LT1236ALS8 [Linear]

Precision, Low Noise, Low Profile Hermetic Voltage Reference; 精密,低噪声,低轮廓密封基准电压源
LT1236ALS8
型号: LT1236ALS8
厂家: Linear    Linear
描述:

Precision, Low Noise, Low Profile Hermetic Voltage Reference
精密,低噪声,低轮廓密封基准电压源

文件: 总16页 (文件大小:232K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LT1236LS8  
Precision, Low Noise, Low  
Profile Hermetic Voltage Reference  
FeaTures  
DescripTion  
The LT®1236LS8 is a precision reference that combines  
low drift and noise with excellent long-term stability and  
highoutputaccuracy.Thereferenceoutputwillbothsource  
and sink up to 10mA and remains very constant with input  
voltage variations.  
n
Hermetic 5mm × 5mm LCC Leadless Chip Carrier  
Package:  
Insensitive to Humidity  
Thermal Hysteresis: 8ppm (0°C to 70°C)  
Thermal Hysteresis: 60ppm (–40°C to 85°C)  
Low Drift:  
n
The hermetic package provides outstanding humidity and  
thermal hysteresis performance. The LT1236LS8 is only  
5mm × 5mm × 1.5mm, offering an alternative to large  
through-hole metal can voltage references, such as the  
industry standard LT1021. The LT1236LS8 offers similar  
performance to the LT1236, with additional stability from  
the hermetic package.  
A-Grade: 5ppm/°C Max  
B-Grade: 10ppm/°C Max  
High Accuracy:  
n
A-Grade: 0.05% Max  
B-Grade: 0.10% Max  
n
Low Noise: <1ppm Peak-to-Peak (0.1Hz to 10Hz)  
n
100% Noise Tested  
LT1236LS8 is based on a buried Zener diode structure,  
whichenablestemperatureandtimestability,andextremely  
low noise performance of < 1ppm peak-to-peak. Noise is  
100% tested in production. The LT1236LS8 operates on a  
supply voltage from 7.2V up to 40V. The subsurface Zener  
exhibits better time stability than even the best bandgap  
reference,andthehermeticpackagemaintainsthatstability  
over a wide range of environmental conditions.  
n
Sinks and Sources 10mA  
n
Wide Supply Range to 40V  
n
8-Pin (5mm × 5mm) LS8 Package  
applicaTions  
n
Instrumentation and Test Equipment  
n
High Resolution Data Acquisition Systems  
n
A/D and D/A Converters  
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear  
Technology Corporation. All other trademarks are the property of their respective owners.  
n
Precision Regulators  
n
Precision Scales  
n
Digital Voltmeters  
Typical applicaTion  
Typical Distribution of Temperature Drift  
24  
DISTRIBUTION  
OF THREE RUNS  
22  
20  
18  
16  
14  
12  
10  
8
Basic Connection  
LT1236LS8  
V
IN  
V
OUT  
OUT  
IN  
GND  
6
LT1236LS8 TA01  
4
2
0
–3  
–1  
0
1
2
3
–2  
OUTPUT DRIFT (ppm/°C)  
LT1236LS8 TA02  
1236ls8f  
1
LT1236LS8  
absoluTe MaxiMuM raTings  
pin conFiguraTion  
(Note 1)  
TOP VIEW  
NC*  
Input Voltage.............................................................40V  
Input/Output Voltage Differential ..............................35V  
Trim Pin-to-Ground Voltage  
8
NC*  
1
2
3
7
6
5
NC*  
Positive................................................. Equal to V  
V
IN  
V
OUT  
OUT  
Negative..............................................................–20V  
NC*  
TRIM**  
4
Output Short-Circuit Duration  
V = 35V..........................................................10 sec  
GND  
LS8 PACKAGE  
8-PIN LEADLESS CHIP CARRIER (5mm × 5mm)  
IN  
V ≤ 20V..................................................... Indefinite  
IN  
Operating Temperature Range .................40°C to 85°C  
*CONNECTED INTERNALLY.  
D0 NOT CONNECT EXTERNAL  
CIRCUITRY TO THESE PINS  
