LTC3563EDC#TR [Linear]
IC 1.75 A SWITCHING REGULATOR, 2700 kHz SWITCHING FREQ-MAX, PDSO6, 2 X 2 MM, PLASTIC, MO-229WCCD-2, DFN-6, Switching Regulator or Controller;型号: | LTC3563EDC#TR |
厂家: | Linear |
描述: | IC 1.75 A SWITCHING REGULATOR, 2700 kHz SWITCHING FREQ-MAX, PDSO6, 2 X 2 MM, PLASTIC, MO-229WCCD-2, DFN-6, Switching Regulator or Controller 转换器 |
文件: | 总16页 (文件大小:272K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC3563
500mA, Synchronous
Step-Down DC/DC Converter
with Selectable Output Voltage
U
DESCRIPTIO
FEATURES
The LTC®3563 is a high efficiency monolithic synchro-
nous buck converter using a constant frequency, current
■
High Efficiency: Up to 96%
■
Pin Selectable Output Voltage: 1.28V/1.87V
Low Ripple (<20mV ) Burst Mode® Operation:
I = 26µA
Q
mode architecture. A voltage select input allows the user
to program the output voltage to 1.28V or 1.87V. Supply
currentduringoperationisonly26µA,droppingto<1µAin
shutdown. The2.5Vto5.5Vinputvoltagerangemakesthe
LTC3563 ideally suited for single Li-Ion battery-powered
applications.100%dutycycleprovideslowdropoutopera-
tion, extending battery life in portable systems. Internal
power switches are optimized to provide high efficiency
and eliminate the need for an external Schottky diode.
■
P-P
■
■
■
■
■
■
■
■
■
Very Low Quiescent Current: Only 26µA
2.5V to 5.5V Input Voltage Range
2.25MHz Constant Frequency Operation
Low Dropout Operation: 100% Duty Cycle
No Schottky Diode Required
Internal Soft-Start Limits Inrush Current
Shutdown Mode Draws <1µA Supply Current
2% Output Voltage Accuracy
Current Mode Operation for Excellent Line and Load
Transient Response
Overtemperature Protected
Available in 2mm × 2mm 6-Lead DFN
U
The switching frequency is internally set at 2.25MHz,
allowing the use of small surface mount inductors and
capacitors. The LTC3563 is specifically designed to work
well with ceramic output capacitors, achieving very low
output voltage ripple and a small PCB footprint.
■
■
The LTC3563 is configured for the power saving Burst
Mode Operation.
, LTC, LT, LTM and Burst Mode are registered trademarks of Linear Technology
Corporation. All other trademarks are the property of their respective owners.
Protected by U.S. Patents, including 5481178, 6580258, 6304066, 6127815, 6498466,
6611131, 5994885.
APPLICATIO S
■
Cellular Telephones
Wireless and DSL Modems
Digital Cameras
MP3 Players
PDAs and Other Handheld Devices
■
■
■
■
U
TYPICAL APPLICATIO
Efficiency and Power Loss vs Output Current
100
90
80
70
60
50
40
30
20
10
0
1000
100
10
2.2µH
V
OUT
V
IN
1.28V/1.87V
500mA
V
SW
OUT
IN
2.7V TO 5.5V
C
IN
10µF
LTC3563
CER
RUN
V
C
OUT
10µF
CER
V
1.28V 1.87V
SEL
3563 TA01a
GND
1
V
V
= 3.6V
IN
OUT
= 1.87V
0.1
1000
0.1
1
10
100
OUTPUT CURRENT (mA)
3563 TA01b
3563f
1
LTC3563
W W U W
ABSOLUTE AXI U RATI GS
PACKAGE/ORDER INFORMATION
(Note 1)
Input Supply Voltage (V )........................... –0.3V to 6V
IN
TOP VIEW
V
V
, RUN Voltages .....................................–0.3V to V
OUT
SEL
IN
6
5
4
RUN
V
1
2
3
OUT
Voltage...................................–0.3V to (V + 0.3V)
IN
7
V
V
SEL
IN
SW Voltage ....................................–0.3V to (V + 0.3V)
IN
GND
SW
Operating Ambient Temperature Range
(Note 2).................................................... –40°C to 85°C
Junction Temperature (Note 7) ............................. 125°C
Storage Temperature Range................... –65°C to 125°C
Reflow Peak Body Temperature (DFN).................. 260°C
DC PACKAGE
6-LEAD (2mm × 2mm) PLASTIC DFN
T
= 125°C, θ = 102°C/W, θ = 20°C/W (SOLDERED TO A 4-LAYER BOARD, NOTE 3)
JA JC
JMAX
EXPOSED PAD (PIN 7) IS PGND, MUST BE SOLDERED TO PCB
ORDER PART NUMBER
LTC3563EDC
DC PART MARKING
LCSZ
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS The
●
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T = 25°C. V = 3.6V unless otherwise noted.
