LT1330CG [Linear]
5V RS232 Transceiver with 3V Logic Interface and One Receiver Active in Shutdown; 5V RS232收发器与3V逻辑接口和一个接收器活跃在关机型号: | LT1330CG |
厂家: | Linear |
描述: | 5V RS232 Transceiver with 3V Logic Interface and One Receiver Active in Shutdown |
文件: | 总8页 (文件大小:251K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LT1330
5V RS232 Transceiver with
3V Logic Interface and One
Receiver Active in Shutdown
U
DESCRIPTIO
EATURE
S
F
The LT®1330 is a three driver, five receiver RS232 trans-
ceiver with low supply current. Designed to interface with
new 3V logic, the LT1330 operates with both a 5V power
supply and a 3V logic power supply. The chip may be shut
down to micropower operation with one receiver remain-
ing active to monitor RS232 inputs such as ring detect
from a modem.
■
■
■
■
3V Logic Interface
ESD Protection over ±10kV
Uses Small Capacitors: 0.1µF, 0.2µF, 1.0µF
One Low Power Receiver Remains Active While in
Shutdown
■
■
■
■
■
■
■
Pin Compatible with LT1137A and LT1237
120kBaud Operation for RL = 3k, CL = 2500pF
250kBaud Operation for RL = 3k, CL = 1000pF
CMOS Comparable Low Power: 30mW
Easy PC Layout—Flowthrough Architecture
Rugged Bipolar Design
Outputs Assume a High Impedance State When Off
or Powered Down
Absolutely No Latchup
The LT1330 is fully compliant with all EIA RS232 specifi-
cations. Additionally, the RS232 line input and output pins
areresilienttomultiple±10kVESDstrikes. Thiseliminates
the need for costly TransZorbs® on line pins for the RS232
part.
■
■
■
The LT1330 operates to 120kbaud even driving high
capacitive loads. During shutdown, driver and receiver
outputs are at a high impedance state allowing devices to
be paralleled.
60µA Supply Current in Shutdown
Available in SO and SSOP Packages
O U
, LTC and LT are registered trademarks of Linear Technology Corporation.
TransZorb is a registered trademark of General Instruments, GSI
PPLICATI
S
A
■
Notebook Computers
Palmtop Computers
■
U
O
TYPICAL APPLICATI
Output Waveforms
–
+
V
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
LT1330
RECEIVER
1.0µF
5V V
0.1µF
OUTPUT
CC
2 × 0.1µF
3
VL = 3V
CL = 50pF
2 × 0.1µF
4
DRIVER 1 IN
RX1 OUT
5
DRIVER
OUTPUT
DRIVER 1 OUT
RX1 IN
6
DRIVER 2 IN
RX2 OUT
RL = 3k
L = 2500pF
7
C
DRIVER 2 OUT
RX2 IN
TO LOGIC
8
R
RX3 OUT
TO
LINE
9
RX3 IN
RX4 OUT
10
11
12
13
14
RX4 IN
DRIVER 3 IN
RX5 OUT (LOW-Q)
INPUT
DRIVER 3 OUT
RING DETECT IN
GND
DRIVER
DISABLE
RX5 IN (LOW-Q)
ON/OFF
µCONTROLLER OR
µPROCESSOR
1330 TA02
SHUTDOWN
CONTROL OUT
3V V
L
1330 TA01
1
LT1330
W W W
U
/O
ABSOLUTE AXI U RATI GS
(Note 1)
PACKAGE RDER I FOR ATIO
ORDER PART
TOP VIEW
Supply Voltage (VCC) ................................................ 6V
Supply Voltage (VL) .................................................. 6V
