MAX2022_V01 [MAXIM]
High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator;
| 型号： | MAX2022_V01 |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | High-Dynamic-Range, Direct Up/ Downconversion 1500MHz to 3000MHz Quadrature Modulator/Demodulator |
| 文件： | 总26页 (文件大小：1255K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
●ꢀ
●ꢀ
●ꢀ
SingleꢀandꢀMulticarrierꢀWCDMA/UMTSꢀandꢀ
LTE/TD-LTE Base Stations
SingleꢀandꢀMulticarrierꢀcdmaOne™ꢀandꢀcdma2000ꢀ
Base Stations
SingleꢀandꢀMulticarrierꢀDCSꢀ1800/PCSꢀ1900ꢀEDGEꢀ
Base Stations
Ordering Information appears at end of data sheet.
EVALUATION KIT AVAILABLE
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
General Description
Benefits and Features
●ꢀ 1500MHzꢀtoꢀ3000MHzꢀRFꢀFrequencyꢀRange
The MAX2022 low-noise, high-linearity, direct conversion
quadrature modulator/demodulator is designed for single
and multicarrier 1500MHz to 3000MHz UMTS/WCDMA,
●ꢀ 1500MHzꢀtoꢀ3000MHzꢀLOꢀFrequencyꢀRange
●ꢀ ScalableꢀPower:ꢀExternalꢀCurrent-SettingꢀResistorsꢀ
Provide Option for Operating Device in Reduced-
Power/Reduced-Performance Mode
®
LTE/TD-LTE, cdma2000 , and DCS/PCS base-station
applications. Direct conversion architectures are advanta-
geous since they significantly reduce transmitter or receiv-
er cost, part count, and power consumption as compared
to traditional IF-based double conversion systems.
●ꢀ 36-Pin,ꢀ6mmꢀxꢀ6mmꢀTQFNꢀProvidesꢀHighꢀIsolationꢀinꢀ
a Small Package
Modulator Operation (2140MHz):
●ꢀ MeetsꢀFour-CarrierꢀWCDMAꢀ65dBcꢀACLR
●ꢀ 23.3dBmꢀTypicalꢀOIP3
●ꢀ 51.5dBmꢀTypicalꢀOIP2
●ꢀ 45.7dBcꢀTypicalꢀSidebandꢀSuppression
●ꢀ -40dBmꢀTypicalꢀLOꢀLeakage
●ꢀ -173.2dBm/HzꢀTypicalꢀOutputꢀNoise,ꢀEliminatingꢀtheꢀ
Need for an RF Output Filter
●ꢀ BroadbandꢀBasebandꢀInput
●ꢀ DC-CoupledꢀInputꢀProvidesꢀforꢀDirectꢀLaunchꢀDACꢀ
Interface, Eliminating the Need for Costly I/Q
Buffer Amplifiers
Demodulator Operation (1890MHz):
●ꢀ 39dBmꢀTypicalꢀIIP3
●ꢀ 58dBmꢀTypicalꢀIIP2
●ꢀ 9.2dBꢀTypicalꢀConversionꢀLoss
●ꢀ 9.4dBꢀTypicalꢀNF
In addition to offering excellent linearity and noise perfor-
mance, the MAX2022 also yields a high level of component
integration. This device includes two matched passive mix-
ers for modulating or demodulating in-phase and quadra-
ture signals, three LO mixer amplifier drivers, and an LO
quadrature splitter. On-chip baluns are also integrated
to allow for single-ended RF and LO connections. As an
added feature, the baseband inputs have been matched
to allow for direct interfacing to the transmit DAC, thereby
eliminating the need for costly I/Q buffer amplifiers.
The MAX2022 operates from a single +5V supply. It is
available in a compact 36-pin TQFN package (6mm x
6mm) with an exposed paddle. Electrical performance is
guaranteed over the extended -40°C to +85°C tempera-
ture range.
Applications
For related parts and recommended products to use with this part, refer
to www.maximintegrated.com/MAX2022.related.
WCDMA, ACLR, ALTCLR and Noise vs. RF Output
Power at 2140MHz for Single, Two, and Four Carriers
-60
-62
-64
-66
-68
-70
-72
-74
-76
-78
-80
-125
-135
-145
-155
-165
-175
●ꢀ PHS/PASꢀBaseꢀStations
●ꢀ PredistortionꢀTransmitters
●ꢀ FixedꢀBroadbandꢀWirelessꢀAccess
●ꢀ WirelessꢀLocalꢀLoop
●ꢀ PrivateꢀMobileꢀRadio
●ꢀ MilitaryꢀSystems
4C ADJ
4C ALT
2C ADJ
1C ADJ
4C
●ꢀ MicrowaveꢀLinks
●ꢀ DigitalꢀandꢀSpread-SpectrumꢀCommunicationꢀSystems
2C
1C
2C ALT
1C ALT
NOISE FLOOR
cdma2000 is a registered trademark of Telecommunications
Industry Association.
-50
-40
-30
-20
-10
0
RF OUTPUT POWER PER CARRIER (dBm)
cdmaOne is a trademark of CDMA Development Group.
19-3572; Rev 3; 7/13
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Absolute Maximum Ratings
VCC_ꢀtoꢀGND.......................................................-0.3V to +5.5V
BBIP,ꢀBBIN,ꢀBBQP,ꢀBBQNꢀtoꢀGND .......... -2.5V to (V
LO,ꢀRFꢀtoꢀGNDꢀMaximumꢀCurrent.....................................50mA
RF Input Power ..............................................................+20dBm
Baseband Differential I/Q Input Power...........................+20dBm
LO Input Power ..............................................................+10dBm
RBIASLO1 Maximum Current ............................................10mA
RBIASLO2 Maximum Current............................................10mA
RBIASLO3 Maximum Current............................................10mA
Continuous Power Dissipation (Note 1)..............................7.6W
Operating Case Temperature Range (Note 2)... -40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow).......................................+260°C
+ 0.3V)
CC
Note 1: Based on junction temperature T = T ꢀ+ꢀ(θ x V
x I ). This formula can be used when the temperature of the exposed
CC
J
C
JC
CC
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: T is the temperature on the exposed pad of the package. T is the ambient temperature of the device and PCB.
C
A
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
TQFN
Junction-to-Ambient
ThermalꢀResistanceꢀ(θ ) (Notes 3, 4) .....................+34°C/W
Junction-to-Case
ThermalꢀResistanceꢀ(θ ) (Notes 1, 4)....................+8.5°C/W
JA
JC
Note 3: Junction temperature T = T ꢀ+ꢀ(θ x V
x I ). This formula can be used when the ambient temperature of the PCB is
CC
J
A
JA
CC
known. The junction temperature must not exceed +150°C.
Note 4:ꢀ PackageꢀthermalꢀresistancesꢀwereꢀobtainedꢀusingꢀtheꢀmethodꢀdescribedꢀinꢀJEDECꢀspecificationꢀJESD51-7,ꢀusingꢀaꢀfour-layerꢀ
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
DC Electrical Characteristics
(MAX2022 Typical Application Circuit, V ꢀ=ꢀ4.75Vꢀtoꢀ5.25V,ꢀV
ꢀ=ꢀ0V,ꢀI/Qꢀportsꢀterminatedꢀintoꢀ50ΩꢀtoꢀGND,ꢀLOꢀandꢀRFꢀportsꢀ
GND
CC
terminatedꢀintoꢀ50ΩꢀtoꢀGND,ꢀR1ꢀ=ꢀ432Ω,ꢀR2ꢀ=ꢀ562Ω,ꢀR3ꢀ=ꢀ301Ω,ꢀT = -40°C to +85°C, unless otherwise noted. Typical values are at
C
V
= 5V, T = +25°C, unless otherwise noted.)
