LTC3418 [Linear]
8A, 4MHz, Monolithic Synchronous Step-Down Regulator; 8A ,为4MHz ,单片同步降压型稳压器型号: | LTC3418 |
厂家: | Linear |
描述: | 8A, 4MHz, Monolithic Synchronous Step-Down Regulator |
文件: | 总20页 (文件大小:291K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC3418
8A, 4MHz, Monolithic
Synchronous Step-Down
Regulator
U
FEATURES
DESCRIPTIO
The LTC®3418 is a high efficiency, monolithic synchro-
nous step-down DC/DC converter utilizing a constant
frequency, current mode architecture. It operates from an
input voltage range of 2.25V to 5.5V and provides a
regulated output voltage from 0.8V to 5V while delivering
up to 8A of output current. The internal synchronous
power switch increases efficiency and eliminates the need
for an external Schottky diode. Switching frequency is set
by an external resistor or can be synchronized to an
external clock. OPTI-LOOP® compensation allows the
transient response to be optimized over a wide range of
loads and output capacitors.
■
High Efficiency: Up to 95%
■
8A Output Current
■
2.25V to 5.5V Input Voltage Range
Low RDS(ON) Internal Switch: 35mΩ
■
■
Tracking Input to Provide Easy Supply Sequencing
■
Programmable Frequency: 300kHz to 4MHz
■
0.8V ±1% Reference Allows Low Output Voltage
■
Quiescent Current: 380µA
Selectable Forced Continuous/Burst Mode® Operation
■
with Adjustable Burst Clamp
■
Synchronizable Switching Frequency
■
Low Dropout Operation: 100% Duty Cycle
■
Power Good Output Voltage Monitor
Overtemperature Protected
The LTC3418 can be configured for either Burst Mode
operationorforcedcontinuousoperation.Forcedcontinu-
ous operation reduces noise and RF interference while
Burst Mode operation provides high efficiency by reduc-
ing gate charge losses at light loads. In Burst Mode
operation, external control of the burst clamp level allows
the output voltage ripple to be adjusted according to the
requirements of the application. A tracking input in the
LTC3418 allows for proper sequencing with respect to
another power supply.
■
■
38-Lead Low Profile (0.75mm) Thermally Enhanced
QFN (5mm × 7mm) Package
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APPLICATIO S
■
Microprocessor, DSP and Memory Supplies
■
Distributed 2.5V, 3.3V and 5V Power Systems
■
Automotive Applications
■
Point of Load Regulation
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode and OPTI-LOOP are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Protected by U.S. Patents, including 5481178, 6580258, 6304066, 6127815, 6498466, 6611131,
6724174.
■
Notebook Computers
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TYPICAL APPLICATIO
Efficiency and Power Loss vs Load Current
2.5V/8A Step-Down Regulator
100
90
80
70
60
50
40
30
20
100000
10000
1000
100
V
IN
2.8V TO 5.5V
C
IN
100µF
EFFICIENCY
SV TRACK PV
IN
IN
0.2µH
V
2.5V
8A
OUT
R
SW
T
C
OUT
2.2M
LTC3418
30.1k
100µF
×2
PGOOD
PGND
SGND
POWER LOSS
RUN/SS
I
1000pF
TH
4.99k SYNC/MODE
V
FB
10
V
V
= 3.3V
IN
OUT
820pF
332Ω
1.69k
4.32k
= 2.5V
3418 TA01a
1
0.01
0.1
1
10
LOAD CURRENT (A)
3418 TA01b
3418f
1
LTC3418
W W U W
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W U
ABSOLUTE MAXIMUM RATINGS
PACKAGE/ORDER INFORMATION
(Note 1)
Input Supply Voltage .................................. –0.3V to 6V
ITH, RUN/SS, VFB Voltages......................... –0.3V to VIN
SYNC/MODE Voltages ............................... –0.3V to VIN
TRACK Voltage .......................................... –0.3V to VIN
SW Voltage .................................. –0.3V to (VIN + 0.3V)
Operating Ambient Temperature Range
(Note 2) .............................................. – 40°C to 85°C
Junction Temperature (Note 5)............................. 125°C
Storage Temperature Range ................. –65°C to 125°C
TOP VIEW
38 37 36 35 34 33 32
SW
SW
1
2
3
4
5
6
7
8
9
31 SW
30 SW
PV
PV
PV
29
28
IN
IN
IN
IN
PV
PGOOD
27 SYNC/MODE
R
T
I
TH
26
25
39
RUN/SS
SGND
V
FB
24 SV
23 PV
22 PV
IN
IN
IN
PV
IN
PV 10
IN
SW 11
SW 12
21 SW
20
SW
13 14 15 16 17 18 19
UHF PACKAGE
38-LEAD (7mm × 5mm) PLASTIC QFN
TJMAX = 125°C, θJA = 34°C/W, θJC = 1°C/W
EXPOSED PAD (PIN 39) IS PGND AND MUST BE SOLDERED TO PCB
ORDER PART NUMBER
UH PART MARKING
LTC3418EUHF
3418
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS The ● indicates specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.3V. (Note 2)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
V
Input Voltage Range
2.25
5.5
V
IN
Regulated Feedback Voltage
0°C ≤ T ≤ 85°C
(Note 3)
0.792
0.784
0.800
0.800
0.808
0.816
V
V
FB
A
●
I
Feedback Input Current
100
200
0.2
nA
FB
∆V
Reference Voltage Line Regulation
Output Voltage Load Regulation
V
= 2.5V to 5.5V (Note 3)
0.04
%/V
FB
IN
V
Measured in Servo Loop, V = 0.36V
Measured in Servo Loop, V = 0.84V
●
●
0.02
–0.02
0.2
–0.2
%
%
LOADREG
ITH
ITH
V
Tracking Voltage Offset
Tracking Voltage Range
TRACK Input Current
Power Good Range
V
= 0.4V
15
0.8
200
±9
mV
V
TRACK
TRACK
0
I
100
±7.5
100
nA
%
Ω
TRACK
∆V
PGOOD
R
Power Good Resistance
150
PGOOD
I
Input DC Bias Current
Active Current
Shutdown
(Note 4)
Q
V
FB
= 0.7V, V = 1V
= 0V
380
0.03
450
1.5
µA
µA
ITH
V
RUN
3418f
2
LTC3418
ELECTRICAL CHARACTERISTICS The ● indicates specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.3V. (Note 2)
SYMBOL PARAMETER CONDITIONS
= 69.8kΩ
MIN
TYP
MAX
UNITS
f
Switching Frequency
R
OSC
0.88
0.3
1
1.12
4
MHz
MHz
OSC
Switching Frequency Range
(Note 6)
f
SYNC Capture Range
(Note 6)
0.3
4
MHz
mΩ
mΩ
A
SYNC
R
R
R
R
of P-Channel FET
of N-Channel FET
I
I
= 600mA
35
25
50
35
PFET
NFET
DS(ON)
DS(ON)
SW
SW
= –600mA
I
Peak Current Limit
12
17
LIMIT
V
V
Undervoltage Lockout Threshold
Reference Output
1.75
1.219
2
2.25
1.281
1
V
UVLO
REF
1.250
0.1
0.65
V
I
SW Leakage Current
RUN Threshold
V
= 0V, V = 5.5V
µA
V
LSW
RUN
IN
V
0.5
0.8
RUN
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 4: Dynamic supply current is higher due to the internal gate charge
being delivered at the switching frequency.
