LTVA [Linear]

1-/2-Channel 20-Bit UPower No Latency ADCs in MSOP-10; 1 / 2通道20位微功耗无延迟的ADC ,采用MSOP - 10
LTVA
型号: LTVA
厂家: Linear    Linear
描述:

1-/2-Channel 20-Bit UPower No Latency ADCs in MSOP-10
1 / 2通道20位微功耗无延迟的ADC ,采用MSOP - 10

文件: 总32页 (文件大小:365K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
LTC2421/LTC2422  
1-/2-Channel 20-Bit µPower  
No Latency ∆ΣTMADCs in MSOP-10  
U
FEATURES  
DESCRIPTIO  
20-Bit ADCs in Tiny MSOP-10 Packages  
TheLTC®2421/LTC2422are1-and2-channel2.7Vto5.5V  
micropower 20-bit analog-to-digital converters with an  
integrated oscillator, 8ppm INL and 1.2ppm RMS noise.  
1- or 2-Channel Inputs  
Single Supply 2.7V to 5.5V Operation  
Low Supply Current (200µA) and Auto Shutdown  
These ultrasmall devices use delta-sigma technology and  
Automatic Channel Selection (Ping-Pong) (LTC2422) anewdigitalfilterarchitecturethatsettlesinasinglecycle.  
No Latency: Digital Filter Settles in a  
Single Conversion Cycle  
8ppm INL, No Missing Codes  
4ppm Full-Scale Error  
0.5ppm Offset  
1.2ppm Noise  
Zero Scale and Full Scale Set for Reference  
and Ground Sensing  
Internal Oscillator—No External Components Required  
110dB Min, 50Hz/60Hz Notch Filter  
Reference Input Voltage: 0.1V to VCC  
Live Zero—Extended Input Range Accommodates  
12.5% Overrange and Underrange  
Pin Compatible with LTC2401/LTC2402  
This eliminates the latency found in conventional ∆Σ  
converters and simplifies multiplexed applications.  
Through a single pin, the LTC2421/LTC2422 can be  
configured for better than 110dB rejection at 50Hz or  
60Hz ±2%, or can be driven by an external oscillator for  
a user defined rejection frequency in the range 1Hz to  
120Hz. The internal oscillator requires no external fre-  
quency setting components.  
These converters accept an external reference voltage  
from 0.1V to VCC. With an extended input conversion  
range of –12.5% VREF to 112.5% VREF (VREF = FSSET  
ZSSET), the LTC2421/LTC2422 smoothly resolve the off-  
set and overrange problems of preceding sensors or  
signal conditioning circuits.  
U
APPLICATIO S  
The LTC2421/LTC2422 communicate through a 2- or  
3-wire digital interface that is compatible with SPI and  
MICROWIRETM protocols.  
, LTC and LT are registered trademarks of Linear Technology Corporation.  
No Latency ∆Σ is a trademark of Linear Technology Corporation.  
MICROWIRE is a trademark of National Semiconductor Corporation.  
Weight Scales  
Direct Temperature Measurement  
Gas Analyzers  
Strain Gauge Transducers  
Instrumentation  
Data Acquisition  
Industrial Process Control  
U
Pseudo Differential Bridge Digitizer  
TYPICAL APPLICATIO  
2.7V TO 5.5V  
2.7V TO 5.5V  
1
V
CC  
1µF  
V
CC  
= INTERNAL OSC/50Hz REJECTION  
1
10  
= EXTERNAL CLOCK SOURCE  
= INTERNAL OSC/60Hz REJECTION  
LTC2422  
SET  
V
F
O
CC  
LTC2422  
2
4
3
5
FS  
9
SCK  
SDO  
CS  
2
3
4
5
9
8
7
6
REFERENCE VOLTAGE  
ZS + 0.1V TO V  
FS  
SET  
SCK  
SDO  
CS  
8
3-WIRE  
SPI INTERFACE  
CH0  
CH1  
ZS  
SET  
CC  
3-WIRE  
SPI INTERFACE  
ANALOG INPUT RANGE  
CH1  
CH0  
ZS  
7
ZS  
– 0.12V  
TO  
SET  
FS  
REF  
+ 0.12V  
SET  
REF  
10  
(V  
= FS  
– ZS  
)
REF  
SET  
SET  
F
SET  
O
INTERNAL OSCILLATOR  
60Hz REJECTION  
GND  
6
0V TO FS  
– 100mV  
GND  
SET  
SET  
24212 TA01  
24012TA02  
24212f  
1
LTC2421/LTC2422  
W W  
U W  
ABSOLUTE MAXIMUM RATINGS  
(Notes 1, 2)  
Operating Temperature Range  
Supply Voltage (VCC) to GND.......................0.3V to 7V  
Analog Input Voltage to GND ....... 0.3V to (VCC + 0.3V)  
Reference Input Voltage to GND .. 0.3V to (VCC + 0.3V)  
Digital Input Voltage to GND........ 0.3V to (VCC + 0.3V)  
Digital Output Voltage to GND ..... 0.3V to (VCC + 0.3V)  
LTC2421/LTC2422C ................................ 0°C to 70°C  
LTC2421/LTC2422I ............................ 40°C to 85°C  
Storage Temperature Range ................. 65°C to 150°C  
Lead Temperature (Soldering, 10 sec).................. 300°C  
U
W
U
PACKAGE/ORDER INFORMATION  
ORDER PART NUMBER  
ORDER PART NUMBER  
TOP VIEW  
TOP VIEW  
LTC2421CMS  
LTC2421IMS  
V
CC  
10 F  
1
2
3
4
5
10 F  
O
LTC2422CMS  
LTC2422IMS  
V
SET  
V
1
2
3
CC  
O
FS  
FS  
9
8
7
6
SCK  
SDO  
CS  
9
8
7
6
SCK  
SDO  
CS  
SET  
CH1  
CH0  
IN  
NC 4  
SET  
ZS  
SET  
ZS  
5
GND  
GND  
MS10 PART MARKING  
MS10 PART MARKING  
MS10 PACKAGE  
10-LEAD PLASTIC MSOP  
MS10 PACKAGE  
10-LEAD PLASTIC MSOP  
LTUX  
LTUY  
LTUZ  
LTVA  
TJMAX = 125°C, θJA = 130°C/W  
TJMAX = 125°C, θJA = 130°C/W  
Consult factory for parts specified with wider operating temperature ranges.  
U
CONVERTER CHARACTERISTICS The denotes specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VREF = FSSET – ZSSET. (Notes 3, 4)  
PARAMETER  
CONDITIONS  
MIN  
20  
TYP  
MAX  
UNITS  
Bits  
Resolution  
No Missing Codes Resolution  
Integral Nonlinearity  
0.1V FS  
V , ZS = 0V (Note 5)  
SET  
20  
Bits  
SET  
CC  
FS = 2.5V, ZS = 0V (Note 6)  
4
8
10  
20  
ppm of V  
ppm of V  
SET  
SET  
REF  
REF  
FS = 5V, ZS = 0V (Note 6)  
SET  
SET  
Offset Error  
2.5V FS  
V , ZS = 0V  
0.5  
0.04  
4
10  
ppm of V  
SET  
SET  
SET  
SET  
CC  
SET  
REF  
Offset Error Drift  
Full-Scale Error  
2.5V FS  
2.5V FS  
2.5V FS  
V , ZS = 0V  
ppm of V /°C  
REF  
CC  
SET  
V , ZS = 0V  
10  
ppm of V  
REF  
CC  
SET  
Full-Scale Error Drift  
Total Unadjusted Error  
V , ZS = 0V  
0.04  
ppm of V /°C  
REF  
CC  
SET  
FS = 2.5V, ZS = 0V  
8
16  
ppm of V  
ppm of V  
SET  
SET  
REF  
REF  
FS = 5V, ZS = 0V  
SET  
SET  
Output Noise  
V
IN  
= 0V (Note 13)  
6
µV  
RMS  
Normal Mode Rejection 60Hz ±2%  
Normal Mode Rejection 50Hz ±2%  
Power Supply Rejection, DC  
(Note 7)  
(Note 8)  
110  
110  
130  
130  
100  
110  
110  
dB  
dB  
dB  
dB  
dB  
FS = 2.5V, ZS = 0V, V = 0V  
SET  
SET  
IN  
Power Supply Rejection, 60Hz ±2% FS = 2.5V, ZS = 0V, V = 0V, (Notes 7, 15)  
SET  
SET  
IN  
Power Supply Rejection, 50Hz ±2% FS = 2.5V, ZS = 0V, V = 0V, (Notes 8, 15)  
SET  
SET  
IN  
24212f  
2
LTC2421/LTC2422  
U
U
U
U
A ALOG I PUT A D REFERE CE  
The denotes specifications which apply over the full operating  
temperature range, otherwise specifications are at TA = 25°C. VREF = FSSET – ZSSET. (Note 3)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
ZS – 0.12V  
TYP  
MAX  
FS + 0.12V  
REF  
UNITS  
V
V
Input Voltage Range  
(Note 14)  
IN  
SET  
REF  
SET  
SET  
FS  
SET  
Full-Scale Set Range  
Zero-Scale Set Range  
Input Sampling Capacitance  
Reference Sampling Capacitance  
Input Leakage Current  
0.1 + ZS  
0
V
V
CC  
ZS  
FS – 0.1  
SET  
V
SET  
C
C
1
1.5  
1
pF  
pF  
nA  
nA  
S(IN)  
S(REF)  
I
I
CS = V  
–100  
100  
100  
100  
IN(LEAK)  
REF(LEAK)  
CC  
V
= 2.5V, CS = V  
1
Reference Leakage CurreU nt  
REF  
CC  
U
The denotes specifications which apply over the full  
DIGITAL I PUTS A D DIGITAL OUTPUTS  
operating temperature range, otherwise specifications are at TA = 25°C. (Note 3)  
SYMBOL  
PARAMETER  
CONDITIONS  
2.7V V 5.5V  
MIN  
TYP  
MAX  
UNITS  
V
V
V
V
High Level Input Voltage  
2.5  
2.0  
V
V
IH  
IL  
IH  
IL  
CC  
CS, F  
2.7V V 3.3V  
O
CC  
Low Level Input Voltage  
CS, F  
4.5V V 5.5V  
0.8  
0.6  
V
V
CC  
2.7V V 5.5V  
O
CC  
High Level Input Voltage  
SCK  
2.7V V 5.5V (Note 9)  
2.5  
2.0  
V
V
CC  
2.7V V 3.3V (Note 9)  
CC  
Low Level Input Voltage  
SCK  
4.5V V 5.5V (Note 9)  
0.8  
0.6  
V
V
CC  
2.7V V 5.5V (Note 9)  
CC  
I
I
Digital Input Current  
0V V V  
CC  
–10  
–10  
10  
µA  
µA  
pF  
pF  
V
IN  
IN  
CS, F  
O
Digital Input Current  
SCK  
0V V V (Note 9)  
10  
IN  
IN  
CC  
C
C
V
V
V
V
Digital Input Capacitance  
10  
10  
IN  
CS, F  
O
Digital Input Capacitance  
SCK  
(Note 9)  
IN  
High Level Output Voltage  
SDO  
I = 800µA  
O
V
V
– 0.5  
OH  
OL  
OH  
OL  
CC  
Low Level Output Voltage  
SDO  
I = 1.6mA  
O
0.4  
V
High Level Output Voltage  
SCK  
I = 800µA (Note 10)  
O
– 0.5  
V
CC  
Low Level Output Voltage  
SCK  
I = 1.6mA (Note 10)  
O
0.4  
10  
V
I
High-Z Output Leakage  
SDO  
–10  
µA  
OZ  
W U  
POWER REQUIRE E TS  
The denotes specifications which apply over the full operating temperature range,  
otherwise specifications are at TA = 25°C. (Note 3)  
SYMBOL  
PARAMETER  
Supply Voltage  
Supply Current  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
2.7  
5.5  
V
CC  
I
CC  
Conversion Mode  
Sleep Mode  
CS = 0V (Note 12)  
200  
20  
300  
30  
µA  
µA  
CS = V (Note 12)  
CC  
24212f  
3
LTC2421/LTC2422  
W U  
TI I G CHARACTERISTICS The denotes specifications which apply over the full operating temperature  
range, otherwise specifications are at TA = 25°C. (Note 3)  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
2.56  
0.5  
TYP  
MAX  
307.2  
390  
UNITS  
kHz  
µs  
f
t
t
t
External Oscillator Frequency Range  
External Oscillator High Period  
External Oscillator Low Period  
Conversion Time  
EOSC  
HEO  
0.5  
390  
µs  
LEO  
F
= 0V  
O
130.86  
157.03  
133.53  
160.23  
EOSC  
136.20  
163.44  
(in kHz)  
ms  
ms  
ms  
CONV  
F = V  
O
CC  
External Oscillator (Note 11)  
20510/f  
f
Internal SCK Frequency  
Internal Oscillator (Note 10)  
External Oscillator (Notes 10, 11)  
19.2  
kHz  
kHz  
ISCK  
f
/8  
EOSC  
D
Internal SCK Duty Cycle  
(Note 10)  
(Note 9)  
(Note 9)  
(Note 9)  
45  
55  
%
kHz  
ns  
ISCK  
f
t
t
t
External SCK Frequency Range  
External SCK Low Period  
2000  
ESCK  
250  
250  
1.23  
LESCK  
External SCK High Period  
ns  
HESCK  
DOUT_ISCK  
Internal SCK 24-Bit Data Output Time  
Internal Oscillator (Notes 10, 12)  
External Oscillator (Notes 10, 11)  
1.25  
1.28  
ms  
ms  
192/f  
(in kHz)  
EOSC  
t
t
t
t
t
t
t
External SCK 24-Bit Data Output Time  
CS to SDO Low Z  
CS to SDO High Z  
CS to SCK ↓  
(Note 9)  
24/f  
(in kHz)  
ms  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
DOUT_ESCK  
ESCK  
0
0
150  
150  
150  
1
2
(Note 10)  
(Note 9)  
0
3
CS to SCK ↑  
50  
4
SCK to SDO Valid  
SDO Hold After SCK ↓  
SCK Set-Up Before CS ↓  
SCK Hold After CS ↓  
200  
KQMAX  
KQMIN  
(Note 5)  
15  
50  
t
t
5
6
50  
Note 1: Absolute Maximum Ratings are those values beyond which the  
life of the device may be impaired.  