C
CC
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
5.00
292
MAX
5.25
342
UNITS
V
Supply Voltage
V
4.75
CC
Total Supply Current
Total Power Dissipation
I
Pins 3, 13, 15, 31, 33 all connected to V
mA
TOTAL
CC
1460
1796
mW
Recommended AC Operating Conditions
PARAMETER
RF Frequency
SYMBOL
CONDITIONS
MIN
1500
1500
TYP
MAX
3000
3000
1000
+3
UNITS
MHz
MHz
MHz
dBm
f
(Note 5)
(Note 5)
(Note 5)
RF
LO
LO Frequency
IF Frequency
f
f
IF
LO Power Range
P
-3
LO
Maxim Integrated
│ 2
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
AC Electrical Characteristics (Modulator)
(MAX2022 Typical Application Circuit, V ꢀ =ꢀ 4.75Vꢀ toꢀ 5.25V,ꢀ V
ꢀ =ꢀ 0V,ꢀ I/Qꢀ differentialꢀ inputsꢀ drivenꢀ fromꢀ aꢀ 100Ωꢀ differentialꢀ
CC
GND
DC-coupled source, 0V common-mode input, P
= 0dBm, f ꢀ=ꢀ1900MHzꢀtoꢀ2200MHz,ꢀ50ΩꢀLOꢀandꢀRFꢀsystemꢀimpedance,ꢀR1ꢀ=ꢀ
LO
LO
432Ω,ꢀR2ꢀ=ꢀ562Ω,ꢀR3ꢀ=ꢀ301Ω,ꢀT = -40°C to +85°C. Typical values are at V
= 5V, V ꢀ=ꢀ109mV
differential, V
ꢀ=ꢀ109mV
C
CC
BBI
P-P
BBQ P-P
differential, f = 1MHz, T ꢀ=ꢀ+25°C,ꢀunlessꢀotherwiseꢀnoted.)ꢀ(Notesꢀ6,ꢀ7)
IQ
C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
BASEBAND INPUT
Baseband Input Differential
Impedance
43
0
Ω
BB Common-Mode Input Voltage
Range
(Note 8)
= +25°C
-2.5
-24
+1.5
V
Output Power
T
dBm
C
RF OUTPUTS (f
= 1960MHz)
LO
V
, V
ꢀ=ꢀ547mV
differential per
P-P
BBI BBQ
Output IP3
toneꢀintoꢀ50Ω,ꢀf
= 1.8MHz,
21.8
dBm
dBm
BB1
f
ꢀ=ꢀ1.9MHz
BB2
V
, V
ꢀ=ꢀ547mV
differential per
P-P
= 1.8MHz,
BBI BBQ
Output IP2
toneꢀintoꢀ50Ω,ꢀf
48.9
BB1
f
ꢀ=ꢀ1.9MHz
BB2
Output Power
-20.5
dBm
Output Power Variation Over
Temperature
T
= -40°C to +85°C
-0.004
dB/°C
C
f
P
ꢀ=ꢀ1960MHz,ꢀsweepꢀf
,
BB
LO
Output-Power Flatness
0.6
70
dB
ꢀflatnessꢀforꢀf from 1MHz to 50MHz
BB
RF
ACLR (1st Adjacent Channel
5MHz Offset)
Single-carrierꢀWCDMAꢀ(Noteꢀ9),
RFOUT = -16dBm
dBc
dBm
No external calibration, with each baseband
inputꢀterminatedꢀinꢀ50ΩꢀtoꢀGND
LO Leakage
-46.7
Sideband Suppression
RF Return Loss
No external calibration
47.3
15.3
dBc
dB
Output Noise Density
LO Input Return Loss
f
= 2060MHz (Note 10)
-173.4
10.1
dBm/Hz
dB
meas
RF OUTPUTS (f
= 2140MHz)
LO
V
, V
ꢀ=ꢀ547mV
differential per
P-P
BBI BBQ
Output IP3
toneꢀintoꢀ50Ω,ꢀf
= 1.8MHz,
23.3
51.5
dBm
dBm
BB1
f
ꢀ=ꢀ1.9MHz
BB2
V
, V
ꢀ=ꢀ547mV
differential per
P-P
= 1.8MHz,
BB1
BBI BBQ
Output IP2
toneꢀintoꢀ50Ω,ꢀf
f
ꢀ=ꢀ1.9MHZ
BB2
Output Power
-20.8
dBm
Output Power Variation Over
Temperature
T
= -40°C to +85°C
-0.005
dB/°C
C
f
P
= 2140MHz, sweep f
,
BB
LO
Output-Power Flatness
0.32
dB
ꢀflatnessꢀforꢀf from 1MHz to 50MHz
BB
RF
Maxim Integrated
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
AC Electrical Characteristics (Modulator) (continued)
(MAX2022 Typical Application Circuit, V ꢀ =ꢀ 4.75Vꢀ toꢀ 5.25V,ꢀ V
ꢀ =ꢀ 0V,ꢀ I/Qꢀ differentialꢀ inputsꢀ drivenꢀ fromꢀ aꢀ 100Ωꢀ differentialꢀ
CC
GND
DC-coupled source, 0V common-mode input, P
= 0dBm, f ꢀ=ꢀ1900MHzꢀtoꢀ2200MHz,ꢀ50ΩꢀLOꢀandꢀRFꢀsystemꢀimpedance,ꢀR1ꢀ=ꢀ
LO
LO
432Ω,ꢀR2ꢀ=ꢀ562Ω,ꢀR3ꢀ=ꢀ301Ω,ꢀT = -40°C to +85°C. Typical values are at V
= 5V, V ꢀ=ꢀ109mV
differential, V
ꢀ=ꢀ109mV
C
CC
BBI
P-P
BBQ P-P
differential, f = 1MHz, T ꢀ=ꢀ+25°C,ꢀunlessꢀotherwiseꢀnoted.)ꢀ(Notesꢀ6,ꢀ7)
IQ
C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ACLR (1st Adjacent Channel
5MHz Offset)
Single-carrierꢀWCDMAꢀ(Noteꢀ9),
70
dBc
RFOUT = -16dBm, f ꢀ=ꢀ2GHz
LO
No external calibration, with each baseband
inputꢀterminatedꢀinꢀ50ΩꢀtoꢀGND
LO Leakage
-40.4
dBm
Sideband Suppression
RF Return Loss
No external calibration
45.7
13.5
dBc
dB
Output Noise Density
LO Input Return Loss
f
= 2240MHz (Note 10)
-173.2
18.1
dBm/Hz
dB
meas
AC Electrical Characteristics (Demodulator, f
(MAX2022 Typical Application Circuit when operated as a demodulator. I/Q outputs are recombined using network shown in Figure 5. Losses
= 1880MHz)
LO
ofꢀcombiningꢀnetworkꢀnotꢀincludedꢀinꢀmeasurements.ꢀRFꢀandꢀLOꢀportsꢀareꢀdrivenꢀfromꢀ50Ωꢀsources.ꢀTypicalꢀvaluesꢀareꢀforꢀV = 5V, I/Q
CC
DCꢀreturnsꢀ=ꢀ160ΩꢀresistorsꢀtoꢀGND,ꢀP
= 0dBm, P
= 0dBm, f ꢀ=ꢀ1890MHz,ꢀf
= 1880MHz, f = 10MHz, T = +25°C, unless
RF
LO
RF
LO IF C
otherwise noted.) (Notes 6, 11)
PARAMETER
Conversion Loss
SYMBOL
CONDITIONS
MIN
TYP
9.2
MAX
UNITS
dB
L
C
Noise Figure
NF
9.4
dB
SSB
f
P
f
=ꢀ1890MHz,ꢀf
=ꢀ1891MHz,
RF2
RF1
Input Third-Order
Intercept Point
IIP3
= P
= 0dBm, f = 10MHz,
IF1
39
dBm
dBm
RF1
RF2
= 11MHz
IF2
f
P
f
=ꢀ1890MHz,ꢀf
=ꢀ1891MHz,
RF2
RF1
Input Second-Order
Intercept Point
IIP2
= P
= 0dBm, f = 10MHz,
58
RF1
RF2
IF1
= 21MHz
= 11MHz, f
IF2
IM2nd
LO Leakage at RF Port
GainꢀCompression
Unnulled
= 20dBm
-40
0.10
35
dBm
dB
dB
dB
dB
Ω
P
RF
Image Rejection
RF Port Return Loss
LO Port Return Loss
IF Port Differential Impedance
C9ꢀ=ꢀ1.2pF
17
C3 = 22pF
9
43
Minimum Demodulation 3dB
Bandwidth
>500
>450
MHz
MHz
Minimumꢀ1dBꢀGainꢀFlatness
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
AC Electrical Characteristics (Demodulator, f
(MAX2022 Typical Application Circuit when operated as a demodulator. I/Q outputs are recombined using network shown in Figure 5. Losses
= 2855MHz)
LO
ofꢀcombiningꢀnetworkꢀnotꢀincludedꢀinꢀmeasurements.ꢀRFꢀandꢀLOꢀportsꢀareꢀdrivenꢀfromꢀ50Ωꢀsources.ꢀTypicalꢀvaluesꢀareꢀforꢀV = 5V, I/Q
CC
DCꢀreturnsꢀ=ꢀ160ΩꢀresistorsꢀtoꢀGND,ꢀP = 0dBm, P = 0dBm, f = 2655MHz, f = 2855MHz, f = 200MHz, T = +25°C, unless
RF
LO
RF
LO
IF
C
otherwise noted.) (Notes 6, 11)
PARAMETER
Conversion Loss
Noise Figure
SYMBOL
CONDITIONS
MIN
TYP
11.2
11.4
MAX
UNITS
dB
L
C
NF
dB
SSB
f
= 2655MHz, f
= 2656.2MHz,
RF1
RF2
Input Third-Order Intercept Point
IIP3
P
= P
=ꢀ198.8MHz
= 0dBm, f
= 200MHz,
RF1
RF2
IF1
34.5
60
dBm
f
IF2
f
= 2655MHz, f
= 2656.2MHz,
RF2
RF1
Input Second-Order Intercept
Point
IIP2
P
= P
= 0dBm, f = 200MHz,
dBm
dBm
RF1
RF2
IF1
f
=ꢀ198.8MHz,ꢀf
=ꢀ398.8MHz
IM2nd
IF2
LO Leakage at RF Port
-31.3
-25.2
-23.5
-26
I+
I-
LO Leakage at IF Port
dBm
Q+
Q-
-22.3
0.10
0.3
GainꢀCompression
P
= 20dBm
dB
dB
deg
dB
dB
Ω
RF
I/QꢀGainꢀMismatch
I/Q Phase Mismatch
RF Port Return Loss
LO Port Return Loss
IF Port Differential Impedance
0.5
C9ꢀ=ꢀ22pF,ꢀL1ꢀ=ꢀ4.7nH,ꢀC14ꢀ=ꢀ0.7pFꢀ
22.5
14.2
43
C3 = 6.8pF
Minimum Demodulation 3dB
Bandwidth
>500
>450
MHz
MHz
Minimumꢀ1dBꢀGainꢀFlatness
Note 5: Recommended functional range, not production tested. Operation outside this range is possible, but with degraded perfor-
mance of some parameters.
Note 6: All limits include external component losses of components, PCB, and connectors.
Note 7: It is advisable not to operate the I and Q inputs continuously above 2.5V
Note 8:ꢀ Guaranteedꢀbyꢀdesignꢀandꢀcharacterization.
differential.
P-P
Note 9: Single-carrier WCDMA peak-to-average ratio of 10.5dB for 0.1% complementary cumulative distribution function.
