LTVA [Linear]
1-/2-Channel 20-Bit UPower No Latency ADCs in MSOP-10; 1 / 2通道20位微功耗无延迟的ADC ,采用MSOP - 10型号: | LTVA |
厂家: | Linear |
描述: | 1-/2-Channel 20-Bit UPower No Latency ADCs in MSOP-10 |
文件: | 总32页 (文件大小:365K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LTC2421/LTC2422
1-/2-Channel 20-Bit µPower
No Latency ∆ΣTMADCs in MSOP-10
U
FEATURES
DESCRIPTIO
■
20-Bit ADCs in Tiny MSOP-10 Packages
TheLTC®2421/LTC2422are1-and2-channel2.7Vto5.5V
micropower 20-bit analog-to-digital converters with an
integrated oscillator, 8ppm INL and 1.2ppm RMS noise.
■
1- or 2-Channel Inputs
■
Single Supply 2.7V to 5.5V Operation
Low Supply Current (200µA) and Auto Shutdown
■
These ultrasmall devices use delta-sigma technology and
■
■
Automatic Channel Selection (Ping-Pong) (LTC2422) anewdigitalfilterarchitecturethatsettlesinasinglecycle.
No Latency: Digital Filter Settles in a
Single Conversion Cycle
8ppm INL, No Missing Codes
4ppm Full-Scale Error
0.5ppm Offset
1.2ppm Noise
Zero Scale and Full Scale Set for Reference
and Ground Sensing
Internal Oscillator—No External Components Required
110dB Min, 50Hz/60Hz Notch Filter
Reference Input Voltage: 0.1V to VCC
Live Zero—Extended Input Range Accommodates
12.5% Overrange and Underrange
Pin Compatible with LTC2401/LTC2402
This eliminates the latency found in conventional ∆Σ
converters and simplifies multiplexed applications.
■
■
■
■
■
Through a single pin, the LTC2421/LTC2422 can be
configured for better than 110dB rejection at 50Hz or
60Hz ±2%, or can be driven by an external oscillator for
a user defined rejection frequency in the range 1Hz to
120Hz. The internal oscillator requires no external fre-
quency setting components.
■
■
■
■
These converters accept an external reference voltage
from 0.1V to VCC. With an extended input conversion
range of –12.5% VREF to 112.5% VREF (VREF = FSSET
ZSSET), the LTC2421/LTC2422 smoothly resolve the off-
set and overrange problems of preceding sensors or
signal conditioning circuits.
–
■
U
APPLICATIO S
The LTC2421/LTC2422 communicate through a 2- or
3-wire digital interface that is compatible with SPI and
MICROWIRETM protocols.
, LTC and LT are registered trademarks of Linear Technology Corporation.
No Latency ∆Σ is a trademark of Linear Technology Corporation.
MICROWIRE is a trademark of National Semiconductor Corporation.
■
Weight Scales
■
Direct Temperature Measurement
■
Gas Analyzers
Strain Gauge Transducers
Instrumentation
Data Acquisition
Industrial Process Control
■
■
■
■
U
Pseudo Differential Bridge Digitizer
TYPICAL APPLICATIO
2.7V TO 5.5V
2.7V TO 5.5V
1
V
CC
1µF
V
CC
= INTERNAL OSC/50Hz REJECTION
1
10
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
LTC2422
SET
V
F
O
CC
LTC2422
2
4
3
5
FS
9
SCK
SDO
CS
2
3
4
5
9
8
7
6
REFERENCE VOLTAGE
ZS + 0.1V TO V
FS
SET
SCK
SDO
CS
8
3-WIRE
SPI INTERFACE
CH0
CH1
ZS
SET
CC
3-WIRE
SPI INTERFACE
ANALOG INPUT RANGE
CH1
CH0
ZS
7
ZS
– 0.12V
TO
SET
FS
REF
+ 0.12V
SET
REF
10
(V
= FS
– ZS
)
REF
SET
SET
F
SET
O
INTERNAL OSCILLATOR
60Hz REJECTION
GND
6
0V TO FS
– 100mV
GND
SET
SET
24212 TA01
24012TA02
24212f
1
LTC2421/LTC2422
W W
U W
ABSOLUTE MAXIMUM RATINGS
(Notes 1, 2)
Operating Temperature Range
Supply Voltage (VCC) to GND.......................–0.3V to 7V
Analog Input Voltage to GND ....... –0.3V to (VCC + 0.3V)
Reference Input Voltage to GND .. –0.3V to (VCC + 0.3V)
Digital Input Voltage to GND........ –0.3V to (VCC + 0.3V)
Digital Output Voltage to GND ..... –0.3V to (VCC + 0.3V)
LTC2421/LTC2422C ................................ 0°C to 70°C
LTC2421/LTC2422I ............................ –40°C to 85°C
Storage Temperature Range ................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
U
W
U
PACKAGE/ORDER INFORMATION
ORDER PART NUMBER
ORDER PART NUMBER
TOP VIEW
TOP VIEW
LTC2421CMS
LTC2421IMS
V
CC
10 F
1
2
3
4
5
10 F
O
LTC2422CMS
LTC2422IMS
V
SET
V
1
2
3
CC
O
FS
FS
9
8
7
6
SCK
SDO
CS
9
8
7
6
SCK
SDO
CS
SET
CH1
CH0
IN
NC 4
SET
ZS
SET
ZS
5
GND
GND
MS10 PART MARKING
MS10 PART MARKING
MS10 PACKAGE
10-LEAD PLASTIC MSOP
MS10 PACKAGE
10-LEAD PLASTIC MSOP
LTUX
LTUY
LTUZ
LTVA
TJMAX = 125°C, θJA = 130°C/W
TJMAX = 125°C, θJA = 130°C/W
Consult factory for parts specified with wider operating temperature ranges.
U
CONVERTER CHARACTERISTICS The ● denotes specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VREF = FSSET – ZSSET. (Notes 3, 4)
PARAMETER
CONDITIONS
MIN
20
TYP
MAX
UNITS
Bits
Resolution
●
●
No Missing Codes Resolution
Integral Nonlinearity
0.1V ≤ FS
≤ V , ZS = 0V (Note 5)
SET
20
Bits
SET
CC
FS = 2.5V, ZS = 0V (Note 6)
●
●
4
8
10
20
ppm of V
ppm of V
SET
SET
REF
REF
FS = 5V, ZS = 0V (Note 6)
SET
SET
Offset Error
2.5V ≤ FS
≤ V , ZS = 0V
●
0.5
0.04
4
10
ppm of V
SET
SET
SET
SET
CC
SET
REF
Offset Error Drift
Full-Scale Error
2.5V ≤ FS
2.5V ≤ FS
2.5V ≤ FS
≤ V , ZS = 0V
ppm of V /°C
REF
CC
SET
≤ V , ZS = 0V
●
10
ppm of V
REF
CC
SET
Full-Scale Error Drift
Total Unadjusted Error
≤ V , ZS = 0V
0.04
ppm of V /°C
REF
CC
SET
FS = 2.5V, ZS = 0V
8
16
ppm of V
ppm of V
SET
SET
REF
REF
FS = 5V, ZS = 0V
SET
SET
Output Noise
V
IN
= 0V (Note 13)
6
µV
RMS
Normal Mode Rejection 60Hz ±2%
Normal Mode Rejection 50Hz ±2%
Power Supply Rejection, DC
(Note 7)
(Note 8)
●
●
110
110
130
130
100
110
110
dB
dB
dB
dB
dB
FS = 2.5V, ZS = 0V, V = 0V
SET
SET
IN
Power Supply Rejection, 60Hz ±2% FS = 2.5V, ZS = 0V, V = 0V, (Notes 7, 15)
SET
SET
IN
Power Supply Rejection, 50Hz ±2% FS = 2.5V, ZS = 0V, V = 0V, (Notes 8, 15)
SET
SET
IN
24212f
2
LTC2421/LTC2422
U
U
U
U
A ALOG I PUT A D REFERE CE
The ● denotes specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VREF = FSSET – ZSSET. (Note 3)
SYMBOL
PARAMETER
CONDITIONS
MIN
ZS – 0.12V
TYP
MAX
FS + 0.12V
REF
UNITS
V
V
Input Voltage Range
(Note 14)
●
●
●
IN
SET
REF
SET
SET
FS
SET
Full-Scale Set Range
Zero-Scale Set Range
Input Sampling Capacitance
Reference Sampling Capacitance
Input Leakage Current
0.1 + ZS
0
V
V
CC
ZS
FS – 0.1
SET
V
SET
C
C
1
1.5
1
pF
pF
nA
nA
S(IN)
S(REF)
I
I
CS = V
●
●
–100
–100
100
100
IN(LEAK)
REF(LEAK)
CC
V
= 2.5V, CS = V
1
Reference Leakage CurreU nt
REF
CC
U
The ● denotes specifications which apply over the full
DIGITAL I PUTS A D DIGITAL OUTPUTS
operating temperature range, otherwise specifications are at TA = 25°C. (Note 3)
SYMBOL
PARAMETER
CONDITIONS
2.7V ≤ V ≤ 5.5V
MIN
TYP
MAX
UNITS
V
V
V
V
High Level Input Voltage
●
●
●
●
●
●
2.5
2.0
V
V
IH
IL
IH
IL
CC
CS, F
2.7V ≤ V ≤ 3.3V
O
CC
Low Level Input Voltage
CS, F
4.5V ≤ V ≤ 5.5V
0.8
0.6
V
V
CC
2.7V ≤ V ≤ 5.5V
O
CC
High Level Input Voltage
SCK
2.7V ≤ V ≤ 5.5V (Note 9)
2.5
2.0
V
V
CC
2.7V ≤ V ≤ 3.3V (Note 9)
CC
Low Level Input Voltage
SCK
4.5V ≤ V ≤ 5.5V (Note 9)
0.8
0.6
V
V
CC
2.7V ≤ V ≤ 5.5V (Note 9)
CC
I
I
Digital Input Current
0V ≤ V ≤ V
CC
–10
–10
10
µA
µA
pF
pF
V
IN
IN
CS, F
O
Digital Input Current
SCK
0V ≤ V ≤ V (Note 9)
10
IN
IN
CC
C
C
V
V
V
V
Digital Input Capacitance
10
10
IN
CS, F
O
Digital Input Capacitance
SCK
(Note 9)
IN
High Level Output Voltage
SDO
I = –800µA
O
●
●
●
●
●
V
V
– 0.5
OH
OL
OH
OL
CC
Low Level Output Voltage
SDO
I = 1.6mA
O
0.4
V
High Level Output Voltage
SCK
I = –800µA (Note 10)
O
– 0.5
V
CC
Low Level Output Voltage
SCK
I = 1.6mA (Note 10)
O
0.4
10
V
I
High-Z Output Leakage
SDO
–10
µA
OZ
W U
POWER REQUIRE E TS
The ● denotes specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C. (Note 3)
SYMBOL
PARAMETER
Supply Voltage
Supply Current
CONDITIONS
MIN
TYP
MAX
UNITS
V
●
2.7
5.5
V
CC
I
CC
Conversion Mode
Sleep Mode
CS = 0V (Note 12)
●
●
200
20
300
30
µA
µA
CS = V (Note 12)
CC
24212f
3
LTC2421/LTC2422
W U
TI I G CHARACTERISTICS The ● denotes specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 3)
SYMBOL
PARAMETER
CONDITIONS
MIN
2.56
0.5
TYP
MAX
307.2
390
UNITS
kHz
µs
f
t
t
t
External Oscillator Frequency Range
External Oscillator High Period
External Oscillator Low Period
Conversion Time
●
●
●
EOSC
HEO
0.5
390
µs
LEO
F
= 0V
O
●
●
●
130.86
157.03
133.53
160.23
EOSC
136.20
163.44
(in kHz)
ms
ms
ms
CONV
F = V
O
CC
External Oscillator (Note 11)
20510/f
f
Internal SCK Frequency
Internal Oscillator (Note 10)
External Oscillator (Notes 10, 11)
19.2
kHz
kHz
ISCK
f
/8
EOSC
D
Internal SCK Duty Cycle
(Note 10)
(Note 9)
(Note 9)
(Note 9)
45
55
%
kHz
ns
ISCK
f
t
t
t
External SCK Frequency Range
External SCK Low Period
●
●
●
2000
ESCK
250
250
1.23
LESCK
External SCK High Period
ns
HESCK
DOUT_ISCK
Internal SCK 24-Bit Data Output Time
Internal Oscillator (Notes 10, 12)
External Oscillator (Notes 10, 11)
●
●
1.25
1.28
ms
ms
192/f
(in kHz)
EOSC
t
t
t
t
t
t
t
External SCK 24-Bit Data Output Time
CS ↓ to SDO Low Z
CS ↑ to SDO High Z
CS ↓ to SCK ↓
(Note 9)
●
●
●
●
●
●
●
●
●
24/f
(in kHz)
ms
ns
ns
ns
ns
ns
ns
ns
ns
DOUT_ESCK
ESCK
0
0
150
150
150
1
2
(Note 10)
(Note 9)
0
3
CS ↓ to SCK ↑
50
4
SCK ↓ to SDO Valid
SDO Hold After SCK ↓
SCK Set-Up Before CS ↓
SCK Hold After CS ↓
200
KQMAX
KQMIN
(Note 5)
15
50
t
t
5
6
50
Note 1: Absolute Maximum Ratings are those values beyond which the
life of the device may be impaired.
