TLRMH1102B [MARKTECH]
Panel Circuit Indicator; 面板指示灯电路型号: | TLRMH1102B |
厂家: | MARKTECH CORPORATE |
描述: | Panel Circuit Indicator |
文件: | 总13页 (文件大小:360K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TL(RH,RMH,SH,OH,YH)1102B(T10)
TOSHIBA LED Lamps
TLRH1102B(T10), TLRMH1102B(T10), TLSH1102B(T10),
TLOH1102B(T10), TLYH1102B(T10)
Unit: mm
Panel Circuit Indicator
•
•
Surface-mount devices
3.2 (L) × 2.8 (W) × 3.4 (H) mm
• φ2.8mm Diameter Lens-top type
•
•
•
•
•
•
InGaAℓP LEDs
High luminous intensity
Low drive current, high-intensity light emission
Colors: red, orange, yellow
Reflow soldering possible
Applications: automotive use, message signboards, backlighting
etc.
•
Standard embossed tape packing: T10 (500/reel)
8-mm tape reel
JEDEC
―
―
Color and Material
JEITA
Product Name
Color
Material
TOSHIBA
4-3Q1
TLRH1102B
TLRMH1102B
TLSH1102B
TLOH1102B
TLYH1102B
Red
Red
Weight: 0.042 g (typ.)
InGaAℓP
Red
Orange
Yellow
For part availability and ordering information please call Toll Free: 800.984.5337
Website: www.marktechopto.com | Email: info@marktechopto.com
1
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
Maximum Ratings (Ta = 25°C)
Forward Current
Operation
Temperature
Storage
Temperature
Reverse Voltage
(V)
Power Dissipation
(mW)
I
(mA)
Product Name
F
V
P
D
R
T
opr
(°C)
T
stg
(°C)
Please see Note 1
TLRH1102B
TLRMH1102B
TLSH1102B
TLOH1102B
TLYH1102B
50
4
115
−40~100
−40~100
Note 1: Forward current derating
I
– Ta
F
80
60
40
20
0
0
20
40
60
80
100
120
Ambient temperature Ta (°C))
Electrical Characteristics (Ta = 25°C)
Reverse Current
Forward Voltage V
F
I
Product Name
R
Min
1.6
1.6
1.6
1.6
1.6
Typ.
1.9
1.9
1.9
2.0
2.0
V
Max
2.3
2.3
2.3
2.3
2.3
I
Max
V
R
F
TLRH1102B
TLRMH1102B
TLSH1102B
TLOH1102B
TLYH1102B
Unit
20
10
4
mA
µA
V
2
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
Optical Characteristics–1 (Ta = 25°C)
Luminous Intensity I
Available Iv rank
V
Product Name
Please see Note 2
Min
160
160
400
400
250
mcd
Typ.
400
480
850
950
700
mcd
Max
1250
1250
3200
3200
2000
mcd
I
F
TLRH1102B
TLRMH1102B
TLSH1102B
TLOH1102B
TLYH1102B
Unit
20
20
20
20
20
mA
SA / TA / UA / VA
SA / TA / UA / VA
UA / VA / WA / XA
UA / VA / WA / XA
TA / UA / VA / WA
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Luminous Intensity I
V
Rank
Min
160
Max
SA
TA
320
500
250
UA
VA
400
800
630
1250
2000
3200
mcd
WA
XA
1000
1600
mcd
Unit
Optical Characteristics–2 (Ta = 25°C)
Emission Spectrum
Peak Emission
Product Name
∆λ
Dominant Wavelength λ
d
Wavelength λ
I
p
F
Min
Typ.
Max
Typ.
18
Min
624
Typ.
630
Max
638
⎯
⎯
⎯
⎯
⎯
⎯
TLRH1102B
TLRMH1102B
TLSH1102B
TLOH1102B
TLYH1102B
Unit
644
⎯
⎯
⎯
⎯
636
623
612
590
nm
17
17
15
15
nm
620
607
599
581
626
613
605
587
nm
634
621
613
595
20
mA
The cautions
•
This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by the IR light.
