LTC3851EUD#PBF [Linear]
LTC3851 - Synchronous Step-Down Switching Regulator Controller; Package: QFN; Pins: 16; Temperature Range: -40°C to 85°C;型号: | LTC3851EUD#PBF |
厂家: | Linear |
描述: | LTC3851 - Synchronous Step-Down Switching Regulator Controller; Package: QFN; Pins: 16; Temperature Range: -40°C to 85°C 开关 控制器 |
文件: | 总28页 (文件大小:321K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC3851
Synchronous
Step-Down Switching
Regulator Controller
FEATURES
DESCRIPTION
The LTC®3851 is a high performance synchronous
step-down switching regulator controller that drives
an all N-channel synchronous power MOSFET stage. A
constant frequency current mode architecture allows a
phase-lockable frequency of up to 750kHz.
n
Wide V Range: 4V to 38V Operation
SENSE
±±1 Output Voltage Accuracy
IN
n
R
or DCR Current Sensing
n
n
n
n
n
n
n
n
n
n
Phase-Lockable Fixed Frequency: 250kHz to 750kHz
Dual N-Channel MOSFET Synchronous Drive
Very Low Dropout Operation: 99% Duty Cycle
Adjustable Output Voltage Soft-Start or Tracking
Output Current Foldback Limiting
OPTI-LOOP compensation allows the transient response
to be optimized over a wide range of output capacitance
and ESR values. The LTC3851 features a precision 0.8V
reference that is compatible with a wide 4V to 38V input
supply range.
Output Overvoltage Protection
5V Internal Regulator
OPTI-LOOP® Compensation Minimizes C
OUT
The TK/SS pin ramps the output voltage during start-up.
Current foldback limits MOSFET heat dissipation during
short-circuit conditions. The MODE/PLLIN pin selects
among Burst Mode operation, pulse skipping mode or
continuousinductorcurrentmodeatlightloadsandallows
the IC to be synchronized to an external clock.
Selectable Continuous, Pulse-Skipping or
Burst Mode® Operation at Light Loads
n
n
n
Low Shutdown I : 20μA
Q
V
Range: 0.8V to 5.5V
OUT
16-Lead Narrow SSOP or 3mm × 3mm QFN Package
APPLICATIONS
, LT, LTC, LTM, Burst Mode and OPTI-LOOP are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
Protected by U.S. Patents, including 5408150, 5481178, 5705919, 5929620, 6304066,
6498466, 6580258, 6611131.
n
Automotive Systems
n
Telecom Systems
n
Industrial Equipment
Distributed DC Power Systems
n
TYPICAL APPLICATION
High Efficiency Synchronous Step-Down Converter
Efficiency and Power Loss
vs Load Current
V
IN
I
V
LIM
IN
100
95
10000
1000
100
4V TO 38V
150μF
V
V
= 12V
IN
OUT
FREQ/PLLFLTR TG
= 3.3V
0.68μH
10k
V
3.3V
10A
OUT
RUN
SW
90
EFFICIENCY
LTC3851
0.22μF
85
TK/SS
BOOST
330μF
0.1μF
80
75
INTV
CC
10nF
1k
POWER LOSS
70
65
60
55
50
BG
I
TH
GND
100pF
+
SENSE
PLLIN/MODE
SENSE
0.22μF
13k
–
62.5k
20k
10
10000
10
100
1000
V
FB
LOAD CURRENT (mA)
3851TA01b
3851 TA01a
3851f
1
LTC3851
ABSOLUTE MAXIMUM RATINGS (Note ±)
Input Supply Voltage (V )......................... 40V to –0.3V
INTV Peak Output Current ..................................50mA
IN
CC
Topside Driver Voltage (BOOST) ................ 46V to –0.3V
Operating Temperature Range (Note 2).... –40°C to 85°C
Junction Temperature (Note 3) ............................. 125°C
Storage Temperature Range
Switch Voltage (SW)..................................... 40V to –5V
INTV , (BOOST – SW), RUN ...................... 6V to –0.3V
CC
TK/SS, I ............................................ INTV to –0.3V
GN ..................................................... –65°C to 150°C
UD .........................................................–65 to 125°C
Lead Temperature (Soldering, 10 sec)
LIM
CC
+
–
SENSE , SENSE .......................................... 6V to –0.3V
MODE/PLLIN, FREQ/PLLFLTR............... INTV to –0.3V
CC
I , V Voltages.......................................... 3V to –0.3V
GN .................................................................... 300°C
TH FB
PIN CONFIGURATION
TOP VIEW
TOP VIEW
MODE/PLLIN
FREQ/PLLFLTR
RUN
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SW
TG
16 15 14 13
BOOST
RUN
1
2
3
4
12 BOOST
TK/SS
V
IN
TK/SS
11
10
9
V
IN
17
I
INTV
CC
TH
I
TH
INTV
BG
CC
FB
BG
FB
–
SENSE
GND
5
6
7
8
+
SENSE
I
LIM
GN PACKAGE
16-LEAD PLASTIC SSOP NARROW
UD PACKAGE
16-LEAD (3mm s 3mm) PLASTIC QFN
T
JMAX
= 125°C, θ = 90°C/W
JA
T
= 125°C, θ = 68°C/W, θ = 4.2°C/W
JA JC
JMAX
EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
LTC3851EGN#PBF
LTC3851EUD#PBF
TAPE AND REEL
PART MARKING
3851
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3851EGN#TRPBF
LTC3851EUD#TRPBF
16-Lead Plastic SSOP
–40°C to 85°C
–40°C to 85°C
LCXN
16-Lead (3mm × 3mm) Plastic QFN
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
3851f
2
LTC3851
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = ±5V, VRUN = 5V unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Main Control Loops
l
l
V
V
Operating Input Voltage Range
Regulated Feedback Voltage
Feedback Current
4
38
0.808
–50
V
V
IN
I
= 1.2V (Note 4)
0.792
0.800
–10
FB
TH
I
FB
(Note 4)
= 6V to 38V (Note 4)
nA
V
V
Reference Voltage Line Regulation
Output Voltage Load Regulation
V
0.002
0.02
%/V
REFLNREG
LOADREG
IN
(Note 4)
l
l
Measured in Servo Loop,
0.01
0.1
%
%
ΔI = 1.2V to 0.7V
TH
(Note 4)
Measured in Servo Loop,
–0.01
–0.1
ΔI = 1.2V to 1.6V
TH
g
g
Transconductance Amplifier g
I
TH
I
TH
= 1.2V, Sink/Source = 5μA (Note 4)
= 1.2V
2
3
mmho
MHz
m
m
GBW
Transconductance Amp Gain Bandwidth
m
I
Q
Input DC Supply Current
Normal Mode
Shutdown
(Note 5)
OUT
RUN
V
V
= 5V
= 0V
1.2
20
mA
μA
35
UVLO
Undervoltage Lockout on INTV
UVLO Hysteresis
V
Ramping Down
INTVCC
3.25
0.4
0.88
1
V
V
CC
UVLO Hys
l
l
V
Feedback Overvoltage Lockout
SENSE Pins Total Current
Soft-Start Charge Current
RUN Pin On Threshold
Measured at V
0.86
0.90
2
V
OVL
FB
I
I
μA
μA
V
SENSE
TK/SS
V
TK/SS
= 0V
0.6
1
2
V
V
V
V
Rising
1.10
1.22
130
1.35
RUN
RUN
RUN Pin On Hysteresis
mV
RUNHYS
SENSE(MAX)
l
l
l
Maximum Current Sense Threshold
V
V
V
= 0.7V, V
= 0.7V, V
= 0.7V, V
= 3.3V, I = 0V
20
40
65
30
50
75
40
65
90
mV
mV
mV
FB
FB
FB
SENSE
SENSE
SENSE
LIM
LIM
LIM
= 3.3V, I = Float
= 3.3V, I = INTV
CC
TG R
TG R
BG R
BG R
TG Driver Pull-Up On-Resistance
TG Driver Pull-Down On-Resistance
BG Driver Pull-Up On-Resistance
BG Driver Pull-Down On-Resistance
TG High
TG Low
BG High
BG Low
(Note 6)
2.6
1.5
2.4
1.1
Ω
Ω
Ω
Ω
UP
DOWN
UP
DOWN
TG Transition Time
Rise Time
Fall Time
TG t
TG t
C
C
= 3300pF
25
25
ns
ns
r
f
LOAD
LOAD
= 3300pF
BG Transition Time
Rise Time
Fall Time
(Note 6)
LOAD
LOAD
BG tr
BG tf
C
C
= 3300pF
= 3300pF
25
25
ns
ns
TG/BG t
Top Gate Off to Bottom Gate On Delay
Synchronous Switch-On Delay Time
C
= 3300pF Each Driver
30
30
90
ns
ns
ns
1D
2D
LOAD
BG/TG t
Bottom Gate Off to Top Gate On Delay
Top Switch-On Delay Time
C
= 3300pF Each Driver
LOAD
t
Minimum On-Time
(Note 7)
ON(MIN)
INTV Linear Regulator
CC
V
V
Internal V Voltage
6V < V < 38V
4.8
5
5.2
2
V
INTVCC
CC
IN
INT
INTV Load Regulation
I = 0mA to 50mA
CC
0.5
%
LDO
CC
3851f
3
LTC3851
ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = ±5V, VRUN = 5V unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Oscillator and Phase-Locked Loop
f
f
f
Nominal Frequency
R
R
R
= 60k
= 160k
= 36k
480
220
710
500
250
750
100
530
280
790
kHz
kHz
kHz
kΩ
NOM
LOW
HIGH
FREQ
FREQ
FREQ
Lowest Frequency
Highest Frequency
R
MODE/PLLIN Input Resistance
MODE/PLLIN
FREQ
I
Phase Detector Output Current
Sinking Capability
Sourcing Capability
f
f
> f
< f
–10
10
μA
μA
MODE
MODE
OSC
OSC
Note ±: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 4: The LTC3851 is tested in a feedback loop that servos V to a
ITH
specified voltage and measures the resultant V
.
FB
Note 5: Dynamic supply current is higher due to the gate charge being
delivered at the switching frequency. See Applications Information.
Note 2: The LTC3851E is guaranteed to meet performance specifications
from 0°C to 85°C. Specifications over the –40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 6: Rise and fall times are measured using 10% and 90% levels. Delay
times are measured using 50% levels.
