MLX80004KLWBAA-001RE中文资料_数据手册_规格书

MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

1. Features and Benefits

.

LIN 2.x/SAE J2602 and ISO17987-4 compliant

Quad/Dual - enhanced master transceiver function for each channel

Backward compatible to quad-channel master transceiver MLX80001

Lowest space (QFN4x4, wettable flanks) and minimized external components

Quad/Dual versions with same package and foot print for cost/space optimized design

Slew rate selection and High Speed Flash mode

Wide operating voltage range V_S= 5 to 27 V

Fully compatible to 3.3V and 5V devices

Very low standby current consumption of (typ) 10µA in sleep mode

WAKE input for local wake-up capability

Remote and local wake-up source recognition

Control output INH for external components

Integrated termination (resistor & decoupling diode) for both LIN master & slave nodes

TxD dominant time out function in slave configuration

RxD dominant time out function in master configuration

Sleep timer

Low EME (emission) and high EMI (immunity) level

High impedance LIN pin in case of loss of ground or battery

Enhanced ESD robustness

o

+/- 10kV according to IEC 61000-4-2 for pins LIN, Vs and WAKE

2. Ordering Information

Temperature

Packing Form

Code

RE

Product Code

Package Code

Option Code

Code

CAA-001

BAA-001

MLX80002

MLX80004

K

LW

RE

Legend:

Temperature Code:

Package Code:

Option Code:

K = -40 to 125°C

LW = Quad Flat Package (QFN), wettable flanks

BAA-001 = Design Revision

RE = Reel

Packing Form:

Ordering example:

MLX80004 KLW-BAA-001-RE

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

3. General Description

The MLX80004(2) is a quad/dual LIN transceiver physical layer device for a single wire data link capable of operating in

applications using baud rates up to 20kBd. It is compliant to LIN2.x as well as to the SAE J2602 specifications. The IC

furthermore can be used in ISO9141 systems. The MLX80004 is functionally compatible to the MLX80001 quad master

LIN transceiver.

The device is flexible for use in LIN – master applications and slave applications as well.

Due to the integrated master termination and the high ESD/EMC robustness of the device a minimum space and

number of external components is required.

The number of LIN – channels can be easily adapted on the application requirements by combinations of quad and dual

channel devices within the same foot print.

Because of the very low power consumption of the MLX80004 while being in sleep mode it’s suitable for ECU

applications with hard standby current requirements. The implemented high resistive LIN - termination in sleep mode as

well as the RxD dominant time-out feature allows a comfortable handling of LIN short circuits to GND.

In order to reduce the power consumption in case of failure modes, the integrated sleep timer takes care for switching

the IC into the most power saving sleep mode after Power-On or Wake-Up events are not followed by a mode change

response of the microcontroller.

The MLX80004/2 has an improved EMI performance and ESD robustness according to the OEM Common Hardware

Requirements for LIN in Automotive Applications Rev.1.2.

By using the MODE0/1 pins the application can be easily adapted on the required baud rate in order to optimize the

EMC emissions. A high speed Flash Mode with disabled slew rate control is available as well.

To fulfill different OEM requirements, the integrated master termination can be disabled and external master resistors

and decoupling diodes can be used. In this mode the MLX80004/2 can be used in slave applications as well.

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

4. Table of Contents

1. Features and Benefits...................................................................................................................................................1

2. Ordering Information ...................................................................................................................................................1

3. General Description .....................................................................................................................................................2

4. Table of Contents.........................................................................................................................................................3

5. Block Diagram ..............................................................................................................................................................5

6. Pin Description.............................................................................................................................................................6

7. Electrical Specification..................................................................................................................................................7

7.1

7.2

7.3

7.4

Operating Conditions ..................................................................................................................................................................... 7

Absolute Maximum Ratings ........................................................................................................................................................... 8

Static Characteristics...................................................................................................................................................................... 9

Dynamic Characteristics............................................................................................................................................................... 12

7.4.1 Duty Cycle Calculation ..................................................................................................................................................... 13

8. Functional Description ...............................................................................................................................................15

8.1

8.2

8.3

Operating Modes.......................................................................................................................................................................... 16

Initialization and Standby mode .................................................................................................................................................. 16

Active Modes................................................................................................................................................................................ 16

8.3.1 High Speed mode............................................................................................................................................................. 17

8.3.2 Low speed mode.............................................................................................................................................................. 17

8.3.3 Normal speed mode ........................................................................................................................................................ 17

8.4

8.5

8.6

8.7

Sleep Mode................................................................................................................................................................................... 17

Wake Up........................................................................................................................................................................................ 18

Wake Up Source Recognition ...................................................................................................................................................... 18

Master / Slave configuration ....................................................................................................................................................... 21

9. Fail-safe Features.......................................................................................................................................................22

9.1

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

Loss of battery .............................................................................................................................................................................. 22

Loss of Ground.............................................................................................................................................................................. 22

Short circuit to battery................................................................................................................................................................. 22

Ground shift and short circuit to ground .................................................................................................................................... 22

Thermal overload ......................................................................................................................................................................... 22

Undervoltage lock out.................................................................................................................................................................. 22

Open Circuit protection ............................................................................................................................................................... 22

TxDx faulty start protection ......................................................................................................................................................... 23

RxDx dominant time-out.............................................................................................................................................................. 23

9.10 TxDx dominant time-out .............................................................................................................................................................. 23

Application Example...............................................................................................................................................24

10.1 Enhanced Master Mode............................................................................................................................................................... 24

10.2 Standard Transceiver Mode......................................................................................................................................................... 25

10.

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

10.3 Application Circuitry for EMC ...................................................................................................................................................... 26

10.3.1 External Circuitry on Supply Lines ............................................................................................................................... 27

10.3.2 External Circuitry on LIN Lines..................................................................................................................................... 27

10.3.3 External Circuitry on Signal Lines................................................................................................................................. 27

11.

12.

13.

14.

Mechanical Specification QFN24 ............................................................................................................................28

Package Marking Information.................................................................................................................................29

Tape and Reel Specification....................................................................................................................................30

ESD and EMC..........................................................................................................................................................33

14.1 Automotive Qualification Test Pulses.......................................................................................................................................... 33

14.2 Test Pulses On supply Lines ......................................................................................................................................................... 33

14.3 Test pulses on Pin LIN................................................................................................................................................................... 34

14.4 Test pulses on signal lines............................................................................................................................................................ 34

14.5 Test circuitry for automotive transients...................................................................................................................................... 35

14.6 EMC Test pulse definition ............................................................................................................................................................ 36

Standard information regarding manufacturability of Melexis products with different soldering processes...........37

Disclaimer ..............................................................................................................................................................38

15.