Note 2: All voltage values are with respect to GND.
Note 9: The converter is in external SCK mode of operation such that
the SCK pin is used as digital input. The frequency of the clock signal
driving SCK during the data output is fESCK and is expressed in kHz.
Note 10: The converter is in internal SCK mode of operation such that
the SCK pin is used as digital output. In this mode of operation, the
SCK pin has a total equivalent load capacitance CLOAD = 20pF.
Note 11: The external oscillator is connected to the FO pin. The external
oscillator frequency, fEOSC, is expressed in kHz.
Note 3: VCC = 2.7 to 5.5V unless otherwise specified. Input source
resistance = 0Ω.
Note 4: Internal Conversion Clock source with the FO pin tied
to GND or to VCC or to external conversion clock source with
f
EOSC = 153600Hz unless otherwise specified.
Note 12: The converter uses the internal oscillator.
Note 5: Guaranteed by design, not subject to test.
FO = 0V or FO = VCC
.
Note 6: Integral nonlinearity is defined as the deviation of a code from
a straight line passing through the actual endpoints of the transfer
curve. The deviation is measured from the center of the quantization
band.
Note 13: The output noise includes the contribution of the internal
calibration operations.
Note 14: VREF = FSSET – ZSSET. The minimum input voltage is limited
to –0.3V and the maximum to VCC + 0.3V.
Note 7: FO = 0V (internal oscillator) or fEOSC = 153600Hz ±2%
(external oscillator).
Note 15: VCC (DC) = 4.1V, VCC (AC) = 2.8VP-P.
Note 8: FO = VCC (internal oscillator) or fEOSC = 128000Hz ±2%
(external oscillator).
24212f
4
LTC2421/LTC2422
U W
TYPICAL PERFOR A CE CHARACTERISTICS
Negative Extended Input Range
Total Unadjusted Error (3V Supply)
Total Unadjusted Error (3V Supply)
INL (3V Supply)
10
8
10
8
10
8
V
V
= 3V
REF
T
= 90°C
V
V
= 3V
REF
CC
A
CC
= 2.5V
= 2.5V
T
= 25°C
A
6
6
6
T
= –45°C
4
4
4
A
2
2
2
0
0
0
T
A
= –55°C
–2
–4
–6
–8
–10
–2
–4
–6
–8
–10
–2
–4
–6
–8
–10
T
= –55°C, –45°C, 25°C, 90°C
A
0
–0.05
–0.15 –0.20 –0.25 –0.30
0
0.5
1.0
1.5
2.0
2.5
0
0.5
1.0
1.5
2.0
2.5
–0.10
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
24212 G03
24212 G01
24212 G02
Positive Extended Input Range
Total Unadjusted Error (3V Supply)
Total Unadjusted Error (5V Supply)
INL (5V Supply)
10
8
10
8
10
8
V
V
= 3V
REF
CC
= 2.5V
6
6
6
4
4
4
2
2
2
0
0
0
–2
–4
–6
–8
–10
–2
–4
–6
–8
–10
–2
–4
–6
–8
–10
T
= –55°C, –45°C, 25°C, 90°C
A
2.50 2.55
2.65 2.70 2.75 2.80
2.60
0
1
2
3
4
5
0
1
2
3
4
5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
24212 G04
24212 G05
24212 G06
Negative Extended Input Range
Total Unadjusted Error (5V Supply)
Positive Extended Input Range
Total Unadjusted Error (5V Supply)
Offset Error vs Reference Voltage
10
8
150
120
90
60
30
0
10
8
T
= 25°C
V
V
= 5V
= 5V
V
V
= 5V
= 5V
V
A
= 5V
CC
A
CC
REF
CC
REF
T
= 25°C
T
T
= 90°C
= –45°C
A
6
A
6
4
4
T
= –55°C
A
2
2
0
0
–2
–4
–6
–8
–10
–2
–4
–6
–8
–10
T
T
= –55°C
= –45°C
A
T
= 90°C
T = 25°C
A
A
A
0
–0.05
–0.15 –0.20 –0.25 –0.30
INPUT VOLTAGE (V)
–0.10
5.00 5.05
5.15 5.20 5.25 5.30
INPUT VOLTAGE (V)
0
1
2
3
4
5
5.10
REFERENCE VOLTAGE (V)
24212 G07
24212 G08
24212 G09
24212f
5
LTC2421/LTC2422
U W
TYPICAL PERFOR A CE CHARACTERISTICS
RMS Noise vs Reference Voltage
Offset Error vs VCC
RMS Noise vs VCC
60
50
10
5
10.0
7.5
V
T
= 5V
V
T
= 2.5V
V
= 2.5V
REF
CC
REF
= 25°C
= 25°C
T
= 25°C
A
A
A
40
30
0
5.0
20
10
0
–5
2.5
–10
0
0
1
2
3
4
5
2.7
3.2
3.7
4.2
(V)
4.7
5.2 5.5
2.7
3.2
3.7
4.2
(V)
4.7
5.2 5.5
REFERENCE VOLTAGE (V)
V
CC
V
CC
24212 G10
24212 G11
24212 G12
Noise Histogram
RMS Noise vs Code Out
Offset Error vs Temperature
350
300
250
200
150
100
50
5.00
3.75
2.50
1.25
10
5
V
V
V
= 5V
= 5V
V
V
V
= 5V
= 5V
V
V
V
= 5
REF
= 0
CC
REF
IN
CC
REF
= 0V
IN
CC
= 5
= 0.3V TO 5.3V
IN
T
= 25°C
A
0
–5
0
–10
0
4
–55 –30 –5
20
45
70
95 120
–2
0
2
6
0
7FFFF
FFFFF
CODE OUT (HEX)
TEMPERATURE (°C)
OUTPUT CODE (ppm)
24212 G13
24212 G14
24212 G15
Full-Scale Error
vs Reference Voltage
Full-Scale Error vs Temperature
Full-Scale Error vs VCC
0
10
5
10
5
V
V
V
= 5V
REF
= 5V
V
= 2.5V
REF
CC
= 5V
V
= 2.5V
IN
–25
T
A
= 25°C
IN
–50
–75
0
0
–100
–125
–150
–5
–5
V
V
= 5V
REF
CC
IN
= V
–10
–10
0
1
2
3
4
5
–55 –30 –5
20
45
70
95 120
2.7
3.2
3.7
4.2
(V)
4.7
5.2 5.5
REFERENCE VOLTAGE (V)
TEMPERATURE (°C)
V
CC
24212 G17
24212 G16
24212 G18
24212f
6
LTC2421/LTC2422
U W
TYPICAL PERFOR A CE CHARACTERISTICS
Conversion Current
vs Temperature
Sleep Current vs Temperature
Rejection vs Frequency at VCC
30
20
10
0
0
230
220
210
200
190
180
170
160
150
V
V
T
= 4.1V
= 0V
CC
IN
A
–20
= 25°C
V
= 5.5V
= 4.1V
= 2.7V
CC
F
= 0
O
V
CC
= 2.7V
–40
–60
V
CC
CC
V
CC
= 5V
–80
–100
–120
V
1
100
10k
1M
–30
–5
45
70
95 120
–55 –30 –5
20
45
70
95 120
–55
20
TEMPERATURE (°C)
FREQUENCY AT V (Hz)
TEMPERATURE (°C)
CC
24212 G23
24212 G19
24212 G20
Rejection vs Frequency at VCC
Rejection vs Frequency at VCC
Rejection vs Frequency at VIN
–20
–40
0
–20
0
V
V
T
= 4.1V
= 0V
V
V
T
= 4.1V
= 0V
CC
IN
V
V
V
F
= 5V
CC
IN
CC
= 5V
REF
= 25°C
–20
= 25°C
A
O
= 2.5V
A
O
IN
F
= 0
F
= 0
= 0
O
–40
–40
–60
–60
–60
–80
–80
–80
–100
–120
–100
–120
–100
–120
1
50
100
150
200
250
15200
15300 15350 15400 15450 15500
1
50
100
150
200
250
15250
FREQUENCY AT V (Hz)
CC
FREQUENCY AT V (Hz)
FREQUENCY AT V (Hz)
IN
CC
24212 G21
24212 G22
24212 G24
Rejection vs Frequency at VIN
Rejection vs Frequency at VIN
Rejection vs Frequency at VIN
0
–60
–70
0
–20
–40
V
V
V
= 5V
CC
= 5V
REF
–20
= 2.5V
IN
F
= 0
O
–80
–40
–60
–90
–60
–80
–100
–110
–120
–130
–140
–80
–100
–120
–100
–120
–140
SAMPLE RATE = 15.36kHz ±2%
15100
15200
15300
15400
15500
–12
–8
–4
0
4
8
12
0
f /2
S
f
S
FREQUENCY AT V (Hz)
INPUT FREQUENCY DEVIATION FROM NOTCH FREQUENCY (%)
INPUT FREQUENCY
IN
24212 G26
24212 G25
24212 G27
24212f
7
LTC2421/LTC2422
U W
TYPICAL PERFOR A CE CHARACTERISTICS
INL vs Output Rate
INL vs Output Rate
Resolution vs Output Rate
24
22
20
18
16
20
18
16
20
18
16
V
V
F
= 3V
REF
= EXTERNAL
V
V
F
= 5V
= 5V
CC
CC
REF
= 2.5V
= EXTERNAL
O
O
T
= –45°C
A
T
= –45°C
A
T
= 25°C
A
14
12
10
14
12
10
T
= 25°C
V
V
O
= 5V
REF
= EXTERNAL
A
CC
T
= 90°C
T
= 90°C
A
A
= 5V
T
T
T
= 25°C
= 90°C
= –45°C
f
A
A
A
STANDARD DEVIATION
OF 100 SAMPLES
0 7.5
25
50
75
100
0
10 20 30 40 50 60 70 80 90 100
0
10 20 30 40 50 60 70 80 90 100
OUTPUT RATE (Hz)
OUTPUT RATE (Hz)
OUTPUT RATE (Hz)
24212 G30
24212 G29
24212 G28
U
U
U
PIN FUNCTIONS
VCC (Pin 1): Positive Supply Voltage. Bypass to GND
(Pin 6) with a 10µF tantalum capacitor in parallel with
0.1µF ceramic capacitor as close to the part as possible.
be connected directly to a ground plane through a mini-
mum length trace or it should be the single-point-ground
in a single-point grounding system.
FSSET (Pin 2): Full-Scale Set Input. This pin defines the
full-scale input value. When VIN = FSSET, the ADC outputs
full scale (FFFFFH). The total reference voltage is
CS (Pin 7): Active LOW Digital Input. A LOW on this pin
enables the SDO digital output and wakes up the ADC.
Following each conversion, the ADC automatically enters
the Sleep mode and remains in this low power state as
long as CS is HIGH. A LOW on CS wakes up the ADC. A
LOW-to-HIGH transition on this pin disables the SDO
digitaloutput.ALOW-to-HIGHtransitiononCSduringthe
Data Output transfer aborts the data transfer and starts a
new conversion.
FSSET – ZSSET
.
CH0, CH1 (Pins 4, 3): Analog Input Channels. The input
voltage range is –0.125 • VREF to 1.125 • VREF. For
VREF > 2.5V, the input voltage range may be limited by the
absolute maximum rating of –0.3V to VCC + 0.3V. Conver-
sions are performed alternately between CH0
and CH1 for the LTC2422. Pin 4 is a No Connect (NC) on
the LTC2421.
SDO (Pin 8): Three-State Digital Output. During the data
output period, this pin is used for serial data output. When
the chip select CS is HIGH (CS = VCC), the SDO pin is in a
high impedance state. During the Conversion and Sleep
periods, this pin can be used as a conversion status out-
put. The conversion status can be observed by pulling CS
LOW.
ZSSET (Pin 5): Zero-Scale Set Input. This pin defines the
zero-scale input value. When VIN = ZSSET, the ADC
outputs zero scale (00000H).
GND (Pin 6): Ground. Shared pin for analog ground,
digitalground,referencegroundandsignalground.Should
24212f
8
LTC2421/LTC2422
U
U
U
PIN FUNCTIONS
SCK (Pin 9): Bidirectional Digital Clock Pin. In the Internal
SerialClockOperationmode, SCKisusedasdigitaloutput
fortheinternalserialinterfaceclockduringthedataoutput
period. In the External Serial Clock Operation mode, SCK
is used as digital input for the external serial interface. An
internal pull-up current source is automatically activated
in Internal Serial Clock Operation mode. The Serial Clock
mode is determined by the level applied to SCK at power
up and the falling edge of CS.