V+ ........................................................................ 13.2V
V– ...................................................................... –13.2V
Input Voltage
NUMBER
+
–
V
1
2
3
4
5
6
7
8
9
28
V
–
+
5V V
27 C2
26 C2
CC
+
LT1330CG
C1
–
C1
25 DR1 IN
24 RX1 OUT
23 DR2 IN
22 RX2 OUT
21 RX3 OUT
20 RX4 OUT
19 DR3 IN
LT1330CJW
LT1330CNW
LT1330CSW
LT1330IJW
DR1 OUT
RX1 IN
Driver ........................................................... V– to V+
Receiver ................................................ –30V to 30V
Output Voltage
DR2 OUT
RX2 IN
RX3 IN
Driver .................................................... – 30V to 30V
Receiver ...................................... – 0.3V to VL + 0.3V
Short-Circuit Duration
RX4 IN 10
RX5 OUT
(LOW-Q)
GND
DRIVER
DISABLE
NC
DR3 OUT 11
RX5 IN
(LOW-Q)
18
12
17
16
15
V+ ................................................................... 30 sec
V– ................................................................... 30 sec
Driver Output.............................................. Indefinite
Receiver Output.......................................... Indefinite
Operating Temperature Range
13
14
ON/OFF
3V V
L
G PACKAGE
JW PACKAGE
28-LEAD PLASTIC SSOP
28-LEAD (WIDE) CERDIP
NW PACKAGE
SW PACKAGE
28-LEAD (WIDE) PDIP 28-LEAD (WIDE) PLASTIC SO
LT1330I ............................................. – 40°C to 85°C
LT1330C................................................. 0°C to 70°C
Storage Temperature Range ................ – 65°C to 150°C
Lead Temperature (Soldering, 10 sec)................. 300°C
TJMAX = 150°C, θJA = 96°C/ W (G)
JMAX = 150°C, θJA = 62°C/ W (JW)
TJMAX = 150°C, θJA = 56°C/ W (NW)
JMAX = 150°C, θJA = 85°C/ W (SW)
T
T
Consult factory for Military grade parts.
ELECTRICAL CHARACTERISTICS (Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Power Supply Generator
+
V Output
7.9
–7
V
V
–
V Output
Supply Current (V
)
T = 25°C (Note 3)
6
6
0.1
0.06
3.00
12
14
1
mA
mA
mA
mA
mA
CC
A
●
●
Supply Current (V )
Supply Current When OFF (V
(Note 4)
Shutdown (Note 5)
Driver Disable
L
)
0.15
CC
Supply Rise Time
Shutdown to Turn-On
C1 = C2 = 0.2µF,
C = 1.0µF, C = 0.1µF
0.2
ms
+
–
ON/OFF Pin Thresholds
Input Low Level (Device Shutdown)
Input High Level (Device Enabled)
●
●
0.8
1.4
1.4
V
V
µA
V
V
2.4
80
ON/OFF Pin Current
DRIVER DISABLE Pin Thresholds
0V ≤ V
≤ 5V
●
–15
0.8
ON/OFF
Input Low Level (Drivers Enabled)
Input High Level (Drivers Disabled)
●
●
1.4
1.4
2.4
DRIVER DISABLE Pin Current
Oscillator Frequency
0V ≤ V
≤ 5V
●
–10
500
µA
kHz
DRIVER DISABLE
Driver Outputs Loaded R = 3k
130
L
2
LT1330
ELECTRICAL CHARACTERISTICS
(Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Any Driver
Output Voltage Swing
Load = 3k to GND
Input Low Level (V
Positive
Negative
●
●
5.0
7.5
– 6.3
1.4
1.4
V
V
V
V
–5.0
0.8
