MAX8756ETI+T [MAXIM]

Dual Switching Controller;
MAX8756ETI+T
型号: MAX8756ETI+T
厂家: MAXIM INTEGRATED PRODUCTS    MAXIM INTEGRATED PRODUCTS
描述:

Dual Switching Controller

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19-3569; Rev 2; 4/07  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
General Description  
Features  
The MAX8716/MAX8717/MAX8756/MAX8757 are dual,  
step-down, interleaved, fixed-frequency, switch-mode  
power-supply (SMPS) controllers with synchronous rec-  
tification. The MAX8716/MAX8717/MAX8756/MAX8757  
are intended for main (5V/3.3V) power generation, while  
the MAX8756 is optimized for I/O power rails in battery-  
powered systems.  
o Fixed Switching Frequency  
200kHz, 300kHz, or 500kHz  
250kHz, 300kHz, or 400kHz (MAX8756 Only)  
o No Current-Sense Resistor Required  
o 40/60 Optimal Interleaving  
o Reduced Input-Capacitor Requirement  
o Output Voltage Fixed or Adjustable Outputs  
(Dual Mode™)  
Fixed-frequency operation with optimal interleaving min-  
imizes input ripple current from the lowest input voltages  
up to the 26V maximum input. Optimal 40/60 interleav-  
ing allows the input voltage to go down to 8.3V before  
duty-cycle overlap occurs in 5V/3.3V applications, com-  
pared to 180° out-of-phase regulators where the duty-  
cycle overlap occurs when the input drops below 10V.  
Accurate output current limit is achieved using a sense  
resistor. Alternatively, power dissipation can be  
reduced using lossless inductor current sensing.  
Independent ON/OFF controls and power-good signals  
allow flexible power sequencing. Soft-start reduces  
inrush current, while soft-stop gradually ramps the out-  
put voltage down preventing negative voltage dips.  
3.3V/5V Fixed or 1V to 5.5V Adjustable  
1.5V/1.8V Fixed or 1V to 2.3V Adjustable  
(MAX8756 Only)  
o 4V to 26V Input Range  
o Independently Selectable PWM, Skip, and Low-  
Noise Mode Operation  
o Soft-Start and Soft-Stop  
o 2V Precision Reference with 0.75% Accuracy  
o Independent Power-Good Outputs  
Ordering Information  
A low-noise mode maintains high light-load efficiency  
while keeping the switching frequency out of the audi-  
ble range.  
The MAX8716 is available in a 24-pin thin QFN pack-  
age, and the MAX8717/MAX8756/MAX8757 are avail-  
able in a 28-pin thin QFN package.  
PIN-  
PACKAGE  
PKG  
CODE  
PART  
TEMP RANGE  
24 Thin QFN  
4mm x 4mm  
MAX8716ETG  
-40°C to +85°C  
T2444-4  
T2444-4  
T2855-6  
24 Thin QFN  
4mm x 4mm  
MAX8716ETG+ -40°C to +85°C  
MAX8717ETI -40°C to +85°C  
Applications  
28 Thin QFN  
5mm x 5mm  
2 to 4 Li+ Cell Battery-Powered Devices  
Notebook and Subnotebook Computers  
PDAs and Mobile Communicators  
Main or I/O Power Supplies  
+Denotes a lead-free package.  
Ordering Information continued at end of data sheet.  
Dual Mode is a trademark of Maxim Integrated Products, Inc.  
Pin Configurations  
TOP VIEW  
TOP VIEW  
21 20 19 18 17 16 15  
18 17 16 15 14 13  
DH1  
22  
23  
14 DH2  
DH1 19  
BST1 20  
12 DH2  
11 BST2  
BST1  
BST2  
CSH2  
13  
12  
CSH1 24  
CSL1 25  
CSH1 21  
CSL1 22  
10 CSH2  
MAX8716ETG  
11 CSL2  
10 FB2  
9
8
7
CSL2  
MAX8717ETI  
MAX8756ETI+  
MAX8757ETI+  
FB1 23  
FB2  
FB1  
26  
27  
PGOOD1 24  
PGOOD2  
PGOOD1  
9
8
PGOOD2  
ILIM2  
+
ILIM1 28  
1
2
3
4
5
6
+
1
2
3
4
5
6
7
TQFN  
+
TQFN  
A " " SIGN WILL REPLACE THE FIRST PIN INDICATOR ON LEAD-FREE PACKAGES.  
________________________________________________________________ Maxim Integrated Products  
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at  
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
ABSOLUTE MAXIMUM RATINGS (Note 1)  
DD CC  
ON1, ON2, SKIP1, SKIP2, PGOOD1,  
V
, V , CSL1, CSH1, CSL2, CSH2 to AGND ......-0.3V to +6V  
REF Short Circuit to AGND.........................................Continuous  
REF Current ......................................................................+10mA  
PGOOD2 to AGND...............................................-0.3V to +6V  
FB1, FB2, ILIM1, ILIM2, FSEL to AGND...................-0.3V to +6V  
Continuous Power Dissipation (T = +70°C)  
24-Pin Thin QFN 4mm x 4mm (derate 20.8mW/°C  
A
REF to AGND..............................................-0.3V to (V  
+ 0.3V)  
above +70°C)..........................................................1666.7mW  
28-Pin Thin QFN 5mm x 5mm (derate 21.3mW/°C  
above +70°C)..........................................................1702.1mW  
Operating Temperature Range ...........................-40°C to +85°C  
Junction Temperature......................................................+150°C  
Storage Temperature Range.............................-65°C to +150°C  
Lead Temperature (soldering, 10s) .................................+300°C  
CC  
BST1, BST2 to AGND.............................................-0.3V to +36V  
LX1 to BST1..............................................................-6V to +0.3V  
LX2 to BST2..............................................................-6V to +0.3V  
DH1 to LX1 ..............................................-0.3V to (V  
DH2 to LX2 ..............................................-0.3V to (V  
DL1, DL2 to PGND .....................................-0.3V to (V  
+ 0.3V)  
+ 0.3V)  
+ 0.3V)  
BST1  
BST2  
DD  
AGND to PGND.....................................................-0.3V to +0.3V  
Note 1: For the 24-pin TQFN version, AGND and PGND refer to a single pin designated GND.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional  
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to  
absolute maximum rating conditions for extended periods may affect device reliability.  
ELECTRICAL CHARACTERISTICS  
(Circuit of Figure 1, V = 12V, FSEL = REF, SKIP_ = 0, V  
= V  
= V  
= V = 5V T = 0°C to +85°C, unless otherwise noted.  
CC DD , A  
IN  
ON_  
ILIM_  
Typical values are at T = +25°C.)  
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
INPUT SUPPLIES  
V
26  
5.5  
4.4  
4.2  
IN  
Input Voltage Range  
V
V
V
V
, V  
CC DD  
4.5  
3.9  
3.7  
BIAS  
V
V
rising  
falling  
4.15  
3.95  
CC  
CC  
V
Undervoltage-Lockout  
200mV typical  
hysteresis  
CC  
V
UVLO  
Threshold  
MAX8716, MAX8717,  
MAX8757  
CSL_ and FB_ forced  
above their regulation  
points  
0.8  
1
1.3  
1.8  
5
Quiescent Supply Current (V  
)
I
I
mA  
µA  
CC  
CC  
MAX8756  
CSL_ and FB_ forced above their regulation  
points  
Quiescent Supply Current (V  
)
DD  
< 1  
DD  
Shutdown Supply Current (V  
Shutdown Supply Current (V  
)
ON1 = ON2 = GND  
ON1 = ON2 = GND  
< 1  
< 1  
5
5
µA  
µA  
CC  
)
DD  
MAIN SMPS CONTROLLERS  
16/MAX857  
MAX8716, MAX8717,  
MAX8757  
V
= 6V to 26V,  
IN  
3.265  
1.484  
4.94  
3.30  
1.50  
3.365  
1.530  
5.09  
PWM1 Output Voltage in  
Fixed Mode  
V
V
SKIP1 = V  
zero to full load  
,
CC  
V
V
OUT1  
OUT2  
MAX8756  
MAX8716, MAX8717,  
MAX8757  
V
= 6V to 26V,  
IN  
5.00  
PWM2 Output Voltage in  
Fixed Mode  
SKIP2 = V  
zero to full load  
,
CC  
MAX8756  
1.778  
0.990  
1.800  
1.005  
1.832  
1.020  
V
= 6V to 26V, FB1 or FB2,  
duty factor = 20% to 80%  
IN  
Feedback Voltage in Adjustable  
Mode (Note 2)  
V
V
V
FB_  
V
= 6V to 26V, FB1 or FB2,  
IN  
0.995  
1.005  
1.015  
duty factor = 50%  
MAX8716, MAX8717,  
MAX8757  
1.0  
1.0  
5.5  
2.3  
Output-Voltage-Adjust Range  
Either SMPS  
MAX8756  
2
_______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
ELECTRICAL CHARACTERISTICS (continued)  
(Circuit of Figure 1, V = 12V, FSEL = REF, SKIP_ = 0, V  
= V  
= V  
= V = 5V T = 0°C to +85°C, unless otherwise noted.  
CC DD , A  
IN  
ON_  
ILIM_  
Typical values are at T = +25°C.)  
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
1.9  
TYP  
MAX  
2.1  
UNITS  
FB1, FB2 Fixed-Mode Threshold  
Voltage  
Dual Mode comparator  
FB1 = 1.1V, FB2 = 1.1V  
V
Feedback Input Leakage Current  
DC Load Regulation  
-0.1  
+0.1  
µA  
%
Either SMPS, SKIP_ = V , zero to full load  
-0.1  
CC  
Line-Regulation Error  
Either SMPS, 4V < V < 26V  
0.03  
%/V  
µA  
IN  
FB_ Input Bias Current  
I
V
= 0 to 5.5V  
FB_  
-0.1  
170  
+0.1  
230  
FB_  
MAX8716, MAX8717,  
MAX8757  
200  
FSEL = GND  
MAX8756  
215  
270  
250  
300  
285  
330  
Operating Frequency  
Maximum Duty Factor  
f
FSEL = REF (Note 3)  
kHz  
%
OSC  
MAX8716, MAX8717,  
MAX8757  
425  
500  
575  
460  
FSEL = V  
CC  
MAX8756  
340  
97.5  
97.5  
97.5  
400  
99  
FSEL = GND  
D
FSEL = REF (Note 3)  
99  
MAX  
FSEL = V  
(Note 4)  
99  
CC  
Minimum On-Time  
t
200  
ns  
%
ON(MIN)  
40  
SMPS1 to SMPS2 Phase Shift  
SMPS2 starts after SMPS1  
144  
Degrees  
Measured from the rising edge of ON_ to full  
scale, REF = 2V  
Soft-Start Ramp Time  
Soft-Stop Ramp Time  
t
2
4
ms  
ms  
SSTART  
Measured from the falling edge of ON_ to full  
scale  
t
SSTOP  
CURRENT LIMIT  
ILIM_ Adjustment Range  
Current-Limit Threshold (Fixed)  
0.5  
45  
V
V
REF  
V
_
V
V
V
_ - V  
_ - V  
_ - V  
_, ILIM_ = V  
(Note 3)  
50  
55  
mV  
LIMIT  
LIMIT  
CSH  
CSL  
CSL  
CC  
V
_ = 2.00V  
_ = 1.00V  
190  
94  
200  
100  
210  
106  
ILIM  
ILIM  
Current-Limit Threshold  
(Adjustable)  
V
_
_
mV  
mV  
%
CSH  
V
_, SKIP_ = ILIM_ = V  
CC  
CSH  
CSL  
-67  
-60  
-53  
14  
(Note 3)  
Current-Limit Threshold  
(Negative)  
V
NEG  
V
_ - V  
CSH  
_, SKIP_ = V , adjustable  
CC  
CSL  
-120  
mode, percent of current limit  
Current-Limit Threshold  
(Zero Crossing)  
V
V
_ - V  
CSH  
_, SKIP_ = GND or REF  
3
mV  
mV  
ZX  
CSL  
ILIM_ = V  
(Note 3)  
6
10  
CC  
V
_ - V  
_,  
CSH  
CSL  
With respect to  
current-limit  
threshold  
Idle Mode™ Threshold  
V
IDLE  
SKIP_ = GND  
20  
%
Idle Mode is a trademark of Maxim Integrated Products, Inc.  
