TB62777FG [MARKTECH]
8-Channel Constant-Current LED Driver;
| 型号： | TB62777FG |
| 厂家： | 
MARKTECH CORPORATE |
| 描述： | 8-Channel Constant-Current LED Driver 驱动 信息通信管理 光电二极管 接口集成电路 |
| 文件： | 总20页 (文件大小：338K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB62777FNG/FG
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB62777FNG, TB62777FG
8-Channel Constant-Current LED Driver of the 3.3-V and 5-V Power Supply Voltage
Operation
The TB62777FNG/FG is comprised of constant-current drivers
designed for LEDs and LED panel displays.
The regulated current sources are designed to provide a
constant current, which is adjustable through one external
resistor.
TB62777FNG
The TB62777FNG/FG incorporates eight channels of shift
registers, latches, AND gates and constant-current outputs.
Fabricated using the Bi-CMOS process, the TB62777FNG/FG is
capable of high-speed data transfers.
The TB62777FNG/FG is RoHS.
TB62777FG
Features
•
•
•
•
Power supply voltages: V
= 3.3 V/5 V
DD
Output drive capability and output count: 50 mA × 8 channels
Constant-current output range: 5 to 40 mA
Voltage applied to constant-current output terminals: 0.4 V
(min, I
= 5 to 40 mA)
OUT
•
•
•
•
Designed for common-anode LEDs
Thermal shutdown (TSD)（min: 150℃）
Power on reset (POR)
Logical input signal voltage level: 3.3-V and 5-V CMOS
interfaces (Schmitt trigger input)
Weight: SSOP16-P-225-0.65B 0.07 g (typ.)
SSOP16-P-225-1.00A 0.14 g
(typ.)
•
•
•
•
•
Maximum output voltage: 25V
Serial data transfer rate: 25 MHz (max) @cascade connection
Operating temperature range: T
= −40 to 85°C
opr
Package: SSOP16-P-225-0.65B/ SSOP16-P-225-1.00A
Constant-current accuracy
Current accuracy
Between Channels
Current Accuracy
Between ICs
Output Voltage
0.4 V to 4 V
Output Current
15 mA
±3%
±6%
1
2010-03-08
TB62777FNG/FG
Pin Assignment (top view)
GND
SERIAL-IN
CLOCK
LATCH
OUT0
VDD
R-EXT
SERIAL-OUT
ENABLE
OUT7
OUT1
OUT6
OUT2
OUT5
OUT3
OUT4
Block Diagram
OUT0
OUT1
OUT7
R-EXT
I-REG
TSD
VDD
POR
ENABLE
LATCH
Q
R
Q
R
Q
R
GND
ST
D
ST
D
ST
D
D0
Q0
Q1
8-bit shift register
D0 to D7
Q7
SERIAL-IN
CLOCK
R
SERIAL-OUT
D
Q
R
CK
Truth Table
CLOCK
LATCH
ENABLE
SERIAL-IN
OUT0 … OUT5 … OUT7
SERIAL-OUT
H
L
L
L
Dn
Dn … Dn − 5 … Dn − 7
No change
No change
No change
No change
Dn －4
Dn + 1
Dn + 2
Dn + 3
Dn + 3
No Change
H
X
X
L
Dn + 2 … Dn − 3 … Dn − 5
H
H
OFF
OFF
Note 1: OUT0 to OUT7 = On when Dn = H; OUT0 to OUT7 = Off when Dn = L.
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2010-03-08
TB62777FNG/FG
Timing Diagram
n = 0
1
2
3
4
5
6
7
H
L
CLOCK
H
SERIAL-IN
LATCH
L
H
L
H
ENABLE
L
ON
OUT0
OUT1
OFF
ON
OFF
ON
OUT2
OFF
ON
OUT7
OFF
H
SERIAL-OUT
Data applied when n = 0
L
Note 1: Latches are level-sensitive, not edge-triggered.
Note 2: The TB62777FNG can be used at 3.3 V or 5.0 V. However, the V
voltage.
supply voltage must be equal to the input
DD
Note 3: Serial data is shifted out of SERIAL-OUT on the falling edge of CLOCK.
