LTC2462CMS#PBF [Linear]
LTC2462 - Ultra-Tiny, 16-Bit ΔΣ ADCs with 10ppm/°C Max Precision Reference; Package: MSOP; Pins: 12; Temperature Range: 0°C to 70°C;型号: | LTC2462CMS#PBF |
厂家: | Linear |
描述: | LTC2462 - Ultra-Tiny, 16-Bit ΔΣ ADCs with 10ppm/°C Max Precision Reference; Package: MSOP; Pins: 12; Temperature Range: 0°C to 70°C 光电二极管 转换器 |
文件: | 总22页 (文件大小:296K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC2460/LTC2462
Ultra-Tiny, 16-Bit ΔΣ ADCs
with 10ppm/°C Max
Precision Reference
DescripTion
FeaTures
n
16-Bit Resolution, No Missing Codes
The LTC®2460/LTC2462 are ultra tiny, 16-Bit analog-to-
digital converters with an integrated precision reference.
They use a single 2.7V to 5.5V supply and communicate
through an SPI Interface. The LTC2460 is single-ended
with a 0V to VREF input range and the LTC2462 is dif-
ferential with a VREF input range. Both ADC’s include
a 1.25V integrated reference with 2ppm/°C drift per-
formance and 0.1% initial accuracy. The converters are
available in a 12-pin DFN 3mm × 3mm package or an
MSOP-12 package. They include an integrated oscillator
and perform conversions with no latency for multiplexed
applications. TheLTC2460/LTC2462includeaproprietary
input sampling scheme that reduces the average input
current several orders of magnitude when compared to
conventional delta sigma converters.
n
Internal Reference, High Accuracy 10ppm/°C (Max)
n
Single-Ended (LTC2460) or Differential (LTC2462)
n
2LSB Offset Error
0.01% Gain Error
60 Conversions Per Second
n
n
n
Single Conversion Settling Time for Multiplexed
Applications
n
Single-Cycle Operation with Auto Shutdown
n
1.5mA Supply Current
2µA (Max) Sleep Current
n
n
Internal Oscillator—No External Components Required
n
SPI Interface
n
Ultra-Tiny 12-Lead 3mm × 3mm DFN and MSOP
Packages
Following a single conversion, the LTC2460/LTC2462
automatically power down the converter and can also be
configured to power down the reference. When both the
ADC and reference are powered down, the supply current
is reduced to 200nA.
applicaTions
n
System Monitoring
n
Environmental Monitoring
n
Direct Temperature Measurements
n
Instrumentation
n
The LTC2460/LTC2462 can sample at 60 conversions per
second, and due to the very large oversampling ratio,
have extremely relaxed antialiasing requirements. Both
includecontinuousinternaloffsetandfullscalecalibration
algorithms which are transparent to the user, ensuring
accuracy over time and the operating temperature range.
Industrial Process Control
n
Data Acquisition
n
Embedded ADC Upgrades
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks and
No Latency ∆∑ is a trademark of Linear Technology Corporation. All other trademarks are the
property of their respective owners. Protected by U.S. Patents including 6208279, 6411242,
7088280, 7164378.
Typical applicaTion
VREF vs Temperature
1.2520
2.7V TO 5.5V
1.2515
1.2510
1.2505
1.2500
1.2495
1.2490
1.2485
1.2480
0.1µF
0.1µF
COMP
0.1µF
10µF
0.1µF
10k
REFOUT
V
CC
+
–
IN
SCK
10k
10k
SPI
INTERFACE
LTC2462
SDO
IN
CS
0.1µF
–
REF
GND
R
24602 TA01a
–50 –30 –10 10
30
50
70
90
TEMPERATURE (°C)
24602 TA01b
24602fa
1
LTC2460/LTC2462
absoluTe MaxiMuM raTings
(Notes 1, 2)
Supply Voltage (V ) ................................... –0.3V to 6V
Storage Temperature Range .................. –65°C to 150°C
Operating Temperature Range
CC
Analog Input Voltage
+
–
–
(IN , IN , IN, REF ,
LTC2460C/LTC2462C............................... 0°C to 70°C
LTC2460I/LTC2462I.............................–40°C to 85°C
COMP, REFOUT) ...........................–0.3V to (V + 0.3V)
CC
Digital Voltage
(V , V , V , V ) ................–0.3V to (V + 0.3V)
SDI SDO SCK CS
CC
pin conFiguraTion
LTC2462
LTC2462
TOP VIEW
TOP VIEW
1
2
3
4
5
6
12
11
10
9
V
CC
REFOUT
COMP
CS
1
2
3
4
5
6
REFOUT
COMP
CS
12 V
CC
GND
11 GND
–
IN
–
+
10 IN
+
IN
SDI
SDI
SCK
SDO
9
8
7
IN
–
–
REF
8
REF
GND
SCK
7
GND
SDO
MS PACKAGE
12-LEAD PLASTIC MSOP
DD PACKAGE
12-LEAD (3mm × 3mm) PLASTIC DFN
T
= 125°C, θ = 120°C/W
T
= 125°C, θ = 43°C/W
JA
JMAX
JA
JMAX
EXPOSED PAD (PIN 13) PCB GROUND CONNECTION OPTIONAL
LTC2460
LTC2460
TOP VIEW
TOP VIEW
1
2
3
4
5
6
12
11
10
9
V
CC
REFOUT
COMP
CS
1
2
3
4
5
6
REFOUT
COMP
CS
12 V
CC
11 GND
10 GND
GND
GND
IN
SDI
SDI
SCK
SDO
9
8
7
IN
REF
GND
–
–
REF
8
SCK
7
GND
SDO
MS PACKAGE
DD PACKAGE
12-LEAD (3mm × 3mm) PLASTIC DFN
= 125°C, θ = 43°C/W
12-LEAD PLASTIC MSOP
T
= 125°C, θ = 120°C/W
T
JMAX
JA
JMAX
JA
EXPOSED PAD (PIN 13) PCB GROUND CONNECTION OPTIONAL
orDer inForMaTion
LEAD FREE FINISH
LTC2460CDD#PBF
LTC2460IDD#PBF
LTC2460CMS#PBF
LTC2460IMS#PBF
LTC2462CDD#PBF
LTC2462IDD#PBF
LTC2462CMS#PBF
LTC2462IMS#PBF
TAPE AND REEL
PART MARKING*
LFDQ
PACKAGE DESCRIPTION
TEMPERATURE RANGE
0°C to 70°C
LTC2460CDD#TRPBF
LTC2460IDD#TRPBF
LTC2460CMS#TRPBF
LTC2460IMS#TRPBF
LTC2462CDD#TRPBF
LTC2462IDD#TRPBF
LTC2462CMS#TRPBF
LTC2462IMS#TRPBF
12-Lead Plastic (3mm × 3mm) DFN
12-Lead Plastic (3mm × 3mm) DFN
12-Lead Plastic MSOP-12
LFDQ
–40°C to 85°C
0°C to 70°C
2460
2460
12-Lead Plastic MSOP-12
–40°C to 85°C
0°C to 70°C
LDXM
LDXM
2462
12-Lead Plastic (3mm × 3mm) DFN
12-Lead Plastic (3mm × 3mm) DFN
12-Lead Plastic MSOP-12
–40°C to 85°C
0°C to 70°C
2462
12-Lead Plastic MSOP-12
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
24602fa
2
LTC2460/LTC2462
elecTrical characTerisTics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 2)
PARAMETER
CONDITIONS
(Note 3)
MIN
TYP
MAX
UNITS
Bits
l
l
l
Resolution (No Missing Codes)
Integral Nonlinearity
Offset Error
16
(Note 4)
1
10
15
LSB
2
LSB
Offset Error Drift
Gain Error
0.02
0.01
LSB/°C
l
Includes Contributions of ADC and Internal Reference
0.25 % of FS
Gain Error Drift
Includes Contributions of ADC and Internal Reference
C-Grade
I-Grade
l
l
2
5
10
ppm/°C
ppm/°C
Transition Noise
2.2
80
µV
RMS
Power Supply Rejection DC
dB
The l denotes the specifications which apply over the full operating temperature range, otherwise
analog inpuTs
specifications are at TA = 25°C.
