DS1340Z-3+ [MAXIM]

I2C RTC with Trickle Charger; I²C RTC ,带有涓流充电器
DS1340Z-3+
型号: DS1340Z-3+
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

I2C RTC with Trickle Charger
I²C RTC ,带有涓流充电器

计时器或实时时钟 微控制器和处理器 外围集成电路 光电二极管
文件: 总13页 (文件大小:1432K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Rev 2; 12/04  
2
I C RTC with Trickle Charger  
General Description  
Features  
Enhanced Second Source for the ST M41T00  
The DS1340 is a real-time clock (RTC)/calendar that is  
pin compatible and functionally equivalent to the ST  
M41T00, including the software clock calibration. The  
device additionally provides trickle-charge capability  
Available in a Surface-Mount Package with an  
Integrated Crystal (DS1340C)  
2
Fast (400kHz) I C Interface  
on the V  
pin, a lower timekeeping voltage, and  
BACKUP  
Software Clock Calibration  
an oscillator STOP flag. Block access of the register  
map is identical to the ST device. Two additional regis-  
ters, which are accessed individually, are required for  
the trickle charger and flag. The clock/calendar pro-  
vides seconds, minutes, hours, day, date, month, and  
year information. A built-in power-sense circuit detects  
power failures and automatically switches to the back-  
up supply. The device is programmed serially through  
RTC Counts Seconds, Minutes, Hours, Day, Date,  
Month, and Year  
Automatic Power-Fail Detect and Switch Circuitry  
Trickle-Charge Capability  
Low Timekeeping Voltage Down to 1.3V  
Three Operating Voltage Ranges (1.8V, 3V, and 3.3V)  
Oscillator Stop Flag  
2
an I CTM bidirectional bus.  
Available in 8-Pin µSOP or SO Packages  
Underwriters Laboratory (UL) Recognized  
Applications  
Ordering Information  
Portable Instruments  
Point-of-Sale Equipment  
Medical Equipment  
Telecommunications  
TOP  
MARK  
PART  
TEMP RANGE PIN-PACKAGE  
DS1340Z-18  
DS1340Z-3  
DS1340Z-33  
-40°C to +85°C 8 SO (0.150in)  
-40°C to +85°C 8 SO (0.150in)  
-40°C to +85°C 8 SO (0.150in)  
D1340-18  
DS1340-3  
D1340-33  
1340  
A1-18  
1340  
A1-3  
Typical Operating Circuit  
DS1340U-18  
DS1340U-3  
DS1340U-33  
-40°C to +85°C 8 µSOP  
-40°C to +85°C 8 µSOP  
-40°C to +85°C 8 µSOP  
V
CC  
1340  
A1-33  
V
CC  
CRYSTAL  
1
RPU  
RPU  
V
CC  
DS1340C-18  
DS1340C-3  
DS1340C-33  
-40°C to +85°C 16 SO  
-40°C to +85°C 16 SO  
-40°C to +85°C 16 SO  
1340C-18  
1340C-3  
2
8
X1  
SCL  
X2  
V
CC  
7
3
6
5
1340C-33  
D1340-18  
DS1340-3  
D1340-33  
FT/OUT  
DS1340Z-18+ -40°C to +85°C 8 SO (0.150in)  
DS1340Z-3+ -40°C to +85°C 8 SO (0.150in)  
CPU  
DS1340  
SDA  
V
BACKUP  
DS1340Z-33+ -40°C to +85°C 8 SO (0.150in)  
GND  
4
1340  
A1-18  
RPU = t / C  
DS1340U-18+ -40°C to +85°C 8 µSOP  
R
B
1340  
A1-3  
DS1340U-3+  
-40°C to +85°C 8 µSOP  
1340  
A1-33  
DS1340U-33+ -40°C to +85°C 8 µSOP  
DS1340C-18+ -40°C to +85°C 16 SO  
1340C-18  
1340C-3  
1340C-33  
2
2
I C is a trademark of Philips Corp. Purchase of I C compo-  
nents from Maxim Integrated Products, Inc., or one of its subli-  
censed Associated Companies, conveys a license under the  
DS1340C-3+  
-40°C to +85°C 16 SO  
DS1340C-33+ -40°C to +85°C 16 SO  
2
2
Philips I C Patent Rights to use these components in an I C  
system, provided that the system conforms to the I C Standard  
2
Note: A "+" in the part number and a "+" anywhere on the top  
mark indicates a lead-free device.  
Specification as defined by Philips.  
Pin Configurations appear at end of data sheet.  
______________________________________________ Maxim Integrated Products  
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at  
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.  
