DS2714E+ [MAXIM]
Quad Loose Cell NiMH Charger; 4节NiMH电池充电器
| 型号： | DS2714E+ |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | Quad Loose Cell NiMH Charger |
| 文件： | 总12页 (文件大小：212K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DS2714
www.maxim-ic.com
GENERAL DESCRIPTION
FEATURES
The DS2714 is ideal for standalone charging of 1 to 4
AA or AAA NiMH “loose” cells. NiCd cells can also be
charged. Temperature, voltage and charge time are
monitored to provide proper fast charging control
algorithms for Nickel Metal Hydride (NiMH) batteries.
Battery tests are included to detect defective or
inappropriate cells such as Alkaline primary batteries.
The DS2714 supports a parallel charging topology,
with independent monitoring and control of each cell.
Cꢀ Charges 1 to 4 NiMH Cells
Cꢀ Detects and Avoids Charging Alkaline Cells
Cꢀ Pre-Charges Deeply Depleted Cells
Cꢀ Fast Charges NiMH with -ꢀV Termination
Sensitivity of 2mV (typ)
Cꢀ Monitors Voltage, Temperature and Time for
Safety and Secondary Termination
Cꢀ Works with Regulated Charge Current Source
Cꢀ Drives PNP Type Pass Element
APPLICATIONS
Desktop/Standalone Chargers (AAA/AA)
Digital Still Cameras
Music Players
Cꢀ Compatible with Integrated Primary-Side PWM
Controllers
Cꢀ 20-pin TSSOP Package
Games
ORDERING INFORMATION
Toys
PART
MARKING
DS2714
PIN-PACKAGE
20 TSSOP
20 TSSOP Tape-and-Reel
DS2714E+
DS2714E+T&R
DS2714
+ Denotes lead-free package.
PIN CONFIGURATION
CHARGE TOPOLOGY
4-Cell NiMH Charger
Controlled
Current
1
2
3
4
5
6
7
8
CC1
CC2
20
THM2
THM1
VP4
Source
19
18
17
16
15
14
13
12
11
CC3
CC4
VP3
LED1
LED2
VSS
VP2
VP1
VSS
VDD
TMR
CTST
DS2714
LED3
LED4
DMSEL
9
10
GND
TSSOP
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through vario
REV: 080206
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DS2714: Quad Loose Cell NiMH Charger
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to VSS
Voltage on DMSEL
-0.3V to +6V
VDD + 0.3V
Continuous Sink Current CC1-4, LED1-4
Operating Temperature Range
Storage Temperature Range
20mA
-40°C to +85°C
-55°C to +125°C
See IPC/JEDECJ-STD-020A
Soldering Temperature
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is
not implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
(4.0V ? VDD ? 5.5V; TA = -20LC to +70LC)
PARAMETER
Supply Voltage
Input Voltage Range
SYMBOL
CONDITIONS
(Note 1)
LEDx, DMSEL
MIN
4.0
-0.3
TYP
MAX
5.5
5.5
UNITS
VDD
V
V
DC ELECTRICAL CHARACTERISTICS
(4.0V ? VDD ? 5.5V; TA = -20LC to +70LC. Unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
Operating mode
VDD = 5.0V,
MIN
TYP
MAX
UNITS
ꢁAꢂ
Supply Current, VDD
Output Voltage Low, CC1-4.