SYMBOL
PARAMETER
CONDITIONS
LTC2462
MIN
0
TYP
MAX
UNITS
V
+
l
l
l
V
V
V
V
V
C
Positive Input Voltage Range
Negative Input Voltage Range
Input Voltage Range
V
V
V
IN
IN
IN
REF
REF
REF
–
LTC2462
0
V
LTC2460
0
V
+
–
+
–
+
–
, V
UR
, V
UR
Overrange/Underrange Voltage, IN
V
IN
V
IN
= 0.625V (See Figure 3)
= 0.625V (See Figure 3)
8
8
LSB
LSB
pF
OR
OR
IN
+
Overrange/Underrange Voltage, IN–
+
–
IN , IN , IN Sampling Capacitance
0.35
+
–
l
l
+
–
I
I
I
IN , IN DC Leakage Current (LTC2462)
IN DC Leakage Current (LTC2460)
V
V
= GND (Note 8)
–10
–10
1
1
10
10
nA
nA
DC_LEAK(IN , IN , IN)
IN
IN
= V (Note 8)
CC
–
l
l
–
IN DC Leakage Current
V
IN
V
IN
= GND (Note 8)
–10
–10
1
1
10
10
nA
nA
DC_LEAK(IN )
= V (Note 8)
CC
Input Sampling Current (Note 5)
Reference Output Voltage
50
nA
V
CONV
l
l
V
1.247
1.25
1.253
10
REF
Reference Voltage Coefficient
(Note 11)
C-Grade
I-Grade
2
5
ppm/°C
ppm/°C
Reference Line Regulation
2.7V ≤ V ≤ 5.5V
–90
dB
mA
CC
l
l
Reference Short Circuit Current
COMP Pin Short Circuit Current
Reference Load Regulation
Reference Output Noise Density
V
CC
V
CC
= 5.5, Forcing Output to GND
= 5.5, Forcing Output to GND
35
200
µA
2.7V ≤ V ≤ 5.5V, I
= 100μA Sourcing
= 0.1μF, At f = 1kHz
3.5
30
mV/mA
nV/√Hz
CC
OUT
C = 0.1μF, C
COMP REFOUT
The l denotes the specifications which apply over the full operating temperature
power requireMenTs
range, otherwise specifications are at TA = 25°C.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
l
V
CC
Supply Voltage
2.7
5.5
V
I
CC
Supply Current
Conversion
Nap
l
l
l
1.5
800
0.2
2.5
1500
2
mA
µA
µA
Sleep
24602fa
3
LTC2460/LTC2462
The l denotes the specifications which apply over the full
DigiTal inpuTs anD DigiTal ouTpuTs
operating temperature range,otherwise specifications are at TA = 25°C. (Note 2)
SYMBOL
PARAMETER
CONDITIONS
MIN
– 0.3
TYP
MAX
UNITS
V
l
l
l
V
IH
V
IL
High Level Input Voltage
Low Level Input Voltage
Digital Input Current
V
CC
0.3
10
V
I
IN
–10
µA
pF
V
C
V
V
Digital Input Capacitance
High Level Output Voltage
Low Level Output Voltage
Hi-Z Output Leakage Current
10
IN
l
l
l
I = –800µA
O
V
– 0.5
CC
OH
OL
I = 1.6mA
O
0.4
10
V
I
OZ
–10
µA
TiMing characTerisTics The l denotes the specifications which apply over the full operating temperature
range,otherwise specifications are at TA = 25°C.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
23
UNITS
ms
MHz
ns
l
l
l
l
l
l
l
l
l
l
t
f
t
t
t
t
t
t
t
t
Conversion Time
13
16.6
CONV
SCK
lSCK
hSCK
1
SCK Frequency Range
SCK Low Period
2
250
250
0
SCK High Period
ns
CS Falling Edge to SDO Low Z
CS Rising Edge to SDO High Z
CS Falling Edge to SCK Falling Edge
SCK Falling Edge to SDO Valid
SDI Setup Before SCK↑
SDI Hold After SCK↑
(Notes 7, 8)
(Notes 7, 8)
100
100
ns
0
ns
2
100
0
ns
3
(Note 7)
(Note 3)
(Note 3)
100
ns
KQ
4
100
100
ns
ns
5
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 5: CS = V . A positive current is flowing into the DUT pin.
CC
Note 6: SCK = V or GND. SDO is high impedance.
CC
Note 7: See Figure 4.
Note 8: See Figure 5.
Note 9: Input sampling current is the average input current drawn from the
input sampling network while the LTC2460/LTC2462 is actively sampling
the input.
Note 10: A positive current is flowing into the DUT pin.
Note 11: Temperature coefficient is calculated by dividing the maximum
Note 2. All voltage values are with respect to GND. V = 2.7V to 5.5V
CC
unless otherwise specified.
V
V
= V /2, FS = V
REF REF
REFCM
+
–
+
–
= V – V , –V ≤ V ≤ V ; V
= (V + V )/2.
IN IN
IN
IN
IN
REF
IN
REF INCM
Note 3. Guaranteed by design, not subject to test.
Note 4. Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual endpoints of the transfer curve.
Guaranteed by design and test correlation.
change in output voltage by the specified temperature range.
24602fa
4
LTC2460/LTC2462
Typical perForMance characTerisTics (TA = 25°C, unless otherwise noted)
Integral Nonlinearity
Integral Nonlinearity
Maximum INL vs Temperature
3
2
3
2
3
2
V
CC
= 5.5V, 4.1V, 2.7V
V
CC
= 5.5V
V
= 2.7V
CC
T
A
= –45°C, 25°C, 90°C
T = –45°C, 25°C, 90°C
A
1
1
1
0
0
0
–1
–2
–3
–1
–2
–3
–1
–2
–3
–1.25
–0.75
–0.25
0.25
0.75
1.25
–1.25
–0.75
–0.25
0.25
0.75
1.25
–55 –35 –15
5
25 45 65 85 105 125
DIFFERENTIAL INPUT VOLTAGE (V)
DIFFERENTIAL INPUT VOLTAGE (V)
TEMPERATURE (°C)
24602 G03
24602 G01
24602 G02
Offset Error vs Temperature
ADC Gain Error vs Temperature
Transition Noise vs Temperature
25
20
15
10
5
10
9
8
7
6
5
4
3
2
1
0
5
4
V
CC
= 5.5V
V
CC
= 5.5V
3
2
V
CC
= 4.1V
1
V
CC
= 2.7V
0
–1
–2
–3
–4
–5
V
= 4.1V
= 2.7V
CC
V
= 2.7V
= 5.5V
30
CC
V
V
CC
CC
0
–50
–25
0
25
50
75
100
–50 –30 –10 10
50
70
90
–50 –30 –10 10
30
50
70
90
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
24602 G05
24602 G06
24602 G04
Conversion Mode Power Supply
Current vs Temperature
Sleep Mode Power Supply
Current vs Temperature
VREF vs Temperature
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
350
300
250
200
150
100
50
1.2508
1.2507
1.2506
1.2505
1.2504
1.2503
1.2502
V
CC
= 5.5V
V
CC
= 5.5V
V
CC
= 4.1V
V
CC
= 2.7V
V
CC
= 4.1V
V
= 2.7V
30
CC
0
–50 –30 –10 10
30
50
70
90
–50 –30 –10 10
50
70
90
–50 –30 –10 10
30
50
70
90
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
24602 G07
24602 G08
24602 G09
24602fa
5
LTC2460/LTC2462
Typical perForMance characTerisTics (TA = 25°C, unless otherwise noted)
Power Supply Rejection
vs Frequency at VCC
Conversion Time vs Temperature
VREF vs VCC
0
–20
21
20
19
18
17
16
15
14
1.24892
1.24891
1.24890
1.24889
1.24888
1.24887
1.24886
1.24885
1.24884
T
= 25°C
A
–40
V
= 5V, 4.1V, 3V
CC
–60
–80
–100
–120
1
10 100 1k 10k 100k 1M 10M
–50
–25
0
25
50
75
100
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
(V)
FREQUENCY AT V (Hz)
CC
TEMPERATURE (°C)
V
CC
24602 G10
24602 G11
24602 G12
pin FuncTions
REFOUT (Pin 1): Reference Output Pin. Nominally 1.25V,
this voltage sets the fullscale input range of the ADC. For
noise and reference stability connect to a 0.1µF capacitor
tied to GND. This capacitor value must be less than or
equal to the capacitor tied to the reference compensation
pin (COMP). REFOUT cannot be overdriven by an external
reference. For applications that require an input range
greater than 0V to 1.25V, please refer to the LTC2450/
LTC2452.