_______________________________________________________________________________________  
3
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
ELECTRICAL CHARACTERISTICS (continued)  
(Circuit of Figure 1, V = 12V, FSEL = REF, SKIP_ = 0, V  
= V  
= V  
= V = 5V T = 0°C to +85°C, unless otherwise noted.  
CC DD , A  
IN  
ON_  
ILIM_  
Typical values are at T = +25°C.)  
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
2.5  
1
TYP  
5
MAX  
7.5  
4
UNITS  
MAX8716, MAX8717,  
MAX8757  
V
_ - V  
_
CSL  
CSH  
SKIP_ = REF  
ILIM_ = V (Note 3)  
mV  
MAX8756  
2.5  
10  
CC  
Low-Noise-Mode Threshold  
V
IDLE  
V
_ - V  
CSH  
_
CSL  
MAX8716, MAX8717,  
MAX8757  
SKIP_ = REF with  
respect to current-  
limit threshold  
%
MAX8756  
5
ILIM_ Leakage Current  
Reference Load Regulation  
Reference Sink Current  
REF Lockout Voltage  
0.1  
10  
µA  
mV  
µA  
V
ΔV  
I
= 0µA to 50µA  
REF  
REF  
10  
V
Rising edge, hysteresis = 50mV  
1.8  
REF(UVLO)  
FAULT DETECTION  
Output Overvoltage Trip  
Threshold  
Output Overvoltage  
Fault-Propagation Delay  
Output Undervoltage-Protection  
Trip Threshold  
Output Undervoltage  
Fault-Propagation Delay  
Output Undervoltage-Protection  
Blanking Time  
MAX8716/MAX8717/MAX8756 only  
11  
65  
15  
10  
19  
75  
%
µs  
%
50mV overdrive,  
MAX8716/MAX8717/MAX8756 only  
t
OVP  
With respect to error-comparator threshold  
50mV overdrive  
70  
t
10  
µs  
UVP  
t
From rising edge of ON_  
6144  
1/f  
OSC  
BLANK  
With respect to error-comparator threshold,  
hysteresis = 1%  
PGOOD_ Lower Trip Threshold  
-12.5  
-10  
10  
-8.0  
%
PGOOD_ Propagation Delay  
PGOOD_ Output Low Voltage  
PGOOD_ Leakage Current  
Thermal-Shutdown Threshold  
GATE DRIVERS  
t
_
_
Falling edge, 50mV overdrive  
µs  
V
PGOOD  
I
= 4mA  
0.4  
1
SINK  
I
High state, PGOOD_ forced to 5.5V  
Hysteresis = 15°C  
µA  
°C  
PGOOD  
T
+160  
SHDN  
16/MAX857  
DH_ Gate-Driver On-Resistance  
R
BST_ - LX_ forced to 5V (Note 5)  
DL_, high state  
1.5  
1.7  
0.6  
5
5
3
Ω
Ω
DH  
DL_ Gate-Driver On-Resistance  
(Note 5)  
R
DL  
DL_, low state  
DH_ Gate-Driver Source/Sink  
Current  
DH_ forced to 2.5V, BST_ - LX_ forced to  
5V  
I
2
A
DH  
I
DL  
(SOURCE)  
DL_ Gate-Driver Source Current  
DL_ Gate-Driver Sink Current  
DL_ forced to 2.5V  
1.7  
A
A
I
DL_ forced to 2.5V  
DL_ rising  
3.3  
35  
DL (SINK)  
Dead Time  
t
ns  
DEAD  
DH_ rising  
26  
LX_, BST_ Leakage Current  
V
_ = V _ = 26V  
< 2  
20  
µA  
BST  
LX  
4
_______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
ELECTRICAL CHARACTERISTICS (continued)  
(Circuit of Figure 1, V = 12V, FSEL = REF, SKIP_ = 0, V  
= V  
= V  
= V = 5V T = 0°C to +85°C, unless otherwise noted.  
CC DD , A  
IN  
ON_  
ILIM_  
Typical values are at T = +25°C.)  
A
PARAMETER  
INPUTS AND OUTPUTS  
Logic Input Current  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
ON1, ON2  
-1  
+1  
µA  
V
ON_ Input Voltage  
Rising edge, hysteresis = 225mV  
1.2  
1.7  
2.2  
V
0.2  
-
CC  
Tri-Level Input Logic  
SKIP1, SKIP2, FSEL, high  
V
Input Leakage Current  
Input Leakage Current  
Input Leakage Current  
Input Bias Current  
SKIP1, SKIP2, FSEL, 0V, or V  
-3  
+3  
+0.1  
+0.1  
50  
µA  
µA  
µA  
µA  
CC  
ILIM1, ILIM2, 0V, or V  
-0.1  
-0.1  
CC  
CSH_, 0V, or V  
DD  
DD  
CSL_, 0V, or V  
25  
ELECTRICAL CHARACTERISTICS  
(Circuit of Figure 1, V = 12V, FSEL = REF, SKIP_ = 0, V  
= V  
= V  
= V  
= 5V, T = -40°C to +85°C, unless otherwise  
DD A  
IN  
ON_  
ILIM_  
CC  
noted.) (Note 6)  
PARAMETER  
INPUT SUPPLIES  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
26  
IN  
Input Voltage Range  
V
V
V
, V  
CC DD  
4.5  
5.5  
BIAS  
MAX8716, MAX8717,  
MAX8757  
CSL_ and FB_  
forced above their  
regulation points  
1.3  
1.8  
5
Quiescent Supply Current (V  
Quiescent Supply Current (V  
)
I
mA  
µA  
CC  
CC  
MAX8756  
CSL_ and FB_ forced above their regulation  
points  
)
DD  
I
DD  
Shutdown Supply Current (V  
Shutdown Supply Current (V  
)
ON1 = ON2 = GND  
ON1 = ON2 = GND  
5
5
µA  
µA  
CC  
)
DD  
MAIN SMPS CONTROLLERS  
MAX8716, MAX8717,  
MAX8757  
V
= 6V to 26V,  
IN  
3.255  
1.480  
4.925  
1.773  
0.987  
3.375  
1.534  
5.105  
1.838  
1.023  
PWM1 Output Voltage in  
Fixed Mode  
V
V
SKIP1 = V  
zero to full load  
,
CC  
V
OUT1  
OUT2  
MAX8756  
MAX8716, MAX8717,  
MAX8757  
V
= 6V to 26V,  
IN  
PWM2 Output Voltage in  
Fixed Mode  
SKIP2 = V  
zero to full load  
,
V
V
V
CC  
MAX8756  
Feedback Voltage in  
Adjustable Mode  
V
= 6V to 26V, FB1 or FB2,  
IN  
duty factor = 20% to 80% (Note 1)  
V
FB_  
MAX8716, MAX8717,  
MAX8757  
MAX8756  
1.0  
1.0  
5.5  
2.3  
Output Voltage Adjust Range  
Either SMPS  
FB1, FB2 Fixed-Mode  
Threshold Voltage  
Dual Mode comparator  
1.9  
2.1  
V
_______________________________________________________________________________________  
5
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
ELECTRICAL CHARACTERISTICS (continued)  
(Circuit of Figure 1, V = 12V, FSEL = REF, SKIP_ = 0, V  
= V  
= V  
= V  
= 5V, T = -40°C to +85°C, unless otherwise  
DD A  
IN  
ON_  
ILIM_  
CC  
noted.) (Note 6)  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
MAX8716, MAX8717,  
MAX8757  
170  
230  
FSEL = GND  
FSEL = REF (Note 3)  
FSEL = V  
MAX8756  
215  
270  
285  
330  
Operating Frequency  
f
kHz  
OSC  
MAX8716, MAX8717,  
MAX8757  
425  
575  
460  
CC  
MAX8756  
340  
97.5  
97.5  
97.5  
FSEL = GND  
Maximum Duty Factor  
D
FSEL = REF (Note 3)  
%
MAX  
FSEL = V  
(Note 4)  
CC  
Minimum On-Time  
t
200  
ns  
ON(MIN)  
CURRENT LIMIT  
ILIM_ Adjustment Range  
Current-Limit Threshold (Fixed)  
0.5  
44  
V
V
REF  
V
_
_
V
V
_ - V  
_, ILIM_ = V (Note 3)  
CC  
56  
mV  
LIMIT  
LIMIT  
CSH  
CSL  
CSL  
V
V
_ = 2.00V  
_ = 1.00V  
188  
93  
212  
107  
ILIM  
ILIM  
Current-Limit Threshold  
(Adjustable)  
V
_ - V  
CSH  
_
mV  
V
REFERENCE (REF)  
Reference Voltage  
V
V
= 4.5V to 5.5V, I  
= 0  
1.98  
2.02  
REF  
CC  
REF  
FAULT DETECTION  
Output Overvoltage Trip Threshold  
MAX8716/MAX8717/MAX8756 only  
11  
65  
19  
75  
%
%
Output Undervoltage-Protection  
Trip Threshold  
With respect to error-comparator threshold  
With respect to error-comparator threshold,  
hysteresis = 1%  
PGOOD_ Lower Trip Threshold  
-12.5  
-8.0  
0.4  
%
V
PGOOD_ Output Low Voltage  
GATE DRIVERS  
I
= 4mA  
SINK  
DH_ Gate-Driver On-Resistance  
R
BST_ - LX_ forced to 5V (Note 5)  
DL_, high state  
5
5
3
Ω
Ω
DH  
DL_ Gate-Driver On-Resistance  
(Note 5)  
16/MAX857  
R
DL  
DL_, low state  
INPUTS AND OUTPUTS  
ON_ Input Voltage  
Rising edge, hysteresis = 225mV  
High  
1.2  
2.2  
V
V
V
-
CC  
0.2  
Tri-Level Input Logic  
SKIP1, SKIP2, FSEL  
REF  
1.7  
2.3  
0.5  
GND  
Note 2: When the inductor is in continuous conduction, the output voltage will have a DC regulation level lower than the error-com-  
parator threshold by 50% of the ripple. In discontinuous conduction, the output voltage will have a DC regulation level higher  
than the error-comparator threshold by 50% of the ripple.  
Note 3: Default setting for the MAX8716.  
Note 4: Specifications are guaranteed by design, not production tested.  
Note 5: Production testing limitations due to package handling require relaxed maximum on-resistance specifications for the thin QFN  
package.  
Note 6: Specifications from 0°C to -40°C are guaranteed by design, not production tested.  
6
_______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
Typical Operating Characteristics  
(Circuit of Figure 1, MAX8717, V = 12V, V  
IN  
= V  
= 5V, SKIP_ = GND, FSEL = REF, T = +25°C, unless otherwise noted.)  
CC A  
DD  
3.3V OUTPUT EFFICIENCY  
vs. LOAD CURRENT  
3.3V OUTPUT EFFICIENCY  
vs. LOAD CURRENT  
3.3V OUTPUT EFFICIENCY  
vs. LOAD CURRENT  
100  
100  
100  
SKIP  
MODE  
SKIP  
MODE  
SKIP  
MODE  
90  
80  
90  
80  
70  
60  
90  
80  
70  
60  
LOW-  
PWM  
NOISE  
MODE  
MODE  
70  
PWM  
MODE  
PWM  
MODE  
LOW-  
NOISE  
MODE  
LOW-  
NOISE  
MODE  
60  
V
= 12V  
V = 20V  
IN  
V
= 6V  
IN  
IN  
50  
50  
50  
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
LOAD CURRENT (A)  
1
10  
0.001  
0.01  
0.1  
LOAD CURRENT (A)  
1
10  
10  
10  
LOAD CURRENT (A)  
3.3V OUTPUT VOLTAGE  
vs. LOAD CURRENT  
5V OUTPUT EFFICIENCY  
vs. LOAD CURRENT  
5V OUTPUT EFFICIENCY  
vs. LOAD CURRENT  
3.40  
100  
100  
LOW-  
NOISE  
MODE  
SKIP  
MODE  
90  
80  
70  
60  
90  
80  
70  
60  
LOW-  
NOISE  
MODE  
3.35  
3.30  
3.25  
PWM  
MODE  
LOW-  
PWM  
SKIP  
MODE  
SKIP  
MODE  
NOISE  
MODE  
MODE  
PWM  
MODE  
V
= 12V  
V
= 6V  
V = 12V  
IN  
IN  
IN  
50  
50  
0
1
2
3
4
5
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
LOAD CURRENT (A)  
LOAD CURRENT (A)  
LOAD CURRENT (A)  
5V OUTPUT EFFICIENCY  
vs. LOAD CURRENT  
2.5V OUTPUT EFFICIENCY  
vs. LOAD CURRENT  
5V OUTPUT VOLTAGE  
vs. LOAD CURRENT  
100  
5.15  
5.10  
5.05  
5.00  
4.95  
100  
90  
80  
70  
60  
50  
V
= 12V  
IN  
L = 4.3μH  
SKIP  
MODE  
90  
80  
70  
60  
LOW-  
NOISE  
MODE  
SKIP  
MODE  
SKIP  
MODE  
PWM  
MODE  
PWM  
MODE  
LOW-  
NOISE  
MODE  
LOW-NOISE  
MODE  
PWM  
MODE  
V
= 20V  
V = 12V  
IN  
IN  
50  
0.001  
0.01  
0.1  
1
10  
0
1
2
3
4
5
0.001  
0.01  
0.1  
LOAD CURRENT (A)  
1
LOAD CURRENT (A)  
LOAD CURRENT (A)  
_______________________________________________________________________________________  
7
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
Typical Operating Characteristics (continued)  
(Circuit of Figure 1, MAX8717, V = 12V, V  
IN  
= V  
= 5V, SKIP_ = GND, FSEL = REF, T = +25°C, unless otherwise noted.)  
