MAX122ACAG+ [MAXIM]

ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, PDSO24, PLASTIC, SSOP-24;
MAX122ACAG+
型号: MAX122ACAG+
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, Word Access, BICMOS, PDSO24, PLASTIC, SSOP-24

信息通信管理 光电二极管 转换器
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MAX120/MAX122  
500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
General Description  
Features  
12-Bit Resolution  
No Missing Codes Over Temperature  
20ppm/°C -5V Internal Reference  
1.6µs Conversion Time/500ksps Throughput  
The MAX120/MAX122 complete, BiCMOS, sampling 12-bit  
analog-to-digital converters (ADCs) combine an on-chip  
track/hold (T/H) and a low-drift voltage reference with fast  
conversion speeds and low-power consumption. The T/H’s  
350ns acquisition time combined with the MAX120’s 1.6µs  
conversion time results in throughput rates as high as 500k  
samples per second (ksps). Throughput rates of 333ksps  
are possible with the 2.6µs conversion time of the MAX122.  
(MAX120)  
2.6µs Conversion Time/333ksps Throughput  
(MAX122)  
Low Noise and Distortion:  
• 70dB (min) SINAD  
• -77dB (max) THD (MAX122)  
Low Power Dissipation: 210mW  
The MAX120/MAX122 accept analog input voltages from  
-5V to +5V. The only external components needed are  
decoupling capacitors for the power-supply and refer-  
ence voltages. The MAX120 operates with clocks in the  
0.1MHz to 8MHz frequency range. The MAX122 accepts  
0.1MHz to 5MHz clock frequencies.  
Separate Track/Hold Control Input  
Continuous-Conversion Mode Available  
±5V Input Range, Overvoltage Tolerant to ±15V  
24-Pin Narrow DIP, Wide SO, and SSOP Packages  
The MAX120/MAX122 employ a standard microprocessor  
(µP) interface. Three-state data outputs are configured  
to operate with 12-bit data buses. Data-access and bus-  
release timing specifications are compatible with most  
popular µPs without resorting to wait states. In addition,  
the MAX120/MAX122 can interface directly to a first-in,  
first-out (FIFO) buffer, virtually eliminating µP interrupt  
overhead. All logic inputs and outputs are TTL/CMOS  
compatible. For applications requiring a serial interface,  
refer to the MAX121.  
Ordering Information  
PIN-  
PACKAGE  
INL  
(LSB)  
PART  
TEMP RANGE  
MAX120CNG+  
MAX120CWG+  
MAX120CAG+  
MAX120ENG+  
MAX120EWG+  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
24 PDIP  
±1  
±1  
±1  
±1  
±1  
24 Wide SO  
24 SSOP  
Applications  
-40°C to +85°C 24 PDIP  
Digital-Signal Processing  
Audio and Telecom Processing  
Speech Recognition and Synthesis  
High-Speed Data Acquisition  
Spectrum Analysis  
-40°C to +85°C 24 Wide SO  
+Denotes a lead(Pb)-free/RoHS-compliant package.  
Functional Diagram  
Data Logging Systems  
Pin Configuration  
TOP VIEW  
+
1
2
MODE  
RD 24  
CS 23  
MAX120  
SS MAX122  
V
V
3
INT/BUSY 22  
CLKIN 21  
CONVST 20  
D0 19  
DD  
4
AIN  
5
V
REF  
6
AGND  
D11  
D10  
D9  
7
D1 18  
8
D2 17  
9
D3 16  
10  
11  
12  
D8  
D4 15  
D7  
D5 14  
DGND  
D6 13  
PDIP/SO/SSOP  
19-0030; Rev 1; 3/12  
MAX120/MAX122  
500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
Absolute Maximum Ratings  
V
to DGND..........................................................-0.3V to +6V  
Narrow CDIP (derate 12.50mW/°C above +70°C)....1000mW  
Operating Temperature Ranges  
DD  
V
to DGND........................................................+0.3V to -17V  
SS  
AIN to AGND.......................................................................±15V  
AGND to DGND .................................................................±0.3V  
Digital Inputs/Outputs to DGND ....................-0.3V to (V + 0.3V)  
MAX12_C ...........................................................0°C to +70°C  
MAX12_E_ .................................................... -40°C to +85°C  
MAX12_MRG .............................................. -55°C to +125°C  
Storage Temperature Range..............................-65°C to+160°C  
Lead Temperature (soldering, 10s) .................................+300°C  
Soldering Temperature (reflow).......................................+260°C  
Continuous Power Dissipation (T = +70°C)  
A
Narrow PDIP (derate 13.33mW/°C above +70°C) ....1067mW  
SO (derate 11.76mW/°C above +70°C) ......................941mW  
SSOP (derate 8.00mW/°C above +70°C) ...................640mW  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these  
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect  
device reliability.  