SDO (Pin 6): Three-State Serial Data Output. SDO is used
for serial data output during the DATA INPUT/OUTPUT
state and can be used to monitor the conversion status.
GND (Pins 7, 11): Ground. Connect directly to the ground
plane through a low impedance connection.
–
REF (Pin 8): Negative Reference Input to the ADC. The
voltage on this pin sets the zero input to the ADC. This
pin should tie directly to ground or the ground sense of
the input sensor.
COMP (Pin 2): Internal Reference Compensation Pin. For
low noise and reference stability, tie a 0.1μF capacitor to
GND.
+
IN (LTC2462), IN (LTC2460) (Pin 9): Positive input volt-
age for the LTC2462 differential device. ADC input for the
LTC2460 single-ended device.
CS (Pin 3): Chip Select (Active LOW) Digital Input. A LOW
on this pin enables the SDO output. A HIGH on this pin
places the SDO output pin in a high impedance state and
any inputs on SDI and SCK will be ignored.
–
IN (LTC2462), GND (LTC2460) (Pin 10): Negative input
voltage for the LTC2462 differential device. GND for the
LTC2460 single-ended device.
V
(Pin12):PositiveSupplyVoltage. BypasstoGNDwith
SDI (Pin 4): Serial Data Input Pin. This pin is used to pro-
CC
a 10μF capacitor in parallel with a low-series-inductance
gramthesleepmodeand30Hz/60Hzoutputrate(LTC2460).
0.1μF capacitor located as close to the device as possible.
SCK (Pin 5): Serial Clock Input. SCK synchronizes the
serial data input/output. Once the conversion is complete,
a new data bit is produced at the SDO pin following each
SCK falling edge. Data is shifted into the SDI pin on each
rising edge of SCK.
Exposed Pad (Pin 13 – DFN Package): Ground. Connect
directly to the ground plane through a low impedance
connection.
24602fa
6
LTC2460/LTC2462
block DiagraM
1
2
12
REFOUT
COMP
V
CC
3
CS
INTERNAL
REFERENCE
5
∆Σ A/D
CONVERTER
SPI
INTERFACE
SCK
9
+
IN
6
4
SDO
SDI
(IN)
DECIMATING
SINC FILTER
–
∆Σ A/D
CONVERTER
10
–
IN
INTERNAL
OSCILLATOR
(GND)
–
REF
GND
7,11,13 (DD PACKAGE)
8
24602 BD
( ) PARENTHESIS INDICATE LTC2460
Figure 1. Functional Block Diagram
applicaTions inForMaTion
CONVERTER OPERATION
POWER-ON RESET
CONVERT
Converter Operation Cycle
The LTC2460/LTC2462 are low power, delta sigma, ana-
log to digital converters with a simple SPI interface (see
Figure 1). The LTC2462 has a fully differential input while
the LTC2460 is single-ended. Both are pin and software
compatible. Their operation is composed of three distinct
states: CONVERT, SLEEP/NAP, and DATA INPUT/OUTPUT.
The operation begins with the CONVERT state (see Fig-
ure 2). Once the conversion is finished, the converter
automatically powers down (NAP) or under user control,
both the converter and reference are powered down
(SLEEP). The conversion result is held in a static register
while the device is in this state. The cycle concludes with
the DATA INPUT/OUTPUT state. Once all 16-bits are read
or an abort is initiated the device begins a new conversion.
SLEEP/NAP
NO
CS = LOW?
YES
DATA INPUT/OUTPUT
16TH FALLING
EDGE OF SCK
OR
NO
YES
24602 F02
CS = HIGH?
TheCONVERTstatedurationisdeterminedbytheLTC2460/
LTC2462 conversion time (nominally 16.6 milliseconds).
Oncestarted, thisoperationcannotbeabortedexceptbya
Figure 2. LTC2460/LTC2462 State Transition Diagram
low power supply condition (V < 2.1V) which generates
CC
While in the SLEEP/NAP state, when chip select input is
HIGH (CS = HIGH), the LTC2460/LTC2462’s converters
are powered down. This reduces the supply current by
approximately 50%. While in the Nap state the reference
remainspoweredup.Inordertopowerdownthereference
in addition to the converter, the user can select the SLEEP
24602fa
an internal power-on reset signal.
Afterthecompletionofaconversion,theLTC2460/LTC2462
enters the SLEEP/NAP state and remains there until the
chip select is LOW (CS = LOW). Following this condition,
the ADC transitions into the DATA INPUT/OUTPUT state.
7
LTC2460/LTC2462
applicaTions inForMaTion
mode during the DATA INPUT/OUTPUT state. Once the
next conversion is complete, the SLEEP state is entered
and power is reduced to less than 2μA. The reference is
powered up once CS is brought low. The reference startup
timeis12ms(ifthereferenceandcompensationcapacitor
values are both 0.1μF).
cycle. If SLP = 1, the reference powers down following
the next conversion cycle. The remaining 12 SDI input
bits are ignored (don’t care).
SDI may also be tied directly to GND or V in order to
DD
simplify the user interface. In the case of the LTC2460,
the 60Hz output rate is selected if SDI is tied low and
the 30Hz output rate is selected if SDI is tied to V . The
UponenteringtheDATAINPUT/OUTPUTstate,SDOoutputs
the sign (D15) of the conversion result. During this state,
the ADC shifts the conversion result serially through the
SDO output pin under the control of the SCK input pin.
There is no latency in generating this data and the result
corresponds to the last completed conversion. A new bit
of data appears at the SDO pin following each falling edge
detected at the SCK input pin and appears from MSB to
LSB. The user can reliably latch this data on every rising
edge of the external serial clock signal driving the SCK pin.
DD
LTC2462 output rate is always 60Hz independent of SDI
or SPD. The reference sleep mode is disabled for both
the LTC2460 and LTC2462 if SDI is tied to GND or V .
