MAX2047EVKIT [MAXIM]
Fully Assembled and Tested;
| 型号： | MAX2047EVKIT |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | Fully Assembled and Tested |
| 文件： | 总10页 (文件大小：571K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-2793; Rev 0a; 4/03
MAX2045/MAX2046/MAX2047 Evaluation Kits
General Description
Features
ꢀ Easy Evaluation of the MAX2045/MAX2046/
The MAX2045/MAX2046/MAX2047 evaluation kits
(EV kits) simplify evaluation of the MAX2045/MAX2046/
MAX2047 vector multipliers. Each kit enables testing of
the device’s RF performance and requires no additional
support circuitry. The EV kit input and output use SMA
connectors and baluns (for single-ended-to-differential
conversions) to facilitate the connection to RF test
equipment.
MAX2047
ꢀ +4.75V to +5.25V Single-Supply Operation
ꢀ Include RF Input and Output Matching
2040MHz to 2240MHz (MAX2045)
1740MHz to 2060MHz (MAX2046)
790MHz to 1005MHz (MAX2047)
Each EV kit is assembled with either the MAX2045,
MAX2046, or MAX2047 and incorporates all matching
components optimized for the corresponding band of
frequency operation.
ꢀ Configurable for Current-Control Mode and
Single-Ended and Differential Voltage-Control
Mode
ꢀ Fully Assembled and Tested
Ordering Information
Component Suppliers
PART
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
IC PACKAGE
32 QFN-EP*
32 QFN-EP*
32 QFN-EP*
SUPPLIER
Murata
Toko
PHONE
FAX
814-238-0490
—
MAX2045EVKIT
MAX2046EVKIT
MAX2047EVKIT
800-831-9172
800-745-8656
Note: When contacting these suppliers, please indicate that
you are using the MAX2045/MAX2046/MAX2047.
*EP = Exposed paddle.
MAX2045 Component List
DESIGNATION QTY
DESCRIPTION
DESIGNATION QTY
DESCRIPTION
1.5pF 0.1pF, 50V C0G ceramic
capacitor (0402)
Murata GRP1555C1H1R5B
22pF 5%, 50V C0G ceramic
capacitors (0402)
Murata GRP1555C1H220J
L1
L2
1
1
C1, C4–C16
C2, C3
14
2
8.2nH 5% chip inductor (0402)
Toko LL1005-FH8N2J
220pF 10%, 50V X7R ceramic
capacitors (0402)
Murata GRP155R71H221K
280Ω 1% resistor (0402)
Any
R1
1
0
2
0.01µF 10%, 25V X7R ceramic
capacitor (0402)
Murata GRP155R71E103K
R2, R4, R6
R3, R5
Not installed
C17
1
0Ω resistors (0402)
Any
PC board edge-mount SMA RF
connectors (flat-tab launch)
EFJohnson 142-0741-856
1:1 balun (50:50)
Murata LDB15C500A1900
J1, J2
J3
2
1
T1
1
4:1 balun (200:50)
Murata LDB15C201A1900
Header, 10 x 2, 0.100in spacing
Molex 10-89-1201
T2
1
1
U1
MAX2045ETJ-T (32-pin QFN)
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
MAX2045/MAX2046/MAX2047 Evaluation Kits
MAX2046 Component List
MAX2047 Component List
DESIGNATION QTY
DESCRIPTION
DESIGNATION QTY
DESCRIPTION
47pF 5%, 50V C0G ceramic
capacitors (0402)
Murata GRP1555C1H470J
3.9pF 0.1pF, 50V C0G ceramic
capacitor (0402)
Murata GRP1555C1H3R9B
C1–C16
C17
16
1
C1
1
2
0.01µF 10%, 25V X7R ceramic
capacitor (0402)
220pF 10%, 50V X7R ceramic
capacitors (0402)
C2, C3
Murata GRP155R71E103K
Murata GRP155R71H221K
PC board edge-mount SMA RF
connectors (flat-tab launch)
EFJohnson 142-0741-856
22pF 5%, 50V C0G ceramic
capacitors (0402)
Murata GRP1555C1H220J
C4–C13,
C15, C16
J1, J2
2
12
1
Header 10 x 2, 0.100in spacing
Molex 10-89-1201
6.2pF 0.25pF, 50V C0G ceramic
capacitor (0402)
Murata GRP1555C1H6R2C