2
I C RTC with Trickle Charger  
ABSOLUTE MAXIMUM RATINGS  
Voltage Range on V  
Pin Relative to Ground .....-0.3V to +6.0V  
Storage Temperature Range.............................-55°C to +125°C  
Soldering Temperature Range............................See IPC/JEDEC  
J-STD-020 Specification  
CC  
Voltage Range on SDA, SCL, and FT/OUT  
Relative to Ground..................................-0.3V to (V  
+ 0.3V)  
CC  
Operating Temperature Range ...........................-40°C to +85°C  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
AC ELECTRICAL CHARACTERISTICS  
(V  
= V  
to V  
, T = -40°C to +85°C, unless otherwise noted.) (Note 1, Figure 1)  
CC MAX A  
CC  
CC MIN  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Standard mode  
Fast mode  
0
100  
SCL Clock Frequency  
f
kHz  
SCL  
100  
4.7  
400  
Standard mode  
Fast mode  
Bus Free Time Between STOP  
and START Conditions  
t
µs  
µs  
µs  
µs  
µs  
ns  
µs  
ns  
ns  
µs  
BUF  
1.3  
Standard mode  
Fast mode  
4.0  
Hold Time (Repeated) START  
Condition (Note 2)  
t
HD:STA  
0.6  
Standard mode  
Fast mode  
4.7  
Low Period of SCL Clock  
High Period of SCL Clock  
Data Hold Time (Notes 3, 4)  
Data Setup Time (Note 5)  
START Setup Time  
t
LOW  
1.3  
Standard mode  
Fast mode  
4.0  
t
HIGH  
0.6  
Standard mode  
Fast mode  
0
0.9  
0.9  
t
HD:DAT  
0
Standard mode  
Fast mode  
250  
t
SU:DAT  
100  
Standard mode  
Fast mode  
4.7  
t
SU:STA  
0.6  
Standard mode  
Fast mode  
20 + 0.1C  
20 + 0.1C  
20 + 0.1C  
20 + 0.1C  
4.7  
1000  
300  
300  
300  
B
Rise Time of SDA and SCL  
Signals (Note 6)  
t
R
B
B
B
Standard mode  
Fast mode  
Fall Time of SDA and SCL Signals  
(Note 6)  
t
F
Standard mode  
Fast mode  
Setup Time for STOP Condition  
t
SU:STO  
0.6  
Capacitive Load for Each Bus  
Line  
C
(Note 6)  
400  
pF  
pF  
ns  
B
I/O Capacitance (SCL, SDA)  
C
10  
30  
I/O  
SP  
Pulse Width of Spikes that Must  
be Suppressed by the Input Filter  
t
Fast mode  
(Note 7)  
Oscillator Stop Flag (OSF) Delay  
t
100  
ms  
OSF  
2
_____________________________________________________________________  
2
I C RTC with Trickle Charger  
RECOMMENDED DC OPERATING CONDITIONS  
(V  
= V  
to V  
, T = -40°C to +85°C, unless otherwise noted. Typical values are at V  
= 3.3V, T = +25°C, unless  
CC A  
CC MIN  
CC MAX  
CC  
A
otherwise noted.) (Note 1)  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
DS1340-18  
DS1340-3  
DS1340-33  
(Note 8)  
1.71  
2.7  
1.8  
1.89  
Supply Voltage (Note 8)  
V
V
3.0  
3.3  
3.3  
5.5  
CC  
2.97  
0.7 x V  
-0.3  
Input Logic 1 (SDA, SCL)  
Input Logic 0 (SDA, SCL)  
V
V + 0.3  
CC  
V
V
IH  
CC  
V
(Note 8)  
+0.3 x V  
CC  
IL  
Supply Voltage, Pullup  
(FT/OUT, SDA, SCL), V  
V
(Note 8)  
5.5  
V
PU  
= 0V  
CC  
DS1340-18  
DS1340-3  
DS1340-33  
(Notes 9, 10)  
(Note 11)  
1.3  
1.3  
1.3  
3.7  
3.7  
5.5  
Backup Supply Voltage (Note 8)  
V
BACKUP  
V
R1  
R2  
R3  
250  
2000  
4000  
1.6  
Trickle-Charge Current-Limiting  
Resistors  
(Note 12)  
DS1340-18  
DS1340-3  
DS1340-33  
1.51  
2.45  
2.70  
-1  
1.71  
2.7  
Power-Fail Voltage (Note 8)  
V
V
2.6  
PF  
2.88  
2.97  
+1  
Input Leakage (SCL, CLK)  
I/O Leakage (SDA, FT/OUT)  
I
µA  
µA  
LI  
I
-1  
+1  
LO  
V
> 2V; V = 0.4V  
3.0  
CC  
OL  
SDA Logic 0 Output  
I
mA  
OLSDA  
1.7V < V  
< 2V; V = 0.2 x V  
3.0  
CC  
OL  
CC  
V
> 2V; V = 0.4V  
3.0  
CC  
OL  
mA  
µA  
FT/OUT Logic 0 Output  
I
1.7V < V  
1.3V < V  
< 2V; V = 0.2 x V  
3.0  
OLSQW  
CC  
CC  
OL  
CC  
< 1.7V; V = 0.2x V  
250  
150  
200  
300  
100  
125  
150  
100  
OL  
CC  
DS1340-18  
DS1340-3  
DS1340-33  
DS1340-18  
DS1340-3  
DS1340-33  
72  
108  
192  
60  
Active Supply Current (Note 13)  
Standby Current (Note 14)  
I
µA  
CCA  
I
µA  
nA  
81  
CCS  
100  
V
Leakage Current  
I
V
= 3.7V  
BACKUP  
BACKUP  
BACKUPLKG  
DC ELECTRICAL CHARACTERISTICS  
(V  
= 0V, V  
= 3.7V, T = -40°C to +85°C, unless otherwise noted.) (Note 1)  
BACKUP A  
CC  
PARAMETER  
SYMBOL  
CONDITIONS  
OSC ON, FT = 0 (Note 15)  
OSC ON, FT = 1 (Note 15)  
MIN  
TYP  
800  
850  
MAX  
1150  
1250  
UNITS  
nA  
I
BACKUP1  
BACKUP2  
I
V
V
Current  
BACKUP  
BACKUP  
OSC ON, FT = 0, V  
= 3.0V,  
BACKUP  
I
800  
1000  
100  
BACKUP3  
T
A
= +25°C (Notes 15, 16)  
Data-Retention Current  
I
OSC OFF  
25.0  
nA  
BACKUPDR  
_____________________________________________________________________  
3
2
I C RTC with Trickle Charger  
POWER-UP/POWER-DOWN CHARACTERISTICS  
(T = -40°C to +85°C) (Figure 2)  
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Recovery at Power-Up  
t
(Note 17)  
2
ms  
REC  
V
V
Fall Time; V  
PF(MIN)  
to  
to  
CC  
PF(MAX)  
t
300  
0
µs  
µs  
VCCF  
V
V
Rise Time; V  
PF(MIN)  
PF(MAX)  
CC  
t
VCCR  
WARNING: Under no circumstances are negative undershoots, of any amplitude, allowed when device is in battery-backup mode.  
