inputs  
5V or 3V (L-Version), Micropower, MSOP Package  
16-Bit, 250ksps Serial ADC  
LTC1864/LTC1865  
LTC1864L/LTC1865L  
16-Bit, 250ksps 1-/2-Channel Serial ADCs  
DACs  
LTC1592  
16-Bit, Serial SoftSpanTM  
I
DAC  
±1LSB INL/DNL, Software Selectable Spans  
OUT  
LTC1666/LTC1667  
LTC1668  
12-/14-/16-Bit, 50Msps DAC  
87dB SFDR, 20ns Settling Time  
References  
LT1460-2.5  
LT1461-2.5  
LT1790-2.5  
Micropower Series Voltage Reference  
Precision Voltage Reference  
0.10% Initial Accuracy, 10ppm Drift  
0.04% Initial Accuracy, 3ppm Drift  
0.05% Initial Accuracy, 10ppm Drift  
Micropower Series Reference in SOT-23  
SoftSpan is a trademark of Linear Technology Corporation.  
U
TYPICAL APPLICATIO  
Low-Jitter Clock Timing with RF Sine Generator Using Clock  
Squaring/Level Shifting Circuit and Re-Timing Flip-Flop  
V
CC  
1k  
NC7SVU04P5X  
0.1µF  
50  
MASTER CLOCK  
CC  
V
1k  
CONTROL  
LOGIC  
(FPGA, CPLD,  
DSP, ETC.)  
PRE  
CLR  
D
Q
Q
CONV  
LTC  
1408-12  
CONVERT ENABLE  
NL17SZ74  
1408 TA02  
140812f  
LT/LWI 1006 • PRINTED IN THE USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
20  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
© LINEAR TECHNOLOGY CORPORATION 2006  

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