LT1766EGN [Linear]

5.5V to 60V 1.5A, 200kHz Step-Down Switching Regulator; 5.5V至60V 1.5A , 200kHz的降压型开关稳压器
LT1766EGN
型号: LT1766EGN
厂家: Linear    Linear
描述:

5.5V to 60V 1.5A, 200kHz Step-Down Switching Regulator
5.5V至60V 1.5A , 200kHz的降压型开关稳压器

稳压器 开关
文件: 总29页 (文件大小:311K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LT1766/LT1766-5  
5.5V to 60V 1.5A, 200kHz  
Step-Down Switching Regulator  
U
FEATURES  
DESCRIPTIO  
Wide Input Range: 5.5V to 60V  
The LT®1766/LT1766-5 are 200kHz monolithic buck  
switching regulators that accept input voltages up to 60V.  
A high efficiency 1.5A, 0.2switch is included on the die  
alongwithallthenecessaryoscillator,controlandlogiccir-  
cuitry. A current mode control architecture delivers fast  
transient response and excellent loop stability.  
1.5A Peak Switch Current  
Constant 200kHz Switching Frequency  
Saturating Switch Design: 0.2Ω  
Peak Switch Current Rating Maintained Over  
Full Duty Cycle Range  
Low Effective Supply Current: 2.5mA  
Special design techniques and a new high voltage process  
achieve high efficiency over a wide input range. Efficiency  
ismaintainedoverawideoutputcurrentrangebyusingthe  
output to bias the circuitry and by utilizing a supply boost  
capacitortosaturatethepowerswitch.Patentedcircuitry*  
maintainspeakswitchcurrentoverthefulldutycyclerange.  
A shutdown pin reduces supply current to 25µA and the  
device can be externally synchronized from 228kHz to  
700kHz with logic level inputs.  
Low Shutdown Current: 25µA  
1.2V Feedback Reference Voltage (LT1766)  
5V Fixed Output (LT1766-5)  
Easily Synchronizable  
Cycle-by-Cycle Current Limiting  
Small 16-Pin SSOP and Thermally Enhanced  
TSSOP Packages  
U
APPLICATIO S  
The LT1766/LT1766-5 are available in a 16-pin fused-lead  
SSOPpackageoraTSSOPpackagewithexposedbackside  
for improved thermal performance.  
High Voltage, Industrial and Automotive  
Portable Computers  
Battery-Powered Systems  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
Battery Chargers  
*Patent # 6, 498, 466  
Distributed Power Systems  
U
TYPICAL APPLICATIO  
5V Buck Converter  
1N4148W  
6
0.33µF  
BOOST  
47µH  
V
V
IN  
Efficiency vs Load Current  
OUT  
4
2
5.5V*  
V
SW  
5V  
IN  
2.2µF†  
100V  
100  
TO 60V  
1A  
10MQ060N  
V
= 5V  
LT1766  
OUT  
L = 47µH  
V
V
= 12V  
= 42V  
+
CERAMIC  
100µF 10V  
SOLID  
TANTALUM  
IN  
IN  
15  
14  
10  
12  
90  
80  
70  
60  
50  
SHDN  
BIAS  
FB  
OFF ON  
15.4k  
4.99k  
SYNC  
GND  
V
C
1, 8, 9, 16  
11  
220pF  
2.2k  
0.022µF  
0
0.25  
0.50  
0.75  
1.00  
1.25  
1766 TA01  
LOAD CURRENT (A)  
1766 TA02  
*FOR INPUT VOLTAGES BELOW 7.5V, SOME RESTRICTIONS MAY APPLY  
TDK C4532X7R2A225K  
1766fa  
1
LT1766/LT1766-5  
W W U W  
ABSOLUTE AXI U RATI GS  
(Note 1)  
Input Voltage (VIN) ................................................. 60V  
BOOST Pin Above SW ............................................ 35V  
BOOST Pin Voltage ................................................. 68V  
SYNC, SENSE Voltage (LT1766-5) ........................... 7V  
SHDN Voltage ........................................................... 6V  
BIAS Pin Voltage .................................................... 30V  
FB Pin Voltage/Current (LT1766)................... 3.5V/2mA  
Operating Junction Temperature Range  
LT1766EFE/LT1766EFE-5/LT1766EGN/  
LT1766EGN-5 (Note 8,10) ................. 40°C to 125°C  
LT1766IFE/LT1766IFE-5/  
LT1766IGN/LT1766IGN-5 (Note 8,10) 40°C to 125°C  
Storage Temperature Range ................ 65°C to 150°C  
Lead Temperature (Soldering, 10 sec)................. 300°C  
U W  
U
PACKAGE/ORDER I FOR ATIO  
TOP VIEW  
TOP VIEW  
ORDER PART  
NUMBER  
ORDER PART  
GND  
SW  
NC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
GND  
GND  
SW  
NC  
1
2
3
4
5
6
7
8
16 GND  
NUMBER  
SHDN  
SYNC  
NC  
15  
14  
13  
12  
11  
10  
9
SHDN  
SYNC  
NC  
LT1766EFE  
LT1766IFE  
LT1766EFE-5  
LT1766IFE-5  
LT1766EGN  
LT1766IGN  
LT1766EGN-5  
LT1766IGN-5  
V
IN  
V
IN  
17  
NC  
BOOST  
NC  
FB/SENSE  
NC  
BOOST  
NC  
FB/SENSE  
V
C
V
C
BIAS  
GND  
BIAS  
GND  
GN PART MARKING  
GND  
GND  
1766  
1766I  
17665  
1766I5  
FE PACKAGE  
GN PACKAGE  
16-LEAD PLASTIC SSOP  
16-LEAD PLASTIC TSSOP  
TJMAX = 125°C, θJA = 45°C/W, θJC (PAD) = 10°C/W  
TJMAX = 125°C, θJA = 85°C/W, θJC (PIN 8) = 25°C/W  
EXPOSED PAD (PIN 17) IS GND.  
MUST BE SOLDERED TO PCB  
FOUR CORNER PINS SOLDERED  
TO GROUND PLANE  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C.  
V
IN = 15V, VC = 1.5V, SHDN = 1V, BOOST open circuit, SW open circuit, unless otherwise noted.  
PARAMETER CONDITIONS  
5.5V V 60V  
MIN  
TYP  
MAX  
UNITS  
Reference Voltage (V ) (LT1766)  
1.204 1.219 1.234  
1.195  
V
V
REF  
IN  
V
+ 0.2 V V – 0.2  
1.243  
OL  
C
OH  
SENSE Voltage (LT1766-5)  
5.5V V 60V  
4.94  
4.90  
5
5.06  
5.10  
V
V
IN  
V
+ 0.2V V V – 0.2V  
OL  
C OH  
SENSE Pin Resistance (LT1766-5)  
FB Input Bias Current (LT1766)  
Error Amp Voltage Gain  
9.5  
13.8  
–0.5  
400  
19  
kΩ  
µA  
–1.5  
(Notes 2, 9)  
dl (V ) = ±10µA (Note 9)  
200  
V/V  
Error Amp g  
1500  
1000  
2000  
3000  
4200  
µMho  
µMho  
m
C
V to Switch g  
1.7  
225  
225  
0.9  
A/V  
µA  
µA  
V
C
m
EA Source Current  
EA Sink Current  
FB = 1V or V  
= 4.1V  
125  
100  
400  
450  
SENSE  
FB = 1.4V or V  
Duty Cycle = 0  
SHDN = 1V  
= 5.7V  
SENSE  
V Switching Threshold  
C
V High Clamp  
C
2.1  
V
1766fa  
2
LT1766/LT1766-5  
ELECTRICAL CHARACTERISTICS  
The denotes specifications which apply over the full operating temperature range, otherwise specifications are at TJ = 25°C.  
VIN = 15V, VC = 1.5V, SHDN = 1V, BOOST open circuit, SW open circuit, unless otherwise noted.  
PARAMETER  
CONDITIONS  
MIN  
TYP  
2
MAX  
UNITS  
Switch Current Limit  
Switch On Resistance  
V Open, Boost = V + 5V, FB = 1V or V  
C
= 4.1V  
1.5  
3
A
IN  
SENSE  
I
= 1.5A, Boost = V + 5V (Note 7)  
0.2  
0.3  
0.4  
SW  
IN  
Maximum Switch Duty Cycle  
Switch Frequency  
FB = 1V or V  
= 4.1V  
93  
90  
96  
%
%
SENSE  
V Set to Give DC = 50%  
C
184  
172  
200  
200  
216  
228  
kHz  
kHz  
f
f
Line Regulation  
5.5V V 60V  
0.05  
0.8  
0.15  
%/V  
V
SW  
SW  
IN  
Frequency Shifting Threshold  
Df = 10kHz  
(Note 3)  
Minimum Input Voltage  
Minimum Boost Voltage  
Boost Current (Note 5)  
4.6  
1.8  
5.5  
3
V
(Note 4) I 1.5A  
V
SW  
Boost = V + 5V, I = 0.5A  
12  
45  
25  
70  
mA  
mA  
IN  
SW  
Boost = V + 5V, I = 1.5A  
IN  
SW  
Input Supply Current (I  
)
)
(Note 6) V  
= 5V  
1.4  
2.9  
25  
2.2  
4.2  
mA  
mA  
VIN  
BIAS  
BIAS  
Bias Supply Current (I  
(Note 6) V  
= 5V  
BIAS  
Shutdown Supply Current  
SHDN = 0V, V 60V, SW = 0V, V Open  
75  
200  
µA  
µA  
IN  
C
Lockout Threshold  
V Open  
C
2.3  
2.42  
2.53  
V
Shutdown Thresholds  
V Open, Shutting Down  
V Open, Starting Up  
C
0.15  
0.25  
0.37  
0.45  
0.6  
0.6  
V
V
C
Minimum SYNC Amplitude  
SYNC Frequency Range  
SYNC Input Resistance  
1.5  
2.2  
V
kHz  
kΩ  
228  
700  
20  
Note 1: Absolute Maximum Ratings are those values beyond which the life  
Note 7: Switch on resistance is calculated by dividing V to SW voltage by  
the forced current (1.5A). See Typical Performance Characteristics for the  
graph of switch voltage at other currents.  
Note 8: The LT1766EGN, LT1766EGN-5, LT1766EFE and LT1766EFE-5 are  
guaranteed to meet performance specifications from 0°C to 125°C  
junction temperature. Specifications over the –40°C to 125°C operating  
junction temperature range are assured by design, characterization and  
correlation with statistical process controls. The LT1766IGN,  
LT1766IGN-5, LT1766IFE and LT1766IFE-5 are guaranteed over the full  
–40°C to 125°C operating junction temperature range.  
IN  
of a device may be impaired.  
Note 2: Gain is measured with a V swing equal to 200mV above the low  
C
clamp level to 200mV below the upper clamp level.  
Note 3: Minimum input voltage is not measured directly, but is guaranteed  
by other tests. It is defined as the voltage where internal bias lines are still  
regulated so that the reference voltage and oscillator remain constant.  
Actual minimum input voltage to maintain a regulated output will depend  
upon output voltage and load current. See Applications Information.  
Note 4: This is the minimum voltage across the boost capacitor needed to  
guarantee full saturation of the internal power switch.  
Note 9: Transconductance and voltage gain refer to the internal amplifier  
exclusive of the voltage divider. To calculate gain and transconductance,  
refer to the SENSE pin on fixed voltage parts. Divide the values shown by  
Note 5: Boost current is the current flowing into the BOOST pin with the  
pin held 5V above input voltage. It flows only during switch on time.  
the ratio V /1.219.  
OUT  
Note 6: Input supply current is the quiescent current drawn by the input  
pin when the BIAS pin is held at 5V with switching disabled. Bias supply  
current is the current drawn by the BIAS pin when the BIAS pin is held at  
5V. Total input referred supply current is calculated by summing input  
Note 10: This IC includes overtemperature protection that is intended to  
protect the device during momentary overload conditions. Junction  
temperature will exceed 125°C when overtemperature protection is active.  
Continuous operation above the specified maximum operating junction  
temperature may impair device reliability.  
supply current (I ) with a fraction of bias supply current (I  
):  
BIAS  
VIN  
I
= I + (I  
)(V /V )  
BIAS OUT IN  
TOTAL  
VIN  
With V = 15V, V  
= 5V, I = 1.4mA, I  
= 2.9mA, I  
= 2.4mA.  
