MLX90392ELQ-AAA-011-RE [MELEXIS]
3D Magnetometer;
| 型号： | MLX90392ELQ-AAA-011-RE |
| 厂家： | 
Melexis Microelectronic Systems |
| 描述： | 3D Magnetometer |
| 文件： | 总40页 (文件大小：2766K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MLX90392
3D Magnetometer
Datasheet
Features and Benefits
Application Examples
▪
3-axis magnetometer device suitable for
compass and position sensors applications
Triaxis Hall Technology
▪
Power tools - Screwdriver trigger
▪
Home security - door/ window opening
detection
▪
Suitable for space constrained applications
(only 2 x 2,5 x 0.4mm)
▪
▪
▪
▪
Knobs for White goods
PC peripheral – Mouse roller
Gaming joystick
▪
▪
Compatible with I2C FM+
Low power application – Power down
current of 1.5uA
Anti-tamper for energy metering
▪
▪
Supply voltage of 1.8V
Description
Ambient temperature range from -40degC
to 85degC
The device, especially designed for micropower
applications, measures magnetic fields along the 3
axis (X, Y being in a plane parallel to the surface of
the die, Z being perpendicular to the surface). Those
measurements and the IC temperature are
converted into 16-bit words which are transferred
upon request over I2C communication channel. The
device transmits compensated raw measurement
data.
▪
▪
▪
Digital Output
o
o
16-bit Magnetic (XYZ)
16-bit Temperature
At runtime selectable modes
o
o
Single Measurement
Continuous Mode up to 1.4kHz (XYZ)
RoHS Compliant & Green Package
The MLX90392 is available in 2 magnetic versions:
▪
▪
+/-5mT range for Low noise applications
+/-50mT range for position sensor
applications
UTDFN-8
Transportstraat 1
3980 Tessenderlo
Phone: +32 13 61 16 75
Fax: +32 13 67 07 70
www.melexis.com
Datasheet
MLX90392
3D Magnetometer
1. Ordering information
Ordering Code
Temperature
Package
Type
Output
Packing
MLX90392ELQ-AAA-010-RE
MLX90392ELQ-AAA-011-RE
Table 1 – Ordering codes
-40°C to 85°C
-40°C to 85°C
UTDFN-8 2x2.5
UTDFN-8 2x2.5
+/-5mT
+/-50mT
I2C
I2C
Reel
Reel
Legend:
Packing Delivery Form
Option Code for variant
Silicon & Firmware Version
Package Code
Temperature Code
Product Name
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3D Magnetometer
2. Contents
Contents
Features and Benefits...........................................................................................................................................1
Application Examples ...........................................................................................................................................1
Description ...........................................................................................................................................................1
1. Ordering information....................................................................................................................................2
2. Contents .......................................................................................................................................................3
3. Glossary of terms..........................................................................................................................................5
4. Pins Description and Block diagram .............................................................................................................6
4.1. Pins description ....................................................................................................................................6
5. Block Diagram...............................................................................................................................................6
6. Conditions and Specifications.......................................................................................................................7
6.1. Absolute Maximum Ratings (AMR) ......................................................................................................7
6.2. Operating Conditions............................................................................................................................7
6.2.1.
6.2.2.
6.2.3.
6.2.4.
General Operating Conditions......................................................................................................7
Electrical Operating Conditions....................................................................................................7
Magnetic Operating Conditions....................................................................................................7
I2C Timings Conditions .................................................................................................................8
6.3. Electrical Specifications ........................................................................................................................9
6.4. Magnetic Specifications......................................................................................................................10
6.5. Timing Specifications..........................................................................................................................12
6.6. Accuracy Specifications ......................................................................................................................14
7. Functional Description & Interfaces...........................................................................................................15
7.1. Operating Modes................................................................................................................................15
7.1.1.
7.1.2.
7.1.3.
7.1.4.
Single measurement mode.........................................................................................................15
Continuous measurement Mode ...............................................................................................17
Self-test Mode (recommended for version xxx - 010)................................................................20
Idle mode....................................................................................................................................22
7.2. Output protocol (I2C) description ......................................................................................................22
7.2.1. Command implementation ........................................................................................................22
7.3. Memory items description .................................................................................................................24
7.3.1.
7.3.2.
Memory Structure ......................................................................................................................24
I/O registers description.............................................................................................................24
7.4. Flowchart............................................................................................................................................29
7.5. Performance Graphs...........................................................................................................................30
7.5.1.
Noise performance.....................................................................................................................30
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7.5.1.1.1. Version 010 - Without temperature compensation...............................................................30
7.6. Temperature compensation...............................................................................................................33
8. Application Information .............................................................................................................................34
8.1. Recommended Application Diagram..................................................................................................34
9. Package and Manufacturability information..............................................................................................34
9.1. ESD precaution ...................................................................................................................................34
9.2. Package information...........................................................................................................................35
9.2.1.
9.2.2.
9.2.3.
Dimensions .................................................................................................................................35
Sensing element placement .......................................................................................................36
Marking.......................................................................................................................................37
9.3. Standard information on soldering processes ...................................................................................37
10.
References..............................................................................................................................................38
List of figures ..................................................................................................................................38
List of tables....................................................................................................................................38
Revision History......................................................................................................................................39
Disclaimer ...............................................................................................................................................40
10.1.
10.2.
11.
12.