Note 1:  
Note 2:  
Note 3:  
Limits at -40°C are guaranteed by design and not production tested.  
After this period, the first clock pulse is generated.  
A device must internally provide a hold time of at least 300ns for the SDA signal (referred to as the V  
signal) to bridge the undefined region of the falling edge of SCL.  
of the SCL  
IH(MIN)  
Note 4:  
Note 5:  
The maximum t  
only has to be met if the device does not stretch the low period (t  
) of the SCL signal.  
to 250ns must be met. This  
HD:DAT  
LOW  
A fast-mode device can be used in a standard-mode system, but the requirement t  
is automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the  
SU:DAT  
low period of the SCL signal, it must output the next data bit to the SDA line t  
before the SCL line is released.  
+ t  
= 1000 + 250 = 1250ns  
R MAX  
SU:DAT  
Note 6:  
Note 7:  
C —total capacitance of one bus line in pF.  
B
The parameter t  
is the period of time the oscillator must be stopped for the OSF flag to be set over the 0V V  
CC  
OSF  
V
and 1.3V V  
3.7V range.  
CCMAX  
BAT  
Note 8:  
Note 9:  
All voltages are referenced to ground.  
Measured at V = typ, V = 0V, register 08h = A5h.  
CC  
BACKUP  
Note 10: The use of the 250trickle-charge resistor is not allowed at V  
> 3.63V and should not be enabled.  
CC  
Note 11: Measured at V  
Note 12: Measured at V  
= typ, V  
= typ, V  
= 0V, register 08h = A6h.  
= 0V, register 08h = A7h.  
CC  
CC  
BACKUP  
BACKUP  
Note 13:  
I
—SCL clocking at max frequency = 400kHz.  
CCA  
2
Note 14: Specified with I C bus inactive.  
Note 15: Measured with a 32.768kHz crystal attached to the X1 and X2 pins.  
Note 16: Limits at +25°C are guaranteed by design and not production tested.  
Note 17: This delay applies only if the oscillator is enabled and running. If the oscillator is disabled or stopped, no power-up delay  
occurs.  
SDA  
t
BUF  
t
SP  
t
HD:STA  
t
LOW  
t
R
t
F
SCL  
t
SU:STA  
t
HD:STA  
t
HIGH  
t
SU:STO  
t
REPEATED  
START  
SU:DAT  
STOP  
START  
t
HD:DAT  
2
Figure 1. Data Transfer on I C Serial Bus  
4
_____________________________________________________________________  
2
I C RTC with Trickle Charger  
V
CC  
PF(MAX)  
V
V
V
PF  
PF  
V
PF(MIN)  
t
t
F
R
t
RPU  
t
RST  
RST  
RECOGNIZED  
VALID  
RECOGNIZED  
INPUTS  
DON'T CARE  
HIGH-Z  
OUTPUTS  
VALID  
Figure 2. Power-Up/Power-Down Timing  
Typical Operating Characteristics  
(V  
= +3.3V, T = +25°C, unless otherwise noted.)  
A
CC  
I
vs. V FT = 0  
I
vs. V FT = 0  
CC  
I (FT = 0) vs. V  
BACKUP1 BACKUP  
CCSA  
CC  
CCS  
250  
150  
125  
100  
75  
850  
800  
750  
700  
650  
600  
550  
500  
450  
400  
200  
150  
100  
50  
-3.3V  
-3.0V  
-1.8V  
50  
25  
0
0
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
(V)  
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
(V)  
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
V
V
V
BACKUP  
(V)  
CC  
CC  
I
(FT = 1) vs. V  
BACKUP  
FT vs. V  
I
vs. TEMPERATURE  
BACKUP2  
BACKUP  
BACKUP3  
850  
800  
750  
700  
650  
600  
550  
500  
450  
400  
512.0000  
511.9995  
511.9990  
511.9985  
511.9980  
511.9975  
511.9970  
511.9965  
511.9960  
850  
800  
750  
700  
650  
600  
550  
500  
V
= 3.0V  
BACKUP  
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
(V)  
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
(V)  
-40  
-20  
0
20  
40  
60  
80  
V
V
TEMPERATURE (°C)  
BACKUP  
BACKUP  
_____________________________________________________________________  
5
2
I C RTC with Trickle Charger  
Pin Description  
PIN  
NAME  
X1  
FUNCTION  
8
16  
Connections for a Standard 32.768kHz Quartz Crystal. The internal oscillator circuitry is designed for  
operation with a crystal having a specified load capacitance (C ) of 12.5pF. X1 is the input to the  
L
1
oscillator and can optionally be connected to an external 32.768kHz oscillator. The output of the internal  
oscillator, X2, is floated if an external oscillator is connected to X1.  