A
IN
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
●
V
Operating Voltage Range
Output Voltage (Note 4)
2.5
5.5
V
IN
●
●
V
V
SEL
V
SEL
= 0V
= High
1.254
1.832
1.28
1.87
1.306
1.908
V
V
OUT
ΔV
ΔV
Reference Voltage Line Regulation (Note 4)
Output Voltage Load Regulation (Note 4)
V
= 2.5V to 5.5V
0.04
0.2
0.2
%/V
%
LINE_REG
IN
I
= 100mA to 500mA
LOAD_REG
LOAD
I
Input DC Supply Current (Note 5)
Active Mode
S
V
V
= 1.1V, V = 0V
500
35
1
µA
µA
µA
OUT
OUT
SEL
Sleep Mode
= 1.4V, V = 0V
26
0.1
SEL
Shutdown
RUN = 0V
●
f
I
Oscillator Frequency
Peak Switch Current
1.8
2.25
2.7
MHz
mA
OSC
V
= 3V, V = 0.5V, Duty Cycle < 35%
650
1000
1750
LIM
IN
FB
R
P-Channel On Resistance (Note 6)
N-Channel On Resistance (Note 6)
I
SW
I
SW
= 100mA
= 100mA
0.5
0.35
0.65
0.55
Ω
Ω
DS(ON)
I
Switch Leakage Current
V
IN
= 5V, V
= 0V, V = 0V or 5V
0.01
1
µA
SW(LKG)
RUN
SW
3563f
2
LTC3563
ELECTRICAL CHARACTERISTICS The
●
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T = 25°C. V = 3.6V unless otherwise noted.
A
IN
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
Undervoltage Lockout Threshold
V
V
Rising
Falling
2.0
1.9
2.3
V
V
UVLO
IN
IN
1.8
0.3
●
●
●
V
RUN Threshold
1.2
1
V
µA
RUN
RUN
I
RUN Leakage Current
0.01
1
V
V
Threshold
0.3
1.3
1.2
3
V
SEL
SEL
SEL
R
V
Pull-Up Resistance
Resistance Between V and V
IN
2.2
MΩ
SEL
SEL
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime. No pin should exceed 6V.
Note 4: The converter is tested in a proprietary test mode that connects
the output of the error amplifier to the SW pin, which is connected to an
external servo loop.
Note 5: Dynamic supply current is higher due to the internal gate charge
Note 2: The LTC3563 is guaranteed to meet performance specifications
from 0°C to 85°C. Specifications over the –40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 3: Failure to solder the Exposed Pad of the package to the PC board
will result in a thermal resistance much higher than 40°C/W.
being delivered at the switching frequency.
Note 6: The DFN switch on resistance is guaranteed by correlation to wafer
level measurements.
Note 7: T is calculated from the ambient temperature T and power
J
A
dissipation P according to the following formula:
D
T = T + (P ) • (θ ).
J
A
D
JA
U W
TYPICAL PERFOR A CE CHARACTERISTICS
T = 25°C unless otherwise specified.
A
Burst Mode Operation
Start-Up from Shutdown
Start-Up from Shutdown
RUN
2V/DIV
RUN
2V/DIV
SW
2V/DIV
V
OUT
V
V
OUT
OUT
50mV/DIV
1V/DIV
1V/DIV
AC COUPLED
I
L
I
L
I
L
100mA/DIV
500mA/DIV
200mA/DIV
3563 G03
3563 G01
3542 G02
V
V
I
= 3.6V
400µs/DIV
V
V
I
= 3.6V
2µs/DIV
V
V
I
= 3.6V
400µs/DIV
IN
OUT
IN
OUT
IN
OUT
= 1.87V
= 1.87V
= 30mA
= 1.87V
= 0A
= 500mA
LOAD
LOAD
LOAD
3563f
3
LTC3563
U W
TYPICAL PERFOR A CE CHARACTERISTICS
T = 25°C unless otherwise specified.