IDD
500
750
1.0
VOL1
ILKG
V-ꢀV
IMTST
V
LED1-4
IOL = 20mA (Note 1)
Leakage Current,
CC1-4 LED1-4
VDD = 5.0V,
-1
1.0
-
+1
3.0
15
ꢁA
mV
ꢁA
Output inactive
Threshold Voltage,
-ꢀV Termination
After tTHO
2.0
5
Pulse high/low once
<5ms after power-up
Mode Test Current, DMSEL
VDD
-
Input Logic High, DMSEL,
Input Logic Low, DMSEL,
VIH
VIL
(Note 1)
V
V
0.2V
(Note 1)
0.2
+1
After power-up mode
select,
Input Leakage Current,
DMSEL
IIL1
-1
ꢁA
DMSEL = VDD or VSS
Threshold Voltage, Cell Test
Accuracy
VCTST-ACC
VCTST-RANGE
VBAT-LOW
VBAT-MAX1
VBAT-MAX2
VTHM-MIN
-15
32
15
%
mV
V
R
TMR = 80Kꢃ
Threshold Voltage, Cell Test
Range
400
1.1
Threshold Voltage, Cell
Voltage Low
CC1 = CC2 = hi-Z
(Note 1, 2)
0.9
1.0
Threshold Voltage, Cell
Voltage Max1
CC1 = CC2 = hi-Z
(Note 1, 2)
1.55
1.64
1.65
1.75
1.86
V
Threshold Voltage, Cell
Voltage Max2
CC1, CC2 active
(Note 1, 2)
1.75
V
Threshold Voltage, Thermistor
- Min
VDD x
(Note 1, 2, 6)
(Note 1, 2, 6)
(Note 1, 2, 6)
V
0.73
Threshold Voltage, Thermistor
- Max
VDD x
VTHM-MAX
VTHM-STOP
ITMR-SUS
0.30
0.36
0.5
V
0.33
Threshold Voltage, Thermistor
- Stop
VDD x
V
0.29
Threshold Current, TMR Pin
Suspend
0.1
ꢁA
2 of 12
DS2714: Quad Loose Cell NiMH Charger
PARAMETER
Presence Test Current, VP1-4
Reverse Leakage Current,
VP1, VP2, VP3, VP4
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ꢁA
IPTST
10
15
ILKGR
VDD = 0V, VPx = 1.5V
2
ꢁA
ELECTRICAL CHARACTERISTICS: TIMING
(4.0V ? VDD ? 5.5V; TA = -20LC to +70LC. Unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Internal Timebase Period
tBASE
(Note 5)
0.48
s
Internal Timebase
Accuracy
-10
+10
%
Duty Factor, Fast Charge
DF1
DF2
DF3
tCTST
tPCHG
tTHO
CCx
0.234
0.0625
0.0078
31
Duty Factor, Pre-
Charge/Top-Off
Duty Factor, Maintenance
Charge
CCx
CCx Note 4
(Note 3)
VCELL < VBAT-MIN
Cell Test Interval
s
Pre-Charge Time-out
30.6
3.6
14.4
-5
34
37.4
4.4
17.6
+5
minutes
minutes
minutes
%
Fast Charge Termination
Hold-Off Period
4
Fast Charge Flat Voltage
Time-out
tFLAT
VCELL not increasing
16
Charge Timer Accuracy
Charge Timer Range
tCTMR-RANGE
0.5
10
h
Note 1: Voltages relative to VSS
.
Note 2: Specification applicable during charge cycle with TA = 0LC to +70LC.
Note 3: One time slot out of every 16 available slots gets a Cell Test.
Note 4: One time slot out of every 32 available time slots gets a charge pulse.
Note 5: 0.48 seconds is one charge time slot. A complete cycle of 4 time slots (one charge time slot per cell) is 1.92 sec.
Note 6: VTHM-MIN, VTHM-MAX, and VTHM-STOP are fixed ratios of VDD. Their ranges never overlap.
Note 7: IMTST current is applied as a source current and as a sink current within 5ms after power-up.
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DS2714: Quad Loose Cell NiMH Charger
PIN DESCRIPTION
PIN
NAME
FUNCTION
Charge Control 1. Turn on and off the charge PNP for Cell 1.
Charge Control 2. Turn on and off the charge PNP for Cell 2.
Charge Control 3. Turn on and off the charge PNP for Cell 3.
Charge Control 4. Turn on and off the charge PNP for Cell 4.
LED 1. Open drain output for LED. Display Cell 1 status.
LED 2. Open drain output for LED. Display Cell 2 status.
Device Ground. Return current path for LEDx pins. Both VSS pins must be connected to ground.
LED 3. Open drain output for LED. Display Cell 3 status.
LED 4. Open drain output for LED. Display Cell 4 status.
Display Mode Select. Select the LED blink rate.
1
CC1
2
CC2
3
CC3
CC4
LED1
LED2
VSS
4
5
6
7
8
LED3
LED4
DMSEL
CTST
TMR
VDD
9
10
11
12
13
14
15
16
17
18
19
20
Cell Test Resistor. Cell test threshold set.