2
X2  
Connection for a Secondary Power Supply. For the 1.8V and 3V devices, V  
must be held  
BACKUP  
between 1.3V and 3.7V for proper operation. V  
can be as high as 5.5V on the 3.3V device.  
BACKUP  
3
14  
V
This pin can be connected to a primary cell such as a lithium coin cell. Additionally, this pin can be  
connected to a rechargeable cell or a super cap when used with the trickle-charge feature. UL  
recognized to ensure against reverse charging when used with a lithium battery.  
BACKUP  
4
5
15  
16  
GND  
SDA  
Ground  
2
Serial Data Input/Output. SDA is the data input/output for the I C serial interface. The SDA pin is open  
drain and requires an external pullup resistor.  
2
Serial Clock Input. SCL is the clock input for the I C interface and is used to synchronize data movement  
on the serial interface.  
6
7
1
2
SCL  
Frequency Test/Output. This pin is used to output either a 512Hz signal or the value of the OUT bit. When  
the FT bit is logic 1, the FT/OUT pin toggles at a 512Hz rate. When the FT bit is logic 0, the FT/OUT pin  
reflects the value of the OUT bit. This open-drain pin requires an external pullup resistor, and operates  
FT/OUT  
with either V  
or V  
applied.  
BACKUP  
CC  
8
3
V
DC Power for Primary Power Supply  
CC  
4–13  
N.C.  
No Connection. Must be connected to ground.  
Detailed Description  
Table 1. Crystal Specifications*  
The DS1340 is a low-power clock/calendar with a trickle  
charger. Address and data are transferred serially  
PARAMETER  
Nominal  
SYMBOL MIN  
TYP  
MAX UNITS  
f
32.768  
kHz  
O
2
through a I C bidirectional bus. The clock/calendar pro-  
Frequency  
vides seconds, minutes, hours, day, date, month, and  
year information. The date at the end of the month is  
automatically adjusted for months with fewer than 31  
days, including corrections for leap year. The DS1340  
has a built-in power-sense circuit that detects power fail-  
ures and automatically switches to the backup supply.  
Series Resistance  
Load Capacitance  
ESR  
45,60**  
k  
pF  
C
12.5  
L
*The crystal, traces, and crystal input pins should be isolated  
from RF generating signals. Refer to Application Note 58:  
Crystal Considerations for Dallas Real-Time Clocks for addi-  
tional specifications.  
**A crystal with up to 60kESR can be used if the minimum  
operating voltages on both V  
and V  
are at least 2.0V.  
Oscillator Circuit  
CC  
BACKUP  
The DS1340 uses an external 32.768kHz crystal. The  
oscillator circuit does not require any external resistors  
or capacitors to operate. Table 1 specifies several crys-  
tal parameters for the external crystal. Figure 3 shows a  
functional schematic of the oscillator circuit. If using a  
crystal with the specified characteristics, the startup  
time is usually less than one second.  
RTC  
COUNTDOWN  
CHAIN  
RTC  
REGISTERS  
C 1  
L
C 2  
L
Clock Accuracy  
The initial clock accuracy depends on the accuracy of  
the crystal and the accuracy of the match between the  
capacitive load of the oscillator circuit and the capaci-  
tive load for which the crystal was trimmed. Additional  
X2  
X1  
CRYSTAL  
Figure 3. Oscillator Circuit Showing Internal Bias Network  
_____________________________________________________________________  
6
2
I C RTC with Trickle Charger  
LOCAL GROUND PLANE (LAYER 2)  
X1  
X2  
FT/OUT  
32,768Hz  
512Hz  
MUX/BUFFER  
OSCILLATOR  
X1  
X2  
DIVIDER AND  
CALIBRATION  
CIRCUIT  
"C" VERSION ONLY  
CRYSTAL  
V
CC  
POWER  
CONTROL  
CLOCK AND  
CALENDAR  
REGISTERS  
1Hz  
V
BACKUP  
CONTROL  
LOGIC  
SCL  
SDA  
SERIAL BUS  
INTERFACE  
AND ADDRESS  
REGISTER  
USER BUFFER  
(7 BYTES)  
GND  
DS1340  
Figure 4. Layout Example  
Figure 5. Functional Diagram  
error is added by crystal frequency drift caused by  
temperature shifts. External circuit noise coupled into  
the oscillator circuit can result in the clock running fast.  
Figure 4 shows a typical PC board layout for isolating  
the crystal and oscillator from noise. Refer to  
Application Note 58: Crystal Considerations with Dallas  
Real-Time Clocks (www.maxim-ic.com/RTCapps) for  
detailed information.  
condition and providing a device identification code fol-  
lowed by data. Subsequent registers can be accessed  
sequentially until a STOP condition is executed. The  
device is fully accessible and data can be written and  
read when V  
is greater than V . However, when  
PF  
CC  
V
falls below V , the internal clock registers are  
CC  
PF  
blocked from any access. If V is less than V  
,
BACKUP  
PF  
the device power is switched from V  
to V  
BACKUP  
CC  
when V  
V
V
drops below V . If V  
is greater than  
CC  
PF  
PF  
DS1340C Only  
, the device power is switched from V  
to  
CC  
. The regis-  
BACKUP  
BACKUP  
The DS1340C integrates a standard 32,768Hz crystal  
when V  
drops below V  
CC  
BACKUP  
into the package. Typical accuracy with nominal V  
CC  
ters are maintained from the V  
source until V  
CC  
BACKUP  
and +25°C is approximately +15ppm. Refer to  
Application Note 58 for information about crystal accu-  
racy vs. temperature.  
is returned to nominal levels. The functional diagram  
(Figure 5) shows the main elements of the serial RTC.  