Note 7: The minimum on-time condition is specified for an inductor
peak-to-peak ripple current ~40% of I
(see Minimum On-Time
MAX
Note 3: T is calculated from the ambient temperature T and power
J
A
Considerations in the Applications Information section).
dissipation P according to the following formulas:
D
LTC3851EGN: T = T + (P • 90°C/W)
J
A
D
LTC3851EUD: T = T + (P • 68°C/W)
J
A
D
TYPICAL PERFORMANCE CHARACTERISTICS
Efficiency vs Output Current and
Mode (Figure TBD)
Efficiency vs Output Current
and Mode
Efficiency vs Output Current and
Mode (Figure TBD)
100
90
100
90
100
90
V
V
= 12V
= 5V
V
V
= 12V
IN
OUT
IN
OUT
= 1.2V
80
80
80
BURST
BURST
70
70
70
BURST
PULSE
SKIP
60
50
60
50
60
50
PULSE
SKIP
PULSE
SKIP
CCM
40
30
20
10
0
40
30
20
10
0
40
30
20
10
0
CCM
CCM
V
V
= 12V
IN
OUT
= 3.3V
FIGURE 11 CIRCUIT
1000 10000
LOAD CURRENT (mA)
10
100
10
100
1000
10000
10
100
1000
10000
LOAD CURRENT (mA)
LOAD CURRENT (mA)
3851 G02
3851 G03
3851 G01
3851f
4
LTC3851
TYPICAL PERFORMANCE CHARACTERISTICS
Load Step
(Burst Mode Operation)
Load Step
(Forced Continuous Mode)
Efficiency and Power Loss vs
Input Voltage
100
95
10000
1000
100
V
V
= 12V
I
I
IN
OUT
LOAD
LOAD
= 3.3V
5A/DIV
5A/DIV
POWER LOSS,
= 5A
FIGURE 11 CIRCUIT
0.2A TO 7.5A
0.2A TO 7.5A
I
OUT
I
L
I
L
90
5A/DIV
EFFICIENCY,
= 5A
5A/DIV
I
OUT
85
80
V
V
OUT
OUT
100mV/DIV
100mV/DIV
AC COUPLED
AC COUPLED
POWER LOSS,
= 0.5A
I
OUT
3851 G05
3851 G06
V
V
= 1.5V
100μs/DIV
V
V
= 1.5V
100μs/DIV
OUT
IN
OUT
IN
EFFICIENCY,
= 0.5A
75
70
= 12V
= 12V
I
OUT
FIGURE 11 CIRCUIT
FIGURE 11 CIRCUIT
4
8
12 16 20 24 28 32 36 40
INPUT VOLTAGE (V)
3851 G04
Load Step
(Pulse-Skip Mode)
Start-Up with Prebiased Output
at 2V
Inductor Current at Light Load
I
LOAD
FORCED
CONTINOUS
MODE
5A/DIV
V
OUT
0.2A TO 7.5A
2V/DIV
5A/DIV
TK/SS
0.5V/DIV
I
L
Burst Mode
OPERATION
5A/DIV
5A/DIV
V
FB
V
OUT
0.5V/DIV
PULSE SKIP
MODE
100mV/DIV
AC COUPLED
5A/DIV
3851 G07
3851 G08
3851 G09
V
V
= 1.5V
100μs/DIV
V
V
LOAD
= 1.5V
= 1mA
1μs/DIV
20ms/DIV
OUT
IN
OUT
IN
= 12V
= 12V
FIGURE 11 CIRCUIT
I
FIGURE 11 CIRCUIT
Coincident Tracking with Master
Supply
Ratiometric Tracking with Master
Supply
Input DC Supply Current vs Input
Voltage
3.0
2.5
2.0
1.5
1.0
0.5
0
V
MASTER
V
MASTER
0.5V/DIV
V
OUT
0.5V/DIV
2A LOAD
0.5V/DIV
V
OUT
2A LOAD
0.5V/DIV
3851 G10
3851 G11
10ms/DIV
10ms/DIV
4
8
12 16 20 24 28 32 36 40
INPUT VOLTAGE (V)
3851 G12
3851f
5
LTC3851
TYPICAL PERFORMANCE CHARACTERISTICS
Maximum Current Sense Threshold
vs Common Mode Voltage
Maximum Peak Current Sense
Threshold vs ITH Voltage
INTVCC Line Regulation
90
80
70
60
50
40
30
20
10
0
5.3
5.1
4.9
4.7
4.5
4.3
4.1
3.9
3.7
90
80
70
60
50
40
30
20
10
0
DUTY CYCLE RANGE: 0% TO 100%
I
= 0mA
LOAD
I
= INTV
CC
LIM
I
= INTV
CC
LIM
I
= 25mA
LOAD
I
= FLOAT
I
= FLOAT
LIM
LIM
I
= GND
LIM
I
= GND
LIM
–10
–20
3.5
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
(V)
4
8
12 16 20 24
INPUT VOLTAGE (V)
40
28 32 36
0
0.5
1
1.5
2
2.5
5
3
3.5 4 4.5
V
ITH
V
COMMON MODE VOLTAGE (V)
SENSE
3851 G15
3851 G13
3851 G14
Maximum Current Sense
Threshold vs Feedback Voltage
(Current Foldback)
Burst Mode Peak Current Sense
Threshold vs ITH Voltage
Maximum Current Sense
Threshold vs Duty Cycle
90
80
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
I
= INTV
CC
I
= INTV
CC
MAXIMUIM
LIM
LIM
I
= FLOAT
= GND
I
= FLOAT
= GND
LIM
I
LIM
I
LIM
LIM
MINIMUIM
I
= FLOAT
LIM
BURST COMPARATOR FALLING THESHOLD:
= 0.4V
V
ITH
0
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
(V)
0
0.1
0.4 0.5
FEEDBACK VOLTAGE (V)
0.8
0.2 0.3
0.6 0.7
0
80
100
20
40
60
V
ITH
DUTY CYCLE (%)
3851 G16
3851 G18
3851 G17
TK/SS Pull-Up Current vs
Temperature
Shutdown (RUN) Threshold vs
Temperature
Regulated Feedback Voltage vs
Temperature
1.4
1.3
1.2
1.1
1.0
0.9
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
806
804
802
800
RUN RISING THRESHOLD (ON)
RUN FALLING THRESHOLD (OFF)
798
796
794
–50 –25
0
25
50
75 100 125
–50 –25
0
25
50
75
100 125
–50
0
25
50
75 100 125
–25
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
3851 G20
3851 G21
3851 G19
3851f
6
LTC3851
TYPICAL PERFORMANCE CHARACTERISTICS
Oscillator Frequency vs
Temperature
Oscillator Frequency vs Input
Voltage
Undervoltage Lockout Threshold
(INTVCC) vs Temperature
900
800
420
5
4
3
2
1
0
R
FREQ
= 80k
415
410
R
R
= 36k
= 60k
FREQ
FREQ
INTV RAMPING UP
CC
700
600
500
400
300
405
400
395
390
385
INTV RAMPING DOWN
CC
R
= 150k
50
FREQ
25
200
380
100 125
–50 –25
0
75
10
15
25
30
35
40
5
20
–50 –25
0
25
50
75 100 125
TEMPERATURE (°C)
INPUT VOLTAGE (V)
TEMPERATURE (°C)
3851 G22
3851 G23
3851 G24
Shutdown Input DC Supply
Current vs Input Voltage
Shutdown Input DC Supply
Current vs Temperature
40
40
35
30
25
20
15
10
5
35
30
25
20
15
10
5
0
0
20 25
10 15
INPUT VOLTAGE (V)
–25
0
50
75 100 125
0
5
30 35 40
–50
25
TEMPERATURE (°C)
3851 G25
3851 G26
Input DC Supply Current vs
Temperature
Maximum Current Sense
Threshold vs INTVCC Voltage
3.0
2.5
2.0
1.5
90
80
70
60
50
40
30
20
10
I
= INTV
CC
SET
I
= FLOAT
SET
I
= GND
SET
1.0
0.5
0
0
50
TEMPERATURE (°C)
100 125
–50 –25
0
25
75
3.2 3.4 3.6 3.8 4.0 4.2
5.0
4.4 4.6 4.8
INTV VOLTAGE(V)
CC
3851 G27
38511 G28
3851f
7
LTC3851
PIN FUNCTIONS (GN/UD)
MODE/PLLIN (Pin ±/Pin ±5): Force Continuous Mode,
Burst Mode or Pulse-Skipping Mode Selection Pin and
External Synchronization Input to Phase Detector Pin.
I
(Pin 9/Pin 7): Current Comparator Sense Voltage
LIM
Range Input. Tying this pin to GND, FLOAT or INTV
CC
selects the maximum current sense threshold from three
different levels.
ConnectthispintoINTV toforcecontinuousconduction
CC
mode of operation. Connect to GND to enable pulse-skip-
GND(Pin±0/Pin8):Ground. Allsmall-signalcomponents
ping mode of operation. To select Burst Mode operation,
andcompensationcomponentsshouldbeKelvinconnected
tie this pin to INTV through a resistor no less than 50k,
CC
tothisground.The(–)terminalofCV andthe(–)terminal
CC
but no greater than 250k. A clock on the pin will force the
controller into pulse skip mode of operation and synchro-
nize the internal oscillator.
of C should be closely connected to this pin.
IN
BG (Pin ±±/Pin 9): Bottom Gate Driver Output. This pin
drives the gate of the bottom N-channel MOSFET between
FREQ/PLLFLTR (Pin 2/Pin ±6): The phase-locked loop’s
lowpass filter is tied to this pin. Alternatively, a resistor
can be connected between this pin and GND to vary the
frequency of the internal oscillator.
GND and INTV .
CC
INTV (Pin±2/Pin±0):Internal5VRegulatorOutput. The
CC
control circuit is powered from this voltage. Decouple this
pin to GND with a minimum 2.2ꢀF low ESR tantalum or
ceramic capacitor.
RUN (Pin 3/Pin ±): Run Control Input. A voltage above
1.25V on this pin turns on the IC. However, forcing this
pin below 1.1V causes the IC to shut down the IC. There
is a 2ꢀA pull-up current on this pin.
V (Pin ±3/Pin ±±): Main Input Supply. Decouple this pin
to GND with a capacitor.
IN
BOOST (Pin ±4/Pin ±2): Boosted Floating Driver Supply.
The (+) terminal of the boost-strap capacitor is connected
to this pin. This pin swings from a diode voltage drop
below INTV up to V + INTV .
TK/SS(Pin4/Pin2):OutputVoltageTrackingandSoft-Start
Input. A capacitor to ground at this pin sets the ramp rate
for the output voltage. An internal soft-start current of of
1ꢀA charges this capacitor.