16.

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

5. Block Diagram

MLX80004

MLX80002

VS

INH

Vs

3.3V

Supply

Temp.

Protection

Vs

monitor/

POR

Mode

Control

MODE0

MODE1

RCO

Sleep timer

Wake-up

Control

WAKE

RxDx time out

TxDx time out

Bias

Calibration

& Control

DIS_MAS

Slew

rate

Master

Pull up

50uA

Vs

Wake-

Filter

RxD1

TxD1

Rec-Filter

30K

1K

Receiver

LIN1

Filter

Driver

control

TxTo

TSD

Local

WU

Vs

Wake-

Filter

RxD2

Rec-Filter

30K

1K

Receiver

LIN2

Filter

TxD2

RxD3

Driver

control

TxTo

TSD

channel3

channel4

LIN3

LIN4

TxD3

RxD4

TxD4

Figure 1: Block Diagram MLX80004/2.

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

6. Pin Description

Figure 2: Pinout MLX80004 QFN24 package

Figure 3: Pinout MLX80002 QFN24 package

Table 1: Pin List

I/O-Type Description

1

MLX80004

MLX80002

RxD1

O

I

Receive Data LIN Ch1, open drain

2

TxD1

Transmit Data LIN Ch1 (+ local WU-Flag)

Operating Mode Selection Input 1

Operating Mode Selection Input 2

Transmit Data LIN Ch4

3

MODE0

MODE1

I

4

I

5

TxD4

RxD4

N.C.

I

6

O

I

Receive Data LIN Ch4, open drain

disable integrated master resistor

7

DIS_MAS

N.C.

8

9

LIN4

N.C.

I/O

G

I/O

I

LIN Bus Ch4

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

EPad

GNDL

WAKE

Ground LIN

LIN3

LIN Bus Ch3

local wake up input, low active

Receive Data LIN Ch3, open drain

Transmit Data LIN Ch3

Ground

RxD3

TxD3

N.C.

O

I

GND

TxD2

RxD2

N.C.

INH

G

I

Transmit Data LIN Ch2

Receive Data LIN Ch2, open drain

O

P

HV High Side Control Pin

Battery Voltage

LIN Bus Ch2

VS

LIN2

GNDL

LIN1

N.C.

I/O

G

Ground LIN

I/O

LIN Bus Ch1

GND / GNDL

G

Exposed Pad of Package (grounded heatsink)¹

¹For enhanced thermal and electrical performance, the exposed pad of the QFN package should be soldered

to the board ground plane (and not to any other voltage level).

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

7. Electrical Specification

All voltages are referenced to ground (GND). Positive currents flow into the IC.

The absolute maximum ratings (in accordance with IEC 60 134) given in the table below are limiting values that do not

lead to a permanent damage of the device but exceeding any of these limits may do so. Long term exposure to limiting

values may affect the reliability of the device.

7.1. Operating Conditions

Table 2: Operating Conditions

Nr.

Parameter

Symbol

Min

Max

Unit Remark

101

Battery supply voltage ^{[1] [2]}

V_S

5

27

V

Parameter deviations

allowed

102

Extended battery supply voltage

Vs_NON_OP

5

40

V

103

104

Operating ambient temperature

T_amb

-40

+125

5.5

°C

V

Voltage on low voltage I/Os (RxDx, TxDx,

MODEx

RxDx, TxDx,

MODEx

-0.3

[1]

[2]

Vs is the IC supply voltage including voltage drop of reverse battery protection diode, VDROP = 0.4 to 1V,

Operating voltage range of the LIN2.x/SAE J2602 plug & play specification is 7V…18V

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

7.2. Absolute Maximum Ratings

Table 3: Absolute Maximum Ratings

Nr. Parameter

Symbol

V_S

Condition

Min

-0.3

Max

Unit

V

201

202

203

204

205

206

207

Battery Supply Voltage

Respective to GND

ISO 7637/2 pulse 1^[1]

ISO 7637/2 pulse 2^[1]

ISO 7637/3 pulses 1^[2]

ISO 7637/3 pulses 2^[2]

ISO 7637/2 pulses 3A, 3B ^[3]

40

Transients at battery supply voltage

Transients at high voltage signal pins

Transients at high voltage signal and power supply pins

DC voltage LINx

V_VS.tr1

V_VS.tr2

V_LIN..tr1

V_LIN..tr2

V_HV..tr3

V_{LIN_DC}

-100

V

75

V

-30

V

30

V

-150

100

V

Respective to GND and V_S

Loss of Ground( V_GND=V_S)

Respective to GND and V_S

Loss of Ground( V_GND=V_S)

-20

-30

-20

-30

40

V

208

DC voltage WAKE

V_{WAKE_DC}

V

V_{INH_DC}

V_{DISMAS_DC}

209

210

211

DC voltage INH, DIS_MAS

-0.3

-10

V_S+ 0.3

7

V

DC voltage low voltage I/O’s (RxDx,TxDx,MODEx)

ESD voltage, IEC 61000-4-2 ^[4]

V_{lv_DC}

V_ESD

10

kV

V

Pin LIN, VS, WAKE

Pin LIN, V_S,WAKE, INH

vs GND

-8

8

212

ESD voltage, HBM (CDF-AEC-Q100-002)

V_ESD

All other pins

-3

3

213

214

215

216

217

ESD voltage, CDM (CDF-AEC-Q100-011)

Maximum latch - up free current at any Pin

Thermal impedance

V_ESD

I_LATCH

_JA

T_stg

-1000

-500

1000

500

50

mA

K/W

°C

JEDEC 1s2p board

Storage temperature

-55

-40

150

Junction temperature

T_vj

[1]

[2]

[3]

ISO 7637/2 test pulses are applied to VS via a reverse polarity diode and >10uF blocking capacitor.

ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 100nF.

ISO 7637/3 test pulses are applied to LIN via a coupling capacitance of 1nF. ISO 7637/2 test pulses are applied to VS via a reverse polarity

diode and >10uF blocking capacitor

[4]

IEC 61000-4-2 validated by external Lab during product qualification (see application examples)

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

7.3. Static Characteristics

Table 4: Static Characteristics

Unless otherwise specified all values in the following tables are valid for V_S= 5 to 27V and T_j= -40 to 150°C. All voltages

are referenced to ground (GND), positive currents flow into the IC.

