MMIQ-1865SCH-2 [MARKIMICROWAVE]
Passive GaAs MMIC IQ Mixer;型号: | MMIQ-1865SCH-2 |
厂家: | Marki |
描述: | Passive GaAs MMIC IQ Mixer |
文件: | 总19页 (文件大小:1479K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Passive GaAs MMIC IQ Mixer
1. Device Overview
MMIQ-1865S
1.1
General Description
The MMIQ-1865S is a high linearity, passive MMIC IQ mixer. This is an
ultra-broadband mixer spanning 18 to 65 GHz on the RF and LO ports
with an IF from DC to 23 GHz. Up to 35 dB of image rejection is
available due to the excellent phase and amplitude balance of its on-chip
LO quadrature hybrid. Both wire bondable die and connectorized
modules are available. For a list of recommended LO driver amps for all
mixers and IQ mixers, see here.
Die
Module
1.2 Electrical Summary
1.3 Applications
▪ Single Side Band & Image Rejection
Mixing
Parameter
Typical
Unit
RF/LO Frequency Range
IF Frequency Range
I+Q Conversion Loss
Image Rejection
18 - 65
DC - 23
9
GHz
GHz
dB
▪ IQ Modulation/Demodulation
▪ Vector Amplitude Modulation
▪ Band Shifting
35
dB
LO-RF Isolation
50
dB
1.4 Functional Block Diagram
R
L
I
Q
Q
1.5 Part Ordering Options1
Part
Green
Status
Product
Lifecycle
Export
Classification
Description
Number
Package
CH
Wire bondable die
RoHS
Active
EAR99
MMIQ-1865SCH-2
MMIQ-1865SUB
Connectorized module
UB
RoHS
Active
EAR99
1
Refer to our website for a list of definitions for terminology presented in this table.
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MMIQ-1865S
4. Application Information .................... 11
4.1 Detailed Description ..................... 11
4.2 Down-Converter........................... 12
4.3 Up-Converter............................... 13
4.4 Band Shifter ................................ 15
4.5 Vector Modulator......................... 16
5. Die Mounting Recommendations ....... 17
Table of Contents
1. Device Overview ............................... 1
1.1
General Description.................... 1
1.2 Electrical Summary......................... 1
1.3 Applications................................... 1
1.4 Functional Block Diagram ................ 1
1.5 Part Ordering Options..................... 1
2. Port Configurations and Functions ...... 3
2.1 Port Diagram................................. 3
2.2 Port Functions............................... 3
3. Specifications ................................... 4
3.1 Absolute Maximum Ratings.............. 4
3.2 Package Information ....................... 4
3.3 Recommended Operating Conditions . 4
3.4 Sequencing Requirements ............... 4
3.5 Electrical Specifications .................. 5
3.6 Typical Performance Plots ............... 6
5.1 Mounting and Bonding
Recommendations .............................. 17
5.2 Handling Precautions .................... 17
5.3 Bonding Diagram.......................... 18
6. Mechanical Data............................. 19
6.1 CH Package Outline Drawing ......... 19
6.2 UB Package Outline Drawing ......... 19
Revision History
Revision Code
Comment
Revision Date
-
October 2019
Datasheet Initial Release
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MMIQ-1865S
2. Port Configurations and Functions
2.1 Port Diagram
A top-down view of the MMIQ-1865S’s UB package outline drawing is shown below. The mixer
may be operated as either a downconverter or an upconverter. Use of the RF or IF as the input or
output port will depend on the application.
2.2 Port Functions
Port
Function
Description
Equivalent Circuit
Port 1 is DC open and AC matched to
50Ω over the specified LO frequency
range.
Port 1
LO Input
Port 2 is diode coupled and AC matched
to 50Ω over the specified Q port
frequency range.
Port 2
Port 3
Port 4
GND
Q Input / Output
I Input / Output
RF Input/Output
Ground
Port 3 is diode coupled and AC matched
to 50Ω over the specified I port
frequency range.
Port 4 is DC open and AC matched to
50Ω over the specified RF frequency
range.