CC
IN
CC
TG (Pin ±5/Pin ±3): Top Gate Driver Output. This is the
I
(Pin 5/Pin 3): Current Control Threshold and Error
TH
output of a floating driver with a voltage swing equal to
Amplifier Compensation Point. The current comparator
INTV superimposed on the switch node voltage.
tripping threshold increases with its I control voltage.
CC
TH
SW (Pin ±6/Pin ±4): Switch Node Connection to the In-
FB (Pin 6/Pin 4): Error Amplifier Feedback Input. This pin
receives the remotely sensed feedback voltage from an
external resistive divider across the output.
ductor. Voltage swing at this pin is from a Schottky diode
(external) voltage drop below ground to V .
IN
–
Exposed Pad (Pin ±7, UD Package Only): Ground. Must
be soldered to PCB, providing a local ground for the IC.
SENSE (Pin7/Pin5):CurrentSenseComparatorInverting
Input.The(–)inputtothecurrentcomparatorisconnected
to the output.
+
SENSE (Pin 8/Pin 6): Current Sense Comparator Non-
inverting Input. The (+) input to the current comparator
is normally connected to the DCR sensing network or
current sensing resistor.
3851f
8
LTC3851
FUNCTIONAL DIAGRAM
V
IN
FREQ/PLLFLTR
MODE/PLLIN
V
IN
+
C
IN
100k
5V REG
0.8V
MODE/SYNC
DETECT
PLL-SYNC
–
+
BOOST
BURSTEN
C
B
TG
OSC
S
R
PULSE SKIP
ON
M1
Q
I
SW
SWITCH
LOGIC
AND
ANTI-
SHOOT
THROUGH
5k
+
SENSE
SENSE
D
+
–
+
B
L1
I
V
CMP
REV
OUT
–
–
RUN
OV
INTV
BG
CC
+
I
LIM
C
OUT
M2
C
VCC
SLOPE COMPENSATION
GND
INTV
CC
UVLO
+
–
0.72V
R2
1
UV
OV
V
FB
100k
I
THB
R1
+
–
V
SLEEP
IN
0.88V
RUN
SS
–
–
+
+
0.8V
REF
1μA
EA
+ –
–
+
+
0.64V
1.25V
2μA
0.4V
3851 FD
I
TH
RUN
TK/SS
C
SS
R
C
C
C1
3851f
9
LTC3851
OPERATION
Main Control Loop
pin and enable that controller. Alternatively, the RUN pin
may be externally pulled up or driven directly by logic.
Be careful not to exceed the absolute maximum rating of
6V on this pin.
The LTC3851 is a constant frequency, current mode step-
downcontroller.Duringnormaloperation,thetopMOSFET
isturnedonwhentheclocksetstheRSlatch, andisturned
off when the main current comparator, I
RS latch. The peak inductor current at which I
, resets the
CMP
The start-up of the controller’s output voltage, V , is
CMP
OUT
resets
controlled by the voltage on the TK/SS pin. When the
the RS latch is controlled by the voltage on the I pin,
voltage on the TK/SS pin is less than the 0.8V internal
TH
FB
which is the output of the error amplifier EA. The V pin
reference, the LTC3851 regulates the V voltage to the
FB
receives the voltage feedback signal, which is compared
TK/SS pin voltage instead of the 0.8V reference. This al-
lows the TK/SS pin to be used to program a soft-start by
connecting an external capacitor from the TK/SS pin to
GND.Aninternal1μApull-upcurrentchargesthiscapacitor
creating a voltage ramp on the TK/SS pin. As the TK/SS
voltage rises linearly from 0V to 0.8V (and beyond), the
to the internal reference voltage by the EA. When the
load current increases, it causes a slight decrease in V
FB
relative to the 0.8V reference, which in turn causes the
I
voltage to increase until the average inductor current
TH
matches the new load current. After the top MOSFET has
turned off, the bottom MOSFET is turned on until either
the inductor current starts to reverse, as indicated by the
output voltage V
rises smoothly from zero to its final
OUT
value. Alternatively, the TK/SS pin can be used to cause
the start-up of V to “track” another supply. Typically,
reverse current comparator, I , or the beginning of the
next cycle.
REV
OUT
this requires connecting to the TK/SS pin an external
resistor divider from the other supply to ground (see the
Applications Information section). When the RUN pin
INTV Power
CC
is pulled low to disable the controller, or when INTV
CC
Power for the top and bottom MOSFET drivers and most
drops below its undervoltage lockout threshold of 3.2V,
the TK/SS pin is pulled low by an internal MOSFET. When
in undervoltage lockout, the controller is disabled and the
external MOSFETs are held off.
other internal circuitry is derived from the INTV pin. An
CC
internal 5V low dropout linear regulator supplies INTV
CC
power from V .
IN
The top MOSFET driver is biased from the floating boot-
strap capacitor, C , which normally recharges during each
Light Load Current Operation (Burst Mode Operation,
Pulse-Skipping or Continuous Conduction)
B
off cycle through an external diode when the top MOSFET
turns off. If the input voltage, V , decreases to a voltage
IN
The LTC3851 can be enabled to enter high efficiency Burst
Modeoperation,constantfrequencypulse-skippingmode
or forced continuous conduction mode. To select forced
close to V , the loop may enter dropout and attempt
OUT
to turn on the top MOSFET continuously. The dropout
detector detects this and forces the top MOSFET off for
about 1/10 of the clock period every tenth cycle to allow
continuous operation, tie the MODE/PLLIN pin to INTV .
CC
To select pulse-skipping mode of operation, float the
C to recharge. However, it is recommended that there is
B
MODE/PLLIN pin or tie it to GND. To select Burst Mode
always a load present during the drop-out transition to
operation, tie MODE/PLLIN to INTV through a resistor
CC
ensure C is recharged.
B
no less than 50k, but no greater than 250k.
Shutdown and Start-Up (RUN and TK/SS)
When the controller is enabled for Burst Mode operation,
the peak current in the inductor is set to approximately
one-forth of the maximum sense voltage even though
The LTC3851 can be shut down using the RUN pin. Pulling
this pin below 1.1V disables the controller and most of the
the voltage on the I pin indicates a lower value. If the
TH
internalcircuitry,includingtheINTV regulator.Releasing
CC
average inductor current is higher than the load current,
the RUN pin allows an internal 2μA current to pull up the
3851f
10
LTC3851
OPERATION
low audio noise and reduced RF interference as compared
to Burst Mode operation. It provides higher low current
efficiency than forced continuous mode, but not nearly as
high as Burst Mode operation.
the error amplifier, EA, will decrease the voltage on the I
TH
pin. When the I voltage drops below 0.4V, the internal
TH
sleep signal goes high (enabling “sleep” mode) and both
external MOSFETs are turned off.
In sleep mode, the load current is supplied by the output
capacitor. As the output voltage decreases, the EA’s output
begins to rise. When the output voltage drops enough, the
sleep signal goes low, and the controller resumes normal
operation by turning on the top external MOSFET on the
next cycle of the internal oscillator. When a controller is
enabled for Burst Mode operation, the inductor current is
not allowed to reverse. The reverse current comparator,
Frequency Selection and Phase-Locked Loop
(FREQ/PLLFLTR and MODE/PLLIN Pins)
Theselectionofswitchingfrequencyisatrade-offbetween
efficiency and component size. Low frequency operation
increasesefficiencybyreducingMOSFETswitchinglosses,
butrequireslargerinductanceand/orcapacitancetomain-
tain low output ripple voltage. The switching frequency
of the LTC3851 can be selected using the FREQ/PLLFLTR
pin. If the MODE/PLLIN pin is not being driven by an ex-
ternal clock source, the FREQ/PLLFLTR pin can be used
to program the controller’s operating frequency from
250kHz to 750kHz.
I
, turnsoffthebottomexternalMOSFETjustbeforethe
REV
inductor current reaches zero, preventing it from revers-
ing and going negative. Thus, the controller operates in
discontinuous operation. In forced continuous operation,
the inductor current is allowed to reverse at light loads or
under large transient conditions. The peak inductor cur-
A phase-locked loop (PLL) is available on the LTC3851
to synchronize the internal oscillator to an external clock
source that is connected to the MODE/PLLIN pin. The
controlleroperatesinforcedcontinuousmodeofoperation
when it is synchronized. A series RC should be connected
between the FREQ/PLLFLTR pin and GND to serve as the
PLL’s loop filter.
rent is determined by the voltage on the I pin, just as in
TH
normal operation. In this mode the efficiency at light loads
is lower than in Burst Mode operation. However, continu-
ous mode has the advantages of lower output ripple and
less interference to audio circuitry.
When the MODE/PLLIN pin is connected to GND, the
LTC3851 operates in PWM pulse-skipping mode at light
Output Overvoltage Protection
loads.Atverylightloadsthecurrentcomparator,I
,may
CMP
remaintrippedforseveralcyclesandforcetheexternaltop
MOSFET to stay off for the same number of cycles (i.e.,
skipping pulses). The inductor current is not allowed to
reverse (discontinuous operation). This mode, like forced
continuousoperation, exhibitslowoutputrippleaswellas
An overvoltage comparator, OV, guards against transient
overshoots (>10%) as well as other more serious con-
ditions that may overvoltage the output. In such cases,
the top MOSFET is turned off and the bottom MOSFET is
turned on until the overvoltage condition is cleared.
3851f
11
LTC3851
APPLICATIONS INFORMATION
The Typical Application on the first page of this data sheet
is a basic LTC3851 application circuit. The LTC3851 can
be configured to use either DCR (inductor resistance)
sensing or low value resistor sensing. The choice of the
two current sensing schemes is largely a design trade-off
between cost, power consumption and accuracy. DCR
sensing is becoming popular because it saves expensive
current sensing resistors and is more power efficient,
especially in high current applications. However, current
sensing resistors provide the most accurate current limits
for the controller. Other external component selection
is driven by the load requirement, and begins with the
V
V
IN
IN
INTV
CC
BOOST
TG
R
SENSE
V
SW
OUT
LTC3851
BG
GND
+
SENSE
–
SENSE
3851 F01
FILTER COMPONENTS
PLACED NEAR SENSE PINS
selection of R
(if R
is used) and the inductor
SENSE
SENSE
value. Next, the power MOSFETs and Schottky diodes are
selected. Finally, input and output capacitors are selected.
The circuit shown on the first page can be configured for
Figure ±. Using a Resistor to Sense Current with the LTC385±
The current comparator has a maximum threshold, V
,
MAX
operation up to 38V at V .
