LTC3577-3 [Linear]
Highly Integrated Portable Product PMIC; 高集成度便携式产品PMIC![LTC3577-3](http://pdffile.icpdf.com/pdf1/p00146/img/icpdf/LTC35_809618_icpdf.jpg)
型号: | LTC3577-3 |
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描述: | Highly Integrated Portable Product PMIC |
文件: | 总52页 (文件大小:555K) |
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LTC3577-3/LTC3577-4
Highly Integrated
Portable Product PMIC
FEATURES
DESCRIPTION
The LTC®3577-3/LTC3577-4 are highly integrated power
managementICsforsinglecellLi-Ion/Polymerbatteryap-
plications.ItincludesaPowerPathmanagerwithautomatic
load prioritization, a battery charger, an ideal diode, input
overvoltage protection and numerous other internal pro-
tection features. The LTC3577-3/LTC3577-4 are designed
toaccuratelychargefromcurrentlimitedsuppliessuchas
USB by automatically reducing charge current such that
the sum of the load current and the charge current does
notexceedtheprogrammedinputcurrentlimit(100mAor
500mAmodes).TheLTC3577-3/LTC3577-4reducethebat-
teryvoltageatelevatedtemperaturestoimprovesafetyand
reliability. The three step-down switching regulators and
two LDOs provide a wide range of available supplies. The
LTC3577-3/LTC3577-4 also include a pushbutton input to
controlpowersequencingandsystemreset. Theonboard
LED backlight boost circuitry can drive up to 10 series
LEDs and includes versatile digital dimming via the I2C
input.TheLTC3577-3/LTC3577-4aredesignedtosupport
the SiRF Atlas IV processor and has pushbutton timing
and sequencing different from other LTC3577 versions.
The LTC3577-3/LTC3577-4 are available in a low profile
4mm × 7mm × 0.75mm 44-pin QFN package.
n
Full Featured Li-Ion/Polymer Charger/PowerPath™
Control with Instant-On Operation
n
Triple Adjustable High Efficiency Step-Down
Switching Regulators (800mA, 500mA, 500mA I
)
OUT
2
n
I C Adjustable SW Slew Rates for EMI Reduction
n
High Temperature Battery Voltage Reduction
Improves Safety and Reliability
n
Overvoltage Protection Controller for USB (V )/Wall
BUS
Inputs Provide Protection to 30V
n
Integrated 40V Series LED Back Light Driver with 60dB
2
Brightness Control and Gradation via I C
n
n
1.5A Maximum Charge Current with Thermal Limiting
Battery Float Voltage: 4.2V (LTC3577-3)
4.1V (LTC3577-4)
n
n
n
Pushbutton ON/OFF Control with System Reset
Dual 150mA Current Limited LDOs
Start-Up Timing Compatible with SiRF Atlas IV
Processor
n
Small 4mm × 7mm 44-pin QFN package
APPLICATIONS
n
PNDs, DMB/DVB-H, Digital/Satellite Radio,
Media Players
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. PowerPath is a trademark of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 6522118, 6700364, 7511390, 5481178, 6580258. Other
patents pending.
n
Portable Industrial/Medical Products
Other USB-Based Handheld Products
n
TYPICAL APPLICATION
5V
10-LED Driver Efficiency
ADAPTER
OPTIONAL
90
80
70
60
100mA/500mA
1000mA
USB
V
OUT
0V
OVERVOLTAGE
PROTECTION
CC/CV
MAX PWM
CONSTANT
CURRENT
CHARGER
+
50
40
30
20
10
0
SINGLE CELL
Li-Ion
CHARGE
NTC
LTC3577-3/LTC3577-4
2
0.8V to 3.6V/150mA
0.8V to 3.6V/150mA
DUAL LDO
2
I C PORT
REGULATORS
LED BACKLIGHT WITH DIGITALLY
CONTROLLED DIMMING
4 TO 10 LED
BOOST
TRIPLE HIGH
0.8V to 3.6V/800mA
0.8V to 3.6V/500mA
0.8V to 3.6V/500mA
EFFICIENCY
PUSHBUTTON
CONTROL
1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01
PB
STEP-DOWN
LED CURRENT (A)
SWITCHING
REGULATORS
357734 TA01b
357734 TA01a
357734fa
1
LTC3577-3/LTC3577-4
TABLE OF CONTENTS
FEATURES....................................................................................................................................................................1
APPLICATIONS ............................................................................................................................................................1
TYPICAL APPLICATION................................................................................................................................................1
DESCRIPTION..............................................................................................................................................................1
ABSOLUTE MAXIMUM RATINGS.................................................................................................................................3
ORDER INFORMATION ................................................................................................................................................3
PIN CONFIGURATION ..................................................................................................................................................3
ELECTRICAL CHARACTERISTICS ................................................................................................................................4
TYPICAL PERFORMANCE CHARACTERISTICS ..........................................................................................................10
PIN FUNCTIONS.........................................................................................................................................................16
BLOCK DIAGRAM ......................................................................................................................................................19
OPERATION ...............................................................................................................................................................20
PowerPath OPERATION.........................................................................................................................................20
LOW DROPOUT LINEAR REGULATOR OPERATION...............................................................................................29
STEP-DOWN SWITCHING REGULATOR OPERATION ............................................................................................30
LED BACKLIGHT/BOOST OPERATION ...................................................................................................................34
2
I C OPERATION .....................................................................................................................................................37
PUSHBUTTON INTERFACE OPERATION ................................................................................................................43
LAYOUT AND THERMAL CONSIDERATIONS .........................................................................................................47
TYPICAL APPLICATION..............................................................................................................................................49
PACKAGE DESCRIPTION............................................................................................................................................51
RELATED PARTS........................................................................................................................................................52
357734fa
2
LTC3577-3/LTC3577-4
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Notes 1, 2, 3)
V
V
............................................................ –0.3V to 45V
BUS OUT IN12 IN3 INLDO1 INLDO2
t < 1ms and Duty Cycle < 1% .................. –0.3V to 7V
Steady State............................................. –0.3V to 6V
SW
TOP VIEW
, V , V
, V , V
, V
, WALL
CHRG, BAT, LED_FS, LED_OV,
PWR_ON, EXTPWR, PBSTAT, PGOOD,
FB1, FB2, FB3, LDO1, LDO1_FB, LDO2,
I
1
2
37 IDGATE
36 PROG
35 NTC
34 NTCBIAS
33 SW1
LIM0
I
LIM1
LED_FS 3
WALL 4
SW3 5
LDO2_FB, DV , SCL, SDA, EN3.................. –0.3V to 6V
CC
V
6
32 V
IN3
IN12
NTC, PROG, CLPROG, ON, I
, I
LIM0 LIM1
45
FB3 7
OVSENS 8
LED_OV 9
DV 10
SDA 11
SCL 12
OVGATE 13
PWR_ON 14
ON 15
31 SW2
30 V
(Note 4)............................................–0.3V to V + 0.3V
INLD02
CC
29 LDO2
28 LDO1
27 V
INLDO1
26 FB1
25 FB2
24 LDO2_FB
23 LDO1_FB
I
I
I
I
I
I
I
, I
, I .........................................................2A
VBUS VOUT BAT
SW3
SW2 SW1
LDO1 LDO2
CHRG ACPR EXTPWR PBSTAT PGOOD
OVSENS
CLPROG PROG LED_FS LED_OV
CC
(Continuous)................................................850mA
, I
, I
, I
(Continuous).......................................600mA
(Continuous).....................................200mA
, I
, I
, I
....................75mA
...................................................................10mA
, I
, I
, I
...............................2mA
Maximum Junction Temperature........................... 110°C
Operating Temperature Range.................. –40°C to 85°C
Storage Temperature Range................... –65°C to 125°C
UFF PACKAGE
44-LEAD (7mm s 4mm) PLASTIC QFN
T
JMAX
= 110°C, θ = 45°C/W
JA
EXPOSED PAD (PIN 45) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
LTC3577EUFF-3#PBF
LTC3577EUFF-4#PBF
TAPE AND REEL
PART MARKING
35773
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3577EUFF-3#TRPBF
LTC3577EUFF-4#TRPBF
–40°C to 85°C
–40°C to 85°C
44-Lead (4mm × 7mm) Plastic QFN
44-Lead (4mm × 7mm) Plastic QFN
35774
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
357734fa
3
LTC3577-3/LTC3577-4
Power Manager. The l denotes the specifications which apply over the
ELECTRICAL CHARACTERISTICS
full operating temperature range, otherwise specifications are at TA = 25°C. VBUS = 5V, VBAT = 3.8V, ILIM0 = ILIM1 = 5V, WALL = 0V,
VINLDO2 = VINLOD1 = VIN12 = VIN3 = VOUT, RPROG = 2k, RCLPROG = 2.1k, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Input Power Supply
V
Input Supply Voltage
4.35
5.5
V
BUS
l
l
l
I
Total Input Current (Note 5)
I
I
I
= 5V, I
= 0V, I
= 0V, I
= 5V (1x Mode)
= 0V (5x Mode)
= 5V (10x Mode)
80
450
900
90
475
950
100
500
1000
mA
mA
mA
BUS_LIM
LIM0
LIM0
LIM0
LIM1
LIM1
LIM1
I
Input Quiescent Current, POFF State
1x, 5x, 10x Modes
= 5V, I = 0V (Suspend Mode)
0.42
0.05
mA
mA
BUSQ
I
0.1
LIM0
LIM1
h
Ratio of Measured V
Current to
1000
mA/mA
CLPROG
BUS
CLPROG Program Current
V
CLPROG Servo Voltage in Current
Limit
1x Mode
5x Mode
10x Mode
0.2
1.0
2.0
V
V
V
CLPROG
V
V
V
V
Undervoltage Lockout
Rising Threshold
Falling Threshold
3.8
3.7
3.9
V
V
UVLO
BUS
3.5
to V
Differential Undervoltage Rising Threshold
Falling Threshold
50
–50
100
mV
mV
DUVLO
BUS
OUT
Lockout
R
Input Current Limit Power FET On-
Resistance (Between V and V
200
mΩ
ON_ILIM
)
OUT
BUS
Battery Charger
V
V
Regulated Output Voltage
BAT
LTC3577-3
LTC3577-3, 0 ≤ T ≤ 85°C
A
4.179
4.165
4.200
4.200
4.221
4.235
V
V
FLOAT
LTC3577-4
4.079
4.065
4.1
4.1
4.121
4.135
V
V
LTC3577-4, 0 ≤ T ≤ 85°C
A
l
l
l
ICHG
Constant-Current Mode Charge Current
IC Not in Thermal Limit
R
PROG
R
PROG
R
PROG
= 1k, Input Current Limit = 2A
= 2k, Input Current Limit = 1A
= 5k, Input Current Limit = 0.4A
950
465
180
1000
500
200
1050
535
220
mA
mA
mA
IBATQ_OFF
IBATQ_ON
Battery Drain Current, POFF State,
Buck3 Disabled, No Load (Note 15)
V
V
= 4.3V, Charger Time Out
= 0V
6
27
μA
μA
BAT
BUS
55
100
Battery Drain Current, PON State,
Buck3 Enabled (Notes 10, 15)
V
= 0V, I
= 0μA, No Load On
OUT
130
200
μA
BUS
Supplies, Burst Mode Operation
V
V
PROG Pin Servo Voltage
V
V
> V
< V
1.000
0.100
V
V
PROG,CHG
BAT
BAT
TRKL
TRKL
PROG Pin Servo Voltage in Trickle
Charge
PROG,TRKL
h
Ratio of I
to PROG Pin Current
1000
50
mA/mA
mA
PROG
BAT
I
Trickle Charge Current
V
< V
40
60
TRKL
BAT
TRKL
V
Trickle Charge Rising Threshold
Trickle Charge Falling Threshold
V
V
Rising
Falling
2.9
3.0
V
V
TRKL
BAT
BAT
2.5
–75
3.2
2.75
ΔV
Recharge Battery Threshold Voltage
Safety Timer Termination Period
Bad Battery Termination Time
Threshold Voltage Relative to V
–100
4
–125
4.8
mV
Hour
RECHRG
FLOAT
t
t
Timer Starts when V
= V
– 50mV
TERM
BADBAT
BAT
FLOAT
V
BAT
< V
0.4
0.5
0.1
200
0.6
Hour
TRKL
h
End-of-Charge Indication Current Ratio (Note 6)
Battery Charger Power FET On-
0.085
0.11
mA/mA
mΩ
C/10
R
ON_CHG
Resistance (Between V
and BAT)
OUT
T
Junction Temperature in Constant
Temperature Mode
110
°C
LIM
357734fa
4
LTC3577-3/LTC3577-4
ELECTRICAL CHARACTERISTICS Power Manager. The l denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. VBUS = 5V, VBAT = 3.8V, ILIM0 = ILIM1 = 5V, WALL = 0V,
VINLDO2 = VINLOD1 = VIN12 = VIN3 = VOUT, RPROG = 2k, RCLPROG = 2.1k, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NTC, Battery Discharge Protection
V
V
Cold Temperature Fault Threshold
Voltage
Rising NTC Voltage
Hysteresis
75
34
76
77
36
%V
%V
COLD
HOT
NTCBIAS
NTCBIAS
1.3
Hot Temperature Fault Threshold
Voltage
Falling NTC Voltage
Hysteresis
35
1.3
%V
%V
NTCBIAS
NTCBIAS
V
_
NTC Discharge Threshold Voltage
Falling NTC Voltage
Hysteresis
24.5
–50
25.5
50
26.5
50
%V
TOO HOT
NTCBIAS
mV
I
I
NTC Leakage Current
BAT Discharge Current
BAT Discharge Threshold
V
V
= V = 5V
BUS
nA
mA
V
NTC
NTC
BAT
= 4.1V, NTC < V
170
3.9
BAT2HOT
TOO_HOT
V
I
< 0.1mA, NTC < V
TOO_HOT
BAT2HOT
BAT
Ideal Diode
V
Forward Voltage Detection
Diode On-Resistance, Dropout
Diode Current Limit
I
I
= 10mA
5
15
200
3.6
25
mV
mΩ
A
FWD
OUT
R
= 200mA
DROPOUT
MAX
OUT
I
(Note 7)
Overvoltage Protection
V
V
Overvoltage Protection Threshold
OVGATE Output Voltage
Rising Threshold, R
= 6.2k
OVSENS
6.10
6.35
6.70
12
V
OVCUTOFF
OVGATE
Input Below V
Input Above V
1.88 • V
0
V
V
OVCUTOFF
OVCUTOFF
OVSENS
I
t
OVSENS Quiescent Current
V
C
= 5V
40
μA
OVSENSQ
RISE
OVSENS
OVGATE
OVGATE Time to Reach Regulation
= 1nF
2.5
ms
Wall Adapter and High Voltage Buck Output Control
V
ACPR Pin Output High Voltage
ACPR Pin Output Low Voltage
I
I
= 0.1mA
= 1mA
V
OUT
– 0.3
V
OUT
0
V
V
ACPR
ACPR
ACPR
0.3
V
Absolute Wall Input Threshold Voltage
V
WALL
Rising
Falling
4.3
3.2
4.45
V
V
W
WALL
V
3.1
0
Differential Wall Input Threshold
Voltage
V
WALL
– V Falling
25
75
mV
mV
ΔV
WALL
BAT
W
V
– V Rising
100
0.4
BAT
I
Wall Operating Quiescent Current
I
+ I
, I = 0mA,
= 5V
440
μA
QWALL
WALL
VOUT BAT
WALL = V
OUT
Logic (I
, I
and CHRG)
LIM0 LIM1
V
V
Input Low Voltage
I
I
I
I
, I
LIM0 LIM1
V
V
IL
IH
Input High Voltage
, I
1.2
LIM0 LIM1
I
Static Pull-Down Current
CHRG Pin Output Low Voltage
CHRG Pin Input Current
, I ; V = 1V
LIM0 LIM1 PIN
2
0.15
0
μA
V
PD
V
= 10mA
CHRG
0.4
1
CHRG
CHRG
I
V
= 4.5V, V
= 5V
CHRG
μA
BAT
357734fa
5
LTC3577-3/LTC3577-4
2
I C Interface. The l denotes the specifications which apply over the full
ELECTRICAL CHARACTERISTICS
operating temperature range, otherwise specifications are at TA = 25°C. DVCC = 3.3V, VOUT = 3.8V, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
DV
Input Supply Voltage
1.6
5.5
V
CC
I
DV Supply Current
CC
SCL = 400kHz
SCL = SDA = 0kHz
10
1
μA
μA
DVCC
V
V
V
DV UVLO
1.0
50
50
V
DVCC,UVLO
CC
Input HIGH Voltage
70
%DV
%DV
IH
IL
CC
CC
Input LOW Voltage
30
–1
–1
I
IH
I
IL
Input HIGH Leakage Current
Input LOW Leakage Current
SDA Output LOW Voltage
SDA = SCL = DV = 5.5V
1
1
μA
μA
V
CC
SDA = SCL = 0V, DV = 5.5V
CC
V
OL
I
= 3mA
0.4
SDA
Timing Characteristics (Note 8) (All Values are Referenced to V and V )
IH
IL
f
t
t
t
t
t
t
t
t
t
t
SCL Clock Frequency
400
kHz
μs
μs
μs
μs
μs
μs
ns
ns
ns
ns
SCL
LOW Period of the SCL Clock
HIGH Period of the SCL Clock
Bus Free Time Between Stop and Start Condition
Hold Time After (Repeated) Start Condition
Setup Time for a Repeated Start Condition
Stop Condition Set-Up Time
1.3
0.6
1.3
0.6
0.6
0.6
0
LOW
HIGH
BUF
HD,STA
SU,STA
SU,STO
HD,DATO
HD,DATI
SU,DAT
SP
Output Data Hold Time
900
50
Input Data Hold Time
0
Data Set-Up Time
100
Input Spike Suppression Pulse Width
LED Boost Switching Regulator. The l denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C. VIN3 = VOUT = 3.8V, ROV = 10M, RLED_FS = 20k, boost regulator disabled unless
otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
(Note 9)
MIN
TYP
MAX
UNITS
l
V
, V
IN3 OUT
Operating Supply Range
2.7
5.5
V
I
Operating Quiescent Current
Shutdown Quiescent Current
(Notes 10, 14)
560
0.01
μA
μA
VOUT_LED
V
LED Overvoltage Threshold
LED_OV Rising
LED_OV Falling
1.0
1.25
V
V
LED_OV
0.6
800
18
0.85
I
I
I
Peak NMOS Switch Current
1000
20
1200
22
mA
mA
dB
LIM
I
I
Pin Full-Scale Operating Current
Pin Full-Scale Dimming Range
LED(FS)
LED(DIM)
LED
64 Steps
60
LED
R
R
of NMOS Switch
240
0.01
1.125
800
4
mΩ
μA
NSWON
NSWOFF
OSC
DS(ON)
I
f
NMOS Switch Off Leakage Current
Oscillator Frequency
V
SW
= 5.5V
1
0.95
780
3.8
1.3
820
4.2
MHz
mV
μA
l
l
V
LED_FS Pin Voltage
LED_FS
LED_OV
I
LED_OV Pin Current
D
BOOST
Maximum Duty Cycle
I
= 0
97
%
LED
l
V
Boost Mode Feedback Voltage
775
800
825
mV
BOOSTFB
357734fa
6
LTC3577-3/LTC3577-4
ELECTRICAL CHARACTERISTICS Step-Down Switching Regulators. The l denotes the specifications
which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VOUT = VIN12 = VIN3 = 3.8V, all
regulators enabled unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Step-Down Switching Regulators (Buck1, Buck2 and Buck3)
l
V
V
, V
Input Supply Voltage
(Note 9)
and V Connected to V Through
OUT
2.7
2.5
5.5
2.9
V
IN12 IN3
UVLO
V
V
Falling
Rising
V
2.7
2.8
V
V
OUT
OUT
OUT
IN12
IN3
Low Impedance. Switching Regulators are
Disabled Below V UVLO
OUT
f
Oscillator Frequency
1.91
2.25
2.59
MHz
OSC
800mA Step-Down Switching Regulator 3 (Buck3-Enabled via EN3, Disabled in PON and POFF States)
I
Pulse-Skipping Mode Input Current
Burst Mode Input Current
Shutdown Input Current
Peak PMOS Current Limit
Feedback Voltage
(Note 10)
(Note 10)
EN3 = 0
100
20
μA
μA
VIN3Q
35
1
0.01
1400
μA
I
(Note 7)
1000
1700
mA
LIM3
l
l
V
Pulse-Skipping Mode
Burst Mode Operation
0.78
0.78
0.8
0.8
0.82
0.824
V
V
FB3
I
FB3 Input Current
Max Duty Cycle
(Note 10)
FB3 = 0V
–0.05
100
0.05
μA
%
Ω
Ω
kΩ
V
FB3
D3
R
R
R
R
R
of PMOS
of NMOS
0.3
0.4
10
P3
DS(ON)
DS(ON)
N3
SW3 Pull-Down in Shutdown
EN3 Input Low Voltage
EN3 Input High Voltage
EN3 = 0
SW3_PD
IL,EN3
IH,EN3
V
V
0.4
1.2
V
500mA Step-Down Switching Regulator 2 (Buck2-Pushbutton Enabled, Third in Sequence)
I
Pulse-Skipping Mode Input Current
Burst Mode Input Current
Shutdown Input Current
Peak PMOS Current Limit
Feedback Voltage
(Note 10)
(Note 10)
POFF State
(Note 7)
100
20
μA
μA
VIN12Q
0.01
900
1
μA
I
650
1200
mA
LIM2
l
l
V
Pulse-Skipping Mode
Burst Mode Operation
0.78
0.78
0.8
0.8
0.82
0.824
V
V
FB2
I
FB2 Input Current
Max Duty Cycle
(Note 10)
FB2 = 0V
–0.05
100
0.05
μA
%
FB2
D2
R
R
R
R
R
of PMOS
of NMOS
I
I
= 100mA
0.6
0.6
10
Ω
P2
DS(ON)
DS(ON)
SW2
SW2
= –100mA
Ω
N2
SW2 Pull-Down in Shutdown
POFF State
kΩ
SW2_PD
500mA Step-Down Switching Regulator 1 (Buck1-Pushbutton Enabled, Second in Sequence)
I
Pulse-Skipping Mode Input Current
Burst Mode Input Current
Shutdown Input Current
Peak PMOS Current Limit
Feedback Voltage
(Note 10)
(Note 10)
100
20
μA
μA
VIN12Q
0.01
900
1
μA
I
(Note 7)
650
1200
mA
LIM1
l
l
V
Pulse Skip Mode
Burst Mode Operation
0.78
0.78
0.8
0.8
0.82
0.824
V
V
FB1
I
FB1 Input Current
Max Duty Cycle
(Note 10)
FB1 = 0V
–0.05
100
0.05
μA
%
FB1
D1
R
R
R
R
R
of PMOS
of NMOS
I
I
= 100mA
0.6
0.6
10
Ω
P1
DS(ON)
DS(ON)
SW1
SW1
= –100mA
Ω
N1
SW1 Pull-Down in Shutdown
POFF State
kΩ
SW1_PD
357734fa
7
LTC3577-3/LTC3577-4
ELECTRICAL CHARACTERISTICS LDO Regulators. The l denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. VINLDO1 = VINLDO2 = VOUT = 3.8V, LDO1 and LDO2 enabled
unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
≤ V + 0.3V
OUT
MIN
TYP
MAX
UNITS
LDO Regulator 1 (LDO1-Always On)
l
l
V
V
Input Voltage Range
V
1.65
2.5
5.5
V
INLDO1
INLDO1
V
OUT
V
OUT
Falling
Rising
LDO1 is Disabled Below V UVLO
OUT
2.7
2.8
V
V
OUT_UVLO
2.9
V
LDO1_FB Regulated Feedback Voltage
LDO1_FB Line Regulation (Note 11)
LDO1_FB Load Regulation (Note 11)
Available Output Current
I
I
I
= 1mA
0.78
0.8
0.4
5
0.82
V
mV/V
μV/mA
mA
LDO1_FB
LDO1
LDO1
LDO1
= 1mA, V = 1.65V to 5.5V
IN
= 1mA to 150mA
l
I
I
150
LDO1_OC
Short-Circuit Output Current
270
mA
LDO1_SC
V
Dropout Voltage (Note 12)
I
I
I
= 150mA, V
= 150mA, V
= 3.6V
= 2.5V
160
200
170
260
320
280
mV
mV
mV
DROP1
LDO1
LDO1
LDO1
INLDO1
INLDO1
= 75mA, V
= 1.8V
INLDO1
R
Output Pull-Down Resistance in Shutdown LDO1 Disabled
LDO_FB1 Input Current
10
kꢀ
nA
LDO1_PD
I
–50
50
LDO_FB1
LDO Regulator 2 (LDO2-Pushbutton Enabled, First in Sequence)
l
l
V
V
Input Voltage Range
V
≤ V + 0.3V
OUT
1.65
2.5
5.5
V
INLDO2
INLDO2
V
OUT
V
OUT
Falling
Rising
LDO2 is Disabled Below V UVLO
OUT
2.7
2.8
V
V
OUT_UVLO
2.9
V
LDO2_FB Regulated Output Voltage
LDO2_FB Line Regulation (Note 11)
LDO2_FB Load Regulation (Note 11)
Available Output Current
I
I
I
= 1mA
0.78
0.8
0.4
5
0.82
V
mV/V
μV/mA
mA
LDO2_FB
LDO2
LDO2
LDO2
= 1mA, V = 1.65V to 5.5V
IN
= 1mA to 150mA
l
I
I
150
LDO2_OC
Short-Circuit Output Current
270
mA
LDO2_SC
V
Dropout Voltage (Note 12)
I
I
I
= 150mA, V
= 150mA, V
= 3.6V
= 2.5V
160
200
170
260
320
280
mV
mV
mV
DROP2
LDO2
LDO2
LDO1
INLDO2
INLDO2
= 75mA, V
= 1.8V
INLDO1
R
Output Pull-Down Resistance in Shutdown LDO2 Disabled
LDO_FB2 Input Current
14
kꢀ
nA
LDO2_PD
I
–50
50
LDO_FB2
357734fa
8
LTC3577-3/LTC3577-4
ELECTRICAL CHARACTERISTICS Pushbutton Controller. The l denotes the specifications which apply
over the full operating temperature range, otherwise specifications are at TA = 25°C. VOUT = 3.8V, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Pushbutton Pin (ON)
l
V
V
Pushbutton Operating Supply Range
(Note 9)
2.7
2.5
5.5
V
OUT
UVLO
V
V
Falling
Rising
Pushbutton is Disabled Below V
UVLO
2.7
2.8
V
V
OUT
OUT
OUT
OUT
2.9
1.2
V
ON Threshold Rising
ON Threshold Falling
0.8
0.7
V
V
ON_TH
0.4
I
ON
ON Input Current
V
ON
V
ON
= V
OUT
= 0V
–1
–4
1
–14
ꢁA
ꢁA
–9
Power-On Input Pin (PWR_ON)
V
PWR_ON Threshold Rising
PWR_ON Threshold Falling
0.8
0.7
1.2
1
V
V
PWR_ON
0.4
–1
I
PWR_ON Input Current
V
V
= 3V
ꢁA
PWR_ON
PWR_ON
Status Output Pins (PBSTAT, EXTPWR, PGOOD)
I
PBSTAT Output High Leakage Current
PBSTAT Output Low Voltage
EXTPWR Pin Input Current
= 3V
–1
1
0.4
1
ꢁA
V
PBSTAT
PBSTAT
PBSTAT
V
I
= 3mA
0.1
0
PBSTAT
I
V
= 3V
ꢁA
V
EXTPWR
EXTPWR
EXTPWR
V
EXTPWR Pin Output Low Voltage
PGOOD Output High Leakage Current
PGOOD Output Low Voltage
I
= 2mA
0.15
0.4
1
EXTPWR
I
V
= 3V
–1
ꢁA
V
PGOOD
PGOOD
PGOOD
V
I
= 3mA
0.1
–8
0.4
PGOOD
V
PGOOD Threshold Voltage
(Note 13)
%
THPGOOD
Pushbutton Timing Parameters
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
ON Low Time to PBSTAT Low
ON High to PBSTAT High
50
900
50
50
14
1.8
1
ms
ꢁs
ON_PBSTAT1
ON_PBSTAT2
PBSTAT_PW
ON_PUP
PBSTAT Low > t
PBSTAT_PW
PBSTAT Minimum Pulse Width
ON Low Time for Power Up
40
12
ms
ms
ON Low to PGOOD Reset Low
PGOOD Reset Low Pulse Width
Minimum Time from Power Up to Down
Minimum Time from Power Down to Up
PWR_ON High to Power Up
16.5
Seconds
ms
ON_RST
ON_RST_PW
PUP_PDN
Seconds
Seconds
ms
1
PDN_PUP
50
50
1
PWR_ONH
PWR_ONL
PWR_ONBK1
PWR_ONBK2
PGOODH
PWR_ON Low to Power Down
PWR_ON Power-Up Blanking
PWR_ON Power-Down Blanking
From Regulation to PGOOD High
Bucks Disabled to PGOOD Low
LDO2 Enable to Buck Enable
ms
PWR_ON Low Recognized from Power Up
PWR_ON High Recognized from Power Down
Buck1, 2 and LDO1 Within PGOOD Threshold
Bucks Disabled
Seconds
Seconds
ms
1
230
44
14.5
μs
PGOODL
12.5
17.5
ms
LDO2_BK1
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3577-3/LTC3577-4 are guaranteed to meet performance
specifications from 0°C to 85°C. Specifications over the –40°C to 85°C
operating temperature range are assured by design, characterization and
correlation with statistical process controls.
Note 3: This IC includes over temperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperatures will exceed 110°C when over temperature protection is
active. Continuous operation above the specified maximum operating
junction temperature may result in device degradation or failure.
Note 4: V is the greater of V , V
or BAT.
CC
BUS OUT
357734fa
9
LTC3577-3/LTC3577-4
ELECTRICAL CHARACTERISTICS
Note 5: Total input current is the sum of quiescent current, I
, and
BUSQ
Note 11: Measured with the LDO running unity gain with output tied to
measured current given by V
/R
• (h
+ 1).
feedback pin.
CLPROG CLPROG
CLPROG
Note 6: h
with indicated PROG resistor.
Note 7: The current limit features of this part are intended to protect the
IC from short term or intermittent fault conditions. Continuous operation
above the maximum specified pin current rating may result in device
degradation or failure.
is expressed as a fraction of measured full charge current
Note 12: Dropout voltage is the minimum input to output voltage
differential needed for an LDO to maintain regulation at a specified output
current. When an LDO is in dropout, its output voltage will be equal to
C/10
V
IN
– V
.
DROP
Note 13: PGOOD threshold is expressed as a percentage difference
from the Buck1, Buck2 and LDO1 regulation voltages. The threshold is
measured from Buck1, Buck2 and LDO1 output rising.
Note 8: The serial port is tested at rated operating frequency. Timing
parameters are tested and/or guaranteed by design.
Note 14: I
is the sum of V and V current due to LED driver.
OUT IN3
VOUT_LED
Note 9: V
Note 10: Buck FB high, not switching.
not in UVLO.
Note 15: The I
specifications represent the total battery load assuming
OUT
BATQ
V
, V
, V
and V are tied directly to V
.
INLDO1 INLDO2 IN12
IN3
OUT
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C unless otherwise specified
Input Supply Current vs
Temperature
Input Supply Current vs
Battery Drain Current vs
Temperature
Temperature (Suspend Mode)
0.10
0.08
0.06
0.04
0.02
0
450
400
350
300
250
200
150
100
50
0.8
ALL SUPPLIES ENABLED (EXCEPT BOOST)
PULSE-SKIP MODE
V
= 5V
V
BUS
= 5V
BUS
1x MODE
0.7
0.6
NO LOAD ON
ALL SUPPLIES
V
BAT
V
BUS
= 3.8V
= 0V
0.5
0.4
0.3
0.2
0.1
ALL SUPPLIES ENABLED
(EXCEPT BOOST)
Burst Mode OPERATION
ALL SUPPLIES DISABLED EXCEPT LDO1
25 75 100 125
50
TEMPERATURE (°C)
0
0
–25
0
50
75 100 125
–50 –25
0
25
50
75
125
–50
0
–50
25
100
–25
TEMPERATURE (°C)
TEMPERATURE (°C)
357734 G01
357734 G02
357734 G03
Input Current Limit vs
Temperature
Charge Current vs Temperature
(Thermal Regulation)
Input RON vs Temperature
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
300
280
260
240
220
180
160
140
120
100
0
600
500
400
300
I
= 400mA
V
R
= 5V
CLPROG
OUT
BUS
= 2.1k
10x MODE
V
= 4.5V
BUS
V
= 5V
BUS
5x MODE
V
= 5.5V
BUS
200
100
0
V
= 5V
BUS
10x MODE
= 2k
1x MODE
R
PROG
50
TEMPERATURE (°C)
100 125
–50 –25
0
25
75
50
75 100 125
–50
0
25
50
75 100 125
–50
0
25
–25
–25
TEMPERATURE (°C)
TEMPERATURE (°C)
357734 G06
357734 G04
357734 G05
357734fa
10
LTC3577-3/LTC3577-4
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C unless otherwise specified
Battery Float Voltage Load
Regulation (LTC3577-3)
Battery Current and Voltage
vs Time
Battery Regulation (Float)
Voltage vs Temperature
600
500
400
300
200
100
0
6
5
4
3
2
1
0
4.24
4.22
4.24
4.22
4.20
4.18
4.16
4.14
4.12
4.10
4.08
4.06
4.04
V
= 5V
I
= 2mA
BAT
BUS
10x MODE
CHRG
LTC3577-3
V
BAT
4.20
4.18
4.16
4.14
4.12
4.10
SAFETY
TIMER
TERMINATION
LTC3577-4
1450mAhr
CELL
C/10
V
= 5V
BUS
PROG
R
R
= 2k
= 2k
I
BAT
CLPROG
0
2
3
4
5
6
0
200
400
I
600
(mA)
800
1000
1
–50 –25
0
25
50
75 100 125
TIME (HOUR)
TEMPERATURE (°C)
BAT
357734 G07
357734 G08
357734 G09
Forward Voltage vs Ideal Diode
Current (No External FET)
IBAT vs VBAT (LTC3577-3)
IBAT vs VBAT (LTC3577-4)
600
500
400
300
200
100
0
600
500
400
300
200
100
0
0.25
0.20
0.15
0.10
V
T
= 0V
R
R
= 2.1k
BUS
A
CLPROG
PROG
= 25°C
= 2k
V
= 3.2V
BAT
V
= 5V
BUS
10x MODE
V
= 3.6V
BAT
V
BAT
= 4.2V
RISING
RISING
V
V
BAT
BAT
FALLING
FALLING
V
V
BAT
BAT
V
= 5V
BUS
0.05
0
10x MODE
R
R
= 2k
PROG
CLPROG
= 2k
2.0
2.8
3.2
(V)
3.6
4.0
4.4
2.0
2.4
2.8
3.2
3.6
4.0
4.4
0
0.4
0.6
(A)
0.8
1.0
1.2
2.4
0.2
V
V
(V)
I
BAT
BAT
BAT
357734 G10
357734 G54
357734 G11
Forward Voltage vs Ideal Diode
Current (with Si2333DS External FET)
Input Connect Waveform
Input Disconnect Waveform
40
35
30
25
V
V
T
= 3.8V
= 0V
BAT
BUS
= 25°C
V
V
BUS
BUS
5V/DIV
5V/DIV
A
V
V
OUT
OUT
5V/DIV
5V/DIV
I
I
BUS
BUS
0.5A/DIV
0.5A/DIV
20
15
I
I
BAT
BAT
0.5A/DIV
0.5A/DIV
10
5
357734 G25
357734 G26
V
I
= 3.75V
= 100mA
= 2k
1ms/DIV
V
I
= 3.75V
= 100mA
= 2k
1ms/DIV
BAT
OUT
R
CLPROG
0
R
= 2k
R = 2k
PROG
PROG
0.2
0.4
I
0.8
0
1.0
0.6
(A)
BAT
357734 G12
357734fa
11
LTC3577-3/LTC3577-4
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C unless otherwise specified
Switching from Suspend Mode to
5x Mode
WALL Connect Waveform
Switching from 1x to 5x Mode
I
WALL
5V/DIV
LIM0
5V/DIV
I
/I
LIM0 LIM1
5V/DIV
V
V
OUT
OUT
5V/DIV
5V/DIV
I
I
I
WALL
BUS
BUS
0.5A/DIV
0.5A/DIV
0.5A/DIV
I
I
I
BAT
BAT
BAT
0.5A/DIV
0.5A/DIV
0.5A/DIV
357734 G27
357734 G28
357734 G29
V
I
= 3.75V
= 50mA
= 2k
1ms/DIV
V
I
= 3.75V
= 100mA
= 2k
100μs/DIV
V
I
= 3.75V
= 100mA
= 2k
1ms/DIV
BAT
OUT
BAT
OUT
BAT
OUT
R
R
R
CLPROG
CLPROG
PROG
R
= 2k
R
= 2k
PROG
PROG
I
= 5V
LIM1
Oscillator Frequency vs
Temperature
Step-Down Switching Regulator 1
3.3V Output Efficiency vs IOUT1
WALL Disconnect Waveform
100
90
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
Burst Mode
OPERATION
WALL
5V/DIV
80
V
OUT
70
5V/DIV
PULSE SKIP
60
50
I
WALL
V
= 5V
OUT
0.5A/DIV
40
30
20
10
0
V
= 3.8V
OUT
I
BAT
0.5A/DIV
V
= 3.3V
OUT1
357734 G30
V
= 3.75V
1ms/DIV
BAT
OUT
V
= 3.8V
= 5V
IN12
IN12
I
= 100mA
V
R
= 2k
PROG
–50
0
25
50
75 100 125
–25
0.01
0.1
1
10
(mA)
100
1000
TEMPERATURE (°C)
I
OUT
357734 G14
357734 G13
Step-Down Switching Regulator 2
1.8V Output Efficiency vs IOUT2
Step-Down Switching Regulator 3
1.2V Ooutput Efficiency vs IOUT3
Step-Down Switching Regulator 3
2.5V Output Efficiency
100
90
100
90
100
90
Burst Mode
OPERATION
Burst Mode
OPERATION
Burst Mode
OPERATION
80
80
80
70
70
70
PULSE SKIP
PULSE SKIP
60
50
60
50
60
50
PULSE SKIP
40
30
20
10
0
40
30
20
10
0
40
30
20
10
0
V
= 2.5V
= 3.8V
= 5V
V
= 1.8V
V
= 1.2V
= 3.8V
= 5V
OUT3
OUT2
OUT3
V
V
V
V
= 3.8V
= 5V
V
V
IN3
IN3
IN12
IN12
IN3
IN3
0.01
0.1
1
I
10
(mA)
100
1000
0.01
0.1
1
I
10
(mA)
100
1000
0.01
0.1
1
I
10
(mA)
100
1000
OUT
OUT
OUT
357734 G15
357734 G17
357734 G16
357734fa
12
LTC3577-3/LTC3577-4
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C unless otherwise specified
Step-Down Switching Regulator
Output Transient (Burst Mode
Operation)
Step-Down Switching Regulator
Output Transient (Pulse Skip)
Step-Down Switching Regulator
Short-Circuit Current vs Temperature
1500
1400
1300
1200
1100
1000
900
V
OUT1
V
OUT1
50mV/DIV
(AC)
50mV/DIV
(AC)
V
OUT2
V
800mA BUCK
500mA BUCK
OUT2
50mV/DIV
(AC)
50mV/DIV
(AC)
V
OUT3
V
OUT3
100mV/DIV
(AC)
100mV/DIV
(AC)
800
500mA
500mA
I
I
OUT3
OUT3
700
5mA
5mA
357734 G19
357734 G20
V
= 3.3V
= 10mA
= 1.8V
= 20mA
= 1.2V
50μs/DIV
V
= 3.3V
= 30mA
= 1.8V
= 20mA
= 1.2V
50μs/DIV
OUT1
OUT1
OUT1
OUT1
V
V
= 3.8V
= 5V
INx
INx
600
I
I
V
I
V
I
500
OUT2
OUT2
OUT2
OUT2
V
OUT3
–25
0
50
75 100 125
–50
25
V
OUT3
TEMPERATURE (°C)
V
= V
= 3.8V
V
= V
= 3.8V
OUT
BAT
OUT
BAT
357734 G18
800mA Step-Down Switching
Regulator Feedback Voltage vs
Output Current
500mA Step-Down Switching
Regulator Feedback Voltage vs
Output Current
Step-Down Switching Regulator
Switch Impedance vs Temperature
0.85
0.84
0.83
0.82
0.81
0.80
0.79
0.78
0.77
0.76
0.75
0.85
0.84
0.83
0.82
0.81
0.80
0.79
0.78
0.77
0.76
0.75
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
V
= 3.2V
INX
500mA
PMOS
500mA
NMOS
Burst Mode
OPERATION
Burst Mode
OPERATION
PULSE SKIP
PULSE SKIP
