DS1742W-150 [MAXIM]

Y2KC Nonvolatile Timekeeping RAMwww.; Y2KC非易失时钟RAMwww 。
DS1742W-150
型号: DS1742W-150
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

Y2KC Nonvolatile Timekeeping RAMwww.
Y2KC非易失时钟RAMwww 。

计时器或实时时钟 微控制器和处理器 外围集成电路 双倍数据速率
文件: 总16页 (文件大小:493K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DS1742  
Y2KC Nonvolatile Timekeeping  
RAM  
www.maxim-ic.com  
FEATURES  
PIN CONFIGURATION  
Integrated NV SRAM, Real-Time Clock,  
Crystal, Power-Fail Control Circuit and  
Lithium Energy Source  
Clock Registers are Accessed Identically to  
the Static RAM; These Registers are  
Resident in the Eight Top RAM Locations  
Century Byte Register  
Totally Nonvolatile with Over 10 Years of  
Operation in the Absence of Power  
BCD Coded Century, Year, Month, Date,  
Day, Hours, Minutes, and Seconds with  
Automatic Leap Year Compensation Valid  
Up to the year 2100  
TOP VIEW  
1
2
3
4
5
6
7
8
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
VCC  
A8  
A9  
WE  
OE  
A10  
CE  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
DS1742  
9
DQ0  
DQ1  
DQ2  
GND  
10  
11  
12  
ENCAPSULATED DIP  
Battery Voltage Level Indicator Flag  
Power-Fail Write Protection Allows for ±10%  
VCC Power Supply Tolerance  
Lithium Energy Source is Electrically  
Disconnected to Retain Freshness until  
Power is Applied for the First Time  
Standard JEDEC Bytewide 2k x 8 Static  
RAM Pinout  
Quartz Accuracy ±1 Minute a Month at  
+25°C, Factory Calibrated  
Underwriters Laboratories (UL®)  
Recognized  
ORDERING INFORMATION  
PART  
VOLTAGE (V)  
TEMP RANGE  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
-40°C to +85°C  
-40°C to +85°C  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
PIN-PACKAGE  
24 EDIP (0.740a)  
24 EDIP (0.740a)  
24 EDIP (0.740a)  
24 EDIP (0.740a)  
24 EDIP (0.740a)  
24 EDIP (0.740a)  
24 EDIP (0.740a)  
24 EDIP (0.740a)  
24 EDIP (0.740a)  
24 EDIP (0.740a)  
TOP MARK**  
DS1742-85  
DS1742-85+  
DS1742-100  
DS1742-100+  
DS1742-100IND  
DS1742-100IND+  
DS1742W-120  
DS1742W-120+  
DS1742W-150  
DS1742W-150+  
5.0  
5.0  
5.0  
5.0  
5.0  
5.0  
3.3  
3.3  
3.3  
3.3  
DS1742-85  
DS1742-85+  
DS1742-100  
DS1742-100+  
DS1742-100IND  
DS1742-100IND+  
DS1742W-120  
DS1742W-120+  
DS1742W-150  
DS1742W-150+  
+Denotes a lead-free/RoHS-compliant device.  
**The top mark will include a “+” on lead-free devices.  
UL is a registered trademark of Underwriters Laboratories, Inc.  
1 of 16  
REV: 102808  
DS1742  
PIN DESCRIPTION  
PIN  
1
NAME  
A7  
FUNCTION  
2
A6  
3
A5  
4
A4  
5
A3  
Address Input  
6
A2  
7
A1  
8
A0  
19  
22  
23  
9
A10  
A9  
A8  
DQ0  
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
GND  
CE  
10  
11  
13  
14  
15  
16  
17  
12  
18  
20  
21  
24  
Data Input/Output  
Ground  
Active-Low Chip-Enable Input  
Active-Low Output-Enable Input  
Active-Low Write-Enable Input  
Power-Supply Input  
OE  
WE  
VCC  
DESCRIPTION  
The DS1742 is a full-function, year 2000-compliant (Y2KC), real-time clock/calendar (RTC) and  
2k x 8 nonvolatile static RAM. User access to all registers within the DS1742 is accomplished  
with a bytewide interface as shown in Figure 1. The RTC information and control bits reside in  
the eight uppermost RAM locations. The RTC registers contain century, year, month, date, day,  
hours, minutes, and seconds data in 24-hour BCD format. Corrections for the day of the month  
and leap year are made automatically.  
The RTC clock registers are double-buffered to avoid access of incorrect data that can occur  
during clock update cycles. The double-buffered system also prevents time loss as the  
timekeeping countdown continues unabated by access to time register data. The DS1742 also  
contains its own power-fail circuitry, which deselects the device when the VCC supply is in an  
out-of-tolerance condition. This feature prevents loss of data from unpredictable system  
operation brought on by low VCC as errant access and update cycles are avoided.  
2 of 16  
DS1742  
