LT3407IMSE-2#TRPBF [Linear]

Dual Switching Controller, Current-mode, 1.6A, 2700kHz Switching Freq-Max, PDSO10;
LT3407IMSE-2#TRPBF
型号: LT3407IMSE-2#TRPBF
厂家: Linear    Linear
描述:

Dual Switching Controller, Current-mode, 1.6A, 2700kHz Switching Freq-Max, PDSO10

开关 光电二极管
文件: 总16页 (文件大小:221K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC3407-2  
Dual Synchronous, 800mA,  
2.25MHz Step-Down  
DC/DC Regulator  
U
DESCRIPTIO  
FEATURES  
The LTC®3407-2 is a dual, constant frequency, synchro-  
nous step down DC/DC converter. Intended for low power  
applications, it operates from 2.5V to 5.5V input voltage  
range and has a constant 2.25MHz switching frequency,  
allowing the use of tiny, low cost capacitors and inductors  
with a profile 1.2mm. Each output voltage is adjustable  
from 0.6V to 5V. Internal synchronous 0.35Ω, 1.2A power  
switches provide high efficiency without the need for  
external Schottky diodes.  
High Efficiency: Up to 95%  
Very Low Quiescent Current: Only 40μA  
2.25MHz Constant Frequency Operation  
High Switch Current: 1.2A on Each Channel  
No Schottky Diodes Required  
Low RDS(ON) Internal Switches: 0.35Ω  
Current Mode Operation for Excellent Line  
and Load Transient Response  
Short-Circuit Protected  
Low Dropout Operation: 100% Duty Cycle  
Ultralow Shutdown Current: IQ < 1μA  
Output Voltages from 5V down to 0.6V  
Power-On Reset Output  
Externally Synchronizable Oscillator  
A user selectable mode input is provided to allow the user  
to trade-off noise ripple for low power efficiency. Burst  
Mode® operation provides high efficiency at light loads,  
while Pulse Skip Mode provides low noise ripple at light  
loads.  
Small Thermally Enhanced MSOP and 3mm × 3mm  
To further maximize battery life, the P-channel MOSFETs  
are turned on continuously in dropout (100% duty cycle),  
and both channels draw a total quiescent current of only  
40μA. In shutdown, the device draws <1μA.  
DFN Packages  
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APPLICATIO S  
PDAs/Palmtop PCs  
, LT, LTC, LTM, and Burst Mode are registered trademarks of Linear Technology  
Corporation. All other trademarks are the property of their respective owners.  
Digital Cameras  
Cellular Phones  
Portable Media Players  
PC Cards  
Wireless and DSL Modems  
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TYPICAL APPLICATIO  
V
= 2.5V*  
TO 5.5V  
LTC3407-2 Efficiency Curve  
IN  
R5  
100  
C1  
100k  
10μF  
RUN2  
V
RUN1  
POR  
IN  
95  
90  
85  
80  
75  
70  
65  
60  
2.5V  
MODE/SYNC  
RESET  
1.8V  
LTC3407-2  
L2  
L1  
2.2μH  
2.2μH  
V
= 2.5V  
OUT2  
AT 800mA  
V
= 1.8V  
OUT1  
SW2  
SW1  
AT 800mA  
C5, 22pF  
C4, 22pF  
V
V
FB1  
FB2  
R4  
887k  
R2  
604k  
GND  
C3  
10μF  
C2  
10μF  
V
= 3.3V  
R3  
280k  
R1  
301k  
IN  
Burst Mode OPERATION  
NO LOAD ON OTHER CHANNEL  
1
10  
100  
1000  
3407 TA01  
C1, C2, C3: TAIYO YUDEN JMK316BJ106ML  
L1, L2: MURATA LQH32CN2R2M33  
LOAD CURRENT (mA)  
*V CONNECTED TO V FOR V 2.8V  
OUT  
IN IN  
3407 TA02  
Figure 1. 2.5V/1.8V at 800mA Step-Down Regulators  
34072fa  
1
LTC3407-2  
W W  
U W  
ABSOLUTE AXI U RATI GS  
(Note 1)  
Ambient Operating Temperature Range (Note 2)  
LTC3407E-2........................................ 40°C to 85°C  
LTC3407I-2 ...................................... 40°C to 125°C  
Junction Temperature (Note 5)............................. 125°C  
Storage Temperature Range ................. – 65°C to 150°C  
Lead Temperature (Soldering, 10 sec)  
VIN Voltages.................................................0.3V to 6V  
VFB1, VFB2, RUN1, RUN2  
Voltages ..................................... 0.3V to VIN + 0.3V  
MODE/SYNC Voltage ...................... 0.3V to VIN + 0.3V  
SW1, SW2 Voltage ......................... 0.3V to VIN + 0.3V  
POR Voltage ................................................0.3V to 6V  
MSE Package Only ........................................... 300°C  
Reflow Peak Body Temperature............................ 260°C  
U
U
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PI CO FIGURATIO  
TOP VIEW  
TOP VIEW  
V
1
2
3
4
5
10  
9
V
FB2  
RUN2  
POR  
SW2  
MODE/  
SYNC  
V
1
2
3
4
5
10  
9
V
FB2  
FB1  
FB1  
RUN1  
RUN1  
RUN2  
V
SW1  
GND  
11  
8
IN  
11  
V
8
POR  
SW2  
7
6
IN  
SW1  
GND  
7
6
MODE/  
SYNC  
MSE PACKAGE  
10-LEAD PLASTIC MSOP  
DD PACKAGE  
10-LEAD (3mm × 3mm) PLASTIC DFN  
MSE PIN 11, EXPOSED PAD: PGND  
MUST BE CONNECTED TO GND  
DD PIN 11, EXPOSED PAD: PGND  
MUST BE CONNECTED TO GND  
TJMAX = 125°C, θJA = 45°C/W, θJC = 10°C/W  
TJMAX = 125°C, θJA = 45°C/W, θJC = 10°C/W  
U
W
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ORDER I FOR ATIO  
LEAD FREE FINISH  
LT3407EDD-2#PBF  
LT3407IDD-2#PBF  
LT3407EMSE-2#PBF  
LT3407IMSE-2#PBF  
LEAD BASED FINISH  
LT3407EDD-2  
TAPE AND REEL  
PART MARKING*  
PACKAGE DESCRIPTION  
TEMPERATURE RANGE  
40°C to 85°C  
40°C to 125°C  
40°C to 85°C  
40°C to 125°C  
TEMPERATURE RANGE  
40°C to 85°C  
40°C to 125°C  
40°C to 85°C  
LT3407EDD-2#TRPBF  
LT3407IDD-2#TRPBF  
LT3407EMSE-2#TRPBF  
LT3407IMSE-2#TRPBF  
TAPE AND REEL  
LBFB  
10-Lead (3mm x 3mm) Plastic DFN  
10-Lead (3mm x 3mm) Plastic DFN  
10-Lead Plastic MSOP  
LBFB  
LTBDZ  
LTBDZ  
PART MARKING*  
LBFB  
10-Lead Plastic MSOP  
PACKAGE DESCRIPTION  
LT3407EDD-2#TR  
LT3407IDD-2#TR  
10-Lead (3mm x 3mm) Plastic DFN  