IN
determined by the I
setting. The current comparator
LIM
threshold sets the maximum peak of the inductor current,
yieldingamaximumaverageoutputcurrent,I ,equalto
Current Limit Programming
MAX
The I
pin is a tri-level logic input to set the maximum
LIM
the maximum peak value less half the peak-to-peak ripple
current limit of the controller. When I is grounded, the
LIM
current, ΔI . Allowing a margin of 20% for variations in
L
maximum current limit threshold of the current compara-
the IC and external component values yields:
tor is programmed to be 30mV. When I is floated, the
LIM
VMAX
RSENSE = 0.8 •
maximum current limit threshold is 50mV. When I
is
LIM
IMAX + ΔIL/2
tied to INTV , the maximum current limit threshold is
CC
set to 75mV.
Inductor DCR Sensing
+
–
SENSE and SENSE Pins
Forapplicationsrequiringthehighestpossibleefficiency,
theLTC3851iscapableofsensingthevoltagedropacross
the inductor DCR, as shown in Figure 2. The DCR of the
inductor represents the small amount of DC winding
resistance of the copper, which can be less than 1mΩ for
today’s low value, high current inductors. If the external
R1||R2 • C1 time constant is chosen to be exactly equal
to the L/DCR time constant, the voltage drop across the
external capacitor is equal to the voltage drop across
the inductor DCR multiplied by R2/(R1 + R2). Therefore,
R2 may be used to scale the voltage across the sense
terminals when the DCR is greater than the target sense
resistance. R2 also resets the sense capacitor, C1, dur-
ing DCM operation. Check the manufacturer’s data sheet
for specifications regarding the inductor DCR, in order
to properly dimension the external filter components.
+
–
The SENSE and SENSE pins are the inputs to the current
comparators. The common mode input voltage range of
the current comparators is 0V to 5.5V. Both SENSE pins
are high impedance inputs with small base currents of
less than 1ꢀA. When the SENSE pins ramp up from 0V to
1.4V, the small base currents flow out of the SENSE pins.
When the SENSE pins ramp down from 5V to 1.1V, the
small base currents flow into the SENSE pins. The high
impedance inputs to the current comparators allow ac-
curate DCR sensing. However, care must be taken not to
float these pins during normal operation.
Low Value Resistors Current Sensing
A typical sensing circuit using a discrete resistor is shown
in Figure 1. R
current.
is chosen based on the required output
SENSE
3851f
12
LTC3851
APPLICATIONS INFORMATION
Accepting larger values of ΔI allows the use of low
L
V
IN
V
IN
inductances, but results in higher output voltage ripple
INTV
CC
and greater core losses. A reasonable starting point for
BOOST
TG
setting ripple current is ΔI = 0.3(I
). The maximum
MAX
L
INDUCTOR
ΔI occurs at the maximum input voltage.
L
L
DCR
SW
LTC3851
V
OUT
The inductor value also has secondary effects. The tran-
sition to Burst Mode operation begins when the average
inductor current required results in a peak current below
BG
GND
R1
R2
+
SENSE
≈10% of the current limit determined by R
. Lower
SENSE
C1*
inductor values (higher ΔI ) will cause this to occur at
L
–
SENSE
lower load currents, which can cause a dip in efficiency in
the upper range of low current operation. In Burst Mode
operation, lower inductance values will cause the burst
frequency to increase.
L
+
–
3851 F02
R1||R2 • C1 =
*PLACE C1 NEAR SENSE , SENSE PINS
DCR
R2
R1 + R2
R
= DCR
SENSE(EQ)
Figure 2. Current Mode Control Using the Inductor DCR
Inductor Core Selection
The DCR of the inductor can also be measured using a
good RLC meter.
Once the value for L is known, the type of inductor must
be selected. High efficiency converters generally cannot
affordthecorelossfoundinlowcostpowderedironcores,
forcingtheuseofmoreexpensiveferriteormolypermalloy
cores. Actual core loss is independent of core size for a
fixedinductorvalue,butitisverydependentoninductance
selected. As inductance increases, core losses go down.
Unfortunately, increased inductance requires more turns
of wire and therefore copper losses will increase.
Slope Compensation and Inductor Peak Current
Slope compensation provides stability in constant fre-
quency architectures by preventing sub-harmonic oscil-
lations at high duty cycles. It is accomplished internally
by adding a compensating ramp to the inductor current
signal. Normally, this results in a reduction of maximum
inductor peak current for duty cycles >40%. However, the
LTC3851 uses a novel scheme that allows the maximum
inductor peak current to remain unaffected throughout
all duty cycles.
Ferrite designs have very low core loss and are preferred
at high switching frequencies, so design goals can con-
centrate on copper loss and preventing saturation. Ferrite
core material saturates “hard,” which means that induc-
tance collapses abruptly when the peak design current is
exceeded. This results in an abrupt increase in inductor
ripple current and consequent output voltage ripple. Do
not allow the core to saturate!
Inductor Value Calculation
The operating frequency and inductor selection are inter-
relatedinthathigheroperatingfrequenciesallowtheuseof
smaller inductor and capacitor values. A higher frequency
generally results in lower efficiency because of MOSFET
gate charge losses. In addition to this basic trade-off, the
effect of inductor value on ripple current and low current
operation must also be considered.
Power MOSFET and Schottky Diode (Optional)
Selection
Two external power MOSFETs must be selected for the
LTC3851 controller: one N-channel MOSFET for the top
(main) switch, and one N-channel MOSFET for the bottom
(synchronous) switch.
The inductor value has a direct effect on ripple current.
The inductor ripple current ΔI decreases with higher
L
inductance or frequency and increases with higher V :
IN
⎛
⎞
VOUT
1
f •L
ΔIL =
VOUT 1–
⎜
⎝
⎟
V
⎠
IN
3851f
13
LTC3851
APPLICATIONS INFORMATION
2
BothMOSFETshaveI RlosseswhilethetopsideN-channel
Thepeak-to-peakdrivelevelsaresetbytheINTV voltage.
CC
equation includes an additional term for transition losses,
This voltage is typically 5V during start-up. Consequently,
logic-level threshold MOSFETs must be used in most ap-
plications. The only exception is if low input voltage is ex-
which are highest at high input voltages. For V < 20V,
IN
the high current efficiency generally improves with larger
MOSFETs, while for V > 20V, the transition losses rapidly
pected(V <5V);then,sub-logiclevelthresholdMOSFETs
IN
IN
increasetothepointthattheuseofahigherR
device
(V
< 3V) should be used. Pay close attention to the
DS(ON)
GS(TH)
withlowerC
actuallyprovideshigherefficiency.The
BV
specification for the MOSFETs as well; most of the
MILLER
DSS
synchronous MOSFET losses are greatest at high input
voltage when the top switch duty factor is low or during
short-circuit when the synchronous switch is on close to
100% of the period.
logic-level MOSFETs are limited to 30V or less.
Selection criteria for the power MOSFETs include the on-
resistance, R , Miller capacitance, C , input
DS(ON) MILLER
voltage and maximum output current. Miller capacitance,
, can be approximated from the gate charge curve
The term (1 + δ) is generally given for a MOSFET in the
C
MILLER
form of a normalized R
vs Temperature curve, but
usually provided on the MOSFET manufacturers’ data
sheet. C is equal to the increase in gate charge
DS(ON)
δ = 0.005/°C can be used as an approximation for low
MILLER
voltage MOSFETs.
along the horizontal axis while the curve is approximately
flat divided by the specified change in V . This result is
DS
The optional Schottky diode shown on the first page
conducts during the dead time between the conduction
of the two power MOSFETs. This prevents the body diode
of the bottom MOSFET from turning on, storing charge
during the dead time and requiring a reverse recovery
period that could cost as much as 3% in efficiency at high
then multiplied by the ratio of the application applied V
DS
to the gate charge curve specified V . When the IC is
DS
operating in continuous mode, the duty cycles for the top
and bottom MOSFETs are given by:
VOUT
Main Switch Duty Cycle =
VIN
V . A 1A to 3A Schottky is generally a good size due to
IN
the relatively small average current. Larger diodes result
in additional transition losses due to their larger junction
capacitance.
V – VOUT
IN
Synchronous Switch Duty Cycle =
V
IN
The MOSFET power dissipations at maximum output
current are given by:
Soft-Start and Tracking
The LTC3851 has the ability to either soft-start by itself
with a capacitor or track the output of another channel
or external supply. When the LTC3851 is configured to
soft-start by itself, a capacitor should be connected to
the TK/SS pin. The LTC3851 is in the shutdown state if
the RUN pin voltage is below 1.25V. TK/SS pin is actively
pulled to ground in this shutdown state.
VOUT
2
PMAIN
=
I
1+ δ R
+
)
(
)
(
)
MAX
DS(ON)
V
IN
I
⎛
⎝
⎞
2
MAX
V
R
C
•
(
)
( DR)(
IN ⎜
⎟
⎠
MILLER
2
⎡
⎢
⎤
⎥
1
1
+
(f)
V
⎢ INTVCC – VTH(MIN) VTH(MIN)⎥
Once the RUN pin voltage is above 1.25V, the LTC3851
powersup.Asoft-startcurrentof1ꢀAthenstartstocharge
its soft-start capacitor. Note that soft-start or tracking is
achieved not by limiting the maximum output current of
the controller but by controlling the output ramp voltage
according to the ramp rate on the TK/SS pin. Current
foldback is disabled during this phase to ensure smooth
soft-start or tracking. The soft-start or tracking range is
⎣
⎦
V – VOUT
2
IN
PSYNC
=
I
(
1+ δ R
DS(ON)
(
)
)
MAX
V
IN
where δ is the temperature dependency of R
DR
and
DS(ON)
R
(approximately 2Ω) is the effective driver resistance
at the MOSFET’s Miller threshold voltage. V
is the
TH(MIN)
typical MOSFET minimum threshold voltage.
3851f
14
LTC3851
APPLICATIONS INFORMATION
0V to 0.8V on the TK/SS pin. The total soft-start time can
be calculated as:
Output Voltage Tracking
The LTC3851 allows the user to program how its output
ramps up and down by means of the TK/SS pins. Through
this pin, the output can be set up to either coincidentally or
ratiometricallytrackwithanothersupply’soutput,asshown
CSS
tSOFT-START = 0.8 •
1.0μA
inFigure3. Inthefollowingdiscussions, V
refersto
Regardless of the mode selected by the MODE/PLLIN pin,
the regulator will always start in pulse-skipping mode up
to TK/SS = 0.64V. Between TK/SS = 0.64V and 0.72V, it
will operate in forced continuous mode and revert to the
selected mode once TK/SS > 0.72V. The output ripple
is minimized during the 80mV forced continuous mode
window.
