MT4164S4-HR6-2-A [MARKTECH]
4.8mm ROUND LED LAMP WITH HOLDER; 4.8毫米圆形LED灯带底座
| 型号： | MT4164S4-HR6-2-A |
| 厂家： | 
MARKTECH CORPORATE |
| 描述： | 4.8mm ROUND LED LAMP WITH HOLDER |
| 文件： | 总5页 (文件大小：142K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
3Northway Lane North Latham,New York 12110.
Tollfree:1.800.984.5337
Phone:1.518.956.2980
Fax:1.518.785.4725
Http://www.marktechopto.com
SPECIFICATION
PART NO. : MT4164S4-HR6-2-A
4.8mm ROUND LED LAMP WITH HOLDER
4.8mm ROUND LED LAMP
WITH HOLDER
MT4164S4-HR6-2-A
Package Dimensions
_
12.0 0.5
7.0
4.8
11.3
0.70
4.1
26AWG
142 2
2.70
Notes:
1. All dimensions are in mm.
2. Tolerance is ±0.25mm unless otherwise noted
Description
LED Chip
Part No.
Lens Color
Material
Emitting Color
MT4164S4-HR6-2-A
GaAsP/GaP
Hi-Effect Red
Red Diffused
VER.: 01 Date: 2007/11/10 Page: 1/5
4.8mm ROUND LED LAMP
WITH HOLDER
MT4164S4-HR6-2-A
Absolute Maximum Ratings at Ta=25 ℃
Parameter
Symbol
Rating
Unit
Power Dissipation
PD
78
mW
Reverse Voltage
VR
If
5
V
D.C. Forward Current
30
mA
mA
Peak Current(1/10Duty duty,0.1ms Pulse Width.)
If(Peak)
100
℃
℃
Operating Temperature Range
Storage Temperature Range
Topr.
Tstg.
-25 to +85
-40 to +100
Dip Soldering: 260℃ for 5sec.
Hand Soldering: 350℃ for 3 sec.
Soldering Temperature(1.6mm from body)
Tsol
Electrical and Optical Characteristics:
Parameter
Symbol
Condition
Min.
Typ. Max. Unit
Luminous Intensity
IV
If=20mA
If=20mA
24.0
40.0
2.1
mcd
V
Forward Voltage
Vf
2.6
Peak Wavelength
Dominant Wavelength
Reverse Current
λp
λd
Ir
If=20mA
If=20mA
Vr=5V
642
629
nm
nm
µA
100
2θ1/2
Viewing Angle
If=20mA
If=20mA
38
35
deg
nm
Spectrum Line Halfwidth
∆λ
Note:The datas come from the SPEC. of LT6441R-81.
VER.: 01 Date: 2007/11/10 Page: 2/5
4.8mm ROUND LED LAMP
WITH HOLDER
MT4164S4-HR6-2-A
Typical Electrical/Optical Characteristic Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
50
50
40
40
30
20
10
30
20
10
0
20.0
Forward Current (mA)
10.0
0.0
30.0
1.2
1.6
2.0
2.4
2.8
3.2
Applied Voltage (V)
FORWARD CURRENT VS. LUMINOUS INTENSITY
FORWARD CURRENT VS.APPLIED VOLTAGE
20°
0° 10°
50
40
30°
40°
30
20
10
1.0
0.9
0.8
50°
60°
70°
80°
90°
0
20
40
60
80
100
0.7
Temperature(。C)
0.5
0.2
0.4
0.1
0.3
0.6
FORWARD CURRENT VS. AMBIENT TEMPERATURE
RADIATION DIAGRAM
VER.: 01 Date: 2007/11/10 Page: 3/5
4.8mm ROUND LED LAMP
WITH HOLDER
MT4164S4-HR6-2-A
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED
1. Temperature in use
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with
high light transparency is used; therefore, additives to improve the heat resistance or moisture
resistance (silica gel , etc) which are used for semiconductor products such as transistors
cannot be added to the resin.
Consequently, the heat resistant ability of the resin used for LED is usually low; therefore,
please be careful on the following during use.
Avoid applying external force, stress, and excessive vibration to the resins and terminals at
high temperature. The glass transition temperature of epoxy resin used for the LED is
approximately 120-130℃.
At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or
more compared to that at normal temperature and the resin is softened.
If external force or stress is applied at that time, it may cause a wire rupture.
2. Soldering
Please be careful on the following at soldering.
After soldering, avoided applying external force, stress, and excessive vibration until the
products go to cooling process (normal temperature), <Same for products with terminal leads>
(1)
Soldering measurements:
Distance between melted solder side to bottom of resin shall be 1.6mm or longer.
Dip Soldering:
(2)
Pre-heat: 90℃ max. (Backside of PCB), Within 60 seconds.
Solder bath: 260±5℃ (Solder temperature), Within 5 seconds.
(3) Hand Soldering : 350℃ max. (Temperature of soldering iron tip), Within 3 seconds
3. Insertion
Pitch of the LED leads and pitch of mounting holes need to be same
4. Others
Since the heat resistant ability of the LED resin is low, SMD components are used on the same
PCB, please mount the LED after adhesive baking process for SMD components. In case
adhesive baking is done after LED lamp insertion due to a production process reason, make
sure not to apply external force, stress, and excessive vibration to the LED and follow the
conditions below.
Baking temperature: 120℃ max. Baking time: Within 60 seconds
If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down
the LED to normal temperature.
VER.: 01 Date: 2007/11/10 Page: 4/5
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