BZT52C3V0S [MCC]
200 mW Zener Diode 2.4 to 39 Volts; 200 mW的稳压二极管2.4 〜39伏特
| 型号： | BZT52C3V0S |
| 厂家： | 
Micro Commercial Components |
| 描述： | 200 mW Zener Diode 2.4 to 39 Volts |
| 文件： | 总4页 (文件大小：282K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
M C C
BZT52C2V4S
THRU
BZT52C39S
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
ꢆꢋꢅꢌꢍꢎꢍꢍ
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
TM
Micro Commercial Components
Features
xꢀ Planar Die Construction
200 mW
Zener Diode
2.4 to 39 Volts
xꢀ 200mW Power Dissipation on Ceramic PCB
xꢀ General Purpose Medium Current
xꢀ Ideally Suited for Automated Assembly Processes
·
Epoxy meets UL 94 V-0 flammability rating
·
•
Moisture Sensitivity Level 1
Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
SOD-323
A
B
Absolute Maximum Ratings
Symbol
Parameter
Rating
200
Unit
mW
к
PD
Power dissipation
C
E
TJ
Junction Temperature
-65 to +150
-65 to +150
к
TSTG
Storage Temperature Range
H
D
J
G
Absolute Maximum Ratings
DIMENSIONS
Symbol
Parameter
Rating
Unit
DIM
INCHES
MIN
MM
NOTE
Thermal Resistance Junction to
Ambient*
к/W
RthJA
625
MAX
.107
.071
.053
.045
.016
.018
.010
.006
MIN
2.30
1.60
1.15
0.80
0.25
0.10
0.10
-----
MAX
2.70
1.80
1.35
1.15
0.40
0.45
0.25
0.15
A
B
C
D
E
G
H
J
.090
.063
.045
.031
.010
.004
.004
-----
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25 mm2
Electrical Characteristics
Symbol
Parameter
Rating
Unit
SUGGESTED SOLDER
PAD LAYOUT
Maximum Forward Voltage
(IF=10mAdc)
0.074"
VF
0.9
V
0.027”
0.022”
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1 of 3
Revision: A
2011/01/01
BZT52C2V4S THRU BZT52C39S
M C C
TM
Micro Commercial Components
ELECTRICAL CHARACTERISTICS @25qC
Typical
ZENER VOLTAGE
VZ
VOLTS
Maximum Zener
Impedance (2)
ZZT(OHMS)
Maximum Zener
Impedance (2)
ZZK (OHMS)
REVERSE
CURRENT
IR (Max) VR
Temperature
Coefficent
@ IZTC
(1)
Type
Marking
@
Max.
IZK(mA)
Max.
uA
V
Min.
Nom
Max.
IZT(mA)
mV/ć
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BZT52C22S
BZT52C24S
BZT52C27S
BZT52C30S
BZT52C33S
BZT52C36S
BZT52C39S
2.28
2.5
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
2.56
2.9
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2
2
2
2
2
100
100
95
95
90
90
90
80
60
40
10
15
15
15
15
20
20
25
30
30
40
45
55
55
70
80
80
80
90
130
1.0
600
50
20
10
5
1.0
1.0
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-3.5
-2.7
-2.0
0.4
0
WX
W1
W2
W3
W4
W5
W6
W7
W8
W9
WA
WB
WC
WD
WE
WF
WG
WH
WI
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
0.5
0.5
0.5
0.5
0.5
600
600
600
600
600
600
500
480
400
150
80
0
2.8
3.1
3.2
3.5
1.0
1.0
0
0
3.4
3.7
3.8
4.1
5
1.0
1.0
0
3
0
4.0
4.4
4.6
5.0
3
1.0
2.0
0
3
0.2
1.2
2.5
3.7
4.5
5.3
6.2
7.0
8.0
9.0
10.0
11.0
13.0
14.0
16.0
18.0
20.0
22.0
25.3
29.4
33.4
37.4
41.2
4.8
5.4
2
2.0
5.2
5.8
6.0
6.6
1
2.0
4.0
3
6.4
7.0
7.2
7.9
2
4.0
5.0
1.2
2.5
80
80
1
7.7
8.5
8.7
9.6
0.7
0.5
0.2
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
5.0
6.0
3.2
3.8
100
150
150
150
170
200
200
225
225
250
250
300
300
325
350
350
9.4
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.2
23.3
25.6
28.9
32
7.0
8.0
4.5
5.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28
11
12
8.0
8.0
6.0
7.0
13
15
10.5
11.2
12.6
14.0
15.4
16.8
18.9
21.0
23.1
25.2
27.3
9.2
WJ
WK
WL
WM
WN
WO
WP
WQ
WR
WS
WT
16
18
10.4
12.4
14.4
16.4
18.4
21.4
24.4
27.4
30.4
33.4
20
22
24
27
30
33
31
34
35
38
36
39
37
41
(1) Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm2
(2) f=1KHz
www.mccsemi.com
2 of 3
Revision: A
2011/01/01
BZT52C2V4S-BZT52C39S
Typical characteristics
M C C
TM
Micro Commercial Components
300
200
50
40
T = 25°C
j
C3V9
C5V6
C2V7
C3V3
C6V8
C4V7
C8V2
30
20
100
Test Current IZ
5.0mA
10
0
0
100
0
200
0
1
2
3
4
5
6
8
9
10
7
TA, AMBIENT TEMPERATURE, °C
Fig. 1. Power Derating Curve
VZ, ZENER VOLTAGE (V)
Fig. 2 Zener Breakdown Characteristics
1000
30
20
10
0
Tj = 25°C
C10
C12
Tj = 25 °C
VR = 1V
VR = 2V
C15
100
C18
VR = 1V
Test current IZ
2mA
C22
C27
VR = 2V
Test current IZ
5mA
C39
C36
C33
10
10
1
100
VZ, NOMINAL ZENER VOLTAGE (V)
Fig. 4 Total Capacitance vs Nominal Zener Voltage
0
10
VZ, ZENER VOLTAGE (V)
Fig. 3. Zener Breakdown Characteristics
20
30
40
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2 of 3
Revision: A
2011/01/01
M C C
TM
Micro Commercial Components
Ordering Information :
Device
Packing
Part Number-TP
Tape&Reel: 3Kpcs/Reel
***IMPORTANT NOTICE***
Micro Commercial Components Corp. reserves the right to make changes without further notice to any product herein to
make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components
Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it
convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all
risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are
represented on our website, harmless against all damages.
***LIFE SUPPORT***
MCC's products are not authorized for use as critical components in life support devices or systems without the express written
approval of Micro Commercial Components Corporation.
***CUSTOMER AWARENESS***
Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking
strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages
customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on
our web page cited below. Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine
parts, have full traceability, meet MCC's quality standards for handling and storage. MCC will not provide any warranty
coverage or other assistance for parts bought from Unauthorized Sources. MCC is committed to combat this global
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized
distributors.
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Revision: A
2011/01/01
3
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