Nr. Parameter

Symbol

Condition

Min

Typ

Max

Unit

PIN VS

301

302

Undervoltage lockout

V_{S_UV}

2.4

0.1

4.8

0.7

V

Undervoltage lockout hysteresis^[1]

V_{S_UV_hys}

0.3

9

V_M0DEx= 0V, Tj ≤ 85C

V_WAKE= V_LINx= V_S≤14V

V_M0Dex= 0V, Tj ≤ 125C

V_WAKE= V_LINx= V_S≤ 18V

V_M0Dex= 0V,

15

20

µA

303

304

305

Supply current, sleep mode

I_Ssl

Supply current standby mode

I_SBY

100

200

12

400

15

after POR or WU

V_M0Dex= 5V,V_TxD1-4= 0V

DIS_MAS = Vs (80004)

V_M0Dex= 5V,V_TxD1-2= 0V

DIS_MAS = Vs (80002)

V_M0Dex= 5V,V_TxD1-4= 0V

DIS_MAS = 0V (80004)

V_M0Dex= 5V,V_TxD1-2= 0V

DIS_MAS = 0V (80002)

Supply current active mode, dominant

Standard transceiver mode

I_{Sd_slave}

mA

7

9

100

125

Supply current active mode, dominant

Enhanced master mode

306

307

I_{Sd_master}

mA

50

3

65

5

Supply current active mode, recessive

I_Sr

V_M0Dex= 5V,V_TxD1-4= 5V

PIN LINx – Transmitter

Capacitance on pins LINx

to GND

310

Transmitter internal capacitance^[1]

C_LIN

30

40

pF

V_LIN= V_S,

V_M0Dex= 5V,V_TxDx= 0V

311

312

313

314

315

Short circuit bus current

I_{BUS_LIM}

40

20

100

30

200

60

mA

kΏ

Ώ

Pull up resistance bus, normal & standby

mode

Pull up resistance bus, normal & standby

mode

R_SLAVE

V_{DIS_MAS}= V_S

V_{DIS_MAS}= 0V

R_Master

900

-100

0.4

1000

-60

1100

-20

1

V_LINx= 0V, V_S= 12V,

V_M0Dex= 0V,V_TxDx= 5V

Pull up current bus, sleep mode

I_{SLAVE_SLEEP}

V_SerDiode

µA

V

Voltage drop at int. diode in pull up path

[1]

R_SLAVE

V_LINx=0V, V_S=12V,

V_M0Dex= 5V,V_TxDx= 5V,

V_{DIS_MAS}= V_S

V_LINx=18V, V_S=5V,

V_M0Dex= 5V,V_TxDx= 5V,

Tamb<125°C

Receiver dominant input leakage current

including pull up resistor

316

317

I_{BUS_PAS_dom}

-400

µA

Receiver recessive input leakage current

I_{BUS_PAS_rec}

20

V_S= 0V,

0V < V_{LIN x}< 18V

Tamb<125°C

V_S= V_GND= 12V,

0 < V_LINx< 18V

318

319

Bus reverse current loss of battery ^[2]

Bus current during loss of ground ^[2]

I_{BUS_NO_BAT}

20

50

µA

I_{BUS_NO_GND}

-10

0

1.2

Rload = 500, V_S= 5V

Rload = 500, V_S>= 7V

V_M0Dex= 0/5V,V_TxDx= 5V

320

321

Transmitter dominant voltage ^[2]

Transmitter recessive voltage ^[2]

Vol_BUS

V

0.2×V_S

1×V_S

Voh_BUS

0.8×V_S

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

Nr. Parameter

Symbol

Condition

Min

Typ

Max

Unit

PIN LINx – Receiver

322

323

324

325

Receiver dominant voltage

V_BUSdom

V_BUSrec

V_{BUS_CNT}

V_HYS

0.4×V_S

V

Receiver recessive voltage

Center point of receiver threshold

Receiver hysteresis

0.6×V_S

V_{BUS_cnt}= (V_BUSdom+ V_BUSrec)/2

0.475×V_S

0.5×V_S

0.525×V_S

0.175×V_S

V_HYS= ( V_BUSrec–V_BUSdom

)

PIN MODE0/1, TxD2/3/4

331

332

High level input voltage

V_{ih_xx}

V_{il_xx}

Rising edge

Falling edge

V_{ih_xx}= 5V

V_{il_xx}= 0V

2

V

Low level input voltage

pull down resistor

Leakage Current

0.8

600

5

333

R_{pd_xx}

I_{leak_xx}

200

-5

350

k

µA

334

PIN TxD1

341

High level input voltage

Low level input voltage

pull down resistor

V_{ih_TxD1}

V_{il_TxD1}

R_{pd_TxD1}

V_{ol_txd1}

Rising edge

Falling edge

V_TxD1= 5V

2

V

342

0.8

600

0.6

5

343

200

350

k

V

I_TxD1= 2mA

Local WU flag

344

Low level output voltage

Leakage Current

345

I_{leak_TxD1}

V_TxD1= 0V

-5

µA

PIN RxDx

351

Low level output voltage

Leakage Current high

Leakage Current low

V_{ol_rxdx}

I_RxDx= 2mA

0.6

5

V

V_RxDx= 5V,V_TxDx= 5V, V_M0/1

= 5V

V_RxDx= 0V,V_TxDx= 5V, V_M0Dex

= 5V

352

I_{leakh_rxdx}

I_{leakl_rxdx}

-5

µA

353

PIN INH

361

5

On resistance INH

R_{on_INH}

I_{leakh_inh}

V_S=12V, T_j≤125°C

20

50

5



362

Leakage current INH high

-5

µA

V

_M0Dex= 0V,V_INH= 27V

_M0Dex= V_INH=0V,

363

Leakage current INH low

I_{leakl_inh}

5

µA

V

PIN WAKE

371

372

373

374

High level input voltage

V_{ih_WAKE}

V_{il_WAKE}

I_{WAKE_PU}

I_{WAKE_lk}

Sleep mode

V_WAKE= 0

V_S-1V

V

Low level input voltage

Pull up current WAKE

V_S-3.3V

-30

-5

-10

-1

5

µA

Leakage current WAKEhigh

V_WAKE= V_S=27V

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

Nr. Parameter

Symbol

Condition

Min

Typ

Max

Unit

PIN DIS_MAS

Active modes

381

382

383

384

385

High level input voltage

V_{ih_ DIS_MAS}

V_{il_ DIS_MAS}

I_{DIS_MAS_PD}

I_{DIS_MAS_lkl}

I_{DIS_MAS_lkh}

4

V_S+0.3V

V

Low level input voltage

Active modes

V_{DIS_MAS}= 0V

1.9

60

5

V

Pull down current DIS_MAS

Leakage current DIS_MAS_low

Leakage current DIS_MAS_high

50

µA

-5

V_{DIS_MAS}= 27V,

sleep mode

5

Thermal Protection

391

392

Thermal shutdown^[1]

Thermal hysteresis^[1]

T_sd

155

170

10

190

30

°C

T_hys

[1]

[2]

No production test, guaranteed by design and qualification

In accordance to SAE J2602

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

7.4. Dynamic Characteristics

Table 5: Dynamic Characteristics

Unless otherwise specified all values in the following table are valid for V_S= 5 to 27V and

T_j= -40 to 150^oC.