Logic Input Voltage Level
= High)
= Low)
●
●
OUT
Input High Level (V
2.0
OUT
Logic Input Current
0.8V ≤ V ≤ 2V
●
5
17
10
20
µA
mA
µA
kBaud
kBaud
IN
Output Short-Circuit Current
Output Leakage Current
Data Rate (Note 8)
V
= 0V
±9
OUT
Shutdown V
= ±30V (Note 5)
●
100
OUT
R = 3k, C = 2500pF
120
250
L
L
R = 3k, C = 1000pF
L
L
Slew Rate
R = 3k, C = 51pF
15
15
30
V/µs
V/µs
L
L
R = 3k, C = 2500pF
4
L
L
Propagation Delay
Output Transition t High to Low (Note 6)
0.6
0.5
1.3
1.3
µs
µs
HL
Output Transition t Low to High
LH
Any Receiver
Input Voltage Thresholds
Input Low Threshold (V
Input High Threshold (V
= High)
= Low)
0.8
1.3
1.7
0.4
5
V
V
V
kΩ
µA
OUT
2.4
1.0
7
OUT
Hysteresis
●
●
0.1
3
Input Resistance
Output Leakage Current
Receivers 1, 2, 3, 4
Output Voltage
V = ±10V
IN
Shutdown (Note 5) 0 ≤ V
≤ V
1
10
OUT
CC
Output Low, I
Output High, I
= –1.6mA
= 160µA (V = 3V)
●
●
0.2
2.9
0.4
V
V
OUT
2.7
OUT
L
Output Short-Circuit Current
Propagation Delay
Sinking Current, V
Sourcing Current, V
Output Transition t High to Low (Note 7)
Output Transition t Low to High
= V
–10
10
–20
20
250
350
mA
mA
ns
ns
OUT
CC
= 0V
OUT
600
600
HL
LH
Receiver 5 (LOW Q-Current RX)
Output Voltage
Output Low, I
Output High, I
= – 500µA
= 160µA (V = 3V)
●
●
0.2
2.9
0.4
V
V
OUT
2.7
OUT
L
Output Short-Circuit Current
Propagation Delay
Sinking Current, V
Sourcing Current, V
Output Transition t High to Low (Note 7)
Output Transition t Low to High
= V
–2
2
–4
4
1
1
mA
mA
µs
µs
OUT
CC
= 0V
OUT
3
3
HL
LH
The
●
denotes specifications which apply over the operating temperature
Note 6: For driver delay measurements, R = 3k and C = 51pF. Trigger
L L
range (0°C ≤ T ≤ 70°C for commercial grade, and –40°C ≤ T ≤ 85°C for
industrial grade).
points are set between the driver’s input logic threshold and the output
transition to the zero crossing (t = 1.4V to 0V and t = 1.4V to 0V).
A
A
HL
LH
Note 1: Absolute Maximum Ratings are those values beyond which the life
of the device may be impaired.
Note 7: For receiver delay measurements, C = 51pF. Trigger points are
set between the receiver’s input logic threshold and the output transition
L
to standard TTL/CMOS logic threshold (t = 1.3V to 2.4V and t = 1.7V
to 0.8V).
Note 8: Data rate operation guaranteed by slew rate, short-circuit current
and propagation delay tests.
HL
LH
Note 2: Testing done at V = 5V and V
= 3V.
ON/OFF
CC
Note 3: Supply current is measured as the average over several charge
+
–
pump burst cycles. C = 1.0µF, C = 0.1µF, C1 = C2 = 0.2µF. All outputs
are open, with all driver inputs tied high.
Note 4: V supply current is measured with all receiver outputs low.
L
Note 5: Measurements in shutdown are performed with V
≤ 0.1V.
ON/OFF
Supply current measurements using driver disable are performed with
≥ 3V.
