LTC3563EDC#TR [Linear]

IC 1.75 A SWITCHING REGULATOR, 2700 kHz SWITCHING FREQ-MAX, PDSO6, 2 X 2 MM, PLASTIC, MO-229WCCD-2, DFN-6, Switching Regulator or Controller;
LTC3563EDC#TR
型号: LTC3563EDC#TR
厂家: Linear    Linear
描述:

IC 1.75 A SWITCHING REGULATOR, 2700 kHz SWITCHING FREQ-MAX, PDSO6, 2 X 2 MM, PLASTIC, MO-229WCCD-2, DFN-6, Switching Regulator or Controller

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LTC3563  
500mA, Synchronous  
Step-Down DC/DC Converter  
with Selectable Output Voltage  
U
DESCRIPTIO  
FEATURES  
The LTC®3563 is a high efficiency monolithic synchro-  
nous buck converter using a constant frequency, current  
High Efficiency: Up to 96%  
Pin Selectable Output Voltage: 1.28V/1.87V  
Low Ripple (<20mV ) Burst Mode® Operation:  
I = 26µA  
Q
mode architecture. A voltage select input allows the user  
to program the output voltage to 1.28V or 1.87V. Supply  
currentduringoperationisonly26µA,droppingto<Ain  
shutdown. The2.5Vto5.5Vinputvoltagerangemakesthe  
LTC3563 ideally suited for single Li-Ion battery-powered  
applications.100%dutycycleprovideslowdropoutopera-  
tion, extending battery life in portable systems. Internal  
power switches are optimized to provide high efficiency  
and eliminate the need for an external Schottky diode.  
P-P  
Very Low Quiescent Current: Only 26µA  
2.5V to 5.5V Input Voltage Range  
2.25MHz Constant Frequency Operation  
Low Dropout Operation: 100% Duty Cycle  
No Schottky Diode Required  
Internal Soft-Start Limits Inrush Current  
Shutdown Mode Draws <1µA Supply Current  
2% Output Voltage Accuracy  
Current Mode Operation for Excellent Line and Load  
Transient Response  
Overtemperature Protected  
Available in 2mm × 2mm 6-Lead DFN  
U
The switching frequency is internally set at 2.25MHz,  
allowing the use of small surface mount inductors and  
capacitors. The LTC3563 is specifically designed to work  
well with ceramic output capacitors, achieving very low  
output voltage ripple and a small PCB footprint.  
The LTC3563 is configured for the power saving Burst  
Mode Operation.  
, LTC, LT, LTM and Burst Mode are registered trademarks of Linear Technology  
Corporation. All other trademarks are the property of their respective owners.  
Protected by U.S. Patents, including 5481178, 6580258, 6304066, 6127815, 6498466,  
6611131, 5994885.  
APPLICATIO S  
Cellular Telephones  
Wireless and DSL Modems  
Digital Cameras  
MP3 Players  
PDAs and Other Handheld Devices  
U
TYPICAL APPLICATIO  
Efficiency and Power Loss vs Output Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
1000  
100  
10  
2.2µH  
V
OUT  
V
IN  
1.28V/1.87V  
500mA  
V
SW  
OUT  
IN  
2.7V TO 5.5V  
C
IN  
10µF  
LTC3563  
CER  
RUN  
V
C
OUT  
10µF  
CER  
V
1.28V 1.87V  
SEL  
3563 TA01a  
GND  
1
V
V
= 3.6V  
IN  
OUT  
= 1.87V  
0.1  
1000  
0.1  
1
10  
100  
OUTPUT CURRENT (mA)  
3563 TA01b  
3563f  
1
LTC3563  
W W U W  
ABSOLUTE AXI U RATI GS  
PACKAGE/ORDER INFORMATION  
(Note 1)  
Input Supply Voltage (V )........................... –0.3V to 6V  
IN  
TOP VIEW  
V
V
, RUN Voltages .....................................–0.3V to V  
OUT  
SEL  
IN  
6
5
4
RUN  
V
1
2
3
OUT  
Voltage...................................–0.3V to (V + 0.3V)  
IN  
7
V
V
SEL  
IN  
SW Voltage ....................................–0.3V to (V + 0.3V)  
IN  
GND  
SW  
Operating Ambient Temperature Range  
(Note 2).................................................... –40°C to 85°C  
Junction Temperature (Note 7) ............................. 125°C  
Storage Temperature Range................... –65°C to 125°C  
Reflow Peak Body Temperature (DFN).................. 260°C  
DC PACKAGE  
6-LEAD (2mm × 2mm) PLASTIC DFN  
T
= 125°C, θ = 102°C/W, θ = 20°C/W (SOLDERED TO A 4-LAYER BOARD, NOTE 3)  
JA JC  
JMAX  
EXPOSED PAD (PIN 7) IS PGND, MUST BE SOLDERED TO PCB  
ORDER PART NUMBER  
LTC3563EDC  
DC PART MARKING  
LCSZ  
Order Options Tape and Reel: Add #TR  
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF  
Lead Free Part Marking: http://www.linear.com/leadfree/  
Consult LTC Marketing for parts specified with wider operating temperature ranges.  
ELECTRICAL CHARACTERISTICS The  
denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at T = 25°C. V = 3.6V unless otherwise noted.  
