MAX4329ESD+ [MAXIM]
Operational Amplifier, 4 Func, 6000uV Offset-Max, BIPolar, PDSO14, 0.150 INCH, SOIC-14;
| 型号： | MAX4329ESD+ |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | Operational Amplifier, 4 Func, 6000uV Offset-Max, BIPolar, PDSO14, 0.150 INCH, SOIC-14 放大器 光电二极管 |
| 文件： | 总17页 (文件大小：498K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-1380; Rev 3; 10/02
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
General Description
____________________________Features
ꢀ 6-Bump UCSP Package (MAX4323)
ꢀ 2.4V to 6.5V Single-Supply Operation
ꢀ Rail-to-Rail Input Common-Mode Voltage Range
ꢀ Rail-to-Rail Output Voltage Swing
ꢀ 5MHz Gain-Bandwidth Product
The MAX4322/MAX4323/MAX4326/MAX4327/MAX4329
family of operational amplifiers combines wide bandwidth
and excellent DC accuracy with Rail-to-Rail® operation at
the inputs and outputs. These devices consume only
650µA per amplifier and operate from either a single sup-
ply (2.4V to 6.5V) or dual supplies (±±.2V to ±3.25V). These
unity-gain-stable amplifiers are capable of driving 250
loads and have a 5MHz gain-bandwidth product. The
MAX4323 and MAX4327 feature a low-power shutdown
mode that reduces supply current to 25µA and places the
outputs in a high-impedance state.
ꢀ 650µA Quiescent Current per Amplifier
ꢀ 700µV Offset Voltage
ꢀ No Phase Reversal for Overdriven Inputs
ꢀ Drive 250 Loads
With their rail-to-rail input common-mode range and
output swing, these amplifiers are ideal for low-voltage,
single-supply operation. In addition, low offset voltage
and high speed make them the ideal signal-condition-
ing stages for precision, low-voltage data-acquisition
systems.
ꢀ 25µA Shutdown Mode (MAX4323/MAX4327)
ꢀ Unity-Gain Stable for Capacitive Loads
Up to 500pF
The MAX4323 is offered in a small 6-bump chip-scale
package (UCSP™). The MAX4322/MAX4323 are also
available in space-saving SOT23 packages.
Ordering Information
TEMP
RANGE
PIN/BUMP-
PACKAGE
TOP
MARK
PART
Selector Guide
MAX4322EUK-T -40oC to +85oC
5 SOT23-5
8 µMAX
8 SO
ACGE
—
MAX4322EUA
MAX4322ESA
-40oC to +85oC
-40oC to +85oC
BW NO. OF
(MHz) AMPS
PIN/BUMP-
PACKAGE
PART
SHUTDOWN
—
Ordering Information continued at end of data sheet.
5 SOT23,
8 µMAX/SO
MAX4322
MAX4323
5
5
1
1
—
Pin Configurations
6 SOT23/UCSP,
8 µMAX/SO
Yes
TOP VIEW
MAX4326
MAX4327
MAX4329
5
5
5
2
2
4
8 µMAX/SO
10 µMAX, 14 SO
14 SO
—
Yes
—
(BUMPS ON BOTTOM)
B
A
1
2
V
EE
IN+
________________________Applications
MAX4323
Battery-Powered
Instruments
Data-Acquisition
Systems
IN-
OUT
RSSI Systems
PA Biasing
Signal Conditioning
Portable Equipment
Low-Power, Low-Voltage
Applications
V
CC
SHDN
3
UCSP
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
UCSP is a trademark of Maxim Integrated Products, Inc.
Pin Configurations continued at end of data sheet.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (V - V )...................................................7.5V
8-Pin µMAX (derate 4.10mW/°C above +70°C)...........330mW
10-Pin µMAX (derate 5.6mW/°C above +70°C)...........444mW
14-Pin SO (derate 8.00mW/°C above +70°C)..............640mW
Operating Temperature Range
CC
EE
All Other Pins ...................................(V
+ 0.3V) to (V - 0.3V)
CC
EE
Output Short-Circuit Duration.....................................Continuous
(Short to Either Supply)
Continuous Power Dissipation (T = +70°C)
MAX432_E__ ...................................................-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range.............................-65°C to +160°C
Bump Reflow Temperature ..............................................+235°C
Lead Temperature (soldering, 10s) .................................+300°C
A
5-Pin SOT23 (derate 7.1mW/°C above +70°C)............571mW
6-Bump UCSP (derate 3.9mW/°C above +70°C).........308mW
6-Pin SOT23 (derate 7.1mW/°C Above + 70°C) ..........571mW
8-Pin SO (derate 5.88mW/°C above +70°C)................471mW
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS—T = +25°C
A
CC,
(V
= 5.0V, V = 0V, V
= 0V, V
= V /2, SHDN = V
R connected to V /2, unless otherwise noted.)
