LTC4261_15 [Linear]

Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring;
LTC4261_15
型号: LTC4261_15
厂家: Linear    Linear
描述:

Negative Voltage Hot Swap Controllers with ADC and I2C Monitoring

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LTC4261/LTC4261-2  
Negative Voltage  
Hot Swap Controllers with  
2
ADC and I C Monitoring  
FEATURES  
DESCRIPTION  
Allows Safe Insertion into Live –48V Backplanes  
The LTC®4261/LTC4261-2 negative voltage Hot SwapTM  
controllersallowaboardtobesafelyinsertedandremoved  
n
n
10-Bit ADC Monitors Current and Voltages  
2
n
I C/SMBus Interface or Single-Wire Broadcast Mode from a live backplane. Using an external N-channel pass  
n
n
Floating Topology Allows Very High Voltage  
Operation  
Independently Adjustable Inrush and Overcurrent  
Limits  
Controlled Soft-Start Inrush  
Adjustable UV/OV Thresholds and Hysteresis  
Sequenced Power Good Outputs with Delays  
Adjustable Power Good Input Timeout  
Programmable Latchoff or Auto-Retry After Faults  
Alerts Host After Faults  
Available in 28-Lead Narrow SSOP and 24-Lead  
(4mm × 5mm) QFN Packages  
transistor, the board supply voltage can be ramped at an  
adjustable rate. The devices feature independently adjust-  
able inrush current and overcurrent limits to minimize  
stresses on the pass transistor during start-up, input  
step and output short conditions. The LTC4261 defaults  
to latch-off while the LTC4261-2 defaults to auto-retry on  
overcurrent faults.  
An I2C interface and onboard 10-bit ADC allow monitoring  
of board current, voltage and fault status. A single-wire  
broadcast mode is available to simplify the interface by  
eliminating two optoisolators.  
n
n
n
n
n
n
n
The controllers have additional features to interrupt the  
host when a fault has occurred, notify when output power  
is good, detect insertion of a board and turn off the pass  
transistor if an external supply monitor fails to indicate  
power good within a timeout period.  
APPLICATIONS  
n
AdvancedTCA Systems  
n
Telecom Infrastructure  
n
–48V Distributed Power Systems  
Power Monitors  
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks and Hot  
Swap is a trademark of Linear Technology Corporation. All other trademarks are the property of  
their respective owners. Protected by U.S. Patents, including 7382167, 8194379, 8230151.  
n
TYPICAL APPLICATION  
–48V/200W Hot Swap Controller with I2C and ADC  
–48V RTN  
Start-Up Behavior  
453k  
1%  
4 × 1k IN SERIES  
1/4W EACH  
V
–48V INPUT  
50V/DIV  
IN  
UV = 38.5V  
UVL  
UVH  
ADIN2  
OV  
PGI  
ALERT  
SDAO  
SDAI  
SCL  
ADIN  
PGIO  
PG  
UV RELEASE  
AT 43V  
16.9k  
1%  
V
OV = 72.3V  
OV RELEASE  
AT 71V  
OUT  
+
LTC4261CGN  
+
330µF  
100V  
50V/DIV  
V
IN  
INTV  
ON  
CC  
LOAD  
ON  
SENSE  
0.5A/DIV  
11.8k  
1%  
SS  
TMR EN V  
SENSE GATE DRAIN RAMP  
EE  
V
IN  
1M  
1k  
PG  
50V/DIV  
47nF  
1µF  
220nF  
47nF  
10Ω  
42612 TA01b  
10nF  
100V  
5%  
0.1µF  
10ms/DIV  
0.008Ω  
1%  
V
OUT  
–48V INPUT  
42612 TA01  
Q1  
IRF1310NS  
42612fd  
1
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
(Notes 1, 2)  
ABSOLUTE MAXIMUM RATINGS  
V (Note 3).......................................... –0.3V to 10.65V  
Operating Ambient Temperature Range  
IN  
Drain (Note 4) .......................................... –0.3V to 3.5V  
PGI, ON, ALERT, SDAO, SDAI, SCL, ADIN, ADIN2,  
OV, SENSE, ADR1, ADR0, FLTIN, TMR,  
LTC4261C ................................................ 0°C to 70°C  
LTC4261I .............................................–40°C to 85°C  
Storage Temperature Range  
SS, RAMP Voltages ...................–0.3V to INTV + 0.3V  
SSOP ................................................. –65°C to 150°C  
QFN.................................................... –65°C to 125°C  
Lead Temperature (Soldering, 10 sec)  
CC  
UVL, UVH, EN ............................................ –0.3V to 10V  
GATE Voltage .................................. –0.3V to V + 0.3V  
IN  
PG, PGIO Voltages .................................... –0.3V to 80V  
SSOP Only........................................................300°C  
Supply Voltage (INTV ).......................... –0.3V to 5.5V  
CC  
PIN CONFIGURATION  
TOP VIEW  
1
2
PGIO  
PG  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
PGI  
ON  
TOP VIEW  
3
EN  
ALERT  
SDAO  
SDAI  
SCL  
24 23 22 21 20  
4
ADR1  
ADR0  
ADIN  
FLTIN  
SDAO  
SDAI  
SCL  
1
2
3
4
5
6
7
19  
18  
17  
16  
15  
14  
13  
EN  
5
ADR1  
ADR0  
ADIN  
6
7
INTV  
CC  
INTV  
25  
CC  
8
V
IN  
UVL  
UVH  
ADIN2  
OV  
UVL  
V
IN  
9
TMR  
SS  
UVH  
OV  
TMR  
SS  
10  
11  
12  
13  
14  
8
9
10 11 12  
RAMP  
NC  
NC  
DRAIN  
GATE  
V
EE  
UFD PACKAGE  
24-LEAD (4mm × 5mm) PLASTIC QFN  
= 125°C, θ = 45°C/W  
SENSE  
T
JMAX  
JA  
EXPOSED PAD (PIN 25) IS GND, MUST BE SOLDERED TO PCB  
GN PACKAGE  
28-LEAD PLASTIC SSOP  
= 125°C, θ = 85°C/W  
T
JMAX  
JA  
ORDER INFORMATION  
LEAD FREE FINISH  
LTC4261CGN#PBF  
LTC4261IGN#PBF  
TAPE AND REEL  
PART MARKING*  
LTC4261CGN  
LTC4261IGN  
LTC4261IGN-2  
LTC4261IGN-2  
4261  
PACKAGE DESCRIPTION  
TEMPERATURE RANGE  
LTC4261CGN#TRPBF  
LTC4261IGN#TRPBF  
LTC4261CGN-2#TRPBF  
LTC4261IGN-2#TRPBF  
LTC4261CUFD#TRPBF  
LTC4261IUFD#TRPBF  
28-Lead Plastic SSOP  
0°C to 70°C  
28-Lead Plastic SSOP  
–40°C to 85°C  
0°C to 70°C  
LTC4261CGN-2#PBF  
LTC4261IGN-2#PBF  
LTC4261CUFD#PBF  
LTC4261IUFD#PBF  
LTC4261CUFD-2#PBF  
LTC4261IUFD-2#PBF  
28-Lead Plastic SSOP  
28-Lead Plastic SSOP  
–40°C to 85°C  
0°C to 70°C  
24-Lead (4mm × 5mm) Plastic QFN  
24-Lead (4mm × 5mm) Plastic QFN  
24-Lead (4mm × 5mm) Plastic QFN  
24-Lead (4mm × 5mm) Plastic QFN  
4261  
–40°C to 85°C  
0°C to 70°C  
LTC4261CUFD-2#TRPBF 42612  
LTC4261IUFD-2#TRPBF 42612  
–40°C to 85°C  
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.  
Consult LTC Marketing for information on non-standard lead based finish parts.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
42612fd  
2
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
ELECTRICAL CHARACTERISTICS  
The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at IIN = 5mA, TA = 25°C. (Note 2)  
SYMBOL  
General  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
l
l
l
l
l
l
V
Shunt Regulator Voltage at V  
I
I
= 5mA  
10.65  
11.2  
370  
2
11.8  
600  
5
V
mV  
mA  
V
Z
IN  
IN  
Shunt Regulator Load Regulation  
= 5mA to 25mA  
DV  
IN  
Z
I
IN  
V
V
V
Supply Current  
V
V
= V – 0.3V  
IN  
IN  
IN  
IN  
IN  
Z
V
Undervoltage Lockout Threshold  
Undervoltage Lockout Hysteresis  
Rising  
8.5  
0.3  
9
9.5  
1
IN(UVLO)  
0.7  
5
V
DV  
IN(UVLO)  
INTV  
Internal Regulator Voltage  
I
= 1mA to 20mA, I = 25mA  
4.75  
5.25  
V
CC  
LOAD  
IN  
Gate Drive  
l
l
l
l
l
l
l
V
GATE Pin Output High Voltage  
GATE Pin Pull-Up Current  
GATE Turn-Off Current  
V
V
V
= 10.65V  
10  
–7.5  
45  
10.25  
–11.5  
90  
10.5  
–15.5  
120  
140  
1.5  
V
µA  
mA  
mA  
µs  
GATEH  
IN  
I
I
= 4V  
GATE(UP)  
GATE(OFF)  
GATE  
= 400mV, V  
= 4V  
GATE  
SENSE  
Gate Off, V  
= 4V  
60  
110  
0.5  
GATE  
t
t
SENSE High to Current Limit  
Propagation Delay  
V
SENSE  
V
SENSE  
= 100mV, GATE Open  
= 300mV, GATE Open  
PHL(SENSE)  
0.2  
0.5  
µs  
GATE Off Propagation Delay  
Input High (OV, EN, PGI), Input Low (ON, UVL),  
GATE Open  
0.2  
0.5  
µs  
PHL(GATE)  
l
l
l
l
l
t
I
Circuit Breaker Gate Off Delay  
RAMP Pin Current  
V
< 2V, GATE Open  
GATE  
440  
–18  
2.43  
–7  
530  
–20  
2.56  
–10  
12  
620  
–22  
2.69  
–13  
20  
µs  
µA  
V
PHLCB  
V
SS  
= 2.56V  
RAMP  
V
SS Pin Clamp Voltage  
SS Pin Pull-Up Current  
SS Pin Pull-Down Current  
SS  
I
I
V
V
= 0V  
µA  
mA  
SS(UP)  
SS(DN)  
SS  
= 2.56V  
6
SS  
Input Pins  
l
l
V
UVH Threshold Voltage  
UVL Threshold Voltage  
V
V
Rising  
Falling  
LTC4261C  
LTC4261I  
2.534  
2.522  
2.56  
2.56  
2.586  
2.598  
V
V
UVH(TH)  
UVH  
l
l
V
LTC4261C  
LTC4261I  
2.263  
2.254  
2.291  
2.291  
2.319  
2.328  
UVL(TH)  
UVL  
l
Built-In UV Hysteresis  
UVH and UVL Tied Together  
256  
269  
15  
282  
mV  
mV  
V
DV  
UV(HYST)  
UVH, UVL Minimum Hysteresis  
UVL Reset Threshold Voltage  
UVL Reset Hysteresis  
dV  
UV  
l
V
V Falling  
UVL  
1.12  
1.21  
60  
1.30  
UVLR(TH)  
mV  
V
DV  
UVLR(HYST)  
l
l
V
OV Pin Threshold Voltage  
V
OV  
Rising  
LTC4261C  
LTC4261I  
1.744  
1.735  
1.770  
1.770  
1.796  
1.805  
OV(TH)  
l
l
l
OV Pin Hysteresis  
18  
45  
37.5  
50  
62  
55  
2
mV  
mV  
V
DV  
DV  
OV(HYST)  
Current Limit Sense Voltage Threshold  
ON, EN, PGI, FLTIN Threshold Voltage  
ON, EN, PGI, FLTIN Hysteresis  
PGIO Pin Input Threshold Voltage  
PGIO Pin Input Hysteresis  
V
– V  
SENSE  
EE  
SENSE  
V
ON, EN, PGI, FLTIN Falling or Rising  
0.8  
1.4  
170  
1.25  
100  
0
INPUT(TH)  
mV  
V
DV  
INPUT(HYST)  
PGIO(TH)  
l
l
V
V
PGIO  
Rising  
1.10  
1.40  
2
mV  
µA  
DV  
PGIO(HYST)  
I
ON, EN, UVH, UVL, OV, SENSE, PGI,  
FLTIN Input Current  
ON, EN, UVH, UVL, OV, SENSE, PGI, FLTIN = 3V  
INPUT  
42612fd  
3
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
ELECTRICAL CHARACTERISTICS  
The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at IIN = 5mA, TA = 25°C. (Note 2)  
SYMBOL  
Timer  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
l
l
l
V
TMR Pin High Threshold  
TMR Pin Low Threshold  
TMR Pin Pull-Up Current  
V
V
Rising  
Falling  
2.43  
40  
2.56  
75  
2.69  
110  
–13  
V
mV  
µA  
TMR(H)  
TMR(L)  
TMR  
V
TMR  
I
Turn-On and Auto-Retry (Except OC) Delays,  
= 0.2V  
–7  
–10  
TMR(UP)  
V
TMR  
l
l
l
Power Good, PGI Check and OC Auto-Retry  
Delays, V = 0.2V  
–3.5  
6
–5  
12  
5
–6.5  
20  
7
µA  
mA  
µA  
TMR  
I
TMR Pin Pull-Down Current  
Delays Except PGI Check or OC Auto-Retry,  
= 2.56V  
TMR(DN)  
V
TMR  
PGI Check and OC Auto-Retry Delays,  
= 2.56V  
3
V
TRM  
Output Pins  
l
l
V
PG, PGIO Pins Output Low  
I
, I = 3mA  
PG PGIO  
0.8  
0.15  
1.6  
0.4  
V
V
PWRGD  
I
, I  
= 500µA  
PG PGIO  
l
I
PG, PGIO Pins Leakage Current  
PG, PGIO = 80V  
0
10  
µA  
PWRGD  
ADC  
l
l
l
l
l
l
l
l
l
l
l
l