10-Lead (3mm x 3mm) Plastic DFN  
10-Lead Plastic MSOP  
LT3407IDD-2  
LBFB  
LT3407EMSE-2  
LT3407IMSE-2  
LT3407EMSE-2#TR  
LT3407IMSE-2#TR  
LTBDZ  
LTBDZ  
10-Lead Plastic MSOP  
40°C to 125°C  
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is indicated by a label on the shipping container  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
34072fa  
2
LTC3407-2  
ELECTRICAL CHARACTERISTICS  
The denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V, unless otherwise specified. (Note 2)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
5.5  
UNITS  
V
V
IN  
Operating Voltage Range  
Feedback Pin Input Current  
Feedback Voltage (Note 3)  
2.5  
I
30  
nA  
FB  
V
FB  
0°C T 85°C  
0.588  
0.585  
0.585  
0.6  
0.6  
0.6  
0.612  
0.612  
0.612  
V
V
V
A
–40°C T 85°C  
A
–40°C T 125°C (Note 2)  
A
ΔV  
ΔV  
Reference Voltage Line Regulation  
Output Voltage Load Regulation  
V
= 2.5V to 5.5V (Note 3)  
0.3  
0.5  
0.5  
%/V  
%
LINE REG  
IN  
(Note 3)  
LOAD REG  
I
Input DC Supply Current  
Active Mode  
S
V
V
= V = 0.5V  
700  
40  
0.1  
950  
60  
1
μA  
μA  
μA  
FB1  
FB2  
Sleep Mode  
Shutdown  
= V = 0.63V, MODE/SYNC = 3.6V  
FB1  
FB2  
RUN = 0V, V = 5.5V, MODE/SYNC = 0V  
IN  
f
f
I
Oscillator Frequency  
V
= 0.6V  
FBX  
1.8  
2.25  
2.25  
1.2  
2.7  
MHz  
MHz  
A
OSC  
SYNC  
LIM  
Synchronization Frequency  
Peak Switch Current Limit  
V
IN  
= 3V, V  
= 0.5V, Duty Cycle <35%  
0.95  
1.6  
FBX  
R
Top Switch On-Resistance  
Bottom Switch On-Resistance  
(Note 6)  
(Note 6)  
0.35  
0.30  
0.45  
0.45  
Ω
Ω
DS(ON)  
I
Switch Leakage Current  
V
IN  
= 5V, V  
= 0V, V = 0V  
FBX  
0.01  
1
μA  
SW(LKG)  
RUN  
POR  
Power-On Reset Threshold  
V
FBX  
V
FBX  
Ramping Up, MODE/SYNC = 0V  
Ramping Down, MODE/SYNC = 0V  
8.5  
–8.5  
%
%
Power-On Reset On-Resistance  
Power-On Reset Delay  
RUN Threshold  
100  
262,144  
1
200  
Ω
Cycles  
V
V
I
0.3  
1.5  
1
RUN  
RUN Leakage Current  
0.01  
μA  
RUN  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 3: The LTC3407-2 is tested in a proprietary test mode that connects  
to the output of the error amplifier.  
Note 4: Dynamic supply current is higher due to the internal gate charge  
V
FB  
being delivered at the switching frequency.  
Note 2: The 5LTC3407E-2 is guaranteed to meet specified performance  
from 0°C to 70°C. Specifications over the 40°C to 85°C operating  
temperature range are assured by design, characterization and correlation  
with statistical process controls. The LTC3407I-2 is guaranteed over the  
full 40°C to 125°C operating temperature range.  
Note 5: T is calculated from the ambient T and power dissipation P  
D
J
A
according to the following formula: T = T + (P θ ).  
J
A
D
JA  
Note 6: The DFN switch on-resistance is guaranteed by correlation to  
wafer level measurements.  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS TA = 25°C unless other wise specified.  
Load Step  
Burst Mode Operation  
Pulse Skipping Mode  
SW  
5V/DIV  
SW  
5V/DIV  
V
OUT  
200mV/DIV  
V
V
I
L
OUT  
OUT  
100mV/DIV  
10mV/DIV  
500mA/DIV  
I
L
I
I
LOAD  
500mA/DIV  
L
200mA/DIV  
200mA/DIV  
3407 G01  
3407 G02  
3407 G03  
V
V
LOAD  
= 3.6V  
V
V
LOAD  
= 3.6V  
V
= 3.6V  
IN  
2μs/DIV  
1μs/DIV  
20μs/DIV  
IN  
IN  
= 1.8V  
= 1.8V  
V
= 1.8V  
OUT  
OUT  
OUT  
I
= 100mA  
I
= 20mA  
I
LOAD  
CIRCUIT OF FIGURE 1  
= 80mA TO 800mA  
CIRCUIT OF FIGURE 1  
CIRCUIT OF FIGURE 1  
34072fa  
3
LTC3407-2  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS TA = 25°C unless other wise specified.  
Oscillator Frequency vs Supply  
Voltage  
Oscillator Frequency vs  
Temperature  
Efficiency vs Input Voltage  
100  
95  
90  
85  
80  
75  
70  
65  
60  
2.5  
2.4  
2.3  
2.2  
2.1  
2.0  
10  
8
V
= 3.6V  
IN  
6
100mA  
10mA  
1mA  
4
2
800mA  
0
–2  
–4  
–6  
–8  
–10  
V
= 1.8V  
OUT  
Burst Mode OPERATION  
CIRCUIT OF FIGURE 1  
4
5
6
50  
TEMPERATURE (°C)  
100 125  
4
5
6
2
3
–50 –25  
0
25  
75  
2
3
INPUT VOLTAGE (V)  
SUPPLY VOLTAGE (V)  
3407 G04  
3407 G05  
3407 G06  
Reference Voltage vs  
Temperature  
RDS(ON) vs Input Voltage  
RDS(ON) vs Temperature  
0.615  
0.610  
0.605  
0.600  
0.595  
0.590  
0.585  
500  
450  
400  
350  
300  
250  
200  
550  
500  
450  
400  
350  
300  
250  
200  
150  
100  
V
= 3.6V  
V
= 2.7V  
IN  
T
= 25°C  
IN  
A
V
= 3.6V  
IN  
V
= 4.2V  
IN  
MAIN  
SWITCH  
SYNCHRONOUS  
SWITCH  
MAIN SWITCH  
SYNCHRONOUS SWITCH  
3
2
50  
TEMPERATURE (°C)  
100 125  
5
7
50  
TEMPERATURE (°C)  
100 125 150  
–50 –25  
0
25  
75  
1
4
6
–50 –25  
0
25  
75  
V
(V)  
IN  
3407 G07  
3407 G08  
3407 G09  
Load Regulation  
Efficiency vs Load Current  
Efficiency vs Load Current  
4
3
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
70  
65  
60  
2.7V  
3.6V  
4.2V  
Burst Mode OPERATION  
Burst Mode OPERATION  
2
1
0
PULSE SKIP MODE  
–1  
–2  
–3  
–4  
PULSE SKIP MODE  
V
= 2.5V  
OUT  
Burst Mode OPERATION  
NO LOAD ON OTHER CHANNEL  
CIRCUIT OF FIGURE 1  
V
= 3.6V, V  
= 1.8V  
OUT  
IN  
V
= 3.6V, V  
= 1.8V  
OUT  
IN  
NO LOAD ON OTHER CHANNEL  
NO LOAD ON OTHER CHANNEL  
1
10  
100  
1000  
1
10  
100  
1000  
1
10  
100  
1000  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
3407 G12  
3407 G10  
3407 G11  
34072fa  
4
LTC3407-2  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS TA = 25°C unless other wise specified.  