A
Load Step
Load Step
Load Step
V
V
OUT
V
OUT
OUT
100mV/DIV
100mV/DIV
100mV/DIV
AC COUPLED
AC COUPLED
AC COUPLED
I
I
L
L
I
L
500mA/DIV
500mA/DIV
500mA/DIV
I
I
LOAD
LOAD
I
LOAD
500mA/DIV
500mA/DIV
500mA/DIV
3563 G04
3563 G05
3563 G06
V
V
I
= 3.6V
20µs/DIV
V
V
I
= 3.6V
20µs/DIV
V
V
I
= 3.6V
20µs/DIV
IN
OUT
IN
OUT
IN
OUT
= 1.87V
= 1.87V
= 1.28V
= 0A TO 500mA
= 30mA TO 500mA
= 0mA TO 500mA
LOAD
LOAD
LOAD
Regulated Output Voltage
vs Temperature
Oscillator Frequency
vs Temperature
Load Step
2.5
2.4
2.3
2.2
2.1
2.0
1.31
1.30
1.29
1.28
1.27
1.26
1.25
1.24
V
= 0V
SEL
V
OUT
100mV/DIV
AC COUPLED
I
L
500mA/DIV
I
LOAD
500mA/DIV
3563 G07
V
V
= 3.6V
20µs/DIV
IN
= 1.28V
OUT
I
= 30mA TO 500mA
LOAD
–50 –25
0
25
50
75 100 125
50
TEMPERATURE (°C)
100 125
–50 –25
0
25
75
TEMPERATURE (°C)
3563 G09
3563 G08
Oscillator Frequency
vs Supply Voltage
Output Voltage vs Load Current
Output Voltage vs Supply Voltage
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
0.5
0.4
2.0
1.5
I
= 200mA
OUT
V
= 3.6V
IN
0.3
1.0
0.2
0.5
0.1
Burst Mode
OPERATION
0
0
–0.1
–0.2
–0.3
–0.4
–0.5
–0.5
–1.0
–1.5
–2.0
V
OUT
V
OUT
= 1.28V
= 1.87V
V
OUT
V
OUT
= 1.28V
= 1.87V
3
2
4
5
6
5.5
2
4
5
2.5
3
3.5
4.5
6
1
10
100
1000
INPUT VOLTAGE (V)
SUPPLY VOLTAGE (V)
LOAD CURRENT (mA)
3563 G10
3563 G12
3563 G11
3563f
4
LTC3563
U W
TYPICAL PERFOR A CE CHARACTERISTICS
T = 25°C unless otherwise specified.
A
R
vs Input Voltage
R
vs Temperature
DS(ON)
Switch Leakage vs Input Voltage
DS(ON)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
1000
900
800
700
600
500
400
300
200
100
0
MAIN SWITCH
MAIN SWITCH
MAIN SWITCH
SYNCHRONOUS
SWITCH
SYNCHRONOUS
SWITCH
SYNCHRONOUS
SWITCH
V
V
V
= 2.7V
= 3.6V
= 4.2V
IN
IN
IN
0
0
1
2
3
4
5
6
7
–50 –25
0
25
125
50
75 100
0
1
3
4
5
6
2
V
(V)
TEMPERATURE (°C)
V
(V)
IN
IN
3563 G13
3563 G14
3542 G15
Switch Leakage vs Temperature
Efficiency vs Input Voltage
100
90
80
70
60
50
40
30
300
250
200
150
V
= 1.87V
OUT
100
50
0
I
I
I
I
I
= 500mA
= 100mA
= 10mA
= 1mA
OUT
OUT
OUT
OUT
OUT
MAIN SWITCH
SYNCHRONOUS SWITCH
= 0.1mA
4.5
5.5
2.5
3
3.5
4
5
50
TEMPERATURE (°C)
100 125
–50 –25
0
25
75
INPUT VOLTAGE (V)
3563 G17
3542 G16
Efficiency vs Load Current
Efficiency vs Load Current
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
V
V
V
= 2.7V
= 3.6V
= 4.2V
V
V
V
= 2.7V
= 3.6V
= 4.2V
IN
IN
IN
IN
IN
IN
V
= 1.87V
V
= 1.28V
OUT
OUT
FIGURE 3a CIRCUIT
FIGURE 3a CIRCUIT
0.1
1
10
100
1000
0.1
1
10
100
1000
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
3563 G17
3563 G18
3563f
5
LTC3563
U
U
U
PI FU CTIO S
V
(Pin1):OutputVoltageFeedback.Aninternalresistive
V
(Pin5):OutputVoltageSelectionPin.Thispincontrols
OUT
SEL
divider divides the output voltage down for comparison
the regulated output voltage. When tied to GND, V
is
OUT
to the internal 0.6V reference voltage.
1.28V. When floating or connecting this pin to V , V
becomes 1.87V.