Address Map  
Table 2 shows the DS1340 address map. The RTC reg-  
isters are located in address locations 00h to 06h, and  
the control register is located at 07h. The trickle-charge  
Operation  
The DS1340 operates as a slave device on the serial  
bus. Access is obtained by implementing a START  
Table 2. Address Map  
ADDRESS  
00H  
BIT 7  
BIT 6  
BIT 5  
BIT 4  
BIT 3  
BIT 2  
BIT 1  
BIT 0  
FUNCTION  
Seconds  
Minutes  
Century/Hours  
Day  
RANGE  
00–59  
00–59  
0–1; 00–23  
01–07  
01–31  
01–12  
00–99  
EOSC  
10 Seconds  
10 Minutes  
Seconds  
01H  
X
CEB  
X
Minutes  
Hours  
02H  
CB  
X
10 Hours  
03H  
X
X
X
X
Day  
04H  
X
X
10 Date  
Date  
Month  
Year  
Date  
05H  
X
X
10 Month  
Month  
06H  
10 Year  
Year  
07H  
OUT  
TCS3  
OSF  
FT  
TCS2  
0
S
TCS1  
0
CAL4  
TCS0  
0
CAL3  
DS1  
0
CAL2  
DS0  
0
CAL1  
CAL0  
Control  
08H  
ROUT1  
0
ROUT0 Trickle Charger  
Flag  
09H  
0
X = Read/Write bit  
Note: Unless otherwise specified, the state of the registers is not defined when power is first applied.  
_____________________________________________________________________  
7
2
I C RTC with Trickle Charger  
BIT 7  
BIT 6  
BIT 5  
BIT 4  
BIT 3  
DS1  
BIT 2  
BIT 1  
BIT 0  
TCS3 TCS2 TCS1 TCS0  
DS0 ROUT1 ROUT0  
TCS = TRICKLE-CHARGER SELECT  
0-3  
DS = DIODE SELECT  
0-1  
TOUT = RESISTOR SELECT  
0-1  
1 OF 16 SELECT  
NOTE: ONLY 1010b  
ENABLES CHARGER  
1 OF 2  
SELECT  
1 OF 3  
SELECT  
R1  
250  
R2  
2kΩ  
V
V
BACKUP  
CC  
R3  
4kΩ  
Figure 6. Trickle Charger Functional Diagram  
and flag registers are located in address locations 08h  
to 09h. During a multibyte access of the timekeeping  
registers, when the address pointer reaches 07h—the  
end of the clock and control register space—it wraps  
around to location 00h. Writing the address pointer to  
the corresponding location accesses address locations  
08h and 09h. After accessing location 09h, the address  
bit (CEB) and the century bit (CB). Setting CEB to logic  
1 causes the CB bit to toggle, either from a logic 0 to a  
logic 1, or from a logic 1 to a logic 0, when the years  
register rolls over from 99 to 00. If CEB is set to logic 0,  
CB does not toggle.  
When reading or writing the time and date registers,  
secondary (user) buffers are used to prevent errors  
when the internal registers update. When reading the  
time and date registers, the user buffers are synchro-  
nized to the internal registers on any START or STOP  
and when the register pointer rolls over to zero. The  
time information is read from these secondary registers  
while the clock continues to run. This eliminates the  
need to reread the registers in case the internal regis-  
ters update during a read.  
2
pointer wraps around to location 00h. On a I C START,  
STOP, or address pointer incrementing to location 00h,  
the current time is transferred to a second set of regis-  
ters. The time information is read from these secondary  
registers, while the clock may continue to run. This  
eliminates the need to reread the registers in case the  
main registers update during a read.  
Clock and Calendar  
The divider chain is reset whenever the seconds regis-  
ter is written. Write transfers occur on the acknowledge  
from the DS1340. Once the divider chain is reset, to  
avoid rollover issues, the remaining time and date reg-  
isters must be written within one second.  
The time and calendar information is obtained by read-  
ing the appropriate register bytes. Table 2 shows the  
RTC registers. The time and calendar data are set or  
initialized by writing the appropriate register bytes. The  
contents of the time and calendar registers are in the  
binary-coded decimal (BCD) format. The day-of-week  
register increments at midnight. Values that correspond  
to the day of week are user-defined but must be  
sequential (i.e., if 1 equals Sunday, then 2 equals  
Monday, and so on). Illogical time and date entries  
result in undefined operation. Bit 7 of register 0 is the  
enable oscillator (EOSC) bit. When this bit is set to 1, the  
oscillator is disabled. When cleared to 0, the oscillator is  
enabled. The initial power-up value of EOSC is 0.  
Special-Purpose Registers  
The DS1340 has three additional registers (control,  
trickle charger, and flag) that control the RTC, trickle  
charger, and oscillator flag output.  
Control Register (07h)  
Bit 7: Output Control (OUT). This bit controls the out-  
put level of the FT/OUT pin when the FT bit is set to 0. If  
FT = 0, the logic level on the FT/OUT pin is 1 if OUT = 1  
and 0 if OUT = 0. The initial power-up OUT value is 1.  
Location 02h is the century/hours register. Bit 7 and bit  
6 of the century/hours register are the century-enable  
8
_____________________________________________________________________  
2
I C RTC with Trickle Charger  
Bit 6: Frequency Test (FT). When this bit is 1, the  
ing current can be calculated as illustrated in the fol-  
lowing example.  
