MAX9996ETP-T [MAXIM]
SiGe High-Linearity, 1700MHz2 2200MHz Downconversion Mixer with LO Buffer/Switch; SiGe，高线性度， 1700MHz2 2200MHz下变频混频器，带有LO缓冲器/开关
| 型号： | MAX9996ETP-T |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | SiGe High-Linearity, 1700MHz2 2200MHz Downconversion Mixer with LO Buffer/Switch |
| 文件： | 总12页 (文件大小：411K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-3531; Rev 0; 12/04
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
General Description
Features
The MAX9996 high-linearity downconversion mixer pro-
vides 8.3dB gain, +26.5dBm IIP3, and 9.7dB NF for
1700MHz to 2200MHz UMTS/WCDMA, DCS, and PCS
base-station receiver applications. With a 1900MHz to
2400MHz LO frequency range, this particular mixer is
ideal for high-side LO injection receiver architectures.
Low-side LO injection is supported by the MAX9994,
which is pin-for-pin and functionally compatible with the
MAX9996.
♦ 1700MHz to 2200MHz RF Frequency Range
♦ 1900MHz to 2400MHz LO Frequency Range
(MAX9996)
♦ 1400MHz to 2000MHz LO Frequency Range
(MAX9994)
♦ 40MHz to 350MHz IF Frequency Range
♦ 8.3dB Conversion Gain
♦ +26.5dBm Input IP3
In addition to offering excellent linearity and noise per-
formance, the MAX9996 also yields a high level of com-
ponent integration. This device includes a double-
balanced passive mixer core, an IF amplifier, a dual-
input LO selectable switch, and an LO buffer. On-chip
baluns are also integrated to allow for single-ended RF
and LO inputs. The MAX9996 requires a nominal LO
drive of 0dBm, and supply current is guaranteed to be
below 240mA.
♦ +12.6dBm Input 1dB Compression Point
♦ 9.7dB Noise Figure
♦ 72dBc 2LO-2RF Spurious Rejection at
P
= -10dBm
RF
♦ Integrated LO Buffer
♦ Integrated RF and LO Baluns for Single-Ended
Inputs
♦ Low -3dBm to +3dBm LO Drive
The MAX9994/MAX9996 are pin compatible with the
MAX9984/MAX9986 815MHz to 995MHz mixers, mak-
ing this entire family of downconverters ideal for appli-
cations where a common PC board layout is used for
both frequency bands. The MAX9996 is also functional-
ly compatible with the MAX9993.
♦ Built-In SPDT LO Switch with 43dB LO1 to LO2
Isolation and 50ns Switching Time
♦ Pin Compatible with MAX9984/MAX9986 815MHz
to 995MHz Mixers
♦ Functionally Compatible with MAX9993
♦ External Current-Setting Resistors Provide Option
for Operating Mixer in Reduced Power/Reduced
Performance Mode
The MAX9996 is available in a compact, 20-pin, thin
QFN package (5mm x 5mm) with an exposed paddle.
Electrical performance is guaranteed over the extended
-40°C to +85°C temperature range.
♦ Lead-Free Package Available
Ordering Information
Applications
UMTS/WCDMA Base Stations
PKG
CODE
PART
TEMP RANGE PIN-PACKAGE
DCS1800/PCS1900 EDGE Base Stations
20 Thin QFN-EP*
-40°C to +85°C
MAX9996ETP
MAX9996ETP-T
T2055-3
cdmaOne™ and cdma2000® Base Stations
PHS/PAS Base Stations
Predistortion Receivers
Fixed Broadband Wireless Access
Wireless Local Loop
5mm × 5mm
20 Thin QFN-EP*
-40°C to +85°C
T2055-3
T2055-3
T2055-3
5mm × 5mm
20 Thin QFN-EP*
5mm × 5mm
MAX9996ETP+D -40°C to +85°C
20 Thin QFN-EP*
5mm × 5mm
Private Mobile Radios
MAX9996ETP+TD -40°C to +85°C
*EP = Exposed paddle.
Military Systems
Microwave Links
+ = Lead free. D = Dry pack. T = Tape-and-reel.
Digital and Spread-Spectrum Communication
Systems
cdma2000 is a registered trademark of Telecommunications
Industry Association.
cdmaOne is a trademark of CDMA Development Group.
