MX27L4000QI-25 [Macronix]
4M-BIT [512K x8] LOW VOLTAGE OPERATION CMOS EPROM; 4M- BIT [ 512K ×8 ]低电压工作CMOS EPROM型号: | MX27L4000QI-25 |
厂家: | MACRONIX INTERNATIONAL |
描述: | 4M-BIT [512K x8] LOW VOLTAGE OPERATION CMOS EPROM |
文件: | 总15页 (文件大小:934K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MX27L4000
4M-BIT [512K x8] LOW VOLTAGE OPERATION
CMOS EPROM
FEATURES
• 512K x 8 organization
• Operating current: 20mA @ 3.6V, 5MHz
• Standby current: 50uA
• Package type:
- 32 pin plastic DIP
- 32 pin PLCC/SOP
- 32pin TSOP
• Wide voltage range, 2.7V to 3.6V
• +12.5V programming voltage
• Fast access time: 200/250ns
• Totally static operation
• Completely TTL compatible
GENERAL DESCRIPTION
The MX27L4000 is a 4M-bit, One Time Programmable
Read Only Memory. It is organized as 512K words by 8
bitsperword, operatesfromasingle+3volt supply, has
a static standby mode, and features fast single address
locationprogramming. AllprogrammingsignalsareTTL
levels, requiring a single pulse. For programming out-
side from the system, existing EPROM programmers
maybeused. TheMX27L4000supportsaintelligentfast
programmingalgorithmwhichcanresultinprogramming
time of less than two minutes.
This EPROM is packaged in industry standard 32 pin
dual-in-line packages, 32 lead PLCC, 32 lead SOP, and
32 lead TSOP(I) packages.
PIN CONFIGURATIONS
32 PLCC
32TSOP
32 PDIP/SOP
VCC
A18
A17
A14
A13
A8
VPP
A16
A15
A12
A7
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
A11
A9
1
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
2
2
4
1
32
30
29
A8
3
3
A14
A13
A8
5
A7
A6
A5
A4
A3
A2
A1
A0
Q0
A13
A14
A17
A18
VCC
VPP
A16
A15
A12
A7
4
4
5
5
6
A6
6
7
A9
A5
7
A9
8
A11
OE
A10
CE
A4
8
A11
OE
A10
CE
Q7
9
25
MX27L4000
9
MX27L4000
A3
9
10
11
12
13
14
15
16
A2
10
11
12
13
14
15
16
A1
Q7
A0
Q6
Q0
A6
A1
13
21
Q5
Q1
A5
A2
14
17
20
Q4
Q2
A4
A3
Q3
GND
BLOCK DIAGRAM
PIN DESCRIPTION
CE
SYMBOL
A0~A18
Q0~Q7
CE
PIN NAME
CONTROL
OUTPUT
Q0~Q7
LOGIC
BUFFERS
OE
Address Input
Data Input/Output
Chip Enable Input
Output Enable Input
Program Supply Voltage
Power Supply Pin
Ground Pin
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
Y-DECODER
X-DECODER
Y-SELECT
OE
A0~A18
ADDRESS
INPUTS
4M BIT
CELL
VPP
MAXTRIX
VCC
GND
VCC
VPP
VSS
REV. 2.5, AUG. 20, 2001
P/N: PM00255
1
MX27L4000
AUTO IDENTIFY MODE
FUNCTIONAL DESCRIPTION
Theautoidentifymodeallowsthereadingoutofabinary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of
automatically matching the device to be programmed
with its corresponding programming algorithm. This
mode is functional in the 25°C ± 5°C ambient
temperature range that is required when programming
the MX27L4000.
THE PROGRAMMING OF THE MX27L4000
When the MX27L4000 is delivered, or it is erased, the
chip hasall4Mbitsinthe"ONE"orHIGHstate."ZEROs"
are loaded into the MX27L4000 through the procedure
of programming.
Forprogramming, thedatatobeprogrammedisapplied
with 8 bits in parallel to the data pins.
To activate this mode, the programming equipment
mustforce12.0±0.5VonaddresslineA9ofthedevice.
Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to
VIH. All other address lines must be held at VIL during
auto identify mode.
VCCmustbeappliedsimultaneouslyorbeforeVPP,and
removed simultaneously or after VPP. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across Vpp and ground to suppress spurious
voltage transients which may damage the device.