CLOCK OPERATIONS—READING THE CLOCK  
While the double-buffered register structure reduces the chance of reading incorrect data,  
internal updates to the DS1742 clock registers should be halted before clock data is read to  
prevent reading of data in transition. However, halting the internal clock register updating  
process does not affect clock accuracy. Updating is halted when a 1 is written into the read bit,  
bit 6 of the century register, see Table 2. As long as a 1 remains in that position, updating is  
halted. After a halt is issued, the registers reflect the count, that is day, date, and time that was  
current at the moment the halt command was issued. However, the internal clock registers of  
the double-buffered system continue to update so that the clock accuracy is not affected by the  
access of data. All of the DS1742 registers are updated simultaneously after the internal clock  
register updating process has been re-enabled. Updating is within a second after the read bit is  
written to 0. The READ bit must be a zero for a minimum of 500μs to ensure the external  
registers will be updated.  
Figure 1. DS1742 BLOCK DIAGRAM  
Table 1. TRUTH TABLE  
VCC  
MODE  
Deselect  
Write  
Read  
Read  
DQ  
POWER  
Standby  
Active  
Active  
Active  
CE OE  
WE  
X
VIL  
VIH  
VIL  
X
X
High-Z  
Data In  
Data Out  
High-Z  
High-Z  
High-Z  
VCC > VPF  
VIL VIL VIH  
VIL VIH VIH  
VSO < VCC < VPF  
VCC < VSO < VPF  
X
X
X
X
X
X
Deselect  
Deselect  
CMOS Standby  
Data Retention Mode  
3 of 16  
DS1742  
SETTING THE CLOCK  
As shown in Table 2, bit 7 of the century register is the write bit. Setting the write bit to a 1, like  
the read bit, halts updates to the DS1742 registers. The user can then load them with the  
correct day, date and time data in 24-hour BCD format. Resetting the write bit to a 0 then  
transfers those values to the actual clock counters and allows normal operation to resume.  
STOPPING AND STARTING THE CLOCK OSCILLATOR  
The clock oscillator may be stopped at any time. To increase the shelf life, the oscillator can be  
turned off to minimize current drain from the battery. The OSC bit is the MSB (bit 7) of the  
seconds registers, see Table 2. Setting it to a 1 stops the oscillator.  
FREQUENCY TEST BIT  
As shown in Table 2, bit 6 of the day byte is the frequency test bit. When the frequency test bit  
is set to logic 1 and the oscillator is running, the LSB of the seconds register will toggle at 512  
Hz. When the seconds register is being read, the DQ0 line will toggle at the 512 Hz frequency  
as long as conditions for access remain valid (i.e., CE low, OE low, WE high, and address for  
seconds register remain valid and stable).  
CLOCK ACCURACY  
The DS1742 is guaranteed to keep time accuracy to within ±1 minute per month at 25°C. Dallas  
Semiconductor calibrates the RTC at the factory using nonvolatile tuning elements. The  
DS1742 does not require additional calibration. For this reason, methods of field clock  
calibration are not available and not necessary. Clock accuracy is also affected by the electrical  
environment and caution should be taken to place the RTC in the lowest level EMI section of  
the PCB layout. For additional information refer to Application Note 58.  
Table 2. REGISTER MAP  
DATA  
B4  
ADDRES  
S
FUNCTION  
RANGE  
B7  
B6  
B5  
B3  
B2  
Year  
B1  
B0  
7FF  
10 Year  
Year  
00–99  
01–12  
10  
Month  
10 Date  
7FE  
X
X
X
FT  
X
X
Month  
Month  
7FD  
7FC  
7FB  
7FA  
7F9  
7F8  
X
BF  
X
Date  
Day  
Hour  
Date  
Day  
Hour  
Minutes  
Seconds  
Control  
01–31  
01–07  
00–23  
00–59  
00–59  
00–39  
X
X
X
10 Hour  
X
10 Minutes  
10 Seconds  
Minutes  
Seconds  
Century  
OSC  
W
R
10 Century  
OSC = STOP BIT  
W = WRITE BIT  
R = READ BIT  
FT = FREQUENCY TEST  
BF = BATTERY FLAG  
X = SEE NOTE BELOW  
Note: All indicated “X” bits are not used but must be set to “0” during write cycle to ensure proper clock operation.  
4 of 16  
DS1742  
RETRIEVING DATA FROM RAM OR CLOCK  
