MAX4367EUA+ [MAXIM]
Audio Amplifier, 0.33W, 1 Channel(s), 1 Func, Bipolar, PDSO8, MICRO, MAX-8;
| 型号： | MAX4367EUA+ |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | Audio Amplifier, 0.33W, 1 Channel(s), 1 Func, Bipolar, PDSO8, MICRO, MAX-8 光电二极管 |
| 文件： | 总18页 (文件大小：600K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-2338; Rev 4; 11/05
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
General Description
Features
♦ Drives 330mW into 32Ω (200mW into 16Ω)
♦ 0.02% THD+N at 1kHz (120mW into 32Ω)
♦ Internal Bridged Configuration
The MAX4366/MAX4367/MAX4368 are bridged audio
power amplifiers intended for devices with internal
speakers and headsets. The MAX4366/MAX4367/
MAX4368 are capable of delivering 330mW of continu-
ous power into a 32Ω load, or 200mW into a 16Ω load
with 1% THD+N from a single 5V supply.
♦ No Output-Coupling Capacitors
♦ 2.3V to 5.5V Single-Supply Operation
♦ 2mA Supply Current
The MAX4366/MAX4367/MAX4368 bridged outputs elimi-
nate the need for output-coupling capacitors minimizing
external component count. The MAX4366/MAX4367/
MAX4368 also feature a low-power shutdown mode,
clickless power-up/power-down and internal DC bias
generation. The MAX4366 is a unity-gain stable, program-
mable gain amplifier. The MAX4367/MAX4368 feature
internally preset gains of 2V/V and 3V/V, respectively.
♦ Low-Power Shutdown Mode
♦ Clickless Power-Up and Shutdown
♦ Thermal Overload Protection
♦ Available in SOT23, TDFN, µMAX, and UCSP
Packages
All devices are available in space-saving 8-pin SOT23,
Ordering Information
®
TDFN, and µMAX packages, and an 8-bump chip-
PIN/BUMP-
PACKAGE
TOP
MARK
scale package (UCSP™).
PART
TEMP RANGE
Applications
MAX4366EBL-T -40°C to +85°C 8 UCSP-8
AAK
AAIO
—
Cellular Phones
Two-Way Radios
PDAs
MAX4366EKA-T -40°C to +85°C 8 SOT23-8
MAX4366EUA
-40°C to +85°C 8 µMAX
MAX4366ETA-T -40°C to +85°C 8 TDFN-8-EP*
MAX4366ETA+T -40°C to +85°C 8 TDFN-8-EP*
AFZ
+AFZ
Headphones
Headsets
*EP = Exposed paddle.
+Denotes lead-free package.
General-Purpose Audio
Ordering Information continued at end of data sheet.
Selector Guide and Functional Diagrams appear at end of
data sheet.
Typical Operating Circuit
Pin Configurations
TOP VIEW
(BUMP SIDE
DOWN)
V
CC
1
2
3
V
CC
SHDN
OUT-
CLICKLESS/POPLESS
SHUTDOWNCONTROL
A
OUT+
IN-
IN+
BIAS
B
MAX4366
MAX4367
MAX4368
V
GND
BIAS
CC
IN+
IN-
AUDIO
INPUT
OUT+
GND
C
OUT-
SHDN
MAX4367
MAX4368
UCSP
Pin Configurations continued at end of data sheet.
UCSP is a trademark and µMAX is a registered trademark of Maxim Integrated Products, Inc.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
ABSOLUTE MAXIMUM RATINGS
CC
IN+, IN-, BIAS, SHDN to GND....................-0.3V to (V
V
to GND..............................................................-0.3V to +6V
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering) (Note 2)
+ 0.3V)
CC
Output Short Circuit to V
or GND (Note 1).............Continuous
CC
Output Short Circuit (OUT+ to OUT-) (Note 1)...........Continuous
Continuous Power Dissipation (T = +70°C)
A
8-Bump UCSP (derate 4.7mW/°C above +70°C)..........379mW
8-Pin SOT23 (derate 9.7mW/°C above +70°C).............777mW
8-Pin µMAX (derate 4.5mW/°C above +70°C)..............362mW
8-Pin TDFN (derate 24.4mW°C above +70°C) ...........1951mW
Infrared (15s) ................................................................+220°C
Vapor Phase (60s) ........................................................+215°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
= 5V, R = ∞, R = R = 30kΩ, C
= 1µF to GND, SHDN = GND, IN+ = BIAS, T = T
to T
, unless otherwise noted.