Timer Resistor. Charge timer set.
Power-Supply Input. Chip supply input (4.0V to 5.5V).
Device Ground. Internally connected to Pin 7. Both VSS pins must be connected to ground.
Voltage Sense 1. Positive terminal sense input for Cell 1.
Voltage Sense 2. Positive terminal sense input for Cell 2.
Voltage Sense 3. Positive terminal sense input for Cell 3.
Voltage Sense 4. Positive terminal sense input for Cell 4.
Thermister 1. Thermister input for Cell 1 and 2.
VSS
VP1
VP2
VP3
VP4
THM1
THM2
Thermister 2. Thermister input for Cell 3 and 4.
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DS2714: Quad Loose Cell NiMH Charger
Figure 1. Block Diagram
VDD
BIAS
Oscillator
VP1-VP4
Voltage
and
State Machine
Temperature
Measurement
CC1
CC2
CC3
THM 1
THM 2
Presence Test
Pre-Charge
CC4
LED1
Fast Charge
&
LED2
LED3
LED4
Cell Tests
Top-Off Charge
VSS
VSS
DMSEL
CTST
Z-test
Scaler
Maintenance Charge
Charge
Timer
TMR
0.1uA
SUSPEND
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DS2714: Quad Loose Cell NiMH Charger
Figure 2. State Diagram
VBAT > 1.65V
OR
T < 0C
Presence
POR
VDD > 4.0V
OR
Standby power
CCx = Hi-Z
TEST
T > 45C
CCx = Hi-Z
LEDx = No Battery
LEDx = Hi-Z
t < PCTimeout
OR
VOFF < 1V
VBAT < 1.65V
PreCHG
VBAT > 1.75V
CCx = Active 6.25%
LEDx = Charging
VOFF > 1.65V
t > PCTimeout
OR
FAULT
T > 50
Standby power
CCx = Hi-Z
OR
LEDx = Fault
VOFF > 1V
AND
VON > 1.75V
t < PCTimeout
AND
VON > 1.75V
(asynchronously
from anywhere)
Cell Test
T < 50C
CCx = Hi-Z
LEDx = Charging
FAIL:
VON-VOFF > VCTST
VON > 1.75V
PASS
16 clock
interval
t < Fast Timeout
Fast
CHG
CCx = Active 23.4%
LEDx = Charging
-ꢀV detect
OR
T > 50
t > Fast Timeout
t < Topoff Timeout
Topoff
CHG
T > 50
MAINT
OR
CCx =Active 1/128
LEDx = Maintenance
t > Topoff Timeout
CCx = Active 6.25%
LEDx = Charging
NOTE: VBAT = cell voltage not in charge state
.
V
V
= open circuit cell voltage .
OFF
= closed circuit cell voltage .
ON
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DS2714: Quad Loose Cell NiMH Charger
Figure 3. Application Example: Regulated Current Source Charger
Current
Source
FCX718
ꢁꢂꢃꢀ
FCX718
ꢁꢂꢃꢀ
FCX718
ꢁꢂꢃꢀ
FCX718
VDD
ꢁꢂꢃꢀ
ꢁꢂꢃꢀ
103AT-2
100ꢀ
100ꢀ
100ꢀ
100ꢀ
1
2
3
4
CC1
CC2
CC3
CC4
THM2
ꢁꢂꢃꢀ
THM1
VP4
103AT-2
VP3
VP2
VP1
330ꢀ
LED1 5
+5VDC
330ꢀ
6
LED2
VSS
VSS
VDD
330ꢀ
LED3
330ꢀ
ꢄꢂꢃꢀ
LED4 9
TMR
10
DMSEL
CTST
ꢄꢂꢃꢀ
7 of 12
DS2714: Quad Loose Cell NiMH Charger
DETAILED DESCRIPTION
CHARGE ALGORITHM OVERVIEW
A charge cycle begins in one of three ways: With the application of power to the DS2714 with cell(s) already
inserted, with the detection of cell insertion after power-up, or when exiting suspend mode with cell(s) inserted. The
charge cycle begins with Pre-charge qualification to prevent Fast charging of deeply depleted cells or charging
under extreme temperature conditions. Pre-charging is performed at a reduced rate until the cell being charged
reaches VBAT-LOW (1V). The algorithm proceeds to a Fast charge phase which includes cell tests to avoid accidental
charging of alkaline cells or NiMH cells which are worn-out or damaged. Fast charging continues as long as the cell
temperature is less than 50°C (based on Thermistor sensors THM 1, 2), the open circuit cell voltage(s) are
between VBAT-LOW (1.0V) and VBAT-MAX1 (1.65V) and the closed ciruit cell voltage(s) are less than VBAT-MAX2 (1.75V).