Note 2: The LTC3418 is guaranteed to meet performance specifications
Note 5: T is calculated from the ambient temperature T and power
dissipation P as follows:
D
J
A
o
o
from 0 C to 70 C. Specifications over the –40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
LTC3418: T = T + (P )(34°C/W)
J
A
D
Note 6: This parameter is guaranteed by design and characterization.
Note 3: The LTC3418 is tested in a feedback loop that adjusts V to
FB
achieve a specified error amplifier output voltage (I ).
TH
U W
TYPICAL PERFOR A CE CHARACTERISTICS TA = 25°C unless otherwise noted.
Internal Reference Voltage
vs Temperature
Switch On-Resistance
vs Input Voltage
On-Resistance vs Temperature
50
45
40
35
30
25
20
15
10
5
45
40
35
30
25
20
15
10
5
0.8000
0.7995
0.7990
0.7985
0.7980
0.7975
0.7970
0.7965
0.7960
V
= 3.3V
V
= 3.3V
IN
IN
PFET
PFET
NFET
NFET
0
0
–40 –20
0
20 40 60 80 100 120
TEMPERATURE (°C)
40 60
TEMPERATURE (°C)
–40 –20
0
20
80 100 120
2.25 2.75 3.25 3.75
5.25
4.25 4.75
INPUT VOLTAGE (V)
3418 G02
3418 G07
3418 G01
3418f
3
LTC3418
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TYPICAL PERFOR A CE CHARACTERISTICS
TA = 25°C unless otherwise noted.
Quiescent Current
vs Input Voltage
Switch Leakage vs Input Voltage
Frequency vs ROSC
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
4500
500
450
400
350
300
250
200
150
100
50
V
= 3.3V
IN
4000
3500
3000
2500
2000
1500
1000
500
NFET
PFET
0
0
2.25 2.75 3.25 3.75
INPUT VOLTAGE (V)
5.25
4.25 4.75
10
50
90
130
(kΩ)
250
170
210
2.5
3
4
4.5
5
5.5
3.5
R
INPUT VOLTAGE (V)
OSC
3418 G03
3418 G08
3418 G04
Efficiency and Power Loss
vs Load Current
Frequency vs Temperature
Frequency vs Input Voltage
100
90
80
70
60
50
40
30
20
100000
10000
1000
100
1100
1080
1060
1040
1020
1000
980
1100
1080
1060
1040
1020
1000
980
V
= 3.3V
IN
EFFICIENCY
POWER LOSS
960
960
10
940
940
V
IN
V
OUT
= 3.3V
920
920
= 2.5V
1
900
900
0.01
0.1
1
10
2.25 2.75 3.25 3.75
INPUT VOLTAGE (V)
5.25
–40 –20
0
20 40 60 80 100 120
4.25 4.75
LOAD CURRENT (A)
TEMPERATURE (°C)
3418 TA01b
3418 G05
3418 G06
Efficiency vs Load Current
Efficiency vs Load Current
Efficiency vs Load Current
100
90
100
90
100
90
Burst Mode OPERATION
3.3V
3.3V
5V
80
80
80
5V
70
70
70
FORCED CONTINUOUS
60
50
60
50
60
50
40
30
20
10
0
40
30
20
10
0
40
30
20
10
0
V
V
= 3.3V
Burst Mode OPERATION
OUT
FORCED CONTINUOUS
OUT
IN
OUT
= 2.5V
V
= 2.5V
V
= 2.5V
0.01
0.1
1
10
0.01
0.1
1
10
0.01
0.1
1
10
LOAD CURRENT (A)
LOAD CURRENT (A)
LOAD CURRENT (A)
3418 G10
3418 G11
3418 G12
3418f
4
LTC3418
U W
TYPICAL PERFOR A CE CHARACTERISTICS
TA = 25°C unless otherwise noted.
Peak Inductor Current
vs Burst Clamp Voltage
Load Step Transient
Load Regulation
12
10
8
0
–0.05
–0.10
–0.15
–0.20
–0.25
–0.30
V
V
= 3.3V
IN
OUT
= 1.8V
OUTPUT
VOLTAGE
f = 1MHz
100mV/DIV
6
INDUCTOR
CURRENT
5A/DIV
4
5V
3418 G15
2
V
V
= 3.3V
20µs/DIV
IN
OUT
3.3V
= 2.5V
LOAD STEP: 800mA TO 8A
0
0.5 0.6
(V)
0
0.1 0.2 0.3 0.4
0.7 0.8
5
6
0
1
2
3
4
7
8
V
LOAD CURRENT (A)
BCLAMP
3418 G13
3418 G14
Load Step Transient
Burst Mode Operation
Start-Up Transient
OUTPUT
VOLTAGE
100mV/DIV
OUTPUT
VOLTAGE
100mV/DIV
OUTPUT
VOLTAGE
500mV/DIV
INDUCTOR
CURRENT
5A/DIV
INDUCTOR
CURRENT
1A/DIV
INDUCTOR
CURRENT
2A/DIV
3418 G16
3418 G17
3418 G18
V
V
= 3.3V
40µs/DIV
V
V
= 3.3V
20µs/DIV
V
V
= 3.3V
1ms/DIV
IN
OUT
IN
OUT
IN
OUT
= 2.5V
= 2.5V
= 2.5V
LOAD STEP: 3A TO 8A
LOAD: 200mA
LOAD: 8A
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PI FU CTIO S
all functions are disabled drawing <1.5µA of supply cur-
rent. A capacitor to ground from this pin sets the ramp
time to full output current.
SW (Pins 1, 2, 11, 12, 20, 21, 30, 31): Switch Node
Connection to Inductor. This pin connects to the drains of
the internal main and synchronous power MOSFET
switches.
SGND (Pin 8): Signal Ground. All small-signal compo-
nents and compensation components should connect to
this ground, which in turn connects to PGND at one point.
PVIN (Pins 3, 4, 9, 10, 22, 23, 28, 29): Power Input
Supply. Decouple this pin to PGND with a capacitor.
