TLSH1052(T20) [MARKTECH]
Visible LED;
| 型号： | TLSH1052(T20) |
| 厂家： | 
MARKTECH CORPORATE |
| 描述： | Visible LED |
| 文件： | 总15页 (文件大小：394K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
TOSHIBA LED Lamp
Preliminary
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
Panel Circuit Indicator
Unit: mm
•
•
5.2 (L) × 5.2 (W) × 4.0 (H) mm size
TL□H1052 (T20) Series
3.6 × 4.4 mm transparent oval lens top type
InGaAℓP LEDs
•
•
High Luminous Intensity and low power
consumption
•
•
•
Colors :Red, Orange, Yellow, Green
Clear luminescence is obtained
High Operating Temperature:
T
opr
T
stg
：
：
−40~100°C
−40~110°C
•
•
Can be mounted using surface mounter.
Standard Embossed Taping
8 mm pitch : T20(400pcs/Reel)
Reflow Soldering is possible.
•
•
Applications: portable devices, backlighting,
message signboards and amusement etc.
Color and Material
Product Name
Color
Material
TLRMH1052
TLSH1052
TLOH1052
TLYH1052
TLGH1052
TLFGH1052
Red
Red
Orange
Yellow
Green
Green
InGaAℓP
JEDEC
―
―
JEITA
TOSHIBA
Weight: 0.085g
4-5AU1
1
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
Absolute Maximum Ratings (Ta = 25°C)
Forward Current
Operation
Temperature
Storage
Temperature
Reverse Voltage
(V)
Power Dissipation
(mW)
I
(mA)
Product Name
F
V
P
D
R
T
opr
(°C)
T
stg
(°C)
Please see Note 1
TLRMH1052
TLSH1052
TLOH1052
TLYH1052
TLGH1052
TLFGH1052
50
4
120
−40~100
−40~110
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
I
– Ta
F
80
60
40
20
0
0
20
40
60
80
100
120
Ambient temperature Ta (°C)
Electrical Characteristics (Ta = 25°C)
Forward Voltage V
Reverse Current I
Product
Name
F
R
I
V
R
Min.
1.7
1.7
1.7
1.7
1.7
1.7
Typ.
2.0
2.0
2.0
2.1
2.1
2.1
V
Max.
Max.
F
TLRMH1052
TLSH1052
TLOH1052
TLYH1052
TLGH1052
TLFGH1052
Unit
2.5
2.5
2.5
2.5
2.5
2.5
20
50
4
mA
µA
V
2
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
Optical Characteristics-1 (Ta = 25°C)
Available Iv rank
Luminous Intensity I
V
Product Name
Please see Note 2
Min.
153
272
476
272
153
85
Typ.
450
900
1000
750
400
190
mcd
Max.
1290
2300
2300
2300
1290
736
I
F
TLRMH1052
TLSH1052
TLOH1052
TLYH1052
TLGH1052
TLFGH1052
Unit
Q / R / S
R / S / T
R / S / T
R / S
20
Q / R
N / P / Q
mA
Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned.
Luminous Intensity I
V
Rank
Min
85
Max
230
N
P
153
272
476
850
mcd
414
Q
736
R
1290
2300
mcd
S
Unit
Optical Characteristics-2 (Ta = 25°C)
Emission Spectrum
Peak Emission Wavelength λ
Dominant Wavelength λ
d
∆λ
Product Name
p
Min
⎯
⎯
⎯
⎯
⎯
⎯
Typ
636
623
612
590
574
568
nm
Max
⎯
Typ
17
17
15
13
11
11
nm
Min
620
607
599
581
565
559
Typ
626
613
605
587
571
565
nm
Max
634
621
613
595
576
571
I
F
TLRMH1052
TLSH1052
TLOH1052
TLYH1052
TLGH1052
TLFGH1052
Unit
⎯
⎯
20
⎯
⎯
⎯
mA
The cautions
•
These visible LED lamps also emit some IR light.
If a photodetector is located near the LED lamps, please ensure that it will not be affected by the IR light.
These products are designed as a general display light source usage, and they have applied the measurement
standard that matched with the sensitivity of human's eyes. Therefore, they are not intended for usage of
functional application (ex. Light source for sensor, optical communication and etc) except general display light
source.