Electrical Characteristics  
(V  
= +4.75V to +5.25V, V  
= -10.8V to -15.75V, f  
= 8MHz for MAX120 and 5MHz for MAX122, T = T  
to T  
, unless  
DD  
SS  
CLK  
A
MIN  
MAX  
otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
ACCURACY  
Resolution  
RES  
12  
Bits  
MAX122AC/AE  
±3/4  
±1  
12-bit no missing  
codes over  
temperature range  
MAX120C/E,  
MAX122BC/BE  
Differential Nonlinearity (Note 1)  
DNL  
INL  
LSB  
11-bit no missing  
codes over  
temperature range  
MAX120M  
±2  
MAX122AC/AE  
±3/4  
±1  
Integral Nonlinearity  
(Note 1)  
LSB  
MAX120C/E,  
MAX122BC/BE  
Code 00..00 to 00..01 transition,  
near V = 0V  
±3  
±8  
LSB  
LSB/”C  
LSB  
Bipolar Zero Error (Note 1)  
AIN  
Temperature drift  
±0.005  
Including reference; adjusted for bipolar  
zero error; T = +25°C  
A
Full-Scale Error (Notes 1, 2)  
Full-Scale Temperature Drift  
Excluding reference  
±1  
ppm/”C  
V
V
V
only, 5V ±5%  
±1/4  
±1/4  
±1/4  
±3/4  
±1  
DD  
SS  
SS  
Power-Supply Rejection Ratio  
(Change in FS)  
(Note 3)  
PSRR  
only, -12V ±10%  
only, -15V ±5%  
LSB  
±1  
ANALOG INPUT  
Input Range  
-5  
+5  
2.5  
10  
V
Input Current  
V
= +5V (approximately 6kΩ to REF)  
mA  
pF  
AIN  
Input Capacitance (Note 4)  
Full-Power Input Bandwidth  
REFERENCE  
1.5  
MHz  
Output Voltage  
No external load, V  
= 5V, T = +25°C  
-5 02  
-4.98  
5
V
AIN  
A
External Load Regulation  
Temperature Drift (Note 5)  
0mA < I  
< 5mA, V  
= 0V  
mV  
SINK  
AIN  
MAX12_C/E  
±25  
ppm/°C  
Maxim Integrated  
2  
www.maximintegrated.com  
MAX120/MAX122  
500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
Electrical Characteristics (continued)  
(V  
= +4.75V to +5.25V, V  
= -10.8V to -15.75V, f  
= 8MHz for MAX120 and 5MHz for MAX122, T = T  
to T  
, unless  
DD  
SS  
CLK  
A
MIN  
MAX  
otherwise noted.)  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
DYNAMIC PERFORMANCE (MAX120: f = 500kHz, V  
= ±5V , 100kHz: MAX122: f = 333kHz, V  
= ±5V , 50kHz  
S
AIN  
P-P  
S
AIN  
P-P  
MAX120, MAX122  
70  
70  
69  
72  
Signal-to-Noise Plus Distortion  
SINAD  
THD  
T
= +25°C  
= +25°C  
MAX122AC/AE  
MAX122BC/BE  
MAX120  
dB  
A
A
-82  
-85  
-77  
-78  
-77  
-75  
T
MAX122  
Total Harmonic Distortion  
(First Five Harmonics)  
dB  
dB  
MAX122AC/AE  
MAX122BC/BE  
MAX120  
77  
78  
77  
75  
82  
85  
T
= +25°C  
A
MAX122  
Spurious-Free Dynamic Range  
SFDR  
MAX122AC/AE  
MAX122BC/BE  
CONVERSION TIME  
MAX120  
MAX122  
MAX120  
MAX122  
1.63  
2.60  
8
Synchronous  
t
13t  
µs  
CONV  
CLK  
0.1  
0.1  
Clock Frequency  
f
MHz  
CLK  
5
DIGITAL INPUTS (CLKIN, CONVST, RD, CS)  
Input High Voltage  
Input Low Voltage  
Input Capacitance (Note 4)  
Input Current  
V
2.4  
V
V
IH  
V
0.8  
10  
±5  
IL  
pF  
µA  
V
= 0V or V  
DD  
IN  
DIGITAL OUTPUTS (INT/BUSY, D11–D0)  
Output Low Voltage  
V
I
= 1.6mA  
0.4  
V
V
OL  
SINK  
Output High Voltage  
V
I
= 1mA  
V
- 0.5  
DD  
OH  
SOURCE  
Leakage Current  
I
V
= 0V or V , D11–D0  
±5  
10  
µA  
pF  
LKG  
IN  
DD  
Output Capacitance (Note 4)  
POWER REQUIREMENTS  
Positive Supply Voltage  
Negative Supply Voltage  
Positive Supply Current (Note 6)  
Negative Supply Current (Note 6)  
Power Dissipation (Note 6)  
V
Guaranteed by supply rejection test  
Guaranteed by supply rejection test  
4.75  
5.25  
-15.75  
15  
V
V
DD  
V
-10.80  
SS  
I
V
V
V
= 5.25V, V = -15.75V, V  
= 0V  
= 0V  
9
mA  
mA  
mW  
DD  
DD  
DD  
