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TLYK31TP

更新时间：2025-07-07 08:33:29
品牌：MARKTECH
描述：TOSHIBA LED Lamp InGaAℓP Yellow Light Emission

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中文翻译

免费 PCB/SMT

TLYK31TP 概述

TOSHIBA LED Lamp InGaAℓP Yellow Light Emission 东芝LED灯泡InGaAℓP黄色发光

TLYK31TP 数据手册

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TLYK31TP(F)  
TOSHIBA LED Lamp InGaAℓP Yellow Light Emission  
TLYK31TP(F)  
Panel Circuit Indicator  
Unit in mm  
•
•
•
•
•
Lead(Pb)-free products (lead: Sn-Ag-Cu)  
5 mm package  
InGaAℓP technology  
Transparent lens  
Low drive current, high intensity yellow light emission  
Recommended forward current: I = 10~30 mA (DC)  
F
•
•
•
All plastic molded lens, provides an excellent on−off contrast ratio.  
Fast response time, capable of pulse operation.  
Applications: outdoor message signboards,Traffic signals, Safety  
equipment, HMSL,etc  
•
Stopper lead type is also available.  
TLYK31T(F)  
Cathode index  
Maximum Ratings (Ta = 25°C)  
Characteristic  
Symbol  
Rating  
Unit  
1. ANODE  
2. CATHODE  
Forward current (DC)  
Reverse voltage  
I
50  
4
mA  
V
F
V
P
R
D
JEDEC  
―
―
―
Power dissipation  
130  
mW  
°C  
EIAJ  
Operating temperature range  
Storage temperature range  
T
opr  
−40~100  
−40~120  
T
stg  
°C  
TOSHIBA  
Weight: 0.28 g  
For part availability and ordering information please call Toll Free: 800.984.5337  
Website: www.marktechopto.com | Email: info@marktechopto.com  
HOL-0133  
1
2007-01-24  
TLYK31TP(F)  
Electrical And Optical Characteristics (Ta = 25°C)  
Characteristic  
Forward voltage  
Symbol  
Test Condition  
= 20 mA  
F
Min  
Typ.  
Max  
Unit  
V
I
1.9  
⎯
2.4  
⎯
2.6  
50  
⎯
V
F
Reverse current  
I
V
= 4 V  
R
µA  
R
Luminous intensity  
I
I
I
I
I
= 20 mA  
= 20 mA  
= 20 mA  
= 20 mA  
(Note)  
(Note)  
1530  
⎯
4000  
(594)  
13  
mcd  
nm  
nm  
nm  
V
F
F
F
F
Peak emission wavelength  
Spectral line half width  
Dominant wavelength  
λ
⎯
P
∆λ  
⎯
⎯
λ
581  
590  
595  
d
(Note): Lamps are classified into the following ranks according to Iv and λd, and packed in boxes  
by each rank.  
Iv-rank ⇒ Ｔ: 1530－4140mcd, Ｕ: 2720－7360mcd, Ｖ: 4760mcd－  
λd-rank ⇒ 1: 581－588nm, 2: 585－592nm, 3: 589－595nm  
Precaution  
Please be careful of the followings  
Soldering temperature: 260°C max  
•
Soldering time: 3 s max  
(Soldering portion of lead: up to 1.6 mm from the body of the device)  
•
•
If the lead is formed, the lead should be formed up to1.6 mm from the body of the device without forming stress  
to the resin. Soldering should be performed after lead forming.  
This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure  
that it will not be affected by this IR light.  
HOL-0133  
2
2007-01-24  
TLYK31TP(F)  
I
– V  
I – I  
V F  
F
F
10000  
100  
Ta = 25 °C  
Ta = 25°C  
50  
30  
1000  
10  
5
3
100  
30  
1
1.6  
1.8  
2.0  
2.2  
2.4  
2.6  
2.8  
1
3
5
10  
30  
50  
640  
100  
100  
Forward voltage  
V
F
(V)  
Forward current  
I
F
(mA)  
Relative Luminous Intensity  
Wavelength  
I
– Tc  
V
1.0  
0.8  
0.6  
0.4  
0.2  
0
10  
IF = 20 mA  
Ta = 25°C  
5
3
1
0.5  
0.3  
0.1  
−20  
0
20  
40  
60  
80  
540  
560  
580  
600  
620  
660  
Case temperature Tc (°C)  
Wavelength  
λ
(nm)  
I
– Ta  
Radiation Pattern  
F
80  
60  
40  
20  
0
Ta = 25 °C  
0°  
10°  
10°  
20°  
20°  
30°  
30°  
40°  
40°  
50°  
60°  
70°  
80°  
90°  
50°  
60°  
70°  
80°  
90°  
1.0  
0
0.2  
0.4 0.6  
0.8  
0
20  
40  
60  
80  
120  
Ambient temperature Ta (°C)  
HOL-0133  
3
2007-01-24  
TLYK31TP(F)  
RESTRICTIONS ON PRODUCT USE  
000707EAC  
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
• The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
• Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes  
are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the  
products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with  
domestic garbage.  
• The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other  
rights of the third parties which may result from its use. No license is granted by implication or otherwise under  
any intellectual property or other rights of TOSHIBA CORPORATION or others.  
HOL-0133  
4
2007-01-24  

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