MT4118A-HRSB-A [MARKTECH]
5.0mm ROUND LED LAMP; 5.0毫米圆形LED灯
| 型号： | MT4118A-HRSB-A |
| 厂家： | 
MARKTECH CORPORATE |
| 描述： | 5.0mm ROUND LED LAMP |
| 文件： | 总6页 (文件大小：132K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
3Northway Lane North Latham,New York 12110.
Tollfree:1.800.984.5337
Phone:1.518.956.2980
Fax:1.518.785.4725
Http://www.marktechopto.com
SPECIFICATION
PART NO. : MT4118A-HRSB-A
5.0mm ROUND LED LAMP
ATTENTION
OBSERVE PRECAUTION
FOR HANDLING
ELECTRO STATIC
SENSITIVE
DEVICES
5.0mm ROUND LED LAMP
MT4118A-HRSB-A
Description
This Hi-Effect red lamp is made with GaAsP/GaP chip and red diffused
epoxy resin.
1.2
K
A
Notes:
1. All dimensions are in mm.
2. Tolerance is ± 0.25mm unless otherwise noted.
Description
LED Chip
Part No.
Lens Color
Material
Emitting Color
Hi-Effect Red
MT4118A-HRSB-A
GaAsP/GaP
Red diffused
VER.: 01 Date: 2007/10/18 Page: 1/5
5.0mm ROUND LED LAMP
MT4118A-HRSB-A
Absolute Maximum Ratings at Ta=25℃
Parameter
Symbol
PD
Rating
Unit
Power Dissipation
78
5
mW
V
Reverse Voltage
VR
D.C. Forward Current
If
30
mA
μA
mA
℃
Reverse (Leakage) Current
Peak Current(1/10Duty Cycle,0.1ms Pulse Width.)
Operating Temperature Range
Storage Temperature Range
Ir
100
If(Peak)
Topr.
Tstg.
100
-40 to +95
-40 to +100
℃
Dip Soldering : 260℃ for 5 sec.
Hand Soldering : 350℃ for 3 sec.
Soldering Temperature(1.6mm from body)
Tsol
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
If=20mA
If=20mA
If=20mA
If=20mA
Vr=5V
Min.
Typ. Max. Unit
Luminous Intensity
Forward Voltage
IV
Vf
19.0
35.0
2.1
72.8
2.6
mcd
V
Peak Wavelength
λp
642
629
nm
nm
µA
deg
nm
Dominant Wavelength
Reverse (Leakage) Current
Viewing Angle
λd
624
636
100
Ir
2θ1/2
If=20mA
If=20mA
35
35
Spectrum Line Halfwidth
∆λ
Notes:1. The datas tested by IS tester.
2. Customer’s special requirements are also welcome.
VER.: 01 Date: 2007/10/18 Page: 2/5
5.0mm ROUND LED LAMP
MT4118A-HRSB-A
Typical Electrical / Optical Characteristics Curves :
50
40
50
40
30
20
10
30
20
10
0
20.0
Forward Current (mA)
10.0
0.0
30.0
1.2
1.6
2.0
2.4
2.8
3.2
Applied Voltage (V)
FORWARD CURRENT VS. LUMINOUS INTENSITY
FORWARD CURRENT VS.APPLIED VOLTAGE
20°
0°
10°
50
40
30°
40°
30
20
10
1.0
0.9
0.8
50°
60°
70°
80°
90°
0.7
0
20
40
60
80
100
0.5
0.2
0.1
0.3
0.4
0.6
Temperature (℃)
RADIATION DIAGRAM
FORWARD CURRENT VS. AMBIENT TEMPERATURE
VER.: 01 Date: 2007/10/18 Page: 3/5
5.0mm ROUND LED LAMP
MT4118A-HRSB-A
Specifications for Bin Grading:
Iv(mcd)
MIN.
19.0
BIN
F
MAX.
26.6
G
26.6
37.2
H
37.2
52.0
J
52.0
72.8
Specifications for Vf Group:
Vf(V)
MIN.
1.6
Group
V1
MAX.
1.8
V2
1.8
2.0
V3
2.0
2.2
V4
2.2
2.4
V5
2.4
2.6
*Majority VF bins are highlighted in Yellow.
Specifications for Wavelength Group:
λD(nm) @20mA
Group
X3
MIN.
624
627
630
633
MAX.
627
X4
630
X5
633
X6
636
VER.: 01 Date: 2007/10/18 Page: 4/5
5.0mm ROUND LED LAMP
MT4118A-HRSB-A
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1. Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130℃.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1)
Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
(2) Solder dip: Preheat: 90℃ max. (Backside of PCB), Within 60 seconds
Solder bath: 260±5℃ (Solder temperature), Within 5 seconds
(3)
Soldering iron : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120℃ max. Baking time: Within 60 seconds
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
VER.: 01 Date: 2007/10/18 Page: 5/5
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