Fast charging terminates by the -ꢀV (negative delta voltage) or flat voltage method. The Top-Off charge phase
follows to completely charge the cell. After the Top-off charge timer expires, the Maintenance charge phase
continues indefinitely to keep the cells fully charged. Maximum voltage, temperature and charge time monitoring
during all charge phases act as secondary or safety termination methods to provide additional protection from
overcharge. A cell voltage greater than VBAT-MAX2 (1.75V) will result in a fault condition, and temperature greater
than 50°C (see Table 1) will result in either Fault or Maintenance depending on which charge state the device was
last in. Each cell is monitored independently, and the charge phase of each cell is independently controlled. If a cell
is removed while being charged, the algorithm for that cell slot is completely reset to its Presence Test state without
affecting the charge control states of the other cells.
CHARGE CONFIGURATION
The DS2714 supports four slot standalone chargers. It alternates charge to the four slots every two seconds, with
one half second available to each cell. Removal or insertion of a cell into the charger does not disturb the charge
timing or charge rates of the other cells. Charge pulses are fed alternately to each cell under the control of the CCx
pins so that the charge regimes occur in parallel. The duty cycle on the CCx pins are completely independent of
one another. Transitions from Pre-charge to Fast charge, Fast charge to Top-off and Top-off to Maintenance occur
independently for each cell. The configuration shown in Figure 3 is for charging four cells with a current limited
source of 2A. The effective average fast charge current for each cell is 2A x 0.25 x 15/16 = 0.469A. The 15/16 term
is due to the fact that every 16th charge time slot is used for negative delta-voltage and impedance testing. No
current is delivered to the cell during that time. Mechanical design of the holders is required to prevent insertion of
more than one cell in each slot. The holder design should also prevent electrical contact with reverse polarity
insertion.
PERFORMANCE REQUIREMENTS OVER TEMPERATURE AND VOLTAGE
5.5
Full Performance
Valid NiMH
Charge Range
Below Operating
Voltage Range
4.0
Low
Temperature
Range
Abs. Max
Operating
Range
High
Temperature
Range
-40
-20
0
85
70
50
TEMPERATURE , DEGRES
CENTIGRADE
INTERNAL OSCILLATORS AND CLOCK GENERATION
An internal oscillator provides the main clock source used to generate timing signals for internal chip operation. The
pre-charge timer, hold-off timers, and duty factors for the charging operations are derived from this timebase. There
are two separate timers for the impedance test and Fast Charge/Topoff functions.
8 of 12
DS2714: Quad Loose Cell NiMH Charger
CHARGE TIMER
The Charge Timer monitors the duration of charge in Fast and Top-Off charge phases, and is reset at the
beginning of each phase. The time-out period is set with an external resistor connected from the TMR pin to VSS.
Resistors can be selected to support Fast charge time-out periods of 0.5 to 10 hours and Top-off charge time-out
periods of 0.25 to 5 hours. If the timer expires in Fast charge, the timer count is reset and charging proceeds to the
Top-Off charge phase. The Top-Off time-out period is half of the Fast charge time-out period. When the timer
expires in Top-Off, charging proceeds to the Maintenance phase. The programmed charge time approximately
follows the equation:
t = 1.5 * R / 1000
(time in minutes)
SUSPEND
Suspension of charge activity is possible by floating the TMR pin. All CCx outputs become high-Z and the Charge
Timer stops. The state machine and all timers are reset to their Presence Test conditions.