J3
L1
L2
1
1
1
C14
C17
15nH 5% chip inductor (0402)
Toko LL1005-FH15NJ
0.01µF 10%, 25V X7R ceramic
capacitor (0402)
Murata GRP155R71E103K
1
39nH 5% chip inductor (0402)
Toko LL1005-FH39NJ
280Ω 1% resistor (0402)
Any
PC board edge-mount SMA RF
connectors (flat-tab launch)
EFJohnson 142-0741-856
R1
1
0
2
J1, J2
J3
2
1
1
1
R2, R4, R6
R3, R5
Not installed
0Ω resistors (0402)
Any
Header 10 x 2, 0.100in spacing
Molex 10-89-1201
1:1 balun (50:50)
Murata LDB20C500A900
1.5pF 0.1pF, 50V C0G ceramic
capacitor (0402)
T1
1
L1
Murata GRP1555C1H1R5B
4:1 balun (200:50)
Murata LDB20C201A900
T2
1
1
12nH 5% chip inductor (0402)
Toko LL1005-FH12NJ
L2
U1
MAX2047ETJ-T (32-pin QFN)
280Ω 1% resistor (0402)
Any
R1
1
0
2
Quick Start
The MAX2045/MAX2046/MAX2047 EV kits are fully
assembled and factory tested. Follow the instructions
in the Connections and Setup section for proper
device evaluation. The EV kits come configured for sin-
gle-ended, voltage-control operation. For differential
voltage- or current-mode operation, see the Detailed
Description section.
R2, R4, R6
R3, R5
Not installed
0Ω resistors (0402)
Any
1:1 balun (50:50)
Murata LDB15C500A1900
T1
1
4:1 balun (200:50)
Murata LDB15C201A1900
T2
1
1
Test Equipment Required
Table 1 lists the required test equipment to verify the
MAX2045/MAX2046/MAX2047 operation. It is intended
as a guide only, and some substitutions are possible.
U1
MAX2046ETJ-T (32-pin QFN)
Connections and Setup
This section provides a step-by-step guide to operat-
ing the EV kits and testing the devices’ functions. Do
not turn on DC power or RF signal generators until all
connections are made.
2
_______________________________________________________________________________________
MAX2045/MAX2046/MAX2047 Evaluation Kits
4) Configure the network analyzer to measure S21. The
Table 1. Required Test Equipment
analyzer should read approximately 6.2dB gain at f
IN
=
EQUIPMENT
QTY
DESCRIPTION
= 2140MHz (MAX2045), 6.6dB gain at f
1900MHz (MAX2046), and 8.1dB gain at f
915MHz (MAX2047).
IN
Capable of delivering up to
250mA at 4.75V to 5.25V
=
IN
Power supply
1
5) Changing the current source value changes the
magnitude of the gain. To adjust the phase, use sep-
arate current sources on the II1 and IQ1 terminals.
Capable of swinging from 0
to +5.5V
Power supplies
2
2
2
Current sources
(optional)
Capable of delivering 5mA of
current
Detailed Description
The EV kits come with all necessary components for
easy testing. For each kit, make sure all ground pins on
the 20-lead header are connected to ground. The
REFOUT voltage can be monitored from pins 17 and 18
on the 20-lead header by installing a 0Ω resistor for R6.
Low-noise RF signal
generators
HP 8648B or equivalent
Network analyzer
Ammeter/voltmeters
50Ω SMA cables
1
2
2
HP 8753ES or equivalent
—
—
To operate the device in differential voltage-control
mode, remove R5 and R3, and install 0Ω resistors for
R2 and R4. Figure 1 shows the connections on the 20-
pin header corresponding to the voltage- and current-
control inputs. Using this configuration, an external DC
source can also be applied to VI2 and VQ2 for single-
ended operation using an external regulated voltage.