Byte 0 ( A0 = VIL) represents the manufacturer code,
andbyte1(A0=VIH),thedeviceidentifiercode. Forthe
MX27L4000, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
devicecodeswillpossessoddparity, withtheMSB(Q7)
defined as the parity bit.
FAST PROGRAMMING
Thedeviceissetupinthefastprogrammingmodewhen
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and OE = VIH (Algorithm is shown in
Figure 1). The programming is achieved by applying a
single TTL low level 100us pulse to the CE input after
addresses and data line are stable. If the data is not
verified, an additional pulse is applied for a maximum of
25 pulses. This process is repeated while sequencing
through each address of the device. When the
programmingmodeiscompleted,thedatainalladdress
is verified at VCC = VPP = 5V ±10%.
READ MODE
The MX27L4000 has two control functions, both of
which must be logically satisfied in order to obtain data
at the outputs. Chip Enable (CE) is the power control
andshouldbeusedfordeviceselection. OutputEnable
(OE) is the output control and should be used to gate
datatotheoutputpins, independentofdeviceselection.
Assuming that addresses are stable, address access
time(tACC)isequaltothedelayfromCEtooutput(tCE).
DataisavailableattheoutputstOEafterthefallingedge
of OE's, assuming that CE has been LOW and
addresses have been stable for at least tACC - tOE.
PROGRAM INHIBIT MODE
Programming of multiple MX27L4000s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27L4000 may be common. A
TTL low-level program pulse applied to an MX27L4000
CE input with VPP = 12.5 ±0.5 V and CE LOW will
programthatMX27L4000. Ahigh-levelCEinputinhibits
the other MX27L4000s from being programmed.
STANDBY MODE
The MX27L4000 has a CMOS standby mode which
reducesthemaximumVCCcurrent to50uA. Itisplaced
in CMOS standby when CE is at VCC ±0.3 V. The
MX27L4000 also has a TTL-standby mode which
reduces the maximum VCC current to 0.25 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
PROGRAM VERIFY MODE
Verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verification should be performed with OE and CE at
VIL, and VPP at its programming voltage.
REV. 2.5, AUG. 20, 2001
P/N: PM00255
2
MX27L4000
SYSTEM CONSIDERATIONS
TWO-LINE OUTPUT CONTROL FUNCTION
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
outputcapacitanceloadingofthedevice. Ataminimum,
a0.1uFceramiccapacitor(highfrequency,lowinherent
inductance) should be used on each device between
VCCandGNDtominimizetransienteffects. Inaddition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.
To accommodate multiple memory connections, a two-
line control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connectedtotheREADlinefromthesystemcontrolbus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
memory device.
MODE SELECT TABLE
PINS
MODE
CE
OE
VIL
VIH
X
A0
X
A9
X
VPP
VCC
VCC
VCC
VCC
VPP
VPP
VPP
VCC
VCC
OUTPUTS
DOUT
High Z
High Z
High Z
DIN
Read
VIL
Output Disable
Standby (TTL)
Standby (CMOS)
Program
VIL
X
X
VIH
X
X
VCC±0.3V
VIL
X
X
X
VIH
VIL
VIH
VIL
VIL
X
X
Program Verify
Program Inhibit
Manufacturer Code(3)
Device Code(3)
VIH
X
X
DOUT
High Z
C2H
VIH
X
X
VIL
VIL
VIH
VH
VH
VIL
40H
NOTES:
1. VH = 12.0 V ±0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A18 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during programming.
REV. 2.5, AUG. 20, 2001
P/N: PM00255
3
MX27L4000
FIGURE 1. FAST PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X = 0
PROGRAM ONE 100us PULSE
INCREMENT X
INTERACTIVE
SECTION
YES
X = 25?
NO
FAIL
VERIFY BYTE
?
PASS
NO
LAST ADDRESS
INCREMENT ADDRESS
FAIL
YES
VCC = VPP = 5.25V
VERIFY SECTION
FAIL
DEVICE FAILED
VERIFY ALL BYTES
?