CC
L
IN
F
BIAS
A
MIN
MAX
Typical values are at T = +25°C.) (Note 3)
A
PARAMETER
SYMBOL
CONDITIONS
Inferred from PSRR test
MIN
TYP
MAX
5.5
UNITS
V
Supply Voltage Range
Supply Current
V
2.3
1.8
CC
CC
I
(Note 4)
2
4.3
mA
µA
Shutdown Supply Current
I
SHDN = V
35
100
SHDN
CC
V
IH
SHDN Threshold
V
nA
V
V
0.8
IL
SHDN Input Bias Current
Common-Mode Bias Voltage
-400
V
/2
CC
V
/2
CC
V
(Note 5)
V
/2
CC
BIAS
- 5%
+ 5%
MAX4366, R = ∞
5
5
15
15
15
IN
Output Offset Voltage
V
mV
MAX4367, IN- = open
MAX4368, IN- = open
OS
5
7.5
100
2
MAX4366 (open loop)
MAX4367 (internally set)
MAX4368 (internally set)
dB
Differential Voltage Gain
A
(Note 6)
V
V/V
3
V
1.0
-
CC
Input Common-Mode Range
V
0.3
V
CM
Differential Input Resistance
Input Resistance
R
MAX4366, V
- V = 10mV
500
20
kΩ
kΩ
IN(DIFF)
IN+
IN-
V
- = 0V to V
(MAX4367/MAX4368)
IN
CC
T
T
= +25°C
70
66
80
A
A
V
5.5V
= 2.3V to
CC
Power-Supply Rejection Ratio
Common-Mode Rejection Ratio
PSRR
dB
dB
= T
to T
MAX
MIN
CMRR
0V ≤ V
≤ V
- 1.0V (MAX4366)
80
CM
CC
2.7V ≤ V
0.6V ≤ V
≤ 5.5V,
CC
87
125
≤ V
- 0.6V
- 0.6V
OUT
CC
Output Source/Sink Current
Output Power
I
(Note 7)
mA
OUT
2.3V ≤ V
0.6V ≤ V
≤ 2.7V,
CC
115
≤ V
OUT
CC
f = 1kHz,
THD+N <1%
(Note 8)
R = 16Ω
L
60
200
330
P
mW
O
R = 32Ω
L
120
2
_______________________________________________________________________________________
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
ELECTRICAL CHARACTERISTICS (continued)
(V
= 5V, R = ∞, R = R = 30kΩ, C
= 1µF to GND, SHDN = GND, IN+ = BIAS, T = T
to T
, unless otherwise noted.
CC
L
IN
F
BIAS
A
MIN
MAX
Typical values are at T = +25°C.) (Note 3)
A
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
A = -2V/V, f = 1kHz
THD+N (MAX4366)
(Notes 9 and 10)
V
P
P
= 60mW, R = 16Ω
0.04
0.02
O
O
L
Total Harmonic Distortion Plus
Noise
%
= 120mW, R = 32Ω
0.15
L
Noise
f = 10kHz, referred to input
To V
20
185
215
165
10
nV/√Hz
CC
Short-Circuit Current
I
t
mA
SC
To GND
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
Power-Up Time
°C
°C
60
ms
ms
ms
PU
Shutdown Time
t
20
SHDN
Enable Time from Shutdown
t
60
ENABLE
Note 1: Continuous power dissipation must also be observed.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
Note 3: All specifications are 100% tested at T = +25°C; temperature limits are guaranteed by design.
A
Note 4: Quiescent power-supply current is specified and tested with no load on the outputs. Quiescent power-supply current
depends on the offset voltage when a practical load is connected to the amplifier.
Note 5: Common-mode bias voltage is the voltage on BIAS and is nominally V /2.
CC
Note 6: Differential voltage gain for the MAX4366 is specified as an open-loop parameter because external resistors are used to set
the closed-loop gain. The MAX4367/MAX4368 contain internal feedback resistors that preset the differential voltage gain.
Differential voltage gain is defined as (V
- V
) / (V - V
). All gains are specified over an output voltage range of
BIAS
OUT+
OUT-
IN
0.6V ≤ V
≤ 4.4V.
OUT
Note 7: Specification applies to either output. An amplifier peak output current of 87mA is required to support an output load power
of 60mW for a 16Ω load, or 120mW for a 32Ω load.
Note 8: Output power specifications are inferred from the output current test. For 60mW into a 16Ω load, I
is 87mA and
is 2.77V per amplifier.
OUT(PEAK)
V
is 1.39V per amplifier. For 120mW into a 32Ω load, I
is 87mA and V
OUT(P-P)
OUT(PEAK)
OUT(P-P)
Note 9: Guaranteed by design. Not production tested.
Note 10: Measurement bandwidth for THD+N is 20Hz to 20kHz.
Note 11: Power-up and shutdown times are for the output to reach 90% of full scale with C
= 1µF.
BIAS
_______________________________________________________________________________________
3
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Typical Operating Characteristics
(Bridge-Tied Load, THD+N Bandwidth = 22Hz to 22kHz, C
= 1µF.)