CC
EE
OUT
CC
L
CC
CM
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
MAX432_ESA/
MAX4327ESD
0.7
2.0
Input Offset Voltage
V
V
= V or V
mV
OS
CM
EE
CC
CC
All other packages
1.2
50
2.50
150
12
Input Bias Current
Input Offset Current
I
V
V
= V or V
nA
nA
k
B
CM
CM
EE
I
= V or V
1
OS
EE
CC
Differential Input Resistance
R
-1.5V < V
< +1.5V
DIFF
500
IN
Common-Mode Input Voltage
Range
CMVR
Inferred from CMRR test
MAX432_ESA/
V
V
V
EE
CC
62
94
91
MAX4327ESD
Common-Mode Rejection Ratio
CMRR
PSRR
V
V
V
CC
dB
dB
dB
EE
CM
All other packages
60
66
Power-Supply Rejection Ratio
Output Resistance
V
= 2.4V to 6.5V
100
0.1
106
86
CC
R
A = +1V/V
V
OUT
V
V
= 0.25V to 4.75V, R = 100k
L
OUT
OUT
Large-Signal Voltage Gain
A
V
= 0.4V to 4.6V, R = 250
L
70
V
- V
12
CC
OL
CC
OL
CC
OL
CC
OL
OH
R = 100k
L
V
V
V
V
V
V
V
- V
- V
20
MAX4322/
MAX4323
EE
200
100
15
300
200
OH
EE
R = 250
L
- V
- V
V
O
Output Voltage Swing
mV
OH
EE
R = 100k
L
MAX4326/
MAX4327/
MAX4329
- V
- V
25
220
120
50
350
250
OH
EE
R = 250
L
- V
Output Short-Circuit Current
SHDN Logic Threshold
SHDN Input Current
I
mA
V
SC
V
Low
0.8
4
IL
MAX4323/MAX4327
MAX4323/MAX4327
V
High
2.0
IH
1
µA
2
_______________________________________________________________________________________
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
DC ELECTRICAL CHARACTERISTICS—T = +25°C (continued)
A
(V
= 5V, V = 0V, V
= 0V, V
= V /2, SHDN = V
R connected to V /2, unless otherwise noted.)
L CC
CC,
CC
EE
OUT
CC
CM
PARAMETER
SYMBOL
CONDITIONS
Inferred from PSRR test
MIN
TYP
MAX
UNITS
Operating Supply Voltage Range
V
2.4
6.5
V
CC
V
V
V
V
= 2.4V
= 5V
650
725
25
CC
CC
CC
CC
Supply Current per Amplifier
I
V
= V
= V /2
µA
µA
CC
CM
OUT
CC
1100
60
= 2.4V
= 5V
Shutdown Supply Current
per Amplifier
V
0.8V,
SHDN
I
SHDN
MAX4323/MAX4327
40
DC ELECTRICAL CHARACTERISTICS—T = -40°C to +85°C
A
(V
= 5V, V = 0V, V
= 0V, V
= V /2, SHDN = V
R connected to V /2, unless otherwise noted.) (Note 1)
L CC
CC,
CC
EE
OUT
CC
CM
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
MAX432_ESA/
MAX4327ESD
3.0
Input Offset Voltage
V
V
= V or V
mV
OS
CM
EE
CC
All other packages
6.0
Input Offset Voltage Tempco
Input Bias Current
TCV
2
µV/°C
nA
OS
I
V
V
= V or V
180
20
B
CM
CM
EE
CC
CC
Input Offset Current
I
= V or V
nA
OS
EE
Common-Mode Input
Voltage Range
CMVR
Inferred from CMRR test
V
V
V
EE
CC
MAX432_ESA/
MAX4327ESD
59
Common-Mode Rejection Ratio
CMRR
PSRR
V
V
V
CC
dB
EE
CM
All other packages
54
62
66
Power-Supply Rejection Ratio
Large-Signal Voltage Gain
V
V
= 2.4V to 6.5V
dB
dB
CC
A
= 0.4V to 4.6V, R = 250
L
V
OUT
V
V
- V
350
250
CC
OL
OH
MAX4322/
MAX4323
R = 250
L
- V
EE
Output Voltage Swing
V
mV
V
O
MAX4326/
MAX4327/
MAX4329
V
V
- V
- V
400
CC
OL
OH
R = 250
L
300
0.8
EE
V
Low
IL
SHDN Logic Threshold
MAX4323/MAX4327
MAX4323/MAX4327
V
High
2.0
2.4
IH
SHDN Input Current
5
6.5
µA
V
Operating Supply Voltage Range
Supply Current per Amplifier
V
CC
I
V
V
= V
= V /2
1200
µA
CC
CM
OUT
CC
Shutdown Supply Current
per Amplifier
I
0.8V, MAX4323/MAX4327
70
µA
SHDN
SHDN
_______________________________________________________________________________________
3
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
AC ELECTRICAL CHARACTERISTICS
(V
= 5V, V = 0V, V
= V
= V /2, SHDN = V T
CC,
A
= +25°C, unless otherwise noted.)
