4-1734598-5 [MACOM]
Wire To Board Serial, Pitch 1.25mm; 线对板系列，节距1.25毫米
| 型号： | 4-1734598-5 |
| 厂家： | 
Tyco Electronics |
| 描述： | Wire To Board Serial, Pitch 1.25mm |
| 文件： | 总4页 (文件大小：153K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Product
Specification
108-57273
05-JAN-2011 Rev. C
Wire To Board Serial, Pitch 1.25mm
1.
SCOPE
1.1. CONTENTS
This specification covers the performance, tests and quality requirements for the Wire To Board Serial
connector.
1.2. QUALIFICATION
When tests are performed on the subject product line, the procedures specified in AMP 109 series
specifications shall be used. All inspections shall be performed using the applicable inspection plan
and product drawing.
2.
APPLICABLE DOCUMENT
The following AMP documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and the referenced documents,
this specification shall take precedence.
2.1 AMP DOCUMENTS
A.
B.
109-1: General Requirements for Test Specifications
109 series: Test Specification as indicated in Figure 1 (Comply with MIL-STD-202, MIL-STD-1344
and EIA RS-364)
C.
D.
Corporate Bulletin 401-76: Cross-reference between AMP test Specifications and Military or
Commercial Documents.
501-57299: Test Report.
3.
REQUIREMENTS
3.1. DESIGN AND CONSTRUCTION
Product shall be of the design, construction and physical dimensions specified on the applicable product
drawing.
3.2. MATERIALS
A. Contact
Material: Copper Alloy.
Finish: Tin-Lead or Matte-Tin over Nickel plated.
B. Housing
Material: Thermoplastic, natural color.
3.3. RATINGS
A.
B.
Voltage: 100 VAC rms.
Current: 1 A for AWG#28
DR
DATE APVD
DATE
Angus Wu
11-NOV-2005 Wei-Jer Ke
11-NOV-2005
©2010 Tyco Electronics Corporation
Taipei, Taiwan
All International Rights Reserved.
* Trademark
│ Indicates change
For latest revision, visit our website at www.tycoelectronics.com\documents.
1 of 4
LOC DW
For Regional Customer Service, visit our website at www.tycoelectronics.com
108-57273
C.
Temperature: -25 °C to 85°C
3.4. PERFOMANCE AND TEST DESCRIPTION
The product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1 unless otherwise specified. All tests are performed at ambient environmental
conditions per AMP Specification 109-1
3.5. TEST REQUIREMENTS AND PROCEDURES SUMMARY
Test Item
Requirement
Procedure
Meets requirements of product
drawing. No physical damage.
Examination of Product
Visual inspection
1
2
Electrical Requirement
Subject mated contacts assembled in
housing to 20mV Max open circuit at
10mA Max.
Termination Resistance
Insulation Resistance
20 m: Max
Impressed voltage 500 VDC
Test between adjacent circuits and
contact
1000 M: Min. (Initial)
100 M: Min. (Finial)
3
4
No creeping discharge nor
flashover shall occur.
Current leakage: 0.5 mA MAX
500 VAC for 1minute
Test between adjacent circuits and
contact
Dielectric withstanding
Voltage
Contact series-wired, apply test current
of loaded rating current to the circuit,
and measure the temperature rising by
probing on soldered areas of contacts,
after the temperature becomes
30C° Max. under loaded rating
current
Temperature Rising
5
stabilized deduct ambient temperature
from the measured value.
Mechanical Requirement
1 kgf/pin Max.
Operation Speed: 10 mm/min.
Measure the force required to mate
connector
Connector Mating Force
6
7
Operation Speed: 10 mm/min.
Measure the force required to unmate
connector
Connector Unmating Force 0.1 kgf/pin Min.
Operation Speed: 10 cycle/min.
No. of Cycles: 25 Cycles
Durability
See note.
8
Figure 1 (cont.)
Rev
C
2 of 4
108-57273
Test Item
Vibration
Requirement
Procedure
Mechanical Requirement
Subject mated connectors to 10-55-10
No electrical discontinuity greater Hz traversed in 1 minute at 1.52mm
than 1 microsecond shall occur. amplitude 2 Hours each of 3 mutually
9
See note.
perpendicular planes, passing DC 1mA
current during the test.
Accelerate Velocity: 490m/s2 50G
Waveform: Half-sine shock plus
No electrical discontinuity greater Duration: 11msec
10
Physical Shock
than 1 microsecond shall occur. No. of Drops : 3 drops each to normal
See note.
and reversed directions of X,Y and Z
axes, totally 18 drops, passing DC 1mA
current during the test.
Environmental Requirements
Temperature Life
(Heat Aging)
Mated Connector
85C°, 250 hours
Mated Connector
-55+/-3C° (30 minutes),
11
12
See note.
Thermal Shock
See note.
+85+/-2C° (30 minutes)
Making this a cycle, repeat 5 cycles
Mated Connector
13 Humidity-Temperature Cycle See note.
25 – 65C°, 95% R.H., 10 cycles
(See Figure 2)
Subject mated connectors to 35+/-2C°
and 5+/-1% salt condition for 48 hours.
After test, rinse the sample with water
and recondition the room temperature
for 1 hour.
14
Salt Spray
See note.
Steam Aging Preconditioning:
93°C +3/-5°C, 8 hours ±15 min.
Reflow Temperature: 230 - 245°C
Reflow Time: 50 - 70 s.
JESD22-B102D, Condition C
Moisture Soak Preconditioning:
85°C and 85% RH. for 168 hours.
Preheat Temp.: 150 – 200°C, 60 – 180 s.
Time over liquidus (217°C): 60 – 150 s.
Peak Temp.: 260 +0/-5°C, 20 – 40 s.
Duration: 3 cycles.
The inspected area of each lead
must have 95% solder coverage
minimum.
Solderability
15
16
Resistance to Reflow
Soldering Heat
See note.
Tyco spec. 109-201, Condition B
NOTE Shall meet visual requirements, show no physical damage, and meet requirements of additional tests
as specified in the Product Qualification and Rrequalification Test Sequence shown in Figure 2.
Figure 1 (end)
Rev
C
3 of 4
108-57273
Humidity-Temperature Cycle
Temperature reduced 25°C to –10°C within 10 minutes. Humidity uncontrolled at a temperature less than
25°C.
Figure 2
3.6. PRODUCT QUALIFICATION AND REQUALIFICATION TEST
Test Group
Test Examination
A
B
C
D
E
F
G
H
I
J
Test Sequence (a)
Examination of Product
Termination Resistance
Insulation Resistance
Dielectric withstanding
Voltage
1, 7 1, 9 1, 6 1, 5 1, 5 1, 5 1, 5 1, 3 1, 3 1, 3
2, 8 2, 5 2, 4 2, 4 2, 4 2, 4
2, 5
3, 6
Temperature Rising
Connector Mating Force
Connector Unmating Force
Durability
2
3, 7
4, 6
5
Vibration
3
Physical Shock
4
Temperature Life
Thermal Shock
3
3
Humidity Temperature
Cycling
4
3
Salt Spray
3
Solderability
2
Resistance to Reflow
Soldering Heat
2
Note: (a) Numbers indicate sequence in which tests are performed.
Figure 3
Rev
C
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