Note 10:ꢀNoꢀbasebandꢀdriveꢀinput.ꢀMeasuredꢀwithꢀtheꢀbasebandꢀinputsꢀterminatedꢀinꢀ50ΩꢀtoꢀGND.ꢀAtꢀlow-outputꢀpowerꢀlevels,ꢀtheꢀ
output noise density is equal to the thermal noise floor.
Note 11:ꢀItꢀisꢀadvisableꢀnotꢀtoꢀoperateꢀtheꢀRFꢀinputꢀcontinuouslyꢀaboveꢀ+17dBm.
Maxim Integrated
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics
(MAX2022 Typical Application Circuit,ꢀ50ΩꢀLOꢀinput,ꢀR1ꢀ=ꢀ432Ω,ꢀR2ꢀ=ꢀ562Ω,ꢀR3ꢀ=ꢀ301Ω,ꢀV
= 5V, P
= 0dBm, f
= 2140MHz,
CC
LO
LO
V = V ꢀ=ꢀ109mV
differential, f ꢀ=ꢀ1MHz,ꢀI/Qꢀdifferentialꢀinputsꢀdrivenꢀfromꢀaꢀ100ΩꢀdifferentialꢀDC-coupledꢀsource,ꢀcommon-modeꢀ
I
Q
P-P
IQ
input from 0V, T = +25°C, unless otherwise noted.)
C
MODULATOR
ACLR vs. OUTPUT POWER
ACLR vs. OUTPUT POWER
ACLR vs. OUTPUT POWER
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-70
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-76
-78
-80
-60
-62
-64
-66
-68
-70
-72
-74
-76
-78
-80
-60
-62
-64
-66
-68
-70
-72
-74
-76
ADJACENT CHANNEL
SINGLE CARRIER
TWO CARRIER
ADJACENT CHANNEL
ADJACENT CHANNEL
ALTERNATE CHANNEL
ALTERNATE CHANNEL
ALTERNATE CHANNEL
-78 FOUR CARRIER
-80
-40
-30
-20
-10
0
-40
-30
-20
-10
0
-50
-40
-30
-20
-10
OUTPUT POWER (dBm)
OUTPUT POWER (dBm)
OUTPUT POWER (dBm)
OUTPUT POWER vs. LO FREQUENCY
OUTPUT POWER vs. LO FREQUENCY
OUTPUT POWER vs. LO FREQUENCY
-2
-3
-4
-5
-6
-7
-8
-2
-3
-4
-5
-6
-7
-8
-2
-3
-4
-5
-6
-7
-8
V = V = 0.611V DIFFERENTIAL
V = V = 0.611V DIFFERENTIAL
V = V = 0.611V DIFFERENTIAL
I Q P-P
I
Q
P-P
I
Q
P-P
P
LO
= -3dBm, 0dBm, +3dBm
V
CC
= 4.75V, 5.0V, 5.25V
T
C
= +25°C
T
= -40°C
C
T
C
= +85°C
1.5
1.7
1.9
2.1
2.3
2.5
1.5
1.7
1.9
2.1
2.3
2.5
1.5
1.7
1.9
2.1
2.3
2.5
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
LO LEAKAGE vs. LO FREQUENCY
LO LEAKAGE vs. LO FREQUENCY
LO LEAKAGE vs. LO FREQUENCY
BASEBAND INPUTS TERMINATED IN 50Ω
BASEBAND INPUTS TERMINATED IN 50Ω
BASEBAND INPUTS TERMINATED IN 50Ω
-10
-30
-50
-70
-90
-10
-30
-50
-70
-90
-10
-30
-50
-70
-90
P
LO
= -3dBm, +3dBm
T = -40°C, +85°C
C
V
CC
= 4.75V, 5.0V
P
LO
= 0dBm
T = +25°C
C
V
CC
= 5.25V
1.5
1.7
1.9
2.1
2.3
2.5
1.5
1.7
1.9
2.1
2.3
2.5
1.5
1.7
1.9
2.1
2.3
2.5
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
Maxim Integrated
│
6
www.maximintegrated.com
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit,ꢀ50ΩꢀLOꢀinput,ꢀR1ꢀ=ꢀ432Ω,ꢀR2ꢀ=ꢀ562Ω,ꢀR3ꢀ=ꢀ301Ω,ꢀV
= 5V, P
= 0dBm, f
= 2140MHz,
CC
LO
LO
V = V ꢀ=ꢀ109mV
differential, f ꢀ=ꢀ1MHz,ꢀI/Qꢀdifferentialꢀinputsꢀdrivenꢀfromꢀaꢀ100ΩꢀdifferentialꢀDC-coupledꢀsource,ꢀcommon-modeꢀ
I
Q
P-P
IQ
input from 0V, T = +25°C, unless otherwise noted.)
C
MODULATOR
IMAGE REJECTION vs. LO FREQUENCY
IMAGE REJECTION vs. LO FREQUENCY
IMAGE REJECTION vs. LO FREQUENCY
60
50
40
30
20
10
0
60
50
40
30
20
10
0
60
50
40
30
20
10
0
f
= 1MHz, V = V = 112mV
f
= 1MHz, V = V = 112mV
f
= 1MHz, V = V = 112mV
BB
I
Q
P-P
BB
I
Q
P-P
BB
I
Q
P-P
P
LO
= -3dBm
T
C
= -40°C, +25°C, +85°C
P
LO
= 0dBm
V
CC
= 4.75, 5.0V, 5.25V
P
LO
= +3dBm
1.7
1.5
1.7
1.9
2.1
2.3
2.5
1.5
1.9
2.1
2.3
2.5
1.5
1.7
1.9
2.1
2.3
2.5
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
IF FLATNESS
OUTPUT NOISE vs. OUTPUT POWER
OUTPUT NOISE vs. OUTPUT POWER
vs. BASEBAND FREQUENCY
-150
-156
-14
-15
-16
-17
-18
-19
-20
-21
-22
-23
-24
P
LO
= 0dBm, f = 1960MHz
P = 0dBm, f = 2140MHz
LO LO
LO
-155
-160
-165
-160
-164
-168
T
C
= -40°C
f
- f
LO IQ
T
C
= +25°C
T
C
= +85°C
T
C
= +25°C
T
= +85°C
C
f + f
LO IQ
-170
-175
-180
-172
-176
-180
f
= 1960MHz, P = -12dBm/PORT INTO 50Ω
BB
T
C
= -40°C
LO
-25 -20 -15 -10
-5
0
5
10
-25 -20 -15 -10
-5
0
5
10
0
20
40
60
80
100
OUTPUT POWER (dBm)
OUTPUT POWER (dBm)
BASEBAND FREQUENCY (MHz)
IF FLATNESS
vs. BASEBAND FREQUENCY
BASEBAND DIFFERENTIAL INPUT
RESISTANCE vs. BASEBAND FREQUENCY
BASEBAND DIFFERENTIAL INPUT
RESISTANCE vs. BASEBAND FREQUENCY
-14
-15
-16
-17
-18
-19
-20
-21
-22
-23
-24
45.0
44.5
44.0
43.5
43.0
42.5
42.0
41.5
41.0
44.5
44.0
43.5
43.0
42.5
V
= 4.75V
CC
f
- f
LO IQ
P
= +3dBm
P
LO
V
CC
= 5.0V
V
CC
= 5.25V
= -3dBm
LO
f
+ f
LO IQ
P
= 0dBm
LO
f
= 2140MHz, P = -12dBm/PORT INTO 50Ω
f
= 2GHz, P = 0dBm
f
= 2GHz, V = 5.0V
LO CC
LO
BB
LO
LO
0
20
40
60
80
100
0
20
40
60
80
100
0
20
40
60
80
100
BASEBAND FREQUENCY (MHz)
BASEBAND FREQUENCY (MHz)
BASEBAND FREQUENCY (MHz)
Maxim Integrated
│ 7
www.maximintegrated.com
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit,ꢀ50ΩꢀLOꢀinput,ꢀR1ꢀ=ꢀ432Ω,ꢀR2ꢀ=ꢀ562Ω,ꢀR3ꢀ=ꢀ301Ω,ꢀV
= 5V, P
= 0dBm, f
= 2140MHz,
CC
LO
LO
V = V ꢀ=ꢀ109mV
differential, f ꢀ=ꢀ1MHz,ꢀI/Qꢀdifferentialꢀinputsꢀdrivenꢀfromꢀaꢀ100ΩꢀdifferentialꢀDC-coupledꢀsource,ꢀcommon-modeꢀ
I
Q
P-P
IQ
input from 0V, T = +25°C, unless otherwise noted.)
