MAX3760 [MAXIM]

622Mbps, Low-Noise Transimpedance Preamplifier for LAN and WAN Optical Receivers; 622Mbps,低噪声互阻前置放大器,用于LAN和WAN光接收器
MAX3760
型号: MAX3760
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

622Mbps, Low-Noise Transimpedance Preamplifier for LAN and WAN Optical Receivers
622Mbps,低噪声互阻前置放大器,用于LAN和WAN光接收器

放大器 局域网
文件: 总8页 (文件大小:126K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
19-4765; Rev 0; 7/98  
6 2 2 Mb p s , Lo w -No is e Tra n s im p e d a n c e  
P re a m p lifie r fo r LAN a n d WAN Op t ic a l Re c e ive rs  
MAX3760  
Ge n e ra l De s c rip t io n  
____________________________Fe a t u re s  
73nA RMS Input-Referred Noise  
560MHz Bandwidth  
The MAX3760 is a transimpedance preamplifier for  
622Mbps ATM applications. It operates from a single  
+ 5V s up p ly a nd typ ic a lly c ons ume s only 100mW  
power. The preamplifier converts a small photodiode  
current to a differential voltage. A DC cancellation cir-  
cuit provides a true differential output swing over a  
wide range of input current levels, thus reducing pulse-  
width distortion.  
1mA Peak Input Current  
6.5kGain  
Operation from -40°C to +85°C  
100mW Typical Power Consumption  
Single +5V Supply  
6.5ktransimpedance gain and 560MHz bandwidth,  
combined with low 73nA input-referred noise, provide  
-31.5dBm typical sensitivity in 1300nm receivers. The  
circuit accepts a 1mAp-p input current, resulting in a  
typical optical overload of -3dBm. The device operates  
over an extended temperature range of -40°C to +85°C.  
The MAX3760 is internally compensated and requires  
fe w e xte rna l c omp one nts . In d ie form it inc lud e s a  
space-saving filter connection, which provides positive  
Ord e rin g In fo rm a t io n  
PART  
TEMP. RANGE  
-40°C to +85°C  
-40°C to +85°C  
PIN-PACKAGE  
8 SO  
bias for the photodiode through a 1kresistor to V  
.
CC  
MAX3760ESA  
MAX3760E/D  
These features, combined with the die aspect ratio and  
dimensioning, allow the MAX3760 to assemble easily  
into a TO-style header with a photodiode.  
Dice*  
*Dice are designed to operate over a -40°C to +100°C junction  
te mp e ra ture (T ) ra ng e , b ut a re te s te d a nd g ua ra nte e d a t  
The MAX3760 is designed to be used with either the  
MAX3761 or the MAX3762 limiting-amplifier ICs. When  
combined with a photodiode, the chipset forms a com-  
plete 5V, 622Mbps receiver. The MAX3760 is available  
in die form and in an 8-pin SO package.  
j
T
A
= +25°C.  
________________________Ap p lic a t io n s  
622Mbps ATM LAN Optical Receivers  
Typ ic a l Ap p lic a t io n Circ u it  
+5V  
622Mbps WAN Optical Receivers  
0.01µF  
V
CC  
P in Co n fig u ra t io n  
1k  
(FILTER)  
MAX3761  
MAX3762  
LIMITING  
MAX3760  
TOP VIEW  
0.01µF  
100pF  
INREF  
AMPLIFIER  
OUT+  
100Ω  
(OPTIONAL)  
1
2
3
4
8
7
6
5
COMP  
OUT+  
OUT-  
GND  
V
CC  
IN  
INREF  
GND  
IN  
MAX3760  
OUT-  
0.01µF  
GND  
COMP*  
SO  
( ) INDICATE PINS AVAILABLE ONLY ON THE DIE.  
*NOT CONNECTED  
________________________________________________________________ Maxim Integrated Products  
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800  
For small orders, phone 408-737-7600 ext. 3468.  
