MMD-3580L [MARKIMICROWAVE]
GaAs MMIC Millimeter Wave Doubler;
| 型号： | MMD-3580L |
| 厂家： | 
Marki |
| 描述： | GaAs MMIC Millimeter Wave Doubler |
| 文件： | 总10页 (文件大小：496K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
GaAs MMIC Millimeter Wave Doubler
1. Device Overview
MMD-3580L
1.1 General Description
Die
The MMD-3580L is a MMIC millimeter wave doubler fabricated
with GaAs Schottky diodes. This operates over a guaranteed
17.5 to 40 GHz input frequency range or a doubled output
frequency range of 35 to 80 GHz. The die version, MMD-
3580LCH, is capable of operating beyond 80GHz. Both the wire
bondable die and connectorized units are available. The MMD-
3567L is a bandlimited version of this doubler.
Module
1.2 Features
1.3 Applications
▪ High fundamental rejection
▪ Millimeter wave output
frequencies
▪ High frequency synthesis
▪ LO signal chain
▪ Low +7 dBm minimum input drive
1.4 Functional Block Diagram
1.5 Part Ordering Options1
Part
Number
Product
Lifecycle
Export
Classification
Description
Package Green Status
MMD-3580LCH
Wire bondable die
CH
U
Active
EAR99
EAR99
RoHS
Connectorized
module; 1.0 mm
connector output
MMD-3580LU-
KW
Active
1
Refer to our website for a list of definitions for terminology presented in this table.
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MMD-3580L
3.3 Recommended Operating Conditions . 4
3.4 Sequencing Requirements ............... 4
3.5 Electrical Specifications .................. 5
3.6 Typical Performance Plots ............... 6
4. Die Mounting Recommendations ......... 8
Table of Contents
1. Device Overview ............................... 1
1.1 General Description........................ 1
1.2 Features ....................................... 1
1.3 Applications................................... 1
1.4 Functional Block Diagram ................ 1
1.5 Part Ordering Options..................... 1
2. Port Configurations and Functions ...... 3
2.1 Port Diagram................................. 3
2.2 Port Functions............................... 3
3. Specifications ................................... 4
3.1 Absolute Maximum Ratings.............. 4
3.2 Package Information ....................... 4
Revision History
4.1 Mounting and Bonding
Recommendations ................................ 8
4.2 Handling Precautions ...................... 8
4.3 Bonding Diagram............................ 9
5. Mechanical Data............................. 10
5.1 CH Package Outline Drawing ......... 10
5.3 U-KW Package Outline Drawing...... 10
Revision Code
Comment
Datasheet Initial Release
Updated output return loss
Revision Date
January 2018
February 2019
-
A
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MMD-3580L
2. Port Configurations and Functions
2.1 Port Diagram
A top-down view of the MMD-3580L’s CH package outline drawing is shown below. The
MMD-3580L should only be used in the forward direction, with the input and output
ports given in Port Functions.
2.2 Port Functions
Equivalent Circuit
Port
Function
Description
for Package
Port 1 is DC open for the CH and U
package.
Port 1
Input
Port 2 is DC open for the CH and U
package.
Port 2
GND
Output
Ground
CH package ground path is provided
through the substrate and ground bond
pads. U package ground provided through
metal housing and outer coax conductor.
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MMD-3580L
3. Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the
device. If these limits are exceeded, the device may be inoperable or have a reduced
lifetime.
Parameter
Maximum Rating
Units
Port 1 DC Current
Port 2 DC Current
NA
NA
mA
mA
dBm
°C
Power Handling, at any Port
Operating Temperature
Storage Temperature
+23
-55 to +100
-65 to +125
ºC
3.2 Package Information
Parameter
Details
Rating
ESD
Human Body Model (HBM), per MIL-STD-750, Method 1020
U Package
1A
Weight
10 g
3.3 Recommended Operating Conditions
The Recommended Operating Conditions indicate the limits, inside which the device should
be operated, to guarantee the performance given in Electrical Specifications Operating
outside these limits may not necessarily cause damage to the device, but the
performance may degrade outside the limits of the electrical specifications. For limits,
above which damage may occur, see Absolute Maximum Ratings.