CC A  
DD  
1.8V OUTPUT EFFICIENCY  
NO-LOAD SUPPLY CURRENT vs. INPUT  
VOLTAGE (FORCED-PWM MODE)  
NO-LOAD SUPPLY CURRENT vs. INPUT  
VOLTAGE (IDLE MODE)  
vs. LOAD CURRENT  
100  
28  
10  
1
V
= 12V  
L = 3.2μH  
IN  
SKIP1 = SKIP2 = GND OR REF  
24  
20  
16  
12  
8
ON1 = ON2 = V  
CC  
90  
80  
70  
60  
50  
I
BIAS  
SKIP  
MODE  
I
BIAS  
PWM  
MODE  
I
IN  
I
IN  
0.1  
0.01  
LOW-NOISE  
MODE  
SKIP1 = SKIP2 = V  
CC  
4
ON1 = ON2 = V  
CC  
0
0.001  
0.01  
0.1  
LOAD CURRENT (A)  
1
10  
0
4
8
12  
16  
20  
24  
0
4
8
12  
16  
20  
24  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
OUT2 IDLE-MODE CURRENT  
vs. INPUT VOLTAGE  
OUT2 SWITCHING FREQUENCY  
vs. LOAD CURRENT  
5V OUTPUT VOLTAGE  
vs. INPUT VOLTAGE  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
1000  
100  
10  
5.05  
5.00  
4.95  
4.90  
MAXIMUM DUTY-  
CYCLE LIMITED  
SKIP2 = V  
CC  
SKIP2 = GND  
SKIP2 = REF  
SKIP2 = REF  
SKIP2 = GND  
SKIP2 = V  
CC  
1
0
4
8
12  
16  
20  
24  
0.001  
0.01  
0.1  
LOAD CURRENT (A)  
1
10  
0
4
8
12  
16  
20  
24  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
3.3V OUTPUT VOLTAGE  
vs. INPUT VOLTAGE  
OUT2 DROPOUT VOLTAGE  
vs. LOAD CURRENT  
16/MAX857  
3.40  
3.35  
3.30  
3.25  
0.4  
0.3  
0.2  
0.1  
0
V
= 4.8V  
OUT2  
SKIP1 = V  
CC  
0
4
8
12  
16  
20  
24  
0
1
2
3
4
5
INPUT VOLTAGE (V)  
LOAD CURRENT (A)  
8
_______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
Typical Operating Characteristics (continued)  
(Circuit of Figure 1, MAX8717, V = 12V, V  
IN  
= V  
= 5V, SKIP_ = GND, FSEL = REF, T = +25°C, unless otherwise noted.)  
CC A  
DD  
STARTUP WAVEFORMS  
SHUTDOWN WAVEFORMS  
STARTUP WAVEFORMS  
MAX8716/17/57 toc20  
MAX8716/17/57 toc18  
MAX8716/17/57 toc19  
3.3V  
0
5V  
0
5V  
A
A
A
B
12V  
B
C
0
B
0
0
2V  
5V  
C
0
C
2V  
5V  
D
E
5V  
D
0
0
F
E
F
0
0
0
0
0
0
D
E
400μs/div  
1ms/div  
1ms/div  
A. ON1/ON2, 5V/div  
B. PGOOD1, 10V/div  
C. PGOOD2, 10V/div  
A. LX2, 20V/div  
B. ON2, 10V/div  
D. REF, 2V/div  
E. OUT2, 2V/div  
F. I , 2.5AV/div  
LX2  
A. DL2, 10V/div  
B. ON2, 10V/div  
D. REF, 2V/div  
E. OUT2, 2V/div  
F. I , 2.5AV/div  
LX2  
D. OUT2, 2V/div  
E. OUT1, 2V/div  
C. PGOOD2, 10V/div  
C. PGOOD2, 10V/div  
1.0Ω LOAD ON OUT2  
1.0kΩ LOAD ON OUT2  
SKIP2 = GND  
V
CC  
UVLO WAVEFORMS  
STEADY-STATE WAVEFORMS  
DROPOUT WAVEFORMS  
MAX8716/17/57 toc23  
MAX8716/17/57 toc21  
MAX8716/17/57 toc22  
5V  
5V  
4.9V  
5V  
A
A
B
5V  
12V  
A
0
0
B
5V  
B
C
C
5V  
C
5V  
0
3.3V  
12V  
D
E
D
E
3.3V  
5V  
0
D
E
0
0
4ms/div  
2μs/div  
2μs/div  
A. V , 2V/div  
CC  
B. OUT2, 2V/div  
D. DL2, 5V/div  
E. I , 2.5AV/div  
A. OUT2, 50mV/div  
B. LX2, 10V/div  
D. OUT1, 50mV/div  
E. LX1, 10V/div  
A. OUT2, 50mV/div  
B. LX2, 10V/div  
D. OUT1, 50mV/div  
E. LX1, 10V/div  
LX2  
C. PGOOD2, 5V/div  
C. V , 50mV/div  
C. V , 50mV/div  
IN  
IN  
1.0A LOAD ON OUT1, 1.0A LOAD ON OUT2  
SKIP1 = V , SKIP2 = V  
100Ω LOAD ON OUT2  
SKIP2 = V  
CC  
1.0A LOAD ON OUT1, 1.0A LOAD ON OUT2  
SKIP1 = V , SKIP2 = V  
CC  
CC  
CC  
CC  
_______________________________________________________________________________________  
9
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
Typical Operating Characteristics (continued)  
(Circuit of Figure 1, MAX8717, V = 12V, V  
IN  
= V  
= 5V, SKIP_ = GND, FSEL = REF, T = +25°C, unless otherwise noted.)  
CC A  
DD  
SKIP1 TRANSITION  
SKIP1 TRANSITION  
MAX8716/17/57 toc26  
OUT1 LOAD TRANSIENT  
MAX8716/17/57 toc25  
MAX8716/17/57 toc24  
0
0
0
A
B
A
B
A
12V  
12V  
3.3V  
B
0
0
3A  
0
3.3V  
3.3V  
C
D
C
D
C
D
2.5A  
0
2.5A  
0
12V  
0
20μs/div  
20μs/div  
20μs/div  
A. CONTROL, 5V/div  
B. OUT1, 50mV/div  
A. SKIP1, 5V/div  
B. LX1, 10V/div  
C. OUT1, 50mV/div  
D. I , 2.5A/div  
LX1  
A. SKIP1, 5V/div  
B. LX1, 10V/div  
C. OUT1, 50mV/div  
D. I , 2.5A/div  
C. I , 3A/div  
LX1  
D. LX1, 10V/div  
LX1  
30mA LOAD ON OUT1  
30mA LOAD ON OUT1  
SKIP1 = V  
CC  
MAX8756 NO-LOAD SUPPLY CURRENT  
vs. INPUT VOLTAGE (FORCED-PWM MODE)  
MAX8756 NO-LOAD SUPPLY CURRENT  
vs. INPUT VOLTAGE (IDLE MODE)  
SKIP1 TRANSITION  
MAX8716/17/57 toc27  
28  
10  
1
ON1 = ON2 = V  
CC  
A
B
0
24  
20  
16  
12V  
0
I
BIAS  
I
BIAS  
0.1  
12  
8
3.3V  
C
D
I
IN  
I
IN  
SKIP_ = GND  
0.01  
0.001  
2.5A  
0
I
IN  
4
SKIP1 = SKIP2 = V  
ON1 = ON2 = V  
CC  
SKIP_ = REF  
CC  
0
0
4
8
12  
16  
20  
24  
0
4
8
12  
16  
20 24  
20μs/div  
A. SKIP1, 5V/div  
B. LX1, 10V/div  
C. OUT1, 50mV/div  
D. I , 2.5A/div  
INPUT VOLTAGE (V)  
INPUT VOLTAGE (V)  
LX1  
16/MAX857  
30mA LOAD ON OUT1  
MAX8756 OUT2 IDLE MODE CURRENT  
vs. INPUT VOLTAGE  
2.0  
1.8  
1.6  
1.4  
SKIP2 = GND  
SKIP2 = REF  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0
4
8
12  
16  
20  
24  
INPUT VOLTAGE (V)  
10 ______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
Pin Description  
PIN  
MAX8717/  
MAX8756/  
MAX8757  
NAME  
FUNCTION  
MAX8716  
Analog Supply Input. Connect to the system supply voltage (+4.5V to +5.5V) through a  
series 20 resistor. Bypass V to AGND with a 1μF or greater ceramic capacitor.  
CC  
1
2
1
2
V
CC  
Low-Noise Mode Control for SMPS1. Connect SKIP1 to GND for normal Idle Mode  
(pulse-skipping) operation or to V for PWM mode (fixed frequency). Connect to REF  
CC  
for low-noise mode.  
SKIP1  
REF  
2.0V Reference Voltage Output. Bypass REF to AGND with a 0.1μF or greater ceramic  
capacitor. The reference can source up to 50μA. Loading REF degrades output voltage  
accuracy according to the REF load-regulation error (see the Typical Operating  
Characteristics). The reference shuts down when both ON1 and ON2 are low.  
3
4
3
4
Low-Noise Mode Control for SMPS2. Connect SKIP2 to GND for normal Idle Mode  
(pulse-skipping) operation or to V for PWM mode (fixed frequency). Connect to REF  
CC  
SKIP2  
for low-noise mode.  
Frequency Select Input. This four-level logic input sets the controller’s switching  
frequency.  
MAX8717/MAX8757 (kHz)  
MAX8756 (kHz)  
FSEL  
5
FSEL  
500  
300  
200  
400  
300  
250  
V
CC  
REF  
GND  
SMPS1 Enable Input. Drive ON1 high to enable SMPS1. Drive ON1 low to shut down  
SMPS1.  
5
6
6
7
ON1  
ON2  
SMPS2 Enable Input. Drive ON2 high to enable SMPS2. Drive ON2 low to shut down  
SMPS2.  
SMPS2 Peak Current-Limit Threshold Adjustment. Connect ILIM2 to V to enable the  
CC  
default 50mV current-limit threshold. In adjustable mode, the current-limit threshold across  
CSH2 and CSL2 is precisely 1/10 the voltage seen at ILIM2 over a 500mV to 2.0V range.  
8
ILIM2  
The logic threshold for switchover to the 50mV default value is approximately V  
- 1V.  
CC  
SMPS2 Open-Drain Power-Good Output. PGOOD2 is low when SMPS2 is more than 10%  
below its regulation threshold, during soft-start, and in shutdown.  
7
8
9
PGOOD2  
FB2  
Feedback Input for SMPS2. Connect FB2 to V for fixed 5V output for the  
CC  
MAX8716/MAX8717/MAX8757, or a fixed 1.8V for the MAX8756. In adjustable mode,  
FB2 regulates to 1V.  
10  
Negative Current-Sense Input for SMPS2. Connect to the negative terminal of the  
current-sense element. Figure 8 describes two different current-sensing options.  
9
11  
12  
CSL2  
CSH2  
Positive Current-Sense Input for SMPS2. Connect to the positive terminal of the current-  
sense element. Figure 8 describes two different current-sensing options.  