BIAS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
1
1
1
V
= 5V
= 2V/V
CC
V
= 5V
= 3V/V
CC
A
V
A
V
R = 16Ω
L
P
OUT
= 10mW
R = 16Ω
L
P
= 10mW
OUT
P
OUT
= 10mW
0.1
0.1
0.1
P
OUT
= 25mW
P
OUT
= 25mW
P
= 60mW
P
= 25mW
OUT
OUT
0.01
0.001
0.01
0.001
0.01
0.001
P
OUT
= 60mW
P
= 60mW
100
OUT
V
CC
= 5V
A
= 4V/V
V
R = 16Ω
L
10
100
1k
FREQUENCY (Hz)
10k
100k
10
100
1k
FREQUENCY (Hz)
10k
100k
10
1k
FREQUENCY (Hz)
10k
100k
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
1
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
1
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
1
V
= 5V
= 2V/V
CC
V
= 5V
CC
A
V
A = 3V/V
V
R = 32Ω
L
R = 32Ω
L
P
= 10mW
OUT
0.1
0.1
0.1
P
= 25mW
OUT
P
= 60mW
OUT
P
= 50mW
OUT
P
= 50mW
OUT
0.01
0.001
0.01
0.001
0.01
0.001
P
= 75mW
OUT
P
= 75mW
OUT
V
= 5V
CC
P
= 120mW
P
= 120mW
1k
A
= 20V/V
OUT
OUT
V
R = 16Ω
L
10
100
1k
FREQUENCY (Hz)
10k
100k
10
100
1k
FREQUENCY (Hz)
10k
100k
10
100
10k
100k
FREQUENCY (Hz)
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
1
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
1
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
1
V
= 3V
= 2V/V
V
= 5V
= 4V/V
CC
CC
P
= 50mW
A
OUT
A
V
V
R = 16Ω
L
R = 32Ω
L
P
= 50mW
OUT
0.1
0.1
0.1
P
OUT
= 10mW
P
OUT
= 75mW
P
= 75mW
OUT
P
OUT
= 120mW
P
= 25mW
OUT
0.01
0.001
0.01
0.001
0.01
0.001
P
= 120mW
P
= 60mW
OUT
OUT
V
= 5V
CC
A
= 20V/V
V
R = 32Ω
L
10
100
1k
FREQUENCY (Hz)
10k
100k
10
100
1k
FREQUENCY (Hz)
10k
100k
10
100
1k
FREQUENCY (Hz)
10k
100k
4
_______________________________________________________________________________________
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Typical Operating Characteristics (continued)
(Bridge-Tied Load, THD+N Bandwidth = 22Hz to 22kHz, C
= 1µF.)
BIAS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
1
1
1
V
= 3V
CC
A
= 3V/V
P
OUT
= 10mW
V
L
R = 16Ω
P
= 60mW
OUT
P
OUT
= 25mW
0.1
P
OUT
= 10mW
0.1
0.1
P
= 10mW
OUT
P
= 25mW
OUT
P
= 60mW
OUT
P
OUT
= 25mW
0.01
0.001
0.01
0.001
0.01
0.001
P
= 60mW
OUT
V
= 3V
= 4V/V
V
CC
= 3V
CC
A
A = 20V/V
V
V
R = 16Ω
L
R = 16Ω
L
10
100
1k
FREQUENCY (Hz)
10k
100k
10
100
1k
FREQUENCY (Hz)
10k
100k
10
100
1k
FREQUENCY (Hz)
10k
100k
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
1
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
1
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
1
V
= 3V
= 2V/V
V
= 3V
CC
V
= 3V
= 4V/V
CC
CC
A
A = 3V/V
A
V
V
V
R = 32Ω
L
R = 32Ω
L
R = 32Ω
L
P
OUT
= 10mW
P
= 10mW
OUT
P
OUT
= 10mW
0.1
0.1
0.1
P
OUT
= 25mW
P
OUT
= 25mW
P
= 25mW
OUT
0.01
0.001
0.01
0.001
0.01
0.001
P
= 50mW
OUT
P
= 50mW
OUT
100
P
= 50mW
OUT
10
100
1k
10k
100k
10
1k
FREQUENCY (Hz)
10k
100k
10
100
1k
10k
100k
FREQUENCY (Hz)
FREQUENCY (Hz)
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. FREQUENCY
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. OUTPUT POWER
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. OUTPUT POWER
1
100
100
P
= 10mW
OUT
P
= 25mW
OUT
10
10
f = 10kHz
0.1
0.01
1
1
f = 10kHz
P
= 50mW
OUT
f = 1kHz
0.1
0.1
V
= 3V
V
= 5V
= 2V/V
V
= 5V
= 4V/V
0.01
0.001
CC
0.01
0.001
CC
CC
f = 1kHz
A
= 20V/V
A
A
V
V
V
R = 32Ω
L
R = 16Ω
L
R = 16Ω
L
0.001
10
100
1k
FREQUENCY (Hz)
10k
100k
0
100
200
300
400
0
100
200
300
400
OUTPUT POWER (mW)
OUTPUT POWER (mW)
_______________________________________________________________________________________
5
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Typical Operating Characteristics (continued)
(Bridge-Tied Load, THD+N Bandwidth = 22Hz to 22kHz, C
= 1µF.)