IN  
OUT  
VIN  
BIAS  
TOTAL  
1766fa  
3
LT1766/LT1766-5  
TYPICAL PERFOR A CE CHARACTERISTICS  
U W  
Switch Peak Current Limit  
FB Pin Voltage and Current  
SHDN Pin Bias Current  
2.5  
2.0  
1.5  
1.0  
1.234  
1.229  
1.224  
1.219  
2.0  
1.5  
250  
200  
150  
100  
12  
T
A
= 25°C  
CURRENT REQUIRED TO FORCE SHUTDOWN  
(FLOWS OUT OF PIN). AFTER SHUTDOWN,  
CURRENT DROPS TO A FEW µA  
TYPICAL  
VOLTAGE  
CURRENT  
1.0  
0.5  
0
GUARANTEED MINIMUM  
1.214  
1.209  
1.204  
AT 2.38V STANDBY THRESHOLD  
(CURRENT FLOWS OUT OF PIN)  
6
0
0
20  
40  
60  
80  
100  
50  
100 125  
–50 –25  
0
25  
75  
50  
100 125  
–50 –25  
0
25  
75  
DUTY CYCLE (%)  
JUNCTION TEMPERATURE (°C)  
JUNCTION TEMPERATURE (°C)  
1766 G01  
1766 G02  
1766 G03  
Lockout and Shutdown  
Thresholds  
Shutdown Supply Current  
Shutdown Supply Current  
300  
250  
40  
35  
30  
25  
20  
15  
10  
5
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0
T
= 25°C  
A
V
A
= 0V  
SHDN  
= 25°C  
T
LOCKOUT  
V
IN  
= 60V  
200  
150  
V
IN  
= 15V  
100  
50  
0
START-UP  
SHUTDOWN  
0
0
0.1  
0.2  
0.3  
0.4  
0.5  
0
10  
20  
30  
40  
50  
60  
–50  
–25  
0
25  
50  
75  
100  
125  
SHUTDOWN VOLTAGE (V)  
INPUT VOLTAGE (V)  
JUNCTION TEMPERATURE (°C)  
1766 G06  
1766 G05  
1766 G04  
Error Amplifier Transconductance  
Error Amplifier Transconductance  
Frequency Foldback  
3000  
2500  
2000  
1500  
1000  
500  
200  
150  
100  
50  
600  
2500  
2000  
1500  
1000  
500  
T
= 25°C  
A
T = 25°C  
A
PHASE  
500  
400  
300  
200  
100  
GAIN  
V
C
SWITCHING  
FREQUENCY  
C
OUT  
12pF  
R
OUT  
200k  
–3  
V
2 • 10  
(
)
FB  
ERROR AMPLIFIER EQUIVALENT CIRCUIT  
= 50Ω  
0
FB PIN  
CURRENT  
R
LOAD  
–50  
0
0
100  
1k  
10k  
100k  
1M  
10M  
–25  
0
25  
50  
75  
100  
125  
0
0.5  
1.5  
–50  
1.0  
FREQUENCY (Hz)  
JUNCTION TEMPERATURE (°C)  
V
FB  
(V)  
1766 G08  
1766 G07  
1766 G09  
1766fa  
4
LT1766/LT1766-5  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Minimum Input Voltage with 5V  
Output  
Switching Frequency  
BOOST Pin Current  
230  
220  
210  
200  
190  
180  
170  
7.5  
7.0  
6.5  
6.0  
5.5  
5.0  
45  
40  
35  
30  
25  
20  
15  
10  
5
T
= 25°C  
T = 25°C  
A
A
MINIMUM INPUT  
VOLTAGE TO START  
MINIMUM INPUT  
VOLTAGE TO RUN  
0
–50  
–25  
0
25  
50  
75  
100  
125  
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9  
LOAD CURRENT (A)  
1
0
0.5  
1
1.5  
JUNCTION TEMPERATURE (°C)  
SWITCH CURRENT (A)  
1766 G10  
1766 G11  
1766 G12  
Switch Minimum ON Time  
vs Temperature  
VC Pin Shutdown Threshold  
Switch Voltage Drop  
600  
500  
400  
300  
2.1  
1.9  
450  
400  
350  
300  
250  
200  
150  
100  
50  
T
= 125°C  
J
1.7  
1.5  
1.3  
1.1  
0.9  
T
= 25°C  
J
200  
100  
0
T
= –40°C  
J
0.7  
0
0
0.5  
1
1.5  
50  
100 125  
50  
100 125  
–50 –25  
0
25  
75  
–50 –25  
0
25  
75  
SWITCH CURRENT (A)  
JUNCTION TEMPERATURE (°C)  
JUNCTION TEMPERATURE (°C)  
1766 G14  
1766 G15  
1766 G13  
U
U
U
PI FU CTIO S  
GND (Pins 1, 8, 9, 16, 17): The GND pin connections act  
as the reference for the regulated output, so load regula-  
tion will suffer if the “ground” end of the load is not at the  
same voltage as the GND pins of the IC. This condition will  
occur when load current or other currents flow through  
metal paths between the GND pins and the load ground.  
Keep the paths between the GND pins and the load ground  
short and use a ground plane when possible. The GND pin  
also acts as a heat sink and should be soldered to a large  
copper plane to reduce thermal resistance. For the FE  
package, the exposed pad should be soldered to the  
coppergroundplaneunderneaththedevice. (SeeApplica-  
tions Information—Layout Considerations.)  
SW (Pin 2): The switch pin is the emitter of the on-chip  
power NPN switch. This pin is driven up to the input pin  
voltage during switch on time. Inductor current drives the  
switch pin negative during switch off time. Negative volt-  
age is clamped with the external catch diode. Maximum  
negative switch voltage allowed is 0.8V.  
NC (Pins 3, 5, 7, 13): No Connection.  
1766fa  
5
LT1766/LT1766-5  
U
U
U
PI FU CTIO S  
VIN (Pin 4): This is the collector of the on-chip power NPN  
switch. VIN powers the internal control circuitry when a  
voltage on the BIAS pin is not present. High dI/dt edges  
occur on this pin during switch turn on and off. Keep the  
path short from the VIN pin through the input bypass  
capacitor, through the catch diode back to SW. All trace  
inductanceonthispathwillcreateavoltagespikeatswitch  
off, adding to the VCE voltage across the internal NPN.  
FB/SENSE (Pin 12): The feedback pin is used to set the  
output voltage using an external voltage divider that gen-  
erates 1.22V at the pin for the desired output voltage. The  
5V fixed output voltage parts have the divider included on  
the chip and the FB pin is used as a SENSE pin, connected  
directly to the 5V output. Three additional functions are  
performed by the FB pin. When the pin voltage drops  
below 0.6V, switch current limit is reduced and the exter-  
nal SYNC function is disabled. Below 0.8V, switching  
frequency is also reduced. See Feedback Pin Functions in  
Applications Information for details.  
BOOST (Pin 6): The BOOST pin is used to provide a drive  
voltage, higher than the input voltage, to the internal  
bipolarNPNpowerswitch. Withoutthisaddedvoltage, the  
typical switch voltage loss would be about 1.5V. The  
additional BOOST voltage allows the switch to saturate  
and voltage loss approximates that of a 0.2FET struc-  
ture, but with much smaller die area.  
SYNC (Pin 14): The SYNC pin is used to synchronize the  
internal oscillator to an external signal. It is directly logic  
compatible and can be driven with any signal between  
10% and 90% duty cycle. The synchronizing range is  
equal to initial operating frequency up to 700kHz. See  
Synchronizing in Applications Information for details.  
BIAS (Pin 10): The BIAS pin is used to improve efficiency  
when operating at higher input voltages and light load  
current. Connecting this pin to the regulated output volt-  
age forces most of the internal circuitry to draw its  
operating current from the output voltage rather than the  
input supply. This architecture increases efficiency espe-  
cially when the input voltage is much higher than the  
output. Minimum output voltage setting for this mode of  
operation is 3V.  
SHDN (Pin 15): The SHDN pin is used to turn off the  
regulator and to reduce input drain current to a few  
microamperes. This pin has two thresholds: one at 2.38V  
to disable switching and a second at 0.4V to force com-  
plete micropower shutdown. The 2.38V threshold func-  
tions as an accurate undervoltage lockout (UVLO);  
sometimes used to prevent the regulator from delivering  
power until the input voltage has reached a predetermined  
level.  
VC (Pin 11) The VC pin is the output of the error amplifier  
and the input of the peak switch current comparator. It is  
normally used for frequency compensation, but can also  
serve as a current clamp or control loop override. VC sits  
at about 0.9V for light loads and 2.1V at maximum load. It  
can be driven to ground to shut off the regulator, but if  
driven high, current must be limited to 4mA.  
If the SHDN pin functions are not required, the pin can  
either be left open (to allow an internal bias current to lift  
the pin to a default high state) or be forced high to a level  
not to exceed 6V.  
W
BLOCK DIAGRA  
The LT1766 is a constant frequency, current mode buck  
converter. This means that there is an internal clock and  
twofeedbackloopsthatcontrolthedutycycleofthepower  
switch. In addition to the normal error amplifier, there is a  
current sense amplifier that monitors switch current on a  
cycle-by-cycle basis. A switch cycle starts with an oscilla-  
tor pulse which sets the RS flip-flop to turn the switch on.  
When switch current reaches a level set by the inverting  
input of the comparator, the flip-flop is reset and the  
switch turns off. Output voltage control is obtained by  
using the output of the error amplifier to set the switch  
current trip point. This technique means that the error  
amplifier commands current to be delivered to the output  
rather than voltage. A voltage fed system will have low  
phase shift up to the resonant frequency of the inductor  
and output capacitor, then an abrupt 180° shift will occur.  
1766fa  
6
LT1766/LT1766-5  
W
BLOCK DIAGRA  
The current fed system will have 90° phase shift at a much  
lower frequency, but will not have the additional 90° shift  
until well beyond the LC resonant frequency. This makes  
itmucheasiertofrequencycompensatethefeedbackloop  
and also gives much quicker transient response.  
regulated output voltage). This will improve efficiency if  
the BIAS pin voltage is lower than regulator input voltage.  
High switch efficiency is attained by using the BOOST pin  
to provide a voltage to the switch driver which is higher  
than the input voltage, allowing switch to be saturated.  
This boosted voltage is generated with an external  
capacitor and diode. Two comparators are connected to  
the shutdown pin. One has a 2.38V threshold for under-  
voltage lockout and the second has a 0.4V threshold for  
complete shutdown.  
Most of the circuitry of the LT1766 operates from an  
internal 2.9V bias line. The bias regulator normally draws  
power from the regulator input pin, but if the BIAS pin is  
connected to an external voltage higher than 3V, bias  
powerwillbedrawnfromtheexternalsource(typicallythe  
V
IN  
4
R
LIMIT  
R
SENSE  
+
2.9V BIAS  
REGULATOR  
INTERNAL  
CC  
BIAS  
10  
V
CURRENT  
COMPARATOR  
SLOPE COMP  
Σ
SYNC 14  
BOOST  
6
ANTISLOPE COMP  
SHUTDOWN  
COMPARATOR  
200kHz  
OSCILLATOR  
+
S
Q1  
POWER  
SWITCH  
R
DRIVER  
CIRCUITRY  
S
FLIP-FLOP  
R
0.4V  
5.5µA  
2
SW  
SHDN 15  
+
FREQUENCY  
FOLDBACK  
LOCKOUT  
COMPARATOR  
×1  
Q2  
FOLDBACK  
CURRENT  
LIMIT  
V
C(MAX)  
CLAMP  
Q3  
ERROR  
AMPLIFIER  
= 2000µMho  
CLAMP  
+
12  
FB  
g
m
11  
1.22V  
2.38V  
V
C
GND  
1, 8, 9, 16, 17  
1766 F01  
Figure 1. LT1766 Block Diagram  
1766fa  
7
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FEEDBACK PIN FUNCTIONS  
switching regulator to operate at very low duty cycles,  
and the average current through the diode and inductor  
is equal to the short-circuit current limit of the switch  
(typically 2A for the LT1766, folding back to less than  
1A). Minimum switch on time limitations would prevent  
the switcher from attaining a sufficiently low duty cycle  
if switching frequency were maintained at 200kHz, so  
frequency is reduced by about 5:1 when the feedback pin  
voltagedropsbelow0.8V(seeFrequencyFoldbackgraph).  