V
DRIVER DISABLE
3
LT1330
TYPICAL PERFOR A CE CHARACTERISTICS
U W
Receiver Input Thresholds
Driver Output Voltage
Supply Current vs Data Rate
10
8
3.00
2.75
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
80
70
60
V
= 5V
CC
R
= 3k
OUTPUT HIGH
L
3
R
C
DRIVERS ACTIVE
= 3k
L
V
CC
= 4.5V
= 2500pF
L
6
4
50
40
2
INPUT HIGH
INPUT LOW
0
–2
–4
–6
–8
–10
30
20
10
0
OUTPUT LOW
V
= 4.5V
CC
V
= 5V
CC
–55
0
25
50
75 100 125
–55
0
25
50
75 100 125
–25
–25
0
25
50
75
125 150
100
TEMPERATURE (°C)
TEMPERATURE (°C)
DATA RATE (kBAUD)
1330 G01
1330 G02
1330 G03
VCC Supply Current in
Driver Disable
VCC Supply Current in Shutdown
DRIVER DISABLE Threshold
5
4
3
2
1
0
150
125
100
75
3.0
2.5
2.0
1.5
50
25
0
1.0
0.5
0
–55
0
25
50
75 100 125
–25
50
TEMPERATURE (°C)
100 125
50
TEMPERATURE (°C)
100 125
–55 –25
0
25
75
–55 –25
0
25
75
TEMPERATURE (°C)
1330 G05
1330 G04
1330 G06
VCC Supply Current
ON/OFF Thresholds
Driver Leakage in Shutdown
100
10
1
3.0
2.5
2.0
1.5
40
35
30
3
DRIVERS LOADED
= 3k
R
L
25
20
ON THRESHOLD
1
DRIVER LOADED
= 3k
R
L
V
= 30V
OUT
15
10
5
1.0
0.5
0
V
= –30V
OUT
OFF THRESHOLD
NO LOAD
0
0.1
–55
0
25
50
75 100 125
50
125
25
75 100
50
TEMPERATURE (°C)
100 125
–25
–55
–25
0
–55 –25
0
25
75
TEMPERATURE (°C)
TEMPERATURE (°C)
1330 G08
1330 G09
1330 G07
4
LT1330
U W
TYPICAL PERFOR A CE CHARACTERISTICS
Driver Short-Circuit Current
Receiver Short-Circuit Current
30
25
20
15
40
35
30
25
20
15
10
5
RX1 TO RX4
+
I
SC
+
I
SC
RX1 TO RX4
–
I
SC
–
I
SC
+
–
RX5 I
SC
10
5
RX5 I
SC
0
0
–55
0
25
50
75 100 125
–25
50
TEMPERATURE (°C)
100 125
–55 –25
0
25
75
TEMPERATURE (°C)
1330 G11
1330 G10
Driver Output Waveforms
Receiver Output Waveforms
RX5 OUTPUT
L = 50pF
DRIVER OUTPUT
C
R
L = 3k
CL = 2500pF
RX1 TO RX4
OUTPUT
DRIVER OUTPUT
RL = 3k
C
L = 50pF
INPUT
INPUT
1330 G12
1330 G13
VL = 3V
U
U
U
PI FU CTIO S
VCC: 5V Input Supply Pin. This pin should be decoupled
with a 0.1µF ceramic capacitor close to the package pin.
Insufficient supply bypassing can result in low output
drive levels and erratic charge pump operation.
60µA of supply current while in shutdown. A logic high
fully enables the transceiver.
DRIVER DISABLE: This pin provides an alternate control
for the charge pump and RS232 drivers. A logic high on
this pin shuts down the charge pump and places all driver
outputsinahighimpedancestate.Allfivereceiversremain
active under these conditions. Floating the driver disable
pin or driving it to a logic low level fully enables the
transceiver. A logic low on the ON/OFF pin supersedes the
state of the DRIVER DISABLE pin. Supply current drops to
3mA when in driver disable mode.
VL: 3V Logic Supply Pin for all RS232 Receivers. Like VCC,
the VL input should be decoupled with a 0.1µF ceramic
capacitor. This pin may also be connected to 5V.
GND: Ground Pin.
ON/OFF: TTL/CMOS Compatible Operating Mode Control.
