1408-12 [Linear]
6 Channel, 12-Bit, 600ksps Simultaneous Sampling ADC with Shutdown; 6通道, 12位, 600ksps同时采样ADC ,带有关断型号: | 1408-12 |
厂家: | Linear |
描述: | 6 Channel, 12-Bit, 600ksps Simultaneous Sampling ADC with Shutdown |
文件: | 总20页 (文件大小:267K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC1408-12
6 Channel, 12-Bit, 600ksps
Simultaneous Sampling ADC
U
with Shutdown
FEATURES
DESCRIPTIO
The LTC®1408-12 is a 12-bit, 600ksps ADC with six
simultaneously sampled differential inputs. The device
draws only 5mA from a single 3V supply, and comes in a
tiny 32 pin (5mm× 5mm) QFN package. A SLEEP shut-
down feature further reduces power consumption to
6µW. The combination of low power and tiny package
makes the LTC1408-12 suitable for portable applications.
■
600ksps ADC with 6 Simultaneously Sampled
Differential Inputs
■
100ksps Throughput per Channel
■
72dB SINAD
■
Low Power Dissipation: 15mW
■
3V Single Supply Operation
■
2.5V Internal Bandgap Reference, Can be Overdriven
with External Reference
3-Wire SPI-Compatible Serial Interface
The LTC1408-12 contains six separate differential inputs
that are sampled simultaneously on the rising edge of the
CONV signal. These six sampled inputs are then
converted at a rate of 100ksps per channel.
■
■
0V to 2.5V Unipolar, or ±1.25V Bipolar Differential
Input Range
■
SLEEP (6µW) Shutdown Mode
The 83dB common mode rejection allows users to
eliminate ground loops and common mode noise by
measuring signals differentially from the source.
■
NAP (3.3mW) Shutdown Mode
■
Internal Conversion Triggered by CONV
■
83dB Common Mode Rejection
■
Tiny 32-Pin (5mm × 5mm) QFN Package
The device converts 0V to 2.5V unipolar inputs differen-
tially, or ±1.25V bipolar inputs also differentially,
depending on the state of the BIP pin. Any analog input
may swing rail-to-rail as long as the differential input
range is maintained.
U
APPLICATIO S
■
Multiphase Power Measurement
■
■
■
Multiphase Motor Control
The conversion sequence can be abbreviated to convert
fewer than six channels, depending on the logic state of
the SEL2, SEL1 and SEL0 inputs.
Data Acquisition Systems
Uninterruptable Power Supplies
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 6084440, 6522187.
The serial interface sends out the six conversion results in
96 clocks for compatibility with standard serial interfaces.
W
BLOCK DIAGRA
–
+
–
+
–
+
–
+
–
+
–
+
10µF
3V
25
CH5
CH5
CH4
CH4
CH3
CH3
CH2
CH2
CH1
CH1
CH0
CH0
V
CC
V
DD
21
20 19 18
17 16 15
14 12 11
13
10
9
8
7
6
5
4
24
12-BIT LATCH 0
12-BIT LATCH 1
12-BIT LATCH 2
12-BIT LATCH 3
12-BIT LATCH 4
12-BIT LATCH 5
OV
3V
DD
–
–
–
–
–
3
1
2
–
THREE-
STATE
SERIAL
OUTPUT
PORT
S AND H
S AND H
S AND H
S AND H
S AND H
S AND H
600ksps
12-BIT ADC
SD0
0.1µF
OGND
MUX
TIMING
LOGIC
CONV
30
32
31
2.5V
REFERENCE
SCK
DGND
V
GND
22
REF
23
33
29
26
27
28
10µF
235114 TA01
BIP
SEL2 SEL1 SEL0
140812f
1
LTC1408-12
W U
W W W
U
/O
PACKAGE RDER I FOR ATIO
ABSOLUTE AXI U RATI GS
(Notes 1, 2)
TOP VIEW
ORDER PART
NUMBER
Supply Voltage (VDD, VCC, OVDD) .............................. 4V
Analog and VREF Input Voltages
(Note 3) ................................... – 0.3V to (VDD + 0.3V)
Digital Input Voltages .................. – 0.3V to (VDD + 0.3V)
Digital Output Voltage.................. – 0.3V to (VDD + 0.3V)
Power Dissipation.............................................. 100mW
Operation Temperature Range
LTC1408C-12 .......................................... 0°C to 70°C
LTC1408I-12 ...................................... –40°C to 85°C
Storage Temperature Range ................. –65°C to 125°C
32 31 30 29 28 27 26 25
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
SDO
V
V
CC
LTC1408CUH-12
LTC1408IUH-12
OGND
REF
OV
GND
DD
+
CH0
CH0
CH5–
CH5+
GND
33
–
GND
+
CH1
CH4–
CH4+
–
CH1
QFN PART MARKING
1408-12
9
10 11 12 13 14 15 16
QFN PACKAGE
32-PIN (5mm × 5mm) PLASTIC QFN
TJMAX = 125°C, θJA = 34°C/ W
EXPOSED PIN IS GND (PAD 33)
MUST BE SOLDERED TO PCB
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
Consult LTC Marketing for parts specified with wider operating temperature ranges.
U
CO VERTER CHARACTERISTICS
The
●
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T = 25°C. With internal reference, V = V = 3V.
A
DD
CC
PARAMETER
CONDITIONS
MIN
12
TYP
MAX
UNITS
Bits
LSB
mV
Resolution (No Missing Codes)
Integral Linearity Error
Offset Error
●
(Note 5)
(Note 4)
●
●
–1
± 0.25
±1
1
4.5
3
–4.5
–3
Offset Match from CH0 to CH5
Range Error
±0.5
±2
mV
(Note 4)
●
–12
–5
12
5
mV
Range Match from CH0 to CH5
Range Tempco
±1
mV
Internal Reference (Note 4)
External Reference
± 15
±1
ppm/°C
ppm/°C
U
U
A ALOG I PUT
The
A
●
denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at T = 25°C. With internal reference, V = V = 3V.
DD
CC
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
V
Analog Differential Input Range (Notes 3, 8, 9)
2.7V ≤ V ≤ 3.3V
0 to 2.5
V
V
IN
DD
Analog Common Mode + Differential
Input Range
0 to V
CM
DD
(Note 8)
(Note 6)
I
Analog Input Leakage Current
●
●
1
µA
pF
ns
ns
ps
ps
IN
C
Analog Input Capacitance
13
IN
t
t
t
t
Sample-and-Hold Acquisition Time
Sample-and-Hold Aperture Delay Time
Sample-and-Hold Aperture Delay Time Jitter
Channel to Channel Aperture Skew
Analog Input Common Mode Rejection Ratio
39
ACQ
AP
1
0.3
JITTER
SK
200
CMRR
f
f
= 100kHz, V = 0V to 3V
–83
–67
dB
dB
IN
IN
IN
= 10MHz, V = 0V to 3V
IN
140812f
2
LTC1408-12
U W
DY A IC ACCURACY
The
●
denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at T = 25°C. With internal reference, V = V = 3V.