IN OUT
V (Pin 2): Power Supply Pin. Must be closely decoupled
IN
to GND.
RUN (Pin 6): Converter Enable Pin. Forcing this pin above
1.5V enables this part, while forcing it below 0.3V causes
the device to shut down. In shutdown, all functions are
disabled drawing <1µA supply current. This pin must be
driven; do not float.
GND (Pin 3): Ground Pin.
SW (Pin 4): Switch Node Connection to Inductor. This pin
connectstothedrainsoftheinternalmainandsynchronous
power MOSFET switches.
Exposed Pad (Pin 7): GND. The Exposed Pad is ground. It
must be soldered to PCB ground to provide both electrical
contact and optimum thermal performance.
3563f
6
LTC3563
W
BLOCK DIAGRA
V
OUT
SLOPE COMPENSATION
V
1
IN
2
+
–
OSC
I
COMP
–
+
–
+
V
IN
EA
0.6V
V
SEL
SW
4
5
ANTI-
SHOOT
THROUGH
+
BURST
V
B
LOGIC
V
IN
+
–
RUN
SHUTDOWN
6
0.6V REF
I
RCMP
GND
3
3563 BD
3563f
7
LTC3563
U
OPERATIO
The LTC3563 uses a constant frequency, current mode,
step-down architecture. The operating frequency is set
at 2.25MHz.
In Burst Mode operation, the peak current of the inductor
issettoapproximately60mAregardlessoftheoutputload.
Each burst event can last from a few cycles at light loads
to almost continuously cycling with short sleep intervals
at moderate loads. In between these burst events, the
powerMOSFETsandanyunneededcircuitryareturnedoff,
reducingthequiescentcurrentto26µA. Inthissleepstate,
the load current is being supplied solely from the output
capacitor. As the output voltage drops, the EA amplifier’s
output rises above the sleep threshold and turns the top
MOSFETon.Thisprocessrepeatsataratethatisdependent
on the load demand. By running cycles periodically, the
switching losses which are dominated by the gate charge
losses of the power MOSFETs are minimized.
The output voltage is set by an internal divider. An error
amplifier compares the divided output voltage with a
reference voltage of 0.6V and adjusts the peak inductor
current accordingly.
Main Control Loop
Duringnormaloperation,thetoppowerswitch(P-channel
MOSFET) is turned on at the beginning of a clock cycle
when the V
voltage is below the regulated voltage.
OUT
The current flows into the inductor and the load increases
until the current limit is reached. The switch turns off and
energy stored in the inductor flows through the bottom
switch (N-channel MOSFET) into the load until the next
clock cycle. The peak inductor current is controlled by
the internally compensated output of the error amplifier.
When the load current increases, the feedback voltage
decreases slightly below the reference. This decrease
causes the error amplifier to increase its output voltage
until the average inductor current matches the new load
current. The main control loop is shut down by pulling
the RUN pin to ground.
Low Supply Operation
To prevent unstable operation, the LTC3563 incorporates
an undervoltage lockout circuit which shuts down the part
when the input voltage drops below 2V.
Internal Soft-Start
At start-up when the RUN pin is brought high, the internal
reference is linearly ramped from 0V to 0.6V in about
1ms. The regulated output voltage follows this ramp from
0% to 100% in 1ms. The current in the inductor during
soft-start is defined by the combination of the current
needed to charge the output capacitance and the current
provided to the load as the output voltage ramps up. The
start-up waveform, shown in the Typical Performance
Characteristics, shows the output voltage start-up from
Burst Mode Operation
During light load currents, the LTC3563 operates in Burst
Mode operation in which the internal power MOSFETs
operate intermittently based on load demand.
0V to 1.87V with a 500mA load and V = 3.6V.
IN
3563f
8
LTC3563
W U U
APPLICATIO S I FOR ATIO
U
the burst clamp. Lower inductor values result in higher
ripplecurrentwhichcausesthetransitiontooccuratlower
load currents. This causes a dip in efficiency in the upper
range of low current operation. In Burst Mode operation,
lower inductance values cause the burst frequency to
increase.
A general LTC3563 application circuit is shown in Figure1.
Externalcomponentselectionisdrivenbytheloadrequire-
ment and begins with the selection of the inductor L. Once
the inductor is chosen, C and C
can be selected.