800mA PMOS
800mA NMOS
V
V
= 3.8V
V
V
= 3.8V
IN3
IN3
IN12
IN12
= 5V
= 5V
0
0.1
1
10
(mA)
100
1000
0.1
1
10
(mA)
100
1000
–50 –25
0
25
125
50
75 100
I
I
OUT
TEMPERATURE (°C)
OUT
357732 G22
357734 G23
357734 G21
Step-Down Switching Regulator 3
Soft-Start and Shutdown
OVP Connection Waveform
OVP Protection Waveform
V
OUT1
100mV/DIV
(AC)
V
BUS
5V/DIV
V
BUS
2V
5V/DIV
1V
0V
V
OUT3
OVGATE
5V/DIV
OVGATE
5V/DIV
400mA
200mA
0mA
OVP
INPUT
I
L3
OVP
INPUT
VOLTAGE
VOLTAGE
5V TO 10V
STEP 5V/DIV
0V TO 5V
STEP 5V/DIV
357734 G31
357734 G24
357734 G32
500μs/DIV
V
= 1.8V
= 100mA
= 3ꢀ
50μs/DIV
500μs/DIV
OUT1
OUT1
OUT3
I
R
357734fa
13
LTC3577-3/LTC3577-4
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C unless otherwise specified
OVSENS Quiescent Current
vs Temperature
Rising Overvoltage Threshold
vs Temperature
OVP Reconnection Waveform
6.280
6.275
6.270
6.265
6.260
6.255
37
35
33
31
29
27
V
= 5V
OVSENS
V
BUS
5V/DIV
OVGATE
5V/DIV
OVP
INPUT
VOLTAGE
10V TO 5V
STEP 5V/DIV
357734 G33
500μs/DIV
–40
–15
10
35
60
85
–40
–15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
357734 G35
357734 G34
OVGATE vs OVSENS
LED Driver Efficiency 10 LEDs
LED Driver Efficiency 8 LEDs
90
90
85
80
75
70
65
60
55
50
12
10
OVSENS CONNECTED
TO INPUT THROUGH
6.2k RESISTOR
85
80
75
70
65
60
55
50
8
6
4
2
0
3V
3V
3.6V
4.2V
4.8V
5.5V
3.6V
4.2V
4.8V
5.5V
0
2
4
6
8
I
10 12 14 16 18 20
(mA)
0
2
4
6
8
0
2
4
6
8
I
10 12 14 16 18 20
(mA)
INPUT VOLTAGE (V)
LED
LED
357734 G38
357734 G36
357734 G39
DAC Code vs LED Current
LED Driver Efficiency 4 LEDs
LED Driver Efficiency 6 LEDs
90
85
80
75
70
65
60
55
50
90
85
80
75
70
65
60
55
50
70
60
50
40
30
20
10
3V
3V
3.6V
4.2V
4.8V
5.5V
3.6V
4.2V
4.8V
5.5V
0dB = 20μA
60dB = 20mA
R
= 20kꢀ
LED_FS
0
0
2
4
6
8
I
10 12 14 16 18 20
(mA)
40
30
DAC CODE
60
70
0
2
4
6
8
I
10 12 14 16 18 20
(mA)
0
50
10
20
LED
LED
357734 G40
357734 G50
357734 G41
357734fa
14
LTC3577-3/LTC3577-4
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C unless otherwise specified
LED Boost Switch Impedance
vs Temperature
LED Boost Maximum Duty Cycle
vs Temperature
LED Boost Start-Up Transient
96.6
96.5
96.4
96.3
96.2
96.1
96.0
95.9
95.8
400
350
300
250
200
150
100
50
I
LED
10mA/DIV
V
BOOST
20V/DIV
I
3V
L
200mA/DIV
3.6V
4.2V
4.8V
5.5V
3V
3.6V
4.2V
5.5V
0
95.7
357734 G42
2ms/DIV
40 60
–40 –20
0
20
80 100 120 140
–50 –25
0
25
125
50
75 100
TEMPERATURE (°C)
TEMPERATURE (°C)
357734 G44
357734 G45
LED Boost Current Limit
vs Temperature
10-LED Driver Efficiency
LDO Load Step
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
90
80
70
60
50
40
30
20
10
0
LDO1
50mV/DIV
(AC)
MAX PWM
CONSTANT
CURRENT
LDO2
20mV/DIV
(AC)
100mA
I
OUT1
5mA
357734 G48
LDO1 = 1.2V
LDO2 = 2.5V
20μs/DIV
I
= 40mA
LDO2
OUT
V
= V
= 3.8V
–40 –20
0
20 40 60 80 100 120
TEMPERATURE (°C)
357734 G46
1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01
BAT
LED CURRENT (A)
357734 TA01b
Input and Battery Current vs
Output Current
Battery Discharge vs
Too Hot BAT Discharge
Temperature
200
180
160
140
120
100
80
600
500
400
300
200
100
0
200
R
R
= 2k
V
V
< V
TOO_HOT
= 0V
PROG
CLPROG
NTC
BUS
I
= 2k
IN
175
V
V
= 5V
= 0V
BUS
BUS
150
I
LOAD
125
100
75
I
BAT
(CHARGING)
60
50
V
V
= 4.1V
BAT
NTC
40
< V
TOO_HOT
5x MODE
25
I
20
BAT
I
= 0mA
VOUT
(DISCHARGING)
WALL = 0V
100
0
–100
0
600
3.8
3.9
4.0
(V)
4.1
4.2
60
70
90 100 110 120
0
200
300
(mA)
400
500
50
80
V
I
TEMPERATURE (°C)
BAT
OUT
357734 G49
357734 G37
357734 G51
357734fa
15
LTC3577-3/LTC3577-4
PIN FUNCTIONS
2
I
, I
LIM1
(Pins 1, 2): Input Current Control Pins. I
SCL (Pin 12): I C Clock Input. The logic level for SCL is
LIM0 LIM1 LIM0
and I
control the input current limit. See Table 1 in
referenced to DV .
CC
“USB PowerPath Controller” section. Both pins are pulled
low by a weak current sink.
OVGATE (Pin 13): Overvoltage Protection Gate 0utput.
Connect OVGATE to the gate pin of an external N-channel
MOS pass transistor. The source of the transistor should
LED_FS (Pin 3): A resistor between this pin and ground
sets the full-scale output current of the I
pin.
be connected to V
and the drain should be connected
LED
BUS
to the product’s DC input connector. In the absence of an
overvoltage condition, this pin is connected to an internal
charge pump capable of creating sufficient overdrive to
fully enhance this transistor. If an overvoltage condition
is detected, OVGATE is brought rapidly to GND to prevent
damage. OVGATE works in conjunction with OVSENSE to
provide this protection.
WALL (Pin 4): Wall Adapter Present Input. Pulling this
pin above 4.3V will disconnect the power path from V
BUS
to V . The ACPR pin will also be pulled low to indicate
OUT
that a wall adapter has been detected.
SW3 (Pin 5): Power Transmission (Switch) Pin for Step-
Down Switching Regulator 3 (Buck3).
VIN3 (Pin6):PowerInputforStep-DownSwitchingRegu-
PWR_ON(Pin14):LogicInputUsedtoKeepBuck1,Buck2
and LDO2 Enabled After Power Up. May also be used to
enable regulators directly (sequence = LDO2 → Buck1 →
Buck2). See “Pushbutton Interface Operation” section for
more information.
lator 3. This pin should be connected to VOUT
.
FB3 (Pin 7): Feedback Input for Step-Down Switching
Regulator 3 (Buck3). This pin servos to a fixed voltage of
0.8V when the control loop is complete.
ON (Pin 15): Pushbutton Input. A weak internal pull-up
forces ON high when left floating. A normally open push-
button is connected from ON to ground to force a low
state on this pin.
OVSENSE (Pin 8): Overvoltage Protection Sense Input.
OVSENSE should be connected through a 6.2k resistor
to the input power connector and the drain of an external
N-channel MOS pass transistor. When the voltage on
this pin exceeds a preset level, the OVGATE pin will be
pulled to GND to disable the pass transistor and protect
downstream circuitry.
PBSTAT (Pin 16): Open-drain output is a debounced
and buffered version of ON to be used for processor
interrupts.
LED_OV(Pin9):Aresistorbetweenthispinandtheboosted
LED backlight voltage sets the overvoltage limit on the
boostoutput.Iftheboostvoltageexceedstheprogrammed
limit the LED boost converter will be disabled.
EN3 (Pin 17): Enable Pin for Step-Down Switching
Regulator 3 (Buck3)
.
SW (Pins 18, 19, 20): Power Transmission (Switch)
Pin for LED Boost Converter. See “LED Backlight/Boost
Operation” section for circuit hook-up and component
2
DV (Pin 10): Supply Voltage for I C Lines. This pin sets
CC
2
2
the logic reference level of the LTC3577-3/LTC3577-4. A
selection. I C is used to control LED driver enable. I C
default is LED driver off.
UVLO circuit on the DV pin forces all registers to all
CC
0s whenever DV is <1V. Bypass to GND with a 0.1μF
CC
PGOOD(Pin21):Open-DrainOutput.PGOODindicatesthat
Buck1, Buck2 and LDO1 are within 8% of final regulation
value. There is a 230ms delay from all regulators reaching
regulation and PGOOD going high.
capacitor.
2
SDA (Pin 11): I C Data Input. Serial data is shifted one bit
per clock to control the LTC3577-3/LTC3577-4. The logic
level for SDA is referenced to DV .
CC
357734fa
16
LTC3577-3/LTC3577-4
PIN FUNCTIONS
V
(Pin 32): Power Input for Step-Down Switching
I
(Pin 22): Series LED Backlight Current Sink Output.
IN12
LED
Regulators 1 and 2. This pin will generally be connected
This pin is connected to the cathode end of the series LED
backlightstring.ThecurrentdrawnthroughtheseriesLEDs
is programmed via a 6-bit 60dB DAC and can be further
to V
.
OUT
SW1 (Pin 33): Power Transmission (Switch) Pin for Step-
Down Switching Regulator 1 (Buck1).
2
dimmedviaaninternalPWMfunction.I Cisusedtocontrol
LEDdriverenable, brightness, gradation(softon/softoff).
2
NTCBIAS (Pin 34): Output Bias Voltage for NTC. A
resistor from this pin to the NTC pin will bias the NTC
thermistor.
I C default is LED driver off, current = 0mA.
LDO1_FB (Pin 23): Feedback Voltage Input for Low Drop-
out Linear Regulator 1 (LDO1). LDO1 output voltage is
set using an external resistor divider between LDO1 and
LDO1_FB.
NTC (Pin 35): The NTC pin connects to a battery’s therm-
istor to determine if the battery is too hot or too cold
to charge. If the battery’s temperature is out of range,
charging is paused until it drops back into range. A low
drift bias resistor is required from NTCBIAS to NTC and
a thermistor is required from NTC to ground.
LDO2_FB (Pin 24): Feedback Voltage Input for Low Drop-
out Linear Regulator 2 (LDO2). LDO2 output voltage is
set using an external resistor divider between LDO2 and
LDO2_FB.
PROG (Pin 36): Charge Current Program and Charge
Current Monitor Pin. Connecting a resistor from PROG
to ground programs the charge current:
FB2 (Pin 25): Feedback Input for Step-Down Switching
Regulator 2 (Buck2). This pin servos to a fixed voltage of
0.8V when the control loop is complete.
1000V
RPROG
FB1 (Pin 26): Feedback Input for Step-Down Switching
Regulator 1 (Buck1). This pin servos to a fixed voltage of
0.8V when the control loop is complete.
ICHG
=
A
( )
If sufficient input power is available in constant-current
mode, this pin servos to 1V. The voltage on this pin always
represents the actual charge current.
V
(Pin 27): Input Supply of Low Dropout Linear
INLDO1
Regulator1(LDO1).Thispinshouldbebypassedtoground
with a 1μF or greater ceramic capacitor.
IDGATE (Pin 37): Ideal Diode Gate Connection. This
pin controls the gate of an optional external P-channel
MOSFET transistor used to supplement the internal ideal
diode. The source of the P-channel MOSFET should be
connected to V
BAT. It is important to maintain high impedance on this
pin and minimize all leakage paths.
LDO1(Pin28):OutputofLowDropoutLinearRegulator 1.
LDO1 is an always-on LDO and will be enabled whenever
the part is not in V
UVLO. This pin must be bypassed
OUT
and the drain should be connected to
OUT
to ground with a 1μF or greater ceramic capacitor.
LDO2(Pin29):OutputofLowDropoutLinearRegulator 2.
This pin must be bypassed to ground with a 1μF or greater
ceramic capacitor.
BAT (Pin 38): Single Cell Li-Ion Battery Pin. Depending
on available power and load, a Li-Ion battery on BAT will
either deliver system power to V
diode or be charged from the battery charger.
V
(Pin 30): Input Supply of Low Dropout Linear
INLDO2
through the ideal
OUT
Regulator2(LDO2).Thispinshouldbebypassedtoground
with a 1μF or greater ceramic capacitor.
SW2 (Pin 31): Power Transmission (Switch) Pin for Step-
Down Switching Regulator 2 (Buck2).
357734fa
17
LTC3577-3/LTC3577-4
PIN FUNCTIONS
V
(Pin39):OutputVoltageofthePowerPathController
signalWALLpresent, WALLmustexceedtheabsoluteand
OUT
and Input Voltage of the Battery Charger. The majority of
differential WALL input thresholds. The EXTPWR signal is
the portable product should be powered from V . The
independentoftheI
andI
pins. Thus, itispossible
OUT
LIM1
LIM0
LTC3577-3/LTC3577-4 will partition the available power
to have the input current limit circuitry in suspend with
EXTPWR showing a valid charging level on V
between the external load on V
and the internal battery
.
OUT
BUS
charger. Priority is given to the external load and any extra
CLPROG (Pin 43): Input Current Program and Input
Current Monitor Pin. A resistor from CLPROG to ground
determines the upper limit of the current drawn from the
power is used to charge the battery. An ideal diode from
BAT to V
ensures that V
is powered even if the load
OUT
OUT
exceeds the allotted input current from V
or if the V
BUS
BUS
V
pin (i.e., the input current limit). A precise fraction
BUS
power source is removed. V
should be bypassed with
OUT
of the input current, h
, is sent to the CLPROG pin.
CLPROG
a low impedance multilayer ceramic capacitor.
The input PowerPath delivers current until the CLPROG
pin reaches 2V (10x mode), 1V (5x mode) or 0.2V (1x
V
BUS
(Pin 40): USB Input Voltage. V will usually be
BUS
connected to the USB port of a computer or a DC output
mode). Therefore, the current drawn from V
will be
. In
BUS
wall adapter. V
ance multilayer ceramic capacitor.
should be bypassed with a low imped-
limited to an amount given by h
USB applications the resistor R
no less than 2.1k.
and R
BUS
CLPROG
CLPROG
CLPROG
should be set to
ACPR(Pin41):WallAdapterPresentOutput(ActiveLow).
A low on this pin indicates that the wall adapter input com-
parator has had its input pulled above its input threshold
(typically 4.3V). This pin can be used to drive the gate of
an external P-channel MOSFET to provide power to V
from a power source other than a USB port.
CHRG (Pin 44): Open-Drain Charge Status Output. The
CHRG pin indicates the status of the battery charger. If
CHRG is high then the charger is near the float voltage
(charge current less than 1/10th programmed charge cur-
rent)orchargingiscompleteandchargerisdisabled.Alow
on CHRG indicates that the charger is enabled. For more
information see the “Charge Status Indication” section.
OUT
EXTPWR (Pin 42): External Power Present Output (Active
Low, Open-Drain Output). A low on this pin indicates that
externalpowerispresentateithertheV
For EXTPWR to signal V
the V
orWALLinput.
present, V must exceed
BUS
Exposed Pad (Pin 45): Ground. The exposed package pad
is ground and must be soldered to the PC board for proper
functionality and for maximum heat transfer.
BUS
BUS
undervoltage lockout threshold. For EXTPWR to
BUS
357734fa
18
LTC3577-3/LTC3577-4
BLOCK DIAGRAM
8
13
42
EXTPWR
4
41
OVSENS
OVGATE
WALL
ACPR
OVERVOLTAGE
PROTECTON
EXTERNAL
POWER DETECT
WALL
DETECT
V
V
OUT
BUS
40
43
39
37
+
–
IDGATE
INPUT
CURRENT
LIMIT
CC/CV
IDEAL
DIODE
CLPROG
CHARGER
–
+
NTCBIAS
NTC
15mV
34
35
BATTERY
TEMP
BAT
OVERTEMP BATTERY
SAFETY DISCHARGER
38
36
MONITOR
PROG
UVLO
I
I
LIM0
LIM1
1
2
I
LIM
V
INLD02
LDO2
LOGIC
EN
30
–
+
0.8V
CHRG
14ms
RISING
DELAY
150mA
LDO2
44
29
24
CHARGE
STATUS
LDO2_FB
V
IN12
EN
32
33
500mA, 2.25MHz
BUCK REGULATOR 1
PWR_ON
ON
SW1
FB1
14
PUSH-
BUTTON
INPUT
0.8V
+
15
16
–
PBSTAT
PG
EN
26
31
EN3
17
DV
CC
500mA, 2.25MHz
BUCK REGULATOR 2
10
11
12
2
SDA
I C
SW2
FB2
LOGIC
0.8V
+
SCL
–
PGOOD
21
PG
EN
25
6
230ms FALLING
DELAY
V
IN3
800mA, 2.25MHz
BUCK REGULATOR 3
LED_OV
SW3
9
40V LED BACKLIGHT
BOOST CONVERTER
5
0.8V
+
SW
18,19,20
–
FB3
7
DAC
V
INLD01
ENB
PG
27
–
+
I
0.8V
LED
0.8V
22
3
LDO1
LED_FS
28
23
150mA
LDO1
LDO1_FB
GND
45
357734 BD
357734fa
19
LTC3577-3/LTC3577-4
OPERATION
PowerPath OPERATION
current specification. The ideal diode from BAT to V
guarantees that ample power is always available to V
OUT
OUT
Introduction
even if there is insufficient or absent power at V . The
BUS
LTC3577-3/LTC3577-4 also have the ability to receive
power from a wall adapter or other non-current-limited
power source. Such a power supply can be connected
The LTC3577-3/LTC3577-4 are highly integrated power
management IC that includes the following features:
– PowerPath controller
– Battery charger
– Ideal diode
– Input overvoltage protection
– Pushbutton controller
– Three step-down switching regulators
– Two low dropout linear regulators
– 40V LED backlight controller
to the V
pin of the LTC3577-3/LTC3577-4 through an
OUT
external device such as a power Schottky or FET as shown
in Figure 1. The LTC3577-3/LTC3577-4 have the unique
ability to use the output, which is powered by an external
supply, to charge the battery while providing power to
the load. A comparator on the WALL pin is configured to
detect the presence of the wall adapter and shut off the
connection to the USB. This prevents reverse conduction
from V
to V
when a wall adapter is present.