Nr. Parameter

Symbol

Condition

Min

Typ

Max

Unit

[1]

401

402

403

404

Propagation delay receiver

t_{rx_pdf}

C_RxD=25pF falling edge

6

µs

Propagation delay receiver

t_{rx_pdr}

t_{rx_sym}

t_{rx_deb}

C_RxD=25pF rising edge

Calculate t_{rx_pdf}- t_{rx_pdr}

LIN rising & falling edge

6

2

4

µs

Propagation delay receiver symmetry

-2

[2]

Receiver debounce time

0.5

20kbps operation,

normal mode

Vs = 7 to 18V

20kbps operation,

normal mode

Vs = 7 to 18V

10.4kbs operation,

low speed mode

Vs = 7 to 18V

10.4kbs operation,

low speed mode

Vs = 7 to 18V

411

412

413

414

LIN duty cycle 1 ^{[2] [3] [5]}

LIN duty cycle 2 ^{[2] [3] [5]}

LIN duty cycle 3 ^{[2] [3] [5]}

LIN duty cycle 4 ^{[2] [3] [5]}

D1

D2

D3

D4

0.396

0.581

0.590

0.417

10.4kbs operation,

low speed mode

10.4kbs operation,

low speed mode

sleep mode,

[4] [5]

415

416

t_REC(MAX)– t_DOM(MIN)

Δt3

Δt4

15.9

µs

[4] [5]

t_DOM(MAX)– t_REC(MIN)

17.28

421

Remote Wake-up filter time

t_{wux_remote}

LIN dominant time before

30

150

µs

rising edge

sleep mode,

WAKE falling edge

422

431

432

433

441

442

Local Wake-up filter time

t_{wu_local}

10

150

27

1

50

500

60

5

µs

ms

µs

Delay from Standby to Sleep Mode

TxDx dominant time out time

RxDx dominant time out time

MODEx – debounce time

t_dsleep

V_MODEx= 0

active modes,

V_TxDx= 0

active modes,

V_LINx= 0, V_{DIS_MAS}= 0

active > sleep mode

transitions

t_{TxDx_to}

T_{RxDx_to}

T_{MODE_deb}

T_{DIS_MAS_deb}

2

DIS_MAS – debounce time

master > slave transitions

1

5

[1]

[2]

[3]

[4]

[5]

This parameter is tested by applying a square wave signal to the LIN. The minimum slew rate for the LIN rising and falling edges is 50V/us

See Figure 4– LIN timing diagram

Standard loads for duty cycle measurements are 1K/1nF, 660/6.8nF, 500/10nF, internal master termination disabled

in accordance to SAE J2602, see Figure 5

for supply voltage ranges Vs=5…7V and Vs=18…27V parametric deviations are possible

Revision 021 – Sept 2016

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

7.4.1. Duty Cycle Calculation

Figure 4: LIN timing diagram (reference LIN2.1 specification)

Figure 4: LIN timing diagram, relation between propagation delay and duty cycle

(reference SAE J2602 specification)

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

As shown in Figure 4, both worst case duty cycles can be calculated as follows :

D_wc1= t_{BUS_rec(min)}/ (2 t_Bit)

D_wc2= t_{BUS_rec(max)}/ (2 t_Bit)

Thresholds for duty cycle calculation for the plug & play specification in accordance to LIN2.0 / SAE J2602:

Baud rate

T_BIT

20kBd

50µs

10.4kBd

96µs

D_wc1

D1

D3

D_wc2

D2

D4

TH_REC(MAX)

TH_DOM(MAX)

TH_REC(MIN)

TH_DOM(MIN)

0.744 × V_{S_TX}

0.581 × V_{S_TX}

0.422 × V_{S_TX}

0.284 × V_{S_TX}

0.778 × V_{S_TX}

0.616 × V_{S_TX}

0.389 × V_{S_TX}

0.251 × V_{S_TX}

Table 6: Data Transmission Rates

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

8. Functional Description

The MLX80004/2 is the physical layer interface between the master/slave microcontroller and the single wire LIN bus

network.

Figure 5: State Diagram of the MLX80004/2

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

8.1. Operating Modes

Table 7: Operating Modes

Mode

MODE0

MODE1

TxDx

RxDx

floating/ active low ^[2]

INH

LIN transceiver

weak pulldown/ active low

Standby

0

Vs

Off

[1]

1

0

1

0

1

weak pulldown/ input

for transmit data stream

On

Active

Sleep

output for LIN data stream

floating

[3] [4] [5]

0

weak pull down

floating

Off

[1]

[2]

[3]

[4]

[5]

Indicates the wake up flag in case of local wake up

After power on RxDx is floating. If any wake up(local or remote) occurs it will be indicated by active low

Active low interrupt at pin RxD will be removed when entering normal mode

Wake up source flag at pin TxD1 will be removed when entering normal mode

Active modes will be entered by a low -> high transition on pin MODEx. When recessive level (high) on pin TxDx is present the transmit path

will be enabled

8.2. Initialization and Standby mode

When the battery supply voltage Vs exceeds the specified threshold V_{S_UV}, the MLX80004/2 automatically enters an

intermediate standby mode. The INH output becomes HIGH (Vs) and can be used for a battery driven interrupt or to

switch on an external ECU – voltage regulator. The pins RxDx are floating and the integrated master (slave) pull up

resistor with decoupling diode pulls the pin LIN. The transmitter and the receiver are disabled.

If no mode change occurs to any active mode via a MODE0/1 LOW to HIGH transition within the time stated (typically

350ms), the IC enters the most power saving sleep mode and the INH output will become floating (logic 0).

Furthermore the standby mode will be entered after a valid local or remote wake up event, when the MLX80004/2 is

in sleep mode. The entering of the standby mode after wake up will be indicated by an active LOW interrupt on pin

RxDx.