IN
OUT
L
V
IN
V
V
SW
OUT
OUT
IN
2.7V TO 5.5V
C
IN
LTC3563
Inductor Core Selection
RUN
C
OUT
Differentcorematerialsandshapeschangethesize/current
and price/current relationships of an inductor. Toroid or
shieldedpotcoresinferriteorpermalloymaterialsaresmall
and don’t radiate much energy, but generally cost more
than powdered iron core inductors with similar electrical
characteristics. The choice of which style inductor to use
often depends more on the price vs size requirements
and any radiated field/EMI requirements than on what the
LTC3563 requires to operate. Table 1 shows some typi-
cal surface mount inductors that work well in LTC3563
applications.
V
V
1.28V 1.87V
SEL
3563 F01
GND
Figure 1. LTC3563 General Schematic
Inductor Selection
The inductor value has a direct effect on ripple current ΔI ,
L
whichdecreaseswithhigherinductanceandincreaseswith
higher V or V , as shown in following equation:
IN
OUT
⎛
⎞
VOUT
VOUT
∆IL =
1–
⎜
⎟
Input Capacitor (C ) Selection
ƒ • L
V
IN
⎝
⎠
O
IN
In continuous mode, the input current of the converter is a
where f is the switching frequency. A reasonable starting
O
square wave with a duty cycle of approximately V /V .
OUT IN
point for setting ripple current is ΔI = 0.4 • I
,
L
OUT(MAX)
Topreventlargevoltagetransients, alowequivalentseries
resistance (ESR) input capacitor sized for the maximum
RMS current must be used. The maximum RMS capacitor
current is given by:
where I
is 500mA. The largest ripple current ΔI
OUT(MAX)
L
occurs at the maximum input voltage. To guarantee that
the ripple current stays below a specified maximum, the
inductor value should be chosen according to the follow-
ing equation:
VOUT V – V
(
)
IN
OUT
IRMS ≈IMAX
⎛
⎞
VOUT
ƒO • ∆IL
VOUT
V
IN
L =
1–
⎜
⎟
V
⎝
⎠
IN(MAX)
where the maximum average output current I
equals
MAX
the peak current minus half the peak-to-peak ripple cur-
rent, I = I – ΔI /2. This formula has a maximum at
The DC current rating of the inductor should be at least
equal to the maximum load current plus half the ripple
current to prevent core saturation. Thus, a 600mA rated
inductor should be enough for most applications (500mA
+ 100mA). For better efficiency, choose a low DC-resis-
tance inductor.
MAX
LIM
L
V = 2V , where I = I /2. This simple worst-case
IN
OUT
RMS OUT
is commonly used to design because even significant
deviations do not offer much relief. Note that capacitor
manufacturer’s ripple current ratings are often based on
only2000hourslifetime.Thismakesitadvisabletofurther
deratethecapacitor,orchooseacapacitorratedatahigher
temperaturethanrequired.Severalcapacitorsmayalsobe
paralleled to meet the size or height requirements of the
The inductor value will also have an effect on Burst Mode
operation. The transition to low current operation begins
when the inductor’s peak current falls below a level set by
3563f
9
LTC3563
W U U
U
APPLICATIO S I FOR ATIO
Table 1. Representative Surface Mount Inductors
MAX DC
PART NUMBER VALUE CURRENT DCR
3
MANUFACTURER
(µH)
2.2
2.2
2.2
3.3
4.7
2.2
4.7
2.2
2.2
(A)
0.780
1.2
(Ω)
SIZE (mm )
Sumida
CDRH2D11
CDRH3D16
CMD4D11
CDH2D09B
CLS4D09
0.098 3.2 × 3.2 × 1.2
0.075 3.8 × 3.8 × 1.8
0.116 4.4 × 5.8 × 1.2
0.95
0.85
0.75
0.79
0.75
0.85
1.0
0.15
0.15
2.8 × 3 × 1
4.9 × 4.9 × 1
Murata
TDK
LQH32CN
LQH43CN
IVLC453232
0.097 2.5 × 3.2 × 1.55
0.15 4.5 × 3.2 × 2.6
0.18 4.8 × 3.4 × 3.4
VLF3010AT-
2R2M1R0
0.12
2.8 × 2.6 × 1
design. An additional 0.1µF to 1µF ceramic capacitor is
T495 series, and Sprague 593D and 595D series. Consult
the manufacturer for other specific recommendations.
also recommended on V for high frequency decoupling,
IN
when not using an all ceramic capacitor solution.
Ceramic Input and Output Capacitors
Output Capacitor (C ) Selection
OUT
Higher value, lower cost ceramic capacitors are now
becoming available in smaller case sizes. Their high
ripple current rating, high voltage rating and low ESR
are tempting for switching regulator use. However, the
ESR is so low that it can cause loop stability problems.