Note 2: All voltage values are with respect to GND.  
Note 9: The converter is in external SCK mode of operation such that  
the SCK pin is used as digital input. The frequency of the clock signal  
driving SCK during the data output is fESCK and is expressed in kHz.  
Note 10: The converter is in internal SCK mode of operation such that  
the SCK pin is used as digital output. In this mode of operation, the  
SCK pin has a total equivalent load capacitance CLOAD = 20pF.  
Note 11: The external oscillator is connected to the FO pin. The external  
oscillator frequency, fEOSC, is expressed in kHz.  
Note 3: VCC = 2.7 to 5.5V unless otherwise specified. Input source  
resistance = 0.  
Note 4: Internal Conversion Clock source with the FO pin tied  
to GND or to VCC or to external conversion clock source with  
f
EOSC = 153600Hz unless otherwise specified.  
Note 12: The converter uses the internal oscillator.  
Note 5: Guaranteed by design, not subject to test.  
FO = 0V or FO = VCC  
.
Note 6: Integral nonlinearity is defined as the deviation of a code from  
a straight line passing through the actual endpoints of the transfer  
curve. The deviation is measured from the center of the quantization  
band.  
Note 13: The output noise includes the contribution of the internal  
calibration operations.  
Note 14: VREF = FSSET – ZSSET. The minimum input voltage is limited  
to 0.3V and the maximum to VCC + 0.3V.  
Note 7: FO = 0V (internal oscillator) or fEOSC = 153600Hz ±2%  
(external oscillator).  
Note 15: VCC (DC) = 4.1V, VCC (AC) = 2.8VP-P.  
Note 8: FO = VCC (internal oscillator) or fEOSC = 128000Hz ±2%  
(external oscillator).  
24212f  
4
LTC2421/LTC2422  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Negative Extended Input Range  
Total Unadjusted Error (3V Supply)  
Total Unadjusted Error (3V Supply)  
INL (3V Supply)  
10  
8
10  
8
10  
8
V
V
= 3V  
REF  
T
= 90°C  
V
V
= 3V  
REF  
CC  
A
CC  
= 2.5V  
= 2.5V  
T
= 25°C  
A
6
6
6
T
= –45°C  
4
4
4
A
2
2
2
0
0
0
T
A
= –55°C  
–2  
–4  
–6  
–8  
–10  
–2  
–4  
–6  
–8  
–10  
–2  
–4  
–6  
–8  
–10  
T
= –55°C, –45°C, 25°C, 90°C  
A
0
–0.05  
–0.15 –0.20 –0.25 –0.30  
0
0.5  
1.0  
1.5  
2.0  
2.5  
0
0.5  
1.0  
1.5  
2.0  
2.5  
–0.10  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
24212 G03  
24212 G01  
24212 G02  
Positive Extended Input Range  
Total Unadjusted Error (3V Supply)  
Total Unadjusted Error (5V Supply)  
INL (5V Supply)  
10  
8
10  
8
10  
8
V
V
= 3V  
REF  
CC  
= 2.5V  
6
6
6
4
4
4
2
2
2
0
0
0
–2  
–4  
–6  
–8  
–10  
–2  
–4  
–6  
–8  
–10  
–2  
–4  
–6  
–8  
–10  
T
= –55°C, –45°C, 25°C, 90°C  
A
2.50 2.55  
2.65 2.70 2.75 2.80  
2.60  
0
1
2
3
4
5
0
1
2
3
4
5
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
24212 G04  
24212 G05  
24212 G06  
Negative Extended Input Range  
Total Unadjusted Error (5V Supply)  
Positive Extended Input Range  
Total Unadjusted Error (5V Supply)  
Offset Error vs Reference Voltage  
10  
8
150  
120  
90  
60  
30  
0
10  
8
T
= 25°C  
V
V
= 5V  
= 5V  
V
V
= 5V  
= 5V  
V
A
= 5V  
CC  
A
CC  
REF  
CC  
REF  
T
= 25°C  
T
T
= 90°C  
= –45°C  
A
6
A
6
4
4
T
= –55°C  
A
2
2
0
0
–2  
–4  
–6  
–8  
–10  
–2  
–4  
–6  
–8  
–10  
T
T
= –55°C  
= –45°C  
A
T
= 90°C  
T = 25°C  
A
A
A
0
–0.05  
–0.15 –0.20 –0.25 –0.30  
INPUT VOLTAGE (V)  
–0.10  
5.00 5.05  
5.15 5.20 5.25 5.30  
INPUT VOLTAGE (V)  
0
1
2
3
4
5
5.10  
REFERENCE VOLTAGE (V)  
24212 G07  
24212 G08  
24212 G09  
24212f  
5
LTC2421/LTC2422  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
RMS Noise vs Reference Voltage  
Offset Error vs VCC  
RMS Noise vs VCC  
60  
50  
10  
5
10.0  
7.5  
V
T
= 5V  
V
T
= 2.5V  
V
= 2.5V  
REF  
CC  
REF  
= 25°C  
= 25°C  
T
= 25°C  
A
A
A
40  
30  
0
5.0  
20  
10  
0
–5  
2.5  
–10  
0
0
1
2
3
4
5
2.7  
3.2  
3.7  
4.2  
(V)  
4.7  
5.2 5.5  
2.7  
3.2  
3.7  
4.2  
(V)  
4.7  
5.2 5.5  
REFERENCE VOLTAGE (V)  
V
CC  
V
CC  
24212 G10  
24212 G11  
24212 G12  
Noise Histogram  
RMS Noise vs Code Out  
Offset Error vs Temperature  
350  
300  
250  
200  
150  
100  
50  
5.00  
3.75  
2.50  
1.25  
10  
5
V
V
V
= 5V  
= 5V  
V
V
V
= 5V  
= 5V  
V
V
V
= 5  
REF  
= 0  
CC  
REF  
IN  
CC  
REF  
= 0V  
IN  
CC  
= 5  
= 0.3V TO 5.3V  
IN  
T
= 25°C  
A
0
–5  
0
–10  
0
4
–55 –30 –5  
20  
45  
70  
95 120  
–2  
0
2
6
0
7FFFF  
FFFFF  
CODE OUT (HEX)  
TEMPERATURE (°C)  
OUTPUT CODE (ppm)  
24212 G13  
24212 G14  
24212 G15  
Full-Scale Error  
vs Reference Voltage  
Full-Scale Error vs Temperature  
Full-Scale Error vs VCC  
0
10  
5
10  
5
V
V
V
= 5V  
REF  
= 5V  
V
= 2.5V  
REF  
CC  
= 5V  
V
= 2.5V  
IN  
–25  
T
A
= 25°C  
IN  
–50  
–75  
0
0
–100  
–125  
–150  
–5  
–5  
V
V
= 5V  
REF  
CC  
IN  
= V  
–10  
–10  
0
1
2
3
4
5
–55 –30 –5  
20  
45  
70  
95 120  
2.7  
3.2  
3.7  
4.2  
(V)  
4.7  
5.2 5.5  
REFERENCE VOLTAGE (V)  
TEMPERATURE (°C)  
V
CC  
24212 G17  
24212 G16  
24212 G18  
24212f  
6
LTC2421/LTC2422  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
Conversion Current  
vs Temperature  
Sleep Current vs Temperature  
Rejection vs Frequency at VCC  
30  
20  
10  
0
0
230  
220  
210  
200  
190  
180  
170  
160  
150  
V
V
T
= 4.1V  
= 0V  
CC  
IN  
A
–20  
= 25°C  
V
= 5.5V  
= 4.1V  
= 2.7V  
CC  
F
= 0  
O
V
CC  
= 2.7V  
–40  
–60  
V
CC  
CC  
V
CC  
= 5V  
–80  
–100  
–120  
V
1
100  
10k  
1M  
–30  
–5  
45  
70  
95 120  
–55 –30 –5  
20  
45  
70  
95 120  
55  
20  
TEMPERATURE (°C)  
FREQUENCY AT V (Hz)  
TEMPERATURE (°C)  
CC  
24212 G23  
24212 G19  
24212 G20  
Rejection vs Frequency at VCC  
Rejection vs Frequency at VCC  
Rejection vs Frequency at VIN  
–20  
–40  
0
–20  
0
V
V
T
= 4.1V  
= 0V  
V
V
T
= 4.1V  
= 0V  
CC  
IN  
V
V
V
F
= 5V  
CC  
IN  
CC  
= 5V  
REF  
= 25°C  
–20  
= 25°C  
A
O
= 2.5V  
A
O
IN  
F
= 0  
F
= 0  
= 0  
O
–40  
–40  
–60  
–60  
–60  
–80  
–80  
–80  
–100  
–120  
–100  
–120  
–100  
–120  
1
50  
100  
150  
200  
250  
15200  
15300 15350 15400 15450 15500  
1
50  
100  
150  
200  
250  
15250  
FREQUENCY AT V (Hz)  
CC  
FREQUENCY AT V (Hz)  
FREQUENCY AT V (Hz)  
IN  
CC  
24212 G21  
24212 G22  
24212 G24  
Rejection vs Frequency at VIN  
Rejection vs Frequency at VIN  
Rejection vs Frequency at VIN  
0
–60  
–70  
0
–20  
–40  
V
V
V
= 5V  
CC  
= 5V  
REF  
–20  
= 2.5V  
IN  
F
= 0  
O
–80  
–40  
–60  
–90  
–60  
–80  
–100  
–110  
–120  
–130  
–140  
–80  
–100  
–120  
–100  
–120  
–140  
SAMPLE RATE = 15.36kHz ±2%  
15100  
15200  
15300  
15400  
15500  
–12  
–8  
–4  
0
4
8
12  
0
f /2  
S
f
S
FREQUENCY AT V (Hz)  
INPUT FREQUENCY DEVIATION FROM NOTCH FREQUENCY (%)  
INPUT FREQUENCY  
IN  
24212 G26  
24212 G25  
24212 G27  
24212f  
7
LTC2421/LTC2422  
U W  
TYPICAL PERFOR A CE CHARACTERISTICS  
INL vs Output Rate  
INL vs Output Rate  
Resolution vs Output Rate  
24  
22  
20  
18  
16  
20  
18  
16  
20  
18  
16  
V
V
F
= 3V  
REF  
= EXTERNAL  
V
V
F
= 5V  
= 5V  
CC  
CC  
REF  
= 2.5V  
= EXTERNAL  
O
O
T
= –45°C  
A
T
= –45°C  
A
T
= 25°C  
A
14  
12  
10  
14  
12  
10  
T
= 25°C  
V
V
O
= 5V  
REF  
= EXTERNAL  
A
CC  
T
= 90°C  
T
= 90°C  
A
A
= 5V  
T
T
T
= 25°C  
= 90°C  
= –45°C  
f
A
A
A
STANDARD DEVIATION  
OF 100 SAMPLES  
0 7.5  
25  
50  
75  
100  
0
10 20 30 40 50 60 70 80 90 100  
0
10 20 30 40 50 60 70 80 90 100  
OUTPUT RATE (Hz)  
OUTPUT RATE (Hz)  
OUTPUT RATE (Hz)  
24212 G30  
24212 G29  
24212 G28  
U
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PIN FUNCTIONS  
VCC (Pin 1): Positive Supply Voltage. Bypass to GND  
(Pin 6) with a 10µF tantalum capacitor in parallel with  
0.1µF ceramic capacitor as close to the part as possible.  
be connected directly to a ground plane through a mini-  
mum length trace or it should be the single-point-ground  
in a single-point grounding system.  
FSSET (Pin 2): Full-Scale Set Input. This pin defines the  
full-scale input value. When VIN = FSSET, the ADC outputs  
full scale (FFFFFH). The total reference voltage is  
CS (Pin 7): Active LOW Digital Input. A LOW on this pin  
enables the SDO digital output and wakes up the ADC.  
Following each conversion, the ADC automatically enters  
the Sleep mode and remains in this low power state as  
long as CS is HIGH. A LOW on CS wakes up the ADC. A  
LOW-to-HIGH transition on this pin disables the SDO  
digitaloutput.ALOW-to-HIGHtransitiononCSduringthe  
Data Output transfer aborts the data transfer and starts a  
new conversion.  
FSSET – ZSSET  
.
CH0, CH1 (Pins 4, 3): Analog Input Channels. The input  
voltage range is 0.125 • VREF to 1.125 • VREF. For  
VREF > 2.5V, the input voltage range may be limited by the  
absolute maximum rating of 0.3V to VCC + 0.3V. Conver-  
sions are performed alternately between CH0  
and CH1 for the LTC2422. Pin 4 is a No Connect (NC) on  
the LTC2421.  
SDO (Pin 8): Three-State Digital Output. During the data  
output period, this pin is used for serial data output. When  
the chip select CS is HIGH (CS = VCC), the SDO pin is in a  
high impedance state. During the Conversion and Sleep  
periods, this pin can be used as a conversion status out-  
put. The conversion status can be observed by pulling CS  
LOW.  
ZSSET (Pin 5): Zero-Scale Set Input. This pin defines the  
zero-scale input value. When VIN = ZSSET, the ADC  
outputs zero scale (00000H).  
GND (Pin 6): Ground. Shared pin for analog ground,  
digitalground,referencegroundandsignalground.Should  
24212f  
8
LTC2421/LTC2422  
U
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PIN FUNCTIONS  
SCK (Pin 9): Bidirectional Digital Clock Pin. In the Internal  
SerialClockOperationmode, SCKisusedasdigitaloutput  
fortheinternalserialinterfaceclockduringthedataoutput  
period. In the External Serial Clock Operation mode, SCK  
is used as digital input for the external serial interface. An  
internal pull-up current source is automatically activated  
in Internal Serial Clock Operation mode. The Serial Clock  
mode is determined by the level applied to SCK at power  
up and the falling edge of CS.  
