ES2AF [MDD]
SURFACE MOUNT SUPER FAST RECOVERY RECTIFIER;型号: | ES2AF |
厂家: | Chendahang Electronics Co., Ltd |
描述: | SURFACE MOUNT SUPER FAST RECOVERY RECTIFIER 超快速恢复二极管 |
文件: | 总3页 (文件大小:689K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ES2AF THRU ES2JF
Reverse Voltage - 50 to 600 Volts Forward Current - 2.0 Ampere
SURFACE MOUNT SUPER FAST RECOVERY RECTIFIER
Features
SMAF
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Low reverse leakage
0.106(2.70)
0.094(2.40)
0.063 (1.60)
0.051 (1.30)
Built-in strain relief,ideal for automated
placement High forward surge current capability
High temperature soldering guaranteed:
250°C/10 seconds at terminals
0.146(3.70)
0.130(3.30)
Glass passivated chip junction
0.047(1.20)
0.035(0.90)
0.008(0.20)
0.005(0.12)
0.047(1.20)
0.031(0.80)
Mechanical Data
0.193(4.90)
0.173(4.40)
Case : JEDEC SMAF Molded plastic body
Terminals : Solder plated, solderable per MIL-STD-750,Method 2026
Polarity : Polarity symbol marking on body
Mounting Position: Any
Dimensions in inches and (millimeters)
Weight
: 0.00095 ounce, 0.027 grams
Maximum Ratings And Electrical Characteristics
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
ES2AF ES2BF ES2CF ES2DF ES2EF ES2GF ES2JF
SYMBOLS
UNITS
MDD
MDD
MDD
MDD
MDD
MDD
MDD
Marking Code
ES2AF ES2BF ES2CF ES2DF ES2EF ES2GF ES2JF
Maximum repetitive peak reverse voltage
Maximum RMS voltage
V
RMM
RMS
50
35
50
100
70
150
105
150
200
140
200
300
210
300
400
280
400
600
420
600
V
V
V
V
Maximum DC blocking voltage
V
DC
100
I
(AV)
Maximum average forward rectified current
2.0
A
A
at TL=55
℃
Peak forward surge current
8.3ms single half sine-wave
superimposed onrated load (JEDEC Method)
I
FSM
30
Maximum instantaneous forward voltage at 2.0A
V
F
1
1.25
1.68
V
I
R
5.0
100.0
Maximum DC reverse current
at rated DCblocking voltage
T
A
=25
TA=125℃
(NOTE 1)
℃
μA
t
rr
Maximum reverserecovery time
35
ns
Typical junction capacitance (NOTE 2)
Typical thermal resistance (NOTE 3)
C
J
15.0
80.0
pF
R
JA
℃/
W
℃
Operating junction and storage temperature range
T
J,
T
STG
-55 to +150
Note:1.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A
2.P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas.
3.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
4.The typical data above is for referenceonly.
DN:T19712A0
https://www.microdiode.com
Rev:2019A0
Page :1
ES2AF THRU ES2JF
Reverse Voltage - 50 to 600 Volts Forward Current - 2.0 Ampere
Ratings And Characteristic Curves
50 ohm
Noninductive
10 ohm
Noninductive
trr
+0.5
D.U.T
+
-
PULSE
GENERATOR
Note 2
25Vdc
approx
0
-0.25
1 ohm
NonInductive
OSCILLOSCOPE
Note 1
-1.0
Note:1.Rise Time = 7ns, max.
Input Impedance = 1megohm,22pF.
10ns/div
2. Ries Time =10ns, max.
Source Impedance = 50 ohms.
Set time Base for 10ns/div
Fig.3 Typical Reverse Characteristics
300
Fig.2 Maximum Average Forward Current Rating
3.0
100
2.5
2.0
1.5
1.0
TJ=125°C
10
TJ=75°C
1.0
TJ=25°C
0.5
Single phase half-wave 60 Hz
resistive or inductive load
0.1
0.0
25
50
75
100
125
150
175
0
20
40
60
80
100
Case Temperature (°C)
% of PIV.VOLTS
Fig.5 Typical Junction Capacitance
Fig.4 Typical Forward Characteristics
10
1.0
TJ=25°C
TJ=25°C
100
10
1
ES2AF~ES2DF
ES2EF/WS2GF
ES2JF
0.1
0.01
0.001
TJ=25°C
f = 1.0MHz
Vsig = 50mVp-p
0.5
1.0
1.5
2.0
2.5
0
0.1
1.0
10
100
Instaneous Forward Voltage (V)
Reverse Voltage (V)
Fig.6 Maximum Non-Repetitive Peak
Forward Surge Current
60
50
40
30
20
10
00
8.3 ms Single Half Sine Wave
(JEDEC Method)
1
10
100
Number of Cycles
The curve above is for reference only.
https://www.microdiode.com
Rev:2019A0
Page :2
ES2AF THRU ES2JF
Reverse Voltage - 50 to 600 Volts Forward Current - 2.0 Ampere
Packing information
P0
P1
unit:mm
d
E
F
Symbol
Item
Tolerance
SMAF
W
B
Carrier width
A
0.1
0.1
0.1
0.05
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.80
4.75
1.42
1.50
Carrier length
B
Carrier depth
C
Sprocket hole
d
A
P
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
D
178.00
54.40
13.00
1.75
D1
D2
E
D2
D1
T
F
5.05
4.00
C
P
P0
P1
T
4.00
W1
D
2.00
0.30
8.00
W
W1
Reel width
12.30
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
Reel packing
APPROX.
GROSS WEIGHT
COMPONENT
SPACING
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
CARTON
SIZE
(m/m)
BOX
CARTON
(pcs)
REEL
(pcs)
PACKAGE
REEL SIZE
7"
(kg)
(m/m)
(pcs)
4.0
178
3,000
6,000
210*208*203
400*265*400
10.0
SMAF
120,000
Suggested Pad Layout
Symbol
Unit (mm)
Unit (inch)
0.071
A
B
C
D
E
1.8
1.6
3.8
0.063
0.150
2.2
5.4
0.087
0.213
Important Notice and Disclaimer
Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and
specifications at any time without notice. Customers should obtain and confirm the latest product information and
specifications before final design,purchase or use.
Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application
assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with
products which are purchased or used for any unintended or unauthorized application.
No license is granted by implication or otherwise under any intellectual property rights of Microdiode
Electronics (Jiangsu).
Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support
devices or systems without express written approval of Microdiode Electronics (Jiangsu).
https://www.microdiode.com
Rev:2019A0
Page :3
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