Resolution (No Missing Codes)  
Integral Nonlinearity  
(Note 5)  
10  
Bits  
LSB  
LSB  
LSB  
LSB  
mV  
V
INL  
SENSE  
0.5  
2.5  
1.25  
1.75  
1.25  
65.2  
2.606  
1.8  
ADIN2/OV, ADIN  
SENSE  
0.25  
V
OS  
Offset Error  
ADIN2/OV, ADIN  
SENSE  
Full-Scale Voltage  
Total Unadjused Error  
62.8  
64  
ADIN2/OV, ADIN  
SENSE  
2.514  
2.560  
%
ADIN2/OV, ADIN  
1.6  
%
Conversion Rate  
5.5  
2
7.3  
10  
0
9
Hz  
R
ADIN  
ADIN, ADIN2 Pins Input Resistance  
ADIN, ADIN2 Pins Input Current  
ADIN, ADIN2 = 1.28V  
ADIN, ADIN2 = 2.56V  
MW  
µA  
I
2
ADIN  
2
I C Interface  
l
V
ADR0, ADR1 Input High Threshold  
INTV  
INTV  
INTV  
CC  
– 0.3  
V
ADR(H)  
CC  
CC  
– 0.8  
– 0.5  
l
l
l
l
l
l
l
l
V
ADR0, ADR1 Input Low Threshold  
ADR0, ADR1 Input Current  
0.3  
0.5  
0.8  
V
µA  
µA  
V
ADR(L)  
I
ADR0, ADR1 = 0V, 5V  
80  
ADR(IN)  
ADR0, ADR1 = 0.8V, (INTV – 0.8V)  
10  
CC  
V
V
ALERT Pin Output Low Voltage  
SDAO Pin Output Low Voltage  
SDAO, ALERT Input Current  
SDAI, SCL Input Threshold  
SDAI, SCL Input Current  
I
I
= 4mA  
= 4mA  
0.2  
0.2  
0
0.4  
0.4  
5
ALERT(OL)  
ALERT  
V
SDAO(OL)  
SDAO  
I
SDAO, ALERT = 5V  
µA  
V
SDAO,ALERT(IN)  
V
1.6  
1.8  
0
2
SDAI,SCL(TH)  
SDAI,SCL(IN)  
I
SDAI, SCL = 5V  
2
µA  
42612fd  
4
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
ELECTRICAL CHARACTERISTICS  
The l denotes the specifications which apply over the full operating  
temperature range, otherwise specifications are at IIN = 5mA, TA = 25°C. (Note 2)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
2
I C Interface Timing (Note 5)  
f
t
t
t
Maximum SCL Clock Frequency  
Minimum SCL Low Period  
Minimum SCL High Period  
400  
kHz  
µs  
SCL(MAX)  
LOW  
0.65  
50  
1.3  
600  
1.3  
ns  
HIGH  
Minimum Bus Free Time Between Stop/  
Start Condition  
0.12  
µs  
BUF(MIN)  
t
t
Minimum Hold Time After (Repeated)  
Start Condition  
140  
30  
600  
600  
ns  
ns  
HD,STA(MIN)  
SU,STA(MIN)  
Minimum Repeated Start Condition  
Set-Up Time  
t
t
t
t
t
Minimum Stop Condition Set-Up Time  
Minimum Data Hold Time Input  
Minimum Data Hold Time Output  
Minimum Data Set-Up Time Input  
30  
–100  
600  
30  
600  
0
ns  
ns  
ns  
ns  
ns  
SU,STO(MIN)  
HD,DATI(MIN)  
HD,DATO(MIN)  
SU,DAT(MIN)  
SP(MAX)  
300  
900  
100  
250  
Maximum Suppressed Spike Pulse  
Width  
50  
25  
110  
t
Stuck-Bus Reset Time  
SCL or SDAI Held Low  
SDAI Tied to SDAO  
66  
5
ms  
pF  
RST  
C
SCL,SDA Input Capacitance  
10  
X
The pin can be safely tied to higher voltages through a resistor that limits  
the current below 50mA.  
Note 4: An internal clamp limits the DRAIN pin to a minimum of 3.5V.  
Driving this pin to voltages beyond the clamp may damage the part. The  
pin can be safely tied to higher voltages through a resistor that limits the  
current below 2mA.  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 2: All currents into pins are positive, all voltages are referenced to  
device GND (V ) unless otherwise specified.  
EE  
Note 5: Guaranteed by design and not subject to test.  
Note 3: An internal shunt regulator limits the V pin to a minimum of  
IN  
10.65V. Driving this pin to voltages beyond 10.65V may damage the part.  
42612fd  
5
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
IIN = 5mA, TA = 25°C, unless otherwise noted  
TYPICAL PERFORMANCE CHARACTERISTICS  
Shunt Regulator Voltage  
vs Input Current  
Shunt Regulator Voltage  
vs Temperature  
INTVCC vs Load Current  
30  
25  
11.35  
11.30  
11.25  
11.20  
5.06  
I
IN  
= 25mA  
I
= 5mA  
IN  
5.04  
5.02  
5.00  
4.98  
4.96  
20  
15  
10  
5
11.15  
11.10  
0
10.8  
11  
11.2  
11.4  
11.6  
11.8  
–50  
–25  
0
25  
50  
75  
100  
10  
LOAD CURRENT (mA)  
0
5
15  
20  
SHUNT REGULATOR VOLTAGE AT V (V)  
TEMPERATURE (°C)  
IN  
42612 G01  
42612 G02  
42612 G03  
GATE Output High Voltage  
vs Temperature  
GATE Pull-Up Current  
vs GATE Voltage  
GATE Turn-Off Current  
vs SENSE Voltage  
10.5  
10.4  
10.3  
10.2  
10.1  
10.0  
–12  
–10  
–8  
–6  
–4  
–2  
0
100  
10  
1
V
= 4V  
V
= 10.65V  
GATE  
IN  
–50  
0
25  
50  
75  
100  
100  
200  
300  
400  
500  
–25  
0
4
6
8
10  
12  
0
2
TEMPERATURE (°C)  
GATE VOLTAGE (V)  
V
(mV)  
SENSE  
42612 G06  
42612 G04  
42612 G05  
UVH Threshold vs Temperature  
UVL Threshold vs Temperature  
RAMP Pin Current vs Temperature  
–22.0  
–21.5  
–21.0  
–20.5  
–20.0  
–19.5  
–19.0  
2.575  
2.570  
2.565  
2.560  
2.555  
2.550  
2.545  
2.305  
2.300  
2.295  
2.290  
2.285  
2.280  
2.275  
–50  
0
25  
50  
75  
100  
–50  
0
25  
50  
75  
100  
–50  
0
25  
50  
75  
100  
–25  
–25  
–25  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
42612 G07  
42612 G08  
42612 G09  
42612fd  
6
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
IIN = 5mA, TA = 25°C, unless otherwise noted  
TYPICAL PERFORMANCE CHARACTERISTICS  
Current Limit Voltage  
vs Temperature  
52.0  
OV Hysteresis vs Temperature  
OV Threshold vs Temperature  
1.785  
1.780  
1.775  
1.770  
1.765  
1.760  
1.755  
50  
45  
40  
35  
51.5  
51.0  
50.5  
50.0  
49.5  
49.0  
30  
25  
–50  
0
25  
50  
75  
100  
–50  
0
25  
50  
75  
100  
–50  
0
25  
50  
75  
100  
–25  
–25  
–25  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
42612 G10  
42612 G11  
42612 G12  
Current Limit Propagation Delay  
(tPHL(SENSE)) vs VSENSE  
PG, PGIO Output Low  
vs Load Current  
ADC Total Unadjusted Error  
vs Code (ADIN Pin)  
1000  
1.0  
0.5  
6
5
C
= 1pF  
GATE  
T
= 85°C  
A
4
3
T
= 25°C  
A
0
2
1
0
–0.5  
–1.0  
T
= –40°C  
A
100  
0
100  
200  
V
300  
400  
500  
512  
768  
0
1024  
0
2
4
6
8
10  
256  
LOAD CURRENT (mA)  
(mV)  
CODE  
SENSE  
42612 G13  
42612 G15  
42612 G14  
ADC Full-Scale Error vs  
Temperature (ADIN Pin)  
ADC INL vs Code (ADIN Pin)  
ADC DNL vs Code (ADIN Pin)  
3
2
1.0  
0.5  
1.0  
0.5  
1
0
0
0
–1  
–2  
–3  
–0.5  
–1.0  
–0.5  
–1.0  
–50  
0
25  
50  
75  
100  
–25  
512  
768  
512  
768  
0
1024  
0
1024  
256  
256  
TEMPERATURE (°C)  
CODE  
CODE  
42612 G16  
42612 G17  
42612 G18  
42612fd  
7
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
PIN FUNCTIONS (SSOP/QFN)  
ADIN (Pin 23/Pin 16): ADC Input. A voltage between 0V  
GATE (Pin 15/Pin 10): N-Channel FET Gate Drive Output.  
This pin is pulled up by an internal current source I  
and 2.56V applied to this pin is measured by the on-chip  
GATE  
ADC. Tie to V if unused.  
(11.5µA when the SS pin reaches its clamping voltage).  
GATE stays low until V and INTV cross the UVLO  
EE  
IN  
CC  
ADIN2 (Pin 10/NA): Second ADC Input. Not available on  
QFN package.  
thresholds, UV and OV conditions are satisified and an  
adjustable timer delay expires. During turn-off, caused by  
ADR0, ADR1 (Pins 24, 25/Pins 17, 18): Serial Bus Ad-  
faults or undervoltage lockout (V or INTV ), a 110mA  
IN  
CC  
dress Inputs. Tying these pins to V , OPEN or INTV  
pull-down current between GATE and V is activated.  
EE  
CC  
EE  
configures one of nine possible addresses. See Table 1  
INTV (Pin 7/Pin 4): Low Voltage (5V) Supply Output.  
CC  
in Applications Information.  
This is the output of the internal linear regulator with an  
internal UVLO threshold of 4.25V. This voltage powers up  
the data converter and logic control circuitry. Bypass this  
ALERT(Pin3/Pin24):FaultAlertOutput. Open-drainlogic  
outputthatpullstoV whenafaultoccurstoalertthehost  
EE  
controller. A fault alert is enabled by the ALERT register.  
pin with a 0.1µF capacitor to V .  
EE  
See Applications Information. Connect to V if unused.  
EE  
ON (Pin 2/Pin 23): On Control Input. A rising edge turns  
on the external N-channel FET while a falling edge turns it  
off. This pin is also used to configure the state of the FET  
ON register bit D3 in the CONTROL register (and hence  
the external FET) at power-up. For example if the ON pin  
is tied high, then the register bit D3 goes high one timer  
cycleafterpower-up.Likewise,iftheONpinistiedlow,then  
the device remains off after power-up until the register bit  
DRAIN (Pin 16/Pin 11): Drain Sense Input. Connect an  
external1Mresistorbetweenthispinandthedrainterminal  
(V ) of the N-channel FET. When the DRAIN pin volt-  
OUT  
age is less than 1.77V and the GATE pin voltage is above  
V – 1.2V the power good outputs are asserted after a  
Z
delay. The voltage at this pin is internally clamped to 4V.  
EN(Pin26/Pin19):DeviceEnableInput.Pulllowtoenable  
the N-channel FET to turn-on after a start-up debounce  
delay set by the TMR pin. When this pin is pulled high, the  
FET is off. Transitions on this pin will be recorded in the  
FAULT register. A high-to-low transition activates the logic  
to read the state of the ON pin and clear faults. Requires  
external pull-up. Debouncing with an external capacitor  
is recommended when used to monitor board present.  
2
D3 is set high using the I C bus. A high-to-low transition  
on this pin clears faults.  
OV (Pin 11/Pin 7): Overvoltage Detection Input. Connect  
this pin to an external resistive divider from V . If the  
EE  
voltage at the pin rises above 1.77V, the N-channel FET is  
turned off. The overvoltage condition does not affect the  
status of the power good outputs. On the QFN package,  
this pin is also measured by the on-chip ADC. Connect  
Connect to V if unused.  
EE  
to V if unused.  
EE  
Exposed Pad (Pin 25, QFN Only): Exposed Pad may be  
left open or connected to device ground (V ).  
PG(Pin27/Pin20):PowerGoodStatusOutput.Thisopen-  
EE  
drain pin pulls low and stays latched a timer delay after  
FLTIN (Pin 22/NA): General Purpose Fault Input. If this  
pin pulls low, the FAULT register bit B7 is latched to “1.”  
This pin is used to sense an external fault condition and  
its status does not affect the FET control functions of the  
LTC4261. Not available on the QFN package. Connect to  
the FET is on (when GATE reaches V – 1.2V and DRAIN  
Z
is within 1.77V of V ). The power good output is reset  
EE  
in all GATE pull-down events except an overvoltage fault.  