Efficiency vs Load Current  
Line Regulation  
Efficiency vs Load Current  
0.5  
0.4  
100  
95  
90  
85  
80  
75  
70  
65  
60  
100  
95  
90  
85  
80  
75  
70  
65  
60  
V
= 1.8V  
OUT  
OUT  
I
= 200mA  
3.6V  
T
= 25°C  
A
0.3  
3.6V  
2.7V  
2.7V  
4.2V  
0.2  
0.1  
0
4.2V  
–0.1  
–0.2  
–0.3  
–0.4  
–0.5  
V
= 1.2V  
V
= 1.5V  
OUT  
OUT  
Burst Mode OPERATION  
NO LOAD ON OTHER CHANNEL  
CIRCUIT OF FIGURE 1  
Burst Mode OPERATION  
NO LOAD ON OTHER CHANNEL  
CIRCUIT OF FIGURE 1  
2
6
1
10  
100  
1000  
1
10  
100  
1000  
3
4
5
V
(V)  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
IN  
3407 G15  
3407 G13  
3407 G14  
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U
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PI FU CTIO S  
VFB1 (Pin 1): Output Feedback. Receives the feedback  
voltage from the external resistive divider across the  
output. Nominal voltage for this pin is 0.6V.  
be syncronized to an external oscillator applied to this pin  
and pulse skipping mode is automatically selected.  
SW2 (Pin 7): Regulator 2 Switch Node Connection to the  
RUN1 (Pin 2): Regulator 1 Enable. Forcing this pin to VIN  
enables regulator 1, while forcing it to GND causes regu-  
lator 1 to shut down.  
Inductor. This pin swings from VIN to GND.  
POR (Pin 8): Power-On Reset . This common-drain logic  
output is pulled to GND when the output voltage is not  
within 8.5% of regulation and goes high after 117ms  
when both channels are within regulation.  
VIN (Pin3):MainPowerSupply.Mustbecloselydecoupled  
to GND.  
SW1 (Pin 4): Regulator 1 Switch Node Connection to the  
Inductor. This pin swings from VIN to GND.  
RUN2 (Pin 9): Output Feedback. Forcing this pin to VIN  
enables regulator 2, while forcing it to GND causes regu-  
lator 2 to shut down.  
GND (Pin 5): Main Ground. Connect to the (–) terminal of  
C
OUT, and (–) terminal of CIN.  
VFB2 (Pin 10): Output Feedback. Receives the feedback  
voltage from the external resistive divider across the  
output. Nominal voltage for this pin is 0.6V.  
MODE/SYNC (Pin 6): Combination Mode Selection and  
OscillatorSynchronization.Thispincontrolstheoperation  
of the device. When tied to VIN or GND, Burst Mode  
operation or pulse skipping mode is selected, respec-  
tively. Do not float this pin. The oscillation frequency can  
Exposed Pad (GND) (Pin 11): Power Ground. Connect to  
the (–) terminal of COUT, and (–) terminal of CIN. Must be  
connected to electrical ground on PCB.  
34072fa  
5
LTC3407-2  
W
BLOCK DIAGRA  
REGULATOR 1  
MODE/SYNC  
6
BURST  
CLAMP  
V
IN  
SLOPE  
COMP  
EN  
+
+
0.6V  
SLEEP  
+
I
TH  
5Ω  
EA  
I
COMP  
0.35V  
V
FB1  
1
BURST  
Q
S
R
RS  
LATCH  
Q
0.55V  
+
SWITCHING  
LOGIC  
UV  
OV  
UVDET  
OVDET  
AND  
BLANKING  
CIRCUIT  
ANTI  
SHOOT-  
THRU  
4
SW1  
+
0.65V  
+
I
RCMP  
SHUTDOWN  
11 GND  
V
IN  
3
8
V
IN  
PGOOD1  
POR  
2
9
RUN1  
RUN2  
POR  
COUNTER  
0.6V REF  
OSC  
OSC  
5
7
GND  
PGOOD2  
REGULATOR 2 (IDENTICAL TO REGULATOR 1)  
10  
SW2  
V
FB2  
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OPERATIO  
Main Control Loop  
The LTC3407-2 uses a constant frequency, current mode  
architecture. The operating frequency is set at 2.25MHz  
and can be synchronized to an external oscillator. Both  
channels share the same clock and run in-phase. To suit  
a variety of applications, the selectable Mode pin allows  
the user to choose between low noise and high efficiency.  
Duringnormaloperation,thetoppowerswitch(P-channel  
MOSFET) is turned on at the beginning of a clock cycle  
when the VFB voltage is below the the reference voltage.  
The current into the inductor and the load increases until  
the current limit is reached. The switch turns off and  
energy stored in the inductor flows through the bottom  
switch (N-channel MOSFET) into the load until the next  
clock cycle.  
The output voltage is set by an external divider returned to  
the VFB pins. An error amplfier compares the divided  
outputvoltagewithareferencevoltageof0.6Vandadjusts  
the peak inductor current accordingly. Overvoltage and  
undervoltage comparators will pull the POR output low if  
the output voltage is not within 8.5%. The POR output  
will go high after 262,144 clock cycles (about 117ms) of  
achieving regulation.  