A
IN  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
Operating Voltage Range  
Output Voltage (Note 4)  
2.5  
5.5  
V
IN  
V
V
SEL  
V
SEL  
= 0V  
= High  
1.254  
1.832  
1.28  
1.87  
1.306  
1.908  
V
V
OUT  
ΔV  
ΔV  
Reference Voltage Line Regulation (Note 4)  
Output Voltage Load Regulation (Note 4)  
V
= 2.5V to 5.5V  
0.04  
0.2  
0.2  
%/V  
%
LINE_REG  
IN  
I
= 100mA to 500mA  
LOAD_REG  
LOAD  
I
Input DC Supply Current (Note 5)  
Active Mode  
S
V
V
= 1.1V, V = 0V  
500  
35  
1
µA  
µA  
µA  
OUT  
OUT  
SEL  
Sleep Mode  
= 1.4V, V = 0V  
26  
0.1  
SEL  
Shutdown  
RUN = 0V  
f
I
Oscillator Frequency  
Peak Switch Current  
1.8  
2.25  
2.7  
MHz  
mA  
OSC  
V
= 3V, V = 0.5V, Duty Cycle < 35%  
650  
1000  
1750  
LIM  
IN  
FB  
R
P-Channel On Resistance (Note 6)  
N-Channel On Resistance (Note 6)  
I
SW  
I
SW  
= 100mA  
= 100mA  
0.5  
0.35  
0.65  
0.55  
Ω
Ω
DS(ON)  
I
Switch Leakage Current  
V
IN  
= 5V, V  
= 0V, V = 0V or 5V  
0.01  
1
µA  
SW(LKG)  
RUN  
SW  
3563f  
2
LTC3563  
ELECTRICAL CHARACTERISTICS The  
denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at T = 25°C. V = 3.6V unless otherwise noted.  
A
IN  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
Undervoltage Lockout Threshold  
V
V
Rising  
Falling  
2.0  
1.9  
2.3  
V
V
UVLO  
IN  
IN  
1.8  
0.3  
V
RUN Threshold  
1.2  
1
V
µA  
RUN  
RUN  
I
RUN Leakage Current  
0.01  
1
V
V
Threshold  
0.3  
1.3  
1.2  
3
V
SEL  
SEL  
SEL  
R
V
Pull-Up Resistance  
Resistance Between V and V  
IN  
2.2  
MΩ  
SEL  
SEL  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime. No pin should exceed 6V.  
Note 4: The converter is tested in a proprietary test mode that connects  
the output of the error amplifier to the SW pin, which is connected to an  
external servo loop.  
Note 5: Dynamic supply current is higher due to the internal gate charge  
Note 2: The LTC3563 is guaranteed to meet performance specifications  
from 0°C to 85°C. Specifications over the –40°C to 85°C operating  
temperature range are assured by design, characterization and correlation  
with statistical process controls.  
Note 3: Failure to solder the Exposed Pad of the package to the PC board  
will result in a thermal resistance much higher than 40°C/W.  
being delivered at the switching frequency.  
Note 6: The DFN switch on resistance is guaranteed by correlation to wafer  
level measurements.  
Note 7: T is calculated from the ambient temperature T and power  
J
A
dissipation P according to the following formula:  
D
T = T + (P ) • (θ ).  
J
A
D
JA  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
T = 25°C unless otherwise specified.  
A
Burst Mode Operation  
Start-Up from Shutdown  
Start-Up from Shutdown  
RUN  
2V/DIV  
RUN  
2V/DIV  
SW  
2V/DIV  
V
OUT  
V
V
OUT  
OUT  
50mV/DIV  
1V/DIV  
1V/DIV  
AC COUPLED  
I
L
I
L
I
L
100mA/DIV  
500mA/DIV  
200mA/DIV  
3563 G03  
3563 G01  
3542 G02  
V
V
I
= 3.6V  
400µs/DIV  
V
V
I
= 3.6V  
2µs/DIV  
V
V
I
= 3.6V  
400µs/DIV  
IN  
OUT  
IN  
OUT  
IN  
OUT  
= 1.87V  
= 1.87V  
= 30mA  
= 1.87V  
= 0A  
= 500mA  
LOAD  
LOAD  
LOAD  
3563f  
3
LTC3563  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
T = 25°C unless otherwise specified.  