MASTER
a master supply and V
refers to the LTC3851’s output
OUT
as a slave supply. To implement the coincident tracking
in Figure 3a, connect a resistor divider to V and
MASTER
connect its midpoint to the TK/SS pin of the LTC3851. The
ratio of this divider should be selected the same as that of
the LTC3851’s feedback divider as shown in Figure 4a. In
this tracking mode, V
must be higher than V
.
MASTER
OUT
When the regulator is configured to track another supply,
the feedback voltage of the other supply is duplicated by a
resistordividerandappliedtotheTK/SSpin.Therefore,the
voltageramprateonthispinisdeterminedbytheramprate
of the other supply’s voltage. Note that the small soft-start
capacitor charging current is always flowing, producing
a small offset error. To minimize this error, one can select
the tracking resistive divider value to be small enough to
make this error negligible.
To implement ratiometric tracking, the ratio of the resistor
divider connected to V is determined by:
MASTER
VMASTER
VOUT
R2 R3+R4
⎛
⎞
=
⎜
⎟
⎠
⎝
R4 R1+R2
So which mode should be programmed? While either
mode in Figure 4 satisfies most practical applications,
the coincident mode offers better output regulation.
This concept can be better understood with the help of
Figure 5. At the input stage of the error amplifier, two
common anode diodes are used to clamp the equivalent
reference voltage and an additional diode is used to match
the shifted common mode voltage. The top two current
sources are of the same amplitude. In the coincident
In order to track down another supply after the soft-start
phase expires, the LTC3851 must be configured for forced
continuous operation by connecting MODE/PLLIN to
INTV .
CC
V
V
V
MASTER
OUT
MASTER
V
OUT
3851 F03
TIME
TIME
(3a) Coincident Tracking
(3b) Ratiometric Tracking
Figure 3. Two Different Modes of Output Voltage Tracking
3851f
15
LTC3851
APPLICATIONS INFORMATION
V
V
V
V
OUT
MASTER
MASTER
OUT
R3
R3
R1
R2
R3
R4
TO
TK/SS
PIN
TO
FB
PIN
TO
TK/SS
PIN
TO
FB
PIN
V
V
R4
R4
3851 F04
(4a) Coincident Tracking Setup
(4b) Ratiometric Tracking Setup
Figure 4. Setup for Coincident and Ratiometric Tracking
what type of bulk capacitor is used, an additional 0.1ꢀF
ceramic capacitor placed directly adjacent to the INTV
I
I
CC
and GND pins is highly recommended. Good bypassing
is needed to supply the high transient currents required
by the MOSFET gate drivers.
+
–
D1
D2
EA
TK/SS
0.8V
D3
High input voltage applications in which large MOSFETs
are being driven at high frequencies may cause the maxi-
mum junction temperature rating for the LTC3851 to be
3851 F05
V
FB
Figure 5. Equivalent Input Circuit of Error Amplifier
exceeded. The INTV current, which is dominated by the
CC
gate charge current, is supplied by the 5V LDO.
mode, the TK/SS voltage is substantially higher than
0.8V at steady-state and effectively turns off D1. D2 and
D3 will therefore conduct the same current and offer
Power dissipation for the IC in this case is highest and
is approximately equal to V • I
. The gate charge
INTVCC
IN
current is dependent on operating frequency as discussed
intheEfficiencyConsiderationssection. Thejunctiontem-
perature can be estimated by using the equations given
in Note 3 of the Electrical Characteristics. For example,
tight matching between V and the internal precision
FB
0.8V reference. In the ratiometric mode, however, TK/SS
equals 0.8V at steady-state. D1 will divert part of the bias
current to make V slightly lower than 0.8V.
FB
the LTC3851 INTV current is limited to less than 17mA
CC
Although this error is minimized by the exponential I-V
characteristic of the diode, it does impose a finite amount
ofoutputvoltagedeviation.Furthermore,whenthemaster
supply’s output experiences dynamic excursion (under
load transient, for example), the slave channel output will
be affected as well. For better output regulation, use the
coincident tracking mode instead of ratiometric.
from a 36V supply in the GN package:
T = 70°C + (17mA)(36V)(90°C/W) = 125°C
J
To prevent the maximum junction temperature from being
exceeded, the input supply current must be checked while
operating in continuous conduction mode (MODE/PLLIN
= INTV ) at maximum V .
CC
IN
INTV Regulator
CC
Topside MOSFET Driver Supply (C , D )
B
B
TheLTC3851featuresaPMOSlowdropoutlinearregulator
An external bootstrap capacitor C connected to the
B
(LDO) that supplies power to INTV from the V supply.
CC
IN
BOOST pin supplies the gate drive voltage for the topside
INTV powers the gate drivers and much of the LTC3851
CC
MOSFET.CapacitorC intheFunctionalDiagramischarged
B
’s internal circuitry. The LDO regulates the voltage at the
though external diode D from INTV when the SW pin
B
CC
INTV pin to 5V.
CC
is low. When the topside MOSFET is to be turned on, the
driver places the C voltage across the gate source of the
The LDO can supply a peak current of 50mA and must
be bypassed to ground with a minimum of 2.2ꢀF ceramic
capacitor or low ESR electrolytic capacitor. No matter
B
MOSFET. This enhances the MOSFET and turns on the
topside switch. The switch node voltage, SW, rises to V
IN
3851f
16
LTC3851
APPLICATIONS INFORMATION
and the BOOST pin follows. With the topside MOSFET on,
the boost voltage is above the input supply:
C
Selection
OUT
The selection of C
is primarily determined by the
OUT
effective series resistance, ESR, to minimize voltage
V
= V + V
IN INTVCC
BOOST
ripple. The output ripple, ΔV , in continuous mode is
OUT
The value of the boost capacitor C needs to be 100 times
B
determined by:
that of the total input capacitance of the topside MOSFET.
The reverse breakdown of the external Schottky diode
⎛
⎜
⎝
⎞
1
ΔVOUT ≈ ΔIL ESR +
must be greater than V
.
⎟
IN(MAX)
8fCOUT
⎠
Undervoltage Lockout
where f = operating frequency, C
= output capacitance
OUT
The LTC3851 has two functions that help protect the
controller in case of undervoltage conditions. A precision
and ΔI = ripple current in the inductor. The output ripple
L
is highest at maximum input voltage since ΔI increases
L
UVLOcomparatorconstantlymonitorstheINTV voltage
CC
with input voltage. Typically, once the ESR requirement
to ensure that an adequate gate-drive voltage is present.
for C
has been met, the RMS current rating gener-
OUT
It locks out the switching action when INTV is below
CC
ally far exceeds the I
requirement. With ΔI =
RIPPLE(P-P)
L
3.2V. To prevent oscillation when there is a disturbance
0.3I
and allowing 2/3 of the ripple to be due to
OUT(MAX)
on the INTV , the UVLO comparator has 400mV of preci-
CC
ESR, the output ripple will be less than 50mV at maximum
V if the I pin is configured to float and:
sion hysteresis.
IN
LIM
Anotherwaytodetectanundervoltageconditionistomoni-
COUT Required ESR < 2.2RSENSE
1
tor the V supply. Because the RUN pin has a precision
IN
turn-on reference of 1.25V, one can use a resistor divider
COUT
>
to V to turn on the IC when V is high enough.
8fRSENSE
IN
IN
C Selection
ThefirstconditionrelatestotheripplecurrentintotheESR
oftheoutputcapacitancewhilethesecondtermguarantees
thattheoutputcapacitancedoesnotsignificantlydischarge
duringtheoperatingfrequencyperiodduetoripplecurrent.
The choice of using smaller output capacitance increases
the ripple voltage due to the discharging term but can be
compensated for by using capacitors of very low ESR to
IN
Incontinuousmode, thesourcecurrentofthetopN-chan-
nel MOSFET is a square wave of duty cycle V /V . To
preventlargevoltagetransients, alowESRinputcapacitor
sized for the maximum RMS current must be used. The
maximum RMS capacitor current is given by:
OUT IN
1/2
maintain the ripple voltage at or below 50mV. The I pin
TH
⎛
⎞
VOUT
VIN
VIN
IRMS ≅ IO(MAX)
– 1
OPTI-LOOP compensation components can be optimized
to provide stable, high performance transient response
regardless of the output capacitors selected.
⎜
⎟
V
⎝
⎠
OUT
This formula has a maximum at V = 2V , where I =
RMS
IN
OUT
I
/2. This simple worst-case condition is commonly
O(MAX)
The selection of output capacitors for applications with
largeloadcurrenttransientsisprimarilydeterminedbythe
voltage tolerance specifications of the load. The resistive
component of the capacitor, ESR, multiplied by the load
current change, plus any output voltage ripple must be
within the voltage tolerance of the load.
usedfordesignbecauseevensignificantdeviationsdonot
offermuchrelief.Notethatcapacitormanufacturers’ripple
current ratings are often based on only 2000 hours of life.
This makes it advisable to further derate the capacitor or
to choose a capacitor rated at a higher temperature than
required.Severalcapacitorsmayalsobeparalleledtomeet
size or height requirements in the design. Always consult
the manufacturer if there is any question.
3851f
17
LTC3851
APPLICATIONS INFORMATION
The required ESR due to a load current step is:
ΔV
AVX TPSV or the KEMET T510 series of surface mount
tantalums, available in case heights ranging from 1.5mm
to 4.1mm. Aluminum electrolytic capacitors can be used
in cost-driven applications, provided that consideration is
given to ripple current ratings, temperature and long-term
reliability. Atypicalapplicationwillrequireseveraltomany
aluminum electrolytic capacitors in parallel. A combina-
tion of the above mentioned capacitors will often result
in maximizing performance and minimizing overall cost.
Other capacitor types include Nichicon PL series, NEC
Neocap, Panasonic SP and Sprague 595D series. Consult
manufacturers for other specific recommendations.
RESR
≤
ΔI
whereΔIisthechangeincurrentfromfullloadtozeroload
(orminimumload)andΔVistheallowedvoltagedeviation
(not including any droop due to finite capacitance).
The amount of capacitance needed is determined by the
maximum energy stored in the inductor. The capacitance
must be sufficient to absorb the change in inductor
current when a high current to low current transition
occurs. The opposite load current transition is generally
determined by the control loop OPTI-LOOP components,
so make sure not to over compensate and slow down
the response. The minimum capacitance to assure the
inductors’ energy is adequately absorbed is:
Like all components, capacitors are not ideal. Each
capacitor has its own benefits and limitations. Combina-
tions of different capacitor types have proven to be a very
cost effective solution. Remember also to include high
frequency decoupling capacitors. They should be placed
as close as possible to the power pins of the load. Any
inductance present in the circuit board traces negates
their usefulness.
