MXD1013SA [MAXIM]
3-in-1 Silicon Delay Line; 3合1硅延迟线
| 型号： | MXD1013SA |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | 3-in-1 Silicon Delay Line |
| 文件： | 总6页 (文件大小：60K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-0394; Rev 0; 12/97
3 -in -1 S ilic o n De la y Lin e
MXD013
_______________Ge n e ra l De s c rip t io n
____________________________Fe a t u re s
♦ Improved Second Source to DS1013
♦ Available in Space-Saving 8-Pin µMAX Package
♦ 20mA Supply Current (vs. Dallas’ 40mA)
♦ Low Cost
The MXD1013 contains three independent, monolithic,
logic-buffered delay lines with delays ranging from
10ns to 200ns. Nominal accuracy is ±2ns for a 10ns to
60ns delay, ±3% for a 70ns to 100ns delay, and ±5%
for a 150ns to 200ns delay. Relative to hybrid solutions,
these devices offer enhanced performance and higher
reliability, and reduce overall cost. Each output can
drive up to ten standard 74LS loads.
♦ Three Separate Buffered Delays
♦ Delay Tolerance of ±2ns for MXD1013__010
The MXD1013 is available in multiple versions, each
offering a different combination of delay times. It comes
in the space-saving 8-pin µMAX package, as well as a
standard 8-pin SO and DIP. It is also offered in indus-
try-sta nd a rd 16-p in SO a nd 14-p in DIP p a c ka ging ,
allowing full compatibility with the DS1013 and other
delay-line products.
through MXD1013__060
♦ TTL/CMOS-Compatible Logic
♦ Leading- and Trailing-Edge Accuracy
♦ Custom Delays Available
______________Ord e rin g In fo rm a t io n
________________________Ap p lic a t io n s
Clock Synchronization
PART
TEMP. RANGE
0°C to +70°C
PIN-PACKAGE
Dice*
Digital Systems
MXD1013C/D___
MXD1013PA___
MXD1013PD___
MXD1013SA___
MXD1013SE___
MXD1013UA___
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
8 Plastic DIP
14 Plastic DIP
8 SO
_________________P in Co n fig u ra t io n s
16 Narrow SO
8 µMAX
TOP VIEW
*Dice are tested at T = +25°C.
A
Note: To complete the ordering information, fill in the blank with
the part number extension from the Part Numbers and Delay
Times table to indicate the desired delay per output.
IN1
IN2
1
2
3
4
8
7
6
5
V
CC
OUT1
OUT2
OUT3
MXD1013
IN3
___P a rt Nu m b e rs a n d De la y Tim e s
GND
PART NUMBER OUTPUT
PART NUMBER OUTPUT
EXTENSION
(MXD1013___)
DELAY
(ns)
EXTENSION
(MXD1013___)
DELAY
(ns)
DIP/SO/µMAX
010
012
015
020
025
030
035
040
045
10
12
15
20
25
30
35
40
45
050
060
070
075
080
090
100
150
200
50
60
IN
N.C.
IN2
1
2
3
4
5
6
7
14
V
CC
70
13 N.C.
12 OUT1
11 N.C.
10 OUT2
75
80
90
N.C.
IN3
MXD1013
100
150
200
N.C.
GND
9
8
N.C.
OUT3
DIP
Functional Diagram appears at end of data sheet.
Pin Configurations continued at end of data sheet.
________________________________________________________________ Maxim Integrated Products
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800.
For small orders, phone 408-737-7600 ext. 3468.
3 -in -1 S ilic o n De la y Lin e
ABSOLUTE MAXIMUM RATINGS
V
to GND..............................................................-0.5V to +6V
8-Pin SO (derate 5.9mW/°C above +70°C)....................471mW
16-Pin Narrow SO (derate 8.7mW/°C above +70°C) .....696mW
8-Pin µMAX (derate 4.1mW/°C above +70°C) ...............330mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10sec) .............................+300°C
CC
All Other Pins ..............................................-0.5V to (V + 0.5V)
Short-Circuit Output Current (1sec)....................................50mA
Continuous Power Dissipation (T = +70°C)
8-Pin Plastic DIP (derate 9.1mW/°C above +70°C) .......727mW
14-Pin Plastic DIP (derate 10.0mW/°C above +70°C) ...800mW
CC
A
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
MXD013
ELECTRICAL CHARACTERISTICS
(V = +5.0V ±5%, T = -40°C to +85°C, unless otherwise noted. Typical values are at T = +25°C.)(Note 1)
CC
A
A
PARAMETER
SYMBOL
CONDITIONS
MIN
4.75
2.2
TYP
MAX
UNITS
V
Supply Voltage
V
CC
(Note 2)
(Note 2)
(Note 2)
5.00
5.25
Input Voltage High
Input Voltage Low
Input Leakage Current
Active Current
V
IH
V
V
IL
0.8
1
V
I
L
0V ≤ V ≤ V
CC
-1
µA
mA
mA
mA
pF
IN
I
CC
V
CC
= 5.25V, period = minimum (Note 3)
20
5
70
-1
Output Current High
Output Current Low
Input Capacitance
I
OH
V
= 4.75V, V = 4.0V
CC OH
I
OL
V
= 4.75V, V = 0.5V
CC OL
12
C
T
A
= +25°C (Note 4)
10
IN
TIMING CHARACTERISTICS
(V = +5.0V ±5%, T = +25°C, unless otherwise noted.)