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3D Magnetometer
3. Glossary of terms
Term
Description
NC
ADC
LSB
Not Connected
Analog-to-digital converter
Least significant bit
MSB
Gauss (G)
RMS
POR
Most significant bit
Units for magnetic flux density – 1mT = 10G
Root mean square
Power On reset
NV
DSP
Non-volatile
Digital signal processing
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3D Magnetometer
4. Pins Description and Block diagram
4.1. Pins description
Pin #
Name (I2C)
Description
1
2
3
4
5
6
7
8
SDA
VDD
VSS
SCL
Not used
Not used
Not used
Not used
[I/O] Bus Data
[S] Supply
[S] Ground
[I] Bus clock
Not connected
Not connected
Not connected
Not connected
Table 2 – Pin description
5. Block Diagram
Figure 1: IC block diagram
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3D Magnetometer
6. Conditions and Specifications
6.1. Absolute Maximum Ratings (AMR)
Operating Characteristics, TA = -40°C to 85°C (unless otherwise specified)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Supply Voltage
Reverse voltage protection
Output voltage
Reverse output voltage
Reverse clock output voltage
ESD HBM (all pins)
VS
VSREV
VSDA, VSCL
VSDAREV
VSCLREV
2.3
-0.3
2.3
-0.3
-0.3
V
V
V
V
V
kV
°C
°C
°C
K/W
<48h
Room temp, <48h
<48h
Operating Temperature
Junction Temperature
Storage Temperature
Thermal resistance
TA
-40
-40
+85
+85
150
TJUNC
Tstorage
Rthja
230
40
Junction to ambient
1s0p board
Junction to ambient
multi layered pcb
Junction to case
K/W
Thermal resistance
Magnetic Flux density
Table 3– Absolute Maximum Ratings
Rthjc
3.4
K/W
T
-1
1
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum-
rated conditions for extended periods may affect device reliability.
6.2. Operating Conditions
6.2.1. General Operating Conditions
Parameter
Operating Temperature
Storage Temperature
Symbol
TA
Tstorage
Min.
-40
-40
Typ.
Max.
+85
150
Unit
°C
°C
Conditions
Conditions
Conditions
Table 4 – General operating conditions
6.2.2. Electrical Operating Conditions
Parameter
Supply Voltage
Symbol
Min.
1.65
Typ.
1.8
Max.
1.95
Unit
V
VS
Table 5 – Electrical Operating conditions
6.2.3. Magnetic Operating Conditions
Parameter
Symbol
Min.
Typ.
Max.
Unit
Magnetic Flux density
Magnetic Flux density
-5
-50
5
50
mT
mT
version XXX-010
version XXX-011
Table 6 – Magnetic Operating conditions
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6.2.4. I2C Timings Conditions
I2C Standard Mode
I2C Fast Mode Plus
Electrical Parameter
Symbol
Unit
Min.
0
Max.
100
Min.
0
Max.
1000
SCL Clock Frequency
SCL Clock Low Time
SCL Clock High Time
SDA Setup Time
SDA Data Hold Time
f (SCL)
tw (SCLL)
tw (SCLH)
tsu (SDA)
th (SDA)
th (ST)
kHz
µs
µs
ns
µs
µs
µs
µs
4.7
4
0.5
0.26
50
250
0
3.45
0
0.45
START Condition Hold Time
REPEATED START Condition Setup Time
STOP Condition Setup Time
Bus Free Time Between STOP and START
Condition
4
4.7
4
0.26
0.26
0.26
tsu (SR)
tsu (SP)
tw (SP:ST)
4.7
0.5
µs
Table 7: General I2C Timing Specification
Figure 2: I2C Timing Diagram
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6.3. Electrical Specifications
Operating Characteristics, TA = -40°C to 85°C (unless otherwise specified)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Power On Reset (rising edge)
Power On Reset (falling edge)
Conversion Current
VPOR_LH
VPOR_HL
1.44
1.35
2.2
2.7
1.4
1.9
0.6
6
1.5
1.4
2.7
3.6
1.8
2.8
0.73
11
1.55
1.45
3.5
5.2
2.7
4.3
0.85
16
V
V
IDD,CONVXY
IDD,CONVZ
IDD,CONVXY
IDD,CONVZ
IDD,CONVT
IDD,CNT
mA
mA
mA
mA
mA
µA
µA
mA
XY axis - Version 010
Z axis - Version -010
XY axis - Version 011
Z axis - Version -011
Temperature
Conversion Current
Conversion current
Counting state current
Idle current
IDD,IDLE
IDD,AVG100-0
0.4
1.8
1.5
2.3
3
3.2
Average current
Version xxx-010
Continuous mode XYZT,
OSR_HALL=1
100Hz refresh
DIG_FILTXY=4
DIG_FILTZ=5
DIG_FILT_TEMP=1
OSR_TEMP=1
Temp Comp enabled
Average current
100Hz refresh
IDD,AVG100-1
IDD,AVG100-1
IDD,AVG200-0
IDD,AVG200-1
1.2
0.7
1.8
1.3
1.7
2.7
1.5
3.5
2.8
mA
mA
mA
mA
VersionXXX-011
Continuous mode XYZT,
OSR_HALL=1
DIG_FILTXY=4
DIG_FILTZ=5
DIG_FILT_TEMP=1
OSR_TEMP=1
Temp Comp enabled
Version xxx-011
Continuous mode XYZT,
OSR_HALL=1
Average current
100Hz refresh
0.95
2.45
1.85
DIG_FILTXY=3
DIG_FILTZ=4
DIG_FILT_TEMP=1
OSR_TEMP=1
Temp Comp enabled
Version xxx-010
Continuous mode XYZT,
OSR_HALL=1
Average current
200Hz refresh
DIG_FILTXY=3
DIG_FILTZ=4
DIG_FILT_TEMP=1
OSR_TEMP=1
Temp Comp enabled
Version xxx-011
Continuous mode XYZT,
OSR_HALL=1
Average current
200Hz refresh
DIG_FILTXY=3
DIG_FILTZ=4
DIG_FILT_TEMP=1
OSR_TEMP=1
Temp Comp enabled
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3D Magnetometer
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Temperature sensor
TRES
48
50
52
LSB16/°C