PGND (Pins 13, 14, 15, 17, 18, 19, 32, 33, 34, 36, 37,
PGOOD (Pin 5): Power Good Output. Open-drain logic
output that is pulled to ground when the output voltage is
not within ±7.5% of regulation point.
38): Power Ground. Connect this pin closely to the (–)
terminal of CIN and COUT
.
VREF (Pin 16): Reference Output. Decouple this pin with a
2.2µF capacitor.
RT (Pin6):OscillatorResistorInput. Connectingaresistor
to ground from this pin sets the switching frequency.
RUN/SS(Pin7):RunControlandSoft-StartInput.Forcing
thispinbelow0.5VshutsdowntheLTC3418. Inshutdown
SVIN (Pin 24): Signal Input Supply. Decouple this pin to
SGND with a capacitor.
3418f
5
LTC3418
U
U
U
PI FU CTIO S
SVIN. Connecting this pin to a voltage between 0V and 1V
selects Burst Mode operation with the burst clamp set to
the pin voltage.
VFB (Pin25): FeedbackPin. Receivesthefeedbackvoltage
from a resistive divider connected across the output.
ITH (Pin 26): Error Amplifier Compensation Point. The
current comparator threshold increases with this control
voltage. Nominal voltage range for this pin is from 0.2V to
1.4V with 0.4V corresponding to the zero-sense voltage
(zero current).
TRACK(Pin35):VoltageTrackingInput. Feedbackvoltage
will regulate to the voltage on this pin during start-up
power sequencing.
Exposed Pad (Pin 39): The Exposed Pad is PGND and
must be soldered to the PCB ground.
SYNC/MODE (Pin 27): Mode Select and External Clock
Synchronization Input. To select Forced Continuous, tie to
W
BLOCK DIAGRA
24
SV
8
26
PV
IN
29
SGND
I
TH
IN
3
4
9
V
REF
16
35
28
23
22
VOLTAGE
REFERENCE
SLOPE
COMPENSATION
RECOVERY
PMOS CURRENT
COMPARATOR
TRACK
10
ERROR
AMPLIFIER
BCLAMP
BURST
COMPARATOR
+
–
+
–
–
+
V
FB
25
+
SYNC/MODE
SLOPE
COMPENSATION
0.74V
+
–
SW
OSCILLATOR
1
2
11
20
30
12
21
31
–
+
+
–
LOGIC
NMOS
0.86V
CURRENT
COMPARATOR
–
+
RUN/SS
PGOOD
RUN
7
5
PGND
13
14
15
17
18
19
32
33
34
36
37
CURRENT
REVERSE
COMPARATOR
R
SYNC/MODE
T
6
27
38
3418 BD
3418f
6
LTC3418
U
OPERATIO
Main Control Loop
Burst Mode Operation
The LTC3418 is a monolithic, constant frequency, current
mode step-down DC/DC converter. During normal opera-
tion, the internal top power switch (P-channel MOSFET) is
turned on at the beginning of each clock cycle. Current in
the inductor increases until the current comparator trips
and turns off the top power MOSFET. The peak inductor
current at which the current comparator shuts off the top
power switch is controlled by the voltage on the ITH pin.
The error amplifier adjusts the voltage on the ITH pin by
comparing the feedback signal from a resistor divider on
the VFB pin with an internal 0.8V reference. When the load
current increases, it causes a reduction in the feedback
voltage relative to the reference. The error amplifier raises
the ITH voltage until the average inductor current matches
the new load current. When the top power MOSFET shuts
off, the synchronous power switch (N-channel MOSFET)
turns on until either the bottom current limit is reached or
the beginning of the next clock cycle. The bottom current
limit is set at –8A for force continuous mode and 0A for
Burst Mode operation.
Connecting the SYNC/MODE pin to a voltage in the range
of 0V to 1V enables Burst Mode operation. In Burst Mode
operation, the internal power MOSFETs operate intermit-
tently at light loads. This increases efficiency by minimiz-
ing switching losses. During Burst Mode operation, the
minimum peak inductor current is externally set by the
voltage on the SYNC/MODE pin and the voltage on the ITH
pin is monitored by the burst comparator to determine
when sleep mode is enabled and disabled. When the
average inductor current is greater than the load current,
the voltage on the ITH pin drops. As the ITH voltage falls
below 350mV, the burst comparator trips and enables
sleep mode. During sleep mode, the top power MOSFET is
held off while the load current is solely supplied by the
output capacitor. When the output voltage drops, the top
and bottom power MOSFETs begin switching to bring the
output back into regulation. This process repeats at a rate
that is dependent on the load demand.
Pulse skipping operation can be implemented by connect-
ing the SYNC/MODE pin to ground. This forces the burst
clamp level to be at 0V. As the load current decreases, the
peak inductor current will be determined by the voltage on
theITH pinuntiltheITH voltagedropsbelow400mV. Atthis
point, the peak inductor current is determined by the
minimum on-time of the current comparator. If the load
demand is less than the average of the minimum on-time
inductor current, switching cycles will be skipped to keep
the output voltage in regulation.
The operating frequency is externally set by an external
resistor connected between the RT pin and ground. The
practical switching frequency can range from 300kHz to
4MHz.
Overvoltage and undervoltage comparators will pull the
PGOOD output low if the output voltage comes out of
regulation by ±7.5%. In an overvoltage condition, the top
powerMOSFETisturnedoffandthebottompowerMOSFET
is switched on until either the overvoltage condition clears
or the bottom MOSFET’s current limit is reached.
Frequency Synchronization
TheinternaloscillatoroftheLTC3418canbysynchronized
toanexternalclockconnectedtotheSYNC/MODEpin.The
frequency of the external clock can be in the range of
300kHz to 4MHz.
Forced Continuous
Connecting the SYNC/MODE pin to SVIN will disable Burst
Mode operation and force continuous current operation.
At light loads, forced continuous mode operation is less
efficient than Burst Mode operation, but may be desirable
in some applications where it is necessary to keep switch-
ing harmonics out of a signal band. The output voltage
ripple is minimized in this mode.
For this application, the oscillator timing resistor should
be chosen to correspond to a frequency that is 25% lower
than the synchronization frequency. During synchroniza-
tion, the burst clamp is set to 0V, and each switching cycle
begins at the falling edge of the clock signal.
3418f
7
LTC3418
U
OPERATIO
Dropout Operation
Short-Circuit Protection
When the input supply voltage decreases toward the
output voltage, the duty cycle increases toward the maxi-
mum on-time. Further reduction of the supply voltage
forces the main switch to remain on for more than one
cycle eventually reaching 100% duty cycle. The output
voltage will then be determined by the input voltage minus
the voltage drop across the internal P-channel MOSFET
and the inductor.