FT/OUT pin toggles at a 512Hz rate. When FT is written  
to 0, the OUT bit controls the state of the FT/OUT pin.  
The initial power-up value of FT is 0.  
Assume that a 3.3V system power supply is applied to  
V
and a super cap is connected to V . Also  
BACKUP  
CC  
Bit 5: Calibration Sign Bit (S). A logic 1 in this bit indi-  
cates positive calibration for the RTC. A 0 indicates  
negative calibration for the clock. See the Clock  
Calibration section for a detailed description of the bit  
operation. The initial power-up value of S is 0.  
assume that the trickle charger has been enabled with  
a diode and resistor R2 between V and V  
.
BACKUP  
CC  
The maximum current I  
ed as follows:  
would therefore be calculat-  
MAX  
I
= (3.3V - diode drop) / R2 (3.3V - 0.7V) /  
2kΩ ≈ 1.3mA  
MAX  
Bits 4 to 0: Calibration Bits (CAL4 to CAL0). These  
bits can be set to any value between 0 and 31 in binary  
form. See the Clock Calibration section for a detailed  
description of the bit operation. The initial power-up  
value of CAL0–CAL4 is 0.  
As the super cap charges, the voltage drop between  
V
and V  
decreases and therefore the charge  
BACKUP  
CC  
current decreases.  
Flag Register (09h)  
Trickle-Charger Register (08h)  
The simplified schematic in Figure 6 shows the basic  
components of the trickle charger. The trickle-charge  
select (TCS) bits (bits 4–7) control the selection of the  
trickle charger. To prevent accidental enabling, only a  
pattern on 1010 enables the trickle charger. All other  
patterns disable the trickle charger. The trickle charger  
is disabled when power is first applied. The diode-  
select (DS) bits (bits 2, 3) select whether or not a diode  
Bit 7: Oscillator Stop Flag (OSF). A logic 1 in this bit  
indicates that the oscillator has stopped or was  
stopped for some time period and may be used to  
judge the validity of the clock and calendar data. This  
bit is edge triggered and is set to logic 1 when the  
internal circuitry senses that the oscillator has transi-  
tioned from a normal run state to a STOP condition. The  
following are examples of conditions that can cause the  
OSF bit to be set:  
is connected between V  
and V  
. If DS is 01,  
CC  
BACKUP  
1) The first time power is applied.  
no diode is selected; if DS is 10, a diode is selected.  
The ROUT bits (bits 0, 1) select the value of the resistor  
2) The voltages present on V  
and V  
BACKUP  
CC  
connected between V  
and V  
. Table 3 shows  
BACKUP  
are insufficient to support oscillation.  
CC  
the resistor selected by the resistor select (ROUT) bits  
and the diode selected by the diode select (DS) bits.  
3) The EOSC bit is set to 1, disabling the  
oscillator.  
Warning: The ROUT value of 250must not be select-  
4) External influences on the crystal (e.g., noise,  
leakage).  
ed whenever V  
is greater than 3.63V.  
CC  
The user determines diode and resistor selection  
according to the maximum current desired for battery  
or super cap charging (Table 3). The maximum charg-  
The OSF bit remains at logic 1 until written to logic 0. It  
can only be written to logic 0. Attempting to write OSF  
to logic 1 leaves the value unchanged.  
Table 3. Trickle-Charge Register  
TCS3  
TCS2  
TCS1  
TCS0  
DS1  
0
DS0  
0
ROUT1  
ROUT0  
FUNCTION  
X
X
X
1
1
1
1
1
1
0
X
X
X
0
0
0
0
0
0
0
X
X
X
1
1
1
1
1
1
0
X
X
X
0
0
0
0
0
0
0
X
X
0
0
0
1
1
1
1
0
X
X
0
1
1
0
0
1
1
0
Disabled  
Disabled  
Disabled  
1
1
X
X
0
1
No diode, 250resistor  
One diode, 250resistor  
No diode, 2kresistor  
One diode, 2kresistor  
No diode, 4kresistor  
One diode, 4kresistor  
Power-on reset value  
1
0
0
1
1
0
0
1
1
0
0
0
_____________________________________________________________________  
9
2
I C RTC with Trickle Charger  
SDA  
MSB  
SLAVE ADDRESS  
R/W  
ACKNOWLEDGEMENT  
SIGNAL FROM RECEIVER  
DIRECTION  
BIT  
ACKNOWLEDGEMENT  
SIGNAL FROM RECEIVER  
SCL  
1
2
6
7
8
9
1
2
3–7  
8
9
ACK  
ACK  
START  
CONDITION  
STOP  
CONDITION  
OR REPEATED  
START  
REPEATED IF MORE BYTES  
ARE TRANSFERED  
CONDITION  
2
Figure 7. I C Data Transfer Overview  
Bits 6 to 0: All other bits in the flag register read as 0  
sent +10.7 or -5.35 seconds per month, corresponding  
to +5.5 or -2.75 minutes per month.  
and cannot be written.  
For example, if using the FT function, a reading of  
512.01024Hz would indicate a +20ppm oscillator fre-  
quency error, requiring a -10(00 1010) value to be  
loaded in the S bit and the five calibration bits.  
Clock Calibration  
The DS1340 provides a digital clock calibration feature  
to allow compensation for crystal and temperature vari-  
ations. The calibration circuit adds or subtracts counts  
from the oscillator divider chain at the divide-by-256  
stage. The number of pulses blanked (subtracted for  
negative calibration) or inserted (added for positive cal-  
ibration) depends upon the value loaded into the five  
calibration bits (CAL4–CAL0) located in the control reg-  
ister. Adding counts speeds the clock up and subtract-  
ing counts slows the clock down.  