A
Load Step  
Load Step  
Load Step  
V
V
OUT  
V
OUT  
OUT  
100mV/DIV  
100mV/DIV  
100mV/DIV  
AC COUPLED  
AC COUPLED  
AC COUPLED  
I
I
L
L
I
L
500mA/DIV  
500mA/DIV  
500mA/DIV  
I
I
LOAD  
LOAD  
I
LOAD  
500mA/DIV  
500mA/DIV  
500mA/DIV  
3563 G04  
3563 G05  
3563 G06  
V
V
I
= 3.6V  
20µs/DIV  
V
V
I
= 3.6V  
20µs/DIV  
V
V
I
= 3.6V  
20µs/DIV  
IN  
OUT  
IN  
OUT  
IN  
OUT  
= 1.87V  
= 1.87V  
= 1.28V  
= 0A TO 500mA  
= 30mA TO 500mA  
= 0mA TO 500mA  
LOAD  
LOAD  
LOAD  
Regulated Output Voltage  
vs Temperature  
Oscillator Frequency  
vs Temperature  
Load Step  
2.5  
2.4  
2.3  
2.2  
2.1  
2.0  
1.31  
1.30  
1.29  
1.28  
1.27  
1.26  
1.25  
1.24  
V
= 0V  
SEL  
V
OUT  
100mV/DIV  
AC COUPLED  
I
L
500mA/DIV  
I
LOAD  
500mA/DIV  
3563 G07  
V
V
= 3.6V  
20µs/DIV  
IN  
= 1.28V  
OUT  
I
= 30mA TO 500mA  
LOAD  
–50 –25  
0
25  
50  
75 100 125  
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
TEMPERATURE (°C)  
3563 G09  
3563 G08  
Oscillator Frequency  
vs Supply Voltage  
Output Voltage vs Load Current  
Output Voltage vs Supply Voltage  
2.7  
2.6  
2.5  
2.4  
2.3  
2.2  
2.1  
2.0  
1.9  
1.8  
0.5  
0.4  
2.0  
1.5  
I
= 200mA  
OUT  
V
= 3.6V  
IN  
0.3  
1.0  
0.2  
0.5  
0.1  
Burst Mode  
OPERATION  
0
0
–0.1  
–0.2  
–0.3  
–0.4  
–0.5  
–0.5  
–1.0  
–1.5  
–2.0  
V
OUT  
V
OUT  
= 1.28V  
= 1.87V  
V
OUT  
V
OUT  
= 1.28V  
= 1.87V  
3
2
4
5
6
5.5  
2
4
5
2.5  
3
3.5  
4.5  
6
1
10  
100  
1000  
INPUT VOLTAGE (V)  
SUPPLY VOLTAGE (V)  
LOAD CURRENT (mA)  
3563 G10  
3563 G12  
3563 G11  
3563f  
4
LTC3563  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
T = 25°C unless otherwise specified.  
A
R
vs Input Voltage  
R
vs Temperature  
DS(ON)  
Switch Leakage vs Input Voltage  
DS(ON)  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
MAIN SWITCH  
MAIN SWITCH  
MAIN SWITCH  
SYNCHRONOUS  
SWITCH  
SYNCHRONOUS  
SWITCH  
SYNCHRONOUS  
SWITCH  
V
V
V
= 2.7V  
= 3.6V  
= 4.2V  
IN  
IN  
IN  
0
0
1
2
3
4
5
6
7
–50 –25  
0
25  
125  
50  
75 100  
0
1
3
4
5
6
2
V
(V)  
TEMPERATURE (°C)  
V
(V)  
IN  
IN  
3563 G13  
3563 G14  
3542 G15  
Switch Leakage vs Temperature  
Efficiency vs Input Voltage  
100  
90  
80  
70  
60  
50  
40  
30  
300  
250  
200  
150  
V
= 1.87V  
OUT  
100  
50  
0
I
I
I
I
I
= 500mA  
= 100mA  
= 10mA  
= 1mA  
OUT  
OUT  
OUT  
OUT  
OUT  
MAIN SWITCH  
SYNCHRONOUS SWITCH  
= 0.1mA  
4.5  
5.5  
2.5  
3
3.5  
4
5
50  
TEMPERATURE (°C)  
100 125  
–50 –25  
0
25  
75  
INPUT VOLTAGE (V)  
3563 G17  
3542 G16  
Efficiency vs Load Current  
Efficiency vs Load Current  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
V
V
= 2.7V  
= 3.6V  
= 4.2V  
V
V
V
= 2.7V  
= 3.6V  
= 4.2V  
IN  
IN  
IN  
IN  
IN  
IN  
V
= 1.87V  
V
= 1.28V  
OUT  
OUT  
FIGURE 3a CIRCUIT  
FIGURE 3a CIRCUIT  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
OUTPUT CURRENT (mA)  
OUTPUT CURRENT (mA)  
3563 G17  
3563 G18  
3563f  
5
LTC3563  
U
U
U
PI FU CTIO S  
V
(Pin1):OutputVoltageFeedback.Aninternalresistive  
V
(Pin5):OutputVoltageSelectionPin.Thispincontrols  
OUT  
SEL  
divider divides the output voltage down for comparison  
the regulated output voltage. When tied to GND, V  
is  
OUT  
to the internal 0.6V reference voltage.  
1.28V. When floating or connecting this pin to V , V  
becomes 1.87V.  
IN OUT  
V (Pin 2): Power Supply Pin. Must be closely decoupled  
IN  
to GND.  
RUN (Pin 6): Converter Enable Pin. Forcing this pin above  
1.5V enables this part, while forcing it below 0.3V causes  
the device to shut down. In shutdown, all functions are  
disabled drawing <1µA supply current. This pin must be  
driven; do not float.  
GND (Pin 3): Ground Pin.  
SW (Pin 4): Switch Node Connection to Inductor. This pin  
connectstothedrainsoftheinternalmainandsynchronous  
power MOSFET switches.  
Exposed Pad (Pin 7): GND. The Exposed Pad is ground. It  
must be soldered to PCB ground to provide both electrical  
contact and optimum thermal performance.  