This does not affect operation with normal load condi-  
tions; one simply sees a gear shift in switching frequency  
during start-up as the output voltage rises.  
The feedback (FB) pin on the LT1766 is used to set output  
voltage and provide several overload protection features.  
The first part of this section deals with selecting resistors  
to set output voltage and the remaining part talks about  
foldback frequency and current limiting created by the FB  
pin. Please read both parts before committing to a final  
design. The 5V fixed output voltage part (LT1766-5) has  
internaldividerresistorsandtheFBpinisrenamedSENSE,  
connected directly to the output.  
The suggested value for the output divider resistor (see  
Figure 2) from FB to ground (R2) is 5k or less, and a  
formula for R1 is shown below. The output voltage error  
caused by ignoring the input bias current on the FB pin is  
less than 0.25% with R2 = 5k. A table of standard 1%  
values is shown in Table 1 for common output voltages.  
Please read the following if divider resistors are increased  
above the suggested values.  
In addition to lower switching frequency, the LT1766 also  
operates at lower switch current limit when the feedback  
pin voltage drops below 0.6V. Q2 in Figure 2 performs this  
function by clamping the VC pin to a voltage less than its  
normal 2.1V upper clamp level. This foldback current limit  
greatly reduces power dissipation in the IC, diode and in-  
ductor during short-circuit conditions. External synchro-  
nization is also disabled to prevent interference with fold-  
back operation. Again, it is nearly transparent to the user  
under normal load conditions. The only loads that may be  
affected are current source loads which maintain full load  
current with output voltage less than 50% of final value. In  
theseraresituationsthefeedbackpincanbeclampedabove  
0.6Vwithanexternaldiodetodefeatfoldbackcurrentlimit.  
Caution: clamping the feedback pin means that frequency  
shifting will also be defeated, so a combination of high in-  
putvoltageanddeadshortedoutputmaycausetheLT1766  
to lose control of current limit.  
R2 V  
1.22  
1.22  
(
)
OUT  
R1=  
Table 1  
OUTPUT  
VOLTAGE  
(V)  
R1  
% ERROR AT OUTPUT  
R2  
(NEAREST 1%) DUE TO DISCREET 1%  
(k  
)
(k  
)
RESISTOR STEPS  
+0.32  
3
3.3  
5
4.99  
4.99  
4.99  
4.75  
4.47  
4.32  
4.12  
4.12  
7.32  
8.45  
15.4  
18.7  
24.9  
30.9  
36.5  
46.4  
0.43  
0.30  
6
+0.38  
8
+0.20  
The internal circuitry which forces reduced switching  
frequency also causes current to flow out of the feedback  
pin when output voltage is low. The equivalent circuitry is  
shown in Figure 2. Q1 is completely off during normal  
operation. If the FB pin falls below 0.8V, Q1 begins to  
conduct current and reduces frequency at the rate of  
approximately 1.4kHz/µA. To ensure adequate frequency  
foldback (under worst-case short-circuit conditions), the  
external divider Thevinin resistance must be low enough  
to pull 115µA out of the FB pin with 0.44V on the pin (RDIV  
3.8k). The net result is that reductions in frequency and  
current limit are affected by output voltage divider imped-  
ance. Although divider impedance is not critical, caution  
10  
12  
15  
0.54  
+0.24  
0.27  
More Than Just Voltage Feedback  
The feedback pin is used for more than just output  
voltage sensing. It also reduces switching frequency and  
current limit when output voltage is very low (see the  
Frequency Foldback graph in Typical Performance Char-  
acteristics). This is done to control power dissipation in  
both the IC and in the external diode and inductor during  
short-circuit conditions. A shorted output requires the  
1766fa  
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U
V
SW  
LT1766  
L1  
TO FREQUENCY  
SHIFTING  
OUTPUT  
5V  
1.4V  
Q1  
ERROR  
AMPLIFIER  
R1  
1.2V  
+
R4  
2k  
R3  
1k  
FB  
+
C1  
BUFFER  
Q2  
R2  
5k  
TO SYNC CIRCUIT  
V
GND  
C
1766 F02  
Figure 2. Frequency and Current Limit Foldback  
should be used if resistors are increased beyond the  
suggested values and short-circuit conditions occur with  
high input voltage. High frequency pickup will increase  
and the protection accorded by frequency and current  
foldback will decrease.  
V
V
AT I  
AT I  
= 1A  
OUT  
OUT  
OUT  
OUT  
40mV/DIV  
0.5A/DIV  
= 0.1A  
INDUCTOR CURRENT  
AT I = 1A  
CHOOSING THE INDUCTOR  
OUT  
For most applications, the output inductor will fall into the  
range of 15µH to 100µH. Lower values are chosen to  
reduce physical size of the inductor. Higher values allow  
more output current because they reduce peak current  
seen by the LT1766 switch, which has a 1.5A limit. Higher  
values also reduce output ripple voltage.  
INDUCTOR CURRENT  
AT I = 0.1A  
OUT  
V
V
= 40V  
OUT  
L = 47µH  
2.5µs/DIV  
1766 F03  
IN  
= 5V  
C = 100µF, 10V, 0.1Ω  
Figure 3. LT1766 Ripple Voltage Waveform  
When choosing an inductor you will need to consider  
output ripple voltage, maximum load current, peak induc-  
tor current and fault current in the inductor. In addition,  
other factors such as core and copper losses, allowable  
component height, EMI, saturation and cost should also  
be considered. The following procedure is suggested as a  
way of handling these somewhat complicated and con-  
flicting requirements.  
value to achieve a desirable output ripple voltage level. If  
output ripple voltage is of less importance, the subse-  
quent suggestions in Peak Inductor and Fault Current  
and EMI will additionally help in the selection of the  
inductor value.  
Peak-to-peak output ripple voltage is the sum of a triwave  
(created by peak-to-peak ripple current (ILP-P) times ESR)  
and a square wave (created by parasitic inductance (ESL)  
and ripple current slew rate). Capacitive reactance is  
assumed to be small compared to ESR or ESL.  
Output Ripple Voltage  
Figure 3 shows a typical output ripple voltage waveform  
for the LT1766. Ripple voltage is determined by ripple  
current (ILP-P) through the inductor and the high  
frequencyimpedanceoftheoutputcapacitor.Thefollow-  
ing equations will help in choosing the required inductor  
dI  
dt  
VRIPPLE = I  
ESR + ESL  
LP-P)( ) (  
(
)
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where:  
or not the inductor must withstand continuous fault  
conditions.  
ESR = equivalent series resistance of the output  
capacitor  
If maximum load current is 0.5A, for instance, a 0.5A  
inductor may not survive a continuous 2A overload condi-  
tion. Dead shorts will actually be more gentle on the  
inductor because the LT1766 has frequency and current  
limit foldback.  
ESL = equivalent series inductance of the output  
capacitor  
dI/dt = slew rate of inductor ripple current = VIN/L  
Peak-to-peak ripple current (ILP-P) through the inductor  
and into the output capacitor is typically chosen to be  
between 20% and 40% of the maximum load current. It is  
approximated by:  
Peak switch and inductor current can be significantly  
higher than output current, especially with smaller induc-  
tors and lighter loads, so don’t omit this step. Powdered  
iron cores are forgiving because they saturate softly,  
whereas ferrite cores saturate abruptly. Other core  
V
V – V  
IN OUT  
(
=
OUT)(  
)
ILP-P  
Table 2  
V
f L  
IN)( )( )  
(
VENDOR/  
PART NO.  
VALUE  
H)  
I
DCR  
(Ohms)  
HEIGHT  
(mm)  
DC  
(
µ
(Amps)  
Example: with VIN = 40V, VOUT = 5V, L = 47µH, ESR = 0.1Ω  
and ESL = 10nH, output ripple voltage can be approxi-  
mated as follows:  
Coiltronics  
CTX15-1P  
15  
15  
33  
33  
33  
47  
68  
1.4  
1.1  
1.3  
1.4  
2.4  
1.9  
1.7  
1.4  
0.087  
0.08  
4.2  
4.2  
6
CTX15-1  
CTX33-2P  
0.126  
0.106  
0.099  
0.146  
0.19  
5 40 5  
( )(  
)
IP-P  
dI  
=
= 0.465A  
CTX33-2  
6
40 47 106 200 103  
( )  
(
)(  
)
UP2-330  
5.9  
5.9  
5.9  
5.9  
40  
UP2-470  
=
= 106 • 0.85  
47 106  
UP2-680  
dt  
UP2-101  
100  
0.277  
VRIPPLE = 0.465A 0.1 + 10 109 106 0.85  
(
)(  
)
(
)
(
)(  
)
Sumida  
= 0.0465 + 0.0085 = 55mVP-P  
CDRH6D28-150M  
CDRH6D38-150M  
CDRH6D28-330M  
CDRH104R-330M  
CDRH125-330M  
CDRH104R-470M  
CDRH125-470M  
CDRH6D38-680M  
CDRH104R-680M  
CDRH125-680M  
CDRH104R-101M  
CDRH125-101M  
Coilcraft  
15  
15  
1.4  
1.6  
0.076  
0.062  
0.122  
0.069  
0.044  
0.095  
0.058  
0.173  
0.158  
0.093  
0.225  
0.120  
3
4
To reduce output ripple voltage further requires an in-  
crease in the inductor value or a reduction in the capacitor  
ESR. The latter can effect loop stability since the ESR  
forms a useful zero in the overall loop response. Typically  
the inductor value is adjusted with the trade-off being a  
physically larger inductor with the possibility of increased  
component height and cost. Choosing a smaller inductor  
with lighter loads may result in discontinuous operation  
but the LT1766 is designed to work well in both continu-  
ous or discontinuous mode.  
33  
0.97  
2.1  
3
33  
3.8  
6
33  
2.1  
47  
2.1  
3.8  
6
47  
1.8  
68  
0.75  
1.5  
4
68  
3.8  
6
68  
1.5  
100  
100  
1.35  
1.3  
3.8  
6
Peak Inductor Current and Fault Current  
DT3316P-153  
DT3316P-333  
DT3316P-473  
15  
33  
47  
1.8  
1.3  
1
0.06  
0.09  
0.11  
5
5
5
To ensure that the inductor will not saturate, the peak  
inductor current should be calculated knowing the maxi-  
mum load current. An appropriate inductor should then  
bechosen.Inaddition,adecisionshouldbemadewhether  
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materials fall somewhere in between. The following for-  
mula assumes continuous mode of operation, but errs  
only slightly on the high side for discontinuous mode, so  
it can be used for all conditions.  
Maximum load current would be equal to maximum  
switch current for an infinitely large inductor, but with  
finite inductor size, maximum load current is reduced by  
one-halfpeak-to-peakinductorcurrent(ILP-P).Thefollow-  
ing formula assumes continuous mode operation, imply-  
ing that the term on the right is less than one-half of IP.  
VOUT V – VOUT  
(
)( IN  
)
(ILP-P  
2
)
IPEAK = IOUT  
+
= IOUT +  
2 V f L  
( )( IN)( )( )  
IOUT(MAX)  
=
Continuous Mode  
EMI  
V
OUT  
+ V V V  
– V  
ILP-P  
2
(
F)(  
)
IN  
OUT F  
IP –  
=IP −  
Decide if the design can tolerate an “open” core geometry  
like a rod or barrel, which have high magnetic field  
radiation, or whether it needs a closed core like a toroid to  
prevent EMI problems. This is a tough decision because  
the rods or barrels are temptingly cheap and small and  
there are no helpful guidelines to calculate when the  
magnetic field radiation will be a problem.  
2 L f V  
( )( )(  
)
IN  
For VOUT = 5V, VIN = 8V, VF(D1) = 0.63V, f = 200kHz and  
L = 20µH:  
5 + 0.63 8 5 – 0.63  
(
(
)(  
)
8
IOUT MAX) = 1.5 −  
(
2 20 106 200103  
( )  
)(  
)
=1.5 0.21= 1.29A  
Additional Considerations  
Note that there is less load current available at the higher  
inputvoltagebecauseinductorripplecurrentincreases.At  
VIN = 15V, duty cycle is 33% and for the same set of  
conditions:  
After making an initial choice, consider additional factors  
such as core losses and second sourcing, etc. Use the  
experts in Linear Technology’s Applications department if  
you feel uncertain about the final choice. They have  
experience with a wide range of inductor types and can tell  
you about the latest developments in low profile, surface  
mounting, etc.  
