MMBD4448WTP [MCC]
DIODE 0.5 A, 75 V, SILICON, SIGNAL DIODE, PLASTIC PACKAGE-3, Signal Diode;型号: | MMBD4448WTP |
厂家: | Micro Commercial Components |
描述: | DIODE 0.5 A, 75 V, SILICON, SIGNAL DIODE, PLASTIC PACKAGE-3, Signal Diode |
文件: | 总4页 (文件大小:78K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
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TM
MMBD4448WT
Micro Commercial Components
Features
Surface Mount
Switching Diode
200mW
ꢀ
ꢀ
ꢀ
ꢀ
Fast Switching Speed
Surface Mount Package Ideally Suited for Automatic Insertion
For General Purpose Switching Applications
High Conductance
Mechanical Data
ꢀ Case Material: Molded Plastic. UL Flammability
SOT-323
A
Classification Rating 94V-0
D
ꢀ Polarity: See Diagram
ꢀ Marking: KA3
C
B
F
E
Maximum Ratings @ 25oC Unless Otherwise Specified
Characteristic
Symbol
VRM
Value
100
Unit
V
Non-Repetitive Peak Reverse Volt.
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
H
G
J
VRRM
VRWM
VR
K
75
V
DIMENSIONS
INCHES
MM
RMS Reverse Voltage
VR(RMS)
IFM
53
V
mA
mA
A
DIM
A
B
C
D
E
MIN
.079
.045
.085
MAX
.087
.053
.096
MIN
2.00
1.15
2.15
MAX
2.20
1.35
2.45
NOTE
Forward Continuous Current(Note1)
Average Rectified Output Current
Non-Repetitive Peak @ t<=1.0s
Forward Surge Current @ t=1.0us
Power Dissipation(Note 1)
500
Io
250
.026 Nominal
0.65Nominal
1.20
.30
.000
.90
.08
IFSM
2
4
.047
.055
.016
.004
.039
.006
.016
1.40
.40
.100
1.00
.15
F
.012
.000
.035
.003
.008
A
G
H
J
Pd
200
mW
K/W
oC
Thermal Resistance(Note 1)
Operation/Storage Temp. Range
Rthja
625
K
.20
.40
Tj, TSTG
-55 to +150
Suggested Solder
Pad Layout
0.70
Electrical Characteristics @ 25oC Unless Otherwise Specified
Charateristic
Symbol Min
Max
Unit
Test Cond.
IF=5.0mA
IF=10mA
0.90
0.62 0.72
Maximum Forward
Voltage Drop
VFM
----- 0.855
V
1.90
1
IF=100mA
IF=150mA
VR=75V
1.25
2.5
uA
0.65
Maximum Peak
Reverse Current
IRM
-----
50
30
25
4
uA VR=75V Tj=150oC
uA VR=25V Tj=150oC
0.65
nA
VR=20V
Junction Capacitance
Cj
trr
-----
-----
pF VR=0V, f=1.0MHz
ns
Reverse Recovery Time
4
Note: 1. Valid provided that terminals are kept at ambient temperature
2. Trr Test Condition: IF=IR=10mA, Irr=0.1*IR, R=100 OHM
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Revision: 4
2007/09/26
MMBD4448WT
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Figure 1
Typical Forward Characteristics
TM
Micro Commercial Components
Figure 2
Forward Derating Curve
1000
100
10
300
250
200
150
MilliWatts
TA = -40ºC
TA = 0ºC
100
50
TA = 25ºC
1
TA = 75ºC
Single Phase, Half Wave
60Hz Resistive or Inductive Load
TA = 125ºC
0
50
75
100
125
150
175
0
0.1
°C
0.4
0.8
1.2
1.6
0
Admissable Power Dissipation - MilliWattsversus
Ambient Temperature -°C
V
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 1 Typical Forward Characteristics
F
Figure 3
Junction Capacitance
10
6
4
2
1
TJ=25°C
pF
.6
.4
.2
.1
400
1000
.1
.2
.4
1
2
10 20
200
4
40
100
Volts
Junction Capacitance - pFversus
Reverse Voltage - Volts
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Revision: 4
2007/09/26
MMBD4448WT
M C C
Figure 4
Typical Reverse Characteristics
TM
Micro Commercial Components
Peak Forward Surge Current
Figure 5
1000
600
2.4
2.0
400
200
1.6
1.2
0.8
100
60
Amps
40
0.4
0
20
10
80
1
60
100
4
6
10 20
40
8
2
NanoAmps
6
4
Cycles
Peak Forward Surge Current - Amperesversus
Number Of Cycles At 60Hz - Cycles
2
1
TA=25°C
.6
.4
.2
.1
20
40
60
80
140
100
120
TJ
Instantaneous Reverse Leakage Current - NanoAmperesversus
Junction Temperature -°C
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Revision: 4
2007/09/26
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TM
Micro Commercial Components
***IMPORTANT NOTICE***
Micro Commercial Components Corp . reserves the right to make changes without further notice to any
product herein to make corrections, modifications , enhancements , improvements , or other changes .
Micro Commercial Components Corp . does not assume any liability arising out of the application or
use of any product described herein; neither does it convey any license under its patent rights ,nor
the rights of others . The user of products in such applications shall assume all risks of such use
and will agree to hold Micro Commercial Components Corp . and all the companies whose
products are represented on our website, harmless against all damages.
***APPLICATIONS DISCLAIMER***
Products offer by Micro Commercial Components Corp . are not intended for use in Medical,
Aerospace or Military Applications.
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Revision: 4
2007/09/26
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