UB package ground path is provided
through the metal housing and outer coax
conductor.
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MMIQ-1865S
3. Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If
these limits are exceeded, the device may be inoperable or have a reduced lifetime.
Parameter
Maximum Rating
Units
Port 2 DC Current
Port 3 DC Current
23
23
mA
mA
dBm
°C
Power Handling, at any Port
Operating Temperature
Storage Temperature
+30
-55 to +100
-65 to +125
ºC
3.2 Package Information
Parameter
Details
Rating
ESD
Human Body Model (HBM), per MIL-STD-750, Method 1020
UB package
1A
Weight
17 g
3.3 Recommended Operating Conditions
The Recommended Operating Conditions indicate the limits, inside which the device should be
operated, to guarantee the performance given in Electrical Specifications. Operating outside these
limits may not necessarily cause damage to the device, but the performance may degrade outside
the limits of the electrical specifications. For limits, above which damage may occur, see Absolute
Maximum Ratings.
Min Nominal Max
Units
TA, Ambient Temperature
LO drive power
-55
+25
+25
+100
+27
°C
+23
dBm
dBm
RF/IF input power
+19
3.4 Sequencing Requirements
There is no requirement to apply power to the ports in a specific order. However, it is
recommended to provide a 50Ω termination to each port before applying power. This is a passive
diode mixer that requires no DC bias.
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MMIQ-1865S
3.5 Electrical Specifications
The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is for a down
conversion application with a +21dBm sine wave LO input.
Min and Max limits apply only to our connectorized units and are guaranteed at TA=+25°C. All bare die are 100% DC tested and visually
inspected.
Parameter
Test Conditions
Min
Typical
Max Units
RF (Port 4) Frequency Range
18
65
LO (Port 1) Frequency Range
I (Port 3) Frequency Range
Q (Port 2) Frequency Range
18
0
65
GHz
23
0
23
RF/LO = 18 - 65 GHz
I = DC – 0.2 GHz
RF/LO = 18 - 65 GHz
I = 0.2 - 23 GHz
RF/LO = 18 - 65 GHz
Q = DC -0.2 GHz
RF/LO = 18 - 65 GHz
Q = 0.2 - 23 GHz
RF/LO = 18 - 65 GHz
I = DC – 0.2 GHz
RF/LO = 18 - 65 GHz
Q = DC – 0.2 GHz
RF/LO = 18 - 65 GHz
I+Q = DC – 0.2 GHz
12
13
12
13
12
13
35
Conversion Loss (CL)2
dB
Noise Figure (NF)3
dB
Image Rejection (IR)4
dBc
LO to RF
RF/LO = 18-65 GHz
IF/LO = 18-65 GHz
IF/LO = 18-65 GHz
RF/IF = 18-65 GHz
RF/IF = 18-65 GHz
50
45
33
53
53
LO to I
LO to Q
RF to I
dB
Isolation
RF to Q
RF/LO = 18 - 65 GHz
I = DC – 0.2 GHz
Input IP3 (IIP3)5
I+Q
27
dBm
dBm
Input 1 dB Gain
Compression
Point (P1dB)
I
19
19
Q
2
Measured as an I/Q down converter. (i.e., I and Q powers are not combined)
Mixer Noise Figure typically measures within 0.5 dB of conversion loss for IF frequencies greater
3
than 5 MHz.
4
Image Rejection and Single sideband performance plots are defined by the upper sideband (USB)
or lower sideband (LSB) with respect to the LO signal. Plots are defined by which sideband is
selected by the external IF quadrature hybrid.
5
Typical IIP3 measured with I and Q ports combined with an external quadrature hybrid coupler.
Vector Modulator measured with +30mA DC current applied to the I and Q ports.
Measured as I/Q mixer (not IR/SSB mixer). SSB/IR mixers experience additional spurious
6
7
suppressions.
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MMIQ-1865S
3.6 Typical Performance Plots6
Due to limited available LO power, all performance plots are measured with a +21dBm
LO drive and in most cases bandlimited to 45 GHz. Data is not representative of the
performance of a properly operated unit. Linear performance at high frequency and high
LO power is similar to MMIQ-1865H. See MMIQ-1865H datasheet for expected linear
performance.