Marks: The latches hold data while the LATCH terminal is held Low. When the LATCH terminal is High, the
latches do not hold data and pass it transparently. When the ENABLE terminal is Low, OUT0 to OUT7
toggle between ON and OFF according to the data. When the ENABLE terminal is High, OUT0 to
OUT7 are forced OFF.
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TB62777FNG/FG
Terminal Description
Pin No.
Pin Name
Function
1
2
GND
SERIAL-IN
CLOCK
LATCH
OUT0
GND terminal
Serial data input terminal
Serial clock input terminal
Latch input terminal
3
4
5
Constant-current output terminal (Open collector)
Constant-current output terminal (Open collector)
Constant-current output terminal (Open collector)
Constant-current output terminal (Open collector)
Constant-current output terminal (Open collector)
Constant-current output terminal (Open collector)
Constant-current output terminal (Open collector)
Constant-current output terminal (Open collector)
Output enable input terminal
6
OUT1
OUT2
7
8
OUT3
9
OUT4
10
11
12
OUT5
OUT6
OUT7
13
ENABLE
All outputs ( OUT0 to OUT7 ) are disabled when the ENABLE terminal is driven High, and
enabled when it is driven Low.
14
15
16
SERIAL-OUT Serial data output terminal. Serial data is clocked out on the falling edge of CLOCK.
An external resistor is connected between this terminal and ground. OUT0 to OUT7 are adjusted
to the same current value.
R-EXT
V
Power supply terminal
DD
Equivalent Circuits for Inputs and Outputs
SERIAL-OUT Terminal
ENABLE
LATCH
，
CLOCK, SERIAL-IN ，
Terminals
V
V
DD
DD
CLOCK
SERIAL-IN
SERIAL-OUT
ENABLE
LATCH
GND
GND
OUT0 to OUT7 Constant-current
Output Terminals
OUT0 ~ OUT7
GND
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TB62777FNG/FG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Supply voltage
Symbol
Rating
6.0
Unit
V
V
V
DD
Input voltage
V
−0.3 to V
+ 0.3 (Note 1)
DD
IN
Output current
I
55
−0.3 to 25
mA/ch
V
OUT
Output voltage
V
OUT
Power dissipation
P
1.19(FG TYPE) / 1.02(FNG TYPE) (Notes 2 and 3)
W
°C/W
°C
d
Thermal resistance
Operating temperature range
Storage temperature range
Maximum junction temperature
R
105(FG TYPE) / 122(FNG TYPE) (Note 2)
th (j-a)
T
opr
−40 to 85
−55 to 150
150
T
stg
°C
T
°C
j
Note 1: However, do not exceed 6.0 V.
Note 2: When mounted on a PCB (76.2 × 114.3 × 1.6 mm; Cu = 30%; 35-μm-thick; SEMI-compliant)
Note 3: Power dissipation is reduced by 1/R for each °C above 25°C ambient.
th (j-a)
Operating Ranges (unless otherwise specified, Ta = −40°C to 85°C)
Characteristics
Supply voltage
Symbol
Test Condition
Min
Typ.
Max
Unit
V
⎯
3
0.4
5
⎯
⎯
⎯
⎯
⎯
5.5
4
V
V
DD
Output voltage
V
OUT0 to OUT7
OUT
OUT
I
OUT0 to OUT7
SERIAL-OUT
40
−5
5
mA/ch
Output current
I
⎯
OH
mA
V
I
SERIAL-OUT
⎯
OL
0.7 ×
V
⎯
⎯
V
IH
DD
V
SERIAL-IN/CLOCK/
LATCH / ENABLE
DD
Input voltage
0.3 ×
V
GND
IL
V
DD
Clock frequency
f
Cascade connection
⎯
20
20
2
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
25
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
5
MHz
ns
CLK
LATCH pulse width
CLOCK pulse width
t
(Note 2)
(Note 2)
(Note 2)
(Note 2)
wLAT
wCLK
t
I
≥ 20 mA
OUT
t
μs
ns
μs
ENABLE pulse width
Setup time
wENA
5 mA ≤ I
≤ 20 mA
3
OUT
t
t
5
SETUP1
SETUP2
5
(Note 2)
t
t
5
HOLD1
HOLD2
Hold time
5
Maximum clock rise time
Maximum clock fall time
t
r
⎯
⎯
Single operation
(Notes 1 and 2)
t
f
5
Note 1: For cascade operation, the CLOCK waveform might become ambiguous, causing the t and t values to be
r
f
large. Then it may not be possible to meet the timing requirement for data transfer. Please consider the
timing carefully.