Connect to V if unused.  
EE  
INTV if unused.  
CC  
42612fd  
8
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
(SSOP/QFN)  
PIN FUNCTIONS  
PGI (Pin 1/Pin 22): Power Good Input. This pin along with  
the PGI check timer serves as a watchdog to monitor the  
power-up of the DC/DC converter. The PGI pin must be low  
before the PGI check timer expires, otherwise the GATE  
pin pulls down and stays latched and a power bad fault  
is logged into the FAULT register. The PGI timer is started  
after the second power good is latched and its delay is  
equal to four times the start-up debounce delay. Connect  
SDAO (Pin 4/Pin 1): Serial Bus Data Output. Open-drain  
output used for sending data back to the master controller  
or acknowledging a write operation. An external pull-up  
resistororcurrentsourceisrequired. Normallyconnected  
to the input of the outgoing optoisolator that outputs to  
the SDA port of the master controller. In the single-wire  
broadcast mode, the SDAO pin sends out selected data  
that is encoded with an internal clock.  
to V if unused.  
EE  
SENSE (Pin 14/Pin 9): Current Limit Sense Input. Load  
PGIO (Pin 28/Pin 21): General Purpose Input/Output.  
Open-drain logic output and logic input. Defaults to pull  
low a timer delay after the PG pin goes low to indicate a  
secondpowergoodoutput.ConfigureaccordingtoTable6.  
current through the external sense resistor (R ) is moni-  
S
tored and controlled by an active current limit amplifier  
to 50mV/R . Once V  
reaches 50mV, a circuit breaker  
S
SENSE  
timerstartsandturnsoffthepasstransistorafter530µs.In  
the event of a catastrophic short circuit, if V crosses  
SENSE  
RAMP (Pin 18/Pin 12): Inrush Current Ramp Control  
250mV, a fast response comparator immediately pulls the  
Pin. The inrush current is set by placing a capacitor (C )  
R
GATEpindowntocontrolthecurrentoftheN-channelFET.  
between the RAMP pin and the drain terminal of the FET.  
At start-up, the GATE pin is pulled up by I  
until the  
SS (Pin 19/Pin 13): Soft-Start Input. Connect a capaci-  
tor to this pin to control the rate of rise of inrush current  
(dI/dt) during start-up. An internal 10µA current source  
GATE(UP)  
pass transistor begins to turn on. A current, I  
, then  
RAMP  
flows through C to ramp down the output voltage V  
.
R
OUT  
The value of I  
is controlled by the SS pin voltage.  
charging the external soft-start capacitor (C ) creates  
RAMP  
SS  
When the SS pin reaches its clamp voltage (2.56V), I  
= 20µA. The ramp rate of V  
set the inrush current: I  
a voltage ramp. This voltage is converted to a current to  
charge the GATE pin up and to ramp the output voltage  
down. The SS pin is internally clamped to 2.56V limiting  
RAMP  
and the load capacitor C  
= (C /C ) • I  
OUT  
L
.
INRUSH  
L
R
RAMP  
I
to 11.5µA and I  
to 20µA. If the SS capacitor  
GATE(UP)  
RAMP  
SCL (Pin 6/Pin 3): Serial Bus Clock Input. Data at the  
SDAI pin is shifted in and data at the SDAO pin is shifted  
out on rising edges of SCL. This is a high impedance pin  
that is generally connected to the output of the incoming  
optoisolatordrivenbytheSCLportofthemastercontroller.  
An external pull-up resistor or current source is required.  
is absent, the SS pin ramps from 0V to 2.56V in 220µs.  
TMR(Pin20/Pin14):DelayTimerInput.Connectacapaci-  
tor (C ) to this pin to create timing delays at start-up,  
TMR  
when power good outputs pull down, during PGI check  
and when auto-retrying after faults (except overvoltage  
fault). Internal pull-up currents of 10µA and 5µA and  
pull-down currents of 5µA and 12mA configure the delay  
Pull up to INTV if unused.  
CC  
SDAI (Pin 5/Pin 2): Serial Bus Data Input. This is a high  
impedance input pin used for shifting in command bits,  
data bits and SDAO acknowledge bits. An external pull-up  
resistororcurrentsourceisrequired. Normallyconnected  
to the output of the incoming optoisolator that is driven  
by the SDA port of the master controller. If the master  
controller separates SDAI and SDAO, data read at SDAO  
periods as multiples of a nominal delay of 256ms • C  
/
TMR  
µF. Delays for start-up and auto-retry following undervolt-  
age or power bad fault are the same as the nominal delay.  
Delays for sequenced power good outputs are twice of the  
nominal delay. Delays for PGI check and auto-retry fol-  
lowing overcurrent fault are four times the nominal delay.  
2
needs to be echoed back to SDAI for proper I C commu-  
nication. Pull up to INTV if unused.  
CC  
42612fd  
9
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
PIN FUNCTIONS (SSOP/QFN)  
V
(Pin 13/Pin 8): Negative Supply Voltage Input and  
UVH (Pin 9/Pin 6): Undervoltage High Level Input. Con-  
EE  
Device Ground. Connect this pin to the negative side of  
nect this pin to an external resistive divider from V . If  
EE  
the power supply.  
the voltage at the UVH pin rises above 2.56V the pass  
transistor is allowed to turn on. A small capacitor at this  
pinpreventstransientsandswitchingnoisefromaffecting  
V (Pin 21/Pin 15): Positive Supply Input. Connect this  
IN  
pin to the positive supply through a dropping resistor. An  
the UVH threshold. Connect to INTV if unused.  
CC  
internal shunt regulator clamps V at 11.2V. An internal  
IN  
undervoltage lockout (UVLO) circuit holds the GATE low  
UVL (Pin 8/Pin 5): Undervoltage Low Level Input. Con-  
nect this pin to an external resistive divider from V . If  
until V is above 9V. Bypass this pin with a 1µF capacitor  
IN  
EE  
to V .  
the voltage at the UVL pin drops below 2.291V, the pass  
transistor is turned off and the power good outputs go  
high impedance. Pulling this pin below 1.21V resets faults  
and allows the pass transistor to turn back on. Connect  
EE  
to INTV if unused.  
CC  
42612fd  
10  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
BLOCK DIAGRAM  
V
IN  
INTV  
CC  
V
IN  
11.2V  
UVLO:  
IN  
INTV = 4.25V  
CC  
V
CC  
V
= 9V  
+
GATE  
20µA  
V
5V  
EE  
SSA  
RAMP  
SENSE  
+
10µA  
50nA  
3pF  
V
EE  
+
ACL  
50mV  
+
V
EE  
V
EE  
+
2.56V  
SS  
V
EE  
40¥  
V
SENSE  
SSC  
PG  
UVL  
UVH  
OV  
UVL  
UVH  
+
2.291V  
2.56V  
V
EE  
PGIO  
+
V
OV  
EE  
FLTIN  
PGI  
+
LOGIC  
1.77V  
5µA  
EN  
5µA  
ON  
+
DRAIN  
DC  
TMR  
TMR  
+
1.77V  
4V  
2.56V  
5µA  
+
GC  
V
EE  
V
– 1.2V  
Z
12mA  
GATE  
2
ADR0  
ADR1  
SCL  
8
I C DEVICE ADDRESS  
SINGLE-WIRE ENABLE  
= 2.56V  
A0  
DECODER  
MUX  
SDAI  
A7  
A8  
SDAO  
2
I C  
INTERFACE  
V
REF  
ADIN  
10  
10  
ALERT  
ADIN2/OV  
10-BIT ADC  
REGISTER  
V
SENSE  
V
EE  
42612 BD  
42612fd  
11  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
OPERATION  
The LTC4261/LTC4261-2 are designed to turn a board’s  
supply voltage on and off in a controlled manner, allowing  
theboardtobesafelyinsertedorremovedfromalive–48V  
backplane.Thedevicesalsofeatureanonboard10-bitADC  
and I2C interface that allows monitoring board current,  
voltages and faults. The main functional circuits of the  
LTC4261/LTC4261-2 are illustrated in the Block Diagram.  
The DRAIN and the GATE voltages are monitored to de-  
termine if power is available for the load. Two power good  
signals are sequenced on the PG pin (first power good  
signal)andthePGIOpin(secondpowergoodsignal),each  
with a debounce delay that is twice the start-up delay. The  
PGIO pin can also be used as a general purpose input or  
output. The PGI pin serves as a watchdog to monitor the  
output of the DC/DC module. If the module output fails to  
come up, the LTC4261/LTC4261-2 shut down.  
In normal operation after a start-up debounce delay, the  
GATE pin turns on the external N-channel FET passing  
power to the load. The GATE pin is powered by a shunt  
regulated 11.2V supply on the VIN pin that is derived  
from –48V RTN through a dropping resistor. The turn-on  
sequence starts by pulling the SS pin up. The voltage at  
the SS pin is converted to a current, IGATE(UP), pulling the  
GATE up. When the pass FET starts to turn on and charge  
the load capacitor, the inrush current flowing through the  
FET is a function of the capacitor at RAMP (CR), the load  
capacitor (CL) and the ramp current (IRAMP) that flows  
from the RAMP pin to CR:  
The TMR pin generates delays for initial start-up, auto-  
retry following a fault, power good outputs and PGI check.  
The logic circuits a re powered by an internally generated  
5V supply (available on the INTVCC pin). Prior to turning  
on the pass FET, both VIN and INTVCC voltages must ex-  
ceed their undervoltage lockout thresholds. In addition,  
the control inputs UVH, UVL, OV, EN, ON and PGI are  
monitored by comparators. The FET is held off until all  
start-up conditions are met.  
A10-bitanalog-to-digitalconverter(ADC)isincludedinthe  
LTC4261/LTC4261-2. The ADC measures SENSE resistor  
voltage as well as voltage at the ADIN2/OV (SSOP/QFN)  
andADINpins.Theresultsarestoredinon-boardregisters.  
CL  
CR  
I
= IRAMP •  
INRUSH  
IRAMP and IGATE(UP) are approximately proportional to  
the SS pin voltage and are limited to 20µA and 11.5µA,  
respectivelywhenSSreachesitsclampingvoltage(2.56V).  
An I2C interface is provided to read the ADCdata registers.  
It also allows the host to poll the device and determine if a  
faulthasoccurred.IftheALERTlineisusedasaninterrupt,  
the host can respond to a fault in real time. The SDA line  
is divided into SDAI (input) and SDAO (output) to facili-  
tate opto coupling with the system host. Two three-state  
pins, ADR0 and ADR1, are used to decode eight device  
addresses. The interface can also be configured through  
the ADR0 and ADR1 pins for a single-wire broadcast  
mode, sending ADC data and faults status through the  
SDAO pin to the host without clocking the SCL line. This  
single-wire, one-way communication simplifies system  
design by eliminating two optocouplers on SCL and SDAI  
that are required by an I2C interface.  
TheACLamplifierisusedforovercurrentandshort-circuit  
protection.ItmonitorstheloadcurrentthroughtheSENSE  
pin voltage and a sense resistor RS. In an overcurrent  
condition, the ACL amplifier limits the current to 50mV/  
RS by pulling down GATE in an active servo loop. After a  
530µs timeout, the ACL amplifier turns off the pass FET.  
In the event of a catastrophic short circuit, when VSENSE  
crosses 250mV, a fast response comparator immediately  
pulls the GATE pin down.  
42612fd  
12  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
The LTC4261/LTC4261-2 are ideally suited for –48V  
distributed power systems and AdvancedTCA systems.  
A basic 200W application circuit using the LTC4261 is  
shown in Figure 1. A more complete application circuit  
with AdvancedTCA connections is shown in Figure 2.  