resolution(1)
Temperature sensor accuracy
Input Level High(2)
TLIN
VIH
VIL
VIHYST
Cin
-3
56
43
5
3
°C
+/-3sigma
SDA, SCL
SDA, SCL
SDA, SCL
SDA, SCL
59
48
11
5
63
54
17
10
%VDD
%VDD
%VDD
pF
Input Level Low(2)
Input Level Hysteresis
Input Capacitance(2)
SDA (Static, 1mA
Output Level Low
VOL
0.5
1
%VDD
load)
Output on resistance
Output leakage current
ESD HBM
Rdson
5
8
0.1
14
0.3
2
ohms
uA
kV
+/-3sigma
All pins
All pins
ESD CDM
Table 8 – Electrical Operating conditions
0.5
kV
6.4. Magnetic Specifications
Operating Characteristics, TA = -40°C to 85°C (unless otherwise specified)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
XY Magnetic sensitivity
SENSXY
0.135
1.33
0.15
1.5
0.165
1.67
µT/LSB
version xxx-010
version xxx-011
room temperature
version xxx-010
version xxx-011
room temperature
version xxx-010
version xxx-011
room temperature
version xxx-010
with temperature
compensation – 5ms
conv time
(DIG_FILTXY=3
DIG_FILTZ=4,
OSR_HALL=1),
room temperature
version xxx-010
without
Z Magnetic Sensitivity
SENSZ
BRANGE
0.135
1.33
0.15
1.5
0.165
1.67
µT/LSB
Magnetic measurement range
±4421
±43560
±4912
±49128
±5403
±54696
µT
µT
RMS Noise
NXYZ
2.2
1.5
2.4
1.7
µTrms
µTrms
temperature
compensation
5ms conv time
(DIG_FILTXY=3
DIG_FILTZ=4,
NXYZ
RMS Noise
OSR_HALL=1), room
temperature
1 The data format is 2’s complement with 0 lsb corresponding to 0degC
2 This specification relates to the sensor and not the I2C bus
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3D Magnetometer
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
RMS Noise
NXYZ
11
12
µTrms
version xxx-011
without
temperature
compensation – 5ms
conv time
(DIG_FILTXY=3
DIG_FILTZ=4,
OSR_HALL=1), room
temperature
RMS Noise
NXYZ
20
21
10
µTrms
version xxx-011
with temperature
compensation - 5ms
conv time
(DIG_FILTXY=3
DIG_FILTZ=4,
OSR_HALL=1), room
temperature
Sensitivity drift
Hysteresis
Table 9 – Magnetic Specifications
SENSTHD
Bh
-10
200
%
µT
vs. Ta=35degC
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3D Magnetometer
6.5. Timing Specifications
Operating Characteristics, TA = -40°C to 85°C (unless otherwise specified)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Fr1
With temperature
compensation (4)
Without
10
100
700
Hz
Output refresh rate(3)
Fr2
1400
Hz
temperature
compensation (4)
Oscillator trimming accuracy
Oscillator Thermal drift
TOSC_TRIM
TOSC_THD
TCONVM
-5
-5
105
0.5
0
111
5
5
117
%
%
µs
Time per axis
DIG_FILT=0, OSR=0
Time per axis
Magnetic axis conversion
time(5)
TCONVM
TCONVM
TCONVM
202
912
13.1
213
960
13.8
224
1008
14.5
µs
µs
DIG_FILT=0, OSR=1
Time per axis
DIG_FILT=3, OSR=1
Time per axis
ms
DIG_FILT=7, OSR=1
Reset to idle mode
with temp
Start up time
DSP Time
TStartup
TDSP
0.15
380
1.2
400
ms
µs
360
220
compensation
enabled (3)
235
250
µs
with temp
compensation
disabled (3)
Table 10 – Timing specifications
3 Fr1 and Fr2 are defined as the period between two set of measurements. It is relevant for the Continuous measurement mode and
is defined by the parameter MODE[3:0]. TREFRESH is adjustable with the following settings: 10Hz, 20Hz, 50Hz, 100Hz, 200Hz, 500Hz
and 1.4kHz. The default value in the non-volatile memory is 100Hz.
4 The temperature compensation can be enabled or disabled by the user.
5 This conversion time is defined as the time to acquire a single axis of the magnetic flux density. When measuring XYZ, they are
obtained through time-multiplexing. The conversion time is programmable through DIG_FILT for magnetic and temperature
conversion. The total conversion time is obtained by summing up the magnetic & temperature conversion time.
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Figure 3: Conversion time
The above graph can be expressed with the following formula:
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3D Magnetometer
6.6. Accuracy Specifications
Operating Characteristics, TA = -40°C to 85°C (unless otherwise specified). All specifications in this chapter are
given with +/- 3 sigma.
Parameter
Symbol
Min.
Typ.
16
-200
-200
300
Max.
Unit
bits
LSB16
Conditions
Resolution(6)
XYZ
Offset (7)
OFFSX
OFFSY
OFFSZ
-1100
-1100
-300
700
700
900
Version xxx-010
Output at 0Gauss.
Room temperature
Offset thermal drift X-axis
Offset thermal drift Y-axis
Offset thermal drift Z-axis
-840
-750
-440
1030
870
470
LSB16
LSB16
LSB16
%
Version xxx-010
vs. 35degC
Offset (7)
OFFSX
OFFSY
OFFSZ
-150
-330
-340
40
-130
80
220
70
500
Version xxx- 011
Output at 0Gauss.
Room temperature
Offset thermal drift X-axis
Offset thermal drift Y-axis
Offset thermal drift Z-axis
-120
-100
-220
90
120
190
Version xxx-011
vs. 35degC
SMISMXY
SMISMXZ
SMISMYZ
-5
-5
-3
-1
-2
-1
2
1
1
Version xxx-010
Mismatch on the raw signals
X, Y and Z
Parameter
Min.
Typ.