6 2 2 Mb p s , Lo w -No is e Tra n s im p e d a n c e  
P re a m p lifie r fo r LAN a n d WAN Op t ic a l Re c e ive rs  
ABSOLUTE MAXIMUM RATINGS  
V
CC  
........................................................................-0.5V to +7.0V  
Continuous Power Dissipation (T = +85°C)  
A
Continuous Current  
SO (derate 5.88mW/°C above +85°C)..........................383mW  
Storage Temperature Range .............................-65°C to +160°C  
Lead Temperature (soldering, 10sec) .............................+300°C  
Operating Junction Temperature Range (die) .....-55°C to +150°C  
Processing Temperature (die) .........................................+400°C  
IN, FILTER..........................................................-5mA to +5mA  
OUT+, OUT-...................................................-25mA to +25mA  
Voltage at INREF ...................................................-0.5V to +0.5V  
Voltage at COMP........................................-0.5V to (V + 0.5V)  
CC  
MAX3760  
Stresses beyond those listed under Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
DC ELECTRICAL CHARACTERISTICS  
(V = +4.5V to +5.5V, COMP = GND, 100load between OUT+ and OUT-, T = -40°C to +85°C, unless otherwise noted. Typical  
CC  
A
values are at V = +5.0V, T = +25°C.) (Note 1)  
CC  
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
0.8  
20  
MAX  
0.95  
30  
UNITS  
V
Input Bias Voltage  
Supply Current  
V
IN  
Input = open  
Input = open  
I
CC  
mA  
kΩ  
V
Small-Signal Transimpedance  
Output Common-Mode Level  
Differential Output Offset  
z
Differential output, input <10µA  
5.2  
6.5  
7.8  
21  
V
- 2.0  
CC  
V
OS  
I
IN  
= 500µA, COMP = open  
-25  
40  
25  
60  
mV  
Output Impedance (per side)  
Z
50  
OUT  
Maximum Differential  
Output Voltage  
I
= 500µA, total peak-to-peak,  
IN  
V
550  
950  
mV  
OUT(MAX)  
differential signal  
FILTER Resistance  
R
800  
20  
1000  
45  
1200  
FILTER  
Power-Supply Rejection Ratio  
PSRR  
f < 1MHz, referred to output  
dB  
Note 1: Dice are tested at T = +25°C.  
A
AC ELECTRICAL CHARACTERISTICS  
(V  
CC  
= +4.5V to +5.5V, COMP = open, C = 0.75pF, outputs terminated differentially into 100, 8-pin SO package in MAX3760  
IN  
EV kit, T = +25°C, unless otherwise noted. Typical values are at V = +5V.) (Notes 2, 3)  
A
CC  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
565  
50  
MAX  
UNITS  
MHz  
kHz  
ps  
Small-Signal Bandwidth  
Low-Frequency Cutoff  
Pulse-Width Distortion  
RMS Noise Referred to Input  
Data-Dependent Jitter  
BW  
455  
20µA average input current  
(Note 4)  
PWD  
75  
200  
i
n
C
= 0.75pF (Notes 3, 5)  
IN  
73  
93.5  
nA  
DDJ  
200  
ps  
Note 2: AC characteristics are guaranteed by design and characterization.  
Note 3: C is the source capacitance presented to the die. Includes package parasitic, photo diode, and parasitic interconnect  
IN  
capacitance.  
Note 4: Input is a 622Mbps 1-0 pattern, signal amplitude = 0 to 1mA, extinction ratio (r ) = 10.  
e
Note 5: Measured with a 4-pole, 470MHz Bessel filter.  
2
_______________________________________________________________________________________  
6 2 2 Mb p s , Lo w -No is e Tra n s im p e d a n c e  
P re a m p lifie r fo r LAN a n d WAN Op t ic a l Re c e ive rs  
MAX3760  
__________________________________________Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s  
(MAX3760 EV kit, V = +5.0V, COMP = open, T = +25°C, unless otherwise noted.)  
CC  
A
INPUT-REFERRED NOISE  
vs. JUNCTION TEMPERATURE  
SMALL-SIGNAL GAIN  
vs. FREQUENCY  
PULSE-WIDTH DISTORTION vs.  