Pin Configuration/Functional Diagram and Typical
Application Circuit appear at end of data sheet.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
CC
IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (V
TAP........................................................................-0.3V to +1.4V
LO1, LO2, LEXT to GND........................................-0.3V to +0.3V
RF, LO1, LO2 Input Power .............................................+12dBm
RF (RF is DC shorted to GND through a balun) .................50mA
V
to GND...........................................................-0.3V to +5.5V
θ
θ
.................................................................................+38°C/W
.................................................................................+13°C/W
JA
JC
+ 0.3V)
CC
Operating Temperature Range (Note A) ....T = -40°C to +85°C
C
Junction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Continuous Power Dissipation (T = +70°C)
A
20-Pin Thin QFN-EP (derate 26.3mW/°C above +70°C)...........2.1W
Note A: T is the temperature on the exposed paddle of the package.
C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(MAX9996 Typical Application Circuit, V
= +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to V
through
CC
CC
inductive chokes, R = 806Ω, R = 549Ω, T = -40°C to +85°C, unless otherwise noted. Typical values are at V
= +5V, T
=
1
2
C
CC
C
+25°C, unless otherwise noted.)
PARAMETER
Supply Voltage
SYMBOL
CONDITIONS
MIN
TYP
5.00
206
MAX
5.25
240
0.8
UNITS
V
4.75
V
mA
V
CC
CC
Supply Current
I
LO_SEL Input-Logic Low
LO_SEL Input-Logic High
V
IL
V
2
V
IH
AC ELECTRICAL CHARACTERISTICS
(MAX9996 Typical Application Circuit, V
= +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources, P
= -3dBm to
> f , T = -40°C to +85°C,
CC
LO
+3dBm, P = -5dBm, f = 1700MHz to 2200MHz, f
= 1900MHz to 2400MHz, f = 200MHz, f
RF
RF
LO
IF
LO RF C
unless otherwise noted. Typical values are at V
= +5V, P = -5dBm, P = 0dBm, f = 1900MHz, f = 2100MHz, f = 200MHz,
CC
RF LO RF LO IF
T
C
= +25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
1700
1900
1400
40
TYP
MAX
UNITS
RF Frequency Range
f
(Note 3)
(Note 3)
2200
2400
2000
350
MHz
RF
LO Frequency Range
f
MHz
LO
MAX9994
IF Frequency Range
f
MHz
dB
IF
Conversion Gain
G
P
< +2dBm, T = +25°C
7.0
8.3
9.0
C
RF
A
Gain Variation Over Temperature
Input Compression Point
T
= -40°C to +85°C
0.75
12.6
dB
C
P
(Note 4)
dBm
1dB
Two tones:
f
P
P
= 2000MHz, f
= -5dBm/tone, f = 2200MHz,
LO
= 2001MHz,
RF1
RF2
Input Third-Order Intercept Point
IIP3
23.5
26.5
0.5
dBm
dB
RF
LO
= 0dBm, T = +25°C
A
Input IP3 Variation Over
Temperature
T
= -40°C to +85°C
C
2
_______________________________________________________________________________________
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX9996 Typical Application Circuit, V
= +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources, P
= -3dBm to
> f , T = -40°C to +85°C,
CC
LO
+3dBm, P = -5dBm, f = 1700MHz to 2200MHz, f
= 1900MHz to 2400MHz, f = 200MHz, f
RF
RF
LO
IF
LO RF C
unless otherwise noted. Typical values are at V
= +5V, P = -5dBm, P = 0dBm, f = 1900MHz, f = 2100MHz, f = 200MHz,
CC
RF LO RF LO IF
T
C
= +25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Noise Figure
NF
Single sideband
9.7
dB
P
f
= 5dBm, f = 2000MHz,
RF
RF
LO
Noise Figure Under-Blocking
LO Drive
19
dB
= 2190MHz, f
= 2100MHz (Note 5)
BLOCK
-3
+3
dBm
P
P
P
P
= -10dBm
= -5dBm
= -10dBm
= -5dBm
72
67
87
77
49
43
-20
-30
40
50
15
RF
RF
RF
RF
2 x 2
3 x 3
2LO-2RF
3LO-3RF
Spurious Response at IF
dBc
LO2 selected, 1900MHz < f < 2100MHz
LO
LO1 to LO2 Isolation
dB
LO1 selected, 1900MHz < f < 2100MHz
LO
Maximum LO Leakage at RF Port
Maximum LO Leakage at IF Port
Minimum RF-to-IF Isolation
LO Switching Time
P
P
= +3dBm
= +3dBm
dBm
dBm
dB
LO
LO
50% of LOSEL to IF settled to within 2°
ns
RF Port Return Loss
dB
LO1/2 port selected,
LO2/1 and IF terminated
16
26
20
LO Port Return Loss
IF Port Return Loss
dB
dB
LO1/2 port unselected,
LO2/1 and IF terminated
LO driven at 0dBm, RF terminated into 50Ω,
differential 200Ω
Note 1: Guaranteed by design and characterization.