OUT
BUS
The LTC3577-3/LTC3577-4 also include a pushbutton
inputtocontrolthepowersequencingoftwosynchronous
step-down switching regulators (Buck1 and Buck2), a low
dropout regulator (LDO2) and system reset. The three
DesignedspecificallyforUSBapplications,thePowerPath
controller incorporates a precision input current limit
which communicates with the battery charger to ensure
that input current does not violate the USB average input
FROM AC ADAPTER
4.3V
–
+
(RISING)
3.2V
(FALLING)
WALL
4
ACPR
41
+
–
75mV (RISING)
+
–
25mV (FALLING)
FROM
ENABLE
V
V
V
OUT
USB
BUS
OUT
40
39
37
SYSTEM
LOAD
USB CURRENT LIMIT
IDEAL
DIODE
OPTIONAL
EXTERNAL
IDEAL DIODE
PMOS
+
–
IDGATE
CONSTANT-CURRENT
CONSTANT-VOLTAGE
BATTERY CHARGER
–
+
15mV
BAT
BAT
38
+
Li-Ion
357734 F01
Figure 1. Simplified PowerPath Block Diagram
357734fa
20
LTC3577-3/LTC3577-4
OPERATION
2.25MHz constant frequency current mode step-down
switching regulators provide 500mA, 500mA and 800mA
each and support 100% duty cycle operation as well as
operating in Burst Mode operation for high efficiency at
light load. No external compensation components are
requiredfortheswitchingregulators.Thetwolowdropout
regulators can output up to 150mA.
CLPROG to GND, the voltage on CLPROG represents the
input current:
VCLPROG
RCLPROG
IVBUS = IBUSQ
+
•hCLPROG
where I
and h
are given in the Electrical
CLPROG
BUSQ
Characteristics table.
The onboard LED backlight boost circuitry can drive up
to 10 series LEDs and includes versatile digital dimming
via the I C input. The I C input also provides additional
regulator controls as well as status read-back.
TheinputcurrentlimitisprogrammedbytheI
andI
LIM0
LIM1
pins.TheLTC3577-3/LTC3577-4canbeconfiguredtolimit
input current to one of several possible settings as well as
be deactivated (USB suspend). The input current limit will
be set by the appropriate servo voltage and the resistor on
CLPROG according to the following expression:
2
2
All regulators can be programmed for a minimum output
voltage of 0.8V and can be used to power a microcon-
troller core, microcontroller I/O, memory or other logic
circuitry.
0.2V
RCLPROG
IVBUS = IBUSQ
IVBUS = IBUSQ
IVBUS = IBUSQ
+
+
+
•hCLPROG 1x Mode
(
)
USB PowerPath Controller
1V
RCLPROG
•hCLPROG 5x Mode
(
)
The input current limit and charge control circuits of the
LTC3577-3/LTC3577-4 are designed to limit input current
as well as control battery charge current as a function of
2V
RCLPROG
•hCLPROG 10x Mode
(
)
I
. V
drives the combination of the external load,
VOUT OUT
the three step-down switching regulators, two LDOs, LED
backlight and the battery charger.
Under worst-case conditions, the USB specification for
average input current will not be violated with an R
CLPROG
If the combined load does not exceed the programmed
resistor of 2.1k or greater. Table 1 shows the available
settings for the I and I pins:
inputcurrentlimit,V
willbeconnectedtoV
through
OUT
BUS
LIM0
LIM1
an internal 200mꢀ P-channel MOSFET. If the combined
load at V exceeds the programmed input current limit,
Table 1. Controlled Input Current Limit
OUT
the battery charger will reduce its charge current by the
amountnecessarytoenabletheexternalloadtobesatisfied
while maintaining the programmed input current. Even if
the battery charge current is set to exceed the allowable
USB current, the average input current USB specification
I
I
I
BUS(LIM)
LIM1
LIM0
1
1
100mA (1x)
1A (10x)
1
0
0
0
1
0
Suspend
500mA (5x)
will not be violated. Furthermore, load current at V
OUT
Notice that when I
is low and I
is high, the input
LIM0
LIM1
will always be prioritized and only excess available cur-
rent will be used to charge the battery. The current out
current limit is set to a higher current limit for increased
charging and current availability at V . This mode is
OUT
of the CLPROG pin is a fraction (1/h
) of the V
BUS
CLPROG
typically used when there is a higher power, non-USB
current. When a programming resistor is connected from
source available at the V
pin.
BUS
357734fa
21
LTC3577-3/LTC3577-4
OPERATION
Ideal Diode from BAT to V
Using the WALL Pin to Detect the Presence of an
External Power Source
OUT
The LTC3577-3/LTC3577-4 have an internal ideal diode as
wellasacontrollerforanoptionalexternalidealdiode.Both
the internal and the external ideal diodes respond quickly
The WALL input pin can be used to identify the presence
of an external power source (particularly one that is not
whenever V
drops below BAT. If the load increases
subject to a fixed current limit like the USB V
input).
OUT
BUS
beyond the input current limit, additional current will be
Typically, such a power supply would be a 5V wall adapter
output or the low voltage output of a high voltage buck
regulator. When the wall adapter output (or buck regulator
output)isconnecteddirectlytotheWALLpin,andthevolt-
age exceeds the WALL pin threshold, the USB power path
pulledfromthebatteryviatheidealdiodes.Furthermore,if
power to V
(USB) or V
(external wall power or high
BUS
OUT
voltage regulator) is removed, then all of the application
power will be provided by the battery via the ideal diodes.
The ideal diodes are fast enough to keep V
from drop-
(from V
to V ) will be disconnected. Furthermore,
OUT
BUS
OUT
ping significantly below V with just the recommended
the ACPR pin will be pulled low. In order for the presence
of an external power supply to be acknowledged, both of
the following conditions must be satisfied:
BAT
output capacitor (see Figure 2). The ideal diode consists
of a precision amplifier that enables an on-chip P-channel
MOSFET whenever the voltage at V
is approximately
OUT
1. The WALL pin voltage must exceed approximately
4.3V.
15mV (V ) below the voltage at BAT. The resistance of
FWD
the internal ideal diode is approximately 200mꢀ. If this is
sufficientfortheapplication,thennoexternalcomponents
are necessary. However, if lower resistance is needed, an
external P-channel MOSFET can be added from BAT to
2. TheWALLpinvoltagemustbegreaterthan75mVabove
the BAT pin voltage.
The input power path (between V
and V ) is re-
OUT
BUS
V
. TheIDGATEpinoftheLTC3577-3/LTC3577-4drives
OUT
enabled and the ACPR pin is pulled high when either of
the gate of the external P-channel MOSFET for automatic
the following conditions is met:
ideal diode control. The source of the MOSFET should be
connected to V
1. The WALL pin voltage falls to within 25mV of the BAT
pin voltage.
and the drain should be connected to
OUT
BAT. Capable of driving a 1nF load, the IDGATE pin can
control an external P-channel MOSFET having extremely
low on-resistance.
2. The WALL pin voltage falls below 3.2V.
Each of these thresholds is suitably filtered in time to
prevent transient glitches on the WALL pin from falsely
triggering an event.
4.0V
V
3.8V
3.6V
OUT
Suspend Mode
500mA
When I
is pulled high and I
is pulled low the
LIM0
LIM1
CHARGE
LTC3577-3/LTC3577-4 enters suspend mode to comply
with the USB specification. In this mode, the power path
I
0
BAT
DISCHARGE
–500mA
1A
between V
and V
is put in a high impedance state
BUS
OUT
I
VOUT
LOAD
to reduce the V
input current to 50ꢁA. If no other
BUS
0A
357734 F02
power source is available to drive WALL and V , the
V
V
= 3.8V
= 5V
10μs/DIV
BAT
BUS
5x MODE
OUT
system load connected to V
is supplied through the
OUT
C
= 10μF
OUT
ideal diodes connected to BAT.
Figure 2. Ideal Diode Transient Response
357734fa
22
LTC3577-3/LTC3577-4
OPERATION
BUS
Current Limit (UVCL)
V
Undervoltage Lockout (UVLO) and Undervoltage
detects that it has entered constant voltage mode, the
four hour safety timer is started. After the safety timer
expires, charging of the battery will terminate and no
more current will be delivered.
An internal undervoltage lockout circuit monitors V
and keeps the input current limit circuitry off until V
BUS
BUS
rises above the rising UVLO threshold (3.8V) and at least
50mV above V . Hysteresis on the UVLO turns off the
Automatic Recharge
OUT
After the battery charger terminates, it will remain off
drawing only microamperes of current from the battery.
If the portable product remains in this state long enough,
thebatterywilleventuallyselfdischarge.Toensurethatthe
battery is always topped off, a charge cycle will automati-
inputcurrentlimitifV
dropsbelow3.7Vor50mVbelow
BUS
V
. When this happens, system power at V
will be
OUT
OUT
drawn from the battery via the ideal diode. To minimize the
possibility of oscillation in and out of UVLO when using
resistive input supplies, the input current limit is reduced
cally begin when the battery voltage falls below V
as V
falls below 4.45V (typ).
RECHRG
BUS
(typically 4.1V for LTC3577-3 and 4V for LTC3577-4). In
Battery Charger
the event that the safety timer is running when the battery
voltage falls below V
, the timer will reset back to
RECHRG
The LTC3577-3/LTC3577-4 include a constant-current/
constant-voltagebatterychargerwithautomaticrecharge,
automatic termination by safety timer, low voltage trickle
charging,badcelldetectionandthermistorsensorinputfor
outoftemperaturechargepausing. Whenabatterycharge
cycle begins, the battery charger first determines if the
batteryisdeeplydischarged.Ifthebatteryvoltageisbelow
zero. To prevent brief excursions below V
from re-
RECHRG
setting the safety timer, the battery voltage must be below
formorethan1.3ms. Thechargecycleandsafety
V
RECHRG
timerwillalsorestartiftheV
UVLOcycleslowandthen
BUS
high (e.g., V , is removed and then replaced).
BUS
Charge Current
V , typically 2.85V, an automatic trickle charge feature
TRKL
The charge current is programmed using a single resistor
from PROG to ground. 1/1000th of the battery charge cur-
rent is delivered to PROG which will attempt to servo to
1.000V. Thus, the battery charge current will try to reach
1000 times the current in the PROG pin. The program
resistor and the charge current are calculated using the
following equations:
setsthebatterychargecurrentto10%oftheprogrammed
value. If the low voltage persists for more than 1/2 hour,
the battery charger automatically terminates. Once the
battery voltage is above 2.85V, the battery charger begins
charginginfullpowerconstant-currentmode. Thecurrent
delivered to the battery will try to reach 1000V/R
.
PROG
Depending on available input power and external load
conditions, the battery charger may or may not be able to
charge at the full programmed rate. The external load will
always be prioritized over the battery charge current. The
USB current limit programming will always be observed
and only additional current will be available to charge the
battery. When system loads are light, battery charge cur-
rent will be maximized.
1000V
ICHG
1000V
RPROG
RPROG
=
, ICHG =
Ineithertheconstant-currentorconstant-voltagecharging
modes, the PROG pin voltage will be proportional to the
actual charge current delivered to the battery. Therefore,
the actual charge current can be determined at any time
by monitoring the PROG pin voltage and using the fol-
lowing equation:
Charge Termination
The battery charger has a built-in safety timer. When the
battery voltage approaches the float voltage, the charge
current begins to decrease as the LTC3577-3/LTC3577-4
enters constant-voltage mode. Once the battery charger
VPROG
RPROG
IBAT
=
•1000
357734fa
23
LTC3577-3/LTC3577-4
OPERATION
In many cases, the actual battery charge current, I , will
Battery Charger Stability Considerations
BAT
belowerthanI
duetolimitedinputcurrentavailableand
CHG
TheLTC3577-3/LTC3577-4’sbatterychargercontainsboth
a constant-voltage and a constant-current control loop.
The constant-voltage loop is stable without any compen-
sation when a battery is connected with low impedance
leads. Excessive lead length, however, may add enough
series inductance to require a bypass capacitor of at least
1μF from BAT to GND. Furthermore, a 4.7μF capacitor in
series with a 0.2Ω to 1Ω resistor from BAT to GND is
required to keep ripple voltage low when the battery is
disconnected.
prioritization with the system load drawn from V
.
OUT
Thermal Regulation
To prevent thermal damage to the IC or surrounding
components, an internal thermal feedback loop will
automatically decrease the programmed charge current
if the die temperature rises to approximately 110°C.
Thermal regulation protects the LTC3577-3/LTC3577-4
from excessive temperature due to high power operation
or high ambient thermal conditions and allows the user
to push the limits of the power handling capability with a
given circuit board design without risk of damaging the
LTC3577-3/LTC3577-4orexternalcomponents.Thebenefit
oftheLTC3577-3/LTC3577-4thermalregulationloopisthat
charge current can be set according to actual conditions
rather than worst-case conditions with the assurance that
the battery charger will automatically reduce the current
in worst-case conditions.
High value, low ESR multilayer ceramic chip capacitors
reduce the constant-voltage loop phase margin, possibly
resulting in instability. Ceramic capacitors up to 22μF may
beusedinparallelwithabattery,butlargerceramicsshould
be decoupled with 0.2Ω to 1Ω of series resistance.
In constant-current mode, the PROG pin is in the feed-
back loop rather than the battery voltage. Because of the
additional pole created by any PROG pin capacitance,
capacitance on this pin must be kept to a minimum. With
no additional capacitance on the PROG pin, the battery
charger is stable with program resistor values as high
as 25k. However, additional capacitance on this node
reduces the maximum allowed program resistor. The pole
frequency at the PROG pin should be kept above 100kHz.
Therefore, if the PROG pin has a parasitic capacitance,
Charge Status Indication
The CHRG pin indicates the status of the battery charger.
An open-drain output, the CHRG pin can drive an indica-
tor LED through a current limiting resistor for human
interfacing or simply a pull-up resistor for microproces-
sor interfacing. When charging begins, CHRG is pulled
low and remains low for the duration of a normal charge
cycle. When charging is complete, i.e., the charger enters
constantvoltagemodeandthechargecurrenthasdropped
to one-tenth of the programmed value, the CHRG pin is
released (high impedance). The CHRG pin does not re-
spond to the C/10 threshold if the LTC3577-3/LTC3577-4
areininputcurrentlimit.Thispreventsfalseend-of-charge
indicationsduetoinsufficientpoweravailabletothebattery
charger. Even though charging is stopped during an NTC
fault the CHRG pin will stay low indicating that charging
is not complete.
C
, the following equation should be used to calculate
PROG
the maximum resistance value for R
:
PROG
1
RPROG
≤
2π •100kHz •CPROG
NTC Thermistor and Battery Voltage Reduction
The battery temperature is measured by placing a nega-
tive temperature coefficient (NTC) thermistor close to
the battery pack. To use this feature connect the NTC
357734fa
24
LTC3577-3/LTC3577-4
OPERATION
thermistor, R , between the NTC pin and ground and a
(for a Vishay “Curve 1” thermistor, this corresponds to
approximately 50°C) the NTC enables circuitry to moni-
tor the battery voltage. If the battery voltage is above the
battery discharge threshold (about 3.9V) then the battery
dischargecircuitryisenabledanddrawsabout140mAfrom
NTC
bias resistor, R
, from NTCBIAS to NTC. R
should
NOM
NOM
be a 1% resistor with a value equal to the value of the
chosen NTC thermistor at 25°C (R25). The LTC3577-3/
LTC3577-4 will pause charging when the resistance of the
NTC thermistor drops to 0.54 times the value of R25 or
approximately 54k (for a Vishay “Curve 1” thermistor, this
correspondstoapproximately40°C).Ifthebatterycharger
is in constant voltage (float) mode, the safety timer also
pauses until the thermistor indicates a return to a valid
temperature. As the temperature drops, the resistance
of the NTC thermistor rises. The LTC3577-3/LTC3577-4
are also designed to pause charging when the value of
the NTC thermistor increases to 3.25 times the value of
R25. For a Vishay “Curve 1” thermistor this resistance,
325k, correspondstoapproximately0°C. Thehotandcold
comparators each have approximately 3°C of hysteresis
to prevent oscillation about the trip point. The typical NTC
circuit is shown in Figure 3.
the battery when V
= 0V and about 180mA when V
BUS
BUS
= 5V. The battery discharge current is disabled below the
battery discharge threshold.
When the charger is disabled an internal watchdog timer
samples the NTC thermistor for about 150μs every 150ms
and will enable the battery monitoring circuitry if the bat-
tery temperature exceeds the NTC TOO_HOT threshold.
If adding a capacitor to the NTC pin for filtering the time
constant must be much less than 150μs so that the NTC
pin can settle to its final value during the sampling period.
A time constant less than 10μs is recommended. Once
the battery monitoring circuitry is enabled it will remain
enabledandmonitoringthebatteryvoltageuntilthebattery
temperature falls back below the discharge temperature
threshold. The battery discharge circuitry is only enabled
if the battery voltage is greater than the battery discharge
threshold.
To improve safety and reliability the battery voltage is re-
ducedwhenthebatterytemperaturebecomesexcessively
high. When the resistance of the NTC thermistor drops to
about 0.35 times the value of R25 or approximately 35k
NTCBIAS
34
LTC3577-3/
NTC BLOCK
LTC3577-4
0.76 • NTCBIAS
R
NOM
–
100k
TOO_COLD
NTC
35
+
R
NTC
100k
–
TOO_HOT
0.35 • NTCBIAS
0.26 • NTCBIAS
+
+
BATTERY
OVERTEMP
–
357734 F03
Figure 3. Typical NTC Thermistor Circuit
357734fa
25
LTC3577-3/LTC3577-4
OPERATION
Alternate NTC Thermistors and Biasing
NTC thermistors have temperature characteristics which
areindicatedonresistance-temperatureconversiontables.
TheVishay-DalethermistorNTHS0603N011-N1003F,used
in the following examples, has a nominal value of 100k
and follows the Vishay “Curve 1” resistance-temperature
characteristic.
The LTC3577-3/LTC3577-4 provide temperature qualified
charging if a grounded thermistor and a bias resistor are
connected to NTC. By using a bias resistor whose value is
equal to the room temperature resistance of the thermis-
tor (R25) the upper and lower temperatures are pre-pro-
grammed to approximately 40°C and 0°C, respectively
(assuming a Vishay “Curve 1” thermistor).
In the explanation below, the following notation is used.
R25 = Value of the thermistor at 25°C
The upper and lower temperature thresholds can be ad-
justed by either a modification of the bias resistor value
or by adding a second adjustment resistor to the circuit.
If only the bias resistor is adjusted, then either the upper
or the lower threshold can be modified but not both. The
other trip point will be determined by the characteristics
of the thermistor. Using the bias resistor in addition to an
adjustmentresistor,boththeupperandthelowertempera-
ture trip points can be independently programmed with
the constraint that the difference between the upper and
lowertemperaturethresholdscannotdecrease.Examples
of each technique are given below.
R
R
= Value of thermistor at the cold trip point
= Value of the thermistor at the hot trip
NTC|COLD
NTC|HOT
point
r
r
= Ratio of R
to R25
COLD
NTC|COLD
= Ratio of R
to R25
HOT
NTC|HOT
R
NOM
= Primary thermistor bias resistor (see Figure 3)
R1 = Optional temperature range adjustment resistor
(see Figure 4)
NTCBIAS
34
LTC3577-3/
LTC3577-4
NTC BLOCK
0.76 • NTCBIAS
R
NOM
–
+
105k
TOO_COLD
NTC
35
R1
12.7k
–
+
R
NTC
TOO_HOT
100k
0.35 • NTCBIAS
0.26 • NTCBIAS
+
–
BATTERY
OVERTEMP
357734 F04
Figure 4. NTC Thermistor Circuit with Additional Bias Resistor
357734fa
26
LTC3577-3/LTC3577-4
OPERATION
ThetrippointsfortheLTC3577-3/LTC3577-4’stemperature
where r
and r
are the resistance ratios at the
COLD
HOT
qualification are internally programmed at 0.35 • V
for
desired hot and cold trip points. Note that these equations
are linked. Therefore, only one of the two trip points can
be chosen, the other is determined by the default ratios
designed in the IC.
NTC
the hot threshold and 0.76 • V
for the cold threshold.
NTC
Therefore, the hot trip point is set when:
RNTC|HOT
Consider an example where a 60°C hot trip point is
desired. From the Vishay Curve 1 R-T characteristics,
•NTCBIAS = 0.35 •NTCBIAS
RNOM +RNTC|HOT
r
is 0.2488 at 60°C. Using the above equation, R
HOT
NOM
and the cold trip point is set when:
RNTC|COLD
should be set to 46.4k. With this value of R
, the cold
NOM
trip point is about 16°C. Notice that the span is now 44°C
rather than the previous 40°C. This is due to the decrease
in “temperature gain” of the thermistor as absolute tem-
perature increases.
