MX7545SQ/883B [MAXIM]
D/A Converter,;
| 型号： | MX7545SQ/883B |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | D/A Converter, 转换器 |
| 文件： | 总5页 (文件大小：25K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SCOPE: CMOS, 12-BIT BUFFERED, MULTIPLYING D/A CONVERTER
Device Type
Generic Number
MX7545S(x)/883B
MX7545T(x)/883B
MX7545U(x)/883B
MX7545GU(x)/883B
01
02
03
04
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter
MAXIM SMD
Mil-Std-1835
Case Outline
Package Code
Q
E
R
2
GDIP1-T20 or CDIP2-T20
CQCC1-N20
20 LEAD CERDIP
20 LCC
J20
L20
Absolute Maximum Ratings:
VREF to GND ...............................................................................................……. -0.3V, + 17V
Digital Input to DGND ...............................................................................…..... -0.3V to VDD
VRFB to GND ...........................................................................................................……. ±25V
V
REF to GND ...........................................................................................................……. ±25V
VOUT1 to AGND ..........................................................................................……. -0.3V to VDD
AGND to DGND ........................................................................................……. -0.3V to VDD
Lead Temperature (soldering, 10 seconds) ........................................................................ +300°C
Storage Temperature ........................................................................................... -65°C to +150°C
Continuous Power Dissipation ..........................................................................…….. TA=+70°C
20 pin CERDIP(derate 11.1mW/°C above +70°C) .................................................…….. 889mW
20 pin LCC(derate 9.1mW/°C above +70°C) ..........................................................……. 727mW
Junction Temperature TJ ....................................................................................…….... +150°C
Thermal Resistance, Junction to Case, ΘJC
20 pin CERDIP................................................................................................…….... 40°C/W
20 pin LCC .....................................................................................................………. 20°C/W
Thermal Resistance, Junction to Ambient, ΘJA:
20 pin CERDIP................................................................................................…….... 90°C/W
20 pin LCC ...................................................................................................………. 110°C/W
Recommended Operating Conditions
Ambient Operating Range (TA) .........................................................……….. -55°C to +125°C
Supply Voltage Range .............................................................................………... +5V to +15V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
----------------------------
Electrical Characteristics of MX7545/883B for
SMD 5962-87702
19-0277
Page 2 of
Rev. C
7
TABLE 1. ELECTRICAL TESTS:
CONDITIONS
-55 °C ≤TA≤ +125°C 1/
Unless otherwise specified
Group A
Subgroup
Device
type
Limits Limits Units
Min Max
TEST
Symbol
RES
All
Resolution NOTE 4
Relative Accuracy
VDD=+5V and +15V
VDD=+5V and +15V
12
Bits
01
02
03,04
RA
1,2,3
LSB
±2.0
±1.0
±0.5
±4.0
01
10-bit monotonic, VDD=+5V and
+15V
LSB
LSB
Differential Nonlinearity
Gain Error NOTE 3
DNL
AE
1,2,3
1,2,3
02,03,
04
12-bit monotonic, VDD=+5V and
+15V
±1.0
01
02
V
DD=5V
±20
±10
03
04
1
2,3
±5.0
±6.0
1
2,3
±1.0
±2.0
±25
±15
±10
01
02
03
V
DD=15V
1,2,3
LSB
Gain Error NOTE 3
AE
1
2,3
±6.0
±7.0
04
Gain Temperature
Coefficient NOTE 4
TCAE
VDD=+5V
±5 ppm/°C
All
VDD=+15V
±10
Power Supply Rejection
PSRR
1
2,3
∆VDD=±5%, VDD=5V
±0.015
±0.03
All
All
%/%
nA
1
2,3
∆VDD=±5%, VDD=15V
±0.01
±0.02
±10
Out1 Leakage Current
IOUT1
FTE
VDD=+5V & +15V, ___ __
D0-D11=0V, WR=CS=0V
1
2,3
±200
Feedthrough Error
NOTE 4, NOTE 5
VREF=±10V, 10kHz sine wave
V
DD=5V
All
4,5,6
10 mVp-p
VREF=±10V, 10kHz sine wave