DD
The DATA INPUT/OUTPUT state concludes in one of two
differentways.First,theDATAINPUT/OUTPUTstateopera-
tion is completed once all 16 data bits have been shifted
out and the clock then goes low. This corresponds to the
th
16 falling edge of SCK. Second, the DATA INPUT/OUT-
PUT state can be aborted at any time by a LOW-to-HIGH
transition on the CS input. Following either one of these
twoactions,theLTC2460/LTC2462willentertheCONVERT
state and initiate a new conversion cycle.
During the DATA INPUT/OUTPUT state, the LTC2460/
LTC2462 can be programmed to SLEEP or NAP (default)
followingthenextconversioncycle.Dataisshiftedintothe
device through the SDI pin on the rising edge of SCK. The
input word is 4 bits. If the first bit EN1 = 1 and the second
bit EN2 = 0 the device is enabled for programming. The
following two bits (SPD and SLP) will be written into the
device. SPD(onlyusedfortheLTC2460)toselectthe60Hz
output rate, no offset calibration mode (SPD = 0, default).
Set SPD = 1 for 30Hz mode with offset calibration. SPD
is ignored for the LTC2462. The next bit (SLP) enables
the sleep or nap mode. If SLP = 0 (default) the reference
remains powered up at the end of the next conversion
Power-Up Sequence
When the power supply voltage (V ) applied to the con-
CC
verter is below approximately 2.1V, the ADC performs a
power-on reset. This feature guarantees the integrity of
the conversion result.
WhenV rises above this criticalthreshold, the converter
CC
generates an internal power-on reset (POR) signal for
approximately 0.5ms. The POR signal clears all internal
registers.FollowingthePORsignal,theLTC2460/LTC2462
startaconversioncycleandfollowthesuccessionofstates
shown in Figure 2. The reference startup time following a
20
16
12
8
POR is 12ms (C
= C
= 0.1μF). The first conver-
COMP
REFOUT
sion following powerup will be invalid since the reference
voltage has not completely settled. The first conversion
following power up can be discarded using the data abort
command or simply read and ignored. The following con-
versions are accurate to the device specifications.
4
0
–4
SIGNALS
–8
BELOW
GND
–12
–16
–20
Ease of Use
–0.001 –0.005
0
V
0.005 0.001 0.0015
+
The LTC2460/LTC2462 data output has no latency, filter
settling delay or redundant results associated with the
conversion cycle. There is a one-to-one correspondence
+
/V
IN REF
24602 F03
Figure 3. Output Code vs VIN+ with VIN– = 0 (LTC2462)
24602fa
8
LTC2460/LTC2462
applicaTions inForMaTion
between the conversion and the output data. Therefore,
multiplexing multiple analog input voltages requires no
special actions.
Input Voltage Range (LTC2462)
AsmentionedintheOutputDataFormatsection,theoutput
+
–
code is given as 32768 • (V – V )/V + 32768. For
IN
IN
REF
+
–
The LTC2460/LTC2462 perform offset calibrations every
conversion. This calibration is transparent to the user and
hasnoeffectuponthecyclicoperationdescribedpreviously.
The advantage of continuous calibration is stability of the
ADC performance with respect to time and temperature.
(V – V ) ≥ V , the output code is clamped at 65535
(all ones). For (V – V ) ≤ –V , the output code is
IN
IN
REF
IN
+
–
IN
REF
clamped at 0 (all zeroes).
The LTC2462 includes a proprietary architecture that
can, typically, digitize each input up to 8 LSBs above V
REF
TheLTC2460/LTC2462includeaproprietaryinputsampling
scheme that reduces the average input current by several
orders of magnitude when compared to traditional delta-
sigma architectures. This allows external filter networks
to interface directly to the LTC2460/LTC2462. Since the
average input sampling current is 50nA, an external RC
lowpass filter using 1kΩ and 0.1µF results in <1LSB
additional error. Additionally, there is negligible leakage
and below GND, if the differential input is within V
.
REF
As an example (Figure 3), if the user desires to measure
–
a signal slightly below ground, the user could set V
IN
+
= GND, and V = 1.25V. If V = GND, the output code
REF
IN
+
would be approximately 32768. If V = GND – 8LSB =
IN
–0.305mV,theoutputcodewouldbeapproximately32760.
For applications that require an input range greater than
1.25V, please refer to the LTC2452.
+
–
current between IN and IN .
Output Data Format
Input Voltage Range (LTC2460)
The LTC2460/LTC2462 generates a 16-bit direct binary
encoded result. It is provided as a 16-bit serial stream
through the SDO output pin under the control of the SCK
input pin (see Figure 4).
Ignoring offset and full-scale errors, the LTC2460 will
theoretically output an “all zero” digital result when the
input is at ground (a zero scale input) and an “all one”
digital result when the input is at V (V
= 1.25V).
The LTC2462 (differential input) output code is given by
REF REFOUT
+
–
In an under-range condition, for all input voltages below
zeroscale,theconverterwillgeneratetheoutputcode0.In
an over-range condition, for all input voltages greater than
32768 • (V – V )/V
+ 32768. The first bit output
IN
IN
REF
+
by the LTC2462, D15, is the MSB, which is 1 for V
≥
IN
–
+
–
V
IN
and 0 for V < V . This bit is followed by succes-
IN IN
V
, the converter will generate the output code 65535.
sively less significant bits (D14, D13, …) until the LSB is
REF
For applications that require an input range greater than
output by the LTC2462, see Table 1.
0V to 1.25V, please refer to the LTC2450.
t
3
t
2
t
1
CS
D
D
D
D
D
11
D
D
9
D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
D
0
15
14
13
12
10
1
MSB
LSB
SDO
SCK
t
t
t
hSCK
KQ
lSCK
EN1
EN2
SPD* SLP
DON’T CARE
SDI
24602 F04
t
5
t
6
*SPD IS A DON’T CARE BIT FOR THE LTC2462
Figure 4. Data Input/Output Timing
24602fa
9
LTC2460/LTC2462
applicaTions inForMaTion
Table 1. LTC2460/LTC2462 Output Data Format
SINGLE ENDED INPUT V
(LTC2460)
DIFFERENTIAL INPUT VOLTAGE
D15
(MSB)
D14
D13
D12...D2
D1
D0
(LSB)
CORRESPONDING
DECIMAL VALUE
IN
+
–
V
– V (LTC2462)
IN
IN
≥V
≥V
1
1
1
1
1
0
0
0
0
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
0
1
0
1
0
1
0
65535
65534
49152
49151
32768
32767
16384
16383
0
REF
REF
V
– 1LSB
V
– 1LSB
REF
REF
0.75 • V
0.5 • V
REF
REF
0.75 • V – 1LSB
0.5 • V – 1LSB
REF
REF
0.5 • V
0
REF
0.5 • V – 1LSB
–1LSB
REF
0.25 • V
–0.5 • V
REF
REF
0.25 • V – 1LSB
–0.5 • V – 1LSB
REF
REF
0
≤ –V
REF
The LTC2460 (single-ended input) output code is a direct
binary encoded result, see Table 1.
the next conversion is complete. It will remain powered
down until CS is pulled low. The reference startup time
is approximately 12ms. In order to ensure a stable refer-
ence for the following conversions, either the data input/
output time should be delayed 12ms after CS goes low or
the first conversion following a reference start up should
be discarded. If SDI is tied HIGH (LTC2460 operating in
30Hz mode) the SLP mode is disabled.