INPUT SIGNAL AMPLITUDE  
110  
100  
90  
80  
200  
150  
C
IS SOURCE CAPACITANCE  
IN  
r = 10  
e
78  
PRESENTED TO DIE. INCLUDES PACKAGE  
PARASITIC, PIN DIODE, AND PARASITIC  
INTERCONNECT CAPACITANCE  
622Mbps,  
ONE-ZERO PATTERN  
76  
74  
C
IN  
= 1.25pF  
72  
70  
68  
66  
80  
100  
50  
0
C
= 0.75pF  
IN  
70  
C
IN  
= 0.25pF  
60  
64  
62  
50  
470MHz BANDWIDTH  
40  
60  
-40  
-5  
30  
65  
100  
10k 100k 1M 10M 100M 1G  
FREQUENCY (Hz)  
10G  
0
200  
400  
600  
800  
1000  
JUNCTION TEMPERATURE (°C)  
INPUT SIGNAL AMPLITUDE (µAp-p)  
TYPICAL BANDWIDTH  
vs. JUNCTION TEMPERATURE  
TRANSIMPEDANCE  
vs. AMBIENT TEMPERATURE  
INPUT-REFERRED RMS NOISE CURRENT  
vs. DC INPUT CURRENT  
540  
450  
400  
350  
300  
250  
200  
150  
100  
50  
7000  
6500  
C
IN  
= 0.25pF  
IN TO-56 HEADER  
C
IN  
= 0.75pF  
470MHz BANDWIDTH  
520  
500  
480  
460  
440  
420  
C
IN  
= 0.75pF  
C
IN  
= 1.25pF  
6000  
5500  
5000  
C
IN  
IS SOURCE CAPACITANCE  
PRESENTED TO DIE. INCLUDES PACKAGE  
PARASITIC, PIN DIODE, AND PARASITIC  
INTERCONNECT CAPACITANCE  
0
-40  
-5  
30  
65  
100  
-40 -20  
0
20  
40  
60  
80  
100  
1.00 2.15 4.64 10.0 21.5 46.4 100 215 464 1000  
JUNCTION TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
DC INPUT CURRENT (µA)  
DATA-DEPENDENT JITTER  
vs. INPUT SIGNAL AMPLITUDE  
OUTPUT COMMON-MODE VOLTAGE  
vs. AMBIENT TEMPERATURE  
TYPICAL EYEWIDTH vs. INPUT SIGNAL  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
800  
600  
-1.0  
23  
2
- 1 PRBS  
REFERENCED TO V  
CC  
-1.2  
-1.4  
-1.6  
-1.8  
-2.0  
-2.2  
-2.4  
-2.6  
-2.8  
-3.0  
622Mbps  
r = 10  
e
T = +85°C  
A
T = +25°C  
A
400  
200  
0
T = -40°C  
A
0
200  
400  
600  
800  
1000  
10 20 50 100 150 200 250 300 400 500 600  
-40 -20  
0
20  
40  
60  
80  
100  
INPUT SIGNAL AMPLITUDE (µAp-p)  
INPUT SIGNAL (µA)  
AMBIENT TEMPERATURE (°C)  
_______________________________________________________________________________________  
3
6 2 2 Mb p s , Lo w -No is e Tra n s im p e d a n c e  
P re a m p lifie r fo r LAN a n d WAN Op t ic a l Re c e ive rs  
Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s (c o n t in u e d )  
(MAX3760 EV kit, V = +5.0V, COMP = open, T = +25°C, unless otherwise noted.)  
CC  
A
MAXIMUM OUTPUT SIGNAL AMPLITUDE  
vs. AMBIENT TEMPERATURE  
800  
700  
MAX3760  
600  
500  
400  
-40 -20  
0
20  
40  
60  
80  
100  
AMBIENT TEMPERATURE (°C)  
EYE DIAGRAM  
(INPUT = 1mA)  
EYE DIAGRAM  
(INPUT = 10µA)  
500mV  
50mV  
23  
2
- 1 PRBS  
23  
2
- 1 PRBS  
10mV/  
div  
100mV/  
div  
-50mV  
-500mV  
200ps/div  
200ps/div  
P in De s c rip t io n  
PIN  
1
NAME  
FUNCTION  
V
CC  
Supply-Voltage Input  
Signal Input  
2
IN  
3
INREF  
GND  
OUT-  
OUT+  
Input Reference Connection. Connect to photodetector AC ground.  