3563f  
6
LTC3563  
W
BLOCK DIAGRA  
V
OUT  
SLOPE COMPENSATION  
V
1
IN  
2
+
OSC  
I
COMP  
+
+
V
IN  
EA  
0.6V  
V
SEL  
SW  
4
5
ANTI-  
SHOOT  
THROUGH  
+
BURST  
V
B
LOGIC  
V
IN  
+
RUN  
SHUTDOWN  
6
0.6V REF  
I
RCMP  
GND  
3
3563 BD  
3563f  
7
LTC3563  
U
OPERATIO  
The LTC3563 uses a constant frequency, current mode,  
step-down architecture. The operating frequency is set  
at 2.25MHz.  
In Burst Mode operation, the peak current of the inductor  
issettoapproximately60mAregardlessoftheoutputload.  
Each burst event can last from a few cycles at light loads  
to almost continuously cycling with short sleep intervals  
at moderate loads. In between these burst events, the  
powerMOSFETsandanyunneededcircuitryareturnedoff,  
reducingthequiescentcurrentto26µA. Inthissleepstate,  
the load current is being supplied solely from the output  
capacitor. As the output voltage drops, the EA amplifier’s  
output rises above the sleep threshold and turns the top  
MOSFETon.Thisprocessrepeatsataratethatisdependent  
on the load demand. By running cycles periodically, the  
switching losses which are dominated by the gate charge  
losses of the power MOSFETs are minimized.  
The output voltage is set by an internal divider. An error  
amplifier compares the divided output voltage with a  
reference voltage of 0.6V and adjusts the peak inductor  
current accordingly.  
Main Control Loop  
Duringnormaloperation,thetoppowerswitch(P-channel  
MOSFET) is turned on at the beginning of a clock cycle  
when the V  
voltage is below the regulated voltage.  
OUT  
The current flows into the inductor and the load increases  
until the current limit is reached. The switch turns off and  
energy stored in the inductor flows through the bottom  
switch (N-channel MOSFET) into the load until the next  
clock cycle. The peak inductor current is controlled by  
the internally compensated output of the error amplifier.  
When the load current increases, the feedback voltage  
decreases slightly below the reference. This decrease  
causes the error amplifier to increase its output voltage  
until the average inductor current matches the new load  
current. The main control loop is shut down by pulling  
the RUN pin to ground.  
Low Supply Operation  
To prevent unstable operation, the LTC3563 incorporates  
an undervoltage lockout circuit which shuts down the part  
when the input voltage drops below 2V.  
Internal Soft-Start  
At start-up when the RUN pin is brought high, the internal  
reference is linearly ramped from 0V to 0.6V in about  
1ms. The regulated output voltage follows this ramp from  
0% to 100% in 1ms. The current in the inductor during  
soft-start is defined by the combination of the current  
needed to charge the output capacitance and the current  
provided to the load as the output voltage ramps up. The  
start-up waveform, shown in the Typical Performance  
Characteristics, shows the output voltage start-up from  
Burst Mode Operation  
During light load currents, the LTC3563 operates in Burst  
Mode operation in which the internal power MOSFETs  
operate intermittently based on load demand.  
0V to 1.87V with a 500mA load and V = 3.6V.  
IN  
3563f  
8
LTC3563  
W U U  
APPLICATIO S I FOR ATIO  
U
the burst clamp. Lower inductor values result in higher  
ripplecurrentwhichcausesthetransitiontooccuratlower  
load currents. This causes a dip in efficiency in the upper  
range of low current operation. In Burst Mode operation,  
lower inductance values cause the burst frequency to  
increase.  
A general LTC3563 application circuit is shown in Figure1.  
Externalcomponentselectionisdrivenbytheloadrequire-  
ment and begins with the selection of the inductor L. Once  
the inductor is chosen, C and C  
can be selected.  
IN  
OUT  
L
V
IN  
V
V
SW  
OUT  
OUT  
IN  
2.7V TO 5.5V  
C
IN  
LTC3563  
Inductor Core Selection  
RUN  
C
OUT  
Differentcorematerialsandshapeschangethesize/current  
and price/current relationships of an inductor. Toroid or  
shieldedpotcoresinferriteorpermalloymaterialsaresmall  
and don’t radiate much energy, but generally cost more  
than powdered iron core inductors with similar electrical  
characteristics. The choice of which style inductor to use  
often depends more on the price vs size requirements  
and any radiated field/EMI requirements than on what the  
LTC3563 requires to operate. Table 1 shows some typi-  
cal surface mount inductors that work well in LTC3563  
applications.  
V
V
1.28V 1.87V  
SEL  
3563 F01  
GND  
Figure 1. LTC3563 General Schematic  
Inductor Selection  
The inductor value has a direct effect on ripple current ΔI ,  
L
whichdecreaseswithhigherinductanceandincreaseswith  
higher V or V , as shown in following equation:  
IN  
OUT  
VOUT  
VOUT  
IL =  
1–  
Input Capacitor (C ) Selection  
ƒ • L  
V
IN  
O
IN  
In continuous mode, the input current of the converter is a  
where f is the switching frequency. A reasonable starting  
O
square wave with a duty cycle of approximately V /V .  