Min Nominal
Max
Units
TA, Ambient Temperature
Input Power
-55
+7
+25
+100
+11
°C
dBm
3.4 Sequencing Requirements
There is no requirement to apply power to the ports in a specific order. However, it is
recommended to provide a 50Ω termination to each port before applying power. This is a
passive diode doubler that requires no DC bias.
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MMD-3580L
3.5 Electrical Specifications
The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is
for the connectorized U package doubler used in the forward direction with a +8 dBm
sine wave input.
Min and Max limits apply only to our connectorized units and are guaranteed at TA=+25°C. RF testing of our die is performed on a sample
basis to verify conformance to datasheet guaranteed specifications.
Parameter
Test Conditions
Min Typical Max Units
Input (Port 1) Frequency Range
17.5
40
GHz
dBm
dB
Output (Port 2) Frequency
Range
35
80
Input Power
+7
+11
15
Input = 17.5 - 33.5 GHz
Output = 35 - 67 GHz
Input = 33.5 - 40 GHz
Output = 67 - 80 GHz
Input = 17.5 - 40 GHz
Output = 17.5 - 40 GHz
Input = 17.5 – 22.3 GHz
Output = 52.5 - 67 GHz
Input = 15 – 16.8 GHz
Output = 60 - 67 GHz
Input = 17.5 - 40 GHz
Output = 17.5 - 40 GHz
Input = 17.5 – 22.3 GHz
Output = 52.5 - 67 GHz
Input = 15 – 16.8 GHz
Output = 60 - 67 GHz
11
12
2F Conversion Loss (CL)
38
1F
3F
4F
1F
3F
4F
Suppression2,3
Isolations4
44
dBc
dB
21
47.7
54.4
31
2
Suppressions and isolations measured with an input source with >70dBc (relative to fundamental
input) harmonic suppression
Suppression is defined as the harmonic power relative to the 2F doubled output power
3
4 Isolation is defined as the harmonic power relative to the 1F fundamental input power.
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MMD-3580L
3.6 Typical Performance Plots
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MMD-3580L
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MMD-3580L
4. Die Mounting Recommendations
4.1 Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The
ground plane electrical impedance should be as low as practically possible. This will
prevent resonances and permit the best possible electrical performance. Datasheet
performance is only guaranteed in an environment with a low electrical impedance ground.
Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the
mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip.
Cure epoxy according to manufacturer instructions.
Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire.
Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding
force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be
started on the chip and terminated on the package or substrate. All bonds should be as
short as possible <0.31 mm (12 mils).
Circuit Considerations – 50 Ω transmission lines should be used for all high frequency
connections in and out of the chip. Wirebonds should be kept as short as possible, with
multiple wirebonds recommended for higher frequency connections to reduce parasitic
inductance. In circumstances where the chip more than .001” thinner than the
substrate, a heat spreading spacer tab is optional to further reduce bondwire length and
parasitic inductance.
4.2 Handling Precautions
General Handling
Chips should be handled with care using tweezers or a vacuum collet. Users should take
precautions to protect chips from direct human contact that can deposit contaminants,
like perspiration and skin oils on any of the chip's surfaces.
Static Sensitivity
GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and
transported only in static protected environments.
Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or
expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are
opened, chips should be stored in a dry nitrogen atmosphere.
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MMD-3580L
4.3 Bonding Diagram
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MMD-3580L
5. Mechanical Data
5.1 CH Package Outline Drawing
1. CH Substrate material is 0.004 in thick GaAs.
2. I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au.
5.3 U-KW Package Outline Drawing
Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.
Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any
particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any
product.
© Marki Microwave, Inc.
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