FO (Pin 10): Frequency Control Pin. Digital input that
controls the ADC’s notch frequencies and conversion
time. When the FO pin is connected to VCC (FO = VCC), the
converter uses its internal oscillator and the digital filter’s
first null is located at 50Hz. When the FO pin is connected
to GND (FO = 0V), the converter uses its internal oscillator
and the digital filter’s first null is located at 60Hz. When FO
isdrivenbyanexternalclocksignalwithafrequencyfEOSC
,
the converter uses this signal as its clock and the digital
filter first null is located at a frequency fEOSC/2560.
U
U
W
FUNCTIONAL BLOCK DIAGRA
INTERNAL
OSCILLATOR
V
CC
GND
AUTOCALIBRATION
AND CONTROL
F
O
(INT/EXT)
V
IN
∫
∫
∫
SDO
SERIAL
INTERFACE
∑
ADC
SCK
CS
V
REF
DECIMATING FIR
DAC
24212 FD
TEST CIRCUITS
V
CC
3.4k
C
SDO
SDO
= 20pF
3.4k
C
= 20pF
LOAD
LOAD
Hi-Z TO V
Hi-Z TO V
OL
OH
OH
V
V
TO V
OL
V
OL
V
OH
TO V
OH
OL
TO Hi-Z
24212 TC02
TO Hi-Z
24212 TC01
24212f
9
LTC2421/LTC2422
W U U
U
APPLICATIO S I FOR ATIO
The LTC2421/LTC2422 are pin compatible with the
LTC2401/LTC2402. The devices are designed to allow the
user to incorporate either device in the same design with
nomodifications.WhiletheLTC2421/LTC2422outputword
length is 24 bits (as opposed to the 32-bit output of the
LTC2401/LTC2402), its output clock timing can be identi-
cal to the LTC2401/LTC2402. As shown in Figure 1, the
LTC2421/LTC2422 data output is concluded on the falling
edge of the 24th serial clock (SCK). In order to maintain
drop-in compatibility with the LTC2401/LTC2402, it is
possibletoclocktheLTC2421/LTC2422withanadditional
8serialclockpulses.Thisresultsin8additionaloutputbits
which are always logic HIGH.
Once CS is pulled LOW and SCK rising edge is applied, the
devicebeginsoutputtingtheconversionresult.Thereisno
latency in the conversion result. The data output corre-
sponds to the conversion just performed. This result is
shifted out on the serial data out pin (SDO) under the
control of the serial clock (SCK). Data is updated on the
falling edge of SCK allowing the user to reliably latch data
on the rising edge of SCK, see Figure 4. The data output
state is concluded once 24 bits are read out of the ADC or
when CS is brought HIGH. The device automatically
initiates a new conversion and the cycle repeats.
Through timing control of the CS and SCK pins, the
LTC2421/LTC2422offerseveralflexiblemodesofopera-
tion (internal or external SCK and free-running conver-
sion modes). These various modes do not require
programming configuration registers; moreover, they do
not disturb the cyclic operation described above. These
modes of operation are described in detail in the Serial
Interface Timing Modes section.
Converter Operation Cycle
The LTC2421/LTC2422 are low power, delta-sigma ana-
log-to-digital converters with an easy to use 3-wire serial
interface. Their operation is simple and made up of three
states. The converter operating cycle begins with the con-
version,followedbythesleepstateandconcludedwiththe
dataoutput(seeFigure2). The3-wireinterfaceconsistsof
serial data output (SDO), a serial clock (SCK) and a chip
select (CS).
CONVERT
SLEEP
Initially,theLTC2421/LTC2422performaconversion.Once
the conversion is complete, the device enters the sleep
state. While in this sleep state, power consumption is re-
duced by an order of magnitude if CS is HIGH. The part
remains in the sleep state as long as CS is logic HIGH. The
conversion result is held indefinitely in a static shift regis-
ter while the converter is in the sleep state.
1
CS AND
SCK
0
DATA OUTPUT
24212 F02
Figure 2. LTC2421/LTC2422 State Transition Diagram
CS
8
8
8
8 (OPTIONAL)
SCK
SDO
EOC = 1
EOC = 0
SLEEP
EOC = 1
DATA OUT
4 STATUS BITS 20 DATA BITS
LAST 8 BITS ALWAYS 1
CONVERSION
DATA OUTPUT
CONVERSION
24212 F01
Figure 1. LTC2421/LTC2422 Compatible Timing with the LTC2401/LTC2402
24212f
10
LTC2421/LTC2422
W U U
APPLICATIO S I FOR ATIO
U
Conversion Clock
above. The first conversion result following POR is accu-
rate within the specifications of the device.
A major advantage delta-sigma converters offer over con-
ventional type converters is an on-chip digital filter (com-
monly known as Sinc or Comb filter). For high resolution,
low frequency applications, this filter is typically designed
to reject line frequencies of 50Hz or 60Hz plus their har-
monics. In order to reject these frequencies in excess of
110dB,ahighlyaccurateconversionclockisrequired.The
LTC2421/LTC2422 incorporate an on-chip highly accu-
rate oscillator. This eliminates the need for external fre-
quency setting components such as crystals or oscilla-
tors. Clocked by the on-chip oscillator, the LTC2421/
LTC2422 reject line frequencies (50Hz or 60Hz ±2%) a
minimum of 110dB.
Reference Voltage Range
TheLTC2421/LTC2422canacceptareferencevoltage(VREF
= FSSET – ZSSET) from 0V to VCC. The converter output
noise is determined by the thermal noise of the front-end
circuits, and as such, its value in microvolts is nearly con-
stant with reference voltage. A decrease in reference volt-
age will not significantly improve the converter’s effective
resolution. On the other hand, a reduced reference voltage
will improve the overall converter INL performance. The
recommended range for the LTC2421/LTC2422 voltage
reference is 100mV to VCC.
Input Voltage Range
Ease of Use
Theconverterisabletoaccommodatesystemleveloffset
and gain errors as well as system level overrange situa-
tions due to its extended input range, see Figure 3. The
LTC2421/LTC2422 convert input signals within the ex-
tended input range of –0.125 • VREF to 1.125 • VREF
(VREF = FSSET – ZSSET).
The LTC2421/LTC2422 data output has no latency, filter
settling or redundant data associated with the conver-
sion cycle. There is a one-to-one correspondence be-
tween the conversion and the output data. Therefore,
multiplexing an analog input voltage is easy.
The LTC2421/LTC2422 perform offset and full-scale cali-
brations every conversion cycle. This calibration is trans-
parenttotheuserandhasnoeffectonthecyclicoperation
describedabove. Theadvantageofcontinuouscalibration
is extreme stability of offset and full-scale readings with
respect to time, supply voltage change and temperature
drift.
For large values of VREF (VREF = FSSET – ZSSET), this range
is limited by the absolute maximum voltage range of
–0.3V to (VCC + 0.3V). Beyond this range, the input ESD
protection devices begin to turn on and the errors due to
the input leakage current increase rapidly.
Input signals applied to VIN may extend below ground by
–300mV and above VCC by 300mV. In order to limit any
Power-Up Sequence
V
+ 0.3V
CC
TheLTC2421/LTC2422automaticallyenteraninternalreset
state when the power supply voltage VCC drops below
approximately 2.2V. This feature guarantees the integrity
of the conversion result and of the serial interface mode
selection which is performed at the initial power-up. (See
the2-wireI/OsectionsintheSerialInterfaceTimingModes
section.)
FS
+ 0.12V
FS
SET
REF
SET
ABSOLUTE
MAXIMUM
INPUT
NORMAL
INPUT
RANGE
EXTENDED
INPUT
RANGE
RANGE
ZS
SET
REF
When the VCC voltage rises above this critical threshold,
the converter creates an internal power-on-reset (POR)
signal with duration of approximately 0.5ms. The POR
signal clears all internal registers. Following the POR sig-
nal,theLTC2421/LTC2422start anormalconversioncycle
and follows the normal succession of states described
ZS
SET
– 0.12V
–0.3V
24212 F03
(V
REF
= FS
– ZS
)
SET
SET
Figure 3. LTC2421/LTC2422 Input Range
24212f
11
LTC2421/LTC2422
W U U
U
APPLICATIO S I FOR ATIO
fault current, a resistor of up to 5k may be added in series
with the VIN pin without affecting the performance of the
device. In the physical layout, it is important to maintain
the parasitic capacitance of the connection between this
series resistance and the VIN pin as low as possible; there-
fore, the resistor should be located as close as practical to
the VIN pin. The effect of the series resistance on the con-
verter accuracy can be evaluated from the curves pre-
sented in the Analog Input/Reference Current section. In
addition, a series resistor will introduce a temperature de-
pendent offset error due to the input leakage current. A
1nA input leakage current will develop a 1ppm offset error
on a 5k resistor if VREF = 5V. This error has a very strong
temperature dependency.
0 ≤ VIN ≤ VREF, this bit is LOW. If the input is outside the
normal input range, VIN > VREF or VIN < 0, this bit is HIGH.
The function of these bits is summarized in Table 1.
Table 1. LTC2421/LTC2422 Status Bits
Bit 23
EOC
Bit 22
Bit 21
SIG
Bit 20
EXR
Input Range
> V
CH0/CH1
V
0
0
0
0
*0/1
*0/1
*0/1
*0/1
1
1
1
0
0
1
IN
REF
0 < V ≤ V
IN
REF
–
+
V
V
= 0 /0
1/0
0
IN
IN
< 0
*Bit 22 displays the channel number for the LTC2422. Bit 22 is always
0 for the LTC2421
Bit 19 (fifth output bit) is the most significant bit (MSB).
Bits 19-0 are the 20-bit conversion result MSB first.
Bit 0 is the least significant bit (LSB).
Output Data Format
TheLTC2421/LTC2422serialoutputdatastreamis24bits
long. The first 4 bits represent status information indicat-
ing the sign, selected channel, input range and conversion
state. Thenext20bitsaretheconversionresult, MSBfirst.
DataisshiftedoutoftheSDOpinundercontroloftheserial
clock (SCK), see Figure 4. Whenever CS is HIGH, SDO
remains high impedance and any SCK clock pulses are
ignored by the internal data out shift register.
Bit 23 (first output bit) is the end of conversion (EOC)
indicator. This bit is available at the SDO pin during the
conversion and sleep states whenever the CS pin is LOW.
This bit is HIGH during the conversion and goes LOW
when the conversion is complete.
In order to shift the conversion result out of the device, CS
mustfirstbedrivenLOW. EOCisseenattheSDOpinofthe
deviceonceCSispulledLOW.EOCchangesrealtimefrom
HIGH to LOW at the completion of a conversion. This sig-
nal may be used as an interrupt for an external microcon-
troller.Bit23(EOC)canbecapturedonthefirstrisingedge
of SCK. Bit 22 is shifted out of the device on the first falling
edge of SCK. The final data bit (Bit 0) is shifted out on the
falling edge of the 23rd SCK and may be latched on the
risingedgeofthe24thSCKpulse.Onthefallingedgeofthe
24th SCK pulse, SDO goes HIGH indicating a new conver-
sion cycle has been initiated. This bit serves as EOC (Bit
23) for the next conversion cycle. Table 2 summarizes the
output data format.
Bit 22 (second output bit) for the LTC2422, this bit is LOW
if the last conversion was performed on CH0 and HIGH for
CH1. This bit is always LOW for the LTC2421.
Bit 21 (third output bit) is the conversion result sign indi-
cator (SIG). If VIN is >0, this bit is HIGH. If VIN is <0, this
bitisLOW.Thesignbitchangesstateduringthezerocode.
Bit20(fourthoutputbit)istheextendedinputrange(EXR)
indicator. If the input is within the normal input range
CS
BIT 23
EOC
BIT 22
BIT 21
SIG
BIT 20
EXT
BIT 19
MSB
BIT 4
BIT 0
SDO
SCK
LSB
20
CH0/CH1
Hi-Z
1
2
3
4
5
19
20
24
SLEEP
DATA OUTPUT
CONVERSION
24212 F04
Figure 4. Output Data Timing
24212f
12
LTC2421/LTC2422
W U U
APPLICATIO S I FOR ATIO
U
Table 2. LTC2421/LTC2422 Output Data Format
Bit 23
EOC
Bit 22*
CH0/CH1
Bit 21
SIG
Bit 20
EXR
Bit 19
MSB
Bit 18
Bit 17
Bit 16
Bit 15
…
Bit 0
LSB
Input Voltage
> 9/8 • V
V
0
0
0
0
0
0
0
0
0
0
0
0
0
0
CH0/CH1
CH0/CH1
CH0/CH1
CH0/CH1
CH0/CH1
CH0/CH1
CH0/CH1
CH0/CH1
CH0/CH1
CH0/CH1
CH0/CH1
CH0/CH1
CH0/CH1
CH0/CH1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
0
0
0
1
1
1
1
0
0
0
0
1
1
1
0
0
0
1
1
0
0
1
1
0
0
1
1
1
0
0
0
1
0
1
0
1
0
1
0
1
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
0
...