The DS1742 is in the read mode whenever OE (output enable) is low, WE (write enable) is  
high, and CE (chip enable) is low. The device architecture allows ripple-through access to any  
of the address locations in the NV SRAM. Valid data will be available at the DQ pins within tAA  
after the last address input is stable, providing that the CE and OE access times and states are  
satisfied. If CE or OE access times and states are not met, valid data will be available at the  
latter of chip enable access (tCEA) or at output enable access time (tOEA). The state of the data  
input/output pins (DQ) is controlled by CE , and OE . If the outputs are activated before tAA, the  
data lines are driven to an intermediate state until tAA. If the address inputs are changed while  
CE and OE remain valid, output data will remain valid for output data hold time (tOH) but will then  
go indeterminate until the next address access.  
WRITING DATA TO RAM OR CLOCK  
The DS1742 is in the write mode whenever WE and CE are in their active state. The start of a  
write is referenced to the latter occurring transition of WE on CE . The addresses must be held  
valid throughout the cycle. CE or WE must return inactive for a minimum of tWR prior to the  
initiation of another read or write cycle. Data in must be valid tDS prior to the end of write and  
remain valid for tDH afterward. In a typical application, the OE signal will be high during a write  
cycle. However, OE can be active provided that care is taken with the data bus to avoid bus  
contention. If OE is low prior to WE transitioning low the data bus can become active with read  
data defined by the address inputs. A low transition on WE will then disable the outputs tWEZ  
after WE goes active.  
DATA RETENTION MODE  
The 5V device is fully accessible and data can be written or read only when VCC is greater than  
VPF  
.
However, when VCC is below the power fail point, VPF (point at which write protection  
,
occurs) the internal clock registers and SRAM are blocked from any access. When VCC falls  
below the battery switch point VSO (battery supply level), device power is switched from the VCC  
pin to the backup battery. RTC operation and SRAM data are maintained from the battery until  
V
CC is returned to nominal levels. The 3.3V device is fully accessible and data can be written or  
read only when VCC is greater than VPF When VCC falls below the power fail point, VPF access to  
the device is inhibited. If VPF is less than Vso the device power is switched from VCC to the  
backup supply (VBAT) when VCC drops below VPF  
switched from VCC to the backup supply (VBAT when VCC drops below Vso  
.
,
,
.
If VPF is greater than Vso  
,
.
the device power is  
RTC operation and  
)
SRAM data are maintained from the battery until VCC is returned to nominal levels.  
5 of 16  
DS1742  
BATTERY LONGEVITY  
The DS1742 has a lithium power source that is designed to provide energy for clock activity,  
and clock and RAM data retention when the VCC supply is not present. The capability of this  
internal power supply is sufficient to power the DS1742 continuously for the life of the  
equipment in which it is installed. For specification purposes, the life expectancy is 10 years at  
25°C with the internal clock oscillator running in the absence of VCC power. Each DS1742 is  
shipped from Dallas Semiconductor with its lithium energy source disconnected, guaranteeing  
full energy capacity. When VCC is first applied at a level greater than VPF, the lithium energy  
source is enabled for battery backup operation. Actual life expectancy of the DS1742 will be  
much longer than 10 years since no lithium battery energy is consumed when VCC is present.  
BATTERY MONITOR  
The DS1742 constantly monitors the battery voltage of the internal battery. The Battery Flag bit  
(bit 7) of the day register is used to indicate the voltage level range of the battery. This bit is not  
writable and should always be a 1 when read. If a 0 is ever present, an exhausted lithium  
