CH101 [MAXWELL]

Transistor Output Optocoupler;


型号：	CH101
厂家：	MAXWELL TECHNOLOGIES
描述：	Transistor Output Optocoupler
文件：	总11页 (文件大小：488K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PART NUMBER

COMPONENT

CH100 Series

ISSUE 1

SPECIFICATION

May 2014

Component Specification

Transistor Optocouplers

With Very Low Operating Temperatures

M1077 IECQ

1077/M

Further copies of this document may be obtained from:

ISOCOM LIMITED

WASHINGTON, UK

NE38 0AH

www.isocom.uk.com

For sales enquiries, or further information, please contact our sales office at:

Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, NE38 0AH, UK

Tel: +44 0191 4166 546 Fax: +44 0191 4155 055

Page 1 of 11

Transistor Optocouplers

Very Low Operating Temperatures

■ CH100/101/102/103

■ CH100/101/102/103/L2

■ CH100/101/102/103/L2S

Features

Applications

▪ Released to European Standard and

Complies to Mil Std

▪ Space Radiation Equipment

▪ Military, high reliability system

▪ Medical instruments

▪ Suitable for Hybrid packaging

▪ Mos, Cmos Applications

▪ Data Transmission

▪ Total Ionizing Dose Tested to 150KRad(si)

▪ Displacement Damage to 1 MEV x 10¹²

▪ Low Temperature Operation upto -150°C

▪ 4 Pad LCC Package

▪ Flexibility in Design for mounting styles

▪ High Current Transfer Ratio

▪ Power Supply

▪ Logic Interfacing

. High Isolation Voltage upto 1000vdc

. Hermetically Sealed

Description

The CH100 has been designed and manufactured to meet the requirements of very low temperatures experienced

in harsh environments encounted by space applications. These devices can be wire bonded within a hybrid

application or mounted directly onto a PCB board offering the customer flexibility in their design.

They are single channel, hermetically sealed, Radiation Hard optically coupled isolators. Each channel is

composed of a infra-red emitting diode and a silicon phototransistor. The CH100 series was manufactured to meet

the JANS standard in conjunction with MIL-PRF-19500 procedures (please see next page for all other applicable

specifications). Package styles for this device include 4 Pad LCC.

For sales enquiries, or further information, please contact our sales office at:

Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, NE38 0AH, UK

Tel: +44 0191 4166 546 Fax: +44 0191 4155 055

Page 2 of 11

Standards

The following specifications have been complied with in the manufacturing of this product to JANS MIL-STD

requirements:

Military Compliance Specifications

MIL-PRF-19500 – General Specification for Discrete Semiconductor Devices

IECQ – M1077

Military Compliance Standards

MIL-STD-202 – Test Method Standard Electronic and Electrical Component Parts

MIL-STD-883 – Test Method Standard Microcircuits

MIL-STD-750 – Test Methods for Semiconductor Devices

ISO 9001:2008 – Manufacturing of Optocouplers and Optoelectronic components.

For sales enquiries, or further information, please contact our sales office at:

Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, NE38 0AH, UK

Tel: +44 0191 4166 546 Fax: +44 0191 4155 055

Page 3 of 11

Selection Guide Package Styles and Configuration Options

Package

4 pad LCC

Lead Style

Channels

Common Channel Wiring

Isocom Part Number and Options

Commercial

CH100/101/102/103

CH100/101/102/103/L2

CH100/101/102/103/L2S

Gold Plate

Defense Screen Level

Space Screen Level

Standard Gold Plate Finish

Solder Dipped

Option 20

Functional Diagrams

CH100

4 pad LCC

1 Channel

CH101

4 pad LCC

1 Channel

CH102

4 pad LCC

1 Channel

CH103

4 pad LCC

1 Channel

Device Marking

Manufacturer

ISOCOM

XXXXXXX

XXXX

Isocom Part Number

Date Code (XX year XX week)

For sales enquiries, or further information, please contact our sales office at:

Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, NE38 0AH, UK

Tel: +44 0191 4166 546 Fax: +44 0191 4155 055

Page 4 of 11

Outline Drawings

Absolute Maximum Ratings

T_A= 25°C U.O.S.

Storage Temperature

-65°C to +150°C

Operating Temperature

-150°C to +125°C

Lead Soldering Temperature

Input-to-Output Isolation Voltage

260°C 1.6mm from case for 10S

1000VDC

Input Diode

Forward DC Current

40mA

DC at (or below) +65°C Derates linearly to +125°C free

air temperature at the rate of 0.67mA/°C.