DD  
SS  
AIN  
I
= 5.25V, V = -15.75V, V  
14  
20  
SS  
SS  
AIN  
= 5V, V = -12V, V  
= 0V  
210  
315  
SS  
AIN  
Maxim Integrated  
3  
www.maximintegrated.com  
MAX120/MAX122  
500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
Timing Characteristics  
(V  
= +5V, V = -12V to -15V, 100% tested, T = T  
to T , unless otherwise noted.) (Note 7)  
MAX  
DD  
SS  
A
MIN  
T = +25°C  
MAX12_C/E  
TYP MAX  
A
PARAMETER  
SYMBOL  
CONDITIONS  
UNITS  
MIN  
0
TYP  
MAX  
MIN  
0
CS to RD Setup Time  
CS to RD Hold Time  
CONVST Pulse Width  
RD Pulse Width  
t
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CS  
t
0
0
CH  
t
30  
30  
CW  
t
t
t
RW  
DA  
DA  
Data-Access Time  
t
C = 100pF  
L
40  
30  
30  
70  
45  
30  
75  
50  
100  
65  
DA  
DH  
Bus-Relinquish Time  
RD or CONVST to BUSY  
t
t
C = 50pF  
L
75  
100  
150  
120  
75  
B0  
B1  
B2  
t
C = 50pF  
L
110  
90  
CLKIN to BUSY or INT  
CLKIN to BUSY Low  
RD to INT High  
t
In mode 5  
t
C = 50pF  
L
50  
IH  
C (Data) = 100pF,  
L
BUSY or INT to Data Valid  
t
20  
30  
ns  
BD  
C (INT, BUSY) = 50pF  
L
Acquisition Time (Note 8)  
Aperture Delay (Note 8)  
Aperture Jitter (Note 8)  
t
350  
350  
ns  
ns  
ps  
ACQ  
t
10  
30  
AP  
Note 1: These tests are performed at V  
= 5V, V = -15V. Operation over supply is guaranteed by supply rejection tests.  
SS  
DD  
Note 2: Ideal full-scale transition is at +5V - 3/2 LSB = +4.9963V, adjusted for offset error.  
Note 3: Supply rejection defined as change in full-scale transition voltage with the specified change in supply voltage = (FS at nomi-  
nal supply)- (FS at nominal supply ± tolerance), expressed in LSBs.  
Note 4: For design guidance only, not tested.  
Note 5: Temperature drift is defined as the change in output voltage from +25°C to T  
or T  
. It is calculated as T = ΔV  
/
REF  
MIN  
MAX  
C
V
/(ΔT).  
REF  
Note 6: V  
= V  
= V  
= 0V, V  
= 5V.  
CS  
RD  
CONVST  
MODE  
Note 7: Control inputs specified with t = t = 5ns ( 10% to 90% of +5V) and timed from a 1.6V voltage level. Output delays are  
r
f
measured to +0.8V if going low, or +2.4V if going high. For bus-relinquish time, a change of 0.5V is measured. See Figures  
1 and 2 for load circuits.  
Note 8: For design guidance only, not tested.  
Pin Description  
PIN  
NAME  
FUNCTION  
Mode Input. Hardwire to set operational mode.  
V
: Single conversion, INT Output  
DD  
1
MODE  
OPEN: Single conversion, BUSY Output  
DGND: Continuous conversions, BUSY Output  
2
3
4
5
V
Negative Power Supply, -12V or -15V  
SS  
V
Positive Power Supply, +5V  
DD  
AIN  
Sampling Analog Input, ±5V bipolar input range  
-5V Reference Output. Bypass to AGND with 22µF || 0.1µF.  
V
REF  
Maxim Integrated  
4  
www.maximintegrated.com  
MAX120/MAX122  
500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
Pin Description (continued)  
PIN  
NAME  
FUNCTION  
6
AGND  
Analog Ground  
7–11, 13–19  
D11–D0  
DGND  
Three-State Data Outputs D11 (MSB) to D0 (LSB)  
Digital Ground  
12  
20  
CONVST  
Convert Start Input. Initiates conversions on its falling edge.  
Clock Input. Drive with TTL-compatible clock from 0.1MHz to 8MHz (MAX120), 0.1MHz to 5MHz  
(MAX122)  
21  
CLKIN  
Interrupt or Busy Output. Indicates converter status. If MODE is connected to V , configure  
DD  
22  
INT/BUSY  
for an INT output. If MODE is open or connected to DGND, configure for a BUSY output. See  
operational diagrams.  