energy source is indicated and both the contents of the RTC and RAM are questionable.  
6 of 16  
DS1742  
ABSOLUTE MAXIMUM RATINGS  
Voltage Range on Any Pin Relative to Ground……………………………………..-0.3V to +6.0V  
Storage Temperature Range………………………………………………………...-40°C to +85°C  
Soldering Temperature (EDIP, leads)..……………………..+260°C for 10 seconds (See Note 7)  
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the  
operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of  
time may affect reliability.  
OPERATING RANGE  
RANGE  
Commercial  
Industrial  
TEMPERATURE  
0°C to +70°C (noncondensing)  
-40°C to +85°C (noncondensing)  
VCC  
3.3V ±10% or 5V ±10%  
3.3V ±10% or 5V ±10%  
RECOMMENDED DC OPERATING CONDITIONS  
(Over the operating range)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS NOTES  
Logic 1  
Voltage  
(All Inputs)  
VCC = 5V ±10%  
VIH  
2.2  
VCC + 0.3V  
V
V
V
V
1
1
1
1
VCC = 3.3V  
±10%  
VIH  
VIL  
VIL  
2.0  
-0.3  
-0.3  
VCC + 0.3V  
+0.8  
Logic 0  
Voltage  
(All Inputs)  
VCC = 5V ±10%  
VCC = 3.3V  
±10%  
+0.6  
DC ELECTRICAL CHARACTERISTICS  
(VCC = 5.0V ±10%, Over the operating range.)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS NOTES  
Active Supply Current  
ICC  
15  
50  
mA  
2, 3  
TTL Standby Current (CE =  
VIH)  
CMOS Standby Current  
(CE VCC - 0.2V)  
Input Leakage Current  
(Any Input)  
Output Leakage Current  
(Any Output)  
ICC1  
1
1
3
mA  
2, 3  
ICC2  
IIL  
3
mA  
A
2, 3  
-1  
-1  
+1  
+1  
IOL  
A
Output Logic 1 Voltage  
(IOUT = -1.0mA)  
Output Logic 0 Voltage  
(IOUT = +2.1mA)  
VOH  
VOL  
2.4  
1
1
0.4  
Write Protection Voltage  
VPF  
VSO  
4.25  
4.50  
V
1
Battery Switchover Voltage  
VBAT  
1, 4  
7 of 16  
DS1742  
DC ELECTRICAL CHARACTERISTICS  
(VCC = 3.3V ±10%, Over the operating range.)  
PARAMETER  
SYMBOL  
MIN  
TYP  
MAX  
UNITS NOTES  
Active Supply Current  
ICC  
10  
30  
mA  
2, 3  
TTL Standby Current (CE =  
VIH)  
CMOS Standby Current  
(CE VCC - 0.2V)  
Input Leakage Current (any  
input)  
Output Leakage Current  
(Any Output)  
ICC1  
0.7  
0.7  
2
mA  
2, 3  
ICC2  
IIL  
2
mA  
A
2, 3  
-1  
-1  
+1  
+1  
IOL  
A
Output Logic 1 Voltage  
(IOUT = -1.0mA)  
VOH  
2.4  
1
Output Logic 0 Voltage  
(IOUT =2.1mA)  
Write Protection Voltage  
VOL  
VPF  
VSO  
0.4  
1
1
2.80  
2.97  
V
V
VBAT or  
VPF  
Battery Switchover Voltage  
1, 4  
AC CHARACTERISTICS—READ CYCLE (5V)  
(VCC = 5.0V ±10%, Over the operating range.)  
85ns  
100ns ACCESS UNITS  
ACCESS  
PARAMETER  
SYMBOL  
MIN  
MAX  
MIN  
MAX  
Read Cycle Time  
Address Access Time  
CE to DQ Low-Z  
CE Access Time  
CE Data Off time  
OE to DQ Low-Z  
OE Access Time  
tRC  
tAA  
85  
5
100  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
85  
100  
tCEL  
tCEA  
tCEZ  
tOEL  
tOEA  
tOEZ  
5
5
85  
30  
100  
35  
5
5
45  
30  
55  
35  
OE Data Off Time  
Output Hold from  
Address  
tOH  
5
ns  
8 of 16  
DS1742  
AC CHARACTERISTICS—READ CYCLE (3.3V)  
(VCC = 3.3V ±10%, Over the operating range.)  
120ns  
150ns  
ACCESS  
ACCESS  
PARAMETER  
SYMBOL  
UNITS  
MIN  
MAX  
MIN  
MAX  
Read Cycle Time  
Address Access Time  
CE to DQ Low-Z  
tRC  
tAA  
120  
5
150  
5
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
120  
150  
tCEL  
tCEA  
tCEZ  
tOEL  
tOEA  
tOEZ  
tOH  
120  
40  
150  
50  
CE Access Time  
CE Data Off time  
OE to DQ Low-Z  
5
5
5
5
100  
35  
130  
35  
OE Access Time  
OE Data Off Time  
Output Hold from Address  
READ CYCLE TIMING DIAGRAM  
9 of 16  
DS1742  
AC CHARACTERISTICS—WRITE CYCLE (5V)  
(VCC = 5.0V ±10%, Over the operating range.)  
100ns  
ACCESS  
85ns ACCESS  
PARAMETER  
SYMBOL  
UNITS  
MIN  
85  
0
MAX  
MIN  
100  
0
MAX  
Write Cycle Time  
Address Access Time  
WE Pulse Width  
tWC  
tAS  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tWEW  
tCEW  
tDS  
65  
70  
35  
0
70  
75  
40  
0
CE Pulse Width  
Data Setup Time  
Data Hold time  
tDH  
Address Hold Time  
WE Data Off Time  
Write Recovery Time  
tAH  
5
5
30  
tWEZ  
tWR  
35  
5
5
AC CHARACTERISTICS—WRITE CYCLE (3.3V)  