10  
Boost Flying Capacitor Connection for SMPS2. Connect to an external capacitor and  
diode as shown in Figure 1. An optional resistor in series with BST2 allows the DH2  
turn-on current to be adjusted.  
11  
13  
BST2  
12  
13  
14  
15  
DH2  
LX2  
High-Side Gate-Driver Output for SMPS2. DH2 swings from LX2 to BST2.  
Inductor Connection for SMPS2. Connect LX2 to the switched side of the inductor. LX2  
is the lower supply rail for the DH2 high-side gate driver.  
______________________________________________________________________________________ 11  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
Pin Description (continued)  
PIN  
MAX8717/  
MAX8756/  
MAX8757  
NAME  
FUNCTION  
MAX8716  
14  
15  
16  
17  
16  
17  
18  
19  
20  
DL2  
Low-Side Gate-Driver Output for SMPS2. DL2 swings from PGND to V  
DD.  
V
Supply Voltage Input for the DL_ Gate Drivers. Connect to a 5V supply.  
Power and Analog Ground. Connect backside pad to GND.  
Power Ground  
DD  
GND  
PGND  
AGND  
DL1  
Analog Ground. Connect backside pad to AGND.  
Low-Side Gate-Driver Output for SMPS1. DL1 swings from PGND to V  
DD.  
Inductor Connection for SMPS1. Connect LX1 to the switched side of the inductor. LX1  
is the lower supply rail for the DH1 high-side gate driver.  
18  
19  
21  
22  
LX1  
DH1  
High-Side Gate-Driver Output for SMPS1. DH1 swings from LX1 to BST1.  
Boost Flying Capacitor Connection for SMPS1. Connect to an external capacitor and  
diode as shown in Figure 1. An optional resistor in series with BST1 allows the DH1 turn-  
on current to be adjusted.  
20  
23  
BST1  
Positive Current-Sense Input for SMPS1. Connect to the positive terminal of the current-  
sense element. Figure 8 describes two different current-sensing options.  
21  
22  
24  
25  
CSH1  
CSL1  
Negative Current-Sense Input for SMPS1. Connect to the negative terminal of the  
current-sense element. Figure 8 describes two different current-sensing options.  
Feedback Input for SMPS1. Connect FB1 to V  
for fixed 3.3V output for the  
CC  
23  
24  
26  
27  
FB1  
MAX8716/MAX8717/MAX8757, or a fixed 1.5V for the MAX8756. In adjustable mode,  
FB1 regulates to 1V.  
SMPS1 Open-Drain Power-Good Output. PGOOD1 is low when SMPS1 is more than  
10% below its regulation threshold, during soft-start, and in shutdown.  
PGOOD1  
SMPS1 Peak Current-Limit Threshold Adjustment. Connect ILIM1 to V to enable the  
CC  
default 50mV current-limit threshold. In adjustable mode, the current-limit threshold  
across CSH1 and CSL1 is precisely 1/10 the voltage seen at ILIM1 over a 500mV to  
2.0V range. The logic threshold for switchover to the 50mV default value is  
28  
EP  
ILIM1  
EP  
approximately V  
- 1V.  
CC  
EP  
Exposed Pad. Connect exposed backside pad to analog ground.  
16/MAX857  
SMPS 5V Bias Supply (V  
and V  
)
CC  
DD  
Detailed Description  
The MAX8716/MAX8717/MAX8756/MAX8757 switch-  
mode power supplies (SMPS) require a 5V bias supply  
in addition to the high-power input supply (battery or  
The MAX8716/MAX8717/MAX8756/MAX8757 Standard  
Application Circuit (Figure 1) generates the 5V/5A and  
3.3V/5A typical of the main supplies in notebook com-  
puters. The input supply range is 6V to 24V. See Table 1  
for component selections, while Table 2 lists the compo-  
nent manufacturers.  
AC adapter). V  
is the power rail for the MOSFET gate  
DD  
drive, and V  
is the power rail for the IC. Connect the  
CC  
external 4.5V to 5.5V supply directly to V  
and con-  
DD  
nect V  
to V  
through an RC filter, as shown in  
DD  
CC  
The MAX8716/MAX8717/MAX8756/MAX8757 contain  
two interleaved fixed-frequency, step-down controllers  
designed for low-voltage power supplies. The optimal  
interleaved architecture guarantees out-of-phase oper-  
ation, which reduces the input capacitor ripple.  
Figure 1. The maximum supply current required is:  
= I + f (Q + Q +Q +  
G2(NL2)  
I
BIAS  
CC  
SW  
G(NL1)  
G1(NH1)  
Q
) = 1.3mA to 40mA  
G2(NH2)  
where I  
is 1.3mA, f  
is the switching frequency,  
SW  
CC  
and Q  
are the MOSFET data sheet’s total gate-  
G_  
charge specification limits at V = 5V.  
GS  
12 ______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
INPUT (V )  
IN  
+5V BIAS  
C
IN  
C1  
(2) 10μF  
1μF  
V
DD  
D
BST1  
D
BST2  
N
H1  
N
H2  
DH1  
DH2  
MAX8716  
MAX8717  
MAX8756  
MAX8757  
BST2  
BST1  
C
0.1μF  
C
0.1μF  
BST1  
BST2  
LX1  
DL1  
LX2  
DL2  
D
L2  
D
L1  
L1  
L2  
5.7μH  
N
L2  
5.7μH  
N
L1  
*PGND  
*AGND  
R
CS1  
7mΩ  
R
7mΩ  
CS2  
CSH2  
CSL2  
CSH1  
CSL1  
5V PWM  
OUTPUT  
3.3V PWM  
OUTPUT  
C
OUT2  
150μF  
C
OUT1  
(1.8V FOR MAX8756)  
(1.5V FOR MAX8756)  
220μF  
FB1  
FB2  
V
CC  
V
CC  
R1  
20Ω  
V
CC  
+5V BIAS  
C2  
1μF  
R2  
100kΩ  
R3  
100kΩ  
PULSE-  
SKIPPING  
CONTROL  
SKIP1  
SKIP2  
PGOOD1  
POWER-GOOD 1  
POWER-GOOD 2  
ON1  
ON2  
PGOOD2  
REF  
C
ON OFF  
REF  
0.22μF  
*FOR THE MAX8716 AGND AND PGND,  
REFER TO A SINGLE  
PIN DESIGNATED GND.  
V
ILIM1  
ILIM2  
DEFAULT  
CURRENT  
LIMIT  
CC  
REF (300kHz)  
FSEL  
V
CC  
MAX8717/MAX8756/MAX8757 ONLY  
POWER GROUND  
ANALOG GROUND  
SEE TABLE 1 FOR COMPONENT SPECIFICATIONS.  
Figure 1. Standard Application Circuit  
______________________________________________________________________________________ 13  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
Table 1. Component Selection for Standard Applications  
MAX8716/MAX8717/MAX8757  
5V/5A, 3.3V/5A, 300kHz  
MAX8716/MAX8717/MAX8757  
5V/5A, 3.3V/5A, 500kHz  
MAX8756  
1.8V/5A, 1.5V/5A, 300kHz  
COMPONENT  
Input Voltage  
V
= 7V to 24V  
V
= 7V to 24V  
V
= 7V to 24V  
IN  
IN  
IN  
(2) 10µF, 25V  
Taiyo Yuden TMK432BJ106KM  
(2) 10µF, 25V  
Taiyo Yuden TMK432BJ106KM  
(2) 10µF, 25V  
Taiyo Yuden TMK432BJ106KM  
C
, Input Capacitor  
IN  
220µF, 4V, 25mΩ  
low-ESR capacitor,  
SANYO 4TPE220M  
150µF, 4V, 25mΩ  
low-ESR capacitor,  
SANYO 4TPE150M  
220µF, 4V, 18mΩ  
low-ESR capacitor,  
SANYO 4TPE220MIC2  
C
C
, Output Capacitor  
OUT1  
150µF, 6.3V, 25mΩ  
low-ESR capacitor,  
SANYO 6TPE150M  
100µF, 6.3V, 25mΩ  
low-ESR capacitor,  
SANYO 6TPE100M  
220µF, 4V, 18mΩ  
low-ESR capacitor,  
SANYO 4TPE220MIC2  
, Output Capacitor  
OUT2  
Fairchild Semiconductor  
FDS6612A  
International Rectifier  
IRF7807V  
Fairchild Semiconductor  
FDS6612A  
International Rectifier  
IRF7807V  
Fairchild Semiconductor  
FDS6612A  
International Rectifier  
IRF7807V  
N
High-Side MOSFET  
Low-Side MOSFET  
H_  
Fairchild Semiconductor  
FDS6670S  
International Rectifier  
IRF7807VD1  
Fairchild Semiconductor  
FDS6670S  
International Rectifier  
IRF7807VD1  
Fairchild Semiconductor  
FDS6670S  
International Rectifier  
IRF7807VD1  
N
L_  
D
Schottky Rectifier  
(if needed)  
Nihon EC21QS03L  
Nihon EC21QS03L  
Nihon EC21QS03L  
L_  
2A, 30V, 0.45V  
2A, 30V, 0.45V  
2A, 30V, 0.45V  
f
f
f
5.7µH  
3.9µH  
3.1µH  
L_ Inductor  
Sumida CDEP105-5R7NC  
Sumida CDRH124-3R9NC  
Sumida CDRH125-3R1NC  
7mΩ 1% 0.5W resistor  
IRC LR2010-01-R007F or  
Dale WSL-2010-R007F  
7mΩ 1% 0.5W resistor  
IRC LR2010-01-R007F or  
Dale WSL-2010-R007F  
7mΩ 1% 0.5W resistor  
IRC LR2010-01-R007F or  
Dale WSL-2010-R007F  
R
SENSE_  
Reference (REF)  
Table 2. Component Suppliers  
The 2V reference is accurate to 1.5% over tempera-  
ture and load, making REF useful as a precision system  
reference. Bypass REF to GND with a 0.1µF or greater  
ceramic capacitor. The reference sources up to 50µA  
and sinks 10µA to support external loads.  
SUPPLIER  
WEBSITE  
AVX  
www.avx.com  
Central Semiconductor  
Coilcraft  
www.centralsemi.com  
www.coilcraft.com  
www.coiltronics.com  
16/MAX857  
SMPS Detailed Description  
Coiltronics  
Power-on reset (POR) occurs when V  
rises above  
CC  
Fairchild Semiconductor www.fairchildsemi.com  
approximately 2V, resetting the undervoltage, overvolt-  
age, and thermal-shutdown fault latches. The POR cir-  
cuit also ensures that the low-side drivers are driven  
International Rectifier  
KEMET  
www.irf.com  
www.kemet.com  
Panasonic  
SANYO  
www.panasonic.com/industrial  
www.secc.co.jp  
high until the SMPS controllers are activated. The V  
CC  
input undervoltage-lockout (UVLO) circuitry inhibits  
switching if V is below the V UVLO threshold.  
CC  
CC  
Sumida  
www.sumida.com  
www.t-yuden.com  
www.component.tdk.com  
www.tokoam.com  
www.vishay.com  
An internal soft-start gradually increases the regulation  
voltage during startup to reduce the input surge cur-  
rents (see the Startup Waveforms in the Typical  
Operating Characteristics).  
Taiyo Yuden  
TDK  
TOKO  
Vishay (Dale, Siliconix)  
14 ______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
REF  
R
V
CC  
MAX8717/MAX8756/MAX8757  
2.0V  
REF  
GND  
OSC  
FSEL  
R
SKIP1  
ON1  
SKIP2  
ON2  
ILIM1  
CSH1  
ILIM2  
CSH2  
CSL1  
BST1  
CSL2  
BST2  
PWM1  
CONTROLLER  
(FIGURE 3)  
PWM2  
CONTROLLER  
(FIGURE 3)  
DH1  
LX1  
DH2  
LX2  
V
V
DD  
DD  
DL1  
DL2  
FB2  
PGND  
FB  
FB  
DECODE  
(FIGURE 5)  
DECODE  
(FIGURE 5)  
FB1  
POWER-GOOD AND  
FAULT PROTECTION  
(FIGURE 7)  
POWER-GOOD AND  
FAULT PROTECTION  
(FIGURE 7)  
PGOOD1  
PGOOD2  
Figure 2. Functional Diagram  
from 0V to the final set voltage in 2ms. This reduces  
inrush current and provides a predictable ramp-up time  
for power sequencing.  