Reverse DC Voltage

Peak forward Current

Power Dissipation

1.0mA

60mW

Pw1µS, PRR<300pps  10µS ms

Derates linearly above 65°C at 1.0W/°C

Output Transistor

Collector-Emitter Voltage

Emitter-Collector Voltage

Collector Current

70V

50mA

300mW

BV_CEO

BV_ECO

Power Dissipation

Derates linearly above 25°C at 3.0W/°C

Coupled Device

Input to Output Isolation Voltage

Power Dissipation

1000V

360mW

SolderingTemperature,Soldering Iron 260,5

°C,s This part shall not be re-soldered until 3 minutes

have elapsed.

SolderingTemperature,Vapour Phase 220,40

°C,s This part shall not be re-soldered until 3 minutes

have elapsed.

ESD Classification

Class 2

Class 2 with minimum critical path voltage of 4,000 to

15,999V. MIL-STD-883

For sales enquiries, or further information, please contact our sales office at:

Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, NE38 0AH, UK

Tel: +44 0191 4166 546 Fax: +44 0191 4155 055

Page 5 of 11

Electrical Characteristics

Input Diode Electrical Characteristics T_A= 25°C U.O.S.

Parameter

Symbol

Test Conditions

I_F= 10mA

Min

1.3

1.1

Type

Max

1.8

100

Units

µA

Forward Voltage

V_F

I_F= 10mA -55°C

I_F= 10mA +125°C

V_R= 2.0V

Reverse Current

I_R

Output Detector Electrical Characteristics

Collector-Emitter

Breakdown Voltage

Emitter-Collector

Breakdown Voltage

Collector–Emitter Leakage

Current

I_C= 1mA

V(BR)

100

CEO

I_E= 0.1mA

V(BR)

I^CEO

ECO

VCE = 20v, IF = 0

VCE = 20v IF = 0, -55°C

VCE = 20v, IF = 0, +125°C

100

150

µA

Coupled Electrical Characteristics

DC Current Transfer Ratio

I_F= 1.0mA, V_CE= 5V

100

150

IC/IF

I_F= 10.0mA, V_CE= 5V (Note 1)

Collector-Emitter Saturation V_CE

I_C=10.0mA

0.3

Voltage

(Sat)

I_F= 20mA

Isolation Voltage

Input to Output Resistance

Rise Time

V in-out

R in-out

T = 5s (Note 2)

V_IO= 500V (Note 2)

R_L= 100Ohms

Vcc = 10V

500

1000

20.0

Vdc

Ω

µS

10⁵

I_F= 10mA

Fall Time

R_L= 100Ohms

Vcc = 10V

I_F= 10mA

R_L= 100Ohms

Vcc = 10V

I_F= 10mA

20.0

5.0

µS

Propagation Delay

H-L

tPHL

tPLH

Propagation Delay

L-H

R_L= 100Ohms

Vcc = 10V

5.0

I_F= 10mA

Notes:

Sample and hold pulse shall not be longer than 0.1 seconds. Duty cycle shall be 10.

Measurements with inputs shorted together and outputs shorted together.

For sales enquiries, or further information, please contact our sales office at:

Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, NE38 0AH, UK

Tel: +44 0191 4166 546 Fax: +44 0191 4155 055

Page 6 of 11

Electrical Measurements During and on Completion of Radiation Testing

Parameter

Symbol

Forward V_F

Test Conditions

I_F= 10mA

Min

1.3

Max

1.8

Units

Input

Diode

Voltage

Input

Current

Diode

Reverse I_R

V_R= 2.0V

100

µA

Photo Transistor Collector- ICEO

Emitter Dark Current

VCE = 20v, IF = 0

Coupled Current Transfer IC

Ratio

Collector-Emitter Saturation V_CE

I_F= 1.0mA, V_CE= 5V

I_F= 10.0mA, V_CE= 5V (note 1)

I_C=10.0mA

100

150

0.3

Voltage

(Sat)

I_F= 20mA

NOTE 1 = Sample and hold pulse shall be not longer than 0.1 seconds. Duty cycle shall be 10

NOTE 2 = Please note that if you require any parameters to be controlled to meet your design needs such as CTR,

V^F, ICEO, VCE(SAT), please contact Isocom Limited customer service team. We also offer a selection of

screening procedures that will match your needs.