Storage Temperature Range .................. –65°C to 150°C  
**SEE APPLICATIONS  
INFORMATION SECTION  
T
= 125°C, θ = 120°C/W  
JA  
JMAX  
PACKAGE LID IS GND  
orDer inForMaTion  
LEAD FREE FINISH  
LT1236AILS8-5#PBF  
LT1236BILS8-5#PBF  
PART MARKING*  
PACKAGE DESCRIPTION  
SPECIFIED TEMPERATURE RANGE  
–40°C to 85°C  
12365  
8-Lead Ceramic LCC 5mm × 5mm  
8-Lead Ceramic LCC 5mm × 5mm  
12365  
–40°C to 85°C  
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
This product is only offered in trays. For more information go to: http://www.linear.com/packaging/  
elecTrical characTerisTics The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = 10V, IOUT = 0, unless otherwise noted.  
LT1236LS8-5  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Output Voltage (Note 2)  
LT1236ALS8  
LT1236BLS8  
4.9975  
4.9950  
5.000  
5.000  
5.0025  
5.0050  
V
V
Output Voltage Temperature Coefficient (Note 3)  
Line Regulation (Note 4)  
LT1236ALS8  
LT1236BLS8  
2
5
5
ppm/°C  
ppm/°C  
10  
7.2V ≤ V ≤ 10V  
4
12  
20  
6
ppm/V  
ppm/V  
ppm/V  
ppm/V  
IN  
l
l
10V ≤ V ≤ 40V  
2
IN  
10  
Load Regulation (Sourcing Current)  
(Note 4)  
0 ≤ I  
≤ 10mA  
15  
25  
40  
ppm/mA  
ppm/mA  
OUT  
l
1236ls8f  
2
LT1236LS8  
elecTrical characTerisTics The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = 10V, IOUT = 0, unless otherwise noted.  
LT1236LS8-5  
PARAMETER  
CONDITIONS  
0 ≤ I ≤ 10mA  
MIN  
TYP  
MAX  
UNITS  
Load Regulation (Sinking Current)  
(Note 4)  
60  
100  
150  
ppm/mA  
ppm/mA  
OUT  
l
l
Supply Current  
0.8  
1.2  
1.5  
mA  
mA  
Output Voltage Noise  
(Note 5)  
0.1Hz ≤ f ≤ 10Hz  
10Hz ≤ f ≤ 1kHz  
3.0  
2.2  
µV  
P-P  
µV  
RMS  
3.5  
Long-Term Stability of Output Voltage (Note 6)  
Temperature Hysteresis of Output (Note 7)  
∆t = 1000Hrs Non-Cumulative  
20  
ppm  
∆T = 25°C  
∆T = 0°C to 70°C  
∆T = –40°C to 85°C  
3
8
60  
ppm  
ppm  
ppm  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 2: Output voltage is measured immediately after turn-on. Changes  
due to chip warm-up are typically less than 0.005%.  
Note 3: Temperature coefficient is measured by dividing the change in  
output voltage over the temperature range by the change in temperature.  
Incremental slope is also measured at 25°C.  
Note 4: Line and load regulation are measured on a pulse basis. Output  
changes due to die temperature change must be taken into account  
separately.  
Note 5: RMS noise is measured with a 2-pole highpass filter at 10Hz and a  
2-pole lowpass filter at 1kHz. The resulting output is full-wave rectified and  
then integrated for a fixed period, making the final reading an average as  
opposed to RMS. Correction factors are used to convert from average to  
RMS, and 0.88 is used to correct for the non-ideal bandbass of the filters.  
Peak-to-peak noise is measured with a single highpass filter at 0.1Hz and a  
2-pole lowpass filter at 10Hz. The unit is enclosed in a still-air environment  
to eliminate thermocouple effects on the leads. Test time is 10 seconds.  
Note 6: Long-term stability typically has a logarithmic characteristic and  
therefore, changes after 1000 hours tend to be much smaller than before  
that time. Total drift in the second thousand hours is normally less than  
one third that of the first thousand hours, with a continuing trend toward  
reduced drift with time. Significant improvement in long-term drift can  