SMPS Enable Controls (ON1, ON2)  
ON1 and ON2 provide independent control of output  
soft-start and soft-shutdown. This allows flexible control  
of startup and shutdown sequencing. The outputs can  
be started simultaneously, sequentially, or indepen-  
dently. To provide sequential startup, connect ON_ of  
one regulator to PGOOD_ of the other. For example,  
with ON1 connected to PGOOD2, OUT1 soft-starts after  
OUT2 is in regulation. Drive ON_ low to clear the over-  
voltage, undervoltage, and thermal fault latches.  
Soft-shutdown begins after ON_ goes low, an output  
undervoltage fault occurs, or a thermal fault occurs.  
The two outputs are independent. A fault at one output  
does not trigger shutdown of the other. During soft-  
shutdown the output is ramped down to 0V in 4ms,  
reducing negative inductor currents that can cause  
negative voltages on the output. At the end of soft-shut-  
down, DL_ is driven high until startup is again triggered  
by a rising edge of ON_. The reference is turned off  
when both outputs have been shut down.  
Soft-Start and Soft-Shutdown  
Soft-start begins when ON_ is driven high and REF is in  
regulation. During soft-start, the output is ramped up  
______________________________________________________________________________________ 15  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
Frequency Selection (FSEL)  
The FSEL input selects the PWM mode switching fre-  
quency. Table 3 shows the switching frequency based  
on the FSEL connection. High-frequency operation opti-  
mizes the application for the smallest component size,  
trading off efficiency due to higher switching losses.  
This may be acceptable in ultra-portable devices where  
the load currents are lower. Low-frequency operation  
offers the best overall efficiency at the expense of com-  
ponent size and board space.  
Fixed-Frequency,  
Current-Mode PWM Controller  
The heart of each current-mode PWM controller is a  
multi-input, open-loop comparator that sums two sig-  
nals: the output-voltage error signal with respect to the  
reference voltage and the slope-compensation  
ramp (Figure 3). The MAX8716/MAX8717/MAX8756/  
MAX8757 use a direct-summing configuration,  
approaching ideal cycle-to-cycle control over the out-  
put voltage without a traditional error amplifier and the  
phase shift associated with it. The MAX8716/MAX8717/  
MAX8756/MAX8757 use a relatively low loop gain,  
allowing the use of low-cost output capacitors. The low  
loop gain results in the 0.1% typical load-regulation  
error and helps reduce the output capacitor size and  
cost by shifting the unity-gain crossover frequency to a  
lower level.  
Forced-PWM Mode  
To maintain low ripple fixed-frequency operation, drive  
SKIP_ high to put the output into forced-PWM mode.  
This disables the zero-crossing comparator and allows  
negative inductor current. During forced-PWM mode,  
FB  
CSH  
CSL  
(0.05 x V  
FOR MAX8756)  
LIMIT  
REF / 2  
SLOPE COMP  
SOFT-START  
SOFT-STOP  
0.1 x V  
0.2 x V  
LIMIT  
LIMIT  
ON  
AGND  
R
S
Q
SKIP  
DECODE  
DH DRIVER  
SKIP  
OSC  
16/MAX857  
V
LIMIT  
-1.2 x V  
LIMIT  
3mV  
DL DRIVER  
S
Q
R
Figure 3. PWM-Controller Functional Diagram  
16 ______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
the switching frequency remains constant and the  
no-load supply current is typically between 8mA and  
20mA per phase, depending on external MOSFETs and  
switching frequency.  
Light-Load Operation Control (SKIP_)  
The MAX8716/MAX8717/MAX8756/MAX8757 include  
SKIP_ inputs that enable the corresponding outputs to  
V
OUT  
t
=
ON(SKIP)  
operate in discontinuous mode. Connect SKIP_ to GND  
or REF as shown in Table 4 to enable or disable the  
zero-crossing comparators of either controller. When  
the zero-crossing comparator is enabled, the controller  
forces DL_ low when the current-sense inputs detect  
zero inductor current. This keeps the inductor from dis-  
charging the output capacitors and forces the con-  
troller to skip pulses under light-load conditions to  
avoid overcharging the output. During skip mode, the  
V
x f  
IN OSC  
I
LOAD(SKIP)  
I
LOAD(SKIP)  
2
I
=
LOAD  
0
TIME  
V
DD  
current consumption is reduced and efficiency is  
ON-TIME  
improved. During low-noise skip mode, the no-load rip-  
ple amplitude is two times smaller and the no-load  
switching frequency is four times higher, although the  
light-load efficiency is somewhat lower.  
Figure 4. Pulse-Skipping/Discontinuous Crossover Point  
Automatic Pulse-Skipping Crossover  
In skip mode, an inherent automatic switchover to PFM  
takes place at light loads (Figure 4). This switchover is  
affected by a comparator that truncates the low-side  
switch on-time at the inductor current’s zero crossing.  
The zero-crossing comparator senses the inductor cur-  
Table 3. FSEL Configuration Table  
MAX8717/  
MAX8757 (kHz)  
FSEL  
MAX8756 (kHz)  
V
500  
300  
200  
400  
300  
250  
CC  
rent across CSH_ and CSL_. Once V  
- V  
_ drops  
CSH  
CSL  
REF  
below the 3mV zero-crossing, current-sense threshold,  
the comparator forces DL_ low (Figure 3). This mecha-  
nism causes the threshold between pulse-skipping PFM  
and nonskipping PWM operation to coincide with the  
boundary between continuous and discontinuous induc-  
tor-current operation (also known as the “critical conduc-  
tion” point). The load-current level at which PFM/PWM  
GND  
Idle Mode Current-Sense Threshold  
When pulse-skipping mode is enabled, the on-time of  
the step-down controller terminates when the output  
voltage exceeds the feedback threshold and when the  
current-sense voltage exceeds the Idle Mode current-  
sense threshold. Under light-load conditions, the on-  
time duration depends solely on the Idle Mode  
current-sense threshold (SKIP_ = GND), which is 20%  
of the full-load current-limit threshold set by ILIM_, or  
the low-noise current-sense threshold (SKIP_ = REF),  
which is 10% for the MAX8716/MAX8717/MAX8757 and  
5% for the MAX8756 of the full-load current-limit thresh-  
old set by ILIM_. This forces the controller to source a  
minimum amount of power with each cycle. To avoid  
overcharging the output, another on-time cannot begin  
until output voltage drops below the feedback thresh-  
old. Since the zero-crossing comparator prevents the  
switching regulator from sinking current, the controller  
must skip pulses. Therefore, the controller regulates the  
valley of the output ripple under light-load conditions.  
crossover occurs, I , is determined by:  
LOAD(SKIP)  
(V V  
)V  
IN  
OUT OUT  
I
=
LOAD(SKIP)  
2LV ƒ  
IN OSC  
The switching waveforms may appear noisy and asyn-  
chronous when light loading causes pulse-skipping  
operation, but this is a normal operating condition that  
results in high light-load efficiency. Trade-offs in PFM  
noise vs. light-load efficiency are made by varying the  
inductance. Generally, low inductance produces a  
broader efficiency vs. load curve, while higher values  
result in higher full-load efficiency (assuming that the  
coil resistance remains fixed) and less output voltage  
ripple. Penalties for using higher inductor values  
include larger physical size and degraded load-tran-  
sient response (especially at low input-voltage levels).  
______________________________________________________________________________________ 17  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
Output Voltage  
A
(V V  
)
V
RIPPLE  
DC output accuracy specifications in the Electrical  
Characteristics refer to the error comparator’s thresh-  
old. When the inductor continuously conducts, the  
MAX8716/MAX8717/MAX8756/MAX8757 regulate the  
peak of the output ripple, so the actual DC output volt-  
age is lower than the slope-compensated trip level by  
50% of the output ripple voltage. For PWM operation  
(continuous conduction), the output voltage is accu-  
rately defined by the following equation:  
SLOPE IN  
NOM  
V
= V  
1−  
OUT(PWM)  
NOM  
V
2
IN  
where V  
is the nominal output voltage, A  
SLOPE  
NOM  
equals 1%, and V  
is the output ripple voltage  
x ΔI as described in the  
INDUCTOR  
RIPPLE  
(V  
= R  
RIPPLE  
ESR  
Output Capacitor Selection section).  
In discontinuous conduction (I  
< I  
), the  
LOAD(SKIP)  
OUT  
MAX8716/MAX8717/MAX8756/MAX8757 regulate the  
valley of the output ripple, so the output voltage has a DC  
regulation level higher than the error-comparator thresh-  
old. For PFM operation (discontinuous conduction), the  
output voltage is approximately defined by the following  
equation:  
Table 4. SKIP_ Configuration Table  
SKIP_  
MODE  
COMMENTS  
Fixed-frequency operation.  
Constant output ripple voltage.  
Able to source and sink current.  
High efficiency at light loads.  
Source-only applications.  
Forced-PWM  
mode  
V
CC  
1
ƒ
SW  
V
= V  
+
I R  
IDLE ESR  
OUT(PFM)  
NOM  
GND  
REF  
Skip mode  
2 ƒ  
OSC  
Good efficiency at light loads.  
where V  
is the nominal output voltage, f  
is the  
NOM  
OSC  
(V  
/ V ) times smaller no-load  
LN  
IDLE  
Low-noise  
skip mode  
maximum switching frequency set by the internal oscil-  
ripple and (V  
/ V )2 times higher  
IDLE  
LN  
lator, f  
is the actual switching frequency, and I  
is  
SW  
IDLE  
frequency compared with skip mode.  
Source-only applications.  
the Idle Mode inductor current when pulse skipping.  
Table 5. Operating Modes Truth Table  
MODE  
Power-Up  
Run  
CONDITION  
COMMENT  
DL_ tracks V  
as V  
rises from 0V to +5V.  
CC  
CC  
When ON_ is low, DL_ tracks V  
as V  
falls.  
falls below the  
CC  
CC  
CC  
V
UVLO  
When ON_ is high, DL_ is forced low as V  
3.95V (typ) falling UVLO threshold. DL_ is forced high when  
falls below 1V (typ).  
CC  
V
CC  
ON1 or ON2 enabled  
Normal operation.  
When the overvoltage (OV) comparator trips, the faulted side  
sets the OV latch, forcing PGOOD_ low and DL_ high. The  
Output Overvoltage  
Protection (OVP)  
MAX8716/MAX8717/  
MAX8756 Only  
Either output > 115% of nominal level other controller is not affected.  
The OV latch is cleared by cycling V  
16/MAX857  
below 1V or cycling  
CC  
the respective ON_ pin.  
When the undervoltage (UV) comparator trips, the faulted  
side sets the UV latch, forcing PGOOD_ low and initiating the  
soft-shutdown sequence by pulsing only DL_. DL_ goes high  
after soft-shutdown. The other controller is not affected.  
Either output < 70% of nominal level,  
UVP is enabled 6144 clock cycles  
Output Undervoltage  
Protection (UVP)  
(1/f  
) after the output is enabled  
(ON_ going high)  
OSC  
The UV latch is cleared by cycling V  
the respective ON_ pin.  
below 1V or cycling  
CC  
DL_ stays high after soft-shutdown is completed.  
All circuitry is shut down.  
Shutdown  
ON1 and ON2 are driven low  
Exited by POR or cycling ON1 and ON2.  
DL1 and DL2 remain high.  
Thermal Shutdown  
T > +160°C  
J
18 ______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
inductor ripple current. Therefore, the maximum load  
TO ERROR  
AMPLIFIER  
capability is a function of the current-sense resistance,  
inductor value, switching frequency, and duty cycle  
ADJUSTABLE  
(V  
/ V ).  
IN  
OUT  
OUTPUT  
FB  
In forced-PWM mode, the MAX8716/MAX8717/  
MAX8756/MAX8757 also implement a negative current  
limit to prevent excessive reverse inductor currents  
when V  
is sinking current. The negative current-limit  
OUT  
threshold is set to approximately -120% of the positive  
current limit and tracks the positive current limit when  
ILIM is adjusted.  
2V  
Connect ILIM_ to V  
for the 50mV default threshold, or  
CC  
adjust the current-limit threshold with an external resis-  
tor-divider at ILIM_. Use a 2µA to 20µA divider current  
for accuracy and noise immunity. The current-limit  
threshold adjustment range is from 50mV to 200mV. In  
the adjustable mode, the current-limit threshold voltage  
equals precisely 1/10 the voltage seen at ILIM_. The  
logic threshold for switchover to the 50mV default value  
FIXED OUTPUT  
FB = V  
CC  
CSL  
is approximately V  
- 1V.  