During the data output operation the CS input pin must
be pulled low (CS = LOW). The data output process starts
with the most significant bit of the result being present at
the SDO output pin (SDO = D15) once CS goes low. A new
data bit appears at the SDO output pin after each falling
edge detected at the SCK input pin. The output data can
be reliably latched on the rising edge of SCK.
Conversion Status Monitor
Data Input Format
For certain applications, the user may wish to monitor the
LTC2460/LTC2462conversionstatus.Thiscanbeachieved
by holding SCK HIGH during the conversion cycle. In
this condition, whenever the CS input pin is pulled low
(CS = LOW), the SDO output pin will provide an indication
of the conversion status. SDO = HIGH is an indication of
a conversion cycle in progress while SDO = LOW is an
indication of a completed conversion cycle. An example
of such a sequence is shown in Figure 5.
The data input word is 4 bits long and consists of two en-
able bits (EN1 and EN2) and two programming bits (SPD
and SLP). EN1 is applied to the first rising edge of SCK
after the conversion is complete. Programming is enabled
by setting EN1 = 1 and EN2 = 0.
The speed bit (SPD) is only used by the LTC2460. In the
default mode, SPD = 0, the output rate is 60Hz and con-
tinuousbackgroundoffsetcalibrationisnotperformed. By
changing the SPD bit to 1, background offset calibration is
performed and the output rate is reduced to 30Hz. Alterna-
Conversion status monitoring, while possible, is not re-
quired for the LTC2460/LTC2462 as its conversion time is
fixed and typically 16.6ms (23ms maximum). Therefore,
externaltimingcanbeusedtodeterminethecompletionofa
conversion cycle.
tively, SDI can be tied directly to ground (SPD = 0) or V
CC
(SPD = 1), eliminating the need to program the device. The
LTC2462 data output rate is always 60Hz and background
offset calibration is performed (SPD = don’t care).
SERIAL INTERFACE
The sleep bit (SLP) is used to power down the on chip
reference. In the default mode, the reference remains
powered up even when the ADC is powered down. If the
SLP bit is set HIGH, the reference will power down after
The LTC2460/LTC2462 transmit the conversion result and
receive the start of conversion command through a syn-
chronous 2-, 3- or 4-wire interface. This interface can be
24602fa
10
LTC2460/LTC2462
applicaTions inForMaTion
t
1
t
2
CS
SDO
SDI = LOW
SCK = HIGH
CONVERT
NAP
24602 F05
Figure 5. Conversion Status Monitoring Mode
used during the CONVERT and SLEEP states to assess the
conversion status and during the DATA OUTPUT state to
readtheconversionresult,andtotriggeranewconversion.
4) When SCK = HIGH, it is possible to monitor the conver-
sion status by pulling CS low and watching for SDO to
go low. This feature is available only in the idle-high
(CPOL = 1) mode.
Serial Interface Operation Modes
Serial Clock Idle-High (CPOL = 1) Examples
The modes of operation can be summarized as follows:
In Figure 6, following a conversion cycle the LTC2460/
LTC2462 automatically enter the NAP mode with the ADC
powereddown.TheADC’sreferencewillpowerdownifthe
SLPbitwassethighpriortothejustcompletedconversion
and CS is HIGH. Once CS goes low, the device powers up.
The user can monitor the conversion status at convenient
intervals using CS and SDO.
1) The LTC2460/LTC2462 function with SCK idle high
(commonly known as CPOL = 1) or idle low (commonly
known as CPOL = 0).
2) After the 16th bit is read, a new conversion is started
if CS is pulled high or SCK is pulled low.
3) At any time during the Data Output state, pulling CS
high causes the part to leave the I/O state, abort the
output and begin a new conversion.
Pulling CS LOW while SCK is HIGH tests whether
or not the chip is in the CONVERT state. While in
the CONVERT state, SDO is HIGH while CS is LOW.
Once the conversion is complete, SDO is LOW
CS
D
D
14
D
13
D
12
D
D
D
0
15
2
1
SD0
SCK
clk
1
clk
2
clk
3
clk
4
clk
15
clk
16
EN1
EN2
SPD
SLP
DATA OUTPUT
SDI
CONVERT
NAP
CONVERT
24602 F06
Figure 6. Idle-High (CPOL = 1) Serial Clock Operation Example.
The Rising Edge of CS Starts a New Conversion
24602fa
11
LTC2460/LTC2462
applicaTions inForMaTion
while CS is LOW. These tests are not required op-
erational steps but may be useful for some applications.
ThetimingdiagraminFigure9isidenticaltothatofFigure 8,
except in this case a new conversion is triggered by SCK.
The 16th SCK falling edge triggers a new conversion cycle
and the CS signal is subsequently pulled high.
Whenthedataisavailable, theuserapplies16clockcycles
to transfer the result. The CS rising edge is then used to
initiate a new conversion.
Examples of Aborting Cycle using CS
The operation example of Figure 7 is identical to that of
Figure 6, except the new conversion cycle is triggered by
the falling edge of the serial clock (SCK).
For some applications, the user may wish to abort the I/O
cycleandbeginanewconversion.IftheLTC2460/LTC2462
are in the data output state, a CS rising edge clears the
remainingdatabitsfromtheoutputregister,abortstheout-
put cycle and triggers a new conversion. Figure 10 shows
an example of aborting an I/O with idle-high (CPOL = 1)
and Figure 11 shows an example of aborting an I/O with
idle-low (CPOL = 0).
Serial Clock Idle-Low (CPOL = 0) Examples
In Figure 8, following a conversion cycle the LTC2460/
LTC2462 automatically enters the NAP state. The device
reference will power down if the SLP bit was set high
prior to the just completed conversion and CS is HIGH.
Once CS goes low, the reference powers up. The user
determines data availability (and the end of conversion)
based upon external timing. The user then pulls CS low
(CS = ↓) and uses 16 clock cycles to transfer the result.
Followingthe16thrisingedgeoftheclock,CSispulledhigh
(CS = ↑), which triggers a new conversion.
A new conversion cycle can be triggered using the CS
signal without having to generate any serial clock pulses
as shown in Figure 12. If SCK is maintained at a low logic
level, after the end of a conversion cycle, a new conver-
sion operation can be triggered by pulling CS low and
then high. When CS is pulled low (CS = LOW), SDO will
CS
D
15
D
14
D
13
D
12
D
2
D
1
D
0
SD0
SCK
clk
1
clk
2
clk
3
clk
4
clk
15
clk
16
clk
17
EN1
EN2
SPD
SLP
DATA OUTPUT
SDI
CONVERT
NAP
CONVERT
24602 F07
Figure 7. Idle-High (CPOL = 1) Clock Operation Example.