Whentheoutputisshortedtoground,theinductorcurrent
decays very slowly during a single switching cycle. To
prevent current runaway from occurring, a secondary
current limit is imposed on the inductor current. If the
inductor valley current increases larger than 15A, the top
powerMOSFETwillbeheldoffandswitchingcycleswillbe
skipped until the inductor current is reduced.
Voltage Tracking
Low Supply Operation
Some microprocessors and DSP chips need two power
supplieswithdifferentvoltagelevels. Thesesystemsoften
require voltage sequencing between the core power sup-
ply and the I/O power supply. Without proper sequencing,
latch-up failure or excessive current draw may occur that
could result in damage to the processor’s I/O ports or the
I/O ports of a supporting system device such as memory,
an FPGA or a data converter. To ensure that the I/O loads
are not driven until the core voltage is properly biased,
tracking of the core supply and the I/O supply voltage is
necessary.
The LTC3418 is designed to operate down to an input
supply voltage of 2.25V. One important consideration at
low input supply voltages is that the RDS(ON) of the
P-channel and N-channel power switches increases. The
user should calculate the power dissipation when the
LTC3418 is used at 100% duty cycle with low input
voltages to ensure that thermal limits are not exceeded.
Slope Compensation and Inductor Peak Current
Slope compensation provides stability in constant fre-
quency architectures by preventing subharmonic oscilla-
tions at duty cycles greater than 50%. It is accomplished
internally by adding a compensating ramp to the inductor
current signal. Normally, the maximum inductor peak
current is reduced when slope compensation is added. In
the LTC3418, however, slope compensation recovery is
implemented to keep the maximum inductor peak current
constant throughout the range of duty cycles. This keeps
the maximum output current relatively constant regard-
less of duty cycle.
Voltage tracking is enabled by applying a ramp voltage to
the TRACK pin. When the voltage on the TRACK pin is
below 0.8V, the feedback voltage will regulate to this
tracking voltage. When the tracking voltage exceeds 0.8V,
tracking is disabled and the feedback voltage will regulate
to the internal reference voltage.
Voltage Reference Output
The LTC3418 provides a 1.25V reference voltage that is
capable of sourcing up to 5mA of output current. This
reference voltage is generated from a linear regulator and
isintendedforapplicationsrequiringalownoisereference
voltage. To ensure that the output is stable, the reference
voltagepinshouldbedecoupledwithaminimumof2.2µF.
3418f
8
LTC3418
W U U
APPLICATIO S I FOR ATIO
U
The basic LTC3418 application circuit is shown on the
front page of this data sheet. External component selec-
tion is determined by the maximum load current and
begins with the selection of the operating frequency and
Having a lower ripple current reduces the core losses in
the inductor, the ESR losses in the output capacitors and
the output voltage ripple. Highest efficiency operation is
achieved at low frequency with small ripple current. This,
however, requires a large inductor.
inductor value followed by CIN and COUT
.
A reasonable starting point for selecting the ripple current
is ∆IL = 0.4(IMAX). The largest ripple current occurs at the
highest VIN. To guarantee that the ripple current stays
below a specified maximum, the inductor value should be
chosen according to the following equation:
Operating Frequency
Selection of the operating frequency is a tradeoff between
efficiency and component size. High frequency operation
allows the use of smaller inductor and capacitor values.
Operation at lower frequencies improves efficiency by
reducing internal gate charge losses but requires larger
inductance values and/or capacitance to maintain low
output ripple voltage.
⎛
⎞⎛
⎞
VOUT
VOUT
L =
1–
⎜
⎟⎜
⎟
f∆I
V
IN(MAX)
⎝
⎠⎝
⎠
L(MAX)
The inductor value will also have an effect on Burst Mode
operation. The transition from low current operation
begins when the peak inductor current falls below a level
set by the burst clamp. Lower inductor values result in
higher ripple current which causes this to occur at lower
load currents. This causes a dip in efficiency in the upper
range of low current operation. In Burst Mode operation,
lower inductance values will cause the burst frequency to
increase.
The operating frequency of the LTC3418 is determined by
an external resistor that is connected between the RT pin
andground.Thevalueoftheresistorsetstherampcurrent
that is used to charge and discharge an internal timing
capacitor within the oscillator and can be calculated by
using the following equation:
7.3 •1010
ROSC
=
Ω – 2.5kΩ
[ ]
f
Although frequencies as high as 4MHz are possible, the
minimum on-time of the LTC3418 imposes a minimum
limit on the operating duty cycle. The minimum on-time is
typically80ns. Therefore, theminimumdutycycleisequal
to:
Inductor Core Selection
Once the value for L is known, the type of inductor must be
selected. Actual core loss is independent of core size for a
fixed inductor value, but it is very dependent on the
inductance selected. As the inductance increases, core
losses decrease. Unfortunately, increased inductance re-
quires more turns of wire and therefore copper losses will
increase.
100 • 80ns • f(Hz)
Inductor Selection
For a given input and output voltage, the inductor value
and operating frequency determine the ripple current. The
ripple current ∆IL increases with higher VIN or VOUT and
decreases with higher inductance:
Ferritedesignshaveverylowcorelossesandarepreferred
at high switching frequencies, so design goals can con-
centrate on copper loss and preventing saturation. Ferrite
core material saturates “hard,” which means that induc-
tance collapses abruptly when the peak design current is
exceeded. This results in an abrupt increase in inductor
ripple current and consequent output voltage ripple. Do
not allow the core to saturate!
⎛
⎞
⎟
VOUT
fL
⎛
⎜
VOUT
⎞
⎟
∆IL =
1–
⎜
⎝
V
IN
⎠
⎝
⎠
3418f
9
LTC3418
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APPLICATIO S I FOR ATIO
Different core materials and shapes will change the size/
current and price/current relationship of an inductor.
Toroid or shielded pot cores in ferrite or permalloy mate-
rials are small and don’t radiate much energy, but gener-
ally cost more than powdered iron core inductors with
similar characteristics. The choice of which style inductor
to use mainly depends on the price vs size requirements
and any radiated field/EMI requirements. New designs for
surface mount inductors are available from Coiltronics,
Coilcraft, Toko and Sumida.
currenthandlingrequirements.Drytantalum,specialpoly-
mer, aluminum electrolytic and ceramic capacitors are all
available in surface mount packages. Special polymer
capacitors offer very low ESR but have lower capacitance
density than other types. Tantalum capacitors have the
highest capacitance density but it is important to only use
types that have been surge tested for use in switching
power supplies. Aluminum electrolytic capacitors have
significantly higher ESR, but can be used in cost-sensitive
applications provided that consideration is given to ripple
current ratings and long term reliability. Ceramic capaci-
tors have excellent low ESR characteristics but can have a
high voltage coefficient and audible piezoelectric effects.
The high Q of ceramic capacitors with trace inductance
can also lead to significant ringing.