Chip-Select Input, Active-Low. When RD is low, enables the three-state outputs. If CONVST and  
RD are low, a conversion is initiated on the falling edge of CS.  
23  
24  
CS  
RD  
Read Input, Active-Low. When CS is low, RD enables the three-state outputs. If CONVST and CS  
are low, conversion is initiated on the falling egde of RD.  
Detailed Description  
ADC Operation  
The MAX120/MAX122 use successive approximation and  
input T/H circuitry to convert an analog signal to a series  
of 12-bit digital-output codes. The control logic interfaces  
easily to most µPs, requiring only a few passive compo-  
nents tor most applications. The T/H does not require an  
external capacitor. Figure 3 shows the MAX120/MAX122  
in the simplest operational configuration.  
Analog Input Track/Hold  
Figure 4 shows the equivalent input circuit, illustrating the  
sampling architecture of the ADC’s analog comparator.  
An internal buffer charges the hold capacitor to minimize  
the required acquisition time between conversions. The  
analog input appears as a 6kΩ resistor in parallel with a  
10pF capacitor.  
Figure 1. Load Circuits for Access Time  
Between conversions, the buffer input is connected to AIN  
through the input resistance. When a conversion starts,  
the buffer input disconnects from AIN, thus sampling the  
input. At the end of the conversion, the buffer input recon-  
nects to AIN, and the hold capacitor once again charges  
to the input voltage.  
The T/H is in tracking mode whenever a conversion is  
NOT in progress. Hold mode starts approximately 10ns  
after a conversion is initiated. Variation in this delay from  
one conversion to the next (aperture jitter) is typically  
30ps. Figures 7 through 11 detail the T/H mode and inter-  
face timing for the various interface modes.  
Figure 2. Load Circuits for Bus-Relinquish Time  
Maxim Integrated  
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www.maximintegrated.com  
MAX120/MAX122  
500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
Figure 4. Equivalent Input Circuit  
Figure 3. MAX120/MAX122 in the Simplest Operational Mode  
(Continuous Conversion)  
Internal Reference  
The MAX120/MAX122 -5.00V buried-zener reference  
biases the internal DAC. The reference output is available  
Digital Interlace  
External Clock  
The MAX120/MAX122 require a TTL-compatible clock  
for proper operation. The MAX120 accepts clocks in  
the 0.1MHz to 8MHz frequency range when operating  
in modes 1–4 (see the Operating Modes section). The  
maximum clock frequency is limited to 6MHz when oper-  
ating in mode 5. The MAX122 requires a 0.1MHz to 5MHz  
clock for operation in all five modes. The minimum clock  
frequency for both the MAX120 and MAX122 is limited to  
0.1MHz, due to the T/H’s droop rate.  
at the V  
pin and must be bypassed to the AGND pin  
REF  
with a 0.1µF ceramic capacitor in parallel with a 22µF or  
greater electrolytic capacitor. The electrolytic capacitor’s  
equivalent series resistance (ESR) must be 100mΩ or  
less to properly compensate the reference output buffer.  
Sanyo’s organic semiconductor works well.  
Sanyo Video Components (USA)  
Phone: (619) 661-6835  
FAX: (619) 661-1055  
Sanyo Electric Company, LTD. (Japan)  
Clock and Control Synchronization  
Phone: 0720-70-1005  
FAX: 0720-70-1174  
The clock and convert start inputs (CONVST or RD and  
CS, see the Operating Modes section) are not synchro-  
nized, the conversion time can vary from 13 to 14 clock  
cycles. The successive approximation register (SAR)  
always changes state on the CLKIN input’s rising edge.  
To ensure a fixed conversion time, see Figure 5 and the  
following guidelines.  
Sanyo Fisher Vertriebs GmbH (Germany)  
Phone: 06102-27041, ext. 44 FAX: 06102-27045  
Proper bypassing minimizes reference noise and main-  
tains a low impedance at high frequencies. The internal  
reference output buffer can sink up to a 5mA external load.  
An external reference voltage can be used to overdrive  
the MAX120/MAX122’s internal reference if it ranges from  
-5.05V to -5.10V and is capable of sinking a minimum  
For a conversion time of 13 clock cycles, the convert start  
input(s) should go low at least 50ns before CLKIN’s next  
rising edge. For a conversion time of 14 clock cycles,  
the convert start input(s) should go low within 10ns of  
CLKIN’s next rising edge. If the convert start input(s) go  
low from 10ns to 50ns before CLKIN’s next rising edge,  
the number of clock cycles required is undefined and can  
be either 13 or 14. For best analog performance, synchro-  
nize the convert start inputs with the clock input.  
of 5mA. The external V  
required.  
bypass capacitors are still  
REF  
Maxim Integrated  
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MAX120/MAX122  
500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
Figure 5. Clock and Control Synchronization  
Figure 7. Full-Control Mode (Mode 1)  
or for µP-based systems where the ADC and the µP are  
linked through first-in, first-out (FIFO) buffers or direct  
memory access (DMA) ports. Slow-memory mode (mode  
3) is intended for µPs that can be forced into a wait state  
during the ADC’s conversion time. ROM mode (mode 4) is  
for µPs that cannot be forced into a wait state.  