Ground  
4, 5  
6
Inverting Voltage Output. Current flowing into the input causes OUT- to decrease.  
7
Noninverting Voltage Output. Current flowing into the input causes OUT+ to increase.  
Compensation Capacitor Connection. Connection for optional external compensation capacitor for DC-  
cancellation circuit. Add capacitance here to reduce the low-frequency cutoff of the DC cancellation circuit.  
Connect COMP directly to GND to disable the DC cancellation circuit.  
8
COMP  
Filter Connection. Provides positive bias for photodiode through a 1kresistor to V (see the Designing  
Filters section). Available on the die only.  
CC  
FILTER  
4
_______________________________________________________________________________________  
6 2 2 Mb p s , Lo w -No is e Tra n s im p e d a n c e  
P re a m p lifie r fo r LAN a n d WAN Op t ic a l Re c e ive rs  
MAX3760  
V
CC  
D1  
1k  
R1  
RF  
MAX3760  
(FILTER)  
OUT-  
V
CC  
V
CC  
Q2  
TRANSIMPEDANCE  
AMPLIFIER  
IN  
PARAPHASE  
AMP  
V
CC  
Q1  
INREF  
Q3  
R2  
OUT+  
R3  
R4  
DC  
CANCELLATION  
AMPLIFIER  
Q4  
GND  
( ) INDICATE PINS AVAILABLE ON DIE ONLY.  
GND  
COMP  
Figure 1. Functional Diagram  
b e te rmina te d with hig he r outp ut imp e d a nc e s for  
increased gain and output voltage swing. The MAX3760  
will not drive a 50load to ground. For best noise rejec-  
tion, terminate the MAX3760 with differential loads.  
De t a ile d De s c rip t io n  
The MAX3760 is a transimpedance amplifier designed  
for 622Mbps fiber optic applications. As shown in the  
Functional Diagram (Figure 1), it comprises a transim-  
pedance amplifier, a paraphase amplifier with emitter-  
follower outputs, and a DC cancellation circuit.  
DC Ca n c e lla t io n Circ u it  
The DC cancellation circuit removes the input signal’s  
DC component by employing low-frequency feedback.  
This feature centers the input signal within the transim-  
pedance amplifiers dynamic range, thereby reducing  
pulse-width distortion on large input signals.  
Tra n s im p e d a n c e Am p lifie r  
The signal current at the input flows into a high-gain  
amplifiers summing node. Shunt feedback through RF  
c onve rts this c urre nt to a volta g e with 6.5kg a in.  
Diode D1 clamps the output voltage for large input cur-  
rents. INREF is a direct connection to the input transis-  
tors emitter, and must be connected directly to the  
photodetector AC ground return for best performance.  
The paraphase amplifiers output is sensed through  
resistors R3 and R4, then filtered, amplified, and fed  
back to the base of transistor Q4. The transistor draws  
the input signal’s DC component away from the trans-  
impedance amplifiers summing node.  
P a ra p h a s e Am p lifie r  
The paraphase amplifier converts single-ended signals to  
differential signals and introduces a voltage gain of 2.  
This signal drives a pair of internally biased emitter follow-  
ers, Q2 and Q3, which form the output stage. Resistors  
R1 and R2 provide back-termination at the output, deliv-  
ering a 100differential output impedance. The output  
emitter followers are designed to drive a 100differential  
load between OUT+ and OUT-. The MAX3760 can also  
The MAX3760 DC cancellation loop is internally com-  
pensated and does not require external capacitors in  
most 622Mbps applications. Add external capacitance  
at the COMP pin to reduce the DC cancellation circuit’s  
frequency response and improve data-dependent jitter.  
Connecting the COMP pin directly to GND disables the  
circuit. The DC cancellation circuit can sink up to 1mA  
at the input.  
_______________________________________________________________________________________  
5
6 2 2 Mb p s , Lo w -No is e Tra n s im p e d a n c e  
P re a m p lifie r fo r LAN a n d WAN Op t ic a l Re c e ive rs  
The MAX3760 minimizes pulse-width distortion for data  
1mA  
Overload = 10log  
1000 dBm  
sequences exhibiting a 50% duty cycle. A duty cycle  
significantly different from 50% will cause the MAX3760  
to generate pulse-width distortion.  