5 + 0.63 15 5 – 0.63  
(
(
)(  
)
I
OUT(MAX) = 1.5 −  
2 20 106 200103 15  
( )  
)(  
)
= 1.5 0.44 = 1.06A  
Maximum Output Load Current  
To calculate actual peak switch current with a given set of  
conditions, use:  
Maximum load current for a buck converter is limited by  
themaximumswitchcurrentrating(IP).Thecurrentrating  
fortheLT1766is1.5A. Unlikemostcurrentmodeconvert-  
ers, the LT1766 maximum switch current limit does not  
fall off at high duty cycles. Most current mode converters  
suffer a drop off of peak switch current for duty cycles  
above 50%. This is due to the effects of slope compensa-  
tion required to prevent subharmonic oscillations in cur-  
rent mode converters. (For detailed analysis, see Applica-  
tion Note 19.)  
ILP-P  
2
ISW PEAK = IOUT  
+
+
(
)
(VOUT + V ) V V  
– V  
F
(
)
F
IN  
OUT  
= IOUT  
2 L f V  
( )( )(  
)
IN  
Reduced Inductor Value and Discontinuous Mode  
If the smallest inductor value is of most importance to a  
converter design, in order to reduce inductor size/cost,  
discontinuous mode may yield the smallest inductor solu-  
tion. The maximum output load current in discontinuous  
mode, however, must be calculated and is defined later in  
The LT1766 is able to maintain peak switch current limit over  
thefulldutycyclerangebyusingpatentedcircuitry*tocancel  
the effects of slope compensation on peak switch current  
without affecting the frequency compensation it provides.  
*Patent # 6, 498, 466  
this section.  
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Discontinuous mode is entered when the output load  
current is less than one-half of the inductor ripple current  
(ILP-P). In this mode, inductor current falls to zero before  
thenextswitchturnon(seeFigure8). Buckconverterswill  
beindiscontinuousmodeforoutputloadcurrentgivenby:  
Short-Circuit Considerations  
The LT1766 is a current mode controller. It uses the VC  
node voltage as an input to a current comparator which  
turns off the output switch on a cycle-by-cycle basis as  
this peak current is reached. The internal clamp on the VC  
node, nominally 2V, then acts as an output switch peak  
current limit. This action becomes the switch current limit  
specification. The maximum available output power is  
then determined by the switch current limit.  
(VOUT + V )(V VOUT – V )  
F
IN  
F
IOUT  
<
(2)(V )(f)(L)  
IN  
Discontinuous Mode  
The inductor value in a buck converter is usually chosen  
large enough to keep inductor ripple current (ILP-P) low;  
this is done to minimize output ripple voltage and maxi-  
mize output load current. In the case of large inductor  
values, as seen in the equation above, discontinuous  
mode will be associated with “light loads.”  
A potential controllability problem could occur under  
short-circuit conditions. If the power supply output is  
short circuited, the feedback amplifier responds to the low  
output voltage by raising the control voltage, VC, to its  
peak current limit value. Ideally, the output switch would  
be turned on, and then turned off as its current exceeded  
thevalueindicatedbyVC.However,thereisfiniteresponse  
time involved in both the current comparator and turnoff  
of the output switch. These result in a minimum on time  
tON(MIN). When combined with the large ratio of VIN to  
(VF + I • R), the diode forward voltage plus inductor I • R  
voltage drop, the potential exists for a loss of control.  
Expressed mathematically the requirement to maintain  
control is:  
When choosing small inductor values, however, discon-  
tinuous mode will occur at much higher output load  
currents. The limit to the smallest inductor value that can  
be chosen is set by the LT1766 peak switch current (IP)  
and the maximum output load current required, given by:  
2
IP  
IOUT(MAX)  
Discontinuous Mode  
=
(2)(ILP-P  
)
2
I
(f)(L)(V )  
IN  
(P) (  
)
=
VF +I•R  
2(VOUT + V )(V VOUT – V )  
F
IN  
F
f • tON  
V
IN  
Example: For VIN = 15V, VOUT = 5V, VF = 0.63V, f = 200kHz  
where:  
and L = 10µH.  
f = switching frequency  
(1.5)2 (200103)(105)(15)  
2(5 + 0.63)(15 – 5 – 0.63)  
IOUT(MAX)  
tON = switch minimum on time  
VF = diode forward voltage  
VIN = Input voltage  
=
Discontinuous  
Mode  
I • R = inductor I • R voltage drop  
IOUT(MAX)  
Discontinuous Mode  
= 0.639A  
If this condition is not observed, the current will not be  
limited at IPK, but will cycle-by-cycle ratchet up to some  
higher value. Using the nominal LT1766 clock frequency  
of 200KHz, a VIN of 40V and a (VF + I • R) of say 0.7V, the  
maximum tON to maintain control would be approximately  
90ns, an unacceptably short time.  
What has been shown here is that if high inductor ripple  
current and discontinuous mode operation can be toler-  
ated, small inductor values can be used. If a higher output  
load current is required, the inductor value must be  
increased. If IOUT(MAX) no longer meets the discontinuous  
mode criteria, use the IOUT(MAX) equation for continuous  
mode; the LT1766 is designed to operate well in both  
modes of operation, allowing a large range of inductor  
values to be used.  
The solution to this dilemma is to slow down the oscillator  
when the FB pin voltage is abnormally low thereby indicat-  
ing some sort of short-circuit condition. Oscillator fre-  
quency is unaffected until FB voltage drops to about 2/3 of  
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tantalum capacitors fail during very high turn-on surges,  
which do not occur at the output of regulators. High  
discharge surges, such as when the regulator output is  
dead shorted, do not harm the capacitors.  
its normal value. Below this point the oscillator frequency  
decreases roughly linearly down to a limit of about 40kHz.  
Thisloweroscillatorfrequencyduringshort-circuitcondi-  
tions can then maintain control with the effective mini-  
mum on time.  
Unlike the input capacitor, RMS ripple current in the  
output capacitor is normally low enough that ripple cur-  
rent rating is not an issue. The current waveform is  
triangular with a typical value of 125mARMS. The formula  
to calculate this is:  
It is recommended that for [VIN/(VOUT + VF)] ratios > 10,  
a soft-start circuit should be used to control the output  
capacitor charge rate during start-up or during recovery  
from an output short circuit, thereby adding additional  
control over peak inductor current. See Buck Converter  
with Adjustable Soft-Start later in this data sheet.  
Output capacitor ripple current (RMS):  
0.29 V  
OUT)(  
=
V V  
IN OUT  
(
)
IRIPPLE RMS  
(
)
OUTPUT CAPACITOR  
L f V  
( )( )(  
)
IN  
The output capacitor is normally chosen by its effective  
series resistance (ESR), because this is what determines  
output ripple voltage. To get low ESR takes volume, so  
physically smaller capacitors have high ESR. The ESR  
range for typical LT1766 applications is 0.05to 0.2. A  
typical output capacitor is an AVX type TPS, 100µF at 10V,  
with a guaranteed ESR less than 0.1. This is a “D” size  
surface mount solid tantalum capacitor. TPS capacitors  
are specially constructed and tested for low ESR, so they  
give the lowest ESR for a given volume. The value in  
microfarads is not particularly critical, and values from  
22µF to greater than 500µF work well, but you cannot  
cheat mother nature on ESR. If you find a tiny 22µF solid  
tantalumcapacitor, itwillhavehighESR, andoutputripple  
voltage will be terrible. Table 2 shows some typical solid  
tantalum surface mount capacitors.  
Ceramic Capacitors  
Higher value, lower cost ceramic capacitors are now  
becoming available. They are generally chosen for their  
good high frequency operation, small size and very low  
ESR (effective series resistance). Their low ESR reduces  
output ripple voltage but also removes a useful zero in the  
loop frequency response, common to tantalum capaci-  
tors. To compensate for this, a resistor RC can be placed  
in series with the VC compensation capacitor CC. Care  
must be taken however, since this resistor sets the high  
frequency gain of the error amplifier, including the gain at  
the switching frequency. If the gain of the error amplifier  
is high enough at the switching frequency, output ripple  
voltage (although smaller for a ceramic output capacitor)  
may still affect the proper operation of the regulator. A  
filter capacitor CF in parallel with the RC/CC network is  
suggested to control possible ripple at the VC pin. An “All  
Ceramic” solution is possible for the LT1766 by choosing  
the correct compensation components for the given  
application.  
Table 3. Surface Mount Solid Tantalum Capacitor ESR  
and Ripple Current  
E Case Size  
ESR (Max,  
)
Ripple Current (A)  
AVX TPS, Sprague 593D  
D Case Size  
0.1 to 0.3  
0.1 to 0.3  
0.2 (typ)  
0.7 to 1.1  
AVX TPS, Sprague 593D  
C Case Size  
0.7 to 1.1  
0.5 (typ)  
Example: For VIN = 8V to 40V, VOUT = 3.3V at 1A, the  
LT1766 can be stabilized, provide good transient re-  
sponse and maintain very low output ripple voltage using  
the following component values: (refer to the first page of  
this data sheet for component references) C3 = 2.2µF,  
RC = 4.7k, CC = 15nF, CF = 220pF and C1 = 47µF. See  
Application Note 19 for further detail on techniques for  
proper loop compensation.  
AVX TPS  
Many engineers have heard that solid tantalum capacitors  
are prone to failure if they undergo high surge currents.  
This is historically true, and type TPS capacitors are  
speciallytestedforsurgecapability,butsurgeruggedness  
is not a critical issue with the output capacitor. Solid  
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APPLICATIO S I FOR ATIO  
rated. AVX recommends derating capacitor operating  
voltage by 2:1 for high surge applications.  
INPUT CAPACITOR  
Step-down regulators draw current from the input supply  
in pulses. The rise and fall times of these pulses are very  
fast. The input capacitor is required to reduce the voltage  
ripple this causes at the input of LT1766 and force the  
switching current into a tight local loop, thereby minimiz-  
ing EMI. The RMS ripple current can be calculated from:  
CATCH DIODE  
HighestefficiencyoperationrequirestheuseofaSchottky  
type diode. DC switching losses are minimized due to its  
low forward voltage drop, and AC behavior is benign due  
to its lack of a significant reverse recovery time. Schottky  
diodes are generally available with reverse voltage ratings  
ofupto60Vandeven100V, andarepricecompetitivewith  
other types.  
2
IRIPPLE RMS = IOUT VOUT V – V  
/ V  
IN  
(
)
IN  
OUT  
(
)
Ceramiccapacitorsareidealforinputbypassing.At200kHz  
switching frequency, the energy storage requirement of  
the input capacitor suggests that values in the range of  
2.2µF to 20µF are suitable for most applications. If opera-  
tionisrequiredclosetotheminimuminputrequiredbythe  
output of the LT1766, a larger value may be required. This  
is to prevent excessive ripple causing dips below the  
minimum operating voltage resulting in erratic operation.  
The use of so-called “ultrafast” recovery diodes is gener-  
ally not recommended. When operating in continuous  
mode, the reverse recovery time exhibited by “ultrafast”  
diodes will result in a slingshot type effect. The power  
internalswitchwillrampupVIN currentintothediodeinan  
attempt to get it to recover. Then, when the diode has  
finallyturnedoff,sometensofnanosecondslater,theVSW  
node voltage ramps up at an extremely high dV/dt, per-  
haps 5 to even 10V/ns! With real world lead inductances,  
the VSW node can easily overshoot the VIN rail. This can  
result in poor RFI behavior and if the overshoot is severe  
enough, damage the IC itself.  
Depending on how the LT1766 circuit is powered up you  
may need to check for input voltage transients.  
The input voltage transients may be caused by input  
voltage steps or by connecting the LT1766 converter to an  
already powered up source such as a wall adapter. The  
sudden application of input voltage will cause a large  
surge of current in the input leads that will store energy in  
the parasitic inductance of the leads. This energy will  
causetheinputvoltagetoswingabovetheDClevelofinput  
power source and it may exceed the maximum voltage  
rating of input capacitor and LT1766.  