The peak inductor current is controlled by the internally  
compensated ITH voltage, which is the output of the error  
amplifier.This amplifier compares the VFB pin to the 0.6V  
reference. When the load current increases, the VFB volt-  
age decreases slightly below the reference. This  
34072fa  
6
LTC3407-2  
U
OPERATIO  
decrease causes the error amplifier to increase the ITH For lower ripple noise at low currents, the pulse skipping  
voltageuntiltheaverageinductorcurrentmatchesthenew modecanbeused. Inthismode, theLTC3407-2continues  
to switch at a constant frequency down to very low  
currents, where it will begin skipping pulses. The effi-  
ciency in pulse skip mode can be improved slightly by  
connecting the SW node to the MODE/SYNC input which  
reduces the clock frequency by approximately 30%.  
load current.  
The main control loop is shut down by pulling the RUN pin  
to ground.  
Low Current Operation  
Two modes are available to control the operation of the  
LTC3407-2 at low currents. Both modes automatically  
switch from continuous operation to the selected mode  
when the load current is low.  
Dropout Operation  
When the input supply voltage decreases toward the  
output voltage, the duty cycle increases to 100% which is  
the dropout condition. In dropout, the PMOS switch is  
turned on continuously with the output voltage being  
equal to the input voltage minus the voltage drops across  
the internal p-channel MOSFET and the inductor.  
To optimize efficiency, the Burst Mode operation can be  
selected. When the load is relatively light, the LTC3407-2  
automatically switches into Burst Mode operation, in  
which the PMOS switch operates intermittently based on  
load demand with a fixed peak inductor current. By run-  
ning cycles periodically, the switching losses which are  
dominatedbythegatechargelossesofthepowerMOSFETs  
are minimized. The main control loop is interrupted when  
the output voltage reaches the desired regulated value. A  
hysteretic voltage comparator trips when ITH is below  
0.35V, shuttingofftheswitchandreducingthepower. The  
output capacitor and the inductor supply the power to the  
load until ITH exceeds 0.65V, turning on the switch and the  
main control loop which starts another cycle.  
An important design consideration is that the RDS(ON) of  
the P-channel switch increases with decreasing input  
supplyvoltage(SeeTypicalPerformanceCharacteristics).  
Therefore, the user should calculate the power dissipation  
when the LTC3407-2 is used at 100% duty cycle with low  
input voltage (See Thermal Considerations in the Applica-  
tions Information Section).  
Low Supply Operation  
To prevent unstable operation, the LTC3407-2 incorpo-  
rates an Under-Voltage Lockout circuit which shuts down  
the part when the input voltage drops below about 1.65V.  
W U U  
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APPLICATIO S I FOR ATIO  
Accepting larger values of ΔIL allows the use of low  
inductances, but results in higher output voltage ripple,  
greater core losses, and lower output current capability.  
A reasonable starting point for setting ripple current is  
ΔIL = 0.3 • ILIM, where ILIM is the peak switch current limit.  
The largest ripple current ΔIL occurs at the maximum  
input voltage. To guarantee that the ripple current stays  
below a specified maximum, the inductor value should be  
chosen according to the following equation:  
A general LTC3407-2 application circuit is shown in  
Figure 2. External component selection is driven by the  
load requirement, and begins with the selection of the  
inductor L. Once the inductor is chosen, CIN and COUT can  
be selected.  
Inductor Selection  
Although the inductor does not influence the operating  
frequency, the inductor value has a direct effect on ripple  
current. The inductor ripple current ΔIL decreases with  
VOUT  
VOUT  
higher inductance and increases with higher VIN or VOUT  
:
L =  
• 1–  
fO ΔIL  
V
IN(MAX)  
VOUT  
fO L  
VOUT  
ΔIL =  
• 1–  
The inductor value will also have an effect on Burst Mode  
V
IN  
operation. The transition from low current operation  
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Table 1. Representative Surface Mount Inductors  
begins when the peak inductor current falls below a level  
set by the burst clamp. Lower inductor values result in  
higher ripple current which causes this to occur at lower  
load currents. This causes a dip in efficiency in the upper  
range of low current operation. In Burst Mode operation,  
lower inductance values will cause the burst frequency to  
increase.  
PART  
VALUE  
DCR  
MAX DC  
SIZE  
3
NUMBER  
(μH)  
(Ω MAX) CURRENT (A) W × L × H (mm )  
Sumida  
CDRH3D16  
2.2  
3.3  
4.7  
0.075  
0.110  
0.162  
1.20  
1.10  
0.90  
3.8 × 3.8 × 1.8  
Sumida  
CDRH2D11  
1.5  
2.2  
0.068  
0.170  
0.900  
0.780  
3.2 × 3.2 × 1.2  
4.4 × 5.8 × 1.2  
2.5 × 3.2 × 2.0  
2.5 × 3.2 × 2.0  
4.5 × 5.4 × 1.2  
Inductor Core Selection  
Sumida  
CMD4D11  
2.2  
3.3  
0.116  
0.174  
0.950  
0.770  
Different core materials and shapes will change the size/  
current and price/current relationship of an inductor.  
Toroid or shielded pot cores in ferrite or permalloy mate-  
rials are small and don’t radiate much energy, but gener-  
ally cost more than powdered iron core inductors with  
similar electrical characterisitics. The choice of which  
style inductor to use often depends more on the price vs  
size requirements and any radiated field/EMI require-  
ments than on what the LTC3407-2 requires to operate.  
Table 1 shows some typical surface mount inductors that  
work well in LTC3407-2 applications.  
Murata  
LQH32CN  
1.0  
2.2  
0.060  
0.097  
1.00  
0.79  
Toko  
D312F  
2.2  
3.3  
0.060  
0.260  
1.08  
0.92  
Panasonic  
ELT5KT  
3.3  
4.7  
0.17  
0.20  
1.00  
0.95  
Output Capacitor (COUT) Selection  
The selection of COUT is driven by the required ESR to  
minimizevoltagerippleandloadsteptransients.Typically,  
once the ESR requirement is satisfied, the capacitance is  
adequate for filtering. The output ripple (ΔVOUT) is deter-  
mined by:  
Input Capacitor (CIN) Selection  
In continuous mode, the input current of the converter is  
a square wave with a duty cycle of approximately VOUT  
/
VIN. To prevent large voltage transients, a low equivalent  
series resistance (ESR) input capacitor sized for the maxi-  
mum RMS current must be used. The maximum RMS  
capacitor current is given by:  
1
ΔVOUT ≈ ΔIL ESR +  
8fO COUT  
where f = operating frequency, COUT = output capacitance  
and ΔIL = ripple current in the inductor. The output ripple  
is highest at maximum input voltage since ΔIL increases  
with input voltage. With ΔIL = 0.3 • ILIM the output ripple  
willbelessthan100mVatmaximumVIN andfO =2.25MHz  
with:  
VOUT (V – VOUT  
)
IN  
IRMS IMAX  
V
IN  
where the maximum average output current IMAX equals  
the peak current minus half the peak-to-peak ripple cur-  
rent, IMAX = ILIM ΔIL/2.  