A logic low puts the device in the low power shutdown
mode.Allthreedriversandfourreceivers(RX1,RX2,RX3,
and RX4) assume a high impedance output state in shut-
down. Only receiver RX5 remains active while the trans-
ceiver is in shutdown. The transceiver consumes only
V+: Positive Supply Output. V+ ≈ 2VCC – 1.5V. This pin
requires an external charge storage capacitor, C ≥ 1.0µF,
tied to ground or 5V. Larger value capacitors may be used
5
LT1330
U
U
U
PI FU CTIO S
to reduce supply ripple. The ratio of the capacitors on V+
limited. Short circuits on one output can load the power
supply generator and may disrupt the signal levels of the
other outputs. The driver outputs are protected against
ESD to ±10kV for human body model discharges.
and V– should be greater than 5 to 1.
V–:NegativeSupplyOutput. V– ≈ –(2VCC –2.5V).Thispin
requires an external charge storage capacitor, C ≥ 0.1µF.
See the Applications Information section for guidance in
choosing filter capacitors for V+ and V –.
C1+, C1–, C2+, C2–: Commutating Capacitor Inputs re-
quire two external capacitors, C ≥ 0.2µF: one from C1+ to
C1–, and another from C2+ to C2–. The capacitor’s effec-
tive series resistance should be less than 2Ω. For C ≥ 1µF,
low ESR tantalum capacitors work well, although ceramic
capacitorsmaybeusedwithaminimalreductionincharge
pump compliance.
RX IN: Receiver Inputs. These pins accept RS232 level
signals (±30V) into a protected 5k terminating resistor.
ThereceiverinputsareprotectedagainstESDto±10kVfor
human body model discharges. Each receiver provides
0.4V of hysteresis for noise immunity. Open receiver
inputs assume a logic low state.
RX OUT: Receiver Outputs with TTL/CMOS Voltage Lev-
els. Outputs are in a high impedance state when in shut-
down mode to allow data line sharing. Outputs, including
LOW-QRXOUT,arefullyshort-circuitprotectedtoground
or VCC with the power on, off, or in shutdown mode.
DRIVER IN: RS232 Driver Input Pins. These inputs are
TTL/CMOS compatible. Unused inputs should be con-
nected to VCC.
LOW Q-CURRENT RX IN: Low Power Receiver Input. This
special receiver remains active when the part is in shut-
down mode, consuming typically 60µA. This receiver has
the same 5k input impedance and ±10kV ESD protection
characteristics as the other receivers.
DRIVER OUT: Driver Outputs at RS232 Voltage Levels.
DriveroutputswingmeetsRS232levelsforloadsupto3k.
Slew rates are controlled for lightly loaded lines. Output
current capability is sufficient for load conditions up to
2500pF. Outputs are in a high impedance state when in
shutdown mode, VCC = 0V, or when the DRIVER DISABLE
pin is active. Outputs are fully short-circuit protected from
V– + 30V to V+ – 30V. Applying higher voltages will not
damage the device if the overdrive is moderately current
LOW Q-CURRENT RX OUT: Low Power Receiver Output.
This pin produces the same TTL/CMOS output voltage
levels as receivers RX1, RX2, RX3, and RX4 with slightly
decreased speed and short-circuit current. Data rates to
120kbaud are supported by this receiver.
U
ESD PROTECTIO
ESD Test Circuit
–
+
V
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
The RS232 line inputs of the LT1330 have on-chip protec-
tion from ESD transients up to ±10kV. The protection
structures act to divert the static discharge safely to
systemground. InorderfortheESDprotectiontofunction
effectively, the power supply and ground pins of the
LT1330 must be connected to ground through low imped-
ances.Thepowersupplydecouplingcapacitorsandcharge
pump storage capacitors provide this low impedance in
normalapplicationofthecircuit.Theonlyconstraintisthat
low ESR capacitors must be used for bypassing and
charge storage. ESD testing must be done with pins VCC,
VL, V+, V–, and GND shorted to ground or connected with
low ESR capacitors.