For sales enquiries, or further information, please contact our sales office at:

Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, NE38 0AH, UK

Tel: +44 0191 4166 546 Fax: +44 0191 4155 055

Page 7 of 11

GROUP TESTING TO MIL-STD 750

GROUP

TEST

MIL-STD-750

READ AND

RECORD

Group A

SG1

Visual inspection & mechanical

dimensions

Method 2071

SG2

SG3

SG4

DC static test at 25°C

DC static test at 125°C and ‐55°C

Dynamic test at 25°C

yes

Group B

SG 1

SG 2

Physical dimensions

Solderability

Resistance to solvents

Thermal Shock

Method 2066

Method 2026

Method 1022

Method 1056 Cond. B, 25

cycles

SG 3

Temperature cycling

Method 1051, 100 cycles,

-55/+125°C

Hermetic seal fine and gross leak

Method 1071, Cond. H

(fine), Cond. C (gross)

pre and post

Electrical measurement

Decap internal visual inspection

Bond strength

yes

2075

Method 2037, Cond. D

Method 2017

yes

Die shear

SG 4

SG 5

Intermittent operation life

Method 1037, 1042, Cond

D, Tab.5-5

Method 1071, Cond. H

(fine), Cond. C (gross)

pre and post

Hermetic seal fine and gross leak

Electrical measurement

Bond strength

Acc. steady‐state operation life

yes

Method 2037, Cond. D

Method 1027

Electrical measurement

Bond strength

pre and post

Method 2037, Cond. D

yes

Group C

SG 2

Thermal Shock

Method 1056, Cond. B, 25

shocks

Temperature cycling

Method 1051, Cond. C,

‐55/+125°C , 25 cycles

(total 45 cycles including

screening)

Hermetic seal fine and gross leak

Method 1071, Cond. H

(fine), Cond. C (gross)

Method 1021

pre and post

Method 2016,

Moisture resistance

Electrical measurement

Mechanical shock

yes

SG 3

non‐operating, 1500 G, 0.5

ms, 5 blows in each

orientation (X1,Y1,Z1)

Vibration

Constant acceleration

Method 2056

Method 2006, at a peak

level of 5000 G

pre and post

Electrical measurement

SG 6

Steady state operating life Not required

as B5 is available on same lot

For sales enquiries, or further information, please contact our sales office at:

Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, NE38 0AH, UK

Tel: +44 0191 4166 546 Fax: +44 0191 4155 055

Page 8 of 11

100% SCREENING TO MIL-STD 750

TEST

MIL-STD-750

READ AND RECORD?

Internal Visual

Sealing

2072

(Fine Leak)

(Gross Leak)

Temp Cycling

1071, Condition H1

1071, Condition C

1051, Condition

B‐55/+125°C, 20 Cycles.

2006, 5000G, Y1 only.

2052, Condition A

2076

Const. Acceler

PIND

Radiography

Initial Electrical

HTRB

R & R

125°C, ‐55°C, 25°C

1039

Interim Electrical

Burn-In

25°C only

1039

Final Electrical

PDA

R & R

Calculate & R

125°C, ‐55°C, 25°C

Max. 5%, pre/post B1

electrical and delta at RT

only

(Fine Leak)

(Gross Leak)

1071, Condition H1

1071, Condition C

Solder Dip

Fine Leak

Gross Leak

1071, Condition H1

1071, Condition C

For sales enquiries, or further information, please contact our sales office at:

Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, NE38 0AH, UK

Tel: +44 0191 4166 546 Fax: +44 0191 4155 055

Page 9 of 11

For sales enquiries, or further information, please contact our sales office at:

Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, NE38 0AH, UK

Tel: +44 0191 4166 546 Fax: +44 0191 4155 055

Page 10 of 11

For sales enquiries, or further information, please contact our sales office at:

Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, NE38 0AH, UK

Tel: +44 0191 4166 546 Fax: +44 0191 4155 055

Page 11 of 11

CH101 [MAXWELL]

相关型号：

CH1064

CH1065

CH1066

CH1067

CH1069

CH11

CH1101.5UH+/-10%B

CH1101.5UH+/-10%V

CH1101.5UH10%V

CH11010000UH+/-10%V

CH1101000UH+/-10%B

CH1101000UH+/-10%V