CC
EE
CM
OUT
CC
PARAMETER
SYMBOL
GBWP
M
CONDITIONS
MIN
TYP
5
MAX
UNITS
MHz
Degrees
dB
Gain-Bandwidth Product
Phase Margin
64
12
0.003
2
Gain Margin
G
M
Total Harmonic Distortion
Slew Rate
THD
SR
f = 10kHz, V
= 2V , A = +1V/V
%
OUT
P-P
V
V/µs
µs
Settling Time to 0.01%
Turn-On Time
t
A = +1V/V, V = 2V step
OUT
2.0
1
S
V
t
V
= 0 to 3V step
CC
µs
ON
Enable
Disable
1
SHDN Delay
MAX4323/MAX4327
µs
0.2
3
Input Capacitance
C
pF
nV/ Hz
pA/ Hz
dB
IN
Input Noise-Voltage Density
Input Noise-Current Density
Amp-Amp Isolation
e
f = 1kHz
f = 1kHz
22
0.4
135
250
n
i
n
Capacitive-Load Stability
C
A = +1V/V
V
pF
L
Note 1: All devices are 100% tested at T = +25°C. All temperature limits are guaranteed by design.
A
4
_______________________________________________________________________________________
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
__________________________________________Typical Operating Characteristics
(V
= 5V, V = 0V, V
= V /2, SHDN = V
T = +25°C, unless otherwise noted.)
A
CC
EE
CM
CC
CC,
GAIN AND PHASE vs. FREQUENCY
POWER-SUPPLY REJECTION RATIO
vs. FREQUENCY
(WITH C
)
LOAD
GAIN AND PHASE vs. FREQUENCY
MAX4322/26/29-02
MAX4322/26/29-01
60
180
144
180
144
60
A = +1
V
0
-20
-40
40
20
0
108
72
108
72
40
20
0
GAIN
GAIN
36
36
0
0
-36
-72
-108
-144
-60
-80
-36
-72
-108
-144
PHASE
PHASE
A = +1000
L
C = 500pF
L
V
R =
-20
-20
A = +1000
V
NO LOAD
-100
-180
-40
100
-40
100
-180
1k
10k 100k
1M 10M 100M
1k
10k
100k 1M 10M 100M
10 100 1k 10k 100k 1M 10M 100M
FREQUENCY (Hz)
FREQUENCY (Hz)
FREQUENCY (Hz)
MAX4323/MAX4327
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
MAX4326/MAX4327/MAX4329
CHANNEL SEPARATION vs. FREQUENCY
OUTPUT IMPEDANCE
vs. FREQUENCY
60
50
40
30
100
10
130
120
110
100
90
A = +1
V
V
= 6.5V
CC
V
= 2.7V
1
0.1
CC
80
70
60
20
10
V
= 0V
SHDN
0
50
0.01
-40 -25 -10
5
20 35 50 65 80 95
100
1k
10k
100k
1M
10M
100
1k
10k 100k
1M 10M
100M
FREQUENCY (Hz)
TEMPERATURE ( C)
FREQUENCY (Hz)
SUPPLY CURRENT PER AMPLIFIER
vs. TEMPERATURE
INPUT OFFSET VOLTAGE
vs. TEMPERATURE
INPUT BIAS CURRENT
vs. COMMON-MODE VOLTAGE
3.00
2.25
900
50
40
SOT23-5/6
PACKAGE
850
800
750
700
V
= 2.7V
CC
30
20
10
0
1.50
0.75
0
V
V
= 6.5V
= 2.7V
V
= 6.5V
CC
CC
CC
-10
-0.75
650
600
550
-20
-30
-1.50
-2.25
-3.00
SO PACKAGE
-40
-50
500
-40 -25 -10
5
20 35 50 65 80 95
-40 -25 -10
5
20 35 50 65 80 95
0
1
2
3
4
5
6
TEMPERATURE ( C)
TEMPERATURE ( C)
COMMON-MODE VOLTAGE (V)
_______________________________________________________________________________________
5
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
_____________________________Typical Operating Characteristics (continued)
(V
= 5V, V = 0V, V
= V /2, SHDN = V
T = +25°C, unless otherwise noted.)