C
MODULATOR
OUTPUT IP3
vs. LO FREQUENCY
OUTPUT IP3
vs. LO FREQUENCY
OUTPUT IP3
vs. LO FREQUENCY
25
20
15
10
5
25
20
15
10
5
25
20
15
10
5
P
= -3dBm
V
= 4.75V
LO
CC
T
= -40°C, +25°C, +85°C
C
V
= 5.0V, 5.25V
P
= 0dBm, +3dBm
CC
LO
V
BB1
= 0.61V DIFFERENTIAL PER TONE,
V
= 0.61V DIFFERENTIAL PER TONE,
V
= 0.61V DIFFERENTIAL PER TONE,
P-P
BB
P-P
BB
BB1
P-P
BB
BB1
f
= 1.8MHz, f
= 1.9MHz
f
= 1.8MHz, f
= 1.9MHz
f
= 1.8MHz, f
BB2
= 1.9MHz
BB2
BB2
0
0
0
1.5
1.7
1.9
2.1
2.3
2.5
1.5
1.7
1.9
2.1
2.3
2.5
1.5
1.7
1.9
2.1
2.3
2.5
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
OUTPUT IP3
vs. COMMON-MODE BASEBAND VOLTAGE
OUTPUT IP2
vs. LO FREQUENCY
OUTPUT IP2
vs. LO FREQUENCY
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
V
BB1
= 0.61V DIFFERENTIAL PER TONE,
P-P
V
= 4.75V, 5.0V
BB
T
= +25°C
= +85°C
CC
C
f
= 1.8MHz, f
= 1.9MHz
BB2
T
C
T
= -40°C
C
V
= 5.25V
CC
f
= 2140MHz
LO
f
= 1960MHz
LO
V
f
= 0.61V DIFFERENTIAL PER TONE,
V
= 0.61V DIFFERENTIAL PER TONE,
P-P
= 1.8MHz, f
BB2
BB
BB1
P-P
BB
BB1
= 1.8MHz, f
= 1.9MHz
f
= 1.9MHz
BB2
-3
-2
-1
0
1
2
3
1.5
1.7
1.9
2.1
2.3
2.5
1.5
1.7
1.9
2.1
2.3
2.5
COMMMON-MODE BASEBAND VOLTAGE (V)
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
OUTPUT IP2
vs. LO FREQUENCY
OUTPUT IP2
vs. COMMON-MODE BASEBAND VOLTAGE
LO LEAKAGE vs. LO FREQUENCY
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
0
-20
f
= 1960MHz
NULLED AT f = 1960MHz AT
LO
LO
P = -18dBm
RF
P
= +3dBm
LO
f
= 2140MHz
LO
-40
P
LO
= 0dBm
P
= -3dBm
LO
-60
-80
V
f
= 0.61V DIFFERENTIAL PER TONE,
P-P
= 1.8MHz, f
V
f
= 0.61V DIFFERENTIAL PER TONE,
P-P
BB
BB1
BB
BB1
= 1.9MHz
BB2
= 1.8MHz, f
= 1.9MHz
BB2
-100
1.5
1.7
1.9
2.1
2.3
2.5
-3
-2
-1
0
1
2
3
1.945 1.950 1.955 1.960 1.965 1.970 1.975
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
COMMMON-MODE BASEBAND VOLTAGE (V)
Maxim Integrated
│ 8
www.maximintegrated.com
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit,ꢀ50ΩꢀLOꢀinput,ꢀR1ꢀ=ꢀ432Ω,ꢀR2ꢀ=ꢀ562Ω,ꢀR3ꢀ=ꢀ301Ω,ꢀV
= 5V, P
= 0dBm, f
= 2140MHz,
CC
LO
LO
V = V ꢀ=ꢀ109mV
differential, f ꢀ=ꢀ1MHz,ꢀI/Qꢀdifferentialꢀinputsꢀdrivenꢀfromꢀaꢀ100ΩꢀdifferentialꢀDC-coupledꢀsource,ꢀcommon-modeꢀ
I
Q
P-P
IQ
input from 0V, T = +25°C, unless otherwise noted.)
C
MODULATOR
LO LEAKAGE vs. P WITH
RF
LO LEAKAGE NULLED AT SPECIFIC P
RF
LO LEAKAGE vs. P WITH
LO LEAKAGE vs. f WITH
LO
LO LEAKAGE NULLED AT SPECIFIC P
RF
LO LEAKAGE NULLED AT SPECIFIC P
RF
RF
-68
-70
-72
-74
-76
-78
-80
-82
-84
-86
-88
-90
-68
-70
-72
-74
-76
-78
-80
-82
-84
-86
-88
-90
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
f
= 2140Hz
LO
NULLED AT -10dBm
NULLED AT -10dBm
NULLED AT -14dBm,
-18dBm, -22dBm
NULLED AT -14dBm,
-18dBm, -22dBm
f
= 1960MHz
LO
f
= 1960MHz, NULLED AT -10dBm P
RF
LO
-40
-35
-30
-25
-20
-15
-10
-40
-35
-30
-25
-20
-15
-10
1.85
1.90
1.95
2.00
2.05
2.10
OUTPUT POWER P (dBm)
OUTPUT POWER P (dBm)
LO FREQUENCY (GHz)
RF
RF
LO LEAKAGE vs. f WITH
LO LEAKAGE vs. DIFFERENTIAL
DC OFFSET ON Q-SIDE
LO
LO LEAKAGE NULLED AT SPECIFIC P
RF
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-40
f
= 2140MHz, NULLED AT -10dBm P
P
= -18dBm, I-SIDE NULLED
LO
RF
RF
f
= 2140MHz
f
LO
-50
-60
-70
-80
= 1960MHz
LO
2.00
2.05
2.10
2.15
2.20
2.25
-15 -14 -13 -12 -11 -10
-9
-8
LO FREQUENCY (GHz)
DC DIFFERENTIAL OFFSET ON Q-SIDE (mV)
SIDEBAND SUPRESSION vs. P
SIDEBAND SUPRESSION vs. P
RF
RF
70
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
1.8MHz
9MHz
1.8MHz
9MHz
f
= 1.8MHz, f
= 9MHz, f = 1960MHz,
f
= 1.8MHz, f
= 9MHz, f = 2140MHz,
BB2 LO
BB1
BB2
LO
BB1
1.8MHz BASEBAND TONE NULLED AT
1.8MHz BASEBAND TONE NULLED AT
P
= -20dBm
P
= -20dBm
RF
RF
-30
-25
-20
-15
-10
-30
-25
-20
-15
-10
MODULATOR P
(dBm)
MODULATOR P
(dBm)
OUT
OUT
Maxim Integrated
│ 9
www.maximintegrated.com
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit,ꢀ50ΩꢀLOꢀinput,ꢀR1ꢀ=ꢀ432Ω,ꢀR2ꢀ=ꢀ562Ω,ꢀR3ꢀ=ꢀ301Ω,ꢀV
= 5V, P
= 0dBm, f
= 2140MHz,
CC
LO
LO
V = V ꢀ=ꢀ109mV
differential, f ꢀ=ꢀ1MHz,ꢀI/Qꢀdifferentialꢀinputsꢀdrivenꢀfromꢀaꢀ100ΩꢀdifferentialꢀDC-coupledꢀsource,ꢀcommon-modeꢀ
I
Q
P-P
IQ
input from 0V, T = +25°C, unless otherwise noted.)
C
MODULATOR
RF PORT MATCH
vs. LO FREQUENCY
LO PORT MATCH
vs. LO FREQUENCY
0
0
-5
-5
V
CC
= 4.75V, 5.0V, 5.25V
-10
-15
-20
-25
-30
-10
V
= 4.75V, 5.0V, 5.25V
CC
-15
-20
1.5
1.7
1.9
2.1
2.3
2.5
1.5
1.7
1.9
2.1
2.3
2.5
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
LO PORT MATCH
OUTPUT POWER vs. INPUT POWER (P *)
IN
vs. LO FREQUENCY
10
8
0
-5
f
= 1960MHz
LO
*P IS THE AVAILABLE
IN
6
POWER FROM ONE OF
THE FOUR 50Ω
-10
-15
-20
-25
-30
-35
-40
-45
-50
4
BASEBAND SOURCES
P
= -3dBm
2
LO
0
P
= 0dBm
LO
-2
-4
-6
-8
-10
T
= -40°C, +25°C, +85°C
P
LO
= +3dBm
2.1
C
-2
3
8
13
18
1.5
1.7
1.9
2.3
2.5
INPUT POWER (P *) (dBm)
IN
LO FREQUENCY (GHz)
TOTAL SUPPLY CURRENT
OUTPUT POWER vs. INPUT POWER (P *)
IN
vs. TEMPERATURE (T )
C
10
8
340
320
300
280
260
240
P
= 2140MHz
LO
*P IS THE AVAILABLE
IN
6
POWER FROM ONE OF
THE FOUR 50Ω
BASEBAND SOURCES
4
V
CC
= 5.25V
2
0
-2
-4
-6
-8
-10
V
CC
= 5.0V
T
C
= -40°C, +25°C, +85°C
V
CC
= 4.75V
-15
-2
3
8
13
18
-40
10
35
60
85
INPUT POWER (P *) (dBm)
IN
TEMPERATURE (°C)
Maxim Integrated
│ 10
www.maximintegrated.com
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit,ꢀ50ΩꢀLOꢀinput,ꢀR1ꢀ=ꢀ432Ω,ꢀR2ꢀ=ꢀ562Ω,ꢀR3ꢀ=ꢀ301Ω,ꢀV
= 5V, P
= 0dBm, f
= 2140MHz,
CC
LO
LO
V = V ꢀ=ꢀ109mV
differential, f ꢀ=ꢀ1MHz,ꢀI/Qꢀdifferentialꢀinputsꢀdrivenꢀfromꢀaꢀ100ΩꢀdifferentialꢀDC-coupledꢀsource,ꢀcommon-modeꢀ
I
Q
P-P
IQ
input from 0V, T = +25°C, unless otherwise noted.)