A 17th Clock Pulse is Used to Trigger a New Conversion Cycle
CS
D
15
D
14
D
13
D
12
D
2
D
1
D
0
SD0
SCK
clk
1
clk
2
clk
3
clk clk
clk
15
clk
16
4
14
EN1
EN2
SPD
SLP
DATA OUTPUT
SDI
CONVERT
NAP
CONVERT
24602 F08
Figure 8. Idle-Low (CPOL = 0) Clock. CS Triggers a New Conversion
24602fa
12
LTC2460/LTC2462
applicaTions inForMaTion
CS
D
D
D
D
D
D
D
0
15
14
13
12
2
1
SD0
SCK
clk
1
clk
2
clk
3
clk
4
clk
14
clk
15
clk
16
EN1
EN2
SPD
SLP
DATA OUTPUT
SDI
CONVERT
NAP
CONVERT
24602 F09
Figure 9. Idle-Low (CPOL = 0) Clock. The 16th SCK Falling Edge Triggers a New Conversion
CS
D
D
D
13
15
14
SD0
SCK
clk
1
clk
2
clk
3
clk
4
EN1
EN2
SPD
SLP
SDI
CONVERT
NAP
DATA OUTPUT
CONVERT
24602 F10
Figure 10. Idle-High (CPOL = 1) Clock and Aborted I/O Example
CS
D
D
D
13
15
14
SD0
SCK
clk
1
clk
2
clk
3
EN1
EN2
SPD
SLP
SDI
CONVERT
NAP
DATA OUTPUT
CONVERT
24602 F11
Figure 11. Idle-Low (CPOL = 0) Clock and Aborted I/O Example
CS
D
15
SD0
SDI = DON’T CARE
SCK = LOW
CONVERT
NAP
DATA OUTPUT
CONVERT
24602 F12
Figure 12. Idle-Low (CPOL = 0) Clock and Minimum Data Output Length Example
24602fa
13
LTC2460/LTC2462
applicaTions inForMaTion
output the sign (D15) of the result of the just completed
conversion. While a low logic level is maintained at SCK
pin and CS is subsequently pulled high (CS = HIGH) the
remaining 15 bits of the result (D14:D0) are discarded
and a new conversion cycle starts.
Figure 13 shows a 2-wire operation sequence which uses
anidle-high(CPOL=1)serialclocksignal. Theconversion
status can be monitored at the SDO output. Following a
conversion cycle, the ADC enters the data output state
and the SDO output transitions from HIGH to LOW. Sub-
sequently 16 clock pulses are applied to the SCK input in
order to serially shift the 16 bit result. Finally, the 17th
clock pulse is applied to the SCK input in order to trigger
a new conversion cycle.
Following the aborted I/O, additional clock pulses in the
CONVERT state are acceptable, but excessive signal tran-
sitions on SCK can potentially create noise on the ADC
during the conversion, and thus may negatively influence
the conversion accuracy.
Figure 14 shows a 2-wire operation sequence which uses
an idle-low (CPOL = 0) serial clock signal. The conversion
status cannot be monitored at the SDO output. Following
aconversioncycle,theLTC2460/LTC2462enterstheDATA
OUTPUT state. At this moment the SDO pin outputs the
sign (D15) of the conversion result. The user must use
externaltiminginordertodeterminetheendofconversion
and result availability. Subsequently 16 clock pulses are
applied to SCK in order to serially shift the 16-bit result.
The 16th clock falling edge triggers a new conversion
cycle. For the LTC2460 tie SDI LOW for 60Hz output rate
and HIGH for 30Hz output rate.
2-Wire Operation
The2-wireoperationmodes,whilereducingthenumberof
requiredcontrolsignals,shouldbeusedonlyiftheLTC2460/
LTC2462 low power sleep capability is not required. In ad-
dition the option to abort serial data transfers is no longer
available. Hardwire CS to GND for 2-wire operation. For
the LTC2460, tie SDI LOW for 60Hz output rate and HIGH
for 30Hz output rate, for the LTC2462 tie SDI low.
CS = LOW
D
15
D
D
13
D
12
D
D
D
0
14
2
1
SD0
SCK
clk
1
clk
2
clk
3
clk
4
clk
15
clk
16
clk
17
CONVERT
DATA OUTPUT
CONVERT
SDI = 0 OR 1
24602 F13
Figure 13. 2-Wire, Idle-High (CPOL = 1) Serial Clock, Operation Example
CS = LOW
SD0
D
D
D
D
D
D
D
0
15
14
13
12
2
1
SCK
clk
1
clk
2
clk
3
clk clk
clk
15
clk
16
4
14
CONVERT
DATA OUTPUT
CONVERT
SDI = 0 OR 1
24602 F14
Figure 14. 2-Wire, Idle-Low (CPOL = 0) Serial Clock Operation Example
24602fa
14
LTC2460/LTC2462
applicaTions inForMaTion
PRESERVING THE CONVERTER ACCURACY
through these two decoupling capacitors, and returning
to the converter GND pin. The area encompassed by this
circuitpath,aswellasthepathlength,shouldbeminimized.
TheLTC2460/LTC2462aredesignedtominimizetheconver-
sion result’s sensitivity to device decoupling, PCB layout,
antialiasing circuits, line and frequency perturbations.
Nevertheless, inordertopreservethehighaccuracycapa-
bility of this part, some simple precautions are desirable.
–
As shown in Figure 15, REF is used as the negative refer-
ence voltage input to the ADC. This pin can be tied directly
to ground or kelvined to sensor ground. In the case where
–
REF is used as a sense input, it should be bypassed to
Digital Signal Levels
ground with a 0.1μF ceramic capacitor in parallel with a
10μF low ESR ceramic capacitor.
DuetothenatureofCMOSlogic,itisadvisabletokeepinput
digital signals near GND or V . Voltages in the range of
CC
Very low impedance ground and power planes, and star
0.5V to V – 0.5V may result in additional current leakage
CC
connectionsatbothV andGNDpins, arepreferable. The
CC
from the part. Undershoot and overshoot should also be
minimized, particularly while the chip is converting. It is
thus beneficial to keep edge rates of about 10ns and limit
overshoot and undershoot to less than 0.3V.
V
CC
pin should have two distinct connections: the first to
thedecouplingcapacitorsdescribedabove,andthesecond
to the ground return for the power supply voltage source.
REFOUT and COMP
Noisy external circuitry can potentially impact the output
under 2-wire operation. In particular, it is possible to get
the LTC2460/LTC2462 into an unknown state if an SCK
pulse is missed or noise triggers an extra SCK pulse.
In this situation, it is impossible to distinguish SDO = 1
(indicating conversion in progress) from valid “1” data
bits. As such, CPOL = 1 is recommended for the 2-wire
mode. The user should look for SDO = 0 before reading
data, and look for SDO = 1 after reading data. If SDO does
not return a “0” within the maximum conversion time (or
return a “1” after a full data read), generate 16 SCK pulses
to force a new conversion.
The on chip 1.25V reference is internally tied to the con-
verter’s reference input and is output to the REFOUT pin.
A 0.1μF capacitor should be placed on the REFOUT pin.
It is possible to reduce this capacitor, but the transition
INTERNAL
REFERENCE
V
V
V
V
CC
CC
CC
CC
R
SW
15k
I
I
LEAK
LEAK
(TYP)
REFOUT
R
SW
15k
I
I
LEAK
LEAK
Driving V and GND
(TYP)
CC
+
IN
InrelationtotheV andGNDpins, the LTC2460/LTC2462
CC
combinesinternalhighfrequencydecouplingwithdamping
elements, which reduce the ADC performance sensitivity
to PCB layout and external components. Nevertheless,
the very high accuracy of this converter is best pre-
served by careful low and high frequency power supply
decoupling.
C
EQ
R
SW
0.35pF
(TYP)
15k
I
I
LEAK
LEAK
(TYP)
–
IN
R
SW
A 0.1µF, high quality, ceramic capacitor in parallel with
a 10µF low ESR ceramic capacitor should be connected
15k
I
I
LEAK
LEAK
(TYP)
24602 F15
–
REF
between the V and GND pins, as close as possible to the
CC
package. The 0.1µF capacitor should be placed closest to
the ADC package. It is also desirable to avoid any via in the
circuit path, starting from the converter V pin, passing
Figure 15. LTC2460/LTC2462 Analog Input/Reference
Equivalent Circuit
CC
24602fa
15
LTC2460/LTC2462
applicaTions inForMaTion
noise increases. A 0.1μF capacitor should also be placed
on the COMP pin. This pin is tied to an internal point in the
reference and is used for stability. In order for the refer-
ence to remain stable the capacitor placed on the COMP
pin must be greater than or equal to the capacitor tied to
the REFOUT pin. The REFOUT pin cannot be overridden
by an external voltage. If a reference voltage greater than
1.25V is required, the LTC2450/LTC2452 should be used.
layout, C
has typical values between 2pF and 15pF. In
PAR
addition, the equivalent circuit of Figure 16 includes the
converter equivalent internal resistor R and sampling
capacitor C .