A
DD
CC
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
SINAD
Signal-to-Noise Plus
Distortion Ratio
100kHz Input Signal
300kHz Input Signal
●
●
70
72
72
dB
dB
THD
SFDR
IMD
Total Harmonic
Distortion
100kHz First 5 Harmonics
300kHz First 5 Harmonics
–80
–90
–86
dB
dB
Spurious Free
Dynamic Range
100kHz Input Signal
300kHz Input Signal
90
86
dB
dB
Intermodulation
Distortion
0.625V , 833kHz into CH0+, 0.625V , 841kHz into CH0–.
–80
dB
P-P
P-P
Bipolar Mode. Also Applicable to Other Channels
Code-to-Code
V
REF
= 2.5V (Note 17)
0.2
LSB
RMS
Transition Noise
Full Power Bandwidth
V
= 2.5V , SDO = 11585LSB (–3dBFS) (Note 15)
50
5
MHz
MHz
IN
P-P
P-P
Full Linear Bandwidth S/(N + D) ≥ 68dB, Bipolar Differential Input
U U
U
T = 25°C. V = V = 3V.
I TER AL REFERE CE CHARACTERISTICS
A
DD
CC
PARAMETER
CONDITIONS
= 0
MIN
TYP
MAX
UNITS
V
V
V
V
V
V
Output Voltage
Output Tempco
Line Regulation
Output Resistance
Settling Time
I
2.5
15
REF
REF
REF
REF
REF
OUT
ppm/°C
µV/V
Ω
V
= 2.7V to 3.6V, V = 2.5V
600
0.2
2
DD
REF
Load Current = 0.5mA
= 10µF
C
ms
REF
External V
Input Range
2.55
V
DD
V
REF
U
U
The
DD
●
denotes the specifications which apply over the
CC
DIGITAL I PUTS A D DIGITAL OUTPUTS
full operating temperature range, otherwise specifications are at T = 25°C. V = V = 3V.
A
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
V
High Level Input Voltage
Low Level Input Voltage
Digital Input Current
V
V
V
= 3.3V
= 2.7V
●
●
●
2.4
V
V
IH
IL
DD
DD
IN
0.6
I
= 0V to V
± 10
µA
pF
V
IN
DD
C
V
V
Digital Input Capacitance
High Level Output Voltage
Low Level Output Voltage
5
IN
V
= 3V, I = –200µA
OUT
●
2.5
2.9
0.05
OH
OL
DD
V
V
= 2.7V, I
= 2.7V, I
= 160µA
V
V
DD
DD
OUT
OUT
= 1.6mA
●
●
0.4
I
Hi-Z Output Leakage D
V
= 0V and V
DD
± 10
µA
pF
OZ
OUT
OUT
C
Hi-Z Output Capacitance D
1
OZ
OUT
I
I
Output Short-Circuit Source Current
Output Short-Circuit Sink Current
V
V
= 0V, V = 3V
20
15
mA
mA
SOURCE
SINK
OUT
OUT
DD
= V = 3V
DD
140812f
3
LTC1408-12
POWER REQUIRE E TS
W U
The
●
denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at T = 25°C. With internal reference, V = V = 3V.
A
DD
CC
SYMBOL
, V
PARAMETER
Supply Voltage
Supply Current
CONDITIONS
MIN
TYP
MAX
UNITS
V
2.7
3.0
3.6
V
DD CC
I
+ I
CC
Active Mode, f
Nap Mode
Sleep Mode
= 600ksps
SAMPLE
●
●
5
1.1
2.0
7
1.9
15
mA
mA
µA
DD
PD
Power Dissipation
Active Mode with SCK, f
= 600ksps
15
mW
SAMPLE
W U
TI I G CHARACTERISTICS
The
DD
●
denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at T = 25°C. V = 3V.
A
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
f
Maximum Sampling Rate per Channel
(Conversion Rate)
●
100
kHz
SAMPLE(MAX)
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Minimum Sampling Period (Conversion + Acquisiton Period)
Clock Period
●
●
10
µs
THROUGHPUT
(Note 16)
100
96
2
10000
ns
SCK
Conversion Time
(Notes 6, 17)
(Note 6)
SCLK cycles
CONV
Minimum High or Low SCLK Pulse Width
CONV to SCKSetup Time
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
1
(Notes 6, 10)
(Note 6)
3
10000
2
SCK Before CONV
0
3
Minimum High or Low CONV Pulse Width
SCK↑ to Sample Mode
(Note 6)
4
4
(Note 6)
4
5
CONV↑ to Hold Mode
(Notes 6, 11)
(Notes 6, 7, 13)
(Notes 6, 12)
(Notes 6, 12)
(Notes 6, 12)
(Notes 6, 14)
1.2
45
6
96th SCK↑ to CONV↑ Interval (Affects Acquisition Period)
Delay from SCKto Valid Bits 0 Through 11
SCK↑ to Hi-Z at SDO
7
8
6
8
9
Previous SDO Bit Remains Valid After SCK
2
10
11
V
Settling Time After Sleep-to-Wake Transition
2
REF
+
–
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliabilty and lifetime.
Note 9: The absolute voltage at CHx and CHx must be within this range.
Note 10: If less than 3ns is allowed, the output data will appear one clock
cycle later. It is best for CONV to rise half a clock before SCK, when
running the clock at rated speed.
Note 2: All voltage values are with respect to ground GND.
Note 11: Not the same as aperture delay. Aperture delay (1ns) is the
difference between the 2.2ns delay through the sample-and-hold and the
1.2ns CONV to Hold mode delay.
Note 3: When these pins are taken below GND or above V , they will be
DD
clamped by internal diodes. This product can handle input currents greater
than 100mA below GND or greater than V without latchup.
DD
Note 12: The rising edge of SCK is guaranteed to catch the data coming
out into a storage latch.
Note 13: The time period for acquiring the input signal is started by the
96th rising clock and it is ended by the rising edge of CONV.
+
Note 4: Offset and range specifications apply for a single-ended CH0 –
+
–
–
CH5 input with CH0 – CH5 grounded and using the internal 2.5V
reference.
Note 5: Integral linearity is tested with an external 2.55V reference and is
defined as the deviation of a code from the straight line passing through
the actual endpoints of a transfer curve. The deviation is measured from
the center of quantization band. Linearity is tested for CH0 only.