The MLX80004/2 enters the standby mode as well in case of a battery under-voltage condition. That happens while

being in sleep mode or any active mode.

8.3. Active Modes

By entering the active modes the MLX80004/2 can be used as interface between the single wire LIN bus and the

microcontroller. The incoming bus traffic is detected by the receiver and transferred via the RxDx output pin to the

microcontroller. (see Figure 4, LIN timing diagram)

The active modes can be entered being in sleep or standby mode, when the pin(s) MODE0/1 are driven HIGH.

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

MODE0

L

MODE1 Mode

L

Sleep Mode

High Speed Mode (slew rate control

disabled)

H

L

H

Low speed mode

Normal Mode

H

Table 8: Mode Selection Table

8.3.1. High Speed mode

This mode allows high speed data download up to 100Kbit/s. The slew rate control is disabled. The falling edge is the

active driven edge, the speed of the rising edge is determined by the network time constant.

8.3.2. Low speed mode

This mode is the recommended operating mode for J2602 applications with a maximum baud rate of 10.4kBd. The

slew rate control of any channel is optimized for minimum radiated noise, especially in the AM band.

8.3.3. Normal speed mode

Transmission bit rate in normal mode is up to 20kbps. The slew rate control of any channel is optimized for maximum

allowed bit rate in the LIN specification package 2.x.

8.4. Sleep Mode

The most power saving mode of the MLX80004/2 is the sleep mode. The mode change into sleep mode is possible

regardless of the voltage levels on the LINx bus, pins WAKE or TxDx. The MLX80004/2 offers two procedures to enter

the sleep mode:



The sleep mode will be entered if both the pins MODE0 and MODE1 are being driven LOW for longer than the

specified filter time (t_{MODE_deb}) when in active modes.

If the MLX80004/2 is in standby mode after power-on or wake-up, a sleep counter is started and switches the

transceiver into sleep mode after the specified time (typ. 350ms) if the microcontroller of the ECU will not

confirm the active operation by setting MODE0/1 pins to logic HIGH. This feature allows faulty blocked LIN

nodes to reach the most power saving sleep mode anyway.

Being in sleep mode the INH pin becomes floating and can be used to switch off the ECU voltage regulator in order to

minimize the current consumption of the complete LIN node (preferred feature in slave applications). The transmitters

are disabled and the pins RxDx are disconnected from the receive path and become floating. The master(slave)

termination resistor (LIN pull up resistor with decoupling diode between pins LIN and Vs) is disconnected, only a weak

LIN pull up current of typically 50uA is applied to the LINx bus (see chapter 9 Fail-safe Features)

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

8.5. Wake Up

When in sleep mode the MLX80004/2 offers three wake-up procedures:



In applications with continuously powered ECU a wake up via mode transition to active modes is possible by

setting the MODEx pins to high level. (see chapter 4.3 Active Modes)

Remote wake-up via LINx bus request

After a falling edge on the LINx bus followed by a dominant voltage level for longer than the specified

value(t_{wu_remote}) and a rising edge on pin LINx will cause a remote wake up (see Figure 6 at page 19)

Local wake-up via a negative edge on pin WAKE



A negative edge on the pin WAKE and a dominant voltage level for longer than the specified time (t_{wu_local}) will

cause a local wake-up. The current for an external switch has to be provided by an external pull up resistor

R_WK. For a reverse current limitation in case of a closed external switch and a negative ground shift or an ECU

loss of ground a protection resistor R_{WK_prot}between pin WAKE and the switch is recommended. (see Figure 7

at page 20)

The pin WAKE provides a weak pull up current towards the battery voltage that provides a HIGH level on the

pin in case of open circuit failures or if no local wake up feature is required. In such applications it is

recommended to connect the pin WAKE to pin Vs via a resistor of 10k ohms.

8.6. Wake Up Source Recognition

The device can distinguish between a local wake-up event (pin WAKE) and a remote wake-up event in dependence of

the requesting LINx bus.

Local Wake Up

In case of a local wakeup via WAKE pin, the wake up request is indicated by an active LOW on pin RxD1. The wake-up

source flag is set and is indicated by an active LOW on pin TxD1.

The wake-up source flag can be read if an external pull up resistor at TxD1 towards the microcontroller supply voltage

has been added and the MLX80004/2 is still in standby mode:

When the microcontroller confirms an active mode operation by setting the pin MODE0/1 to HIGH, both the wake-up

request on pin RxD1 as well as the wake-up source flag on pin TxD1 are reset immediately.

Remote Wake Up

In case of a remote wake-up via a LINx bus, the source of the wake-up request will be indicated by the RxDx pin that

belongs to the LINx pin. (example: LOW level on RxD4 and floating RxD1-3 indicate a wake-up request on LIN4).

The wake up source flag at TxD1 remains floating.

This allows following the wake-up request of the requesting LIN bus while remaining the other LIN bus channels in

recessive mode (no wake up occurs in these LIN networks).

After a mode transition into any active mode by setting the pin MODE0/1 to HIGH, the active LOW wake-up request on

pin RxDx is reset immediately.

If the device is not set into an active mode after a wake up request (either local or remote) then it will return into sleep

mode after t_dsleep

.

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

Figure 6: remote wake up and wake-up source recognition

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

Figure 7: local wake up and wake-up source recognition

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

8.7. Master / Slave configuration

The target applications of the MLX80004/2 are BCM master modules with multiple LIN channels. In order to be able to

use the same module for a wide variety of applications with different stages of extension, a space efficient and cost

effective adaptation on the number of LIN channels is desired.

The MLX80004/2 device family offers the combination of quad and dual channel LIN transceiver within the same

advanced package and a compatible foot print.

By the integration of the LIN master-termination (decoupling diode and 1K resistor) the external circuitry can be

minimized in terms of space as well as BOM (bill of material). The RxD time-out feature allows the handling of a LIN

short to ground failure without software support by the microcontroller. This application mode is called enhanced

master mode, compatible to the functionality of the quad – LIN transceiver MLX80001.