In all five operating modes, the start of a conversion is  
controlled by one of three digital inputs: CONVST, RD, or  
CS. Figure 12 shows the logic equivalent for the conver-  
sion circuitry. In any operating mode, CONVST must be  
low for a conversion to occur. Once the conversion is in  
progress, it cannot be restarted.  
Figure 6. Data-Access and Bus-Relinquish Timing  
Output Data Format  
The conversion result is output on a 12-bit data bus with  
a 75ns data-access time. The output data format is twos-  
complement. Three input control signals (CS, RD, and  
CONVST), the INT/BUSY converter status output, and the  
12 bits of output data can interface directly to a 16-bit data  
bus. See Figure 6 for data-access timing.  
Read operations are controlled by RD and CS. Both of  
these digital inputs must be low to read output data. The  
INT/BUSY output indicates the converter’s status and  
determines when the data from the most recent conver-  
sion is available. The MODE input configures the INT/  
BUSY output as follows:  
Timing and Control  
If MODE =  
V
, INT/BUSY functions as an  
DD  
The MAX120/MAX122 have five operational modes as  
outlined in Figures 7 to 11 and discussed in the Operating  
Modes section.  
INTERRUPT output. In this configuration, INT/BUSY  
goes low when the conversion is complete and returns  
high after the conversion data has been read.  
Full-control mode (mode 1) provides maximum control to  
the user for convert start and data-read operations.  
If MODE is left open or tied to DGND, INT/BUSY  
functions as a BUSY output. In this case, INT/BUSY  
goes low at the start of a conversion and remains low  
until the conversion is complete and the data is avail-  
able at D0–D11.  
Full-control mode is for µPs with or without wait-state  
capability. Stand-alone mode (mode 2) and continuous-  
conversion mode (mode 5) are for systems without µPs,  
Maxim Integrated  
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MAX120/MAX122  
500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
Figure 8. Stand-Alone Mode (Mode 2)  
Figure 9. Slow-Memory Mode (Mode 3)  
When the conversion is complete, the data can be read  
without initiating a new conversion by pulling RD and CS  
low and leaving CONVST high. To start a new conversion  
without reading data, RD and CS should remain high  
while CONVST is driven low. To simultaneous read data  
and initiate a new conversion, CONVST, RD, and CS  
should all be pulled low. Note: Allow at least 350ns for  
T/H acquisition time between the end of one conversion  
and the beginning of the next.  
Initialization After Power-Up  
On power-up, the first MAX120/MAX122 conversion is  
valid if the following conditions are met:  
1) Allow 14 clock cycles for the internal T/H to enter the  
track mode, plus a minimum of 350ns in the track  
mode for the data-acquisition time.  
2) Make sure the reference voltage has settled. Allow  
0.5ms for each 1µF of reference bypass capacitance  
(11ms for a 22µF capacitor).  
Mode 2: Stand-Alone Operation  
Operating Modes  
(MODE= OPEN, RD = CS = DGND)  
For systems that do not use or require full-bus interfac-  
ing, the MAX120/MAX122 can be operated in stand-alone  
mode directly linked to memory through DMA ports or a  
FIFO buffer. In stand-alone mode, a conversion is initi-  
ated by a falling edge on CONVST. The data outputs are  
always enabled; data changes at the end of a conversion  
as indicated by a rising edge on INT/BUSY. See Figure 8  
for stand-alone mode timing.  
Mode 1: (Full-Control Mode)  
Figure 7 shows the timing diagram for full-control mode  
(mode 1). In this mode, the µP controls the conversion-  
start and data-read operations independently.  
A falling edge on CONVST places the T/H into hold mode  
and starts a conversion in the SAR. The conversion is  
complete in 13 or 14 clock cycles as discussed in the  
Clock and Control Synchronization section. A change in  
the INT/BUSY output state signals the end of a conver-  
sion as follows:  
Mode 3: Slow-Memory Mode  
(CONVST = GND, MODE= OPEN)  
Taking RD and CS lo laces the T/H into hold mode and  
starts a conversion. INT/BUSY remains low while the  
conversion is in progress and can be used as a wait input  
to the µP. Data from the previous conversion appears on  
the data bus until the conversion end is indicated by INT/  
BUSY. See Figure 9 for slow-memory mode timing.  
If MODE = V , the end of conversion is signaled by the  
DD  
INT/BUSY output falling edge.  
If MODE = OPEN or DGND, the INT/BUSY output goes  
low while the conversion is in progress and returns high  
when the conversion is complete.  