DD=15V
V
All
All
Input Resistance
Digital Input High
Voltage
RIN
VIH
VDD=+5V and +15V
VDD=+5V
1,2,3
1,2,3
7
2.4
25
kΩ
V
VDD=+15V
VDD=+5V
13.5
Digital Input Low
Voltage
VIL
0.8
1.5
All
1,2,3
V
V
DD=+15V
----------------------------
Electrical Characteristics of MX7545/883B for
SMD 5962-87702
19-0277
Page 3 of
Rev. C
7
CONDITIONS
-55 °C ≤TA≤ +125°C 1/
Unless otherwise specified
Group A Device
Limits
Min
Limits Units
Max
Subgroup
type
TEST
Symbol
All
Digital Input Leakage
Current
IIN
VIN=0V or VDD
VDD=+5V or +15V
1
2,3
±1.0 µA
±10
D0-D11, VDD=5V
___ __
5
Digital Input Capacitance
NOTE 2, NOTE 6
WR, CS, VDD=5V
20
pF
5
All
CIN
4
D0-D11, VIN=0V, VDD=15V
___ __
WR, CS, VIN=0V, VDD=15V
20
70
VDD=5V
___ __
D0-D11=0V, WR, CS=0V
pF
Output Capacitance
NOTE 2, NOTE 6
V
DD=5V
___ __
200
COUT1
D0-D11=VDD, WR, CS=0V
All
4
VDD=15V
___ __
70
D0-D11=0V, WR, CS=0V
V
DD=15V
___ __
200
D0-D11=VDD, WR, CS=0V
Chip Select to Write-
Setup Time NOTE 7
tCS
VDD=5V
170
All
All
All
9,10,11
9,10,11
9,10,11
ns
ns
VDD=15V
VDD=+5V and +15V
95
0
Chip Select to Write-Hold tCH
Time NOTE 7
Write Pulse Width NOTE tWR
7
170
tCS±tWR, tCH±0, VDD=+5V
ns
ns
95
tCS≥tWR, tCH≥0, VDD=15V
VDD=5V
All
Data-Setup Time
NOTE 7
tDS
9,10,11
150
VDD=15V
80
5
All
All
Data-Hold Time NOTE 7 tDH
VDD=+5V and +15V
All digital inputs VIL or VIH
VDD=+5V and +15V
9,10,11
1,2,3
ns
2.0 mA
Supply Current
IDD
1
2,3
All digital inputs 0V or VDD
VDD=+5V and +15V
100
500
µA
NOTE 1: VDD=+15V, VOUT1=0V; VREF=+10V, AGND=DGND, unless otherwise specified.
NOTE 2: These parameters may be guaranteed if not tested at 25°C to the limits specified in Table 1.
NOTE 3: Measured using internal feedback resistor and includes effect of 5ppm max gain TC.
NOTE 4: These parameters may be guaranteed if not tested over the full military temp range to the
limits specified in Table 1.
NOTE 5: Feedthrough error can be reduced by connecting the metal lid on the package to ground.
NOTE 6: Subgroup 4 (CIN measurement) shall be measured only for the initial test and after process
or design changes which may affect capacitance.
NOTE 7: Timing Diagram. See Commercial Datasheet.
----------------------------
Electrical Characteristics of MX7545/883B for
SMD 5962-87702
19-0277
Page 4 of
Rev. C
7
ORDERING INFORMATION:
Package
20 pin CERDIP
20 pin LCC
20 pin CERDIP
20 pin LCC
20 pin CERDIP
20 pin LCC
Pkg. Code
MAXIM PART #
MX7545SQ/883B
MX7545SE/883B
MX7545TQ/883B
MX7545TE/883B
MX7545UQ/883B
MX7545UE/883B
MX7545GUQ/883B
MX7545GUE/883B
SMD Number
01
01
02
02
03
03
04
04
J20
L20
J20
L20
J20
L20
J20
L20
5962-8770201RA
5962-87702012C
5962-8770202RA
5962-87702022C
5962-8770203RA
5962-87702032C
5962-8770204RA
5962-87702042C
20 pin CERDIP
20 pin LCC
TERMINAL CONNECTIONS:
J20 & L20
Pin
1
2
3
4
5
6
OUT1
AGND
DGND
D11(MSB)
D10
D9
7
D8
8
D7
9
D6
10
11
12
13
14
15
16
D5
D4
D3
D2
D1
D0(LSB)
__
CS
17
___
WR
18
19
20
VDD
VREF
RFB
----------------------------
Electrical Characteristics of MX7545/883B for
SMD 5962-87702
19-0277
Page 5 of
Rev. C
7
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-
Std-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125°C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,
C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125°C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2.
ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Subgroups
per Method 5005, Table 1
Interim Electric Parameters
Method 5004
1
Final Electrical Parameters
Method 5005
1*, 2, 3
Group A Test Requirements
Method 5005
Group C and D End-Point Electrical Parameters
Method 5005
1, 2, 3, 4**, 5, 6, 9, 10***, 11***
1
*
PDA applies to Subgroup 1 only.
** Subgroup 4 shall be tested at initial qualification and upon redesign. Sample size will
be 116 units.
*** Subgroups 10 and 11, if not tested shall be guaranteed to the specified limits of Table 1.
----------------------------
Electrical Characteristics of MX7545/883B for
SMD 5962-87702
19-0277
Page 6 of
Rev. C
7
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