6
I output means that the IF output signal is measured at the I port of the mixer and the Q port is
loaded. Q output means the IF output signal is measured at the Q port of the mixer while the I
port is loaded.
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MMIQ-1865S
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MMIQ-1865S
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MMIQ-1865S
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MMIQ-1865S
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MMIQ-1865S
4. Application Information
4.1 Detailed Description
MMIQ-1865 belongs to Marki Microwave’s MMIQ family of mixers. The MMIQ product line
consists of passive GaAs MMIC mixers designed and fabricated with GaAs Schottky diodes.
MMIQ mixers offer excellent amplitude and phase balance from the due to its on-chip LO
quadrature hybrid. Up to 35dB of image rejection (i.e., single sideband suppression) can be
obtained by using the MMIQ-1865 as an image rejection or single sideband mixer. The MMIQ-
1865L and MMIQ-1865H are the sister mixers of the MMIQ-1865S. The MMIQ-1865L and
MMIQ-1865H both require a lower LO drive to operate the mixer. In exchange, both display lower
linearity (i.e., lower IIP3, P1dB, Spurious Suppression) than the MMIQ-1865S. Marki S, H, and L
diodes correspond to different diode forward turn on voltages.
Support for the K, through V bands are offered by the ultra-broadband performance of the mixer’s
RF and LO ports (ports 1 and 4). Direct baseband to V band frequency conversions are available
by using this mixer as an up-converter. Traditional use of this mixer to do image reject or single
sideband mixing is available with an external IF quadrature hybrid. The MMIQ-1865 is also suitable
for use as a Vector Modulator through DC bias of the I and Q ports (ports 2 and 3).
Port 1, the LO port, and port 4, the RF port, support an 18-65GHz signal. Ports 2 and 3, the I
and Q ports, support a DC-23GHz signal. A signal may be input into any port of the mixer which
supports that signal’s frequency. This is the basis of using the mixer as a band shifter.
For a given LO power within the recommended operating range, the RF (in the case of a down
conversion) or IF (in the case of an up conversion) input power should be below the input 1dB
compression point to avoid signal distortion. The input 1dB compression point will vary across the
mixer’s operating bandwidth and with LO input power. Careful characterization is required for
optimal performance for each application. There is no minimum small signal input power required
for operation. Excessive RF/IF input power increases non-desired spurious output power and
degrades the fundamental conversion loss. Excessive LO input power can also cause this effect.
The table below describes how to use an IQ mixer and quad hybrid to select a single sideband.
Up Conversion
Hybrid Port
Mixer Port
Sideband Selected
Lower Sideband
0
I
Q
I
Q
90
90
0
Upper Sideband
Down Conversion
Hybrid Port
Mixer Port
Sideband Selected
Upper Sideband
0
I
Q
I
90
90
0
Lower Sideband
Q
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MMIQ-1865S
4.2 Down-Converter
A down converter is a mixer application which takes a high frequency small signal RF input, and a
high frequency large signal LO input and mixes the signals together to produce a low frequency IF
output. The fundamental 1RFx1LO outputs present at the IF port are the fLO-RF and fLO+RF tones.
The desired output in a down conversion is typically the fLO-RF term. An image frequency at
fImage=f2LO-RF will also down convert to the fLO-RF frequency. The above illustration shows the relative
location of the image frequency for a highside LO, or the frequency plan for which fLO > fRF.
To use the IQ mixer as a down converter, input a high frequency small signal RF input into port 4,
a high frequency large signal LO input into port 1, and pull the low frequency IF output from ports
2 and 3. Ports 2 and 3 will output the IF signals I and Q. I and Q IF outputs will be at the same
frequency but 90° out of phase (i.e., I and Q are in quadrature). If only a single IF output is
desired, terminate either the I or Q ports with a wideband 50Ω load.
This is the input scheme was used to take I/Q down-conversion data found in the Typical
Performance Plots section.