Max
Units
Conditions
Symbol
Thermal drift of sensitivity
mismatch
-110
225
ppm/°C
Version xxx-010
SMISMXY
SMISMXZ
SMISMYZ
-3
7
6
1
10
9
5
13
11
%
Version xxx-011
Mismatch on the raw signals
X, Y and Z
Thermal drift of sensitivity
mismatch
-140
265
ppm/°C
%
Version xxx-011
Cross-axis sensitivity (8)
SXYi
SYXi
SXZi
SZXi
SYZi
SZYi
-1.8
-2.7
-8.0
-5.0
-5.7
-4.8
0.5
-0.7
-3.2
-0.2
0.5
2.6
1.3
1.8
4.5
6.6
3
Version xxx-010
(guaranteed by
characterization /
not by final testing)
0.9
Cross-axis sensitivity (8)
SXYi
SYXi
SXZi
SZXi
SYZi
SZYi
-1.5
-1.7
-1.3
-3.0
-9.6
-3.3
0.2
0.0
4.9
1.0
-6.3
-1.6
1.9
1.8
12.4
5.6
-4.1
-0.5
%
Version xxx-011
(guaranteed by
characterization /
not by final testing)
Table 11 – Accuracy specifications
6 The data format is 2’s complement, further explanation can be found on chapter 7.1.2.6, Table 12
7 Value of measurement data register on shipment test without applying magnetic field on purpose
8
The cross axis sensitivity is measured by applying a force field on one axis and measured on another axis. For instance, SXYi means
that a field was applied along X axis and measured along Y axis.
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7. Functional Description & Interfaces
7.1. Operating Modes
MLX90392 has the following Application modes
1. Idle mode
2. Single measurement mode
3. Continuous measurement mode (10Hz, 20Hz, 50Hz, 100Hz, 200Hz, 500Hz, 700Hz and 1.4kHz)
4. Self-test mode
Operating
Mode
Start of
Mode
Command to
enter mode 1
or 9
End of Mode
(Return to IDLE)
Measurement Data
Single
Measurement
finished
measurement
(T)XYZ
Command to
enter mode 2,
3, 4, 5, 10, 11,
12, 13
Continuous
mode
Transition to
other mode
(T)XYZ
Power up or
command to
enter mode 0,
7, 8, 15
Transition to
other mode
-
Idle Mode
Command to
enter mode 6
and 14 from
Idle
Measurement
finished
Self-test Mode
Z
7.1.1. Single measurement mode
When the Single measurement mode is set, a magnetic measurement is started. After a measurement and
when the signal processing is finished, the measurement data is stored to the data registers (X, Y and Z).
After this, the sensor will go to the Idle mode automatically.
While going to the Idle mode, MODE[3:0] bits turns to 0. At the same time, DRDY bit (Data Ready) in STAT1
register turns to Low.
When any of measurement data register (X, Y and Z) is read, DRDY bit turns to Low. It remains High when
switching from Idle mode to another mode.
Figure 4: Single measurement mode when data is read out of measurement period
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When the sensor is measuring, the data registers (X, Y and Z) keep the previous data. Therefore, it is possible
to read out data even during measurement periods.
Figure 5: Single measurement mode when data read started during measurement period
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7.1.2. Continuous measurement Mode
When the "Continuous measurement" mode is set, the measurement starts periodically. After measurement
and signal processing is finished, the measurement data is stored to the data registers (X, Y, and Z).
Almost all internal blocks are disabled ("Counting" power state).
After a measurement period, the device wakes up automatically from "Counting" power state and starts a
new measurement.
The Continuous measurement mode ends when "Idle" mode (MODE[3:0] bits = 0) is set. If the measurement
period is changed while the device is already configured in "Continuous measurement" mode, a new
measurement starts.
STAT1 and measurement data registers (X, Y and Z) will not be initialized by this.
Figure 6: Continuous measurement mode
7.1.2.1. Data Ready
When the measurement data is stored and ready to be read, the DRDY bit (Data ready) in STAT register is set
to High. When a measurement is performed correctly, the device sets the Data Ready bit before going back
to "Counting" power state.
7.1.2.2. Normal Read Sequence
The stored measurement data is protected during the data reading. There is no update of the data during
this time. Consequently, the following sequence should be followed:
1. Check if the Data is Ready or not by polling DRDY bit of STAT1 register
a. DRDY: Data Ready. The Data is ready when set High.
2. Reading of the STAT1 register will not trigger the protection.
3. Read measurement data - When any of the measurement data register (X, Y, or Z) is read, the
device enables the protection as soon as the register is copied into the I2C sending register. When
data reading starts, DRDY (Data ready) bit turns Low.
4. Read STAT2 register (required for data consistency - provides information on overflow and data
skip)
When this read sequence is followed and there is no attempted I2C read during measurement, reading of
STAT2 sets the DOR bit to low (see I/O registers description for reference).
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Figure 7: Normal read sequence
7.1.2.3. Data Read Start during Measurement
When the sensor is measuring, the measurement data registers (X, Y and Z) keep the previous data.
Therefore, it is possible to read out data even in measurement period.
Figure 8: Data read start during measurement
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7.1.2.4. Data Skip
If the available data is not read before a new measurement ends, the DRDY bit (Data Ready) remains High.
However, a new set of measurement data will replace the previous one.
Figure 9: Data Skip: When data is not read
If the available data is read while a new measurement is being performed, this set of data will be protected.
This is also the case even if the reading procedure finishes after the measurement.
Consequently, this new set of data is skipped.
Figure 10: Data Skip: When data read has not been finished before the next measurement end
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7.1.2.5. End Operation
Set the Idle mode (MODE[3:0] bits = 0) to end the Continuous measurement mode.