Since the LTC3563’s control loop does not depend on
the output capacitor’s ESR for stable operation, ceramic
capacitors can be used to achieve very low output ripple
and small circuit size. X5R or X7R ceramic capacitors are
recommended because these dielectrics have the best
temperatureandvoltagecharacteristicsofalltheceramics
for a given value and size.
The selection of C
is driven by the required ESR to
OUT
minimizevoltagerippleandloadsteptransients. Typically,
once the ESR requirement is satisfied, the RMS current
rating generally far exceeds the I
requirement,
RIPPLE(P-P)
exceptforanallceramicsolution.Theoutputripple(ΔV
)
OUT
is determined by:
⎛
⎞
1
∆VOUT ≈ ∆IL ESR+
⎜
⎝
⎟
8• ƒO •COUT
⎠
where f is the switching frequency, C
is the output
O
OUT
capacitanceandΔI istheinductorripplecurrent.Forafixed
L
Great care must be taken when using only ceramic input
and output capacitors. When a ceramic capacitor is used
at the input and the power is being supplied through long
wires, suchasfromawalladapter, aloadstepattheoutput
output voltage, the output ripple is highest at maximum
input voltage since ΔI increases with input voltage.
L
Iftantalumcapacitorsareused,itiscriticalthatthecapaci-
tors are surge tested for use in switching power supplies.
AnexcellentchoiceistheAVXTPSseriesofsurfacemount
tantalums, available in case heights ranging from 2mm to
4mm. These are specially constructed and tested for low
ESR so they give the lowest ESR for a given volume. Other
capacitor types include Sanyo POSCAP, Kemet T510 and
can induce ringing at the V pin. At best, this ringing can
IN
couple to the output and be mistaken as loop instability.
At worst, the ringing at the input can be large enough to
damage the part. For more information, see Application
Note 88. The recommended capacitance value to use is
10µF for both input and output capacitors.
3563f
10
LTC3563
W U U
U
APPLICATIO S I FOR ATIO
Efficiency Considerations
1)TheV quiescentcurrentistheDCsupplycurrentgiven
IN
in the Electrical Characteristics which excludes MOSFET
Theefficiencyofaswitchingregulatorisequaltotheoutput
power divided by the input power times 100%. It is often
useful to analyze individual losses to determine what is
limiting the efficiency and which change would produce
the most improvement. Efficiency can be expressed as:
charging current. V current results in a small (<0.1%)
IN
loss that increases with V , even at no load.
IN
2
2) I R losses are calculated from the DC resistances of
the internal switches, R , and external inductor, R . In
SW
L
continuousmode,theaverageoutputcurrentflowsthrough
inductor L, but is “chopped” between the internal top and
bottom switches. Thus, the series resistance looking into
the SW pin is a function of both top and bottom MOSFET
Efficiency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc. are the individual losses as a percent-
age of input power.
R
and the duty cycle (D) as follows:
DS(ON)
Although all dissipative elements in the circuit produce
losses, three main sources usually account for most of
R
SW
= (R
)(D) + (R
)(1 – D)
DS(ON)TOP
DS(ON)BOT
the losses in LTC3563 circuits: 1) V quiescent current,
IN
The R
for both the top and bottom MOSFETs can
2
DS(ON)
2) I R loss and 3) switching loss. V quiescent current
IN
be obtained from the Typical Performance Characteristics
loss dominates the power loss at very low load currents,
whereas the other two dominate at medium to high load
currents. In a typical efficiency plot, the efficiency curve
at very low load currents can be misleading since the
actual power loss is of no consequence as illustrated in
Figure 2.
2
curves. Thus, to obtain I R losses:
2
2
I R losses = I
(R + R )
SW L
OUT
3)TheswitchingcurrentisMOSFETgatechargingcurrent,
that results from switching the gate capacitance of the
power MOSFETs. Each time a MOSFET gate is switched
fromlowtohightolowagain,apacketofchargedQmoves
1000
V
= 3.6V
IN
from V to ground. The resulting dQ/dt is a current out of
IN
V that is typically much larger than the DC bias current.
IN
100
10
In continuous mode, I
= f (Q + Q ), where Q
GATECHG
O T B T
and Q are the gate charges of the internal top and bottom
B
MOSFETswitches.Thegatechargelossesareproportional
to V and thus their effects will be more pronounced at
IN
higher supply voltages.