FO (Pin 10): Frequency Control Pin. Digital input that  
controls the ADC’s notch frequencies and conversion  
time. When the FO pin is connected to VCC (FO = VCC), the  
converter uses its internal oscillator and the digital filter’s  
first null is located at 50Hz. When the FO pin is connected  
to GND (FO = 0V), the converter uses its internal oscillator  
and the digital filter’s first null is located at 60Hz. When FO  
isdrivenbyanexternalclocksignalwithafrequencyfEOSC  
,
the converter uses this signal as its clock and the digital  
filter first null is located at a frequency fEOSC/2560.  
U
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FUNCTIONAL BLOCK DIAGRA  
INTERNAL  
OSCILLATOR  
V
CC  
GND  
AUTOCALIBRATION  
AND CONTROL  
F
O
(INT/EXT)  
V
IN  
SDO  
SERIAL  
INTERFACE  
ADC  
SCK  
CS  
V
REF  
DECIMATING FIR  
DAC  
24212 FD  
TEST CIRCUITS  
V
CC  
3.4k  
C
SDO  
SDO  
= 20pF  
3.4k  
C
= 20pF  
LOAD  
LOAD  
Hi-Z TO V  
Hi-Z TO V  
OL  
OH  
OH  
V
V
TO V  
OL  
V
OL  
V
OH  
TO V  
OH  
OL  
TO Hi-Z  
24212 TC02  
TO Hi-Z  
24212 TC01  
24212f  
9
LTC2421/LTC2422  
W U U  
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APPLICATIO S I FOR ATIO  
The LTC2421/LTC2422 are pin compatible with the  
LTC2401/LTC2402. The devices are designed to allow the  
user to incorporate either device in the same design with  
nomodifications.WhiletheLTC2421/LTC2422outputword  
length is 24 bits (as opposed to the 32-bit output of the  
LTC2401/LTC2402), its output clock timing can be identi-  
cal to the LTC2401/LTC2402. As shown in Figure 1, the  
LTC2421/LTC2422 data output is concluded on the falling  
edge of the 24th serial clock (SCK). In order to maintain  
drop-in compatibility with the LTC2401/LTC2402, it is  
possibletoclocktheLTC2421/LTC2422withanadditional  
8serialclockpulses.Thisresultsin8additionaloutputbits  
which are always logic HIGH.  
Once CS is pulled LOW and SCK rising edge is applied, the  
devicebeginsoutputtingtheconversionresult.Thereisno  
latency in the conversion result. The data output corre-  
sponds to the conversion just performed. This result is  
shifted out on the serial data out pin (SDO) under the  
control of the serial clock (SCK). Data is updated on the  
falling edge of SCK allowing the user to reliably latch data  
on the rising edge of SCK, see Figure 4. The data output  
state is concluded once 24 bits are read out of the ADC or  
when CS is brought HIGH. The device automatically  
initiates a new conversion and the cycle repeats.  
Through timing control of the CS and SCK pins, the  
LTC2421/LTC2422offerseveralflexiblemodesofopera-  
tion (internal or external SCK and free-running conver-  
sion modes). These various modes do not require  
programming configuration registers; moreover, they do  
not disturb the cyclic operation described above. These  
modes of operation are described in detail in the Serial  
Interface Timing Modes section.  
Converter Operation Cycle  
The LTC2421/LTC2422 are low power, delta-sigma ana-  
log-to-digital converters with an easy to use 3-wire serial  
interface. Their operation is simple and made up of three  
states. The converter operating cycle begins with the con-  
version,followedbythesleepstateandconcludedwiththe  
dataoutput(seeFigure2). The3-wireinterfaceconsistsof  
serial data output (SDO), a serial clock (SCK) and a chip  
select (CS).  
CONVERT  
SLEEP  
Initially,theLTC2421/LTC2422performaconversion.Once  
the conversion is complete, the device enters the sleep  
state. While in this sleep state, power consumption is re-  
duced by an order of magnitude if CS is HIGH. The part  
remains in the sleep state as long as CS is logic HIGH. The  
conversion result is held indefinitely in a static shift regis-  
ter while the converter is in the sleep state.  
1
CS AND  
SCK  
0
DATA OUTPUT  
24212 F02  
Figure 2. LTC2421/LTC2422 State Transition Diagram  
CS  
8
8
8
8 (OPTIONAL)  
SCK  
SDO  
EOC = 1  
EOC = 0  
SLEEP  
EOC = 1  
DATA OUT  
4 STATUS BITS 20 DATA BITS  
LAST 8 BITS ALWAYS 1  
CONVERSION  
DATA OUTPUT  
CONVERSION  
24212 F01  
Figure 1. LTC2421/LTC2422 Compatible Timing with the LTC2401/LTC2402  
24212f  
10  
LTC2421/LTC2422  
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APPLICATIO S I FOR ATIO  
U
Conversion Clock  
above. The first conversion result following POR is accu-  
rate within the specifications of the device.  
A major advantage delta-sigma converters offer over con-  
ventional type converters is an on-chip digital filter (com-  
monly known as Sinc or Comb filter). For high resolution,  
low frequency applications, this filter is typically designed  
to reject line frequencies of 50Hz or 60Hz plus their har-  
monics. In order to reject these frequencies in excess of  
110dB,ahighlyaccurateconversionclockisrequired.The  
LTC2421/LTC2422 incorporate an on-chip highly accu-  
rate oscillator. This eliminates the need for external fre-  
quency setting components such as crystals or oscilla-  
tors. Clocked by the on-chip oscillator, the LTC2421/  
LTC2422 reject line frequencies (50Hz or 60Hz ±2%) a  
minimum of 110dB.  
Reference Voltage Range  
TheLTC2421/LTC2422canacceptareferencevoltage(VREF  
= FSSET – ZSSET) from 0V to VCC. The converter output  
noise is determined by the thermal noise of the front-end  
circuits, and as such, its value in microvolts is nearly con-  
stant with reference voltage. A decrease in reference volt-  
age will not significantly improve the converter’s effective  
resolution. On the other hand, a reduced reference voltage  
will improve the overall converter INL performance. The  
recommended range for the LTC2421/LTC2422 voltage  
reference is 100mV to VCC.  
Input Voltage Range  
Ease of Use  
Theconverterisabletoaccommodatesystemleveloffset  
and gain errors as well as system level overrange situa-  
tions due to its extended input range, see Figure 3. The  
LTC2421/LTC2422 convert input signals within the ex-  
tended input range of 0.125 • VREF to 1.125 • VREF  
(VREF = FSSET – ZSSET).  
The LTC2421/LTC2422 data output has no latency, filter  
settling or redundant data associated with the conver-  
sion cycle. There is a one-to-one correspondence be-  
tween the conversion and the output data. Therefore,  
multiplexing an analog input voltage is easy.  
The LTC2421/LTC2422 perform offset and full-scale cali-  
brations every conversion cycle. This calibration is trans-  
parenttotheuserandhasnoeffectonthecyclicoperation  
describedabove. Theadvantageofcontinuouscalibration  
is extreme stability of offset and full-scale readings with  
respect to time, supply voltage change and temperature  
drift.  
For large values of VREF (VREF = FSSET – ZSSET), this range  
is limited by the absolute maximum voltage range of  
0.3V to (VCC + 0.3V). Beyond this range, the input ESD  
protection devices begin to turn on and the errors due to  
the input leakage current increase rapidly.  
Input signals applied to VIN may extend below ground by  
300mV and above VCC by 300mV. In order to limit any  
Power-Up Sequence  
V
+ 0.3V  
CC  
TheLTC2421/LTC2422automaticallyenteraninternalreset  
state when the power supply voltage VCC drops below  
approximately 2.2V. This feature guarantees the integrity  
of the conversion result and of the serial interface mode  
selection which is performed at the initial power-up. (See  
the2-wireI/OsectionsintheSerialInterfaceTimingModes  
section.)  
FS  
+ 0.12V  
FS  
SET  
REF  
SET  
ABSOLUTE  
MAXIMUM  
INPUT  
NORMAL  
INPUT  
RANGE  
EXTENDED  
INPUT  
RANGE  
RANGE  
ZS  
SET  
REF  
When the VCC voltage rises above this critical threshold,  
the converter creates an internal power-on-reset (POR)  
signal with duration of approximately 0.5ms. The POR  
signal clears all internal registers. Following the POR sig-  
nal,theLTC2421/LTC2422start anormalconversioncycle  
and follows the normal succession of states described  
ZS  
SET  
– 0.12V  
–0.3V  
24212 F03  
(V  
REF  
= FS  
– ZS  
)
SET  
SET  
Figure 3. LTC2421/LTC2422 Input Range  
24212f  
11  
LTC2421/LTC2422  
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APPLICATIO S I FOR ATIO  
fault current, a resistor of up to 5k may be added in series  
with the VIN pin without affecting the performance of the  
device. In the physical layout, it is important to maintain  
the parasitic capacitance of the connection between this  
series resistance and the VIN pin as low as possible; there-  
fore, the resistor should be located as close as practical to  
the VIN pin. The effect of the series resistance on the con-  
verter accuracy can be evaluated from the curves pre-  
sented in the Analog Input/Reference Current section. In  
addition, a series resistor will introduce a temperature de-  
pendent offset error due to the input leakage current. A  
1nA input leakage current will develop a 1ppm offset error  
on a 5k resistor if VREF = 5V. This error has a very strong  
temperature dependency.  
0 VIN VREF, this bit is LOW. If the input is outside the  
normal input range, VIN > VREF or VIN < 0, this bit is HIGH.  
The function of these bits is summarized in Table 1.  
Table 1. LTC2421/LTC2422 Status Bits  
Bit 23  
EOC  
Bit 22  
Bit 21  
SIG  
Bit 20  
EXR  
Input Range  
> V  
CH0/CH1  
V
0
0
0
0
*0/1  
*0/1  
*0/1  
*0/1  
1
1
1
0
0
1
IN  
REF  
0 < V V  
IN  
REF  
+
V
V
= 0 /0  
1/0  
0
IN  
IN  
< 0  
*Bit 22 displays the channel number for the LTC2422. Bit 22 is always  
0 for the LTC2421  
Bit 19 (fifth output bit) is the most significant bit (MSB).  
Bits 19-0 are the 20-bit conversion result MSB first.  
Bit 0 is the least significant bit (LSB).  
Output Data Format  
TheLTC2421/LTC2422serialoutputdatastreamis24bits  
long. The first 4 bits represent status information indicat-  
ing the sign, selected channel, input range and conversion  
state. Thenext20bitsaretheconversionresult, MSBfirst.  
DataisshiftedoutoftheSDOpinundercontroloftheserial  
clock (SCK), see Figure 4. Whenever CS is HIGH, SDO  
remains high impedance and any SCK clock pulses are  
ignored by the internal data out shift register.  
Bit 23 (first output bit) is the end of conversion (EOC)  
indicator. This bit is available at the SDO pin during the  
conversion and sleep states whenever the CS pin is LOW.  
This bit is HIGH during the conversion and goes LOW  
when the conversion is complete.  
In order to shift the conversion result out of the device, CS  
mustfirstbedrivenLOW. EOCisseenattheSDOpinofthe  
deviceonceCSispulledLOW.EOCchangesrealtimefrom  
HIGH to LOW at the completion of a conversion. This sig-  
nal may be used as an interrupt for an external microcon-  
troller.Bit23(EOC)canbecapturedonthefirstrisingedge  
of SCK. Bit 22 is shifted out of the device on the first falling  
edge of SCK. The final data bit (Bit 0) is shifted out on the  
falling edge of the 23rd SCK and may be latched on the  
risingedgeofthe24thSCKpulse.Onthefallingedgeofthe  
24th SCK pulse, SDO goes HIGH indicating a new conver-  
sion cycle has been initiated. This bit serves as EOC (Bit  
23) for the next conversion cycle. Table 2 summarizes the  
output data format.  
Bit 22 (second output bit) for the LTC2422, this bit is LOW  
if the last conversion was performed on CH0 and HIGH for  
CH1. This bit is always LOW for the LTC2421.  
Bit 21 (third output bit) is the conversion result sign indi-  
cator (SIG). If VIN is >0, this bit is HIGH. If VIN is <0, this  
bitisLOW.Thesignbitchangesstateduringthezerocode.  
Bit20(fourthoutputbit)istheextendedinputrange(EXR)  
indicator. If the input is within the normal input range  
CS  
BIT 23  
EOC  
BIT 22  
BIT 21  
SIG  
BIT 20  
EXT  
BIT 19  
MSB  
BIT 4  
BIT 0  
SDO  
SCK  
LSB  
20  
CH0/CH1  
Hi-Z  
1
2
3
4
5
19  
20  
24  
SLEEP  
DATA OUTPUT  
CONVERSION  
24212 F04  
Figure 4. Output Data Timing  
24212f  
12  
LTC2421/LTC2422  
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APPLICATIO S I FOR ATIO  
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Table 2. LTC2421/LTC2422 Output Data Format  
Bit 23  
EOC  
Bit 22*  
CH0/CH1  
Bit 21  
SIG  
Bit 20  
EXR  
Bit 19  
MSB  
Bit 18  
Bit 17  
Bit 16  
Bit 15  
Bit 0  
LSB  
Input Voltage  
> 9/8 • V  
V
0
0
0
0
0
0
0
0
0
0
0
0
0
0
CH0/CH1  
CH0/CH1  
CH0/CH1  
CH0/CH1  
CH0/CH1  
CH0/CH1  
CH0/CH1  
CH0/CH1  
CH0/CH1  
CH0/CH1  
CH0/CH1  
CH0/CH1  
CH0/CH1  
CH0/CH1  
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
0
0
0
1
1
1
1
0
0
0
0
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
1
1
0
0
0
1
0
1
0
1
0
1
0
1
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
0
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
...  