CIN and COUT Selection
The input capacitance, CIN, is needed to filter the trapezoi-
dal wave current at the source of the top MOSFET. To
preventlargevoltagetransientsfromoccurring,alowESR
input capacitor sized for the maximum RMS current
should be used. The maximum RMS current is given by:
Using Ceramic Input and Output Capacitors
Higher values, lower cost ceramic capacitors are now
becoming available in smaller case sizes. Their high ripple
current, high voltage rating and low ESR make them ideal
for switching regulator applications. However, care must
be taken when these capacitors are used at the input and
output. When a ceramic capacitor is used at the input and
thepowerissuppliedbyawalladapterthroughlongwires,
a load step at the output can induce ringing at the input,
VIN. At best, this ringing can couple to the output and be
mistaken as loop instability. At worst, a sudden inrush of
current through the long wires can potentially cause a
voltage spike at VIN large enough to damage the part.
VOUT
V
IN
V
IN
VOUT
IRMS = IOUT(MAX)
– 1
This formula has a maximum at VIN = 2VOUT, where IRMS
= IOUT/2. This simple worst-case condition is commonly
usedfordesignbecauseevensignificantdeviationsdonot
offer much relief. Note that ripple current ratings from
capacitor manufacturers are often based on only 2000
hours of life which makes it advisable to further derate the
capacitor, orchooseacapacitorratedatahighertempera-
ture than required. Several capacitors may also be paral-
leled to meet size or height requirements in the design.
When choosing the input and output ceramic capacitors,
choose the X5R or X7R dielectric formulations. These
dielectrics have the best temperature and voltage charac-
teristics of all the ceramics for a given value and size.
The selection of COUT is determined by the effective series
resistance (ESR) that is required to minimize voltage
ripple and load step transients as well as the amount of
bulk capacitance that is necessary to ensure that the
control loop is stable. Loop stability can be checked by
viewing the load transient response as described in a later
section. The output ripple, ∆VOUT, is determined by:
Output Voltage Programming
The output voltage is set by an external resistive divider
according to the following equation:
⎛
1
⎞
R2
R1
⎛
⎝
⎞
⎟
⎠
∆VOUT ≤ ∆I ESR +
⎜
⎟
L
VOUT = 0.8 1+
⎜
⎝
8fCOUT
⎠
The output ripple is highest at maximum input voltage
since ∆IL increases with input voltage. Multiple capacitors
placedinparallelmaybeneededtomeettheESRandRMS
The resistive divider allows pin VFB to sense a fraction of
the output voltage as shown in Figure 1.
3418f
10
LTC3418
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APPLICATIO S I FOR ATIO
U
V
OUT
SYNC/MODE pin to ground. This sets IBURST to 0A. In this
condition, the peak inductor current is limited by the mini-
mum on-time of the current comparator; and the lowest
output voltage ripple is achieved while still operating dis-
continuously.Duringverylightoutputloads,pulseskipping
allowsonlyafewswitchingcyclestobeskippedwhilemain-
taining the output voltage in regulation.
R2
V
FB
LTC3418
SGND
R1
3418 F01
Figure 1. Setting the Output Voltage
Voltage Tracking
Burst Clamp Programming
The LTC3418 allows the user to program how its output
voltagerampsduringstart-upbymeansoftheTRACKpin.
Through this pin, the output voltage can be set up to either
track coincidentally or ratiometrically follow another out-
put voltage as shown in Figure 2. If the voltage on the
TRACK pin is less than 0.8V, voltage tracking is enabled.
During voltage tracking, the output voltage regulates to
the tracking voltage through a resistor divider network.
IfthevoltageontheSYNC/MODEpinislessthanVIN by1V,
Burst Mode operation is enabled. During Burst Mode
operation, the voltage on the SYNC/MODE pin determines
the burst clamp level, which sets the minimum peak
inductorcurrent, IBURST, foreachswitchingcycle. Agraph
showing the relationship between the minimum peak
inductor current and the voltage on the SYNC/MODE pin
can be found in the Typical Performance Characteristics
section. In the graph, VBURST is the voltage on the SYNC/
MODE pin. IBURST can only be programmed in the range of
0A to 10A. For values of VBURST less than 0.4V, IBURST is
set at 0A. As the output load current drops, the peak
inductor currents decrease to keep the output voltage in
regulation. When the output load current demands a peak
inductor current that is less than IBURST, the burst clamp
will force the peak inductor current to remain equal to
IBURST regardlessoffurtherreductionsintheloadcurrent.
Since the average inductor current is greater than the
output load current, the voltage on the ITH pin will de-
crease. When the ITH voltage drops to 350mV, sleep mode
is enabled in which both power MOSFETs are shut off and
switching action is discontinued to minimize power con-
sumption. All circuitry is turned back on and the power
MOSFETs begin switching again when the output voltage
dropsoutofregulation. ThevalueforIBURST isdetermined
by the desired amount of output voltage ripple. As the
valueofIBURST increases, thesleepperiodbetweenpulses
and the output voltage ripple increase. The burst clamp
voltage, VBURST, can be set by a resistor divider from the
VFB pin to the SGND pin as shown in the Typical Applica-
tion on the front page of this data sheet.
V
V
OUT2
OUT1
3418 F02a
TIME
Figure 2a. Coincident Tracking
V
V
OUT2
OUT1
3418 F02a
TIME
Pulse skipping, which is a compromise between low out-
put voltage ripple and efficiency during low load current
operation, can be implemented by connecting the
Figure 2b. Ratiometric Sequencing
3418f
11
LTC3418
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APPLICATIO S I FOR ATIO
The output voltage during tracking can be calculated with
as shown in Typical Application on the front page of this
data sheet. The soft-start duration can be calculated by
using the following formula:
the following equation:
R2
R1
⎛
⎝
⎞
⎟
⎠
VOUT = VTRACK 1+
,VTRACK < 0.8V
⎜
V
IN
t
SS = RSS •CSS •In
Seconds
[
]
V – 1.8V
IN
To implement the coincident tracking in Figure 2a, con-
nect an extra resistor divider to the output of VOUT2 and
connect its midpoint to the TRACK pin of the LTC3418 as
shown in Figure 3a. The ratio of this divider should be
selected the same as that of VOUT1’s resistor divider. To
implement the ratiometric sequencing in Figure 2b, no
extra resistor divider is necessary. Simply connect the
TRACK pin to VFB2, as shown in Figure 3b.
When the voltage on the RUN/SS pin is raised above 2V,
the full current range becomes available on ITH.
Efficiency Considerations
The efficiency of a switching regulator is equal to the
output power divided by the input power times 100%. It is
oftenusefultoanalyzeindividuallossestodeterminewhat
is limiting the efficiency and which change would produce
the most improvement. Efficiency can be expressed as:
V
V
OUT2
OUT2
(MASTER)
(MASTER)
R2
R1
R4
R3
R2
TRACK
PIN
Efficiency = 100% – (L1 + L2 + L3 + ...)