be realized by preconditioning the IC with a 100-200 hour, 125°C burn in.  
Long term stability will also be affected by differential stresses between  
the IC and the board material created during board assembly. Temperature  
cycling and baking of completed boards is often used to reduce these  
stresses in critical applications.  
Note 7: Hysteresis in output voltage is created by package stress that  
differs depending on whether the IC was previously at a higher or lower  
temperature. Output voltage is always measured at 25°C, but the IC is  
cycled to high or low temperature before successive measurements.  
Hysteresis is roughly proportional to the square of temperature change.  
Hysteresis is not normally a problem for operational temperature  
excursions, but can be significant in critical narrow temperature range  
applications where the instrument might be stored at high or low  
temperatures. Hysteresis measurements are preconditioned by one  
temperature cycle.  
1236ls8f  
3
LT1236LS8  
Typical perForMance characTerisTics  
Ripple Rejection  
Ripple Rejection  
Start-Up  
130  
8
7
6
5
4
3
115  
110  
105  
100  
95  
V
C
= 15V  
OUT  
V
= 0V TO 12V  
f = 150Hz  
IN  
IN  
= 0  
120  
110  
100  
90  
80  
70  
90  
60  
50  
85  
25 30  
10 15 20  
INPUT VOLTAGE (V)  
10  
100  
1k  
10k  
0
5
35 40  
12  
0
2
4
6
8
10  
14  
TIME (µs)  
FREQUENCY (Hz)  
1236ls8 G01  
1236ls8 G03  
1236ls8 G02  
Output Voltage Noise  
Output Voltage Temperature Drift  
Output Voltage Noise Spectrum  
16  
14  
12  
10  
8
5.005  
5.004  
5.003  
5.002  
5.001  
5.000  
400  
350  
300  
250  
200  
150  
100  
50  
C
= 0  
OUT  
FILTER = 1 POLE  
= 0.1Hz  
f
LOW  
6
4
2
0
0
10  
100  
1k  
10k  
10  
100  
1k  
10k  
–40  
0
20  
40  
60  
–20  
80 100  
FREQUENCY (Hz)  
BANDWIDTH (Hz)  
TEMPERATURE (°C)  
1236ls8 G04  
1236ls8 G05  
1236ls8 G06  
Load Regulation  
Quiescent Current  
Sink Mode Current Limit  
5
4
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
60  
50  
V
= 8V  
I
= 0  
V
= 8V  
IN  
OUT  
IN  
3
2
40  
T
= – 55°C  
J
1
0
T
= 25°C  
30  
20  
J
–1  
– 2  
– 3  
– 4  
– 5  
T
= 125°C  
J
10  
0
0
–10 8 – 6 – 4 – 2  
SOURCING  
0
2
4
6
8
10  
0
5
10 15 20 25  
INPUT VOLTAGE (V)  
40  
30 35  
0
2
4
6
8
10 12 14 16 18  
SINKING  
OUTPUT VOLTAGE (V)  
1236ls8 G08  
1236ls8 G09  
OUTPUT CURRENT (mA)  
1236ls8 G07  
1236ls8f  
4
LT1236LS8  
Typical perForMance characTerisTics  
Load Transient Response,  
CLOAD = 0  
Thermal Regulation  
V
= 25V  
IN  
∆POWER = 200mW  
I
= 0  
I
= 0  
SOURCE  
SINK  
LOAD  
REGULATION  
0
– 0.5  
1.0  
50mV  
50mV  
THERMAL  
REGULATION*  
I
= 0.2mA  
SINK  
I
= 0.5mA  
SOURCE  
I
= 2-10mA  
I
= 2-10mA  
SINK  
SOURCE  
I
= 10mA  
LOAD  
∆I  
= 100µA  
∆I  
0
= 100µA  
P-P  
SOURCE  
P-P  
SINK  
60 80  
20 40  
TIME (ms)  
0
1
2
4
1
2
3
4
0
100 120 140  
3
TIME (µs)  
1236ls8 G11  
*INDEPENDENT OF TEMPERATURE COEFFICIENT  
1236ls8 G10  
Load Transient Response,  
C
LOAD = 1000pF  
Output Noise 0.1Hz to 10Hz  
FILTERING = 1 ZERO AT ORIGIN  
1 POLE AT 0.1Hz  
I
= 0  
I
= 0  
SINK  
SOURCE  
2 POLES AT 10Hz  
5µV (1ppm)  
20mV  
20mV  
I
= 0.2mA  
I
= 0.2mA  
SINK  
SOURCE  
I
= 2-10mA  
SINK  
I
= 2-10mA  
SOURCE  
∆I  
SOURCE  
= 100µA  
P-P  
∆I  
SINK  
= 100µA  
P-P  
4
6
0
5
10 15 20  
0
5
10 15 20  
0
1
2
3
5
TIME (µs)  
TIME (MINUTES)  
1236ls8 G13  
1236ls8 G12  
1236ls8f  
5
LT1236LS8  
pin FuncTions  
NC (Pins 1, 3, 7, 8): Connected internally, do not connect.  