BIAS
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. OUTPUT POWER
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. OUTPUT POWER
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. OUTPUT POWER
100
100
100
V
CC
= 5V
V
= 3V
= 2V/V
CC
A
= 2V/V
V
L
A
V
R = 32Ω
10
10
10
R = 16Ω
L
1
1
1
f = 10kHz
f = 10kHz
0.1
0.1
0.1
f = 10kHz
f = 1kHz
V
= 5V
= 4V/V
0.01
0.001
0.01
0.001
0.01
0.001
CC
f = 1kHz
100
A
V
f = 1kHz
75
R = 32Ω
L
0
100
200
300
400
0
200
300
400
0
150
225
300
OUTPUT POWER (mW)
OUTPUT POWER (mW)
OUTPUT POWER (mW)
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. OUTPUT POWER
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. OUTPUT POWER
TOTAL HARMONIC DISTORTION PLUS NOISE
vs. OUTPUT POWER
100
100
100
V
= 3V
CC
A
= 2V/V
V
L
f = 10kHz
10
10
10
R = 32Ω
f = 10kHz
1
1
1
f = 10kHz
0.1
0.1
0.1
V
= 3V
= 4V/V
V
= 3V
CC
0.01
0.001
f = 1kHz
0.01
0.001
0.01
0.001
CC
f = 1kHz
A
A = 4V/V
V
V
f = 1kHz
R = 16Ω
L
R = 32Ω
L
0
75
150
225
300
0
75
150
225
300
0
75
150
225
300
OUTPUT POWER (mW)
OUTPUT POWER (mW)
OUTPUT POWER (mW)
OUTPUT POWER vs. SUPPLY VOLTAGE
OUTPUT POWER vs. SUPPLY VOLTAGE
500
400
300
200
100
0
600
R = 32Ω
L
R = 16Ω
L
500
400
THD+N = 10%
THD+N = 10%
300
200
100
0
THD+N = 1%
THD+N = 1%
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.5
3.0
3.5
4.0
4.5
5.0
5.5
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
6
_______________________________________________________________________________________
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Typical Operating Characteristics (continued)
(Bridge-Tied Load, THD+N Bandwidth = 22Hz to 22kHz, C
= 1µF.)
BIAS
OUTPUT POWER vs. LOAD
OUTPUT POWER vs. LOAD
450
250
200
150
100
50
400
THD+N = 10%
THD+N = 10%
A
= 20V/V
A
= 20V/V
V
V
350
300
250
200
150
100
50
THD+N = 1%
THD+N = 1%
= 2V/V
A
= 2V/V
V
A
V
V
= 5V
V
CC
= 3V
CC
f = 1kHz
f = 1kHz
0
0
10
100
1k
10k
10
100
1k
10k
LOAD RESISTANCE (Ω)
LOAD RESISTANCE (Ω)
POWER DISSIPATION vs. OUTPUT POWER
POWER DISSIPATION vs. OUTPUT POWER
500
400
300
200
100
0
200
150
V
A
= 5V
= 2V/V
V
A
= 3V
= 2V/V
CC
V
CC
V
R = 16Ω
L
R = 16Ω
L
100
R = 32Ω
50
0
L
R = 32Ω
L
0
50
100
150
200
0
20
40
60
80
100
OUTPUT POWER (mW)
OUTPUT POWER (mW)
POWER DISSIPATION vs. OUTPUT POWER
GAIN AND PHASE vs. FREQUENCY
200
150
100
50
80
60
40
20
0
-20
-40
-60
-80
-100
-120
-140
-160
-180
V
A
= 5V
= 2V/V
CC
V
GAIN
SINGLE ENDED
R = 16Ω
L
PHASE
V
A
= 5V
= 1000V/V
CC
V
R = 32Ω
L
SINGLE ENDED
NO LOAD
0
0
10
20
30
40
50
100
1k
10k
100k
1M
10M 100M
OUTPUT POWER (mW)
FREQUENCY (Hz)
_______________________________________________________________________________________
7
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Typical Operating Characteristics (continued)
(Bridge-Tied Load, THD+N Bandwidth = 22Hz to 22kHz, C
= 1µF.)
BIAS
DIFFERENTIAL POWER-SUPPLY
REJECTION RATIO vs. FREQUENCY
SUPPLY CURRENT vs. SUPPLY VOLTAGE
2.5
2.0
1.5
1.0
0.5
0
0
-10
-20
-30
-40
V
= 3V
CC
-50
-60
-70
-80
V
= 5V
CC
0
1
2
3
4
5
10
100
1k
10k
100k
1M
SUPPLY VOLTAGE (V)
FREQUENCY (Hz)
SHUTDOWN SUPPLY CURRENT
vs. SUPPLY VOLTAGE
SUPPLY CURRENT vs. TEMPERATURE
3.0
2.5
2.0
1.5
1.0
0.5
0
45
40
35
30
25
20
15
10
5
V
CC
= 5V
V
= 3V
CC
0
-40
-15
10
35
60
85
0
1
2
3
4
5
TEMPERATURE (°C)
SUPPLY VOLTAGE (V)
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
50
45
40
35
30
25
20
15
10
5
V
CC
= 5V
V
= 3V
CC
0
-40
-15
10
35
60
85
TEMPERATURE (°C)
8
_______________________________________________________________________________________
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Pin Description
PIN/BUMP
NAME
FUNCTION
SOT23/
µMAX
TDFN
UCSP
C3
1
1
2
SHDN
BIAS
Active-High Shutdown. Connect SHDN to GND for normal operation.
DC Bias Bypass. See BIAS Capacitor section for capacitor selection. Connect
2
C1
C
capacitor from BIAS to GND.