ESRCOUT < 150mΩ  
This formula has a maximum at VIN = 2VOUT, where IRMS  
= IOUT/2. This simple worst-case is commonly used to  
design because even significant deviations do not offer  
much relief. Note that capacitor manufacturer’s ripple  
current ratings are often based on only 2000 hours life-  
time. This makes it advisable to further derate the capaci-  
tor, or choose a capacitor rated at a higher temperature  
thanrequired. Severalcapacitorsmayalsobeparalleledto  
meet the size or height requirements of the design. An  
additional 0.1μF to 1μF ceramic capacitor is also recom-  
mended on VIN for high frequency decoupling, when not  
using an all ceramic capacitor solution.  
Once the ESR requirements for COUT have been met, the  
RMS current rating generally far exceeds the IRIPPLE(P-P)  
requirement, except for an all ceramic solution.  
In surface mount applications, multiple capacitors may  
have to be paralleled to meet the capacitance, ESR or RMS  
current handling requirement of the application. Alumi-  
numelectrolytic,specialpolymer,ceramicanddrytantulum  
capacitorsareallavailableinsurfacemountpackages.The  
OS-CONsemiconductordielectriccapacitoravailablefrom  
Sanyo has the lowest ESR(size) product of any aluminum  
electrolytic at a somewhat higher price. Special polymer  
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capacitors, such as Sanyo POSCAP, Panasonic Special  
Polymer (SP), and Kemet A700, offer very low ESR, but  
have a lower capacitance density than other types. Tanta-  
lum capacitors have the highest capacitance density, but  
they have a larger ESR and it is critical that the capacitors  
are surge tested for use in switching power supplies. An  
excellent choice is the AVX TPS series of surface mount  
tantalums, available in case heights ranging from 2mm to  
4mm. Aluminum electrolytic capacitors have a signifi-  
cantly larger ESR, and are often used in extremely cost-  
sensitiveapplicationsprovidedthatconsiderationisgiven  
to ripple current ratings and long term reliability. Ceramic  
capacitorshavethelowestESRandcost, butalsohavethe  
lowest capacitance density, a high voltage and tempera-  
ture coefficient, and exhibit audible piezoelectric effects.  
In addition, the high Q of ceramic capacitors along with  
trace inductance can lead to significant ringing.  
requires the designer to check loop stability over the  
operating temperature range. To minimize their large  
temperature and voltage coefficients, only X5R or X7R  
ceramic capacitors should be used. A good selection of  
ceramic capacitors is available from Taiyo Yuden, AVX,  
Kemet, TDK, and Murata.  
Great care must be taken when using only ceramic input  
and output capacitors. When a ceramic capacitor is used  
at the input and the power is being supplied through long  
wires,suchasfromawalladapter,aloadstepattheoutput  
can induce ringing at the VIN pin. At best, this ringing can  
couple to the output and be mistaken as loop instability. At  
worst, the ringing at the input can be large enough to  
damage the part.  
Since the ESR of a ceramic capacitor is so low, the input  
and output capacitor must instead fulfill a charge storage  
requirement.Duringaloadstep,theoutputcapacitormust  
instantaneously supply the current to support the load  
untilthefeedbackloopraisestheswitchcurrentenoughto  
support the load. The time required for the feedback loop  
to respond is dependent on the compensation and the  
output capacitor size. Typically, 3-4 cycles are required to  
respond to a load step, but only in the first cycle does the  
output drop linearly. The output droop, VDROOP, is usually  
about 2-3 times the linear drop of the first cycle. Thus, a  
good place to start is with the output capacitor size of  
approximately:  
In most cases, 0.1μF to 1μF of ceramic capacitors should  
also be placed close to the LTC3407-2 in parallel with the  
main capacitors for high frequency decoupling.  
V = 2.5V  
IN  
TO 5.5V  
C
R5  
IN  
RUN2  
V
RUN1  
POR  
IN  
BM*  
POWER-ON  
RESET  
MODE/SYNC  
PS*  
LTC3407-2  
L1  
L2  
V
OUT2  
SW2  
SW1  
V
OUT1  
C5  
R4  
C4  
R2  
V
FB1  
V
FB2  
GND  
R1  
C
OUT1  
C
R3  
OUT2  
ΔIOUT  
fO VDROOP  
COUT 2.5  
3407 F02  
*MODE/SYNC = 0V: PULSE SKIP  
MODE/SYNC = V : Burst Mode  
IN  
More capacitance may be required depending on the duty  
cycle and load step requirements.  
Figure 2. LTC3407-2 General Schematic  
Ceramic Input and Output Capacitors  
In most applications, the input capacitor is merely re-  
quired to supply high frequency bypassing, since the  
impedance to the supply is very low. A 10μF ceramic  
capacitor is usually enough for these conditions.  
Higher value, lower cost ceramic capacitors are now  
becomingavailableinsmallercasesizes.Thesearetempt-  
ing for switching regulator use because of their very low  
ESR. Unfortunately, the ESR is so low that it can cause  
loop stability problems. Solid tantalum capacitor ESR  
generatesaloopzeroat5kHzto50kHzthatisinstrumen-  
tal in giving acceptable loop phase margin. Ceramic ca-  
pacitors remain capacitive to beyond 300kHz and usually  
resonate with their ESL before ESR becomes effective.  
Also, ceramic caps are prone to temperature effects which  
Setting the Output Voltage  
The LTC3407-2 develops a 0.6V reference voltage be-  
tween the feedback pin, VFB, and the ground as shown in  
Figure 2. The output voltage is set by a resistive divider  
according to the following formula:  
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Checking Transient Response  
R2  
R1  
VOUT = 0.6V 1+  
The regulator loop response can be checked by looking at  
the load transient response. Switching regulators take  
several cycles to respond to a step in load current. When  
a load step occurs, VOUT immediately shifts by an amount  
equal to ΔILOAD • ESR, where ESR is the effective series  
resistance of COUT. ΔILOAD also begins to charge or  
discharge COUT, generating a feedback error signal used  
by the regulator to return VOUT to its steady-state value.  
During this recovery time, VOUT can be monitored for  
overshoot or ringing that would indicate a stability  
problem.  
Keeping the current small (<5μA) in these resistors maxi-  
mizes efficiency, but making them too small may allow  
stray capacitance to cause noise problems and reduce the  
phase margin of the error amp loop.  
To improve the frequency response, a feed-forward ca-  
pacitor CF may also be used. Great care should be taken to  
route the VFB line away from noise sources, such as the  
inductor or the SW line.  