L ΔI 2
( )
COUT
>
2 ΔV V
(
)
OUT
where ΔI is the change in load current.
Setting Output Voltage
Manufacturers such as Nichicon, United Chemi-Con and
Sanyo can be considered for high performance through-
hole capacitors. The OS-CON semiconductor electrolyte
capacitor available from Sanyo has the lowest (ESR)(size)
product of any aluminum electrolytic at a somewhat
higher price. An additional ceramic capacitor in parallel
with OS-CON capacitors is recommended to reduce the
inductance effects.
The LTC3851 output voltage is set by an external feed-
back resistive divider carefully placed across the output,
as shown in Figure 6. The regulated output voltage is
determined by:
⎛
⎞
⎟
RB
RA
VOUT = 0.8V 1+
⎜
⎝
⎠
Insurfacemountapplications,ESR,RMScurrenthandling
and load step specifications may require multiple capaci-
tors in parallel. Aluminum electrolytic, dry tantalum and
special polymer capacitors are available in surface mount
packages.Specialpolymersurfacemountcapacitorsoffer
very low ESR but have much lower capacitive density per
unit volume than other capacitor types. These capacitors
offeraverycost-effectiveoutputcapacitorsolutionandare
an ideal choice when combined with a controller having
highloopbandwidth.Tantalumcapacitorsofferthehighest
capacitance density and are often used as output capaci-
tors for switching regulators having controlled soft-start.
Several excellent surge-tested choices are the AVX TPS,
To improve the transient response, a feed-forward ca-
pacitor, C , may be used. Great care should be taken to
FF
route the V line away from noise sources, such as the
FB
inductor or the SW line.
V
OUT
R
C
FF
LTC3851
B
A
V
FB
R
3851 F06
Figure 6. Settling Output Voltage
3851f
18
LTC3851
APPLICATIONS INFORMATION
Fault Conditions: Current Limit and Current Foldback
Phase-Locked Loop and Frequency Synchronization
The LTC3851 includes current foldback to help limit load
current when the output is shorted to ground. If the
output falls below 40% of its nominal output level, the
maximum sense voltage is progressively lowered from
its maximum programmed value to about 25% of the that
value. Foldback current limiting is disabled during soft-
start or tracking. Under short-circuit conditions with very
low duty cycles, the LTC3851 will begin cycle skipping in
order to limit the short-circuit current. In this situation
the bottom MOSFET will be dissipating most of the power
but less than in normal operation. The short-circuit ripple
current is determined by the minimum on-time tON(MIN)
of the LTC3851 (≈90ns), the input voltage and inductor
value:
The LTC3851 has a phase-locked loop (PLL) comprised
of an internal voltage-controlled oscillator (V ) and a
CO
phase detector. This allows the turn-on of the top MOSFET
to be locked to the rising edge of an external clock signal
applied to the MODE/PLLIN pin. This phase detector is
an edge sensitive digital type that provides zero degrees
phase shift between the external and internal oscillators.
This type of phase detector does not exhibit false lock to
harmonics of the external clock.
Theoutputofthephasedetectorisapairofcomplementary
current sources that charge or discharge the external filter
network connected to the FREQ/PLLFLTR pin. Note that
the LTC3851 can only be synchronized to an external clock
whose frequency is within range of the LTC3851’s internal
V .Thisisguaranteedtobebetween250kHzand750kHz.
V
CO
IN
L
ΔIL(SC) = tON(MIN)
•
A simplified block diagram is shown in Figure 8.
The resulting short-circuit current is:
If the external clock frequency is greater than the internal
oscillator’s frequency, f
, then current is sunk con-
OSC
1/4MaxVSENSE
RSENSE
1
2
tinuouslyfromthephasedetectoroutput,pullingdownthe
ISC
=
– ΔIL(SC)
FREQ/PLLFLTR pin. When the external clock frequency is
less than f
, current is sourced continuously, pulling up
OSC
Programming Switching Frequency
theFREQ/PLLFLTRpin.Iftheexternalandinternalfrequen-
ciesarethesamebutexhibitaphasedifference,thecurrent
sourcesturnonforanamountoftimecorrespondingtothe
phase difference. The voltage on the FREQ/PLLFLTR pin is
adjusted until the phase and frequency of the internal and
external oscillators are identical. At the stable operating
point, the phase detector output is high impedance and
To set the switching frequency of the LTC3851, connect
a resistor, R
, between FREQ/PLLFLTR and GND. The
FREQ
relationship between the oscillator frequency and R
is shown in Figure 7. A 0.1μF bypass capacitor should be
FREQ
connected in parallel with R
.
FREQ
1000
750
the filter capacitor C holds the voltage.
LP
R
2.7V
LP
500
250
C
LP
FREQ/PLLFLTR
VCO
MODE/
PLLIN
DIGITAL
PHASE/
FREQUENCY
DETECTOR
EXTERNAL
OSCILLATOR
100
10
36 60
160
1000
R
FREQ
(k)
3851F07
3851 F08
Figure 7. Relationship Between Oscillator Frequency
and Resistor Connected Between FREQ/PLLFLTR and GND
Figure 8. Phase-Locked Loop Block Diagram
3851f
19
LTC3851
APPLICATIONS INFORMATION
where L1, L2, etc. are the individual losses as a percent-
age of input power.
The loop filter components, C and R , smooth out
LP
LP
the current pulses from the phase detector and provide
a stable input to the voltage-controlled oscillator. The
Although all dissipative elements in the circuit produce
losses, four main sources usually account for most of the
filter components C and R determine how fast the
LP
LP
loop acquires lock. Typically R is 1k to 10k and C is
LP
LP
losses in LTC3851 circuits: 1) IC V current, 2) INTV
IN
CC
2200pF to 0.01ꢀF.
2
regulator current, 3) I R losses, 4) topside MOSFET
transition losses.
The external clock (on MODE/PLLIN pin) input high
threshold is nominally 1.6V, while the input low threshold
is nominally 1.2V.
1. The V current is the DC supply current given in the
IN
ElectricalCharacteristicstable,whichexcludesMOSFET
driver current. V current typically results in a small
IN
Minimum On-Time Considerations
(<0.1%) loss.
Minimum on-time t
is the smallest time duration
ON(MIN)
2. INTVCC current is the sum of the MOSFET driver and
control currents. The MOSFET driver current results
from switching the gate capacitance of the power
MOSFETs. Each time a MOSFET gate is switched from
low to high to low again, a packet of charge dQ moves
fromINTVCC toground. TheresultingdQ/dtisacurrent
out of INTVCC that is typically much larger than the
control circuit current. In continuous mode, IGATECHG
= f(QT + QB), where QT and QB are the gate charges of
the topside and bottom side MOSFETs.
that the LTC3851 is capable of turning on the top MOSFET.
It is determined by internal timing delays and the gate
charge required to turn on the top MOSFET. Low duty
cycle applications may approach this minimum on-time
limit and care should be taken to ensure that:
VOUT
tON(MIN)
<
V (f)
IN
If the duty cycle falls below what can be accommodated
by the minimum on-time, the controller will begin to skip
cycles. The output voltage will continue to be regulated,
but the ripple voltage and current will increase.
2
3. I R losses are predicted from the DC resistances of
the fuse (if used), MOSFET, inductor and current sense
resistor.Incontinuousmode,theaverageoutputcurrent
The minimum on-time for the LTC3851 is approximately
90ns. However, as the peak sense voltage decreases the
minimum on-time gradually increases. This is of particu-
lar concern in forced continuous applications with low
ripple current at light loads. If the duty cycle drops below
the minimum on-time limit in this situation, a significant
amount of cycle skipping can occur with correspondingly
larger current and voltage ripple.
flows through L and R
, but is “chopped” between
SENSE
the topside MOSFET and the synchronous MOSFET. If
thetwoMOSFETshaveapproximatelythesameR
,
DS(ON)
then the resistance of one MOSFET can simply be
summed with the resistances of L and R
to obtain
SENSE
= 10mΩ, DCR
2
I R losses. For example, if each R
DS(ON)
= 10mΩ and R
= 5mΩ, then the total resistance
SENSE
is 25mΩ. This results in losses ranging from 2% to
8% as the output current increases from 3A to 15A for
a 5V output, or a 3% to 12% loss for a 3.3V output.
Efficiency Considerations
Efficiency varies as the inverse square of V
for the
OUT
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can
be expressed as:
sameexternalcomponentsandoutputpowerlevel. The
combined effects of increasingly lower output voltages
andhighercurrentsrequiredbyhighperformancedigital
systemsisnotdoublingbutquadruplingtheimportance
of loss terms in the switching regulator system!
%Efficiency = 100% – (L1 + L2 + L3 + ...)
3851f
20
LTC3851
APPLICATIONS INFORMATION
The I series R -C filter sets the dominant pole-zero
4. Transition losses apply only to the topside MOSFET(s),
and become significant only when operating at high
input voltages (typically 15V or greater). Transition
losses can be estimated from:
TH
C
C
loop compensation. The values can be modified slightly
(from 0.5 to 2 times their suggested values) to optimize
transient response once the final PC layout is done and
the particular output capacitor type and value have been
determined. The output capacitors need to be selected
because the various types and values determine the loop
gain and phase. An output current pulse of 20% to 80%
of full-load current having a rise time of 1ꢀs to 10ꢀs will
2
Transition Loss = (1.7)V • I
• C
• f
RSS
IN
O(MAX)
Other “hidden” losses such as copper trace and the bat-
tery internal resistance can account for an additional 5%
to 10% efficiency degradation in portable systems. It is
very important to include these “system” level losses
during the design phase. The internal battery and fuse
resistance losses can be minimized by making sure that
produce output voltage and I pin waveforms that will
TH
give a sense of the overall loop stability without breaking
the feedback loop. Placing a power MOSFET directly
across the output capacitor and driving the gate with an
appropriate signal generator is a practical way to produce
a realistic load step condition. The initial output voltage
step resulting from the step change in output current may
not be within the bandwidth of the feedback loop, so this
signal cannot be used to determine phase margin. This
C has adequate charge storage and very low ESR at the
IN
switching frequency. A 25W supply will typically require a
minimum of 20ꢀF to 40ꢀF of capacitance having a maxi-
mum of 20mΩ to 50mΩ of ESR. Other losses including
Schottky conduction losses during dead time and induc-
tor core losses generally account for less than 2% total
additional loss.