C
MODULATOR
VCCLOA SUPPLY CURRENT
VCCLOI1 SUPPLY CURRENT
vs. TEMPERATURE (T )
vs. TEMPERATURE (T )
C
C
90
85
80
75
70
65
60
55
50
45
40
35
30
V
CC
= 5.25V
V
= 5.25V
= 5.0V
CC
V
CC
= 5.0V
V
CC
V
CC
= 4.75V
V
= 4.75V
CC
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
VCCLOI2 SUPPLY CURRENT
vs. TEMPERATURE (T )
VCCLOQ1 SUPPLY CURRENT
vs. TEMPERATURE (T )
C
C
70
65
60
55
50
45
40
55
50
45
40
35
30
V
CC
= 5.25V
V
CC
= 5.25V
V
CC
= 5.0V
V
CC
= 5.0V
V
CC
= 4.75V
V
CC
= 4.75V
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
VCCLOQ2 SUPPLY CURRENT
vs. TEMPERATURE (T )
C
70
65
60
55
50
45
40
V
CC
= 5.25V
V
CC
= 5.0V
V
= 4.75V
CC
-40
-15
10
35
60
85
TEMPERATURE (°C)
Maxim Integrated
│ 11
www.maximintegrated.com
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics
(MAX2022 Typical Application Circuit, RF and LO ports tuned for 1500MHz to 2400MHz as noted in Table 1. I/Q outputs are recombined
using network shown in Figure 5. Losses of combining network not included in measurements. V ꢀ=ꢀ5.0V,ꢀGNDꢀ=ꢀ0V,ꢀP = 0dBm,
CC
RF
P
= 0dBm, f = 20MHz, f > f ,ꢀintermodulationꢀdeltaꢀfrequencyꢀ=ꢀ1.2MHz,ꢀ50ΩꢀLOꢀandꢀRFꢀsystemꢀimpedance,ꢀT = +25°C un-
LO
IF
LO
RF
C
less otherwise noted.)
DEMODULATOR LOW BAND TUNING (VARIABLE LO)
CONVERSION LOSS
vs. RF FREQUENCY
CONVERSION LOSS
vs. RF FREQUENCY
CONVERSION LOSS
vs. RF FREQUENCY
12
11
10
9
12
11
10
9
12
11
10
9
P
LO
= -3dBm, 0dBm, +3dBm
V
CC
= 4.75V, 5.0V, 5.25V
T
= +25°C
C
T
= +85°C
C
8
8
8
T
= -40°C
1780
C
7
7
7
1480
2080
2380
1480
1780
2080
2380
1480
1780
2080
2380
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
INPUT IP3 vs. RF FREQUENCY
INPUT IP3 vs. RF FREQUENCY
40
35
30
25
40
35
30
25
40
35
30
25
P
= 0dBm/TONE
RF
V
= 5.0V
CC
P
= 0dBm/TONE
P
= 0dBm/TONE
RF
RF
V
= 5.25V
CC
T
= +85°C
P
LO
= 0dBm, +3dBm
C
P
= -3dBm
LO
T
= +25°C
C
V
= 4.75V
CC
T
= -40°C
C
1480
1780
2080
2380
1480
1780
2080
2380
1480
1780
2080
2380
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
Maxim Integrated
│ 12
www.maximintegrated.com
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit, RF and LO ports tuned for 1500MHz to 2400MHz as noted in Table 1. I/Q outputs are recombined
using network shown in Figure 5. Losses of combining network not included in measurements. V ꢀ=ꢀ5.0V,ꢀGNDꢀ=ꢀ0V,ꢀP = 0dBm,
CC
RF
P
= 0dBm, f = 20MHz, f > f ,ꢀintermodulationꢀdeltaꢀfrequencyꢀ=ꢀ1.2MHz,ꢀ50ΩꢀLOꢀandꢀRFꢀsystemꢀimpedance,ꢀT = +25°C un-
LO
IF
LO
RF
C
less otherwise noted.)
DEMODULATOR LOW BAND TUNING (VARIABLE LO)
IMAGE REJECTION
vs. LO FREQUENCY
RF PORT RETURN LOSS
vs. RF FREQUENCY
INPUT IP2 vs. RF FREQUENCY
80
70
60
50
40
50
40
30
20
10
0
5
P
= 0dBm/TONE
= +25°C
RF
T
= +85°C
C
T
C
P
LO
= -3dBm, 0dBm, +3dBm
10
15
20
25
30
T
= -40°C
C
1480
1780
2080
2380
1500
1800
2100
2400
1500
2000
2500
3000
RF FREQUENCY (MHz)
LO FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF PORT RETURN LOSS
vs. RF FREQUENCY
LO PORT RETURN LOSS
vs. LO FREQUENCY
LO PORT RETURN LOSS
vs. LO FREQUENCY
0
5
0
10
20
30
40
0
10
20
30
40
V
= 4.75V, 5.0V, 5.25V
CC
P
= 0dBm
LO
V
CC
= 4.75V, 5.0V, 5.25V
10
15
20
25
30
P
= +3dBm
LO
P
= -3dBm
LO
1500
2000
2500
3000
1500
2000
2500
3000
1500
2000
2500
3000
RF FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
Maxim Integrated
│ 13
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics
(MAX2022 Typical Application Circuit, RF and LO ports tuned for 2400MHz to 3000MHz as noted in Table 1. I/Q outputs are recombined
using network shown in Figure 5. Losses of combining network not included in measurements. V ꢀ=ꢀ5.0V,ꢀGNDꢀ=ꢀ0V,ꢀP = 0dBm,
CC
RF
P
= 0dBm, f = 20MHz, f > f ,ꢀintermodulationꢀdeltaꢀfrequencyꢀ=ꢀ1.2MHz,ꢀ50ΩꢀLOꢀandꢀRFꢀsystemꢀimpedance,ꢀT = +25°C, un-
LO
IF
LO
RF
C
less otherwise noted.)
DEMODULATOR HIGH BAND TUNING (VARIABLE LO)
CONVERSION LOSS
vs. RF FREQUENCY
CONVERSION LOSS
vs. RF FREQUENCY
CONVERSION LOSS
vs. RF FREQUENCY
13
12
11
10
9
13
12
11
10
9
13
12
11
10
9
T
= +25°C
C
P
LO
= -3dBm, 0dBm, +3dBm
V
= 4.75V, 5.0V, 5.25V
CC
T
= +85°C
C
T
= -40°C
2780
C
2380
2580
2980
2380
2580
2780
2980
2380
2580
2780
2980
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
INPUT IP3 vs. RF FREQUENCY
INPUT IP3 vs. RF FREQUENCY
40
38
36
34
32
30
40
38
36
34
32
30
40
38
36
34
32
30
P
= 0dBm/TONE
RF
P
= 0dBm/TONE
P
= 0dBm/TONE
RF
RF
T
= +85°C
C
T
= +25°C
V
= 5.25V
P
= +3dBm
C
CC
LO
V
CC
= 5.0V
V
= 4.75V
CC
P
= 0dBm
LO
P
= -3dBm
LO
T
= -40°C
C
2380
2580
2780
2980
2380
2580
2780
2980
2380
2580
2780
2980
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
Maxim Integrated
│ 14
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Operating Characteristics, RF and LO ports tuned for 2400MHz to 3000MHz as noted in Table 1. I/Q outputs are
recombined using network shown in Figure 5. Losses of combining network not included in measurements. V ꢀ=ꢀ5.0V,ꢀGNDꢀ=ꢀ0V,ꢀ
CC
P
= 0dBm, P = 0dBm, f = 20MHz, f > f ,ꢀintermodulationꢀdeltaꢀfrequencyꢀ=ꢀ1.2MHz,ꢀ50ΩꢀLOꢀandꢀRFꢀsystemꢀimpedance,ꢀT
RF
LO IF LO RF C
= +25°C, unless otherwise noted.)
DEMODULATOR HIGH BAND TUNING (VARIABLE LO)
RF PORT RETURN LOSS
vs. RF FREQUENCY
IMAGE REJECTION
vs. LO FREQUENCY
INPUT IP2 vs. RF FREQUENCY
90
80
70
60
50
40
0
5
50
40
30
20
10
P
= 0dBm/TONE
RF
T
= +85°C
C
T
= +25°C
C
10
15
20
25
P
= -3dBm, 0dBm, +3dBm
LO
T
= -40°C
C
2380
2580
2780
2980
1500
2000
2500
3000
2400
2600
2800
3000
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO PORT RETURN LOSS
vs. LO FREQUENCY
RF PORT RETURN LOSS
vs. RF FREQUENCY
LO PORT RETURN LOSS
vs. LO FREQUENCY
0
5
0
5
0
5
P
= 0dBm
LO
V
CC
= 4.75V, 5.0V, 5.25V
10
15
20
25
30
10
15
20
25
30
10
15
20
25
V
CC
= 4.75V, 5.0V, 5.25V
P
= -3dBm
LO
P
LO
= +3dBm
1500
2000
2500
3000
1500
2000
2500
3000
1500
2000
2500
3000
LO FREQUENCY (MHz)
RF FREQUENCY (MHz)
LO FREQUENCY (MHz)
Maxim Integrated
│ 15
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit, RF and LO ports tuned for 2400MHz to 3000MHz as noted in Table 1. I/Q outputs are recombined
using network shown in Figure 5. Losses of combining network not included in measurements. V ꢀ=ꢀ5.0V,ꢀGNDꢀ=ꢀ0V,ꢀP = 0dBm, P
CC
RF
LO
= 0dBm, f = 2855MHz, f = f - f ,ꢀintermodulationꢀdeltaꢀfrequencyꢀ=ꢀ1.2MHz,ꢀ50ΩꢀLOꢀandꢀRFꢀsystemꢀimpedance,ꢀT = +25°C,
LO
IF
LO RF
C
unless otherwise noted.)