Note: Setting the calibration bits does not affect the fre-  
quency test output frequency. Also note that writing to  
the control register resets the divider chain.  
2
I C Serial Data Bus  
2
The DS1340 supports a bidirectional I C bus and data  
transmission protocol. A device that sends data onto  
the bus is defined as a transmitter and a device receiv-  
ing data as a receiver. The device that controls the  
message is called a master. The devices that are con-  
trolled by the master are slaves. A master device that  
generates the serial clock (SCL), controls the bus  
access, and generates the START and STOP condi-  
tions must control the bus. The DS1340 operates as a  
The calibration bits can be set to any value between 0  
and 31 in binary form. Bit 5 of the control register, S, is  
the sign bit. A value of 1 for the S bit indicates positive  
calibration, while a value of 0 represents negative cali-  
bration. Calibration occurs within a 64-minute cycle.  
The first 62 minutes in the cycle can, once per minute,  
have a one-second interval where the calibration is per-  
formed. Negative calibration blanks 128 cycles of the  
32,768Hz oscillator, slowing the clock down. Positive  
calibration inserts 256 cycles of the 32,768Hz oscillator,  
speeding the clock up. If a binary 1 is loaded into the  
calibration bits, only the first two minutes in the 64-  
minute cycle are modified. If a binary 6 is loaded, the  
first 12 minutes are affected, and so on. Therefore,  
each calibration step either adds 512 or subtracts 256  
oscillator cycles for every 125,829,120 actual 32,678Hz  
oscillator cycles (64 minutes). This equates to  
+4.068ppm or -2.034ppm of adjustment per calibration  
step. If the oscillator runs at exactly 32,768Hz, each of  
the 31 increments of the calibration bits would repre-  
2
slave on the I C bus. Connections to the bus are made  
through the open-drain I/O lines SDA and SCL. Within  
the bus specifications a standard mode (100kHz max  
clock rate) and a fast mode (400kHz max clock rate)  
are defined. The DS1340 works in both modes.  
The following bus protocol has been defined (Figure 7):  
Data transfer can be initiated only when the bus is  
not busy.  
During data transfer, the data line must remain  
stable whenever the clock line is high. Changes in  
the data line while the clock line is high are inter-  
preted as control signals.  
10  
____________________________________________________________________  
2
I C RTC with Trickle Charger  
<SLAVE  
ADDRESS>  
S 1101000  
<SLAVE  
ADDRESS>  
S 1101000  
<WORD  
<DATA (n)>  
<DATA (n + 1)> <DATA (n + 2)> <DATA (n + X)>  
ADDRESS (n)> <DATA (n)> <DATA (n + 1)> <DATA (n + X)>  
XXXXXXXX A XXXXXXXX A XXXXXXXX A XXXXXXXX A P  
1
A
XXXXXXXX A XXXXXXXX A XXXXXXXX A XXXXXXXX A P  
0
A
DATA TRANSFERRED  
(X + 1 BYTES + ACKNOWLEDGE)  
NOTE: LAST DATA BYTE IS FOLLOWED BY  
A NOT ACKNOWLEDGE (A) SIGNAL  
S — START  
A — ACKNOWLEDGE  
P — STOP  
S — START  
A — ACKNOWLEDGE  
P — STOP  
DATA TRANSFERRED  
(X + 1 BYTES + ACKNOWLEDGE)  
R/W — READ/WRITE OR DIRECTION BIT ADDRESS = D0H  
A — NOT ACKNOWLEDGE  
R/W — READ/WRITE OR DIRECTION BIT ADDRESS = D0H  
Figure 8. Slave Receiver Mode (Write Mode)  
Figure 9. Slave Transmitter Mode (Read Mode  
Accordingly, the following bus conditions have been  
defined:  
Figures 8 and 9 detail how data transfer is accom-  
2
plished on the I C bus. Depending upon the state of  
the R/W bit, two types of data transfer are possible:  
Bus not busy: Both data and clock lines remain  
high.  
Data transfer from a master transmitter to a  
slave receiver. The first byte transmitted by the  
master is the slave address. Next follows a num-  
ber of data bytes. The slave returns an acknowl-  
edge bit after each received byte.  
START data transfer: A change in the data line’s  
state from high to low, while the clock line is high,  
defines a START condition.  
STOP data transfer: A change in the data line’s  
state from low to high, while the clock line is high,  
defines a STOP condition.  
Data transfer from a slave transmitter to a mas-  
ter receiver. The master transmits the first byte (the  
slave address). The slave then returns an acknowl-  
edge bit. Next follows a number of data bytes trans-  
mitted by the slave to the master. The master  
returns an acknowledge bit after all received bytes  
other than the last byte. At the end of the last  
received byte, a not acknowledge is returned.  
Data valid: The data line’s state represents valid  
data when, after a START condition, the data line is  
stable for the duration of the high period of the  
clock signal. The data on the line must be changed  
during the low period of the clock signal. There is  
one clock pulse per bit of data.  
The master device generates all the serial clock  
pulses and the START and STOP conditions. A  
transfer is ended with a STOP condition or with a  
repeated START condition. Since a repeated  
START condition is also the beginning of the next  
serial transfer, the bus is not released.  