•NTCBIAS = 0.76 •NTCBIAS
RNOM +RNTC|COLD
SolvingtheseequationsforR
in the following:
andR
results
NTC|COLD
NTC|HOT
The upper and lower temperature trip points can be inde-
pendentlyprogrammedbyusinganadditionalbiasresistor
as shown in Figure 4. The following formulas can be used
R
= 0.538 • R
NTC|HOT
NOM
to compute the values of R
and R1:
and
NOM
rCOLD –rHOT
R
= 3.17 • R
NTC|COLD
NOM
RNOM
=
•R25
2.714
By setting R
equal to R25, the above equations result
NOM
in r
= 0.538 and r
= 3.17. Referencing these ratios
HOT
COLD
R1= 0.536 •RNOM –rHOT •R25
to the Vishay Resistance-Temperature Curve 1 chart gives
a hot trip point of about 40°C and a cold trip point of about
0°C. The difference between the hot and cold trip points
is approximately 40°C.
For example, to set the trip points to 0°C and 45°C with
a Vishay Curve 1 thermistor choose:
3.266 – 0.4368
RNOM
=
•100k = 104.2k
By using a bias resistor, R
, different in value from R25,
NOM
2.714
the hot and cold trip points can be moved in either direc-
tion. The temperature span will change somewhat due to
the non-linear behavior of the thermistor. The following
equations can be used to easily calculate a new value for
the bias resistor:
the nearest 1% value is 105k.
R1 = 0.536 • 105k – 0.4368 • 100k = 12.6k
the nearest 1% value is 12.7k. The final solution is shown
in Figure 4 and results in an upper trip point of 45°C and
a lower trip point of 0°C.
rHOT
0.538
RNOM
RNOM
=
=
•R25
r
COLD •R25
3.17
357734fa
27
LTC3577-3/LTC3577-4
OPERATION
Overvoltage Protection (OVP)
√P
• 6.2k = 24V applied across its terminals. With the
MAX
6VatOVSENS,themaximumovervoltagemagnitudethat
this resistor can withstand is 30V. A 1/4W 6.2k resistor
raises this value to 45V.
The LTC3577-3/LTC3577-4 can protect themselves from
the inadvertent application of excessive voltage to V
or
BUS
WALL with just two external components: an N-channel
FET and a 6.2k resistor. The maximum safe overvoltage
magnitude will be determined by the choice of the external
NMOS and its associated drain breakdown voltage.
The charge pump output on OVGATE has limited output
drive capability. Care must be taken to avoid leakage on
this pin, as it may adversely affect operation.
The overvoltage protection module consists of two pins.
Thefirst,OVSENS,isusedtomeasuretheexternallyapplied
voltagethroughanexternalresistor.Thesecond,OVGATE,
is an output used to drive the gate pin of an external FET.
The voltage at OVSENS will be lower than the OVP input
Dual Input Overvoltage Protection
It is possible to protect both V
and WALL from
BUS
overvoltage damage with several additional components,
as shown in Figure 5. Schottky diodes D1 and D2 pass the
larger of V1 and V2 to R1 and OVSENS. If either V1 or V2
voltage by (I
• 6.2kΩ) due to the OVP circuit’s
OVSENS
exceeds 6V plus V , OVGATE will be pulled to
F(SCHOTTKY)
quiescent current. The OVP input will be 200mV to 400mV
higher than OVSENS under normal operating conditions.
When OVSENS is below 6V, an internal charge pump will
drive OVGATE to approximately 1.88 • OVSENS. This will
enhance the N-channel FET and provide a low impedance
GND and both the WALL and USB inputs will be protected.
Each input is protected up to the drain-source breakdown,
BVDSS, of MN1 and MN2. R1 must also be rated for the
power dissipated during maximum overvoltage. See the
“OvervoltageProtection”sectionforanexplanationofthis
calculation. Table 2 shows some NMOS FETs that maybe
suitable for overvoltage protection.
connection to V
or WALL which will, in turn, power
BUS
the LTC3577-3/LTC3577-4. If OVSENS should rise above
6V (6.35V OVP input) due to a fault or use of an incorrect
wall adapter, OVGATE will be pulled to GND, disabling the
external FET to protect downstream circuitry. When the
voltage drops below 6V again, the external FET will be
re-enabled.
Table 2. Recommended Overvoltage FETs
NMOS FET
Si1472DH
BVDSS
30V
R
PACKAGE
SC70-6
SOT-23
SOT-23
SOT-23
SOT-23
ON
82mΩ
60mΩ
65mΩ
80mΩ
35mΩ
Si2302ADS
Si2306BDS
Si2316BDS
IRLML2502
20V
In an overvoltage condition, the OVSENS pin will be
clamped at 6V. The external 6.2k resistor must be
sized appropriately to dissipate the resultant power.
For example, a 1/10W 6.2k resistor can have at most
30V
30V
20V
MN1
WALL
V1
LTC3577-3/
LTC3577-4
OVGATE
V2
V
BUS
MN2
D2
D1
C1
R1
OVSENS
357734 F05
Figure 5. Dual Input Overvoltage Protection
357734fa
28
LTC3577-3/LTC3577-4
OPERATION
Reverse Input Voltage Protection
When disabled all LDO circuitry is powered off leaving
only a few nanoamps of leakage current on the LDO sup-
ply. Both LDO outputs are individually pulled to ground
through internal resistors when disabled.
The LTC3577-3/LTC3577-4 can also be easily protected
against the application of reverse voltage as shown in
Figure 6. D1 and R1 are necessary to limit the maximum
VGSseenbyMP1duringpositiveovervoltageevents.D1’s
breakdownvoltagemustbesafelybelowMP1’sBVGS.The
circuitshowninFigure 6offersforwardvoltageprotection
up to MN1’s BVDSS and reverse voltage protection up to
MP1’s BVDSS.
The power good status bits of LDO1 and LDO2 are avail-
2
able in I C through the read-back registers PGLDO[1] and
PGLDO[2] for LDO1 and LDO2 respectively. The power
good comparators for both LDOs are sampled when the
2
2
I C port receives the correct I C read address.
Figure 7 shows the LDO application circuit. The full-scale
outputvoltageforeachLDOisprogrammedusingaresistor
divider from the LDO output (LDO1 or LDO2) connected
to the feedback pins (LDO1_FB or LDO2_FB) such that:
MP1
MN1
USB/WALL
ADAPTER
V
BUS
C1
D1
LTC3577-3/
LTC3577-4
R1
500k
R2
6.2k
OVGATE
OVSENS
⎛
⎞
R1
R2
357734 F06
VLDOx = 0.8V •
+ 1
D1: 5.6V ZENER
MP1: Si2323 DS, BVDSS = 20V
⎜
⎝
⎟
⎠
V
V
POSITIVE PROTECTION UP TO BVDSS OF MN1
NEGATIVE PROTECTION UP TO BVDSS OF MP1
BUS
BUS
Forstability,eachLDOoutputmustbebypassedtoground
with a minimum 1ꢁF ceramic capacitor (C ).
Figure 6. Dual Polarity Voltage Protection
LOW DROPOUT LINEAR REGULATOR OPERATION
LDO Operation and Voltage Programming
OUT
V
INLDOx
MP
0
1
LDOxEN
TheLTC3577-3/LTC3577-4containtwo150mAadjustable
output LDO regulators. The first LDO (LDO1) is always on
LDOx
LDOx
OUTPUT
R1
C
OUT
and will be enabled whenever V
is greater than V
LDOx_FB
0.8V
OUT
OUT
UVLO. The second LDO (LDO2) is controlled by the push-
button and is the first supply to sequence up in response
to pushbutton application. Both LDOs are disabled when
R2
GND
357734 F07
V
is less than V
UVLO and LDO2 is further disabled
OUT
OUT
when the pushbutton circuity is in the power down or
power off states. Both LDOs contain a soft-start function
to limit inrush current when enabled. The soft-start func-
tion works by ramping up the LDO reference over a 200μs
period (typical) when the LDO is enabled.
Figure 7. LDO Application Circuit
357734fa
29
LTC3577-3/LTC3577-4
OPERATION
STEP-DOWN SWITCHING REGULATOR OPERATION
V
IN
Introduction
EN
MP
L
SWx
FBx
MODE
SLEW
PWM
V
OUTx
The LTC3577-3/LTC3577-4 include three 2.25MHz
constant-frequency current mode step-down switching
regulators providing 500mA, 500mA and 800mA each.
All step-down switching regulators can be programmed
for a minimum output voltage of 0.8V and can be used to
poweramicrocontrollercore,microcontrollerI/O,memory
orotherlogiccircuitry. Allstep-downswitchingregulators
support 100% duty cycle operation (low dropout mode)
when the input voltage drops very close to the output
voltage and are also capable of Burst Mode operation for
highest efficiencies at light loads. Burst Mode operation
is individually selectable for each step-down switching
CONTROL
MN
C
OUT
C
R1
FB
0.8V
R2
GND
357734 F08
Figure 8. Step-Down Switching Regulator Application Circuit
resistor divider from the step-down switching regulator
output connected to the feedback pins (FB1, FB2 and
FB3) such that:
2
regulatorthroughtheI CregisterbitsBK1BRST,BK2BRST
⎛
⎞
R1
R2
and BK3BRST. The step-down switching regulators also
include soft-start to limit inrush current when powering
on, short-circuit current protection, and switch node slew
limiting circuitry to reduce EMI radiation. No external
compensation components are required for the switch-
ing regulators. Switching regulators 1 and 2 (Buck1 and
Buck2) are sequenced up and down together through the
pushbutton interface (see “Pushbutton Interface” section
for more information), while Buck3 has an individual en-
able pin (EN3) that is active when the pushbutton is in
the power up or power on states. Buck3 is disabled in the
power down and power off states. It is recommended that
VOUTx = 0.8V •
+ 1
⎜
⎝
⎟
⎠
Typical values for R1 are in the range of 40k to 1M. The
capacitor C cancels the pole created by feedback resis-
FB
tors and the input capacitance of the FB pin and also helps
to improve transient response for output voltages much
greater than 0.8V. A variety of capacitor sizes can be used
for C but a value of 10pF is recommended for most ap-
FB
plications. Experimentation with capacitor sizes between
2pF and 22pF may yield improved transient response.
Operating Modes
the step-down switching regulator input supplies (V
IN12
OUT
and V ) be connected to the system supply pin (V ).
The step-down switching regulators include two possible
operatingmodestomeetthenoise/powerneedsofavariety
of applications. In pulse-skipping mode, an internal latch
is set at the start of every cycle, which turns on the main
P-channel MOSFET switch. During each cycle, a current
comparator compares the peak inductor current to the
output of an error amplifier. The output of the current
comparatorresetstheinternallatch,whichcausesthemain
P-channel MOSFET switch to turn off and the N-channel
MOSFET synchronous rectifier to turn on. The N-channel
MOSFET synchronous rectifier turns off at the end of the
2.25MHz cycle or if the current through the N-channel
MOSFET synchronous rectifier drops to zero. Using this
method of operation, the error amplifier adjusts the peak
IN3
This is recommended because the undervoltage lockout
circuit on the V pin (V UVLO) disables the step-
OUT
OUT
down switching regulators when the V
voltage drops
OUT
below the V
UVLO threshold. If driving the step-down
OUT
switching regulator input supplies from a voltage other
than V the regulators should not be operated outside
OUT
thespecifiedoperatingrangeasoperationisnotguaranteed
beyond this range.
Output Voltage Programming
Figure 8 shows the step-down switching regulator ap-
plication circuit. The full-scale output voltage for each
step-down switching regulator is programmed using a
357734fa
30
LTC3577-3/LTC3577-4
OPERATION
inductor current to deliver the required output power. All
necessary compensation is internal to the step-down
switching regulator requiring only a single ceramic output
capacitorforstability.Atlightloadsinpulse-skippingmode,
the inductor current may reach zero on each pulse which
will turn off the N-channel MOSFET synchronous rectifier.
In this case, the switch node (SW1, SW2 or SW3) goes
high impedance and the switch node voltage will “ring”.
Thisisdiscontinuousoperation,andisnormalbehaviorfor
a switching regulator. At very light loads in pulse-skipping
mode, the step-down switching regulators will automati-
cally skip pulses as needed to maintain output regulation.
step-down switching regulators allow mode transition
on-the-fly, providing seamless transition between modes
even under load. This allows the user to switch back and
forth between modes to reduce output ripple or increase
low current efficiency as needed. Burst Mode operation
is individually selectable for each step-down switching
2
regulatorthroughtheI CregisterbitsBK1BRST,BK2BRST
and BK3BRST.
Shutdown
The step-down switching regulators (Buck1, Buck2 and
Buck3) are shut down when the pushbutton circuitry is in
the power-down or power-off state. Step-down switching
regulator 3 (Buck3) can also be shut down by bringing the
EN3 input low. In shutdown all circuitry in the step-down
switching regulator is disconnected from the switching
regulator input supply leaving only a few nanoamps of
leakage current. The step-down switching regulator out-
puts are individually pulled to ground through internal 10k
resistors on the switch pin (SW1, SW2 or SW3) when in
shutdown.
At high duty cycle (V
approaching V ) it is possible
OUTX
INX
for the inductor current to reverse at light loads causing
the stepped down switching regulator to operate continu-
ously. When operating continuously, regulation and low
noise output voltage are maintained, but input operating
current will increase to a few milliamps.
In Burst Mode operation, the step-down switching regula-
tors automatically switch between fixed frequency PWM
operation and hysteretic control as a function of the load
current. At light loads the step-down switching regulators
control the inductor current directly and use a hysteretic
control loop to minimize both noise and switching losses.
While operating in Burst Mode operation, the output
capacitor is charged to a voltage slightly higher than the
regulation point. The step-down switching regulator then
goes into sleep mode, during which the output capacitor
provides the load current. In sleep mode, most of the
switching regulator’s circuitry is powered down, helping
conserve battery power. When the output voltage drops
below a pre-determined value, the step-down switching
regulator circuitry is powered on and another burst cycle
begins. The sleep time decreases as the load current
increases. Beyond a certain load current point (about
1/4 rated output load current) the step-down switching
regulators will switch to a low noise constant frequency
PWM mode of operation, much the same as pulse-skip-
ping operation at high loads.
Dropout Operation
It is possible for a step-down switching regulator’s input
voltagetoapproachitsprogrammedoutputvoltage(e.g.,a
battery voltage of 3.4V with a programmed output voltage
of 3.3V). When this happens, the PMOS switch duty cycle
increasesuntilitisturnedoncontinuouslyat100%.Inthis
dropoutcondition,therespectiveoutputvoltageequalsthe
regulator’s input voltage minus the voltage drops across
the internal P-channel MOSFET and the inductor.
Soft-Start Operation
Soft-startisaccomplishedbygraduallyincreasingthepeak
inductor current for each step-down switching regulator
overa500ꢁsperiod.Thisallowseachoutputtoriseslowly,
helping minimize inrush current required to charge up the
switching regulator output capacitor. A soft-start cycle
occurs whenever a given switching regulator is enabled.
A soft-start cycle is not triggered by changing operating
modes. This allows seamless output transition when
actively changing between operating modes.
For applications that can tolerate some output ripple
at low output currents, Burst Mode operation provides
better efficiency than pulse-skipping at light loads. The
357734fa
31
LTC3577-3/LTC3577-4
OPERATION
Slew Rate Control
UVLO prevents the step-down switching regulators from
operating at low supply voltages where loss of regula-
tion or other undesirable operation may occur. If driving
the step-down switching regulator input supplies from
The step-down switching regulators contain new patent
pending circuitry to limit the slew rate of the switch node
(SW1, SW2 and SW3). This new circuitry is designed to
transition the switch node over a period of a few nanosec-
onds, significantly reducing radiated EMI and conducted
supply noise while maintaining high efficiency. Since
slowingtheslewrateoftheswitchnodescausesefficiency
loss, the slew rate of the step-down switching regulators
a voltage other than the V
pin, the regulators should
OUT
not be operated outside the specified operating range as
operation is not guaranteed beyond this range.
Inductor Selection
2
Many different sizes and shapes of inductors are available
fromnumerousmanufacturers.Choosingtherightinductor
fromsuchalargeselectionofdevicescanbeoverwhelming,
butfollowingafewbasicguidelineswillmaketheselection
process much simpler. The step-down switching regula-
tors are designed to work with inductors in the range of
2.2ꢁH to 10ꢁH. For most applications a 4.7ꢁH inductor is
suggested for step-down switching regulators providing
up to 500mA of output current while a 3.3ꢁH inductor is
suggested for step-down switching regulators providing
upto800mA.Largervalueinductorsreduceripplecurrent,
which improves output ripple voltage. Lower value induc-
tors result in higher ripple current and improved transient
responsetime,butwillreducetheavailableoutputcurrent.
To maximize efficiency, choose an inductor with a low DC
resistance. For a 1.2V output, efficiency is reduced about
2% for 100mꢀ series resistance at 400mA load current,
and about 2% for 300mꢀ series resistance at 100mA load
current. Choose an inductor with a DC current rating at
least 1.5 times larger than the maximum load current to
is adjustable via the I C registers SLEWCTL1 and SLEW-
CTL2. This allows the user to optimize efficiency or EMI as
necessarywithfourdifferentslewratesettings.Thepower
up default is the fastest slew rate (highest efficiency) set-
ting. Figures 9 and 10 show the efficiency and power loss
graph for Buck3 programmed for 1.2V and 2.5V outputs.
Note that the power loss curves remain fairly constant for
both graphs yet changing the slew rate has a larger effect
on the 1.2V output efficiency. This is mainly because for
a given output current the 2.5V output is delivering more
than 2x the power than the 1.2V output. Efficiency will
always decrease and show more variation to slew rate as
the programmed output voltage is decreased.
Low Supply Operation
An undervoltage lockout circuit on V
shutsdownthestep-downswitchingregulatorswhenV
drops below about 2.7V. It is recommended that the step-
down switching regulator input supplies (V , V ) be
connected to the power path output (V ) directly. This
(V
UVLO)
OUT
OUT
OUT
IN12 IN3
OUT
100
90
80
70
60
50
40
30
20
10
1.00E+00
1.00e-01
1.00E-02
1.00E-03
1.00E-04
1.00E-05
100
90
80
70
60
50
40
30
20
10
1.00E+00
1.00e-01
1.00E-02
1.00E-03
1.00E-04
1.00E-05
Burst Mode
OPERATION
IN
Burst Mode
OPERATION
IN
V
= 3.8V
V
= 3.8V
SW[1:0] =
SW[1:0] =
00
01
10
11
00
01
10
11
0
0
1.00E-05
1.00E-0.3
1.00E-01
1.00E-05
1.00E-0.3
1.00E-01
I
(mA)
I
(mA)
OUT3
OUT3
357734 F09
357734 F10
Figure 9. VOUT3 (1.2V) Efficiency and Power Loss vs IOUT3
Figure 10. VOUT3 (2.5V) Efficiency and Power Loss vs IOUT3
357734fa
32
LTC3577-3/LTC3577-4
OPERATION
ensure that the inductor does not saturate during normal
operation. If output short circuit is a possible condition,
the inductor should be rated to handle the maximum peak
current specified for the step-down converters. Different
core materials and shapes will change the size/current
and price/current relationship of an inductor. Toroid or
shielded pot cores in ferrite or Permalloy materials are
small and don’t radiate much energy, but generally cost
more than powdered iron core inductors with similar
electrical characteristics. Inductors that are very thin or
have a very small volume typically have much higher core
and DCR losses, and will not give the best efficiency. The
choice of which style inductor to use often depends more
on the price versus size, performance, and any radiated
EMI requirements than on what the step-down switching
regulatorsrequirestooperate. Theinductorvaluealsohas
an effect on Burst Mode operation. Lower inductor values
will cause Burst Mode switching frequency to increase.
Table 3 shows several inductors that work well with the
step-down switching regulators. These inductors offer a
good compromise in current rating, DCR and physical
size. Consult each manufacturer for detailed information
on their entire selection of inductors.
Input/Output Capacitor Selection
LowESR(equivalentseriesresistance)ceramiccapacitors
should be used at both step-down switching regulator
outputs as well as at each step-down switching regulator
input supply. Only X5R or X7R ceramic capacitors should
be used because they retain their capacitance over wider
voltage and temperature ranges than other ceramic types.