Note 2: All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit.
Note 3: Operation outside this range is possible, but with degraded performance of some parameters.
Note 4: Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm.
Note 5: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all
SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021.
_______________________________________________________________________________________
3
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics
(MAX9996 Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 200MHz, unless otherwise noted.)
LO RF LO RF IF
CC
CONVERSION GAIN vs. RF FREQUENCY
CONVERSION GAIN vs. RF FREQUENCY
CONVERSION GAIN vs. RF FREQUENCY
11
10
9
11
10
9
11
10
9
T
C
= -25°C
P
LO
= -3dBm, 0dBm, +3dBm
8
8
8
V
= 4.75V, 5.0V, 5.25V
CC
T
= +85°C
C
T
C
= +25°C
7
7
7
6
6
6
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
INPUT IP3 vs. RF FREQUENCY
INPUT IP3 vs. RF FREQUENCY
28
27
26
25
24
23
22
28
27
26
25
24
23
22
21
28
27
26
25
24
23
22
V
= 4.75V, 5.0V
CC
T
= +25°C
C
V
CC
= 5.25V
P
= -3dBm, 0dBm, +3dBm
LO
T
C
= -25°C
T
C
= +85°C
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
NOISE FIGURE vs. RF FREQUENCY
NOISE FIGURE vs. RF FREQUENCY
NOISE FIGURE vs. RF FREQUENCY
13
12
11
10
9
12
11
10
9
12
11
10
9
P
= 0dBm
V
= 5.25V
LO
CC
P
LO
= -3dBm
T
C
= +85°C
T
C
= +25°C
V
CC
= 5.0V
P
= +3dBm
LO
V
CC
= 4.75V
T
C
= -25°C
8
8
8
7
6
7
7
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
4
_______________________________________________________________________________________
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 200MHz, unless otherwise noted.)
LO RF LO RF IF
CC
2LO-2RF RESPONSE vs. RF FREQUENCY
2LO-2RF RESPONSE vs. RF FREQUENCY
2LO-2RF RESPONSE vs. RF FREQUENCY
85
80
75
70
65
60
55
50
45
85
80
75
70
65
60
55
50
45
85
80
75
70
65
60
55
50
45
P
RF
= -5dBm
P
RF
= -5dBm
P
RF
= -5dBm
P
LO
= +3dBm
T
C
= +85°C
P
= 0dBm
LO
V
= 5.25V
V
= 5.0V
CC
CC
T
C
= +25°C
V
= 4.75V
CC
P
LO
= -3dBm
T
C
= -25°C
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
3LO-3RF RESPONSE vs. RF FREQUENCY
3LO-3RF RESPONSE vs. RF FREQUENCY
3LO-3RF RESPONSE vs. RF FREQUENCY
95
90
85
80
75
70
65
60
55
95
90
85
80
75
70
65
60
55
95
90
85
80
75
70
65
60
55
P
= -5dBm
P
= -5dBm
RF
P
= -5dBm
RF
RF
V
= 4.75V
CC
T
= +85°C
C
P
LO
= -3dBm, 0dBm, +3dBm
V
CC
= 5.0V
2100
T
= +25°C
C
V
= 5.25V
CC
T
C
= -25°C
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
1500
1700
1900
2300
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
INPUT P
vs. RF FREQUENCY
INPUT P
vs. RF FREQUENCY
INPUT P
vs. RF FREQUENCY
1dB
1dB
1dB
15
14
13
12
11
10
15
14
13
12
11
10
15
14
13
12
11
10
V
= 5.25V
CC
T
= +85°C
C
P
= -3dBm, 0dBm, +3dBm
LO
T
= +25°C
V
= 5.0V
C
CC
T
= -25°C
C
V
CC
= 4.75V
1700
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
1500
1900
2100
2300
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
_______________________________________________________________________________________
5
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 200MHz, unless otherwise noted.)