In case of different BCM requirements it may happen that the external master termination is desired only. To cover

these applications the pin DIS_MAS has been introduced:

DIS_MAS

Mode

LIN termination

Supported fail safe features

 RxDx time-out, independent disconnect of master

Active mode : Diode & 1k

sleep mode :Diode & 60µA

termination in case of LINx short to ground

Enhanced Master

Mode

GND

 TxDx time-out, independent disable of faulty

dominant blocked transmit path

Active mode : Diode & 30k

sleep mode :Diode & 60µA

Standard

Transceiver Mode

 TxDx time-out, independent disable of faulty

dominant blocked transmit path

Vs

Table 9: Time Out Modes

In case of externally mounted master termination (standard transceiver mode), the handling of a LIN short to ground is

not possible. By using the standard transceiver mode, the MLX80004/2 can be used in slave applications as well. To

pull the pin DIS_MAS to high even in case the external ECU regulator is switched off in sleep mode. The pin shall be

connected to Vs via an external resistor. (see Figure 8 at page 24, application example)

In the standard transceiver mode, only the TxDx time-out feature is enabled.

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

9. Fail-safe Features

9.1. Loss of battery

If the ECU is disconnected from the battery, the bus pin is in high impedance state. There is no impact to the bus traffic

and to the ECU itself. Reverse current is limited to < 20µA

9.2. Loss of Ground

In case of an interrupted ECU ground connection there is no influence to the bus lines. The current from the ECU to the

LINx pins is limited by the weak pull up current of the pin LINx, the integrated master termination (DIS_MAS = GND) as

well as the integrated slave termination (DIS_MAS = V_s) is disconnected in order to fulfill the SAE J2602 requirements

for the loss of ground current (<100µA @12V).

9.3. Short circuit to battery

The transmitter output currents are limited to the specified value in case of short circuit to battery in order to prevent

high current densities and thermal hot spots in the LIN drivers. In dependency of the ambient temperature as well as

the battery voltage the junction temperature can exceed the specified value and a thermal overload condition occurs

(see chapter 4.5)

9.4. Ground shift and short circuit to ground

If the LIN bus wiring is shorted to negative shifted ground levels, there is no current flow from the ECU ground to the

LIN bus and no distortion of the bus traffic occurs.

A LIN bus short to ground condition can cause an undesired current flow. The MLX80004/MLX80002 offers different

opportunities to handle the LIN short to ground, see chapter 8.7.

9.5. Thermal overload

The MLX80004 and the MLX80002 is protected against thermal overloads. If the chip junction temperature exceeds

the specified value, all transmitters are disabled and the master termination is switched off in order to reduce the

power consumption. The receiver is still working during the thermal shutdown state. The pins RxDx indicate the

voltage level from the LINx pins also if the circuit is in thermal shut down. The circuit returns automatically to the

normal mode after thermal recovery.

9.6. Undervoltage lock out

If the battery supply voltage is missing or decreased under the specified value (V_{S_UV}), all transmitters are disabled to

prevent undefined bus traffic.

While in sleep mode, the MLX80004/2 enters the standby mode if Vs drops below the internal power on reset

threshold (V_INH= V_s).

9.7. Open Circuit protection



The pins TxDx provide a weak pull down. The transmitter cannot be enabled.

The pins MODE0/MODE1 provide a weak pull down to prevent undefined active mode transitions.

If the battery supply voltage is disconnected, the pins RxDx are floating

The pin WAKE provides a weak pull up current towards supply voltage Vs to prevent local wake-up requests.

The pin DIS_MAS provides a pull down current of 50uA.

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

9.8. TxDx faulty start protection

After power-on or wake-up a dominant level on TxDx will not lead to a dominant LINx level if the IC is being switched

into an active mode. Only in case of recessive level before applying the first dominant level the transmit path will be

enabled.

9.9. RxDx dominant time-out

A dominant LINx level longer than the specified time (typ. 40ms) indicates a faulty blocked bus. The master pull-up

resistor of the affected LIN channel will be disconnected from the network in order to prevent thermal overload

conditions or failure currents from the battery without any intervention from the microcontroller. Only a weak pull-up

current (typ.60uA) is applied on the LIN bus. The RxD time-out will be reset with the next dominant -> recessive

transition on the LIN bus if the failure disappears.

The RxDx time-out is only active in the Enhanced Master Mode, while the master termination is enabled.

9.10. TxDx dominant time-out

In case of a faulty blocked permanent dominant level on pin TxDx the transmit path will be disabled after the specified

time t_{TxDx_to}(typ. 40ms). The data transmission is released again as soon as the failure disappears by the next rising

edge of TxDx. The TxDx time-out is active in both, the Standard Transceiver and Enhanced Master Mode.

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

10. Application Example

10.1. Enhanced Master Mode

Car Battery Cl30

LINx

1N4001

22uF

network

V_{BAT_ECU}

Master

ECU

Voltage regulator

V_BAT

+5V

100nF

4,7K

10K

VS

WAKE

INH

MLX80004

LIN1

TxD1

TxD2

LIN2

TxD3

TxD4

µP

LIN3

LIN4

RxD1

RxD2

RxD3

RxD4

1nF

MODE0

MODE1

Control

LIN

DIS_MAS

1N4001

22uF

V_{BAT_ECU}

Slave

ECU

Voltage regulator

V_BAT

INH

+5V

100nF

4,7K

10k

10K

VS

INH

DIS_MAS

WAKE

LIN1

LIN2

TxD1

TxD2

µP

180p

MLX80002

RxD1

RxD2

MODE0

MODE1

Control

LIN

Figure 8:

Application example using enhanced master mode with minimized external components and LIN short to GND feature.

Note: All pins of MLX80004/MLX80002 with „N.C.“ are internally not connected.

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

10.2. Standard Transceiver Mode

Car Battery Cl30

LINx

1N4001

22uF

network

V_{BAT_ECU}

Master

ECU

Voltage regulator

V_BAT

+5V

100nF

4,7K

10k 10K

VS

INH

DIS_MAS

WAKE

1K

LIN1

LIN2

TxD1

TxD2

TxD3

TxD4

µP

LIN3

LIN4

RxD1

RxD2

RxD3

RxD4

1nF

MODE0

MODE1

Control

LIN

MLX80004

1N4001

22uF

V_{BAT_ECU}

Slave

ECU

Voltage regulator

V_BAT

INH

+5V

100nF

4,7K

10K

VS

INH

WAKE

TxD

LIN

µP

MLX80020

180p

RxD

EN

Control

LIN

Figure 9:

Application example using standard transceiver mode without LIN short to GND feature.

Note: All pins of MLX80004/MLX80002 with „N.C.“ are internally not connected.