Input Power Supply  
Power for the LTC4261/LTC4261-2 is derived from the  
–48V RTN through an external current limiting resistor  
(R ) to the V pin. An internal shunt regulator clamps  
IN  
IN  
–48V RTN  
R
IN  
R3  
453k  
1%  
4 × 1k IN SERIES  
1/4W EACH  
7
21  
8
9
22  
1
6
5
4
INTV  
V
IN  
CC  
UVL  
UVH  
ADIN2  
OV  
SS  
TMR  
EN  
FLTIN  
PGI  
SCL  
SDAI  
SDAO  
ALERT  
UV = 38.5V  
R2  
16.9k  
1%  
UV RELEASE  
AT 43V  
10  
11  
19  
20  
26  
2
+
C
L
OV = 72.3V  
+
330µF  
100V  
V
IN  
OV RELEASE  
AT 71V  
3
LTC4261CGN  
MODULE2  
+
ON  
V
V
IN  
PGIO 28 PWRGD2  
IN  
MODULE1  
ON  
ADR1  
ADRO  
25  
24  
27 PWRGD1  
PG  
23  
ON  
V
ADIN  
IN  
V
SENSE GATE DRAIN RAMP  
EE  
13  
14  
15  
16  
18  
C
C
C
UV  
100nF  
IN  
SS  
220nF  
1µF  
R
10Ω  
R
1M  
R
1k  
C
47nF  
G
D
F
G
R1  
11.8k  
1%  
C
C
VCC  
0.1µF  
TMR  
47nF  
C
R
C
F
10nF  
100V  
5%  
R
S
33nF  
0.008Ω  
1%  
V
OUT  
–48V INPUT  
R10  
10k 1%  
R11  
402k 1%  
Q1  
IRF1310NS  
42612 F01  
Figure 1. –48V/200W Hot Swap Controller Using LTC4261 with Current,  
Input Voltage and VDS Monitoring (5.6A Current Limit, 0.66A Inrush)  
MBRM5100  
10A  
RTN A  
A
MBRM5100  
10A  
R3  
412k  
1%  
RTN B  
UV TURN OFF = 34.2V  
UV RELEASE = 37.5V  
OV TURN OFF = 74.8V  
OV RELEASE = 73.2V  
R12  
10k  
Q9  
2N5401  
ENABLE A  
ENABLE B  
R13  
10k  
R
604Ω  
1%  
H
Q10  
2N5401  
8
9
UVL  
UVH  
ADIN2  
OV  
SS  
TMR  
EN  
R2  
19.1k  
1%  
R10  
R11  
R14  
R15  
100k  
10  
11  
19  
20  
26  
2
100k 100k  
100k  
1N4148  
×2  
C
UV  
100nF  
LTC4261CGN  
ON  
ADR1  
ADR0  
25  
24  
V
SENSE GATE DRAIN RAMP  
EE  
13  
C
SS  
330nF  
14  
15  
16  
18  
R1  
10.5k  
1%  
R
R
R
1k  
C
47nF  
G
D
F
G
C
R16  
100k  
TMR  
330nF  
V
10Ω  
1M  
EE  
LTC4354  
C
R
C
EN  
1µF  
C
33nF  
F
7A  
7A  
10nF  
100V  
5%  
HZS5C1  
R
S
–48V A  
–48V B  
0.008Ω  
5%  
B
42612 F02a  
Q1  
IRF1310NS  
BACKPLANE  
PLUG-IN  
CARD  
Figure 2a. 200W AdvancedTCA Hot Swap Controller with Input/Output Monitoring  
and Power Good Watchdog Using LTC4261 in I2C Mode (Part One)  
42612fd  
13  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
RTN  
the voltage at V to 11.2V (V ) and provides power to the  
IN  
Z
GATE driver. The data converter and logic control circuits  
are powered by an internal linear regulator that derives  
5V from the 11.2V supply. The 5V output is available at  
100Ω  
V
OR  
CC  
IN  
BCP56  
INTV  
10.5V OR 4.3V  
42612 F03  
the INTV pin for driving external circuits (up to 20mA  
CC  
Figure 3. NPN Buffer Relieves RIN of Excessive Dissipation  
when Supplying External Loads  
load current).  
Bypass capacitors of 1µF and 0.1µF are recommended  
Initial Start-Up and Inrush Control  
at V and INTV , respectively. R should be chosen to  
IN  
CC  
IN  
accommodate the maximum supply current requirement  
SeveralconditionsmustbesatisfiedbeforetheFETturn-on  
of the LTC4261/LTC4261-2 (5mA) plus the supply current  
sequence is started. First the voltage at V must exceed  
IN  
required by any external devices driven by the V and  
IN  
its 9V undervoltage lockout level. Next the internal supply  
INTV pins at the minimum intended operation voltage.  
CC  
INTV must cross its 4.25V undervoltage lockout level.  
CC  
This generates a 100µs to 160µs power-on-reset pulse  
during which the FAULT register bits are cleared and the  
CONTROL register bits are set or cleared as described in  
the register section. After the power-on-reset pulse, the  
voltages at the UVH, UVL and OV pins must satisfy UVH  
> 2.56V, UVL > 2.291V and OV < 1.77V to indicate that  
the input power is within the acceptable range and the EN  
pin must be pulled low. All the above conditions must be  
satisfiedthroughoutthedurationofthestart-updebounce  
V48V(MIN) – VZ(MAX)  
RIN ≤  
IIN(MAX) + IEXTERNAL  
The maximum power dissipation in the resistor is:  
2
)
V
48V(MAX) – VZ(MIN)  
(
PMAX  
=
RIN  
If the power dissipation is too high for a single resistor,  
use multiple resistors in series or supply external loads  
from a separate NPN buffer as illustrated in Figure 3.  
delaythatissetbyanexternalcapacitor(C  
)connected  
TMR  
to the TMR pin. C  
is charged with a pull-up current of  
TMR  
–48V RTN OUTPUT  
A
R17  
R18  
100k  
1%  
R4  
20k  
OUTPUT  
100k  
SENSE  
R
1%  
SUPPLY  
IN  
8 × 240Ω IN SERIES  
MONITOR  
+
Q11  
2N5401  
Q12  
2N5401  
V
IN  
1/4W EACH  
5V  
+
+
+
V
OUT  
V
V
IN  
V
OUT  
DD  
R21  
1k  
LUCENT  
LTC2900  
LUCENT  
FLTR100V10  
MOC207  
Q8  
JW050A1-E  
R19  
2.49k  
1%  
R20  
2.49k  
1%  
RST  
GND  
C
C
IN  
1µF  
VCC  
0.1µF  
ON/OFF  
R6  
R7A  
10k  
R7B  
10k  
R7  
100k  
100k  
V
V
V
OUT  
CASE  
IN  
OUT  
CASE  
V
EE  
V
EE  
V
V
OUT  
R8  
7.5k  
R9  
5.1k  
EE  
V
V
7
21  
23  
ADIN  
IN  
22  
1
6
INTV  
V
IN  
CC  
FLTIN  
PGI  
SCL  
V
OUT  
EE  
5V  
5
C
L
SDAI  
R22  
1k  
R23  
1k  
R24  
5.1k  
4000µF  
+
100V  
Q5  
28  
27  
Q6  
Q7  
LTC4261CGN  
PGIO  
PG  
0V TRANSIENT  
RESEVOIR  
CAPACITOR  
V
V
CC  
ANODE  
CC  
ANODE  
CATHODE  
V
O
V
O
V
DD  
SCL  
SDA  
4
3
CATHODE  
GND  
MOC207  
SDAO  
ALERT  
GND  
Q3  
Q4  
MICRO-  
CONTROLLER  
PS9113  
PS9113  
V
V
CC  
ANODE  
CC  
ANODE  
V
EE  
R
L
V
O
ALERT RST  
CATHODE V  
GND  
CATHODE  
GND  
GND  
OUT  
R
L
HCPL-0300  
6N139  
343Ω  
V
MBRM5100  
OUT  
7 × 2.4k, 0805  
EACH 28.7W  
42612 F02b  
B
Figure 2b. 200W AdvancedTCA Hot Swap Controller with Input/Output Monitoring  
and Power Good Watchdog Using LTC4261 in I2C Mode (Part Two)  
42612fd  
14  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
10µA until the voltage at TMR reaches 2.56V. C  
is then  
During board insertion and input power step, an internal  
TMR  
quickly discharged with a 12mA current. The initial delay  
expires when TMR is brought below 75mV. The duration  
of the start-up delay is given by:  
clamp turns on to hold the RAMP pin low. Capacitor C  
F
and resistor R suppress the noise at the RAMP pin. For  
proper operation, R • C should not exceed 50µs. The  
F
F
R
F
recommended value of C is 3 • C .  
R
CTMR  
tD = 256ms •  
1µF  
Power Good Monitors  
Ifanyoftheaboveconditionsisviolatedbeforethestart-up  
When V of the pass transistor falls below 1.77V and  
DS  
delay expires, C  
is quickly discharged and the turn-on  
GATE pulls above V – 1.2V, an internal power good signal  
TMR  
Z
sequenceisrestarted. Afteralltheconditionsarevalidated  
throughout the start-up delay, the ON pin is then checked.  
If it is high, the FET will be turned on. Otherwise, the FET  
will be turned on when the ON pin is raised high or the FET  
ON bit D3 in the CONTROL register is set to “1” through  
is latched and a series of three delay cycles are started  
as shown in Figure 4. When the first delay cycle with a  
duration of 2t expires, the PG pin pulls low as a power  
D
good signal to turn on the first module. When the second  
delaycycle(2t )expires,thePGIOpinpullslowasapower  
D
2
the I C interface.  
good signal to turn on the second module. The third delay  
cycle with a duration of 4t is for PGI check. Before the  
D
The FET turn-on sequence follows by charging an external  
third delay cycle expires, the PGI pin must be pulled low  
by an external supply monitor (such as the LTC2900 in  
Figure 2) to keep the FET on. Otherwise, the FET is turned  
off and the power bad fault (PBAD) is logged in the FAULT  
capacitor at the SS pin (C ) with a 10µA pull-up current  
SS  
and the voltage at SS (V ) is converted to a current  
SS  
(I  
) of 11.5µA· V /2.56V for GATE pull-up. When  
GATE(UP)  
SS  
the GATE reaches the FET threshold voltage, the inrush  
register. The 2t timer delay is obtained by charging C  
D
TMR  
with a 12mA  
currentstartstoflowthroughtheFETandacurrent(I  
)
RAMP  
with a 5µA current and discharging C  
TMR  
of20µA·V /2.56VflowsoutoftheRAMPpinandthrough  
SS  
current when TMR reaches 2.56V. For the 4t timer delay,  
D
an external capacitor (C ) connected between RAMP and  
R
the charging and discharging currents of C  
are both  
TMR  
V
. The SS voltage is clamped to 2.56V, which cor-  
OUT  
5µA. The power good signals at PG and PGIO are reset in  
responds to I  
= 11.5µA and I  
= 20µA. The  
GATE(UP)  
RAMP  
all FET turn-off conditions except the overvoltage fault.  
RAMP pin voltage is regulated at 1.1V and the ramp rate  
of V  
determines the inrush current:  
OUT  
Turn-Off Sequence and Auto-Retry  
CL  
In any of the following conditions, the FET is turned off  
by pulling down GATE with a 110mA current, and CSS  
and CTMR are discharged with 12mA currents.  
IINRUSH = 20µA •  
CR  
TheramprateofV determinesdI/dtoftheinrushcurrent:  
SS  
1. The ON pin is low or the ON bit in the CONTROL reg-  
ister is set to 0.  
dIINRUSH  
dt  
CL  
1µF  
= 20µA •  
CR 256ms CSS  
2. The EN pin is high.  
If C is absent, an internal circuit pulls the SS pin from  
SS  
0V to 2.56V in about 220µs.  
3. The voltage at UVL is lower than 2.291V and the volt-  
age at UVH is lower than 2.56V (undervoltage fault).  
When V  
is ramped down to V , I  
returns to  
. Figure 4  
OUT  
EE GATE  
the GATE pin and pulls the GATE up to V  
4. The voltage at OV is higher than 1.77V (overvoltage  
fault).  
GATEH  
illustrates the start-up sequence of the LTC4261/  
LTC4261-2.  
5. The voltage at V is lower than 9V (V undervoltage  
IN  
IN  
lockout).  
42612fd  
15  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
RTN_V  
EE  
UVH  
PWRGD1  
DELAY  
PWRGD2  
DELAY  
PGI CHECK  
DELAY  
START-UP DELAY  
TMR  
SS  
1x  
2x  
2x  
4x  
V
– 1.2V  
Z
GATE  
V
OUT  
1.77V  
50mV  
LOAD 1 + LOAD 2  
LOAD 1  
SENSE  
INRUSH  
LATCHED  
INTERNAL  
PWRGD  
PWRGD1  
READY  
PG  
PWRGD2  
READY  
PGIO  
POWER BAD  
PGI  
NORMAL PGI  
42612 F04  
Figure 4. LTC4261 Turn-On Sequence  
to 0, the FET is latched off upon the fault condition. If  
the auto-retry bit is set to 1, after the fault condition is  
cleared, a delay timer is started. After the timer expires,  
the FET enters the auto-retry mode and GATE is pulled  
up. The auto-retry delay following the undervoltage fault  
6. The voltage at INTV is lower than 4.25V (INTV  
CC  
CC  
undervoltage lockout).  
7. V  
> 50mV and the condition lasts longer than  
SENSE  
530µs (overcurrent fault).  
or the power bad fault has a duration of t . The auto-  
8. The PGI pin is high when the PGI check timer expires  
D
retry delay following the overcurrent fault has a duration  
(power bad fault).  
of 4t for extra cooling time. The auto-retry following the  
D
For conditions 1, 2, 5, 6, after the condition is cleared,  
the LTC4261/LTC4261-2 will automatically enter the FET  
turn-on sequence as previously described.  
overvoltage fault does not have a delay. The auto-retry  
control bits and their defaults at power up are listed in  
Table 6. Note that the LTC4261 defaults to latch-off while  
the LTC4261-2 defaults to auto-retry following the over-  
current fault.  
For any of the fault conditions 3, 4, 7, 8, the FET off  
mode is programmable by the corresponding auto-retry  
bit in the CONTROL register. If the auto-retry bit is set  
42612fd  
16  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
EN and ON  
and starting a 530µs circuit breaker timer and 250mV for  
a fast GATE pull-down to limit peak current in the event  
of a catastrophic short circuit or an input step.  
Figure 5 shows a logic diagram for EN and ON as they  
relate to GATE, ALERT and internal registers A4, A7, B4,  
C4 and D3. Also affecting GATE is the status of UV, OV  
and several other fault conditions. The EN and ON pins  
have 0.8V to 2V logic thresholds relative to V with a  
maximum input leakage current of 2µA.  