DEMODULATOR HIGH BAND TUNING (FIXED LO)
CONVERSION LOSS
vs. RF FREQUENCY
I/Q GAIN MISMATCH
vs. IF FREQUENCY
I/Q PHASE MISMATCH
vs. IF FREQUENCY
0.10
0.05
0
2
1
12
11
10
9
f
= 2855MHz
f
= 2855MHz
f
= 2855MHz
LO
LO
LO
0
-0.05
-0.10
-1
-2
10
170
330
490
650
10
170
330
490
650
2200
2360
2520
2680
2840
IF FREQUENCY (MHz)
IF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
INPUT IP2 vs. RF FREQUENCY
40
38
36
34
32
30
80
70
60
50
40
P
RF
= 0dBm/TONE
P
= 0dBm/TONE
RF
IF1+IF2 TERM
f
= 2855MHz
f
= 2855MHz
LO
LO
2200
2400
2600
2800
2200
2400
2600
2800
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
Maxim Integrated
│ 16
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Pin Configuration/Functional Diagram
TOP VIEW
28
33
32
30
29
36
34
31
35
+
GND
RBIASLO3
VCCLOA
1
2
3
27
26
GND
MAX2022
BIAS
LO3
BBQP
BBQN
25
90°
0°
4
5
24
23
LO
GND
RF
GND
BIAS
LO1
∑
RBIASLO1
6
22
GND
N.C.
RBIASLO2
GND
7
8
9
21 BBIN
BIAS
LO2
20
19
BBIP
GND
EP
16
10
18
11
12
13
14
15
17
TQFN
(6mm x 6mm)
Pin Description
PIN
NAME
FUNCTION
1,ꢀ5,ꢀ9–12,ꢀ14,ꢀ16–19,ꢀ22,ꢀ24,ꢀ
27–30,ꢀ32,ꢀ34,ꢀ35,ꢀ36
GND
Ground
2
3
RBIASLO3
VCCLOA
LO
3rdꢀLOꢀAmplifierꢀBias.ꢀConnectꢀaꢀ301Ωꢀresistorꢀtoꢀground.ꢀ
LOꢀInputꢀBufferꢀAmplifierꢀSupplyꢀVoltage
4
LocalꢀOscillatorꢀInput.ꢀ50Ωꢀinputꢀimpedance.ꢀ
6
RBIASLO1
N.C.
1stꢀLOꢀInputꢀBufferꢀAmplifierꢀBias.ꢀConnectꢀaꢀ432Ωꢀresistorꢀtoꢀground.ꢀ
No internal connection and can be connected to ground or left open.
2ndꢀLOꢀAmplifierꢀBias.ꢀConnectꢀaꢀ562Ωꢀresistorꢀtoꢀground.
I-Channelꢀ1stꢀLOꢀAmplifierꢀSupplyꢀVoltageꢀ
7
8
RBIASLO2
VCCLOI1
VCCLOI2
BBIP
13
15
20
I-Channelꢀ2ndꢀLOꢀAmplifierꢀSupplyꢀVoltage
Baseband In-Phase Positive Input
Maxim Integrated
│ 17
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Pin Description (continued)
PIN
21
23
25
26
31
33
NAME
FUNCTION
BBIN
RF
Baseband In-Phase Negative Input
RF Port
BBQN
Baseband Quadrature Negative Input
Baseband Quadrature Positive Input
Q-Channelꢀ2ndꢀLOꢀAmplifierꢀSupplyꢀVoltageꢀ
Q-Channelꢀ1stꢀLOꢀAmplifierꢀSupplyꢀVoltage
BBQP
VCCLOQ2
VCCLOQ1
ExposedꢀGroundꢀPaddle.ꢀTheꢀexposedꢀpaddleꢀMUST be soldered to the
ground plane using multiple vias.
—
EP
LO Driver
Detailed Description
The MAX2022 is designed for upconverting differential
in-phase (I) and quadrature (Q) inputs from baseband to
a 1500MHz to 3000MHz RF frequency range. The device
can also be used as a demodulator, downconverting an
RF input signal directly to baseband or an IF frequency.
Applications include single and multicarrier 1500MHz
to 3000MHz UMTS/WCDMA, LTE/TD-LTE, cdma2000,
and DCS/PCS base stations. Direct conversion architec-
tures are advantageous since they significantly reduce
transmitter or receiver cost, part count, and power con-
sumption as compared to traditional IF-based double-
conversion systems.
Followingꢀtheꢀphaseꢀsplitter,ꢀtheꢀ0°ꢀandꢀ90°ꢀLOꢀsignalsꢀareꢀ
each amplified by a two-stage amplifier to drive the I and
Q mixers. The amplifier boosts the level of the LO signals
to compensate for any changes in LO drive levels. The
two-stage LO amplifier allows a wide input power range
for the LO drive. While a nominal LO power of 0dBm is
specified, the MAX2022 can tolerate LO level swings from
-3dBm to +3dBm.
I/Q Modulator
The MAX2022 modulator is composed of a pair of
matched double-balanced passive mixers and a balun.
The I and Q differential baseband inputs accept signals
from DC to beyond 500MHz with differential amplitudes
The MAX2022 integrates internal baluns, an LO buffer, a
phase splitter, two LO driver amplifiers, two matched dou-
ble-balanced passive mixers, and a wideband quadrature
combiner. Precision matching between the in-phase and
quadrature channels, and highly linear mixers achieves
excellent dynamic range, ACLR, 1dB compression point,
and LO and sideband suppression, making it ideal for
four-carrier WCDMA/UMTS operation.
up to 2V
differential (common-mode input equals 0V).
P-P
The wide input bandwidth allows for direct interface with
the baseband DACs. No active buffer circuitry between
the baseband DAC and the MAX2022 is required.
TheꢀIꢀandꢀQꢀsignalsꢀdirectlyꢀmodulateꢀtheꢀ0°ꢀandꢀ90°ꢀLOꢀ
signals and are upconverted to the RF frequency. The
outputs of the I and Q mixers are combined through a
balun to a singled-ended RF output.
LO Input Balun, LO Buffer, and Phase Splitter
The MAX2022 requires a single-ended LO input, with a
nominal power of 0dBm. An internal low-loss balun at
the LO input converts the single-ended LO signal to a
differential signal at the LO buffer input. In addition, the
internal balun matches the buffer’s input impedance to
50Ωꢀoverꢀtheꢀentireꢀbandꢀofꢀoperation.
Applications Information
LO Input Drive
The LO input of the MAX2022 requires a single-ended
drive at a 1500MHz to 3000MHz frequency. It is internally
matchedꢀtoꢀ50Ω.ꢀAnꢀintegratedꢀbalunꢀconvertsꢀtheꢀsingle-
ended input signal to a differential signal at the LO buffer
differential input. An external DC-blocking capacitor is the
only external part required at this interface. The LO input
power should be within the -3dBm to +3dBm range.
The output of the LO buffer goes through a phase splitter,
whichꢀgeneratesꢀaꢀsecondꢀLOꢀsignalꢀthatꢀisꢀshiftedꢀbyꢀ90°ꢀ
withꢀ respectꢀ toꢀ theꢀ original.ꢀTheꢀ 0°ꢀ andꢀ 90°ꢀ LOꢀ signalsꢀ
drive the I and Q mixers, respectively.
Maxim Integrated
│ 18
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
be in the -12dBm range for a single CDMA or WCDMA
carrier, reducing to -18dBm per carrier for a four-carrier
application.
Modulator Baseband I/Q Input Drive
The MAX2022 I and Q baseband inputs should be driven
differentially for best performance. The baseband inputs
haveꢀ aꢀ 50Ωꢀ differentialꢀ inputꢀ impedance.ꢀ Theꢀ optimumꢀ
sourceꢀimpedanceꢀforꢀtheꢀIꢀandꢀQꢀinputsꢀisꢀ100Ωꢀdifferen-
tial. This source impedance will achieve the optimal signal
transfer to the I and Q inputs, and the optimum output RF
impedance match. The MAX2022 can accept input power
levels of up to +12dBm on the I and Q inputs. Operation
with complex waveforms, such as CDMA or WCDMA
carriers, utilize input power levels that are far lower. This
lower power operation is made necessary by the high
peak-to-average ratios of these complex waveforms. The
peak signals must be kept below the compression level of
the MAX2022. The input common-mode voltage should
be confined to the -2V to +1.5V DC range.
The I/Q input bandwidth is greater than 50MHz at -0.1dB
response. The direct connection of the DAC to the
MAX2022 insures the maximum signal fidelity, with no
performance-limiting baseband amplifiers required. The
DAC output can be passed through a lowpass filter to
remove the image frequencies from the DAC’s output
response.ꢀTheꢀMAX5895ꢀdualꢀinterpolatingꢀDACꢀcanꢀbeꢀ
operated at interpolation rates up to x8. This has the ben-
efit of moving the DAC image frequencies to a very high,
remote frequency, easing the design of the baseband
filters. The DAC’s output noise floor and interpolation
filter stopband attenuation are sufficiently good to insure
thatꢀ theꢀ 3GPPꢀ noiseꢀ floorꢀ requirementꢀ isꢀ metꢀ forꢀ largeꢀ
frequency offsets, 60MHz for example, with no filtering
required on the RF output of the modulator.
The MAX2022 is designed to interface directly with Maxim
high-speed DACs. This generates an ideal total transmit-
ter lineup, with minimal ancillary circuit elements. Such
DACsꢀ includeꢀ theꢀ MAX5875ꢀ seriesꢀ ofꢀ dualꢀ DACs,ꢀ andꢀ
theꢀMAX5895ꢀdualꢀinterpolatingꢀDAC.ꢀTheseꢀDACsꢀhaveꢀ
ground-referenced differential current outputs. Typical
terminationꢀofꢀeachꢀDACꢀoutputꢀintoꢀaꢀ50Ωꢀloadꢀresistorꢀ
to ground, and a 10mA nominal DC output current results
in a 0.5V common-mode DC level into the modulator I/Q
inputs. The nominal signal level provided by the DACs will
Figure 1 illustrates the ease and efficiency of interfac-
ing the MAX2022 with a Maxim DAC, in this case the
MAX5895ꢀdualꢀ16-bitꢀinterpolating-modulatingꢀDAC.