TEMPERATURE SENSE
Connecting an external 10kΩ NTC thermistor between THM1 or THM2 (THMx) and VSS, and a 10kΩ bias resistor
between VDD and THMx allows the DS2714 to sense temperature. In order to sense the temperature of the battery
cells, locate the thermistor close to the body of the battery cell. The THM1 thermistor should be placed between
cells 1 and 2, and THM2 thermistor between cells 3 and 4. Alternatively, the thermistors can sense ambient
temperature by locating them away from the cells. THM1 and THM2 can be tied together to sense temperature
using a single thermistor and bias resistor. The temperature qualification function can be defeated by tying THMx
pins to a single resistor divider supplying a voltage between the Thermistor-Min and Thermistor-Max threshold
voltages.
MIN, MAX TEMPERATURE COMPARE
The voltage thresholds of the THMx inputs (VTHM-MIN, VTHM-MAX) are set to allow Fast charging to start if 0LC <
TA < 45LC when using the recommended 10kΩ bias and 10kΩ thermistor. If Fast charging is in progress, and the
voltage on THMx reaches VTHM-STOP (TA > 50LC), Fast charging stops and the maintenance phase begins. In
Pre-charge the device will transition to the Fault state if the voltage on THMx reaches VTHM-STOP.
Table 1. THM1, THM2 Thresholds
TEMPERATURE
THM
RATIO
THERMISTOR
Fenwal
Semitec
103AT-2
THRESHOLD OF VDD RESISTANCE
197-103LAG-A01
173-103LAF-301
MIN
MAX
STOP
0.73
0.33
0.29
27.04k
4.925k
4.085k
0C
4C
45C
50C
42C
47C
CELL VOLTAGE MONITORING
Individual cell voltages are monitored for minimum and maximum values, using the VBAT-LOW , VBAT-MAX1 and VBAT-
MAX2 threshold limits. Upon inserting a cell or power-up with cells inserted, cell voltages must be less than the VBAT-
threshold before charging begins. The VBAT-LOW threshold determines whether a Pre-charge cycle should
MAX1
precede the Fast charge cycle, and when to transition from Pre-charge to Fast charge. Once Fast charging
commences, cell voltages are compared to the VBAT-MAX2 threshold once every 2 seconds. The comparison occurs
while the charge control pin (CC1-4) controlling current to the cell is active (low). When the charge control pin is
active such that charge is applied to the cell, the cell voltage is referred to as the VON voltage. When the charge
control pin is inactive, the cell voltage is referred to as the VOFF voltage. Charging is halted and a Fault condition is
displayed if VON is greater than VBAT-MAX2. Charging is also halted and a fault condition is entered if VOFF is greater
than VBAT-MAX1. While Fast charge is in progress, cell voltage measurements are stored and compared to future
measurements for charge termination and cell test purposes.
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DS2714: Quad Loose Cell NiMH Charger
CELL TESTS
Two types of tests are performed to detect primary Alkaline and Lithium cells or defective NiMH or NiCd secondary
cells. The first test checks the absolute closed circuit cell voltage (VON), and the second test checks the difference
in open circuit cell voltage (VOFF) and (VON). VON for each cell is compared to the VBAT-MAX2 threshold once every
2 seconds. During fast charge, VON - VOFF of each cell is compared to the cell test threshold, VCTST. If VON - VOFF
>
V
CTST, the cell test fails. Cells are tested individually so that a single improper or defective cell can be detected
quickly. VCTST is set by the resistance from the CTST pin to ground. The nominal sensitivity of 100mV is set by
connecting an 80kΩ ohm resistor between CTST and VSS. The impedance threshold can be set from 32mV to
400mV. The following formula approximates the setting for the impedance threshold
VCTST = 8000/R
(value in volts)
-∆V AND FLAT VOLTAGE TERMINATION
During Fast charge, -ꢀV detection is performed by comparing successive voltage measurements for a drop of 2mV
in the cell voltage. A Hold-off period for -ꢀV detection begins at the start of Fast charging and prevents false
termination in the first few minutes of the charge cycle. Once the hold-off period expires, cell voltage
measurements are acquired every 16th charge time slot (approximately 31 seconds, during the CCx off time).
When a newly acquired voltage measurement is greater than any previous one, the new value is retained as the
maximum value. When the cell voltage no longer increases, the maximum value is retained and compared against
subsequent values. If the cell voltage drops below the -ꢀV threshold, V-ꢀV, (2mV typ), Fast charging is terminated. If
the cell voltage remains flat such that the maximum value persists for a period of 16 minutes (tFLAT), Fast charge
terminates and Top-Off charging begins.