1
1
0
1
0
1
0
1
0
1
0
1
0
0
IN  
REF  
9/8 • V  
1
REF  
V
V
+ 1LSB  
1
REF  
REF  
1
3/4V  
3/4V  
1/2V  
1/2V  
1/4V  
1/4V  
+ 1LSB  
+ 1LSB  
+ 1LSB  
1
REF  
REF  
REF  
REF  
REF  
REF  
1
1
1
1
1
+
0 /0  
1/0**  
–1LSB  
0
0
0
–1/8 • V  
REF  
V
< –1/8 • V  
REF  
IN  
*Bit 22 is always 0 for the LTC2421 **The sign bit changes state during the 0 code.  
As long as the voltage on the VIN pin is maintained within  
the 0.3V to (VCC + 0.3V) absolute maximum operating  
range, a conversion result is generated for any input value  
from 0.125 • VREF to 1.125 • VREF. For input voltages  
greaterthan1.125VREF,theconversionresultisclamped  
to the value corresponding to 1.125 • VREF. For input volt-  
agesbelow0.125VREF,theconversionresultisclamped  
When a fundamental rejection frequency different from  
50Hz or 60Hz is required or when the converter must be  
synchronized with an outside source, the LTC2421/  
LTC2422 can operate with an external conversion clock.  
The converter automatically detects the presence of an  
external clock signal at the FO pin and turns off the internal  
oscillator. The frequency fEOSC of the external signal must  
be at least 2560Hz (1Hz notch frequency) to be detected.  
The external clock signal duty cycle is not significant as  
long as the minimum and maximum specifications for the  
high and low periods tHEO and tLEO are observed.  
to the value corresponding to 0.125 • VREF  
.
Frequency Rejection Selection (FO Pin Connection)  
The LTC2421/LTC2422 internal oscillator provides better  
than 110dB normal mode rejection at the line frequency  
and all its harmonics for 50Hz ±2% or 60Hz ±2%. For  
60Hz rejection, FO (Pin 10) should be connected to GND  
(Pin 6) while for 50Hz rejection the FO pin should be con-  
nected to VCC (Pin 1).  
While operating with an external conversion clock of a  
frequencyfEOSC,theLTC2421/LTC2422providebetterthan  
110dB normal mode rejection in a frequency range fEOSC  
/
2560 ±4% and its harmonics. The normal mode rejection  
as a function of the input frequency deviation from fEOSC  
2560 is shown in Figure 5.  
/
The selection of 50Hz or 60Hz rejection can also be made  
by driving FO to an appropriate logic level. A selection  
change during the sleep or data output states will not  
disturb the converter operation. If the selection is made  
duringtheconversionstate, theresultoftheconversionin  
progress may be outside specifications but the following  
conversions will not be affected.  
Whenever an external clock is not present at the FO pin, the  
converterautomaticallyactivatesitsinternaloscillatorand  
enters the Internal Conversion Clock mode. The LTC2421/  
LTC2422 operation will not be disturbed if the change of  
conversion clock source occurs during the sleep state or  
during the data output state while the converter uses an  
24212f  
13  
LTC2421/LTC2422  
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APPLICATIO S I FOR ATIO  
–60  
synchronous 3-wire interface. During the conversion and  
sleep states, this interface can be used to assess the con-  
verter status and during the data output state, it is used to  
read the conversion result.  
–70  
–80  
–90  
–100  
–110  
–120  
–130  
–140  
Serial Clock Input/Output (SCK)  
The serial clock signal present on SCK (Pin 9) is used to  
synchronizethedatatransfer.Eachbitofdataisshiftedout  
the SDO pin on the falling edge of the serial clock.  
–12  
–8  
–4  
0
4
8
12  
In the Internal SCK mode of operation, the SCK pin is an  
output and the LTC2421/LTC2422 create their own serial  
clock by dividing the internal conversion clock by 8. In the  
External SCK mode of operation, the SCK pin is used as  
input. The internal or external SCK mode is selected on  
power-up and then reselected every time a HIGH-to-LOW  
transition is detected at the CS pin. If SCK is HIGH or  
floating at power-up or during this transition, the con-  
verter enters the internal SCK mode. If SCK is LOW at  
power-up or during this transition, the converter enters  
the external SCK mode.  
INPUT FREQUENCY DEVIATION FROM NOTCH FREQUENCY (%)  
24212 F05  
Figure 5. LTC2421/LTC2422 Normal Mode Rejection When  
Using an External Oscillator of Frequency fEOSC  
external serial clock. If the change occurs during the con-  
version state, the result of the conversion in progress may  
be outside specifications but the following conversions  
will not be affected. If the change occurs during the data  
output state and the converter is in the Internal SCK mode,  
the serial clock duty cycle may be affected but the serial  
data stream will remain valid.  
Serial Data Output (SDO)  
Table 3 summarizes the duration of each state as a func-  
tion of FO.  
The serial data output pin, SDO (Pin 8), drives the serial  
data during the data output state. In addition, the SDO pin  
is used as an end of conversion indicator during the con-  
version and sleep states.  
SERIAL INTERFACE  
The LTC2421/LTC2422 transmit the conversion results  
and receives the start of conversion command through a  
When CS (Pin 7) is HIGH, the SDO driver is switched to a  
high impedance state. This allows sharing the serial  
Table 3. LTC2421/LTC2422 State Duration  
State  
Operating Mode  
Duration  
CONVERT  
Internal Oscillator  
F = LOW  
(60Hz Rejection)  
133ms  
O
F = HIGH  
O
160ms  
(50Hz Rejection)  
External Oscillator  
F = External Oscillator  
20510/f  
s
EOSC  
O
with Frequency f  
kHz  
EOSC  
(f  
EOSC  
/2560 Rejection)  
SLEEP  
As Long As CS = HIGH Until CS = 0 and SCK  
DATA OUTPUT  
Internal Serial Clock  
External Serial Clock with  
F = LOW/HIGH  
(Internal Oscillator)  
As Long As CS = LOW But Not Longer Than 1.28ms  
(24 SCK cycles)  
O
F = External Oscillator with  
As Long As CS = LOW But Not Longer Than 192/f  
ms  
EOSC  
O
Frequency f  
kHz  
(24 SCK cycles)  
EOSC  
As Long As CS = LOW But Not Longer Than 24/f ms  
SCK  
Frequency f  
kHz  
(24 SCK cycles)  
SCK  
24212f  
14  
LTC2421/LTC2422  
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APPLICATIO S I FOR ATIO  
U
interface with other devices. If CS is LOW during the con-  
vert or sleep state, SDO will output EOC. If CS is LOW  
duringtheconversionphase,theEOCbitappearsHIGHon  
the SDO pin. Once the conversion is complete, EOC goes  
LOW. The device remains in the sleep state until the first  
rising edge of SCK occurs while CS = 0. While in the sleep  
state, the device is in a LOW power state if CS is HIGH.  
these serial interface timing modes in detail. In all these  
cases, the converter can use the internal oscillator (FO =  
LOW or FO = HIGH) or an external oscillator connected to  
the FO pin. Refer to Table 4 for a summary.  
External Serial Clock, Single Cycle Operation  
(SPI/MICROWIRE Compatible)  
This timing mode uses an external serial clock to shift out  
the conversion result and a CS signal to monitor and con-  
trol the state of the conversion cycle, see Figure 6.  
Chip Select Input (CS)  
The active LOW chip select, CS (Pin 7), is used to test the  
conversionstatusandtoenablethedataoutputtransferas  
described in the previous sections.  
The serial clock mode is selected on the falling edge of CS.  
Toselecttheexternalserialclockmode,theserialclockpin  
(SCK) must be LOW during each CS falling edge.  
In addition, the CS signal can be used to trigger a new  
conversion cycle before the entire serial data transfer has  
been completed. The LTC2421/LTC2422 will abort any  
serial data transfer in progress and start a new conversion  
cycle anytime a LOW-to-HIGH transition is detected at the  
CSpinaftertheconverterhasenteredthedataoutputstate  
(i.e., after the first rising edge of SCK occurs with CS = 0).  
The serial data output pin (SDO) is Hi-Z as long as CS is  
HIGH. At any time during the conversion cycle, CS may be  
pulled LOW in order to monitor the state of the converter.  
While CS is LOW, EOC is output to the SDO pin. EOC = 1  
while a conversion is in progress and EOC = 0 if the device  
is in the sleep state. Independent of CS, the device auto-  
matically enters the sleep state once the conversion is  
complete. While in the sleep state, power is reduced an  
order of magnitude if CS is HIGH.  
Finally, CS can be used to control the free-running modes  
of operation, see Serial Interface Timing Modes section.  
Grounding CS will force the ADC to continuously convert  
at the maximum output rate selected by FO. Tying a ca-  
pacitor to CS will reduce the output rate and power dissi-  
pation by a factor proportional to the capacitor’s value,  
see Figures 13 to 15.  
When the device is in the sleep state (EOC = 0), its  
conversion result is held in an internal static shift register.  
The device remains in the sleep state until the first rising  
edge of SCK is seen while CS is LOW. Data is shifted out  
the SDO pin on each falling edge of SCK. This enables  
external circuitry to latch the output on the rising edge of  
SCK. EOC can be latched on the first rising edge of SCK  
and the last bit of the conversion result can be latched on  
the 24th rising edge of SCK. On the 24th falling edge of  
SCK, thedevicebeginsanewconversion. SDOgoesHIGH  
(EOC = 1) indicating a conversion is in progress.  
SERIAL INTERFACE TIMING MODES  
The LTC2421/LTC2422’s 3-wire interface is SPI and  
MICROWIRE compatible. This interface offers several  
flexible modes of operation. These include internal/exter-  
nal serial clock, 2- or 3-wire I/O, single cycle conversion  
and autostart. The following sections describe each of  
Table 4. LTC2421/LTC2422 Interface Timing Modes  
Conversion  
Cycle  
Control  
Data  
Output  
Control  
Connection  
and  
Waveforms  
SCK  
Configuration  
Source  
External  
External  
Internal  
Internal  
Internal  
External SCK, Single Cycle Conversion  
External SCK, 2-Wire I/O  
CS and SCK  
SCK  
CS and SCK  
SCK  
Figures 6, 7  
Figure 8  
Internal SCK, Single Cycle Conversion  
Internal SCK, 2-Wire I/O, Continuous Conversion  
Internal SCK, Autostart Conversion  
CS ↓  
CS ↓  
Figures 9, 10  
Figure 11  
Continuous  
Internal  
Internal  
C
EXT  
Figure 12  
24212f  
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LTC2421/LTC2422  
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APPLICATIO S I FOR ATIO  
At the conclusion of the data cycle, CS may remain LOW  
and EOC monitored as an end-of-conversion interrupt.  
Alternatively, CS may be driven HIGH setting SDO to Hi-Z.  
As described above, CS may be pulled LOW at any time in  
order to monitor the conversion status.  
CS HIGH anytime between the first rising edge and the  
24th falling edge of SCK, see Figure 7. On the rising edge  
of CS, the device aborts the data output state and imme-  
diately initiates a new conversion. This is useful for sys-  
tems not requiring all 24 bits of output data, aborting an  
invalid conversion cycle or synchronizing the start of a  
conversion.  
Typically, CS remains LOW during the data output state.  
However, the data output state may be aborted by pulling  
2.7V TO 5.5V  
V
CC  
1µF  
= INTERNAL OSC/50Hz REJECTION  
1
10  
= EXTERNAL CLOCK SOURCE  
= INTERNAL OSC/60Hz REJECTION  
V
F
O
CC  
LTC2422  
2
9
8
7
6
REFERENCE VOLTAGE  
FS  
SCK  
SDO  
CS  
SET  
ZS  
+ 0.1V TO V  
SET  
CC  
3
4
5
3-WIRE  
SERIAL I/O  
ANALOG INPUT RANGE  
CH1  
CH0  
ZS  
ZS  
– 0.12V  
TO  
SET  
FS  
REF  
+ 0.12V  
SET  
REF  
(V  
= FS  
– ZS  
)
REF  
SET  
SET  
0V TO FS  
– 100mV  
GND  
SET  
SET  
CS  
TEST EOC  
TEST EOC  
TEST EOC  
BIT 23  
EOC  
BIT 22  
CH0/CH1  
BIT 21  
SIG  
BIT 20  
EXR  
BIT 19  
MSB  
BIT 18  
BIT 4  
BIT 0  
LSB  
SDO  
20  
Hi-Z  
Hi-Z  
Hi-Z  
SCK  
(EXTERNAL)  
CONVERSION  
SLEEP  
DATA OUTPUT  
CONVERSION  
24212 F06  
Figure 6. External Serial Clock, Single Cycle Operation  
2.7V TO 5.5V  
V
CC  
1µF  
= INTERNAL OSC/50Hz REJECTION  
= EXTERNAL CLOCK SOURCE  
= INTERNAL OSC/60Hz REJECTION  
1
10  
V
F
O
CC  
LTC2422  
2
3
4
5
9
8
7
6
REFERENCE VOLTAGE  
FS  
SCK  
SDO  
CS  
SET  
ZS  
+ 0.1V TO V  
SET  
CC  
3-WIRE  
SERIAL I/O  
ANALOG INPUT RANGE  
CH1  
CH0  
ZS  
ZS  
– 0.12V  
TO  
REF  
)
SET  
SET  
FS  
REF  
+ 0.12V  
SET  
(V  
= FS  
– ZS  
REF  
SET  
0V TO FS  
– 100mV  
GND  
SET  
SET  
CS  
TEST EOC  
TEST EOC  
TEST EOC  
BIT 0  
EOC  
BIT 23  
EOC  
BIT 22  
BIT 21  
SIG  
BIT 20  
EXR  
BIT 19  
MSB  
BIT 9  
BIT 8  
SDO  
SCK  
CH0/CH1  
Hi-Z  
Hi-Z  
Hi-Z  
Hi-Z  
(EXTERNAL)  
SLEEP  
CONVERSION  
DATA OUTPUT  
SLEEP  
DATA OUTPUT  
CONVERSION  
24212 F07  
Figure 7. External Serial Clock, Reduced Data Output Length  
24212f  
16  
LTC2421/LTC2422  
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APPLICATIO S I FOR ATIO  
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External Serial Clock, 2-Wire I/O  
goes HIGH (EOC = 1) indicating a new conversion has  
begun.  