A
CC
EE
CM
CC
CC,
INPUT BIAS CURRENT
vs. TEMPERATURE
COMMON-MODE REJECTION RATIO
vs. TEMPERATURE
MINIMUM OUTPUT VOLTAGE
vs. TEMPERATURE
50
40
120
250
200
150
100
R TO V
L
CC
V
= 6.5V, V = V
CM CC
115
110
105
100
CC
30
V
= 6.5V, R = 500
L
CC
V
= 2.7V, V = V
CM
CC
CC
20
V
= 0 TO 5.0V
CM
10
0
V
= 2.7V, R = 500
L
CC
-10
-20
-30
-40
-50
-60
95
90
85
V
= 2.7V, V = V
CM
V
= -0.2V TO 5.2V
CC
EE
CM
50
0
V
= 6.5V, R = 100k
CC L
V
= 6.5V, V = V
CM
CC
EE
V
= 2.7V, R = 100k
L
CC
80
-40 -25 -10
5
20 35 50 65 80 95
-40 -25 -10
5
20 35 50 65 80 95
-40 -25 -10
5
20 35 50 65 80 95
TEMPERATURE ( C)
TEMPERATURE ( C)
TEMPERATURE ( C)
LARGE-SIGNAL GAIN
vs. OUTPUT VOLTAGE
LARGE-SIGNAL GAIN
vs. OUTPUT VOLTAGE
MAXIMUM OUTPUT VOLTAGE
vs. TEMPERATURE
120
110
100
90
120
110
100
90
300
250
200
150
V
= 2.7V
V
= 6.5V
CC
CC
R TO V
L
EE
R = 100k
L
R TO V
L
R TO V
L
EE
EE
V
= 6.5V, R = 500
L
CC
R = 100k
L
R = 10k
L
R = 10k
L
R = 2k
L
R = 2k
V
= 2.7V, R = 500
L
CC
L
R = 500
L
80
80
100
50
R = 500
L
V
= 6.5V, R = 100k (TOP)
L
CC
70
70
V
= 2.7V, R = 100k (BOTTOM)
L
CC
60
60
0
0
100
200
300
400
500
600
0
100
200
300
400
500
600
-40 -25 -10
5
20 35 50 65 80 95
OUTPUT VOLTAGE: FROM V (mV)
CC
OUTPUT VOLTAGE: FROM V (mV)
CC
TEMPERATURE ( C)
LARGE-SIGNAL GAIN
vs. OUTPUT VOLTAGE
LARGE-SIGNAL GAIN
vs. OUTPUT VOLTAGE
LARGE-SIGNAL GAIN
vs. TEMPERATURE
120
110
100
90
120
110
100
90
125
120
115
110
105
V = 6.5V
CC
R = 100k
L
V
= 2.7V
R = 500
L
OUT(P-P)
CC
R TO V
L
V
= 6.5V,
CC
R TO V
L
R = 100k
L
V
= V - 1V
CC
R TO V
L
CC
CC
EE
R = 10k
L
R = 10k
L
V
= 2.7V,
CC
R = 2k
L
R TO V
L
EE
R = 2k
L
100
95
R = 500
L
R = 500
L
V
= 6.5V, R TO V
L
CC
CC
80
80
90
85
80
75
70
70
V
= 2.7V, R TO V
L CC
CC
5
60
60
0
100
200
300
400
500
600
0
100
200
300
400
500
600
-40 -25 -10
20 35 50 65 80 95
TEMPERATURE ( C)
OUTPUT VOLTAGE: FROM V (mV)
OUTPUT VOLTAGE: FROM V (mV)
EE
EE
6
_______________________________________________________________________________________
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
_____________________________Typical Operating Characteristics (continued)
(V
= 5V, V = 0V, V
= V /2, SHDN = V
T = +25°C, unless otherwise noted.)