...
...
...
...
...
...
...
...
...
...
...
...
...
1
1
0
1
0
1
0
1
0
1
0
1
0
0
IN
REF
9/8 • V
1
REF
V
V
+ 1LSB
1
REF
REF
1
3/4V
3/4V
1/2V
1/2V
1/4V
1/4V
+ 1LSB
+ 1LSB
+ 1LSB
1
REF
REF
REF
REF
REF
REF
1
1
1
1
1
+
–
0 /0
1/0**
–1LSB
0
0
0
–1/8 • V
REF
V
< –1/8 • V
REF
IN
*Bit 22 is always 0 for the LTC2421 **The sign bit changes state during the 0 code.
As long as the voltage on the VIN pin is maintained within
the –0.3V to (VCC + 0.3V) absolute maximum operating
range, a conversion result is generated for any input value
from –0.125 • VREF to 1.125 • VREF. For input voltages
greaterthan1.125•VREF,theconversionresultisclamped
to the value corresponding to 1.125 • VREF. For input volt-
agesbelow–0.125•VREF,theconversionresultisclamped
When a fundamental rejection frequency different from
50Hz or 60Hz is required or when the converter must be
synchronized with an outside source, the LTC2421/
LTC2422 can operate with an external conversion clock.
The converter automatically detects the presence of an
external clock signal at the FO pin and turns off the internal
oscillator. The frequency fEOSC of the external signal must
be at least 2560Hz (1Hz notch frequency) to be detected.
The external clock signal duty cycle is not significant as
long as the minimum and maximum specifications for the
high and low periods tHEO and tLEO are observed.
to the value corresponding to –0.125 • VREF
.
Frequency Rejection Selection (FO Pin Connection)
The LTC2421/LTC2422 internal oscillator provides better
than 110dB normal mode rejection at the line frequency
and all its harmonics for 50Hz ±2% or 60Hz ±2%. For
60Hz rejection, FO (Pin 10) should be connected to GND
(Pin 6) while for 50Hz rejection the FO pin should be con-
nected to VCC (Pin 1).
While operating with an external conversion clock of a
frequencyfEOSC,theLTC2421/LTC2422providebetterthan
110dB normal mode rejection in a frequency range fEOSC
/
2560 ±4% and its harmonics. The normal mode rejection
as a function of the input frequency deviation from fEOSC
2560 is shown in Figure 5.
/
The selection of 50Hz or 60Hz rejection can also be made
by driving FO to an appropriate logic level. A selection
change during the sleep or data output states will not
disturb the converter operation. If the selection is made
duringtheconversionstate, theresultoftheconversionin
progress may be outside specifications but the following
conversions will not be affected.
Whenever an external clock is not present at the FO pin, the
converterautomaticallyactivatesitsinternaloscillatorand
enters the Internal Conversion Clock mode. The LTC2421/
LTC2422 operation will not be disturbed if the change of
conversion clock source occurs during the sleep state or
during the data output state while the converter uses an
24212f
13
LTC2421/LTC2422
W U U
U
APPLICATIO S I FOR ATIO
–60
synchronous 3-wire interface. During the conversion and
sleep states, this interface can be used to assess the con-
verter status and during the data output state, it is used to
read the conversion result.
–70
–80
–90
–100
–110
–120
–130
–140
Serial Clock Input/Output (SCK)
The serial clock signal present on SCK (Pin 9) is used to
synchronizethedatatransfer.Eachbitofdataisshiftedout
the SDO pin on the falling edge of the serial clock.
–12
–8
–4
0
4
8
12
In the Internal SCK mode of operation, the SCK pin is an
output and the LTC2421/LTC2422 create their own serial
clock by dividing the internal conversion clock by 8. In the
External SCK mode of operation, the SCK pin is used as
input. The internal or external SCK mode is selected on
power-up and then reselected every time a HIGH-to-LOW
transition is detected at the CS pin. If SCK is HIGH or
floating at power-up or during this transition, the con-
verter enters the internal SCK mode. If SCK is LOW at
power-up or during this transition, the converter enters
the external SCK mode.
INPUT FREQUENCY DEVIATION FROM NOTCH FREQUENCY (%)
24212 F05
Figure 5. LTC2421/LTC2422 Normal Mode Rejection When
Using an External Oscillator of Frequency fEOSC
external serial clock. If the change occurs during the con-
version state, the result of the conversion in progress may
be outside specifications but the following conversions
will not be affected. If the change occurs during the data
output state and the converter is in the Internal SCK mode,
the serial clock duty cycle may be affected but the serial
data stream will remain valid.
Serial Data Output (SDO)
Table 3 summarizes the duration of each state as a func-
tion of FO.
The serial data output pin, SDO (Pin 8), drives the serial
data during the data output state. In addition, the SDO pin
is used as an end of conversion indicator during the con-
version and sleep states.
SERIAL INTERFACE
The LTC2421/LTC2422 transmit the conversion results
and receives the start of conversion command through a
When CS (Pin 7) is HIGH, the SDO driver is switched to a
high impedance state. This allows sharing the serial
Table 3. LTC2421/LTC2422 State Duration
State
Operating Mode
Duration
CONVERT
Internal Oscillator
F = LOW
(60Hz Rejection)
133ms
O
F = HIGH
O
160ms
(50Hz Rejection)
External Oscillator
F = External Oscillator
20510/f
s
EOSC
O
with Frequency f
kHz
EOSC
(f
EOSC
/2560 Rejection)
SLEEP
As Long As CS = HIGH Until CS = 0 and SCK
DATA OUTPUT
Internal Serial Clock
External Serial Clock with
F = LOW/HIGH
(Internal Oscillator)
As Long As CS = LOW But Not Longer Than 1.28ms
(24 SCK cycles)
O
F = External Oscillator with
As Long As CS = LOW But Not Longer Than 192/f
ms
EOSC
O
Frequency f
kHz
(24 SCK cycles)
EOSC
As Long As CS = LOW But Not Longer Than 24/f ms
SCK
Frequency f
kHz
(24 SCK cycles)
SCK
24212f
14
LTC2421/LTC2422
W U U
APPLICATIO S I FOR ATIO
U
interface with other devices. If CS is LOW during the con-
vert or sleep state, SDO will output EOC. If CS is LOW
duringtheconversionphase,theEOCbitappearsHIGHon
the SDO pin. Once the conversion is complete, EOC goes
LOW. The device remains in the sleep state until the first
rising edge of SCK occurs while CS = 0. While in the sleep
state, the device is in a LOW power state if CS is HIGH.
these serial interface timing modes in detail. In all these
cases, the converter can use the internal oscillator (FO =
LOW or FO = HIGH) or an external oscillator connected to
the FO pin. Refer to Table 4 for a summary.
External Serial Clock, Single Cycle Operation
(SPI/MICROWIRE Compatible)
This timing mode uses an external serial clock to shift out
the conversion result and a CS signal to monitor and con-
trol the state of the conversion cycle, see Figure 6.
Chip Select Input (CS)
The active LOW chip select, CS (Pin 7), is used to test the
conversionstatusandtoenablethedataoutputtransferas
described in the previous sections.
The serial clock mode is selected on the falling edge of CS.
Toselecttheexternalserialclockmode,theserialclockpin
(SCK) must be LOW during each CS falling edge.
In addition, the CS signal can be used to trigger a new
conversion cycle before the entire serial data transfer has
been completed. The LTC2421/LTC2422 will abort any
serial data transfer in progress and start a new conversion
cycle anytime a LOW-to-HIGH transition is detected at the
CSpinaftertheconverterhasenteredthedataoutputstate
(i.e., after the first rising edge of SCK occurs with CS = 0).
The serial data output pin (SDO) is Hi-Z as long as CS is
HIGH. At any time during the conversion cycle, CS may be
pulled LOW in order to monitor the state of the converter.
While CS is LOW, EOC is output to the SDO pin. EOC = 1
while a conversion is in progress and EOC = 0 if the device
is in the sleep state. Independent of CS, the device auto-
matically enters the sleep state once the conversion is
complete. While in the sleep state, power is reduced an
order of magnitude if CS is HIGH.
Finally, CS can be used to control the free-running modes
of operation, see Serial Interface Timing Modes section.
Grounding CS will force the ADC to continuously convert
at the maximum output rate selected by FO. Tying a ca-
pacitor to CS will reduce the output rate and power dissi-
pation by a factor proportional to the capacitor’s value,
see Figures 13 to 15.
When the device is in the sleep state (EOC = 0), its
conversion result is held in an internal static shift register.
The device remains in the sleep state until the first rising
edge of SCK is seen while CS is LOW. Data is shifted out
the SDO pin on each falling edge of SCK. This enables
external circuitry to latch the output on the rising edge of
SCK. EOC can be latched on the first rising edge of SCK
and the last bit of the conversion result can be latched on
the 24th rising edge of SCK. On the 24th falling edge of
SCK, thedevicebeginsanewconversion. SDOgoesHIGH
(EOC = 1) indicating a conversion is in progress.
SERIAL INTERFACE TIMING MODES
The LTC2421/LTC2422’s 3-wire interface is SPI and
MICROWIRE compatible. This interface offers several
flexible modes of operation. These include internal/exter-
nal serial clock, 2- or 3-wire I/O, single cycle conversion
and autostart. The following sections describe each of
Table 4. LTC2421/LTC2422 Interface Timing Modes
Conversion
Cycle
Control
Data
Output
Control
Connection
and
Waveforms
SCK
Configuration
Source
External
External
Internal
Internal
Internal
External SCK, Single Cycle Conversion
External SCK, 2-Wire I/O
CS and SCK
SCK
CS and SCK
SCK
Figures 6, 7
Figure 8
Internal SCK, Single Cycle Conversion
Internal SCK, 2-Wire I/O, Continuous Conversion
Internal SCK, Autostart Conversion
CS ↓
CS ↓
Figures 9, 10
Figure 11
Continuous
Internal
Internal
C
EXT
Figure 12
24212f
15
LTC2421/LTC2422
W U U
U
APPLICATIO S I FOR ATIO
At the conclusion of the data cycle, CS may remain LOW
and EOC monitored as an end-of-conversion interrupt.
Alternatively, CS may be driven HIGH setting SDO to Hi-Z.
As described above, CS may be pulled LOW at any time in
order to monitor the conversion status.
CS HIGH anytime between the first rising edge and the
24th falling edge of SCK, see Figure 7. On the rising edge
of CS, the device aborts the data output state and imme-
diately initiates a new conversion. This is useful for sys-
tems not requiring all 24 bits of output data, aborting an
invalid conversion cycle or synchronizing the start of a
conversion.
Typically, CS remains LOW during the data output state.
However, the data output state may be aborted by pulling
2.7V TO 5.5V
V
CC
1µF
= INTERNAL OSC/50Hz REJECTION
1
10
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
V
F
O
CC
LTC2422
2
9
8
7
6
REFERENCE VOLTAGE
FS
SCK
SDO
CS
SET
ZS
+ 0.1V TO V
SET
CC
3
4
5
3-WIRE
SERIAL I/O
ANALOG INPUT RANGE
CH1
CH0
ZS
ZS
– 0.12V
TO
SET
FS
REF
+ 0.12V
SET
REF
(V
= FS
– ZS
)
REF
SET
SET
0V TO FS
– 100mV
GND
SET
SET
CS
TEST EOC
TEST EOC
TEST EOC
BIT 23
EOC
BIT 22
CH0/CH1
BIT 21
SIG
BIT 20
EXR
BIT 19
MSB
BIT 18
BIT 4
BIT 0
LSB
SDO
20
Hi-Z
Hi-Z
Hi-Z
SCK
(EXTERNAL)
CONVERSION
SLEEP
DATA OUTPUT
CONVERSION
24212 F06
Figure 6. External Serial Clock, Single Cycle Operation
2.7V TO 5.5V
V
CC
1µF
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
1
10
V
F
O
CC
LTC2422
2
3
4
5
9
8
7
6
REFERENCE VOLTAGE
FS
SCK
SDO
CS
SET
ZS
+ 0.1V TO V
SET
CC
3-WIRE
SERIAL I/O
ANALOG INPUT RANGE
CH1
CH0
ZS
ZS
– 0.12V
TO
REF
)
SET
SET
FS
REF
+ 0.12V
SET
(V
= FS
– ZS
REF
SET
0V TO FS
– 100mV
GND
SET
SET
CS
TEST EOC
TEST EOC
TEST EOC
BIT 0
EOC
BIT 23
EOC
BIT 22
BIT 21
SIG
BIT 20
EXR
BIT 19
MSB
BIT 9
BIT 8
SDO
SCK
CH0/CH1
Hi-Z
Hi-Z
Hi-Z
Hi-Z
(EXTERNAL)
SLEEP
CONVERSION
DATA OUTPUT
SLEEP
DATA OUTPUT
CONVERSION
24212 F07
Figure 7. External Serial Clock, Reduced Data Output Length
24212f
16
LTC2421/LTC2422
W U U
APPLICATIO S I FOR ATIO
U
External Serial Clock, 2-Wire I/O
goes HIGH (EOC = 1) indicating a new conversion has
begun.