Testing the Supply Current
1) If available, set the current limit of the power supply
to 250mA. Do not turn on the supply. Connect the
DC supply set to 5V, through an ammeter, to the
VCC and GND terminals on the EV kit. Use a volt-
meter to verify that the voltage is at V
= 5V.
CC
For current-mode operation, leave the VI and VQ (header
pins 1, 2, 5, and 6) open, and remove R3 and R5.
2) Turn on the DC supply; the supply current should
read approximately 160mA.
Bias Resistor
The bias resistor value (280Ω) was optimized during
characterization at the factory. This value should not be
adjusted. If the 280Ω ( 1%) resistor is not readily avail-
able, substitute a standard 280Ω ( 5%) resistor.
Testing the Gain (Single-Ended Voltage Mode)
1) Connect a DC supply set to +3.2V to the VI1 and
VQ1 terminals (Figure 1).
2) Using a calibrated network analyzer, connect port 1
to the RF_IN terminal (SMA J1) and port 2 to the
RF_OUT terminal (SMA J2).
On-Chip Reference Voltage
An on-chip, 2.5V reference voltage is provided for sin-
gle-ended control mode. REFOUT is connected,
through R3 and R5, to VI2 and VQ2 to provide a stable
reference voltage. The equivalent output resistance of
the REFOUT pin is approximately 80Ω. REFOUT is
capable of sourcing 1mA of current with <10mV drop
in voltage.
3) Configure the network analyzer to measure S21. The
analyzer should read approximately 7dB gain at f
IN
=
=
= 2140MHz (MAX2045), 7.4dB gain at f
IN
1900MHz (MAX2046), and 8.4dB gain at f
915MHz (MAX2047).
IN
4) Changing the DC supply on the VI1 and VQ1 termi-
nals changes the magnitude of the gain. To adjust
the phase, use separate DC supplies on the VI1 and
VQ1 terminals.
Capacitors
Ceramic capacitors C16 and C17 provide bypass on
the supply. Place C16 as close to the part as possible
for high-frequency bypassing. C4–C11 are bypass
capacitors for the control inputs. C1 and C14 are DC-
blocking capacitors for the on-board baluns. DC-block-
ing capacitors prevent DC current from flowing into the
transformers and can be used as part of the matching
circuit. Capacitors C13 and C15 are used to provide an
RF ground for transformer T2. Capacitor C12 is used to
bypass the 2.5V reference in case the reference is
used. As the differential RF outputs are relatively high
Testing the Gain (Current Mode)
1) Configure the evaluation kits for current mode (see
the Detailed Description section).
2) Connect a current source set to 4mA to the II1 and
IQ1 terminals. Leave II2, IQ2, and all voltage-control
pins open (Figure 1).
3) Using a calibrated network analyzer, connect port 1
to the RF_IN terminal (SMA J1) and port 2 to the
RF_OUT terminal (SMA J2).
_______________________________________________________________________________________
3
MAX2045/MAX2046/MAX2047 Evaluation Kits
impedance, they are more susceptible to component
parasitics. It is often good practice to relieve the
ground plane directly underneath large components to
reduce associated shunt-C parasitics.
er and of the same length to ensure signal balance. The
PC board layout should provide a large ground pad
under the device for proper RF grounding and thermal
performance. This pad should be connected to the
ground plane of the board by using multiple vias. To
minimize inductance, route the ground pins of the
device to the large ground pad. Solder the exposed pad
on the bottom of the device package to the PC board
exposed pad (refer to the MAX2045/MAX2046/
MAX2047 data sheet).
Layout
The EV kit’s PC board can serve as a guide for laying
out a board using the MAX2045/MAX2046/MAX2047.
Keep RF signal lines as short as possible to minimize
losses and radiation. Always use controlled-impedance
lines on all high-frequency inputs and outputs and use
low-inductance connections to ground on all GND pins.
At all differential ports, keep the differential lines togeth-
The MAX2045/MAX2046/MAX2047 EV kits can be used
as a reference for board layout. Gerber files are avail-
able upon request at www.maxim-ic.com.
