TL21W02L [MARKTECH]

LED Lamps InGaN and Phosphor; LED灯具的InGaN和磷


型号：	TL21W02L
厂家：	MARKTECH CORPORATE
描述：	LED Lamps InGaN and Phosphor LED灯具的InGaN和磷灯具
文件：	总14页 (文件大小：289K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TL21W02-L(T34

LED Lamps InGaN and Phosphor

TL21W02-L(T34

1. Applications

•

General Lighting

2. Features

(1) Size: 2.1 (L) mm × 2.5 (W) mm × 0.65 (H) mm

(2) High luminous flux LED: 46 lm (typ.) @IF = 150 mA

(3) Color: White (color temperature: 3000 K (typ.))

(4) Reflow-soldering is available.

3. Packaging and Internal Circuit

1: Cathode

2: Anode

4-2J1A

Marktech

Optoelectronics

For part availability and ordering information please call Toll Free: 800.984.5337

Website: www.marktechopto.com | Email: info@marktechopto.com

2011-10-20

Rev.1.0

TL21W02-L(T34

4. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25)

Characteristics

Forward current (DC)

Symbol

Note

Rating

Unit

See Fig. 4.1

(Note 1)

180

300

0.71

Forward current (pulsed)

Power dissipation

IFP

Operating temperature

Storage temperature

Junction temperature

Topr

Tstg

-40 to 100

120



Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Fig. 4.1 IF - Ta (Note)

Note: The junction-to-ambient thermal resistance, Rth(j-a), should be kept below 70/W so that this product is not

exposed to a condition beyond the absolute maximum ratings.

Rth(j-a): Thermal resistance from the LED junction to ambient temperature

Note 1: Pulse width 10 ms, duty = 1/10

2011-10-20

Rev.1.0

TL21W02-L(T34

5. Handling Precautions

•

This product is sensitive to electrostatic and care must be fully taken when handling products. Particularly

in the case that an overvoltage shall be applied, the overflowed energy may cause damage to or possibly

result in destruction of the product. Users shall take absolutely secure countermeasures against

electrostatic and surge when handling the product.

•

Since this product is intended to be used for display lighting, the measurement standard is based on the

spectral sensitivity of the human eye. It is not intended to be used for any applications other than display

lighting (e.g., sensors and light communications systems.)

Please note the handling of products during evaluation.

1. Please do not apply pressure to the upper surface of the product with finger, tweezers, and others.

Failure of product to light up may occur due to package deformation, wire deformation and/or

disconnection.

2. Should tweezers be used in product handling, one with flat surfaces is recommended.

3. Please handle the product widthwise.

4. Please do not drop the product. There is a possibility for package transformation etc. to occur when the

product is dropped.

5. Please do not stack the printed circuit boards on which the product is mounted to prevent damages to

product surface. Also, please note not to damage the surface of the product with cushioning material etc.

Surface damage to the product may influence their optical characteristics.

2011-10-20

Rev.1.0

TL21W02-L(T34

6. Electrical Characteristics (Unless otherwise specified, Ta = 25)

Characteristics

Forward voltage

Symbol

Note

Test Condition

Min

Typ.

Max

Unit

See Table 6.1 IF = 150 mA

IR = 1 mA

2.9



3.25

0.75

3.8



Reverse voltage

Thermal resistance (junction-to-

soldering point)

Rth(j-s)

(Note 1)

IF = 150 mA



/W

Note 1: Rth(j-s): Thermal resistance from the LED junction to solder point.

Table 6.1 Forward Voltage (Note)

Rank

Test Condition

Forward Voltage (Min)

Forward Voltage (Max)

Unit

IF = 150 mA, Ta = 25, Tolerance ±0.1 V

2.9

3.2

3.5

3.2

3.5

3.8

Note: This LED lamp is sorted into forward voltage (VF) ranks shown above. Each reel includes the same rank LEDs.

Let the delivery ratio of each rank be unquestioned.

7. Optical Characteristics (Unless otherwise specified, Ta = 25)

Characteristics

Chromaticity

Symbol

Note

Test Condition

IF = 150 mA

Min

Typ.