The initial output voltage step may not be within the  
bandwidth of the feedback loop, so the standard second-  
order overshoot/DC ratio cannot be used to determine  
phase margin. In addition, a feed-forward capacitor, CF,  
can be added to improve the high frequency response, as  
shown in Figure 2. Capacitor CF provides phase lead by  
creating a high frequency zero with R2, which improves  
the phase margin.  
Power-On Reset  
The POR pin is an open-drain output which pulls low when  
either regulator is out of regulation. When both output  
voltages are within 8.5% of regulation, a timer is started  
which releases POR after 218 clock cycles (about 117ms).  
This delay can be significantly longer in Burst Mode  
operation with low load currents, since the clock cycles  
only occur during a burst and there could be milliseconds  
of time between bursts. This can be bypassed by tying the  
POR output to the MODE/SYNC input, to force pulse  
skipping mode during a reset. In addition, if the output  
voltage faults during Burst Mode sleep, POR could have a  
slight delay for an undervoltage output condition and may  
notrespondtoanovervoltageoutput. Thiscanbeavoided  
by using pulse skipping mode instead. When either chan-  
nel is shut down, the POR output is pulled low, since one  
or both of the channels are not in regulation.  
The output voltage settling behavior is related to the  
stability of the closed-loop system and will demonstrate  
the actual overall supply performance. For a detailed  
explanation of optimizing the compensation components,  
including a review of control loop theory, refer to Applica-  
tion Note 76.  
In some applications, a more severe transient can be  
caused by switching in loads with large (>1μF) input  
capacitors.Thedischargedinputcapacitorsareeffectively  
put in parallel with COUT, causing a rapid drop in VOUT. No  
regulator can deliver enough current to prevent this prob-  
Mode Selection & Frequency Synchronization  
TheMODE/SYNCpinisamultipurposepinwhichprovides lem, if the switch connecting the load has low resistance  
mode selection and frequency synchronization. Connect- and is driven quickly. The solution is to limit the turn-on  
ing this pin to VIN enables Burst Mode operation, which speed of the load switch driver. A Hot SwapTM controller is  
provides the best low current efficiency at the cost of a designedspecificallyforthispurposeandusuallyincorpo-  
higheroutputvoltageripple.Connectingthispintoground rates current limiting, short-circuit protection, and soft-  
selects pulse skipping mode, which provides the lowest starting.  
output ripple, at the cost of low current efficiency.  
Efficiency Considerations  
The LTC3407-2 can also be synchronized to an external  
The percent efficiency of a switching regulator is equal to  
the output power divided by the input power times 100%.  
It is often useful to analyze individual losses to determine  
what is limiting the efficiency and which change would  
2.25MHz clock signal by the MODE/SYNC pin. During  
synchronization, the mode is set to pulse skipping and the  
topswitchturn-onissynchronizedtotherisingedgeofthe  
external clock.  
Hot Swap is registered trademark of Linear Technology Corporation.  
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produce the most improvement. Percent efficiency can be  
expressed as:  
include these “system” level losses in the design of a  
system. The internal battery and fuse resistance losses  
can be minimized by making sure that CIN has adequate  
charge storage and very low ESR at the switching fre-  
quency. Other losses including diode conduction losses  
during dead-time and inductor core losses generally ac-  
count for less than 2% total additional loss.  
%Efficiency = 100% - (L1 + L2 + L3 + ...)  
whereL1, L2, etc. aretheindividuallossesasapercentage  
of input power.  
Although all dissipative elements in the circuit produce  
losses, 4 main sources usually account for most of the  
losses in LTC3407-2 circuits: 1)VIN quiescent current, 2)  
switching losses, 3) I2R losses, 4) other losses.  
Thermal Considerations  
In a majority of applications, the LTC3407-2 does not  
dissipate much heat due to its high efficiency. However, in  
applications where the LTC3407-2 is running at high  
ambient temperature with low supply voltage and high  
duty cycles, such as in dropout, the heat dissipated may  
exceed the maximum junction temperature of the part. If  
the junction temperature reaches approximately 150°C,  
both power switches will turn off and the SW node will  
become high impedance.  
1) The VIN current is the DC supply current given in the  
Electrical Characteristics which excludes MOSFET driver  
andcontrolcurrents.VIN currentresultsinasmall(<0.1%)  
loss that increases with VIN, even at no load.  
2) The switching current is the sum of the MOSFET driver  
and control currents. The MOSFET driver current results  
fromswitchingthegatecapacitanceofthepowerMOSFETs.  
Each time a MOSFET gate is switched from low to high to  
low again, a packet of charge dQ moves from VIN to  
ground. The resulting dQ/dt is a current out of VIN that is  
typically much larger than the DC bias current. In continu-  
ousmode, IGATECHG =fO(QT +QB), whereQT andQB arethe  
gate charges of the internal top and bottom MOSFET  
switches. The gate charge losses are proportional to VIN  
and thus their effects will be more pronounced at higher  
supply voltages.  
3) I2R losses are calculated from the DC resistances of the  
internal switches, RSW, and external inductor, RL. In  
continuousmode,theaverageoutputcurrentflowsthrough  
inductor L, but is “chopped” between the internal top and  
bottom switches. Thus, the series resistance looking into  
the SW pin is a function of both top and bottom MOSFET  
RDS(ON) and the duty cycle (DC) as follows:  
To prevent the LTC3407-2 from exceeding the maximum  
junction temperature, the user will need to do some  
thermal analysis. The goal of the thermal analysis is to  
determine whether the power dissipated exceeds the  
maximum junction temperature of the part. The tempera-  
ture rise is given by:  
TRISE = PD θJA  
where PD is the power dissipated by the regulator and θJA  
is the thermal resistance from the junction of the die to the  
ambient temperature.  
The junction temperature, TJ, is given by:  
TJ = TRISE + TAMBIENT  
As an example, consider the case when the LTC3407-2 is  
in dropout on both channels at an input voltage of 2.7V  
with a load current of 800mA and an ambient temperature  
of 70°C. From the Typical Performance Characteristics  
graph of Switch Resistance, the RDS(ON) resistance of the  
main switch is 0.425Ω. Therefore, power dissipated by  
each channel is:  
RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC)  
The RDS(ON) for both the top and bottom MOSFETs can be  
obtained from the Typical Performance Characteristics  
curves. Thus, to obtain I2R losses:  
I2R losses = IOUT2(RSW + RL)  
PD = I2 • RDS(ON) = 272mW  
4) Other ‘hidden’ losses such as copper trace and internal  
battery resistances can account for additional efficiency  
degradations in portable systems. It is very important to  
The MS package junction-to-ambient thermal resistance,  
θJA, is 45°C/W. Therefore, the junction temperature of the  
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Board Layout Considerations  
regulator operating in a 70°C ambient temperature is  
approximately:  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of the  
LTC3407-2. These items are also illustrated graphically in  
the layout diagram of Figure 3. Check the following in your  
layout:  
TJ = 2 • 0.272 • 45 + 70 = 94.5°C  
which is below the absolute maximum junction tempera-  
ture of 125°C.  