1
V
V
= 1.87V
= 1.28V
OUT
OUT
Other “hidden” losses such as copper trace and internal
battery resistances can account for additional efficiency
degradations in portable systems. The internal battery
and fuse resistance losses can be minimized by making
0.1
0.1
1
10
100
1000
OUTPUT CURRENT (mA)
3563 F02
sure that C has adequate charge storage and very low
IN
Figure 2. Power Loss vs Load Current
ESR at the switching frequency. Other losses include
diode conduction losses during dead-time and inductor
core losses generally account for less than 2% total ad-
ditional loss.
3563f
11
LTC3563
W U U
U
APPLICATIO S I FOR ATIO
Thermal Considerations
which is below the maximum junction temperature of
125°C.
InmostapplicationstheLTC3563doesnotdissipatemuch
heatduetoitshighefficiency.Butinapplicationswherethe
LTC3563 is running at high ambient temperature with low
supply voltage and high duty cycles, such as in dropout,
the heat dissipated may exceed the maximum junction
temperatureofthepart.Ifthejunctiontemperaturereaches
approximately 150°C, both power switches will be turned
off and the SW node will become high impedance.
Notethatathighersupplyvoltages,thejunctiontemperature
is lower due to reduced switch resistance (R
).
DS(ON)
Checking Transient Response
The regulator loop response can be checked by looking
at the load transient response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, V
immediately shifts by an amount
To avoid the LTC3563 from exceeding the maximum
junction temperature, the user needs to do some thermal
analysis. The goal of the thermal analysis is to determine
whether the power dissipated exceeds the maximum
junction temperature of the part. The temperature rise is
given by:
OUT
equal to ΔI
• ESR, where ESR is the effective series
LOAD
resistance of C . ΔI
also begins to charge or dis-
OUT
LOAD
chargeC ,generatingafeedbackerrorsignalusedbythe
OUT
regulator to return V
this recovery time, V
to its steady-state value. During
can be monitored for overshoot
OUT
OUT
or ringing that would indicate a stability problem.
T = (P )(θ )
R
D
JA
Theoutputvoltagesettlingbehaviorisrelatedtothestability
of the closed-loop system and will demonstrate the actual
overall supply performance. For a detailed explanation of
optimizing the compensation components, including a re-
view of control loop theory, refer to Application Note 76.
where P is the power dissipated by the regulator and
JA
to the ambient.
D
θ
is the thermal resistance from the junction of the die
The junction temperature, T , is given by:
J
T = T + T
R
Insomeapplications,amoreseveretransientcanbecaused
by switching loads with large (>1µF) bypass capacitors.
The discharged bypass capacitors are effectively put in
J
A
where T is the ambient temperature.
A
As an example, consider the LTC3563 with an output
voltage of 1.87V, an input voltage of 2.7V, a load current
of 500mA and an ambient temperature of 70°C. From
the typical performance graph of switch resistance, the
parallelwithC , causingarapiddropinV . Noregula-
OUT
OUT
tor can deliver enough current to prevent this problem, if
the switch connecting the load has low resistance and is
driven quickly. The solution is to limit the turn-on speed of
the load switch driver. A Hot SwapTM controller is designed
specifically for this purpose and usually incorporates cur-
rent limit, short circuit protection and soft-start.
R
of the P-channel switch at 70°C is approximately
DS(ON)
0.7Ω and the R
of the N-channel synchronous
DS(ON)
switch is approximately 0.4Ω. The duty cycle in this case
is approximately 70%.
Design Example
The series resistance looking into the SW pin is:
As a design example, assume the LTC3563 is used in
a single lithium-ion battery-powered cellular phone ap-
R
= 0.7Ω (0.7) + 0.4Ω (0.3) = 0.61Ω
SW
Therefore, for the power dissipated by the part is:
plication. The V will be operating from a maximum of
IN
2
4.2V down to about 2.7V. The load current requirement
is a maximum of 0.5A, but most of the time it will be in
standby mode, requiring only 2mA. Efficiency at both
low and high load currents is important. Output voltage
is either 1.87V or 1.28V.
P = I
D
• R = 152.5mW
SW
LOAD
FortheDFNpackage, theθ is40°C/W. Thus, thejunction
temperature of the regulator is:
JA
T = 70°C + (0.1525)(40) = 76.1°C
J
3563f
12
LTC3563
W U U
APPLICATIO S I FOR ATIO
U
With this information we can calculate L using:
C
will require an RMS current rating of at least
IN
0.25A ≅ I
/2 at temperature and C
will require
LOAD(MAX)
OUT
⎛
⎞
VOUT
1
L =
• VOUT • 1–
ESR of less than 0.2Ω. In most cases, ceramic capacitors
will satisfy these requirements. Select C = 10µF and
⎜
⎝
⎟
f • ∆IL
V
⎠
IN
OUT
C = 10µF.