Theꢀ MAX5895ꢀ DACꢀ hasꢀ programmableꢀ gainꢀ andꢀ dif-
ferential offset controls built in. These can be used to
optimize the LO leakage and sideband suppression of the
MAX2022 quadrature modulator.
MAX5895
DUAL 16-BIT INTERP DAC
50Ω
MAX2022
RF MODULATOR
50Ω
BBI
FREQ
50Ω
50Ω
0°
RF
LO
I/Q GAIN AND
OFFSET ADJUST
∑
90°
50Ω
FREQ
BBQ
50Ω
Figure 1. MAX5895 DAC Interfaced with MAX2022
Maxim Integrated
│ 19
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
illustrates a complete transmitter lineup for a multicarrier
WCDMA transmitter in the UMTS band.
RF Output
The MAX2022 utilizes an internal passive mixer architec-
ture.ꢀThisꢀenablesꢀaꢀveryꢀlowꢀnoiseꢀfloorꢀofꢀ-173.2dBm/Hzꢀ
for low-level signals, below about -20dBm output power
level. For higher output level signals, the noise floor will
be determined by the internal LO noise level at approxi-
mately -162dBc/Hz.
Theꢀ MAX5895ꢀ dualꢀ interpolating-modulatingꢀ DACꢀ isꢀ
operated as a baseband signal generator. For genera-
tion of four carriers of WCDMA modulation, and digital
predistortion, an input data rate of 61.44 or 122.88Mbps
can be used. The DAC can then be programmed to
operate in x8 or x4 interpolation mode, resulting in a
491.52Mspsꢀ outputꢀ sampleꢀ rate.ꢀ Theꢀ DACꢀ willꢀ gener-
ate four carriers of WCDMA modulation with an ACLR
typicallyꢀgreaterꢀthanꢀ77dBꢀunderꢀtheseꢀconditions.ꢀTheꢀ
output power will be approximately -18dBm per carrier,
with a noise floor typically less than -144dBc/Hz.
The I/Q input power levels and the insertion loss of the
device will determine the RF output power level. The input
power is the function of the delivered input I and Q voltag-
esꢀtoꢀtheꢀinternalꢀ50Ωꢀtermination.ꢀForꢀsimpleꢀsinusoidalꢀ
basebandꢀsignals,ꢀaꢀlevelꢀofꢀ89mV
differential on the I
P-P
andꢀtheꢀQꢀinputsꢀresultsꢀinꢀanꢀinputꢀpowerꢀlevelꢀofꢀ-17dBmꢀ
deliveredꢀtoꢀtheꢀIꢀandꢀQꢀinternalꢀ50Ωꢀterminations.ꢀThisꢀ
results in a -23.5dBm RF output power.
Theꢀ MAX5895ꢀ DACꢀ hasꢀ built-inꢀ gainꢀ andꢀ offsetꢀ fineꢀ
adjustments. These are programmable by a 3-wire serial
logic interface. The gain adjustment can be used to adjust
the relative gains of the I and Q DAC outputs. This feature
can be used to improve the native sideband suppression
of the MAX2022 quadrature modulator. The gain adjust-
ment resolution of 0.01dB allows sideband nulling down
to approximately -60dB. The offset adjustment can simi-
larly be used to adjust the offset DC output of each I and
Q DAC. These offsets can then be used to improve the
native LO leakage of the MAX2022. The DAC resolution
of 4 LSBs will yield nulled LO leakage of typically less
than -50dBc relative to four-carrier output levels.
Generation of WCDMA Carriers
The MAX2022 quadrature modulator makes an ideal sig-
nal source for the generation of multiple WCDMA carriers.
The combination of high OIP3 and exceptionally low out-
put noise floor gives an unprecedented output dynamic
range. The output dynamic range allows the generation of
four WCDMA carriers in the UMTS band with a noise floor
sufficientlyꢀ lowꢀ toꢀ meetꢀ theꢀ 3GPPꢀ specificationꢀ require-
ments with no additional RF filtering. This promotes an
extremely simple and efficient transmitter lineup. Figure 2
MAX5895
MAX2022
RF-MODULATOR
I
L-C FILTER
MAX2057
+12dB
TX
OUTPUT
I
I/Q GAIN AND
OFFSET ADJUST
∑
Q
Q
SYNTH
CLOCK
Figure 2. Complete Transmitter Lineup for a Multicarrier WCDMA in the UMTS Band
Maxim Integrated
│ 20
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
The DAC outputs must be filtered by baseband filters to
remove the image frequency signal components. The
baseband signals for four-carrier operation cover DC
to 10MHz. The image frequency appears at 481MHz to
491MHz.ꢀ Thisꢀ veryꢀ largeꢀ frequencyꢀ spreadꢀ allowsꢀ theꢀ
use of very low-complexity lowpass filters, with excellent
in-band gain and phase performance. The low DAC noise
floor allows for the use of a very wideband filter, since
theꢀfilterꢀisꢀnotꢀnecessaryꢀtoꢀmeetꢀtheꢀ3GPPꢀnoiseꢀfloorꢀ
specification.
C = 2.2pF
MAX2022
50Ω
RF MODULATOR
L = 11nH
I
50Ω
LO
0°
90°
The MAX2022 quadrature modulator then upconverts the
baseband signals to the RF output frequency. The output
power of the MAX2022 will be approximately -28dBm
perꢀcarrier.ꢀTheꢀnoiseꢀfloorꢀwillꢀbeꢀlessꢀthanꢀ-169dBm/Hz,ꢀ
with an ACLR typically greater than 65dBc. This perfor-
manceꢀmeetsꢀtheꢀ3GPPꢀspecificationꢀrequirementsꢀwithꢀ
substantial margins. The noise floor performance will be
maintained for large offset frequencies, eliminating the
need for subsequent RF filtering in the transmitter lineup.
C = 2.2pF
∑
RF
50Ω
L = 11nH
Q
50Ω
C = 2.2pF
The RF output from the MAX2022 is then amplified by
a combination of a low-noise amplifier followed by a
MAX2057ꢀ RF-VGA.ꢀ Thisꢀ VGAꢀ canꢀ beꢀ usedꢀ forꢀ lineupꢀ
compensation for gain variance of transmitter and power
amplifier elements. No significant degradation of the
signal or noise levels will be incurred by this additional
amplification.ꢀTheꢀMAX2057ꢀwillꢀdeliverꢀanꢀoutputꢀpowerꢀ
of -6dBm per carrier, 0dBm total at an ACLR of 65dB and
noise floor of -142dBc/Hz.
Figure 3. Diplexer Network Recommended for UMTS
Transmitter Applications
As demonstrated in Figure 3, providing an RC termination
on each of the I+, I-, Q+, Q- ports reduces the amount of
LO leakage present at the RF port under varying tempera-
ture, LO frequency, and baseband termination conditions.
See the Typical Operating Characteristics for details. Note
thatꢀtheꢀresistorꢀvalueꢀisꢀchosenꢀtoꢀbeꢀ50Ωꢀwithꢀaꢀcornerꢀ
External Diplexer
LO leakage at the RF port can be nulled to a level less
than -80dBm by introducing DC offsets at the I and Q
ports. However, this null at the RF port can be compro-
mised by an improperly terminated I/Q interface. Care
must be taken to match the I/Q ports to the external
circuitry. Without matching, the LO’s second-order term
frequencyꢀ1ꢀ/ꢀ(2�RC)ꢀselectedꢀtoꢀadequatelyꢀfilterꢀtheꢀf
LO
and 2f
leakage, yet not affecting the flatness of the
LO
baseband response at the highest baseband frequency.
The common-mode f and 2f signals at I+/I- and
LO
LO
Q+/Q- effectively see the RC networks and thus become
terminatedꢀinꢀ25Ωꢀ(R/2).ꢀTheꢀRCꢀnetworkꢀprovidesꢀaꢀpathꢀ
(2f ) it may reflect back into the modulator’s I/Q ports
LO
for absorbing the 2f
and f
leakage, while the induc-
where it can remix with the internal LO signal to produce
additional LO leakage at the RF output. This reflection
effectively counteracts against the LO nulling. In addi-
tion, the LO signal reflected at the I/Q IF port produces
a residual DC term that can disturb the nulling condition.
LO
LO
tor provides high impedance at f
and 2f
to help the
LO
LO
diplexing process.
Maxim Integrated
│ 21
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
within the -2.5V to +1.5V common-mode range), through
an inductor to ground, or through a low-value resistor to
ground. Figure 6 shows a typical network that would be
used to connect to each baseband port for demodulator
operation. This network provides a common-mode DC
return, implements a high-frequency diplexer to terminate
unwanted RF terms, and also provides an impedance
transformation to a possible higher impedance baseband
amplifier.
RF Demodulator
The MAX2022 can also be used as an RF demodulator
(see Figure 4), downconverting an RF input signal directly
to baseband. The single-ended RF input accepts signals
from 1500MHz to 3000MHz. The passive mixer architec-
tureꢀproducesꢀaꢀconversionꢀlossꢀofꢀtypicallyꢀ9.2dBꢀandꢀaꢀ
noiseꢀ figureꢀ ofꢀ 9.4dB.ꢀ Theꢀ downconverterꢀ isꢀ optimizedꢀ
forꢀhighꢀlinearityꢀofꢀtypicallyꢀ+39dBmꢀIIP3.ꢀAꢀwideꢀI/Qꢀportꢀ
bandwidth allows the port to be used as an image-reject
mixer for downconversion to a quadrature IF frequency.