The suggested catch diode (D1) is an International Recti-  
fier 10MQ060N Schottky. It is rated at 1.5A average  
forward current and 60V reverse voltage. Typical forward  
voltage is 0.63V at 1A. The diode conducts current only  
during switch off time. Peak reverse voltage is equal to  
regulatorinputvoltage.Averageforwardcurrentinnormal  
operation can be calculated from:  
The easiest way to suppress input voltage transients is to  
addasmallaluminumelectrolyticcapacitorinparallelwith  
the low ESR input capacitor. The selected capacitor needs  
to have the right amount of ESR in order to critically  
dampen the resonant circuit formed by the input lead  
inductance and the input capacitor. The typical values of  
ESRwillfallintherangeof0.5to2andcapacitancewill  
fall in the range of 5µF to 50µF.  
IOUT V – V  
(
)
IN  
OUT  
ID(AVG)  
=
V
IN  
This formula will not yield values higher than 1.5A with  
maximum load current of 1.5A. The only reason to  
consider a larger diode is the worst-case condition of a  
high input voltage and shorted output. With a shorted  
condition, diode current will increase to a typical value of  
2A, determined by peak switch current limit. This is safe  
forshortperiodsoftime, butitwouldbeprudenttocheck  
with the diode manufacturer if continuous operation  
under these conditions must be tolerated.  
If tantalum capacitors are used, values in the 22µF to  
470µF range are generally needed to minimize ESR and  
meet ripple current and surge ratings. Care should be  
taken to ensure the ripple and surge ratings are not  
exceeded. The AVX TPS and Kemet T495 series are surge  
1766fa  
14  
LT1766/LT1766-5  
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SHUTDOWN FUNCTION AND UNDERVOLTAGE  
LOCKOUT  
BOOST PIN  
Formostapplications, theboostcomponentsarea0.33µF  
capacitor and a 1N4148W diode. The anode is typically  
connected to the regulated output voltage to generate a  
voltage approximately VOUT above VIN to drive the output  
stage. However, the output stage discharges the boost  
capacitor during the on time of the switch. The output  
driver requires at least 3V of headroom throughout this  
period to keep the switch fully saturated. If the output  
voltage is less than 3.3V, it is recommended that an  
alternate boost supply is used. The boost diode can be  
connected to the input, although, care must be taken to  
prevent the 2× VIN boost voltage from exceeding the  
BOOST pin absolute maximum rating. The additional  
voltage across the switch driver also increases power  
loss, reducing efficiency. If available, and independent  
supply can be used with a local bypass capacitor.  
Figure 4 shows how to add undervoltage lockout (UVLO)  
totheLT1766. Typically, UVLOisusedinsituationswhere  
the input supply is current limited, or has a relatively high  
source resistance. A switching regulator draws constant  
power from the source, so source current increases as  
source voltage drops. This looks like a negative resistance  
loadtothesourceandcancausethesourcetocurrentlimit  
or latch low under low source voltage conditions. UVLO  
prevents the regulator from operating at source voltages  
where these problems might occur.  
Threshold voltage for lockout is about 2.38V. A 5.5µA bias  
currentflowsout ofthepinatthisthreshold. Theinternally  
generated current is used to force a default high state on  
the shutdown pin if the pin is left open. When low shut-  
down current is not an issue, the error due to this current  
can be minimized by making RLO 10k or less. If shutdown  
currentisanissue, RLO canberaisedto100k, buttheerror  
due to initial bias current and changes with temperature  
should be considered.  
A 0.33µF boost capacitor is recommended for most appli-  
cations. Almost any type of film or ceramic capacitor is  
suitable, but the ESR should be <1to ensure it can be  
fully recharged during the off time of the switch. The  
capacitor value is derived from worst-case conditions of  
4700ns on time, 42mA boost current and 0.7V discharge  
ripple. The boost capacitor value could be reduced under  
less demanding conditions, but this will not improve  
circuitoperationorefficiency.Underlowinputvoltageand  
low load conditions, a higher value capacitor will reduce  
discharge ripple and improve start-up operation.  
RLO = 10k to 100k 25k suggested  
(
)
RLO V 2.38V  
(
)
IN  
RHI =  
2.38V RLO 5.5µA  
(
)
VIN = Minimum input voltage  
R
FB  
L1  
LT1766  
OUTPUT  
V
SW  
2.38V  
+
IN  
INPUT  
STANDBY  
R
R
HI  
5.5µA  
+
SHDN  
C1  
+
TOTAL  
SHUTDOWN  
C2  
LO  
0.4V  
GND  
1766 F04  
Figure 4. Undervoltage Lockout  
1766fa  
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APPLICATIO S I FOR ATIO  
Keep the connections from the resistors to the shutdown  
pin short and make sure that interplane or surface capaci-  
tance to the switching nodes are minimized. If high  
resistor values are used, the shutdown pin should be  
bypassed with a 1000pF capacitor to prevent coupling  
problems from the switch node. If hysteresis is desired in  
the undervoltage lockout point, a resistor RFB can be  
added to the output node. Resistor values can be calcu-  
lated from:  
compensation used to prevent subharmonic switching is  
reduced. This type of subharmonic switching only occurs  
at input voltages less than twice output voltage. Higher  
inductor values will tend to eliminate this problem. See  
Frequency Compensation section for a discussion of an  
entirely different cause of subharmonic switching before  
assuming that the cause is insufficient slope compensa-  
tion. Application Note 19 has more details on the theory  
of slope compensation.  
At power-up, when VC is being clamped by the FB pin (see  
Figure2,Q2),thesyncfunctionisdisabled.Thisallowsthe  
frequency foldback to operate in the shorted output con-  
dition. During normal operation, switching frequency is  
controlledbytheinternaloscillatoruntiltheFBpinreaches  
0.6V, after which the SYNC pin becomes operational. If no  
synchronization is required, this pin should be connected  
to ground.  
RLO V 2.38 V/V  
+1 + ∆V  
(
)
[
IN  
OUT  
]
RHI =  
2.38 RLO 5.5µA  
(
)
R = R  
V
/
V  
(
)
(
)
FB  
HI  
OUT  
25k suggested for RLO  
VIN = Input voltage at which switching stops as input  
voltage descends to trip level  
V = Hysteresis in input voltage level  
LAYOUT CONSIDERATIONS  
Example: output voltage is 5V, switching is to stop if input  
voltage drops below 12V and should not restart unless  
input rises back to 13.5V. V is therefore 1.5V and  
VIN = 12V. Let RLO = 25k.  
As with all high frequency switchers, when considering  
layout,caremustbetakeninordertoachieveoptimalelec-  
trical, thermal and noise performance. For maximum effi-  
ciency, switch rise and fall times are typically in the nano-  
second range. To prevent noise both radiated and con-  
ducted, the high speed switching current path, shown in  
Figure 5, must be kept as short as possible. This is imple-  
mented in the suggested layout of Figure 6. Shortening  
this path will also reduce the parasitic trace inductance of  
approximately 25nH/inch. At switch off, this parasitic in-  
ductance produces a flyback spike across the LT1766  
switch. When operating at higher currents and input volt-  
ages, with poor layout, this spike can generate voltages  
acrosstheLT1766thatmayexceeditsabsolutemaximum  
25k 12 2.38 1.5/5 +1 + 1.5  
(
)
)
[
]
RHI =  
2.38 – 25k 5.5µA  
(
25k 10.41  
(
)
=
= 116k  
2.24  
RFB = 116k 5/1.5 = 387k  
(
)
SYNCHRONIZING  
The SYNC input must pass from a logic level low, through  
the maximum synchronization threshold with a duty cycle  
between 10% and 90%. The input can be driven directly  
from a logic level output. The synchronizing range is equal  
to initial operating frequency up to 700kHz. This means  
that minimum practical sync frequency is equal to the  
worst-case high self-oscillating frequency (228kHz), not  
the typical operating frequency of 200kHz. Caution should  
be used when synchronizing above 265kHz because at  
highersyncfrequenciestheamplitudeoftheinternalslope  
LT1766  
L1  
5V  
HIGH  
FREQUENCY  
CIRCULATING  
PATH  
V
IN  
C3  
D1 C1  
LOAD  
1766 F05  
Figure 5. High Speed Switching Path  
1766fa  
16  
LT1766/LT1766-5  
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APPLICATIO S I FOR ATIO  
U
CONNECT TO  
GROUND PLANE  
GND  
L1  
FOR THE FE PACKAGE, THE  
EXPOSED PAD (PIN 17) SHOULD  
BE PROPERLY SOLDERED TO  
THE GROUND PLANE.  
NOTE: BOOST AND BIAS  
COPPER TRACES ARE ON  
A SEPARATE LAYER FROM  
THE GROUND PLANE  
C1  
MINIMIZE LT1766  
C3-D1 LOOP  
D2  
V
OUT  
D1  
C3  
C2  
GND  
1
GND  
SW  
GND 16  
SHDN  
KELVIN SENSE  
2
3
4
5
6
7
8
15  
14  
13  
V
OUT  
SYNC  
R1  
V
IN  
LT1766  
FB  
12  
11  
R2  
V
C
BOOST  
GND  
C
FB  
BIAS 10  
GND  
C
F
9
V
IN  
R
C
KEEP FB AND V COMPONENTS  
C
AWAY FROM HIGH FREQUENCY,  
HIGH CURRENT COMPONENTS  
C
C
PLACE FEEDTHROUGH AROUND  
GROUND PINS (4 CORNERS) FOR  
GOOD THERMAL CONDUCTIVITY  
1766 F06  
Figure 6. Suggested Layout  
rating. A ground plane should always be used under the  
switcher circuitry to prevent interplane coupling and over-  
all noise.  
package, the exposed pad (Pin 17) should be soldered to  
the copper ground plane underneath the device.  
PARASITIC RESONANCE  
The VC and FB components should be kept as far away as  
possible from the switch and boost nodes. The LT1766  
pinout has been designed to aid in this. The ground for  
these components should be separated from the switch  
current path. Failure to do so will result in poor stability or  
subharmonic like oscillation.  
Resonance or “ringing” may sometimes be seen on the  
switch node (see Figure 7). Very high frequency ringing  
followingswitchrisetimeiscausedbyswitch/diode/input  
capacitor lead inductance and diode capacitance. Schot-  
tky diodes have very high “Q” junction capacitance that  
can ring for many cycles when excited at high frequency.  
If total lead length for the input capacitor, diode and  
switchpathis1inch,theinductancewillbeapproximately  
25nH. At switch off, this will produce a spike across the  
NPN output device in addition to the input voltage. At  
highercurrentsthisspikecanbeintheorderof10Vto20V  
or higher with a poor layout, potentially exceeding the  
absolute max switch voltage. The path around switch,  
catch diode and input capacitor must be kept as short as  
possibletoensurereliableoperation.Whenlookingatthis,  
a >100MHz oscilloscope must be used, and waveforms  
Board layout also has a significant effect on thermal  
resistance. Pins 1, 8, 9 and 16, GND, are a continuous  
copper plate that runs under the LT1766 die. This is the  
best thermal path for heat out of the package. Reducing  
the thermal resistance from Pins 1, 8, 9 and 16 onto the  
board will reduce die temperature and increase the power  
capability of the LT1766. This is achieved by providing as  
much copper area as possible around these pins. Adding  
multiple solder filled feedthroughs under and around  
these four corner pins to the ground plane will also help.  
Similar treatment to the catch diode and coil terminations  
will reduce any additional heating effects. For the FE  
should be observed on the leads of the package. This  
1766fa  
17  
LT1766/LT1766-5  
APPLICATIO S I FOR ATIO  
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SW RISE  
SW FALL  
SWITCH NODE  
VOLTAGE  
10V/DIV  
0.2A/DIV  
2V/DIV  
INDUCTOR  
CURRENT  
AT I  
= 0.1A  
OUT  
1766 F08  
V
V
= 40V  
OUT  
L = 47µH  
1µs/DIV  
IN  
50ns/DIV  
1766 F07  
= 5V  
Figure 7. Switch Node Resonance  
Figure 8. Discontinuous Mode Ringing  
switch off spike will also cause the SW node to go below  
ground. The LT1766 has special circuitry inside which  
mitigates this problem, but negative voltages over 0.8V  
lasting longer than 10ns should be avoided. Note that  
100MHz oscilloscopes are barely fast enough to see the  
details of the falling edge overshoot in Figure 7.  