(VCC = 3.3V ±10%, Over the operating range.)  
120ns  
150ns  
PARAMETER  
SYMBOL  
ACCESS  
ACCESS  
UNITS  
MIN  
MAX  
MIN  
MAX  
Write Cycle Time  
Address Setup Time  
WE Pulse Width  
tWC  
tAS  
120  
0
150  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tWEW  
tCEW  
tDS  
100  
110  
80  
0
130  
140  
90  
0
CE Pulse Width  
Data Setup Time  
Data Hold Time  
tDH  
Address Hold Time  
WE Data Off Time  
Write Recovery Time  
tAH  
0
0
tWEZ  
tWR  
40  
50  
10  
10  
10 of 16  
DS1742  
WRITE CYCLE TIMING DIAGRAM—WRITE-ENABLE CONTROLLED  
WRITE CYCLE TIMING DIAGRAM—CHIP-ENABLE CONTROLLED  
11 of 16  
DS1742  
POWER-UP/POWER-DOWN CHARACTERISTICS (5V)  
(VCC = 5.0V ±10%, Over the operating range.)  
PARAMETER  
SYMBOL MIN  
TYP MAX UNITS NOTES  
tPD  
0
μs  
CE or WE at VIH, Before Power-Down  
VCC Fall Time: VPF(MAX) to VPF(MIN)  
VCC Fall Time: VPF(MIN) to VSO  
VCC Rise Time: VPF(MIN) to VPF(MAX)  
Power-Up Recover Time  
tF  
tFB  
tR  
300  
10  
0
μs  
μs  
μs  
tREC  
35  
ms  
Expected Data Retention Time  
(Oscillator On)  
tDR  
10  
years  
5, 6  
POWER-UP/POWER-DOWN WAVEFORM TIMING (5V DEVICE)  
12 of 16  
DS1742  
POWER-UP/POWER-DOWN CHARACTERISTICS (3.3V)  
(VCC = 3.3V ±10%, Over the operating range.)  
PARAMETER  
SYMBOL MIN  
TYP MAX UNITS NOTES  
CE or WE at VIH, Before Power-  
Down  
tPD  
0
s
VCC Fall Time: VPF(MAX) to VPF(MIN)  
VCC Rise Time: VPF(MIN) to VPF(MAX)  
Power-Up Recovery Time  
tF  
tR  
300  
0
s
s
tREC  
35  
ms  
Expected Data Retention Time  
(Oscillator On)  
tDR  
10  
years  
5, 6  
POWER-UP/POWER-DOWN WAVEFORM TIMING (3.3V DEVICE)  
CAPACITANCE  
(TA = +25°C)  
PARAMETER  
Capacitance on All Input Pins  
SYMBOL  
CIN  
MIN  
TYP  
MAX  
7
UNITS NOTES  
pF  
pF  
Capacitance on All Output  
Pins  
CO  
10  
13 of 16  
DS1742  
AC TEST CONDITIONS  
Output Load: 100pF + 1TTL Gate  
Input Pulse Levels: 0.0 to 3.0V  
Timing Measurement Reference Levels:  
Input: 1.5V  
Output: 1.5V  
Input Pulse Rise and Fall Times: 5ns  
NOTES:  
1) Voltage referenced to ground.  
2) Typical values are at 25°C and nominal supplies.  
3) Outputs are open.  
4) Battery switchover occurs at the lower of either the battery voltage or VPF.  
5) Data retention time is at 25°C.  
6) Each DS1742 has a built-in switch that disconnects the lithium source until VCC is first  
applied by the user. The expected tDR is defined as a cumulative time in the absence of VCC  
starting from the time power is first applied by the user.  
7) Real-time clock modules can be successfully processed through conventional wave-  
soldering techniques as long as temperature exposure to the lithium energy source  
contained within does not exceed +85°C. Post-solder cleaning with water washing  
techniques is acceptable, provided that ultrasonic vibration is not used to prevent damage to  
the crystal.  
14 of 16  
DS1742  
PACKAGE INFORMATION  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package  
outline information, go to www.maxim-ic.com/packages.)  
15 of 16  
DS1742  
REVISION HISTORY  
REVISION  
PAGES  
CHANGED  
DESCRIPTION  
DATE  
Added “UL Recognized” bullet to Features and new Ordering  
Information table.  
1
Added new Pin Description table.  
Updated note for Table 2  
2
4
041305  
updated Operating Temperature Range for Absolute Maximum  
Ratings.  
Corrected 24-pin to 28-pin package and top mark items in  
Ordering Information table.  
Removed reference to J-STD-020 and indicated the lead  
soldering temperature of +260°C for 10 seconds max.  
Added DS1742-85, DS1742-85+ to the Ordering Information  
table; removed DS1742P-100+ (PowerCap) package.  
Removed the –70 ordering numbers from the Ordering  
Information table.  
7
1
7
1
1
071905  
060706  
022207  
102808  
16 of 16  
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.  
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.  
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600  
© 2008 Maxim Integrated Products  
The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.  