LT1330
5V V
CC
0.1µF
0.2µF
1µF
0.1µF
0.2µF
3
4
DRIVER 1 IN
RX1 OUT
5
DRIVER 1 OUT
RX1 IN
6
DRIVER 2 IN
RX2 OUT
7
DRIVER 2 OUT
RX2 IN
8
RS232
RX3 OUT
LINE PINS
PROTECTED
TO ±10kV
9
RX3 IN
RX4 OUT
10
11
12
13
14
RX4 IN
DRIVER 3 IN
RX5 OUT (LOW-Q)
GND
DRIVER 3 OUT
RX5 IN (LOW-Q)
ON/OFF
DRIVER DISABLE
3V V
L
1330 TC01
0.1µF
6
LT1330
O U
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PPLICATI
S I FOR ATIO
A
Do not attempt to reduce V– ripple when the charge pump
is in discontinuous Burst Mode operation. The ripple in
this mode is determined by internal comparator thresh-
olds. Larger storage capacitor values increase the burst
period, and do not reduce ripple amplitude.
Storage Capacitor Selection
The V+ and V– storage capacitors must be chosen care-
fully to insure low ripple and stable operation. The LT1330
charge pump operates in a power efficient Burst ModeTM
operation. When storage capacitor voltage drops below a
preset threshold, the oscillator is gated on until V+ and V–
are boosted up to levels exceeding a second threshold.
The oscillator then turns off, and current is supplied from
the V+ and V– storage capacitors.
The V– potential is monitored to control charge pump
operation. It is therefore important to insure lower V+
ripple than V– ripple, or erratic operation of the charge
pump will result. Proper operation is insured in most
applications by choosing the V+ filter capacitor to be at
least 5 times the V– filter capacitor value. If V+ is more
heavily loaded than V–, a larger ratio may be needed.
Power Saving Operational Modes
The LT1330 has both shutdown and driver disable operat-
ing modes. These operating modes can optimize power
consumption based upon applications needs.
The On/Off shutdown control turns off all circuitry except
for Low-Q RX5. When RX5 detects a signal, this informa-
tion can be used to wake up the system for full operation.
Ifmorethanonelinemustbemonitored, thedriverdisable
mode provides a power efficient operating option. The
driver disable mode turns off the charge pump and RS232
drivers, but keeps all five receivers active. Power con-
sumption in driver disable mode is 3mA from VCC.
The V– filter capacitor should be selected to obtain low
ripple when the drivers are loaded, forcing the charge
pump into continuous mode. A minimum value 0.1µF is
suggested.
Burst Mode is a trademark of Linear Technology Corporation
U
Dimensions in inches (millimeters) unless otherwise noted.
PACKAGE DESCRIPTIO
G Package
28-Lead Plastic SSOP (0.209)
(LTC DWG # 05-08-1640)
0.397 – 0.407*
(10.07 – 10.33)
0.205 – 0.212**
(5.20 – 5.38)
0.068 – 0.078
(1.73 – 1.99)
2827262524232221201918 1615
17
0° – 8°
0.301 – 0.311
(7.65 – 7.90)
0.0256
(0.65)
BSC
0.022 – 0.037
(0.55 – 0.95)
0.005 – 0.009
(0.13 – 0.22)
0.010 – 0.015
(0.25 – 0.38)
0.002 – 0.008
(0.05 – 0.21)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
G28 SSOP 0694
5
7
1
2
3
4
6
8 9 101112 13 14
**DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
JW Package