This timing mode utilizes a 2-wire serial I/O interface. The  
conversion result is shifted out of the device by an exter-  
nally generated serial clock (SCK) signal, see Figure 8. CS  
maybepermanentlytiedtoground(Pin6),simplifyingthe  
user interface or isolation barrier.  
Internal Serial Clock, Single Cycle Operation  
This timing mode uses an internal serial clock to shift out  
the conversion result and a CS signal to monitor and con-  
trol the state of the conversion cycle, see Figure 9.  
The external serial clock mode is selected at the end of the  
power-on reset (POR) cycle. The POR cycle is concluded  
approximately 0.5ms after VCC exceeds 2.2V. The level  
applied to SCK at this time determines if SCK is internal or  
external. SCK must be driven LOW prior to the end of POR  
in order to enter the external serial clock timing mode.  
In order to select the internal serial clock timing mode, the  
serial clock pin (SCK) must be floating (Hi-Z) or pulled  
HIGH prior to the falling edge of CS. The device will not  
enter the internal serial clock mode if SCK is driven LOW  
on the falling edge of CS. An internal weak pull-up resistor  
is active on the SCK pin during the falling edge of CS;  
therefore, the internal serial clock timing mode is auto-  
matically selected if SCK is not externally driven.  
Since CS is tied LOW, the end-of-conversion (EOC) can  
be continuously monitored at the SDO pin during the  
convert and sleep states. EOC may be used as an inter-  
rupt to an external controller indicating the conversion  
resultisready.EOC=1whiletheconversionisinprogress  
and EOC = 0 once the conversion enters the low power  
sleep state. On the falling edge of EOC, the conversion  
result is loaded into an internal static shift register. The  
deviceremainsinthesleepstateuntilthefirstrisingedge  
of SCK. Data is shifted out the SDO pin on each falling  
edge of SCK enabling external circuitry to latch data on  
the rising edge of SCK. EOC can be latched on the first  
rising edge of SCK. On the 24th falling edge of SCK, SDO  
The serial data output pin (SDO) is Hi-Z as long as CS is  
HIGH. At any time during the conversion cycle, CS may be  
pulled LOW in order to monitor the state of the converter.  
Once CS is pulled LOW, SCK goes LOW and EOC is output  
to the SDO pin. EOC = 1 while a conversion is in progress  
and EOC = 0 if the device is in the sleep state.  
WhentestingEOC, iftheconversioniscomplete(EOC=0),  
the device will exit the sleep state and enter the data output  
state if CS remains LOW. In order to prevent the device  
from exiting the low power sleep state, CS must be pulled  
2.7V TO 5.5V  
V
CC  
1µF  
= INTERNAL OSC/50Hz REJECTION  
1
10  
= EXTERNAL CLOCK SOURCE  
= INTERNAL OSC/60Hz REJECTION  
V
F
O
CC  
LTC2422  
2
3
4
5
9
8
7
6
REFERENCE VOLTAGE  
FS  
SET  
SCK  
SDO  
CS  
ZS  
+ 0.1V TO V  
SET  
CC  
2-WIRE SERIAL I/O  
ANALOG INPUT RANGE  
CH1  
CH0  
ZS  
ZS  
– 0.12V  
TO  
SET  
FS  
REF  
+ 0.12V  
SET  
REF  
(V  
= FS  
– ZS  
)
REF  
SET  
SET  
0V TO FS  
SET  
– 100mV  
GND  
SET  
CS  
BIT 23  
EOC  
BIT 22  
CH0/CH1  
BIT 21  
SIG  
BIT 20  
EXR  
BIT 19  
MSB  
BIT 18  
BIT 4  
BIT 0  
LSB  
SDO  
20  
SCK  
(EXTERNAL)  
CONVERSION  
SLEEP  
DATA OUTPUT  
CONVERSION  
24212 F08  
Figure 8. External Serial Clock, CS = 0 Operation  
24212f  
17  
LTC2421/LTC2422  
APPLICATIO S I FOR ATIO  
W U U  
U
V
CC  
2.7V TO 5.5V  
V
CC  
1µF  
= INTERNAL OSC/50Hz REJECTION  
10k  
1
10  
= EXTERNAL CLOCK SOURCE  
= INTERNAL OSC/60Hz REJECTION  
V
F
O
CC  
LTC2422  
2
9
8
7
6
REFERENCE VOLTAGE  
ZS + 0.1V TO V  
FS  
SCK  
SDO  
CS  
SET  
SET  
CC  
3
4
5
ANALOG INPUT RANGE  
CH1  
CH0  
ZS  
ZS  
– 0.12V  
TO  
SET  
FS  
REF  
+ 0.12V  
SET  
REF  
(V  
= FS  
SET  
– ZS  
)
REF  
SET  
0V TO FS  
SET  
– 100mV  
GND  
SET  
<t  
EOCtest  
CS  
TEST EOC  
TEST EOC  
BIT 23  
EOC  
BIT 22  
BIT 21  
SIG  
BIT 20  
EXR  
BIT 19  
MSB  
BIT 18  
BIT 4  
BIT 0  
LSB  
SDO  
CH0/CH1  
20  
Hi-Z  
Hi-Z  
Hi-Z  
Hi-Z  
SCK  
(INTERNAL)  
CONVERSION  
SLEEP  
DATA OUTPUT  
CONVERSION  
24212 F09  
Figure 9. Internal Serial Clock, Single Cycle Operation  
HIGH before the first rising edge of SCK. In the internal  
SCK timing mode, SCK goes HIGH and the device begins  
outputting data at time tEOCtest after the falling edge of CS  
(if EOC = 0) or tEOCtest after EOC goes LOW (if CS is LOW  
duringthefallingedgeofEOC).ThevalueoftEOCtest is23µs  
if the device is using its internal oscillator (F0 = logic LOW  
or HIGH). If FO is driven by an external oscillator of fre-  
quency fEOSC, then tEOCtest is 3.6/fEOSC. If CS is pulled  
HIGH before time tEOCtest, the device remains in the sleep  
state. The conversion result is held in the internal static  
shift register.  
CS HIGH anytime between the first and24th rising edge of  
SCK, see Figure 10. On the rising edge of CS, the device  
aborts the data output state and immediately initiates a  
new conversion. This is useful for systems not requiring  
all 24 bits of output data, aborting an invalid conversion  
cycle, or synchronizing the start of a conversion. If CS is  
pulled HIGH while the converter is driving SCK LOW, the  
internal pull-up is not available to restore SCK to a logic  
HIGH state. This will cause the device to exit the internal  
serial clock mode on the next falling edge of CS. This can  
be avoided by adding an external 10k pull-up resistor to  
theSCKpinorbyneverpullingCSHIGHwhenSCKisLOW.  
If CS remains LOW longer than tEOCtest, the first rising  
edge of SCK will occur and the conversion result is serially  
shiftedoutoftheSDOpin. Thedataoutputcyclebeginson  
this first rising edge of SCK and concludes after the 24th  
rising edge. Data is shifted out the SDO pin on each falling  
edgeofSCK.Theinternallygeneratedserialclockisoutput  
to the SCK pin. This signal may be used to shift the con-  
version result into external circuitry. EOC can be latched  
on the first rising edge of SCK and the last bit of the con-  
version result on the 24th rising edge of SCK. After the  
24th rising edge, SDO goes HIGH (EOC = 1), SCK stays  
HIGH, and a new conversion starts.  
Whenever SCK is LOW, the LTC2421/LTC2422’s internal  
pull-up at pin SCK is disabled. Normally, SCK is not exter-  
nallydrivenifthedeviceisintheinternalSCKtimingmode.  
However,certainapplicationsmayrequireanexternaldriver  
on SCK. If this driver goes Hi-Z after outputting a LOW  
signal, the LTC2421/LTC2422’s internal pull-up remains  
disabled. Hence, SCK remains LOW. On the next falling  
edge of CS, the device is switched to the external SCK  
timing mode. By adding an external 10k pull-up resistor to  
SCK, this pin goes HIGH once the external driver goes  
Hi-Z. On the next CS falling edge, the device will remain in  
the internal SCK timing mode.  
Typically, CS remains LOW during the data output state.  
However, the data output state may be aborted by pulling  
24212f  
18  
LTC2421/LTC2422  
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APPLICATIO S I FOR ATIO  
U
V
CC  
2.7V TO 5.5V  
V
CC  
1µF  
= INTERNAL OSC/50Hz REJECTION  
10k  
1
10  
= EXTERNAL CLOCK SOURCE  
= INTERNAL OSC/60Hz REJECTION  
V
F
O
CC  
LTC2422  
2
9
8
7
6
REFERENCE VOLTAGE  
ZS + 0.1V TO V  
FS  
SET  
SCK  
SDO  
CS  
SET CC  
3
4
5
ANALOG INPUT RANGE  
CH1  
CH0  
ZS  
ZS  
– 0.12V  
TO  
SET  
FS  
REF  
+ 0.12V  
SET  
REF  
(V  
= FS  
– ZS  
)
REF  
SET  
SET  
0V TO FS  
SET  
– 100mV  
GND  
SET  
>t  
EOCtest  
<t  
EOCtest  
CS  
TEST EOC  
TEST EOC  
TEST EOC  
BIT 0  
EOC  
BIT 23  
EOC  
BIT 22  
BIT 21  
SIG  
BIT 20  
EXR  
BIT 19  
MSB  
BIT 18  
BIT 8  
SDO  
CH0/CH1  
Hi-Z  
Hi-Z  
Hi-Z  
Hi-Z  
Hi-Z  
SCK  
(INTERNAL)  
SLEEP  
CONVERSION  
DATA OUTPUT  
SLEEP  
DATA OUTPUT  
CONVERSION  
24212 F10  
Figure 10. Internal Serial Clock, Reduced Data Output Length  
A similar situation may occur during the sleep state when  
CS is pulsed HIGH-LOW-HIGH in order to test the conver-  
sionstatus.Ifthedeviceisinthesleepstate(EOC=0),SCK  
will go LOW. Once CS goes HIGH (within the time period  
defined above as tEOCtest), the internal pull-up is activated.  
For a heavy capacitive load on the SCK pin, the internal  
pull-up may not be adequate to return SCK to a HIGH level  
before CS goes low again. This is not a concern under  
normal conditions where CS remains LOW after detecting  
EOC = 0. This situation is easily overcome by adding an  
external 10k pull-up resistor to the SCK pin.  
weak pull-up is active during the POR cycle; therefore, the  
internal serial clock timing mode is automatically selected  
if SCK is not externally driven LOW (if SCK is loaded such  
that the internal pull-up cannot pull the pin HIGH, the ex-  
ternal SCK mode will be selected).  
During the conversion, the SCK and the serial data output  
pin (SDO) are HIGH (EOC = 1). Once the conversion is  
complete, SCK and SDO go LOW (EOC = 0) indicating the  
conversion has finished and the device has entered the  
sleepstate.Thepartremainsinthesleepstateaminimum  
amount of time (1/2 the internal SCK period) then imme-  
diatelybeginsoutputtingdata.Thedataoutputcyclebegins  
on the first rising edge of SCK and ends after the 24th  
risingedge. DataisshiftedouttheSDOpinoneachfalling  
edge of SCK. The internally generated serial clock is out-  
put to the SCK pin. This signal may be used to shift the  
conversionresultintoexternalcircuitry.EOCcanbelatched  
on the first rising edge of SCK and the last bit of the  
conversion result can be latched on the 24th rising edge  
of SCK. After the 24th rising edge, SDO goes HIGH  
(EOC=1)indicatinganewconversionisinprogress. SCK  
remains HIGH during the conversion.  
Internal Serial Clock, 2-Wire I/O,  
Continuous Conversion  
This timing mode uses a 2-wire, all output (SCK and SDO)  
interface. Theconversionresultisshiftedoutofthedevice  
by an internally generated serial clock (SCK) signal, see  
Figure 11. CS may be permanently tied to ground (Pin 6),  
simplifying the user interface or isolation barrier.  
The internal serial clock mode is selected at the end of the  
power-on reset (POR) cycle. The POR cycle is concluded  
approximately 0.5ms after VCC exceeds 2.2V. An internal  
24212f  
19  
LTC2421/LTC2422  
APPLICATIO S I FOR ATIO  
W U U  
U
V
CC  
2.7V TO 5.5V  
V
CC  
1µF  
= INTERNAL OSC/50Hz REJECTION  
1
10  
= EXTERNAL CLOCK SOURCE  
= INTERNAL OSC/60Hz REJECTION  
V
F
O
10k  
CC  
LTC2422  
2
9
8
7
6
REFERENCE VOLTAGE  
ZS + 0.1V TO V  
FS  
SCK  
SDO  
CS  
SET  
SET CC  
3
4
5
ANALOG INPUT RANGE  
CH1  
CH0  
ZS  
ZS  
– 0.12V  
TO  
SET  
FS  
REF  
+ 0.12V  
SET  
REF  
(V  
= FS  
SET  
– ZS  
)
REF  
SET  
0V TO FS  
– 100mV  
GND  
SET  
SET  
CS  
BIT 23  
EOC  
BIT 22  
BIT 21  
SIG  
BIT 20  
EXR  
BIT 19  
MSB  
BIT 18  
BIT 4  
BIT 0  
LSB  
SDO  
CH0/CH1  
20  
SCK  
(INTERNAL)  
CONVERSION  
DATA OUTPUT  
CONVERSION  
24212 F11  
SLEEP  
Figure 11. Internal Serial Clock, Continuous Operation  
Internal Serial Clock, Autostart Conversion  
It should be noticed that the external capacitor discharge  
current is kept very small in order to decrease the con-  
verterpowerdissipationinthesleepstate. Intheautostart  
mode, the analog voltage on the CS pin cannot be  
observed without disturbing the converter operation  
using a regular oscilloscope probe. When using this con-  
figuration, it is important to minimize the external leakage  
current at the CS pin by using a low leakage external ca-  
pacitor and properly cleaning the PCB surface.  
This timing mode is identical to the internal serial clock,  
2-wire I/O described above with one additional feature.  
Instead of grounding CS, an external timing capacitor is  
tied to CS.  