TRIM (Pin 5): Allows adjustment of output voltage. See  
Applications Information section for details.  
V (Pin 2): Power Supply. Bypass with 0.1µF (or larger)  
IN  
capacitor to ground.  
V
OUT  
(Pin6):OutputVoltage.SeeApplicationsInformation  
section for details regarding DC and capacitive loading  
and stability.  
GND(Pin4):DeviceGround.SeeApplicationsInformation  
section for recommended connection methods.  
block DiagraM  
INPUT  
Q2  
R1  
R2  
OUTPUT  
D6  
+
D5  
6.3V  
A1  
R3  
R4  
D3  
D4  
TRIM  
Q1  
GND  
1236sl8 ES  
1236ls8f  
6
LT1236LS8  
applicaTions inForMaTion  
Effect of Reference Drift on System Accuracy  
LT1236LS8  
IN  
GND TRIM  
A large portion of the temperature drift error budget in  
many systems is the system reference voltage. This graph  
indicates the maximum temperature coefficient allowable  
if the reference is to contribute no more than 0.5LSB error  
to the overall system performance. The example shown is  
a 12-bit system designed to operate over a temperature  
rangefrom2Cto65°C.Assumingthesystemcalibration  
is performed at 25°C, the temperature span is 40°C. It can  
be seen from the graph that the temperature coefficient  
of the reference must be no worse than 3ppm/°C if it is  
to contribute less than 0.5LSB error. For this reason, the  
LT1236LS8 has been optimized for low drift.  
V
OUT  
OUT  
R1  
27k  
R2  
50k  
1N4148  
1236ls8 AI02  
Capacitive Loading and Transient Response  
The LT1236LS8 is stable with all capacitive loads, but for  
optimum settling with load transients, output capacitance  
should be under 1000pF. The output stage of the reference  
is class AB with a fairly low idling current. This makes  
transient response worst-case at light load currents.  
Because of internal current drain on the output, actual  
Maximum Allowable Reference Drift  
100  
worst-case occurs at I  
= 0. Significantly better load  
LOAD  
8-BIT  
transient response is obtained by moving slightly away  
from these points. See Load Transient Response curves  
for details. In general, best transient response is obtained  
when the output is sourcing current. In critical applica-  
tions, a 10µF solid tantalum capacitor with several ohms  
in series provides optimum output bypass.  
10-BIT  
10  
12-BIT  
14-BIT  
Load Regulation  
1.0  
10 20  
40  
60 70 80  
100  
90  
30  
50  
The LT1236LS8 is capable of driving 10mA to a load. The  
load regulation at the output of the LT1236LS8 is very  
good, with a change of less than 25ppm/mA when driving  
the load. However, the load current will cause a voltage  
drop in the connecting wire between the LT1236LS8 and  
the load. This IR drop is dependent on the resistance of  
the connecting wire and will appear as additional load  
regulation error. For example, 12 feet of #22 gauge wire or  
1 foot of 0.025 inch printed circuit board trace will create  
2mV loss at 10mA output current. This is equivalent to  
1LSB in a 10V, 12-bit system.  
TEMPERATURE SPAN (°C)  
1236ls8 AI01  
Trimming Output Voltage  
The LT1236LS8 has an output voltage trim pin, but the  
temperature drift of the nominal 4V open circuit voltage  
at pin 5 is about –1.7mV/°C. For the voltage trimming not  
to affect reference output temperature drift, the external  
trim voltage must track the voltage on the trim pin. Input  
impedance of the trim pin is about 100kΩ and attenua-  