A
CC
EE
CM
CC
CC,
LARGE-SIGNAL GAIN
vs. TEMPERATURE
MINIMUM OPERATING VOLTAGE
vs. TEMPERATURE
TOTAL HARMONIC DISTORTION
PLUS NOISE vs. FREQUENCY
1.9
125
0.040
0.035
0.030
0.025
0.020
V
CC
= 6.5V, R TO V
L EE
A
= +1
V
120
115
110
105
1.8
1.7
2V SIGNAL
P-P
V
= 6.5V, R TO V
L CC
CC
500kHz LOWPASS FILTER
R = 10k TO V /2
L
CC
1.6
1.5
1.4
1.3
1.2
100
95
V
= 2.7V, R TO V
L EE
CC
0.015
0.010
0.005
V
= 2.7V, R TO V
L CC
CC
90
85
80
75
V
= V - 600mV
CC
OUT(P-P)
R = 100k
L
0
-40 -25 -10
5
20 35 50 65 80 95
-40 -25 -10
5
20 35 50 65 80 95
10
100
1k
FREQUENCY (Hz)
10k
100k
TEMPERATURE ( C)
TEMPERATURE ( C)
SMALL-SIGNAL TRANSIENT
RESPONSE (NONINVERTING)
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. PEAK-TO-PEAK SIGNAL AMPLITUDE
SMALL-SIGNAL TRANSIENT
RESPONSE (INVERTING)
0.1
A
= +1
V
A
= +1
A
= -1
V
V
10kHz SINE WAVE
R TO V /2
L
CC
500kHz LOWPASS FILTER
IN
IN
R = 2k
L
0.01
R = 250
L
OUT
OUT
R = 100k
L
R = 10k
L
0.001
200ns/div
4.0
4.2
4.4
4.6
4.8
5.0
200ns/div
PEAK-TO-PEAK SIGNAL AMPLITUDE (V)
LARGE-SIGNAL TRANSIENT
RESPONSE (INVERTING)
LARGE-SIGNAL TRANSIENT
RESPONSE (NONINVERTING)
A
V
= +1
A = -1
V
IN
IN
OUT
OUT
2 s/div
2 s/div
_______________________________________________________________________________________
7
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
Pin Description
PIN
MAX4322
NAME
FUNCTION
MAX4323
SOT23 SO/µMAX UCSP
MAX4327
MAX4326
MAX4329
SOT23 SO/µMAX
µMAX
SO
—
—
OUT
Output
1
6
1
6
A2
—
—
Negative Supply.
Ground for single-
supply operation.
4
11
V
EE
2
4
2
4
A1
4
4
—
—
14
—
—
4
IN+
IN-
Noninverting Input
Inverting Input
3
4
5
—
—
7
3
4
6
3
2
7
B1
B2
A3
—
—
8
—
—
10
V
Positive Supply
CC
5, 7,
8 , 10
No Connection. Not
internally connected.
—
N.C.
—
1, 5, 8
—
1, 5
—
—
—
Shutdown Control.
Connected high or
leave floating to
—
—
—
—
SHDN
5
8
B3
—
enable amplifier.
OUT1,
OUT2
Outputs for Amps 1
and 2
—
—
—
—
—
—
—
—
—
—
2
1, 9
2, 8
3, 7
—
—
—
1, 7
2, 6
3, 5
1, 13
2, 12
3, 11
1, 7
2, 6
3, 5
Inverting Inputs for
Amps 1 and 2
IN1-, IN2-
IN1+,
IN2+
Noninverting Inputs
for Amps 1 and 2
3
Shutdown Control for
Amps 1 and 2.
Connected high or
leave floating to
enable amplifier.
SHDN1,
SHDN2
—
—
—
—
5, 6
—
—
5, 9
—
OUT3,
OUT4
Outputs for Amps 3
and 4
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
8, 14
9, 13
Inverting Inputs for
Amps 3 and 4
IN3-, IN4-
IN3+,
IN4+
Noninverting Inputs
for Amps 3 and 4
10, 12
8
_______________________________________________________________________________________
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
Since the input stage switches between the NPN and
__________Applications Information
PNP pairs, the input bias current changes polarity as
Rail-to-Rail Input Stage
the input voltage passes through the transition region.
To reduce the offset error caused by input bias cur-
rents flowing through external source impedances,
match the effective impedance seen by each input
(Figures 1a, 1b). High-source impedances, together
with the input capacitance, can create a parasitic pole
that produces an underdamped signal response.
Reducing the input impedance or placing a small (2pF
to 10pF) capacitor across the feedback resistor
improves the response.