A 10ꢁF output capacitor is sufficient for the step-down
switching regulator outputs. For good transient response
and stability the output capacitor for step-down switching
regulators should retain at least 4ꢁF of capacitance over
operating temperature and bias voltage. Each switching
regulator input supply should be bypassed with a 2.2ꢁF
capacitor. Consult with capacitor manufacturers for de-
tailed information on their selection and specifications
of ceramic capacitors. Many manufacturers now offer
Table 3. Recommended Inductors for Step-Down Switching Regulators
INDUCTOR TYPE
L (μH)
MAX I (A)
MAX DCR (Ω)
SIZE in mm (L × W × H) MANUFACTURER
DC
DB318C
4.7
3.3
4.7
3.3
4.7
3.3
1.07
1.20
0.79
0.90
1.15
1.37
0.1
0.07
Toko
www.toko.com
3.8 × 3.8 × 1.8
3.8 × 3.8 × 1.8
3.6 × 3.6 × 1.2
3.6 × 3.6 × 1.2
3.0 × 2.8 × 1.2
3.0 × 2.8 × 1.2
D312C
0.24
0.20
0.13*
0.105*
DE2812C
CDRH3D16
CDRH2D11
4.7
3.3
4.7
3.3
4.7
0.9
1.1
0.11
0.085
0.17
Sumida
4 × 4 × 1.8
4 × 4 × 1.8
www.sumida.com
0.5
3.2 × 3.2 × 1.2
3.2 × 3.2 × 1.2
4.9 × 4.9 × 1
0.6
0.75
0.123
0.19
CLS4D09
SD3118
4.7
3.3
4.7
3.3
4.7
3.3
4.7
3.3
1.3
1.59
0.8
0.97
1.29
1.42
1.08
1.31
0.162
0.113
Cooper
www.cooperet.com
3.1 × 3.1 × 1.8
3.1 × 3.1 × 1.8
3.1 × 3.1 × 1.2
3.1 × 3.1 × 1.2
5.2 × 5.2 × 1.2
5.2 × 5.2 × 1.2
5.2 × 5.2 × 1.0
5.2 × 5.2 × 1.0
SD3112
SD12
0.246
0.165
0.117*
0.104*
0.153*
0.108*
SD10
LPS3015
4.7
3.3
1.1
1.3
0.2
0.13
Coil Craft
www.coilcraft.com
3.0 × 3.0 × 1.5
3.0 × 3.0 × 1.5
*Typical DCR
357734fa
33
LTC3577-3/LTC3577-4
OPERATION
very thin (<1mm tall) ceramic capacitors ideal for use in
height-restricted designs. Table 4 shows a list of several
ceramic capacitor manufacturers.
LED Boost Operation
The LED boost converter is designed for very high duty
cycle operation and can boost from 3V to 40V out for load
currents up to 20mA. The boost converter also features
overvoltage protection to protect the output in case of an
open circuit in the LED string. The overvoltage protection
threshold is set by adjusting R1 in Figure 11 such that:
Table 4. Ceramic Capacitor Manufacturers
AVX
www.avxcorp.com
www.murata.com
www.t-yuden.com
www.vishay.com
www.tdk.com
Murata
Taiyo Yuden
Vishay Siliconix
TDK
R1
BOOST(MAX) = 800mV •
+LED_OV
10 •R2
where LED_OV is approximately 1.0V.
LED BACKLIGHT/BOOST OPERATION
Introduction
In the case of Figure 11 BOOST(MAX) is set to 40V for a
10-LED string.
The LED driver uses a constant frequency, current mode
boost converter to supply power for up to 10 series LEDs.
As shown in Figure 11 the series string of LEDs is con-
nected from the output of the boost converter (BOOST) to
Capacitor C3 provides soft-start, limiting the inrush cur-
rentwhentheboostconverterisfirstenabled. C3provides
feedback to the I pin. This feedback limits the rise time
LED
of output voltage and the inrush current while the output
capacitor, C2, is charging.
the I
pin. Under normal operation the boost converter
LED
BOOST output will be driven to a voltage where the I
pin regulates at approximately 300mV to 400mV. The I
LED
The boost converter will be operated in either continuous
conduction mode, discontinuous conduction mode or
pulse-skipping mode depending on the inductor current
required for regulation.
LED
2
pin is a constant current sink that is programmed via I C
“LED DAC register”. The LED can be further controlled
2
using I C to program brightness levels and soft turn-on/
2
turn-off effects. See the “I C Interface” section for more
LED Constant Current Sink
information on programming the I
current. The boost
LED
converter also includes an overvoltage protection feature
to limit the BOOST output voltage as well as variable slew
rate control of the SW pin to reduce EMI.
TheLEDdriverusesaprecisioncurrentsinktoregulatethe
LED current up to 20mA. The current sink is programmed
2
via I C “LED DAC Register” and utilizes a 6-bit 60dB expo-
nential DAC. This DAC provides accurate current control
from 20ꢁA to 20mA with approximately 1dB per step for
LED(FS)
C1
I
= 20mA. The LED current can be approximated
22μF
39
V
by the following equations:
OUT
L1
LTC3577-3/
10μH
⎛
⎞
DAC – 63
63
LTC3577-4
LPS4018-103ML
D12
ZLLS400
ILED = ILED(FS) •10⎜⎝3 •
⎟
⎠
18
19
20
SW
SW
SW
(1)
BOOST
R1
10M
0.8V
R2
ILED(FS)
=
• 500
9
LED_OV
C2
C3
22nF
50V
R2
20k
D1 D2 D3 D4 D5
D10 D9 D8 D7 D6
1μF
3
2
50V
I
LED_FS
where DAC is the decimal value programmed into the I C
“LED DAC register”. For example with I
= 20mA
22
LED(FS)
I
LED
357734 F11
and DAC[5:0] = 000000 (0 decimal) I equates to 20ꢁA,
LED
while DAC[5:0] = 111111 (63 decimal) I
20mA.AsafinalexampleDAC[5:0]=101010is42decimal
equates to
LED
Figure 11. LED Boost Application Circuit
357734fa
34
LTC3577-3/LTC3577-4
OPERATION
and equates to I
= 2mA for I
= 20mA. The DAC
current may be adjusted but the accuracy of the output
current will be degraded the further it is programmed
from 20mA. The LED_FS pin is current limited and will
only source about 80μA. This protects the pin and limits
LED
LED(FS)
approximates Equation 1 using the nominal values in
Table 5. The differences between the approximation
equation and the table are due to design of the DAC using
eight linear segments that approximate the exponential
function.
the I
current in a case where LED_FS is shorted to
LED
ground, it is not recommended to program the LED cur-
rent above 25mA.
Table 5. LED DAC Codes to Output Current
DAC Codes
Output Current
20.0μA
23.5μA
27.0μA
30.5μA
34.0μA
37.6μA
41.1μA
44.6μA
48.1μA
56.5μA
65.0μA
73.4μA
81.9μA
90.3μA
98.7μA
107μA
116μA
136μA
156μA
177μA
197μA
217μA
237μA
258μA
278μA
327μA
376μA
424μA
473μA
522μA
571μA
DAC Codes
Output Current
668μA
LED Gradation
0
1
2
3
4
5
6
7
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
786μA
903μA
The LED driver features an automatic gradation circuit.
The gradation circuit ramps the LED current up when
the LED driver is enabled and ramps the current down
when the LED driver is disabled. The DAC is enabled and
1.02mA
1.14mA
1.26mA
1.37mA
1.49mA
1.61mA
1.89mA
2.17mA
2.45mA
2.74mA
3.02mA
3.30mA
3.58mA
3.86mA
4.54mA
5.22mA
5.90mA
6.58mA
7.26mA
7.93mA
8.61mA
9.29mA
10.8mA
12.4mA
13.9mA
15.4mA
17.0mA
18.5mA
20.0mA
2
disabled with the EN bit of the I C “LED control register”.
The gradation function is automatic when enabling and
disablingtheLEDdriver;onlythegradationspeedneedsto
be programmed to use this function. The gradation speed
8
9
2
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
is set by the GR1 and GR2 bits of the I C “LED control
register” which allows transitions times of approximately
15ms, one-half second, one second and two seconds.
2
See the “I C Interface” section for more information. The
gradation function allows the LEDs to turn on and off
gradually as opposed to an abrupt step.
LED PWM vs Constant Current Operation
The LED driver provides both linear LED current mode as
wellasPWMLEDcurrentmode.Thesemodesareselected
2
through the MD1 and MD2 bits of the I C “LED control
register”. When both bits are “0” the LED boost converter
is in constant current (CC) mode and the I current sink
LED
is constant whose value is set by the DAC[5:0] bits of the
2
I C“LED DAC register”.
Setting MD1 to “0” and MD2 to “1” selects the LED PWM
mode. In this mode the LED driver is pulsed using an
internally generated PWM signal. The PWM mode may be
used to reduce the LED intensity for a given programmed
current.
620μA
The full-scale LED current is set using a resistor (R2 in
Figure 11)connectedbetweentheLED_FSpinandground.
Typically R2 should be set to 20k to give 20mA of LED
current at full scale. The resistance may be increased to
decrease the current or the resistance may be decreased
to increase the LED current. The DAC has been optimized
for best performance at 20mA full scale. The full-scale
WhendimmingviaPWMtheLEDdriverandboostconverter
are both turned on and off together. This allows some
degree of additional control over the LED current, and in
somecasesmayofferamoreefficientmethodofdimming
since the boost could be operated at an optimal efficiency
point and pulsed for the desired LED intensity.
357734fa
35
LTC3577-3/LTC3577-4
OPERATION
The PWM mode, if enabled, is set up using 3 values,
Fixed Boost Output
2
PWMNUM [3:0] and PWMDEN [3:0] in the I C “LED PWM
Setting MD1 to 1 and MD2 to 0 selects the fixed high
voltage boost mode. This mode can be used to generate
output voltages at or greater than V . When configured
as a boost converter the I
pin, and the boost will regulate the output voltage such
that the voltage on the I pin is 800mV.
Register” and PWMCLK, set by PWMC2 and PWMC1 in
2
the I C “LED Control Register.”
OUT
pin becomes the feedback
PWMNUM
Duty Cycle =
LED
PWMDEN
LED
PWMCLK
Frequency =
Figure 12 shows a fixed 12V output generated using the
boost converter in the fixed high voltage boost mode. Any
output voltage up to 40V may be programmed by select-
ing appropriate values for the R1 and R2 voltage divider
from the equation:
PWMDEN
Table 6. PWM Clock Frequency
PWMC2
PWMC1
PWMCLK
8.77kHz
4.39kHz
2.92kHz
2.19kHz
0
0
1
1
0
1
0
1
⎛
⎞
R1
R2
VBOOST = 0.8V •
+ 1
⎜
⎝
⎟
⎠
Values for R2 should be kept below 24.3k to keep the pole
at the I pin beyond cross over.
UsingthePWMcontrol,a4-bitinternallygeneratedPWMis
possible as additional dimming. Using these control bits a
number of PWM duty cycles and frequencies are available
in the 100Hz to 500Hz range. This range was selected to
be below the audio range and above the frequency where
the PWM is visible.
LED
The boost is designed primarily as a high voltage and high
duty cycle converter. When operating with a lower boost
ratio, a larger output capacitor, 10μF, should be used. Op-
erating with a very low duty cycle will cause cycle skipping
which will increase ripple.
For example, given PWMC2 = 1, PWMC1 = 0,
PWMNUM[3:0] = 0111 and PWMDEN[3:0] = 1100 then
the duty cycle will be 58.3% and PWM frequency will be
243Hz.
C1
22μF
39
V
OUT
LED_FS
3
L4
I
If PWMNUM is set to 0 then the duty cycle will be 0% and
the current sink will effectively be off. If PWMNUM is ever
programmed to a value larger than PWMDEN the duty
cycle will be 100% and the current sink will effectively be
constant. PWMDEN and PWMNUM may both be changed
to result in 73 different duty cycle possibilities and 41 dif-
ferent PWM frequencies between 8.77kHz and 100Hz.
10μH
LTC3577-3/
LTC3577-4
LPS4018-103ML
D12
ZLLS400
18
19
20
SW
SW
SW
BOOST
C2
R1
10μF
10V
301k
800mV V
REF
22
9
I
LED
R2
21.5k
LED_OV
357734 F12
WhenPWMmodeisenabledasmall(2μA)standbycurrent
source is always enabled on the LED pin. The purpose of
thisistohavesomecurrentflowingintheLED’satalltimes.
This helps to reduce the magnitude of the voltage swing
on the LED pin as the current is pulsed on and off.
Figure 12. Fixed 12V/75mA Boost Output Application
357734fa
36
LTC3577-3/LTC3577-4
OPERATION
To keep the average steady-state inductor current below
300mA the maximum output current is reduced as pro-
grammed output voltage increases. The output current
available is given by:
Diode Selection
When boosting to increasingly higher voltages, parasitic
capacitance at the switch pin becomes an increasing
large component of the switching loses. For this reason
it is important to minimize the capacitance on the switch
node. The diode selected should be sized to handle the
peak inductor current and the average output current.
At high boost voltages a diode with the lowest possible
junction capacitance will often result in a more efficient
solution than one with a lower forward drop.
VOUT(MIN)
IBOOST(MAX) = 300mA •
VBOOST
Note that the maximum boost output current must be
set by the minimum V
converter is allowed to operate down to the V
operating voltage. If the boost
OUT
UVLO
OUT
then 2.5V must be assumed as the minimum operating
voltage.
2
I C OPERATION
V
OUT
2
I C Interface
Inductor Selection
The LTC3577-3/LTC3577-4 may communicate with a
The LED boost converter is designed to work with a 10ꢁH
inductor. The inductor must be able to handle a peak
current of 1A and should have a low ESR value for good
efficiency. Table 7 shows several inductors that work
well with the LED boost converter. These inductors offer
a good compromise in current rating, DCR and physical
size. Consult each manufacturer for detailed information
on their entire selection of inductors.
2
bus master using the standard I C 2-wire interface. The
Timing Diagram shows the relationship of the signals on
the bus. The two bus lines, SDA and SCL, must be high
when the bus is not in use. External pull-up resistors or
current sources, such as the LTC1694 SMBus accelerator,
arerequiredontheselines.TheLTC3577-3/LTC3577-4are
2
both a slave receiver and slave transmitter. The I C control
signals, SDA and SCL are scaled internally to the DV
CC
supply. DV should be connected to the same power
CC
supply as the bus pull-up resistors.
Table 7. Recommended Inductors for Boost Switching Reguators
INDUCTOR TYPE
L (μH)
MAX I (A)
MAX DCR (Ω)
SIZE in mm (L × W × H) MANUFACTURER
DC
LPS4018-103
10
1.1
0.200
Coil Craft
www.coilcraft.com
4.0 × 4.0 × 1.8
DB62LCB
10
10
10
1.22
1.05
1.28
0.118
0.155
Toko
6.2 × 6.2 × 2
www.toko.com
CDRH4D16NP-100M
SD18-100-R
*Typical
Sumida
www.sumida.com
4.8 × 4.8 × 1.8
5.2 × 5.2 × 1.8
0.158*
Cooper
www.cooperet.com
357734fa
37
LTC3577-3/LTC3577-4
OPERATION
2
2
The I C port has an undervoltage lockout on the DV pin.
I C Byte Format
CC
2
When DV is below approximately 1V, the I C serial port
CC
EachbytesenttoorreceivedfromtheLTC3577-3/LTC3577-4
must be 8 bits long followed by an extra clock cycle for the
acknowledgebit.ThedatashouldbesenttotheLTC3577-3/
LTC3577-4 most significant bit (MSB) first.
is cleared and registers are set to the default configura-
tion of all zeros.
2
I C Bus Speed
2
2
The I C port is designed to be operated at speeds of up
I C Acknowledge
to 400kHz. It has built-in timing delays to ensure correct
operation when addressed from an I C compliant master
device. It also contains input filters designed to suppress
glitches should the bus become corrupted.
The acknowledge signal is used for handshaking between
themasterandtheslave.WhentheLTC3577-3/LTC3577-4
are written to (write address), they acknowledge their
write address as well as the subsequent two data bytes.
When they are read from (read address), the LTC3577-3/
LTC3577-4 acknowledge their read address only. The bus
master should acknowledge receipt of information from
the LTC3577-3/LTC3577-4.
2
2
I C START and STOP Conditions
A bus master signals the beginning of communications
by transmitting a START condition. A START condition is
generated by transitioning SDA from HIGH to LOW while
SCL is HIGH. The master may transmit either the slave
write or the slave read address. Once data is written to the
LTC3577-3/LTC3577-4, the master may transmit a STOP
condition which commands the LTC3577-3/LTC3577-4 to
actuponitsnewcommandset.ASTOPconditionissentby
the master by transitioning SDA from LOW to HIGH while
SCL is HIGH. The bus is then free for communication with
Anacknowledge(activeLOW)generatedbytheLTC3577-3/
LTC3577-4 let the master know that the latest byte of
information was received. The acknowledge related clock
pulse is generated by the master. The master releases the
SDA line (HIGH) during the acknowledge clock cycle. The
LTC3577-3/LTC3577-4 pull down the SDA line during the
write acknowledge clock pulse so that it is a stable LOW
during the HIGH period of this clock pulse.
2
another I C device.
I2C Timing Diagram
DATA BYTE A
DATA BYTE B
ADDRESS
WR
0
0
0
0
1
0
0
1
1
A7
1
A6
2
A5
3
A4
A3
A2
6
A1
7
A0
8
B7
1
B6
2
B5
3
B4
4
B3
5
B2
6
B1
7
B0
8
START
STOP
SDA
SCL
0
0
0
1
0
0
0
8
ACK
9
ACK
9
ACK
9
1
2
3
4
5
6
7
4
5
SDA
t
t
t
BUF
SU, DAT
SU, STA
t
t
t
t
LOW
HD, STA
SU, STO
HD, DAT
357734 TD
SCL
t
t
t
HD, STA
HIGH
SP
START
CONDITION
REPEATED START
CONDITION
STOP
CONDITION
START
CONDITION
t
t
f
r
357734fa
38
LTC3577-3/LTC3577-4
OPERATION
When the LTC3577-3/LTC3577-4 are read from, they re-
lease the SDA line so that the master may acknowledge
receipt of the data. Since the LTC3577-3/LTC3577-4 only
transmit one byte of data, a master not acknowledging the
datasentbytheLTC3577-3/LTC3577-4hasnoI Cspecific
consequence on the operation of the I C port.
the sub-address. Again the LTC3577-3/LTC3577-4 ac-
knowledge and the cycle is repeated for the data byte.
The data byte is transferred to an internal holding latch
upon the return of its acknowledge by the LTC3577-3/
LTC3577-4. This procedure must be repeated for each
sub-address that requires new data. After one or more
cyclesof[ADDRESS][SUB-ADDRESS][DATA],themaster
may terminate the communication with a STOP condition.
Alternatively, a REPEAT-START condition can be initiated
2
2
2
I C Slave Address
The LTC3577-3/LTC3577-4 respond to a 7-bit address
whichhasbeenfactoryprogrammedtob’0001001[R/W]’.
The LSB of the address byte, known as the read/write bit,
shouldbe0whenwritingdatatotheLTC3577-3/LTC3577-4
and 1 when reading data from it. Considering the address
an eight bit word, then the write address is 0x12 and the
read address is 0x13. The LTC3577-3/LTC3577-4 will
acknowledge both its read and write address.
2
by the master and another chip on the I C bus can be
addressed. This cycle can continue indefinitely and the
LTC3577-3/LTC3577-4willrememberthelastinputofvalid
data that it received. Once all chips on the bus have been
addressed and sent valid data, a global STOP can be sent
and the LTC3577-3/LTC3577-4 will update their command
latches with the data that they had received.
2
2
I C Bus Read Operation
I C Sub-Addressed Writing
The bus master reads the status of the LTC3577-3/
LTC3577-4 with a START condition followed by the
LTC3577-3/LTC3577-4 read address. If the read address
matchesthatoftheLTC3577-3/LTC3577-4,theLTC3577-3/
LTC3577-4returnanacknowledge.Followingtheacknowl-
edgementoftheirreadaddress,theLTC3577-3/LTC3577-4
return one bit of status information for each of the next
8 clock cycles. A STOP command is not required for the
bus read operation.