LO RF LO RF IF
CC
LO SWITCH ISOLATION
vs. LO FREQUENCY
LO SWITCH ISOLATION
vs. LO FREQUENCY
LO SWITCH ISOLATION
vs. LO FREQUENCY
50
45
40
35
30
50
45
40
50
T
= -25°C
C
45
40
35
30
T
C
= +85°C
V
= 4.75V, 5.0V, 5.25V
CC
T
C
= +25°C
P
LO
= -3dBm, 0dBm, +3dBm
35
30
1700
1900
2100
2300
2500
1700
1900
2100
2300
2500
2500
2500
1700
1900
2100
2300
2500
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
-20
-25
-30
-35
-40
-45
-50
-55
-60
-20
-25
-30
-35
-40
-45
-50
-55
-60
-20
-25
-30
-35
-40
-45
-50
-55
P
= +3dBm
LO
T
C
= -25°C
V
= 5.25V
CC
V
CC
= 5.0V
P
= 0dBm
LO
V
= 4.75V
CC
P
LO
= -3dBm
T
C
= +25°C
T
C
= +85°C
1700
1900
2100
2300
2500
1700
1900
2100
2300
2500
1700
1900
2100
2300
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
-10
-15
-20
-25
-30
-10
-10
-15
-20
-25
-30
-15
-20
-25
-30
V
= 5.25V
CC
V
CC
= 4.75V
1900
V
= 5.0V
CC
T
= -25°C, +25°C, +85°C
C
P
LO
= -3dBm, 0dBm, +3dBm
1700
2100
2300
1700
1900
2100
2300
2500
1700
1900
2100
2300
2500
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO FREQUENCY (MHz)
6
_______________________________________________________________________________________
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, V
= +5.0V, P = 0dBm, P = -5dBm, f > f , f = 200MHz, unless otherwise noted.)
LO RF LO RF IF
CC
RF-TO-IF ISOLATION
vs. RF FREQUENCY
RF-TO-IF ISOLATION
vs. RF FREQUENCY
RF-TO-IF ISOLATION
vs. RF FREQUENCY
60
60
55
50
45
40
35
30
60
55
50
45
40
35
30
T
= +85°C
C
55
50
45
40
35
30
T
= +25°C
C
T
C
= -25°C
V = 4.75V, 5.0V, 5.25V
CC
P
LO
= -3dBm, 0dBm, +3dBm
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
1500
1700
1900
2100
2300
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF PORT RETURN LOSS
vs. RF FREQUENCY
IF PORT RETURN LOSS
vs. IF FREQUENCY
LO SELECTED RETURN LOSS
vs. LO FREQUENCY
0
5
0
0
5
10
15
20
25
30
35
40
45
50
5
10
15
20
25
30
35
40
10
15
20
25
30
35
40
P
LO
= +3dBm
P
LO
= -3dBm
P
LO
= -3dBm, 0dBm, +3dBm
V
CC
= 4.75V, 5.0V, 5.25V
P
LO
= 0dBm
1500
1700
1900
2100
2300
2500
50
100
150
200
250
300
350
1500
1700
1900
2100
2300
2500
RF FREQUENCY (MHz)
IF FREQUENCY (MHz)
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS
vs. LO FREQUENCY
SUPPLY CURRENT
vs. TEMPERATURE (T )
C
0
5
230
V
CC
= 5.25V
220
210
200
190
180
170
10
15
20
25
30
35
P
LO
= -3dBm, 0dBm, +3dBm
V
= 4.75V
CC
V
= 5.0V
CC
40
1500
1700
1900
2100
2300
2500
-30
-10
10
30
50
70
90
LO FREQUENCY (MHz)
TEMPERATURE (°C)
_______________________________________________________________________________________
7
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Pin Description
PIN
NAME
FUNCTION
Power-Supply Connection. Bypass each V
Application Circuit.
pin to GND with capacitors as shown in the Typical
CC
1, 6, 8, 14
V
CC
Single-Ended 50Ω RF Input. This port is internally matched and DC shorted to GND through a balun.