TRACK
PIN
V
FB(MASTER)
PIN
V
FB(MASTER)
R1
whereL1, L2, etc. aretheindividuallossesasapercentage
of input power.
3418 F03
(3a) Coincident Setup
(3b) Ratiometric Setup
Although all dissipative elements in the circuit produce
losses, two main sources usually account for most of the
losses: VIN quiescent current and I2R losses.
Figure 3
Frequency Synchronization
The VIN quiescent current loss dominates the efficiency
loss at very low load currents whereas the I2R loss
dominates the efficiency loss at medium to high load
currents. In a typical efficiency plot, the efficiency curve at
very low load currents can be misleading since the actual
power lost is of no consequence.
The LTC3418’s internal oscillator can be synchronized to
an external clock signal. During synchronization, the top
MOSFET turn-on is locked to the falling edge of the
externalfrequencysource.Thesynchronizationfrequency
range is 300kHz to 4MHz. Synchronization only occurs if
the external frequency is greater than the frequency set by
the external resistor. Because slope compensation is
generated by the oscillator’s RC circuit, the external fre-
quency should be set 25% higher than the frequency set
by the external resistor to ensure that adequate slope
compensation is present.
1.TheVIN quiescentcurrentisduetotwocomponents:the
DC bias current as given in the Electrical Characteristics
and the internal main switch and synchronous switch gate
charge currents. The gate charge current results from
switching the gate capacitance of the internal power
MOSFET switches. Each time the gate is switched from
high to low to high again, a packet of charge dQ moves
from VIN to ground. The resulting dQ/dt is the current out
of VIN that is typically larger than the DC bias current. In
continuous mode, IGATECHG = f(QT + QB) where QT and QB
are the gate charges of the internal top and bottom
switches. Both the DC bias and gate charge losses are
proportional to VIN and thus their effects will be more
pronounced at higher supply voltages.
Soft-Start
The RUN/SS pin provides a means to shut down the
LTC3418 as well as a timer for soft-start. Pulling the RUN/
SS pin below 0.5V places the LTC3418 in a low quiescent
current shutdown state (IQ < 1.5µA).
The LTC3418 contains a soft-start clamp that can be set
externally with a resistor and capacitor on the RUN/SS pin
3418f
12
LTC3418
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APPLICATIO S I FOR ATIO
U
2. I2R losses are calculated from the resistances of the
internal switches, RSW, and external inductor RL. In con-
tinuous mode the average output current flowing through
inductor L is “chopped” between the main switch and the
synchronous switch. Thus, the series resistance looking
into the SW pin is a function of both top and bottom
MOSFET RDS(ON) and the duty cycle (DC) as follows:
The junction temperature, TJ, is given by:
TJ = TA + TR
where TA is the ambient temperature.
Note that at higher supply voltages, the junction tempera-
ture is lower due to reduced switch resistance (RDS(ON)).
Checking Transient Response
RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC)
The regulator loop response can be checked by looking at
the load transient response. Switching regulators take
several cycles to respond to a step in load current.
The RDS(ON) for both the top and bottom MOSFETs can be
obtained from the Typical Performance Characteristics
curves. Thus, to obtain I2R losses, simply add RSW to RL
and multiply the result by the square of the average output
current.
When a load step occurs, VOUT immediately shifts by an
amount equal to ∆ILOAD(ESR), where ESR is the effective
series resistance of COUT. ∆ILOAD also begins to charge or
dischargeCOUT generatingafeedbackerrorsignalusedby
the regulator to return VOUT to its steady-state value.
During this recovery time, VOUT can be monitored for
overshoot or ringing that would indicate a stability prob-
lem. The ITH pin external components and output capaci-
tor shown in the Typical Application on the front page of
this data sheet will provide adequate compensation for
most applications.
Other losses including CIN and COUT ESR dissipative
losses and inductor core losses generally account for less
than 2% of the total loss.
Thermal Considerations
In most applications, the LTC3418 does not dissipate
much heat due to its high efficiency.
But, in applications where the LTC3418 is running at high
ambient temperature with low supply voltage and high
duty cycles, such as in dropout, the heat dissipated may
exceed the maximum junction temperature of the part. If
the junction temperature reaches approximately 150°C,
both power switches will be turned off and the SW node
will become high impedance.
Design Example
As a design example, consider using the LTC3418 in an
application with the following specifications: VIN = 3.3V,
VOUT = 2.5V, IOUT(MAX) = 8A, IOUT(MIN) = 200mA, f = 1MHz.
Because efficiency is important at both high and low load
current, Burst Mode operation will be utilized.
To avoid the LTC3418 from exceeding the maximum
junction temperature, the user will need to do some
thermal analysis. The goal of the thermal analysis is to
determine whether the power dissipated exceeds the
maximum junction temperature of the part. The tempera-
ture rise is given by:
First, calculate the timing resistor:
7.3 •1010
ROSC
=
– 2.5k = 70.5k
1•106
Use a standard value of 69.8k. Next, calculate the inductor
value for about 40% ripple current:
TR = (PD)(θJA)
where PD is the power dissipated by the regulator and θJA
is the thermal resistance from the junction of the die to the
ambient temperature. For the 38-Lead 5mm × 7mm QFN
package, the θJA is 34°C/W.
⎛
⎞
2.5V
1MHz 3.2A
2.5V
3.3V
⎛
⎜
⎝
⎞
⎟
⎠
L =
1–
= 0.19µH
⎜
⎟
(
)(
)
⎝
⎠
3418f
13
LTC3418
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APPLICATIO S I FOR ATIO
Using a 0.2µH inductor results in a maximum ripple
divider consisting of R2 and R3. A burst clamp voltage of
0.67V will set the minimum inductor current, IBURST, to
approximately 1.2A.
current of:
⎛
⎞
2.5V
1MHz 0.2µH
2.5V
3.3V
⎛
⎜
⎝
⎞
⎟
⎠
∆IL =
1–
= 3.03A
If we set the sum of R2 and R3 to 200k, then the following
equations can be solved.
⎜
⎟
(
)(
)
⎝
⎠
COUT will be selected based on the ESR that is required to
satisfy the output voltage ripple requirement and the bulk
capacitance needed for loop stability. For this design, five
100µF ceramic capacitors will be used.