tion to the output is 13:1. The technique shown below  
is suggested for trimming the output of the LT1236LS8  
while maintaining minimum shift in output temperature  
coefficient. The R1/R2 ratio is chosen to minimize interac-  
tion of trimming and temperature drift shifts, so the exact  
values shown should be used.  
Therearethreeapproachesthatwillreducethiseffect.First,  
limiting the distance between the LT1236LS8 and the load  
will reduce the trace length, and improve load regulation.  
Second, use wider traces for the connections between  
the LT1236LS8 and the load to reduce IR drop. Finally,  
1236ls8f  
7
LT1236LS8  
applicaTions inForMaTion  
Series Mode with Boost Transistor  
use a star-ground method, with the LT1236LS8 ground  
tied directly to the load, rather than through a ground  
plane or other shared ground trace. This last method will  
reduce drop in the ground trace between the LT1236LS8  
and the load. The ground wire in this case will carry only  
approximately 1mA, which is the ground current of the  
LT1236LS8, while the load return current will shunt to the  
system ground separate from the reference-to-load path.  
INPUT  
R1  
220Ω  
2N3906  
IN  
LT1236LS8  
OUT  
LOAD  
GND  
R2*  
The following circuits show proper hook-up to minimize  
errors due to ground loops and line losses. Losses in the  
output lead can be greatly reduced by adding a PNP boost  
transistor if load currents are 5mA or higher. R2 can be  
added to further reduce current in the output sense lead.  
GROUND  
RETURN  
*OPTIONAL—REDUCES CURRENT IN OUTPUT SENSE  
LEAD: R2 = 2.4k  
1236ls8 AI04  
Long-Term Drift  
Effects of Air Movement on Low Frequency Noise  
Long-term drift cannot be extrapolated from accelerated  
high temperature testing. This erroneous technique gives  
drift numbers that are wildly optimistic. The only way  
long-term drift can be determined is to measure it over  
the time interval of interest.  
The LT1236LS8 has very low noise because of the buried  
zener used in its design. In the 0.1Hz to 10Hz band, peak-  
to-peaknoiseisabout0.5ppmoftheDCoutput.Toachieve  
this low noise, however, care must be taken to shield the  
reference from ambient air turbulence. Air movement can  
createnoisebecauseofthermoelectricdifferencesbetween  
ICpackageleadsandprintedcircuitboardmaterialsand/or  
sockets. Powerdissipationinthereference, eventhoughit  
rarely exceeds 20mW, is enough to cause small tempera-  
ture gradients in the package leads. Variations in thermal  
resistance, caused by uneven air flow, create differential  
leadtemperatures,therebycausingthermoelectricvoltage  
noise at the output of the reference.  
The LT1236LS8 long-term drift data was collected on 80  
parts that were soldered into printed circuit boards similar  
to a real world application. The boards were then placed  
into a constant temperature oven with a T = 35°C, their  
A
outputs were scanned regularly and measured with an 8.5  
digit DVM. Typical long-term drift is illustrated in Figure 1.  
200  
NORMALIZED TO 10 HOURS  
DUE TO SYSTEM WARM-UP  
160  
120  
80  
Standard Series Mode  
40  
LT1236LS8  
KEEP THIS LINE RESISTANCE LOW  
0
INPUT  
IN  
OUT  
+
LOAD  
GND  
–40  
–80  
–120  
–160  
–200  
GROUND  
RETURN  
1236ls8 AI03  
0
500  
1000  
1500  
2000  
HOURS  
1236ls8 F01  
Figure 1. Long-Term Drift  
1236ls8f  
8
LT1236LS8  
applicaTions inForMaTion  
Hysteresis  
stresses on the die have changed position. This shift is  