In an overcurrent condition, when the voltage drop across  
R exceeds 50mV, the current limit loop is engaged and  
S
an internal 530µs circuit breaker timer is started. The  
EE  
current limit loop servos the GATE to maintain a constant  
output current of 50mV/R . When the circuit breaker  
S
Register bit A4 indicates the present state of EN, and B4  
is set high whenever EN changes state. Rising and falling  
edges at the ON pin set and clear FET-on control bit, D3.  
Another path allows a falling edge at EN to latch a high  
state at the ON pin (such as when ON is permanently  
pulled high) into D3 after a time delay. Both B4 and D3  
can be set or cleared directly by I C, and both are cleared  
low whenever INTV drops below its UVLO threshold.  
The condition of the GATE pin output is controlled by  
register bit A7, which is the AND of A4, D3 and the ab-  
sence of UV, OV and other faults.  
timer expires, the FET is turned off by pulling GATE down  
with a 110mA current, the capacitors at SS and TMR are  
discharged and the power good signals are reset. At this  
time, the overcurrent present bit A2 and the overcurrent  
fault bit B2 are set, and the circuit breaker timer is reset.  
2
After the FET is turned off, the overcurrent present bit  
A2 is cleared. If the overcurrent auto-retry bit D2 has  
been set, the FET will turn on again automatically after  
CC  
a cooling time of 4t . Otherwise, the FET will remain off  
D
until the overcurrent fault bit B2 is reset. When the over-  
current fault bit is reset (see Resetting Faults), the FET  
Overcurrent Protection and Overcurrent Fault  
is allowed to turn on again after a delay of 4t . The 4t  
D
D
cooling time associated with the overcurrent fault will not  
be interrupted by any other fault condition. See Figure 6  
for operation of LTC4261/LTC4261-2 under overcurrent  
condition followed by auto-retry.  
The LTC4261/LTC4261-2 feature two levels of protec-  
tion from short-circuit and overcurrent conditions. Load  
current is monitored by the SENSE pin and resistor  
R . There are two distinct thresholds for the voltage at  
S
SENSE: 50mV for engaging the active current limit loop  
ABSENCE OF UV/OV AND OTHER FAULTS  
GATE ON  
A4  
A7  
INTV UVLO  
CC  
CLR  
STATE-CHANGE  
DETECTOR  
ALERT*  
S
EN  
Q
B4  
C4  
S
ALERT  
Q
R/W  
CLR  
1 t  
D
TIMER  
DELAY  
2
I C ALERT RESPONSE  
READ ANY REGISTER  
2
I C  
ON  
*B4 • C4 IS ONE OF SEVEN CONDITIONS  
THAT CAN GENERATE AN ALERT OUTPUT.  
SEE TABLE 5  
R/W  
CLR  
S
R
EDGE  
DETECTOR  
42612 F05  
D3  
Q
INTV UVLO  
CC  
Figure 5. Logic Block Diagram of EN and ON Pins  
42612fd  
17  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
PWRGD1  
DELAY  
PWRGD2  
DELAY  
OC COOLING DELAY  
TMR  
2x  
2x  
4x  
SS  
V
– 1.2V  
Z
GATE  
V
OUT  
1.77V  
50mV  
530µs  
SENSE  
INRUSH  
PG  
PGIO  
42612 F06  
Figure 6. Overcurrent Fault and Auto-Retry  
In the case of a low impedance short circuit on the load  
side or an input step during battery replacement, current  
overshoot is inevitable. A fast SENSE comparator with a  
threshold of 250mV detects the overshoot and immedi-  
ately pulls GATE low. Once the SENSE voltage drops to  
50mV, the current limit loop takes over and servos the  
current as previously described. If the short-circuit con-  
dition lasts longer than 530µs, the FET is shut down and  
the overcurrent fault is registered.  
the current limit loop in the event of an input step. The  
maximum value of the inrush current is given by:  
45mV  
RS  
IINRUSH 0.8 •  
ILOAD  
where the 0.8 factor is used as a worst case margin com-  
bined with the minumum threshold (45mV).  
The active current limit circuit is compensated using the  
capacitor C with a series resistor R (10W) connected  
G
G
Inthecaseofaninputstep,afteraninternalclamppullsthe  
RAMP pin down to 1.1V, the inrush control circuit takes  
over and the current limit loop is disengaged before the  
circuitbreakertimerexpires.Fromthispointon,thedevice  
between GATE and V , as shown in Figure 1. The sug-  
EE  
gested value for C is 50nF. This value should work for  
G
most pass transistors (Q1).  
works as in the initial start-up: V  
is ramped down at the  
Overvoltage Fault  
OUT  
rate set by I  
and C followed by GATE pull-up. The  
RAMP  
R
An overvoltage fault occurs when the OV pin rises above  
its 1.77V threshold. This shuts off the pass transistor  
immediately, sets the overvoltage present bit A0 and  
the overvoltage fault bit B0, and pulls the SS pin down.  
Note that the power good signals are not affected by the  
overvoltage fault. If the OV pin subsequently falls back  
below the threshold, the pass transistor will be allowed  
power good signals on the PG and PGIO pins, the TMR  
pin, and the SS pin are not interrupted through the input  
step sequence. The waveform in Figure7 shows how the  
LTC4261/LTC4261-2respondstoaninputstep.  
Note that the current limit threshold should be set  
sufficiently high to accommodate the sum of the load  
current and the inrush current to avoid engagement of  
to turn on again immediately (without delay) unless the  
42612fd  
18  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
72V  
RTN – V  
EE  
36V  
0V  
TMR  
SS  
2.56V  
V
GATEH  
GATE  
FET V  
TH  
V
OUT  
50mV  
LOAD + INRUSH  
SENSE  
LOAD  
0V  
LOAD  
PG  
0V  
PGIO  
42612 F07  
Figure 7. –36V to –72V Step Response  
overvoltage auto-retry has been disabled by clearing reg-  
ister bit D0.  
an undervoltage shutdown threshold of 38.5V and an  
overvoltage shutdown threshold of 72.3V.  
The UV hysteresis can be adjusted by separating the  
Undervoltage Comparator and Undervoltage Fault  
UVH and the UVL pins with a resistor R (Figure 8). To  
H
The LTC4261/LTC4261-2 provide two undervoltage pins,  
UVH and UVL, for adjustable UV threshold and hyster-  
esis. The UVH and UVL pins have the following accurate  
thresholds:  
increase the UV hysteresis, the UVL tap should be placed  
above the UVH tap as in Figure 8a. To reduce the UV hys-  
teresis, place the UVL tap under the UVH tap as in Figure  
8b. UV hysteresis referred to the UVL pin is given by:  
For UVH rising, V  
For UVL falling, V  
= 2.56V, turn on  
= 2.291V, turn off  
UVH(TH)  
UVL(TH)  
for VUVL VUVH  
,
RH  
R1+ R2  
DVUVL(HYST) = DVUV(HYST) + 2.56V •  
Both UVH and UVL pins have a minimum hysteresis of  
or for VUVL < VUVH  
,
dV (15mV typical). In either a rising or a falling input  
UV  
supply, the undervoltage comparator works in such a way  
that both the UVH and the UVL pins have to cross their  
thresholds for the comparator output to change state.  
RH  
DVUVL(HYST) = DVUV(HYST) – 2.56V •  
R1+ R2+ RH  
< V , the minimum UV hysteresis allowed is  
UVH  
For V  
UVL  
The UVH, UVL, and OV threshold ratio is designed to  
match the standard telecom operating range of 43V to  
71V and UV hysteresis of 4.5V when UVH and UVL are  
tied together as in Figure 1, where the built-in UV hyster-  
esis referred to the UVL pin is:  
the minimum hysteresis at UVH and UVL: dV = 15mV  
UV  
when R  
= 0.11 • (R1 + R2)  
H(MAX)  
The design of the LTC4261/LTC4261-2 protects the UV  
comparator from chattering even when R is larger than  
H
R
.
H(MAX)  
DV  
= V  
– V  
= 0.269V  
UV(HYST)  
UVH(TH)  
UVL(TH)  
An undervoltage fault occurs when the UVL pin falls  
Using R1 = 11.8k, R2 = 16.9k and R3 = 453k as in Figure 1  
gives a typical operating range of 43.0V to 70.7V, with  
below 2.291V and the UVH pin falls below 2.56V – dV .  
UV  
This activates the FET turn-off and sets the undervoltage  
42612fd  
19  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
–48V RTN  
–48V RTN  
FET Short Fault  
R3  
R3  
AFETshortfaultwillbereportedifthedataconvertermea-  
sures a current sense voltagegreaterthan orequalto 2mV  
while the FET is turned off. This condition sets the FET  
short present bit A5 and the FET short fault bit B5.  
453k  
453k  
1%  
1%  
UVL  
UVH  
0V  
UVH  
UVL  
0V  
R
H
R
H
TURN-ON = 46V  
TURN-OFF = 38.5V  
HYSTERESIS = 7.5V  
TURN-ON = 43V  
TURN-OFF = 41.2V  
HYSTERESIS = 1.8V  
1.91k  
1%  
1.91k  
1%  
R2  
15k  
1%  
R2  
15k  
1%  
Power Bad Fault  
After the FET is turned on and the power good outputs  
pull PG and PGIO low, a delay timer with duration of 4t is  
R1  
R1  
11.8k  
1%  
11.8k  
1%  
D
started and the level of the PGI pin is checked (Figure 3).  
If the PGI pin is pulled below its 1.4V threshold before  
the PGI check timer expires, the FET will remain on.  
Otherwise, the FET is immediately turned off, the power  
good signals are reset and the power bad present bit A3  
and the power bad fault bit B3 are set. After the FET is  
turned off, the power bad present bit A3 will be cleared.  
If the PGI pin is subsequently pulled low, the FET will  
remain off unless the power bad auto-retry has been en-  
abled by setting bit D4 or the power bad fault bit B3 is  
cleared. In either of those two conditions, the FET will  
42612 F08  
V
V
EE  
EE  
(8a)  
(8b)  
Figure 8. Adjustment of Undervoltage Thresholds  
for Larger (8a) or Smaller (8b) Hysteresis  
present bit A1 and the undervoltage fault bit B1. The  
power good signals at PG and PGIO are also reset.  
The undervoltage present bit A1 is cleared when the  
UVH pin rises above 2.56V and the UVL pin rises above  
2.291V + dV . After a delay of t , the FET will turn on  
again unless the undervoltage auto-retry has been dis-  
UV  
D
turn on again following a delay of t and the PGI pin is  
D
abled by clearing bit D1.  
checked again as described above.  
When power is applied to the device, if UVL is below  
External Fault Monitors  
the 2.291V threshold and UVH is below 2.56V – dV  
UV  
after INTV crosses its undervoltage lock out threshold  
CC  
The FLTIN pin (SSOP only) and the PGIO pin, when con-  
figured as general purpose input, allow monitoring of ex-  
ternal fault conditions such as broken fuses. If FLTIN is  
pulled below its 1.4V threshold, bit B7 in the FAULT reg-  
ister is set. An associated alert bit, C7, is also available  
in the ALERT register. When the PGIO pin is configured  
as general purpose input, if the voltage at PGIO is above  
1.25V, both bit A6 in the STATUS register and bit B6 in  
the FAULT register are set, though there is no alert bit as-  
sociated with this fault. The external fault conditions do  
not directly affect the GATE control functions.  
(4.25V), an undervoltage fault will be logged in the fault  
register.  
Because of the compromises of selecting from a table of  
discrete resistor values (1% resistors in 2% increments,  
0.1% resistors in 1% increments), best possible OV and  
UV accuracy is achieved using separate dividers for each  
pin. This increases the total number of resistors from  
three or four to as many as six, but maximizes accuracy,  
greatly simplifies calculations and facilitates running  
changes to accommodate multiple standards or custom-  
ization without any board changes.  
Fault Alerts  
To improve noise immunity, put the resistive divider to  
the UV and OV pins close to the chip and keep traces to  
When any of the fault bits in FAULT register B is set, an  
optionalbusalertcanbegeneratedbysettingtheappropri-  
ate bit in the ALERT register C. This allows only selected  
faultstogeneratealerts.Atpower-upthedefaultstateisnot  
to alert on faults. If an alert is enabled, the corresponding  
RTN and V short. A 0.1µF capacitor from the UVH or  
EE  
UVL pin (and OV pin through resistor R2) to V helps  
EE  
reject supply noise.  
42612fd  
20  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
A2 or A3 will hold the FET off and the FAULT register is  
ignored. Subsequently, when the A0, A1, A2 and A3 bits  
are cleared, the FET is allowed to turn on again.  
fault will cause the ALERT pin to pull low. After the bus  
master controller broadcasts the alert response address,  
the LTC4261/LTC4261-2 will respond with its address on  
the SDA line and release ALERT as shown in Figure 14.  
If there is a collision between two LTC4261’s responding  
with their addresses simultaneously, then the device with  
the lower address wins arbitration and responds first. The  
ALERT line will also be released if the device is addressed  
by the bus master.  
Turning the LTC4261/LTC4261-2 On and Off  
Many methods of on/off control are possible using the  
2
ON, EN, UV/OV, FLTIN or PGIO pins along with the I C  
port. The EN pin works well with logic inputs or float-  
2
ing switch contacts; I C control is intended for systems  
where the board operates only under command of a cen-  
tral control processor and the ON pin is useful with sig-  
nals referenced to RTN, as are the UV (UVH, UVL) and  
OV pins. PGIO and FLTIN control nothing directly, but are  
Once the ALERT signal has been released for one fault,  
it will not be pulled low again until the FAULT register  
indicates a different fault has occurred, or the original  
fault is cleared and it occurs again. Note that this means  
repeated or continuing faults will not generate alerts until  
the associated FAULT register bit has been cleared.  