Requires an external DC-blocking capacitor.
2
3
RF
Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the
Typical Application Circuit.
TAP
GND
4, 5, 10, 12,
13, 17
Ground
7
9
LOBIAS
LOSEL
LO1
Bias Resistor for Internal LO Buffer. Connect a 549Ω 1% resistor from LOBIAS to the power supply.
Local Oscillator Select. Logic control input for selecting LO1 or LO2.
Local Oscillator Input 1. Drive LOSEL low to select LO1.
11
15
LO2
Local Oscillator Input 2. Drive LOSEL high to select LO2.
External Inductor Connection. Connect a low-ESR, 10nH inductor from LEXT to GND. This inductor
carries approximately 100mA DC current.
16
LEXT
Differential IF Outputs. Each output requires external bias to V
Typical Application Circuit).
through an RF choke (see the
CC
18, 19
IF-, IF+
20
EP
IFBIAS
GND
IF Bias Resistor Connection for IF Amplifier. Connect an 806Ω resistor from IFBIAS to GND.
Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias.
This device can operate in low-side LO injection appli-
Detailed Description
cations with an extended LO range, but performance
The MAX9996 high-linearity downconversion mixer pro-
vides 8.3dB of conversion gain and 26.5dBm of IIP3,
with a typical 9.7dB noise figure. The integrated baluns
and matching circuitry allow for 50Ω single-ended inter-
faces to the RF and the two LO ports. A single-pole, dou-
ble-throw (SPDT) switch provides 50ns switching time
between the two LO inputs with 43dB of LO-to-LO isola-
tion. Furthermore, the integrated LO buffer provides a
high drive level to the mixer core, reducing the LO drive
required at the MAX9996’s inputs to a -3dBm to +3dBm
range. The IF port incorporates a differential output,
which is ideal for providing enhanced IIP2 performance.
degrades as f
continues to decrease. The
LO
MAX9994—a variant of the MAX9996—provides better
low-side performance since it is tuned for a lower LO
range of 1400MHz to 2000MHz.
RF Input and Balun
The MAX9996 RF input is internally matched to 50Ω,
requiring no external matching components. A DC-
blocking capacitor is required because the input is
internally DC shorted to ground through the on-chip
balun. Input return loss is typically 15dB over the entire
1700MHz to 2200MHz RF frequency range.
Specifications are guaranteed over broad frequency
ranges to allow for use in UMTS, cdma2000, and
2G/2.5G/3G DCS1800 and PCS1900 base stations. The
MAX9996 is specified to operate over a 1700MHz to
2200MHz RF frequency range, a 1900MHz to 2400MHz
LO frequency range, and a 40MHz to 350MHz IF fre-
quency range. Operation beyond these ranges is pos-
sible; see the Typical Operating Characteristics for
additional details.
LO Inputs, Buffer, and Balun
The MAX9996 can be used for either high-side or low-
side injection applications with a 1900MHz to 2400MHz
LO frequency range. For a device with a 1400MHz to
2000MHz LO frequency range, refer to the MAX9994
data sheet. As an added feature, the MAX9996 includes
an internal LO SPDT switch that can be used for fre-
quency-hopping applications. The switch selects one of
the two single-ended LO ports, allowing the external
oscillator to settle on a particular frequency before it is
8
_______________________________________________________________________________________
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
switched in. LO switching time is typically less than
50ns, which is more than adequate for virtually all GSM
applications. If frequency hopping is not employed, set
the switch to either of the LO inputs. The switch is con-
trolled by a digital input (LOSEL): logic-high selects
LO2, logic-low selects LO1. To avoid damage to the
The IF output impedance is 200Ω (differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance down to a 50Ω single-
ended output (see the Typical Application Circuit).