CC  
Carefully observe the PCB layout guidelines to ensure  
that noise and DC errors do not corrupt the differential  
current-sense signals seen by CSH_ and CSL_. Place  
the IC close to the sense resistor with short, direct  
traces, making a Kelvin-sense connection to the cur-  
rent-sense resistor.  
Figure 5. Dual Mode Feedback Decoder  
Adjustable/Fixed Output Voltages  
(Dual-Mode Feedback)  
to enable the fixed SMPS  
Connect FB1 and FB2 to V  
CC  
output voltages (3.3V and 5V, respectively, for the  
MAX8716/MAX8717/MAX8757, and 1.5V and 1.8V for  
the MAX8756, respectively), set by a preset, internal  
resistive voltage-divider connected between CSL_ and  
analog ground. See Figure 5. Connect a resistive volt-  
age-divider at FB_ between CSL_ and GND to adjust  
the respective output voltage between 1V and 5.5V.  
Choose R2 (resistance from FB to AGND) to be approx-  
imately 10kΩ and solve for R1 (resistance from OUT to  
FB) using the equation:  
MOSFET Gate Drivers (DH_, DL_)  
The DH_ and DL_ drivers are optimized for driving  
moderate-sized high-side, and larger low-side power  
MOSFETs. This is consistent with the low duty factor  
seen in notebook applications, where a large V  
OUT  
-
IN  
V
differential exists. The high-side gate drivers  
(DH_) source and sink 2A, and the low-side gate dri-  
vers (DL_) source 1.7A and sink 3.3A. This ensures  
robust gate drive for high-current applications. The  
DH_ floating high-side MOSFET drivers are powered by  
diode-capacitor charge pumps at BST_ (Figure 6) while  
the DL_ synchronous-rectifier drivers are powered  
V
OUT_  
R1 = R2  
1  
V
FB_  
directly by the external 5V supply (V ).  
DD  
where V  
= 1V nominal.  
FB_  
Adaptive dead-time circuits monitor the DL_ and DH_ dri-  
vers and prevent either FET from turning on until the other  
is fully off. The adaptive driver dead-time allows operation  
without shoot-through with a wide range of MOSFETs,  
minimizing delays and maintaining efficiency. There must  
be a low-resistance, low-inductance path from the DL_  
and DH_ drivers to the MOSFET gates for the adaptive  
dead-time circuits to work properly; otherwise, the sense  
circuitry in the MAX8716/MAX8717/MAX8756/MAX8757  
interprets the MOSFET gates as “off” while charge actually  
remains. Use very short, wide traces (50 mils to 100 mils  
wide if the MOSFET is 1in from the driver).  
Current-Limit Protection (ILIM_)  
The current-limit circuit uses differential current-sense  
inputs (CSH_ and CSL_) to limit the peak inductor cur-  
rent. If the magnitude of the current-sense signal  
exceeds the current-limit threshold, the PWM controller  
turns off the high-side MOSFET (Figure 3). At the next  
rising edge of the internal oscillator, the PWM controller  
does not initiate a new cycle unless the current-sense  
signal drops below the current-limit threshold. The  
actual maximum load current is less than the peak cur-  
rent-limit threshold by an amount equal to half of the  
______________________________________________________________________________________ 19  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
The internal pulldown transistor that drives DL_ low is  
robust, with a 0.6Ω (typ) on-resistance. This helps pre-  
vent DL_ from being pulled up due to capacitive cou-  
pling from the drain to the gate of the low-side MOSFETs  
when the inductor node (LX_) quickly switches from  
Power-Good Output (PGOOD_)  
PGOOD_ is the open-drain output of a comparator that  
continuously monitors each SMPS output voltage for  
overvoltage and undervoltage conditions. PGOOD_ is  
actively held low in shutdown (ON_ = GND), soft-start,  
and soft-shutdown. Once the analog soft-start termi-  
nates, PGOOD_ becomes high impedance as long as  
the output is above 90% of the nominal regulation volt-  
age set by FB_. PGOOD_ goes low once the output  
drops 10% below its nominal regulation point, an output  
overvoltage fault occurs, or ON_ is pulled low. For a  
logic-level PGOOD_ output voltage, connect an exter-  
nal pullup resistor between PGOOD_ and +5V or +3.3V.  
A 100kΩ pullup resistor works well in most applications.  
ground to V . Applications with high input voltages and  
IN  
long inductive driver traces may require additional gate-  
to-source capacitance to ensure fast-rising LX_ edges  
do not pull up the low-side MOSFETs gate, causing  
shoot-through currents. The capacitive coupling  
between LX_ and DL_ created by the MOSFET’s gate-to-  
drain capacitance (C  
), gate-to-source capacitance  
RSS  
(C  
- C  
), and additional board parasitics should not  
ISS  
RSS  
exceed the following minimum threshold:  
Fault Protection  
Output Overvoltage Protection  
(MAX8716/MAX8717/MAX8756 Only)  
C
C
RSS  
V
> V  
IN  
GS(TH)  
ISS  
If the output voltage of either SMPS rises above 115%  
of its nominal regulation voltage, the corresponding  
controller sets its overvoltage fault latch, pulls PGOOD_  
low, and forces DL_ high for the corresponding SMPS  
controller. The other controller is not affected. If the  
condition that caused the overvoltage persists (such as  
a shorted high-side MOSFET), the battery fuse will  
Variation of the threshold voltage may cause problems  
in marginal designs. Alternatively, adding a resistor  
less than 10Ω in series with BST_ may remedy the  
problem by increasing the turn-on time of the high-side  
MOSFET without degrading the turn-off time (Figure 6).  
blow. Cycle V  
below 1V or toggle ON_ to clear the  
CC  
C
BYP  
overvoltage fault latch and restart the SMPS controller.  
V
DD  
MAX8716  
MAX8717  
MAX8756  
MAX8757  
D
BST  
FAULT  
PROTECTION  
(R )*  
BST  
POWER-GOOD  
BST  
0.9 x  
1.15 x  
0.7 x  
INT REF_  
INT REF_  
INT REF_  
INPUT (V  
)
IN  
INTERNAL FB  
C
BST  
DH  
LX  
N
H
L
POR  
16/MAX857  
V
DD  
TIMER  
DL  
N
L
(C )*  
NL  
FAULT  
FAULT  
LATCH  
PGND  
POWER-  
GOOD  
(R )* OPTIONAL—THE RESISTOR LOWERS EMI BY DECREASING  
BST  
THE SWITCHING-NODE RISE TIME.  
(C )* OPTIONAL—THE CAPACITOR REDUCES LX TO DL CAPACITIVE  
NL  
COUPLING THAT CAN CAUSE SHOOT-THROUGH CURRENTS.  
Figure 7. Power-Good and Fault Protection  
Figure 6. Optional Gate-Driver Circuitry  
20 ______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
Output Undervoltage Protection  
If the output voltage of either SMPS falls below 70% of  
its regulation voltage, the corresponding controller sets  
its undervoltage fault latch, pulls PGOOD_ low, and  
begins soft-shutdown for the corresponding SMPS con-  
troller by pulsing DL_. DH_ remains off during the soft-  
shutdown sequence initiated by an unvervoltage fault.  
The other controller is not affected. After soft-shutdown  
has completed, the MAX8716/MAX8717/MAX8756/  
Maximum Load Current. There are two values to  
consider. The peak load current (I ) deter-  
LOAD(MAX)  
mines the instantaneous component stresses and fil-  
tering requirements and thus drives output capacitor  
selection, inductor saturation rating, and the design  
of the current-limit circuit. The continuous load cur-  
rent (I ) determines the thermal stresses and thus  
LOAD  
drives the selection of input capacitors, MOSFETs,  
and other critical heat-contributing components.  
MAX8757 force DL_ high and DH_ low. Cycle V  
CC  
Switching Frequency. This choice determines the  
basic trade-off between size and efficiency. The  
optimal frequency is largely a function of maximum  
input voltage, due to MOSFET switching losses that  
below 1V or toggle ON_ to clear the undervoltage fault  
latch and restart the SMPS controller.  
V
POR and UVLO  
CC  
CC  
are proportional to frequency and V 2. The opti-  
IN  
Power-on reset (POR) occurs when V  
rises above  
mum frequency is also a moving target, due to rapid  
improvements in MOSFET technology that are mak-  
ing higher frequencies more practical.  
approximately 2V, resetting the fault latch and prepar-  
ing the PWM for operation. V undervoltage-lockout  
CC  
(UVLO) circuitry inhibits switching, forces PGOOD_  
low, and forces the DL_ gate drivers low.  
Inductor Operating Point. This choice provides  
trade-offs between size vs. efficiency and transient  
response vs. output ripple. Low inductor values pro-  
vide better transient response and smaller physical  
size, but also result in lower efficiency and higher  
output ripple due to increased ripple currents. The  
minimum practical inductor value is one that causes  
the circuit to operate at the edge of critical conduc-  
tion (where the inductor current just touches zero  
with every cycle at maximum load). Inductor values  
lower than this grant no further size-reduction bene-  
fit. The optimum operating point is usually found  
between 20% and 50% ripple current. When pulse-  
skipping (SKIP low and light loads), the inductor  
value also determines the load-current value at  
which PFM/PWM switchover occurs.  
If V  
drops low enough to trip the UVLO comparator  
CC  
while ON_ is high, the MAX8716/MAX8717/MAX8756/  
MAX8757 immediately force DH_ and DL_ low on both  
controllers. The output discharges to 0V at a rate  
dependent on the load and the total output capaci-  
tance. This prevents negative output voltages, eliminat-  
ing the need for a Schottky diode to GND at the output.  
Thermal Fault Protection  
The MAX8716/MAX8717/MAX8756/MAX8757 feature a  
thermal fault-protection circuit. When the junction tem-  
perature rises above +160°C, a thermal sensor sets the  
fault latches, pulls PGOOD low, and shuts down both  
SMPS controllers using the soft-shutdown sequence  
(see the Sort-Start and Soft-Shutdown section). Cycle  
V
CC  
below 1V or toggle ON1 and ON2 to clear the fault  
Inductor Selection  
latches and restart the controllers after the junction  
temperature cools by 15°C.  
The switching frequency and inductor operating point  
determine the inductor value as follows:  
Design Procedure  
V
(V V  
I
)
OUT IN  
OUT  
Firmly establish the input voltage range and maximum  
load current before choosing a switching frequency  
and inductor operating point (ripple-current ratio). The  
primary design trade-off lies in choosing a good switch-  
ing frequency and inductor operating point, and the fol-  
lowing four factors dictate the rest of the design:  
L =  
V ƒ  
LIR  
IN OSC LOAD(MAX)  
For example: I  
= 5A, V = 12V, V  
= 5V,  
OUT  
LOAD(MAX)  
= 300kHz, 30% ripple current or LIR = 0.3:  
IN  
f
OSC  
5V ×(12V 5V)  
12V × 300kHz× 5A × 0.3  
Input Voltage Range. The maximum value (V  
)
IN(MAX)  
L =  
= 6.50μH  
must accommodate the worst-case, high AC-adapter  
voltage. The minimum value (V ) must account  
IN(MIN)  
Find a low-loss inductor having the lowest possible DC  
resistance that fits in the allotted dimensions. Most  
inductor manufacturers provide inductors in standard  
values, such as 1.0µH, 1.5µH, 2.2µH, 3.3µH, etc. Also  
for the lowest battery voltage after drops due to con-  
nectors, fuses, and battery selector switches. If there  
is a choice at all, lower input voltages result in better  
efficiency.  
______________________________________________________________________________________ 21  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
look for nonstandard values, which can provide a better  
ΔI  
compromise in LIR across the input voltage range. If  
using a swinging inductor (where the no-load induc-  
tance decreases linearly with increasing current), evalu-  
ate the LIR with properly scaled inductance values. For  
the selected inductance value, the actual peak-to-peak  
INDUCTOR  
I
>I  
+
LIMIT LOAD(MAX)  
2
where I  
equals the minimum current-limit thresh-  
old voltage divided by the current-sense resistance  
(R ). For the 50mV default setting, the minimum  
LIMIT_  
inductor ripple current (ΔI ) is defined by:  
INDUCTOR  
SENSE  
current-limit threshold is 50mV.  