7.1.2.6. Magnetic Sensor Overflow
Version - 010
The sum of absolute values of each axis must be smaller than 4912μT to avoid an overflow. (BRG:
0.15μT/LSB)
|X|+|Y|+|Z| < 4912μT
2's complement
0111_1111_1111_0000
|
Hex
7FF0
|
Dec
32752
Magnetic flux density [μT]
4912
|
|
0000_0000_0000_0001
0000_0000_0000_0000
1111_1111_1111_1111
|
0001
0000
FFFF
|
1
0
-1
0.15
0
-0.15
|
|
1000_0000_0001_0000
8010
-32752
-4912
Table 12 - Measurement magnetic data format
Version - 011
The sum of absolute values of each axis must be smaller than 49.13mT to avoid an overflow. (BRG:
1.5μT/LSB)
|X|+|Y|+|Z| < 4913μT
2's complement
0111_1111_1111_0000
|
Hex
7FF0
|
Dec
32752
Magnetic flux density [μT]
4913
|
|
0000_0000_0000_0001
0000_0000_0000_0000
1111_1111_1111_1111
|
0001
0000
FFFF
|
1
0
-1
1.5
0
-1.5
|
|
1000_0000_0001_0000
8010
-32752
-4913
Table 13 - Measurement magnetic data format
The calculation is done as follows:
|X|+|Y|+|Z| < 32752
When the magnetic field exceeds this limitation, this is a Magnetic Sensor Overflow. When magnetic sensor
overflow occurs, HOVF bit turns to “High”. The HOVF bit is updated as soon as the measurement data
register (X, Y and Z) is updated.
7.1.3. Self-test Mode (recommended for version xxx - 010)
The Self-test mode is used to check if the magnetic sensor is working normally.
When the Self-test mode is set, a magnetic field is generated by the internal magnetic source and a
measurement is performed. The data is stored to the data registers (X, Y and Z). The sensor will then go to
Idle mode automatically. The correct sequence to set the Self-test Mode is described below:
7.1.3.1. Self-test Sequence
1. Set Idle mode.
2. Set Self-test mode.
3. Check Data Ready or not by polling DRDY bit (Data Ready) of STAT1 register.
a. When the data is ready, proceed to the next step.
4. Read measurement data. (X, Y and Z)
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7.1.3.2. Self-test Judgment (used by the customer)
The following criteria will help the user to decide if the sensor is correctly calibrated.
DeltaX[15:0]
DeltaY[15:0]
DeltaZ[15:0]
Units
Criteria
-150 ≤ X ≤ 150
-150 ≤ Y ≤ 150
-1200 ≤ Z ≤ -400
LSB16
The typical magnetic field generated by the internal coil is around 135μT at room temperature. The self-test
judgement are the expected values over temperature and voltage variations
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7.1.4. Idle mode
In Idle mode, the device is in minimal power consumption state. All internal blocks including the oscillator
are disabled except the POR circuit. Only the communication over the I2C interface is maintained. The digital
handling of the communication is clocked by the I2C master clock. All registers remain accessible and the
data stored in read/write registers remains.
7.2. Output protocol (I2C) description
7.2.1. Command implementation
The following I2C commands are implemented:
▪
▪
MEM_DIRECT_READ: reads data from memory space, starting from the default address 0x00
MEM_READ: the start address will be specified in the command and the address will be
incremented for continuous reading until an I2C stop is detected.
▪
▪
MEM_WRITE: the start address will be specified followed by the data to be stored at
addresses starting from the given start address and incremented until an I2C stop is
detected.
ADDRESSED_RESET: reset of the device, based on the I2C Slave Address (reset of addressed
devices on the I2C bus only)
In the next sections, the format of the different I2C commands is explained.
The following legend is used:
7.2.1.1. Read Commands
There are two read commands that are implemented
▪
▪
MEM_DIRECT_READ: reads data from memory space, starting from the default address 0x00
MEM_READ: the start address will be specified in the command and the address will be incremented
for continuous reading until an I2C stop is detected.
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7.2.1.1.1.
MEM_DIRECT_READ (direct read) Command
MEM_DIRECT_READ: reads data from memory space, starting from the default address 0x00
Figure 11: I2C - MEM_DIRECT_READ (direct read) Command
NOTES:
▪
▪
Incremental readout – return 0x00 when address out of valid space
NAK is needed from master to allow going to STOP
MEM_READ (addressed read)
7.2.1.1.2.
MEM_READ: the start address will be specified in the command and the address will be incremented for
continuous reading until an I2C stop (P) is detected.
Incremental read-out starting at a given address (Register Start Address).
Normally it will read 1x register only, but the slave will continue to transmit data of sequential register
addresses until the master terminates the communication.
Figure 11: I2C - MEM_READ (addressed read)
Important! A repeated START is required to perform an “addressed read”. Without repeated START, the command will be
seen as a “direct read”.
As soon as incremental addressing leaves the address space, the slave will respond with all 0x00.
NOTES:
▪
▪
Incremental readout – return 0x00 when address out of valid space
NAK is needed from master to allow going to STOP
7.2.1.2. MEM_WRITE (addressed write) Command
MEM_WRITE: the start address will be specified followed by the data to be stored at addresses starting from
the given start address and incremented until an I2C stop (P) is detected.
Incremental write starting at a given address (Register Start Address).
Normally you write 1x register only, but optionally the master can continue to transmit data of sequential
register addresses to reduce the communication time when a lot of registers should be written.
Figure 12: I2C - MEM_WRITE (addressed write) Command
The slave is sending AK/NAK based on the fact whether it was able to write data
The slave will automatically increment the address of the read out byte, independent if it gave an AK or a
NAK to the master. It is up to the master to re-write the byte afterwards.
When the device is busy with the write operation, new write commands will be ignored. A read operation
will return invalid data.
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7.2.1.3. ADDRESSED_RESET: Addressed reset
The addressed reset command brings the device back into a state like it was after power-on.
The I2C Slave Address is used, which means that only the addressed devices on the I2C bus will be reset.
7.3. Memory items description
7.3.1. Memory Structure
The MLX90392 has registers (ports) of 16 addresses. Each address consists of 8 bits data.
Data is transferred to or received from the external CPU via the I2C interface.
Table 14 – Memory map
DNC=Do Not Change
The STAT1 register is mapped on address 0x00, since it is the default address of MEM_DIRECT_READ (direct
read) command.
The idea is that first the user has to read the status bits DRDY to check if there is new data and if there is
new data, to continue the command to read the registers X, Y and Z.