The network C , R , L , and C form a highpass/lowpass
a
a
a
b
network to terminate the high frequencies into a load
while passing the desired lower IF frequencies. Elements
Theꢀ RFꢀ andꢀ LOꢀ inputsꢀ areꢀ internallyꢀ matchedꢀ toꢀ 50Ω.ꢀ
Thus, no matching components are required, and only
DC-blocking capacitors are needed for interfacing.
L , C , L , C , L , and C provide a possible impedance
a
b
b
c
c
d
transformer. Depending on the impedance being trans-
formed and the desired bandwidth, a fewer number of ele-
Demodulator Output Port Considerations
ments can be used. It is suggested that L and C always
a
b
Much like in the modulator case, the four baseband ports
require some form of DC return to establish a common
mode that the on-chip circuitry drives. This is achieved
by directly DC-coupling to the baseband ports (staying
be used since they are part of the high-frequency diplexer.
If power matching is not a concern, then this reduces the
elements to just the diplexer.
MAX2022
DIPLEXER/
DC RETURN
MATCHING
MATCHING
ADC
ADC
90
RF
LO
0
DIPLEXER/
DC RETURN
Figure 4. MAX2022 Demodulator Configuration
I+
I-
3dB PAD
3dB PAD
DC BLOCK
DC BLOCK
0°
MINI-CIRCUITS
ZFSCJ-2-1
180°
3dB PADS LOOK LIKE 160Ω TO GROUND
AND PROVIDES THE COMMON-MODE
DC RETURN FOR THE ON-CHIP CIRCUITRY.
MINI-CIRCUITS
ZFSC-2-1W-S+
0° COMBINER
Q+
Q-
3dB PAD
DC BLOCK
0°
MINI-CIRCUITS
90°
ZFSCJ-2-1
3dB PAD
DC BLOCK
180°
Figure 5. Demodulator Combining Diagram
Maxim Integrated
│ 22
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
L
d
R
a
R
b
C
a
C
e
L
L
L
c
a
b
EXTERNAL
STAGE
MAX2022
I/Q OUTPUTS
C
b
C
c
C
d
Figure 6. Baseband Port Typical Filtering and DC Return Network
Resistor R provides a DC return to set the common-
b
multiple vias be used to connect this pad to the lower-
level ground planes. This method provides a good RF/
thermal conduction path for the device. Solder the
exposed pad on the bottom of the device package to
the PCB. The MAX2022 evaluation kit can be used as
aꢀreferenceꢀforꢀboardꢀlayout.ꢀGerberꢀfilesꢀareꢀavailableꢀ
upon request at www.maximintegrated.com.
mode voltage. In this case, due to the on-chip circuitry,
the voltage is approximately 0V DC. It can also be used
to reduce the load impedance of the next stage. Inductor
L can provide a bit of high-frequency gain peaking for
d
wideband IF systems. Capacitor C is a DC block.
e
Typical values for C , R , L , and C would be 1.5pF,
a
a
a
b
50Ω,ꢀ 11nH,ꢀ andꢀ 4.7pF,ꢀ respectively.ꢀ Theseꢀ valuesꢀ canꢀ
change depending on the LO, RF, and IF frequencies
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass all V
and 0.1µF capacitors placed as close to the pins as pos-
sible. The smallest capacitor should be placed closest to
the device.
used. Resistor R ꢀisꢀinꢀtheꢀ50Ωꢀtoꢀ200Ωꢀrange.
b
pins with 22pF
CC
The circuitry presented in Figure 6 does not allow for
LO leakage at RF port nulling. Depending on the LO at
RF leakage requirement, a trim voltage may need to be
introduced on the baseband ports to null the LO leakage.
To achieve optimum performance, use good voltage-
supply layout techniques. The MAX2022 has several RF
processing stages that use the various V
Power Scaling with Changes to the Bias
Resistors
pins, and
CC
while they have on-chip decoupling, off-chip interaction
between them may degrade gain, linearity, carrier sup-
pression, and output power-control range. Excessive
coupling between stages may degrade stability.
Bias currents for the LO buffers are optimized by fine tun-
ing resistors R1, R2, and R3. Maxim recommends using
±1%-tolerance resistors; however, standard ±5% values
can be used if the ±1% components are not readily avail-
able. The resistor values shown in the Typical Application
Circuit were chosen to provide peak performance for the
entire 1500MHz to 3000MHz band. If desired, the current
can be backed off from this nominal value by choosing
different values for R1, R2, and R3. Contact the factory
for additional details.
Exposed Pad RF/Thermal Considerations
The EP of the MAX2022’s 36-pin thin QFN-EP package
provides a low thermal-resistance path to the die. It is
important that the PCB on which the IC is mounted be
designed to conduct heat from this contact. In addition,
the EP provides a low-inductance RF ground path for the
device.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the pack-
age. The PCB exposed paddle MUST be connected
to the ground plane of the PCB. It is suggested that
The exposed paddle (EP) MUST be soldered to a ground
plane on the PCB either directly or through an array of
platedꢀviaꢀholes.ꢀAnꢀarrayꢀofꢀ9ꢀvias,ꢀinꢀaꢀ3ꢀxꢀ3ꢀarray,ꢀisꢀ
suggested. Soldering the pad to ground is critical for
efficient heat transfer. Use a solid ground plane wherever
possible.
Maxim Integrated
│ 23
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Table 1. Component List Referring to the Typical Application Circuit
COMPONENT
VALUE
22pF
DESCRIPTION
22pFꢀ±5%,ꢀ50VꢀC0Gꢀceramicꢀcapacitorsꢀ(0402)
0.1µFꢀ±10%,ꢀ16VꢀX7Rꢀceramicꢀcapacitorsꢀ(0603)
C1,ꢀC6,ꢀC7,ꢀC10,ꢀC13
C2, C5, C8, C11, C12
0.1µF
22pF
22pFꢀ±5%,ꢀ50VꢀC0Gꢀceramicꢀcapacitorꢀ(0402),ꢀf
= 1500MHz to 2400MHz
= 2400MHz to 3000MHz
LO
C3
C9
6.8pF
1.2pF
22pF
6.8pFꢀ±5%,ꢀ50VꢀC0Gꢀceramicꢀcapacitorꢀ(0402),ꢀf
LO
1.2pFꢀ±0.1pF,ꢀ50VꢀC0Gꢀceramicꢀcapacitorꢀ(0402),ꢀf = 1500MHz to 2400MHz
RF
22pFꢀ±5%,ꢀ50VꢀC0Gꢀceramicꢀcapacitorꢀ(0402),ꢀf = 2400MHz to 3000MHz
RF
Short
0.7pF
Replaceꢀwithꢀaꢀshortꢀcircuitꢀorꢀ0Ωꢀresistorꢀ(0402),ꢀf = 1500MHz to 2400MHz
RF
C16
0.7pFꢀ±0.1pF,ꢀ50VꢀC0Gꢀceramicꢀcapacitorꢀ(0402),ꢀf = 2400MHz to 3000MHz
RF
Not Used
Not installed for f = 1500MHz to 2400MHz
RF
L1
4.7nH
432Ω
562Ω
301Ω
4.7nHꢀ±0.3nHꢀinductorꢀ(0402)ꢀforꢀf = 2400MHz to 3000MHz
RF
R1
R2
R3
432Ωꢀ±1%ꢀresistorꢀ(0402)
562Ωꢀ±1%ꢀresistorꢀ(0402)
301Ωꢀ±1%ꢀresistorꢀ(0402)
Ordering Information
Chip Information
PROCESS:ꢀSiGeꢀBiCMOS
PART
TEMP RANGE
PIN-PACKAGE
MAX2022ETX+
MAX2022ETX+T
-40°C to +85°C
-40°C to +85°C
36 TQFN-EP*
36 TQFN-EP*
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
*EP = Exposed pad.
PACKAGE
TYPE
PACKAGE OUTLINE
LAND
PATTERN NO.
CODE
NO.
TQFN-EP
(6mm x 6mm)
T3666+2
21-0141
90-0049
Maxim Integrated
│ 24
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Application Circuit
C11
C10
C12
0.1µF
C13
22pF
0.1µF
22pF
V
CC
V
CC
GND GND GND
GND
32
GND GND GND
R3
301Ω
28
33
30
29
36
34
31
35
GND
1
2
3
27
26
MAX2022
GND
BIAS
LO3
RBIASLO3
VCCLOA
Q+
Q-
C2
0.1µF
C1
BBQP
BBQN
22pF
V
CC
25
C3
LO
GND
90°
0°
LO
4
5
24
23
GND
RF
C9
C16
RF
BIAS
LO1
RBIASLO1
∑
L1
6
22
GND
R1
432Ω
N.C.
7
8
9
I-
I+
21
20
BBIN
BBIP
BIAS
LO2
RBIASLO2
R2
562Ω
GND
19
EP
16
GND
10
GND GND GND
18
11
12
13
14
GND
15
17
GND GND GND
V
CC
V
CC
C5
0.1µF
C6
22pF
C8
0.1µF
C7
22pF
Maxim Integrated
│ 25
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MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Revision History
REVISION REVISION
PAGES
DESCRIPTION
CHANGED
NUMBER
DATE
0
4/05
Initial release
—
Updated the Benefits and Features, Applications, Absolute Maximum Ratings, and
Ordering Information;ꢀaddedꢀnewꢀelectricalꢀcharacteristicsꢀtables,ꢀfigures,ꢀandꢀsections
1
9/12
1–19
Corrected pin 15 name from VCCLOI1 to VCCLOI2 in the Pin Configuration/Functional
Diagram and Pin Description
2
3
3/13
11, 12
7/13
AddedꢀnewꢀTOCsꢀ46–74
12–16
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
©
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
2013 Maxim Integrated Products, Inc.
│ 26
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