•
3
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
TLRMH1052
I
– I
F
I
– V
F
V
F
1000
100
Ta = 25°C
Ta = 25°C
500
300
10
100
50
30
1
10
1
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
3
5
10
30
50
100
Forward voltage
V
F
(V)
Forward current
I
F
(mA)
Relative luminous intensity – wavelength
I
– Tc
V
10
1.0
0.8
0.6
0.4
0.2
0
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−40
−20
0
20
40
60
80
100
580
600
620
640
660
680
700
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
4
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
TLSH1052
I
– V
I
– I
F
F
F
V
10000
100
Ta = 25°C
Ta = 25°C
3000
1000
10
300
100
30
10
1
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
1
3
10
30
100
Forward voltage
V
F
(V)
Forward current
I
F
(mA)
Relative luminous intensity – wavelength
I
– Tc
V
1.0
0.8
0.6
0.4
0.2
0
10
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−40
580
600
620
640
660
680
700
−20
0
20
40
60
80
100
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
5
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
TLOH1052
I
– V
I
– I
F
F
F
V
10000
100
Ta = 25°C
Ta = 25°C
3000
1000
10
300
100
30
10
1
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
1
3
10
30
100
Forward voltage
V
F
(V)
Forward current
I
F
(mA)
I
– Tc
V
Relative luminous intensity – wavelength
10
1.0
0.8
0.6
0.4
0.2
0
I
= 20 mA
F
5
3
Ta = 25°C
1
0.5
0.3
0.1
−40
−20
0
20
40
60
80
100
540
560
580
600
620
640
660
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
6
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
TLYH1052
I
– V
I – I
V F
F
F
100
Ta = 25°C
Ta = 25°C
3000
1000
10
300
100
30
10
1
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
1
3
10
30
100
Forward voltage
V
F
(V)
Forward current
I
F
(mA)
Relative luminous intensity – wavelength
I
– Tc
V
10
1.0
0.8
0.6
0.4
0.2
0
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−40
−20
0
20
40
60
80
100
540
560
580
600
620
640
660
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
7
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
TLGH1052
I
– V
I – I
V F
F
F
100
10000
1000
100
Ta = 25°C
Ta = 25°C
10
1
10
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
1
10
Forward current
100
Forward voltage
V
F
(V)
I
F
(mA)
Relative luminous intensity – wavelength
I
– Tc
V
10
1.0
0.8
0.6
0.4
0.2
I
= 20 mA
F
Ta = 25°C
5
3
1
0.5
0.3
0.1
−40
0
540
−20
0
20
40
60
80
100
560
580
600
620
Case temperature Tc (°C)
Wavelength
λ
(nm)
Radiation pattern
Ta = 25°C
8
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
TLFGH1052
I
– V
F
F
I
– I
V
F
1000
100
Ta = 25°C
Ta = 25°C
300
100
10
30
10
3
1
1
1.6
1.7
1.8
1.9
2.0
2.1
(V)
2.2
2.3
1
3
10
30
100
Forward voltage
V
F
Forward current
I
F
(mA)
Relative luminous intensity – wavelength
I
– Tc
V
10
1.0
I
= 20 mA
F
Ta = 25°C
5
3
0.8
0.6
0.4
0.2
0
1
0.5
0.3
0.1
−40
−20
0
20
40
60
80
100
520
540
560
580
600
Case temperature Tc (°C)
Wavelength
λ (nm)
Radiation pattern
Ta = 25°C
9
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
Packaging
These LED devices are packed in an aluminum envelope with silica gel and a moisture indicator to prevent
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After the moisture-proof bag has been opened, the devices should be assembled within 72 hours in an
environment of 5°C to 30°C/70% RH or below.
3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color
changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60 ±5°C, for 12 to 24 hours.
Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.
4. Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also,
be sure to prevent damage to the device from static electricity during the baking process.
5. Any breakage in the laminate packing material will cause the hermetically of the product to deteriorate. Do
not toss or drop the packed devices.
Mounting Method
Soldering
•
Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
(*)
(*)
10 s max
5 s max
(*)
(*)
240°C max
260°C max
(*)
4°C/s max
max(*)
max(*)
140~160°C
230°C
150~180°C
(*)
(*)
4°C/s max
4°C/s max
(*)
4°C/s max
max(*)
60~120 s
60~120 s
max(*)
30~50s max(*)
Time (s)
Time (s)
•
The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
•
•
Perform the first reflow soldering in accordance with the above temperature profile and within 72 hours of
opening the package.
Second time reflow
In case of second reflow soldering should be performed within 72 hours of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 5～30°C, 70% RH max
•
•
Do not perform flow soldering and soldering dip.
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: Less than 25 W
Temperature : Less than 350°C or less
Time
: within 3 s (Up to 1time per place)
10
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
Recommended soldering pattern
Unit: mm
2.45
1.3
2.45
2.7
Cleaning
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. Our
dipping tests (carried out under the recommended conditions) confirm that these solvents have no effect on
semiconductor devices. In selecting the cleaning solvent you will actually use, be sure to take into account
the cleaning conditions and usage conditions.