IN
Substituting V
= 1.87V, V = 4.2V, ΔI = 200mA and
OUT
IN
L
f = 2.25MHz gives:
Figure3showsthecompletecircuitalongwithitsefficiency
curve, load step response and recommended layout.
1.87V
2.25MHz •200mA
1.87V
4.2V
⎛
⎝
⎞
L =
• 1–
= 2.31µH
⎜
⎟
⎠
PC Board Layout Checklist
With VOUT =1.28V
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3563. These items are also illustrated graphically
in Figure 3b. Check the following in your layout:
1.28V
2.25MHz •200mA
1.28V
4.2V
⎛
⎝
⎞
L =
• 1–
=1.98µH
⎜
⎟
⎠
Choosingavendor’sclosestinductorvalueof2.2µHresults
in a maximum ripple current of:
1. The power traces, consisting of the GND trace, the SW
trace and the V trace should be kept short, direct and
IN
For VOUT = 1.87V
wide.
2. Does the (+) plate of C connect to V as closely as
IN
IN
1.87V
2.25MHz • 2.2µH
1.87V
4.2V
⎛
⎝
⎞
∆IL =
• 1–
= 209.6mA
= 179.8mA
⎜
⎟
⎠
possible? This capacitor provides the AC current to the
internal power MOSFETs.
For VOUT = 1.28V
3. Keepthe(–)platesofC andC
ascloseaspossible.
OUT
IN
Hot Swap is a trademark of Linear Technology Corporation.
1.28V
2.25MHz • 2.2µH
1.28V
4.2V
⎛
⎞
∆IL =
• 1–
⎜
⎟
⎠
⎝
L
V
IN
V
V
SW
OUT
OUT
IN
2.7V TO 5.5V
C
IN
LTC3563
RUN
C
OUT
V
V
1.28V 1.87V
SEL
3563 F03
GND
Figure 3a. Typical Application
3563f
13
LTC3563
W U U
U
APPLICATIO S I FOR ATIO
VIA TO V
OUT
GND
V
IN
6
5
4
RUN
V
1
2
3
OUT
GND
V
V
SEL
IN
GND
SW
C
IN
L
C
OUT
GND
V
OUT
3563 F03b
Figure 3b. Layout Diagram
100
90
80
70
60
50
40
30
20
10
0
V
OUT
100mV/DIV
AC COUPLED
I
L
500mA/DIV
I
LOAD
500mA/DIV
V
V
V
= 2.7V
= 3.6V
= 4.2V
3563 G04
IN
IN
IN
V
V
LOAD
= 3.6V
20µs/DIV
IN
V
= 1.87V
OUT
= 1.87V
OUT
FIGURE 3a CIRCUIT
I
= 0A TO 500mA
0.1
1
10
100
1000
OUTPUT CURRENT (mA)
Figure 3d. Load Step
3563 G17
Figure 3c. Efficiency Curve
3563f
14
LTC3563
U
PACKAGE DESCRIPTIO
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
0.675 0.05
2.50 0.05
0.61 0.05
1.15 0.05
(2 SIDES)
PACKAGE
OUTLINE
0.25 0.05
0.50 BSC
1.42 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
R = 0.115
TYP
0.56 0.05
(2 SIDES)
0.38 0.05
4
6
2.00 0.10
(4 SIDES)
PIN 1 BAR
PIN 1
TOP MARK
CHAMFER OF
(SEE NOTE 6)
EXPOSED PAD
(DC6) DFN 1103
3
1
0.25 0.05
0.50 BSC
0.75 0.05
0.200 REF
1.37 0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
3563f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
LTC3563
U
TYPICAL APPLICATIO
Using Low Profile Components, <1mm Height
2.2µH**
V
OUT
V
IN
1.28V/1.87V
500mA
V
SW
OUT
IN
2.7V TO 5.5V
C
*
IN
10µF
LTC3563
CER
RUN
V
C
*
OUT
10µF
V
CER
1.28V 1.87V
SEL
3563 TA02a
GND
*MURATA GRM219R60J106KE19
**TDK VLF3010AT-2R2M1R0
Efficiency vs Output Current
100
V
= 3.6V
IN
V
V
= 1.87V
= 1.28V
90
80
70
60
50
40
30
20
10
0
OUT
OUT
0.1
1
10
100
1000
OUTPUT CURRENT (mA)
3563 TA02b
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3563f
LT 0107 • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
16
●
●
© LINEAR TECHNOLOGY CORPORATION 2007
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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