This timing mode utilizes a 2-wire serial I/O interface. The
conversion result is shifted out of the device by an exter-
nally generated serial clock (SCK) signal, see Figure 8. CS
maybepermanentlytiedtoground(Pin6),simplifyingthe
user interface or isolation barrier.
Internal Serial Clock, Single Cycle Operation
This timing mode uses an internal serial clock to shift out
the conversion result and a CS signal to monitor and con-
trol the state of the conversion cycle, see Figure 9.
The external serial clock mode is selected at the end of the
power-on reset (POR) cycle. The POR cycle is concluded
approximately 0.5ms after VCC exceeds 2.2V. The level
applied to SCK at this time determines if SCK is internal or
external. SCK must be driven LOW prior to the end of POR
in order to enter the external serial clock timing mode.
In order to select the internal serial clock timing mode, the
serial clock pin (SCK) must be floating (Hi-Z) or pulled
HIGH prior to the falling edge of CS. The device will not
enter the internal serial clock mode if SCK is driven LOW
on the falling edge of CS. An internal weak pull-up resistor
is active on the SCK pin during the falling edge of CS;
therefore, the internal serial clock timing mode is auto-
matically selected if SCK is not externally driven.
Since CS is tied LOW, the end-of-conversion (EOC) can
be continuously monitored at the SDO pin during the
convert and sleep states. EOC may be used as an inter-
rupt to an external controller indicating the conversion
resultisready.EOC=1whiletheconversionisinprogress
and EOC = 0 once the conversion enters the low power
sleep state. On the falling edge of EOC, the conversion
result is loaded into an internal static shift register. The
deviceremainsinthesleepstateuntilthefirstrisingedge
of SCK. Data is shifted out the SDO pin on each falling
edge of SCK enabling external circuitry to latch data on
the rising edge of SCK. EOC can be latched on the first
rising edge of SCK. On the 24th falling edge of SCK, SDO
The serial data output pin (SDO) is Hi-Z as long as CS is
HIGH. At any time during the conversion cycle, CS may be
pulled LOW in order to monitor the state of the converter.
Once CS is pulled LOW, SCK goes LOW and EOC is output
to the SDO pin. EOC = 1 while a conversion is in progress
and EOC = 0 if the device is in the sleep state.
WhentestingEOC, iftheconversioniscomplete(EOC=0),
the device will exit the sleep state and enter the data output
state if CS remains LOW. In order to prevent the device
from exiting the low power sleep state, CS must be pulled
2.7V TO 5.5V
V
CC
1µF
= INTERNAL OSC/50Hz REJECTION
1
10
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
V
F
O
CC
LTC2422
2
3
4
5
9
8
7
6
REFERENCE VOLTAGE
FS
SET
SCK
SDO
CS
ZS
+ 0.1V TO V
SET
CC
2-WIRE SERIAL I/O
ANALOG INPUT RANGE
CH1
CH0
ZS
ZS
– 0.12V
TO
SET
FS
REF
+ 0.12V
SET
REF
(V
= FS
– ZS
)
REF
SET
SET
0V TO FS
SET
– 100mV
GND
SET
CS
BIT 23
EOC
BIT 22
CH0/CH1
BIT 21
SIG
BIT 20
EXR
BIT 19
MSB
BIT 18
BIT 4
BIT 0
LSB
SDO
20
SCK
(EXTERNAL)
CONVERSION
SLEEP
DATA OUTPUT
CONVERSION
24212 F08
Figure 8. External Serial Clock, CS = 0 Operation
24212f
17
LTC2421/LTC2422
APPLICATIO S I FOR ATIO
W U U
U
V
CC
2.7V TO 5.5V
V
CC
1µF
= INTERNAL OSC/50Hz REJECTION
10k
1
10
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
V
F
O
CC
LTC2422
2
9
8
7
6
REFERENCE VOLTAGE
ZS + 0.1V TO V
FS
SCK
SDO
CS
SET
SET
CC
3
4
5
ANALOG INPUT RANGE
CH1
CH0
ZS
ZS
– 0.12V
TO
SET
FS
REF
+ 0.12V
SET
REF
(V
= FS
SET
– ZS
)
REF
SET
0V TO FS
SET
– 100mV
GND
SET
<t
EOCtest
CS
TEST EOC
TEST EOC
BIT 23
EOC
BIT 22
BIT 21
SIG
BIT 20
EXR
BIT 19
MSB
BIT 18
BIT 4
BIT 0
LSB
SDO
CH0/CH1
20
Hi-Z
Hi-Z
Hi-Z
Hi-Z
SCK
(INTERNAL)
CONVERSION
SLEEP
DATA OUTPUT
CONVERSION
24212 F09
Figure 9. Internal Serial Clock, Single Cycle Operation
HIGH before the first rising edge of SCK. In the internal
SCK timing mode, SCK goes HIGH and the device begins
outputting data at time tEOCtest after the falling edge of CS
(if EOC = 0) or tEOCtest after EOC goes LOW (if CS is LOW
duringthefallingedgeofEOC).ThevalueoftEOCtest is23µs
if the device is using its internal oscillator (F0 = logic LOW
or HIGH). If FO is driven by an external oscillator of fre-
quency fEOSC, then tEOCtest is 3.6/fEOSC. If CS is pulled
HIGH before time tEOCtest, the device remains in the sleep
state. The conversion result is held in the internal static
shift register.
CS HIGH anytime between the first and24th rising edge of
SCK, see Figure 10. On the rising edge of CS, the device
aborts the data output state and immediately initiates a
new conversion. This is useful for systems not requiring
all 24 bits of output data, aborting an invalid conversion
cycle, or synchronizing the start of a conversion. If CS is
pulled HIGH while the converter is driving SCK LOW, the
internal pull-up is not available to restore SCK to a logic
HIGH state. This will cause the device to exit the internal
serial clock mode on the next falling edge of CS. This can
be avoided by adding an external 10k pull-up resistor to
theSCKpinorbyneverpullingCSHIGHwhenSCKisLOW.
If CS remains LOW longer than tEOCtest, the first rising
edge of SCK will occur and the conversion result is serially
shiftedoutoftheSDOpin. Thedataoutputcyclebeginson
this first rising edge of SCK and concludes after the 24th
rising edge. Data is shifted out the SDO pin on each falling
edgeofSCK.Theinternallygeneratedserialclockisoutput
to the SCK pin. This signal may be used to shift the con-
version result into external circuitry. EOC can be latched
on the first rising edge of SCK and the last bit of the con-
version result on the 24th rising edge of SCK. After the
24th rising edge, SDO goes HIGH (EOC = 1), SCK stays
HIGH, and a new conversion starts.
Whenever SCK is LOW, the LTC2421/LTC2422’s internal
pull-up at pin SCK is disabled. Normally, SCK is not exter-
nallydrivenifthedeviceisintheinternalSCKtimingmode.
However,certainapplicationsmayrequireanexternaldriver
on SCK. If this driver goes Hi-Z after outputting a LOW
signal, the LTC2421/LTC2422’s internal pull-up remains
disabled. Hence, SCK remains LOW. On the next falling
edge of CS, the device is switched to the external SCK
timing mode. By adding an external 10k pull-up resistor to
SCK, this pin goes HIGH once the external driver goes
Hi-Z. On the next CS falling edge, the device will remain in
the internal SCK timing mode.
Typically, CS remains LOW during the data output state.
However, the data output state may be aborted by pulling
24212f
18
LTC2421/LTC2422
W U U
APPLICATIO S I FOR ATIO
U
V
CC
2.7V TO 5.5V
V
CC
1µF
= INTERNAL OSC/50Hz REJECTION
10k
1
10
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
V
F
O
CC
LTC2422
2
9
8
7
6
REFERENCE VOLTAGE
ZS + 0.1V TO V
FS
SET
SCK
SDO
CS
SET CC
3
4
5
ANALOG INPUT RANGE
CH1
CH0
ZS
ZS
– 0.12V
TO
SET
FS
REF
+ 0.12V
SET
REF
(V
= FS
– ZS
)
REF
SET
SET
0V TO FS
SET
– 100mV
GND
SET
>t
EOCtest
<t
EOCtest
CS
TEST EOC
TEST EOC
TEST EOC
BIT 0
EOC
BIT 23
EOC
BIT 22
BIT 21
SIG
BIT 20
EXR
BIT 19
MSB
BIT 18
BIT 8
SDO
CH0/CH1
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
SCK
(INTERNAL)
SLEEP
CONVERSION
DATA OUTPUT
SLEEP
DATA OUTPUT
CONVERSION
24212 F10
Figure 10. Internal Serial Clock, Reduced Data Output Length
A similar situation may occur during the sleep state when
CS is pulsed HIGH-LOW-HIGH in order to test the conver-
sionstatus.Ifthedeviceisinthesleepstate(EOC=0),SCK
will go LOW. Once CS goes HIGH (within the time period
defined above as tEOCtest), the internal pull-up is activated.
For a heavy capacitive load on the SCK pin, the internal
pull-up may not be adequate to return SCK to a HIGH level
before CS goes low again. This is not a concern under
normal conditions where CS remains LOW after detecting
EOC = 0. This situation is easily overcome by adding an
external 10k pull-up resistor to the SCK pin.
weak pull-up is active during the POR cycle; therefore, the
internal serial clock timing mode is automatically selected
if SCK is not externally driven LOW (if SCK is loaded such
that the internal pull-up cannot pull the pin HIGH, the ex-
ternal SCK mode will be selected).
During the conversion, the SCK and the serial data output
pin (SDO) are HIGH (EOC = 1). Once the conversion is
complete, SCK and SDO go LOW (EOC = 0) indicating the
conversion has finished and the device has entered the
sleepstate.Thepartremainsinthesleepstateaminimum
amount of time (1/2 the internal SCK period) then imme-
diatelybeginsoutputtingdata.Thedataoutputcyclebegins
on the first rising edge of SCK and ends after the 24th
risingedge. DataisshiftedouttheSDOpinoneachfalling
edge of SCK. The internally generated serial clock is out-
put to the SCK pin. This signal may be used to shift the
conversionresultintoexternalcircuitry.EOCcanbelatched
on the first rising edge of SCK and the last bit of the
conversion result can be latched on the 24th rising edge
of SCK. After the 24th rising edge, SDO goes HIGH
(EOC=1)indicatinganewconversionisinprogress. SCK
remains HIGH during the conversion.
Internal Serial Clock, 2-Wire I/O,
Continuous Conversion
This timing mode uses a 2-wire, all output (SCK and SDO)
interface. Theconversionresultisshiftedoutofthedevice
by an internally generated serial clock (SCK) signal, see
Figure 11. CS may be permanently tied to ground (Pin 6),
simplifying the user interface or isolation barrier.
The internal serial clock mode is selected at the end of the
power-on reset (POR) cycle. The POR cycle is concluded
approximately 0.5ms after VCC exceeds 2.2V. An internal
24212f
19
LTC2421/LTC2422
APPLICATIO S I FOR ATIO
W U U
U
V
CC
2.7V TO 5.5V
V
CC
1µF
= INTERNAL OSC/50Hz REJECTION
1
10
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
V
F
O
10k
CC
LTC2422
2
9
8
7
6
REFERENCE VOLTAGE
ZS + 0.1V TO V
FS
SCK
SDO
CS
SET
SET CC
3
4
5
ANALOG INPUT RANGE
CH1
CH0
ZS
ZS
– 0.12V
TO
SET
FS
REF
+ 0.12V
SET
REF
(V
= FS
SET
– ZS
)
REF
SET
0V TO FS
– 100mV
GND
SET
SET
CS
BIT 23
EOC
BIT 22
BIT 21
SIG
BIT 20
EXR
BIT 19
MSB
BIT 18
BIT 4
BIT 0
LSB
SDO
CH0/CH1
20
SCK
(INTERNAL)
CONVERSION
DATA OUTPUT
CONVERSION
24212 F11
SLEEP
Figure 11. Internal Serial Clock, Continuous Operation
Internal Serial Clock, Autostart Conversion
It should be noticed that the external capacitor discharge
current is kept very small in order to decrease the con-
verterpowerdissipationinthesleepstate. Intheautostart
mode, the analog voltage on the CS pin cannot be
observed without disturbing the converter operation
using a regular oscilloscope probe. When using this con-
figuration, it is important to minimize the external leakage
current at the CS pin by using a low leakage external ca-
pacitor and properly cleaning the PCB surface.
This timing mode is identical to the internal serial clock,
2-wire I/O described above with one additional feature.
Instead of grounding CS, an external timing capacitor is
tied to CS.