2ρ  
Linear Range  
DC cancellation current is drawn from the input and  
creates noise. This is not a problem for low-level signals  
with little or no DC c omp one nt. Pre a mp lifie r nois e  
increases for signals with significant DC component  
(see Typical Operating Characteristics).  
The MAX3760 has high gain, which limits the output  
when the input signal exceeds 20µAp-p. It operates  
with 90% linearity for inputs not exceeding the follow-  
ing:  
MAX3760  
The MAX3760 operates with the photodetector cathode  
20µA r + 1  
(
)
e
connected to V , as shown in the Typical Application  
10log  
1000 dBm  
CC  
ρ r - 1  
Circuit. Connecting the photodetector anode to GND  
and the cathode to IN defeats the DC cancellation cir-  
cuit and causes pulse-width distortion.  
(
)
e
Table 1. Optical Power Relations  
In p u t Re fe re n c e  
INREF is the reference point for IN. Connect it as close  
as possible to the photodetector diodes AC ground. The  
photodetectors AC ground is usually the ground of the  
photodetectors filter capacitor. The total length from  
INREF, through the filter capacitor and the diode, and  
back to the input should be no more than 2cm.  
PARAMETER SYMBOL  
RELATION  
Average  
Power  
P
AVE  
P
= P0 + P1 / 2  
(
)
AVE  
Extinction  
Ratio  
r
e
r
= P1 / P0  
e
re  
AVE (re + 1)  
Ap p lic a t io n s In fo rm a t io n  
Optical Power  
of a 1”  
P1 = 2P  
P1  
P0  
Op t ic a l P o w e r De fin it io n s  
Many of the MAX3760s specifications relate to the  
input signal amplitude. When working with fiber optic  
re c e ive rs, the optic a l input is usua lly e xpre sse d in  
terms of average optical power and extinction ratio.  
Use the relations given in Table 1 to convert optical  
p owe r to inp ut s ig na l whe n d e s ig ning with the  
MAX3760.  
Optical Power  
of a 0”  
P0 = 2P  
/ r + 1  
(
)
AVE  
e
r
- 1  
Signal  
Amplitude  
(
)
e
P
IN  
PIN = P1 - P0 = 2P  
AVE (re + 1)  
Note: Assuming a 50% average input duty cycle.  
Ca lc u la t in g S e n s it ivit y,  
Ove rlo a d , a n d Lin e a r Ra n g e  
OPTICAL  
POWER  
Sensitivity Calculation  
The MAX3760s input-referred RMS noise current (i )  
n
P1  
generally dominates the receiver sensitivity. In a system  
where the bit error rate (BER) is 1E - 10, the signal-to-  
noise ratio must always exceed 12.7. The sensitivity,  
expressed in average power, can be estimated as:  
P
AVE  
12.7i r + 1  
(
)
n e  
Sensitivity = 10log  
1000 dBm  
2ρ r - 1  
(
)
e
Where ρ is the photodiode responsivity in A/W.  
Input Overload  
P0  
The overload is the largest input that the MAX3760  
TIME  
accepts while meeting specifications. It is calculated  
as:  
Figure 2. Optical Power Definitions  
6
_______________________________________________________________________________________  
6 2 2 Mb p s , Lo w -No is e Tra n s im p e d a n c e  
P re a m p lifie r fo r LAN a n d WAN Op t ic a l Re c e ive rs  
MAX3760  
supply-noise voltage is divided between C  
and  
P o w e r S u p p ly  
The MAX3760 can operate from a power-supply volt-  
FILTER  
C
. The input noise current due to supply noise is  
PHOTO  
as follows (assuming the filter capacitor is much larger  
than the photodiode capacitance):  
age (V - GND) between 4.5V and 5.5V. GND can be  
any stable voltage, including -5.0V, as found in many  
systems using ECL interface levels.  