Devices in the MAX4322/MAX4323/MAX4326/MAX4327/
MAX4329 family of high-speed amplifiers have rail-to-
rail input and output stages designed for low-voltage,
single-supply operation. The input stage consists of
separate NPN and PNP differential stages, which com-
bine to provide an input common-mode range extend-
ing to the supply rails. The PNP stage is active for input
voltages close to the negative rail, and the NPN stage
is active for input voltages near the positive rail. The
input offset voltage is typically below 250µV. The
The MAX4322/MAX4323/MAX4326/MAX4327/MAX4329s’
inputs are protected from large differential input voltages
by 1k series resistors and back-to-back triple diodes
across the inputs (Figure 2). For differential input volt-
ages less than 1.8V, the input resistance is typically
500k . For differential input voltages greater than 1.8V,
the input resistance is approximately 2k , and the input
bias current is determined by the following equation:
switchover transition region, which occurs near V /2,
CC
has been extended to minimize the slight degradation in
CMRR caused by the mismatch of the input pairs. Their
low offset voltage, high bandwidth, and rail-to-rail
common-mode range make these op amps excellent
choices for precision, low-voltage, data-acquisition
systems.
R3
R3
MAX4322/MAX4323
MAX4326/MAX4327
MAX4329
MAX4322/MAX4323
MAX4326/MAX4327
MAX4329
R1
R2
R1
R2
R3 = R1 R2
R3 = R1 R2
Figure 1a. Reducing Offset Error Due to Bias Current
(Noninverting)
Figure 1b. Reducing Offset Error Due to Bias Current
(Inverting)
1k
1k
Figure 2. Input Protection Circuit
_______________________________________________________________________________________
9
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
Driving a capacitive load can cause instability in most
V
- 1.8V
2k
DIFF
high-speed op amps, especially those with low quies-
cent current. The MAX4322/MAX4323/MAX4326/
MAX4327/MAX4329 have a high tolerance for capaci-
tive loads. They are stable with capacitive loads up to
500pF. Figure 4 gives the stable operating region for
capacitive loads. Figures 5 and 6 show the response
with capacitive loads and the results of adding an iso-
lation resistor in series with the output (Figure 7). The
resistor improves the circuit’s phase margin by isolat-
ing the load capacitor from the op amp’s output.
I
=
BIAS
Rail-to-Rail Output Stage
The minimum output voltage is within millivolts of
ground for single-supply operation where the load is
referenced to ground (V ). Figure 3 shows the input
EE
voltage range and output voltage swing of a MAX4322
connected as a voltage follower. With a 3V supply and
the load tied to ground, the output swings from 0 to
2.90V. The maximum output voltage swing depends on
the load, but is within 350mV of a 5V supply, even with
the maximum load (500 to ground).
Power-Up and Shutdown Mode
The MAX4322/MAX4323/MAX4326/MAX4327/MAX4329
amplifiers typically settle within 1µs after power-up.
10,000
V
= 3V
CC
A = +1
V
IN
UNSTABLE
REGION
1000
OUT
R TO V
OUT
L
EE
V
= V / 2
CC
100
100
1k
10k
100k
2 s/div
RESISTIVE LOAD (
)
Figure 3. Rail-to-Rail Input/Output Voltage Range
Figure 4. Capacitive-Load Stability
A = +1
L
R = 39
S
V
A = +1
L
V
C = 1000pF
C = 500pF
IN
IN
OUT
OUT
400ns/div
400ns/div
Figure 5. Small-Signal Transient Response with
Capacitive Load
Figure 6. Transient Response to Capacitive Load with
Isolation Resistor
10 ______________________________________________________________________________________
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
V
CC
MAX4322/MAX4323
MAX4326/MAX4327
MAX4329
0 TO 2.7V
STEP FOR
POWER-UP
TEST
2k
2k
V
R
OUT
S
C
L
MAX4322/MAX4323
MAX4326/MAX4327
MAX4329
SUPPLY-CURRENT
MONITORING POINT
10k
10
Figure 8. Power-Up Test Circuit
Figure 7. Capacitive-Load-Driving Circuit
Figures 9 and 10 show the output voltage and supply
current on power-up of the test circuit in Figure 8.
0.33mm (13mil). Round or square pads are permissi-
ble. Connect multiple vias from the ground plane as
close to the ground connections as possible.
The MAX4323 and MAX4327 have a shutdown option.
When shutdown (SHDN) is pulled low, the supply cur-
rent drops to 25µA per amplifier and the amplifiers are
disabled with the outputs in a high-impedance state.
Pulling SHDN high or leaving it floating (1µA internal
pullup) enables the amplifier. In the dual-amplifier
MAX4327, the shutdown functions operate indepen-
dently. Figures 11 and 12 show the output voltage and
supply current responses of the MAX4323 to a shut-
down pulse.
Install capacitors as close as possible to the device
supply voltage input. Place the ground end of these
capacitors near the ground plane to provide a low-
impedance return path for the signal current.