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500ksps, 12-Bit ADCs with Track/Hold  
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Figure 12. Conversion-Control Logic  
continuously at the rate of one conversion for every 14  
clock cycles, which includes 2 clock cycles for the T/H  
acquisition time. To satisfy the 350ns minimum acquisi-  
tion time requirement within 2 clock cycles, the MAX120’s  
maximum clock frequency is 6MHz when operating in  
mode 5.  
Figure 10. ROM Mode (Mode 4)  
The data outputs are always enabled and “new” disap-  
pears on the output bus at the end of a conversion as  
indicated by the INT/BUSY output rising edge. The MODE  
input should be hard-wired to GND. Pulling CS, RD,  
or CONVST high stops conversions. See Figure 11 for  
continuous-conversion mode timing.  
Applications Information  
Using FIFO Buffers  
Using FIFO memory to buffer blocks of data from the  
MAX120 reduces µP interrupt overhead time by enabling  
the µP to process data while the MAX120, unassisted,  
writes conversion results to the FIFO. To retrieve a block  
of data, the µP reads from the FIFO via a read-interrupt  
cycle. Read and write operations for the FIFO are com-  
pletely asynchronous. Figure 13 shows the MAX120  
operating in continuous-conversion mode (mode 5),writ-  
ing data directly into the two IDT7200 256 x 9 FIFO buf-  
fers at the rate of 428ksps. The µP is interrupted to read  
the accumulated data by the FIFO’s half-full (HF) flag  
approximately three times per millisecond. For operation  
at 500ksps, use an 8MHz clock, and pulse CONVST at  
500kHz. The full flag (FF) indicates that the FIFO is full.  
If this flag is ignored, data may be lost. If necessary, con-  
versions can be inhibited by pulling CS, RD, or CONVST  
high. The FIFO’s read cycle times are as fast as 15ns,  
satisfying most system speed requirements. The RESET  
input resets all data in the FIFO to zero.  
Figure 11. Continuous-Conversion Mode (Mode 5)  
Mode 4: ROM Mode  
(MODE = OPEN, CONVST = GND)  
In ROM mode, the MAX120/MAX122 behave like a fast-  
access memory location avoid placing the µP into a wait  
state. Pulling RD and CS low places the T/H in hold mode,  
starts a conversion, and reads data from the previous  
conversion. Data from the first read in a sequence is often  
disregarded when this interface mode is used. A second  
read operation accesses the first conversion’s result and  
also starts a new conversion. The time between succes-  
sive read operations must be longer than the sum of the  
T/H acquisition time and the MAX120/MAX122 conver-  
sion time. See Figure 10 for ROM-mode timing.  
Mode 5: Continuous-Conversion Mode  
(CONVST = RD = CS = MODE = GND)  
For systems that do not use or require full-bus interfacing,  
the MAX120/MAX122 can operate in continuous-conver-  
sion mode, directly linked to memory through DMA ports  
or a FIFO buffer. In this mode, conversions are performed  
For synchronous operation, the CONVST pin may be  
used to initiate conversions, as described in the Operating  
Modes section (Mode 2: Stand-Alone Operation).  
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Figure 13. Using MAX120 with FIFO Memory  
Digital-Bus Noise  
Layout, Grounding, and Bypassing  
If the ADC’s data bus is active during a conversion,  
coupling from the data pins to the ADC comparator can  
cause errors. Using slow-memory mode (mode 3) avoids  
this problem by placing the µP in a wait state during the  
conversion. If the data bus is active during the conversion  
in either mode 1 or 4, use three-state drivers to isolate the  
bus from the ADC.  
For best system performance, use PCBs with separate  
analog and digital ground planes. Wirewrap boards are  
not recommended. The two ground planes should be tied  
together at the low-impedance power-supply source, as  
shown in Figure 14.  
The board layout should ensure that digital and analog  
signal lines are kept separate from each other as much as  
possible. Do not run analog and digital (especially clock)  
lines parallel to one another.  
In ROM mode (mode 4), considerable digital noise is  
generated in the ADC when RD or CS go high, disabling  
the output buffers after a conversion is started. This noise  
can cause errors if it occurs at the same instant the SAR  
latches a comparator decision. To avoid this problem, RD  
and CS should be active for less than 1 clock cycle. If  
this is not possible, RD or CS should go high coinciding  
with CLKIN’s falling edge, since the comparator output is  
always latched at CLKIN’s rising edge  
The ADC’s high-speed comparator is sensitive to high-  
frequency noise in the V  
and V  
power supplies.  
DD  
SS  
Bypass these supplies to the analog ground plane with  
0.1µF and 10µF bypass capacitors. Minimize capacitor  
lead lengths for best noise rejection. If the +5V power  
supply is very noisy, connect a 5Ω resistor, as shown in  
Figure 14. Figure 15 shows the negative power-supply  
(V ) rejection vs. frequency. Figure 16 shows the posi-  
SS  
tive power-supply (V ) rejection vs. frequency, with and  
DD  
without the optional 5Ω resistor.  