Boost current loss:  
2
VOUT  
I
/36  
OUT  
(
)
PBOOST  
=
V
IN  
Quiescent current loss:  
P = V 0.0015 + V 0.003  
OUT  
(
)
(
)
A second, much lower frequency ringing is seen during  
switch off time if load current is low enough to allow the  
inductor current to fall to zero during part of the switch off  
time (see Figure 8). Switch and diode capacitance reso-  
nate with the inductor to form damped ringing at 1MHz to  
10 MHz. This ringing is not harmful to the regulator and it  
hasnotbeenshowntocontributesignificantlytoEMI. Any  
attempt to damp it with a resistive snubber will degrade  
efficiency.  
Q
IN  
RSW = Switch resistance (0.3) hot  
tEFF = Effective switch current/voltage overlap time  
= (tr + tf + tIr + tIf)  
tr = (VIN/1.2)ns  
tf = (VIN/1.7)ns  
tIr = tIf = (IOUT/0.05)ns  
f = Switch frequency  
Example: with VIN = 40V, VOUT = 5V and IOUT = 1A:  
THERMAL CALCULATIONS  
0.3 1 2 5  
(
)( ) ( )  
PSW  
=
+ 97•109 1/2 1 40 200 •103  
(
)
)
( )( )  
(
(
)
Power dissipation in the LT1766 chip comes from four  
sources: switch DC loss, switch AC loss, boost circuit  
current,andinputquiescentcurrent.Thefollowingformu-  
las show how to calculate each of these losses. These  
formulas assume continuous mode operation, so they  
should not be used for calculating efficiency at light load  
currents.  
40  
= 0.04 + 0.388 = 0.43W  
2
5 1/36  
( )  
(
)
PBOOST  
=
= 0.02W  
40  
PQ = 40(0.0015)+ 5(0.003) = 0.08W  
Switch loss:  
Total power dissipation in the IC is given by:  
PTOT = PSW + PBOOST + PQ  
2
RSW IOUT VOUT  
(
) (  
)
PSW  
=
+ tEFF(1/2) IOUT  
V
f
= 0.43W + 0.02W + 0.08W = 0.53W  
(
)( IN)( )  
V
IN  
1766fa  
18  
LT1766/LT1766-5  
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U
Thermal resistance for the LT1766 packages is influenced  
Die temperature can peak for certain combinations of VIN,  
VOUT and load current. While higher VIN gives greater  
switch AC losses, quiescent and catch diode losses, a  
lower VIN may generate greater losses due to switch DC  
losses. In general, the maximum and minimum VIN levels  
should be checked with maximum typical load current for  
calculation of the LT1766 die temperature. If a more  
accurate die temperature is required, a measurement of  
the SYNC pin resistance (to GND) can be used. The SYNC  
pin resistance can be measured by forcing a voltage no  
greaterthan0.5Vatthepinandmonitoringthepincurrent  
over temperature in an oven. This should be done with  
minimal device power (low VIN and no switching  
(VC = 0V)) in order to calibrate SYNC pin resistance with  
ambient (oven) temperature.  
by the presence of internal or backside planes.  
SSOP (GN16) Package: With a full plane under the GN16  
package, thermal resistance will be about 85°C/W.  
TSSOP(ExposedPad)Package:Withafullplaneunderthe  
TSSOPpackage, thermalresistancewillbeabout45°C/W.  
To calculate die temperature, use the proper thermal  
resistance number for the desired package and add in  
worst-case ambient temperature:  
TJ = TA + (θJA • PTOT  
)
When estimating ambient, remember the nearby catch  
diode and inductor will also be dissipating power:  
(V )(V VOUT)(ILOAD  
)
F
IN  
Note: Some of the internal power dissipation in the IC, due  
to BOOST pin voltage, can be transferred outside of the IC  
to reduce junction temperature, by increasing the voltage  
drop in the path of the boost diode D2 (see Figure 9). This  
reduction of junction temperature inside the IC will allow  
higher ambient temperature operation for a given set of  
conditions. BOOST pin circuitry dissipates power given  
by:  
PDIODE  
=
V
IN  
VF = Forward voltage of diode (assume 0.63V at 1A)  
(0.63)(40 – 5)(1)  
40  
PINDUCTOR = (ILOAD)2 (RL)  
PDIODE  
=
= 0.55W  
RL = Inductor DC resistance (assume 0.1)  
PINDUCTOR (1)2 (0.1) = 0.1W  
VOUT • (ISW / 36) • VC2  
PDISS(BOOST)  
=
V
IN  
Only a portion of the temperature rise in the external  
inductoranddiodeiscoupledtothejunctionoftheLT1766.  
Based on empirical measurements the thermal effect on  
LT1766 junction temperature due to power dissipation in  
the external inductor and catch diode can be calculated as:  
Typically VC2 (the boost voltage across the capacitor C2)  
equals Vout. This is because diodes D1 and D2 can be  
considered almost equal, where:  
VC2 = VOUT – VFD2 – (–VFD1) = VOUT  
TJ(LT1766) (PDIODE + PINDUCTOR)(10°C/W)  
Hencetheequationusedforboostcircuitrypowerdissipa-  
tion given in the previous Thermal Calculations section is  
stated as:  
Using the example calculations for LT1766 dissipation,  
the LT1766 die temperature will be estimated as:  
TJ = TA + (θJA • PTOT) + [10 • (PDIODE + PINDUCTOR)]  
VOUT (ISW /36)VOUT  
PDISS(BOOST)  
=
With the GN16 package (θJA = 85°C/W), at an ambient  
temperature of 60°C:  
V
IN  
Here it can be seen that boost power dissipation increases  
as the square of VOUT. It is possible, however, to reduce  
VC2 below VOUT to save power dissipation by increasing  
the voltage drop in the path of D2. Care should be taken  
that VC2 does not fall below the minimum 3.3V boost  
TJ = 60 + (85 • 0.53) + (10 • 0.65) = 112°C  
With the TSSOP package (θJA = 45°C/W), at an ambient  
temperature of 60°C:  
TJ = 60 + (45 • 0.53) + (10 • 0.65) = 90°C  
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APPLICATIO S I FOR ATIO  
For an FE package with thermal resistance of 45°C/W,  
ambient temperature savings would be, T(ambient) sav-  
ings = 0.116W • 45°C/W = 5c. For a GN Package with  
thermal resistance of 85°C/W, ambient temperature sav-  
ings would be T/(ambient) savings = 0.116 • 85°C/W =  
10c. The 7V zener should be sized for excess of 0.116W  
operation. The tolerances of the zener should be consid-  
voltage required for full saturation of the internal power  
switch.Foroutputvoltagesof5V,VC2 isapproximately5V.  
During switch turn on, VC2 will fall as the boost capacitor  
C2 is dicharged by the boost pin. In the previous Boost Pin  
section, the value of C2 was designed for a 0.7V droop in  
VC2 = VDROOP. Hence, an output voltage as low as 4V  
would still allow the minimum 3.3V for the boost function  
usingtheC2capacitorcalculated.Ifatargetoutputvoltage  
of 12V is required, however, an excess of 8V is placed  
across the boost capacitor which is not required for the  
boost function but still dissipates additional power.  
ered to ensure minimum VC2 exceeds 3.3V + VDROOP  
.
Input Voltage vs Operating Frequency Considerations  
TheabsolutemaximuminputsupplyvoltagefortheLT1766  
is specified at 60V. This is based solely on internal semi-  
conductor junction breakdown effects. Due to internal  
power dissipation, the actual maximum VIN achievable in  
a particular application may be less than this.  
What is required is a voltage drop in the path of D2 to  
achieve minimal power dissipation while still maintaining  
minimum boost voltage across C2. A zener, D4, placed in  
series with D2 (see Figure 9), drops voltage to C2.  
A detailed theoretical basis for estimating internal power  
loss is given in the section, Thermal Considerations. Note  
that AC switching loss is proportional to both operating  
frequency and output current. The majority of AC switch-  
ing loss is also proportional to the square of input voltage.  
Example:theBOOSTpinpowerdissipationfora20Vinput  
to 12V output conversion at 1A is given by:  
D2  
D4  
For example, while the combination of VIN = 40V, VOUT  
=
D2  
5V at 1A and fOSC = 200kHz may be easily achievable,  
simultaneously raising VIN to 60V and fOSC to 700kHz is  
not possible. Nevertheless, input voltage transients up to  
60V can usually be accommodated, assuming the result-  
ing increase in internal dissipation is of insufficient time  
duration to raise die temperature significantly.  
C2  
D1  
BOOST  
LT1766  
L1  
V
V
V
SW  
IN  
OUT  
IN  
C3  
SHDN  
BIAS  
FB  
R1  
+
A second consideration is controllability. A potential limi-  
SYNC  
GND  
C1  
R2  
V
C
tation occurs with a high step-down ratio of VIN to VOUT  
,
asthisrequiresacorrespondinglynarrowminimumswitch  
on time. An approximate expression for this (assuming  
continuous mode operation) is given as follows:  
C
F
R
C
C
C
V
OUT + VF  
Min tON  
=
1766 F09  
VIN (fOSC  
)
Figure 9. Boost Pin, Diode Selection  
where:  
12(1/36)•12  
PBOOST  
=
= 0.2W  
VIN = input voltage  
20  
VOUT = output voltage  
VF = Schottky diode forward drop  
fOSC = switching frequency  
If a 7V zener D4 is placed in series with D2, then power  
dissipation becomes :  
A potential controllability problem arises if the LT1766 is  
called upon to produce an on time shorter than it is able to  
12(1/36)•5  
PBOOST  
=
= 0.084W  
20  
produce. Feedback loop action will lower then reduce the  
1766fa  
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LT1766/LT1766-5  
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VC control voltage to the point where some sort of cycle-  
LT1766  
skipping or odd/even cycle behavior is exhibited.  
CURRENT MODE  
POWER STAGE  
V
SW  
OUTPUT  
ERROR  
g
m
= 2mho  
In summary:  
AMPLIFIER  
C
FB  
R1  
FB  
CERAMIC  
ESL  
TANTALUM  
ESR  
1. Be aware that the simultaneous requirements of high  
VIN, high IOUT and high fOSC may not be achievable in  
practice due to internal dissipation. The Thermal Con-  
siderations section offers a basis to estimate internal  
power.Inquestionablecasesaprototypesupplyshould  
be built and exercised to verify acceptable operation.  
g
=
m
2000µmho  
+
R
1.22V  
O
200k  
+
R
LOAD  
C1  
C1  
GND  
V
C
R2  
R
C
C
F
C
C
1766 F10  
2. The simultaneous requirements of high VIN, low VOUT  
and high fOSC can result in an unacceptably short  
minimum switch on time. Cycle skipping and/or odd/  
even cycle behavior will result although correct output  
voltage is usually maintained.  
Figure 10. Model for Loop Response  
80  
180  
150  
120  
90  
60  
GAIN  
FREQUENCY COMPENSATION  
40  
20  
Before starting on the theoretical analysis of frequency  
response,thefollowingshouldberemembered—theworse  
the board layout, the more difficult the circuit will be to  
stabilize. This is true of almost all high frequency analog  
circuits, read the Layout Considerations section first.  
Common layout errors that appear as stability problems  
are distant placement of input decoupling capacitor and/  
or catch diode, and connecting the VC compensation to a  
ground track carrying significant switch current. In addi-  
tion, the theoretical analysis considers only first order  
non-ideal component behavior. For these reasons, it is  
important that a final stability check is made with produc-  
tion layout and components.  
PHASE  
0
60  
–20  
–40  
30  
0
10  
100  
1k  
10k  
100k  
1M  
FREQUENCY (Hz)  
R
1766 F11  
V
= 42V  
= 5V  
= 500mA  
= 100µF, 10V, 0.1Ω  
= 2.2k  
= 22nF  
= 220pF  
IN  
OUT  
LOAD  
OUT  
C
C
F
V
I
C
C
C
Figure 11. Overall Loop Response  
ity. This ESR, however, contributes significantly to the  
ripple voltage at the output (see Output Ripple Voltage in  
the Applications Section). It is possible to reduce capaci-  
torsizeandoutputripplevoltagebyreplacingthetantalum  
output capacitor with a ceramic output capacitor because  
of its very low ESR. The zero provided by the tantalum  
output capacitor must now be reinserted back into the  
loop. Alternatively there may be cases where, even with  
the tantalum output capacitor, an additional zero is re-  
quired in the loop to increase phase margin for improved  
transient response.  
The LT1766 uses current mode control. This alleviates  
many of the phase shift problems associated with the  
inductor. The basic regulator loop is shown in Figure 10.  