7.3.2. I/O registers description
1. Address 0x00. STAT1[7:0]
7
6
5
4
3
2
1
0
STAT1_7
STAT1_6
STAT1_5
STAT1_4
RT
STAT1_2
RW-0
STAT1_1
RW-0
DRDY
RW-0
RW-0
RW-0
RW-0
RW-0
RW-1
NOTE: R=Read access; W=Write access; value following dash (-) = value after reset
Bit 7 – 4
STAT1[7:4]. Reserved (Not used)
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RT. The device is reset
0 – The device was not reset
1 – The device was reset and this is the first reading. Automatically set to 0 when the first
reading of STAT register is done
Bit 3
Bit 2 – 1
STAT1[2:1]. Reserved (Not used)
DRDY. Data Ready.
DRDY bit turns to “1” when data is ready in "Single measurement" mode, "Continuous
measurement" mode or "Self-test" mode.
It returns to “0” when any one the measurement data register (X, Y or Z ) is read
Bit 0
0 – Normal
1 – Data is ReaDY
2. Addresses 0x01- 0x06. XYZ[15:0]
Bit 7 – 0
Bit 15 –8
Bit 7 – 0
Bit 15 –8
Bit 7 – 0
Bit 15 –8
X[7:0]. LSB byte of X axis
X[15:8]. МSB byte of X axis
Y[7:0]. LSB byte of Y axis
Y[15:8]. МSB byte of Y axis
Z[7:0]. LSB byte of Z axis
Z[15:8]. МSB byte of Z axis
3. Address 0x07. STAT2[7:0]
7
6
5
4
3
2
1
0
STAT2_7
STAT2_6
STAT2_5
STAT2_4
STAT2_3
STAT2_2
RW-0
DOR
RW-0
HOVF
RW-0
RW-0
RW-0
RW-0
RW-0
RW-0
NOTE: R=Read access; W=Write access; value following dash (-) = value after reset
STAT2 register contains the following bits:
Bit 7 – 2
STAT2[7:2]. Reserved (Not used)
DOR. Data Overrun
DOR bit turns to “1” when data has been skipped in "Continuous measurement" mode. It returns to
Bit 1
“0” when the data registers (X, Y, Z) are read.
0 – Normal
1 – Data OverRun
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HOVF. Magnetic Sensor OverfLow
0 – Normal
Bit 0
1 – Magnetic Sensor Overflow occurred
In "Single measurement" mode, "Continuous measurement" mode and "Self-test" mode, the magnetic sensor may
overflow even though the measurement data register is not saturated. In this case, measurement data is not correct and
HOVF bit turns to “1”. When the measurement data register is updated, HOVF bit is updated.
4. Addresses 0x08- 0x09. T[15:0]
Bit 7 – 0
Bit 15 –8
T[7:0]. LSB byte of Temperature
T[15:8]. МSB byte of Temperature
5. Addresses 0x0A. CID[7:0]
Bit 7 – 0
CID[7:0]. Company ID
6. Addresses 0x0B. DID[7:0]
Bit 7 – 0
DID[7:0]. Device ID
7. Addresses 0x10. CTRL[7:0]
7
6
5
4
3
2
1
0
CTRL_7
CTRL_6
CTRL_5
CTRL_4
MODE3
MODE2
RW-0
MODE1
RW-0
MODE0
RW-0
RW-0
RW-0
RW-0
RW-0
RW-0
NOTE: R=Read access; W=Write access; value following dash (-) = value after reset
Bit 7 - 4
CTRL[7:4]. Reserved (Not used)
MODE[3:0]. Application Mode
0 – Idle mode
1 – Single Measurements mode
2 – Continuous measurement mode 10Hz
3 – Continuous measurement mode 20Hz
4 – Continuous measurement mode 50Hz
5 – Continuous measurement mode 100Hz
6 – Self-test mode
Bit 3 - 0
7 – Idle mode
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8 – Idle mode
9 – Single Measurements mode
10 – Continuous measurement mode 200Hz
11 – Continuous measurement mode 500Hz
12 – Continuous measurement mode 800Hz
13 – Continuous measurement mode 1.4kHz
14 – Self-test mode
15 – Power-down mode
8. Addresses 0x11. RST[7:0]
Bit 7 – 0
RST[7:0]. Addressed RESET when users sends an I2C_ADDRESSED_RESET command
9. Addresses 0x12-0x13. Not used
10. Addresses 0x14. OSR_DIG_FILT[7:0]
7
6
5
4
3
2
1
0
OSR_HALL
OSR_TEMP
DIG_FILT_HA DIG_FILT_HA DIG_FILT_HA
DIG_FILT_TE
MP2
DIG_FILT_TE
MP1
DIG_FILT_TE
MP0
LL_XY2
LL_XY1
LL_XY0
RW-0
RW-0
RW-0
RW-0
RW-0
RW-0
RW-0
RW-0
NOTE: R=Read access; W=Write access; value following dash (-) = value after reset
OSR_HALL. Over Sampling Ratio setting for the magnetic measurements
Bit 7
Bit 6
0 - 32
1 - 64
OSR_TEMP. Over Sampling Ratio setting for the temperature measurement
0 - 32
1 - 64
DIG_FILT_HALL_XY[2:0]. DIG_FILT setting for X and Y magnetic measurements
0 - 0.113ms @ OSR = 0; 0.220ms @ OSR = 1
1 - 0.167ms @ OSR = 0; 0.327ms @ OSR = 1
2 - 0.273ms @ OSR = 0; 0.540ms @ OSR = 1
3 - 0.487ms @ OSR = 0; 0.967ms @ OSR = 1
4 - 0.913ms @ OSR = 0; 1.820ms @ OSR = 1
5 - 1.767ms @ OSR = 0; 3.527ms @ OSR = 1
6 - 3.473ms @ OSR = 0; 6.940ms @ OSR = 1
7 - 6.887ms @ OSR = 0; 13.767ms @ OSR = 1
Bits 5 - 3
DIG_FILT_TEMP[2:0]. DIG_FILT setting for the temperature measurements
0 - 0.113ms @ OSR = 0; 0.220ms @ OSR = 1
Bits 2 - 0
1 - 0.167ms @ OSR = 0; 0.327ms @ OSR = 1
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2 - 0.273ms @ OSR = 0; 0.540ms @ OSR = 1
3 - 0.487ms @ OSR = 0; 0.967ms @ OSR = 1
4 - 0.913ms @ OSR = 0; 1.820ms @ OSR = 1
5 - 1.767ms @ OSR = 0; 3.527ms @ OSR = 1
6 - 3.473ms @ OSR = 0; 6.940ms @ OSR = 1
7 - 6.887ms @ OSR = 0; 13.767ms @ OSR = 1
11. Addresses 0x15. CUST_CTRL[7:0]
7
6
5
4
3
2
1
0
DNC = 1
DNC = 0
T_COMP_EN
DNC = 1
CUST_CTRL3
DIG_FILT_HA DIG_FILT_HA DIG_FILT_HA
LL_Z2
LL_Z1
LL_Z0
RW-0
RW-0
RW-0
RW-0
RW-0
RW-0
RW-0
RW-0