相关型号:

DS1742W-150+

Y2KC Nonvolatile Timekeeping RAMwww.
MAXIM

DS1742W-200

Real Time Clock, Non-Volatile, 0 Timer(s), CMOS, PDIP24,
DALLAS

DS1742_V01

Y2KC Nonvolatile Timekeeping RAM
MAXIM

DS1743

Y2KC Nonvolatile Timekeeping RAM
DALLAS

DS1743

Y2K-Compliant, Nonvolatile Timekeeping
MAXIM

DS1743

Y2KC Nonvolatile Timekeeping RAM
ARTSCHIP

DS1743-100

Y2KC Nonvolatile Timekeeping RAM
DALLAS

DS1743-100

Real Time Clock, Non-Volatile, 0 Timer(s), CMOS, EDIP MODULE-28
MAXIM

DS1743-100+

Real Time Clock, Non-Volatile, 0 Timer(s), CMOS, ROHS COMPLIANT, EDIP MODULE-28
MAXIM

DS1743-100IND

Real Time Clock, Non-Volatile, 0 Timer(s), CMOS, EDIP MODULE-28
MAXIM

DS1743-100IND+

Real Time Clock, Non-Volatile, 0 Timer(s), CMOS, ROHS COMPLIANT, EDIP MODULE-28
MAXIM

DS1743-70

Y2KC Nonvolatile Timekeeping RAM
DALLAS