Cleaning Solvent
Manufacturer
ASAHI CLEAN AK-225AES
KAO CLEANTHROUGH 750H
PINE ALPHA ST-100S
TOSHIBA TECHNOCARE
(FRW-17, FRW-1, FRV-100)
ASAHI GLASS
KAO
ARAKAWA CHEMICAL
GE TOSHIBA SILICONES
Precautions When Mounting
Do not apply force to plastic parts of the LED under high-temperature conditions.
The LED plastic is easily scratched. Avoid friction between plastic parts and hard objects or materials.
When installing the PCB in a product, ensure that the device does not come into contact with other components.
This product doesn't apply mounting that solder flow. Please mount on recommended reflow solder mounting
condition.
Tape Specifications
1. Product number format
The type of package used for shipment is denoted by a symbol suffix after the product number. The method
of classification is as below. (This method, however, does not apply to products whose electrical
characteristics differ from standard Toshiba specifications.)
(1) Tape Type: T20 (8-mm pitch)
(2) Example
TLRMH1052 (T20)
Tape type
Toshiba product No.
2. Handling precautions
Tape material protected against static electricity. However, static electricity may occur depending on
quantity of charged static electricity and a device may attach to a tape, or a device may be unstable
when peeling a tape cover.
(a)In process, taping materials may sustain an electrostatic charge, use an ionizer to
neutralize the ions.
(b)For transport and temporary storage of devices, use containers(boxes, jigs, and bags) that
are made of anti-static materials or of materials that dissipate electrostatic electricity.
11
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
3. Tape dimensions
(Unit: mm)
Symbol
Dimension
Tolerance
Symbol
Dimension
Tolerance
D
E
1.5
1.75
4.0
+0.1/−0
±0.1
P
2.0
12.0
8.0
5.5
±0.05
±0.2
±0.1
±0.1
±0.1
±0.1
2
W
P
P
±0.1
0
t
0.4
±0.05
±0.05
±0.1
A
B
K
0
0
0
F
5.5
5.5
D
1
1.6
4.4
K
P
0
0
D
t
P
2
E
F
W
B
0
POLARITY
P
D
1
A
0
12
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
4. Reel dimensions
Unit: mm
13 ± 0.3
15.4 ± 1.0
φ44
2 ± 0.5
5. Leader and trailer section of tape
40mm or more
(Note-2)
40mm or more
(Note-1)
Leading part 190 mm (min)
Note-1 : Empty trailer section
Note-2 : Empty leader section
13
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
6. Packing display
Bar-code label
（１）Packing quantity
Tape type
T20
Reel
400pcs
Carton
2000pcs
Item
Reel
Silica gel with a
humidity indicator
Aluminum pack
No.
①
④
Bar-code label
②
⑤
③
④
⑤
Cushion
Carton
①
②
comment
③
（２）Packing form: Each reel and a silica gel with a humidity indicator are sealed in an aluminum pack.
7. Label format
（１）Example：TLRMH1052(T20)
*See below for how to decipher the Lot Number.
TOSHIBA
P/N：
TYPE TLRMH1052
ADDC (T20)
Ｑ‘TY 400pcs
Lot. Number & Symbol for control
(Rank symbol)
400
Use under 5-30degC/70%RH within 72h
[[G]]/RoHS COMPATIBLE
*(Y)380□□□□ 400 Symbol for control
∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥
SEALED Feb, 22, 2007
DIFFUSED IN JAPAN
ASSEMBLED IN JAPAN
∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥∥
（２）Label location
•
Reel
•
Carton
Tape reel direction
Label position
Label position
•
The aluminum package in which the reel is supplied also has a copy of the label
attached to the center of one side.
*The Lot Number includes the following information.
Example: 270 7 B 3 B “Packaged February 22, 2007”
b c d e
a: Domestic ID
→
a
b: Last digit of the year (CE): “0” (Y2000), “1” (Y2001), “2” (Y2002) ~ “9” (Y2009)
Repeated for each decade
c: Month: “A” (Jan), “B” (Feb), “C” (Mar) ~ “L” (Dec)
d: Decade of the month: “1” (First), “2” (Middle), “3” (Last)
e: Day in d above: “A” (1st), “B” (2nd), “C” (3rd) ~ “J” (9th), “K” (10th)
“L” denotes the 31st of the month
“I” is not used to denote a day in this date system
14
2008-01-10
TL(RMH,SH,OH,YH,GH,FGH)1052(T20)
RESTRICTIONS ON PRODUCT USE
030619EAC
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
15
2008-01-10
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