BIAS
3
4
3
4
A3
A1
A2
B3
B1
C2
—
IN+
IN-
Noninverting Input
Inverting Input
5
5
OUT+
Bridged Amplifier Positive Output
Power Supply
6
6
V
CC
7
7
GND
OUT-
EP
Ground
8
8
Bridged Amplifier Negative Output
Exposed Paddle. Connect exposed pad to GND.
—
EP
Detailed Description
The MAX4366/MAX4367/MAX4368 bridged audio
power amplifiers can deliver 330mW into a 32Ω load, or
200mW into a 16Ω load, while operating from a single
5V supply. These devices consist of two high-output-
current op amps configured as a bridge-tied load (BTL)
amplifier (see Functional Diagram). The closed-loop
gain of the input op amp sets the single-ended gain of
the device. Two external resistors set the gain of the
MAX4366 (see Gain-Setting Resistors section). The
MAX4367/MAX4368 feature internally fixed gains of
2V/V and 3V/V, respectively. The output of the first
amplifier serves as the input to the second amplifier,
which is configured as an inverting unity-gain follower
in all three devices. This results in two outputs, identical
in magnitude, but 180° out of phase.
OUT+
+1
-1
RL
2 x OUT
OUT-
Figure 1. Bridge-Tied Load Configuration
high disables the device’s bias circuitry and drives
OUT+, OUT-, and BIAS to GND. Connect SHDN to
GND for normal operation.
Applications Information
BIAS
The MAX4366/MAX4367/MAX4368 feature an internally
Bridge-Tied Load
The MAX4366/MAX4367/MAX4368 are designed to
drive a load differentially, a configuration referred to as
bridge-tied load (BTL). The BTL configuration (Figure 1)
offers advantages over the single-ended configuration,
where one side of the load is connected to ground.
Driving the load differentially doubles the output volt-
age compared to a single-ended amplifier under similar
conditions. The differential gain of the device is twice
the closed-loop gain of the input amplifier. The effective
gain of the MAX4366 is given by:
generated common-mode bias voltage of V /2 refer-
CC
enced to GND. BIAS provides both click-and-pop sup-
pression and the DC bias level for the audio signal.
BIAS is internally connected to the noninverting input of
one amplifier, and should be connected to the nonin-
verting input of the other amplifier for proper signal
biasing (Typical Application Circuit). Choose the value
of the bypass capacitor as described in the BIAS
Capacitor section.
Shutdown
The MAX4366/MAX4367/MAX4368 feature a 35µA, low-
power shutdown mode that reduces quiescent current
consumption and extends battery life. Pulling SHDN
RF
AVD = 2 ×
R
IN
_______________________________________________________________________________________
9
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
The effective gains of the MAX4367 and MAX4368 are
= 2V/V and A = 3V/V respectively. Substituting 2
In single-ended mode, the load must be capacitively
coupled to the device output to block the half-supply
DC voltage from the load (see Output Coupling
Capacitor section). Leave the unused output floating.
A
VD
x V
VD
for V
into the following equations
OUT(P-P)
OUT(P-P)
yields four times the output power due to doubling of
the output voltage.
Power Dissipation
Under normal operating conditions, linear power ampli-
fiers like the MAX4366/MAX4367/MAX4368 can dissi-
pate a significant amount of power. The maximum
power dissipation for each package is given in the
Absolute Maximum Ratings section under Continuous
Power Dissipation or can be calculated by the following
equation:
V
OUT(P−P)
V
=
=
RMS
2 2
2
V
RMS
P
OUT
R
L
Since the differential outputs are biased at midsupply,
there is no net DC voltage across the load. This elimi-
nates the need for DC-blocking capacitors required for
single-ended amplifiers. These capacitors can be
large, expensive, consume board space, and degrade
low-frequency performance.
T
J(MAX) -TA
PDISS(MAX)
=
ΘJA
where T
is +150°C and T is the reciprocal of the
J(MAX)
A
derating factor in °C/W as specified in the Absolute
Single-Ended Configuration
The MAX4366/MAX4367/MAX4368 can be used as sin-
gle-ended amplifiers (Figure 2). The gain of the device
in single-ended mode is 1/2 the gain in BTL configura-
tion and the output power is reduced by a factor of 4.
The single-ended gains of the MAX4367 and MAX4368
are 1V/V and 1.5V/V, respectively. Set the MAX4366
gain according to the Gain-Setting Resistors section.
5
OUT+
COUT
RL
MAX4367
8
OUT-
Figure 2. MAX4367 Single-Ended Configuration
V
CC
6
CLICKLESS/
V
CC
SHDN
OUT-
1
8
POPLESS
SHUTDOWN
CONTROL
50kΩ
BIAS
2
C
BIAS
50kΩ
10kΩ
3
4
IN+
IN-
10kΩ
OUT+
GND
5
7
C
IN
R
IN
AUDIO INPUT
MAX4366
R
F
Figure 3. MAX4366 Typical Application Circuit
10 ______________________________________________________________________________________
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
V
CC
6
CLICKLESS/
POPLESS
SHUTDOWN
CONTROL
V
CC
SHDN
OUT-
1
8
50kΩ
50kΩ
2
BIAS
C
BIAS
10kΩ
3
4
IN+
IN-
10kΩ
OUT+
GND
5
7
C
IN
R
IN
AUDIO
INPUT
MAX4367
MAX4368
R
F
MAX4367: R = R = 20kΩ
IN
F
MAX4368: R = 20kΩ, R = 30kΩ
IN
F
PIN NUMBERS REFER TO SOT23, TDFN, AND µMAX PACKAGES
Figure 4. MAX4367/MAX4368 Typical Application Circuit
Maximum Ratings section. For example, Θ of a µMAX
Component Selection
JA
package is 222°C/W.