2
useful for I C monitoring of connection sense or other  
important signals.  
2
On/off control is possible with or without I C interven-  
Resetting Faults  
tion. Further, the LTC4261/LTC4261-2 may reside on  
either the removable board or on the backplane. Even  
Faults are reset with any of the following conditions.  
First, writing zeros to the FAULT register B will clear the  
associated fault bits. Second, the entire FAULT register  
is cleared when either the ON pin or bit D3 goes from  
2
when operating autonomously, the I C port can still ex-  
ercise control over the GATE output, although depending  
on how they are connected, EN and ON could subse-  
2
quently override conditions set by I C. UV, OV and other  
high to low, or if INTV falls below its 4.25V undervolt-  
CC  
fault conditions seize control as needed to turn off the  
age lockout. Pulling the UVL pin below its 1.21V reset  
threshold also clears the entire FAULT register. When the  
UVL pin is brought back above 1.21V but below 2.291V,  
the undervoltage fault bit B1 is set if the UVH pin is below  
2.56V. This can be avoided by holding the UVH pin above  
2.56V while toggling the UVL pin to reset faults. Finally,  
when EN is brought from high to low, all fault bits except  
bit B4 are cleared. The bit B4 that indicates an EN change  
of state will be set.  
2
GATE output, regardless of the state of EN, ON or the I C  
port. Figure 9 shows five configurations of on/off control  
of the LTC4261/LTC4261-2.  
Determining factors in selecting a pin configuration for  
autonomous operation are the polarity and voltage of the  
controlling signal.  
Optical Isolation. Figure 9a shows an opto-isolator driv-  
ing the ON pin. Rising and falling edges at the ON pin  
turn the GATE output on and off. If ON is already high  
Fault bits with associated conditions that are still pres-  
ent (as indicated in the STATUS Register A) cannot be  
cleared. The FAULT register will not be cleared when  
auto-retrying. When auto-retry is disabled, the existence  
of B0 (overvoltage), B1 (undervoltage), B2 (overcurrent)  
or B3 (power bad) fault keeps the FET off. After the fault  
when power is applied, GATE is delayed one t period.  
D
The status of ON can be examined or overridden through  
2
the I C port at register bit D3. This circuit works in both  
backplane and board resident applications.  
Logic Control. Figure 9b shows an application using log-  
ic signal control. Again, the ON pin is used as an input;  
all remarks made concerning opto-isolator control apply  
here as well.  
bit is cleared and a delay of t (for B0, B1 and B3) or 4t  
D
D
(for B4) expires, the FET will turn on again. Note that if  
the overvoltage fault bit B0 is cleared by writing a zero  
2
through I C, the FET is allowed to turn on without a de-  
lay. If auto-retry is enabled, then a high value in A0, A1,  
42612fd  
21  
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LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
Ejector Switch or Loop-Through Connection Sense.  
Floating switch contacts or a connection sense loop also  
work well with the ON pin, replacing the phototransistor  
in Figure 9a. If an insertion debounce delay is desired,  
use the EN pin as shown in Figure 9c. Like Figures 9a  
and 9b, this circuit works on either side of the backplane  
connector.  
Data Converter  
The LTC4261/LTC4261-2 incorporates a 10-bit ana-  
log-to-digital converter (ADC) that continuously moni-  
tors three different voltages at (in the sequence of)  
SENSE, ADIN2/OV (SSOP/QFN) and ADIN. The ar-  
chitecture inherently averages signal noise during the  
measurement period. The voltage between the SENSE  
pin and VEE is monitored with a 64mV full scale and  
62.5µV resolution, and the data is stored in registers E  
and F. The ADIN and the ADIN2/OV pins are monitored  
with a 2.56V full scale and 2.5mV resolution. The data  
for the ADIN2/OV pin is stored in registers G and H. The  
data for the ADIN pin is stored in registers I and J.  
Short Pin to RTN. Figure 9d uses the UV divider string to  
detect board insertion. This method works equally well in  
both backplane and board resident applications.  
AdvancedTCA Style Control. Figure 2 shows an ATCA  
application using EN as the interface to the LTC4261.  
2
Register bit A4 allows the I C port to monitor the status  
of EN and by setting C4 high, bit B4 can generate an alert  
to instantly report any changes in the state of EN.  
The results in registers E, F, G, H, I and J are updated at  
a frequency of 7.3Hz. Setting CONTROL register bit D5  
invokes a test mode that halts updating of these registers  
so that they can be written to and read from for software  
testing. By invoking the test mode right before reading  
the ADC data registers, the 10-bit data separated in two  
registers are synchronized.  
2
I C Only Control. To lock out EN and ON, use the con-  
figuration shown in Figure 9e and control the GATE pin  
with register bit D3. The circuit defaults off at power up.  
To default on, connect the ON pin to INTV . Either FLTIN  
CC  
or PGIO can be used as an input to monitor a connection  
sense or other control signal. PGIO is configured as an  
input by setting register bits D6 and D7 high; its input  
state is stored at location B6. FLTIN is always an input  
whose state is available from register bit B7. FLTIN gen-  
erates an alert if C7 is set high.  
The ADIN and ADIN2 pins can be used to monitor input  
and output voltages of the Hot Swap controller as shown  
in Figures 1 and 2.  
LOOP OR  
SWITCH  
5V  
1k  
1M  
INTV  
INTV  
ON  
INTV  
CC  
CC  
CC  
100k  
LTC4261  
LTC4261  
LTC4261  
EN  
ON  
EN  
EN  
ON  
V
V
EE  
V
EE  
EE  
10nF  
47k  
–48V  
–48V  
–48V  
(9a) Opto-Isolator Control  
(9b) Logic Control  
(9c) Contact Debounce Delay Upon  
Insertion for Use with an Ejector  
Switch or Loop-Through Style  
Connection Sense  
–48V  
RTN  
453k  
INTV  
INTV  
ON  
CC  
ON  
EN  
CC  
DEFAULT  
ON  
SDAO  
SDAI  
SCL  
LTC4261  
2
UVL  
UVH  
I C  
LTC4261  
DEFAULT  
OFF  
28.7k  
V
V
EE  
EE  
EN  
–48V  
INPUT  
42612 F09  
–48V  
2
(9d) Short Pin Connection Sense to RTN  
(9e) I C-Only Control  
Figure 9. On/Off Control of the LTC4261  
42612fd  
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LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
Configuring the PGIO Pin  
The FET is selected to handle the maximum power dissi-  
pation during start-up or an input step. The latter usually  
results in a larger power due to summation of the inrush  
Table 6 describes the possible states of the PGIO pin us-  
ing the CONTROL register bits D6 and D7. At power-up  
the default state is for the PGIO pin to pull low when  
the second power good signal is ready. Other uses for  
the PGIO pin are to go high impedence when the sec-  
ond power good is ready, a general purpose output and a  
general purpose input. When the PGIO pin is configured  
as a general purpose output, the status of bit C6 is sent  
out to the pin. When it is configured as a general pur-  
pose input, if the input voltage at PGIO is higher than  
1.25V, both bit A6 in the STATUS register and bit B6 in  
the FAULT register are set. If the input voltage at PGIO  
subsequently drops below 1.25V, bit A6 is cleared. Bit  
B6 can be cleared by resetting the FAULT register as de-  
scribed previously.  
current charging C and the load current. For a 36V input  
L
2
step, the total P t in the FET is approximated by:  
t
3
2
P2t = 36V •I  
(
)
MAX  
where t is the time it takes to charge up C :  
L
CL • 36V 330µF • 36V  
t =  
=
= 18ms  
IINRUSH  
0.66A  
2
2
which gives a P t value of 244W s.  
2
Now the P t given by the SOA (safe operating area)  
2
curves of candidate FETs must be higher than 244W s.  
The SOA curves of the IRF1310NS provide for 5A at 50V  
2
2
(250W) for 10ms, which gives a P t value of 625W s and  
satisfies the requirement.  
Design Example  
As a design example, consider the 200W application with  
Sizing R1, R2 and R3 for the required UV and OV thresh-  
old voltages:  
C = 330µF as shown in Figure 1. The operating voltage  
L
range is from 43V to 71V with a UV turn-off threshold of  
V
V
= 43V, V  
= 38.5V, (using  
38.5V.  
UV(RISING)  
UV(FALLING)  
= 2.56V and V  
= 2.291V)  
UVH(TH)  
UVH(TH)  
The design flow starts with calculating the maximum in-  
put current:  
V
V
= 72.3V, V  
OV(FALLING)  
= 70.7V (using  
OV(RISING)  
= 1.77V rising and 1.7325V falling)  
OV(TH)  
200W  
36V  
IMAX  
=
= 5.6A  
Layout Considerations  
where 36V is the minimum input voltage.  
To achieve accurate current sensing, a Kelvin connection  
is recommended (Figure 10). The minimum trace width  
for 1oz copper foil is 0.02" per amp to make sure the  
trace stays at a reasonable temperature. Using 0.03" per  
amp or wider is recommended. Note that 1oz copper ex-  
hibits a sheet resistance of about 530µW/square. Small  
resistances add up quickly in high current applications.  
The selection of the sense resistor, R , is determined by  
S
the minimum current limit threshold and maximum input  
current:  
DVSENSE(MIN)  
45mV  
5.6A  
RS =  
=
= 8mW  
IMAX  
The V pin of the LTC4261 should be connected to a  
The inrush current is set to 0.66A using C :  
EE  
R
separate plane that is different from the main –48V in-  
IRAMP  
IINRUSH  
20µA  
0.66A  
put plane. To improve noise immunity, as shown in  
CR = CL •  
= 330µF •  
= 10nF  
Figure 10, the V connections of all capacitors, resistive  
EE  
2
dividers, opto-isolators and I C common must be made  
directly to the local V plane, not the –48V input plane.  
The value of R and C are chosen to 1k and 33nF as  
F
F
EE  
discussed previously.  
42612fd  
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LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
command will be identical to the first word. The second  
word in a Write Word command is ignored. The data for-  
matsforthesecommandsareshowninFigures12to15.  
V
PLANE  
EE  
LTC4261 V PIN  
EE  
TO SENSE PIN  
MOSFET  
ALL CAPACITORS  
ALL RESISTIVE DIVIDERS  
ALL OPTO-ISOLATORS  
2
G
I C COMMON  
D
Using Opto-Isolators with SDA  
R
S
S
42612 F10  
The LTC4261/LTC4261-2 split the SDA line into SDAI (in-  
put) and SDAO (output) for convenience of opto-coupling  
with the host. If opto-isolators are not used then tie SDAI  
and SDAO together to form a normal SDA line. When us-  
ing opto-isolators, connect the SDAI pin to the output of  
the incoming opto-isolator and connect the SDAO pin to  
the input of the outgoing opto-isolator (see Figure 2). If  
the SDAI and SDAO on the master controller are not tied  
together, the ACK bit of SDAO must be returned back to  
SDAI. If the ALERT line is used as an interrupt for the  
host to respond to a fault in real time, connect the ALERT  
pin to an opto-isolator in a way similar to that for the  
SDAO pin as shown in Figure 2.  
VIAS  
–48V INPUT PLANE  
Figure 10. Layout Example of VEE Plane, –48V Input Plane and  
Sense Resistor Connection  
2
I C Interface  
2
The LTC4261/LTC4261-2 feature an I C interface to pro-  
vide access to the ADC data registers and four other regis-  
ters for monitoring and control of the pass FET. Figure11  
2
shows a general data transfer format using the I C. The  
LTC4261/LTC4261-2 are read-write slave devices and  
supportSMBusbusReadByte,WriteByte,ReadWordand  
Write Word commands. The second word in a Read Word  
SDA  
SCL  
a6 - a0  
1 - 7  
b7 - b0  
b7 - b0  
8
9
1 - 7  
8
9
1 - 7  
8
9
S
P
START  
CONDITION  
ADDRESS  
R/W  
ACK  
DATA  
ACK  
DATA  
ACK  
STOP  
CONDITION  
42612 F11  
Figure 11. Data Transfer over I2C or SMBus  
S
ADDRESS W A  
0 0 1 a3:a0  
COMMAND  
A
DATA  
A
P
S
ADDRESS W A  
0 0 1 a3:a0  
COMMAND  
X X X X b3:b0  
A
DATA  
A
DATA  
A
P
0
0
X X X X b3:b0  
0
b7:b0  
0
0
0
0
b7:b0  
0
X X X X X X X X  
0
42612 F13  
FROM MASTER TO SLAVE  
FROM SLAVE TO MASTER  
A: ACKNOWLEDGE (LOW)  
A: NOT ACKNOWLEDGE (HIGH)  
R: READ BIT (HIGH)  
Figure 13. LTC4261 Serial Bus SDA Write Word Protocol  
W: WRITE BIT (LOW)  
S: START CONDITION  
S
ADDRESS W A  
0 0 1 a3:a0  
COMMAND  
A
S
ADDRESS  
R
A
DATA  
A
P
P: STOP CONDITION  
0
0
X X X X b3:b0  
0
0 0 1 a3:a0  
1
0
b7:b0  
1
42612 F12  
42612 F14  
Figure 12. LTC4261 Serial Bus SDA Write Byte Protocol  
Figure 14. LTC4261 Serial Bus SDA Read Byte Protocol  
S
ADDRESS W A  
0 0 1 a3:a0  
COMMAND  
A
S
ADDRESS  
R
A
DATA  
A
DATA  
A
P
0
0
X X X X b3:b0  
0
0 0 1 a3:a0  
1
0
b7:b0  
0
b7:b0  
1
42612 F15  
Figure 15. LTC4261 Serial Bus SDA Read Word Protocol  
42612fd  
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LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
START and STOP Conditions  
leases the SDA line during the acknowledge clock pulse.  