TOP-OFF, PRE-CHARGE AND MAINTENANCE
In Top-off and Pre-charge modes, the charger scales the cell current to 1/16 of the DC current set by the current
source, i.e, one charge pulse for every 16 main clock pulses, or one in four available time slots for a given cell. The
ratio of average Top-off/Pre-charge current to average fast charge current is 0.286. When the charge timer expires
in Top-Off, the charger enters Maintenance and delivers 1/128 of the DC charge source current to the cells (one
time slot in every 32 available to that cell). This is slightly more than 3% of the average DC Fast Charge current.
Maintenance charge remains continuous until power is removed, the cell(s) are removed or the DS2714 is cycled
into and out of suspend mode by floating the TMR pin.
CCX OUTPUTS
The CC1 through CC4 pins operate as open-drain outputs that drive active low to connect the charge source to the
NiMH cells. During charge, the behavior of these outputs depends on the charge states of the cells and on how
many cells have been installed.
FAST CHARGE
Referring to the application circuit shown in Figure 3, CC1 controls the PNP switch that gates current to the cell in
slot 1. CC2 controls the PNP switch that gates current to the cell in slot 2, and so on. During Fast charge, current is
gated to each slot sequentially, with charge pulses occurring in alternating time frames. The cell in one slot charges
while the others relax. Each cell skips a charge pulse every 16 of its allocated charge time slots (approximately
once every 31 seconds) to facilitate independent testing of the open and closed circuit cell voltages (VOFF and VON
,
respectively). Since the charge regime of each cell is independent, one cell may complete a charge phase before
the other without affecting the charging of the other cells. In the case of an improper or faulty cell (ex. alkaline)
being inserted along with proper cells (NiMH or NiCd), charging of the improper cell would be stopped, while the
proper cells will be charged to full.
10 of 12
DS2714: Quad Loose Cell NiMH Charger
EXAMPLE TIMING DIAGRAM FOR THE DS2714
N
N +1
N +2
N +3
N +4
N +5
N +6
N +7
N +8
N +9
N +10
N +11
1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3
Cell 1
Cell 2
Cell 3
NOTE 1
NOTE 2
Cell 4
Note 1: Cell test time slot for Cell 2.
Note 2: Cell test time slot for Cell 3.
In this timing diagram, the pulses represent charge current into the individual cells. Cell 1 is in Precharge (the timing of Precharge is the same as Top-off). It
gets one charge pulse out of every four available times slots.
Cell 2 is in initially in Fast Charge and it transitions to Topoff charge during the N+7th time interval (Note 1)shown in the diagram.
Cell 3 is in Fast charge. Cell testing is performed during the interval marked Note 2. This cell is not ready to go into Top-off and it resumes Fast charge.
Cell 4 is in maintenance mode, one out of every 32 available time slots gets a charge pulse.
11 of 12
DS2714: Quad Loose Cell NiMH Charger
LEDX OUTPUTS, DISPLAY MODE SELECT
Open-drain outputs LEDX pull low to indicate charge status. When inactive, the outputs are high impedance. LED1
displays the status for the cell monitored by VP1, LED2 displays the status for the cell monitored by VP2 and so on.
The LED pins drive low in three “blink” patterns to annunciate the charge status. Table 2 summarizes the LED
operation in each display mode (DM0, DM1, DM2) for each charge condition.
Table 2. Display Patterns By Display Mode and Charge Activity
Display Mode
Charge Activity
Pre/Fast/Top-off
DMSEL pin
No Battery
Hi-Z
Maintenance
Fault
Charging
0.80s Low
0.16s Hi-Z
0.48s Low
0.48s Hi-Z
DM0
DM1
DM2
Low
Float
High
Low
0.16s Low
0.16s Hi-Z
Hi-Z
Low
Hi-Z
Low
0.80s Low
0.16s Hi-Z
0.16s Low
0.16s Hi-Z
Hi-Z
PACKAGE INFORMATION
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package
outline information, go to www.maxim-ic.com/DallasPackInfo.)
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2006 Maxim Integrated Products S Printed USA
The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.
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