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4.2.1 Image Reject Down-Converter
MMIQ-1865S
An image reject mixer is a mixer which rejects the down converted image frequency from the IF
output. Image reject mixers are constructed using an external quadrature hybrid attached to the I
and Q (i.e., IF) output ports. Using the external IF quadrature hybrid, one can select whether the
upper sideband or lower sideband signal is suppressed with respect to the LO signal.
To use the IQ mixer as an image reject mixer, input the high frequency small signal RF into port 4
and a high frequency large signal LO input into port 1. Take the combined I+Q down converted
signal through the IF quadrature hybrid. Select the upper sideband (i.e., suppress the lower
sideband) by connecting the I port to the 0° port of the IF quadrature hybrid and attach the Q port
to the 90° port of the IF quadrature hybrid. Select the lower sideband (i.e., suppress the upper
sideband) by attaching the I port to the 90° port of the IF quadrature hybrid and attach the Q port
to the 0° port of the IF quadrature hybrid.
This is the input scheme was used to take image rejection down-conversion data found in the
Typical Performance Plots section.
4.3 Up-Converter
An up converter is a mixer application which takes a low frequency small signal IF input, and a high
frequency large signal LO input and mixes the signal together to produce a high frequency RF
output. The fundamental 1IFx1LO outputs present at the RF port are the fLO-IF and fLO+RF tones.
An up conversion can select either the fLO-IF or the fLO+IF tones. The above illustration shows both
up converted sidebands with either an I or Q port input signal.
To use the IQ mixer as an up converter, input a low frequency small signal IF input into port 2 or
3, a high frequency large signal LO input into port 1, and pull the high frequency RF output from
port 4. Input into the Q port will result in a up converted signal that is 90° out of phase with the
up converted I port input signal. If only a single IF input is desired, terminate either the I or Q
ports with a wideband 50Ω load.
This is the input scheme used to take I/Q up-conversion data found in section 3.6 Typical
Performance.
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4.3.1 Single Sideband Up-Converter
MMIQ-1865S
A single sideband mixer is a mixer which suppresses the up converted image frequency from the
RF output. Single sideband mixers are constructed using an external quadrature hybrid attached
to the I and Q (i.e., IF) input ports. Using an external IF quadrature hybrid, one can select whether
the upper sideband or the lower sideband signal is suppressed with respect to the LO signal.
To use the IQ mixer as a single sideband mixer, input the low frequency small signal I+Q IF signal
into the IF quadrature hybrid. The IF quadrature hybrid is attached to the I and Q ports of the IQ
mixer. Input the high frequency large signal LO input into port 1 and take the up converted high
frequency RF signal from port 4. Select the upper sideband (i.e., suppress the lower sideband) by
attaching the I port to the 90° port of the IF quadrature hybrid and attach the Q port to the 0°
port of the IF quadrature hybrid. Select the lower sideband (i.e., suppress the upper sideband) by
attaching the I port to the 0° port of the IF quadrature hybrid and attach the Q port to the 90°
port of the IF quadrature hybrid.
This is the input scheme used to take single sideband up-conversion data found in section 3.6
Typical Performance.
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MMIQ-1865S
4.4 Band Shifter
A band shifter is an unusual application for a mixer. Band shifters take an IF signal and shift it to a
different band, generally to either avoid interference or for rebroadcast at a different frequency.
For cases in which the desired band shift cannot be employed by using a standard up or down
conversion scheme, an exotic input scheme is required.
A passive diode mixer is reciprocal on all ports. Port 4, the RF port, supports a 18-65GHz signal.
Port 1, the LO port, supports a 18-65GHz signal. Ports 2 and 3, the IF ports, support a DC-
23GHz signal. 2 signals input into any combination of the 3 ports, RF, LO, or IF, will result in an
output signal at the 3rd port. In addition, an output signal will be present at both input ports. By
using the IF port, as a large signal input port, low frequency LO applications can be supported.