When the slave is the receiver, it must pull down the SDA  
line so that it remains LOW during this pulse to acknowl-  
edge receipt of the data. If the slave fails to acknowl-  
edge by leaving SDA HIGH, then the master can abort  
the transmission by generating a STOP condition. When  
the master is receiving data from the slave, the master  
must pull down the SDA line during the clock pulse to  
indicate receipt of the data. After the last byte has been  
received the master will leave the SDA line HIGH (not  
acknowledge) and issue a STOP condition to terminate  
the transmission.  
When the bus is idle, both SCL and SDA must be high. A  
bus master signals the beginning of a transmission with  
a START condition by transiting SDA from high to low  
while SCL is high. When the master has finished com-  
municating with the slave, it issues a STOP condition by  
transiting SDA from low to high while SCL is high. The  
bus is then free for another transmission.  
Stuck-Bus Reset  
2
The LTC4261/LTC4261-2 I C interface features a stuck-  
bus reset timer. The low conditions of the SCL and the  
SDAI pins are ORed to start the timer. The timer is reset  
when both SCL and SDAI are pulled high. If the SCL pin  
or the SDAI pin is held low for over 66ms, the stuck-bus  
Write Protocol  
The master begins communication with a START con-  
dition followed by the seven bit slave address and the  
R/W bit set to zero. The addressed LTC4261/LTC4261-2  
acknowledge this and then the master sends a command  
byte which indicates which internal register the master  
wishes to write. The LTC4261/LTC4261-2 acknowledge  
this and then latch the lower four bits of the command  
byte into its internal Register Address pointer. The master  
then delivers the data byte and the LTC4261/LTC4261-2  
acknowledge once more and latch the data into its inter-  
nal register. The transmission is ended when the master  
sends a STOP condition. If the master continues sending  
a second data byte, as in a Write Word command, the  
second data byte will be acknowledged by the LTC4261/  
LTC4261-2 but ignored.  
2
timer will expire and the internal I C state machine will  
be reset to allow normal communication after the stuck-  
low condition is cleared. When the SCL pin and the SDAI  
pin are held low alternatively, if the ORed low period of  
SCL and SDAI exceeds 66ms before the timer reset con-  
dition (both SCL and SDAI are high) occurs, the stuck-  
2
bus timer will expire and the I C state machine is reset.  
2
I C Device Addressing  
2
Any of eight distinct I C bus addresses are selectable us-  
ing the three-state pins ADR0 and ADR1, as shown in  
Table 1. Note that the configuration of ADR0 = L and ADR1  
= H is used to enable the single-wire broadcasting mode.  
2
For the eight I C bus addresses, address bits B6, B5 and  
B4 are configured to (001) and the least significant bit B0  
is the R/W bit. In addition, the LTC4261/LTC4261-2 will  
respond to two special addresses. Address (0011 111)  
is a mass write used to write to all LTC4261/LTC4261-2s,  
regardless of their individual address settings. Address  
(0001 100) is the SMBus Alert Response Address. If the  
LTC4261/LTC4261-2 are pulling low on the ALERT pin,  
it will acknowledge this address using the SMBus Alert  
Response Protocol.  
Read Protocol  
The master begins a read operation with a START con-  
dition followed by the seven bit slave address and the  
R/W bit set to zero. The addressed LTC4261/LTC4261-2  
acknowledge this and then the master sends a command  
byte that indicates which internal register the master  
wishes to read. The LTC4261/LTC4261-2 acknowledge  
this and then latch the lower four bits of the command  
byte into its internal Register Address pointer. The mas-  
ter then sends a repeated START condition followed by  
the same seven bit address with the R/W bit now set to  
one. The LTC4261/LTC4261-2 acknowledge and send the  
contents of the requested register. The transmission is  
Acknowledge  
The acknowledge signal is used for handshaking be-  
tween the transmitter and the receiver to indicate that the  
last byte of data was received. The transmitter always re-  
ended when the master sends a STOP condition. If the  
42612fd  
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LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
master acknowledges the transmitted data byte, as in a  
Read Word command, the LTC4261/LTC4261-2 will re-  
peat the requested register as the second data byte. Note  
that the Register Address pointer is not cleared at the  
end of the transaction. Thus the Receive Byte protocol  
can be used to repeatedly read a specific register.  
this means repeated or continuing faults will not gener-  
ate alerts until the associated FAULT register bit has been  
cleared.  
Single-Wire Broadcast Mode  
TheLTC4261/LTC4261-2providesasingle-wirebroadcast  
mode in which selected register data are sent out to the  
SDAO pin without clocking the SCL line (Figure 17). The  
single-wire broadcast mode is enabled by setting the  
Alert Response Protocol  
The LTC4261/LTC4261-2 implement the SMBus Alert  
Response Protocol as shown in Figure 16. If enabled  
to do so through the ALERT register C, the LTC4261/  
LTC4261-2 will respond to faults by pulling the ALERT  
pin low. Multiple LTC4261/LTC4261-2s can share a com-  
mon ALERT line and the protocol allows a master to de-  
termine which LTC4261/LTC4261-2s are pulling the line  
low. The master begins by sending a START bit followed  
by the special Alert Response Address (0001 100)b with  
the R/W bit set to one. Any LTC4261/LTC4261-2 that is  
pulling its ALERT pin low will acknowledge and begin  
sending back its individual slave address.  
2
ADR1 pin high and the ADR0 pin low (the I C interface is  
disabled). At the end of each conversion of the three ADC  
channels, a stream of eighteen bits are broadcasted to  
SDAO with a serial data rate of 15.3kHz 20% in a format  
as illustrated in Figure 18. The data bits are encoded with  
an internal clock in a way similar to Manchester encoding  
that can be easily decoded by a microcontroller or FPGA.  
Each data bit consists of a noninverting phase and an  
inverting phase. During the conversion of each ADC chan-  
nel, SDAO is idle at high. At the end of the conversion, the  
SDAO pulls low. The START bit indicates the beginning of  
data broadcasting and is used along with the dummy bit  
(DMY) to measure the internal clock cycle (i.e., the serial  
data rate). Following the DMY bit are two channel code  
bits CH1 and CH0 labeling the ADC channel (see Table  
10). Ten data bits of the ADC channel (ADC9-0) and three  
FAULT register bits (B2, B1 and B0) are then sent out. A  
parity bit (PRTY) ends each data stream. After that the  
SDAO line enters the idle mode with SDAO pulled high.  
ALERT  
RESPONSE  
ADDRESS  
DEVICE  
ADDRESS  
S
R
P
A
A
0 0 0 1 1 0 0  
1
0
0 0 1 a3:a0 0  
1
42612 F16  
Figure 16. LTC4261 Serial Bus SDA Alert Response Protocol  
An arbitration scheme ensures that the LTC4261/  
LTC4261-2 with the lowest address will have priority;  
all others will abort their response. The successful re-  
sponder will then release its ALERT pin while any others  
will continue to hold their ALERT pins low. Polling may  
also be used to search for any LTC4261/LTC4261-2 that  
have detected faults. Any LTC4261/LTC4261-2 pulling its  
ALERT pin low will also release it if it is individually ad-  
dressed during a read or write transaction.  
The following data reception procedure is recommended:  
0. Wait for INTV rising edge.  
CC  
1. Wait for SDAO falling edge.  
2. The first falling edge could be a glitch, so check again  
after a delay of 10µs. If back to high, wait again. If still  
low, it is the START bit.  
The ALERT signal will not be pulled low again until the  
FAULT register indicates a different fault has occurred or  
the original fault is cleared and it occurs again. Note that  
3. Use the following low-to-high and high-to-low transis-  
tions to measure 1/2 of the internal clock cycle.  
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LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
–48V RTN  
6 × 0.51k IN SERIES  
1/4W EACH  
5V  
7.5k  
INTV  
V
IN  
CC  
ADR1  
ADR0  
SDAI  
SCL  
V
CC  
LTC4261  
1µF  
V
DD  
ANODE  
R
D
IN  
L
MICRO-  
CONTROLLER  
0.1µF  
CATHODE V  
GND  
SDAO  
V
OUT  
EE  
HCPL-0300  
–48V INPUT  
42612 F17  
Figure 17. Single-Wire Broadcast Mode  
INTERNAL  
CLK  
.. .. ..  
DATA  
START DMY  
CH1  
CH0 ADC9  
ADC0  
OC  
UV  
OV  
PRTY  
SDAO  
4261 F18  
START  
Figure 18. Single-Wire Broadcast Data Format  
4. Wait for the second low-to-high transistion (middle of  
DMY bit).  
The above procedure can be ported to a microcontroller  
or used to design a state machine in FPGA. Code should  
have timeouts in case an edge is missed. Abort the read  
if it takes more than double the typical time (1.2ms) for  
all 18 bits to be clocked out.  
5. Wait 3/4 of a clock cycle.  
6. Sample bit CH1, wait for transistion.  
7. Wait 3/4 of a clock cycle.  
A typical application circuit with the LTC4261/LTC4261-2  
in the broadcast mode is illustrated in Figure 19, where  
8. Sample bit CH0, wait for transistion.  
9. Wait 3/4 of a clock cycle.  
input voltage, V of the FET and V  
are monitored.  
DS  
SENSE  
Register Addresses and Contents  
10. Sample ADC9, wait for transistion.  
11. Continue until all bits are read.  
The register addresses and contents are summerized in  
Table 1 and Table 2. The function of each register bit is  
detailed in Tables 3 to 9.  
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LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
Table 1. LTC4261 Device Addressing  
HEX DEVICE  
ADDRESS  
LTC4261  
ADDRESS PINS  
DESCRIPTION  
BINARY DEVICE ADDRESS  
h
6
0
0
0
0
0
0
0
0
0
0
5
0
0
0
0
0
0
0
0
0
0
4
1
0
1
1
1
1
1
1
1
1
3
1
1
0
0
0
0
0
0
0
0
2
1
1
0
0
0
0
1
1
1
1
1
1
0
0
0
1
1
0
0
1
1
0
1
0
0
1
0
1
0
1
0
1
R/W  
0
ADR1  
X
ADR0  
X
Mass Write  
3E  
19  
20  
22  
24  
26  
28  
2A  
2C  
2E  
Alert Response  
1
X
X
0
1
2
3
4
5
6
7
8
X
L
L
X
L
NC  
NC  
H
X
H
X
L
X
NC  
NC  
H
L
X
NC  
H
X
X
NC  
H
H
Single-Wire Broadcast Mode  
L
H = Tie to INV ; L = Tie to V ; NC = No connect, open; X = Don’t care  
CC  
EE  
Table 2. LTC4261 Register Address and Contents  
REGISTER  
ADDRESS*  
REGISTER  
NAME  
READ/WRITE  
R
DESCRIPTION  
00h  
01h  
02h  
03h  
04h  
05h  
06h  
07h  
08h  
09h  
STATUS (A)  
FAULT (B)  
System Status Information  
Fault Log and PGIO Input  
R/W  
ALERT (C)  
CONTROL (D)  
SENSE (E)  
SENSE (F)  
ADIN2/OV (G)  
ADIN2/OV (H)  
ADIN (I)  
R/W  
Controls Whether the ALERT Pin is Pulled Low After a Fault is Logged in the Fault Register  
Controls Whether the Part Retries After Faults, Set the On/Off Switch State  
ADC Current Sense Voltage Data (8 MSBs)  
R/W  
R/W**  
R/W**  
R/W**  
R/W**  
R/W**  
R/W**  
ADC Current Sense Voltage Data (2 LSBs)  
ADC ADIN2/OV (SSOP/QFN) Voltage Data (8 MSBs)  
ADC ADIN2/OV (SSOP/QFN) Voltage Data (2 LSBs)  
ADC ADIN Voltage Data (8 MSBs)  
ADIN (J)  
ADC ADIN Voltage Data (2 LSBs)  
*Register address MSBs b7-b4 are ignored. **Writable if bit D5 set.  