PASS
DEVICE PASSED
REV. 2.5, AUG. 20, 2001
P/N: PM00255
4
MX27L4000
SWITCHING TEST CIRCUITS
DEVICE
UNDER
TEST
1.8K ohm
+5V
DIODES = IN3064
OR EQUIVALENT
CL
6.2K ohm
CL = 100 pF including jig capacitance
SWITCHING TEST WAVEFORMS
2.0V
0.8V
2.0V
TEST POINTS
AC driving levels
0.8V
OUTPUT
INPUT
AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade.
(2) Input pulse rise and fall times are < 10ns.
REV. 2.5, AUG. 20, 2001
P/N: PM00255
5
MX27L4000
NOTICE:
ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for
extended period may affect reliability.
RATING
VALUE
Ambient Operating Temperature -40oC to 85oC
Storage Temperature
Applied Input Voltage
Applied Output Voltage
VCC to Ground Potential
V9 & VPP
-65oC to 125oC
-0.5V to 7.0V
-0.5V to VCC+0.5V
-0.5V to 7.0V
NOTICE:
Specifications contained within the following tables are sub-
ject to change.
-0.5V to 13.5V
DC/AC Operating Conditions for Read Operation
MX27L4000
-20
-25
Operating Temperature
VCC Power Supply
Commercial
Industrial
0°C to 70°C
-40°C to 85°C
2.7V to 3.6V
0°C to 70°C
-40°C to 85°C
2.7V to 3.6V
DC CHARACTERISTICS
SYMBOL PARAMETER
MIN.
MAX.
UNIT
V
CONDITIONS
VOH
VOL
VIH
Output High Voltage
Output Low Voltage
VCC-0.3
IOH = -100uA, VCC = 3.0V
IOL = 2.1mA,VCC = 3.0V
0.3
VCC+0.5
0.6
V
Input High Voltage
2.0
-0.3
-10
-10
V
VIL
Input Low Voltage
V
ILI
Input Leakage Current
Output Leakage Current
VCC Power-Down Current
VCC Standby Current
VCC Active Current
10
uA
uA
uA
mA
mA
VIN = 0 to 3.6V
ILO
10
VOUT = 0 to 3.6V
CE = VCC ±0.3V
CE = VIH
ICC3
ICC2
ICC1
50
0.25
20
CE = VIL, f=5MHz, Iout = 0mA,
VCC =3.6V
IPP
VPP Supply Current Read
10
uA
CE = OE = VIL, VPP = VCC
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL
CIN
PARAMETER
TYP.
8
MAX.
UNIT
pF
CONDITIONS
VIN = 0V
Input Capacitance
Output Capacitance
VPP Capacitance
12
12
25
COUT
CVPP
8
pF
VOUT = 0V
VPP = 0V
18
pF
REV. 2.5, AUG. 20, 2001
P/N: PM00255
6
MX27L4000
AC CHARACTERISTICS
SYMBOL PARAMETER
27L4000-20
27L4000-25
MIN.
MAX. MIN. MAX.
UNIT CONDITIONS
tACC
tCE
Address to Output Delay
200
200
100
60
250
250
120
70
ns
ns
ns
ns
CE = OE = VIL
OE = VIL
Chip Enable to Output Delay
Output Enable to Output Delay
OE High to Output Float,
tOE
tDF
CE = VIL
0
0
0
0
or CE High to Output Float
Output Hold from Address,
CE or OE which ever occurred first
tOH
ns
DC PROGRAMMING CHARACTERISTICS TA = 25oC ±5oC
SYMBOL PARAMETER
MIN.
MAX.
UNIT
V
CONDITIONS
VOH
VOL
VIH
Output High Voltage
2.4
IOH = -0.40mA
IOL = 2.1mA
Output Low Voltage
0.4
V
Input High Voltage
2.0
-0.3
-10
VCC + 0.5
0.8
V
VIL
Input Low Voltage
V
ILI
Input Leakage Current
10
uA
V
VIN = 0 to 3.6V
VH
A9 Auto Select Voltage
11.5
12.5
50
ICC3
IPP2
VCC1
VPP1
VCC Supply Current (Program & Verify)
VPP Supply Current(Program)
Fast Programming Supply Voltage
Fast Programming Voltage
mA
mA
V
30
CE = VIL, OE = VIH
6.00
12.5
6.50
13.0
V
AC PROGRAMMING CHARACTERISTICS TA = 25oC ±5oC
SYMBOL
tAS
PARAMETER
MIN.