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500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
Figure 16. V  
Power-Supply Rejection vs. Frequency  
DD  
To adjust bipolar offset with Figure 19’s circuit, apply +1/2  
LSB (0.61mV) to the noninverting amplifier input and  
adjust R4 for output-code flicker between 0000 and 0000  
0000 0001. For full scale, apply FS - the output code flick-  
ers between 0111 1111 1110 and 0111 1111 1111. There  
may be some interaction between these adjustments. The  
MAX120/MAX122 transfer function used in conjunction  
with Figure 19’s circuit is the same as Figure 17, except  
the full-scale range is reduced to 2.5V.  
Figure 14. Power-Supply Grounding  
To adjust bipolar offset with Figure 20’s circuit, apply  
-1/2 LSB (-1.22mV) at V and adjust R5 for output-code  
IN  
flicker between 0000 0000 0000 and 0000 0000 0001. For  
gain adjustment, apply -FS + ½ LSB (-4.9951V) at V  
IN  
and adjust R1 so the output code flickers between 0111  
1111 1110 and 0111 1111 1111. As with Figure 20’s circuit,  
the offset and gain adjustments may interact. Figure 21  
plots the transfer function for Figure 20’s circuit.  
Figure 15. V Power-Supply Rejection vs. Frequency  
SS  
Dynamic Performance  
High-speed sampling capability and 500ksps throughput  
(333ksps for the MAX122) make the MAX120/MAX122  
ideal for wideband-signal processing. To support these  
and other related applications, fast fourier transform (FFT)  
test techniques are used to guarantee the ADC’s dynamic  
frequency response, distortion, and noise at the rated  
throughput. Specifically, this involves applying a low-  
distortion sine wave to the ADC input and recording the  
digital conversion results for a specified time. The data is  
then analyzed using an FFT algorithm, which determines  
its spectral content.  
Gain and Offset Adjustment  
Figure 17 plots the bipolar input/output transfer func-  
tion for the MAX120/MAX122. Code transitions occur  
halfway between successive integer LSB values. Output  
coding is two’s-complement binary with 1 LSB = 2.44mV  
(10V/4096).  
In applications where gain (full-scale range) adjustment  
is required, Figure 18’s circuit can be used. If both offset  
and gain (full-scale range) need adjustment, either of the  
circuits in Figures 19 and 20 can be used. Offset should  
be adjusted before gain for either of these circuits.  
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500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
Figure 17. Bipolar Transfer Function  
Figure 19. Offset and Gain Adjustment (Noninverting)  
Figure 18. Trim Circuit for Gain Only  
Figure 19. Offset and Gain Adjustment (Noninverting)  
ADCs have traditionally been evaluated by specifications  
such as zero and full-scale error, integral nonlinearity  
(INL), and differential nonlinearity (DNL). Such parame  
ters are widely accepted for specifying performance with  
DC and slowly varying signals, but are less useful in  
signal processing applications where the ADC’s impact  
on the system transfer function is the main concern. The  
significance of various DC errors does not translate well  
to the dynamic case, so different tests are required.  
The theoretical minimum ADC noise is caused by quanti-  
zation error and is a direct result of the ADC’s resolution:  
SNR = (6.02N + 1.76)dB, where N is the number of bits  
of resolution. A perfect 12-bit ADC can, therefore, do no  
better than 74dB. An FFT plot shows the output level in  
various spectral bands. Figure 22 shows the result of  
sampling a pure 100kHz sinusoid at a 500ksps rate with  
the MAX120.  
By transposing the equation that converts resolution to  
SNR, we can, from the measured SINAD, determine the  
effective resolution (or effective number of bits) the ADC  
provides: N = (SINAD - 1.76)/6.02. Figure 22 shows the  
effective number of bits as a function of the input fre-  
quency for the MAX120. The MAX122 performs similarly.  
Signal-to-Noise Ratio and  
Effective Number of Bits  
The signal-to-noise plus distortion ratio (SINAD) is the  
ratio of the fundamental input frequency’s RMS amplitude  
to the RMS amplitude of all other ADC output signals. The  
output band is limited to frequencies above DC and below  
one-half the ADC sample rate.  
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500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
Figure 21. Inverting Bipolar Transfer Function  
Figure 23. Effective Bits vs. Input Frequency  
where V is the fundamental RMS amplitude, and V to  
1
2
V
are the amplitudes of the 2nd through Nth harmonics.  