Max

Unit

(Note 1)

(Note 2)



IF = 150 mA

Luminous flux

φV

30.3



46.0

3000

60.5



Color temperature

Color rendering index

CCT

(Note 3)



Note 1: See Fig. 7.1 and Table 7.1 for chromaticity rank.

Note 2: See Table 7.2 for luminous flux rank.

Note 3: Tolerance: ±5

2011-10-20

Rev.1.0

TL21W02-L(T34

Fig. 7.1 Chromaticity Rank (Note)

Note: Test conditions: IF = 150 mA, Ta = 25, Tolerance: ±0.01

Table 7.1 Chromaticity Rank (Note)

0.4147

0.4221

0.4342

0.4259

0.4221

0.4299

0.4430

0.4342

0.3814

0.4342

0.4430

0.4562

0.4465

0.4259

0.4342

0.4465

0.4373

0.4028

0.4212

0.4260

0.4071

0.3853

0.4028

0.4071

0.3893

0.3984

0.4028

0.3853

0.3984

0.4165

0.4212

0.4028

Note: This LED lamp is sorted into chromaticity coordinate groups shown above. Each reel includes the same rank

LEDs. Let the delivery ratio of each rank be unquestioned.

Table 7.2 Luminous Flux Rank (Note)

Rank

Test Condition

Luminous Flux (Min)

Luminous Flux (Max)

Unit

C16

C17

C18

C19

IF = 150 mA, Ta = 25, Tolerance ±10%

30.3

36.0

42.8

51.0

36.0

42.8

51.0

60.5

Note: This LED lamp is sorted into luminous flux ranks shown above. Each reel includes the same rank LEDs. Let

the delivery ratio of each rank be unquestioned.

Rank notations: The luminous flux, chromaticity and VF ranks are printed on labels as shown below:

Example: 7A C18 2

7A: Chromaticity rank

C18: Luminous flux rank

2: VF rank

2011-10-20

Rev.1.0

TL21W02-L(T34

8. Characteristics Curves (Note)

Fig. 8.1 IF - VF

Fig. 8.2 Relative luminous flux - IF

Fig. 8.3 Relative luminous flux - Ta

Fig. 8.4 Wavelength characteristic

Fig. 8.5 Radiation Pattern

Fig. 8.6 Radiation pattern

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

2011-10-20

Rev.1.0

TL21W02-L(T34

9. Packing

9.1. Moisture-Proof Packing

These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid

moisture absorption. The optical characteristics of the device may be affected by exposure to moisture in the air

before soldering and the device should therefore be stored under the following conditions:

•

This moisture proof bag may be stored unopened within 12 months at the following conditions.

Temperature: 5 to 30

Humidity: 90% (max)

•

After opening the moisture proof bag, the device should be assembled within 168 hours in an environment

of 5 to 30/60% RH or below.

If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to

pink) or the expiration date has passed, the device should be baked in taping with reel.

After baking, use the baked device within 72 hours, but perform baking only once.

Baking conditions: 60±5, for 12 to 24 hours.

Expiration date: 12 months from sealing date, which is imprinted on the label affixed.

Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.

Furthermore, prevent the devices from being destructed against static electricity for baking of it.

If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not

throw or drop the packed devices.

•

10. Mounting

10.1. Mounting Precautions

•

Do not apply mechanical stress to the resin body at high temperature.

The time taken for a device to return to the room temperature after reflow soldering depends on the

mounting board and environmental conditions.

•

The resin body is easily scratched. Avoid friction against hard materials.

When installing an assembled board into equipment, ensure that the devices on the board do not contact

with other components.

2011-10-20

Rev.1.0

TL21W02-L(T34

10.2. Soldering

Following show examples of reflow soldering.

•

Temperature Profile (see following figures.)

Fig. 10.2.1 Temperature Profile for Pb Soldering Fig. 10.2.2 Temperature profile for Lead(Pb)-free

(example) soldering (example)

•

The product is evaluated using above reflow soldering conditions. No additional test is performed exceed

the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering

under the above conditions.

•

Please perform the first reflow soldering with reference to the above temperature profile and within 168

hours of opening the package.

If a second reflow process is necessary, reflow soldering should be performed within 168 h of the first

reflow under the above conditions. Storage conditions before the second reflow soldering: 30, 60% RH

(max)

•

Do not perform wave soldering.