Note 2: Please see the timing waveform on page 9.
5
2010-03-08
TB62777FNG/FG
Electrical Characteristics (Unless otherwise specified, Ta = 25°C, V = 4.5 to 5.5 V)
DD
Test
Circuit
Characteristics
Output current
Symbol
Test Condition
Min
―
Typ.
15
Max
―
Unit
mA
％
V
V
= 0.4 V, R-EXT = 1.2 kΩ
= 5 V,
OUT
DD
I
5
5
OUT1
V
= 0.4 V, R-EXT = 1.2 kΩ
OUT
Output current error between ICs
ΔI
ΔI
―
±3
±6
OUT1
OUT2
All channels ON V
= 5 V,
DD
V
= 0.4 V, R-EXT = 1.2 kΩ
OUT
All channels ON V
Output current error between channels
Output leakage current
5
5
⎯
±1
±3
%
= 5 V
DD
I
V
= 25 V
OUT
⎯
⎯
1
μA
OZ
SERIAL-IN/CLOCK/ LATCH /
ENABLE
0.7 ×
DD
V
⎯
⎯
2
⎯
⎯
―
V
IH
DD
V
Input voltage
Input current
V
SERIAL-IN/CLOCK/ LATCH /
ENABLE
0.3 ×
V
V
GND
IL
DD
1
V
= V
CLOCK/SERIAL-IN
DD
IN
/ LATCH / ENABLE
I
―
IH
μA
V
= GND
IN
CLOCK/SERIAL-IN/ LATCH /
I
3
―
―
−1
IL
ENABLE
V
1
1
I
I
= 5.0 mA, V
= 5 V
⎯
⎯
⎯
0.3
OL
OL
DD
SERIAL-OUT output voltage
V
V
= −5.0 mA, V
= 5 V
4.7
⎯
OH
OH
DD
= 3 V to 5.5 V
Changes in constant output current
%/V
5
4
4
V
⎯
⎯
⎯
1
2
1
5
%
DD
DD
dependent on V
DD
I
I
R-EXT = OPEN, V
= 25.0 V
OUT
⎯
⎯
DD (OFF) 1
DD (OFF) 2
R-EXT = 1.2 kΩ, V
All channels OFF
= 25.0 V,
OUT
Supply current
mA
R-EXT = 1.2 kΩ, V
All channels ON
= 0.4 V,
OUT
I
4
⎯
⎯
9
DD (ON)
Switching Characteristics (Unless otherwise specified, Ta = 25°C, VDD = 4.5 to 5.5V)
Test
Characteristics
Symbol
Test Condition (Note 1) Min
Typ.
Max
Unit
Circuit
6
CLK- OUTn , LATCH = “H”,
t
t
t
⎯
⎯
20
300
pLH1
pLH2
pLH3
ENABLE = “L”
LATCH − OUTn ,
ENABLE = “L”
6
20
300
ENABLE − OUTn ,
LATCH = “H”
6
6
6
⎯
2
20
10
30
300
14
t
CLK-SERIAL OUT
pLH
Propagation delay time
CLK- OUTn , LATCH = “H”,
ENABLE = “L”
t
⎯
340
pHL1
pHL2
pHL3
ns
LATCH − OUTn ,
ENABLE = “L”
t
t
6
6
⎯
⎯
70
70
340
340
ENABLE − OUTn ,
LATCH = “H”
t
6
6
CLK-SERIAL OUT
2
10
20
14
pHL
10% to 90% points of OUT0
to OUT7 voltage waveforms
Output rise time
Output fall time
t
―
150
or
90% to 10% points of OUT0
to OUT7 voltage waveforms
t
of
6
―
125.