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

10.3. Application Circuitry for EMC

In order to minimize EMC influences, the external application circuitry shall be designed as followed:

D12)

VS

+

C11)

C22)

C32)

VS

R12)

R22)

Signal

-line

WAKE

LIN

LINx

MLX80004

C42)

C51)

D21)

GNDx

GND

1) optional implemented

2) mandatory implemented

Figure 10:

Typical Application Circuitry for EMC

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

10.3.1. External Circuitry on Supply Lines

In order to minimize EMC influences, the external application circuitry shall be designed as followed:

Name

Mounting

Min

Recommended

Max

Dim

Comment

Ceramic SMD: 10%, 0805,

≥50V;

C1

recommended

-

100

-

nF

close to the connector

D1

C2

mandatory

Inverse-polarity protection diode

Tantal SMD: 10%, 7343, 35V

1

-

22

100

-

μF

Ceramic SMD: 10%, 0805,

≥50V;

C3

mandatory

100

nF

close to the pin

Table 10: External Components on Supply Lines

10.3.2. External Circuitry on LIN Lines

In order to minimize EMC influences, the external application circuitry shall be designed as followed:

Name

Mounting

Min

Recommended

Max

Dim

Comment

ESD protection Diode: SOD323

close to the connector;

D2

no

-

PESD1LIN

-

Ceramic SMD: 10%, 0805, ≥50V;

C_Slave≤ C_D2+C₄+C_IC

C4

mandatory

-

220/1000

-

pF

C_Slave≤250pF/ C_Master≤1nF

Table 11: External Components on LIN Lines

10.3.3. External Circuitry on Signal Lines

In order to minimize EMC influences, the external application circuitry shall be designed as followed:

Name

C5

Mounting

no

Min

0.1

5k

Recommended

Max

100

Dim

nF

Comment

1

Ceramic SMD: 10%, 0805, ≥50V;

Serial resistor: 0805

R2

mandatory

10k

100k

Ω

Table 12: External Components on Signal Lines

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

11. Mechanical Specification QFN24

The chip will be assembled in a 24Pin QFN 4x4 Package with wettable flanks.

Figure 11: Package Drawing

Θja [°C/W]

(JEDEC 1s0p board)

Θja [°C/W]

(JEDEC 1s2p board)

Package

Θjc [°C/W]

QFN 4x4

16

154

50

Table 13: _JAvalues

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

12. Package Marking Information

5-digit Type Number

Design revision

18 17

16 15 14 13

12

11

10

9

19

20

21

22

23

24

80004

A

2345D

1025

5-digit Lot Number

8

4-digit Date Code

Format: YYWW

7

1

2

3

4

5

6

Figure 12: Package marking of the MLX80004 device in QFN24 4x4 SMD package

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

13. Tape and Reel Specification

Note: that the above mentioned labels are just examples which represent the label layout!

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

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Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

14. ESD and EMC

In order to minimize EMC influences, the PCB has to be designed according to EMC guidelines.

The products MLX80004/2 are ESD sensitive devices and have to be handled according to the rules in IEC61340-5-2.

The products MLX80004/2 are evaluated according AEC-Q100-002 (HBM) and AEC-Q100-011 (CDM).

The extended ESD/EMC tests (acc. to IEC 61000-4-2, LIN Conf. Test Specification Package for LIN2.1, OEM hardware

requirements for LIN, CAN and FlexRay Interfaces in automotive applications – Audi, BMW, Daimler, Porsche,

Volkswagen - Rev. 1.3/2012) have been tested by external certificated test houses.

The test reports are available on request.

14.1. Automotive Qualification Test Pulses

Automotive test pulses are applied on the module in the application environment and not on the naked IC. Therefore

attention must be taken, that only protected pins (protection by means of the IC itself or by means of external

components) are wired to a module connector. In the recommended application diagrams, the reverse polarity diode

together with the capacitors on supply pins, the protection resistors in several lines and the load dump protected IC

itself will protect the module against the below listed automotive test pulses. The exact value of the capacitors for the

application has to be figured out during design-in of the product according to the automotive requirements.

For the LIN pin the specification “LIN Physical Layer Spec 2.1 (Nov. 24, 2006)” is valid.

Supply Pin VS is protected via the reverse polarity diode and the supply capacitors. No damage will occur for defined

test pulses. A deviation of characteristics is allowed during pulse 1 and 2; but the module will recover to the normal

function after the pulse without any additional action. During test pulse 3a, 3b, 5 the module will work within

characteristic limits.

14.2. Test Pulses On supply Lines

test condition,

functional status

Parameter

Symbol

Min

Max

Dim

Coupling

Transient test pulses in accordance to ISO7637-2 (supply lines) & , VS=13.5V, TA=(23 ± 5)°C

& (Document: “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”; Audi, BMW, Daimler,

Porsche, VW; 2009-12-02)

5000 pulses,

functional state C

5000 pulses,

functional state A

Test pulse #1

vpulse1

-100

-150

V

Direct

Test pulse #2

Test pulse #3a

Test pulse #3b

vpulse2

75

V

Direct

vpulse3a

vpulse3b

1h,functional state A

100

Load dump test pulse in accordance to ISO7637-2 (supply lines), VS=13.0V, TA=(23 ±5)°C

1 pulse clamped to 27V (+13V

(VS)),

65

87

Test pulse #5b

vpulse5b

(+13V

(VS))

(+13V

(VS))

V

Direct

(32V (+13V (VS))for

applications for north America),

functional state C

Table 14: Test pulses Supply Line

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

14.3. Test pulses on Pin LIN

test

condition,

functional

status

Parameter

Symbol

Min

Max

Dim

Coupling

Transient test pulses in accordance to ISO7637-3, VS=13.5V, TA=(23 ±5)°C

& (Document: “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”; Audi, BMW, Daimler,

Porsche, VW; 2009-12-02)

1000

Direct capacitive

Vpulse_

slow+

pulses,

functional

state D

Test pulse ‘DCC slow –‘

Test pulse ‘DCC slow +‘

-100

-150

V

coupled:

1nF

1000

pulses,

functional

state D

Direct capacitive

coupled:

Vpulse_

slow-

75

1nF

Direct capacitive

coupled:

10 min,

functional

state D

Vpulse_

fast_a

Test pulse ‘DCC fast a’

Test pulse ‘DCC fast b’

V

100pF

Direct capacitive

coupled:

10 min,

functional

state D

Vpulse_

fast_b

100

100pF

Table 15: Test pulses LIN

14.4. Test pulses on signal lines

test condition,

functional status

Parameter

Symbol

Min

Max

Dim

Coupling

Transient test pulses in accordance to ISO7637-3 (signal lines). VS=13.5V, TA=(23 ± 5)°C

Vpulse_

slow+

1000 pulses,

functional state C

1000 pulses,

Direct capacitive

coupled:100nF

Test pulse ‘DCC slow –‘

Test pulse ‘DCC slow +‘

Test pulse ‘DCC fast a’

Test pulse ‘DCC fast b’

-30

+8

-8

+30

-10

40

V

Vpulse_

slow-

Vpulse_

fast_a

Vpulse_

fast_b

Direct capacitive

coupled:100nF

functional state A

Direct capacitive

coupled:100pF

10 min,

functional state A

-60

10

10 min,

functional state A

Direct capacitive

coupled:100pF

Table 16: Test pulses signal lines

Description of functional state

A:

B:

All functions of the module are performed as designed during and after the disturbance.