Note 6: Guaranteed by design, not subject to test.
Note 7: Recommended operating conditions.
Note 14: The internal reference settles in 2ms after it wakes up from Sleep
mode with one or more cycles at SCK and a 10µF capacitive load.
Note 15: The full power bandwidth is the frequency where the output code
swing drops by 3dB with a 2.5V input sine wave.
P-P
Note 16: Maximum clock period guarantees analog performance during
conversion. Output data can be read with an arbitrarily long clock period.
Note 8: The analog input range is defined for the voltage difference
between CHx and CHx , x = 0–5.
Note 17: The conversion process takes 16 clocks for each channel that is
enabled, up to 96 clocks for all 6 channels.
+
–
140812f
4
LTC1408-12
U W
V
DD
= 3V, T = 25°C
A
TYPICAL PERFOR A CE CHARACTERISTICS
THD, 2nd and 3rd
vs Input Frequency
THD, 2nd and 3rd
SINAD vs Input Frequency
vs Input Frequency
–50
–50
–56
–62
–68
–74
–80
–86
–92
–98
–104
–110
74
71
68
65
62
59
56
53
UNIPOLAR SINGLE-ENDED
BIPOLAR SINGLE-ENDED
–56
–62
–68
THD
THD
–74
2nd
2nd
–80
–86
–92
3rd
3rd
–98
–104
–110
0.1
1
10
0.1
1
10
0.1
10
1
FREQUENCY (MHz)
FREQUENCY (MHz)
FREQUENCY (MHz)
140812 G02
140812 G03
140814 G01
100kHz Unipolar Sine Wave 8192
Point FFT Plot
SNR vs Input Frequency
SFDR vs Input Frequency
0
–10
–20
77
74
71
68
92
86
80
74
68
62
56
50
–30
–40
–50
–60
–70
–80
–90
–100
65
62
59
56
53
50
–110
–120
0.1
1
10
0.1
10
0
10
20
30
40
50
1
FREQUENCY (MHz)
FREQUENCY (MHz)
FREQUENCY (kHz)
140812 G05
140812 G06
140814 G04
Differential Linearity vs Output
Code, CH0, Unipolar Mode
Integral Linearity vs Output Code,
CH0, Unipolar Mode
100kHz Bipolar Sine Wave 8192
Point FFT Plot
0
–10
1
0.8
0.6
0.4
0.2
0
1
0.8
–20
0.6
–30
0.4
–40
0.2
–50
–60
0
–70
–0.2
–0.4
–0.6
–0.8
0
–0.2
–0.4
–0.6
–0.8
–1
–80
–90
–100
–110
–120
0
20
30
40
50
0
512 1024 1536 2048 2560 3072 3584 4096
OUTPUT CODE
10
0
512 1024 1536 2048 2560 3072 3584 4096
OUTPUT CODE
FREQUENCY (KHZ)
140812 G09
140812 G07
140812 G08
140812f
5
LTC1408-12
U W
V
DD
= 3V, T = 25°C
TYPICAL PERFOR A CE CHARACTERISTICS
A
Full Scale Signal Response
CMRR vs Frequency
3
0
0
–20
–3
–6
–40
–60
–9
–12
–15
–18
–21
–24
–27
–30
–80
–100
–120
10
100
1000
100 1k 10k 100k 1M 10M 100M 1G
FREQUENCY (Hz)
FREQUENCY (MHz)
1408 G11
1408 G10
PSRR vs Frequency
Crosstalk vs Frequency
0
0
–20
–20
–40
–60
–40
–60
–80
–100
–120
–80
–100
–120
100 1k 10k 100k 1M 10M 100M 1G
100 1k 10k 100k 1M 10M 100M 1G
FREQUENCY (Hz)
FREQUENCY (Hz)
1408 G12
1408 G13
140812f
6
LTC1408-12
U
U
U
PI FU CTIO S
CH3+ (Pin 14): Non-Inverting Channel 3. CH3+ operates
fully differentially with respect to CH3– with a 0V to 2.5V,
or ±1.25V differential swing and a 0V to VDD absolute
input range.
CH3– (Pin 15): Inverting Channel 3. CH3– operates fully
differentially with respect to CH3+ with a –2.5V to 0V, or
±1.25V differential swing and a 0V to VDD absolute
input range.
CH4+ (Pin 17): Non-Inverting Channel 4. CH4+ operates
fully differentially with respect to CH4– with a 0V to 2.5V,
or±1.25Vdifferentialswinganda0VtoVDD absoluteinput
range.
SDO (Pin 1): Three-State Serial Data Output. Each set of
six output data words represent the six analog input
channels at the start of the previous conversion. Data for
CH0 comes out first and data for CH5 comes out last. Each
data word comes out MSB first.
OGND (Pin 2): Ground Return for SDO Currents. Connect
to the solid ground plane.
OVDD (Pin 3): Power Supply for the SDO Pin. OVDD must
be no more than 300mV higher than VDD and can be
brought to a lower voltage to interface to low voltage logic
families. The unloaded high state at SDO is at the potential
of OVDD.
CH0+ (Pin 4): Non-Inverting Channel 0. CH0+ operates
fully differentially with respect to CH0– with a 0V to 2.5V,
or ±1.25V differential swing and a 0V to VDD absolute
input range.
CH4– (Pin 18): Inverting Channel 4. CH4– operates fully
differentially with respect to CH4+ with a –2.5V to 0V, or
±1.25V differential swing and a 0V to VDD absolute input
range.
CH0– (Pin 5): Inverting Channel 0. CH0– operates fully
differentially with respect to CH0+ with a –2.5V to 0V,
or ±1.25V differential swing and a 0V to VDD absolute
input range.
CH5+ (Pin 20): Non-Inverting Channel 5. CH5+ operates
fully differentially with respect to CH5– with a 0V to 2.5V,
or±1.25Vdifferentialswinganda0VtoVDD absoluteinput
range.
CH5– (Pin 21): Inverting Channel 5. CH5– operates fully
differentially with respect to CH5+ with a –2.5V to 0V, or
±1.25V differential swing and a 0V to VDD absolute input
range.
GND (Pins 6, 9, 12, 13, 16, 19): Analog Grounds. These
groundpinsmustbetieddirectlytothesolidgroundplane
under the part. Analog signal currents flow through these
connections.
CH1+ (Pin 7): Non-Inverting Channel 1. CH1+ operates
fully differentially with respect to CH1– with a 0V to 2.5V,
or ±1.25V differential swing and a 0V to VDD absolute
input range.
CH1– (Pin 8): Inverting Channel 1. CH1– operates fully
differentially with respect to CH1+ with a –2.5V to 0V,
or ±1.25V differential swing and a 0V to VDD absolute
input range.