Gain-Setting Resistors
The increase in power delivered by the BTL configura-
tion directly results in an increase in internal power dis-
sipation over the single-ended configuration. If the
power dissipation exceeds the maximum allowed for a
External feedback components set the gain of the
MAX4366. Resistors R and R (Figure 3) set the gain
F
IN
of the input amplifier as follows:
given package, either reduce V , increase load
CC
R
F
A
= 2
VD
impedance, decrease the ambient temperature, or add
heat sinking to the device. Large output, supply, and
ground traces improve the maximum power dissipation
in the package.
R
IN
The gain of the device in a single-ended configuration
is half the gain of the BTL case. Choose R between
F
Thermal overload protection limits total power dissipa-
tion in the MAX4366/MAX4367/MAX4368. When the
junction temperature exceeds +165°C, the thermal pro-
tection circuitry disables the amplifier output stage. The
amplifiers are re-enabled once the junction temperature
cools by +10°C. This results in a pulsing output under
continuous thermal overload conditions avoiding dam-
age to the port.
10kΩ and 50kΩ. The gains of the MAX4367/MAX4368
are set internally (Figure 4).
Input Filter
The input capacitor (C ), in conjunction with R forms
IN
IN
a highpass filter that removes the DC bias from an
incoming signal. The AC-coupling capacitor allows the
amplifier to bias the signal to an optimum DC level.
Assuming zero source impedance, the -3dB point of
the highpass filter is given by:
1
f
=
-3dB
2πR C
IN IN
______________________________________________________________________________________ 11
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Choose R according to the Gain-Setting Resistors
IN
section. Choose the C such that f
the lowest frequency of interest. Setting f
affects the low-frequency response of the system.
is well below
-3dB
IN
-3dB
too high
TIP
(SIGNAL)
SLEEVE
(GND)
Other considerations when designing the input filter
include the constraints of the overall system, the actual
frequency band of interest and click-and-pop suppres-
sion. Although high-fidelity audio calls for a flat-gain
response between 20Hz and 20kHz, portable voice-
reproduction devices such as cellular phones and two-
way radios need only concentrate on the frequency
range of the spoken human voice (typically 300Hz to
3.5kHz). In addition, speakers used in portable devices
typically have a poor response below 150Hz. Taking
these two factors into consideration, the input filter may
not need to be designed for a 20Hz to 20kHz response,
saving both board space and cost due to the use of
smaller capacitors.
Figure 5. Typical 2-Wire Headphone Plug
In addition to click-and-pop suppression and frequency
band considerations, the load impedance is another
concern when choosing C
. Load impedance can
OUT
vary, changing the -3dB point of the output filter. A
lower impedance increases the corner frequency,
BIAS Capacitor
The BIAS bypass capacitor, C
improves power-
BIAS
degrading low-frequency response. Select C
such
OUT
supply rejection ratio and THD+N by reducing power-
supply noise at the common-mode bias node, and
serves as the primary click-and-pop suppression
that the worst-case load/C
adequate response.
combination yields an
OUT
mechanism. C
is fed from an internal 25kΩ source,
BIAS
Clickless/Popless Operation
Proper selection of AC-coupling capacitors and C
and controls the rate at which the common-mode bias
voltage rises at startup and falls during shutdown. For
optimum click-and-pop suppression, ensure that the
BIAS
achieves clickless/popless shutdown and startup. The
value of C determines the rate at which the mid-rail
BIAS
input capacitor (C ) is fully charged (ten time con-
IN
bias voltage rises on startup and falls when entering
shutdown. The size of the input capacitor also affects
stants) before C
. The value of C
BIAS
for best click-
BIAS
and-pop suppression is given by:
clickless/popless operation. On startup, C is charged
IN
to its quiescent DC voltage through the feedback resis-
C R
25kΩ
IN IN
tor (R ) from the output. This current creates a voltage
F
C
≤10
BIAS
transient at the amplifier’s output, which can result in an
audible pop. Minimizing the size of C reduces this
IN
In addition, a larger C
value yields higher PSRR,
especially in single-ended applications.
BIAS
effect, improving click-and-pop suppression.
Supply Bypassing
Proper supply bypassing ensures low-noise, low-distor-
tion performance. Place a 0.1µF ceramic capacitor in par-
Output-Coupling Capacitor
The MAX4366/MAX4367/MAX4368 require output-cou-
pling capacitors only when configured as a single-
ended amplifier. The output capacitor blocks the DC
component of the amplifier output, preventing DC cur-
rent flowing to the load. The output capacitor and the
load impedance form a highpass filter with the -3dB
point determined by:
allel with a 10µF capacitor from V
to GND. Locate the
CC
bypass capacitors as close to the device as possible.