This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional
application (ex. Light source for sensor, optical communication and etc) except general display light source.
•
3
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
TLRH1102B
I
– I
F
I
– V
V
F
F
(typ.)
(typ.)
100
1000
Ta = 25°C
500
300
30
10
100
50
30
1
1.6
10
1
1.8
2.0
2.2
2.4
3
5
10
30
50
100
Forward current
I
(mA)
Forward voltage
V
(V)
F
F
Wavelength characteristic
I
– Tc
(typ.)
V
(typ.)
10
1.0
0.8
0.6
0.4
0.2
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−25
0
580
0
25
50
75
100
600
620
640
660
680
700
Case temperature Tc (°C)
Wavelength
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
0°
10°
10°
20°
20°
30°
30°
40°
40°
50°
50°
60°
70°
80°
90°
60°
70°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
4
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
TLRMH1102B
I
– V
F
F
I
– I
V
F
(typ.)
(typ.)
100
2000
1000
Ta = 25°C
30
10
500
300
3
100
50
1
1.6
1.8
2.0
2.2
2.4
1
3
5
10
30
50
100
Forward voltage
V
(V)
F
Forward current
I
(mA)
F
I
– Tc
Wavelength characteristic
V
(typ.)
(typ.)
3
1
1.0
0.8
0.6
0.4
0.2
0
I
= 20 mA
F
Ta = 25°C
0.5
0.3
0.1
−20
0
20
40
60
80
580
600
620
640
660
680
700
Case temperature Tc (°C)
Wavelength
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
0°
10°
10°
20°
20°
30°
30°
40°
40°
50°
50°
60°
70°
60°
70°
80°
90°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
5
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
TLSH1102B
I
– V
I
– I
F
F
F
V
(typ.)
(typ.)
100
2000
1000
Ta = 25°C
30
10
500
300
3
100
50
1
1.6
1.8
2.0
2.2
2.4
1
3
5
10
30
50
100
Forward voltage
V
(V)
Forward current
I
(mA)
F
F
I
– Tc
Wavelength characteristic
V
(typ.)
(typ.)
10
1.0
0.8
0.6
0.4
0.2
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−25
0
580
0
25
50
75
100
600
620
640
660
680
700
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
(typ.)
0°
10°
10°
20°
20°
30°
30°
40°
40°
50°
50°
60°
70°
60°
70°
80°
90°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
6
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
TLOH1102B
I
– V
I – I
V F
F
F
(typ.)
(typ.)
100
2000
1000
Ta = 25°C
30
10
500
300
3
100
50
1
1.6
1.8
2.0
2.2
2.4
1
3
5
10
30
50
100
Forward voltage
V
(V)
Forward current
I
(mA)
F
F
I
– Tc
Wavelength characteristic
V
(typ.)
(typ.)
10
1.0
0.8
0.6
0.4
0.2
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
1
−25
0
540
0
25
50
75
100
560
580
600
620
640
660
Case temperature Tc (°C)
Wavelength
λ (nm)
Radiation pattern
Ta = 25°C
(typ.)
0°
10°
10°
20°
20°
30°
30°
40°
40°
50°
50°
60°
70°
80°
90°
60°
70°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
7
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
TLYH1102B
I
– V
I
– I
F
F
F
V
(typ.)
(typ.)
100
2000
1000
Ta = 25°C
30
10
500
300
3
100
50
1
1.6
1.8
2.0
2.2
2.4
5
1
3
10
30
50
100
Forward voltage
V
(V)
Forward current
I
(mA)
F
F
I
– Tc
V
Wavelength characteristic
(typ.)
(typ.)
