MAX6713ZEXS [MAXIM]
PLASTIC ENCAPSULATED DEVICES; 塑封器件
| 型号： | MAX6713ZEXS |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | PLASTIC ENCAPSULATED DEVICES |
| 文件： | 总8页 (文件大小：58K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX6713SEXS
Rev. A
RELIABILITY REPORT
FOR
MAX6713SEXS
PLASTIC ENCAPSULATED DEVICES
December 17, 2001
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX6713S successfully meets the quality and reliability standards required of all Maxim products. In
addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet
Maxim’s quality and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
IV. .......Die Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
......Attachments
I. Device Description
The MAX6713S is a microprocessor (µP) supervisory circuit used to monitor the power supplies in µP and digital
systems. It provides excellent circuit reliability and low cost by eliminating external components and adjustments
when used with +5.0V, +3.3V, +3.0V, or +2.5V-powered circuits. It also provides a debounced manual reset input.
This circuit asserts a reset signal whenever the VCC supply voltage declines below a preset threshold or whenever
manual reset is asserted. Reset remains asserted for at least 140ms after VCC has risen above the reset threshold or
when manual reset is asserted. Reset thresholds suitable for operation with a variety of supply voltages are available.
The MAX6713 has an open-drain output stage. The MAX6713S’s open-drain RESET-bar output requires a pull-up
resistor that can be connected to a voltage higher than VCC. The MAX6713S has an active-low reset output. The reset
comparator is designed to ignore fast transients on VCC, and the outputs are guaranteed to be in the correct logic
state for VCC down to 1V.
Low supply current makes the MAX6713S ideal for use in portable equipment. Thia device ia available in a 4-pin
SC70 package.
B. Absolute Maximum Ratings
Item
Rating
VCC to Gnd
-0.3V to +6V
-0.3V to +6V
-400C to +1250C
-650C to +1500C
+3000C
/RESETOUT to Gnd
Operating Temp Range
Storage Temp Range
Lead Temp Range (soldering, 10s)
Power Dissipation
4-Pin SC70
1245mW
Derates above +70°C
4-Pin SC70
3.1mW/°C
II. Manufacturing Information
A. Description/Function:
B. Process:
4-Pin SC70 Microprocessor Reset Circuits with Manual Reset Input
S8
C. Number of Device Transistors:
380
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
Oregon, USA
Malaysia
April, 2001
III. Packaging Information
A. Package Type:
B. Lead Frame:
4-Lead SC70
Alloy 42
C. Lead Finish:
Solder Plate
D. Die Attach:
Non-Conductive Expoxy
Gold (1.0 mil dia.)
Epoxy with silica filler
Buildsheet # 05-1601-0100
Class UL94-V0
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1
IV. Die Information
A. Dimensions:
30 x 30 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Aluminum/Copper/Silicon
None
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
.8 microns (as drawn)
.8 microns (as drawn)
5 mil. Sq.
SiO2
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
Jim Pedicord
Bryan Preeshl
(Reliablity Lab Manager)
(Executive Director of QA)
Kenneth Huening (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (l ) is calculated as follows:
l =
1
=
1.83
(Chi square value for MTTF upper limit)
MTTF
192 x 4389 x 180 x 2
Thermal acceleration factor assuming a 0.8eV activation energy
l = 6.79 x 10-9
l = 6.79 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs.
Maxim also performs weekly Burn-In on samples from production to assure the reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on lots exceeding this level. The following
Burn-In Schematic (Spec. #06-5033) shows the static circuit used for this test. Maxim also performs 1000 hour
life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1L).
B. Moisture Resistance Tests
Maxim evaluates pressure pot stress from every assembly process during qualification of each new
design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard
85°C/85%RH or HAST tests are performed quarterly per device/package family.
C. E.S.D. and Latch-Up Testing
The MS42-3 die type has been found to have all pins able to withstand a transient pulse of 2500V, per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±200mA.
Table 1
Reliability Evaluation Test Results
MAX6713S
S
EXS
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
SAMPLE
SIZE
NUMBER OF
FAILURES
Static Life Test (Note 1)
Ta = 135°C
Biased
DC Parameters
& functionality
160
0
Time = 192 hrs.
Moisture Testing (Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
DC Parameters
& functionality
100
77
0
0
85/85
Ta = 85°C
RH = 85%
Biased
DC Parameters
& functionality
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
DC Parameters
77
0
Note 1: Life Test Data may represent plastic D.I.P. qualification lots for the SC70 package.
Note 2: Generic package/process data
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A
Terminal B
(Each pin individually
connected to terminal A
with the other floating)
(The common combination
of all like-named pins
connected to terminal B)
All pins except VPS1 3/
All input and output pins
All VPS1 pins
1.
2.
All other input-output pins
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
a.
Pin combinations to be tested.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal
B. All pins except the one being tested and the ground pin(s) shall be open.
b.
Each pin individually connected to terminal A with respect to each different set of a combination of all
named power supply pins (e.g., V , or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins
SS1
except the one being tested and the power supply pin or set of pins shall be open.
c.
Each input and each output individually connected to terminal A with respect to a
combination of all the other input and output pins connected to terminal B. All pins except the input or
output pin being tested and the combination of all the other input and output pins shall be open.
TERMINAL C
R2
R1
S1
TERMINAL A
REGULATED
HIGH VOLTAGE
SUPPLY
DUT
S2
SHORT
SOCKET
C1
CURRENT
PROBE
(NOTE 6)
TERMINAL B
R = 1.5kW
C = 100pf
TERMINAL D
Mil Std 883D
Method 3015.7
Notice 8
ONCE PER SOCKET
ONCE PER BOARD
100 OHMS
+5V
700uA
1
2
3
4
8
7
6
5
0.1uF
8-DIP
DEVICES: MAX 941/809/810/823/824/825/803
MAX 6381/6835
MAX. EXPECTED CURRENT = 700uA AND 15uA
DRAWN BY: HAK TAN
NOTES: 15 uA FOR MAX 6381
DOCUMENT I.D. 06-5033
REVISION E
MAXIM TITLE: BI Circuit (MAX 6381/803/809/810/823/824/825/941/6835)
PAGE 2 OF 3
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