is why it is better to look at the I pin signal which is in
TH
the feedback loop and is the filtered and compensated
Checking Transient Response
control loop response. The midband gain of the loop will
be increased by increasing R and the bandwidth of the
C
The regulator loop response can be checked by looking at
the load current transient response. Switching regulators
take several cycles to respond to a step in DC (resistive)
loop will be increased by decreasing C . If R is increased
C
C
bythesamefactorthatC isdecreased,thezerofrequency
C
will be kept the same, thereby keeping the phase shift the
same in the most critical frequency range of the feedback
loop. The output voltage settling behavior is related to the
stability of the closed-loop system and will demonstrate
the actual overall supply performance.
load current. When a load step occurs, V
shifts by an
OUT
amount equal to ΔI
(ESR), where ESR is the effective
LOAD
series resistance of C . ΔI
also begins to charge or
OUT LOAD
discharge C
generating the feedback error signal that
OUT
forces the regulator to adapt to the current change and
return V
time V
to its steady-state value. During this recovery
can be monitored for excessive overshoot or
OUT
A second, more severe transient is caused by switching
in loads with large (>1ꢀF) supply bypass capacitors. The
dischargedbypasscapacitorsareeffectivelyputinparallel
OUT
ringing, which would indicate a stability problem. The
availability of the I pin not only allows optimization of
TH
with C , causing a rapid drop in V . No regulator can
OUT
OUT
control loop behavior but also provides a DC coupled and
AC filtered closed-loop response test point. The DC step,
rise time and settling at this test point truly reflects the
closed-loop response. Assuming a predominantly second
ordersystem, phasemarginand/ordampingfactorcanbe
estimated using the percentage of overshoot seen at this
pin.Thebandwidthcanalsobeestimatedbyexaminingthe
alter its delivery of current quickly enough to prevent this
sudden step change in output voltage if the load switch
resistance is low and it is driven quickly. If the ratio of
C
to C
is greater than 1:50, the switch rise time
LOAD
OUT
should be controlled so that the load rise time is limited
to approximately 25 • C . Thus a 10ꢀF capacitor would
LOAD
require a 250ꢀs rise time, limiting the charging current
to about 200mA.
rise time at the pin. The I external components shown
TH
in the Typical Application circuit will provide an adequate
starting point for most applications.
3851f
21
LTC3851
APPLICATIONS INFORMATION
PC Board Layout Checklist
2. Does the V pin connect directly to the feedback resis-
FB
tors? The resistive divider R1, R2 must be connected
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3851. These items are also illustrated graphically
in the layout diagram of Figure 9. Check the following in
your layout:
between the (+) plate of C
and signal ground. The
OUT
47pF to 100pF capacitor should be as close as possible
to the LTC3851. Be careful locating the feedback resis-
tors too far away from the LTC3851. The V line should
FB
not be routed close to any other nodes with high slew
1. Are the board signal and power grounds segregated?
The LTC3851 GND pin should tie to the ground plane
closetotheinputcapacitor(s).Thelowcurrentorsignal
ground lines should make a single point tie directly to
the GND pin. The synchronous MOSFET source pins
should connect to the input capacitor(s) ground.
rates.
–
+
3. Are the SENSE and SENSE leads routed together
with minimum PC trace spacing? The filter capaci-
+
–
tor between SENSE and SENSE should be as close
as possible to the LTC3851. Ensure accurate current
sensing with Kelvin connections as shown in Figure
10. Series resistance can be added to the SENSE lines
to increase noise rejection and to compensate for the
ESL of R
.
SENSE
+
0.1μF
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
MODE/PLLIN
SW
TG
R
FREQ
C
IN
M1
FREQ/PLLFLTR
RUN
BOOST
V
IN
LTC3851
C
SS
TK/SS
V
IN
C
C2
C
B
C
D
C
B
R
C
D1
I
TH
INTV
CC
47pF
+
M2
V
BG
4.7μF
FB
–
+
SENSE
SENSE
GND
–
1000pF
I
LIM
L1
–
R1
C
OUT
V
OUT
+
R
SENSE
R2
+
3851 F09
Figure 9. LTC385± Layout Diagram
3851f
22
LTC3851
APPLICATIONS INFORMATION
HIGH CURRENT PATH
Thedutycyclepercentageshouldbemaintainedfromcycle
tocycleinawelldesigned, lownoisePCBimplementation.
Variation in the duty cycle at a subharmonic rate can sug-
gest noise pick-up at the current or voltage sensing inputs
or inadequate loop compensation. Overcompensation of
the loop can be used to tame a poor PC layout if regulator
bandwidth optimization is not required.
3851 F10
CURRENT SENSE
RESISTOR
(R
)
Reduce V from its nominal level to verify operation
SENSE
+
–
IN
SENSE SENSE
of the regulator in dropout. Check the operation of the
undervoltage lockout circuit by further lowering V while
IN
Figure ±0. Kelvin Sensing RSENSE
monitoring the outputs to verify operation.
Investigate whether any problems exist only at higher out-
put currents or only at higher input voltages. If problems
coincide with high input voltages and low output currents,
look for capacitive coupling between the BOOST, SW, TG
and possibly BG connections and the sensitive voltage
and current pins. The capacitor placed across the current
sensing pins needs to be placed immediately adjacent to
the pins of the IC. This capacitor helps to minimize the
effects of differential noise injection due to high frequency
capacitive coupling. If problems are encountered with
high current output loading at lower input voltages, look
4. Does the (+) terminal of C connect to the drain of
IN
the topside MOSFET(s) as closely as possible? This
capacitor provides the AC current to the MOSFET(s).
5. Is the INTV decoupling capacitor connected closely
CC
between INTV and GND? This capacitor carries the
CC
MOSFETdriverpeakcurrents.Anadditional1ꢀFceramic
capacitor placed immediately next to the INTV and
CC
GND pins can help improve noise performance.
6. Keep the switching node (SW), top gate node (TG) and
boost node (BOOST) away from sensitive small-signal
nodes, especially from the voltage and current sensing
feedback pins. All of these nodes have very large and
fast moving signals and therefore should be kept on
the “output side” (Pin 9 to Pin 16) of the LTC3851EGN
and occupy minimum PC trace area.
for inductive coupling between C , the Schottky and the
IN
top MOSFET to the sensitive current and voltage sens-
ing traces. In addition, investigate common ground path
voltage pickup between these components and the GND
pin of the IC.
PC Board Layout Debugging
Design Example
It is helpful to use a DC-50MHz current probe to monitor
thecurrentintheinductorwhiletestingthecircuit.Monitor
the output switching node (SW pin) to synchronize the
oscilloscope to the internal oscillator and probe the actual
outputvoltageaswell. Checkforproperperformanceover
the operating voltage and current range expected in the
application. The frequency of operation should be main-
tained over the input voltage range down to dropout and
until the output load drops below the low current opera-
tion threshold—typically 10% of the maximum designed
current level in Burst Mode operation.
Asadesignexample,assumeV =12V(nominal),V =22V
IN
IN
(maximum), V
= 1.8V, I
= 5A, and f = 250kHz.
OUT
MAX
The inductance value is chosen first based on a 30%
ripple current assumption. The highest value of ripple
current occurs at the maximum input voltage. Connect a
160k resistor between the FREQ/PLLFLTR and GND pins,
generating 250kHz operation. The minimum inductance
for 30% ripple current is:
⎛
⎞
VOUT
VIN
1
f L
( )( )
ΔIL =
VOUT 1−
⎜
⎝
⎟
⎠
3851f
23
LTC3851
APPLICATIONS INFORMATION
A short-circuit to ground will result in a folded back cur-
rent of:
A 4.7μH inductor will produce 28% ripple current and
a 3.3μH will result in 40%. The peak inductor current
will be the maximum DC value plus one-half the ripple
current, or 6A, for the 3.3μH value. Increasing the ripple
current will also help ensure that the minimum on-time
of 90ns is not violated. The minimum on-time occurs at
⎛
⎞
90ns 22V
29mV
0.0125Ω 2
1
(
)
ISC
=
–
= 2.02A
⎜
⎟
3.3μH
⎝
⎠
with a typical value of R
and δ = (0.005/°C)(25°C)
DS(ON)
maximum V :
IN
= 0.125. The resulting power dissipated in the bottom
VOUT
VIN(MAX)
1.8V
MOSFET is:
tON(MIN)
=
=
= 327ns
f
( )
22V 250kHz
(
)
22V
22V
2
PSYNC
=
2.02A 1.125 0.022Ω
(
) (
)(
)
The R
resistor value can be calculated by connect-
SENSE
= 101.0mW
which is less than under full-load conditions.
C is chosen for an RMS current rating of at least 3A at
ing I to INTV and using the maximum current sense
LIM
CC
voltage specification with some accommodation for toler-
ances. Tie I to INTV .
LIM
CC
IN
75mV
6A
temperature. C
is chosen with an ESR of 0.02Ω for
OUT
RSENSE
≤
= 0.0125Ω
low output ripple. The output ripple in continuous mode
will be highest at the maximum input voltage. The output
voltage ripple due to ESR is approximately:
Choosing 1% resistors: R1 = 25.5k and R2 = 32.4k yields
an output voltage of 1.816V.