CH2+ (Pin 10): Non-Inverting Channel 2. CH2+ operates
fully differentially with respect to CH2– with a 0V to 2.5V,
or ±1.25V differential swing and a 0V to VDD absolute
input range.
CH2– (Pin 11): Inverting Channel 2. CH2– operates fully
differentially with respect to CH2+ with a –2.5V to 0V, or
±1.25V differential swing and a 0V to VDD absolute
input range.
GND (PIN 22): Analog Ground for Reference. Analog
ground must be tied directly to the solid ground plane
under the part. Analog signal currents flow through this
connection. The 10µF reference bypass capacitor should
be returned to this pad.
VREF (Pin 23): 2.5V Internal Reference. Bypass to GND
and a solid analog ground plane with a 10µF ceramic
capacitor (or 10µF tantalum in parallel with 0.1µF ce-
ramic). Can be overdriven by an external reference voltage
between 2.55V and VDD, VCC.
VCC (Pin 24): 3V Positive Analog Supply. This pin supplies
3V to the analog section. Bypass to the solid analog
ground plane with a 10µF ceramic capacitor (or 10µF
tantalum) in parallel with 0.1µF ceramic. Care should be
taken to place the 0.1µF bypass capacitor as close to
Pin 24 as possible. Pin 24 must be tied to Pin 25.
140812f
7
LTC1408-12
U
U
U
PI FU CTIO S
BIP (Pin 29): Bipolar/Unipolar Mode. The input differen-
tial range is 0V – 2.5V when BIP is LOW, and it is ±1.25V
when BIP is HIGH. Must be kept in fixed state during
conversion and during subsequent conversion to read
data. When changing BIP between conversions the full
acquisition time must be allowed before starting the next
conversion. The output data is in 2’s complement
format for bipolar mode and straight binary format for
unipolar mode.
VDD (Pin 25): 3V Positive Digital Supply. This pin supplies
3V to the logic section. Bypass to DGND pin and solid
analog ground plane with a 10µF ceramic capacitor (or
10µF tantalum in parallel with 0.1µF ceramic). Keep in
mind that internal digital output signal currents flow
through this pin. Care should be taken to place the 0.1µF
bypass capacitor as close to Pin 25 as possible. Pin 25
must be tied to Pin 24.
SEL2 (Pin 26): Most significant bit controlling the
number of channels being converted. In combination with
SEL1andSEL0,000selectsjustthefirstchannel(CH0)for
conversion. Incrementing SELx selects additional
channels(CH0–CH5) for conversion. 101, 110 or 111
selectall6channelsforconversion. Mustbekeptinafixed
state during conversion and during the subsequent con-
version to read data.
CONV (Pin 30): Convert Start. Holds the six analog input
signals and starts the conversion on CONV’s rising edge.
Two CONV pulses with SCK in fixed high or fixed low state
starts Nap mode. Four or more CONV pulses with SCK in
fixed high or fixed low state starts Sleep mode.
DGND (Pin 31): Digital Ground. This ground pin must be
tied directly to the solid ground plane. Digital input signal
currents flow through this pin.
SEL1 (Pin 27): Middle significance bit controlling the
number of channels being converted. In combination with
SEL0andSEL2,000selectsjustthefirstchannel(CH0)for
conversion. Incrementing SELx selects additional
channels for conversion. 101, 110 or 111 select all 6
channels (CH0–CH5) for conversion. Must be kept in a
fixed state during conversion and during the subsequent
conversion to read data.
SCK (Pin 32): External Clock Input. Advances the conver-
sion process and sequences the output data at SD0 (Pin1)
on the rising edge. One or more SCK pulses wake from
sleep or nap power saving modes. 16 clock cycles are
needed for each of the channels that are activated by SELx
(Pins 26, 27, 28), up to a total of 96 clock cycles needed
to convert and read out all 6 channels.
SEL0 (Pin 28): Least significant bit controlling the
number of channels being converted. In combination with
SEL1andSEL2,000selectsjustthefirstchannel(CH0)for
conversion. Incrementing SELx selects additional
channels for conversion. 101, 110 or 111 select all 6
channels (CH0–CH5) for conversion. Must be kept in a
fixed state during conversion and during the subsequent
conversion to read data.
EXPOSED PAD (Pin 33): GND. Must be tied directly to the
solid ground plane.
140812f
8
LTC1408-12
W
BLOCK DIAGRA
0.1µF
10µF
3V
V
V
DD
CC
24
25
+
CH0
4
+
S & H
S & H
S & H
S & H
S & H
S & H
–
CH0
5
6
7
–
+
–
CH1
+
–
CH1
8
9
+
–
CH2
10
+
–
OV
3V
DD
12-BIT LATCH 0
12-BIT LATCH 1
12-BIT LATCH 2
12-BIT LATCH 3
12-BIT LATCH 4
12-BIT LATCH 5
3
1
2
CH2
THREE-
STATE
SERIAL
OUTPUT
PORT
11
SD0
0.1µF
600ksps
12-BIT ADC
MUX
12 13
14
OGND
+
–
CH3
+
–
CH3
15
16
17
TIMING
LOGIC
CONV
SCK
30
32
+
–
CH4
+
–
CH4
18
19
20
+
–
CH5
+
–
CH5
21
2.5V
REFERENCE
V
REF
EXPOSED PAD
33
22
23 29
26
27
28
31
10µF
DGND
GND
BIP
SEL2 SEL1 SEL0
1408 BD
140812f
9
LTC1408-12
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W
TI I G DIAGRA S
S C K
140812f
10
LTC1408-12
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W
TI I G DIAGRA S
Nap Mode and Sleep Mode Waveforms
SCK
t
1
t
1
CONV
NAP
SLEEP
t
11
V
REF
1408 TD02
NOTE: NAP AND SLEEP ARE INTERNAL SIGNALS
SCK to SDO Delay
SCK
SCK
V
IH
V
IH
t
10
8
t
t
9
V
V
OH
SDO
SDO
Hi-Z
OL
1408 TD03
140812f
11
LTC1408-12
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APPLICATIO S I FOR ATIO
SELECTING THE NUMBER OF CONVERTED CHANNELS
(SEL2, SEL1, SEL0)
BIPOLAR/UNIPOLAR MODE
The input voltage range for each of the CHx input differen-
tial pairs is UNIPOLAR 0V – 2.5V when BIP is LOW, and
BIPOLAR ±1.25V when BIP is HIGH. This pin must be kept
in fixed state during conversion and during subsequent
conversion to read data. When changing BIP between
conversions the full acquisition time must be allowed
beforestartingthenextconversion. Afterchangingmodes
from BIPOLAR to UNIPOLAR, or from UNIPOLAR to
BIPOLAR, you can still read the first set of channels in the
new mode, by inverting the MSB to read these channels in
the mode that they were converted in.