OUT IN  
point for setting ripple current is ΔI = 0.4 • I  
,
L
OUT(MAX)  
Topreventlargevoltagetransients, alowequivalentseries  
resistance (ESR) input capacitor sized for the maximum  
RMS current must be used. The maximum RMS capacitor  
current is given by:  
where I  
is 500mA. The largest ripple current ΔI  
OUT(MAX)  
L
occurs at the maximum input voltage. To guarantee that  
the ripple current stays below a specified maximum, the  
inductor value should be chosen according to the follow-  
ing equation:  
VOUT V – V  
(
)
IN  
OUT  
IRMS IMAX  
VOUT  
ƒO IL  
VOUT  
V
IN  
L =  
1–  
V
IN(MAX)  
where the maximum average output current I  
equals  
MAX  
the peak current minus half the peak-to-peak ripple cur-  
rent, I = I ΔI /2. This formula has a maximum at  
The DC current rating of the inductor should be at least  
equal to the maximum load current plus half the ripple  
current to prevent core saturation. Thus, a 600mA rated  
inductor should be enough for most applications (500mA  
+ 100mA). For better efficiency, choose a low DC-resis-  
tance inductor.  
MAX  
LIM  
L
V = 2V , where I = I /2. This simple worst-case  
IN  
OUT  
RMS OUT  
is commonly used to design because even significant  
deviations do not offer much relief. Note that capacitor  
manufacturer’s ripple current ratings are often based on  
only2000hourslifetime.Thismakesitadvisabletofurther  
deratethecapacitor,orchooseacapacitorratedatahigher  
temperaturethanrequired.Severalcapacitorsmayalsobe  
paralleled to meet the size or height requirements of the  
The inductor value will also have an effect on Burst Mode  
operation. The transition to low current operation begins  
when the inductor’s peak current falls below a level set by  
3563f  
9
LTC3563  
W U U  
U
APPLICATIO S I FOR ATIO  
Table 1. Representative Surface Mount Inductors  
MAX DC  
PART NUMBER VALUE CURRENT DCR  
3
MANUFACTURER  
(µH)  
2.2  
2.2  
2.2  
3.3  
4.7  
2.2  
4.7  
2.2  
2.2  
(A)  
0.780  
1.2  
(Ω)  
SIZE (mm )  
Sumida  
CDRH2D11  
CDRH3D16  
CMD4D11  
CDH2D09B  
CLS4D09  
0.098 3.2 × 3.2 × 1.2  
0.075 3.8 × 3.8 × 1.8  
0.116 4.4 × 5.8 × 1.2  
0.95  
0.85  
0.75  
0.79  
0.75  
0.85  
1.0  
0.15  
0.15  
2.8 × 3 × 1  
4.9 × 4.9 × 1  
Murata  
TDK  
LQH32CN  
LQH43CN  
IVLC453232  
0.097 2.5 × 3.2 × 1.55  
0.15 4.5 × 3.2 × 2.6  
0.18 4.8 × 3.4 × 3.4  
VLF3010AT-  
2R2M1R0  
0.12  
2.8 × 2.6 × 1  
design. An additional 0.1µF to 1µF ceramic capacitor is  
T495 series, and Sprague 593D and 595D series. Consult  
the manufacturer for other specific recommendations.  
also recommended on V for high frequency decoupling,  
IN  
when not using an all ceramic capacitor solution.  
Ceramic Input and Output Capacitors  
Output Capacitor (C ) Selection  
OUT  
Higher value, lower cost ceramic capacitors are now  
becoming available in smaller case sizes. Their high  
ripple current rating, high voltage rating and low ESR  
are tempting for switching regulator use. However, the  
ESR is so low that it can cause loop stability problems.  
Since the LTC3563’s control loop does not depend on  
the output capacitor’s ESR for stable operation, ceramic  
capacitors can be used to achieve very low output ripple  
and small circuit size. X5R or X7R ceramic capacitors are  
recommended because these dielectrics have the best  
temperatureandvoltagecharacteristicsofalltheceramics  
for a given value and size.  
The selection of C  
is driven by the required ESR to  
OUT  
minimizevoltagerippleandloadsteptransients. Typically,  
once the ESR requirement is satisfied, the RMS current  
rating generally far exceeds the I  
requirement,  
RIPPLE(P-P)  
exceptforanallceramicsolution.Theoutputripple(ΔV  
)
OUT  
is determined by:  
1
VOUT ≈ ∆IL ESR+  
8• ƒO COUT  
where f is the switching frequency, C  
is the output  
O
OUT  
capacitanceandΔI istheinductorripplecurrent.Foraxed  
L
Great care must be taken when using only ceramic input  
and output capacitors. When a ceramic capacitor is used  
at the input and the power is being supplied through long  
wires, suchasfromawalladapter, aloadstepattheoutput  
output voltage, the output ripple is highest at maximum  
input voltage since ΔI increases with input voltage.  
L
Iftantalumcapacitorsareused,itiscriticalthatthecapaci-  
tors are surge tested for use in switching power supplies.  
AnexcellentchoiceistheAVXTPSseriesofsurfacemount  
tantalums, available in case heights ranging from 2mm to  
4mm. These are specially constructed and tested for low  
ESR so they give the lowest ESR for a given volume. Other  
capacitor types include Sanyo POSCAP, Kemet T510 and  
can induce ringing at the V pin. At best, this ringing can  
IN  
couple to the output and be mistaken as loop instability.  