While the conversion is in progress, the CS pin is held
HIGH by an internal weak pull-up. Once the conversion is
complete, the device enters the low power sleep state and
an internal 25nA current source begins discharging the
capacitor tied to CS, see Figure 12. The time the converter
spends in the sleep state is determined by the value of the
external timing capacitor, see Figures 13 and 14. Once the
voltageatCSfallsbelowaninternalthreshold(≈1.4V), the
device automatically begins outputting data. The data out-
put cycle begins on the first rising edge of SCK and ends
on the 24th rising edge. Data is shifted out the SDO pin on
each falling edge of SCK. The internally generated serial
clock is output to the SCK pin. This signal may be used to
shift the conversion result into external circuitry. After the
24th rising edge, CS is pulled HIGH and a new conversion
is immediately started. This is useful in applications re-
quiring periodic monitoring and ultralow power. Figure 15
shows the average supply current as a function of capaci-
tance on CS.
The internal serial clock mode is selected every time the
voltage on the CS pin crosses an internal threshold volt-
age. An internal weak pull-up at the SCK pin is active while
CS is discharging; therefore, the internal serial clock tim-
ing mode is automatically selected if SCK is floating. It is
important to ensure there are no external drivers pulling
SCK LOW while CS is discharging.
DIGITAL SIGNAL LEVELS
The LTC2421/LTC2422’s digital interface is easy to use.
Its digital inputs (FO, CS and SCK in External SCK mode of
operation)acceptstandardTTL/CMOSlogiclevelsandthe
internal hysteresis receivers can tolerate edge rates as
slowas100µs.However,someconsiderationsarerequired
24212f
20
LTC2421/LTC2422
W U U
APPLICATIO S I FOR ATIO
U
V
CC
2.7V TO 5.5V
V
CC
1µF
= INTERNAL OSC/50Hz REJECTION
10k
1
10
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
V
F
O
CC
LTC2422
2
9
8
7
6
REFERENCE VOLTAGE
ZS + 0.1V TO V
FS
SCK
SDO
CS
SET
SET
CC
3
4
5
ANALOG INPUT RANGE
CH1
CH0
ZS
ZS
– 0.12V
TO
SET
FS
REF
+ 0.12V
SET
REF
(V
= FS
– ZS
)
REF
SET
SET
C
EXT
0V TO FS
– 100mV
GND
SET
SET
V
CC
CS
GND
BIT 23
EOC
BIT 22
BIT 21
SIG
BIT 0
SDO
Hi-Z
Hi-Z
SCK
(INTERNAL)
CONVERSION
DATA OUTPUT
CONVERSION
SLEEP
2420 F12
Figure 12. Internal Serial Clock, Autostart Operation
300
300
250
7
6
250
V
V
= 5V
= 3V
V
V
= 5V
= 3V
CC
CC
CC
CC
5
4
3
2
1
0
200
150
200
150
100
50
0
100
50
0
V
= 5V
CC
V
= 3V
CC
1
10
100
1000
10000 100000
1
10
100
1000
10000 100000
10
100
100000
1
1000
10000
CAPACITANCE ON CS (pF)
CAPACITANCE ON CS (pF)
CAPACITANCE ON CS (pF)
24212 F15
24212 F15
24212 F13
Figure 13. CS Capacitance vs tSAMPLE
Figure 14. CS Capacitance
vs Output Rate
Figure 15. CS Capacitance
vs Supply Current
to take advantage of exceptional accuracy and low supply
current.
In order to preserve the LTC2421/LTC2422’s accuracy, it
is very important to minimize the ground path impedance
whichmayappearinserieswiththeinputand/orreference
signal and to reduce the current which may flow through
this path. The GND pin should be connected to a low
24212f
The digital output signals (SDO and SCK in Internal SCK
modeofoperation)arelessofaconcernbecausetheyare
not generally active during the conversion state.
21
LTC2421/LTC2422
W U U
U
APPLICATIO S I FOR ATIO
resistance ground plane through a minimum length trace.
The use of multiple via holes is recommended to further
reduce the connection resistance.
Parallel termination near the LTC2421/LTC2422 pin will
eliminate this problem but will increase the driver power
dissipation.Aseriesresistorbetween27Ωand56Ωplaced
near the driver or near the LTC2421/LTC2422 pin will also
eliminate this problem without additional power dissipa-
tion. The actual resistor value depends upon the trace
impedance and connection topology.
In an alternative configuration, the GND pin of the con-
verter can be the single-point-ground in a single point
grounding system. The input signal ground, the reference
signal ground, the digital drivers ground (usually the digi-
tal ground) and the power supply ground (the analog
ground) should be connected in a star configuration with
the common point located as close to the GND pin as
possible.
Driving the Input and Reference
The analog input and reference of the typical delta-sigma
analog-to-digital converter are applied to a switched ca-
pacitornetwork.Thisnetworkconsistsofcapacitorsswitch-
ingbetweentheanaloginput(VIN),ZSSET(Pin5)andFSSET
(Pin 2). The result is small current spikes seen at both VIN
and VREF. A simplified input equivalent circuit is shown in
Figure 16.
The power supply current during the conversion state
should be kept to a minimum. This is achieved by restrict-
ing the number of digital signal transitions occurring dur-
ing this period.
While a digital input signal is in the range 0.5V to
(VCC – 0.5V), the CMOS input receiver draws additional
current from the power supply. It should be noted that,
when any one of the digital input signals (FO, CS and SCK
inExternalSCKmodeofoperation)iswithinthisrange,the
LTC2421/LTC2422 power supply current may increase
even if the signal in question is at a valid logic level. For
micropower operation and in order to minimize the poten-
tialerrorsduetoadditionalgroundpincurrent,itisrecom-
mendedtodrivealldigitalinputsignalstofullCMOSlevels
[VIL < 0.4V and VOH > (VCC – 0.4V)].
The key to understanding the effects of this dynamic input
current is based on a simple first order RC time constant
model. Using the internal oscillator, the LTC2421/
LTC2422’s internal switched capacitor network is clocked
at 153,600Hz corresponding to a 6.5µs sampling period.
Fourteentimeconstantsarerequiredeachtimeacapacitor
is switched in order to achieve 1ppm settling accuracy.
Therefore, the equivalent time constant at VIN and VREF
should be less than 6.5µs/14 = 460ns in order to achieve
1ppm accuracy.
Severe ground pin current disturbances can also occur
due to the undershoot of fast digital input signals. Under-
shoot and overshoot can occur because of the imped-
ance mismatch at the converter pin when the transition
time of an external control signal is less than twice the
propagation delay from the driver to LTC2421/LTC2422.
For reference, on a regular FR-4 board, signal propaga-
tion velocity is approximately 183ps/inch for internal
traces and 170ps/inch for surface traces. Thus, a driver
generating a control signal with a minimum transition
timeof1nsmustbeconnectedtotheconverterpinthrough
a trace shorter than 2.5 inches. This problem becomes
particularly difficult when shared control lines are used
and multiple reflections may occur. The solution is to
carefully terminate all transmission lines close to their
characteristic impedance.
V
CC
R
SW
5k
I
I
REF(LEAK)
REF(LEAK)
V
REF
V
CC
I
IN
IN
AVERAGE INPUT CURRENT:
= 0.25(V – 0.5 • V )fC
REF EQ
R
SW
5k
I
I
I
IN
IN(LEAK)
IN(LEAK)
IN
V
C
EQ
1pF (TYP)
R
SW
5k
24212 F16
GND
SWITCHING FREQUENCY
f = 153.6kHz FOR INTERNAL OSCILLATOR (f = LOGIC LOW OR HIGH)
f = f
O
FOR EXTERNAL OSCILLATORS
EOSC
Figure 16. LTC2421/LTC2422 Equivalent Analog Input Circuit
24212f
22
LTC2421/LTC2422
W U U
APPLICATIO S I FOR ATIO
U
Input Current (VIN)
If the total capacitance at VIN (see Figure 18) is small
(<0.01µF), relatively large external source resistances (up
to 80k for 20pF parasitic capacitance) can be tolerated
withoutanyoffset/full-scaleerror. Figures19and20show
a family of offset and full-scale error curves for various
small valued input capacitors (CIN < 0.01µF) as a function
of input source resistance.
If complete settling occurs on the input, conversion re-
sultswillbeuneffectedbythedynamicinputcurrent. Ifthe
settling is incomplete, it does not degrade the linearity
performance of the device. It simply results in an offset/
full-scale shift, see Figure 17. To simplify the analysis of
input dynamic current, two separate cases are assumed:
large capacitance at VIN (CIN > 0.01µF) and small capaci-
tance at VIN (CIN < 0.01µF).
For large input capacitor values (CIN > 0.01µF), the input
spikes are averaged by the capacitor into a DC current. The
gain shift becomes a linear function of input source resis-
tance independent of input capacitance, see Figures 21
and 22. The equivalent input impedance is 16.6MΩ. This
results in ±150nA of input dynamic current at the extreme
values of VIN (VIN = 0V and VIN = VREF, when VREF = 5V).
This corresponds to a 0.3ppm shift in offset and full-scale
readings for every 10Ω of input source resistance.
TUE
35
C
C
C
C
C
C
= 22µF
IN
IN
IN
IN
IN
IN
= 10µF
30
= 1µF
= 0.1µF
= 0.01µF
= 0.001µF
25
20
15
10
5
ZS
SET
FS
SET
V
IN
24212 F17
V
V
V
= 5V
CC
REF
IN
= 5V
= 0V
Figure 17. Offset/Full-Scale Shift
T
= 25°C
A
R
SOURCE
V
IN
INTPUT
LTC2421/
LTC2422
C
PAR
20pF
0
SIGNAL
C
IN
200
400
1000
0
600
800
SOURCE
R
(Ω)
SOURCE
24212 F17
24212 F20
Figure 20. Offset vs RSOURCE (Large C)
Figure 18. An RC Network at VIN
50
40
30
20
10
5
0
V
V
V
T
= 5V
CC
= 5V
REF
= 0V
IN
A
= 25°C
V
V
V
= 5V
CC
–5
= 5V
REF
= 0V
IN
–10
T
= 25°C
A
C
IN
= 1000pF
= 0pF
= 100pF
IN
C
IN
–15
–20
C
C
C
C
C
C
C
= 22µF
IN
IN
IN
IN
IN
IN
C
= 0.01µF
IN
= 10µF
–25
–30
–35
= 1µF
= 0.1µF
= 0.01µF
= 0.001µF
0
1
10
100
1k
10k
100k
200
400
800
0
1000
600
R
(Ω)
SOURCE
R
(Ω)
SOURCE
24212 F19
24212 F21
Figure 21. Full-Scale Error vs RSOURCE (Large C)
Figure 19. Offset vs RSOURCE (Small C)
24212f
23
LTC2421/LTC2422
W U U
U
APPLICATIO S I FOR ATIO
60
10
C
C
C
C
C
C
= 22µF
VREF
VREF
VREF
VREF
VREF
VREF
= 10µF
50
= 1µF
0
= 0.1µF
= 0.01µF
= 0.001µF
40
30
–10
C
IN
= 1000pF
= 0pF
= 100pF
V
V
V
= 5V
IN
CC
REF
IN
= 5V
C
–20
–30
–40
–50
= 5V
C
IN
20
T
= 25°C
A
10
C
= 0.01µF
IN
V
V
V
= 5V
CC
= 5V
REF
0
= 5V
IN
T
= 25°C
A
–10
200
400
1000
0
600
800
(Ω)
1
10
100
R
1k
(Ω)
10k
100k
RESISTANCE AT V
REF
SOURCE
24212 F23
24212 F22
Figure 22. Full-Scale Error vs RSOURCE (Small C)
Figure 23. Full-Scale Error vs RVREF (Large C)
In addition to the input current spikes, the input ESD pro-
tection diodes have a temperature dependent leakage cur-
rent. This leakage current, nominally 1nA (±100nA max),
results in a fixed offset shift of 10µV for a 10k source
resistance.
500
V
V
V
T
= 5V
CC
= 5V
REF
400
= 5V
IN
A
= 25°C
C
= 1000pF
VREF
300
200
100
0
C
= 100pF
VREF
C
= 0.01µF
The effect of input leakage current is evident for CIN = 0 in
Figures 19 and 22. A leakage current of 3nA results in a
150µV (30ppm) error for a 50k source resistance. As
RSOURCE gets larger, the switched capacitor input current
begins to dominate.
VREF
C
= 0pF
VREF
–100
–200
10
100
RESISTANCE AT V
100k
1
1k
10k
(Ω)
Reference Current (VREF
)
REF
24212 F24
Similar to the analog input, the reference input has a dy-
namic input current. This current has negligible effect on
the offset. However, the reference current at VIN = VREF is
similar to the input current at full-scale. For large values of
reference capacitance (CVREF > 0.01µF), the full-scale er-
ror shift is 0.03ppm/Ω of external reference resistance
independent of the capacitance at VREF, see Figure 23. If
the capacitance tied to VREF is small (CVREF < 0.01µF), an
input resistance of up to 80k (20pF parasitic capacitance
at VREF) may be tolerated, see Figure 24.