NOTE: R=Read access; W=Write access; value following dash (-) = value after reset
Bit 7
Bit 6
DNC=1. Value is preloaded from OTP with 0b1. Do not change it
DNC=0. Value is preloaded from OTP with 0b0. Do not change it
T_COMP_EN. Enable or disable the temperature measurement and compensation
Bit 5
0 - Disabled
1 - Enabled
Bit 4
Bit 3
DNC=1. Value is preloaded from OTP with 0b1. Do not change it
CUST_CTRL3.Reserved. Not used
DIG_FILT_HALL_Z[2:0]. DIG_FILT setting for Z magnetic measurements
0 - 0.113ms @ OSR = 0; 0.220ms @ OSR = 1
1 - 0.167ms @ OSR = 0; 0.327ms @ OSR = 1
2 - 0.273ms @ OSR = 0; 0.540ms @ OSR = 1
3 - 0.487ms @ OSR = 0; 0.967ms @ OSR = 1
4 - 0.913ms @ OSR = 0; 1.820ms @ OSR = 1
5 - 1.767ms @ OSR = 0; 3.527ms @ OSR = 1
6 - 3.473ms @ OSR = 0; 6.940ms @ OSR = 1
7 - 6.887ms @ OSR = 0; 13.767ms @ OSR = 1
Bit 2 - 0
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7.4. Flowchart
Reset
Initialization
TSTARTUP
Power down command
Idle
State
Single measurement
End of single measurement
Continuous measurement
Power down command
Continuous mode
Active State
Measurement finished
Counting
State
3*TCONVM+TCONVT
+TDSP
Continuous mode
Next measurement
Figure 13: Sequence flowchart
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7.5. Performance Graphs
7.5.1. Noise performance
7.5.1.1.1.Version 010 - Without temperature compensation
Figure 14: version 010 - XY axis RMS noise (typ)
Figure 15: version 010 - Z axis RMS Noise (typ)
Note: When OSR_HALL is set to 0, the above values have to be scaled by sqrt(2).
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7.5.1.1.2. With temperature compensation and maximum field
Figure 16: version 010 - XY axes RMS noise(typ)
Figure 17: version 010 - Z axis RMS noise (typ)
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7.5.1.1.3.Version 011 - Without temperature compensation
Figure 18: version 011 – XY axis RMS noise (typ)
Figure 19: version 011 - Z axis RMS noise (typ)
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7.5.1.1.4. With temperature compensation and maximum field
Figure 20: version 011 - XY axis RMS noise (typ)
Figure 21: version 011 - Z axis RMS noise (typ)
7.6. Temperature compensation
The MLX90392 has a built-in temperature compensation, which is done by a piecewise linear approximation
of the temperature coefficient of the Hall plates. A reference temperature is chosen (TREF=35°C), where the
result at any temperature, higher than TREF is adjusted by a gain SENT_TC_HT and if the temperature is lower
than TREF - by SENS_TC_LT. These two coefficients are calibrated at Melexis and are lumped into the
parameter name SENS_TC in the equation below.
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SENS_TC_N is a scaling factor needed for the fixed-point calculations. It is determined and written at Melexis
during production test.
In case the temperature compensation is not needed, bit 5 in T_EN_DIG_FILT_Z register is set to 0. This also
disables the temperature measurement and the term in the square brackets of the formula above is equal to
1.
The operation is executed on the 19 bits raw magnetic data which is consequently truncated to 16 bit and
loaded into the results registers.
8. Application Information
8.1. Recommended Application Diagram
RSDA
RSCL
VDD
SDA
C1
100nF
VSUP
MLX90392
SCL
GND
Figure 22: Recommended application diagram
Note: RSDA and RSCL are part of the bus specifications. Please refer to it.
9. Package and Manufacturability information
9.1. ESD precaution
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro
Static Discharge control procedures whenever handling semiconductor products.
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9.2. Package information
9.2.1. Dimensions
UTDFN 2x2.5mm
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9.2.2. Sensing element placement
Magnetic sweet spot
1.00 ± 0.10 mm
0.16 ± 0.03 mm
Figure 23: Field convention (Top view of the package with pin 1 at the bottom left)
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9.2.3. Marking
Marking :
8
7
Part Number MLX90392 (1 digit)
Masks revisions (2 digits)
Version (1 digit)
0->010, 1->011
2
AA
0
2AA0
WWY
WWY
Assembly Year (Y) and week (WW)
1
4
9.3. Standard information on soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to standards in place in Semiconductor industry.
For further details about test method references and for compliance verification of selected soldering
method for product integration, Melexis recommends reviewing on our web site the General Guidelines
soldering recommendation (http://www.melexis.com/en/quality-environment/soldering)
For all soldering technologies deviating from the one mentioned in above document (regarding peak
temperature, temperature gradient, temperature profile etc.), additional classification and qualification tests
have to be agreed upon with Melexis.