300
Note 1: T
= 25°C, V
= V = 5 V, V = 0 V, R
= 1.2 kΩ, I
= 15 mA, V = 5.0 V,
OUT L
opr
DD
IH
IL
EXT
C = 10.5 pF (see test circuit 6.)
L
6
2010-03-08
TB62777FNG/FG
Electrical Characteristics (Unless otherwise specified, Ta = 25°C, V = 3 to 3.6 V)
DD
Test
Circuit
Characteristics
Output current
Symbol
Test Condition
Min
―
Typ.
15
Max
―
Unit
mA
%
V
V
= 0.4 V, R-EXT = 1.2 kΩ
= 3.3 V
OUT
DD
I
5
5
OUT1
V
= 0.4 V, R-EXT = 1.2 kΩ
OUT
Output current error between ICs
ΔI
―
±3
±6
OUT1
All channels ON
V
DD
= 3.3 V
V
= 0.4 V, R-EXT = 1.2 kΩ
OUT
All channels ON
Output current error between channels
Output leakage current
ΔI
⎯
±1
±3
%
5
5
OUT2
V
= 3.3 V
DD
I
V
= 25 V
OUT
⎯
⎯
1
μA
OZ
SERIAL-IN/CLOCK/ LATCH /
ENABLE
0.7 ×
DD
V
⎯
⎯
V
⎯
⎯
IH
DD
V
Input voltage
V
SERIAL-IN/CLOCK/ LATCH /
ENABLE
0.3 ×
V
V
GND
IL
DD
V
= VDD
IN
CLOCK/SERIAL-IN/ LATCH /
I
―
―
―
1
2
3
IH
ENABLE
Input current
μA
V
= GND
IN
CLOCK/SERIAL-IN/ LATCH /
I
―
−1
IL
ENABLE
V
I
I
= 5.0 mA, V
= 3.3 V
= 3.3 V
⎯
⎯
⎯
0.3
1
1
OL
OL
DD
SERIAL-OUT output voltage
V
V
= −5.0 mA, V
3.0
⎯
OH
OH
DD
= 3 V to 5.5 V
Changes in constant output current
dependent on VDD
%/V
DD
V
⎯
⎯
⎯
1
2
1
5
%
5
4
4
DD
I
I
R-EXT = OPEN, V
= 25.0 V
OUT
⎯
⎯
DD (OFF) 1
DD (OFF) 2
R-EXT = 1.2 kΩ, V
All channels OFF
= 25.0 V,
OUT
Supply current
mA
R-EXT = 1.2 kΩ, V
All channels ON
= 0.4 V,
OUT
I
⎯
⎯
9
4
DD (ON)
Switching Characteristics (Unless otherwise specified, Ta = 25°C, V = 3 to 3.6 V)
DD
Test
Circuit
Characteristics
Symbol
Test Condition (Note 1) Min
Typ.
Max
Unit
CLK- OUTn , LATCH = “H”,
t
⎯
⎯
300
6
pLH1
ENABLE = “L”
LATCH - OUTn ,
⎯
t
⎯
300
6
pLH2
ENABLE = “L”
ENABLE - OUTn ,
⎯
t
⎯
⎯
⎯
300
14
6
6
6
pLH3
LATCH = “H”
t
CLK-SERIAL OUT
2
pLH
Propagation delay time
CLK- OUTn , LATCH = “H”,
ENABLE = “L”
t
⎯
340
pHL1
ns
LATCH - OUTn ,
t
⎯
⎯
⎯
⎯
340
340
6
6
pHL2
ENABLE = “L”
ENABLE - OUTn ,
t
pHL3
LATCH = “H”
t
CLK-SERIAL OUT
2
⎯
⎯
14
6
6
pHL
10% to 90% points of OUT0
to OUT7 voltage waveforms
Output rise time
Output fall time
t
⎯
150
or
90% to 10% points of OUT0
to OUT7 voltage waveforms
t
of
⎯
⎯
300
6
Note 1: T
= 25°C, V
= V = 3.3 V, V = 0 V, R
= 1.2 kΩ, I = 15 mA, V = 5.0 V,
OUT L
opr
DD
IH
IL
EXT
C = 10.5 pF (see test circuit 6.)