The diagram above shows an IQ mixer being used as a band shifter. Using an IQ mixer as a band
shifter allows for sideband suppression. This is identical to using the IQ mixer as a single sideband
up converter. However, the large signal input port is now 2+3 versus port 1. Selection of the
output tone is done through the orientation of the LO quadrature hybrid.
To use the mixer as a single sideband band shifter, input a low frequency large signal LO into the
external LO quadrature hybrid. Input the high frequency small signal IF signal into port 1 and take
the high frequency RF output from port 4. Select the upper sideband (i.e., suppress the lower
sideband) by attaching the I port to the 90° port of the IF quadrature hybrid and attach the Q port
to the 0° port of the LO quadrature hybrid. Select the lower sideband (i.e., suppress the upper
sideband) by attaching the I port to the 0° port of the LO quadrature hybrid and attach the Q port
to the 90° port of the LO quadrature hybrid.
Using this input scheme requires careful accounting of which input signal is injecting which port.
Injecting a signal into any port which does not support the correct band will lead to a degraded or
no output response. Abide by the maximum DC current input into the I and Q ports of the mixer or
otherwise irreversible damage to the mixer will occur.
The limiting factor in use of the mixer as an image reject band shifter is in the bandwidth of the
external LO quadrature hybrid and bandwidth of the I and Q ports.
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MMIQ-1865S
4.5 Vector Modulator
A vector modulator is a device that can modulate an input signal’s amplitude and phase. Similar to
using a double balanced mixer as a phase modulator or phase shifter, an IQ mixer can be used as a
vector modulator. An IQ mixer can be used as a vector modulator by inputting DC current into
both the I and Q ports.
Injecting DC current into both the I and Q ports forward biases both mixer cores and causes them
to be shorted. This connects the RF and LO baluns allowing the input signal to pass from balun to
balun without a frequency conversion. Modulating the DC current into either or both I and Q
mixers causes both the phase and amplitude to modulate based on the polarity of the input current
and the magnitude of the input current. Modulating only the I or Q mixers causes the device to
behave as a biphase modulator (i.e., the device can only swing the phase from +90° to -90°).
To use the IQ mixer as a vector modulator, supply a DC current sufficient to turn on the mixer
through both the I and Q ports. Current limiting the DC source to the maximum DC current value
found in section 3.1 Absolute Maximum Ratings is recommended to prevent irreversible damage to
the vector modulator. The typical DC current required to turn on the vector modulator is <30mA.
It is recommended to sequence the vector modulator by slowly increasing the DC bias until the
vector modulator is operating at the user desired condition.
Near the band edges of the vector modulator, more current than is typical for mid-band operation
may be necessary to achieve the same amplitude and phase shift. This is due to the on chip LO
quadrature hybrid operating near its band edge.
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MMIQ-1865S
5. Die Mounting Recommendations
5.1 Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground
plane electrical impedance should be as low as practically possible. This will prevent resonances
and permit the best possible electrical performance. Datasheet performance is only guaranteed in
an environment with a low electrical impedance ground.
Mounting
To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a
thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to
manufacturer instructions.
Wire Bonding
Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with
a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge
bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to
achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the
package or substrate. All bonds should be as short as possible <0.31 mm (12 mils).
Circuit Considerations
50 Ω transmission lines should be used for all high frequency connections in and out of the chip.
Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher
frequency connections to reduce parasitic inductance. In circumstances where the chip more than
.001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce
bondwire length and parasitic inductance.
5.2 Handling Precautions
General Handling
Chips should be handled with care using tweezers or a vacuum collet. Users should take
precautions to protect chips from direct human contact that can deposit contaminants, like
perspiration and skin oils on any of the chip's surfaces.
Static Sensitivity
GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and
transported only in static protected environments.
Cleaning and Storage
Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid.
Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry
nitrogen atmosphere.
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MMIQ-1865S
5.3 Bonding Diagram
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MMIQ-1865S
6. Mechanical Data
6.1 CH Package Outline Drawing
1. CH Substrate material is 0.004 in thick GaAs.
2. I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au
6.2 UB Package Outline Drawing
Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice.
Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any
particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any
product.
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