Figure 24. Full-Scale Error vs RVREF (Small C)
50
V
V
A
= 5V
REF
= 25°C
CC
= 5V
40
T
30
20
C
= 1000pF
VREF
C
= 100pF
VREF
10
C
VREF
= 0.01µF
0
Unlike the analog input, the integral nonlinearity of the
device can be degraded with excessive external RC time
constants tied to the reference input. If the capacitance at
node VREF is small (CVREF < 0.01µF), the reference input
can tolerate large external resistances without reduction
in INL, see Figure 25. If the external capacitance is large
(CVREF > 0.01µF), the linearity will be degraded by
–10
–20
C
VREF
= 0pF
10
100
100k
1
1k
10k
RESISTANCE AT V
(Ω)
REF
24212 F25
Figure 25. INL Error vs RVREF (Small C)
24212f
24
LTC2421/LTC2422
W U U
APPLICATIO S I FOR ATIO
0.015ppm/Ω independent of capacitance at VREF, see
Figure 26.
U
0
–20
–40
Inadditiontothedynamicreferencecurrent, theVREF ESD
protection diodes have a temperature dependent leakage
current.Thisleakagecurrent,nominally1nA(±10nAmax),
results in a fixed full-scale shift of 10µV for a 10k source
resistance.
–60
–80
–100
–120
–140
10
C
VREF
C
VREF
C
VREF
C
VREF
C
VREF
C
VREF
= 22µF
8
6
= 10µF
f /2
S
f
0
S
= 1µF
= 0.1µF
= 0.01µF
= 0.001µF
INPUT FREQUENCY
4
24212 F27
2
Figure 27. Sinc4 Filter Rejection
V
V
A
= 5V
REF
= 25°C
CC
0
= 5V
T
–2
–4
–6
–8
–10
The modulator contained within the LTC2421/LTC2422
can handle large-signal level perturbations without satu-
rating. Signal levels up to 40% of VREF do not saturate the
analog modulator. These signals are limited by the input
ESDprotectionto300mVbelowgroundand300mVabove
VCC.
200
400
1000
0
600
800
(Ω)
RESISTANCE AT V
REF
24212 F26
Figure 26. INL Error vs RVREF (Large C)
Simple Basic Program for Interfacing to the
LTC2421/LTC2422
ANTIALIASING
DTR
V
SCK
SDO
CS
One of the advantages delta-sigma ADCs offer over con-
ventional ADCs is on-chip digital filtering. Combined with
a large oversampling ratio, the LTC2421/LTC2422 signifi-
cantly simplify antialiasing filter requirements.
REF
PC
SERIAL
PORT
CTS
RTS
LTC2421
LTC2422
V
IN
GND
24212 F28
Figure 28
The digital filter provides very high rejection except at
integer multiples of the modulator sampling frequency
(fS), see Figure 27. The modulator sampling frequency is
256 • FO, where FO is the notch frequency (typically 50Hz
or 60Hz). The bandwidth of signals not rejected by the
digital filter is narrow (≈0.2%) compared to the band-
width of the frequencies rejected.
”TINY.BAS V1.0 Copyright (C) 2000 by J. A. Dutra and LTC, All rights reseved'
NOTE this program generates 32 SCK’s for compatibility to 24-bit parts
'For use with most LTC24xy demo boards
designed for the PC Com Port, QBASIC
'Outputs are chan%,signneg%,d2400 (magnitude), PPM, and v (volts)
CLS : ON ERROR GOTO 4970
As a result of the oversampling ratio (256) and the digital
filter, minimal (if any) antialias filtering is required in front
of the LTC2421/LTC2422. If passive RC components are
placed in front of the LTC2421/LTC2422, the input dy-
namic current should be considered (see Input Current
section). In cases where large effective RC time constants
are used, an external buffer amplifier may be required to
minimize the effects of input dynamic current.
cport = 1: REM INPUT "com port number "; cport
GOSUB 1900: timestart$ = TIME$
mcr% = port + 4: msr% = port + 6
COLOR 15: LOCATE 3, 1: PRINT "Hit any key to stop…
FOR np = 1 TO 2000: OUT port, c0%: NEXT np: 'Power Via TxD
DO: '-------------------------START LOOP here--------
";
24212f
25
LTC2421/LTC2422
W U U
U
APPLICATIO S I FOR ATIO
nummeas = nummeas + c1%
LOCATE 5, 21: PRINT "CHANNEL 1": LOCATE 5, 2: PRINT "CHANNEL 0"
FOR n% = port TO port + 7: OUT n%, 0: NEXT n%: ’Init UART regs
CLOSE #1: DEF SEG = 0: RETURN ’--------------------------------------
2000 ’SUB read MSR AND RETURN data dfrm% INTERFACE
LOCATE 2, 2: PRINT "Scan#="; nummeas; " "; DATE$; " "; TIME$;
OUT mcr%, c0%: 'Initialize SCLK=0
k1 = km: d2400 = 0: chan% = c0%: signneg% = c0%
FOR bita% = 31 TO 0 STEP -1: v31 = 1
x3% = INP(msr%) AND c16%: OUT mcr%, c1%
GOSUB 3000: OUT mcr%, c0%
148 GOSUB 2200: v31 = v31 + 1
2040 IF x3% = c16% THEN dfrm% = c1% ELSE dfrm% = c0%
OUT mcr%, c0%: RETURN ’---------------------------------------------
2200 ’SUB READ THE DATA BIT dfrm% does NOT change sclock
x3% = INP(msr%) AND C16%: GOTO 2040: RETURN’----------------
3000 REM delay sub !!!!!!!!!!
150 IF bita% = 31 THEN GOTO 152 ELSE 156
152 IF dfrm% = c0% THEN GOTO 156
155 IF v31 > 2 THEN LOCATE 16, 16: OUT port, c0%: PRINT "waiting for eoc":
IF v31 < 20000 THEN IF dfrm% = c1% THEN GOTO 148
IF dfrm% = 1 THEN LOCATE 17, 16: PRINT "Timed out on EOC,not fatal"
FOR bs = 1 TO 32: ' never got an eoc => clock it 32 times
GOSUB 2000: NEXT bs: GOTO 1800
FOR n8% = 0 TO 1: OUT port, c0%: NEXT n8%: RETURN: ’----------
3700 FOR n = 6 TO 9: LOCATE n, 20
PRINT "
": NEXT n: RETURN’---------------------------
156 LOCATE 16, 16: PRINT"
": GOSUB 2000
3800 ’SUB to convert PPM into Volts and print it
IF bita% = 30 THEN 161 ELSE 171 ' CHANNEL BIT !!!!!!!!!!!!!!!
161 IF dfrm% = c1% THEN chan% = c1%: ch1% = c0%
IF dfrm% = c0% THEN chan% = c0%: ch1% = ch1% + c1%
IF ch1% > c4% THEN GOSUB 3700: ch1% = c1%
v = PPM * (5 / 1000000): v1 = v * 1000000: hz% = (chan% * 20) + 12
IF v <= .1 THEN PRINT v1; " "; : LOCATE rw% + 1, hz%: PRINT "uV "
IF v > .1 THEN PRINT v; " "; : LOCATE rw% + 1, hz%: PRINT "Volts";
RETURN’----------------------------------------------------------------
4970 PRINT "ERROR !!!!!!!!!!!!!!!"
171 IF bita% = 29 THEN IF dfrm% = c0% THEN signneg% = c1%: ' NEG
IF bita% <= 28 THEN d2400 = d2400 + (dfrm% * k1): k1 = k1 / c2%
NEXT bita%: k1 = 1: digin% = c0%: 'MATH BELOW
5000 PRINT : LOCATE 18, 1: PRINT "Ending!!": PRINT "Hit any key to exit."
PRINT "Start ="; timestart$; " End = "; TIME$; " # samples ="; nummeas
1600 PPM = (d2400 / km) * kn: rw% = 6: hz% = (chan% * 20) + 1
IF signneg% = c1% THEN 1700 ELSE 1705
CLOSE #1: END
1700 IF d2400 <> c0% THEN PPM = (PPM - 2000000)
1705 LOCATE rw%, hz%: PRINT PPM; " "; : LOCATE rw%, hz% + 11:
PRINT "PPM";
Single Ended Half-Bridge Digitizer
with Reference and Ground Sensing
Sensorsconvertrealworldphenomena(temperature,pres-
sure, gas levels, etc.) into a voltage. Typically, this voltage
is generated by passing an excitation current through the
sensor. The wires connecting the sensor to the ADC form
parasiticresistorsRP1 andRP2.Theexcitationcurrentalso
flowsthroughparasiticresistorsRP1 andRP2, asshownin
Figure 29. The voltage drop across these parasitic resis-
tors leads to systematic offset and full-scale errors.
LOCATE rw% + 1, (chan% * 20) + 1: GOSUB 3800: 'THIS WORKS!
1800 LOOP WHILE INKEY$ = "": REM Works with "DO"
GOTO 5000 ’rem END!!-------------- Subs follow !!----------------!!!
1900 ’ESSENTIAL INITIALIZATIONS
REM set some constants, since they can be accessed much faster
LET c128% = 128: c64% = 64: c32% = 32: c16% = 16: c8% = 8: c4% = 4
LET c3% = 3: c2% = 2: c1% = 1: c0% = 0: km = (2 ^ 30) - 1: kn = 1000000
Inordertoeliminatetheerrorsassociatedwiththesepara-
sitic resistors, the LTC2421/LTC2422 include a full-scale
set input (FSSET) and a zero-scale set input
(ZSSET). As shown in Figure 30, the FSSET pin acts as a
zero current full-scale sense input. Errors due to parasitic
IF cport = 2 THEN OPEN "COM2:300,N,8,1,CD0,CS0,DS0,OP0,RS" FOR
RANDOM AS #1: port = (&H2F8)
IF cport = 1 THEN OPEN "COM1:300,N,8,1,CD0,CS0,DS0,OP0,RS" FOR
RANDOM AS #1: port = (&H3F8)
24212f
26
LTC2421/LTC2422
W U U
APPLICATIO S I FOR ATIO
U
1
resistance RP1 in series with the half-bridge sensor are
removed by the FSSET input to the ADC. The absolute full-
scale output of the ADC (data out = FFFFFHEX ) will occur
at VIN = VB = FSSET, see Figure 31. Similarly, the offset
errors due to RP2 are removed by the ground sense input
ZSSET. The absolute zero output of the ADC (data out =
00000HEX) occurs at VIN = VA = ZSSET. Parasitic resistors
RP3 to RP5 have negligible errors due to the 1nA (typ)
leakage current at pins FSSET, ZSSET and VIN. The wide
dynamic input range (–300mV to 5.3V) and low noise
(1.2ppm RMS) enable the LTC2421 or the LTC2422 to
directly digitize the output of the bridge sensor.
V
CC
R
I
I
I
0
0
0
P1
DC
LTC2421
SET
2
3
V
FS
V
B
R
P3
P4
P5
9
8
7
SCK
DC
3-WIRE
I
EXCITATION
SDO
CS
IN
SPI INTERFACE
R
DC
5
6
V
A
ZS
SET
R
R
10
P2
GND
F
O
24212 F03
Figure 30. Half-Bridge Digitizer with
Zero-Scale and Full-Scale Sense
The LTC2422 is ideal for applications requiring continu-
ous monitoring of two input sensors. As shown in
Figure 32, the LTC2422 can monitor both a thermocouple
temperature probe and a cold junction temperature sen-
sor. Absolute temperature measurements can be
performed with a variety of thermocouples using digital
cold junction compensation.
12.5%
EXTENDED
RANGE
FFFFF
H
+
–
R
P1
V
FULL-SCALE ERROR
+
–
I
SENSOR
SENSOR OUTPUT
EXCITATION
00000
H
12.5%
UNDER
RANGE
+
ZS
FS
SET
R
V
SET
P2
OFFSET ERROR
–
V
24212 F31
IN
24212 F29
Figure 29. Errors Due to Excitation Currents
Figure 31. Transfer Curve with Zero-Scale and Full-Scale Set
2.7V TO 5.5V
LTC2422
1
2
3
4
5
10
V
F
O
CC
9
8
7
6
12k
FS
SCK
SDO
CS
SET
PROCESSOR
COLD JUNCTION
CH1
CH0
ZS
THERMISTOR
24212 F32
100Ω
GND
SET
+
–
ISOLATION
BARRIER
THERMOCOUPLE
Figure 32. Isolated Temperature Measurement
24212f
27
LTC2421/LTC2422
W U U
U
APPLICATIO S I FOR ATIO
TheselectionbetweenCH0andCH1isautomatic. Initially,
after power-up, a conversion is performed on CH0. For
each subsequent conversion, the input channel selection
is alternated. Embedded within the serial data output is a
status bit indicating which channel corresponds to the
conversion result. If the conversion was performed on
CH0, this bit (Bit 22) is LOW and is HIGH if the conversion
was performed on CH1 (see Figure 33).
conversionresultsmaybedigitallysubtractedyieldingthe
differential result.
The LTC2422’s single ended rejection of line frequencies
(±2%) and harmonics is better than 110dB. Since the
device performs two independent single ended conver-
sions each with >110dB rejection, the overall common
mode and differential rejection is much better than the
80dB rejection typically found in other differential input
delta-sigma converters.