The LT1766 can be considered as two gm blocks, the error  
amplifier and the power stage.  
Figure 11 shows the overall loop response. At the VC pin,  
the frequency compensation components used are:  
RC = 2.2k, CC = 0.022µF and CF = 220pF. The output  
capacitor used is a 100µF, 10V tantalum capacitor with  
typical ESR of 100m.  
A zero can be added into the loop by placing a resistor, RC,  
at the VC pin in series with the compensation capacitor, CC  
or by placing a capacitor, CFB, between the output and the  
FB pin.  
TheESRofthetantalumoutputcapacitorprovidesauseful  
zerointheloopfrequencyresponseformaintainingstabil-  
1766fa  
21  
LT1766/LT1766-5  
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APPLICATIO S I FOR ATIO  
When using RC, the maximum value has two limitations.  
First, thecombinationofoutputcapacitorESRandRC may  
stopthelooprollingoffaltogether. Second, iftheloopgain  
is not rolled off sufficiently at the switching frequency,  
output ripple will peturb the VC pin enough to cause  
unstable duty cycle switching similar to subharmonic  
oscillations. If needed, an additional capacitor CF can be  
addedacrosstheRC/CC networkfromtheVC pintoground  
to further suppress VC ripple voltage.  
CONVERTER WITH BACKUP OUTPUT REGULATOR  
In systems with a primary and backup supply, for ex-  
ample, a battery powered device with a wall adapter input,  
the output of the LT1766 can be held up by the backup  
supply with the LT1766 input disconnected. In this condi-  
tion, the SW pin will source current into the VIN pin. If the  
SHDN pin is held at ground, only the shut down current of  
25µAwillbepulledviatheSWpinfromthesecondsupply.  
With the SHDN pin floating, the LT1766 will consume its  
quiescentoperatingcurrentof1.5mA. TheVIN pinwillalso  
source current to any other components connected to the  
input line. If this load is greater than 10mA or the input  
could be shorted to ground, a series Schottky diode must  
be added, as shown in Figure 12. With these safeguards,  
the output can be held at voltages up to the VIN absolute  
maximum rating.  
With a tantalum output capacitor, the LT1766 already  
includesaresistor,RC andfiltercapacitor,CF,attheVC pin  
(see Figures 10 and 11) to compensate the loop over the  
entire VIN range (to allow for stable pulse skipping for high  
VIN-to-VOUT ratios 10). A ceramic output capacitor can  
stillbeusedwithasimpleadjustmenttotheresistorRC for  
stable operation. (See Ceramic Capacitors section for  
stabilizingLT1766).Ifadditionalphasemarginisrequired,  
a capacitor, CFB, can be inserted between the output and  
FB pin but care must be taken for high output voltage  
applications. Sudden shorts to the output can create  
unacceptably large negative transients on the FB pin.  
BUCK CONVERTER WITH ADJUSTABLE SOFT-START  
Large capacitive loads or high input voltages can cause  
high input currents at start-up. Figure 13 shows a circuit  
that limits the dv/dt of the output at start-up, controlling  
the capacitor charge rate. The buck converter is a typical  
configuration with the addition of R3, R4, CSS and Q1.  
As the output starts to rise, Q1 turns on, regulating switch  
current via the VC pin to maintain a constant dv/dt at the  
output. Output rise time is controlled by the current  
through CSS defined by R4 and Q1’s VBE. Once the output  
is in regulation, Q1 turns off and the circuit operates  
normally. R3 is transient protection for the base of Q1.  
For VIN-to-VOUT ratios <10, higher loop bandwidths are  
possiblebyreadjustingthefrequencycompensationcom-  
ponents at the VC pin.  
When checking loop stability, the circuit should be oper-  
ated over the applications’s full voltage, current and tem-  
perature range. Proper loop compensation may be ob-  
tained by emperical methods as described in detail in  
Application Notes 19 and 76.  
D2  
1N4148W  
C2  
0.33µF  
D3  
L1  
47µH  
10MQ060N  
BOOST  
REMOVABLE  
INPUT  
V
LT1766 SW  
IN  
5V, 1A  
R3  
ALTERNATE  
SUPPLY  
BIAS  
54k  
R1  
SHDN  
SYNC  
15.4k  
FB  
+
C1  
100µF  
10V  
R2  
4.99k  
GND  
V
C
D1  
10MQ060N  
R4  
25k  
R
C
2.2k  
C3  
2.2µF  
C
F
220pF  
C
C
0.022µF  
1766 F12  
Figure 12. Dual Source Supply with 25µA Reverse Leakage  
1766fa  
22  
LT1766/LT1766-5  
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APPLICATIO S I FOR ATIO  
U
At switch off, energy is transferred by magnetic coupling  
into L1B, powering the 5V rail. C4 pulls L1B positive  
duringswitchontime, causingcurrenttoflow, andenergy  
to build in L1B and C4. At switch off, the energy stored in  
both L1B and C4 supply the –5V rail. This reduces the  
current in L1A and changes L1B current waveform from  
square to triangular. For details on this circuit, including  
maximum output currents, see Design Note 100.  
R4 CSS VOUT  
( )( )(  
)
RiseTime =  
VBE  
Using the values shown in Figure 10,  
47 •103 1510–9  
5
( )  
(
)(  
)
Rise Time =  
= 5ms  
0.7  
The ramp is linear and rise times in the order of 100ms are  
possible. Since the circuit is voltage controlled, the ramp  
rate is unaffected by load characteristics and maximum  
outputcurrentisunchanged. Variantsofthiscircuitcanbe  
used for sequencing multiple regulator outputs.  
D2  
1N4148W  
C2  
0.33µF  
L1A*  
50µH  
BOOST  
LT1766  
V
OUT1  
V
IN  
5V  
7.5V  
V
SW  
IN  
(SEE DN100  
FOR MAX I  
TO 60V  
)
OUT  
R1  
SHDN  
SYNC  
GND  
C1  
D2  
15.4k  
C3  
2.2µF  
100V  
CER  
+
100µF  
10V  
1N4148W  
FB  
OUTPUT  
R2  
5V  
V
TANT  
INPUT  
40V  
C
C2  
0.33µF  
4.99k  
1A  
L1  
47µH  
D1  
C
F
BOOST  
BIAS  
SW  
R
C
220pF  
2.2k  
V
IN  
C3  
C
C
+
C1  
100µF  
R1  
D1  
2.2µF  
50V  
CER  
0.022µF  
LT1766  
15.4k  
GND  
C4  
C5  
+
+
SHDN  
SYNC GND  
FB  
C
100µF  
100µF  
10V  
L1B*  
D3  
R2  
4.99k  
10V  
TANT  
V
TANT  
V
OUT2  
C
SS  
15nF  
–5V†  
C
F
* L1 IS A SINGLE CORE WITH TWO WINDINGS  
COILTRONICS #CTX50-3A  
1766 F14  
R3  
2k  
Q1  
220pF  
R
C
IF LOAD CAN GO TO ZERO, AN OPTIONAL  
2.2k  
1766 F13  
PRELOAD OF 1k TO 5k MAY BE USED TO  
IMPROVE LOAD REGULATION  
D1, D3: 10MQ060N  
C
C
R4  
47k  
0.022µF  
Figure 14. Dual Output SEPIC Converter  
Figure 13. Buck Converter with Adjustable Soft-Start  
DUAL OUTPUT SEPIC CONVERTER  
POSITIVE-TO-NEGATIVE CONVERTER  
The circuit in Figure 14 generates both positive and  
negative 5V outputs with a single piece of magnetics. The  
two inductors shown are actually just two windings on a  
standard Coiltronics inductor. The topology for the 5V  
output is a standard buck converter. The 5V topology  
would be a simple flyback winding coupled to the buck  
converter if C4 were not present. C4 creates a SEPIC  
(single-ended primary inductance converter) topology  
which improves regulation and reduces ripple current in  
L1. Without C4, the voltage swing on L1B compared to  
L1A would vary due to relative loading and coupling  
losses. C4 provides a low impedance path to maintain an  
equal voltage swing in L1B, improving regulation. In a  
flybackconverter,duringswitchontime,alltheconverter’s  
energyisstoredinL1Aonly, sincenocurrentflowsinL1B.  
The circuit in Figure 15 is a positive-to-negative topology  
using a grounded inductor. It differs from the standard  
approach in the way the IC chip derives its feedback signal  
because the LT1766 accepts only positive feedback sig-  
nals. Thegroundpinmustbetiedtotheregulatednegative  
output. A resistor divider to the FB pin then provides the  
proper feedback voltage for the chip.  
Thefollowingequationcanbeusedtocalculatemaximum  
load current for the positive-to-negative converter:  
(V )(VOUT  
)
IN  
IP –  
(VOUT)(V – 0.3)  
IN  
2(VOUT + V )(f)(L)  
IN  
IMAX  
=
(VOUT + V – 0.3)(VOUT + V )  
IN  
F
1766fa  
23  
LT1766/LT1766-5  
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APPLICATIO S I FOR ATIO  
Output current where continuous mode is needed:  
IP = Maximum rated switch current  
VIN = Minimum input voltage  
VOUT = Output voltage  
VF = Catch diode forward voltage  
0.3 = Switch voltage drop at 1.5A  
(V )2(IP)2  
IN  
ICONT  
>
4(V + VOUT)(V + VOUT + V )  
IN  
IN  
F
Minimum inductor discontinuous mode:  
Example: with VIN(MIN) = 5.5V, VOUT = 12V, L = 18µH,  
VF = 0.63V, IP = 1.5A: IMAX = 0.280A.  
2(VOUT)(IOUT  
(f)(IP)2  
)
LMIN  
=
OUTPUT DIVIDER  
Minimum inductor continuous mode:  
Refer to Applications Information Feedback Pin Functions  
to calculate R1 and R2 for the (negative) output voltage  
(V )(VOUT  
IN  
)
LMIN  
=
(from Table 1).  
(VOUT + V )  
F
D2  
1N4148W  
2(f)(V + VOUT) IP IOUT 1+  
IN  
V
IN  
C2  
L1*  
0.33µF  
18µH  
INPUT  
BOOST  
LT1766  
For a 40V to –12V converter using the LT1766 with peak  
switch current of 1.5A and a catch diode of 0.63V:  
V
5.5V TO  
48V  
V
SW  
FB  
IN  
R1  
44.2k  
(40)2(1.5)2  
4(40 +12)(40 +12 + 0.63)  
GND  
V
C
C1  
C3  
+
D1  
100µF  
25V  
2.2µF  
100V  
CER  
ICONT  
>
= 0.573A  
10MQO60N  
C
C
C
TANT  
R2  
4.99k  
C
R
F
OUTPUT**  
–12V, 0.25A  
For a load current of 0.25A, this says that discontinuous  
mode can be used and the minimum inductor needed is  
found from:  
1766 F15  
* INCREASE L1 TO 30µH OR 60µH FOR HIGHER CURRENT APPLICATIONS.  
SEE APPLICATIONS INFORMATION  
** MAXIMUM LOAD CURRENT DEPENDS ON MINIMUM INPUT VOLTAGE  
AND INDUCTOR SIZE. SEE APPLICATIONS INFORMATION  
FOR V > 44V AND V  
= –12V, ADDITIONAL VOLTAGE DROP IN THE  
IN  
OUT  
2(12)(0.25)  
(200 103)(1.5)2  
PATH OF D2 IS REQUIRED TO ENSURE BOOST PIN MAXIMUM RATING IS  
LMIN  
=
= 13.3µH  
NOT EXCEEDED. SEE APPLICATIONS INFORMATION (BOOST PIN VOLTAGE)  
Figure 15. Positive-to-Negative Converter  
In practice, the inductor should be increased by about  
30% over the calculated minimum to handle losses and  
variations in value. This suggests a minimum inductor of  
18µH for this application.  
Inductor Value  
The criteria for choosing the inductor is typically based on  
ensuring that peak switch current rating is not exceeded.  
This gives the lowest value of inductance that can be used,  
but in some cases (lower output load currents) it may give  
a value that creates unnecessarily high output ripple  
voltage.  