CC
A
PARAMETER
SYMBOL
CONDITIONS
(Note 5)
MIN
TYP
MAX
UNITS
Input Pulse Width
t
WI
100% of t
ns
PLH
Input-to-Output Delay
(leading edge)
See Part Number and
Delay Times table
t
t
(Notes 6, 7, 8)
(Notes 6, 7, 8)
ns
ns
PLH
PHL
Input-to-Output Delay
(trailing edge)
See Part Number and
Delay Times table
Power-Up Time
Period
t
100
ms
ns
PU
(Note 5)
3(t )
WI
Note 1: Specifications to -40°C are guaranteed by design, not production tested.
Note 2: All voltages referenced to GND.
Note 3: Measured with outputs open.
Note 4: Guaranteed by design.
Note 5: Pulse width and/or period specifications may be exceeded, but accuracy is application sensitive (i.e., layout, decoupling, etc.).
Note 6: = +5V at +25°C. Typical delays are accurate on both rising and falling edges within ±2ns for delays from 10ns to
V
CC
60ns, within ±3% for delays from 70ns to 100ns, and within ±5% for delays from 150ns to 200ns.
Note 7: The Part Number and Delay Times table provides typical delays at +25°C with V = +5V. The delays may shift with tem-
CC
perature and supply variations. The combination of temperature (from +25°C to 0°C, or +25°C to +70°C) and supply varia-
tion (from 5V to 4.75V, or 5V to 5.25V) could produce an additional typical delay of ±1.5ns or ±3%, whichever is greater.
Note 8: All output delays tend to vary unidirectionally with temperature or supply voltage variations (i.e., if OUT1 slows down, all
other outputs also slow down).
2
_______________________________________________________________________________________
3 -in -1 S ilic o n De la y Lin e
MXD013
__________________________________________Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s
(V = +5V, T = +25°C, unless otherwise noted.)
CC
A
MXD1013_ _100
ACTIVE CURRENT
vs. INPUT FREQUENCY
PERCENT CHANGE IN DELAY
vs. TEMPERATURE (OUT1)
2.0
1.5
1.0
0.5
0
11.0
ALL INPUTS CONNECTED TOGETHER
0V–3V INPUT
NO LOAD
10.5
10.0
9.5
9.0
8.5
8.0
7.5
7.0
6.5
t
PHL
t
PLH
t
PLH
t
PHL
-0.5
-1.0
-1.5
-2.0
MXD1013_ _030
MXD1013_ _075
6.0
-40 -20
0
20
40
60
80 100
0.0001 0.001 0.01
0.1
1
10
100
TEMPERATURE (°C)
INPUT FREQUENCY (MHz)
MXD1013_ _100
MXD1013_ _00
PERCENT CHANGE IN DELAY
vs. TEMPERATURE (OUT2)
PERCENT CHANGE IN DELAY
vs. TEMPERATURE (OUT3)
2.0
1.5
1.0
0.5
0
2.0
1.5
1.0
0.5
0
t
PHL
t
PLH
t
PLH
t
PHL
t
PHL
t
PHL
t
PLH
t
t
PHL
PLH
-0.5
-1.0
-1.5
-2.0
-0.5
-1.0
-1.5
-2.0
t
PLH
-40 -20
0
20
40
60
80 100
-40 -20
0
20
40
60
80 100
TEMPERATURE (°C)
TEMPERATURE (°C)
_______________________________________________________________________________________
3
3 -in -1 S ilic o n De la y Lin e
______________________________________________________________P in De s c rip t io n
PIN
NAME
FUNCTION
8-PIN
DIP/SO/µMAX
14-PIN DIP
16-PIN SO
1
2
3
4
5
6
7
8
1
3
1
4
IN1
IN2
First Independent Input
Second Independent Input
Third Independent Input
Device Ground
MXD013
5
6
IN3
7
8
GND
OUT3
OUT2
OUT1
8
9
Third Delayed Output
Second Delayed Output
First Delayed Output
Power-Supply Input
10
12
14
11
13
16
V
CC
2, 4, 6, 9, 11,
13
2, 3, 5, 7, 10,
12, 14, 15
—
N.C.