There are no extra control or status pins required to per-
form the alternating 2-channel measurements. The
LTC2422onlyrequirestwodigitalsignals(SCKandSDO).
This simplification is ideal for isolated temperature mea-
surements or systems where minimal control signals are
available.
In addition to excellent rejection of line frequency noise,
the LTC2422 also exhibits excellent single ended noise
rejection over a wide range of frequencies due to its 4th
order sinc filter. Each single ended conversion indepen-
dentlyrejectshighfrequencynoise(>60Hz). Caremustbe
taken to insure noise at frequencies below 15Hz and at
multiples of the ADC sample rate (15,360Hz) are not
present. For this application, it is recommended the
LTC2422 is placed in close proximity to the bridge sensor
in order to reduce the noise injected into the ADC input. By
performingthreesuccessiveconversions(CH0-CH1-CH0),
the drift and low frequency noise can be measured and
compensated for digitally.
Pseudo Differential Applications
Generally, designers choose fully differential topologies
for several reasons. First, the interface to a 4- or 6-wire
bridge is simple (it is a differential output). Second, they
requiregoodrejectionoflinefrequencynoise.Third,they
typically look at a small differential signal sitting on a
large common mode voltage; they need accurate
measurements of the differential signal independent of
the common mode input voltage. Many applications cur-
rently using fully differential analog-to-digital converters
for any of the above reasons may migrate to a pseudo
differential conversion using the LTC2422.
I
EXCITATION
5V
1
I
= 0
DC
V
CC
2
FS
SET
LTC2422
9
SCK
SDO
CS
350Ω
350Ω
350Ω
Direct Connection to a Full Bridge
3
4
8
3-WIRE
SPI INTERFACE
CH1
CH0
The LTC2422 interfaces directly to a 4- or 6-wire bridge,
as shown in Figure 34. The LTC2422 includes a FSSET and
a ZSSET for sensing the excitation voltage directly across
the bridge. This eliminates errors due to excitation cur-
rents flowing through parasitic resistors. The LTC2422
also includes two single ended input channels which can
tie directly to the differential output of the bridge. The two
7
350Ω
10
I
= 0
DC
F
O
5
ZS
SET
GND
6
24212 F32
Figure 34. Pseudo Differential Strain Guage Application
SCK
SDO
• • •
• • •
CH1 DATA OUT
CH0 DATA OUT
24212 F33
EOC
EOC
CH1
CH0
Figure 33. Embedded Selected Channel Indicator
24212f
28
LTC2421/LTC2422
W U U
APPLICATIO S I FOR ATIO
U
Theabsoluteaccuracy(lessthan10ppmtotalerror)ofthe
LTC2422 enables extremely accurate measurement of
small signals sitting on large voltages. Each of the two
pseudo differential measurements performed by the
LTC2422 is absolutely accurate independent of the com-
mon mode voltage output from the bridge. The pseudo
differential result obtained from digitally subtracting the
two single ended conversion results is accurate to within
the noise level of the device (3µVRMS) times the square
rootof2, independentofthecommonmodeinputvoltage.
resistance changes as a function of temperature (100Ω to
400Ωfor0°Cto800°C). Thesameexcitationcurrentflows
back to the ADC ground and generates another voltage
drop across the return leads. In order to get an accurate
measurementofthetemperature,thesevoltagedropsmust
be measured and removed from the conversion result.
Assumingtheresistanceisapproximatelythesameforthe
forward and return paths (R1 = R2), the auxiliary channel
on the LTC2422 can measure this drop. These errors are
then removed with simple digital correction.
Typically, a bridge sensor outputs 2mV/V full scale. With
a 5V excitation, this translates to a full-scale output of
10mV. Divided by the RMS noise of 8.4µV(= 6µV • 1.414),
this circuit yields 1190 counts with no averaging or ampli-
fication. If more counts are required, several conversions
may be averaged (the number of effective counts is in-
creased by a factor of square root of 2 for each doubling
of averages).
TheresultofthefirstconversiononCH0correspondstoan
input voltage of VRTD + R1 • IEXCITATION. The result of the
second conversion (CH1) is –R1 • IEXCITATION. Note, the
LTC2422’s input range is not limited to the supply rails, it
has underrange capabilities. The device’s input range is
–300mV to VREF + 300mV. Adding the two conversion
results together, the voltage drop across the RTD’s leads
are cancelled and the final result is VRTD
.
An RTD Temperature Digitizer
An Isolated, 20-Bit Data Acquisition System
RTDs used in remote temperature measurements often
have long lead lengths between the ADC and RTD sensor.
These long lead lengths lead to voltage drops due to exci-
tation current in the interconnect to the RTD. This voltage
drop can be measured and digitally removed using the
LTC2422 (see Figure 35).
TheLTC1535isusefulforsignalisolation.Figure36shows
afullyisolated,20-bitdifferentialinputA/Dconverterimple-
mented with the LTC1535 and LTC2422. Power on the
isolated side is regulated by an LT1761-5.0 low noise, low
dropout micropower regulator. Its output is suitable for
driving bridge circuits and for ratiometric applications.
The excitation current (typically 200µA) flows from the
ADC through a long lead length to the remote temperature
sensor (RTD). This current is applied to the RTD, whose
During power-up, the LTC2422 becomes active at VCC
2.3V, while the isolated side of the LTC1535 must wait for
VCC2 to reach its undervoltage lockout threshold of 4.2V.
=
5V
1
V
CC
2
4
FS
SET
LTC2422
9
8
7
I
I
= 200µA
= 200µA
SCK
SDO
CS
EXCITATION
25Ω
25Ω
5k
3-WIRE
SPI INTERFACE
CH0
CH1
+
–
R1
EXCITATION
1000pF
3
P
t
V
RTD
100Ω
10
I
DC
= 0
F
O
5k
5
ZS
SET
R2
0.1µF
GND
6
24212 F35
Figure 35. RTD Remote Temperature Measurement
24212f
29
LTC2421/LTC2422
W U U
U
APPLICATIO S I FOR ATIO
from the time power is applied to VCC1 until the LT1761’s
output has reached 5V, is approximately 1ms.
Below 4.2V, the LTC1535’s driver outputs Y and Z are in a
high impedance state, allowing the 1kΩ pull-down to de-
fine the logic state at SCK. When the LTC2422 first be-
comes active, it samples SCK; a logic “0” provided by the
1kΩ pull-down invokes the external serial clock mode. In
this mode, the LTC2422 is controlled by a single clock line
from the nonisolated side of the barrier, through the
LTC1535’sdriveroutputY.Theentirepower-upsequence,
DatareturnstothenonisolatedsidethroughtheLTC1535’s
receiver at RO. An internal divider on receiver input B sets
a logic threshold of approximately 3.4V at input A, facili-
tating communications with the LTC2422’s SDO output
without the need for any external components.
1/2 BAT54C
LT1761-5
IN
OUT
+
10µF
10µF
16V
SHDN BYP
GND
+
10µF
10V
TANT
TANT
T1
1µF
2
10µF
CERAMIC
1/2 BAT54C
LTC1535
+
10µF
10V
TANT
2
2
LTC2422
ST1 ST2
V
CC2
“SDO”
RO
RE
DE
DI
A
B
Y
Z
F
O
V
CC
SCK FS
SET
“SCK”
V
SDO
CS
CH1
CH0
CC1
G1 G2
1k
LOGIC 5V
GND ZS
SET
+
10µF
10V
TANT
= LOGIC COMMON
1
2
2
1
1
2
24212 F36
= FLOATING COMMON
ISOLATION
BARRIER
1
2
T1 = COILTRONICS CTX02-14659
OR SIEMENS B78304-A1477-A3
Figure 36. Complete, Isolated 20-Bit Data Acquisition System
24212f
30
LTC2421/LTC2422
U W
U
PACKAGE I FOR ATIO
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
0.889 ± 0.127
(.035 ± .005)
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
0.497 ± 0.076
(.0196 ± .003)
REF
0.50
3.05 ± 0.38
(.0120 ± .0015)
TYP
(.0197)
10 9
8
7 6
BSC
RECOMMENDED SOLDER PAD LAYOUT
3.00 ± 0.102
(.118 ± .004)
NOTE 4
4.88 ± 0.10
(.192 ± .004)
DETAIL “A”
0.254
(.010)
0° – 6° TYP
GAUGE PLANE
1
2
3
4 5
0.53 ± 0.01
(.021 ± .006)
0.86
(.034)
REF
1.10
(.043)
MAX
DETAIL “A”
0.18
(.007)
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
0.13 ± 0.05
(.005 ± .002)
0.50
(.0197)
TYP
MSOP (MS) 1001
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
24212f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection ofits circuits as described herein willnotinfringe on existing patentrights.
31
LTC2421/LTC2422
U
TYPICAL APPLICATIO
convert either the thermal couple output or the thermistor
cold junction output. After each conversion, the devices
enter their sleep state and wait for the SCK signal before
clocking out data and beginning the next conversion.
Figure 37 shows the block diagram of a demo circuit
(contact LTC for a demonstration) of a multichannel
isolated temperature measurement system. This circuit
decodes an address to select which LTC2422 receives a
24-bit burst of SCK signal. All devices independently
D1
RE
R0
V
CC
FS
SET
LTC1535
LTC1535
LTC1535
A
Y
SDO
LTC2422
SCK
CH1
CH0
ZS
SET
SCK
HC138
D1
RE
R0
V
CC
FS
SET
A
Y
SDO
LTC2422
+
2500V
–
SCK
CH1
CH0
ZS
SET
D1
RE
R0
V
CC
FS
SET
HC138
A
Y
SDO
LTC2422
SCK
CH1
CH0
SD0
ZS
SET
SEE FIGURE 34 FOR
THE COMPLETE CIRCUIT
HC595
ADDRESS
LATCH
24212 F37
D
IN
(ADDRESS
OR COUNTER)
Figure 37. Mulitchannel Isolated Temperature Measurement System
RELATED PARTS
PART NUMBER
LT1019
DESCRIPTION
Precision Bandgap Reference, 2.5V, 5V
COMMENTS
3ppm/°C Drift, 0.05% Max
LTC1050
Precision Chopper Stabilized Op Amp
Precision Bandgap Reference, 5V
8-Channel Multiplexer
No External Components 5µV Offset, 1.6µV Noise
P-P
LT1236A-5
LTC1391
0.05% Max, 5ppm/°C Drift
Low R : 45Ω, Low Charge Injection Serial Interface
ON
LT1461-2.5
LTC1535
Precision Micropower Voltage Reference
Isolated RS485 Transceiver
50µA Supply Current, 3ppm/°C Drift
2500V
Isolation
RMS
LTC2400
24-Bit, No Latency ∆Σ ADC in SO-8
4ppm INL, 10ppm Total Unadjusted Error, 200µA
LTC2401/LTC2402 1-/2-Channel, 24-Bit, No Latency ∆Σ ADC in MSOP
LTC2404/LTC2408 4-/8-Channel, 24-Bit, No Latency ∆Σ ADC
0.6ppm Noise, 4ppm INL, Pin Compatible with the LTC2421/LTC2422
4ppm INL, 10ppm Total Unadjusted Error, 200µA
LTC2413
LTC2415
LTC2420
24-Bit, No Latency ∆Σ ADC
Simultaneous 50Hz and 60Hz Rejection, 0.16ppm Noise
15Hz Output Rate at 60Hz Rejection, Pin Conpatible with the LTC2410
1.2ppm Noise, 8ppm INL, Pin Compatible with LTC2400
1.2ppm Noise, 8ppm INL, Pin Compatible with LTC2404/LTC2408
0.16ppm Noise, 2ppm INL, 10ppm Total Unadjusted Error, 200µA
0.29ppm Noise, 4ppm INL, 10ppm Total Unadjusted Error, 200µA
24-Bit, Fully Differential, No Latency ∆Σ ADC
20-Bit, No Latency ∆Σ ADC in SO-8
LTC2424/LTC2428 4-/8-Channel, 20-Bit, No Latency ∆Σ ADC
LTC2430
LTC2431
20-Bit, Fully Differential, No Latency ∆Σ ADC in SSOP-16
24-Bit, Fully Differential, No Latency ∆Σ ADC in MS10
24212f
LT/TP 0202 2K • PRINTED IN USA
LinearTechnology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
32
●
●
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
LINEAR TECHNOLOGY CORPORATION 2002
相关型号:
LTW-006DCG-100
Package in 12mm tape on 7 diameter reels Compatible with automatic placement equipment
LITEON
LTW-006DCG-120
Package in 12mm tape on 7 diameter reels Compatible with automatic placement equipment
LITEON
LTW-006DCG-30
Package in 12mm tape on 7 diameter reels Compatible with automatic placement equipment
LITEON
LTW-006DCG-5
Package in 12mm tape on 7 diameter reels Compatible with automatic placement equipment
LITEON
©2020 ICPDF网 联系我们和版权申明