At worst, the ringing at the input can be large enough to  
damage the part. For more information, see Application  
Note 88. The recommended capacitance value to use is  
10µF for both input and output capacitors.  
3563f  
10  
LTC3563  
W U U  
U
APPLICATIO S I FOR ATIO  
Efficiency Considerations  
1)TheV quiescentcurrentistheDCsupplycurrentgiven  
IN  
in the Electrical Characteristics which excludes MOSFET  
Theefficiencyofaswitchingregulatorisequaltotheoutput  
power divided by the input power times 100%. It is often  
useful to analyze individual losses to determine what is  
limiting the efficiency and which change would produce  
the most improvement. Efficiency can be expressed as:  
charging current. V current results in a small (<0.1%)  
IN  
loss that increases with V , even at no load.  
IN  
2
2) I R losses are calculated from the DC resistances of  
the internal switches, R , and external inductor, R . In  
SW  
L
continuousmode,theaverageoutputcurrentowsthrough  
inductor L, but is “chopped” between the internal top and  
bottom switches. Thus, the series resistance looking into  
the SW pin is a function of both top and bottom MOSFET  
Efficiency = 100% – (L1 + L2 + L3 + ...)  
where L1, L2, etc. are the individual losses as a percent-  
age of input power.  
R
and the duty cycle (D) as follows:  
DS(ON)  
Although all dissipative elements in the circuit produce  
losses, three main sources usually account for most of  
R
SW  
= (R  
)(D) + (R  
)(1 – D)  
DS(ON)TOP  
DS(ON)BOT  
the losses in LTC3563 circuits: 1) V quiescent current,  
IN  
The R  
for both the top and bottom MOSFETs can  
2
DS(ON)  
2) I R loss and 3) switching loss. V quiescent current  
IN  
be obtained from the Typical Performance Characteristics  
loss dominates the power loss at very low load currents,  
whereas the other two dominate at medium to high load  
currents. In a typical efficiency plot, the efficiency curve  
at very low load currents can be misleading since the  
actual power loss is of no consequence as illustrated in  
Figure 2.  
2
curves. Thus, to obtain I R losses:  
2
2
I R losses = I  
(R + R )  
SW L  
OUT  
3)TheswitchingcurrentisMOSFETgatechargingcurrent,  
that results from switching the gate capacitance of the  
power MOSFETs. Each time a MOSFET gate is switched  
fromlowtohightolowagain,apacketofchargedQmoves  
1000  
V
= 3.6V  
IN  
from V to ground. The resulting dQ/dt is a current out of  
IN  
V that is typically much larger than the DC bias current.  
IN  
100  
10  
In continuous mode, I  
= f (Q + Q ), where Q  
GATECHG  
O T B T  
and Q are the gate charges of the internal top and bottom  
B
MOSFETswitches.Thegatechargelossesareproportional  
to V and thus their effects will be more pronounced at  
IN  
higher supply voltages.  
1
V
V
= 1.87V  
= 1.28V  
OUT  
OUT  
Other “hidden” losses such as copper trace and internal  
battery resistances can account for additional efficiency  
degradations in portable systems. The internal battery  
and fuse resistance losses can be minimized by making  
0.1  
0.1  
1
10  
100  
1000  
OUTPUT CURRENT (mA)  
3563 F02  
sure that C has adequate charge storage and very low  
IN  
Figure 2. Power Loss vs Load Current  
ESR at the switching frequency. Other losses include  
diode conduction losses during dead-time and inductor  
core losses generally account for less than 2% total ad-  
ditional loss.  
3563f  
11  
LTC3563  
W U U  
U
APPLICATIO S I FOR ATIO  
Thermal Considerations  
which is below the maximum junction temperature of  
125°C.  
InmostapplicationstheLTC3563doesnotdissipatemuch  
heatduetoitshighefficiency.Butinapplicationswherethe  
LTC3563 is running at high ambient temperature with low  
supply voltage and high duty cycles, such as in dropout,  
the heat dissipated may exceed the maximum junction  
temperatureofthepart.Ifthejunctiontemperaturereaches  
approximately 150°C, both power switches will be turned  
off and the SW node will become high impedance.  
Notethatathighersupplyvoltages,thejunctiontemperature  
is lower due to reduced switch resistance (R  
).  
DS(ON)  
Checking Transient Response  
The regulator loop response can be checked by looking  
at the load transient response. Switching regulators take  
several cycles to respond to a step in load current. When  
a load step occurs, V  
immediately shifts by an amount  
To avoid the LTC3563 from exceeding the maximum  
junction temperature, the user needs to do some thermal  
analysis. The goal of the thermal analysis is to determine  
whether the power dissipated exceeds the maximum  
junction temperature of the part. The temperature rise is  
given by:  
OUT  
equal to ΔI  
• ESR, where ESR is the effective series  
LOAD  
resistance of C . ΔI  
also begins to charge or dis-  
OUT  
LOAD  
chargeC ,generatingafeedbackerrorsignalusedbythe  
OUT  
regulator to return V  
this recovery time, V  
to its steady-state value. During  
can be monitored for overshoot  
OUT  
OUT  
or ringing that would indicate a stability problem.  