10
1.0
0.8
I
= 20 mA
F
Ta = 25°C
5
3
0.6
0.4
1
0.5
0.3
0.2
0
0.1
−25
25
0
50
75
100
540
560
580
600
620
640
660
Case temperature Tc (°C)
Wavelength
λ (nm)
Radiation pattern
Ta = 25°C
0°
10°
10°
20°
20°
30°
30°
40°
40°
50°
50°
60°
70°
80°
90°
60°
70°
80°
90°
0.2 0.4 0.6 0.8 1.0
0
8
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
Packaging
These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an
environment of 5°C to 30°C/60% RH or below.
3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color
changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60 ±5°C, for 12 to 24 hours.
Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.
4. Repeated baking can cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be
sure to prevent damage to the device from static electricity during the baking process.
5. Any breakage in the laminate packing material will cause the hermeticity of the product to deteriorate. Do
not toss or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering
Temperature profile (example)
10 s max
(*)
(*)
240°C max
(*)
140~160°C max
(*)
4°C/s max
4°C/s max
(*)
60~120 s max
(*)
Time (s)
•
The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
•
•
Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
•
•
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron
Temperature
Time
: 25 W
: 300°C or less
: within 3 s
Do not perform wave soldering.
Recommended soldering pattern
Unit: mm
1.65
1.15
1.65
2.41
9
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the
recommended conditions). In selecting the one for your actual usage, please perform sufficient review
on washing condition, using condition and etc.
ASAHI CLEAN AK-225AES
KAO CLEAN TROUGH 750H
PINE ALPHA ST-100S
TOSHIBA TECHNOCARE
(FRW-17, FRW-1, FRV-100)
: (made by ASAHI GLASS)
: (made by KAO)
: (made by ARAKAWA CHEMICAL)
: (made by GE TOSHIBA SILICONES)
Precautions When Mounting
Do not apply force to plastic parts of the LED under high-temperature conditions.
The LED plastic is easily scratched. Avoid friction between plastic parts and hard objects or materials.
When installing the PCB in a product, ensure that the device does not come into contact with other components.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The method
of classification is as below. (This method, however does not apply to products whose electrical
characteristics differ from standard Toshiba specifications.)
(1) Tape Type: T10 (8-mm pitch)
(2) Example
TLRH1102B (T10)
Tape type
Toshiba product No.
2. Tape dimensions
Unit: mm
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
E
1.5
1.75
4.0
+0.1/−0
±0.1
P
2.0
12.0
8.0
2.9
±0.05
±0.3
±0.1
±0.1
±0.1
±0.1
2
W
P
P
±0.1
0
t
0.3
±0.05
±0.05
+0.1/−0
A
B
K
0
0
0
F
5.5
3.7
D
1
1.5
3.6
K
0
P
0
D
t
P
2
E
F
W
B
0
Polarity
P
D
1
A
0
10
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
3. Reel dimensions
Unit: mm
13.0 ± 0.3
15.4 ± 1.0
φ44
2 ± 0.5
4. Leader and trailer sections of tape
40 mm or more
(Note 1)
40 mm or more
(Note 2)
Leading part: 190 mm (min)
Note 1: Empty trailer section
Note 2: Empty leader section
11
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
5. Packing display
(1) Packing quantity
Reel
500 pcs
Carton
2,000 pcs
(2) Packing form: Each reel is sealed in an aluminum pack with silica gel.
6. Label format
(1) Example: TLRH1102B (T10)
P/N:
TOSHIBA
TYPE
ADDC
TLRH1102B
(T10)
Q’TY
32C
500 pcs
500
Lot Number
Key code for TSB
(RANK SYMBOL)
Use under 5-30degC/60%RH within 168h
SEAL DATE:
DIFFUSED IN *****
ASSEMBLED IN *****
[[G]]/RoHS COMPATIBLE
*Y3804xxxxxxxxxxxxxxxxx*
(2) Label location
•
Reel
•
Carton
Tape reel direction
Label position
Label position
•
The aluminum package in which the reel is supplied also has a copy of the label
attached to the center of one side.
12
2006-07-07
TL(RH,RMH,SH,OH,YH)1102B(T10)
RESTRICTIONS ON PRODUCT USE
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
13
2006-07-07
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