similar, but more extreme than thermal hysteresis.  
Thermal hysteresis is a measure of change of output volt-  
age as a result of temperature cycling. Figure 2a and 2b  
illustrate the typical hysteresis based on data taken from  
theLT1236LS8. Aproprietarydesigntechniqueminimizes  
thermal hysteresis.  
Experimental results of IR reflow shift are shown below  
in Figure 4. These results show only shift due to reflow  
and not mechanical stress.  
300  
380s  
T
= 260°C  
P
IR Reflow Shift  
RAMP  
DOWN  
T
= 217°C  
L
225  
150  
75  
The mechanical stress of soldering a part to a board can  
cause the output voltage to shift. Moreover, the heat of  
an IR reflow or convection soldering oven can also cause  
the output voltage to shift. The materials that make up a  
semiconductor device and its package have different rates  
of expansion and contraction. After a part undergoes the  
extreme heat of a lead-free IR reflow profile, like the one  
shown in Figure 3, the output voltage shifts. After the  
device expands, due to the heat, and then contracts, the  
T
= 200°C  
S(MAX)  
t
P
T
= 190°C  
S
30s  
T = 150°C  
t
L
RAMP TO  
150°C  
130s  
40s  
120s  
4
0
0
2
6
8
10  
MINUTES  
1236ls8 F03  
22  
Figure 3. Lead-Free Reflow Profile  
25°C TO 0°C TO 25°C  
25°C TO 70°C TO 25°C  
20  
18  
16  
14  
12  
10  
8
10  
9
8
7
6
5
4
3
2
1
0
1× REFLOW  
3× REFLOW  
24Hr REST  
6
4
2
0
–50 –30 –10 10  
30  
50  
70  
90  
DISTRIBUTION (ppm)  
1236ls8 F02a  
–0.05 –0.04 –0.03 –0.02 –0.01  
REFLOW SHIFT (%)  
0
0.01  
Figure 2a. Hysteresis Plot 0°C to 70°C  
1236ls8 F04  
35  
Figure 4. Output Voltage Shift Due to IR Reflow  
25°C TO –40°C TO 25°C  
25°C TO 85°C TO 25°C  
30  
25  
20  
15  
10  
5
Humidity Sensitivity  
Plastic mold compounds absorb moisture. With changes  
in relative humidity, plastic packaging materials change  
the amount of pressure they apply to the die inside, which  
can cause slight changes in the output of a voltage refer-  
ence, usually on the order of 100ppm. The LS8 package is  
hermetic, so it is not affected by humidity, and is therefore  
more stable in environments where humidity may be a  
concern.However,PCBoardmaterialmayabsorbmoisture  
and apply mechanical stress to the LT1236LS8. Proper  
0
–120 –80 –40  
0
40  
80  
120  
DISTRIBUTION (ppm)  
1236ls8 F02b  
board materials and layout are essential.  
Figure 2b. Hysteresis Plot –40°C to 85°C  
1236ls8f  
9
LT1236LS8  
Typical applicaTions  
Boosted Output Current  
with Current Limit  
Boosted Output Current  
with No Current Limit  
+
+
V
≥ 9V  
V ≥ 10V  
D1*  
LED  
R1  
220Ω  
R1  
220Ω  
8.2Ω  
2N2905  
2N2905  
IN  
LT1236LS8  
OUT  
IN  
LT1236LS8  
OUT  
5V AT  
100mA  
5V AT  
100mA  
GND  
+
2µF  
SOLID  
TANT  
GND  
+
2µF  
SOLID  
TANT  
1236ls8 TA03  
*GLOWS IN CURRENT LIMIT,  
DO NOT OMIT  
1236ls8 TA04  
Handling Higher Load Currents  
10V  
30mA  
R1*  
169Ω  
IN  
LT1236LS8  
V
OUT  
OUT  
5V  
GND  
TYPICAL LOAD  
CURRENT = 30mA  
R
L
*SELECT R1 TO DELIVER TYPICAL LOAD CURRENT.  
LT1236 WILL THEN SOURCE OR SINK AS NECESSARY  
TO MAINTAIN PROPER OUTPUT. DO NOT REMOVE LOAD  
AS OUTPUT WILL BE DRIVEN UNREGULATED HIGH. LINE  
REGULATION IS DEGRADED IN THIS APPLICATION  
1236ls8 TA05  
1236ls8f  
10  
LT1236LS8  
Typical applicaTions  
Operating 5V Reference from 5V Supply  
5V LOGIC  
SUPPLY  
1N914  
CMOS LOGIC GATE**  
≥ 2kHz*  
LT1236LS8  
IN  
1N914  
+