42612fd  
28  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
Table 3. STATUS Register A (00h)—Read Only  
BIT  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
NAME  
OPERATION  
FET On  
Indicates State of FET; 1 = FET On, 0 = FET Off  
PGIO Input  
FET Short  
EN  
Indicates State of the PGIO Pin when Configured to General Purpose Input: 1 = PGIO High, 0 = PGIO Low  
Indicates Potential FET Short if Current Sense Voltage Exceeds 2mV While FET is Off; 1 = FET is Shorted, 0 = FET is Not Shorted  
Indicates State of the EN Pin; 1 = EN Pin High, 0 = EN Pin Low  
Power Bad  
Overcurrent  
Undervoltage  
Overvoltage  
Indicates Power is Bad when PGI is High at the End of the PGI Check Timer; 1 = PGI High, 0 = PGI Low  
Indicates Overcurrent Condition; 1 = Overcurrent, 0 = Not Overcurrent  
Indicates Input Undervoltage when Both UVH and UVL are Low; 1 = UVH and UVL Low, 0 = UVH or UVL High  
Indicates Input Overvoltage when OV is High; 1 = OV High, 0 = OV Low  
Table 4. FAULT Register B (01h)—Read/Write  
BIT  
NAME  
OPERATION  
B7  
External Fault  
Occurred  
Latched to 1 if FLTIN Goes Low; 1 = FLTIN Low State Detected, 0 = FLTIN has Not Been Low  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
PGIO Input  
Latched to 1 if the PGIO Pin Goes High when Configured to General Purpose Input; 1 = PGIO High Detected,  
0 = PGIO has Been Low  
High Occurred  
FET Short Fault Indicates Potential FET Short was Detected When Measured Current Sense Voltage Exceeded 2mV While FET was Off;  
Occurred  
1 = FET Short Fault Occurred, 0 = No FET Short Fault  
EN Changed  
State  
Indicates That a Board was Inserted or Extracted when EN Changed State; 1 = EN Changed State, 0 = EN Unchanged  
Power Bad  
Fault Occurred 0 = No Power Bad Fault  
Indicates Power was Bad when PGI was High at the End of the PGI Check Timer; 1 = Power Bad Fault Occurred,  
Overcurrent  
Fault Occurred  
Indicates Overcurrent Fault Occurred; 1 = Overcurrent Fault Occurred, 0 = No Overcurrent Fault  
Indicates Input Undervoltage Fault Occurred when Both UVH and UVL went Low; 1 = Undervoltage Fault Occurred,  
Undervoltage  
Fault Occurred 0 = No Undervoltage Fault  
Overvoltage  
Fault Occurred  
Indicates Input Overvoltage Fault Occurred when OV was High; 1 = Overvoltage Fault Occurred, 0 = No Overvoltage Fault  
Table 5. ALERT Register C (02h)—Read/Write  
BIT  
NAME  
OPERATION  
C7  
External Fault  
Alert  
Enables Alert for External Fault When FLTIN was Low; 1 = Enable Alert, 0 = Disable Alert (Default)  
C6  
C5  
C4  
PGIO Output  
Output Data Bit to PGIO Pin when Configured as Output. Defaults to 0  
FET Short Alert Enables Alert for FET Short Fault; 1 = Enable Alert, 0 = Disable Alert (Default)  
EN State  
Change Alert  
Enables Alert when EN Changed State; 1 = Enable Alert, 0 Disable Alert (Default)  
Enables Alert for Power Bad Fault; 1 = Enable Alert, 0 Disable Alert (Default)  
Enables Alert for Overcurrent Fault; 1 = Enable Alert, 0 Disable Alert (Default)  
Enables Alert for Undervoltage Fault; 1 = Enable Alert, 0 Disable Alert (Default)  
Enables Alert for Overvoltage Fault; 1 = Enable Alert, 0 Disable Alert (Default)  
C3  
C2  
C1  
C0  
Power Bad  
Alert  
Overcurrent  
Alert  
Undervoltage  
Alert  
Overvoltage  
Alert  
42612fd  
29  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
APPLICATIONS INFORMATION  
Table 6. CONTROL Register D (03h)—Read/Write  
BIT  
NAME  
OPERATION  
D7:6 PGIO Configure  
Configures Behavior of PGIO Pin  
FUNCTION  
D6  
D7  
0
PGIO PIN  
Open Drain  
Open Drain  
PGIO = C6  
PGIO = Hi-Z  
Power Good (Default)  
Power Good  
0
0
1
1
1
General Purpose Output  
General Purpose Input  
0
1
D5  
D4  
Test Mode Enable Test Mode Halts ADC Operation and Enables Writes to ADC Registers; 1 = Enable Test Mode, 0 = Disable Test Mode (Default)  
Power Bad  
Auto-Retry  
Enables Auto-Retry After a Power Bad Fault; 1 = Retry Enabled, 0 = Retry Disabled (Default)  
D3  
D2  
FET On Control  
Turns FET On and Off; 1 = Turn FET On, 0 = Turn FET Off. Defaults to ON Pin State at End of Start-Up Debounce Delay  
Overcurrent  
Auto-Retry  
Enables Auto-Retry After an Overcurrent Fault; 1 = Retry Enabled (Default, LTC4261-2),  
0 = Retry Disabled (Default, LTC4261)  
D1  
D0  
Undervoltage  
Auto-Retry  
Enables Auto-Retry After an Undervoltage Fault; 1 = Retry Enabled (Default), 0 = Retry Disabled  
Overvoltage  
Auto-Retry  
Enables Auto-Retry After an Overvoltage Fault; 1 = Retry Enabled (Default), 0 = Retry Disabled  
Table 7. SENSE Registers E (04h) and F (O5h)—Read/Write  
BIT  
NAME  
OPERATION  
E7:0, F7:6  
F5:0  
SENSE Voltage Data  
Reserved  
10-Bit Data of Current Sense Voltage with 62.5µV LSB and 64mV Full Scale  
Always Returns 0, Not Writable  
Table 8. ADIN2/OV Registers G (06h) and H (O7h)—Read/Write  
BIT  
NAME  
ADIN2/OV Voltage Data 10-Bit Data of ADIN2/OV (SSOP/QFN) Voltage with 2.5mV LSB and 2.56V Full Scale  
Reserved Always Returns 0, Not Writable  
OPERATION  
G7:0, H7:6  
H5:0  
Table 9. ADIN Registers I (08h) and J (O9h)—Read/Write  
BIT  
NAME  
OPERATION  
I7:0, J7:6  
J5:0  
ADIN Voltage Data  
Reserved  
10-Bit Data of ADIN Voltage with 2.5mV LSB and 2.56V Full Scale  
Always Returns 0, Not Writable  
Table 10. ADC Channel Labeling for Single-Wire Broadcast Mode  
CH1  
0
CH0  
0
ADC CHANNEL  
SENSE Voltage  
0
1
ADIN2/OV (SSOP/QFN) Voltage  
ADIN Voltage  
1
0
42612fd  
30  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
TYPICAL APPLICATION  
Using the LTC4261 and a Thermistor to Monitor Temperature  
–48V RTN  
6 × 0.51k IN SERIES  
1/4W EACH  
100k AT 25°C  
1%  
VISHAY  
NTCS0402E3104*HT  
V
IN  
30.1k  
1%  
LTC4261CGN  
SDAO  
2
ADIN  
SDAI  
SCL  
I C  
10k  
1µF  
1%  
V
EE  
–48V INPUT  
42612 TA02  
T (°C) = 38.05 • (V  
(V) – 0.1458), 20°C < T < 60°C  
ADIN  
PACKAGE DESCRIPTION  
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.  
GN Package  
28-Lead Plastic SSOP (Narrow .150 Inch)  
(Reference LTC DWG # 05-08-1641 Rev B)  
.386 – .393*  
(9.804 – 9.982)  
.045 .005  
.033  
(0.838)  
REF  
28 27 26 25 24 23 22 21 20 19 18 17 1615  
.254 MIN  
.150 – .165  
.229 – .244  
.150 – .157**  
(5.817 – 6.198)  
(3.810 – 3.988)  
.0165 .0015  
.0250 BSC  
1
2
3
4
5
6
7
8
9 10 11 12 13 14  
RECOMMENDED SOLDER PAD LAYOUT  
.015 .004  
.0532 – .0688  
(1.35 – 1.75)  
× 45°  
.004 – .0098  
(0.102 – 0.249)  
(0.38 0.10)  
.0075 – .0098  
(0.19 – 0.25)  
0° – 8° TYP  
.016 – .050  
(0.406 – 1.270)  
.008 – .012  
.0250  
(0.635)  
BSC  
GN28 REV B 0212  
(0.203 – 0.305)  
TYP  
NOTE:  
1. CONTROLLING DIMENSION: INCHES  
INCHES  
2. DIMENSIONS ARE IN  
(MILLIMETERS)  
3. DRAWING NOT TO SCALE  
4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE  
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH  
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE  
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD  
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE  
42612fd  
31  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
PACKAGE DESCRIPTION  
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.  
UFD Package  
24-Lead Plastic QFN (4mm × 5mm)  
(Reference LTC DWG # 05-08-ꢀ696 Rev A)  
0.70 0.05  
4.50 0.05  
3.ꢀ0 0.05  
2.65 0.05  
2.00 REF  
3.65 0.05  
PACKAGE OUTLINE  
0.25 0.05  
0.50 BSC  
3.00 REF  
4.ꢀ0 0.05  
5.50 0.05  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED  
R = 0.05 TYP  
PIN ꢀ NOTCH  
2.00 REF  
R = 0.20 OR C = 0.35  
R = 0.ꢀꢀ5  
TYP  
0.75 0.05  
4.00 0.ꢀ0  
(2 SIDES)  
23  
24  
0.40 0.ꢀ0  
PIN ꢀ  
TOP MARK  
(NOTE 6)  
2
5.00 0.ꢀ0  
(2 SIDES)  
3.00 REF  
3.65 0.ꢀ0  
2.65 0.ꢀ0  
(UFD24) QFN 0506 REV A  
0.25 0.05  
0.200 REF  
0.50 BSC  
0.00 – 0.05  
BOTTOM VIEW—EXPOSED PAD  
NOTE:  
ꢀ. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.ꢀ5mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN ꢀ LOCATION  
ON THE TOP AND BOTTOM OF PACKAGE  
42612fd  
32  
For more information www.linear.com/LTC4261  
LTC4261/LTC4261-2  
REVISION HISTORY (Revision history begins at Rev C)  
REV  
DATE  
DESCRIPTION  
PAGE NUMBER  
C
9/11  
Change to Electrical Characteristics Gate Turn-Off Current  
Update to Typical Performance Characteristics graph G06  
Update to Pin Functions SDAI (Pin 5/Pin 2) description  
Update to Block Diagram  
3
6
9
11  
Text changes to Operations section  
Added Figure 3  
12  
14  
Update to Figure 4  
16  
14, 17, 18, 22, 24  
34  
Text changes to Applications Information  
Update to Typical Applications Figure 17  
D
6/14  
Separated V connection of LTC4261 and related components from –48V input plane in circuit figures  
1, 13, 20, 22, 27, 31, 34  
EE  
Added patent numbers  
1
3
Changed delay conditions to GATE Open from C  
= 1pF  
GATE  
Layout Considerations section: Added paragraph and Figure 10 on separating local V plane from -48V  
23, 24  
EE  
input plane  
42612fd  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tation that the interconnectionofitscircuits asdescribedhereinwillnotinfringeon existing patent rights.  
33  
LTC4261/LTC4261-2  
TYPICAL APPLICATIONS  
–48V RTN  
R
IN  
6 × 0.51k IN SERIES  
R3  
432k  
1%  
1/4W EACH  
R4  
7.5k  
5V  
ON INTV  
V
IN  
CC  
UVL  
UVH  
SDAI  
SCL  
R2  
15.8k  
V
ADIN2  
OV  
ADR1  
CC  
1%  
V
C
DD  
L
ANODE  
R
L
D
LTC4261CGN  
IN  
330µF  
100V  
R1  
MICRO-  
CONTROLLER  
SDAO  
ADIN  
CATHODE V  
GND  
OUT  
11.5k  
ADR0  
1%  
SS  
TMR EN V  
SENSE GATE DRAIN  
RAMP  
EE  
HCPL-0300  
C
C
TMR  
IN  
1µF  
47nF  
R
R
D
C
R
G
C
C
F
F
VCC  
SS  
C
G
10Ω 1M  
33nF  
R
1k  
0.1µF  
220nF  
47nF  
C
R
S
10nF  
100V  
5%  
0.02Ω  
1%  
V
OUT  
–48V INPUT  
Q1  
R6  
10k 1%  
R7  
402k 1%  
IRF1310NS  
4261 F19  
Figure 19. Application Circuit of the LTC4261 in Single-Wire Broadcast Mode  
RELATED PARTS  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LT1640AH/LT1640AL  
LTC1921  
Negative High Voltage Hot Swap Controllers in SO-8 Negative High Voltage Supplies from –10V to –80V  
Dual –48V Supply and Fuse Monitor  
–48V Hot Swap Controllers in SO-8  
–48V Hot Swap Controllers in SOT-23  
–48V Hot Swap Controllers in MS8  
UV/OV Monitor, 10V to –80V Operation, MSOP Package  
Active Current Limiting, Supplies from –18V to –80V  
Fast Active Current Limiting, Supplies from –15V  
LT4250L/LT4250H  
LTC4251/LTC4251-1  
LTC4252-1/LTC4252-2  
LTC4252A-1/LTC4252A-2  
Fast Active Current Limiting, Supplies from –15V,  
1ꢀ UV/OV (LTC4252A)  
LTC4253  
–48V Hot Swap Controller with Sequencer  
Fast Current Limiting with Three Sequenced Power Good Outputs,  
Supplies from –15V  
2
LTC4260  
LTC4354  
Positive High Voltage Hot Swap Controller  
With I C and ADC, Supplies from 8.5V to 80V  
Negative Voltage Diode-OR Controller and Monitor  
Controls Two N-Channel MOSFETs, 1.2µs Turn-Off, 80V Operation  
42612fd  
LT 0614 REV D • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
34  
(408)432-1900 FAX: (408) 434-0507 www.linear.com/LTC4261  
LINEAR TECHNOLOGY CORPORATION 2005  

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