These three control pins select the number of channels
being converted (see Table 1). 000 selects only the first
channel (CH0) for conversion. Incrementing SELx selects
additional channels for conversion, up to 6 channels. 101,
110or111selectall6channelsforconversion. Thesepins
must be kept in a fixed state during conversion and during
the subsequent conversion to read data. When changing
modes between conversions, keep in mind that the output
data of a particular channel will remain unchanged until
afterthatchannelisconvertedagain. Forexample:convert
a sequence of 4 channels (CH0, CH1, CH2, CH3) with
SELx = 011, then, after these channels are converted
change SELx to 001 to convert just CH0 and CH1. During
the conversion of the first set of two channels you will be
able to read the data from the same two channels con-
verted as part of the previous group of 4 channels. Later,
you could convert 4 or more channels to read back the
unread CH2 and CH3 data that was converted in the first
setof4channels. Thesepinsareoftenhardwiredtoenable
the right number of channels for a particular application.
Choosing to convert fewer channels per conversion re-
sults in faster throughput of those channels. For example,
6 channels can be converted at 100ksps/ch, while 3
channels can be converted at 200ksps/ch.
DRIVING THE ANALOG INPUT
The differential analog inputs of the LTC1408-12 may be
driven differentially or as a single-ended input (i.e., the
CHx– input is grounded). All twelve analog inputs of all six
differential analog input pairs, CH0+ and CH0–, CH1+ and
CH1–, CH2+ and CH2–, CH3+ and CH3–, CH4+ and CH4–
and CH5+ and CH5–, are sampled at the same instant. Any
unwanted signal that is common to both inputs of each
input pair will be reduced by the common mode rejection
of the sample-and-hold circuit. The inputs draw only one
small current spike while charging the sample-and-hold
capacitors at the end of conversion. During conversion,
the analog inputs draw only a small leakage current. If the
source impedance of the driving circuit is low, then the
Table 1. Conversion Sequence Control
(“acquire” represents simultaneous sampling of all channels; CHx represents conversion of channels)
SEL2
SEL1
SEL0
CHANNEL ACQUISITION AND CONVERSION SEQUENCE
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
acquire, CH0, acquire, CH0...
acquire, CH0, CH1, acquire, CH0, CH1...
acquire, CH0, CH1, CH2, acquire, CH0, CH1, CH2...
acquire, CH0, CH1, CH2, CH3, acquire, CH0, CH1, CH2, CH3...
acquire, CH0, CH1, CH2, CH3, CH4, acquire, CH0,CH1,CH2, CH3, CH4...
acquire, CH0, CH1, CH2, CH3, CH4, CH5, acquire, CH0, CH1, CH2, CH3, CH4, CH5...
acquire, CH0, CH1, CH2, CH3, CH4, CH5, acquire, CH0, CH1, CH2, CH3, CH4, CH5...
acquire, CH0, CH1, CH2, CH3, CH4, CH5, acquire, CH0, CH1, CH2, CH3, CH4, CH5...
140812f
12
LTC1408-12
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APPLICATIO S I FOR ATIO
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LTC1566-1: Low Noise 2.3MHz Continuous Time
LTC1408-12 inputs can be driven directly. As source
impedance increases, so will acquisition time. For mini-
mum acquisition time with high source impedance, a
buffer amplifier must be used. The main requirement is
that the amplifier driving the analog input(s) must settle
after the small current spike before the next conversion
starts (the time allowed for settling must be at least 39ns
for full throughput rate). Also keep in mind while choosing
an input amplifier the amount of noise and harmonic
distortion added by the amplifier.
Lowpass Filter.
LT®1630: Dual 30MHz Rail-to-Rail Voltage FB Amplifier.
2.7V to ±15V supplies. Very high AVOL, 500µV offset and
520ns settling to 0.5LSB for a 4V swing. THD and noise
are –93dB to 40kHz and below 1LSB to 320kHz (AV = 1,
2VP-P into1kΩ,VS =5V),makingthepartexcellentforAC
applications (to 1/3 Nyquist) where rail-to-rail perfor-
mance is desired. Quad version is available as LT1631.
LT1632: Dual 45MHz Rail-to-Rail Voltage FB Amplifier.
2.7V to ±15V supplies. Very high AVOL, 1.5mV offset and
400ns settling to 0.5LSB for a 4V swing. It is suitable for
applications with a single 5V supply. THD and noise are
–93dB to 40kHz and below 1LSB to 800kHz (AV = 1,
2VP-P into1kΩ,VS =5V),makingthepartexcellentforAC
applications where rail-to-rail performance is desired.
Quad version is available as LT1633.
CHOOSING AN INPUT AMPLIFIER
Choosing an input amplifier is easy if a few requirements
are taken into consideration. First, to limit the magnitude
of the voltage spike seen by the amplifier from charging
the sampling capacitor, choose an amplifier that has a low
output impedance (< 100Ω) at the closed-loop bandwidth
frequency. For example, if an amplifier is used in a gain of
1 and has a unity-gain bandwidth of 50MHz, then the
output impedance at 50MHz must be less than 100Ω. The
second requirement is that the closed-loop bandwidth
must be greater than 40MHz to ensure adequate small-
signal settling for full throughput rate. If slower op amps
are used, more time for settling can be provided by
increasing the time between conversions. The best choice
for an op amp to drive the LTC1408-12 depends on the
application. Generally, applications fall into two catego-
ries: AC applications where dynamic specifications are
most critical and time domain applications where DC
accuracy and settling time are most critical. The following
list is a summary of the op amps that are suitable for
driving the LTC1408-12. (More detailed information is
available in the Linear Technology Databooks and on the
website at www.linear.com.)
LT1801: 80MHz GBWP, –75dBc at 500kHz, 2mA/ampli-
fier, 8.5nV/√Hz.
LT1806/LT1807: 325MHz GBWP, –80dBc distortion at
5MHz, unity gain stable, rail-to-rail in and out,
10mA/amplifier, 3.5nV/√Hz.
LT1810: 180MHz GBWP, –90dBc distortion at 5MHz,
unity gain stable, rail-to-rail in and out, 15mA/amplifier,
16nV/√Hz.
LT1818/LT1819: 400MHz, 2500V/µs, 9mA, Single/Dual
Voltage Mode Operational Amplifier.
LT6200: 165MHz GBWP, –85dBc distortion at 1MHz,
unity gain stable, rail-to-rail in and out, 15mA/amplifier,
0.95nV/√Hz.