For package technology embedding trim and form post-delivery capability, Melexis recommends consulting
the dedicated trim&form recommendation application note: lead trimming and forming recommendations
(http://www.melexis.com/en/documents/documentation/application-notes/lead-trimming-and-forming-
recommendations).
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/en/quality-environment.
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10. References
10.1. List of figures
Figure 1: IC block diagram....................................................................................................................................6
Figure 2: I2C Timing Diagram................................................................................................................................8
Figure 3: Conversion time...................................................................................................................................13
Figure 4: Single measurement mode when data is read out of measurement period .......................................15
Figure 5: Single measurement mode when data read started during measurement period .............................16
Figure 6: Continuous measurement mode .........................................................................................................17
Figure 7: Normal read sequence.........................................................................................................................18
Figure 8: Data read start during measurement..................................................................................................18
Figure 9: Data Skip: When data is not read........................................................................................................19
Figure 10: Data Skip: When data read has not been finished before the next measurement end ....................19
Figure 11: I2C - MEM_DIRECT_READ (direct read) Command ...........................................................................23
Figure 12: I2C - MEM_WRITE (addressed write) Command...............................................................................23
Figure 13: Sequence flowchart ...........................................................................................................................29
Figure 14: version 010 - XY axis RMS noise (typ) ................................................................................................30
Figure 15: version 010 - Z axis RMS Noise (typ)..................................................................................................30
Figure 16: version 010 - XY axes RMS noise(typ)................................................................................................31
Figure 17: version 010 - Z axis RMS noise (typ) ..................................................................................................31
Figure 18: version 011 – XY axis RMS noise (typ) ...............................................................................................32
Figure 19: version 011 - Z axis RMS noise (typ) ..................................................................................................32
Figure 20: version 011 - XY axis RMS noise (typ) ................................................................................................33
Figure 21: version 011 - Z axis RMS noise (typ) ..................................................................................................33
Figure 22: Recommended application diagram .................................................................................................34
Figure 23: Field convention (Top view of the package with pin 1 at the bottom left)........................................36
10.2. List of tables
Table 1 – Ordering codes......................................................................................................................................2
Table 2 – Pin description.......................................................................................................................................6
Table 3– Absolute Maximum Ratings...................................................................................................................7
Table 4 – General operating conditions................................................................................................................7
Table 5 – Electrical Operating conditions .............................................................................................................7
Table 6 – Magnetic Operating conditions ............................................................................................................7
Table 7: General I2C Timing Specification.............................................................................................................8
Table 8 – Electrical Operating conditions ...........................................................................................................10
Table 9 – Magnetic Specifications ......................................................................................................................11
Table 10 – Timing specifications.........................................................................................................................12
Table 11 – Accuracy specifications .....................................................................................................................14
Table 12 - Measurement magnetic data format................................................................................................20
Table 13 - Measurement magnetic data format................................................................................................20
Table 14 – Memory map.....................................................................................................................................24
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11. Revision History
Revision
Date
Change history
001
002
13-Jan-2021
First datasheet issue (JED)
15-Apr-2021 Revised specifications. Package dimensions updated + Cosmetic changes (JED)
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12. Disclaimer
The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for
informational use only and no representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its
implementation. Melexis assumes no responsibility or liability for any errors or inaccuracies that may appear in this document. Customer
will follow the practices contained in this document under its sole responsibility. This documentation is in fact provided without
warranty, term, or condition of any kind, either implied or expressed, including but not limited to warranties of merchantability,
satisfactory quality, non-infringement, and fitness for purpose. Melexis, its employees and agents and its affiliates' and their employees
and agents will not be responsible for any loss, however arising, from the use of, or reliance on this document. Notwithstanding the
foregoing, contractual obligations expressly undertaken in writing by Melexis prevail over this disclaimer.
This document is subject to change without notice, and should not be construed as a commitment by Melexis. Therefore, before placing
orders or prior to designing the product into a system, users or any third party should obtain the latest version of the relevant
information.
Users or any third party must determine the suitability of the product described in this document for its application, including the level
of reliability required and determine whether it is fit for a particular purpose.
This document as well as the product here described may be subject to export control regulations. Be aware that export might require
a prior authorization from competent authorities. The product is not designed, authorized or warranted to be suitable in applications
requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-
support or life-sustaining equipment or avionics application are specifically excluded by Melexis. The product may not be used for the
following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage,
recognition or proliferation of:
1. chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons;
2. civil firearms, including spare parts or ammunition for such arms;
3. defense related products, or other material for military use or for law enforcement;
4. any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or
goods and that can be used as a means of violence in an armed conflict or any similar violent situation.
No license nor any other right or interest is granted to any of Melexis' or third party's intellectual property rights.
If this document is marked “restricted” or with similar words, or if in any case the content of this document is to be reasonably
understood as being confidential, the recipient of this document shall not communicate, nor disclose to any third party, any part of the
document without Melexis’ express written consent. The recipient shall take all necessary measures to apply and preserve the
confidential character of the document. In particular, the recipient shall (i) hold document in confidence with at least the same degree
of care by which it maintains the confidentiality of its own proprietary and confidential information, but no less than reasonable care;
(ii) restrict the disclosure of the document solely to its employees for the purpose for which this document was received, on a strictly
need to know basis and providing that such persons to whom the document is disclosed are bound by confidentiality terms substantially
similar to those in this disclaimer; (iii) use the document only in connection with the purpose for which this document was received, and
reproduce document only to the extent necessary for such purposes; (iv) not use the document for commercial purposes or to the
detriment of Melexis or its customers. The confidentiality obligations set forth in this disclaimer will have indefinite duration and in any
case they will be effective for no less than 10 years from the receipt of this document.
This disclaimer will be governed by and construed in accordance with Belgian law and any disputes relating to this disclaimer will be
subject to the exclusive jurisdiction of the courts of Brussels, Belgium.
The invalidity or ineffectiveness of any of the provisions of this disclaimer does not affect the validity or effectiveness of the other
provisions.
The previous versions of this document are repealed.
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