N
The THD specification in the Electrical Characteristics  
table includes the 2nd through 5th harmonics.  
lntermodulation Distortion  
If the ADC input signal consists of more than one spec-  
tral component, the ADC transfer function nonlinearities  
produce intermodulation distortion (IMD) in addition to  
THD. IMD is the change in one sinusoidal input caused  
by the presence of another sinusoidal input at a different  
frequency  
If two pure sine waves of frequency fa and fb are applied  
to the ADC input, nonlinearities in the ADC transfer func-  
tion create distortion products at sum and difference  
frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3, etc.  
THD includes those distortion products with m or n equal  
to zero. lntermodulation distortion consists of all distor-  
tion products for which neither m nor n equal zero. For  
example, the 2nd-order IMD terms include (fa + fb) and  
(fa - fb) while the 3rd-order IMD terms include (2fa + fb),  
(2fa - fb) , (fa + 2fb), and (fa - 2fb).  
Figure 22. MAX120 FFT Plot  
Total Harmonic Distortion  
If a pure sine wave is sampled by an ADC at greater than  
the Nyquist frequency, the nonlinearities in the ADC’s  
transfer function create harmonics of the input frequency  
in the sampled output data.  
If the two input sine waves are equal in magnitude, the  
value (in decibels) of the 2nd-order IMD products can be  
expressed by the following formula:  
Total harmonic distortion (THD) is the ratio of the RMS  
sum of all harmonics (in the frequency band above DC  
and below one-half the sample rate, but not including the  
DC component) to the RMS amplitude of the fundamental  
frequency. This is expressed as follows:  
amplitude at(fa ± fb)  
IMD (fa ± fb) = 20log  
amplitude at fa  
2
2
2
2
V
+ V  
+ V ... + V  
4 N  
2
3
THD = 20log  
V
1
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MAX120/MAX122  
500ksps, 12-Bit ADCs with Track/Hold  
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Spurious-Free Dynamic Range  
Ordering Information (continued)  
Spurious-free dynamic range is the ratio of the fundamen-  
tal RMS amplitude to the amplitude of the next largest  
spectral component (in the frequency band above DC and  
below one-half the sample rate). Usually the next largest  
spectral component occurs at some harmonic of the input  
frequency. However, if the ADC is exceptionally linear, it  
may occur only at a random peak in the ADC’s noise floor.  
PIN-  
PACKAGE  
INL  
(LSB)  
PART  
TEMP RANGE  
MAX120EAG+  
-40°C to +85°C 24 SSOP  
±1  
±3/4  
±1  
MAX122ACNG+  
MAX122BCNG+  
MAX122ACWG+  
MAX122BCWG+  
MAX122ACAG+  
MAX122BCAG+  
MAX122AENG+  
MAX122BENG+  
MAX122AEWG+  
MAX122BEWG+  
MAX122AEAG+  
MAX122BEAG+  
MAX122BMRG-  
MAX120EVKIT-DIP  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
0°C to +70°C  
24 PDIP  
24 PDIP  
24 Wide SO  
24 Wide SO  
24 SSOP  
24 SSOP  
±3/4  
±1  
Chip Information  
PROCESS: BiCMOS  
±3/4  
±1  
-40°C to +85°C 24 PDIP  
-40°C to +85°C 24 PDIP  
-40°C to +85°C 24 Wide SO  
-40°C to +85°C 24 Wide SO  
-40°C to +85°C 24 SSOP  
-40°C to +85°C 24 SSOP  
-55°C to +125°C 24 CERDIP  
±3/4  
±1  
Package Information  
±3/4  
±1  
For the latest package outline information and land patterns  
(footprints), go to www.maximintegrated.com/packages. Note  
that a “+”, “#”, or “-” in the package code indicates RoHS status  
only. Package drawings may show a different suffix character, but  
the drawing pertains to the package regardless of RoHS status.  
±3/4  
±1  
±1  
PACKAGE  
TYPE  
PACKAGE  
CODE  
OUTLINE  
NO.  
LAND  
PATTERN NO.  
0°C to +70°C  
PDIP – Through Hole  
24 CDIP  
24 PDIP  
24 SO  
R24-4  
N24+3  
W24+2  
A24+2  
21-0045  
21-0043  
21-0042  
21-0056  
+Denotes a lead(Pb)-free/RoHS-compliant package.  
MAX120 EV kit can be used to evaluate the MAX122; when  
ordering the EV kit, ask for a free sample of the MAX122.  
90-0182  
90-0110  
-Denotes a package containing lead(Pb).  
24 SSOP  
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MAX120/MAX122  
500ksps, 12-Bit ADCs with Track/Hold  
and Reference  
Revision History  
REVISION REVISION  
PAGES  
CHANGED  
DESCRIPTION  
NUMBER  
DATE  
0
9/92  
Initial release  
Removed PDIP, CERDIP packages from Ordering Information. Updated style  
throughout data sheet.  
1
3/12  
1–16  
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.  
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses  
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)  
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.  
©
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.  
2012 Maxim Integrated Products, Inc.  
15  

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