LT6203: 100MHz GBWP, –80dBc distortion at 1MHz,
unity gain stable, rail-to-rail in and out, 3mA/amplifier,
1.9nV/√Hz.
LinearView is a trademark of Linear Technology Corporation.
LT6600: Amplifier/Filter Differential In/Out with 10MHz
Cutoff frequency.
140812f
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LTC1408-12
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APPLICATIO S I FOR ATIO
INPUT RANGE
INPUT FILTERING AND SOURCE IMPEDANCE
The analog inputs of the LTC1408-12 may be driven fully
differentially with a single supply. Either input may swing
uptoVCC,providedthedifferentialswingisnogreaterthan
2.5V with BIP (Pin 29) Low, or ±1.25V with (BIP Pin 29)
High. The 0V to 2.5V range is also ideally suited for single-
ended input use with single supply applications. The
common mode range of the inputs extend from ground to
the supply voltage VCC. If the difference between the CH+
andCH– atanyinputpairexceeds2.5V(unipolar)or1.25V
(bipolar), the output code will stay fixed at positive full-
scale, and if this difference goes below 0V (unipolar) or –
1.25V (bipolar), the output code will stay fixed at negative
full-scale.
The noise and the distortion of the input amplifier and
other circuitry must be considered since they will add to
the LTC1408-12 noise and distortion. The small-signal
bandwidth of the sample-and-hold circuit is 50MHz. Any
noise or distortion products that are present at the analog
inputs will be summed over this entire bandwidth. Noisy
input circuitry should be filtered prior to the analog inputs
tominimizenoise. Asimple1-poleRCfilterissufficientfor
many applications. For example, Figure 1 shows a 47pF
capacitor from CHO+ to ground and a 51Ω source resistor
to limit the net input bandwidth to 30MHz. The 47pF ca-
pacitoralsoactsasachargereservoirfortheinputsample-
and-hold and isolates the ADC input from sampling-glitch
sensitive circuitry. High quality capacitors and resistors
should be used since these components can add distor-
tion. NPO and silvermica type dielectric capacitors have
excellent linearity. Carbon surface mount resistors can
generate distortion from self heating and from damage
thatmayoccurduringsoldering. Metalfilmsurfacemount
resistors are much less susceptible to both problems.
When high amplitude unwanted signals are close in
frequency to the desired signal frequency a multiple pole
filter is required.
INTERNAL REFERENCE
The LTC1408-12 has an on-chip, temperature compen-
sated, bandgap reference that is factory trimmed to 2.5V
to obtain a precise 2.5V input span. The reference ampli-
fieroutputVREF, (Pin23)mustbebypassedwithacapaci-
tortoground.Thereferenceamplifierisstablewithcapaci-
tors of 1µF or greater. For the best noise performance, a
10µF ceramic or a 10µF tantalum in parallel with a 0.1µF
ceramic is recommended. The VREF pin can be overdriven
with an external reference as shown in Figure 2. The volt-
age of the external reference must be higher than the 2.5V
of the open-drain P-channel output of the internal refer-
ence. The recommended range for an external reference
is 2.55V to VDD. An external reference at 2.55V will see a
DC quiescent load of 0.75mA and as much as 3mA
during conversion.
High external source resistance, combined with 13pF of
inputcapacitance,willreducetherated50MHzinputband-
width and increase acquisition time beyond 39ns.
51Ω*
1
ANALOG
INPUT
+
–
CH0
47pF*
2
CH0
LTC1408-12
REF
3
V
3.5V to 18V
10µF
11
GND
51Ω*
ANALOG
INPUT
4
+
3V
23
CH1
CH1
LT1790-3
V
REF
LTC2351-12
GND
47pF*
5
–
10µF
22
1408 F01
*TIGHT TOLERANCE REQUIRED TO AVOID
APERTURE SKEW DEGRADATION
1408 F02
Figure 2. Overdriving V Pin with an External Reference
Figure 1. RC Input Filter
REF
140812f
14
LTC1408-12
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APPLICATIO S I FOR ATIO
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INPUT SPAN VERSUS REFERENCE VOLTAGE
Figure 4 shows the ideal input/output characteristics for
the LTC1408-12 in unipolar mode (BIP = Low). The code
transitionsoccurmidwaybetweensuccessiveintegerLSB
values (i.e., 0.5LSB, 1.5LSB, 2.5LSB, FS – 1.5LSB). The
output code is straight binary with 1LSB = 2.5V/4096 =
610µV for the LTC1408-12. The LTC1408-12 has 0.2 LSB
RMS of Gaussian white noise.
The differential input range has a unipolar voltage span
that equals the difference between the voltage at the
reference buffer output VREF (Pin 23) and the voltage at
ground. The differential input range of the ADC is 0V to
2.5V when using the internal reference. The internal ADC
is referenced to these two nodes. This relationship also
holds true with an external reference.
111...111
111...110
111...101
DIFFERENTIAL INPUTS
The ADC will always convert the difference of CH+ minus
CH–, independentofthecommonmodevoltageatanypair
of inputs. The common mode rejection holds up at high
frequencies (see Figure 3.) The only requirement is that
both inputs not go below ground or exceed VDD.
000...010
000...001
000...000
0
FS – 1LSB
0
INPUT VOLTAGE (V)
1408 F04
–20
Figure 4. LTC1408-12 Transfer Characteristic
in Unipolar Mode (BIP = Low)
–40
–60
Figure 5 shows the ideal input/output characteristics for
the LTC1408-12 in bipolar mode (BIP = High). The code
transitionsoccurmidwaybetweensuccessiveintegerLSB
values (i.e., 0.5LSB, 1.5LSB, 2.5LSB, FS – 1.5LSB). The
output code is 2’s complement with 1LSB = 2.5V/4096 =
610µV for the LTC1408-12. The LTC1408-12 has 0.2 LSB
RMS of Gaussian white noise.
–80
–100
–120
100 1k 10k 100k 1M 10M 100M 1G
FREQUENCY (Hz)
1408 G11
Figure 3. CMRR vs Frequency
011...111
011...110
011...101
Integral nonlinearity errors (INL) and differential nonlin-
earityerrors(DNL)arelargelyindependentofthecommon
mode voltage. However, the offset error will vary. DC
CMRR is typically better than –90dB.