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are
optimized by fine tuning resistors R1 and R2. If
reduced current is required at the expense of perfor-
mance, contact the factory for details. If the 1% bias
resistor values are not readily available, substitute stan-
dard 5% values.
part, voltage must be applied to V
before digital logic
CC
is applied to LOSEL. LO1 and LO2 inputs are internally
matched to 50Ω, requiring only a 22pF DC-
blocking capacitor.
A two-stage internal LO buffer allows a wide input
power range for the LO drive. All guaranteed specifica-
tions are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO inputs to the IF out-
puts are integrated on-chip.
LEXT Inductor
LEXT serves to improve the LO-to-IF and RF-to-IF leak-
age. The inductance value can be adjusted by the user to
optimize the performance for a particular frequency
band. Since approximately 100mA flows through this
inductor, it is important to use a low-DCR wire-wound coil.
High-Linearity Mixer
The core of the MAX9996 is a double-balanced, high-
performance passive mixer. Exceptional linearity is pro-
vided by the large LO swing from the on-chip LO
buffer. When combined with the integrated IF ampli-
fiers, the cascaded IIP3, 2LO-2RF rejection, and NF
performance is typically 26.5dBm, 72dBc, and 9.7dB,
respectively.
If the LO-to-IF and RF-to-IF leakage are not critical
parameters, the inductor can be replaced by a short
circuit to ground.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that mul-
tiple vias be used to connect this pad to the lower level
ground planes. This method provides a good RF/ther-
mal conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX9996 Evaluation Kit can be used as a
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
Differential IF Output Amplifier
The MAX9996 mixer has a 40MHz to 350MHz IF fre-
quency range. The differential, open-collector IF output
ports require external pullup inductors to V . Note that
CC
these differential outputs are ideal for providing
enhanced 2LO-2RF rejection performance. Single-
ended IF applications require a 4:1 balun to transform
the 200Ω differential output impedance to a 50Ω single-
ended output. After the balun, the IF return loss is bet-
ter than 15dB.
Applications Information
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω.
No matching components are required. Return loss at
the RF port is typically 15dB over the entire input range
(1700MHz to 2200MHz) and return loss at the LO ports
is typically better than 16dB (1900MHz to 2400MHz).
RF and LO inputs require only DC-blocking capacitors
for interfacing.
frequency circuit stability. Bypass each V
pin and
CC
TAP with the capacitors shown in the Typical Application
Circuit; see Table 1. Place the TAP bypass capacitor to
ground within 100 mils of the TAP pin.
_______________________________________________________________________________________
9
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
be soldered to a ground plane on the PC board, either
directly or through an array of plated via holes.
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9996’s 20-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
which the MAX9996 is mounted be designed to con-
duct heat from the EP. In addition, provide the EP with a
low-inductance path to electrical ground. The EP MUST
Chip Information
TRANSISTOR COUNT: 1414
PROCESS: SiGe BiCMOS
Table 1. Component List Referring to the Typical Application Circuit
COMPONENT
VALUE
470nH
10nH
DESCRIPTION
Wire-wound high-Q inductors (0805)
L1, L2
L3
Wire-wound high-Q inductor (0603)
Microwave capacitor (0603)
Microwave capacitor (0603)
Microwave capacitors (0603)
Microwave capacitors (0603)
Microwave capacitors (0603)
Microwave capacitor (0402)
1% resistor (0603)
C1
4pF
C4
10pF
C2, C6, C7, C8, C10, C12
22pF
C3, C5, C9, C11
0.01µF
150pF
150pF
806Ω
C13, C14
C15
R1
R2
549Ω
1% resistor (0603)
R3
7.15Ω
4:1 balun
MAX9996
1% resistor (1206)
T1
IF balun
U1
Maxim IC
Pin Configuration/Functional Diagram
20
18
19
16
17
V
CC
1
2
3
4
15
14
13
12
11
LO2
V
RF
CC
MAX9996
TAP
GND
GND
LO1
GND
GND
5
6
7
8
9
10
10 ______________________________________________________________________________________
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Typical Application Circuit
V
CC
T1
3
6
4
IF
R3
OUTPUT
L1
L2
2
C13
1
C15
17
C14
R1
L3
V
CC
19
18
16
20
C12
C3
C2
V
CC
LO2
LO2
INPUT
1
2
3
4
5
15
C1
MAX9996
V
CC
RF
INPUT
RF
TAP
14
13
12
11
V
CC
C11
C5
GND
GND
C4
GND
GND
C10
LO1
INPUT
LO1
6
7
8
9
10
R2
C7
V
CC
LOSEL
INPUT
C6
C8
C9
V
CC
______________________________________________________________________________________ 11
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
D2
D
b
0.10 M
C A B
C
L
D2/2
D/2
k
L
MARKING
XXXXX
E/2
E2/2
C
(NE-1) X
e
L
E2
E
PIN # 1 I.D.