10.3. Land Pattern Dimensions for Reference Only

Fig. 10.3.1 Land Pattern Dimensions for Reference Only (Unit: mm)

2011-10-20

Rev.1.0

TL21W02-L(T34

11. Cleaning

When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed

that these solvents have no effect on semiconductor devices in our dipping test (under the recommended

conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition,

using condition and etc.

Recommended cleaning solvents

ASAHI CLEAN AK-225AES: (made by ASAHI GLASS)

KAO CLEANTHROUGH 750HS: (made by KAO)

PINE ALPHA ST-100S: (made by ARAKAWA CHEMICAL)

12. Tape Specifications

12.1. Product Naming Conventions

The type of package used for shipment is denoted by a symbol suffix after the part number. The method of

classification is as below. (this method, however does not apply to products whose electrical characteristics differ

from standard Toshiba specifications)

Example: TL21W02-L(T34

Toshiba part number: TL21W02-L

Tape type: T34 (4-mm pitch)

12.2. Handling Precautions

(1) The tape is antistatic-coated. However, if the tape is charged with excess static electricity, devices might

cling to the tape or waggle in the tape when the cover tape peeled off. Be aware of the following to avoid

this:

Use an ionizer to neutralize the ions when utilizing an automatic mounter.

For transport and temporary storage of devices, use containers (boxes, jigs, bags) that are made with

antistatic materials or materials that dissipate static electricity.

2011-10-20

Rev.1.0

TL21W02-L(T34

12.3. Tape Dimensions

Table 12.3.1 Tape Dimensions (Unit: mm)

Dimensions

1.5

1.75

4.0

0.2

3.5

1.1

2.0

8.0

4.0

2.38

2.78

0.8

Tolerance +0.1/-0

±0.1

±0.05

±0.1

±0.05

±0.2

±0.1

±0.05

Fig. 12.3.1 Tape Dimensions

12.4. Reel Specification

12.4.1. Reel Dimensions

Fig. 12.4.1.1 Reel Dimensions

2011-10-20

Rev.1.0

TL21W02-L(T34

12.4.2. Tape Leader and Trailer

Fig. 12.4.2.1 Tape Leader and Trailer

2011-10-20

Rev.1.0

TL21W02-L(T34

12.5. Packing Form

Each reel is sealed in an aluminum pack with silica gel. Packing quantity is as shown below.

•

Reel: 2,000 pcs

Carton: 10,000 pcs

Sealed aluminum pack with silica gel

12.6. Label Format

Label example for TL21W02-L(T34 and label location are as shown below.

12.6.1. Label Example

Fig. 12.6.1.1 Label Example

12.6.2. Label Details

No. (# refer to to the

above label example)

Information for Customers Use

Information for Toshiba Use

(1)

(2)

Part No.

TL21W02-L(T34

ADD code

Notation explanation

(O Assembled in Japan, sales for domestic and overseas customers

(J Assembled in overseas factory, sales for domestic customers

(T Assembled in overseas factory, sales for overseas customers

(3)

(4)

(5)

Lot code

Example: 270xxxxx

Rank symbol

Example: 7AC182

Storage condition after

Opening

Use under 5-30/60%RH within 168 h

(6)

(7)

(8)

Packing quantity

Key code

Example: 2,000 pcs

Example: 12345

Example: JAPAN

Country of origin

12.6.3. Label Location

Fig. 12.6.3.1 Label Position on the Reel

Fig. 12.6.3.2 Label Position on the Carton

Aluminum pack: The aluminum pack in which the reel is supplied also has the label attached to center of one side.

2011-10-20

Rev.1.0

TL21W02-L(T34

13. Internal Circuit

1: Cathode

2: Anode

Fig. 13.1 Internal Circuit

Package Dimensions

Unit: mm

Weight: 0.007 g (typ.)

Package Name(s)

TOSHIBA: 4-2J1A

2011-10-20

Rev.1.0

TL21W02-L(T34

RESTRICTIONS ON PRODUCT USE

•

Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible

for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

•

Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product

is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/

or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact

("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace

industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,

equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and

equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.

•

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

•

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

•

Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange

and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology

are strictly prohibited except in compliance with all applicable export laws and regulations.

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

2011-10-20

Rev.1.0

TL21W02L [MARKTECH]

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