100...010
100...001
100...000
–FS
FS – 1LSB
INPUT VOLTAGE (V)
1408 F05
Figure 5. LTC1408-12 Transfer Characteristic
in Bipolar Mode (BIP = High)
140812f
15
LTC1408-12
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APPLICATIO S I FOR ATIO
Conversion Start Input (CONV)
POWER-DOWN MODES
The rising edge of CONV starts a conversion, but subse-
quent rising edges at CONV are ignored by the LTC1408-12
until the following 96 SCK rising edges have occurred. The
duty cycle of CONV can be arbitrarily chosen to be used as
aframesyncsignalfortheprocessorserialport.Asimple
approachtogenerateCONVistocreateapulsethatisone
SCK wide to drive the LTC1408-12 and then buffer this
signal to drive the frame sync input of the processor
serial port. It is good practice to drive the LTC1408-12
CONVinputfirsttoavoiddigitalnoiseinterferenceduring
the sample-to-hold transition triggered by CONV at the
start of conversion. It is also good practice to keep the
width of the low portion of the CONV signal greater than
15ns to avoid introducing glitches in the front end of the
ADCjustbeforethesample-and-holdgoesintoHoldmode
at the rising edge of CONV.
Upon power-up, the LTC1408-12 is initialized to the
activestateandisreadyforconversion.TheNapandSleep
mode waveforms show the power down modes for the
LTC1408-12. TheSCKandCONVinputscontrolthepower
down modes (see Timing Diagrams). Two rising edges at
CONV, without any intervening rising edges at SCK, put
the LTC1408-12 in Nap mode and the power consumption
drops from 15mW to 3.3mW. The internal reference
remains powered in Nap mode. One or more rising edges
at SCK wake up the LTC1408-12 very quickly and CONV
can start an accurate conversion within a clock cycle. Four
rising edges at CONV, without any intervening rising
edges at SCK, put the LTC1408-12 in Sleep mode and the
power consumption drops from 15mW to 6µW. One or
more rising edges at SCK wake up the LTC1408-12 for
operation. Theinternalreference(VREF )takes2mstoslew
and settle with a 10µF load. Using sleep mode more
frequently compromises the accuracy of the output data.
Note that for slower conversion rates, the Nap and Sleep
modes can be used for substantial reductions in power
consumption.
Minimizing Jitter on the CONV Input
In high speed applications where high amplitude sine
waves above 100kHz are sampled, the CONV signal must
have as little jitter as possible (10ps or less). The square
wave output of a common crystal clock module usually
meets this requirement. The challenge is to generate a
CONV signal from this crystal clock without jitter corrup-
tion from other digital circuits in the system. A clock
divider and any gates in the signal path from the crystal
clock to the CONV input should not share the same
integrated circuit with other parts of the system. The SCK
andCONVinputsshouldbedrivenfirst,withdigitalbuffers
DIGITAL INTERFACE
The LTC1408-12 has a 3-wire SPI (Serial Peripheral Inter-
face) interface. The SCK and CONV inputs and SDO output
implement this interface. The SCK and CONV inputs
acceptswingsfrom3VlogicandareTTLcompatible, ifthe
logic swing does not exceed VDD. A detailed description of
the three serial port signals follows:
140812f
16
LTC1408-12
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APPLICATIO S I FOR ATIO
U
after the next convert pulse. It is good practice to drive the
LTC1408-12 SCK input first to avoid digital noise interfer-
ence during the internal bit comparison decision by the
internal high speed comparator. Unlike the CONV input,
the SCK input is not sensitive to jitter because the input
signal is already sampled and held constant.
used to drive the serial port interface. Also note that the
master clock in the DSP may already be corrupted with
jitter, even if it comes directly from the DSP crystal.
Another problem with high speed processor clocks is that
they often use a low cost, low speed crystal (i.e., 10MHz)
to generate a fast, but jittery, phase-locked-loop system
clock (i.e., 40MHz). The jitter in these PLL-generated high
speed clocks can be several nanoseconds. Note that if you
choose to use the frame sync signal generated by the DSP
port, this signal will have the same jitter of the DSP’s
master clock.
Serial Data Output (SDO)
Upon power-up, the SDO output is automatically reset
to the high impedance state. The SDO output remains
in high impedance until a new conversion is started.
SDO sends out up to six sets of 12 bits in the output data
stream after the third rising edge of SCK after the start
of conversion with the rising edge of CONV. The six or
fewer 12-bit words are separated by two don’t care bits
and two clock cycles in high impedance mode. Please
note the delay specification from SCK to a valid SDO.
SDO is always guaranteed to be valid by the next rising
edge of SCK. The 16 – 96-bit output data stream is
compatible with the 16-bit or 32-bit serial port of most
processors.
The Typical Application Figure on page 20 shows a circuit
for level-shifting and squaring the output from an RF
signal generator or other low-jitter source. A single D-type
flip flop is used to generate the CONV signal to the
LTC1408-12.Re-timingthemasterclocksignaleliminates
clock jitter introduced by the controlling device (DSP,
FPGA, etc.) Both the inverter and flip flop must be treated
as analog components and should be powered from a
clean analog supply.
Serial Clock Input (SCK)
BOARD LAYOUT AND BYPASSING
The rising edge of SCK advances the conversion process
and also udpates each bit in the SDO data stream. After
CONV rises, the third rising edge of SCK sends out up to
six sets of 12 data bits, with the MSB sent first. A simple
approach is to generate SCK to drive the LTC1408-12 first
and then buffer this signal with the appropriate number of
inverters to drive the serial clock input of the processor
serial port. Use the falling edge of the clock to latch data
from the Serial Data Output (SDO) into your processor
serial port. The 12-bit Serial Data will be received in six
16-bit words with 96 or more clocks per frame sync. If
fewer than 6 channels are selected by SEL0–SEL2 for
conversion, then 16 clocks are needed per channel to
convert the analog inputs and read out the resulting data
Wire wrap boards are not recommended for high resolu-
tion and/or high speed A/D converters. To obtain the best
performancefromtheLTC1408-12,aprintedcircuitboard
with ground plane is required. Layout for the printed
circuit board should ensure that digital and analog signal
linesareseparatedasmuchaspossible. Inparticular, care
should be taken not to run any digital track alongside an
analog signal track. If optimum phase match between the
inputsisdesired, thelengthofthetwelveinputwiresofthe
six input channels should be kept matched. But each pair
of input wires to the six input channels should be kept
separated by a ground trace to avoid high frequency
crosstalk between channels.