R2 +R3 = 200k
R2 0.8V
1+
=
R3 0.67V
The two equations shown above result in the following
values for R2 and R3: R2 = 33.2k, R3 = 169k. The value
of R1 can now be determined by solving the equation:
CIN should be sized for a maximum current rating of:
2.5V 3.3V
⎛
⎝
⎞
IRMS = 8A
– 1 = 3.43ARMS
(
)
⎜
⎟
⎠
3.3V 2.5V
R1
2.5V
1+
=
202.2k 0.8V
Decoupling the PVIN and SVIN pins with four 100µF
capacitors is adequate for this application.
R1= 430k
The burst clamp and output voltage can now be pro-
grammed by choosing the values of R1, R2 and R3. The
voltageontheMODEpinwillbesetto0.67Vbytheresistor
A value of 432k will be selected for R1. Figure 4 shows the
complete schematic for this design example.
L1
0.2µH
V
2.5V
8A
OUT
3
4
1
V
IN
3.3V
PV
PV
PV
PV
PV
PV
PV
PV
SV
SW
SW
SW
SW
SW
SW
SW
SW
IN
IN
IN
IN
IN
IN
IN
IN
IN
C
C
OUT
2
IN
100µF
×4
100µF
×5
9
11
12
20
21
30
31
25
10
22
23
28
29
24
C1
R1
22pF
432k
X7R
R
R
PG
SS
2.2M 100k
R
SVIN
100Ω
V
C
FB
SVIN
1µF
R2
33.2k
LTC3418
TRACK SYNC/MODE
X7R
35
5
27
38
37
36
34
33
32
19
18
16
C
SS
1000pF
X7R
PGOOD
RUN/SS
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
7
26
I
TH
R
OSC
69.8k
6
8
R3
169k
R
ITH
7.5k
R
T
C
ITH
820pF
X7R
SGND
PGND
PGND
PGND
PGND
13
14
15
17
C1
47pF
X7R
V
V
REF
REF
C
REF
2.2µF
X7R
C
, C : AVX 18126D107MAT
IN OUT
3418 F04
L1: TOKO FDV0620-R20M
Figure 4. 2.5V, 8A Regulator at 1MHz, Burst Mode Operation
3418f
14
LTC3418
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APPLICATIO S I FOR ATIO
U
PC Board Layout Checklist
3. Keep the switching node, SW, away from all sensitive
small-signal nodes.
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC3418. Check the following in your layout.
4. Flood all unused areas on all layers with copper.
Flooding with copper will reduce the temperature rise of
power components. You can connect the copper areas to
any DC net (PVIN, SVIN, VOUT, PGND, SGND or any other
DC rail in your system).
1. Agroundplaneisrecommended. Ifagroundplanelayer
is not used, the signal and power grounds should be
segregated with all small-signal components returning to
the SGND pin at one point which is then connected to the
PGND pin close to the LTC3418.
5. Connect the VFB pin directly to the feedback resistors.
The resistor divider must be connected between VOUT and
SGND.
2. Connect the (+) terminal of the input capacitor(s), CIN,
as close as possible to the PVIN pin. This capacitor
provides the AC current into the internal power MOSFETs.
6. To minimize switching noise coupling to SVIN, place a
local filter between SVIN and PVIN.
Top Layer
Bottom Layer
Figure 5. LTC3418 Layout Diagram
3418f
15
LTC3418
TYPICAL APPLICATIO S
U
3.3V, 8A Step-Down Regulator Synchronized to 1.25MHz
L1
0.33µH
V
3.3V
8A
OUT
3
4
1
V
IN
5V
PV
PV
PV
PV
PV
PV
PV
PV
SV
SW
SW
SW
SW
SW
SW
SW
SW
IN
IN
IN
IN
IN
IN
IN
IN
IN
C
C
2
IN
OUT
100µF
×2
100µF
×3
9
11
12
20
21
30
31
25
10
22
23
28
29
24
C1
R1
1000pF
6.34k
X7R
R
R
PG
SS
2.2M 100k
V
FB
C
R
SVIN
SVIN
100Ω
LTC3418
1µF
35
5
16
38
37
36
34
33
32
19
18
17
C
X7R
SS
V
TRACK
V
REF
REF
1000pF
X7R
C
REF
PGOOD
RUN/SS
PGND
2.2µF
7
X7R
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
26
I
TH
R
69.8k
OSC
6
8
R2
2k
R
ITH
R
C
T
ITH
2200pF
X7R
2k
SGND
C1
47pF
X7R
13
14
15
27
PGND
PGND
PGND
SYNC/MODE
C
, C : TDK C3225X5R0J107M
IN OUT
3418 TA02
L1: VISHAY DALE IHLP-2525CZ-01
1.25MHz CLOCK
1.2V, 8A Step-Down Regulator at 2MHz, Forced Continuous Mode
L1
0.2µH
V
1.2V
8A
OUT
3
4
1
V
IN
3.3V
PV
PV
PV
PV
PV
PV
PV
PV
SV
SW
SW
SW
SW
SW
SW
SW
SW
IN
IN
IN
IN
IN
IN
IN
IN
IN
C
2
OUT
C
IN
100µF
×3
100µF
×4
9
11
12
20
21
30
31
25
10
22
23
28
29
24
C1
1000pF
X7R
R1
1k
R
R
PG
SS
2.2M 100k
V
FB
C
R
SVIN
100Ω
SVIN
LTC3418
1µF
35
27
5
16
38
37
36
34
33
32
19
18
17
X7R
V
REF
TRACK
V
REF
C
REF
C
SS
SYNC/MODE
PGOOD
PGND
2.2µF
1000pF
X7R
X7R
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
7
RUN/SS
26
R2
2k
I
TH
R
OSC
30.1k
6
8
R
ITH
4.99k
R
T
C
ITH
2200pF
X7R
SGND
PGND
PGND
PGND
C1
47pF
X7R
14
15
13
C
, C : AVX 12106D107MAT
IN OUT
3418 TA03
L1: COOPER FP3-R20
3418f
16
LTC3418
U
TYPICAL APPLICATIO S
1.8V, 8A Step-Down Regulator with Tracking
I/O SUPPLY
2.5V
R4
2k
R3
2.55k
L1
0.2µH
V
1.8V
8A
OUT
35
3
1
TRACK
SW
C
2
OUT
V
IN
PV
PV
PV
PV
PV
PV
PV
PV
SW
SW
SW
SW
SW
SW
SW
IN
IN
IN
IN
IN
IN
IN
IN
100µF
×2
3.3V
C
4
11
12
20
21
30
31
25
IN
100µF
×4
9
C1
R1
2.55k
1000pF
10
22
23
29
28
X7R
R
R
PG
100k
SS
2.2M
V
FB
R
SVIN