≈8.5V  
5V  
f
OUT  
IN  
REFERENCE  
+
C2*  
5µF  
GND  
C1*  
5µF  
*FOR HIGHER FREQUENCIES C1 AND C2 MAY BE DECREASED  
**PARALLEL GATES FOR HIGHER REFERENCE CURRENT LOADING  
1236ls8 TA06  
2-Pole Lowpass Filtered Reference  
1µF  
MYLAR  
V
IN  
V
LT1236LS8  
IN  
LT1001  
REF  
OUT  
+
V
IN  
R1  
36k  
R2  
36k  
GND  
TOTAL NOISE  
0.5µF  
MYLAR  
≤2µV  
f = 10Hz  
RMS  
1Hz ≤ f ≤ 10kHz  
–V  
REF  
1236ls8 TA07  
1236ls8f  
11  
LT1236LS8  
Typical applicaTions  
High Precision, High Stability, Differential Measurement System  
8V TO 12V  
5V  
LT1236LS8  
4.7µF  
0.01µF  
10µF  
15  
V
CC  
BUSY  
R1  
5k  
14  
+
f
O
REF  
LTC2440  
13  
12  
11  
4
0.1µF  
SCK  
REF  
C1  
0.01µF  
R2  
SDO  
+
10Ω  
5
6
+
CS  
IN  
C2  
7
+
IN  
IN  
IN  
SDI  
1µF  
1
/
/
LTC2051HV  
LTC2051HV  
2
R4  
5k  
1, 8, 9, 16  
10  
EXT  
C4  
0.01µF  
1236ls8 TA08  
R5  
10Ω  
+
C5  
1µF  
1
2
C2, C5 TAIYO YUDEN JMK107BJ105MA  
1236ls8f  
12  
LT1236LS8  
Typical applicaTions  
Use Resistor Arrays to Provide Precise Matching in Excitation Amplifier  
15V  
5V  
3
2
+
LT1236LS8  
20Ω  
1/2  
LT1112  
1
+
Q1  
C3  
47µF  
C1  
0.1µF  
2N3904  
22Ω  
C1  
0.1µF  
RN1  
10k  
10V  
5V  
1
8
7
1
RN1  
10k  
V
CC  
6
350Ω BRIDGE  
TWO ELEMENTS  
VARYING  
LTC2411/  
LTC2411-1  
2
3
+
REF  
REF  
4
5
+
IN  
–5V  
IN  
4
5
RN1  
10k  
GND  
6
RN1  
10k  
3
6
15V  
C2  
0.1µF  
33Ω  
×2  
RN1 IS LT5400ACMS8E-1  
8
6
Q2, Q3  
2N3906  
×2  
20Ω  
1/2  
7
LT1112  
5
+
4
–15V  
1236ls8 TA09  
–15V  
1236ls8f  
13  
LT1236LS8  
Typical applicaTions  
10V Range Precision Measurement System  
+
REF  
2
6
5
V
IN1  
5V  
IN  
OUT  
LT1236LS8  
GND TRIM  
C15  
4.7k  
R20  
1k  
C13  
0.1µF  
C8  
0.1µF  
4
–2.5V  
2.5V  
5V  
–2.5V  
29  
21  
+
R1  
40k  
R3  
5k  
R4  
5k  
V
V
CC  
+
REF  
–2.5V  
30  
31  
6
35  
+
REF  
REF  
CS  
5V  
1
LTC2442  
SCK  
SD0  
6
36  
33  
3
4
R5  
8.87k  
CH0  
+
1
7
CH1  
SDI  
8
9
2
CH2  
BUSY  
5
34  
3
2
CH3  
F
O
28  
LTC2050HV  
–5V  
–2.5V  
COM  
ADCINB  
ADCINA  
OUTA  
–INA  
OUTB  
–INB  
EXT  
10  
11  
12  
13  
17  
18  
27  
26  
MUOUTA  
C14  
0.1µF  
MUXOUTB  
V
IN2  
R6  
30k  
R9  
10k  
R10  
7.5k  
C10  
0.1µF  
25  
19  
+INA  
+INB  
GND GND GND  
32  
V
4
5
24  
74HC4053  
–5V  
–2.5V  
12  
13  
2
14  
15  
4
C17  
0.1µF  
C9  
–2.5V  
2.5V  
X0  
X1  
Y0  
Y1  
Z0  
X
Y
Z
0.1µF  
R21  
5k  
1
5V  
5
SDO  
3
Z1  
R22  
1.8k  
6
MMBT3904  
INH  
11  
10  
9
A
B
C
V
SDI  
CS  
5V  
CC  
V
–2.5V  
EE  
GND  
R1, R3, R4 ARE CADDOCK T914  
SCK  
1236sl8 TA10  
1236ls8f  
14  
LT1236LS8  
package DescripTion  
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.  
LS8 Package  
8-Pin Leadless Chip Carrier (5mm × 5mm)  
(Reference LTC DWG # 05-08-1852 Rev Ø)  
8
2.50 0.15  
PACKAGE OUTLINE  
7
1
2
3
6
5
2.54 0.15  
1.50 0.15  
4
0.70 0.05  
5.00 SQ 0.15  
5.80 SQ 0.15  
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED  
5.00 SQ 0.15  
4.20 SQ 0.10  
8
1.45 0.10  
0.95 0.10  
R0.20 REF  
8
2.00 REF  
PIN 1  
1
1
2
7
6
7
6
TOP MARK  
(SEE NOTE 5)  
2
2.54 0.15  
4.20 0.10  
5
3
3
5
R0.20 REF  
1.00 TYP  
LS8 0609 REV Ø  
4
4
0.70 TYP  
0.10 TYP  
0.64 TYP  
NOTE:  
1. ALL DIMENSIONS ARE IN MILLIMETERS  
2. DRAWING NOT TO SCALE  
3. DIMENSIONS PACKAGE DO NOT INCLUDE PLATING BURRS  
PLATING BURRS, IF PRESENT, SHALL NOT EXCEED 0.30mm ON ANY SIDE  
4. PLATING—ELECTO NICKEL MIN 1.25UM, ELECTRO GOLD MIN 0.30UM  
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