L
7
2010-03-08
TB62777FNG/FG
Test Circuits
Test Circuit 1: SERIAL-OUT output voltage (V /V
)
OH OL
V
DD
ENABLE
CLOCK
OUT0
OUT7
F.G
LATCH
SERIAL-IN
V
V
= V
DD
= 0 V
IH
IL
GND SERIAL-OUT
R-EXT
t = t = 10 ns
r
f
(10 to 90%)
V
Test Circuit 2: Input Current (I )
IH
V
= V
DD
IN
V
DD
ENABLE
CLOCK
A
OUT0
OUT7
A
LATCH
A
SERIAL-IN
A
SERIAL-OUT
GND
R-EXT
Test Circuit 3: Input Current (I )
IL
V
DD
ENABLE
A
OUT0
OUT7
CLOCK
A
LATCH
A
SERIAL-IN
A
SERIAL-OUT
GND
R-EXT
8
2010-03-08
TB62777FNG/FG
Test Circuit 4: Supply Current
ENABLE
OUT0
OUT7
CLOCK
F.G
LATCH
SERIAL-IN
A
V
V
= V
DD
= 0 V
IH
IL
SERIAL-OUT
GND
R-EXT
t = t = 10 ns
r
f
(10 to 90%)
Note: The output terminal is based on the power supply current conditions on page 6 and 7.
Test Circuit 5: Output Current (I
), Output Leakage Current (I ), Output Current Error
OZ
OUT1
Margin (ΔI
/ΔI
), Current Variation with V (%/V
)
DD
OUT1 OUT2
DD
V
ENABLE
CLOCK
DD
OUT0
OUT7
A
A
F.G
LATCH
SERIAL-IN
A
GND SERIAL-OUT
R-EXT
V
V
= V
DD
= 0 V
IH
IL
t = t = 10 ns
r
f
(10 to 90%)
Theoretical output current = 1.13 V/R
EXT
× 16
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TB62777FNG/FG
Test Circuit 6: Switching Characteristics
R =300Ω
L
V
ENABLE
CLOCK
DD
OUT0
OUT7
C
L
F.G
LATCH
I
OUT
SERIAL-IN
C
L
= 10.5 pF
SERIAL-OUT
GND
R-EXT
V
V
= V
DD
= 0 V
IH
IL
t = t = 10 ns
r
f
(10 to 90%)
10
2010-03-08
TB62777FNG/FG
Timing Waveforms
1. CLOCK, SERIAL-IN, SERIAL-OUT
t
wCLK
90%
10%
90%
10%
CLOCK
SERIAL-IN
50%
50%
t
SETUP1
t
t
f
r
50%
50%
t
HOLD1
SERIAL-OUT
50%
t
/t
pLH pHL
2. CLOCK, SERIAL-IN, LATCH, ENABLE, OUTn
CLOCK
50%
50%
SERIAL-IN
LATCH
t
t
SETUP2
50%
HOLD2
50%
t
t
t
wENA
wENA
wLAT
50%
50%
50%
ENABLE
OUTn
50%
50%
t
/
pHL1 LH1
t
/
pHL2 LH2
t
/
pHL3 LH3
3. OUTn
OFF
90%
90%
OUTn
10%
10%
ON
t
t
or
of
Note: Timing chart waveforms are presented to describe functions and operations and may be simplified. Adequate
consideration should be given to timing conditions.
11
2010-03-08
TB62777FNG/FG
Output Current vs. Derating (lighting rate) Graph
PCB Conditions: 76.2 × 114.3 × 1.6 mm, Cu = 30%, 35-μm Thick, SEMI-Compliant
TB62777FNG
Pd-Ta
I
− Duty ON PCB
OUT
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
100
90
80
70
60
50
40
ON PCB
30 All outputs ON
Ta = 85°C
20
V
DD
= 5.0 V
10
0
V
OUT
= 1.0 V
0
50
100
150
0
20
40
60
80
100
T
(°C)
a
Duty − Turn-ON rate (%)
Output Current vs. External Resistor (typ.)