While the conversion is in progress, the CS pin is held  
HIGH by an internal weak pull-up. Once the conversion is  
complete, the device enters the low power sleep state and  
an internal 25nA current source begins discharging the  
capacitor tied to CS, see Figure 12. The time the converter  
spends in the sleep state is determined by the value of the  
external timing capacitor, see Figures 13 and 14. Once the  
voltageatCSfallsbelowaninternalthreshold(1.4V), the  
device automatically begins outputting data. The data out-  
put cycle begins on the first rising edge of SCK and ends  
on the 24th rising edge. Data is shifted out the SDO pin on  
each falling edge of SCK. The internally generated serial  
clock is output to the SCK pin. This signal may be used to  
shift the conversion result into external circuitry. After the  
24th rising edge, CS is pulled HIGH and a new conversion  
is immediately started. This is useful in applications re-  
quiring periodic monitoring and ultralow power. Figure 15  
shows the average supply current as a function of capaci-  
tance on CS.  
The internal serial clock mode is selected every time the  
voltage on the CS pin crosses an internal threshold volt-  
age. An internal weak pull-up at the SCK pin is active while  
CS is discharging; therefore, the internal serial clock tim-  
ing mode is automatically selected if SCK is floating. It is  
important to ensure there are no external drivers pulling  
SCK LOW while CS is discharging.  
DIGITAL SIGNAL LEVELS  
The LTC2421/LTC2422’s digital interface is easy to use.  
Its digital inputs (FO, CS and SCK in External SCK mode of  
operation)acceptstandardTTL/CMOSlogiclevelsandthe  
internal hysteresis receivers can tolerate edge rates as  
slowas100µs.However,someconsiderationsarerequired  
24212f  
20  
LTC2421/LTC2422  
W U U  
APPLICATIO S I FOR ATIO  
U
V
CC  
2.7V TO 5.5V  
V
CC  
1µF  
= INTERNAL OSC/50Hz REJECTION  
10k  
1
10  
= EXTERNAL CLOCK SOURCE  
= INTERNAL OSC/60Hz REJECTION  
V
F
O
CC  
LTC2422  
2
9
8
7
6
REFERENCE VOLTAGE  
ZS + 0.1V TO V  
FS  
SCK  
SDO  
CS  
SET  
SET  
CC  
3
4
5
ANALOG INPUT RANGE  
CH1  
CH0  
ZS  
ZS  
– 0.12V  
TO  
SET  
FS  
REF  
+ 0.12V  
SET  
REF  
(V  
= FS  
– ZS  
)
REF  
SET  
SET  
C
EXT  
0V TO FS  
– 100mV  
GND  
SET  
SET  
V
CC  
CS  
GND  
BIT 23  
EOC  
BIT 22  
BIT 21  
SIG  
BIT 0  
SDO  
Hi-Z  
Hi-Z  
SCK  
(INTERNAL)  
CONVERSION  
DATA OUTPUT  
CONVERSION  
SLEEP  
2420 F12  
Figure 12. Internal Serial Clock, Autostart Operation  
300  
300  
250  
7
6
250  
V
V
= 5V  
= 3V  
V
V
= 5V  
= 3V  
CC  
CC  
CC  
CC  
5
4
3
2
1
0
200  
150  
200  
150  
100  
50  
0
100  
50  
0
V
= 5V  
CC  
V
= 3V  
CC  
1
10  
100  
1000  
10000 100000  
1
10  
100  
1000  
10000 100000  
10  
100  
100000  
1
1000  
10000  
CAPACITANCE ON CS (pF)  
CAPACITANCE ON CS (pF)  
CAPACITANCE ON CS (pF)  
24212 F15  
24212 F15  
24212 F13  
Figure 13. CS Capacitance vs tSAMPLE  
Figure 14. CS Capacitance  
vs Output Rate  
Figure 15. CS Capacitance  
vs Supply Current  
to take advantage of exceptional accuracy and low supply  
current.  
In order to preserve the LTC2421/LTC2422’s accuracy, it  
is very important to minimize the ground path impedance  
whichmayappearinserieswiththeinputand/orreference  
signal and to reduce the current which may flow through  
this path. The GND pin should be connected to a low  
24212f  
The digital output signals (SDO and SCK in Internal SCK  
modeofoperation)arelessofaconcernbecausetheyare  
not generally active during the conversion state.  
21  
LTC2421/LTC2422  
W U U  
U
APPLICATIO S I FOR ATIO  
resistance ground plane through a minimum length trace.  
The use of multiple via holes is recommended to further  
reduce the connection resistance.  
Parallel termination near the LTC2421/LTC2422 pin will  
eliminate this problem but will increase the driver power  
dissipation.Aseriesresistorbetween27and56placed  
near the driver or near the LTC2421/LTC2422 pin will also  
eliminate this problem without additional power dissipa-  
tion. The actual resistor value depends upon the trace  
impedance and connection topology.  
In an alternative configuration, the GND pin of the con-  
verter can be the single-point-ground in a single point  
grounding system. The input signal ground, the reference  
signal ground, the digital drivers ground (usually the digi-  
tal ground) and the power supply ground (the analog  
ground) should be connected in a star configuration with  
the common point located as close to the GND pin as  
possible.  
Driving the Input and Reference  
The analog input and reference of the typical delta-sigma  
analog-to-digital converter are applied to a switched ca-  
pacitornetwork.Thisnetworkconsistsofcapacitorsswitch-  
ingbetweentheanaloginput(VIN),ZSSET(Pin5)andFSSET  
(Pin 2). The result is small current spikes seen at both VIN  
and VREF. A simplified input equivalent circuit is shown in  
Figure 16.  
The power supply current during the conversion state  
should be kept to a minimum. This is achieved by restrict-  
ing the number of digital signal transitions occurring dur-  
ing this period.  
While a digital input signal is in the range 0.5V to  
(VCC – 0.5V), the CMOS input receiver draws additional  
current from the power supply. It should be noted that,  
when any one of the digital input signals (FO, CS and SCK  
inExternalSCKmodeofoperation)iswithinthisrange,the  
LTC2421/LTC2422 power supply current may increase  
even if the signal in question is at a valid logic level. For  
micropower operation and in order to minimize the poten-  
tialerrorsduetoadditionalgroundpincurrent,itisrecom-  
mendedtodrivealldigitalinputsignalstofullCMOSlevels  
[VIL < 0.4V and VOH > (VCC – 0.4V)].  
The key to understanding the effects of this dynamic input  
current is based on a simple first order RC time constant  
model. Using the internal oscillator, the LTC2421/  
LTC2422’s internal switched capacitor network is clocked  
at 153,600Hz corresponding to a 6.5µs sampling period.  
Fourteentimeconstantsarerequiredeachtimeacapacitor  
is switched in order to achieve 1ppm settling accuracy.  
Therefore, the equivalent time constant at VIN and VREF  
should be less than 6.5µs/14 = 460ns in order to achieve  
1ppm accuracy.  
Severe ground pin current disturbances can also occur  
due to the undershoot of fast digital input signals. Under-  
shoot and overshoot can occur because of the imped-  
ance mismatch at the converter pin when the transition  
time of an external control signal is less than twice the  
propagation delay from the driver to LTC2421/LTC2422.  
For reference, on a regular FR-4 board, signal propaga-  
tion velocity is approximately 183ps/inch for internal  
traces and 170ps/inch for surface traces. Thus, a driver  
generating a control signal with a minimum transition  
timeof1nsmustbeconnectedtotheconverterpinthrough  
a trace shorter than 2.5 inches. This problem becomes  
particularly difficult when shared control lines are used  
and multiple reflections may occur. The solution is to  
carefully terminate all transmission lines close to their  
characteristic impedance.  
V
CC  
R
SW  
5k  
I
I
REF(LEAK)  
REF(LEAK)  
V
REF  
V
CC  
I
IN  
IN  
AVERAGE INPUT CURRENT:  
= 0.25(V – 0.5 • V )fC  
REF EQ  
R
SW  
5k  
I
I
I
IN  
IN(LEAK)  
IN(LEAK)  
IN  
V
C
EQ  
1pF (TYP)  
R
SW  
5k  
24212 F16  
GND  
SWITCHING FREQUENCY  
f = 153.6kHz FOR INTERNAL OSCILLATOR (f = LOGIC LOW OR HIGH)  
f = f  
O
FOR EXTERNAL OSCILLATORS  
EOSC  
Figure 16. LTC2421/LTC2422 Equivalent Analog Input Circuit  
24212f  
22  
LTC2421/LTC2422  
W U U  
APPLICATIO S I FOR ATIO  
U
Input Current (VIN)  
If the total capacitance at VIN (see Figure 18) is small  
(<0.01µF), relatively large external source resistances (up  
to 80k for 20pF parasitic capacitance) can be tolerated  
withoutanyoffset/full-scaleerror. Figures19and20show  
a family of offset and full-scale error curves for various  
small valued input capacitors (CIN < 0.01µF) as a function  
of input source resistance.  
If complete settling occurs on the input, conversion re-  
sultswillbeuneffectedbythedynamicinputcurrent. Ifthe  
settling is incomplete, it does not degrade the linearity  
performance of the device. It simply results in an offset/  
full-scale shift, see Figure 17. To simplify the analysis of  
input dynamic current, two separate cases are assumed:  
large capacitance at VIN (CIN > 0.01µF) and small capaci-  
tance at VIN (CIN < 0.01µF).  
For large input capacitor values (CIN > 0.01µF), the input  
spikes are averaged by the capacitor into a DC current. The  
gain shift becomes a linear function of input source resis-  
tance independent of input capacitance, see Figures 21  
and 22. The equivalent input impedance is 16.6M. This  
results in ±150nA of input dynamic current at the extreme  
values of VIN (VIN = 0V and VIN = VREF, when VREF = 5V).  
This corresponds to a 0.3ppm shift in offset and full-scale  
readings for every 10of input source resistance.  
TUE  
35  
C
C
C
C
C
C
= 22µF  
IN  
IN  
IN  
IN  
IN  
IN  
= 10µF  
30  
= 1µF  
= 0.1µF  
= 0.01µF  
= 0.001µF  
25  
20  
15  
10  
5
ZS  
SET  
FS  
SET  
V
IN  
24212 F17  
V
V
V
= 5V  
CC  
REF  
IN  
= 5V  
= 0V  
Figure 17. Offset/Full-Scale Shift  
T
= 25°C  
A
R
SOURCE  
V
IN  
INTPUT  
LTC2421/  
LTC2422  
C
PAR  
20pF  
0
SIGNAL  
C
IN  
200  
400  
1000  
0
600  
800  
SOURCE  
R
()  
SOURCE  
24212 F17  
24212 F20  
Figure 20. Offset vs RSOURCE (Large C)  
Figure 18. An RC Network at VIN  
50  
40  
30  
20  
10  
5
0
V
V
V
T
= 5V  
CC  
= 5V  
REF  
= 0V  
IN  
A
= 25°C  
V
V
V
= 5V  
CC  
–5  
= 5V  
REF  
= 0V  
IN  
–10  
T
= 25°C  
A
C
IN  
= 1000pF  
= 0pF  
= 100pF  
IN  
C
IN  
–15  
–20  
C
C
C
C
C
C
C
= 22µF  
IN  
IN  
IN  
IN  
IN  
IN  
C
= 0.01µF  
IN  
= 10µF  
–25  
–30  
–35  
= 1µF  
= 0.1µF  
= 0.01µF  
= 0.001µF  
0
1
10  
100  
1k  
10k  
100k  
200  
400  
800  
0
1000  
600  
R
()  
SOURCE  
R
()  
SOURCE  
24212 F19  
24212 F21  
Figure 21. Full-Scale Error vs RSOURCE (Large C)  
Figure 19. Offset vs RSOURCE (Small C)  
24212f  
23  
LTC2421/LTC2422  
W U U  
U
APPLICATIO S I FOR ATIO  
60  
10  
C
C
C
C
C
C
= 22µF  
VREF  
VREF  
VREF  
VREF  
VREF  
VREF  
= 10µF  
50  
= 1µF  
0
= 0.1µF  
= 0.01µF  
= 0.001µF  
40  
30  
–10  
C
IN  
= 1000pF  
= 0pF  
= 100pF  
V
V
V
= 5V  
IN  
CC  
REF  
IN  
= 5V  
C
–20  
–30  
–40  
–50  
= 5V  
C
IN  
20  
T
= 25°C  
A
10  
C
= 0.01µF  
IN  
V
V
V
= 5V  
CC  
= 5V  
REF  
0
= 5V  
IN  
T
= 25°C  
A
–10  
200  
400  
1000  
0
600  
800  
()  
1
10  
100  
R
1k  
()  
10k  
100k  
RESISTANCE AT V  
REF  
SOURCE  
24212 F23  
24212 F22  
Figure 22. Full-Scale Error vs RSOURCE (Small C)  
Figure 23. Full-Scale Error vs RVREF (Large C)  
In addition to the input current spikes, the input ESD pro-  
tection diodes have a temperature dependent leakage cur-  
rent. This leakage current, nominally 1nA (±100nA max),  
results in a fixed offset shift of 10µV for a 10k source  
resistance.  
500  
V
V
V
T
= 5V  
CC  
= 5V  
REF  
400  
= 5V  
IN  
A
= 25°C  
C
= 1000pF  
VREF  
300  
200  
100  
0
C
= 100pF  
VREF  
C
= 0.01µF  
The effect of input leakage current is evident for CIN = 0 in  
Figures 19 and 22. A leakage current of 3nA results in a  
150µV (30ppm) error for a 50k source resistance. As  
RSOURCE gets larger, the switched capacitor input current  
begins to dominate.  
VREF  
C
= 0pF  
VREF  
–100  
–200  
10  
100  
RESISTANCE AT V  
100k  
1
1k  
10k  
()  
Reference Current (VREF  
)
REF  
24212 F24  
Similar to the analog input, the reference input has a dy-  
namic input current. This current has negligible effect on  
the offset. However, the reference current at VIN = VREF is  
similar to the input current at full-scale. For large values of  
reference capacitance (CVREF > 0.01µF), the full-scale er-  
ror shift is 0.03ppm/of external reference resistance  
independent of the capacitance at VREF, see Figure 23. If  
the capacitance tied to VREF is small (CVREF < 0.01µF), an  
input resistance of up to 80k (20pF parasitic capacitance  
at VREF) may be tolerated, see Figure 24.  