Each data transfer is initiated with a START condi-  
tion and terminated with a STOP condition. The  
number of data bytes transferred between the  
START and STOP conditions is not limited, and is  
determined by the master device. The information  
is transferred byte-wise and each receiver  
acknowledges with a ninth bit.  
The DS1340 can operate in the following two modes:  
Slave Receiver Mode (Write Mode): Serial data  
and clock are received through SDA and SCL.  
After each byte is received, an acknowledge bit is  
transmitted. Start and STOP conditions are recog-  
nized as the beginning and end of a serial trans-  
fer. Hardware performs address recognition after  
reception of the slave address and direction bit.  
The slave address byte is the first byte received  
after the master generates the START condition.  
The slave address byte contains the 7-bit DS1340  
address, which is 1101000, followed by the direc-  
tion bit (R/W), which is 0 for a write. After receiving  
and decoding the slave address byte, the DS1340  
outputs an acknowledge on SDA. After the  
DS1340 acknowledges the slave address + write  
bit, the master transmits a word address to the  
DS1340. This sets the register pointer on the  
DS1340, with the DS1340 acknowledging the  
transfer. The master can then transmit zero or  
Acknowledge: Each receiving device, when  
addressed, is obliged to generate an acknowl-  
edge after the reception of each byte. The master  
device must generate an extra clock pulse that is  
associated with this acknowledge bit.  
A device that acknowledges must pull down the  
SDA line during the acknowledge clock pulse in  
such a way that the SDA line is stable low during  
the high period of the acknowledge-related clock  
pulse. Setup and hold times must be taken into  
account. A master must signal an end of data to  
the slave by not generating an acknowledge bit on  
the last byte that has been clocked out of the  
slave. In this case, the slave must leave the data  
line high to enable the master to generate the  
STOP condition.  
____________________________________________________________________ 11  
2
I C RTC with Trickle Charger  
more bytes of data, with the DS1340 acknowledg-  
ing each byte received. The register pointer incre-  
ments after each data byte is transferred. The  
master generates a STOP condition to terminate  
the data write.  
Handling, PC Board  
Layout, and Assembly  
The DS1340C package contains a quartz tuning-fork  
crystal. Pick-and-place equipment may be used, but  
precautions should be taken to ensure that excessive  
shocks are avoided. Ultrasonic cleaning should be  
avoided to prevent damage to the crystal.  
Slave Transmitter Mode (Read Mode): The first  
byte is received and handled as in the slave  
receiver mode. However, in this mode, the direc-  
tion bit indicates that the transfer direction is  
reversed. The DS1340 transmits serial data on  
SDA while the serial clock is input on SCL. Start  
and STOP conditions are recognized as the begin-  
ning and end of a serial transfer. Hardware per-  
forms address recognition after reception of the  
slave address and direction bit. The slave address  
byte is the first byte received after the master gen-  
erates the START condition. The slave address  
byte contains the 7-bit DS1340 address, which is  
1101000, followed by the direction bit (R/W),  
which is 1 for a read. After receiving and decoding  
the slave address byte, the DS1340 outputs an  
acknowledge on SDA. The DS1340 then begins to  
transmit data starting with the register address  
pointed to by the register pointer. If the register  
pointer is not written to before the initiation of a  
read mode, the first address that is read is the last  
one stored in the register pointer. The DS1340  
must receive a not acknowledge to end a read.  
Avoid running signal traces under the package, unless  
a ground plane is placed between the package and the  
signal line. All N.C. (no connect) pins must be connect-  
ed to ground.  
The SO package may be reflowed as long as the peak  
temperature does not exceed 240°C. Peak reflow tem-  
perature (230°C) duration should not exceed 10 sec-  
onds, and the total time above 200°C should not  
exceed 40 seconds (30 seconds nominal). Exposure to  
reflow is limited to 2 times maximum.  
Moisture-sensitive packages are shipped from the facto-  
ry dry-packed.Handling instructions listed on the pack-  
age label must be followed to prevent damage during  
reflow. Refer to the IPC/JEDEC J-STD-020 standard for  
moisture-sensitive device (MSD) classifications.  
Pin Configurations  
TOP VIEW  
SCL  
1
2
3
4
5
6
7
8
16 SDA  
15 GND  
FT/OUT  
X1  
X2  
1
2
3
4
8
7
6
5
V
CC  
V
CC  
14 V  
BACKUP  
FT/OUT  
SCL  
N.C.  
N.C.  
N.C.  
N.C.  
N.C.  
13 N.C.  
12 N.C.  
11 N.C.  
10 N.C.  
DS1340  
DS1340C  
V
BACKUP  
GND  
SDA  
SO, µSOP  
9
N.C.  
SO (300 mils)  
12  
____________________________________________________________________  
2
I C RTC with Trickle Charger  
Package Information  
Chip Information  
For the latest package outline information, go to  
www.maxim-ic.com/DallasPackInfo.  
TRANSISTOR COUNT: 10,930  
PROCESS: CMOS  
SUBSTRATE CONNECTED TO GROUND  
Thermal Information  
Theta-JA: +170°C/W (0.150in SO)  
Theta-JC: +40°C/W (0.150in SO)  
Theta-JA: +221°C/W (µSOP)  
Theta-JC: +39°C/W (µSOP)  
Theta-JA: +89.6°C/W (0.300in SO)  
Theta-JC: +24.8°C/W (0.300in SO)  
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are  
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.  
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13  
© 2004 Maxim Integrated Products  
Printed USA  
is a registered trademark of Maxim Integrated Products.  
is a registered trademark of Dallas Semiconductor Corporation.  

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