Headphone Applications
The MAX4366/MAX4368 can drive a mono headphone
when configured as a single-ended amplifier. Typical 2-
wire headphone plugs consist of a tip and sleeve. The tip
is the signal carrier while the sleeve is the ground con-
nection (Figure 5). Figure 6 shows the device configured
to drive headphones. OUT+ is connected to the tip,
delivering the signal to the headphone, while OUT-
remains unconnected.
1
f
=
-3dB
2πR C
L
OUT
As with the input capacitor, choose the output capacitor
(C ) such that f is well below the lowest frequen-
OUT
-3dB
cy of interest. Setting f
too high affects the low-
-3dB
frequency response of the system.
12 ______________________________________________________________________________________
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
OUT+
C
EARBUD SPEAKER
JACK
OUT
5
8
MAX4366
MAX4367
MAX4368
HEADPHONE JACK
OUT+
OUT-
COUT
MAX4366
MAX4367
MAX4368
OUT-
INTERNAL
LOUDSPEAKER
Figure 7. Headset with Internal Speaker Application Circuit
Figure 6. MAX4367 Headphone Application Circuit
tion passes the audio signal unattenuated. Setting the
wiper to the lowest position fully attenuates the input.
Use the 100kΩ version of the MAX5160.
Layout Considerations
Good layout improves performance by decreasing the
amount of stray capacitance and noise at the amplifi-
er’s inputs and outputs. Decrease stray capacitance by
minimizing PC board trace lengths, using surface-
mount components and placing external components
as close to the device as possible.
MAX5160
3 H
6 L
AUDIO
INPUT
5
8
OUT+
OUT-
W
5
4
IN-
MAX4367
MAX4368
CIN
UCSP Considerations
For general UCSP information and PC layout considera-
tions, please refer to the Maxim Application Note:
UCSP–A Wafer-Level Chip-Scale Package.
Figure 8. MAX4367/MAX5160 Volume Control Circuit
Wireless-Phone Headset Application
Many wireless telephones feature an earbud speaker/in-
line microphone combination for hands-free use. One
common solution is to use a BTL amplifier that drives the
internal speaker and an earplug jack that mutes the inter-
nal speaker by physically disconnecting OUT- when a
headset is plugged in (Figure 7). The headset is driven
single-endedly, requiring an output-coupling capacitor,
C , and resulting in a 4x reduction in output power.
OUT
Adding Volume Control
The addition of a digital potentiometer provides simple
volume control. Figure 8 shows the MAX4367/MAX4368
with the MAX5160 digital potentiometer used as an
input attenuator. Connect the high terminal of the
MAX5160 to the audio input, the low terminal to ground
and the wiper to C . Setting the wiper to the top posi-
IN
______________________________________________________________________________________ 13
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Ordering Information (continued)
Pin Configurations (continued)
PIN/BUMP-
PACKAGE
TOP
MARK
PART
TEMP RANGE
TOP VIEW
MAX4367EBL-T -40°C to +85°C 8 UCSP-8
AAL
AAIP
—
MAX4367EKA-T -40°C to +85°C 8 SOT23-8
8
7
6
5
SHDN
BIAS
IN+
1
2
3
4
8
7
6
5
OUT-
GND
MAX4367EUA
-40°C to +85°C 8 µMAX
MAX4367ETA-T -40°C to +85°C 8 TDFN-8-EP*
MAX4367ETA+T -40°C to +85°C 8 TDFN-8-EP*
MAX4368EBL-T -40°C to +85°C 8 UCSP-8
MAX4368EKA-T -40°C to +85°C 8 SOT23-8
AGA
+AGA
AAM
AAIQ
—
MAX4366
MAX4367
MAX4368
MAX4366
MAX4367
MAX4368
V
CC
*EXPOSED PAD.
CONNECT TO GND.
IN-
OUT+
2
3
1
4
MAX4368EUA
-40°C to +85°C 8 µMAX
SOT23/µMAX
MAX4368ETA-T -40°C to +85°C 8 TDFN-8-EP*
MAX4368ETA+T -40°C to +85°C 8 TDFN-8-EP*
AGB
+AGB
TDFN
(3mm x 3mm x 0.8mm)
*EP = Exposed paddle.
+Denotes lead-free package.