I
− R
OU
T
E
XT
50
45
40
35
30
25
20
15
10
5
Theoretical value
I
= 1.13 (V) ÷ R (Ω)) × 16
EXT
OUT (A)
All outputs ON
Ta = 25°C
V
OUT
= 0.7 V
0
100
1000
10000
R
( )
Ω
EXT
The above graphs are presented merely as a guide and do not constitute any guarantee as to the performance or
characteristics of the device. Each product design should be fully evaluated in a real-world environment.
12
2010-03-08
TB62777FNG/FG
Application Circuit 1: General Composition for Static Lighting of LEDs
In the following diagram, it is recommended that the LED supply voltage (V ) be equal to or greater than the sum of V (max) of all LEDs plus 0.7 V.
LED f
V
LED
O0
O1
O2
O5
O6
O7
O0 O1 O2
O5 O6 O7
SERIAL-OUT
SERIAL-IN
SERIAL-OUT
SERIAL-IN
ENABLE
LATCH
CLOCK
ENABLE
LATCH
CLOCK
C.U.
TB62777FNG/FG
TB62777FNG/FG
R-EXT
GND
R-EXT
GND
13
2010-03-08
TB62777FNG/FG
Application Circuit 2: General Composition for Dynamic Lighting of LEDs
In the following diagram, it is recommended that the LED supply voltage (V ) be equal to or greater than the sum of V (max) of all LEDs plus 0.7 V.
LED f
Example) TD62M8600FG 8 bit multichip PNP transistor array.
It is not necessary when lighting statically.
V
LED
O0
O1
O6
O7
O6
O7
O0
O1
SERIAL-OUT
SERIAL-IN
SERIAL-OUT
SERIAL-IN
ENABLE
LATCH
CLOCK
ENABLE
LATCH
CLOCK
C.U.
TB62777FNG/FG
TB62777FNG/FG
R-EXT
R-EXT
GND
GND
14
2010-03-08
TB62777FNG/FG
Package Dimensions
Weight: 0.07 g (typ.)
15
2010-03-08
TB62777FNG/FG
Package Dimensions
Weight: 0.14 g (typ.)
16
2010-03-08
TB62777FNG/FG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause breakdown, damage or deterioration of the device, and may result
in injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the
event of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow. Such a
breakdown can lead to smoke or ignition. To minimize the effects of a large current flow in the event of
breakdown, fuse capacity, fusing time, insertion circuit location, and other such suitable settings are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
For ICs with built-in protection functions, use a stable power supply with. An unstable power supply
may cause the protection function to not operate, causing IC breakdown. IC breakdown may cause
injury, smoke or ignition.
(4) Do not insert devices incorrectly or in the wrong orientation. Make sure that the positive and negative
terminals of power supplies are connected properly. Otherwise, the current or power consumption may
exceed the absolute maximum rating, and exceeding the rating(s) may cause breakdown, damage or
deterioration of the device, which may result in injury by explosion or combustion. In addition, do not
use any device that has had current applied to it while inserted incorrectly or in the wrong orientation
even once.
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(5) Carefully select power amp, regulator, or other external components (such as inputs and negative
feedback capacitors) and load components (such as speakers).
If there is a large amount of leakage current such as input or negative feedback capacitors, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
(BTL) connection type IC that inputs output DC voltage to a speaker directly.
Points to remember on handling of ICs
(1) Heat Dissipation Design
In using an IC with large current flow such as a power amp, regulator or driver, please design the
device so that heat is appropriately dissipated, not to exceed the specified junction temperature (Tj) at
any time or under any condition. These ICs generate heat even during normal use. An inadequate IC
heat dissipation design can lead to decrease in IC life, deterioration of IC characteristics or IC
breakdown. In addition, please design the device taking into consideration the effect of IC heat
dissipation on peripheral components..
(2) Back-EMF
When a motor rotates in the reverse direction, stops, or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in your
system design.
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About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
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RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public
impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the
aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign
Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software
or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
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Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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