The LTC3577-3/LTC3577-4 have four command registers
2
forcontrolinput.TheyareaccessedbytheI Cportviaasub-
addressed writing system.
Each write cycle of the LTC3577-3/LTC3577-4 consists of
exactlythreebytes. ThefirstbyteisalwaystheLTC3577-3/
LTC3577-4’swriteaddress.Thesecondbyterepresentsthe
LTC3577-3/LTC3577-4’ssub-address.Thesubaddressisa
pointer which directs the subsequent data byte within the
LTC3577-3/LTC3577-4. The third byte consists of the data
to be written to the location pointed to by the sub-address.
TheLTC3577-3/LTC3577-4containcontrolregistersatonly
four sub-address locations: 0x00, 0x01, 0x02 and 0x03.
Writing to sub-addresses outside the four sub-addresses
listed is not recommended as it can cause data in one of
the four listed sub-addresses to be overwritten.
2
I C Input Data
There are 4 bytes of data that can be written to on the
LTC3577-3/LTC3577-4. The bytes are accessed through
the sub-addresses 0x00 to 0x03. At first power applica-
tion (V , WALL or BAT) all bits default to 0. Addition-
BUS
ally all bits are cleared to 0 when DV drops below its
CC
2
undervoltage lock out or if the pushbutton enters the
I C Bus Write Operation
power down (PDN) state.
The master initiates communication with the LTC3577-3/
LTC3577-4 with a START condition and the LTC3577-3/
LTC3577-4’s write address. If the address matches that
of the LTC3577-3/LTC3577-4, the LTC3577-3/LTC3577-4
return an acknowledge. The master should then deliver
Table 8 shows the first byte of data that can be written to
at sub-address 0x00. This byte of data is referred to as
the “buck control register”.
357734fa
39
LTC3577-3/LTC3577-4
OPERATION
Table 8. Buck Control Register
BUCK CONTROL
REGISTER
BitB0enablesanddisablestheLEDboostcircuitry.Writing
a 1 to B0 enables the LED boost circuitry, while writing a
0 disables the LED boost circuitry.
ADDRESS: 00010010
SUB-ADDRESS: 00000000
BIT NAME
B0 N/A
FUNCTION
Bits B1 and B2 are the LED gradation which sets the ramp
up and down time of the LED current when enabled or
disabled. The gradation function allows the LEDs to turn
on/off gradually as opposed to an abrupt step.
Not Used—No Effect on Operation
Not Used—No Effect on Operation
Buck1 Burst Mode Enable
Buck2 Burst Mode Enable
Buck2 Burst Mode Enable
B1 N/A
B2 BK1BRST
B3 BK2BRST
B4 BK3BRST
B5 SLEWCTL1
B6 SLEWCTL2
B7 N/A
Bits B3 and B4 set the operating mode of the LED boost
circuitry. The operating modes are: B4:B3 = 00 LED con-
stant current (CC) boost operation; B4:B3 = 10 LED PWM
boostoperation;B4:B3=01fixedhighvoltage(HV)output
boost operation; B4:B3 = 11, not supported, do not use.
See the “LED Backlight/Boost Operation” section for more
information on the operating modes.
Buck SW Slew Rate: 00 = 1ns,
01 = 2ns, 10 = 4ns, 11 = 8ns
Not Used—No Effect on Operation
Bits B2, B3, and B4 set the operating modes of the
step-down switching regulators (bucks). Writing a 1 to
any of these three registers will put that respective buck
converter in the high efficiency Burst Mode of operation,
while a 0 will enable the low noise “pulse-skipping” mode
of operation.
Bits B5 and B6 set the PWM clock speed as shown in
Table 5 of the “LED Backlight/Boost Operation” section.
Bit B7 sets the slew rate of the LED boost SW pin. Setting
B7 to 0 results in the fastest slew rate and provides the
most efficient mode of operation. Setting B7 to 1 should
only be used in cases where EMI due to SW slewing is an
issue as the slower slew rate causes a loss in efficiency.
The B5 and B6 bits adjust the slew rate of all SW pins
together so they all slew at the same rate. It is recom-
mended that the fastest slew rate (B6:B5 = 00) be used
unless EMI is an issue in the application as slower slew
rates cause reduced efficiency.
See “LED Backlight/Boost Operation” section for more
detailed operating information.
Table 9 shows the second byte of data that can be written
to at sub-address 0x01. This byte of data is referred to as
the “LED control register”.
Table 10 shows the third byte of data that can be written
to at sub-address 0x02. This byte of data is referred to as
the “LED DAC register”. The LED current source utilizes a
6-bit 60dB exponential DAC. This DAC provides accurate
current control from 20ꢁA to 20mA with approximately
Table 9. I2C LED Control Register
LED CONTROL
REGISTER
ADDRESS: 00010010
SUB-ADDRESS: 00000001
1dB per step with I
programmed to 20mA. The LED
LED(FS)
BIT NAME
B0 EN
FUNCTION
current can be approximated by the following equation:
Enable: 1 = Enable 0 = Off
B1 GR2
Gradation GR[2:1]: 00 = 15ms, 01 = 460ms,
10 = 930ms, 11 = 1.85 Seconds
⎛
⎞
DAC – 63
63
ILED = ILED(FS) •10⎜⎝3 •
⎟
⎠
B2 GR1
B3 MD1
Mode MD[2:1]: 00 = CC Boost,
10 = PWM Boost; 01 = HV Boost,
B4 MD2
2
where DAC is the decimal value programmed into the I C
“LEDDACregister”. ForexamplewithI =20mAand
DAC[5:0] = 101010 (42 decimal) I
B5 PWMC1
B6 PWMC2
B7 SLEWLED
PWM CLK PWMC[2:1]: 00 = 8.77kHz,
01 = 4.39kHz, 10 = 2.92kHz, 11 = 2.19kHz
LED(FS)
equates to 2mA.
LED
LED SW Slew Rate: 0/1 = Fast/Slow
357734fa
40
LTC3577-3/LTC3577-4
OPERATION
Table 10. I2C LED DAC Register
2
I C Output Data
ADDRESS: 00010010
One status byte may be read from the LTC3577-3/
LTC3577-4 as shown in Table 12. A 1 read back in the any
of the bit positions indicates that the condition is true. For
example, 1 read back from bit A3 indicate that LDO1 is
enabled and regulating correctly. A status read from the
LTC3577-3/LTC3577-4 captures the status information
when the LTC3577-3/LTC3577-4 acknowledge its read
address.
LED DAC REGISTER
BIT NAME
B0 DAC[0]
B1 DAC[1]
B2 DAC[2]
B3 DAC[3]
B4 DAC[4]
B5 DAC[5]
B6 N/A
SUB-ADDRESS: 00000010
FUNCTION
6-Bit Log DAC Code
Table 12. I2C READ Register
Not Used—No Effect On Operation
Not Used—No Effect On Operation
ADDRESS: 00010011
B7 N/A
STATUS REGISTER
BIT NAME
SUB-ADDRESS: None
Table 11 shows the final byte of data that can be written
to at sub-address 0x03. This byte of data is referred to as
the “LED PWM register”. See the “LED PWM vs Constant
Current Operation” section for detailed information on
how to set the values of this register.
FUNCTION
A0 CHARGE
A1 STAT[0]
A2 STAT[1]
Charge Status (1 = Charging)
STAT[1:0]; 00 = No Fault
01 = TOO COLD/HOT
10 = BATTERY OVERTEMP
11 = BATTERY FAULT
A3 PGLDO[1]
A4 PGLDO[2]
A5 PGBCK[1]
A6 PGBCK[2]
A7 PGBCK[3]
LDO1 Power Good
LDO2 Power Good
Buck1 Power Good
Buck2 Power Good
Buck3 Power Good
Table 11. LED PWM Register
ADDRESS: 00010010
LED PWM REGISTER
BIT NAME
SUB-ADDRESS: 00000011
FUNCTION
B0 PWMDEN[0]
B1 PWMDEN[1]
B2 PWMDEN[2]
B3 PWMDEN[3]
B4 PWMNUM[0]
B5 PWMNUM[1]
B6 PWMNUM[2]
B7 PWMNUM[3]
PWM DENOMINATOR
BitA7showsthepowergoodstatusofBuck3.A1indicates
that Buck3 is enabled and is regulating correctly. A 0 indi-
cates that either Buck3 is not enabled, or that the Buck3 is
enabled, but is out of regulation by more than 8%.
PWM NUMERATOR
BitA6showsthepowergoodstatusofBuck2.A1indicates
that Buck2 is enabled and is regulating correctly. A 0 indi-
cates that either Buck2 is not enabled, or that the Buck2 is
enabled, but is out of regulation by more than 8%.
357734fa
41
LTC3577-3/LTC3577-4
OPERATION
2
2
BitA5showsthepowergoodstatusofBuck1.A1indicates
that Buck1 is enabled and is regulating correctly. A 0 indi-
cates that either Buck1 is not enabled, or that the Buck1 is
enabled, but is out of regulation by more than 8%.
I C Write Register Map (see “I C Input Data” section for
more details, all registers default to 0 when reset)
BUCK CONTOL
REGISTER
ADDRESS: 00010010
SUB-ADDRESS: 00000000
BIT NAME
FUNCTION
BitA4showsthepowergoodstatusofLDO2. A1indicates
that LDO2 is enabled and is regulating correctly. A 0 indi-
cates that either LDO2 is not enabled, or that the LDO2 is
enabled, but is out of regulation by more than 8%.
B0 N/A
B1 N/A
Not Used—No Effect On Operation
Not Used—No Effect On Operation
Buck1 Burst Mode Enable
Buck2 Burst Mode Enable
Buck2 Burst Mode Enable
B2 BK1BRST
B3 BK2BRST
B4 BK3BRST
B5 SLEWCTL1
B6 SLEWCTL2
B7 N/A
BitA3showsthepowergoodstatusofLDO1. A1indicates
that LDO1 is enabled and is regulating correctly. A 0 indi-
cates that either LDO1 is not enabled, or that the LDO1 is
enabled, but is out of regulation by more than 8%.
Buck SW Slew Rate: 00 = 1ns,
01 = 2ns, 10 = 4ns, 11 = 8ns
Not Used—No Effect On Operation
LED CONTROL
REGISTER
BIT NAME
B0 EN
B1 GR2
B2 GR1
B3 MD1
B4 MD2
ADDRESS: 00010010
Bits A2 and A1 indicate the fault status of the charger
measurementcircuitandaredecodedinTable12.The“too
cold/hot”stateindicatesthatthethermistortemperatureis
out of the valid charging range (either below 0°C or above
40°Cforacurve1thermistor)andthatcharginghaspaused
untilthebatteryreturnstovalidchargingtemperature.The
batteryovertempstateindicatesthatthebattery’sthermis-
tor has reached a critical temperature (about 50°C for a
curve 1 thermistor) and that long-term battery capacity
may be seriously compromised if the condition persists.
The battery fault state indicates that an attempt was made
to charge a low battery (typically < 2.85V) but that the low
voltage condition persisted for more than 1/2 hour. In this
case charging has terminated.
SUB-ADDRESS: 00000001
FUNCTION
Enable: 1= Enable 0 = Off
Gradation GR[2:1]: 00 = 15ms, 01 = 460ms,
10 = 930ms, 11 = 1.85 Seconds
Mode MD[2:1]: 00 = CC Boost,
10 = PWM Boost, 01 = HV Boost
B5 PWMC1
B6 PWMC2
B7 SLEWLED
PWM CLK PWMC[2:1]: 00 = 8.77kHz,
01 = 4.39kHz, 10 = 2.92kHz, 11 = 2.19kHz
LED SW Slew Rate: 0/1 = Fast/Slow
ADDRESS: 00010010
SUB-ADDRESS: 00000010
FUNCTION
6-Bit Log DAC Code
LED DAC REGISTER
BIT NAME
B0 DAC[0]
B1 DAC[1]
B2 DAC[2]
B3 DAC[3]
B4 DAC[4]
B5 DAC[5]
B6 N/A
Bit A0 indicates the status of the battery charger. A 1
indicates that the charger is enabled and is in the con-
stant-current charge state. In this case the battery is
being charged unless the NTC thermistor is outside its
valid charge range in which case charging is temporarily
suspended but not complete. Charging will continue once
the battery has returned to a valid charging temperature.
A 0 in bit A0 indicates that charger has reached end-of-
Not Used—No Effect On 0peration
Not Used—No Effect On 0peration
B7 N/A
ADDRESS: 00010010
SUB-ADDRESS: 00000011
FUNCTION
PWM DENOMINATOR
LED PWM REGISTER
BIT NAME
charge(h )andisnearV
orthatcharginghasbeen
C/10
FLOAT
B0 PWMDEN[0]
B1 PWMDEN[1]
B2 PWMDEN[2]
B3 PWMDEN[3]
B4 PWMNUM[0]
B5 PWMNUM[1]
B6 PWMNUM[2]
B7 PWMNUM[3]
terminated. Charging can be terminated by reaching the
end of the charge timer or by a battery fault as described
previously.
PWM NUMERATOR
357734fa
42
LTC3577-3/LTC3577-4
OPERATION
PUSHBUTTON INTERFACE OPERATION
PBSTAT Operation
PBSTAT goes low 50ms after the initial pushbutton ap-
plication (ON low) and will stay low for 50ms minimum.
PBSTAT will go high coincident with ON going high unless
ON goes high before the 50ms minimum low time.
State Diagram/Operation
Figure 13 shows the LTC3577-3/LTC3577-4 pushbutton
statediagram.Uponfirstapplicationofpower(V ,WALL
or BAT) an internal power-on reset (POR) signal places
the pushbutton circuitry into the power-off (POFF) state.
The following events cause the state machine to transition
out of POFF into the power-up (PUP) state:
BUS
Hard Reset and PGOOD Operation
The hard reset event is generated by pressing and holding
the pushbutton (ON input low) for 14 seconds. For a valid
hardreseteventtooccurtheinitialpushbuttonapplication
must start in the PUP or PON state. This avoids causing a
hard reset from occurring if the user hangs on the push-
button during initial power up. If a valid hard reset event
is present then the PGOOD output will transition low for
about 1.8ms to allow the microprocessor to reset. The
hard reset event does not affect the operating state or
regulator operation.
1) ON input low for 50ms (PB50MS)
2) PWR_ON input going high (PWR_ON)
Upon entering the PUP state, the pushbutton circuitry will
sequence up LDO2, Buck1 and Buck2 in that order. The
LED backlight is enabled via I C and does not take part in
the power-up sequence of the pushbutton. One second
after entering the PUP state, the pushbutton circuitry will
transition into the power-on (PON) state. Note that the
PWR_ON input must be brought high before entering the
PON state if the part is to remain in the PON state. Buck3
canbeenabledthroughtheEN3inputoncethepushbutton
is in the PUP or PON states.
2
The PGOOD pin is an open-drain output used to indicate
thatBuck1,Buck2andLDO1areenabledandhavereached
their final regulation voltage. A 230ms delay is included
from the time Buck1, Buck2 and LDO1 reach 92% of their
regulationvaluetoallowasystemcontrollerampletimeto
reset itself. PGOOD is an open-drain output and requires a
pull-up resistor to an appropriate power source. Optimally
the pull-up resistor is connected to the output of Buck1,
Buck2 or LDO2 so that power is not dissipated while the
regulators are disabled.
PWR_ON going low, or V
dropping to its undervoltage
OUT
lockout(V UVLO)thresholdwillcausethestatemachine
OUT
to leave the PON state and enter the power-down (PDN)
2
state. The PDN state resets the I C registers effectively
shutting down the LED backlight as well as disabling
Buck1, Buck2 and LDO2 together. Buck3 is also disabled
in the PDN and POFF states. The one second delay before
leavingthepower-downstateallowsthesuppliestopower
down completely before they can be re-enabled.
Pushbutton Operation and V
UVLO
OUT
As stated earlier V
dropping to its UVLO threshold will
OUT
causethepushbuttontoleavethepower-onstateandenter
thepower-downstate,thuspoweringdownBuck1,Buck2,
Buck3, LDO2 and the LED backlight. Additionally, LDO1 is
disabled when in UVLO. Thus, all LTC3577-3/LTC3577-4
supplies are disabled and remain disabled as long as the
PUP
PB50ms +
PWR_ON
1SEC
V
OUT
UVLO condition exists. It is not possible to power
POR
POFF
PON
up any of the LTC3577-3/LTC3577-4 generated supplies
while V is below the V UVLO threshold.
OUT
OUT
UVLO +
1SEC
PWR_ON
PDN
35773 F13
Figure 13. Pushbutton State Diagram
357734fa
43
LTC3577-3/LTC3577-4
OPERATION
Power-Up via Pushbutton Timing
Power-Up via PWR_ON Timing
The timing diagram, Figure 14, shows the LTC3577-3/
LTC3577-4poweringupthroughapplicationoftheexternal
pushbutton. For this example the pushbutton circuitry
The timing diagram, Figure 15, shows the LTC3577-3/
LTC3577-4 powering up by driving PWR_ON high. For
this example the pushbutton circuitry starts in the POFF
starts in the POFF state with V
not in UVLO and Buck1,
state with V
not in UVLO and Buck1, Buck2 and LDO2
OUT
OUT
Buck2 and LDO2 disabled. Pushbutton application (ON
low) for 50ms transitions the pushbutton circuitry into the
PUP state which sequences up LDO2, Buck1 and Buck2
in that order. PWR_ON must be driven high before the 1
secondPUPperiodisovertokeepsuppliesup.IfPWR_ON
is low or goes low after the 1 second PUP period Buck1,
Buck2, and LDO2 will be shut down together. PGOOD is
asserted once Buck1, Buck2 and LDO1 are within 8% of
their regulation voltage for 230ms.
disabled. 50ms after PWR_ON goes high the pushbutton
circuitry transitions into the PUP state which sequences
up LDO2, Buck1 and Buck2 in that order. PWR_ON must
be driven high before the 1 second PUP period is over
to keep supplies up. If PWR_ON is low or goes low after
the 1 second PUP period Buck1, Buck2 and LDO2 will
be shut down together. PGOOD is asserted once Buck1,
Buck2 and LD01 are within 8% of their regulation voltage
for 230ms.
Buck3 and LED backlight can be enabled and disabled at
Buck3 and LED backlight can be enabled and disabled at
2
2
any time via EN3 or I C once in the PUP or PON states.
any time via EN3 or I C once in the PUP or PON states.
The PWR_ON input can be driven via a ꢁP/ꢁC or by one of
the sequenced outputs through a high impedance (100kΩ
typ). PBSTAT goes low 50ms after the initial pushbutton
application and will stay low for 50ms minimum. PBSTAT
willgohigh coincidentwithON goinghigh unlessONgoes
high before the 50ms minimum low time.
Powering up via PWR_ON is useful for applications
containing an always on microcontroller. This allows the
microcontroller to power the application up and down
for house keeping and other activities outside the user’s
control.
V
UVLO
OUT
V
UVLO
OUT
ON (PB)
PBSTAT
LDO2
ON (PB)
50ms
PBSTAT
1 SEC
PWR_ON
LDO2
14ms
50ms
14ms
BUCK1
BUCK2
PGOOD
BUCK1
BUCK2
230ms
1 SEC
230ms
PWR_ON
STATE
PGOOD
STATE
35773 F15
POFF
PUP
PON
35773 F14
POFF
PUP
PON
Figure 14. Power-Up via Pushbutton
Figure 15. Power-Up via PWR_ON
357734fa
44
LTC3577-3/LTC3577-4
OPERATION
Power Down via Pushbutton Timing
V
OUT
UVLO Power-Down Timing
The timing diagram, Figure 16, shows the LTC3577-3/
LTC3577-4 powering down by ꢁC/ꢁP control. For this ex-
amplethepushbuttoncircuitrystartsinthePONstatewith
If V
drops below the V
UVLO threshold, the push-
OUT
OUT
button circuitry will transition from the PON state to the
PDN state. Buck1, Buck2 and LDO2 are disabled together
upon entering the PDN state. After entering the PDN state,
a 1 second wait time is initiated before entering the POFF
state. During this 1 second time ON and PWR_ON inputs
are ignored to allow all LTC3577-3/LTC3577-4 generated
supplies to go low.
V
not in UVLO and Buck1, Buck2 and LDO2 enabled.