SW
EQ
V
CC
IN
R
SW
(LTC2460)
15k
I
LEAK
R
S
(TYP)
+
IN
(LTC2462)
I
I
LEAK
+
+
C
C
C
IN
EQ
SIG
I
I
CONV
–
0.35pF
(TYP)
C
PAR
DependingonthesizeofthecapacitorstiedtotheREFOUT
and COMP pins, the internal reference has a correspond-
ing start up time. This start up time is typically 12ms
when 0.1μF capacitors are used. At initial power up, the
first conversion result can be aborted or ignored. At the
completion of this first conversion, the reference has
settled and all subsequent conversions are valid.
V
CC
R
SW
15k
I
LEAK
R
S
(TYP)
–
IN
(LTC2462)
LEAK
–
+
C
IN
SIG
EQ
CONV
–
0.35pF
(TYP)
C
PAR
24602 F16
Figure 16. LTC2460/LTC2462 Input Drive Equivalent Circuit
If the reference is put to sleep (program SLP = 1 and
CS = 1) the reference is powered down after the next
conversion. This conversion result is valid. On CS falling
edge, the reference is powered up. In order to ensure the
reference output has settled before the next conversion,
the power up time can be extended by delaying the data
read 12ms after the falling edge of CS. Once all 16 bits
are read from the device or CS is brought HIGH, the next
conversion automatically begins. In the default operation,
the reference remains powered up at the conclusion of the
conversion cycle.
Therearesomeimmediatetrade-offsinR andC without
S
IN
needing a full circuit analysis. Increasing R and C can
S
IN
give the following benefits:
1) DuetotheLTC2460/LTC2462’sinputsamplingalgorithm,
+
–
the input current drawn by either V or V over a
IN
IN
conversion cycle is typically 50nA. A high R • C at-
S
IN
tenuates the high frequency components of the input
current, and R values up to 1k result in <1LSB error.
S
2) The bandwidth from V is reduced at the input pins
SIG
+
–
+
–
Driving V and V
IN
IN
(IN , IN or IN). This bandwidth reduction isolates the
ADC fromhigh frequency signals, andas suchprovides
simple antialiasing and input noise reduction.
The input drive requirements can best be analyzed using
the equivalent circuit of Figure 16. The input signal V is
SIG
+
–
connected to the ADC input pins (IN and IN ) through an
3) Switching transients generated by the ADC are attenu-
ated before they go back to the signal source.
equivalentsourceresistanceR .Thisresistorincludesboth
S
the actual generator source resistance and any additional
4) A large C gives a better AC ground at the input pins,
IN
optional resistors connected to the input pins. Optional
helping reduce reflections back to the signal source.
input capacitors C are also connected to the ADC input
IN
pins. This capacitor is placed in parallel with the ADC
5) Increasing R protects the ADC by limiting the current
S
input parasitic capacitance C . Depending on the PCB
during an outside-the-rails fault condition.
PAR
24602fa
16
LTC2460/LTC2462
applicaTions inForMaTion
There is a limit to how large R • C should be for a given
through low value sense resistors, temperature measure-
ments, low impedance voltage source monitoring, and so
S
IN
application. Increasing R beyond a given point increases
S
the voltage drop across R due to the input current,
on. The resultant INL vs V is shown in Figure 18. The
S
IN
to the point that significant measurement errors exist.
measurements of Figure 18 include a capacitor C
cor-
PAR
Additionally, forsomeapplications, increasingtheR • C
respondingtoaminimumsizedlayoutpadandaminimum
width input trace of about 1 inch length.
S
IN
product too much may unacceptably attenuate the signal
at frequencies of interest.
Signal Bandwidth, Transition Noise and Noise
Equivalent Input Bandwidth
For most applications, it is desirable to implement C as
IN
a high-quality 0.1µF ceramic capacitor and R ≤ 1k. This
S
1
The LTC2460/LTC2462 include a sinc type digital filter
capacitor should be located as close as possible to the
with the first notch located at f = 60Hz. As such, the
actualV packagepin.Furthermore,theareaencompassed
0
IN
3dB input signal bandwidth is 26.54Hz. The calculated
LTC2460/LTC2462 input signal attenuation vs frequency
over a wide frequency range is shown in Figure 19. The
calculated LTC2460/LTC2462 input signal attenuation vs
frequency at low frequencies is shown in Figure 20. The
by this circuit path, as well as the path length, should be
minimized.
In the case of a 2-wire sensor that is not remotely
grounded, it is desirable to split R and place series
S
resistors in the ADC input line as well as in the sensor
ground return line, which should be tied to the ADC GND
pin using a star connection topology.
converter noise level is about 2.2µV
and can be mod-
RMS
eled by a white noise source connected at the input of a
noise-free converter.
Figure 17 shows the measured LTC2462 INL vs Input
On a related note, the LTC2462 uses two separate A/D
converterstodigitizethepositiveandnegativeinputs. Each
Voltage as a function of R value with an input capacitor
S
C = 0.1µF.
IN
of these A/D converters has 2.2µV
transition noise.
RMS
Insomecases,R canbeincreasedabovetheseguidelines.
If one of the input voltages is within this small transition
noise band, then the output will fluctuate one bit, regard-
less of the value of the other input voltage. If both of the
input voltages are within their transition noise bands, the
output can fluctuate 2 bits.
S
The input current is zero when the ADC is either in sleep
or I/O modes. Thus, if the time constant of the input RC
circuit t = R • C , is of the same order of magnitude or
S
IN
longer than the time periods between actual conversions,
then one can consider the input current to be reduced
correspondingly.
Forasimplesystemnoiseanalysis,theV drivecircuitcan
IN
be modeled as a single-pole equivalent circuit character-
These considerations need to be balanced out by the input
ized by a pole location f and a noise spectral density n .
i
i
signal bandwidth. The 3dB bandwidth ≈ 1/(2pR C ).
If the converter has an unlimited bandwidth, or at least a
S IN
bandwidth substantially larger than f , then the total noise
i
Finally, if the recommended choice for C is unacceptable
IN
contribution of the external drive circuit would be:
fortheuser’sspecificapplication,analternatestrategyisto
eliminateC andminimizeC andR .Inpracticalterms,
Vn = ni p / 2 • fi
IN
PAR
S
thisconfigurationcorrespondstoalowimpedancesensor
directly connected to the ADC through minimum length
traces. Actual applications include current measurements
Then, the total system noise level can be estimated as
2
the square root of the sum of (V ) and the square of the
n
2
LTC2460/LTC2462 noise floor (~2.2µV ).