Prototype Chip Installation
Alignment keys on the PC board, around the area
where the chip is located, are helpful in the prototype
assembly process. It is better to align the chip on the
board before any other components are placed, and
then place the board on a hot plate or hot surface until
the solder starts melting. Remove the board from the
hot plate without disturbing the position of the chip and
let it cool down to room temperature before processing
the board further.
Power Supplies and Layout
The MAX4322/MAX4323/MAX4326/MAX4327/MAX4329
operate from a single 2.4V to 6.5V power supply, or
from dual supplies of 1.2V to 3.25V. For single-supply
operation, bypass the power supply with a 0.1µF
ceramic capacitor in parallel with at least 1µF. For dual
supplies, bypass each supply to ground.
MAX4323EBT (UCSP) Marking Information
Good layout improves performance by decreasing the
amount of stray capacitance at the op amp’s inputs and
outputs. To decrease stray capacitance, minimize trace
lengths and resistor leads by placing external compo-
nents close to the op amp.
TOP VIEW
(BUMPS ON BOTTOM)
ORIENTATION
PRODUCT ID CODE
LOT CODE
A1
A2
A3
UCSP Information
AAA
AAA
Layout Issues
Design the layout for the device to be as compact as
possible to minimize parasitics. The UCSP uses a
bump pitch of 0.5mm (19.7mil) and a bump diameter of
0.33mm (~12mil). Therefore, lay out the solder-pad
spacing on 0.5mm (19.7mil) centers, using a pad size
of 0.25mm (~10mil) and a solder mask opening of
______________________________________________________________________________________ 11
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
V
CC
V
CC
1V/div
OUT
I
CC
500 A/div
5 s/div
5 s/div
Figure 10. Power-Up Supply Current
Figure 9. Power-Up Output Voltage
V
= 2.7V
V
= 2.7V
CC
R = 10k
L
CC
SHDN
1V/div
SHDN
1V/div
OUT
0.5V/div
I
CC
500 A/div
2 s/div
2 s/div
Figure 11. Shutdown Output Voltage
Figure 12. Shutdown Enable/Disable Supply Current
12 ______________________________________________________________________________________
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
Pin Configurations (continued)
TOP VIEW
1
5
4
V
1
2
3
4
8
7
6
5
1
2
3
1
2
3
4
8
7
6
5
OUT
N.C.
IN1-
IN1+
N.C.
6
5
4
V
N.C.
IN1-
IN1+
SHDN
OUT
CC
CC
V
V
CC
CC
MAX4322
MAX4322
MAX4323
MAX4323
2
3
V
SHDN
IN-
V
EE
EE
OUT
N.C.
OUT
N.C.
V
EE
V
EE
IN+
IN-
IN+
SO/ MAX
SO/ MAX
SOT23-5
SOT23
OUT1
IN1-
OUT1
IN1-
V
OUT4
IN4-
1
2
3
4
5
6
7
1
CC
14
13
12
11
10
9
14
13
12
11
10
9
1
2
3
4
8
7
6
5
V
OUT1
IN1-
1
2
3
4
5
10 V
CC
OUT1
CC
OUT2
IN2-
2
3
4
5
6
7
9
8
7
6
OUT2
IN2-
OUT2
IN2-
IN1-
IN1+
MAX4326
MAX4327
IN1+
IN1+
IN4+
IN1+
V
EE
V
CC
IN2+
N.C.
V
MAX4327
MAX4329
EE
V
IN2+
EE
V
EE
IN2+
N.C.
SHDN1
N.C.
IN2+
IN2-
IN3+
IN3-
SHDN1
SHDN2
SHDN2
N.C.
MAX
SO/ MAX
OUT2
OUT3
8
8
SO
SO
UCSP Reliability
Ordering Information (continued)
The UCSP represents a unique packaging form factor
that may not perform as well as a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user's assembly
methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP.
TEMP
RANGE
PIN/BUMP-
PACKAGE
TOP
MARK
PART
MAX4323EBT-T* -40oC to +85oC
MAX4323EUT-T -40oC to +85oC
6 UCSP-6
6 SOT23-6
8 µMAX
8 SO
AAW
AAEC
—
MAX4323EUA
MAX4323ESA
MAX4326EUA
MAX4326ESA
MAX4327EUB
MAX4327ESD
MAX4329ESD
-40oC to +85oC
-40oC to +85oC
-40oC to +85oC
-40oC to +85oC
-40oC to +85oC
-40oC to +85oC
-40oC to +85oC
—
Performance through operating-life test and moisture
resistance remains uncompromised. The wafer-fabrica-
tion process primarily determines the performance.