28-Lead CERDIP (Wide 0.600, Hermetic)
(LTC DWG # 05-08-1120)
1.490
(37.85)
MAX
0.225
(5.715)
MAX
0.600 TYP
(15.240 TYP)
24
21
27
22
20 19
17
25
23
18
16 15
28
26
0.015 – 0.075
0.025
(0.381 – 1.904)
(0.635)
RAD TYP
0° – 15°
0.008 – 0.018
(0.203 – 0.457)
0.510 – 0.620
(12.95 – 15.75)
MAX
+0.025
0.685
17.40
0.045 – 0.068
(1.143 – 1.727)
0.100 ± 0.010
(2.540 ± 0.254)
–0.060
0.125
(3.175)
MIN
+0.635
–1.524
(
)
1
2
3
9
10 11
4
6
7
8
5
12 13 14
J28 1197
0.005
(0.127)
MIN
0.014 – 0.026
(0.360 – 0.660)
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP
OR TIN PLATE LEADS
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
7
LT1330
U
TYPICAL APPLICATION
Typical Mouse Driving Application
–
+
V
1
2
28
27
26
V
LT1330
1.0µF
2 × 0.1µF
5V V
CC
0.1µF
2 × 0.1µF
MOUSE
3
4
25 DRIVER 1 IN
24 RX1 OUT
23 DRIVER 2 IN
22 RX2 OUT
21 RX3 OUT
20 RX4 OUT
19 DRIVER 3 IN
18 RX5 OUT (LOW-Q)
17 GND
LOGIC “0”
LOGIC “0”
+
V
5
DRIVER 1 OUT
RX1 IN
LOGIC
6
DCD
DSR
RX
(1)
7
DRIVER 2 OUT
RX2 IN
8
MOUSE DATA
LOGIC “1”
9
RTS
TX
RX3 IN
OPTICS
10
11
12
13
14
RX4 IN
–
CTS
DTR
RI
DRIVER 3 OUT
V
RX5 IN (LOW-Q)
ON/OFF
16 DRIVER DISABLE
15
(9)
(5)
3V V
L
DB9
1330 TA03
U
Dimensions in inches (millimeters) unless otherwise noted.
PACKAGE DESCRIPTIO
NW Package
28-Lead PDIP (Wide 0.600)
(LTC DWG # 05-08-1520)
0.070
(1.778)
TYP
1.455*
(36.957)
MAX
0.045 – 0.065
(1.143 – 1.651)
0.150 ± 0.005
(3.810 ± 0.127)
0.600 – 0.625
(15.240 – 15.875)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
0.015
(0.381)
MIN
0.009 – 0.015
(0.229 – 0.381)
0.505 – 0.560*
(12.827 – 14.224)
+0.035
–0.015
0.625
0.125
(3.175)
MIN
0.035 – 0.080
(0.889 – 2.032)
0.018 ± 0.003
(0.457 ± 0.076)
+0.889
15.87
1
2
3
5
7
9
4
6
8
10 11 12 13 14
(
)
–0.381
0.100 ± 0.010
(2.540 ± 0.254)
N28 1197
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
SW Package
28-Lead Plastic Small Outline (Wide 0.300)
(LTC DWG # 05-08-1620)
0.697 – 0.712*
(17.70 – 18.08)
0.291 – 0.299**
(7.391 – 7.595)
0.037 – 0.045
(0.940 – 1.143)
0.093 – 0.104
(2.362 – 2.642)
0.010 – 0.029
(0.254 – 0.737)
28 27 26 25 24 23 22 21 20 19 18
16 15
17
× 45°
0° – 8° TYP
0.394 – 0.419
(10.007 – 10.643)
0.050
NOTE 1
(1.270)
0.009 – 0.013
TYP 0.014 – 0.019
0.004 – 0.012
(0.102 – 0.305)
(0.229 – 0.330)
NOTE 1
0.016 – 0.050
(0.406 – 1.270)
(0.356 – 0.482)
TYP
NOTE:
2
3
5
7
8
9 10 11 12 13 14
1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
1
4
6
S28 (WIDE) 0996
DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
*
**
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LT1137A
LT1237
LT1780/LT1781
5V RS232 Transceiver
RS232 Transceiver
2 Driver/2 Receiver RS232 Transceivers
IEC-1000-4-2 ESD Compliant
1 Receiver Active in Shutdown
IEC-1000-4-2 ESD Compliant
1330fa LT/TP 1098 2K REV A • PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 1992
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
8
●
●
(408)432-1900 FAX:(408)434-0507 www.linear-tech.com
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