MDDS2KB [MDD]

SURFACE MOUNT GENERAL RECTIFIER;
MDDS2KB
型号: MDDS2KB
厂家: Chendahang Electronics Co., Ltd    Chendahang Electronics Co., Ltd
描述:

SURFACE MOUNT GENERAL RECTIFIER

文件: 总3页 (文件大小:796K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
S2AB THRU S2MB  
Reverse Voltage - 50 to 1000 Volts Forward Current - 2.0 Ampere  
SURFACE MOUNT GENERAL RECTIFIER  
Features  
DO-214AA/SMB  
The plastic package carries Underwriters Laboratory  
Flammability Classification 94V-0  
Idea for printed circuit board  
0.155(3.94)  
0.130(3.30)  
0.086 (2.20)  
0.075 (1.80)  
Open Junction chip  
0.185(4.70)  
0.160(4.06)  
Low reverse leakage  
0.012(0.305)  
0.006(0.152)  
High forward surge current capability  
High temperature soldering guaranteed  
250/10 seconds at terminals  
0.096(2.44)  
0.084(2.13)  
0.060(1.52)  
0.030(0.76)  
0.008(0.203)MAX.  
0.220(5.59)  
0.200(5.08)  
Mechanical Data  
Cas e : JEDEC SMB molded plastic body  
Terminals : Solderable per MIL-STD-750,Method 2026  
Polarity : Polarity symbol marking on body Mounting  
Pos ition : Any  
Dimensions in inches and (millimeters)  
Weight  
: 0.003ounce, 0.09grams  
Maximum Ratings And Electrical Characteristics  
Ratings at 25 C ambient temperature unless otherwise specified.  
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.  
Parameter  
MDD  
S2AB  
MDD  
S2BB  
MDD  
S2DB  
MDD  
S2GB  
MDD  
S2JB  
MDD  
S2KB  
MDD  
S2MB  
SYMBOLS  
UNITS  
Marking Code  
50  
35  
50  
100  
70  
200  
140  
200  
400  
280  
400  
600  
420  
600  
800  
560  
800  
1000  
700  
V
V
V
V
RRM  
Maximum repetitive peak reverse voltage  
Maximum RMS voltage  
V
RMS  
100  
1000  
Maximum DC blocking voltage  
V
DC  
I
(AV)  
2.0  
A
Maximum average forward rectified current  
Peak forward surge current  
60  
I
FSM  
8.3ms single half sine-wave  
A
superimposed onrated load (JEDEC Method)  
Maximum instantaneous forward voltage at 2.0A  
V
F
1.10  
V
5.0  
100.0  
Maximum DCreverse current  
at rated DCblocking voltage  
T
A
=25  
μA  
pF  
I
R
TA=125  
25.0  
Typical junction capacitance (NOTE 1)  
C
J
R
JA  
60.0  
20.0  
℃/  
W
Typical thermal resistance (NOTE 2)  
RθJC  
-55 to +150  
T
Operating junction and storage temperature range TJ, STG  
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.  
2.P.C.B. mounted with 2.0”x2.0(5.0x5.0cm) copper pad areas  
DN:T21312A1  
http://www.microdiode.com  
Rev:2021A1  
Page :1  
S2AB THRU S2MB  
Reverse Voltage - 50 to 1000 Volts Forward Current - 2.0 Ampere  
Typical Characterisitics  
Fig.2 Typical Instaneous Reverse  
Characteristics  
Fig.1 Forward Current Derating Curve  
100  
2.5  
2.0  
TJ=150°C  
TJ=125°C  
10  
TJ=100°C  
1.5  
1.0  
1.0  
TJ=75°C  
0.1  
0.5  
Single phase half-wave 60 Hz resistive  
or inductive load  
TJ=25°C  
0.0  
0.01  
25  
50  
75  
100  
125  
150  
175  
0
200  
400  
600  
800  
Instaneous Reverse Voltage (V)  
Case Temperature (°C)  
Fig.3 Typical Forward Characteristic  
Fig.4 Typical Junction Capacitance  
100  
10  
1.0  
0.1  
TJ=25°C  
10  
TJ=25°C  
1
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
0.1  
1.0  
10  
100  
Reverse Voltage (V)  
Instaneous Forward Voltage (V)  
Fig.5 Maximum Non-Repetitive Peak  
Forward Surage Current  
100  
80  
60  
40  
20  
00  
8.3 ms Single Half Sine Wave (JEDEC  
Method)  
1
10  
100  
Number of Cycles  
The curve above is for reference only.  
http://www.microdiode.com  
Rev:2021A1  
Page :2  
S2AB THRU S2MB  
Reverse Voltage - 50 to 1000 Volts Forward Current - 2.0 Ampere  
Packing information  
P0  
unit:mm  
P1  
d
Symbol  
Item  
Tolerance  
SMB  
E
F
Carrier width  
Carrier length  
Carrier depth  
Sprocket hole  
A
B
C
d
D
D1  
D2  
E
F
P
P0  
P1  
T
W
W1  
0.1  
0.1  
0.1  
0.05  
2.0  
min  
0.5  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.3  
1.0  
3.81  
5.41  
2.42  
1 5.0  
330.00  
50.00  
13.00  
1.75  
5.55  
8.00  
4.00  
2.00  
W
B
13" Reel outside diameter  
13" Reel inner diameter  
Feed hole diameter  
Sprocket hole position  
Punch hole position  
Punch hole pitch  
Sprocket hole pitch  
Embossment center  
Overall tape thickness  
Tape width  
A
P
D2  
D1  
T
C
0.30  
12.00  
12.30  
W1  
D
Reel width  
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.  
Reel packing  
APPROX.  
GROSS WEIGHT  
COMPONENT  
SPACING  
INNER  
BOX  
(mm)  
REEL  
DIA,  
(mm)  
CARTON  
SIZE  
(mm)  
BOX  
(pcs)  
CARTON  
(pcs)  
REEL  
(pcs)  
PACKAGE  
REEL SIZE  
(kg)  
(mm)  
SMB  
4.0  
13"  
3,000  
190*190*41  
330  
365*365*360  
6,000  
48,000  
14.0  
Suggested Pad Layout  
Symbol  
Unit (mm)  
Unit (inch)  
0.110  
A
B
C
D
E
2.8  
2.4  
0.094  
4.6  
2.2  
7.0  
0.181  
0.086  
0.276  
Important Notice and Disclaimer  
Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and  
specifications at any time without notice. Customers should obtain and confirm the latest product information and  
specifications before final design,purchase or use.  
Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its  
products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application  
assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with  
products which are purchased or used for any unintended or unauthorized application.  
No license is granted by implication or otherwise under any intellectual property rights of Microdiode  
Electronics (Jiangsu).  
Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support  
devices or systems without express written approval of Microdiode Electronics (Jiangsu).  
http://www.microdiode.com  
Rev:2021A1  
Page :3  

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