CC  
V
C
PHOTO  
(
=
)(  
)
)
NOISE  
I
La yo u t Co n s id e ra t io n s  
Us e g ood hig h-fre q ue nc y d e s ig n a nd la yout te c h-  
niques. The use of a multilayer circuit board with sepa-  
NOISE  
R
C
)(  
FILTER  
(
FILTER  
If the amount of tolerable noise is known, the filter  
capacitor is easy to select, as follows:  
rate ground and V  
planes is recommended. Take  
CC  
care to bypass V and to connect the GND pin to the  
CC  
ground plane with the shortest possible traces.  
V
C
PHOTO  
(
>
)(  
)
NOISE  
De s ig n in g a Lo w -Ca p a c it a n c e In p u t  
Noise performance and bandwidth will be adversely  
affected by stray capacitance at IN. Make every effort  
to minimize capacitance on this node. Select a low-  
capacitance photodiode and use good high-frequency  
design and layout techniques. The MAX3760 is opti-  
mized for 0.75pF of capacitance on the input—approxi-  
mately the capacitance of a low-cost photodetector  
packaged in a header.  
C
FILTER  
R
(
I
)(  
)
FILTER NOISE  
For example, with maximum noise voltage = 10mV  
,
RMS  
C
= 0.75pF, R  
= 1k, and I  
selected  
PHOTO  
FILTER  
NOISE  
to be 30nA (half the MAX3760s input noise):  
10mV 0.75pF  
(
(
)(  
)(  
)
C
=
= 250pF  
FILTER  
1000 30E- 9  
)
When using the MAX3760 in the SO package, note that  
the package capacitance is about 0.3pF. The PC board  
between the MAX3760 input and the photodetector will  
add parasitic capacitance. Keep the input line short,  
and remove power and ground planes beneath it.  
TOP VIEW OF TO-56 HEADER  
For the b e s t p os s ib le p e rforma nc e , a s s e mb le the  
MAX3760 in die form using chip-and-wire technology,  
or package the die in a TO header. These techniques  
minimize parasitic capacitance, resulting in the lowest  
noise.  
V
CC  
C
FILTER  
De s ig n in g Filt e rs  
The MAX3760s noise performance is strongly affected  
by the circuit’s bandwidth, which changes over temper-  
ature and varies from lot to lot. Receiver sensitivity can  
be improved by adding filters to limit this bandwidth.  
Filter designs range from a one-pole filter using a single  
capacitor to more complex filters using inductors. The  
simple filter provides a moderate rolloff with minimal  
components, while the complex filter provides a sharp-  
e r rolloff a nd b e tte r tra ns ie nt re s p ons e . A s imp le  
530MHz filter can be created by placing a 6pF capaci-  
tor between the OUT+ and OUT- pins.  
PHOTODIODE  
OUT-  
OUT+  
Supply-voltage noise at the photodiode cathode pro-  
d uc e s a c urre nt, I = C  
V/t, whic h re d uc e s  
PHOTO  
receiver sensitivity (C  
is the photodiode capaci-  
PHOTO  
tance.) The MAX3760s FILTER resistor, combined with  
an external capacitor, can be used to reduce this noise  
(see Typical Application Circuit). Current generated by  
CASE IS GROUND  
Figure 3. Suggested Layout for TO-56 Header  
_______________________________________________________________________________________  
7
6 2 2 Mb p s , Lo w -No is e Tra n s im p e d a n c e  
P re a m p lifie r fo r LAN a n d WAN Op t ic a l Re c e ive rs  
Wire Bo n d in g  
For high current density and reliable operation, the  
___________________Ch ip To p o g ra p h y  
MAX3760 uses gold metalization. Make connections to  
the die with gold wire only, using ball-bonding tech-  
niques. Wedge bonding is not recommended. Die-pad  
size is 4 mils square, with 6 mil pitch. Die thickness is  
15 mils.  
INREF FILTER IN  
V
GND  
GND  
CC  
MAX3760  
COMP  
0.042"  
(1.05mm)  
OUT-  
OUT+  
0.030"  
(0.75mm)  
TRANSISTOR COUNT: 131  
SUBSTRATE CONNECTED TO GND  
P a c k a g e In fo rm a t io n  
8
_______________________________________________________________________________________  

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