T = (P )(θ )  
R
D
JA  
Theoutputvoltagesettlingbehaviorisrelatedtothestability  
of the closed-loop system and will demonstrate the actual  
overall supply performance. For a detailed explanation of  
optimizing the compensation components, including a re-  
view of control loop theory, refer to Application Note 76.  
where P is the power dissipated by the regulator and  
JA  
to the ambient.  
D
θ
is the thermal resistance from the junction of the die  
The junction temperature, T , is given by:  
J
T = T + T  
R
Insomeapplications,amoreseveretransientcanbecaused  
by switching loads with large (>1µF) bypass capacitors.  
The discharged bypass capacitors are effectively put in  
J
A
where T is the ambient temperature.  
A
As an example, consider the LTC3563 with an output  
voltage of 1.87V, an input voltage of 2.7V, a load current  
of 500mA and an ambient temperature of 70°C. From  
the typical performance graph of switch resistance, the  
parallelwithC , causingarapiddropinV . Noregula-  
OUT  
OUT  
tor can deliver enough current to prevent this problem, if  
the switch connecting the load has low resistance and is  
driven quickly. The solution is to limit the turn-on speed of  
the load switch driver. A Hot SwapTM controller is designed  
specifically for this purpose and usually incorporates cur-  
rent limit, short circuit protection and soft-start.  
R
of the P-channel switch at 70°C is approximately  
DS(ON)  
0.7Ω and the R  
of the N-channel synchronous  
DS(ON)  
switch is approximately 0.4Ω. The duty cycle in this case  
is approximately 70%.  
Design Example  
The series resistance looking into the SW pin is:  
As a design example, assume the LTC3563 is used in  
a single lithium-ion battery-powered cellular phone ap-  
R
= 0.7Ω (0.7) + 0.4Ω (0.3) = 0.61Ω  
SW  
Therefore, for the power dissipated by the part is:  
plication. The V will be operating from a maximum of  
IN  
2
4.2V down to about 2.7V. The load current requirement  
is a maximum of 0.5A, but most of the time it will be in  
standby mode, requiring only 2mA. Efficiency at both  
low and high load currents is important. Output voltage  
is either 1.87V or 1.28V.  
P = I  
D
• R = 152.5mW  
SW  
LOAD  
FortheDFNpackage, theθ is40°C/W. Thus, thejunction  
temperature of the regulator is:  
JA  
T = 70°C + (0.1525)(40) = 76.1°C  
J
3563f  
12  
LTC3563  
W U U  
APPLICATIO S I FOR ATIO  
U
With this information we can calculate L using:  
C
will require an RMS current rating of at least  
IN  
0.25A I  
/2 at temperature and C  
will require  
LOAD(MAX)  
OUT  
VOUT  
1
L =  
• VOUT • 1–  
ESR of less than 0.2Ω. In most cases, ceramic capacitors  
will satisfy these requirements. Select C = 10µF and  
f • IL  
V
IN  
OUT  
C = 10µF.  
IN  
Substituting V  
= 1.87V, V = 4.2V, ΔI = 200mA and  
OUT  
IN  
L
f = 2.25MHz gives:  
Figure3showsthecompletecircuitalongwithitsefficiency  
curve, load step response and recommended layout.  
1.87V  
2.25MHz 200mA  
1.87V  
4.2V  
L =  
• 1–  
= 2.31µH  
PC Board Layout Checklist  
With VOUT =1.28V  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of  
the LTC3563. These items are also illustrated graphically  
in Figure 3b. Check the following in your layout:  
1.28V  
2.25MHz 200mA  
1.28V  
4.2V  
L =  
• 1–  
=1.98µH  
Choosingavendor’sclosestinductorvalueof2.2µHresults  
in a maximum ripple current of:  
1. The power traces, consisting of the GND trace, the SW  
trace and the V trace should be kept short, direct and  
IN  
For VOUT = 1.87V  
wide.  
2. Does the (+) plate of C connect to V as closely as  
IN  
IN  
1.87V  
2.25MHz • 2.2µH  
1.87V  
4.2V  
IL =  
• 1–  
= 209.6mA  
= 179.8mA  
possible? This capacitor provides the AC current to the  
internal power MOSFETs.  
For VOUT = 1.28V  
3. Keepthe()platesofC andC  
ascloseaspossible.  
OUT  
IN  
Hot Swap is a trademark of Linear Technology Corporation.  