V
(V V  
)
Connect ILIM_ to V for a default 50mV current-limit  
OUT IN  
OUT  
L
CC  
ΔI  
=
INDUCTOR  
threshold. In adjustable mode, the current-limit thresh-  
old is precisely 1/10 the voltage seen at ILIM_. For an  
adjustable threshold, connect a resistive divider from  
REF to analog ground (GND) with ILIM_ connected to  
the center tap. The external 500mV to 2V adjustment  
range corresponds to a 50mV to 200mV current-limit  
threshold. When adjusting the current limit, use 1% tol-  
erance resistors and a divider current of approximately  
10µA to prevent significant inaccuracy in the current-  
limit tolerance.  
V ƒ  
IN OSC  
Ferrite cores are often the best choice, although pow-  
dered iron is inexpensive and can work well at 200kHz.  
The core must be large enough not to saturate at the  
peak inductor current (I  
):  
PEAK  
ΔI  
INDUCTOR  
I
=I  
+
PEAK LOAD(MAX)  
2
The current-sense method (Figure 8) and magnitude  
determines the achievable current-limit accuracy and  
power loss. Typically, higher current-sense limits pro-  
vide tighter accuracy, but also dissipate more power.  
Most applications employ a current-limit threshold  
Transient Response  
The inductor ripple current also impacts transient-  
response performance, especially at low V - V dif-  
ferentials. Low inductor values allow the inductor  
current to slew faster, replenishing charge removed  
from the output filter capacitors by a sudden load step.  
The total output voltage sag is the sum of the voltage  
sag while the inductor is ramping up and the voltage  
sag before the next pulse can occur:  
IN  
OUT  
(V ) of 50mV to 100mV, so the sense resistor can be  
LIM  
determined by:  
R
= V  
/ I  
SENSE_  
LIM_ LIM_  
For the best current-sense accuracy and overcurrent  
protection, use a 1% tolerance current-sense resistor  
between the inductor and output as shown in Figure 8a.  
This configuration constantly monitors the inductor cur-  
rent, allowing accurate current-limit protection.  
2
L(ΔI  
)
ΔI  
(T − ΔT)  
LOAD(MAX)  
LOAD(MAX)  
V
=
+
SAG  
2C  
(V ×D  
V  
)
C
OUT  
OUT IN  
MAX  
OUT  
where D  
is maximum duty factor (see the Electrical  
MAX  
Alternatively, high-power applications that do not  
require highly accurate current-limit protection may  
reduce the overall power dissipation by connecting a  
series RC circuit across the inductor (Figure 8b) with an  
equivalent time constant:  
Characteristics), T is the switching period (1 / f  
), and  
OSC  
ΔT equals V  
/ V x T when in PWM mode, or L x 0.2  
OUT  
OUT  
IN  
x I  
/ (V - V  
) when in skip mode. The amount of  
MAX  
IN  
overshoot during a full-load to no-load transient due to  
stored inductor energy can be calculated as:  
16/MAX857  
L
2
= C ×R  
(ΔI  
) L  
EQ  
EQ  
LOAD(MAX)  
R
V
L
SOAR  
2C  
V
OUT OUT  
where R is the inductor’s series DC resistance. In this  
L
configuration, the current-sense resistance equals the  
Setting the Current Limit  
inductor’s DC resistance (R  
= R ). Use the worst-  
L
The minimum current-limit threshold must be great  
enough to support the maximum load current when the  
current limit is at the minimum tolerance value. The  
SENSE  
case inductance and R values provided by the induc-  
L
tor manufacturer, adding some margin for the  
inductance drop over temperature and load.  
peak inductor current occurs at I  
the ripple current; therefore:  
plus half  
LOAD(MAX)  
22 ______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
INPUT (V )  
IN  
C
IN  
N
H
DH_  
LX_  
R
SENSE  
L
C
OUT  
D
L
DL_  
MAX8716  
MAX8717  
MAX8756  
MAX8757  
N
L
PGND  
CSH_  
CSL_  
a) OUTPUT SERIES RESISTOR SENSING  
INPUT (V )  
IN  
C
IN  
N
H
INDUCTOR  
DH_  
LX_  
C
OUT  
DL_  
MAX8716  
MAX8717  
MAX8756  
MAX8757  
D
L
N
L
R
EQ  
C
EQ  
PGND  
CSH_  
CSL_  
R
R
BIAS = EQ  
b) LOSSLESS INDUCTOR SENSING  
Figure 8. Current-Sense Configurations  
Output Capacitor Selection  
The output filter capacitor must have low enough equiv-  
alent series resistance (ESR) to meet output ripple and  
load-transient requirements, yet have high enough ESR  
to satisfy stability requirements. The output capaci-  
tance must be high enough to absorb the inductor  
energy while transitioning from full-load to no-load con-  
ditions without tripping the overvoltage fault protection.  
When using high-capacitance, low-ESR capacitors (see  
the Output-Capacitor Stability Considerations section),  
the filter capacitor’s ESR dominates the output voltage  
ripple. So the output capacitor’s size depends on the  
maximum ESR required to meet the output-voltage-rip-  
V
R
R
IDLE ESR  
V
=
RIPPLE(PP)  
SENSE  
The actual capacitance value required relates to the  
physical size needed to achieve low ESR, as well as to  
the chemistry of the capacitor technology. Thus, the  
capacitor is usually selected by ESR and voltage rating  
rather than by capacitance value (this is true of tanta-  
lums, OS-CONs, polymers, and other electrolytics).  
When using low-capacity filter capacitors, such as  
ceramic capacitors, size is usually determined by the  
capacity needed to prevent V  
and V  
from  
SOAR  
SAG  
causing problems during load transients. Generally,  
once enough capacitance is added to meet the over-  
shoot requirement, undershoot at the rising load edge  
ple (V  
) specifications:  
RIPPLE(P-P)  
V
= R  
I
LIR  
RIPPLE(P-P)  
ESR LOAD(MAX)  
In Idle Mode, the inductor current becomes discontinu-  
ous, with peak currents set by the idle-mode current-  
is no longer a problem (see the V  
and V  
equa-  
SOAR  
SAG  
tions in the Transient Response section). However, low-  
capacity filter capacitors typically have high-ESR zeros  
that may effect the overall stability (see the Output-  
Capacitor Stability Considerations section).  
sense threshold (V  
= 0.2V  
). In Idle Mode, the  
LIMIT  
IDLE  
no-load output ripple can be determined as follows:  
______________________________________________________________________________________ 23  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
Output-Capacitor Stability Considerations  
Stability is determined by the value of the ESR zero rel-  
ative to the switching frequency. The boundary of insta-  
bility is given by the following equation:  
cause the output voltage to rise above or fall below the  
tolerance limits.  
The easiest method for checking stability is to apply a  
very fast zero-to-max load transient and carefully  
observe the output-voltage-ripple envelope for over-  
shoot and ringing. It can help to simultaneously monitor  
the inductor current with an AC current probe. Do not  
allow more than one cycle of ringing after the initial  
step-response under/overshoot.  
ƒ
SW  
π
ƒ
ESR  
where:  
1
ƒ
=
ESR  
2πR  
C
ESR OUT  
Input Capacitor Selection  
For a typical 300kHz application, the ESR zero frequen-  
cy must be well below 95kHz, preferably below 50kHz.  
Tantalum and OS-CON capacitors in widespread use  
at the time of publication have typical ESR zero fre-  
quencies of 25kHz. In the design example used for  
The input capacitor must meet the ripple-current  
requirement (I  
) imposed by the switching currents.  
RMS  
For an out-of-phase regulator, the total RMS current in  
the input capacitor is a function of the load currents,  
the input currents, the duty cycles, and the amount of  
overlap as defined in Figure 9.  
inductor selection, the ESR needed to support 25mV  
P-P  
ripple is 25mV/1.5A = 16.7mΩ. One 220µF/4V SANYO  
polymer (TPE) capacitor provides 15mΩ (max) ESR.  
This results in a zero at 48kHz, well within the bounds  
of stability.  
The 40/60 optimal interleaved architecture of the  
MAX8716/MAX8717/MAX8756/MAX8757 allows the  
input voltage to go as low as 8.3V before the duty  
cycles begin to overlap. This offers improved efficiency  
over a regular 180° out-of-phase architecture where the  
duty cycles begin to overlap below 10V. Figure 9  
For low input-voltage applications where the duty cycle  
exceeds 50% (V  
voltage should not be greater than twice the internal  
slope-compensation voltage:  
/ V 50%), the output ripple  
IN  
OUT  
V
0.02 x V  
RIPPLE  
OUT  
INPUT CAPACITOR RMS CURRENT  
vs. INPUT VOLTAGE  
where V  
equals ΔI  
x R  
. The worst-  
ESR  
RIPPLE  
INDUCTOR  
5.0  
case ESR limit occurs when V = 2 x V  
, so the  
OUT  
IN  
4.5  
above equation can be simplified to provide the follow-  
ing boundary condition:  
4.0  
IN PHASE  
3.5  
R
ESR  
0.04 x L x ƒ  
OSC  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
50/50 INTERLEAVING  
Do not put high-value ceramic capacitors directly  
across the feedback sense point without taking precau-  
tions to ensure stability. Large ceramic capacitors can  
have a high-ESR zero frequency and cause erratic,  
unstable operation. However, it is easy to add enough  
series resistance by placing the capacitors a couple of  
inches downstream from the feedback sense point,  
which should be as close as possible to the inductor.  
40/60 OPTIMAL  
INTERLEAVING  
5V/5A AND 3.3V/5A  
16/MAX857  
6
8
10  
12  
V
14  
(V)  
16  
18  
20  
IN  
Unstable operation manifests itself in two related but  
distinctly different ways: short/long pulses or cycle  
skipping resulting in a lower switching frequency.  
Instability occurs due to noise on the output or because  
the ESR is so low that there is not enough voltage ramp  
in the output voltage signal. This “fools” the error com-  
parator into triggering too early or skipping a cycle.  
Cycle skipping is more annoying than harmful, resulting  
in nothing worse than increased output ripple.  
However, it can indicate the possible presence of loop  
instability due to insufficient ESR. Loop instability can  
result in oscillations at the output after line or load  
steps. Such perturbations are usually damped, but can  
INPUT RMS CURRENT FOR INTERLEAVED OPERATION  
I
=
RMS  
2
2
(I  
(I  
- I  
OUT1 IN  
)
(D - D ) + (I  
LX1 OL  
- I  
)
(D - D ) +  
LX2 OL  
OUT2 IN  
2
2
+ I  
- I  
)
D
+ I (1 - D - D + D  
)
OL  
OUT1 OUT2 IN  
OL IN  
LX1  
LX2  
V
V
V
V
OUT1  
OUT2  
D
OL  
= DUTY-CYCLE OVERLAP FRACTION  
D
=
D
=
LX2  
LX1  
IN  
IN  
V
I
+ V  
I
OUT1 OUT1  
OUT2 OUT2  
I
=
IN  
V
IN  
INPUT RMS CURRENT FOR SINGLE-PHASE OPERATION  
I
= I  
RMS LOAD  
V
(V - V  
OUT IN  
)
OUT  
(
)
V
IN  
Figure 9. Input RMS Current  
24 ______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
shows the input-capacitor RMS current vs. input volt-  
age for an application that requires 5V/5A and 3.3V/5A.  
This shows the improvement of the 40/60 optimal inter-  
leaving over 50/50 interleaving and in-phase operation.  
The optimum occurs when the switching losses equal  
the conduction (R ) losses. High-side switching  
losses do not become an issue until the input is greater  
than approximately 15V.  
DS(ON)  
For most applications, nontantalum chemistries (ceramic,  
aluminum, or OS-CON) are preferred due to their resis-  
tance to power-up surge currents typical of systems  
with a mechanical switch or connector in series with the  
input. Choose a capacitor that has less than 10°C tem-  
perature rise at the RMS input current for optimal relia-  
bility and lifetime.  