24602fa
17
LTC2460/LTC2462
applicaTions inForMaTion
3
3
2
C
V
T
= 0.1µF
= 5V
C
V
T
= 0
IN
CC
= 25°C
IN
CC
A
= 5V
= 25°C
2
1
A
R
= 10k
R = 10k
S
S
1
R
= 1k
S
R
S
= 0k
0
0
R
= 0k
R
S
= 1k
S
–1
–2
–3
–1
–2
–3
–1.25
–0.75
–0.25
0.25
0.75
1.25
–1.25
–0.75
–0.25
0.25
0.75
1.25
DIFFERENTIAL INPUT VOLTAGE (V)
DIFFERENTIAL INPUT VOLTAGE (V)
24602 F17
24602 F18
Figure 17. Measured INL vs Input Voltage
Figure 18. Measured INL vs Input Voltage
0
–20
0
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
–40
–60
–80
–100
0
5.0
7.5
1.00 1.25 1.50
2.5
0
60 120 180 240 300 360 420 480 540 600
INPUT SIGNAL FREQUENCY (Hz)
INPUT SIGNAL FREQUENCY (MHz)
24602 F19
24602 F20
Figure 19. LTC2462 Input Signal Attentuation vs Frequency
Figure 20. LTC2462 Input Signal Attenuation
vs Frequency (Low Frequencies)
24602fa
18
LTC2460/LTC2462
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DD Package
12-Lead Plastic DFN (3mm 3mm)
(Reference LTC DWG # 05-08-1725 Rev A)
0.70 0.05
2.38 0.05
1.65 0.05
3.50 0.05
2.10 0.05
PACKAGE
OUTLINE
0.25 0.05
0.45 BSC
2.25 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
R = 0.115
0.40 ± 0.10
TYP
7
12
2.38 0.10
1.65 ± 0.10
3.00 ±0.10
(4 SIDES)
PIN 1 NOTCH
PIN 1
TOP MARK
R = 0.20 OR
0.25 × 45°
CHAMFER
(SEE NOTE 6)
6
1
0.23 0.05
0.45 BSC
0.75 ±0.05
0.200 REF
2.25 REF
(DD12) DFN 0106 REV A
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
24602fa
19
LTC2460/LTC2462
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MS Package
12-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1668 Rev Ø)
0.889 ± 0.127
(.035 ± .005)
5.23
3.20 – 3.45
(.206)
(.126 – .136)
MIN
4.039 ± 0.102
(.159 ± .004)
(NOTE 3)
0.65
(.0256)
BSC
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.406 ± 0.076
(.016 ± .003)
REF
12 11 10 9 8 7
RECOMMENDED SOLDER PAD LAYOUT
DETAIL “A”
0° – 6° TYP
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
4.90 ± 0.152
(.193 ± .006)
0.254
(.010)
GAUGE PLANE
0.53 ± 0.152
(.021 ± .006)
1
2 3 4 5 6
0.86
(.034)
REF
1.10
(.043)
MAX
DETAIL “A”
0.18
(.007)
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.1016 ± 0.0508
(.004 ± .002)
MSOP (MS12) 1107 REV Ø
0.650
(.0256)
BSC
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
24602fa
20
LTC2460/LTC2462
revision hisTory
REV
DATE
DESCRIPTION
PAGE NUMBER
A
09/11 Updated Offset Error Maximum in the Electrical Characteristics table.
3
24602fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
21
LTC2460/LTC2462
Typical applicaTion
10µF
+
V
CC
V
V
CC
0.1µF
0.1µF
1µF
1
2
10V
5V
SCK SDO
CS
µC
1
12
U1*
6
4
7
5
CS
3
5
REFOUT
V
1k
CC
CS
10
9
+
+
–
SCK/SCL
MOSI/SDA
MISO/SDO
IN
IN
SCK
LTC2462
0.1µF
1k
6
4
SDO
SDI
–
IN
IN
GND GND GND
–
COMP REF GND
0.1µF
0.1µF
3
8
13
2
8
7, 11
0.1µF
24602 TA02
relaTeD parTs
PART NUMBER
DESCRIPTION
COMMENTS
LTC1860/LTC1861
12-Bit, 5V, 1-/2-Channel 250ksps SAR ADC in MSOP
850µA at 250ksps, 2µA at 1ksps, SO-8 and MSOP Packages
450µA at 150ksps, 10µA at 1ksps, SO-8 and MSOP Packages
850µA at 250ksps, 2µA at 1ksps, SO-8 and MSOP Packages
450µA at 150ksps, 10µA at 1ksps, SO-8 and MSOP Packages
3V Supply, 1.5mW at 100ksps, TSOT 6-pin/8-pin Packages
LTC1860L/LTC1861L 12-Bit, 3V, 1-/2-Channel 150ksps SAR ADC
LTC1864/LTC1865 16-Bit, 5V, 1-/2-Channel 250ksps SAR ADC in MSOP
LTC1864L/LTC1865L 16-bit, 3V, 1-/2-Channel 150ksps SAR ADC
LTC2360
LTC2440
LTC2480
12-Bit, 100ksps SAR ADC
200nV
Noise, 4kHz Output Rate, 15ppm INL
24-Bit No Latency ΔΣ™ADC
RMS
Easy-Drive Input Current Cancellation, 600nV
Tiny 10-Lead DFN Package
Noise,
Noise,
Noise,
Noise,
Noise,
Noise,
16-Bit, Differential Input, No Latency ΔΣ ADC, with PGA,
Temp. Sensor, SPI
RMS
RMS
RMS
RMS
RMS
RMS
LTC2481
LTC2482
LTC2483
LTC2484
LTC2485
Easy-Drive Input Current Cancellation, 600nV
Tiny 10-Lead DFN Package
16-Bit, Differential Input, No Latency ΔΣ ADC, with PGA,
2
Temp. Sensor, I C
Easy-Drive Input Current Cancellation, 600nV
Tiny 10-Lead DFN Package
16-Bit, Differential Input, No Latency ΔΣ ADC, SPI
2
Easy-Drive Input Current Cancellation, 600nV
Tiny 10-Lead DFN Package
16-Bit, Differential Input, No Latency ΔΣ ADC, I C
Easy-Drive Input Current Cancellation, 600nV
Tiny 10-Lead DFN Package
24-Bit, Differential Input, No Latency ΔΣ ADC, SPI with
Temp. Sensor
2
Easy-Drive Input Current Cancellation, 600nV
Tiny 10-Lead DFN Package
24-Bit, Differential Input, No Latency ΔΣ ADC, I C with
Temp. Sensor
LTC6241
LTC2450
Dual, 18MHz, Low Noise, Rail-to-Rail Op Amp
550nV Noise, 125µV Offset Max
P-P
Easy-to-Use, Ultra-Tiny 16-Bit ADC, SPI, 0V to 5.5V Input
Range
2 LSB INL, 50nA Sleep current, Tiny 2mm × 2mm DFN-6 Package,
30Hz Output Rate
LTC2450-1
LTC2451
LTC2452
LTC2453
Easy-to-Use, Ultra-Tiny 16-Bit ADC, SPI, 0V to 5.5V Input
Range
2 LSB INL, 50nA Sleep Current, Tiny 2mm × 2mm DFN-6 Package,
60Hz Output Rate
2
Easy-to-Use, Ultra-Tiny 16-Bit ADC, I C, 0V to 5.5V Input
2 LSB INL, 50nA Sleep Current, Tiny 3mm × 2mm DFN-8 or TSOT
Package, Programmable 30Hz/60Hz Output Rates
Range
Easy-to-Use, Ultra-Tiny 16-Bit Differential ADC, SPI, 5.5V
Input Range
2 LSB INL, 50nA Sleep Current, Tiny 3mm × 2mm DFN-8 or TSOT
Package
2
Easy-to-Use, Ultra-Tiny 16-Bit Differential ADC, I C, 5.5V
2 LSB INL, 50nA Sleep Current, Tiny 3mm × 2mm DFN-8 or TSOT
Package
Input Range
24602fa
LT 0911 REV A • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
22
l
l
LINEAR TECHNOLOGY CORPORATION 2009
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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