All functions of the module are performed as designed during the disturbance:

One or more functions can violate the specified tolerances. All functions return automatically to within their

normal limits after the disturbance is removed. Memory functions shall remain class A.

A function of the module does not perform as designed during the disturbance but returns

automatically to the normal operation after the disturbance is removed.

C:

D:

A function of the module does not perform as designed during the disturbance and does not

return automatically to the normal operation after the disturbances is removed.

The device needs to be reset by a simple operation/action to return to the specified limits/function.

Revision 021 – Sept 2016

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

14.5. Test circuitry for automotive transients

Figure 13: Test circuit for automotive transients

Figure 13 shows the general requirement on the test circuitry for applying automotive transient test pulses.

In order to represent the most critical network impedance, the LINx pins has to be connected via 1kOhm / decoupling

diode to the Schaffner test generator. Including the integrated master termination of 1kOhm, the minimum network

resistance of 500Ohm can be simulated by adding an external 1Kohm resistor.

In slave application mode (DIS_MAS = Vs), the external coupling has to be applied via 500Ohm resistor.

Revision 021 – Sept 2016

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

14.6. EMC Test pulse definition

EMC Test Pulse shapes (ISO7637-2 (supply lines))

Test Pulse 1

Ri = 10 Ohm

Test pulse 2

Ri = 2 Ohm

200 ms

0.5...5s

V

< 100 µs

50 µs

1 µs

V

12 V

0 V

t

10%

90%

vpulse1

vpulse2

90%

10%

12V

1 µs

2 ms

0 V

t

200 ms

0.5...5s

Test Pulse 3a

Ri = 50 Ohm

Test Pulse 3b

Ri = 50 Ohm

100 ns

5

ns

V

90%

V

vpulse3b

12V

10%

0

V

t

vpulse3a

vpulse3b

vpulse3a

10%

12V

0 V

100 µs

10 ms

90 ms

100 µs

10 ms

t

5 ns

90%

90 ms

100 ns

Test Pulse 5 (Load Dump)

Ri = 0.5…4 Ohm (clamped to 45V during test)

V

Pulse 5

90%

vpulse5

Pulse 5 at

device

40V

12V

10%

t

tr = 0.1...10ms

td = 40...400ms

Table 17: Test pulses shapes ISO7637-2

EMC Test Pulse shapes (ISO7637-3 (non-supply lines))

Test Pulse ‘DCC slow –’

Test pulse ‘DCC slow +’

Ri = 2 Ohm

Test Pulse ‘Fast a, DCC’

Test Pulse ‘Fast b, DCC’

Ri = 50 Ohm

Table 18: Test pulses shapes ISO7637-3

Revision 021 – Sept 2016

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

15. Standard information regarding

manufacturability of Melexis products with different

soldering processes

Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level

according to following test methods:

Reflow Soldering SMD’s (Surface Mount Devices)



IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

(classification reflow profiles according to table 5-2)

EIA/JEDEC JESD22-A113

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

(reflow profiles according to table 2)

Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)



EN60749-20

Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat

EIA/JEDEC JESD22-B106 and EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Iron Soldering THD’s (Through Hole Devices)



EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)



EIA/JEDEC JESD22-B102 and EN60749-21

Solderability

For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,

temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon

with Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive

strength between device and board.

Melexis recommends reviewing on our web site the General Guidelines soldering recommendation

(http://www.melexis.com/Quality_soldering.aspx) as well as trim&form recommendations

(http://www.melexis.com/Assets/Trim-and-form-recommendations-5565.aspx).

For wettable flanks packages, please refer to the Melexis Application Note “QFN wettable flanks specific handling”.

Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information

on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain

Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx

Revision 021 – Sept 2016

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MLX80002/MLX80004

Enhanced Universal Dual/Quad LIN Transceiver

Datasheet

16. Disclaimer

Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of

Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth

herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to

change specifications and prices at any time and without notice. Therefore, prior to designing this product into a

system, it is necessary to check with Melexis for current information. This product is intended for use in normal

commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or

high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not

recommended without additional processing by Melexis for each application.

The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to

recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of

profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in

connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or

liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services.

For the latest version of this document, go to our website at

www.melexis.com

Or for additional information contact Melexis Direct:

Europe, Africa, Asia:

America:

Phone: +32 1367 0495

Phone: +1 248 306 5400

E-mail: sales_europe@melexis.com E-mail: sales_usa@melexis.com

ISO/TS 16949 and ISO14001 Certified

Revision 021 – Sept 2016

Page 38 of 38

型号	制造商	描述	价格	文档
MLX80020	MELEXIS	Enhanced LIN Transceiver	获取价格
MLX80020KDC-BAA-000-RE	MELEXIS	IC TXRX 2ND GEN LIN2.X 8SOIC	获取价格
MLX80020KDC-BAA-000-SP	MELEXIS	IC TXRX 2ND GEN LIN2.X 8SOIC	获取价格
MLX80020KDC-BAA-000-TU	MELEXIS	IC TXRX 2ND GEN LIN2.X 8SOIC	获取价格
MLX80020KDC-BBA-000-RE	MELEXIS	IC TXRX 2ND GEN SAE J2602 8SOIC	获取价格
MLX80020KDC-BBA-000-SP	MELEXIS	IC TXRX 2ND GEN SAE J2602 8SOIC	获取价格
MLX80020KDC-BBA-000-TU	MELEXIS	IC TXRX 2ND GEN SAE J2602 8SOIC	获取价格
MLX80020KDCBAA-000RE	MELEXIS	Enhanced LIN Transceiver	获取价格
MLX80020KDCBAA-000TU	MELEXIS	Enhanced LIN Transceiver	获取价格
MLX80020KDCBBA-000RE	MELEXIS	Enhanced LIN Transceiver	获取价格

MLX80004KLWBAA-001RE

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