Figure 24. Full-Scale Error vs RVREF (Small C)  
50  
V
V
A
= 5V  
REF  
= 25°C  
CC  
= 5V  
40  
T
30  
20  
C
= 1000pF  
VREF  
C
= 100pF  
VREF  
10  
C
VREF  
= 0.01µF  
0
Unlike the analog input, the integral nonlinearity of the  
device can be degraded with excessive external RC time  
constants tied to the reference input. If the capacitance at  
node VREF is small (CVREF < 0.01µF), the reference input  
can tolerate large external resistances without reduction  
in INL, see Figure 25. If the external capacitance is large  
(CVREF > 0.01µF), the linearity will be degraded by  
–10  
–20  
C
VREF  
= 0pF  
10  
100  
100k  
1
1k  
10k  
RESISTANCE AT V  
()  
REF  
24212 F25  
Figure 25. INL Error vs RVREF (Small C)  
24212f  
24  
LTC2421/LTC2422  
W U U  
APPLICATIO S I FOR ATIO  
0.015ppm/independent of capacitance at VREF, see  
Figure 26.  
U
0
–20  
–40  
Inadditiontothedynamicreferencecurrent, theVREF ESD  
protection diodes have a temperature dependent leakage  
current.Thisleakagecurrent,nominally1nA(±10nAmax),  
results in a fixed full-scale shift of 10µV for a 10k source  
resistance.  
–60  
–80  
–100  
–120  
–140  
10  
C
VREF  
C
VREF  
C
VREF  
C
VREF  
C
VREF  
C
VREF  
= 22µF  
8
6
= 10µF  
f /2  
S
f
0
S
= 1µF  
= 0.1µF  
= 0.01µF  
= 0.001µF  
INPUT FREQUENCY  
4
24212 F27  
2
Figure 27. Sinc4 Filter Rejection  
V
V
A
= 5V  
REF  
= 25°C  
CC  
0
= 5V  
T
–2  
–4  
–6  
–8  
–10  
The modulator contained within the LTC2421/LTC2422  
can handle large-signal level perturbations without satu-  
rating. Signal levels up to 40% of VREF do not saturate the  
analog modulator. These signals are limited by the input  
ESDprotectionto300mVbelowgroundand300mVabove  
VCC.  
200  
400  
1000  
0
600  
800  
()  
RESISTANCE AT V  
REF  
24212 F26  
Figure 26. INL Error vs RVREF (Large C)  
Simple Basic Program for Interfacing to the  
LTC2421/LTC2422  
ANTIALIASING  
DTR  
V
SCK  
SDO  
CS  
One of the advantages delta-sigma ADCs offer over con-  
ventional ADCs is on-chip digital filtering. Combined with  
a large oversampling ratio, the LTC2421/LTC2422 signifi-  
cantly simplify antialiasing filter requirements.  
REF  
PC  
SERIAL  
PORT  
CTS  
RTS  
LTC2421  
LTC2422  
V
IN  
GND  
24212 F28  
Figure 28  
The digital filter provides very high rejection except at  
integer multiples of the modulator sampling frequency  
(fS), see Figure 27. The modulator sampling frequency is  
256 • FO, where FO is the notch frequency (typically 50Hz  
or 60Hz). The bandwidth of signals not rejected by the  
digital filter is narrow (0.2%) compared to the band-  
width of the frequencies rejected.  
”TINY.BAS V1.0 Copyright (C) 2000 by J. A. Dutra and LTC, All rights reseved'  
NOTE this program generates 32 SCK’s for compatibility to 24-bit parts  
'For use with most LTC24xy demo boards  
designed for the PC Com Port, QBASIC  
'Outputs are chan%,signneg%,d2400 (magnitude), PPM, and v (volts)  
CLS : ON ERROR GOTO 4970  
As a result of the oversampling ratio (256) and the digital  
filter, minimal (if any) antialias filtering is required in front  
of the LTC2421/LTC2422. If passive RC components are  
placed in front of the LTC2421/LTC2422, the input dy-  
namic current should be considered (see Input Current  
section). In cases where large effective RC time constants  
are used, an external buffer amplifier may be required to  
minimize the effects of input dynamic current.  
cport = 1: REM INPUT "com port number "; cport  
GOSUB 1900: timestart$ = TIME$  
mcr% = port + 4: msr% = port + 6  
COLOR 15: LOCATE 3, 1: PRINT "Hit any key to stop…  
FOR np = 1 TO 2000: OUT port, c0%: NEXT np: 'Power Via TxD  
DO: '-------------------------START LOOP here--------  
";  
24212f  
25  
LTC2421/LTC2422  
W U U  
U
APPLICATIO S I FOR ATIO  
nummeas = nummeas + c1%  
LOCATE 5, 21: PRINT "CHANNEL 1": LOCATE 5, 2: PRINT "CHANNEL 0"  
FOR n% = port TO port + 7: OUT n%, 0: NEXT n%: ’Init UART regs  
CLOSE #1: DEF SEG = 0: RETURN ’--------------------------------------  
2000 ’SUB read MSR AND RETURN data dfrm% INTERFACE  
LOCATE 2, 2: PRINT "Scan#="; nummeas; " "; DATE$; " "; TIME$;  
OUT mcr%, c0%: 'Initialize SCLK=0  
k1 = km: d2400 = 0: chan% = c0%: signneg% = c0%  
FOR bita% = 31 TO 0 STEP -1: v31 = 1  
x3% = INP(msr%) AND c16%: OUT mcr%, c1%  
GOSUB 3000: OUT mcr%, c0%  
148 GOSUB 2200: v31 = v31 + 1  
2040 IF x3% = c16% THEN dfrm% = c1% ELSE dfrm% = c0%  
OUT mcr%, c0%: RETURN ’---------------------------------------------  
2200 ’SUB READ THE DATA BIT dfrm% does NOT change sclock  
x3% = INP(msr%) AND C16%: GOTO 2040: RETURN’----------------  
3000 REM delay sub !!!!!!!!!!  
150 IF bita% = 31 THEN GOTO 152 ELSE 156  
152 IF dfrm% = c0% THEN GOTO 156  
155 IF v31 > 2 THEN LOCATE 16, 16: OUT port, c0%: PRINT "waiting for eoc":  
IF v31 < 20000 THEN IF dfrm% = c1% THEN GOTO 148  
IF dfrm% = 1 THEN LOCATE 17, 16: PRINT "Timed out on EOC,not fatal"  
FOR bs = 1 TO 32: ' never got an eoc => clock it 32 times  
GOSUB 2000: NEXT bs: GOTO 1800  
FOR n8% = 0 TO 1: OUT port, c0%: NEXT n8%: RETURN: ’----------  
3700 FOR n = 6 TO 9: LOCATE n, 20  
PRINT "  
": NEXT n: RETURN’---------------------------  
156 LOCATE 16, 16: PRINT"  
": GOSUB 2000  
3800 ’SUB to convert PPM into Volts and print it  
IF bita% = 30 THEN 161 ELSE 171 ' CHANNEL BIT !!!!!!!!!!!!!!!  
161 IF dfrm% = c1% THEN chan% = c1%: ch1% = c0%  
IF dfrm% = c0% THEN chan% = c0%: ch1% = ch1% + c1%  
IF ch1% > c4% THEN GOSUB 3700: ch1% = c1%  
v = PPM * (5 / 1000000): v1 = v * 1000000: hz% = (chan% * 20) + 12  
IF v <= .1 THEN PRINT v1; " "; : LOCATE rw% + 1, hz%: PRINT "uV "  
IF v > .1 THEN PRINT v; " "; : LOCATE rw% + 1, hz%: PRINT "Volts";  
RETURN’----------------------------------------------------------------  
4970 PRINT "ERROR !!!!!!!!!!!!!!!"  
171 IF bita% = 29 THEN IF dfrm% = c0% THEN signneg% = c1%: ' NEG  
IF bita% <= 28 THEN d2400 = d2400 + (dfrm% * k1): k1 = k1 / c2%  
NEXT bita%: k1 = 1: digin% = c0%: 'MATH BELOW  
5000 PRINT : LOCATE 18, 1: PRINT "Ending!!": PRINT "Hit any key to exit."  
PRINT "Start ="; timestart$; " End = "; TIME$; " # samples ="; nummeas  
1600 PPM = (d2400 / km) * kn: rw% = 6: hz% = (chan% * 20) + 1  
IF signneg% = c1% THEN 1700 ELSE 1705  
CLOSE #1: END  
1700 IF d2400 <> c0% THEN PPM = (PPM - 2000000)  
1705 LOCATE rw%, hz%: PRINT PPM; " "; : LOCATE rw%, hz% + 11:  
PRINT "PPM";  
Single Ended Half-Bridge Digitizer  
with Reference and Ground Sensing  
Sensorsconvertrealworldphenomena(temperature,pres-  
sure, gas levels, etc.) into a voltage. Typically, this voltage  
is generated by passing an excitation current through the  
sensor. The wires connecting the sensor to the ADC form  
parasiticresistorsRP1 andRP2.Theexcitationcurrentalso  
flowsthroughparasiticresistorsRP1 andRP2, asshownin  
Figure 29. The voltage drop across these parasitic resis-  
tors leads to systematic offset and full-scale errors.  
LOCATE rw% + 1, (chan% * 20) + 1: GOSUB 3800: 'THIS WORKS!  
1800 LOOP WHILE INKEY$ = "": REM Works with "DO"  
GOTO 5000 ’rem END!!-------------- Subs follow !!----------------!!!  
1900 ’ESSENTIAL INITIALIZATIONS  
REM set some constants, since they can be accessed much faster  
LET c128% = 128: c64% = 64: c32% = 32: c16% = 16: c8% = 8: c4% = 4  
LET c3% = 3: c2% = 2: c1% = 1: c0% = 0: km = (2 ^ 30) - 1: kn = 1000000  
Inordertoeliminatetheerrorsassociatedwiththesepara-  
sitic resistors, the LTC2421/LTC2422 include a full-scale  
set input (FSSET) and a zero-scale set input  
(ZSSET). As shown in Figure 30, the FSSET pin acts as a  
zero current full-scale sense input. Errors due to parasitic  
IF cport = 2 THEN OPEN "COM2:300,N,8,1,CD0,CS0,DS0,OP0,RS" FOR  
RANDOM AS #1: port = (&H2F8)  
IF cport = 1 THEN OPEN "COM1:300,N,8,1,CD0,CS0,DS0,OP0,RS" FOR  
RANDOM AS #1: port = (&H3F8)  
24212f  
26  
LTC2421/LTC2422  
W U U  
APPLICATIO S I FOR ATIO  
U
1
resistance RP1 in series with the half-bridge sensor are  
removed by the FSSET input to the ADC. The absolute full-  
scale output of the ADC (data out = FFFFFHEX ) will occur  
at VIN = VB = FSSET, see Figure 31. Similarly, the offset  
errors due to RP2 are removed by the ground sense input  
ZSSET. The absolute zero output of the ADC (data out =  
00000HEX) occurs at VIN = VA = ZSSET. Parasitic resistors  
RP3 to RP5 have negligible errors due to the 1nA (typ)  
leakage current at pins FSSET, ZSSET and VIN. The wide  
dynamic input range (300mV to 5.3V) and low noise  
(1.2ppm RMS) enable the LTC2421 or the LTC2422 to  
directly digitize the output of the bridge sensor.  
V
CC  
R
I
I
I
0
0
0
P1  
DC  
LTC2421  
SET  
2
3
V
FS  
V
B
R
P3  
P4  
P5  
9
8
7
SCK  
DC  
3-WIRE  
I
EXCITATION  
SDO  
CS  
IN  
SPI INTERFACE  
R
DC  
5
6
V
A
ZS  
SET  
R
R
10  
P2  
GND  
F
O
24212 F03  
Figure 30. Half-Bridge Digitizer with  
Zero-Scale and Full-Scale Sense  
The LTC2422 is ideal for applications requiring continu-  
ous monitoring of two input sensors. As shown in  
Figure 32, the LTC2422 can monitor both a thermocouple  
temperature probe and a cold junction temperature sen-  
sor. Absolute temperature measurements can be  
performed with a variety of thermocouples using digital  
cold junction compensation.  
12.5%  
EXTENDED  
RANGE  
FFFFF  
H
+
R
P1  
V
FULL-SCALE ERROR  
+
I
SENSOR  
SENSOR OUTPUT  
EXCITATION  
00000  
H
12.5%  
UNDER  
RANGE  
+
ZS  
FS  
SET  
R
V
SET  
P2  
OFFSET ERROR  
V
24212 F31  
IN  
24212 F29  
Figure 29. Errors Due to Excitation Currents  
Figure 31. Transfer Curve with Zero-Scale and Full-Scale Set  
2.7V TO 5.5V  
LTC2422  
1
2
3
4
5
10  
V
F
O
CC  
9
8
7
6
12k  
FS  
SCK  
SDO  
CS  
SET  
PROCESSOR  
COLD JUNCTION  
CH1  
CH0  
ZS  
THERMISTOR  
24212 F32  
100Ω  
GND  
SET  
+
ISOLATION  
BARRIER  
THERMOCOUPLE  
Figure 32. Isolated Temperature Measurement  
24212f  
27  
LTC2421/LTC2422  
W U U  
U
APPLICATIO S I FOR ATIO  
TheselectionbetweenCH0andCH1isautomatic. Initially,  
after power-up, a conversion is performed on CH0. For  
each subsequent conversion, the input channel selection  
is alternated. Embedded within the serial data output is a  
status bit indicating which channel corresponds to the  
conversion result. If the conversion was performed on  
CH0, this bit (Bit 22) is LOW and is HIGH if the conversion  
was performed on CH1 (see Figure 33).  
conversionresultsmaybedigitallysubtractedyieldingthe  
differential result.  