OUT
In this case the pushbutton is applied (ON low) for at least
50ms, which generates a low impedance on the PBSTAT
output. After receiving the PBSTAT the ꢁC/ꢁP will drive
the PWR_ON input low. 50ms after PWR_ON goes low
the pushbutton circuitry will enter the PDN state. Buck1,
Buck2 and LDO2 are disabled together upon entering the
PDN state. After entering the PDN state, a 1 second wait
time is initiated before entering the POFF state. During
this 1 second time ON and PWR_ON inputs are ignored
to allow all LTC3577-3/LTC3577-4 generated supplies to
go low.
Upon entering the PDN state the Buck3 is disabled and
LEDbacklightI Cregistersareclearedeffectivelydisabling
the backlight. LDO1 is also disabled by the V
and stays disabled as long as the V
remains. Note that it is not possible to sequence any of
the supplies up while the V UVLO condition exists.
LDO1 will be re-enabled when the V
2
UVLO
OUT
UVLO condition
OUT
OUT
UVLO condition
OUT
Upon entering the PDN state Buck3 is disabled and LED
is removed. The other supplies will remain disabled until
a valid power-up pushbutton event takes place.
2
backlight I C registers are cleared effectively disabling the
2
backlight. The LED backlight can be disabled via I C prior
to entering the PDN state if desired.
V
UVLO
OUT
1 SEC
Holding ON low through the 1 second power-down period
will not cause a power-up event at end of the 1second
period. The ON input must be brought high following the
power-down event and then go low again to establish a
valid power-up event.
ON (PB)
LDO1
PBSTAT
PWR_ON
BUCK1
BUCK2
LDO2
V
UVLO
OUT
1 SEC
ON (PB)
50ms
PBSTAT
PWR_ON
BUCK1
BUCK2
LDO2
μC/μP CONTROL
50ms
PGOOD
STATE
35773 F17
PON
PDN
POFF
Figure 17. VOUT UVLO Power Down
PGOOD
STATE
PON
PDN
POFF
35773 F16
Figure 16. Power Down via Pushbutton
357734fa
45
LTC3577-3/LTC3577-4
OPERATION
Hard Reset Timing
Power-Up Sequencing
Hard reset provides a way to reset the ꢁC/ꢁP in case of a
software lockup. To initiate a hard reset, the pushbutton
is pressed (ON low) and held for greater than 14 seconds.
Once the hard reset time is exceeded the PGOOD input
will go low for 1.8ms which resets the ꢁC/ꢁP. Operation
of the enabled supplies is not effected by the hard reset
event. All enabled supplies should remain in regulation
and operating correctly assuming specified operating
conditions are met (i.e., no shorted supplies, etc).
Figure 19 shows the actual power-up sequencing of the
LTC3577-3/LTC3577-4.Buck1,Buck2andLDO2areallini-
tiallydisabled(0V). Oncethepushbuttonhasbeenapplied
(ONlow)for50msPBSTATgoeslowandLDO2isenabled.
Once enabled, LDO2 slews up and enters regulation. The
actual slew rate is controlled by the soft-start function of
LDO2 which ramps the LDO reference up over a 200μs
period typically. After a 14ms delay from LDO2 being
enabled, Buck1 is enabled and slews up into regulation.
When Buck1 is within about 8% of final regulation, Buck2
is enabled and slews up into regulation. The bucks also
have a soft-start function to limit inrush current at start-
up. 230ms after Buck2 is within 8% of final regulation,
the PGOOD output will go high impedance (not shown in
Figure 19).TheregulatorsinFigure 19areslewingupwith
nominal output capacitors and no load. Adding a load or
increasing output capacitance on any of the outputs will
reduce the slew rate and lengthen the time it takes the
regulator to get into regulation.
ThereareonlytwomethodstopowerdowntheLTC3577-3/
LTC3577-4 supplies: 1) PWR_ON goes low; 2) V
drops
OUT
below the V
UVLO threshold. If the ꢁC/ꢁP controls
OUT
shutdown by bringing PWR_ON low, it is possible that
the application can hang with all supplies enabled if the
ꢁC/ꢁP fails to reset correctly on hard reset. In this case
the battery will continue to be drained until V
drops
OUT
below the V
UVLO threshold, or the user intervenes to
OUT
shut down the application manually. The application can
be shut down manually by removing the battery and any
external supplies, or by providing a suicide button that
will bring PWR_ON low when pressed.
1
PBSTAT
0
V
UVLO
OUT
>14 SEC
LDO2
1V/DIV
ON (PB)
50ms
0V
PBSTAT
PWR_ON
BUCK1
BUCK1
1V/DIV
0V
BUCK2
2V/DIV
BUCK2
LDO1
0V
35773 F19
2ms/DIV
14 SEC
1.8ms
Figure 19. Power-Up Sequencing
35773 F18
PGOOD
STATE PON
Figure 18. Hard Reset Timing
357734fa
46
LTC3577-3/LTC3577-4
OPERATION
LAYOUT AND THERMAL CONSIDERATIONS
where LDOx is the programmed output voltage, VI
NLDOx
is the LDO supply voltage and I
is the LDO output
LDOx
Printed Circuit Board Power Dissipation
load current. Note that if the LDO supply is connected to
one of the buck output, then its supply current must be
added to the buck regulator load current for calculating
the buck power loss.
In order to be able to deliver maximum charge current
under all conditions, it is critical that the exposed ground
pad on the backside of the LTC3577-3/LTC3577-4 pack-
age be soldered to a ground plane on the board. Correctly
The power dissipated by the LED boost regulator can be
estimated as follows:
2
solderedto2500mm groundplaneonadouble-sided1oz
copper board the LTC3577-3/LTC3577-4 have a thermal
2
resistance (θ ) of approximately 45°C/W. Failure to make
⎛
⎜
⎝
⎞
⎟
BOOST
VOUT – 1
JA
PDLED = ILED • 0.3V +RNSWON • ILED
•
good thermal contact between the Exposed Pad on the
backside of the package and a adequately sized ground
plane will result in thermal resistances far greater than
45°C/W.
⎠
where BOOST is the output voltage driving the top of
the LED string, R is the on-resistance of the SW
NSWON
N-FET (typically 330mΩ), I
is the LED programmed
LED
The conditions that cause the LTC3577-3/LTC3577-4
to reduce charge current due to the thermal protection
feedback can be approximated by considering the power
dissipated in the part. For high charge currents with a wall
current sink.
Thus the power dissipated by all regulators is:
= P + P + P + P + P
P
+ P
DLED
DREGS
DSW1
DSW2
DSW3
DLDO1
DLDO2
adapterappliedtoV , theLTC3577-3/LTC3577-4power
OUT
It is not necessary to perform any worst-case power dis-
sipationscenariosbecausetheLTC3577-3/LTC3577-4will
automatically reduce the charge current to maintain the
die temperature at approximately 110°C. However, the
approximate ambient temperature at which the thermal
feedback begins to protect the IC is:
dissipation is approximately:
P = (V
– BAT) • I + P
BAT DREGS
D
OUT
where P is the total power dissipated, V
is the supply
D
OUT
BAT
voltage, BAT is the battery voltage and I is the battery
charge current. P
is the sum of power dissipated
DREGS
on-chip by the step-down switching, LDO and LED boost
T = 110°C – P • θ
JA
A
D
regulators.
Example: Consider the LTC3577-3/LTC3577-4 operating
from a wall adapter with 5V (V ) providing 1A (I ) to
The power dissipated by a step-down switching regulator
can be estimated as follows:
OUT
BAT
chargeaLi-Ionbatteryat3.3V(BAT). AlsoassumeP
= 0.3W, so the total power dissipation is:
DREGS
100 –Eff
P
= OUTx •I
(
•
)
D(SWx)
OUTx
100
P = (5V – 3.3V) • 1A + 0.3W = 2W
D
The ambient temperature above which the LTC3577-3/
LTC3577-4 will begin to reduce the 1A charge current, is
approximately
where OUTx is the programmed output voltage, I
OUTx
is the load current and Eff is the % efficiency which can
be measured or looked up on an efficiency table for the
programmed output voltage.
T = 110°C – 2W • 45°C/W = 20°C
A
The power dissipated on chip by a LDO regulator can be
estimated as follows:
P
= (V
– LDOx) • I
INLDOx LDOx
DLDOx
357734fa
47
LTC3577-3/LTC3577-4
OPERATION
ACcurrenttotheinternalpowerMOSFETsandtheirdriv-
ers. It’s important to minimizing inductance from these
capacitors to the pins of the LTC3577-3/LTC3577-4.
The LTC3577-3/LTC3577-4 can be used above 20°C, but
the charge current will be reduced below 1A. The charge
current at a given ambient temperature can be approxi-
mated by:
Connect V
and V to V
through a short low
IN12
IN3
OUT
impedance trace.
110°C – TA
P =
= V
–BAT •IBAT +P
(
)
D
OUT
D(REGS)
3. TheswitchingpowertracesconnectingSW1,SW2,and
SW3 to their respective inductors should be minimized
to reduce radiated EMI and parasitic coupling. Due to
thelargevoltageswingoftheswitchingnodes,sensitive
nodes such as the feedback nodes (FBx, LDOx_FB and
LED_OV) should be kept far away or shielded from the
switching nodes or poor performance could result.
θJA
Thus:
110°C – T
(
)
A
θJA –P
D(REGS)
IBAT
=
VOUT –BAT
4. Connectionsbetweenthestep-downswitchingregulator
inductorsandtheirrespectiveoutputcapacitorsshould
be kept should be kept as short as possible. The GND
side of the output capacitors should connect directly
to the thermal ground plane of the part.
Consider the above example with an ambient temperature
of 55°C. The charge current will be reduced to approxi-
mately:
110°C – 55°C
– 0.3W
45°C/W
5. Keep the buck feedback pin traces (FB1, FB2, and FB3)
asshortaspossible.Minimizeanyparasiticcapacitance
between the feedback traces and any switching node
(i.e. SW1, SW2, SW3, and logic signals). If necessary
shield the feedback nodes with a GND trace.
IBAT
IBAT
=
=
5V – 3.3V
1.22 – 0.3W
= 542mA
1.7V
6. ConnectionsbetweentheLTC3577-3/LTC3577-4power
Printed Circuit Board Layout
path pins (V
and V ) and their respective decou-
BUS
OUT
When laying out the printed circuit board, the following
list should be followed to ensure proper operation of the
LTC3577-3/LTC3577-4:
plingcapacitorsshouldbekeptasshortaspossible.The
GND side of these capacitors should connect directly
to the ground plane of the part.
1. TheExposedPadofthepackage(Pin45)shouldconnect
directlytoalargegroundplanetominimizethermaland
electrical impedance.
7. The boost converter switching power trace connect-
ing SW to the inductor should be minimized to reduce
radiated EMI and parasitic coupling. Due to the large
voltage swing of the SW node, sensitive nodes such
as the feedback nodes (FBx, LDOx_FB and LED_OV)
should be kept far away or shielded from this switching
node or poor performance could result.
2. The step-down switching regulator input supply pins
(V
and V ) and their respective decoupling ca-
IN12
IN3
pacitors should be kept as short as possible. The GND
side of these capacitors should connect directly to the
ground plane of the part. These capacitors provide the
357734fa
48
LTC3577-3/LTC3577-4
TYPICAL APPLICATION
5V WALL
ADAPTER
Si2333DS
4
41
WALL ACPR
V
OUT
13
30
27
39
SYSTEM
LOAD
OVGATE
V
V
INLDO2
INLDO1
8
10μF
2.2μF
2.2μF
OVSENSE
V
OUT
40
32
6
USB
V
BUS
V
IN12
1k
10μF
2k
LTC3577-3/
LTC3577-4
V
IN3
44
37
CHRG
36
43
Si2333DS
(OPT)
PROG
IDGATE
38
2.1k
BAT
BAT
+
100k
CLPROG
34
35
Li-Ion
NTCBIAS
NTC
10
11
12
20μF
100k
NTC
DV
DV
CC
SDA
SCL
CC
10μH
SDA
SCL
ZLLS400
V
BOOST
18,19,20
SW
499k 499k 499k
μC/μP
1μF
50V
10M
9
42
16
14
LED_OV
EXTPWR
PBSTAT
EXTPWR
PBSTAT
22nF
50V
10-LED BACKLIGHT
22
I
LED
PWR_ON
PWR_ON
20k
3
LED_FS
KILL
4.7μH
17
1
V
OUT1
33
26
EN3
EN3
SW1
FB1
1.8V
I
I
I
I
LIM0
LIM1
LIM0
LIM1
500mA
10pF
806k
10μF
649k
2
RST
PUSHBUTTON
15
ON
4.7μH
3.3μH
V
V
LDO1
3.3V
OUT2
31
28
LDO1
SW2
3.3V
150mA
500mA
1μF
1μF
1.02M
348k
10pF
10pF
1.02M
232k
10μF
324k
324k
464k
23
29
25
5
LDO1_FB
LDO2
FB2
V
1.2V
800mA
V
OUT3
LDO2
SW3
1.4V
150mA
10μF
464k
7
24
LDO2_FB
FB3
21
PGOOD
GND
45
100k
35773 TA02
357734fa
49
LTC3577-3/LTC3577-4
TYPICAL APPLICATION
Si2333DS
Si2306BDS
5V WALL
ADAPTER
D3
5.6V
Si2333DS
4
41
R1
WALL ACPR
500k
V
OUT
SYSTEM
LOAD
13
8
30
39
OVGATE
V
INLDO1
6.2k
10μF
2.2μF
2.2μF
OVSENSE
OPTIONAL OVERVOLTAGE/
REVERSE VOLTAGE PROTECTION
V
OUT
40
32
6
USB
V
BUS
V
IN12
1k
LTC3577-3/
LTC3577-4
10μF
V
IN3
44
37
2k
CHRG
36
43
Si2333DS
(OPT)
PROG
IDGATE
38
2.1k
BAT
BAT
+
100k
CLPROG
34
35
Li-Ion
NTCBIAS
NTC
10
11
12
20μF
100k
NTC
DV
DV
CC
SDA
SCL
CC
10μH
SDA
SCL
ZLLS400
V
BOOST
18,19,20
SW
499k 499k 499k
μC/μP
1μF
50V
6M
9
42
16
14
LED_OV
EXTPWR
PBSTAT
EXTPWR
PBSTAT
22nF
50V
6-LED BACKLIGHT
22
I
LED
PWR_ON
PWR_ON
20k
3
LED_FS
KILL
4.7μH
17
1
V
OUT1
33
26
EN3
EN3
SW1
FB1
3.3V
I
I
I
I
LIM0
LIM1
LIM0
LIM1
500mA
10pF
1.02M
10μF
2
324k
RST
PUSHBUTTON
15
30
31
V
ON
INLDO2
4.7μH
3.3μH
V
V
1.8V
500mA
LDO1
2.5V
150mA
OUT2
28
LDO1
SW2
1μF
1μF
1.00M
115k
10pF
10pF
806k
402k
10μF
10μF
470k
464k
649k
649k
23
29
25
5
LDO1_FB
LDO2
FB2
V
1.3V
800mA
V
OUT3
LDO2
SW3
1.0V
150mA
7
24
LDO2_FB
FB3
21
PGOOD
GND
45
100k
35773 TA03
357734fa
50
LTC3577-3/LTC3577-4
PACKAGE DESCRIPTION
UFF Package
Variation: UFFMA
44-Lead Plastic QFN (4mm × 7mm)
(Reference LTC DWG # 05-08-1762 Rev Ø)
1.48 0.05
0.70 0.05
0.98 0.05
1.70 0.05
2.56 0.05
4.50 0.05
3.10 0.05
2.40 REF
2.02 0.05
2.76 0.05
2.64 0.05
PACKAGE
OUTLINE
0.20 0.05
5.60 REF
0.40 BSC
6.10 0.05
7.50 0.05
RECOMMENDED SOLDER PAD LAYOUT
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 s 45o
CHAMFER
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.75 p0.05
2.40 REF
4.00 p0.10
43
44
0.00 – 0.05
0.40 p0.10
1
2
PIN 1
TOP MARK
(SEE NOTE 6)
2.64
0.10
2.56
0.10
7.00 p0.10
5.60 REF
R = 0.10
TYP
1.70
0.10
2.76
0.10
0.74 0.10
R = 0.10 TYP
0.74 0.10
(UFF44MA) QFN REF Ø 1107
R = 0.10 TYP
0.200 REF
0.20 p0.05
0.40 BSC
0.98 0.10
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
3. ALL DIMENSIONS ARE IN MILLIMETERS
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
357734fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
51
LTC3577-3/LTC3577-4
RELATED PARTS
PART NUMBER DESCRIPTION
COMMENTS
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Synchronous Buck Efficiency: >95%, ADJ Outputs: 0.8V to 3.6V at 400mA/400mA/600mA
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Multifunction PMIC: Switchmode Power Manager and 1A Buck-Boost Regulator + LDO,
Charge Current Programmable Up to 1.5A from Wall Adapter Input, Thermal Regulation
Synchronous Buck-Boost Converters Efficiency: >95%, ADJ Output: Down to 0.8V at 1A,
Bat-Track Adaptive Output Control, 180mꢀ Ideal Diode, 4mm × 4mm QFN24 Package
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Switching USB Power Manager with
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Multifunction PMIC: Switchmode Power Manager and 1A Buck-Boost + LDO, I C Interface,
Charge Current Programmable up to 1.5A from Wall Adapter Input, Thermal Regulation
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Bat-Track Adaptive Output Control, 180mꢀ Ideal Diode, 4mm x 4mm QFN24 Package
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LTC3577/
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Highly Integrated Protable/Navigation
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Complete Multifunction PMIC: Linear Power Manager and Three Buck Regulators,
Charge Current Programmable up to 1.5A from Wall Adapter Input, Thermal Regulation,
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2
500mA/500mA, Pushbutton Control, I C Interface, 2× 150mA LDOs, Overvoltage
Protection Bat-Track Adaptive Output Control, 200mꢀ Ideal Diode, 4mm × 7mm QFN44
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USB Power Manager with Ideal Diode
Controller and Li-Ion Charger
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Battery Charger with Regulated Output
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Reduction Maintains 3.6V Minimum Vout, Battery charger disabled when all logic inputs
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LTC4088-2
LTC4098
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Battery Charger with Regulated Output
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USB-Compatible Switchmode Power
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High V : 38V operating, 60V transient; 66V OVP. Maximizes Available Power from USB
IN
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Charge Current from USB, 180mꢀ Ideal Diode with <50mꢀ option; 3mm x 4mm ultra-thin
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Hot Swap is a trademark of Linear Technology Corporation.
357734fa
LT 0709 REV A • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
52
●
●
© LINEAR TECHNOLOGY CORPORATION 2009
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
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Linear
![](http://pdffile.icpdf.com/pdf2/p00296/img/page/LTC3577EUFF-_1791201_files/LTC3577EUFF-_1791201_1.jpg)
![](http://pdffile.icpdf.com/pdf2/p00296/img/page/LTC3577EUFF-_1791201_files/LTC3577EUFF-_1791201_2.jpg)
LTC3577EUFF#TRPBF
LTC3577 and -1 - Highly Integrated 6-Channel Portable PMIC; Package: QFN; Pins: 44; Temperature Range: -40°C to 85°C
Linear
![](http://pdffile.icpdf.com/pdf2/p00296/img/page/LTC3577EUFF-_1791201_files/LTC3577EUFF-_1791201_1.jpg)
![](http://pdffile.icpdf.com/pdf2/p00296/img/page/LTC3577EUFF-_1791201_files/LTC3577EUFF-_1791201_2.jpg)
LTC3577EUFF-1#PBF
LTC3577 and -1 - Highly Integrated 6-Channel Portable PMIC; Package: QFN; Pins: 44; Temperature Range: -40°C to 85°C
Linear
![](http://pdffile.icpdf.com/pdf2/p00294/img/page/LTC3577EUFF-_1783690_files/LTC3577EUFF-_1783690_1.jpg)
![](http://pdffile.icpdf.com/pdf2/p00294/img/page/LTC3577EUFF-_1783690_files/LTC3577EUFF-_1783690_2.jpg)
LTC3577EUFF-3#PBF
LTC3577-3 and -4 - Highly Integrated Portable Product PMIC; Package: QFN; Pins: 44; Temperature Range: -40°C to 85°C
Linear
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