1.28V  
2.25MHz • 2.2µH  
1.28V  
4.2V  
IL =  
• 1–  
L
V
IN  
V
V
SW  
OUT  
OUT  
IN  
2.7V TO 5.5V  
C
IN  
LTC3563  
RUN  
C
OUT  
V
V
1.28V 1.87V  
SEL  
3563 F03  
GND  
Figure 3a. Typical Application  
3563f  
13  
LTC3563  
W U U  
U
APPLICATIO S I FOR ATIO  
VIA TO V  
OUT  
GND  
V
IN  
6
5
4
RUN  
V
1
2
3
OUT  
GND  
V
V
SEL  
IN  
GND  
SW  
C
IN  
L
C
OUT  
GND  
V
OUT  
3563 F03b  
Figure 3b. Layout Diagram  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
OUT  
100mV/DIV  
AC COUPLED  
I
L
500mA/DIV  
I
LOAD  
500mA/DIV  
V
V
V
= 2.7V  
= 3.6V  
= 4.2V  
3563 G04  
IN  
IN  
IN  
V
V
LOAD  
= 3.6V  
20µs/DIV  
IN  
V
= 1.87V  
OUT  
= 1.87V  
OUT  
FIGURE 3a CIRCUIT  
I
= 0A TO 500mA  
0.1  
1
10  
100  
1000  
OUTPUT CURRENT (mA)  
Figure 3d. Load Step  
3563 G17  
Figure 3c. Efficiency Curve  
3563f  
14  
LTC3563  
U
PACKAGE DESCRIPTIO  
DC Package  
6-Lead Plastic DFN (2mm × 2mm)  
(Reference LTC DWG # 05-08-1703)  
0.675 0.05  
2.50 0.05  
0.61 0.05  
1.15 0.05  
(2 SIDES)  
PACKAGE  
OUTLINE  
0.25 0.05  
0.50 BSC  
1.42 0.05  
(2 SIDES)  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
R = 0.115  
TYP  
0.56 0.05  
(2 SIDES)  
0.38 0.05  
4
6
2.00 0.10  
(4 SIDES)  
PIN 1 BAR  
PIN 1  
TOP MARK  
CHAMFER OF  
(SEE NOTE 6)  
EXPOSED PAD  
(DC6) DFN 1103  
3
1
0.25 0.05  
0.50 BSC  
0.75 0.05  
0.200 REF  
1.37 0.05  
(2 SIDES)  
BOTTOM VIEW—EXPOSED PAD  
0.00 – 0.05  
NOTE:  
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE  
TOP AND BOTTOM OF PACKAGE  
3563f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
15  
LTC3563  
U
TYPICAL APPLICATIO  
Using Low Profile Components, <1mm Height  
2.2µH**  
V
OUT  
V
IN  
1.28V/1.87V  
500mA  
V
SW  
OUT  
IN  
2.7V TO 5.5V  
C
*
IN  
10µF  
LTC3563  
CER  
RUN  
V
C
*
OUT  
10µF  
V
CER  
1.28V 1.87V  
SEL  
3563 TA02a  
GND  
*MURATA GRM219R60J106KE19  
**TDK VLF3010AT-2R2M1R0  
Efficiency vs Output Current  
100  
V
= 3.6V  
IN  
V
V
= 1.87V  
= 1.28V  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
OUT  
OUT  
0.1  
1
10  
100  
1000  
OUTPUT CURRENT (mA)  
3563 TA02b  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
95% Efficiency, V : 2.5V to 5.5V, V  
LTC3405/LTC3405B 300mA I , 1.5MHz, Synchronous Step-Down DC/DC  
= 0.8V, I = 20µA,  
Q
OUT  
IN  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
OUT(MIN)  
Converter  
I
< 1µA, ThinSOT Package  
SD  
LTC3406/LTC3406B 600mA I , 1.5MHz, Synchronous Step-Down DC/DC  
96% Efficiency, V : 2.5V to 5.5V, V  
SD  
= 0.6V, I = 20µA,  
Q
OUT  
IN  
Converter  
I
< 1µA, ThinSOT Package  
LTC3407/LTC3407-2 Dual 600mA/800mA I , 1.5MHz/2.25MHz, Synchronous 95% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V, I = 40µA,  
Q
OUT  
IN  
Step-Down DC/DC Converter  
I
SD  
< 1µA, MS10E, DFN Packages  
LTC3409  
600mA I , 1.7MHz/2.6MHZ, Synchronous Step-Down  
96% Efficiency, V : 1.6V to 5.5V, V  
SD  
= 0.6V, I = 65µA,  
Q
OUT  
IN  
DC/DC Converter  
I
< 1µA, DFN Package  
LTC3410/LTC3410B 300mA I , 2.25MHz, Synchronous Step-Down DC/DC  
95% Efficiency, V : 2.5V to 5.5V, V  
SD  
= 0.8V, I = 26µA,  
Q
OUT  
IN  
Converter  
I
< 1µA, SC70 Package  
LTC3411  
LTC3542  
LTC3548  
LTC3561  
1.25A I , 4MHz, Synchronous Step-Down DC/DC  
95% Efficiency, V : 2.5V to 5.5V, V  
SD  
= 0.8V, I = 60µA,  
Q
OUT  
Converter  
IN  
I
< 1µA, MS10, DFN Packages  
500mA I , 2.25MHz, Synchronous Step-Down DC/DC  
96% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V, I = 26µA,  
Q
OUT  
IN  
Converter  
I
SD  
< 1µA, DFN Packages  
Dual 400mA/800mA I , 2.25MHz, Synchronous  
95% Efficiency, V : 2.5V to 5.5V, V  
= 0.6V, I = 40µA,  
Q
OUT  
IN  
Step-Down DC/DC Converter  
I
SD  
< 1µA, MS10, DFN Packages  
1A I , 4MHz Synchronous Step-Down DC/DC Converter 95% Efficiency, V : 2.6V to 5.5V, V  
= 0.8V, I = 240µA,  
Q
OUT  
IN  
I
SD  
< 1µA, 3mm × 3mm DFN Package  
3563f  
LT 0107 • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
16  
© LINEAR TECHNOLOGY CORPORATION 2007  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  

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