Not Connected
_______________De fin it io n s o f Te rm s
____________________Te s t Co n d it io n s
Period: The time elapsed between the first pulse’s
Ambient Temperature: +25°C
leading edge and the following pulse’s leading edge.
Supply Voltage (V ):
CC
5.0V ±0.1V
High = 3.0V ±0.1V
Low = 0.0V ±0.1V
50Ω max
Pulse Width (t ): The time elapsed on the pulse
WI
Input Pulse:
between the 1.5V level on the leading edge and the
1.5V level on the trailing edge, or vice versa.
Source Impedance:
Rise and Fall Times:
Pulse Width:
Input Rise Time (t
): The elapsed time between
RISE
the 20% and 80% points on the input pulse’s leading
edge.
3.0ns max
500ns max
1µs
Input Fall Time (t
): The time elapsed between
FALL
Period:
the 80% and 20% points on the input pulse’s trailing
edge.
Each output is loaded with a 74F04 input gate. Delay is
measured at the 1.5V level on the rising and falling
edges. The time delay due to the 74F04 is subtracted
from the measured delay.
Time Delay, Rising (t ): The time elapsed between
PLH
the 1.5V level on the input pulse’s leading edge and the
corresponding output pulse’s leading edge.
Time Delay, Falling (t
): The time elapsed between
PHL
the 1.5V level on the input pulse’s trailing edge and the
corresponding output pulse’s trailing edge.
4
_______________________________________________________________________________________
3 -in -1 S ilic o n De la y Lin e
MXD013
TIME
INTERVAL
COUNTER
PERIOD
MXD1013
74F04
t
t
FALL
RISE
PULSE
GENERATOR
TD
V
IH
2.4V
1.5V
0.6V
2.4V
1.5V
0.6V
1.5V
IN
50Ω
V
IL
74F04
t
WI
PULSE
GENERATOR
TD
50Ω
t
PHL
74F04
t
PLH
PULSE
GENERATOR
TD
50Ω
1.5V
1.5V
OUT
EACH OUTPUT IS LOADED WITH THE EQUIVALENT OF ONE 74F04.
THE DELAY OF THE 74F04 IS SUBTRACTED FROM THE MEASURED DELAY.
Figure 2. Test Circuit
Figure 1. Timing Diagram
Bo a rd La yo u t Co n s id e ra t io n s
Bypass the MXD1013 with a 0.1µF capacitor to mini-
mize the impact of high-speed switching on the power
supply. The power supply must be able to deliver the
required switching currents for proper operation.
__________ Ap p lic a t io n s In fo rm a t io n
S u p p ly a n d Te m p e ra t u re
Effe c t s o n De la y
Over the specified range, the MXD1013’s delays are
typically 2% accurate. Variations in supply voltage may
affect the MXD1013’s fixed output delays. Supply volt-
ages beyond the specified range may result with larger
variations. Although there might be a slight variance in
delays over temperature, the MXD1013 is internally
compensated to maintain its nominal values.
It is advisable to minimize trace lengths in order to
reduce board capacitance as well as the traveling dis-
tance between devices. Sockets and wire-wrapped
boards increase capacitance and should be avoided.
Lo a d in g Effe c t o n De la y Lin e s
Capacitive loads increase delay times as they increase
the rise and fall times of the delay lines. Other logic
devices increase the capacitance at the output of the
delays, which can affect device performance.
___________________Ch ip In fo rm a t io n
TRANSISTOR COUNT: 824
_______________________________________________________________________________________
5
3 -in -1 S ilic o n De la y Lin e
____P in Co n fig u ra t io n s (c o n t in u e d )
________________Fu n c t io n a l Dia g ra m
TOP VIEW
IN
N.C.
N.C.
IN2
1
2
3
4
5
6
7
8
16 V
CC
MXD1013
15 N.C.
14 N.C.
13 OUT1
12 N.C.
11 OUT2
10 N.C.
IN1
IN2
IN3
TD
TD
TD
OUT1
OUT2
OUT3
MXD013
MXD1013
N.C.
IN3
N.C.
GND
9
OUT3
SO
________________________________________________________P a c k a g e In fo rm a t io n
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
6 _____________________Ma x im In t e g ra t e d P ro d u c t s , 1 2 0 S a n Ga b rie l Drive , S u n n yva le , CA 9 4 0 8 6 4 0 8 -7 3 7 -7 6 0 0
© 1997 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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