TLYK31TP [MARKTECH]

TLYK31TP(F)

TOSHIBA LED Lamp

InGaAℓP Yellow Light Emission

TLYK31TP(F)

Panel Circuit Indicator

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Lead(Pb)-free products (lead: Sn-Ag-Cu)

5 mm package

InGaAℓP technology

Transparent lens

Low drive current, high intensity yellow light emission

Recommended forward current: I

F

= 10~30 mA (DC)

All plastic molded lens, provides an excellent on−off contrast ratio.

Fast response time, capable of pulse operation.

Applications: outdoor message signboards,Traffic signals, Safety

equipment, HMSL,etc

Stopper lead type is also available.

TLYK31T(F)

6.75±0.2

Unit in mm

Maximum Ratings

(Ta = 25°C)

Characteristic

Forward current (DC)

Reverse voltage

Power dissipation

Operating temperature range

Storage temperature range

Symbol

I

F

V

R

P

D

T

opr

T

stg

Rating

50

4

130

−40~100

−40~120

Unit

mA

V

mW

°C

°C

Cathode index

1. ANODE

2. CATHODE

JEDEC

EIAJ

TOSHIBA

Weight: 0.28 g

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For part availability and ordering information please call Toll Free: 800.984.5337

Website: www.marktechopto.com | Email: info@marktechopto.com

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2007-01-24

TLYK31TP(F)

Electrical And Optical Characteristics

(Ta = 25°C)

Characteristic

Forward voltage

Reverse current

Luminous intensity

Peak emission wavelength

Spectral line half width

Dominant wavelength

Symbol

V

F

I

R

I

V

λ

P

∆λ

λ

d

Test Condition

I

F

= 20 mA

V

R

= 4 V

I

F

= 20 mA

I

F

= 20 mA

I

F

= 20 mA

I

F

= 20 mA

(Note)

(Note)

Min

1.9

⎯

1530

⎯

⎯

581

Typ.

2.4

⎯

4000

(594)

13

590

Max

2.6

50

⎯

⎯

⎯

595

Unit

V

µA

mcd

nm

nm

nm

(Note): Lamps are classified into the following ranks according to Iv and

λd,

and packed in boxes

by each rank.

Iv-rank

⇒ Ｔ:

1530−4140mcd,

Ｕ:

2720−7360mcd,

Ｖ:

4760mcd−

λd-rank

⇒

1: 581−588nm, 2: 585−592nm, 3: 589−595nm

Precaution

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Please be careful of the followings

Soldering temperature: 260°C max

Soldering time: 3 s max

(Soldering portion of lead: up to 1.6 mm from the body of the device)

If the lead is formed, the lead should be formed up to1.6 mm from the body of the device without forming stress

to the resin. Soldering should be performed after lead forming.

This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure

that it will not be affected by this IR light.

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2007-01-24

TLYK31TP(F)

I

F

– V

F

100

50

10000

Ta = 25 °C

Ta

=

25°C

I

V

– I

F

30

Luminous intensity IV (mcd)

1.8

2.0

2.2

2.4

2.6

2.8

(mA)

Forward current IF

1000

10

5

3

100

1

1.6

30

1

3

5

10

30

50

100

Forward voltage VF

(V)

Forward current IF

(mA)

I

V

– Tc

10

5

1.0

Relative Luminous Intensity

Wavelength

I

F

=

20 mA

Ta

=

25°C

0.8

Relative luminous intensity IV

3

Relative luminous intensity

0.6

1

0.5

0.3

0.4

0.2

0.1

−20

0

20

40

60

80

0

540

560

580

600

620

640

660

Case temperature Tc (°C)

Wavelength

λ

(nm)

Radiation Pattern

80

I

F

– Ta

Ta = 25 °C

Allowable forward current

IF (mA)

60

20°

30°

40°

50°

60°

70°

80°

90°

10°

0°

10°

20°

30°

40°

50°

60°

70°

80°

40

20

0

0.2

0.4

0.6

0.8

90°

1.0

0

0

20

40

60

80

100

120

Ambient temperature Ta (°C)

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2007-01-24

TLYK31TP(F)

RESTRICTIONS ON PRODUCT USE

000707EAC

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TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of

safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of

such TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc..

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The TOSHIBA products listed in this document are intended for usage in general electronics applications

(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,

etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires

extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or

bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or

spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,

medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this

document shall be made at the customer’s own risk.

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Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes

are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the

products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with

domestic garbage.

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The information contained herein is presented only as a guide for the applications of our products. No

responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other

rights of the third parties which may result from its use. No license is granted by implication or otherwise under

any intellectual property or other rights of TOSHIBA CORPORATION or others.

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