The LTC2422’s single ended rejection of line frequencies  
(±2%) and harmonics is better than 110dB. Since the  
device performs two independent single ended conver-  
sions each with >110dB rejection, the overall common  
mode and differential rejection is much better than the  
80dB rejection typically found in other differential input  
delta-sigma converters.  
There are no extra control or status pins required to per-  
form the alternating 2-channel measurements. The  
LTC2422onlyrequirestwodigitalsignals(SCKandSDO).  
This simplification is ideal for isolated temperature mea-  
surements or systems where minimal control signals are  
available.  
In addition to excellent rejection of line frequency noise,  
the LTC2422 also exhibits excellent single ended noise  
rejection over a wide range of frequencies due to its 4th  
order sinc filter. Each single ended conversion indepen-  
dentlyrejectshighfrequencynoise(>60Hz). Caremustbe  
taken to insure noise at frequencies below 15Hz and at  
multiples of the ADC sample rate (15,360Hz) are not  
present. For this application, it is recommended the  
LTC2422 is placed in close proximity to the bridge sensor  
in order to reduce the noise injected into the ADC input. By  
performingthreesuccessiveconversions(CH0-CH1-CH0),  
the drift and low frequency noise can be measured and  
compensated for digitally.  
Pseudo Differential Applications  
Generally, designers choose fully differential topologies  
for several reasons. First, the interface to a 4- or 6-wire  
bridge is simple (it is a differential output). Second, they  
requiregoodrejectionoflinefrequencynoise.Third,they  
typically look at a small differential signal sitting on a  
large common mode voltage; they need accurate  
measurements of the differential signal independent of  
the common mode input voltage. Many applications cur-  
rently using fully differential analog-to-digital converters  
for any of the above reasons may migrate to a pseudo  
differential conversion using the LTC2422.  
I
EXCITATION  
5V  
1
I
= 0  
DC  
V
CC  
2
FS  
SET  
LTC2422  
9
SCK  
SDO  
CS  
350  
350Ω  
350Ω  
Direct Connection to a Full Bridge  
3
4
8
3-WIRE  
SPI INTERFACE  
CH1  
CH0  
The LTC2422 interfaces directly to a 4- or 6-wire bridge,  
as shown in Figure 34. The LTC2422 includes a FSSET and  
a ZSSET for sensing the excitation voltage directly across  
the bridge. This eliminates errors due to excitation cur-  
rents flowing through parasitic resistors. The LTC2422  
also includes two single ended input channels which can  
tie directly to the differential output of the bridge. The two  
7
350Ω  
10  
I
= 0  
DC  
F
O
5
ZS  
SET  
GND  
6
24212 F32  
Figure 34. Pseudo Differential Strain Guage Application  
SCK  
SDO  
• • •  
• • •  
CH1 DATA OUT  
CH0 DATA OUT  
24212 F33  
EOC  
EOC  
CH1  
CH0  
Figure 33. Embedded Selected Channel Indicator  
24212f  
28  
LTC2421/LTC2422  
W U U  
APPLICATIO S I FOR ATIO  
U
Theabsoluteaccuracy(lessthan10ppmtotalerror)ofthe  
LTC2422 enables extremely accurate measurement of  
small signals sitting on large voltages. Each of the two  
pseudo differential measurements performed by the  
LTC2422 is absolutely accurate independent of the com-  
mon mode voltage output from the bridge. The pseudo  
differential result obtained from digitally subtracting the  
two single ended conversion results is accurate to within  
the noise level of the device (3µVRMS) times the square  
rootof2, independentofthecommonmodeinputvoltage.  
resistance changes as a function of temperature (100to  
400for0°Cto800°C). Thesameexcitationcurrentflows  
back to the ADC ground and generates another voltage  
drop across the return leads. In order to get an accurate  
measurementofthetemperature,thesevoltagedropsmust  
be measured and removed from the conversion result.  
Assumingtheresistanceisapproximatelythesameforthe  
forward and return paths (R1 = R2), the auxiliary channel  
on the LTC2422 can measure this drop. These errors are  
then removed with simple digital correction.  
Typically, a bridge sensor outputs 2mV/V full scale. With  
a 5V excitation, this translates to a full-scale output of  
10mV. Divided by the RMS noise of 8.4µV(= 6µV • 1.414),  
this circuit yields 1190 counts with no averaging or ampli-  
fication. If more counts are required, several conversions  
may be averaged (the number of effective counts is in-  
creased by a factor of square root of 2 for each doubling  
of averages).  
TheresultofthefirstconversiononCH0correspondstoan  
input voltage of VRTD + R1 • IEXCITATION. The result of the  
second conversion (CH1) is R1 • IEXCITATION. Note, the  
LTC2422’s input range is not limited to the supply rails, it  
has underrange capabilities. The device’s input range is  
300mV to VREF + 300mV. Adding the two conversion  
results together, the voltage drop across the RTD’s leads  
are cancelled and the final result is VRTD  
.
An RTD Temperature Digitizer  
An Isolated, 20-Bit Data Acquisition System  
RTDs used in remote temperature measurements often  
have long lead lengths between the ADC and RTD sensor.  
These long lead lengths lead to voltage drops due to exci-  
tation current in the interconnect to the RTD. This voltage  
drop can be measured and digitally removed using the  
LTC2422 (see Figure 35).  
TheLTC1535isusefulforsignalisolation.Figure36shows  
afullyisolated,20-bitdifferentialinputA/Dconverterimple-  
mented with the LTC1535 and LTC2422. Power on the  
isolated side is regulated by an LT1761-5.0 low noise, low  
dropout micropower regulator. Its output is suitable for  
driving bridge circuits and for ratiometric applications.  
The excitation current (typically 200µA) flows from the  
ADC through a long lead length to the remote temperature  
sensor (RTD). This current is applied to the RTD, whose  
During power-up, the LTC2422 becomes active at VCC  
2.3V, while the isolated side of the LTC1535 must wait for  
VCC2 to reach its undervoltage lockout threshold of 4.2V.  
=
5V  
1
V
CC  
2
4
FS  
SET  
LTC2422  
9
8
7
I
I
= 200µA  
= 200µA  
SCK  
SDO  
CS  
EXCITATION  
25Ω  
25Ω  
5k  
3-WIRE  
SPI INTERFACE  
CH0  
CH1  
+
R1  
EXCITATION  
1000pF  
3
P
t
V
RTD  
100Ω  
10  
I
DC  
= 0  
F
O
5k  
5
ZS  
SET  
R2  
0.1µF  
GND  
6
24212 F35  
Figure 35. RTD Remote Temperature Measurement  
24212f  
29  
LTC2421/LTC2422  
W U U  
U
APPLICATIO S I FOR ATIO  
from the time power is applied to VCC1 until the LT1761’s  
output has reached 5V, is approximately 1ms.  
Below 4.2V, the LTC1535’s driver outputs Y and Z are in a  
high impedance state, allowing the 1kpull-down to de-  
fine the logic state at SCK. When the LTC2422 first be-  
comes active, it samples SCK; a logic “0” provided by the  
1kpull-down invokes the external serial clock mode. In  
this mode, the LTC2422 is controlled by a single clock line  
from the nonisolated side of the barrier, through the  
LTC1535’sdriveroutputY.Theentirepower-upsequence,  
DatareturnstothenonisolatedsidethroughtheLTC1535’s  
receiver at RO. An internal divider on receiver input B sets  
a logic threshold of approximately 3.4V at input A, facili-  
tating communications with the LTC2422’s SDO output  
without the need for any external components.  
1/2 BAT54C  
LT1761-5  
IN  
OUT  
+
10µF  
10µF  
16V  
SHDN BYP  
GND  
+
10µF  
10V  
TANT  
TANT  
T1  
1µF  
2
10µF  
CERAMIC  
1/2 BAT54C  
LTC1535  
+
10µF  
10V  
TANT  
2
2
LTC2422  
ST1 ST2  
V
CC2  
“SDO”  
RO  
RE  
DE  
DI  
A
B
Y
Z
F
O
V
CC  
SCK FS  
SET  
“SCK”  
V
SDO  
CS  
CH1  
CH0  
CC1  
G1 G2  
1k  
LOGIC 5V  
GND ZS  
SET  
+
10µF  
10V  
TANT  
= LOGIC COMMON  
1
2
2
1
1
2
24212 F36  
= FLOATING COMMON  
ISOLATION  
BARRIER  
1
2
T1 = COILTRONICS CTX02-14659  
OR SIEMENS B78304-A1477-A3  
Figure 36. Complete, Isolated 20-Bit Data Acquisition System  
24212f  
30  
LTC2421/LTC2422  
U W  
U
PACKAGE I FOR ATIO  
MS Package  
10-Lead Plastic MSOP  
(Reference LTC DWG # 05-08-1661)  
0.889 ± 0.127  
(.035 ± .005)  
5.23  
(.206)  
MIN  
3.2 – 3.45  
(.126 – .136)  
3.00 ± 0.102  
(.118 ± .004)  
(NOTE 3)  
0.497 ± 0.076  
(.0196 ± .003)  
REF  
0.50  
3.05 ± 0.38  
(.0120 ± .0015)  
TYP  
(.0197)  
10 9  
8
7 6  
BSC  
RECOMMENDED SOLDER PAD LAYOUT  
3.00 ± 0.102  
(.118 ± .004)  
NOTE 4  
4.88 ± 0.10  
(.192 ± .004)  
DETAIL “A”  
0.254  
(.010)  
0° – 6° TYP  
GAUGE PLANE  
1
2
3
4 5  
0.53 ± 0.01  
(.021 ± .006)  
0.86  
(.034)  
REF  
1.10  
(.043)  
MAX  
DETAIL “A”  
0.18  
(.007)  
SEATING  
PLANE  
0.17 – 0.27  
(.007 – .011)  
0.13 ± 0.05  
(.005 ± .002)  
0.50  
(.0197)  
TYP  
MSOP (MS) 1001  
NOTE:  
1. DIMENSIONS IN MILLIMETER/(INCH)  
2. DRAWING NOT TO SCALE  
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.  
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX  
24212f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-  
tation that the interconnection ofits circuits as described herein willnotinfringe on existing patentrights.  
31  
LTC2421/LTC2422  
U
TYPICAL APPLICATIO  
convert either the thermal couple output or the thermistor  
cold junction output. After each conversion, the devices  
enter their sleep state and wait for the SCK signal before  
clocking out data and beginning the next conversion.  
Figure 37 shows the block diagram of a demo circuit  
(contact LTC for a demonstration) of a multichannel  
isolated temperature measurement system. This circuit  
decodes an address to select which LTC2422 receives a  
24-bit burst of SCK signal. All devices independently  
D1  
RE  
R0  
V
CC  
FS  
SET  
LTC1535  
LTC1535  
LTC1535  
A
Y
SDO  
LTC2422  
SCK  
CH1  
CH0  
ZS  
SET  
SCK  
HC138  
D1  
RE  
R0  
V
CC  
FS  
SET  
A
Y
SDO  
LTC2422  
+
2500V  
SCK  
CH1  
CH0  
ZS  
SET  
D1  
RE  
R0  
V
CC  
FS  
SET  
HC138  
A
Y
SDO  
LTC2422  
SCK  
CH1  
CH0  
SD0  
ZS  
SET  
SEE FIGURE 34 FOR  
THE COMPLETE CIRCUIT  
HC595  
ADDRESS  
LATCH  
24212 F37  
D
IN  
(ADDRESS  
OR COUNTER)  
Figure 37. Mulitchannel Isolated Temperature Measurement System  
RELATED PARTS  
PART NUMBER  
LT1019  
DESCRIPTION  
Precision Bandgap Reference, 2.5V, 5V  
COMMENTS  
3ppm/°C Drift, 0.05% Max  
LTC1050  
Precision Chopper Stabilized Op Amp  
Precision Bandgap Reference, 5V  
8-Channel Multiplexer  
No External Components 5µV Offset, 1.6µV Noise  
P-P  
LT1236A-5  
LTC1391  
0.05% Max, 5ppm/°C Drift  
Low R : 45, Low Charge Injection Serial Interface  
ON  
LT1461-2.5  
LTC1535  
Precision Micropower Voltage Reference  
Isolated RS485 Transceiver  
50µA Supply Current, 3ppm/°C Drift  
2500V  
Isolation  
RMS  
LTC2400  
24-Bit, No Latency ∆Σ ADC in SO-8  
4ppm INL, 10ppm Total Unadjusted Error, 200µA  
LTC2401/LTC2402 1-/2-Channel, 24-Bit, No Latency ∆Σ ADC in MSOP  
LTC2404/LTC2408 4-/8-Channel, 24-Bit, No Latency ∆Σ ADC  
0.6ppm Noise, 4ppm INL, Pin Compatible with the LTC2421/LTC2422  
4ppm INL, 10ppm Total Unadjusted Error, 200µA  
LTC2413  
LTC2415  
LTC2420  
24-Bit, No Latency ∆Σ ADC  
Simultaneous 50Hz and 60Hz Rejection, 0.16ppm Noise  
15Hz Output Rate at 60Hz Rejection, Pin Conpatible with the LTC2410  
1.2ppm Noise, 8ppm INL, Pin Compatible with LTC2400  
1.2ppm Noise, 8ppm INL, Pin Compatible with LTC2404/LTC2408  
0.16ppm Noise, 2ppm INL, 10ppm Total Unadjusted Error, 200µA  
0.29ppm Noise, 4ppm INL, 10ppm Total Unadjusted Error, 200µA  
24-Bit, Fully Differential, No Latency ∆Σ ADC  
20-Bit, No Latency ∆Σ ADC in SO-8  
LTC2424/LTC2428 4-/8-Channel, 20-Bit, No Latency ∆Σ ADC  
LTC2430  
LTC2431  
20-Bit, Fully Differential, No Latency ∆Σ ADC in SSOP-16  
24-Bit, Fully Differential, No Latency ∆Σ ADC in MS10  
24212f  
LT/TP 0202 2K • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
32  
(408) 432-1900 FAX: (408) 434-0507 www.linear.com  
LINEAR TECHNOLOGY CORPORATION 2002  

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