Selector Guide
PART
GAIN
External
2V/V
MAX4366
MAX4367
MAX4368
3V/V
14 ______________________________________________________________________________________
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Functional Diagrams
V
CC
V
CC
50kΩ
50kΩ
MAX4367
MAX4368
50kΩ
50kΩ
MAX4366
BIAS
BIAS
OUT-
OUT+
CLICKLESS/
POPLESS
OUT-
OUT+
SHDN
CLICKLESS/
POPLESS
SHUTDOWN
CONTROL
SHUTDOWN
CONTROL
SHDN
10kΩ
IN+
IN-
10kΩ
10kΩ
IN+
IN-
10kΩ
20kΩ
R *
F
GND
*R = 30kΩ (MAX4368)
F
F
GND
R = 20kΩ (MAX4367)
Chip Information
TRANSISTOR COUNT: 669
PROCESS: Bipolar
______________________________________________________________________________________ 15
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
SEE DETAIL "A"
SYMBOL
MIN
MAX
e
b
A
0.90
0.00
0.90
0.28
0.09
2.80
2.60
1.50
0.30
1.45
0.15
1.30
0.45
0.20
3.00
3.00
1.75
0.60
C
L
A1
A2
b
C
D
E
C
C
L
E1
L
E
E1
L
0.25 BSC.
L2
e
PIN 1
I.D. DOT
(SEE NOTE 6)
0.65 BSC.
1.95 REF.
0∞
e1
0
8∞
e1
D
C
C
L
L2
A2
A
GAUGE PLANE
A1
SEATING PLANE
C
0
L
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. FOOT LENGTH MEASURED FROM LEAD TIP TO UPPER RADIUS OF
HEEL OF THE LEAD PARALLEL TO SEATING PLANE C.
DETAIL "A"
3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH & METAL BURR.
4. PACKAGE OUTLINE INCLUSIVE OF SOLDER PLATING.
5. COPLANARITY 4 MILS. MAX.
6. PIN 1 I.D. DOT IS 0.3 MM ÿ MIN. LOCATED ABOVE PIN 1.
PROPRIETARY INFORMATION
TITLE:
7. SOLDER THICKNESS MEASURED AT FLAT SECTION OF LEAD
BETWEEN 0.08mm AND 0.15mm FROM LEAD TIP.
PACKAGE OUTLINE, SOT-23, 8L BODY
8. MEETS JEDEC MO178.
APPROVAL
DOCUMENT CONTROL NO.
REV.
1
21-0078
D
1
4X S
8
8
MILLIMETERS
INCHES
DIM MIN
MAX
MIN
-
MAX
0.043
0.006
0.037
-
1.10
0.15
0.95
0.36
0.18
3.05
A
0.002
0.030
0.010
0.005
0.116
0.05
0.75
0.25
0.13
2.95
A1
A2
b
0.014
0.007
0.120
E
H
Ø0.50±0.1
c
D
e
0.0256 BSC
0.65 BSC
0.6±0.1
E
H
0.116
0.188
0.016
0°
0.120
2.95
4.78
0.41
0°
3.05
5.03
0.66
6°
0.198
0.026
6°
L
1
1
α
S
0.6±0.1
0.0207 BSC
0.5250 BSC
D
BOTTOM VIEW
TOP VIEW
A1
A2
A
c
α
e
L
b
SIDE VIEW
FRONT VIEW
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 8L uMAX/uSOP
APPROVAL
DOCUMENT CONTROL NO.
REV.
1
21-0036
J
1
16 ______________________________________________________________________________________
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
D2
D
A2
PIN 1 ID
N
0.35x0.35
b
[(N/2)-1] x e
REF.
PIN 1
INDEX
AREA
E
E2
DETAIL A
e
A1
k
C
C
L
L
A
L
L
e
e
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
1
-DRAWING NOT TO SCALE-
21-0137
G
2
COMMON DIMENSIONS
SYMBOL
MIN.
0.70
2.90
2.90
0.00
0.20
MAX.
0.80
3.10
3.10
0.05
0.40
A
D
E
A1
L
k
0.25 MIN.
0.20 REF.
A2
PACKAGE VARIATIONS
DOWNBONDS
ALLOWED
PKG. CODE
T633-1
N
6
D2
E2
e
JEDEC SPEC
b
[(N/2)-1] x e
1.90 REF
1.90 REF
1.95 REF
1.95 REF
1.95 REF
2.00 REF
2.40 REF
2.40 REF
1.50±0.10 2.30±0.10 0.95 BSC
1.50±0.10 2.30±0.10 0.95 BSC
1.50±0.10 2.30±0.10 0.65 BSC
1.50±0.10 2.30±0.10 0.65 BSC
1.50±0.10 2.30±0.10 0.65 BSC
MO229 / WEEA
MO229 / WEEA
MO229 / WEEC
MO229 / WEEC
MO229 / WEEC
0.40±0.05
0.40±0.05
0.30±0.05
0.30±0.05
0.30±0.05
NO
NO
T633-2
6
T833-1
8
NO
T833-2
8
NO
T833-3
8
YES
NO
T1033-1
T1433-1
T1433-2
10
14
14
1.50±0.10 2.30±0.10 0.50 BSC MO229 / WEED-3 0.25±0.05
1.70±0.10 2.30±0.10 0.40 BSC
1.70±0.10 2.30±0.10 0.40 BSC
- - - -
- - - -
0.20±0.05
0.20±0.05
YES
NO
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
2
-DRAWING NOT TO SCALE-
21-0137
G
2
Note: MAX4366/MAX4367/MAX4368 Package Code: T833-1
______________________________________________________________________________________ 17
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
PACKAGE OUTLINE, 3x3 UCSP
1
21-0093
J
1
Note: Bump B2 is not present.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
18 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2005 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products, Inc.
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