Ripple Current in the Input and Output Capacitors  
Positive-to-negativeconvertershavehighripplecurrentin  
the input capacitor. For long capacitor lifetime, the RMS  
value of this current must be less than the high frequency  
ripple current rating of the capacitor. The following for-  
mula will give an approximate value for RMS ripple cur-  
rent. This formula assumes continuous mode and large  
inductor value. Small inductors will give somewhat higher  
ripple current, especially in discontinuous mode. The  
exactformulasareverycomplexandappearinApplication  
Note 44, pages 29 and 30. For our purposes here a fudge  
The difficulty in calculating the minimum inductor size  
needed is that you must first decide whether the switcher  
will be in continuous or discontinuous mode at the critical  
point where switch current reaches 1.5A. The first step is  
to use the following formula to calculate the load current  
above which the switcher must use continuous mode. If  
your load current is less than this, use the discontinuous  
mode formula to calculate minimum inductor needed. If  
load current is higher, use the continuous mode formula.  
factor (ff) is used. The value for ff is about 1.2 for higher  
1766fa  
24  
LT1766/LT1766-5  
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APPLICATIO S I FOR ATIO  
U
load currents and L 15µH. It increases to about 2.0 for  
Keep in mind that during start-up and output overloads,  
average diode current may be much higher than with  
normalloads.Careshouldbeusedifdiodesratedlessthan  
1A are used, especially if continuous overload conditions  
must be tolerated.  
smaller inductors at lower load currents.  
VOUT  
V
IN  
Input Capacitor IRMS = (ff)(IOUT  
)
ff = 1.2 to 2.0  
BOOST Pin Voltage  
The output capacitor ripple current for the positive-to-  
negative converter is similar to that for a typical buck  
regulator—it is a triangular waveform with peak-to-peak  
value equal to the peak-to-peak triangular waveform of the  
inductor. The low output ripple design in Figure 15 places  
the input capacitor between VIN and the regulated negative  
output. This placement of the input capacitor significantly  
reduces the size required for the output capacitor (versus  
placing the input capacitor between VIN and ground).  
To ensure that the BOOST pin voltage does not exceed its  
absolute maximum rating of 68V with respect to device  
GND pin voltage, care should be taken in the generation of  
boost voltage. For the conventional method of generating  
boostvoltage, showninFigure1, thevoltageattheBOOST  
pin during switch on time is approximately given by:  
V
BOOST (GND pin) = (VIN – VGNDPIN) + VC2  
where:  
VC2 = (D2+) – VD2 – (D1+) + VD1  
The peak-to-peak ripple current in both the inductor and  
output capacitor (assuming continuous mode) is:  
= voltage across the “boost” capacitor  
For the positive-to-negative converter shown in Figure 15,  
theconventionalBuckoutputnodeisgrounded(D2+)=0V  
and the catch diode (D1+) is connected to the negative  
output = VOUT = –12V. Absolute maximum ratings should  
also be observed with the GND pin now at –12V. It can be  
seen that for VD1 = VD2:  
DC • V  
IN  
IP-P  
=
f L  
V
OUT + V  
F
DC = Duty Cycle =  
V
OUT + V + V  
IN F  
IP-P  
ICOUT (RMS) =  
12  
VC2 = (D2+) – (D1+) = |VOUT| = 12V  
The maximum VIN voltage allowed for the device (GND pin  
at –12V) is 48V.  
The output ripple voltage for this configuration is as low as  
the typical buck regulator based predominantly on the  
inductor’s triangular peak-to-peak ripple current and the  
ESR of the chosen capacitor (see Output Ripple Voltage in  
Applications Information).  
The maximum VIN voltage allowed without exceeding the  
BOOST pin voltage absolute maximum rating is given by:  
V
IN(MAX) = Boost (Max) + (VGNDPIN) – VC2  
Diode Current  
VIN(MAX) = 68 + (–12) – 12 = 44V  
Average diode current is equal to load current. Peak diode  
current will be considerably higher.  
To increase usable VIN voltage, VC2 must be reduced. This  
can be achieved by placing a zener diode VZ1 (anode at  
C2+) in series with D2.  
Peak diode current:  
Note: A maximum limit on VZ1 must be observed to  
ensure a minimum VC2 is maintained on the “boost”  
capacitor; referred to as “VBOOST(MIN)” in the Electrical  
Characteristics.  
ContinuousMode =  
(V + VOUT  
)
(V )(VOUT)  
IN  
IN  
IOUT  
+
V
IN  
2(L)(f)(V + VOUT)  
IN  
2(IOUT)(VOUT  
(L)(f)  
)
DiscontinuousMode =  
1766fa  
25  
LT1766/LT1766-5  
U
PACKAGE DESCRIPTIO  
FE Package  
16-Lead Plastic TSSOP (4.4mm)  
(Reference LTC DWG # 05-08-1663,  
Exposed Pad Variation BB)  
4.90 – 5.10*  
(.193 – .201)  
3.58  
(.141)  
3.58  
(.141)  
16 1514 13 12 1110  
9
6.60 ±0.10  
4.50 ±0.10  
2.94  
(.116)  
SEE NOTE 4  
2.94  
(.116)  
6.40  
BSC  
0.45 ±0.05  
1.05 ±0.10  
0.65 BSC  
5
7
8
1
2
3
4
6
RECOMMENDED SOLDER PAD LAYOUT  
1.10  
(.0433)  
MAX  
4.30 – 4.50*  
(.169 – .177)  
0° – 8°  
0.65  
(.0256)  
BSC  
0.45 – 0.75  
0.09 – 0.20  
0.05 – 0.15  
(.018 – .030)  
(.0036 – .0079)  
(.002 – .006)  
0.195 – 0.30  
(.0077 – .0118)  
FE16 (BB) TSSOP 0203  
NOTE:  
1. CONTROLLING DIMENSION: MILLIMETERS 4. RECOMMENDED MINIMUM PCB METAL SIZE  
FOR EXPOSED PAD ATTACHMENT  
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.150mm (.006") PER SIDE  
MILLIMETERS  
(INCHES)  
2. DIMENSIONS ARE IN  
3. DRAWING NOT TO SCALE  
1766fa  
26  
LT1766/LT1766-5  
U
PACKAGE DESCRIPTIO  
GN Package  
16-Lead Plastic SSOP (Narrow .150 Inch)  
(Reference LTC DWG # 05-08-1641)  
.189 – .196*  
(4.801 – 4.978)  
.045 ±.005  
.009  
(0.229)  
REF  
16 15 14 13 12 11 10 9  
.254 MIN  
.150 – .165  
.229 – .244  
.150 – .157**  
(5.817 – 6.198)  
(3.810 – 3.988)  
.0165 ±.0015  
.0250 TYP  
RECOMMENDED SOLDER PAD LAYOUT  
1
2
3
4
5
6
7
8
.015 ± .004  
(0.38 ± 0.10)  
× 45°  
.053 – .068  
(1.351 – 1.727)  
.004 – .0098  
(0.102 – 0.249)  
.007 – .0098  
(0.178 – 0.249)  
0° – 8° TYP  
.016 – .050  
(0.406 – 1.270)  
.0250  
(0.635)  
BSC  
.008 – .012  
(0.203 – 0.305)  
NOTE:  
1. CONTROLLING DIMENSION: INCHES  
INCHES  
2. DIMENSIONS ARE IN  
(MILLIMETERS)  
GN16 (SSOP) 0502  
3. DRAWING NOT TO SCALE  
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE  
1766fa  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
27  
LT1766/LT1766-5  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
V : 7.3V to 45V/64V, V  
LT1074/LT1074HV  
4.4A (I ), 100kHz, High Efficiency Step-Down DC/DC Converters  
: 2.21V, I : 8.5mA,  
Q
OUT  
IN  
OUT(MIN)  
: 10µA, DD-5/7, TO220-5/7  
I
SD  
LT1076/LT1076HV  
LT1616  
1.6A (I ), 100kHz, High Efficiency Step-Down DC/DC Converters  
V : 7.3V to 45V/64V, V  
: 2.21V, I : 8.5mA,  
Q
OUT  
IN  
OUT(MIN)  
I
: 10µA, DD-5/7, TO220-5/7  
SD  
500mA (I ), 1.4MHz, High Efficiency  
V : 3.6V to 25V, V  
: 1.25V, I : 1.9mA,  
Q
OUT  
IN  
OUT(MIN)  
Step-Down DC/DC Converter  
I
: <1µA, ThinSOT™  
SD  
LT1676  
60V, 440mA (I ), 100kHz, High Efficiency  
Step-Down DC/DC Converter  
V : 7.4V to 60V, V  
I : 2.5µA, S8  
SD  
: 1.24V, I : 3.2mA,  
OUT(MIN) Q  
OUT  
IN  
LT1765  
25V, 2.75A (I ), 1.25MHz, High Efficiency  
Step-Down DC/DC Converter  
V : 3V to 25V, V  
I : 15µA, S8, TSSOP16E  
SD  
: 1.20V, I : 1mA,  
OUT  
IN  
OUT(MIN) Q  
LT1766  
60V, 1.2A (I ), 200kHz, High Efficiency  
Step-Down DC/DC Converter  
V : 5.5V to 60V, V  
I : 25µA, TSSOP16/E  
SD  
: 1.20V, I : 2.5mA,  
OUT  
IN  
OUT(MIN) Q  
LT1767  
25V, 1.2A (I ), 1.25MHz, High Efficiency  
Step-Down DC/DC Converter  
V : 3V to 25V, V  
I : 6µA, MS8/E  
SD  
: 1.20V, I : 1mA,  
OUT(MIN) Q  
OUT  
IN  
LT1776  
40V, 550mA (I ), 200kHz, High Efficiency  
Step-Down DC/DC Converter  
V : 7.4V to 40V, V  
I : 30µA, N8,S8  
SD  
: 1.24V, I : 3.2mA,  
OUT(MIN) Q  
OUT  
IN  
LT1940  
Dual Output 1.4A (I ) Constant 1.1MHz, High Efficiency  
Step-Down DC/DC Converter  
V : 3V to 25V, V  
I : <1µA, TSSOP-16E  
SD  
: 1.20V, I : 2.5mA,  
OUT ,  
IN  
OUT(MIN) Q  
LT1956  
60V, 1.2A (I ), 500kHz, High Efficiency  
Step-Down DC/DC Converter  
V : 5.5V to 60V, V  
: 1.20V, I : 2.5mA,  
Q
OUT  
IN  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
I
: 25µA, TSSOP16/E  
SD  
LT1976  
60V, 1.2A (I ), 200kHz, Micropower (I = 100µA), High Efficiency  
V : 3.3V to 60V, V  
: 1.20V, I : 100µA,  
Q
OUT  
Q
IN  
Step-Down DC/DC Converter  
I
: <1µA, TSSOP16/E  
SD  
LT3010  
80V, 50mA, Low Noise Linear Regulator  
V : 1.5V to 80V, V  
IN  
: 1.28V, I : 30µA,  
Q
I
: <1µA, MS8E  
SD  
LTC3412  
LTC3414  
LT3430/LT3431  
LT3433  
2.5A (I ), 4MHz, Synchronous Step-Down DC/DC Converter  
V : 2.5V to 5.5V, V  
: 0.8V, I : 60µA,  
Q
OUT  
IN  
OUT(MIN)  
I
: <1µA, TSSOP16E  
SD  
4A (I ), 4MHz, Synchronous Step-Down DC/DC Converter  
V : 2.3V to 5.5V, V  
: 0.8V, I : 64µA,  
Q
OUT  
IN  
OUT(MIN)  
I
: <1µA, TSSOP20E  
SD  
60V, 2.75A (I ), 200kHz/500kHz, High Efficiency  
V : 5.5V to 60V, V  
: 1.20V, I : 2.5mA,  
OUT  
IN  
OUT(MIN) Q  
Step-Down DC/DC Converters  
I : 30µA, TSSOP16E  
SD  
High Voltage, Micropower (I = 100µA), Buck-Boost DC/DC Converter  
V : 4V to 60V, I : 100µA, 500mA Switch Current,  
Q
IN  
Q
TSSOP16E  
LTC3727/LTC3727-1  
36V, 500kHz, High Efficiency Step-Down DC/DC Controllers  
V : 4V to 36V, V  
: 0.8V, I : 670µA,  
IN  
OUT(MIN) Q  
I
: 20µA, QFN-32, SSOP-28  
SD  
ThinSOT is a trademark of Linear Technology Corporation.  
1766fa  
LT/TP 0903 1K • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
28  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
LINEAR TECHNOLOGY CORPORATION 2001  
This datasheet has been download from:  
www.datasheetcatalog.com  
Datasheets for electronics components.  

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