0.35x45∞
DETAIL A
e
PIN # 1
I.D.
(ND-1) X
e
DETAIL B
e
L
C
C
L
L1
L
L
L
e
e
0.10
C
A
0.08
C
C
A3
A1
PACKAGE OUTLINE,
16, 20, 28, 32L THIN QFN, 5x5x0.8mm
1
-DRAWING NOT TO SCALE-
21-0140
G
2
COMMON DIMENSIONS
20L 5x5 28L 5x5
EXPOSED PAD VARIATIONS
D2 E2
MIN. NOM. MAX. MIN. NOM. MAX. ±0.15
DOWN
BONDS
ALLOWED
L
PKG.
SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX.
16L 5x5
32L 5x5
PKG.
CODES
T1655-1
T1655-2
3.00 3.10 3.20 3.00 3.10 3.20
3.00 3.10 3.20 3.00 3.10 3.20
NO
YES
NO
A
**
**
**
**
0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80
0.02 0.05 0.02 0.05 0.02 0.05 0.02 0.05
0.20 REF. 0.20 REF. 0.20 REF. 0.20 REF.
A1
0
0
0
0
T1655N-1 3.00 3.10 3.20 3.00 3.10 3.20
A3
b
T2055-2
T2055-3
T2055-4
T2055-5
3.00 3.10 3.20 3.00 3.10 3.20
3.00 3.10 3.20 3.00 3.10 3.20
3.00 3.10 3.20 3.00 3.10 3.20
NO
YES
NO
Y
0.25 0.30 0.35 0.25 0.30 0.35 0.20 0.25 0.30 0.20 0.25 0.30
4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10
4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10
**
**
D
E
3.15 3.25 3.35 3.15 3.25 3.35 0.40
e
0.80 BSC.
0.25
0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50
0.65 BSC.
0.50 BSC.
0.50 BSC.
T2855-1
T2855-2
3.15 3.25 3.35 3.15 3.25 3.35
2.60 2.70 2.80 2.60 2.70 2.80
NO
NO
**
**
**
**
k
-
-
0.25
-
-
0.25
-
-
0.25
-
-
L
T2855-3
T2855-4
3.15 3.25 3.35 3.15 3.25 3.35
2.60 2.70 2.80 2.60 2.70 2.80
2.60 2.70 2.80 2.60 2.70 2.80
3.15 3.25 3.35 3.15 3.25 3.35
YES
YES
NO
L1
-
-
-
-
-
-
-
-
-
-
-
-
N
ND
16
4
20
5
28
7
32
8
T2855-5
T2855-6
T2855-7
T2855-8
**
**
**
NO
YES
4
5
7
8
NE
2.80
3.35
3.35
3.20
2.60 2.70
3.15 3.25
2.60 2.70 2.80
3.15 3.25 3.35
3.15 3.25 3.35
3.00 3.10 3.20
WHHB
WHHC
WHHD-1
WHHD-2
JEDEC
0.40
Y
N
NO
T2855N-1 3.15 3.25
**
**
**
NOTES:
T3255-2
T3255-3
T3255-4
3.00 3.10
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
3.00 3.10 3.20 3.00 3.10 3.20
3.00 3.10 3.20 3.00 3.10 3.20
YES
NO
**
**
NO
T3255N-1 3.00 3.10 3.20 3.00 3.10 3.20
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL
CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE
OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1
IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
**SEE COMMON DIMENSIONS TABLE
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm
FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1,
T2855-3 AND T2855-6.
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY.
12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY.
PACKAGE OUTLINE,
16, 20, 28, 32L THIN QFN, 5x5x0.8mm
2
-DRAWING NOT TO SCALE-
21-0140
G
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2004 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products, Inc.
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