Design Example  
1. Does the capacitor CIN connect to the power VIN (Pin 3)  
andGND(exposedpad)ascloseaspossible?Thiscapaci-  
torprovidestheACcurrenttotheinternalpowerMOSFETs  
and their drivers.  
As a design example, consider using the LTC3407-2 in an  
portable application with a Li-Ion battery. The battery  
provides a VIN = 2.8V to 4.2V. The load requires a maxi-  
mum of 800mA in active mode and 2mA in standby mode.  
The output voltage is VOUT = 2.5V. Since the load still  
needs power in standby, Burst Mode operation is selected  
for good low load efficiency.  
2. Are the COUT and L1 closely connected? The (–) plate of  
COUT returns current to GND and the (–) plate of CIN.  
3. The resistor divider, R1 and R2, must be connected  
between the (+) plate of COUT and a ground sense line  
terminatednearGND(exposedpad). Thefeedbacksignals  
VFB should be routed away from noisy components and  
traces, such as the SW line (Pins 4 and 7), and its trace  
should be minimized.  
First, calculate the inductor value for about 30% ripple  
current at maximum VIN:  
2.5V  
2.5V  
4.2V  
L =  
• 1–  
= 1.5μH  
2.25MHz • 300mA  
4.KeepsensitivecomponentsawayfromtheSWpins.The  
input capacitor CIN and the resistors R1 to R4 should be  
routed away from the SW traces and the inductors.  
Choosing a vendor’s closest inductor value of 2.2μH,  
results in a maximum ripple current of:  
5. Agroundplaneispreferred, butifnotavailable, keepthe  
signal and power grounds segregated with small signal  
components returning to the GND pin at one point and  
2.5V  
2.5V  
4.2V  
ΔIL =  
• 1−  
= 204mA  
2.25MHz 2.2μ  
should not share the high current path of CIN or COUT  
.
For cost reasons, a ceramic capacitor will be used. COUT  
selection is then based on load step droop instead of ESR  
requirements. For a 5% output droop:  
6. Flood all unused areas on all layers with copper.  
Flooding with copper will reduce the temperature rise of  
power components. These copper areas should be con-  
nected to VIN or GND.  
800mA  
COUT 2.5  
= 7.1μF  
2.25MHz (5%2.5V)  
V
IN  
C
A good standard value is 10μF. Since the output imped-  
ance of a Li-Ion battery is very low, CIN is typically 10μF.  
The output voltage can now be programmed by choosing  
the values of R1 and R2. To maintain high efficiency, the  
current in these resistors should be kept small. Choosing  
2μA with the 0.6V feedback voltage makes R1~300k. A  
close standard 1% resistor is 280k, and R2 is then 887k.  
IN  
RUN2  
V
RUN1  
POR  
IN  
MODE/SYNC  
LTC3407-2  
L1  
C4  
L2  
V
OUT2  
SW2  
SW1  
V
OUT1  
C5  
R4  
V
V
FB2  
FB1  
R2  
GND  
R1  
C
OUT1  
C
OUT2  
R3  
The PGOOD pin is a common drain output and requires a  
pull-upresistor.A100kresistorisusedforadequate speed.  
3407 F03  
BOLD LINES INDICATE HIGH CURRENT PATHS  
Figure 1 shows the complete schematic for this design  
example.  
Figure 3. LTC3407-2 Layout Diagram (See Board Layout Checklist)  
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LTC3407-2  
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TYPICAL APPLICATIO S  
Low Ripple Buck Regulators Using Ceramic Capacitors  
V
= 2.5V  
IN  
TO 5.5V  
R5  
100k  
C1  
10μF  
RUN2  
V
RUN1  
POR  
IN  
POWER-ON  
RESET  
LTC3407-2  
L2  
L1  
4.7μH  
4.7μH  
V
= 1.8V  
V
= 1.2V  
OUT2  
OUT1  
SW2  
SW1  
AT 800mA  
AT 800mA  
C5, 22pF  
C4, 22pF  
V
V
FB1  
FB2  
R4  
887k  
R2  
604k  
MODE/SYNC GND  
C3  
10μF  
C2  
10μF  
R3  
442k  
R1  
604k  
3407 TA03  
C1, C2, C3: TAIYO YUDEN JMK316BJ106ML  
L1, L2: SUMIDA CDRH2D18/HP-4R7NC  
Efficiency vs Load Current  
100  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
1.8V  
1.2V  
V
= 3.3V  
IN  
PULSE SKIP MODE  
NO LOAD ON OTHER CHANNEL  
10  
100  
1000  
LOAD CURRENT (mA)  
3407 TA03b  
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LTC3407-2  
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TYPICAL APPLICATIO S  
2mm Height Core Supply  
V
= 3.6V  
IN  
TO 5.5V  
R5  
100k  
C1*  
4.7μF  
RUN2  
V
RUN1  
POR  
IN  
POWER-ON  
RESET  
MODE/SYNC  
LTC3407-2  
L2  
L1  
2.2μH  
2.2μH  
V
OUT2  
= 3.3V  
V
= 1.8V  
OUT1  
SW2  
SW1  
AT 800mA  
AT 800mA  
C5, 22pF  
C4, 22pF  
V
V
FB2  
FB1  
R4  
887k  
R2  
604k  
C3  
C2  
GND  
R3  
196k  
R1  
301k  
4.7μF  
4.7μF  
×2  
×2  
3407 TA07  
C1, C2, C3: TDK C1608X5ROJ475M  
L1, L2: CMD4D11-2R2  
*IF C1 IS GREATER THAN 3" FROM POWER SOURCE,  
ADDITIONAL CAPACITANCE MAY BE REQUIRED.  
Efficiency vs Load Current  
100  
95  
90  
85  
80  
75  
70  
65  
60  
3.3V  
1.8V  
V
= 5V  
IN  
Burst Mode OPERATION  
NO LOAD ON OTHER CHANNEL  
1
10  
100  
1000  
LOAD CURRENT (mA)  
3407 TA08  
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LTC3407-2  
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PACKAGE DESCRIPTIO  
DD Package  
10-Lead Plastic DFN (3mm × 3mm)  
(Reference LTC DWG # 05-08-1699)  
R = 0.115  
TYP  
6
0.38 0.10  
10  
0.675 0.05  
3.50 0.05  
2.15 0.05 (2 SIDES)  
1.65 0.05  
3.00 0.10  
(4 SIDES)  
1.65 0.10  
(2 SIDES)  
PIN 1  
TOP MARK  
(SEE NOTE 6)  
PACKAGE  
OUTLINE  
(DD) DFN 1103  
5
1
0.25 0.05  
0.50 BSC  
0.75 0.05  
0.200 REF  
0.25 0.05  
0.50  
BSC  
2.38 0.05  
(2 SIDES)  
2.38 0.10  
(2 SIDES)  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
NOTE:  
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).  