Calculating the power dissipation in high-side  
MOSFETs (N ) due to switching losses is difficult, since  
H
it must allow for difficult-to-quantify factors that influ-  
ence the turn-on and turn-off times. These factors  
include the internal gate resistance, gate charge,  
threshold voltage, source inductance, and PCB layout  
characteristics. The following switching-loss calculation  
provides only a very rough estimate and is no substi-  
tute for breadboard evaluation, preferably including  
Power MOSFET Selection  
Most of the following MOSFET guidelines focus on the  
challenge of obtaining high load-current capability  
when using high-voltage (> 20V) AC adapters. Low-  
current applications usually require less attention.  
verification using a thermocouple mounted on N :  
H
PD (N SWITCHING)=  
H
2
V
I
f
Q
I
⎞⎛  
C
V
f
IN(MAX) LOAD SW  
G(SW)  
OSS IN SW  
2
+
⎟⎜  
η
The high-side MOSFET (N ) must be able to dissipate  
H
the resistive losses plus the switching losses at both  
⎠⎝  
GATE  
TOTAL  
V
and V  
. Ideally, the losses at V  
where C  
is the N , MOSFET's output capacitance,  
H
IN(MIN)  
IN(MAX)  
IN(MIN)  
, with  
OSS  
2
should be roughly equal to the losses at V  
lower losses in between. If the losses at V  
Q
, is the change needed to turn on the  
IN(MAX)  
IN(MIN)  
G(SW)  
are  
N
MOSFET, and I  
is the peak gate-drive  
GATE  
H
significantly higher, consider increasing the size of N .  
source/sink current (1A typ).  
H
Conversely, if the losses at V  
are significantly  
IN(MAX)  
Switching losses in the high-side MOSFET can become  
a heat problem when maximum AC adapter voltages  
are applied, due to the squared term in the switching-  
loss equation (C x V 2 x f ). If the high-side MOSFET  
higher, consider reducing the size of N . If V does  
H
IN  
not vary over a wide range, optimum efficiency is  
achieved by selecting a high-side MOSFET (N ) that  
H
IN  
SW  
DS(ON)  
has conduction losses equal to the switching losses.  
chosen for adequate R  
at low battery voltages  
Choose a low-side MOSFET (N ) that has the lowest  
L
becomes extraordinarily hot when subjected to  
possible on-resistance (R  
), comes in a moder-  
V
, consider choosing another MOSFET with  
DS(ON)  
IN(MAX)  
ate-sized package (i.e., 8-pin SO, DPAK, or D2PAK),  
and is reasonably priced. Ensure that the  
MAX8716/MAX8717/MAX8756/MAX8757 DL_ gate dri-  
ver can supply sufficient current to support the gate  
charge and the current injected into the parasitic drain-  
to-gate capacitor caused by the high-side MOSFET  
turning on; otherwise, cross-conduction problems may  
occur. Switching losses are not an issue for the low-  
side MOSFET since it is a zero-voltage switched device  
when used in the step-down topology.  
lower parasitic capacitance.  
For the low-side MOSFET (N ), the worst-case power  
L
dissipation always occurs at maximum battery voltage:  
V
OUT  
2
PD (N RESISTIVE)= 1−  
(I  
) R  
L
LOAD DS(ON)  
V
IN(MAX)  
The absolute worst case for MOSFET power dissipation  
occurs under heavy-overload conditions that are  
greater than I  
but are not high enough to  
LOAD(MAX)  
Power MOSFET Dissipation  
exceed the current limit and cause the fault latch to trip.  
To protect against this possibility, “overdesign” the cir-  
cuit to tolerate:  
Worst-case conduction losses occur at the duty-factor  
extremes. For the high-side MOSFET (N ), the worst-  
H
case power dissipation due to resistance occurs at  
minimum input voltage:  
ΔI  
INDUCTOR  
I
=I  
LOAD LIMIT  
2
V
2
OUT  
PD (N RESISTIVE) =  
(I  
) R  
H
LOAD DS(ON)  
V
IN  
where I  
is the peak current allowed by the current-  
LIMIT  
Generally, use a small high-side MOSFET to reduce  
switching losses at high input voltages. However, the  
DS(ON)  
limit circuit, including threshold tolerance and sense-  
resistance variation. The MOSFETs must have a  
relatively large heatsink to handle the overload power  
dissipation.  
R
required to stay within package power-dissi-  
pation limits often limits how small the MOSFET can be.  
______________________________________________________________________________________ 25  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
Choose a Schottky diode (D ) with a forward-voltage  
L
(ΔI ). This results in a minimum operating voltage  
UP  
drop low enough to prevent the low-side MOSFET’s  
body diode from turning on during the dead time. As a  
general rule, select a diode with a DC current rating  
equal to 1/3 the load current. This diode is optional and  
can be removed if efficiency is not critical.  
defined by the following equation:  
1
V
= V  
+ V  
+h  
1 (V  
+ V  
)
IN(MIN)  
OUT  
CHG  
OUT  
DIS  
D
MAX  
where V  
and V  
are the parasitic voltage drops in  
DIS  
CHG  
Boost Capacitors  
the charge and discharge paths, respectively. A rea-  
sonable minimum value for h is 1.5, while the absolute  
minimum input voltage is calculated with h = 1.  
The boost capacitors (C  
) must be selected large  
BST  
enough to handle the gate-charging requirements of  
the high-side MOSFETs. Typically, 0.1µF ceramic  
capacitors work well for low-power applications driving  
medium-sized MOSFETs. However, high-current appli-  
cations driving large, high-side MOSFETs require boost  
capacitors larger than 0.1µF. For these applications,  
select the boost capacitors to avoid discharging the  
capacitor more than 200mV while charging the high-  
side MOSFETs’ gates:  
Maximum Input Voltage  
The MAX8716/MAX8717/MAX8756/MAX8757 controller  
includes a minimum on-time specification, which deter-  
mines the maximum input operating voltage that main-  
tains the selected switching frequency (see the  
Electrical Characteristics table). Operation above this  
maximum input voltage results in pulse-skipping opera-  
tion, regardless of the operating mode selected by  
SKIP. At the beginning of each cycle, if the output volt-  
age is still above the feedback threshold voltage, the  
controller does not trigger an on-time pulse, effectively  
skipping a cycle. This allows the controller to maintain  
regulation above the maximum input voltage, but forces  
the controller to effectively operate with a lower switch-  
ing frequency. This results in an input threshold voltage  
Q
GATE  
200mV  
C
=
BST  
where Q  
is the total gate charge specified in the  
GATE  
high-side MOSFET’s data sheet. For example, assume  
the FDS6612A n-channel MOSFET is used on the high  
side. According to the manufacturer’s data sheet, a sin-  
gle FDS6612A has a maximum gate charge of 13nC  
at which the controller begins to skip pulses (V  
):  
IN(SKIP)  
(V  
= 5V). Using the above equation, the required  
GS  
boost capacitance would be:  
1
V
= V  
IN(SKIP)  
OUT ⎜  
ƒ
t
OSC ON(MIN) ⎠  
13nC  
100mV  
C
=
= 0.065μF  
BST  
where f  
is the switching frequency selected by FSEL.  
OSC  
PCB Layout Guidelines  
Selecting the closest standard value, this example  
requires a 0.1µF ceramic capacitor.  
Careful PCB layout is critical to achieving low switching  
losses and clean, stable operation. The switching  
power stage requires particular attention (Figure 10). If  
possible, mount all the power components on the top  
side of the board, with their ground terminals flush  
against one another. Follow these guidelines for good  
PCB layout:  
Applications Information  
16/MAX857  
Duty-Cycle Limits  
Minimum Input Voltage  
The minimum input operating voltage (dropout voltage)  
is restricted by the maximum duty-cycle specification  
(see the Electrical Characteristics table). For the best  
dropout performance, use the slowest switching-fre-  
quency setting (FSEL = GND). However, keep in mind  
that the transient performance gets worse as the step-  
down regulators approach the dropout voltage, so bulk  
output capacitance must be added (see the voltage  
sag and soar equations in the Design Procedure sec-  
tion). The absolute point of dropout occurs when the  
inductor current ramps down during the off-time  
• Keep the high-current paths short, especially at the  
ground terminals. This practice is essential for sta-  
ble, jitter-free operation.  
• Keep the power traces and load connections short.  
This practice is essential for high efficiency. Using  
thick copper PCBs (2oz vs. 1oz) can enhance full-  
load efficiency by 1% or more. Correctly routing PCB  
traces is a difficult task that must be approached in  
terms of fractions of centimeters, where a single mΩ  
of excess trace resistance causes a measurable effi-  
ciency penalty.  
(ΔI  
) as much as it ramps up during the on-time  
DOWN  
26 ______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
• Minimize current-sensing errors by connecting  
CSH_ and CSL_ directly across the current-sense  
3) Group the gate-drive components (BST_ diode and  
capacitor and LDO5 bypass capacitor) together  
near the controller IC.  
resistor (R  
).  
SENSE_  
• When trade-offs in trace lengths must be made, it is  
preferable to allow the inductor charging path to be  
made longer than the discharge path. For example,  
it is better to allow some extra distance between the  
input capacitors and the high-side MOSFET than to  
allow distance between the inductor and the low-  
side MOSFET or between the inductor and the out-  
put filter capacitor.  
4) Make the DC-DC controller ground connections as  
shown in Figures 1 and 10. This diagram can be  
viewed as having two separate ground planes:  
power ground, where all the high-power compo-  
nents go; and an analog ground plane for sensitive  
analog components. The analog ground plane and  
power ground plane must meet only at a single point  
directly at the IC.  
• Route high-speed switching nodes (BST_, LX_, DH_,  
and DL_) away from sensitive analog areas (REF,  
FB_, CSH_, CSL_).  
5) Connect the output power planes directly to the out-  
put filter capacitor positive and negative terminals  
with multiple vias. Place the entire DC-DC converter  
circuit as close to the load as is practical.  
Layout Procedure  
1) Place the power components first, with ground ter-  
minals adjacent (N _ source, C , C  
_, and D _  
L
L
IN  
OUT  
Chip Information  
TRANSISTOR COUNT: 5879  
anode). If possible, make all these connections on  
the top layer with wide, copper-filled areas.  
PROCESS: BiCMOS  
2) Mount the controller IC adjacent to the low-side  
MOSFET, preferably on the back side opposite N  
L_  
and N to keep LX_, GND, DH_, and the DL_ gate-  
H_  
drive lines short and wide. The DL_ and DH_ gate  
traces must be short and wide (50 mils to 100 mils  
wide if the MOSFET is 1in from the controller IC) to  
keep the driver impedance low and for proper adap-  
tive dead-time sensing.  
______________________________________________________________________________________ 27  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
CONNECT GND AND PGND TO THE  
CONTROLLER AT ONE POINT  
ONLY AS SHOWN  
VIA TO POWER  
GROUND  
CONNECT THE  
EXPOSED PAD TO  
ANALOG GND  
VIA TO V PIN  
CC  
VIA TO V  
CC  
BYPASS CAPACITOR  
VIA TO REF  
BYPASS CAPACITOR  
VIA TO REF PIN  
MAX8717/MAX8756/MAX8757  
BOTTOM LAYER  
MAX8717/MAX8756/MAX8757  
TOP LAYER  
KELVIN-SENSE VIAS  
UNDER THE SENSE  
RESISTOR  
(REFER TO THE EVALUATION KIT)  
DUAL  
n-CHANNEL  
MOSFET  
INDUCTOR  
SINGLE  
n-CHANNEL  
MOSFETS  
INDUCTOR  
DH  
LX  
DL  
C
C
OUT  
INPUT  
OUT  
OUTPUT  
C
OUT  
OUTPUT  
GROUND  
INPUT  
GROUND  
HIGH-POWER LAYOUT  
Figure 10. PCB Layout Example  
LOW-POWER LAYOUT  
16/MAX857  
Ordering Information (continued)  
PIN-  
PACKAGE  
PKG  
CODE  
PART  
TEMP RANGE  
-40°C to +85°C  
-40°C to +85°C  
-40°C to +85°C  
28 Thin QFN  
5mm x 5mm  
MAX8717ETI+  
MAX8756ETI+  
MAX8757ETI+  
T2855-6  
T2855-6  
T2855-6  
28 Thin QFN  
4mm x 4mm  
28 Thin QFN  
5mm x 5mm  
+Denotes a lead-free package.  
28 ______________________________________________________________________________________  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
16/MAX857  
Package Information  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
PACKAGE OUTLINE,  
12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm  
1
21-0139  
F
2
PACKAGE OUTLINE,  
12, 16, 20, 24, 28L THIN QFN, 4x4x0.8mm  
2
21-0139  
F
2
______________________________________________________________________________________ 29  
Interleaved High-Efficiency, Dual Power-Supply  
Controllers for Notebook Computers  
Package Information (continued)  
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,  
go to www.maxim-ic.com/packages.)  
16/MAX857  
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are  
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.  
30 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600  
© 2007 Maxim Integrated Products  
is a registered trademark of Maxim Integrated Products, Inc.  

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