LTC3418
100Ω
24
5
16
38
37
36
34
33
32
19
18
17
V
SV
V
REF
REF
IN
C
C
SVIN
REF
C
SS
PGOOD
PGND
1µF
2.2µF
1000pF
X7R
27
7
X7R
X7R
SYNC/MODE
RUN/SS
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
26
6
R2
2k
I
TH
R
69.8k
OSC
R
ITH
R
C
T
ITH
3.32k
8
2200pF
X7R
SGND
PGND
PGND
PGND
C1
47pF
X7R
13
14
15
C
, C : TDK C3225X5R0J107M
IN OUT
3418 TA04
L1: VISHAY DALE IHLP-2525CZ-01
3418f
17
LTC3418
TYPICAL APPLICATIO S
U
1.8V, 16A Step-Down Regulator
L1
0.2µH
3
4
1
V
IN
3.3V
PV
PV
PV
PV
PV
PV
PV
PV
SV
SW
SW
SW
SW
SW
SW
SW
SW
IN
IN
IN
IN
IN
IN
IN
IN
IN
C
2
IN1
100µF
×4
9
11
12
20
21
30
31
25
10
22
23
28
29
24
C2
R1
2.55k
1000pF
X7R
R
R
SS1
2.2M
PG1
100k
V
FB
C
R
SVIN1
SVIN1
100Ω
LTC3418
1µF
35
5
38
37
36
34
33
32
19
18
17
16
C
X7R
SS1
TRACK
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
1000pF
X7R
PGOOD
RUN/SS
V
1.8V
16A
OUT
7
C
OUT
26
I
TH
100µF
×4
C1A
47pF
X7R
R
OSC1
59k
6
8
R
T
R2
2k
SGND
13
14
15
27
PGND
PGND
PGND
SYNC/MODE
V
C
REF
REF1
2.2µF
X7R
R
ITH
2k
C
ITH
2200pF
X7R
L2
0.2µH
3
4
1
PV
IN
PV
IN
PV
IN
PV
IN
PV
IN
PV
IN
PV
IN
PV
IN
SV
IN
SW
SW
SW
SW
SW
SW
SW
SW
C
IN2
2
100µF
×4
9
11
12
20
21
30
31
25
10
22
23
28
29
24
C3
R3
2.55k
1000pF
X7R
R
R
PG2
100k
SS2
2.2M
V
FB
C
R
SVIN2
SVIN2
LTC3418
1µF
100Ω
35
5
38
37
36
34
33
32
19
18
17
16
C
X7R
SS2
TRACK
PGOOD
RUN/SS
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
1000pF
X7R
7
26
6
I
TH
R
OSC2
69.8k
C1B
47pF
X7R
R
T
R4
2k
8
SGND
13
14
15
27
PGND
PGND
PGND
SYNC/MODE
V
C
REF
REF2
2.2µF
C
, C , C : TDK C3225X5R0J107M
IN1 IN2 OUT
X7R
L1, L2: VISHAY DALE IHLP-2525CZ-01
3418 TA06
3418f
18
LTC3418
U
PACKAGE DESCRIPTIO
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701)
0.70 ± 0.05
5.50 ± 0.05
(2 SIDES)
4.10 ± 0.05
(2 SIDES)
3.15 ± 0.05
(2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
5.20 ± 0.05 (2 SIDES)
6.10 ± 0.05 (2 SIDES)
7.50 ± 0.05 (2 SIDES)
RECOMMENDED SOLDER PAD LAYOUT
3.15 ± 0.10
(2 SIDES)
0.75 ± 0.05
5.00 ± 0.10
(2 SIDES)
0.435 0.18
0.18
37 38
0.00 – 0.05
PIN 1
TOP MARK
(SEE NOTE 6)
1
2
0.23
5.15 ± 0.10
(2 SIDES)
7.00 ± 0.10
(2 SIDES)
0.40 ± 0.10
0.200 REF 0.25 ± 0.05
R = 0.115
TYP
(UH) QFN 1203
0.50 BSC
0.200 REF
BOTTOM VIEW—EXPOSED PAD
0.75 ± 0.05
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3. ALL DIMENSIONS ARE IN MILLIMETERS
3418f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
19
LTC3418
U
TYPICAL APPLICATIO
Low Noise 1.5V, 8A Step-Down Regulator
L1
0.2µH
V
1.5V
8A
OUT
3
4
1
V
IN
2.5V
PV
PV
PV
PV
PV
PV
PV
PV
SV
SW
SW
SW
SW
SW
SW
SW
SW
IN
IN
IN
IN
IN
IN
IN
IN
IN
C
C
2
IN
OUT
100µF
×4
100µF
×3
9
11
12
20
21
30
31
25
10
22
23
28
29
24
C1
1000pF
X7R
R1
1.78k
R
R
PG
SS
2.2M 100k
V
FB
C
R
SVIN
SVIN
100Ω
LTC3418
1µF
35
5
16
38
37
36
34
33
32
19
18
17
C
X7R
SS
V
TRACK
V
REF
REF
1000pF
X7R
C
REF
PGOOD
RUN/SS
PGND
2.2µF
7
X7R
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
26
I
TH
R
69.8k
OSC
6
27
8
R2
2k
R
ITH
3.32k
R
C
T
ITH
2200pF
X7R
SYNC/MODE
SGND
C1
47pF
X7R
13
14
15
PGND
PGND
PGND
C
, C : TDK C3225X5R0J107M
IN OUT
3418 TA05
L1: VISHAY DALE IHLP-2525CZ-01
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600mA (I ), 1.5MHz, Synchronous Step-Down
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Dual 600mA (I ), 1.5MHz, Synchronous Step-Down
95% Efficiency, V : 2.5V to 5.5V, V
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1.25A (I ), 4MHz, Synchronous Step-Down
95% Efficiency, V : 2.5V to 5.5V, V
IN
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DC/DC Converter
I = 60µA, I < 1µA, MS Package
Q SD
LTC3412
2.5A (I ), 4MHz, Synchronous Step-Down
95% Efficiency, V : 2.5V to 5.5V, V
IN
OUT
DC/DC Converter
I = 60µA, I < 1µA, TSSOP16E Package
Q SD
LTC3413
3A (I
Sink/source), 2MHz, Monolithic Synchronous
90% Efficiency, V : 2.25V to 5.5V, V
Q SD
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4A (I ), 4MHz, Synchronous Step-Down
95% Efficiency, V : 2.25V to 5.5V, V
OUT(MIN)
Q SD
= 0.8V,
= 0.8V,
OUT
IN
DC/DC Converter
I = 64µA, I < 1µA, TSSOP20E Package
LTC3416
4A (I ), 4MHz, Synchronous Step-Down
95% Efficiency, V : 2.25V to 5.5V, V
IN OUT(MIN)
OUT
DC/DC Converter with Tracking
I = 300µA, I < 1µA, TSSOP20E Package
Q SD
3418f
LT/TP 0205 1K • PRINTED IN THE USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
20
●
●
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
©LINEAR TECHNOLOGY CORPORATION 2005
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