V
= R (ΔI ) = 0.02Ω (2A) = 40mV
ESR L P-P
ORIPPLE
ThepowerdissipationonthetopsideMOSFETcanbeeasily
estimated. Choosing a Fairchild FDS6982S dual MOSFET
results in: R
= 0.035Ω/0.022Ω, C
= 215pF. At
DS(ON)
MILLER
maximum input voltage with T (estimated) = 50°C:
1.8V
⎡
⎤
PMAIN
=
5 2 1+ 0.005 50°C − 25°C •
( )
(
)(
)
⎣
⎦
22V
0.035Ω + 22V
5A
2
⎛
⎞
2
2Ω 215pF •
)(
(
) (
)
(
)
⎜
⎝
⎟
⎠
1
1
⎡
⎤
+
250kHz = 185mW
(
)
⎢
⎣
⎥
⎦
5− 2.3 2.3
3851f
24
LTC3851
TYPICAL APPLICATIONS
V
IN
4V TO 38V
MODE/PLLIN
V
IN
C
IN
R
FREQ
180μF
80k
M1
IRF7478PBF
FREQ/PLLFLTR
TG
C
B
0.1μF
RUN
BOOST
0.1μF
C
SS
LTC3851
0.1μF
L1
0.68μH
V
3.3V
15A
OUT
TK/SS
SW
C
D
C
B
C
R
C2
C
3300pF
R27
10k
CMDSH-4E
R2
62.5k
1%
100pF
1k
C15
47pF
I
TH
INTV
CC
+
+
C
OUT
4.7μF
330μF
M2
IRF7478PBF
s2
R1
20k
1%
V
FB
BG
CMSH3-40M
–
+
SENSE
SENSE
GND
C5
0.22μF
C
C
: SANYO 2R5TPE330M9
OUT
IN
I
LIM
: SANYO 80UK150K
13k
L1: SUMIDA CEP125-0R68
3851 TA03
Figure ±±. High Efficiency 3.3V/±5A Step-Down Converter
±.8V/5A Converter from Design Example with Pulse Skip Operation
V
IN
4.5V TO 22V
MODE/PLLIN
V
IN
C
IN
22μF
50V
CER
R
FREQ
80k
M1
Si4412DY
FREQ/PLLFLTR
TG
C
B
0.1μF
RUN
BOOST
0.1μF
C
SS
LTC3851
0.1μF
L1
3.3μH
R
SENSE
V
0.01Ω
OUT
TK/SS
SW
C
D
1.8V
C
B
R
C
C
470pF
C2
CMDSH-3
5A
R2
33k
220pF
32.4k
1%
C
I
INTV
OUT
TH
CC
+
+
150μF
6.3V
s2
47pF
4.7μF
M2
R1
25.5k
1%
V
BG
FB
Si4410DY
PANASONIC SP
MBRS140T3
–
+
SENSE
SENSE
GND
1000pF
C
C
: PANASONIC EEFUEOG151R
OUT
IN
I
LIM
: MARCON THCR70LE1H226ZT
L1: PANASONIC ETQP6F3R3HFA
: IRC LR 2010-01-R010F
R
SENSE
3851 TA02
3851f
25
LTC3851
TYPICAL APPLICATIONS
2.5V/±5A Synchronized at 350kHz
V
IN
6V TO 14V
PLLIN
350kHz
MODE/PLLIN
V
IN
C2
0.01μF
C
IN
180μF
R5
10k
M1
FREQ/PLLFLTR
TG
RJK0305DPB
C
B
0.1μF
RUN
BOOST
C
SS
0.1μF
C1
1000pF
LTC3851
L1
0.68μH
R
SENSE
0.002Ω
V
2.5V
15A
OUT
TK/SS
SW
D
B
C
C
CMDSH-3
R
C
C
1000pF
C2
R2
43.2k
1%
7.5k
C10
100pF
I
TH
INTV
33pF
CC
+
+
C
OUT
47pF
4.7μF
330μF
M2
RJK0301DPB
D2
B34OLA
R1
20k
1%
s2
V
BG
FB
–
+
SENSE
SENSE
GND
1000pF
I
C
: SANYO 2R5TPE330M9
OUT
L1: SUMIDA CEP125-OR6MC
LIM
R22 100Ω
R20 100Ω
3851 TA04
4V to 40V Input to ±2V Flyback Converter
V
IN
4V TO 40V
CMDSH-3
FMMT625
V
OUT
C
V
12V
3A
IN
OUT
10k
6.2V
T1
10
22μF
50V
s2
6
7
R2
113k
1%
C
3
OUT
+
220μF
16V
s4
R1
8.06k
1%
47Ω
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
M2
Si4850EY
MBRS1100
MODE/PLLIN
SW
TG
1nF
100V
R
FREQ
22Ω
80k
M1
IRL2910S
FREQ/PLLFLTR
1nF
100V
RUN
BOOST
R
0.1μF
SENSE
C
SS
0.1μF
0.004Ω
LTC3851
TK/SS
V
IN
C
10nF
C
R
C
C
C2
100pF
1k
I
TH
INTV
CC
0.1μF
47pF
+
V
BG
FB
4.7μF
–
+
C
C
: MARCON THCR70EIH226ZT
SENSE
SENSE
GND
IN
OUT
R
: AVX TPSV227M016R0150
C5
0.22μF
: IRC LRF2512-01-R004F
SENSE
T1: COILTRONICS VP5-0155
I
LIM
3851 TA05
3851f
26
LTC3851
PACKAGE DESCRIPTION
GN Package
±6-Lead Plastic SSOP (Narrow .±50 Inch)
(Reference LTC DWG # 05-08-1641)
.189 – .196*
(4.801 – 4.978)
.045 p.005
.009
(0.229)
REF
16 15 14 13 12 11 10 9
.254 MIN
.150 – .165
.229 – .244
.150 – .157**
(5.817 – 6.198)
(3.810 – 3.988)
.0165 p.0015
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
1
2
3
4
5
6
7
8
.015 p .004
(0.38 p 0.10)
s 45o
.0532 – .0688
(1.35 – 1.75)
.004 – .0098
(0.102 – 0.249)
.007 – .0098
(0.178 – 0.249)
0o – 8o TYP
.016 – .050
(0.406 – 1.270)
.0250
(0.635)
BSC
.008 – .012
GN16 (SSOP) 0204
(0.203 – 0.305)
TYP
NOTE:
1. CONTROLLING DIMENSION: INCHES
INCHES
2. DIMENSIONS ARE IN
(MILLIMETERS)
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
UD Package
±6-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 s 45o CHAMFER
R = 0.115
TYP
0.75 p 0.05
3.00 p 0.10
(4 SIDES)
15 16
0.70 p0.05
PIN 1
TOP MARK
(NOTE 6)
0.40 p 0.10
1
2
1.45 p 0.10
(4-SIDES)
3.50 p 0.05
2.10 p 0.05
1.45 p 0.05
(4 SIDES)
PACKAGE
OUTLINE
(UD16) QFN 0904
0.200 REF
0.25 p 0.05
0.25 p0.05
0.50 BSC
0.00 – 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3851f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
27
LTC3851
TYPICAL APPLICATION
Dual Output ±5W 3.3V/5V Power Supply
V
IN
T1C
6
4.5V TO 28V
V
OUT2
•
5V
3
MODE/PLLIN
V
IN
C
22μF
50V
IN
1.5A
0.01μF
C
OUT2
R
+
FREQ
M3
100μF
10V
s2
80k
M1
Si4412DY
Si4412DY
FREQ/PLLFLTR
TG
C
B
4.7k
CMDSH-3
MBRS140T3
0.1μF
RUN
BOOST
0.1μF
C
SS
D
LTC3851
B
0.1μF
R
SENSE
CMDSH-3
T1A
T1B
0.01Ω
V
3.3V
2.5A
TK/SS
OUT1
SW
•
1
•
8 2
C
C
R
C
C
4700pF
7
C2
R2
1k
100pF
62.6k
I
TH
INTV
CC
C
OUT1
1%
+
+
100μF
10V
s2
47pF
4.7μF
M2
Si4412DY
R1
20k
1%
V
FB
BG
MBRS140T3
–
+
SENSE
GND
1000pF
SENSE
I
C
: MARCON THCR70EIH226ZT
LIM
IN
C
: AVX TPSD107M010R0065
: IRC LRF2512-01-R010F
OUT1,2
R
SENSE
T1: BI TECHNOLOGIES HM00-93839
3851TA06
RELATED PARTS
PART NUMBER
LTC1625/LTC1775
LTC1735
DESCRIPTION
No R
TM Current Mode Synchronous Step-Down Controllers
COMMENTS
97% Efficiency, No Sense Resistor, 16-Pin SSOP
Output Fault Protection, 16-Pin SSOP
SENSE
High Efficiency Synchronous Step-Down Switching Regulator
No R
LTC1778
Wide Input Range Synchronous Step-Down Controller Up to 97% Efficiency, 4V ≤ V ≤ 36V,
IN
SENSE
0.8V ≤ V
≤ (0.9)(V ), I
Up to 20A
OUT
IN OUT
LTC3727A-1
LTC3728
Dual, 2-Phase Synchronous Controller
Very Low Dropout, V
≤ 14V
OUT
2-Phase 550kHz, Dual Synchronous Step-Down Controller
20A to 200A PolyPhase® Synchronous Controllers
QFN and SSOP Packages
LTC3729
Expandable from 2-Phase to 12-Phase, Uses All Surface Mount
Components, No Heat Sink
LTC3731
LTC3773
LTC3810
LTC3811
3-Phase, 600kHz Synchronous Step-Down Controller
Triple Output DC/DC Synchronous Controller
0.6V ≤ V
≤ 6V, 4.5V ≤ V ≤ 32V, I
≤ 60A, Integrated
OUT
OUT
IN
MOSFET Drivers
3-Phase Step-Down DC/DC Controller, 3.3V ≤ V ≤ 36V, Fixed
Frequency 160kHz to 700kHz
IN
100V Current Mode Synchronous Nonisolated Switching
Regulator Controller
6.2V ≤ V ≤ 100V, 0.8V ≤ V
≤ 0.9V , No R
,
IN
OUT
IN
SENSE
Tracking and Synchronizable
Dual, PolyPhase Synchronous Step-Down Controller, 20A to 200A Differential Remote Sense Amplifier, R
Sense
or DCR Current
SENSE
LTC3826/LTC3826-1 Low I Dual Synchronous Controllers
4V ≤ V ≤ 36V, 0.8V ≤ V
≤ 10V, 30μA Quiescent Current
OUT
Q
IN
LTC3834/LTC3834-1 Low I Synchronous Step-Down Controllers
Single Channel LTC3826/LTC3826-1
4V ≤ V ≤ 60V, 1.23V ≤ V ≤ 36V, 120μA Quiescent Current
Q
LT®3845
Low I Synchronous Step-Down Controller
Q
IN
OUT
LTC3850
Dual, 2-Phase Synchronous Step-Down Controller
R
SENSE
or DCR Current Sensing
PolyPhase is a registered trademark of Linear Technology Corporation. No R
is a trademark of Linear Technology Corporation.
SENSE
3851f
LT 0708 • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
28
●
●
© LINEAR TECHNOLOGY CORPORATION 2008
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
相关型号:
LTC3851EUD#TRPBF
LTC3851 - Synchronous Step-Down Switching Regulator Controller; Package: QFN; Pins: 16; Temperature Range: -40°C to 85°C
Linear
LTC3851EUD-1#PBF
LTC3851-1 - Synchronous Step-Down Switching Regulator Controller; Package: QFN; Pins: 16; Temperature Range: -40°C to 85°C
Linear
LTC3851EUD-1#TRPBF
LTC3851-1 - Synchronous Step-Down Switching Regulator Controller; Package: QFN; Pins: 16; Temperature Range: -40°C to 85°C
Linear
LTC3851IMSE-1#PBF
LTC3851-1 - Synchronous Step-Down Switching Regulator Controller; Package: MSOP; Pins: 16; Temperature Range: -40°C to 85°C
Linear
LTC3851IMSE-1#TRPBF
LTC3851-1 - Synchronous Step-Down Switching Regulator Controller; Package: MSOP; Pins: 16; Temperature Range: -40°C to 85°C
Linear
©2020 ICPDF网 联系我们和版权申明