C1
J1
RF_IN
L1
T1
C2
C3
J3
GND
GND
VI1
24
23
22
1
1
3
2
C4
C5
R2
90°
OPEN
CONTROL
VI2
VQ1
VQ2
II1
PHASE
SHIFTER
AMPLIFIER I
2
3
U1
RBIAS
GND
MAX2045
MAX2046
MAX2047
C6
R4
OPEN
R1
280Ω
21
20
4
5
VECTOR
MULTIPLIER
C7
CONTROL
AMPLIFIER Q
GND
GND
C8
II2
19
18
17
6
7
C9
V
CC
2.5V
REFERENCE
V
OUTPUT
STAGE
CC
IQ1
IQ2
C16
C17
C10
C11
V
CC
8
VREF
5V
R5
0Ω
R3
0Ω
R6
OPEN
19
20
C12
C14
J2
L2
V
CC
RF_OUT
C15
NOTE:
PLEASE SEE THE PART-SPECIFIC
COMPONENT LIST FOR COMPONENT VALUES.
C13
T2
Figure 1. MAX2045/MAX2046/MAX2047 EV Kit Schematic
_______________________________________________________________________________________
4
MAX2045/MAX2046/MAX2047 Evaluation Kits
1.0"
1.0"
Figure 2. MAX2045 EV Kit Component Placement Guide—Top
Silkscreen
Figure 3. MAX2045 EV Kit Component Placement Guide—
Bottom Silkscreen
1.0"
1.0"
Figure 5. MAX2045 EV Kit PC Board Layout —Ground Layer
(Layer 2)
Figure 4. MAX2045 EV Kit PC Board Layout—Primary
Component Side
_______________________________________________________________________________________
5
MAX2045/MAX2046/MAX2047 Evaluation Kits
1.0"
1.0"
Figure 6. MAX2045 EV Kit PC Board Layout—Route Layer
(Layer 3)
Figure 7. MAX2045 EV Kit PC Board Layout—Secondary Side
1.0"
1.0"
Figure 9. MAX2045 EV Kit PC Board Layout—Bottom Solder
Mask
Figure 8. MAX2045 EV Kit PC Board Layout—Top Solder Mask
6
_______________________________________________________________________________________
MAX2045/MAX2046/MAX2047 Evaluation Kits
1.0"
Figure 10. MAX2046 EV Kit Component Placement Guide—
Top Silkscreen
Figure 11. MAX2046 EV Kit Component Placement Guide—
Bottom Silkscreen
1.0"
1.0"
Figure 13. MAX2046 EV Kit PC Board Layout—Ground Layer
(Layer 2)
Figure 12. MAX2046 EV Kit PC Board Layout—Primary
Component Side
_______________________________________________________________________________________
7
MAX2045/MAX2046/MAX2047 Evaluation Kits
1.0"
1.0"
Figure 14. MAX2046 EV Kit PC Board Layout—Route Layer
(Layer 3)
Figure 15. MAX2046 EV Kit PC Board Layout—Secondary Side
1.0"
1.0"
Figure 17. MAX2046 EV Kit PC Board Layout—Bottom Solder
Mask
Figure 16. MAX2046 EV Kit PC Board Layout—Top Solder
Mask
8
_______________________________________________________________________________________
MAX2045/MAX2046/MAX2047 Evaluation Kits
1.0"
1.0"
Figure 18. MAX2047 EV Kit Component Placement Guide—
Top Silkscreen
Figure 19. MAX2047 EV Kit Component Placement Guide—
Bottom Silkscreen
1.0"
1.0"
Figure 21. MAX2047 EV Kit PC Board Layout—Ground Layer
(Layer 2)
Figure 20. MAX2047 EV Kit PC Board Layout—Primary
Component Side
_______________________________________________________________________________________
9
MAX2045/MAX2046/MAX2047 Evaluation Kits
1.0"
1.0"
Figure 22. MAX2047 EV Kit PC Board Layout—Route Layer
(Layer 3)
Figure 23. MAX2047 EV Kit PC Board Layout—Secondary Side
1.0"
1.0"
Figure 24. MAX2047 EV Kit PC Board Layout—Top Solder
Mask
Figure 25. MAX2047 EV Kit PC Board Layout—Bottom Solder
Mask
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
10 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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