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
MSE Package  
10-Lead Plastic MSOP  
(Reference LTC DWG # 05-08-1664)  
BOTTOM VIEW OF  
EXPOSED PAD OPTION  
2.06 0.102  
3.00 0.102  
(.118 .004)  
(NOTE 3)  
2.794 0.102  
(.110 .004)  
0.889 0.127  
(.035 .005)  
0.497 0.076  
(.0196 .003)  
REF  
(.081 .004)  
1
10 9  
8
7 6  
1.83 0.102  
(.072 .004)  
3.00 0.102  
(.118 .004)  
(NOTE 4)  
5.23  
(.206)  
MIN  
DETAIL “A”  
0° – 6° TYP  
4.90 0.152  
(.193 .006)  
2.083 0.102 3.20 – 3.45  
(.082 .004) (.126 – .136)  
0.254  
(.010)  
GAUGE PLANE  
0.53 0.152  
(.021 .006)  
1
2
3
4
5
10  
0.50  
(.0197)  
BSC  
0.305 0.038  
(.0120 .0015)  
TYP  
0.86  
(.034)  
REF  
1.10  
(.043)  
MAX  
RECOMMENDED SOLDER PAD LAYOUT  
DETAIL “A”  
0.18  
(.007)  
SEATING  
PLANE  
0.17 – 0.27  
(.007 – .011)  
TYP  
0.1016 0.0508  
(.004 .002)  
0.50  
(.0197)  
BSC  
MSOP (MSE) 0307 REV B  
NOTE:  
1. DIMENSIONS IN MILLIMETER/(INCH)  
2. DRAWING NOT TO SCALE  
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.  
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX  
34072fa  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.  
15  
LTC3407-2  
U
TYPICAL APPLICATIO  
2mm Height Lithium-Ion Single Inductor Buck-Boost Regulator and a Buck Regulator  
V
= 2.8V  
IN  
TO 4.2V  
R5  
100k  
C1  
10μF  
RUN2  
V
RUN1  
POR  
IN  
POWER-ON  
RESET  
MODE/SYNC  
LTC3407-2  
L2  
10μH  
L1  
2.2μH  
D1  
V = 3.3V  
OUT2  
AT 200mA  
V
= 1.8V  
OUT1  
SW2  
SW1  
AT 800mA  
C5, 22pF  
C4, 22pF  
M1  
+
C6  
47μF  
V
V
FB2  
FB1  
R4  
887k  
R2  
604k  
GND  
C3  
10μF  
C2  
10μF  
R3  
196k  
R1  
301k  
3407 TA04  
C1, C2, C3: TAIYO YUDEN JMK316BJ106ML  
C6: SANYO 6TPB47M  
D1: PHILIPS PMEG2010  
L1: MURATA LQH32CN2R2M33  
L2: TOKO A914BYW-100M (D52LC SERIES)  
M1: SILICONIX Si2302  
Efficiency vs Load Current  
Efficiency vs Load Current  
100  
95  
90  
85  
80  
75  
70  
65  
60  
90  
80  
70  
60  
50  
40  
30  
2.8V  
4.2V  
3.6V  
4.2V  
3.6V  
2.8V  
V
OUT  
= 1.8V  
V
OUT  
= 3.3V  
Burst Mode OPERATION  
Burst Mode OPERATION  
NO LOAD ON OTHER CHANNEL  
NO LOD ON OTHER CHANNEL  
1
10  
100  
1000  
1
10  
100  
1000  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
3407 TA06  
3407 TA05  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
95% Efficiency, V : 2.7V to 6V, V  
LTC1878  
600mA (I ), 550kHz,  
= 0.8V, I = 10μA,  
Q
OUT  
IN  
OUT(MIN)  
Synchronous Step-Down DC/DC Converter  
I
<1μA, MSOP-8, Package  
SD  
LT1940  
Dual Output 1.4A(I , Constant 1.1MHz,  
V : 3V to 25V, V  
= 1.2V, I = 2.5mA, I = <1μA,  
OUT)  
IN  
OUT(MIN)  
Q
SD  
High Efficiency Step-Down DC/DC Converter  
TSSOP-16E Package  
LTC3252  
Dual 250mA (I ), 1MHz, Spread Spectrum  
88% Efficiency, V : 2.7V to 5.5V, V  
Q SD  
= 0.9V to 1.6V,  
OUT  
IN  
OUT(MIN)  
Inductorless Step-Down DC/DC Converter  
I = 60μA, I < 1μA, DFN-12 Package  
LTC3405/LTC3405A  
LTC3406/LTC3406B  
LT3407  
300mA (I ), 1.5MHz,  
96% Efficiency, V : 2.5V to 5.5V, V  
SD  
= 0.8V, I = 20μA,  
OUT  
IN  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
Q
Synchronous Step-Down DC/DC Converters  
I
<1μA, ThinSOT Package  
600mA (I ), 1.5MHz,  
96% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V, I = 20μA,  
OUT  
IN  
Q
Synchronous Step-Down DC/DC Converters  
I
<1μA, ThinSOT Package  
SD  
600mA, 1.5MHz  
Dual Synchronous Step-Down DC/DC Converter  
96% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V, I = 40μA,  
IN  
Q
I
<1μA, MSE, DFN Package  
SD  
LTC3411  
1.25A (I ), 4MHz,  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.8V, I = 60μA,  
OUT  
IN  
Q
Synchronous Step Down DC/DC Converter  
I
<1μA, MSOP-10 Package  
SD  
LTC3412  
2.5A (I ), 4MHz,  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.8V, I = 60μA,  
OUT  
IN  
Q
Synchronous Step Down DC/DC Converter  
I
<1μA, TSSOP-16E Package  
SD  
LTC3414  
4A (I ), 4MHz,  
95% Efficiency, V : 2.25V to 5.5V, V  
SD  
= 0.8V, I = 64μA,  
OUT  
IN  
OUT(MIN)  
Q
Synchronous Step Down DC/DC Converter  
I
<1μA, TSSOP-28E Package  
LTC3440  
600mA (I ), 2MHz,  
95% Efficiency, V : 2.5V to 5.5V, V  
SD  
= 2.5V, I = 25μA,  
OUT  
IN  
OUT(MIN)  
Q
Synchronous Buck-Boost DC/DC Converter  
I
<1μA, MSOP-10 Package  
34072fa  
LT 0707 REV A • PRINTED IN USA  
16 LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
© LINEAR TECHNOLOGY CORPORATION 2004  

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