2.0
2.0
2.0
0
MAX.
UNIT
us
Address Setup Time
OE Setup Time
tOES
tDS
us
Data Setup Time
us
tAH
Address Hold Time
Data Hold Time
us
tDH
2.0
0
us
tDFP
tVPS
tPW
Output Enable to Output Float Delay
VPP Setup Time
130
105
150
ns
2.0
95
us
PGM Program Pulse Width
VCC Setup Time
us
tVCS
tOE
2.0
us
Data valid from OE
ns
REV. 2.5, AUG. 20, 2001
P/N: PM00255
7
MX27L4000
WAVEFORMS
READ CYCLE
ADDRESS
INPUTS
DATA ADDRESS
tACC
CE
tCE
OE
tDF
DATA
OUT
VALID DATA
tOE
tOH
FAST PROGRAMMING ALGORITHM WAVEFORM
PROGRAM
PROGRAM VERIFY
VIH
Addresses
VIL
tAH
tAS
Hi-z
DATA OUT VALID
DATA
VPP
DATA IN STABLE
tDFP
tDS
tDH
VPP1
VCC
tVPS
tVCS
VCC1
VCC
VCC
CE
VIH
VIL
tOES
tOE
Max
tPW
VIH
VIL
OE
REV. 2.5, AUG. 20, 2001
P/N: PM00255
8
MX27L4000
ORDERING INFORMATION
PLASTIC PACKAGE
PART NO.
ACCESS TIME(ns)
OPERATING
STANDBY
OPERATING
TEMPERATURE
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
PACKAGE
CURRENT MAX.(mA) CURRENT MAX.(uA)
MX27L4000PC-25
MX27L4000PC-20
MX27L4000QC-25
MX27L4000QC-20
MX27L4000MC-25
MX27L4000MC-20
MX27L4000TC-25
MX27L4000TC-20
MX27L4000PI-25
MX27L4000PI-20
MX27L4000QI-25
MX27L4000QI-20
MX27L4000MI-25
MX27L4000MI-20
MX27L4000TI-25
MX27L4000TI-20
250
200
250
200
250
200
250
200
250
200
250
200
250
200
250
200
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
50
32 Pin DIP
32 Pin DIP
32 Pin PLCC
32 Pin PLCC
32 Pin SOP
32 Pin SOP
32 Pin TSOP
32 Pin TSOP
-40°C to 85°C 32 Pin DIP
-40°C to 85°C 32 Pin DIP
-40°C to 85°C 32 Pin PLCC
-40°C to 85°C 32 Pin PLCC
-40°C to 85°C 32 Pin SOP
-40°C to 85°C 32 Pin SOP
-40°C to 85°C 32 Pin TSOP
-40°C to 85°C 32 Pin TSOP
REV. 2.5, AUG. 20, 2001
P/N: PM00255
9
MX27L4000
PACKAGE INFORMATION
32-PIN PLASTIC DIP(600 mil)
REV. 2.5, AUG. 20, 2001
P/N: PM00255
10
MX27L4000
32-PIN PLASTIC SOP (450 mil)
REV. 2.5, AUG. 20, 2001
P/N: PM00255
11
MX27L4000
32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
REV. 2.5, AUG. 20, 2001
P/N: PM00255
12
MX27L4000
32-PIN PLASTIC TSOP
REV. 2.5, AUG. 20, 2001
P/N: PM00255
13
MX27L4000
REVISION HISTORY
Revision No. Description
Page
Date
2.0
1) AC driving levels changed from 2.4V/0.3V to 3.0V/0V.
6/05/1997
2) Change package type, from 12 x 20 mm 48TSOP(I) to
8 x 20mm 32TSOP(I)
3) Eliminate Interactive Programming Mode.
IPP1 100uA ----> 10uA
Change TSOP Orientation
Cancel Ceramic DIP package type
To modify Package Information
Cancel "Ultraviolet Erasable" wording in General Description
2.1
2.2
2.3
2.4
2.5
7/17/1997
4/09/1998
MAR/02/2000
JUL/19/2001
AUG/20/2001
P1,2,9,10
P10~13
P1
REV. 2.5, AUG. 20, 2001
P/N: PM00255
14
MX27L4000
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MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
15
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