1236ls8f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
15  
LT1236LS8  
Typical applicaTion  
Measure DC to Daylight Using the LTC2408 and LT1236LS8  
DC  
VOLTMETER  
INPUT  
R1  
GUARD RING  
900k  
5V  
0.1%, 1W, 1000 WVDC  
7
ELECTROMETER  
1mV TO 1000V  
3
2
R5  
5k, 1%  
+
INPUT  
R2  
4.7k  
6
(pH, PIEZO)  
LT1793  
0.1%  
0V TO 5V  
4
–60mV TO 4V  
–5V  
R3, 10k  
LT1236LS8  
OUT IN  
R4  
1k  
6
2
5V  
8V  
REF  
C1, 0.1µF  
+
+
5V  
MAX  
GND  
4
10µF  
100µF  
3-WIRE R-PACK  
60Hz  
R6  
10k, 0.1%  
R7  
5V  
10k, 0.1%  
AC  
INPUT  
5V  
7
7
4
3
V
2, 8  
V
CC  
1µF  
SERIAL DATA LINK  
1µF  
RT  
R9  
1k  
1%  
R10  
MUXOUT  
ADCIN  
REF  
5k  
IN914  
IN914  
2
1%  
9
CH0  
6
MICROWIRE AND  
SPI COMPATABLE  
10 CH1  
11 CH2  
12 CH3  
13 CH4  
14 CH5  
15 CH6  
17 CH7  
LTC1050  
23  
20  
CSADC  
R8  
100Ω, 5%  
3
+
CSMUX  
4
19, 25  
21  
24-BIT  
CLK  
8-CHANNEL  
MUX  
20mV TO 80mV  
MPU  
∆∑ ADC  
–5V  
D
IN  
R11  
24  
SDO  
24.9k, 0.1%  
V
REF  
5V  
LTC2408  
GND  
INTERNAL OSC  
60Hz–RF  
RF POWER  
26  
F
SELECTED FOR  
O
60Hz REJECTION  
<1mV  
J1  
J2  
100Ω  
1, 5, 6, 16, 18, 22, 27, 28  
Pt RTD  
50Ω  
(3-WIRE)  
FORCE SENSE  
2.7V AT 0°C  
0.9V AT 40°C  
1236sl8 TA11  
–2.2mV to 16mV  
0V to 4V  
R12  
24.9k, 0.1%  
V
REF  
5V  
J3  
50Ω LOAD  
BONDED TO  
RTD ON  
INSULATED  
MOUNTING  
LOCAL  
TEMP  
THERMISTOR  
10k NTC  
5V  
DAYLIGHT  
HAMAMATSU  
PHOTODIODE  
S1336-5BK  
OMEGA  
0S36-01  
INFRARED  
R13  
5k  
0.1%  
INFRARED  
THERMOCOUPLE  
relaTeD parTs  
PART NUMBER DESCRIPTION  
COMMENTS  
LT1021  
Precision References for Series or Shunt Operation in  
Hermetic TO-5, SOP-8, DIP-8 Package  
0.05% Max Initial Error, 5ppm/°C Max Drift, 1ppm Peak-to-Peak Noise  
(0.1Hz to 10Hz), –55°C to 125°C (TO-5)  
LT1236S8/  
LT1236N8  
Low Drift, Low Noise, 5V and 10V Voltage Reference in  
SO8, and DIP8 Package  
0.05% Max Initial Error, 5ppm/°C Max Drift, 1ppm Peak-to-Peak Noise  
(0.1Hz to 10Hz), –40°C to 85°C  
LTC6652LS8  
High Precision, Buffered Voltage Reference Family in  
5mm × 5mm Hermetic QFN Package  
0.05% Max Initial Error, 5ppm/°C Max Drift, Shutdown Current <2µA,  
–40°C to 125°C Operation  
LT6654LS8  
Precision, Low Noise, High Output Drive Voltage Reference 1.6ppm Peak-to-Peak Noise (0.1Hz to 10Hz, Sink/Source 10mA, 5ppm/°C  
Family in 5mm × 5mm Hermetic QFN Package  
Max Drift, –40°C to 125°C Operation  
1236ls8f  
LT 0812 • PRINTED IN USA  
16 LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
LINEAR TECHNOLOGY CORPORATION 2012  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

相关型号:

LT1236BC

Precision Reference
Linear

LT1236BCN8-10

Precision Reference
Linear

LT1236BCN8-5

Precision Reference
Linear

LT1236BCS8-10

Precision Reference
Linear

LT1236BCS8-10#PBF

LT1236 - Precision Reference; Package: SO; Pins: 8; Temperature Range: 0&deg;C to 70&deg;C
Linear

LT1236BCS8-10#TR

LT1236 - Precision Reference; Package: SO; Pins: 8; Temperature Range: 0&deg;C to 70&deg;C
Linear

LT1236BCS8-5

Precision Reference
Linear

LT1236BCS8-5#PBF

LT1236 - Precision Reference; Package: SO; Pins: 8; Temperature Range: 0&deg;C to 70&deg;C
Linear

LT1236BCS8-5#TR

LT1236 - Precision Reference; Package: SO; Pins: 8; Temperature Range: 0&deg;C to 70&deg;C
Linear

LT1236BI

Precision Reference
Linear

LT1236BILS8-5

Precision, Low Noise, Low Profile Hermetic Voltage Reference
Linear

LT1236BIN8-10

Precision Reference
Linear