Mechanical stress performance is a greater considera-
tion for UCSPs. UCSPs are attached through direct sol-
der contact to the user's PC board, foregoing the
inherent stress relief of a packaged product lead frame.
Solder-joint contact integrity must be considered.
Comprehensive reliability tests have been performed
and are available upon request. In conclusion, the
UCSP performs reliably through environmental stresses.
8 µMAX
8 SO
—
—
10 µMAX
14 SO
—
—
14 SO
—
*UCSP reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. See the
UCSP Reliability Notice in the UCSP Reliability section of this
data sheet for more information.
______________________________________________________________________________________ 13
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
Typical Operating Circuit
Chip Information
MAX4322 TRANSISTOR COUNT: 170
MAX4323 TRANSISTOR COUNT: 170
MAX4326 TRANSISTOR COUNT: 340
MAX4327 TRANSISTOR COUNT: 340
MAX4329 TRANSISTOR COUNT: 680
PROCESS: Bipolar
+5V
MAX187
1
3
6
V
SHDN
DOUT
DD
2
4
5
AIN
MAX4322
SUBSTRATE CONNECTED TO V
EE
SERIAL
INTERFACE
8
7
SCLK
CS
VREF
GND
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
e
4X S
10
10
INCHES
DIM MIN
MAX
MILLIMETERS
MIN
-
MAX
1.10
0.15
0.95
3.05
3.00
3.05
3.00
5.05
0.70
A
-
0.043
0.006
0.037
0.120
0.118
0.120
0.118
0.199
A1
A2
D1
D2
E1
E2
H
0.002
0.030
0.116
0.114
0.116
0.114
0.187
0.05
0.75
2.95
2.89
2.95
2.89
4.75
0.40
H
ÿ 0.50±0.1
0.6±0.1
L
0.0157 0.0275
0.037 REF
L1
b
0.940 REF
0.007
0.0106
0.177
0.090
0.270
1
1
e
0.0197 BSC
0.500 BSC
0.6±0.1
c
0.0035 0.0078
0.0196 REF
0.200
BOTTOM VIEW
0.498 REF
S
TOP VIEW
0∞
6∞
0∞
6∞
D2
E2
GAGE PLANE
A2
c
A
E1
b
L
A1
D1
L1
FRONT VIEW
SIDE VIEW
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 10L uMAX/uSOP
APPROVAL
DOCUMENT CONTROL NO.
REV.
1
21-0061
I
1
14 ______________________________________________________________________________________
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
______________________________________________________________________________________ 15
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
4X S
8
8
MILLIMETERS
INCHES
DIM MIN
MAX
MAX
MIN
-
-
0.043
0.006
0.037
0.014
0.007
0.120
1.10
0.15
0.95
0.36
0.18
3.05
A
0.002
0.030
0.010
0.005
0.116
0.05
0.75
0.25
0.13
2.95
A1
A2
b
E
H
ÿ 0.50±0.1
c
D
e
0.0256 BSC
0.65 BSC
0.6±0.1
E
H
0.116
0.188
0.016
0∞
0.120
2.95
4.78
0.41
0∞
3.05
5.03
0.66
6∞
0.198
0.026
6∞
L
1
1
0.6±0.1
S
0.0207 BSC
0.5250 BSC
D
BOTTOM VIEW
TOP VIEW
A1
A2
A
c
e
L
b
SIDE VIEW
FRONT VIEW
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 8L uMAX/uSOP
APPROVAL
DOCUMENT CONTROL NO.
REV.
1
21-0036
J
1
16 ______________________________________________________________________________________
Single/Dual/Quad, Low-Cost, SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
INCHES
MILLIMETERS
DIM
A
MIN
MAX
0.069
0.010
0.019
0.010
MIN
1.35
0.10
0.35
0.19
MAX
1.75
0.25
0.49
0.25
0.053
0.004
0.014
0.007
N
A1
B
C
e
0.050 BSC
1.27 BSC
E
0.150
0.228
0.016
0.157
0.244
0.050
3.80
5.80
0.40
4.00
6.20
1.27
E
H
H
L
VARIATIONS:
INCHES
1
MILLIMETERS
DIM
D
MIN
MAX
0.197
0.344
0.394
MIN
4.80
8.55
9.80
MAX
5.00
N
8
MS012
AA
TOP VIEW
0.189
0.337
0.386
D
8.75 14
10.00 16
AB
D
AC
D
C
A
B
0∞-8∞
e
A1
L
FRONT VIEW
SIDE VIEW
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, .150" SOIC
APPROVAL
DOCUMENT CONTROL NO.
REV.
1
21-0041
B
1
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 17
© 2002 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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