140812f
17
LTC1408-12
APPLICATIO S I FOR ATIO
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Highqualitytantalumandceramicbypasscapacitorsshould HARDWARE INTERFACE TO TMS320C54x
be used at the VCC, VDD and VREF pins as shown in the
The LTC1408-12 is a serial output ADC whose interface
Block Diagram on the first page of this data sheet. For
has been designed for high speed buffered serial ports in
optimum performance, a 10µF surface mount tantalum
fast digital signal processors (DSPs). Figure 7 shows an
example of this interface using a TMS320C54X.
capacitor with a 0.1µF ceramic is recommended for the
VCC, VDD and VREF pins. Alternatively, 10µF ceramic chip
The buffered serial port in the TMS320C54x has direct
access to a 2kB segment of memory. The ADC’s serial
data can be collected in two alternating 1kB segments, in
real time, at the full 600ksps conversion rate of the
LTC1408-12. The DSP assembly code sets frame sync
mode at the BFSR pin to accept an external positive going
pulse and the serial clock at the BCLKR pin to accept an
external positive edge clock. Buffers near the LTC1408-12
may be added to drive long tracks to the DSP to prevent
corruption of the signal to LTC1408-12. This configura-
tion is adequate to traverse a typical system board, but
source resistors at the buffer outputs and termination
resistors at the DSP, may be needed to match the charac-
teristic impedance of very long transmission lines. If you
need to terminate the SDO transmission line, buffer it first
withoneortwo74ACxxgates. TheTTLthresholdinputsof
the DSP port respond properly to the 3V swing used with
the LTC1408-12.
capacitors such as X5R or X7R may be used. The capaci-
tors must be located as close to the pins as possible. The
tracesconnectingthepinsandthebypasscapacitorsmust
bekeptshortandshouldbemadeaswideaspossible. The
VCC and VDD bypass capacitor returns to the ground plane
and the VREF bypass capacitor returns to the Pin 22. Care
should be taken to place the 0.1µF VCC and VDD bypass
capacitor as close to Pins 24 and 25 as possible.
Figure6showstherecommendedsystemgroundconnec-
tions. All analog circuitry grounds should be terminated at
theLTC1408-12ExposedPad. Thegroundreturnfromthe
LTC1408-12 to the power supply should be low imped-
ance for noise-free operation. The Exposed Pad of the 32-
pin QFN package is also internally tied to the ground pads.
The Exposed Pad should be soldered on the PC board to
reduce ground connection inductance. All ground pins
(GND, DGND, OGND) must be connected directly to the
same ground plane under the LTC1408-12.
OV BYPASS,
DD
0.1µF, 0402
TMS320C54x
LTC1408-12
3V
5V
3
OV
DD
V
CC
30
CONV
SCK
BFSR
32
BCLKR
BDR
B11 B10
1
2
V
BYPASS,
SDO
DD
0.1µF, 0402
OGND
CONV
CLK
3-WIRE SERIAL
INTERFACE LINK
V
BYPASS,
1408 F06
CC
31
0.1µF, 0402 AND
10µF, 0805
DGND
0V TO 3V LOGIC SWING
Figure 7. DSP Serial Interface to TMS320C54x
V BYPASS,
REF
10µF, 0805
Figure 6. Recommended Layout
140812f
18
LTC1408-12
U
PACKAGE DESCRIPTIO
UH Package
32-Lead Plastic QFN (5mm x 5mm)
(Reference LTC DWG # 05-08-1693)
0.70 ±0.05
5.50 ±0.05
4.10 ±0.05
3.45 ± 0.05
3.50 REF
(4 SIDES)
3.45 ± 0.05
PACKAGE OUTLINE
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 × 45° CHAMFER
R = 0.05
TYP
0.00 – 0.05
R = 0.115
TYP
0.75 ± 0.05
5.00 ± 0.10
(4 SIDES)
31 32
0.40 ± 0.10
PIN 1
TOP MARK
(NOTE 6)
1
2
3.45 ± 0.10
3.50 REF
(4-SIDES)
3.45 ± 0.10
(UH32) QFN 0406 REV D
0.200 REF
0.25 ± 0.05
0.50 BSC
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
140812f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
19
LTC1408-12
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
ADCs
LTC1402
12-Bit, 2.2Msps Serial ADC
5V or ±5V Supply, 4.096V or ±2.5V Span
3V, 15mW, Unipolar Inputs, MSOP Package
3V, 15mW, Bipolar Inputs, MSOP Package
5V, Selectable Spans, 115mW
LTC1403/LTC1403A
12-/14-Bit, 2.8Msps Serial ADC
LTC1403-1/LTC1403A-1 12-/14-Bit, 2.8Msps Serial ADC
LTC1405
12-Bit, 5Msps Parallel ADC
LTC1407/LTC1407A
12-/14-Bit, 3Msps Simultaneous Sampling ADC
3V, 14mW, 2-Channel Unipolar Input Range
3V, 14mW, 2-Channel Bipolar Input Range
3V, 15mW, Selectable Bipolar (Unipolar Input, Six Differential Inputs)
5V, Selectable Spans, 80dB SINAD
LTC1407-1/LTC1407A-1 12-/14-Bit, 3Msps Simultaneous Sampling ADC
LTC1408
LTC1411
LTC1412
LTC1420
LTC1608
LTC1609
14-Bit, 600ksps Simultaneous Sampling ADC
14-Bit, 2.5Msps Parallel ADC
12-Bit, 3Msps Parallel ADC
±5V Supply, ±2.5V Span, 72dB SINAD
5V, Selectable Spans, 72dB SINAD
12-Bit, 10Msps Parallel ADC
16-Bit, 500ksps Parallel ADC
±5V Supply, ±2.5V Span, 90dB SINAD
5V Configurable Bipolar/Unipolar Inputs
5V or 3V (L-Version), Micropower, MSOP Package
16-Bit, 250ksps Serial ADC
LTC1864/LTC1865
LTC1864L/LTC1865L
16-Bit, 250ksps 1-/2-Channel Serial ADCs
DACs
LTC1592
16-Bit, Serial SoftSpanTM
I
DAC
±1LSB INL/DNL, Software Selectable Spans
OUT
LTC1666/LTC1667
LTC1668
12-/14-/16-Bit, 50Msps DAC
87dB SFDR, 20ns Settling Time
References
LT1460-2.5
LT1461-2.5
LT1790-2.5
Micropower Series Voltage Reference
Precision Voltage Reference
0.10% Initial Accuracy, 10ppm Drift
0.04% Initial Accuracy, 3ppm Drift
0.05% Initial Accuracy, 10ppm Drift
Micropower Series Reference in SOT-23
SoftSpan is a trademark of Linear Technology Corporation.
U
TYPICAL APPLICATIO
Low-Jitter Clock Timing with RF Sine Generator Using Clock
Squaring/Level Shifting Circuit and Re-Timing Flip-Flop
V
CC
1k
NC7SVU04P5X
0.1µF
50Ω
MASTER CLOCK
CC
V
1k
CONTROL
LOGIC
(FPGA, CPLD,
DSP, ETC.)
PRE
CLR
D
Q
Q
CONV
LTC
1408-12
CONVERT ENABLE
NL17SZ74
1408 TA02
140812f
LT/LWI 1006 • PRINTED IN THE USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
20
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(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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