MAX8796GTJ+ [MAXIM]
PLASTIC ENCAPSULATED DEVICES; 塑封器件
| 型号： | MAX8796GTJ+ |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | PLASTIC ENCAPSULATED DEVICES |
| 文件： | 总5页 (文件大小：32K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MAX8796GTJ+
RELIABILITY REPORT
FOR
MAX8796GTJ+
PLASTIC ENCAPSULATED DEVICES
March 18, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX8796GTJ+
Conclusion
The MAX8796GTJ+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
.....Attachments
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
IV. .......Die Information
I. Device Description
A. General
na
Maxim Integrated Products. All rights reserved.
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MAX8796GTJ+
II. Manufacturing Information
A. Description/Function:
B. Process:
Single-Phase Quick-PWM Intel IMVP6/6+/GMCH Controller
S4
C. Number of Device Transistors:
10146
D. Fabrication Location:
E. Assembly Location:
Texas
UTL Thailand
December 19, 2007
F. Date of Initial Production:
III. Packaging Information
A. Package Type:
B. Lead Frame:
32-pin TQFN 5x5
Copper
C. Lead Finish:
100% matte Tin
Conductive Epoxy
Gold (1 mil dia.)
Epoxy with silica filler
#05-9000-2634
Class UL94-V0
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
K. Single Layer Theta Jc:
L. Multi Layer Theta Ja:
M. Multi Layer Theta Jc:
47°C/W
1.7°C/W
29°C/W
2.7°C/W
IV. Die Information
A. Dimensions:
77 X 73 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
None
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
Maxim Integrated Products. All rights reserved.
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MAX8796GTJ+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
D. Sampling Plan:
< 50 ppm
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
=
1.83
(Chi square value for MTTF upper limit)
MTTF
192 x 4340 x 192 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 5.6 x 10-9
= 5.6 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly
1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-
ic.com/. Current monitor data for the S4 Process results in a FIT Rate of 0.28 @ 25C and 4.85 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The PE11 die type has been found to have all pins able to withstand a HBM transient pulse of +/-300 V per JEDEC
JESD22-A114-D. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
Maxim Integrated Products. All rights reserved.
Page 4/5
MAX8796GTJ+
Table 1
Reliability Evaluation Test Results
MAX8796GTJ+
SAMPLE SIZE
TEST ITEM
TEST CONDITION
FAILURE
NUMBER OF
FAILURES
IDENTIFICATION
Static Life Test (Note 1)
Ta = 135°C
DC Parameters
& functionality
192
77
0
0
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
DC Parameters
& functionality
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
DC Parameters
& functionality
77
0
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
Maxim Integrated Products. All rights reserved.
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